Surface light emitting device

Abstract

To provide a surface light emitting device capable of changing a spot shape of laser light formed on a work surface in additional processing of a work-piece.SOLUTION: A surface light emitting device (300C) is used for additional processing of a work-piece. The surface light emitting device (300C) comprises a plurality of PCSEL (Photonic-Crystal Surface-Emitting Laser) elements (331) electrically connected in series to each other, and a plurality of switching elements (431) electrically connected in parallel with the respective PCSEL elements (331).SELECTED DRAWING: Figure 20

Description

[Technical Field]

[0001] The present invention relates to a surface emitting device. [Background technology]

[0002] For example, Japanese Patent Laid-Open Publication No. 2018-24006 (Patent Document 1) discloses a processing machine equipped with an additional processing head that can move relatively while supplying material powder to a workpiece and irradiating it with laser light. The laser light is guided to the additional processing head through an optical fiber.

[0003] In addition, Japanese Patent No. 6132995 (Patent Document 2), Japanese Patent No. 7384349 (Patent Document 3), and Japanese Patent No. 7086501 (Patent Document 4) disclose various laser processing machines equipped with multiple PCSEL (Photonic-Crystal Surface-Emitting Laser) elements. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2018-24006 [Patent Document 2] Patent No. 6132995 [Patent Document 3] Patent No. 7384349 [Patent Document 4] Patent No. 7086501 Summary of the Invention [Problem to be solved by the invention]

[0005] The above-mentioned Patent Document 1 discloses a directed energy deposition method in which a metal is supplied to a workpiece and a laser beam is irradiated onto the workpiece as one form of additional processing of the workpiece. In such additional processing of the workpiece, there is a demand for changing the shape of the spot of the laser beam formed on the workpiece surface in accordance with various processing conditions such as the shape of the workpiece surface, the range of the workpiece to be melted, or the scanning direction of the additional processing head relative to the workpiece.

[0006] An object of the present invention is to provide a surface light emitting device that can change the spot shape of laser light formed on the surface of a workpiece during additional processing of the workpiece. [Means for solving the problem]

[0007] A surface light-emitting device according to the present invention is used for additional machining of a workpiece. The surface light-emitting device includes a plurality of photonic-crystal surface-emitting laser (PCSEL) elements electrically connected in series with each other, and a plurality of switching elements electrically connected in parallel to each of the plurality of PCSEL elements. [Effects of the Invention]

[0008] According to the present invention, it is possible to provide a surface light emitting device capable of changing the spot shape of laser light formed on the surface of a workpiece during additional machining of the workpiece. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. [Figure 2] 2 is a front view showing an additional machining head held by the tool spindle in FIG. 1. FIG. [Figure 3] 3 is a cross-sectional view showing the tool spindle and additional machining head in the area surrounded by the two-dot chain line III in FIG. 2. FIG. [Figure 4]3 is a diagram showing irradiation of laser light from the additional processing head in FIG. 2 toward the workpiece. FIG. [Figure 5] 3 is a plan view of the surface light-emitting unit in FIG. 2 as viewed from the light-emitting surface side. [Figure 6] FIG. 3 is a circuit diagram showing the surface light-emitting unit in FIG. 2. [Figure 7] FIG. 1 is a cross-sectional view showing a PCSEL device. [Figure 8] 10 is a diagram showing the relative positions of a surface light-emitting unit, a condenser lens, and a workpiece. FIG. [Figure 9] 9 is a diagram showing a laser beam in the vicinity of a focal point surrounded by a two-dot chain line IX in FIG. 8. FIG. [Figure 10] 3 is a front view showing a modified example of the additional machining head in FIG. 2. FIG. [Figure 11] 3 is a top view showing the relationship between the shank portion, the surface light-emitting portion, the condenser lens, and the spot of the laser light in the additional processing head in FIG. 2. FIG. [Figure 12] 11 is a top view showing the relationship between the shank portion, the surface light-emitting portion, the condenser lens, and the spot of the laser light in the additional processing head in FIG. 10. [Figure 13] 6 is a plan view showing a modified example of the surface light-emitting portion in FIG. 5. FIG. [Figure 14] FIG. 14 is a circuit diagram showing the surface light-emitting unit in FIG. [Figure 15] FIG. 10 is a front view showing an additional machining head in a reference example. [Figure 16] 16 is a top view showing the additional machining head in the reference example as seen in the direction of the arrows on line XVI-XVI in FIG. 15. FIG. [Figure 17] FIG. 2 is a view of the surface light-emitting unit as seen from the light-emitting surface side. [Figure 18] 18 is a cross-sectional view showing the surface light-emitting portion as seen in the direction of the arrows on line XVIII-XVIII in FIG. 17. [Figure 19] FIG. 18 is a perspective view showing the electrode stack in FIG. [Figure 20] FIG. 10 is a perspective view showing a surface light emitting device according to a second embodiment of the present invention. [Figure 21] FIG. 21 is a circuit diagram showing the surface light emitting device in FIG. 20. [Figure 22] 22 is a plan view showing one mode of light emission in the surface light emitting device in FIG. 21. FIG. [Figure 23] FIG. 10 is a plan view showing another aspect of light emission in the surface light emitting device. [Figure 24] FIG. 10 is a plan view showing yet another aspect of light emission in the surface light emitting device. [Figure 25] 21 is a plan view showing the surface light emitting device in the area surrounded by the two-dot chain line XXV in FIG. 20. FIG. [Figure 26] 26 is a side view showing the surface light emitting device as seen in the direction indicated by the arrow XXVI in FIG. 25. [Figure 27] 27 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on line XXVII-XXVII in FIG. 26. [Figure 28] 27 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on line XXVIII-XXVIII in FIG. 26. [Figure 29] 27 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on line XXIX-XXIX in FIG. 26. [Figure 30] 26 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on the line XXX-XXX in FIG. 25. [Figure 31] FIG. 31 is a diagram schematically showing wiring between the electrode laminate and the switching element in FIG. 30. DETAILED DESCRIPTION OF THE INVENTION

[0010] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described with reference to the accompanying drawings, in which the same or corresponding elements are designated by the same reference numerals.

[0011] (Embodiment 1) Fig. 1 is a front view of a processing machine, showing the interior of the processing machine through a cover body that forms the exterior of the processing machine.

[0012] 1, the processing machine 100 is an AM / SM hybrid processing machine capable of additive processing (AM (Additive Manufacturing) processing) of a workpiece and subtractive processing (SM (Subtractive Manufacturing) processing) of a workpiece. As SM processing functions, the processing machine 100 has a turning function using a fixed tool and a milling function using a rotary tool.

[0013] The processing machine 100 is an NC (Numerically Controlled) processing machine in which various operations for processing a workpiece are automated by computer numerical control.

[0014] In this specification, an axis that is parallel to the left-right direction (width direction) of the processing machine 100 and extends horizontally is referred to as the "Z axis," an axis that is parallel to the front-rear direction (depth direction) of the processing machine 100 and extends horizontally is referred to as the "Y axis," and an axis that extends vertically is referred to as the "X axis." The X axis, Y axis, and Z axis are three axes that are perpendicular to one another.

[0015] First, we will explain the overall structure of the processing machine 100. The processing machine 100 has a cover body 161. The cover body 161 forms the processing area 150 and also forms the outer appearance of the processing machine 100.

[0016] The processing area 150 is a space where the workpiece is processed. The processing area 150 is sealed by a cover body 161 so that chips and coolant (mist) generated during the removal processing of the workpiece, and fumes generated during additional processing of the workpiece, do not leak out of the processing area 150.

[0017] The processing machine 100 has a bed 141 , a first workpiece spindle 111 , a second workpiece spindle 116 , a tool spindle 121 , and a tool rest 131 .

[0018] The bed 141 is a base member for supporting the first workpiece spindle 111, the second workpiece spindle 116, the tool spindle 121, the tool rest 131, etc., and is installed on the floor of a factory or the like.

[0019] The first work spindle 111 and the second work spindle 116 are arranged opposite each other in the Z-axis direction. Each of the first work spindle 111 and the second work spindle 116 is capable of holding a workpiece. Each of the first work spindle 111 and the second work spindle 116 is provided with a chuck mechanism for detachably holding a workpiece. The first work spindle 111 rotates the held workpiece about a rotation center axis 101 parallel to the Z-axis. The second work spindle 116 rotates the held workpiece about a rotation center axis 102 parallel to the Z-axis.

[0020] The first workpiece spindle 111 is fixed to the bed 141. The second workpiece spindle 116 is movable in the Z-axis direction by various feed mechanisms, guide mechanisms, servo motors, etc. The second workpiece spindle 116 may be configured to be fixed to the bed 141.

[0021] In place of the second work spindle 116, a tailstock may be provided to support the center of rotation of the work held by the first work spindle 111, or a work vibration prevention device may be provided to support the work held by the first work spindle 111 from its outer periphery and prevent the work from vibrating.

[0022] The tool spindle 121 is provided in the machining area 150. The tool spindle 121 can hold a tool for removing the workpiece. The tool spindle 121 can hold a rotary tool for milling the workpiece. The tool spindle 121 is provided with a clamping mechanism 126 (see FIG. 3 described later) for detachably holding the tool. When milling the workpiece using the rotary tool, the tool spindle 121 rotates the held rotary tool around a rotation center axis 105 that is parallel to the X-axis-Z-axis plane.

[0023] The tool spindle 121 can also rotate around a predetermined axis 104 (B-axis rotation). The predetermined axis 104 is parallel to the Y-axis. As an example, the rotation range of the tool spindle 121 is within a range of ±120° from a reference position (the position shown in FIG. 1) in which a spindle end face 123 of the tool spindle 121 faces downward.

[0024] The tool spindle 121 is supported on a bed 141 by a column or the like (not shown). The tool spindle 121 is movable within a machining area 150. The tool spindle 121 is movable in the X-axis, Y-axis, and Z-axis directions by various feed mechanisms, guide mechanisms, servo motors, and the like provided on the column or the like. The machining position of a rotary tool attached to the tool spindle 121 moves three-dimensionally.

[0025] Although not shown in FIG. 1, an automatic tool changer (ATC) for automatically changing the tools held by the tool spindle 121 and a tool magazine for storing replacement tools held by the tool spindle 121 are provided around the first work spindle 111.

[0026] A plurality of fixed tools for turning are attached to the tool rest 131. The tool rest 131 is a so-called turret type, and a plurality of fixed tools are attached radially and perform turning indexing.

[0027] The tool rest 131 has a swivel unit 132. The swivel unit 132 is swivelable around a swivel central axis 106 that is parallel to the Z axis. Tool holders for holding fixed tools are attached to positions spaced apart in the circumferential direction around the swivel central axis 106. When the swivel unit 132 swivels around the swivel central axis 106, the fixed tool held in the tool holder moves in the circumferential direction, and the fixed tool to be used in the turning process is indexed.

[0028] The tool rest 131 is supported on a bed 141 by a saddle or the like (not shown). The tool rest 131 can move in the X-axis direction and the Z-axis direction by various feed mechanisms, guide mechanisms, servo motors, etc. provided on the saddle or the like. The tool rest 131 may also have a milling function for rotating a rotary tool.

[0029] Next, the structure of the additional machining head 200 will be described. Fig. 2 is a front view showing the additional machining head held by the tool spindle in Fig. 1. With reference to Figs. 1 and 2, the processing machine 100 further has an additional machining head 200.

[0030] The additional processing head 200 supplies metal and irradiates it with laser light to melt the metal and perform additional processing (Directed Energy Deposition). The additional processing head 200 supplies material powder to the workpiece and irradiates it with laser light to perform additional processing. Metal powder such as stainless steel, nickel-based alloy, cobalt-based alloy, or titanium is used as the material powder. The material supplied from the additional processing head 200 to the workpiece may be any metal, and may be, for example, a linear metal wire.

[0031] The additional processing head 200 has a head portion 211. The head portion 211 is movable relative to the workpiece. The head portion 211 is made of a housing that forms the external appearance of the additional processing head 200. The head portion 211 is made of metal.

[0032] Either a tool or an additional machining head 200 is selectively attached to the tool spindle 121. Figures 1 and 2 show the tool spindle 121 to which the additional machining head 200 is attached. During additional machining of the workpiece, the additional machining head 200 is held by the tool spindle 121 and moves integrally with the tool spindle 121 in the X-axis, Y-axis and Z-axis directions and rotates about the predetermined axis 104. During removal machining of the workpiece, the additional machining head 200 is detached from the tool spindle 121.

[0033] Although not shown in FIG. 1, a head stocker for storing the additional machining head 200 detached from the tool spindle 121 is provided around the second work spindle 116 .

[0034] Figure 3 is a cross-sectional view showing the tool spindle and additional machining head in the area surrounded by the two-dot chain line III in Figure 2. Referring to Figure 3, the tool spindle 121 has a spindle body 122. The spindle body 122 is made of a cylindrical body centered on the central rotation axis 105. The spindle body 122 is supported so as to be rotatable about the central rotation axis 105. The spindle body 122 has the aforementioned spindle end surface 123. The spindle end surface 123 is made of a plane perpendicular to the central rotation axis 105.

[0035] The tool spindle 121 (spindle body 122) is provided with a tool insertion hole 125. The tool insertion hole 125 extends in the axial direction of the rotation center axis 105 and has a hole shape that opens to the spindle end face 123. When a tool is attached to the tool spindle 121 during removal processing of a workpiece, the tool (the shank portion of the tool) is inserted into the tool insertion hole 125.

[0036] The tool spindle 121 further has a clamping mechanism 126. The clamping mechanism 126 is provided on the spindle body 122. The clamping mechanism 126 is a mechanism for holding a tool on the tool spindle 121 during removal machining of a workpiece. The clamping mechanism 126 is operable between a clamped state in which the tool is clamped and an unclamped state in which the tool is unclamped. In this embodiment, the shack specification of the tool that can be held by the clamping mechanism 126 is a polygonal tapered shank.

[0037] The additional machining head 200 further has a shank portion 231. The shank portion 231 has a shack shape that corresponds to the shank specifications (polygonal tapered shank) of a tool that can be held by the clamping mechanism 126. When the additional machining head 200 is attached to the tool spindle 121 during additional machining of a workpiece, the shank portion 231 is inserted into the tool insertion hole 125.

[0038] The clamping mechanism 126 includes a draw bar 128, a collet 127, a spring member 129, and an unclamping cylinder (not shown).

[0039] Draw bar 128 is provided on the axis of rotation central shaft 105. Draw bar 128 is provided so as to be able to slide in the axial direction of rotation central shaft 105 (in the axial direction of rotation central shaft 105, the side on which spindle end surface 123 is located is referred to as the "front side," and the opposite side is referred to as the "rear side").

[0040] Collet 127 is attached to the front end of draw bar 128. Collet 127 is disposed inside shank portion 231 having a cylindrical shape. Collet 127 deforms so as to contract or expand its diameter around rotation center shaft 105 as draw bar 128 slides in the axial direction of rotation center shaft 105. Spring member 129 is provided on the outer periphery of draw bar 128. Spring member 129 applies an elastic force to draw bar 128 toward the rear in the axial direction of rotation center shaft 105. An unclamping cylinder is provided at the rear end of draw bar 128. When hydraulic pressure is supplied to the unclamping cylinder, it operates to slide draw bar 128 forward in the axial direction of rotation center shaft 105.

[0041] In this configuration, when the additional machining head 200 is attached to the tool spindle 121, the elastic force of the spring member 129 causes the draw bar 128 to slide rearward in the axial direction of the rotation center shaft 105. The collet 127 deforms so as to expand in diameter around the rotation center shaft 105, and pulls the shank portion 231 rearward in the axial direction of the rotation center shaft 105. This results in a clamped state of the shank portion 231 by the clamp mechanism 126.

[0042] On the other hand, when the additional machining head 200 is detached from the tool spindle 121, hydraulic pressure is supplied to the unclamping cylinder, causing the draw bar 128 to slide forward in the axial direction of the rotation center shaft 105. While the collet 127 deforms so as to reduce its diameter around the rotation center shaft 105, the draw bar 128 pushes the shank portion 231 forward in the axial direction of the rotation center shaft 105. This results in an unclamped state of the shank portion 231 by the clamping mechanism 126.

[0043] The shack specifications of the tool that can be held by the clamping mechanism in the tool spindle are not limited to a polygonal tapered shank, but may also be, for example, a hollow tapered shank.

[0044] As shown in FIG. 2, the additive processing head 200 further has a material powder discharge portion 217. The material powder discharge portion 217 is provided in the head portion 211. The material powder discharge portion 217 is made of a tubular member through which material powder can flow. The material powder discharge portion 217 opens at a position spaced apart radially outward from the central axis 201, which will be described later. The material powder discharge portion 217 discharges material powder toward the workpiece.

[0045] Fig. 4 is a diagram showing the irradiation of laser light from the additional processing head in Fig. 2 toward the workpiece. Fig. 5 is a plan view of the surface light-emitting unit in Fig. 2, viewed from the light-emitting surface side. Fig. 6 is a circuit diagram showing the surface light-emitting unit in Fig. 2. In Fig. 6 and in Figs. 14 and 21 described below, two arrows are attached to the PCSEL element 331 that emits laser light. Fig. 7 is a cross-sectional view of the PCSEL element.

[0046] 2 to 7, the additional processing head 200 further includes a surface light-emitting unit 300 (300A). The surface light-emitting unit 300 is mounted on the head unit 211. The surface light-emitting unit 300 is fixed inside the head unit 211.

[0047] The surface light-emitting unit 300 has a plurality of PCSEL (Photonic-Crystal Surface-Emitting Laser) elements 331 (331-1 to 331-36).

[0048] As shown in FIG. 7, the PCSEL element 331 has an element body 310, a front electrode 321, a rear electrode 326, and an AR (Anti Reflection) coating layer 322.

[0049] Device body 310 is made of, for example, GaAs (gallium arsenide). Device body 310 has substrate 311, n-type cladding layer 312, active layer 313, carrier block layer 314 which is a p-type doped layer, photonic crystal layer 315, p-type cladding layer 317, back surface reflector (distributed Bragg reflector) 319, and p-type contact layer 318. Substrate 311, n-type cladding layer 312, active layer 313, carrier block layer 314, photonic crystal layer 315, p-type cladding layer 317, back surface reflector 319, and p-type contact layer 318 are stacked in the listed order in the thickness direction of device body 310. Photonic crystal layer 315 has a plurality of holes 316 formed as a periodic structure approximately equal to the oscillation wavelength.

[0050] The order in which active layer 313, carrier block layer 314 and photonic crystal layer 315 are stacked may be reversed.

[0051] The element body 310 has an emission surface 310a and a back surface 310b. The emission surface 310a is the surface of the element body 310 that faces the substrate 311. The back surface 310b is the surface of the element body 310 that faces the p-type contact layer 318, and is located on the opposite side of the emission surface 310a.

[0052] Front surface electrode 321 is provided along the periphery of emission surface 310a. Front surface electrode 321 has a frame shape with a circular opening. AR coating layer 322 is provided in the opening of front surface electrode 321. Back surface electrode 326 is provided on back surface 310b. When a voltage is applied between front surface electrode 321 and back surface electrode 326, light is emitted in active layer 313. The light resonates in photonic crystal layer 315 and is emitted as laser light from the opening of front surface electrode 321 via emission surface 310a.

[0053] The direction of laser light emitted from PCSEL element 331 is perpendicular to element body 310 (photonic crystal layer 315). Laser light generated in PCSEL element 331 travels toward emission surface 310a and back surface 310b, and the laser light directed toward back surface 310b is reflected backward by back surface reflector 319 and is emitted from the opening of front surface electrode 321 through emission surface 310a together with the laser light directed toward emission surface 310a.

[0054] The lattice shape of photonic crystal layer 315 (the arrangement of multiple holes 316) may be any shape, such as a square lattice, a triangular lattice, or an orthogonal lattice. The opening shape of holes 316 is not particularly limited and may be, for example, circular, elliptical, or triangular. Each hole 316 may also be formed by a pair of a circular hole and an elliptical hole (dual lattice photonic crystal).

[0055] The opening size of surface electrode 321, which forms the laser light emitting surface, is not particularly limited and may be, for example, 1 mm in diameter, 3 mm in diameter, or 10 mm in diameter. The opening size of surface electrode 321 may be in the range of 3 mm to 10 mm in diameter. The opening size of surface electrode 321 may also be in the range of more than 10 mm in diameter.

[0056] For example, by focusing the laser light from the PCSEL element 331 (the opening size of the surface electrode 321 is 1 mm in diameter), it is possible to irradiate a laser with an output of 10 W and a spot diameter of approximately 10 μm, and by focusing the laser light from the PCSEL element 331 (the opening size of the surface electrode 321 is 3 mm in diameter), it is possible to irradiate a laser with an output of 50 W and a spot diameter of approximately 50 μm.

[0057] As shown in Fig. 5, the multiple PCSEL elements 331 are arranged in a plane. The multiple PCSEL elements 331 are arranged in a planar manner. The multiple PCSEL elements 331 are arranged at intervals from one another. The multiple PCSEL elements 331 are arranged at equal intervals. The multiple PCSEL elements 331 are arranged in a matrix. The multiple PCSEL elements 331 are arranged in an area having a square planar shape.

[0058] The multiple PCSEL elements 331 (331-1 to 331-36) are arranged in a 6 x 6 matrix. PCSEL elements 331-1 to 331-6 are arranged in a row vertically on the surface of the paper showing Figure 5, PCSEL elements 331-12 to 331-7 are arranged in a row vertically, PCSEL elements 331-13 to 331-18 are arranged in a row vertically, PCSEL elements 331-24 to 331-19 are arranged in a row vertically, PCSEL elements 331-25 to 331-30 are arranged in a row vertically, and PCSEL elements 331-36 to 331-31 are arranged in a row vertically.

[0059] Each PCSEL element 331 is electrically connected to an electrode stack 371 made up of a p-side electrode 372 and an n-side electrode 373 .

[0060] The PCSEL element 331-1 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-36 is electrically connected to the n-side general terminal 352 via a plurality of wires 367. The PCSEL elements 331 adjacent in the vertical direction are electrically connected to each other via a plurality of wires 361. PCSEL elements 331-6 and 331-7, which are adjacent in the horizontal direction of the paper on which Figure 5 is shown, are electrically connected via multiple wires 361, PCSEL elements 331-12 and PCSEL elements 331-13, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361, PCSEL elements 331-18 and PCSEL elements 331-19, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361, PCSEL elements 331-24 and PCSEL elements 331-25, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361, and PCSEL elements 331-30 and PCSEL elements 331-31, which are adjacent in the horizontal direction, are electrically connected via multiple wires 361.

[0061] The p-side general terminal 351 is electrically connected to the positive side of the power supply 341, and the n-side general terminal 352 is electrically connected to the negative side of the power supply 341. With this configuration, the multiple PCSEL elements 331 are electrically connected in series. The PCSEL elements 331-1 to 331-36 are arranged in the listed order on the series electrical circuit.

[0062] The electrode structure for connecting adjacent PCSEL elements 331 will be described in detail later.

[0063] The laser beams emitted from the multiple PCSEL elements 331 are parallel to one another and perpendicular to the imaginary plane on which the multiple PCSEL elements 331 are arranged.

[0064] Theoretically, a single PCSEL element 331 can output 50 to 100 W. Assuming that the output of a single PCSEL element 331 is 80 W, the 6 x 6 PCSEL element array described above can output approximately 3 kW. This output value satisfies the laser output performance required for additive processing using directed energy deposition (DED).

[0065] 2 and 4, the additional processing head 200 further includes a condenser lens 221. The condenser lens 221 is mounted on the head portion 211. The condenser lens 221 is fixed inside the head portion 211.

[0066] The condenser lens 221 is disposed on a straight line 210, which is the emission direction of the laser light, in order to condense the laser light from the surface light-emitting unit 300 onto the surface of the workpiece W. The straight line 210 is the optical axis of the laser light from each PCSEL element 331. The straight line 210 is an imaginary line that passes through the center of the opening of the surface electrode 321 of each PCSEL element 331 and extends in the emission direction of the laser light from each PCSEL element 331 (the direction of the arrow indicated by the straight line 210). The condenser lens 221 is disposed at a position intersecting with the straight line 210. The condenser lens 221 is disposed at a position intersecting with multiple straight lines 210 that extend from multiple PCSEL elements 331.

[0067] The condenser lens 221 condenses the laser light from the surface light-emitting unit 300 (plurality of PCSEL elements 331) onto the surface of the workpiece W. The laser light directed from the condenser lens 221 toward the workpiece W travels around a central axis 201. The central axis 201 is the optical axis of the laser light directed from the condenser lens 221 toward the workpiece W. The central axis 201 is parallel to the straight line 210.

[0068] The condensing lens 221 is a convex lens having a convex surface 223 and a flat surface 222. The condensing lens 221 is arranged so that the flat surface 222 is perpendicular to the straight line 210. The condensing lens 221 is arranged around the central axis 201. The convex surface 223 is arranged on the side of the surface light-emitting unit 300 on the path of the laser light from the surface light-emitting unit 300 toward the workpiece W, and the flat surface 222 is arranged on the side of the workpiece W on the path of the laser light from the surface light-emitting unit 300 toward the workpiece W.

[0069] The condenser lens 221 faces the surface light-emitting unit 300 in the emission direction of the laser light from the surface light-emitting unit 300. The condenser lens 221 directly faces the surface light-emitting unit 300 in the emission direction of the laser light from the surface light-emitting unit 300. The emission direction of the laser light from the surface light-emitting unit 300 is parallel to the axial direction of the central axis 201. The laser light emitted from the surface light-emitting unit 300 enters the condenser lens 221 without passing through an optical component such as a reflecting mirror or a collimating lens.

[0070] Although the present embodiment has been described with respect to a configuration in which one condenser lens 221 is provided for a plurality of PCSEL elements 331, the present invention is not limited to this, and a condenser lens may be provided for each of a plurality of PCSEL elements 331. For example, 36 condenser lenses 221 may be disposed opposite the surface light-emitting unit 300 having PCSEL elements 331-1 to 331-36.

[0071] 1, 2, and 4, the additional processing head 200 further has a laser light emitting unit 216. The laser light emitting unit 216 is provided in the head unit 211. The laser light emitting unit 216 has an opening facing the workpiece W. The laser light from the condenser lens 221 passes through the laser light emitting unit 216 and travels toward the workpiece W.

[0072] The surface light emitting unit 300, the condenser lens 221, and the laser light emitting unit 216 are arranged side by side on the central axis 201. The condenser lens 221 is disposed between the surface light emitting unit 300 and the laser light emitting unit 216.

[0073] When the additional machining head 200 is attached to the tool spindle 121, the central axis 201 is arranged on the same straight line as the rotational center axis 105 of the tool spindle 121. In this configuration, the shank portion 231 is arranged around the central axis 201. The shank portion 231, the surface light-emitting portion 300, the condensing lens 221, and the laser light emitting portion 216 are arranged side by side on the axis of the central axis 201. The surface light-emitting portion 300 is arranged between the shank portion 231 and the condensing lens 221 in the axial direction of the central axis 201.

[0074] The shank portion 231 is disposed on the opposite side of the condenser lens 221 in the axial direction of the central axis 201, with the surface light-emitting portion 300 sandwiched therebetween.

[0075] Fig. 8 is a diagram showing the relative positions of the surface light emitting unit, the condenser lens, and the workpiece, and Fig. 9 is a diagram showing the laser light in the vicinity of the focal point surrounded by the two-dot chain line IX in Fig. 8.

[0076] Next, specific examples of the size of the surface light-emitting unit 300, the mutual distance between the surface light-emitting unit 300, the condenser lens 221, and the workpiece W, and the spot diameter of the laser light formed on the surface of the workpiece W will be described.

[0077] As shown in FIG. 5, it is assumed that the opening dimension D of the surface electrode 321 that forms the laser light emission surface is 3 mm in diameter.

[0078] In this case, each PCSEL element 331 has a square planar shape with a side length E of 4.5 mm. The electrode stack 371 provided corresponding to each PCSEL element 331 has a square planar shape with a side length B of 8 mm. The multiple PCSEL elements 331 are arranged so that the spacing C between adjacent electrode stacks 371 in the vertical and horizontal directions is 1 mm. In this configuration, the surface light-emitting unit 300 has a square planar shape with a side length L of 53 mm.

[0079] As shown in FIG. 8, the distance Sa between the surface light-emitting portion 300 and the condenser lens 221 (convex surface 223) in the emission direction of the laser light from the surface light-emitting portion 300 (axial direction of the central axis 201) is 50 mm. The distance Sb between the flat surface 222 of the condenser lens 221 and the focal position F of the laser light in the emission direction of the laser light from the surface light-emitting portion 300 (axial direction of the central axis 201) is 200 mm.

[0080] As shown in FIGS. 8 and 9, the diameter of the laser light from the condenser lens 221 centered on the central axis 201 decreases as it moves away from the condenser lens 221, becomes minimum at the focal position F, and further increases as it moves away from the focal position F. The spot diameter d of the laser light at the focal position F is 3 mm.

[0081] The side length L of the surface light-emitting portion 300 using the PCSEL element 331 with the opening dimension D of the surface electrode 321 being 3 mm in diameter may be in the range of 50 mm or more and 55 mm or less. The side length L of the surface light-emitting portion 300 using the PCSEL element 331 with the opening dimension D of the surface electrode 321 being 3 mm or more in diameter may be in the range of 50 mm or more and 100 mm or less, or may be in the range of 50 mm or more and 75 mm or less.

[0082] The distance Sa between the surface light-emitting portion 300 and the condenser lens 221 is preferably smaller than the distance Sb between the condenser lens 221 and the focal position F of the laser light (Sa < Sb). The distance Sa between the surface light-emitting portion 300 and the condenser lens 221 may be 1 / 2 times or less of the distance Sb between the condenser lens 221 and the focal position F of the laser light (Sa ≤ 1 / 2Sb). The spot diameter d of the laser light at the focal position F may be in the range of 0.5 mm or more and 5 mm or less, or may be in the range of 1.5 mm or more and 3 mm or less.

[0083] The distance Sa between the surface light emitter 300 and the collecting lens 221 may be equal to or less than the distance between the shank portion 231 and the surface light emitter 300 in the emission direction of the laser light from the surface light emitter 300 (the axial direction of the central axis 201), or may be greater than the distance between the shank portion 231 and the surface light emitter 300 in the emission direction of the laser light from the surface light emitter 300 (the axial direction of the central axis 201). The distance between the shank portion 231 and the surface light emitter 300 in the emission direction of the laser light from the surface light emitter 300 (the axial direction of the central axis 201) may be equal to or less than the distance Sb between the collecting lens 221 and the focal position F of the laser light, or may be greater than the distance Sb between the collecting lens 221 and the focal position F of the laser light.

[0084] Fig. 10 is a front view showing a modified example of the additional processing head in Fig. 2. Referring to Fig. 10, in this modified example, when the additional processing head 200 is attached to the tool spindle 121, a central axis 201 corresponding to the optical axis of the laser light from the condenser lens 221 is disposed so as to be deviated from the rotation central axis 105 of the tool spindle 121. The central axis 201 is parallel to the rotation central axis 105 of the tool spindle 121.

[0085] Fig. 11 is a top view showing the relationship between the shank, surface light-emitting unit, condenser lens, and laser light spot in the additional processing head in Fig. 2. Fig. 12 is a top view showing the relationship between the shank, surface light-emitting unit, condenser lens, and laser light spot in the additional processing head in Fig. 10.

[0086] 2 and 11, when viewed in the axial direction of central axis 201, laser light spot SP, shank portion 231, and surface light-emitting portion 300 are arranged inside the outer shape of condenser lens 221. Spot SP and shank portion 231 are arranged inside the outer shape of surface light-emitting portion 300. Spot SP is arranged inside the outer shape of shank portion 231 (the maximum diameter portion centered on rotation central axis 105).

[0087] When viewed in the axial direction of the central axis 201, the surface light-emitting portion 300 may be configured to be positioned inside the outer shape of the shank portion 231, or a portion of the surface light-emitting portion 300 and a portion of the shank portion 231 may be configured to overlap each other.

[0088] The diameter of the condenser lens 221 centered on the central axis 201 is equal to or greater than the diagonal length of the surface light-emitting unit 300. The diagonal length of the surface light-emitting unit 300 is equal to or greater than the maximum diameter of the shank portion 231 centered on the rotation central axis 105. The diagonal length of the surface light-emitting unit 300 may be less than the maximum diameter of the shank portion 231 centered on the rotation central axis 105.

[0089] 10 and 12, in this modification, the central axis 201 is offset in the Z-axis direction and the Y-axis direction from the rotation central axis 105 of the tool spindle 121. The central axis 201 may be configured to be offset from the rotation central axis 105 of the tool spindle 121 only in the Z-axis direction or only in the Y-axis direction.

[0090] Fig. 13 is a plan view showing a modified example of the surface light-emitting unit in Fig. 5. Fig. 14 is a circuit diagram showing the surface light-emitting unit in Fig. 13.

[0091] 13 and 14, in the surface light-emitting unit 300B of this modification, the PCSEL element 331-1 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-12 is electrically connected to the n-side general terminal 352 via a plurality of wires 367. The PCSEL element 331-13 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-24 is electrically connected to the n-side general terminal 352 via a plurality of wires 367. The PCSEL element 331-25 is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The PCSEL element 331-36 is electrically connected to the n-side general terminal 352 via a plurality of wires 367.

[0092] Vertically adjacent PCSEL elements 331 are electrically connected to each other via multiple wires 361. Horizontally adjacent PCSEL elements 331-6 and 331-7 are electrically connected to each other via multiple wires 361, horizontally adjacent PCSEL elements 331-18 and 331-19 are electrically connected to each other via multiple wires 361, and horizontally adjacent PCSEL elements 331-30 and 331-31 are electrically connected to each other via multiple wires 361.

[0093] The three p-side general terminals 351 are electrically connected to the positive side of the power supply 341, and the three n-side general terminals 352 are electrically connected to the negative side of the power supply 341. With this configuration, the PCSEL elements 331-1 to 331-12 are electrically connected in series in the order listed, the PCSEL elements 331-13 to 331-24 are electrically connected in series in the order listed, and the PCSEL elements 331-25 to 331-36 are electrically connected in series in the order listed. The PCSEL elements 331-1 to 331-12, the PCSEL elements 331-1 to 331-12, and the PCSEL elements 331-13 to 331-24 are electrically connected in parallel with one another.

[0094] Fig. 15 is a front view showing the additional processing head in the reference example. Fig. 16 is a top view showing the additional processing head in the reference example as seen in the direction of the arrows on line XVI-XVI in Fig. 15.

[0095] 15 and 16 , in this reference example, a laser oscillator installed outside the processing machine 100 oscillates a laser beam, and the laser beam is introduced into the additional processing head 600 through an optical fiber 611. The laser beam is converted into parallel beams by passing through a collimating lens 612. The laser beam from the collimating lens 612 travels toward the condenser lens 221 while being reflected by a first reflecting mirror 613, a second reflecting mirror 614, a third reflecting mirror 615, a fourth reflecting mirror 616, and a fifth reflecting mirror 617 inside the additional processing head 600. The laser beam condensed by the condenser lens 221 is emitted toward the workpiece through the laser beam emitting unit 216.

[0096] In the above-described reference example, in order to obtain the energy necessary to melt the metal, a large laser oscillator such as a fiber laser, fiber-coupled semiconductor laser, or CO2 laser is installed outside the processing area, and the laser light is transmitted to an additional processing head 600 within the processing area using an optical fiber 611. In addition, by providing a collimating lens 612 in the additional processing head 600, the laser light from the optical fiber 611 is converted into parallel light, and further, by providing a plurality of reflecting mirrors 613 to 617 in the additional processing head 600, the laser light introduced into the additional processing head 600 by the optical fiber 611 is guided to the condenser lens 221.

[0097] 1 to 14, in contrast to this, in the additional processing head 200 of this embodiment, a head section 211 that is movable relative to the workpiece is equipped with a surface light-emitting section 300 that includes a plurality of PCSEL elements 331, and a focusing lens 221 that can focus laser light from the surface light-emitting section 300 onto the surface of the workpiece W.

[0098] In this configuration, the surface light-emitting unit 300, which uses the PCSEL element 331 as the light-emitting element, is small and capable of emitting high-power laser light, so the surface light-emitting unit 300 can be directly mounted on the additional processing head 200. This makes it possible to omit an optical fiber for transmitting laser light to the additional processing head 200, simplifying the configuration of the additional processing head 200. Furthermore, the PCSEL element 331 has the characteristic of high beam quality (small beam divergence). Therefore, optical components for shaping laser light, such as a collimating lens, can be omitted, further simplifying the configuration of the additional processing head 200.

[0099] The condenser lens 221 is disposed opposite to the surface light-emitting unit 300 in the direction in which the laser light is emitted from the surface light-emitting unit 300 .

[0100] As described above, the surface light-emitting unit 300 is small. Therefore, when the surface light-emitting unit 300 is mounted on the additional processing head 200, the surface light-emitting unit 300 and the condenser lens 221 can be arranged opposite each other, regardless of the space constraints within the head unit 211. This makes it possible to omit optical components for guiding the laser light, such as a reflecting mirror, and further simplify the configuration of the additional processing head 200.

[0101] Furthermore, if the distance Sa between the surface light-emitting unit 300 and the focusing lens 221 is smaller than the distance Sb between the focusing lens 221 and the focal position F of the laser light, the surface light-emitting unit 300 and the focusing lens 221 can be arranged in a more compact space within the head unit 211.

[0102] Furthermore, in the processing machine 100 of this embodiment, the additional processing head 200 has a shank portion 231 that is clamped by the tool spindle 121. In this configuration, the additional processing head 200 is attached to the tool spindle 121 by clamping the shank portion 231 with the tool spindle 121. This makes it possible to irradiate the workpiece W with laser light from the additional processing head 200 while moving the additional processing head 200 integrally with the tool spindle 121.

[0103] Moreover, the shank portion 231 is disposed on the opposite side of the condenser lens 221 across the surface light-emitting portion 300 in the axial direction of the central axis 201. With this configuration, the shank portion 231 can be provided on the head portion 211 without affecting the progression of the laser light emitted from the surface light-emitting portion 300.

[0104] Next, the electrode structure for electrically connecting the multiple PCSEL elements 331 together will be described.

[0105] Fig. 17 is a view of the surface light-emitting unit as viewed from the light-emitting surface side. Fig. 18 is a cross-sectional view of the surface light-emitting unit as viewed in the direction of the arrows on line XVIII-XVIII in Fig. 17. For simplicity, Figs. 17 and 18 show two PCSEL elements 331A and 331B electrically connected in series. Fig. 19 is a perspective view of the electrode stack in Fig. 17.

[0106] 17 to 19, the surface light-emitting unit 300 further includes an electrode stack 371 (371A, 371B). The electrode stack 371A and the electrode stack 371B are provided corresponding to the PCSEL element 331A and the PCSEL element 331B, respectively. The electrode stack 371A and the electrode stack 371B are provided with a gap between them.

[0107] The electrode stack 371 has a p-side electrode 372 and an n-side electrode 373. Each of the p-side electrode 372 and the n-side electrode 373 is made of, for example, a copper frame.

[0108] The p-side electrode 372 is disposed around the PCSEL element 331 when the light-emitting surface 310a of the element body 310 is viewed in plan (when viewed in the thickness direction of the element body 310). The p-side electrode 372 extends in a frame shape around the PCSEL element 331 when the light-emitting surface 310a of the element body 310 is viewed in plan (when viewed in the thickness direction of the element body 310). The n-side electrode 373 is disposed around the PCSEL element 331 when the light-emitting surface 310a of the element body 310 is viewed in plan (when viewed in the thickness direction of the element body 310). The n-side electrode 373 extends in a frame shape around the PCSEL element 331 when the light-emitting surface 310a of the element body 310 is viewed in plan. The p-side electrode 372 and the n-side electrode 373 are stacked in the thickness direction of the element body 310 with an insulating layer 374 interposed therebetween.

[0109] The p-side electrode 372 is provided at a position perpendicular to the thickness direction of the device body 310 and intersects with an imaginary plane on which the device body 310 is disposed. The p-side electrode 372 extends in a rectangular shape along the outer periphery of the PCSEL device 331, with a gap between the p-side electrode 372 and the PCSEL device 331. The n-side electrode 373 is provided at a position perpendicular to the thickness direction of the device body 310 and protrudes beyond the imaginary plane on which the device body 310 is disposed in the direction in which laser light is emitted from the PCSEL device 331.

[0110] The cross-sectional area of ​​the p-side electrode 372 when cut along a plane perpendicular to the thickness direction of the element body 310 is larger than the cross-sectional area of ​​the n-side electrode 373 when cut along a plane perpendicular to the thickness direction of the element body 310. When viewed in the thickness direction of the element body 310, the outer peripheral edge of the p-side electrode 372 protrudes in a direction away from the element body 310 more than the outer peripheral edge of the n-side electrode 373. When viewed in the thickness direction of the element body 310, the inner peripheral edge of the p-side electrode 372 and the inner peripheral edge of the n-side electrode 373 are aligned.

[0111] The surface light-emitting unit 300 further includes a submount 381 (381A, 381B) and a conductive layer 382 (382A, 382B).

[0112] Submounts 381A and 381B are provided corresponding to PCSEL elements 331A and 331B, respectively. Conductive layers 382A and 382B are provided corresponding to PCSEL elements 331A and 331B, respectively.

[0113] The conductive layer 382 is provided in a layered form so that the direction of laser light emission from the element body 310 is the thickness direction. The conductive layer 382 is made of a conductive material. The PCSEL element 331 and the electrode stack 371 are mounted on a submount 381 via the conductive layer 382. The back electrode 326 of the PCSEL element 331 and the p-side electrode 372 of the electrode stack 371 are bonded to the conductive layer 382, ​​which is a plated layer. The submount 381 is made of a material with high thermal conductivity. The submounts 381A and 381B are spaced apart from each other.

[0114] The surface light-emitting unit 300 further includes a heat sink 386. A refrigerant such as cooling oil is circulated through the heat sink 386. The submount 381 (381A, 381B) is connected to the heat sink 386 via a solder layer 383. The heat sink 386 functions to promote heat dissipation from the PCSEL elements 331 and to hold the multiple PCSEL elements 331 together.

[0115] In each PCSEL element 331, a p-side electrode 372 is electrically connected to the PCSEL element 331. The p-side electrode 372 is electrically connected to the backside electrode 326 via a conductive layer 382. The p-side electrode 372 is bonded to the conductive layer 382 along the entire periphery extending in a frame shape around the PCSEL element 331. The entire surface of the backside electrode 326 is bonded to the conductive layer 382.

[0116] In each PCSEL element 331, the n-side electrode 373 is electrically connected to the PCSEL element 331. The n-side electrode 373 is electrically connected to the surface electrode 321 via a plurality of wires 362. The wires 362 are connected to the n-side electrode 373 and the surface electrode 321. The plurality of wires 362 are provided at intervals from one another on the n-side electrode 373. The plurality of wires 362 are provided at intervals from one another in the circumferential direction of the n-side electrode 373, which extends in a frame shape around the PCSEL element 331. The plurality of wires 362 are provided around the entire periphery of the n-side electrode 373, which extends in a frame shape around the PCSEL element 331. The plurality of wires 362 are provided on the four sides of the n-side electrode 373, which extends in a rectangular shape.

[0117] The multiple wires 362 may be provided in a partial section in the circumferential direction of the n-side electrode 373. The multiple wires 362 may be provided, for example, on two opposing sides of the n-side electrode 373 that extends in a rectangular shape.

[0118] The adjacent PCSEL elements 331A and 331B are electrically connected to each other via multiple wires 361. The wires 361 are connected to an n-side electrode 373 of the electrode stack 371A and a p-side electrode 372 of the electrode stack 371B. The multiple wires 361 are provided at intervals from each other in the circumferential direction of the p-side electrode 372 and n-side electrode 373 that extend in a frame shape around the PCSEL element 331. The multiple wires 361 are provided on one side of the n-side electrode 373 and on one side of the p-side electrode 372 that extends adjacent to and parallel to the side of the n-side electrode 372.

[0119] The p-side electrode 372 of the electrode laminate 371A is electrically connected to the p-side general terminal 351 via a plurality of wires 366. The n-side electrode 373 of the electrode laminate 371B is electrically connected to the n-side general terminal 352 via a plurality of wires 367.

[0120] 18, current from the p-side main terminal 351 flows through wire 366 to the p-side electrode 372 of the electrode laminate 371A. The current flows from the p-side electrode 372 of the electrode laminate 371A through the conductive layer 382A to the back electrode 326 of the PCSEL device 331A. The current that has flowed through the PCSEL device 331A flows from the front electrode 321 through multiple wires 362 to the n-side electrode 373 of the electrode laminate 371A.

[0121] Current from the n-side electrode 373 of the electrode stack 371A flows through multiple wires 361 to the p-side electrode 372 of the electrode stack 371B. The current flows through the electrode stack 371B and the PCSEL device 331B in the same order as the current flow through the electrode stack 371A and the PCSEL device 331A. The current from the n-side electrode 373 of the electrode stack 371B flows through multiple wires 367 to the n-side general terminal 352.

[0122] In order to achieve the high output required for metal melting, the surface light-emitting unit 300 of this embodiment uses a PCSEL element 331 having a large area when viewed from above at the emission surface 310a. In this case, it is necessary to pass a current uniformly across the large-area PCSEL element 331.

[0123] In contrast, in the present embodiment, an electrode stack 371 consisting of a p-side electrode 372 and an n-side electrode 373 stacked with an insulating layer 374 interposed therebetween is disposed around the PCSEL element 331 when the emission surface 310a is viewed in plan, and the p-side electrode 372 and the n-side electrode 373 are electrically connected to the PCSEL element 331. This configuration allows current to flow from the periphery of the PCSEL element 331 when the emission surface 310a is viewed in plan toward the PCSEL element, and current to flow from the PCSEL element 331 toward the periphery of the PCSEL element 331 when the emission surface 310a is viewed in plan. This allows current to flow uniformly across the entire surface even in the large-area PCSEL element 331.

[0124] Furthermore, the stacked structure of the p-side electrode 372 and the n-side electrode 373 can further reduce the distance between the multiple PCSEL elements 331. This allows the surface emitting unit 300 to be further miniaturized.

[0125] The PCSEL element 331 also has a surface electrode 321 provided along the periphery of the emission surface 310a. The PCSEL element 331 and the n-side electrode 373 are provided on the n-side electrode 373 at intervals from each other and are electrically connected by multiple wires 362 extending between the n-side electrode 373 and the surface electrode 321. This configuration allows current to flow from the PCSEL element 331 through the multiple wires 362 toward the periphery of the PCSEL element 331 when the emission surface 310a is viewed in plan.

[0126] The PCSEL element 331 also has a back surface electrode 326 provided on the back surface 310b of the element body 310. The PCSEL element 331 and the p-side electrode 372 are electrically connected by a conductive layer 382 to which the back surface electrode 326 and the p-side electrode 372 are bonded. This configuration allows current to flow from the periphery of the PCSEL element 331, when the emission surface 310a is viewed in plan, toward the PCSEL element 331 through the conductive layer 382.

[0127] In the present embodiment, the p-side electrode 372 and the n-side electrode 373 have a frame structure surrounding the PCSEL device on all four sides. However, the p-side electrode and the n-side electrode of the present invention may be disposed in at least a portion of the area surrounding the PCSEL device. For example, the p-side electrode and the n-side electrode may have a shape that surrounds the PCSEL device on three sides. Furthermore, the p-side electrode and the n-side electrode may have a divided structure consisting of two parts facing each other across the PCSEL device, or a divided structure consisting of four parts located at the four corners of the PCSEL device.

[0128] (Embodiment 2) Fig. 20 is a perspective view showing a surface light emitting device in accordance with embodiment 2 of the present invention, and Fig. 21 is a circuit diagram showing the surface light emitting device in Fig. 20.

[0129] Surface light emitting device 300C in the present embodiment basically has the same configuration as surface light emitting unit 300A in Embodiment 1. Hereinafter, description of the overlapping structure will not be repeated.

[0130] 20 and 21, a surface light emitting device 300C in this embodiment corresponds to the surface light emitting unit 300 (300A, 300B) in the first embodiment. The surface light emitting device 300C is used for additional processing of a workpiece. More specifically, the surface light emitting device 300C is used for additional processing of a workpiece by directed energy deposition. The surface light emitting device 300C has a plurality of PCSEL elements 331 (331-1 to 331-36). The plurality of PCSEL elements 331 are electrically connected to one another in series. The PCSEL elements 331-1 to 331-36 are arranged in the listed order on a series electrical circuit.

[0131] The multiple PCSEL elements 331 (331-1 to 331-36) are arranged in a 6 × 6 matrix. The multiple PCSEL elements 331 are arranged in a plane including a first direction 510 and a second direction 520. The multiple PCSEL elements 331 are aligned in the first direction 510 and a second direction 520 that is perpendicular to the first direction 510.

[0132] 21 corresponds to the positive direction in first direction 510, and the left direction in first direction 510 corresponds to the negative direction in first direction 510. In addition, the upward direction in second direction 520 corresponds to the positive direction in second direction 520, and the downward direction in second direction 520 corresponds to the negative direction in second direction 520.

[0133] PCSEL element 331-1, PCSEL element 331-2, and PCSEL element 331-3 are aligned in the listed order from the positive side to the negative side of first direction 510. PCSEL element 331-4, PCSEL element 331-5, and PCSEL element 331-6 are aligned in the listed order from the positive side to the negative side of first direction 510. PCSEL element 331-1 and PCSEL element 331-4 are aligned in the listed order from the positive side to the negative side of second direction 520, PCSEL element 331-2 and PCSEL element 331-5 are aligned in the listed order from the positive side to the negative side of second direction 520, and PCSEL element 331-3 and PCSEL element 331-6 are aligned in the listed order from the positive side to the negative side of second direction 520.

[0134] PCSEL elements 331-7 to 331-9, PCSEL elements 331-10 to 331-12, PCSEL elements 331-13 to 331-15, and PCSEL elements 331-16 to 331-18 are arranged in the first direction 510 and the second direction 520 in the same order as above.

[0135] The PCSEL elements 331-19 to 331-36 are provided at positions obtained by moving the PCSEL elements 331-1 to 331-18, respectively, in point symmetry with respect to the center of the light-emitting surface of the surface light-emitting device 300C.

[0136] The multiple PCSEL elements 331 are mounted on the heat sink 386 in groups of PCSEL elements 331-1 to 331-9, PCSEL elements 331-10 to 331-18, PCSEL elements 331-19 to 331-27, and PCSEL elements 331-28 to 331-36.

[0137] The surface light emitting device 300C further includes a plurality of switching elements 431 (431-1 to 431-36) and a plurality of gate drivers 440.

[0138] The plurality of switching elements 431 are electrically connected in parallel to the plurality of PCSEL elements 331. Switching elements 431-1 to 431-36 are provided corresponding to PCSEL elements 331-1 to 331-36, respectively. Switching elements 431 are made up of transistors capable of handling large currents. Switching elements 431 are made up of, for example, GaN-Field Effect Transistors (FETs).

[0139] The multiple switching elements 431 are arranged adjacent to the multiple PCSEL elements 331 arranged in a matrix. The multiple PCSEL elements 331 are arranged in a planar manner within a plane including the first direction 510 and the second direction 520. The multiple switching elements 431 are arranged linearly along the periphery of the multiple PCSEL elements 331 arranged in a matrix.

[0140] Switching elements 431-1 to 431-36 are provided corresponding to PCSEL elements 331-1 to 331-36, respectively. Switching elements 431-1 to 431-18 are aligned in second direction 520 along PCSEL element 331-1, PCSEL element 331-4, PCSEL element 331-7, PCSEL element 331-10, PCSEL element 331-13, and PCSEL element 331-16 in the listed order. Switching elements 431-1 to 431-3 face PCSEL element 331-1 in the second direction 520, switching elements 431-4 to 431-6 face PCSEL element 331-4 in the second direction 520, switching elements 431-7 to 431-9 face PCSEL element 331-7 in the second direction 520, switching elements 431-10 to 431-12 face PCSEL element 331-10 in the second direction 520, switching elements 431-13 to 431-15 face PCSEL element 331-13 in the second direction 520, and switching elements 431-16 to 431-18 face PCSEL element 331-16 in the second direction 520.

[0141] The switching elements 431-19 to 431-36 are provided at positions obtained by moving the switching elements 431-1 to 431-18 point-symmetrically with respect to the center of the light-emitting surface of the surface light-emitting device 300C, respectively.

[0142] The plurality of gate drivers 440 are provided corresponding to the plurality of switching elements 431, respectively. The gate drivers 440 drive and control the switching elements 431 by applying a voltage to the gates of the switching elements 431.

[0143] The multiple gate drivers 440 are arranged facing the multiple switching elements 431 in the first direction 510. The multiple switching elements 431 and the multiple gate drivers 440 are mounted on the printed circuit board 441 in groups of two: a group of the multiple gate drivers 440 corresponding to the switching elements 431-1 to 431-18 and the switching elements 431-1 to 431-18, and a group of the multiple gate drivers 440 corresponding to the switching elements 431-19 to 431-36 and the switching elements 431-19 to 431-36.

[0144] FIG. 22 is a plan view showing one mode of light emission in the surface light-emitting device in FIG. 21. The two arrows attached to each PCSEL element 331 in FIG. 21 correspond to the mode of light emission shown in FIG. 22. Also, in FIG. 21, the arrows indicate current flow. Referring to FIGS. 20 to 22, when a switching element 431 is turned off, no current flows through that switching element 431, and the PCSEL element 331 electrically connected in parallel to that switching element 431 is energized. On the other hand, when a switching element 431 is turned on, current flows through that switching element 431, and the PCSEL element 331 electrically connected in parallel to that switching element 431 is de-energized.

[0145] 21 and 22, switching element 431-1, switching element 431-9, switching element 431-12, switching element 431-16, switching element 431-19, switching element 431-27, switching element 431-30, and switching element 431-34 are turned on, and the remaining switching elements 431 are turned off. As a result, PCSEL element 331-1, PCSEL element 331-9, PCSEL element 331-12, PCSEL element 331-16, PCSEL element 331-19, PCSEL element 331-27, PCSEL element 331-30, and PCSEL element 331-34 are not emitting light, and the remaining PCSEL elements 331 are emitting light. The light emission behavior of the multiple PCSEL elements 331 is symmetrical with respect to each of lines that pass through the center of the light-emitting surface of the surface-emitting device 300C and extend in the first direction 510 and the second direction 520.

[0146] 23 and 24 are plan views showing another aspect of light emission in a surface light emitting device. Referring to Fig. 23, all of switching elements 431-1 to 431-36 are turned off. As a result, all of PCSEL elements 331-1 to 331-36 emit light.

[0147] 24, switching element 431-12, switching element 431-15, switching element 431-17, switching element 431-18, switching element 431-20, switching element 431-21, switching element 431-24, and switching element 431-27 are turned on, and the remaining switching elements 431 are turned off. As a result, PCSEL element 331-12, PCSEL element 331-15, PCSEL element 331-17, PCSEL element 331-18, PCSEL element 331-20, PCSEL element 331-21, PCSEL element 331-24, and PCSEL element 331-27 are not emitting light, and the remaining PCSEL elements 331 are emitting light. The light emission behavior of the multiple PCSEL elements 331 is asymmetric with respect to a line passing through the center of the light-emitting surface of the surface-emitting device 300C and extending in the first direction 510, while it is symmetric with respect to a line passing through the center of the light-emitting surface of the surface-emitting device 300C and extending in the second direction 52.

[0148] As described above, in the surface light emitting device 300C of this embodiment, any of the multiple PCSEL elements 331 can be made to emit light by selectively turning on and off the multiple switching elements 431. This makes it possible to change the spot shape of the laser light formed on the workpiece surface in accordance with various processing conditions for additional processing, such as the shape of the workpiece surface, the area to be melted in the workpiece, or the scanning direction of the additional processing head 200 relative to the workpiece.

[0149] The spot shape of the laser light emitted from the condenser lens 221 changes depending on the distance from the focal position. For example, at a position 15 mm closer to the condenser lens 221 from the focal position, a spot shape similar to the light emission mode of the surface light emitting device 300C is obtained, and as the laser light spot gets smaller closer to the condenser lens 221 from the focal position, the corners of the spot shape become rounded, and at the focal position, a single-peaked spot shape is obtained.

[0150] Fig. 25 is a plan view showing the surface light emitting device in the area surrounded by the two-dot chain line XXV in Fig. 20. Fig. 26 is a side view showing the surface light emitting device as viewed in the direction indicated by the arrow XXVI in Fig. 25. Fig. 27 is a cross-sectional view showing the surface light emitting device as viewed in the direction of the arrows on the line XXVII-XXVII in Fig. 26. Fig. 28 is a cross-sectional view showing the surface light emitting device as viewed in the direction of the arrows on the line XXVIII-XXVIII in Fig. 26. Fig. 29 is a cross-sectional view showing the surface light emitting device as viewed in the direction of the arrows on the line XXIX-XXIX in Fig. 26.

[0151] Fig. 30 is a cross-sectional view showing the surface light emitting device as seen in the direction of the arrows on the line XXX-XXX in Fig. 25. Fig. 31 is a diagram schematically showing wiring between the electrode stack and the switching element in Fig. 30.

[0152] 25 to 31, the surface light emitting device 300C further includes an electrode stack 461. The following describes the structure of the electrode stack 461 provided for the PCSEL elements 331-1, 331-2, and 331-3 aligned in the first direction 510, as a representative example, but the electrode stacks 461 provided for the PCSEL elements 331-4 to 331-36 also have the same structure.

[0153] The electrode stack 461 forms a current path for the PCSEL element 331-1, a current path for the PCSEL element 331-2, and a current path for the PCSEL element 331-3. The electrode stack 461 has a layer structure in a third direction 530 that is perpendicular to the first direction 510 and the second direction 520. The third direction 530 is the direction in which laser light is emitted from the PCSEL element 331 (the thickness direction of the element body 310).

[0154] The electrode stack 461 has a first layer 471 (471A, 471B, 471C) and a second layer 472 (472A, 472B, 472C).

[0155] The first layer 471 constitutes a current path flowing into the PCSEL element 331. The second layer 472 constitutes a current path flowing out of the PCSEL element 331. The first layer 471 and the second layer 472 are provided in pairs corresponding to each of the PCSEL elements 331, i.e., PCSEL element 331-1, PCSEL element 331-2, and PCSEL element 331-3.

[0156] The first layer 471 has a p-side electrode portion 471p and a first extension portion 471e. The p-side electrode portion 471p has a configuration corresponding to the p-side electrode 372 described in the first embodiment. When viewed in the third direction 530, the p-side electrode portion 471p extends in a frame shape around the PCSEL element 331. When viewed in the third direction 530, the p-side electrode portion 471p extends in a rectangular shape along the outer periphery of the PCSEL element 331.

[0157] The p-side electrode portion 471p is electrically connected to the PCSEL element 331. The p-side electrode portion 471p is joined to the conductive layer 382, ​​which is a plated layer, via the conductive layer 456. The back electrode 326 of the PCSEL element 331 is joined to the conductive layer 382, ​​which is a plated layer. The p-side electrode 372 is electrically connected to the back electrode 326 via the conductive layer 456 and the conductive layer 382.

[0158] The first extending portion 471e extends in the first direction 510 from the p-side electrode portion 471p toward the switching element 431. The first extending portion 471e extends in the first direction 510 at a position offset in the second direction 520 from the PCSEL element 331. The first extending portion 471e extends in the first direction 510 on both sides of the PCSEL element 331 in the second direction 520.

[0159] The second layer 472 has an n-side electrode portion 472n and a second extension portion 472e. The n-side electrode portion 472n has a configuration corresponding to the n-side electrode 373 described in the first embodiment. When viewed in the third direction 530, the n-side electrode portion 472n extends in a frame shape around the PCSEL element 331. When viewed in the third direction 530, the n-side electrode portion 472n extends in a rectangular shape along the outer periphery of the PCSEL element 331. The n-side electrode portion 472n forms a layered structure with the p-side electrode portion 471p in the third direction 530, with an insulating layer 481 interposed between them.

[0160] The n-side electrode portion 472n is electrically connected to the PCSEL element 331. The n-side electrode portion 472n is electrically connected to the surface electrode 321 via a plurality of wires 362. The wires 362 are connected to the n-side electrode portion 472n and the surface electrode 321. The plurality of wires 362 are provided at intervals from one another in the circumferential direction of the n-side electrode 373, which extends in a frame shape around the PCSEL element 331. The plurality of wires 362 are provided on two opposing sides of the rectangular extending n-side electrode portion 472n in the first direction 510.

[0161] The second extending portion 472e extends in the first direction 510 from the n-side electrode portion 472n toward the switching element 431. The second extending portion 472e extends in the first direction 510 at a position offset in the second direction 520 from the PCSEL element 331. The second extending portion 472e extends in the first direction 510 on both sides of the PCSEL element 331 in the second direction 520. The second extending portion 472e forms a layered structure with the n-side electrode portion 472n in the third direction 530, with the insulating layer 481 interposed between them.

[0162] The first layer 471A and the second layer 472A are provided corresponding to the PCSEL element 331-1. The first layer 471B and the second layer 472B are provided corresponding to the PCSEL element 331-2. The first layer 471C and the second layer 472C are provided corresponding to the PCSEL element 331-3.

[0163] The p-side electrode portion 471p of the first layer 471A extends in a frame shape around the PCSEL element 331-1 when viewed in the third direction 530. The first extending portion 471e of the first layer 471A extends in the first direction 510 from the p-side electrode portion 471p of the first layer 471A toward the switching elements 431-1 to 431-3. The p-side electrode portion 471p of the first layer 471B extends in a frame shape around the PCSEL element 331-2 when viewed in the third direction 530. The first extending portion 471e of the first layer 471B extends in the first direction 510 from the p-side electrode portion 471p of the first layer 471B toward the switching elements 431-1 to 431-3. The p-side electrode portion 471p of the first layer 471C extends in a frame shape around the PCSEL element 331-3 when viewed in the third direction 530. The first extending portion 471e of the first layer 471C extends in the first direction 510 from the p-side electrode portion 471p of the first layer 471C toward the switching elements 431-1 to 431-3.

[0164] 27 and 30, in the range from PCSEL element 331-1 toward switching elements 431-1 to 431-3 in first direction 510, first layer 471A, first layer 471B, first layer 471C, second layer 472A, second layer 472B, and second layer 472C form a layer structure in third direction 530 with insulating layer 481 interposed therebetween. As shown in Figures 28 and 30, in the range from PCSEL element 331-2 to just before PCSEL element 331-1 in first direction 510, first layer 471B, first layer 471C, second layer 472B, and second layer 472C form a layer structure in third direction 530 with insulating layer 481 interposed therebetween. As shown in FIGS. 29 and 30, in the range in the first direction 510 from the PCSEL element 331-3 to just before the PCSEL element 331-2, the first layer 471C and the second layer 472C form a layer structure in the third direction 530 with the insulating layer 481 interposed therebetween.

[0165] 31, the surface light-emitting device 300C further includes a first wiring 551, a second wiring 552, a third wiring 553, a fourth wiring 554, a fifth wiring 556, a sixth wiring 557, and a seventh wiring 558. The first wiring 551, the second wiring 552, the third wiring 553, the fourth wiring 554, the fifth wiring 556, the sixth wiring 557, and the seventh wiring 558 are provided on the printed circuit board 441 in FIG.

[0166] The first wiring 551 extends from the positive side of the power supply 341 in FIG. 21 and is connected to the first layer 471A. The second wiring 552 is connected to the second layer 472A and the first layer 471B. The third wiring 553 is connected to the second layer 472B and the first layer 471C. The fourth wiring 554 is connected to the second layer 472C and the first layer 471A provided corresponding to the PCSEL element 331-4 in FIG. 21.

[0167] The fifth wiring 556 is connected to the first wiring 551 and the second wiring 552. A switching element 431-1 is provided on the path of the fifth wiring 556. The sixth wiring 557 is connected to the second wiring 552 and the third wiring 553. A switching element 431-2 is provided on the path of the sixth wiring 557. The seventh wiring 558 is connected to the third wiring 553 and the fourth wiring 554. A switching element 431-3 is provided on the path of the seventh wiring 558.

[0168] With this configuration, PCSEL element 331-1, PCSEL element 331-2, and PCSEL element 331-3 are electrically connected in series by first wiring 551, second wiring 552, third wiring 553, and electrode stack 461. Switching element 431-1 is electrically connected in parallel to PCSEL element 331-1, switching element 431-2 is electrically connected in parallel to PCSEL element 331-2, and switching element 431-3 is electrically connected in parallel to PCSEL element 331-3.

[0169] In this embodiment, a plurality of PCSEL elements 331 are arranged in a matrix so as to be aligned in a first direction 510 and a second direction 520 perpendicular to the first direction 510. In such a configuration, by causing any of the plurality of PCSEL elements 331 to emit light, the shape of the laser light spot formed on the workpiece surface can be freely changed to a shape that matches the conditions for additional processing of the workpiece.

[0170] Furthermore, the multiple switching elements 431 are arranged linearly along the periphery of the multiple PCSEL elements 331 extending in the second direction 520. With this configuration, the spacing between the multiple PCSEL elements 331 can be kept small compared to when the switching elements 431 are provided in an area where the multiple PCSEL elements 331 are arranged.

[0171] The electrode stack 461 has a first layer 471 having a p-side electrode portion 471p and a first extending portion 471e, and a second layer 472 having an n-side electrode portion 472n and a second extending portion 472e, where the p-side electrode portion 471p and the n-side electrode portion 472n form a layered structure in the third direction 530, and the first extending portion 471e and the second extending portion 472e form a layered structure in the third direction 530. This configuration enables electrical connection between the PCSEL elements 331 and the switching elements 431 through the electrode stack 461 while keeping the installation area of ​​the electrode stack 461 small in the planar direction in which the multiple PCSEL elements 331 are arranged.

[0172] Furthermore, a first layer 471 and a second layer 472 are provided corresponding to each of the PCSEL elements 331 of the plurality of PCSEL elements 331-1 to 331-3 aligned in the first direction 510, and these plurality of sets of first layers 471 and second layers 472 form a layered structure in the third direction 530. With this configuration, it is possible to keep the installation area of ​​the electrode stack 461 small in the planar direction in which the plurality of PCSEL elements 331 are arranged, while enabling electrical connection between the PCSEL elements 331-1 to 331-3 and the switching elements 431-1 to 431-3 through the electrode stack 461.

[0173] In this embodiment, the multiple switching elements 431 are arranged linearly along the periphery of the multiple PCSEL elements 331 extending in the second direction 520, but this is not limiting. By changing the structure of the electrode stack, the multiple switching elements 431 may be arranged linearly along the periphery of the multiple PCSEL elements 331 extending in the first direction 510, or some of the multiple switching elements 431 may be arranged linearly along the first direction 510 and the other parts of the multiple switching elements 431 may be arranged linearly along the second direction 520.

[0174] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present invention is defined by the claims, not by the above description, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0175] 100 Processing machine, 101, 102, 105 Rotation center axis, 104 Predetermined axis, 106 Swivel center axis, 111 First work spindle, 116 Second work spindle, 121 Tool spindle, 122 Spindle body, 123 Spindle end face, 125 Tool insertion hole, 126 Clamping mechanism, 127 Collet, 128 Draw bar, 129 Spring member, 131 Tool rest, 132 Swivel part, 141 Bed, 150 Processing area, 161 Cover body, 200, 600 Additional processing head, 201 Central axis, 210 Straight line, 211 Head part, 216 Laser light emission part, 217 Material powder discharge part, 221 Condenser lens, 222 Plane, 223 Convex surface, 231 Shank portion, 300, 300A, 300B surface light emitting portion, 300C surface light emitting device, 310 element body, 310a emission surface, 310b back surface, 311 substrate, 312 n-type cladding layer, 313 active layer, 314 carrier block layer, 315 photonic crystal layer, 316 air holes, 317 p-type cladding layer, 318 p-type contact layer, 319 back surface reflector, 321 front surface electrode, 322 AR coating layer, 326 back surface electrode, 331, 331A, 331B PCSEL element, 341 power supply, 351 p-side terminal, 352 n-side terminal, 361, 362, 366, 367 wire, 371, 371A, 371B, 461 electrode stack, 372 p-side electrode, 373 n-side electrode, 374, 481; insulating layer, 381, 381A, 381B; submount, 382, ​​382A, 382B, 456; conductive layer, 383; solder layer, 386; heat sink, 431; switching element, 440; gate driver, 441; printed circuit board, 471, 471A, 471B, 471C; first layer, 471e; first extension, 471p; p-side electrode portion, 472n; n-side electrode portion, 472, 472A, 472B, 472C; second layer, 472e; second extension, 510; first direction, 520; second direction, 530; third direction, 551; first wiring, 552; second wiring, 553; third wiring, 554; fourth wiring, 556; fifth wiring, 557; sixth wiring, 558; seventh wiring, 611 Optical fiber, 612 collimating lens, 613 first reflecting mirror, 614 second reflecting mirror, 615 third reflecting mirror, 616 fourth reflecting mirror, 617 fifth reflecting mirror.

Claims

1. A surface light emitting device used for additional processing of a workpiece, a plurality of photonic crystal surface-emitting laser (PCSEL) elements electrically connected in series with one another; and a plurality of switching elements electrically connected in parallel to the plurality of PCSEL elements, respectively.

2. The surface light emitting device according to claim 1 , wherein the plurality of PCSEL elements are arranged in a matrix so as to be aligned in a first direction and a second direction perpendicular to the first direction.

3. The surface emitting device according to claim 2 , wherein at least some of the switching elements are linearly arranged along peripheries of the PCSEL elements extending in the second direction.

4. The surface emitting device further includes an electrode stack, The electrode stack is a first layer including a p-side electrode portion that extends in a frame shape around the PCSEL element when viewed in a third direction perpendicular to the first and second directions and is electrically connected to the PCSEL element, and a first extension portion that extends in the first direction from the p-side electrode portion toward the switching element; 4. The surface emitting device according to claim 3, further comprising: an n-side electrode portion that extends in a frame shape around the PCSEL element when viewed in the third direction, that forms a layer structure with the p-side electrode portion in the third direction via an insulating layer, and that is electrically connected to the PCSEL element; and a second extension portion that extends in the first direction from the n-side electrode portion toward the switching element, and that forms a layer structure with the first extension portion in the third direction via an insulating layer.

5. the plurality of PCSEL elements include a first PCSEL element and a second PCSEL element aligned in the first direction; the first layer and the second layer are provided corresponding to the first PCSEL element and the second PCSEL element, respectively; 5. The surface emitting device according to claim 4, wherein the first layer provided corresponding to the first PCSEL element, the second layer provided corresponding to the first PCSEL element, the first layer provided corresponding to the second PCSEL element, and the second layer provided corresponding to the second PCSEL element form a layer structure in the third direction with an insulating layer interposed therebetween.

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