Thermal conductive component and electronic apparatus

Abstract

To improve the cooling performance while suppressing noise of an electronic apparatus including a high heat-generating electric component with a simple configuration.SOLUTION: In an electronic apparatus 100, a heat conduction component 170 includes: a shield part 160 covering an electric component 110 on a circuit board 120 and shielding noise; and a heat transfer elastic part 150 disposed on the upper surface of the shield part 160, the heat transfer elastic part transferring heat of the electric component 110 to a heat dissipation component 140. The shield part 160 is electrically connected to a ground connection part 130 on the circuit board 120 and is in contact with the electric component 110 with a predetermined pressure.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a heat conducting component and an electronic device. [Background technology]

[0002] There are electronic devices that have circuit boards mounted with heat-generating electrical components inside their housings. While the amount of heat generated by these electrical components increases as their functionality becomes more sophisticated, market demands are driving the miniaturization of these components. For this reason, various measures are being taken, such as providing metal heat dissipation components to transfer heat from the electrical components and keep them within a guaranteed temperature range.

[0003] There is a shielding structure for an LSI case that includes a wiring board having a ground pad connected to a power supply layer of a reference potential, an LSI case that is mounted on the wiring board and stores a semiconductor element, and has a heat sink mounting structure that can be attached and detached with screws, and a box-shaped shielding fence that covers the LSI case and is fixed in a position where a part of it comes into contact with the ground pad of the wiring board when the LSI case is sandwiched and fixed between the LSI case and the heat sink (see, for example, Patent Document 1).

[0004] 5 is a schematic diagram showing the shielding structure disclosed in Patent Document 1, omitting the LSI case. In the technology disclosed in Patent Document 1, a heat dissipation sheet (heat transfer sheet) is also sandwiched and fixed between the shielding fence and the mounting plate of the LSI case, and between the shielding fence and the heat sink. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 07-86786 Summary of the Invention [Problem to be solved by the invention]

[0006] The following analysis has been carried out by the inventors of the present invention.

[0007] According to the technology disclosed in Patent Document 1, a semiconductor element mounted on a wiring board is covered with a shielding fence to prevent noise from the semiconductor element, which is a heat-generating electrical component, from propagating to a heat sink, which is a heat-dissipating component. This shielding fence is then fixed in contact with the ground pad of the wiring board, thereby confining noise from the semiconductor element within the shielding fence and transmitting heat from the semiconductor element to the heat sink. To transfer heat in this state, heat-transfer sheets are mounted above and below the shielding fence.

[0008] In this type of configuration, contact thermal resistance occurs between the heat transfer sheet and the contact surfaces of each component. To reduce this contact thermal resistance, it is necessary to apply appropriate pressure to the contact surfaces. For this reason, the heat transfer sheet is made of an elastic material, and pressure is applied to the contact surfaces by pressing it into place.

[0009] For example, if the pressure is too small, the contact thermal resistance will increase, while if it is too large, the circuit board will deform, leading to damage to surrounding electrical components. For this reason, it is necessary to apply an appropriate amount of pressure. Considering that the thickness of the heat transfer sheet and electrical components varies, a certain thickness of the heat transfer sheet is necessary to achieve the appropriate pressure. However, the thermal conductivity of the material used for heat transfer sheets is about 1 / 10 to 1 / 100 that of metal. Therefore, increasing this thickness increases the resistance to heat transfer from the electrical component to the heat dissipation component.

[0010] Furthermore, inserting multiple heat transfer sheets increases the number of locations where contact thermal resistance occurs, increasing the total thermal resistance between the electrical components and the heat dissipating components, and suppressing the amount of heat transfer, making it difficult to improve cooling performance.

[0011] The present invention has been made in consideration of the above circumstances, and aims to provide a technology that has a simple configuration and contributes to improving cooling performance while suppressing noise in electronic devices that include highly heat-generating electrical components. [Means for solving the problem]

[0012] According to a first aspect of the present disclosure, a shielding portion that covers electrical components mounted on the circuit board and shields them from noise; a heat-transfer elastic body disposed on an upper surface of the shield portion and configured to transfer heat from the electrical component to a heat-dissipating component, The shield portion is electrically connected to a ground portion provided on the circuit board, and a heat conducting part is provided that contacts the electrical part with a predetermined pressure.

[0013] According to a second aspect of the present disclosure, The heat conducting component described above; the circuit board; the electrical component mounted on the circuit board; the heat dissipation component that dissipates heat from the electrical component; and the ground connection portion provided on the circuit board. [Effects of the Invention]

[0014] According to the present invention, it is possible to improve the cooling performance of an electronic device that includes highly heat-generating electrical components while suppressing noise with a simple configuration. [Brief explanation of the drawings]

[0015] [Figure 1] FIG. 1A is a schematic cross-sectional view of an example of an electronic device equipped with a heat conducting component according to the present disclosure; FIG. 1B is a schematic cross-sectional view of an example of a heat conducting component according to the present disclosure; and FIG. 1C is an exploded oblique view of an example of an electronic device equipped with a heat conducting component according to the present disclosure. [Figure 2] 5(a) and 5(b) are explanatory diagrams for explaining dimensions of a heat conducting component according to the present disclosure. [Figure 3] 10(a) and 10(b) are schematic cross-sectional views of another example of an electronic device including a heat conducting component according to the present disclosure. [Figure 4]1A is a schematic cross-sectional view of another example of a heat conducting component according to the present disclosure, and FIG. 1B is an exploded perspective view of another example of an electronic device including a heat conducting component according to the present disclosure. [Figure 5] FIG. 10 is a schematic cross-sectional view of a conventional electronic device. DETAILED DESCRIPTION OF THE INVENTION

[0016] <<First Embodiment>> A first embodiment of a heat conduction component for an electronic device to which the present disclosure is applied will be described with reference to the drawings. Note that the present disclosure is not limited to the following embodiment, and various modifications are possible within the scope of the gist of the present disclosure. Furthermore, the drawings are schematic, and the ratios of dimensions may differ from those of the actual components. Specific dimensions should be determined with reference to the following explanation. Furthermore, the drawings may include portions in which the dimensional relationships and ratios differ from one another. Reference symbols in the drawings are assigned to each element for convenience as an example to facilitate understanding, and are not intended to limit the present invention to the illustrated embodiments.

[0017] Furthermore, regardless of the orientation of the electronic device, the vertical and horizontal directions on the drawings will be referred to as vertical and horizontal directions in the description in this specification.

[0018] 1(a) is a schematic cross-sectional view of an electronic device 100 including a heat conducting component 170 according to the present disclosure. As shown in this figure, the electronic device 100 further includes an electric component 110, a circuit board 120, a grounding portion 130, and a heat dissipation component 140.

[0019] The electric component 110 is, for example, a semiconductor element, which receives power and generates heat, and is also a source of noise such as electromagnetic noise.

[0020] The circuit board 120 is a board on which the electric component 110 is mounted. The circuit board 120 has a ground contact portion 130 thereon. The ground contact portion 130 is provided so as to surround the electric component 110, for example, as shown in FIG. 1(c).

[0021] The heat dissipation component 140 receives heat from the electric component 110 and dissipates the heat, thereby lowering the temperature of the electric component 110 .

[0022] 1(a), the heat conducting component 170 of this embodiment is sandwiched and fixed between the circuit board 120 and the heat dissipation component 140. The heat conducting component 170 also covers the electric component 110 mounted on the circuit board 120, shielding it from noise from the electric component 110. The heat conducting component 170 also contacts the electric component 110 and the heat dissipation component 140 with a predetermined pressure, thereby transferring heat generated by the electric component 110 to the heat dissipation component 140.

[0023] For this reason, the heat conducting component 170 includes a shielding portion 160 for shielding against noise, and a heat conducting elastic body 150 for conducting heat from the electric component 110 to the heat dissipation component 140, as shown in FIG. 1(b).

[0024] 1(a) and 1(c), the shield section 160 is arranged to cover the electrical component 110 mounted on the circuit board 120. At this time, the shield section 160 is electrically connected to the ground connection section 130 provided on the circuit board 120, for example, by contacting the shield section 160 with a predetermined pressure. Furthermore, the shield section 160 of this embodiment contacts the electrical component 110 with a predetermined pressure.

[0025] The heat-transfer elastic body 150 is disposed on the side and top surfaces of the shield portion 160. The heat-transfer elastic body 150 contacts the heat-dissipating component 140 with a predetermined pressure, and transfers the heat of the electrical component 110 received through the shield portion 160 to the heat-dissipating component 140.

[0026] Generally, the thermal conductivity of materials used for the heat transfer elastic body 150 is low, 1 / 10 to 1 / 100 that of metal. For this reason, the amount of heat transfer increases by making the heat transfer elastic body 150 as thin as possible and bringing the electrical component 110 and the heat dissipation component 140 closer together. In other words, the amount of heat transfer is inversely proportional to the thickness of the heat transfer elastic body 150. On the other hand, the closer the electrical component 110 and the heat dissipation component 140 are brought together, the more noise from the electrical component 110 propagates to the heat dissipation component 140, and the more noise is spread throughout the entire electronic device 100 by the heat dissipation component 140.

[0027] However, the heat conducting component 170 of this embodiment includes a shield portion 160 that covers the electric component 110, and the shield portion 160 is electrically connected to the ground portion 130. The heat conducting component 170 is then sandwiched and fixed between the heat dissipation component 140 and the circuit board 120 that has the ground portion 130. This allows for stable grounding, and noise from the electric component 110 can be effectively contained within the shield portion 160. Therefore, because the shield portion 160 sufficiently suppresses noise, the heat conducting elastic body 150 does not need to be thick.

[0028] Therefore, the heat conduction component 170 of this embodiment can provide a single layer of heat transfer elastomer 150. As described above, contact thermal resistance occurs between the heat transfer elastomer 150 and the contact surface of other components, hindering heat transfer from the electrical component 110 to the heat dissipation component 140. However, according to this embodiment, the heat transfer elastomer 150 is single-layered, which reduces contact thermal resistance compared to conventional configurations in which the heat transfer elastomer 150 has multiple layers. Furthermore, the heat conduction component 170 of this embodiment contacts the electrical component 110 and the heat dissipation component 140 with a predetermined pressure. This further reduces the contact thermal resistance between the heat transfer elastomer 150 and the electrical component 110, thereby increasing the amount of heat transferred from the electrical component 110 to the heat dissipation component 140 and improving cooling performance. Furthermore, by setting the predetermined pressure to a level that does not cause deformation of the circuit board, damage to surrounding electrical components can be prevented.

[0029] Therefore, according to this embodiment, it is possible to improve the cooling performance while suppressing noise from the electronic device 100 including the electrical component 110 that generates a high amount of heat, with a simple configuration.

[0030] <<Second embodiment>> Next, a second embodiment to which the present invention is applied will be described. In this embodiment, an electronic device 100 including the heat conducting component 170 of the first embodiment will be described as an example. In this embodiment, components with the same names as those in the first embodiment basically have the same functions as those in the first embodiment. Below, this embodiment will be described, focusing on the differences from the first embodiment.

[0031] As shown in FIG. 1(a), the electronic device 100 of this embodiment includes an electric component 110, a circuit board 120, a grounding portion 130, a heat conducting component 170, and a heat dissipation component 140.

[0032] As in the first embodiment, the electrical component 110 is, for example, a semiconductor element or the like, which receives power and generates heat. It is also a source of noise such as electromagnetic noise. For example, the electrical component 110 may be an integrated circuit such as an IC (Integrated Circuit) or an LSI (Large Scale Integration), a CPU (Central Processing Unit), an MPU (Microprocessing Unit), a graphic calculation element, an image sensor, or the like.

[0033] The circuit board 120 is a board on which the electric component 110 is mounted. The circuit board 120 has a ground connection portion 130 thereon. The ground connection portion 130 is provided on the circuit board 120 so as to surround the electric component 110, for example, as shown in FIG. 1(c).

[0034] The heat dissipation component 140 receives heat from the electrical component 110 and dissipates it to the outside, thereby lowering the temperature of the electrical component 110. There are no particular limitations on the type, and the heat dissipation component 140 may be, for example, a radiator, a cooler, a heat sink, a heat spreader, a die pad, a cooling fan, a heat pipe, a metal cover, an electronic device housing, or the like.

[0035] The heat conducting component 170 of this embodiment covers the electric component 110 mounted on the circuit board 120 , shields the electric component 110 from noise, and transfers the heat generated by the electric component 110 to the heat dissipation component 140 .

[0036] 1(b) and 1(c), the heat conducting component 170 of this embodiment has a box shape with an upper bottom portion and no lower bottom portion. As in the first embodiment, the heat conducting component 170 of this embodiment is also placed on the ground contact portion 130 on the circuit board 120 so as to cover the electric component 110 mounted on the circuit board 120.

[0037] Moreover, the heat conducting component 170 is flexible as a whole, and is sandwiched and fixed between the heat dissipation component 140 and the circuit board 120 .

[0038] The heat conducting component 170 of this embodiment includes a heat conducting elastic body 150 and a shield portion 160, similar to the first embodiment.

[0039] The shielding section 160 has a shielding function and shields noise from the electrical component 110. As shown in Figures 1(b) and 1(c), the shielding section 160 is formed in a box shape, and is arranged to cover the electrical component 110 mounted on the circuit board 120, as shown in Figures 1(a) and 1(c).

[0040] 1(b), the shield part 160 of this embodiment includes a side part 160s, an upper part 160u, and a bottom part 160b. The bottom part 160b is provided at the bottom of the side part of the box-shaped heat conducting component 170. In this embodiment, the bottom part 160b is electrically connected to the ground contact part 130, thereby grounding the shield part 160.

[0041] The shield portion 160 may be, for example, a metal sheet made of a metal such as aluminum. The shield portion 160 is flexible and is formed to have strength and thickness sufficient to conform to the shape of the heat transfer elastic body 150.

[0042] The material of the shield portion 160 is not particularly limited as long as it has high electrical conductivity and a high electromagnetic wave shielding effect. For example, metals with high electrical conductivity such as aluminum, copper, and stainless steel, as well as magnetic materials with high electrical conductivity, can be used. Examples of magnetic materials with high electrical conductivity include permalloy, sendust, Fe-based or Co-based amorphous materials, and microcrystalline materials. When the magnetic materials described above are used as the constituent materials, magnetic shielding and magnetic absorption effects can be expected in addition to the electrical shielding effect.

[0043] The heat transfer elastic body 150 transfers heat from the electric component 110 to the heat dissipation component 140. The heat transfer elastic body 150 of this embodiment is disposed so as to cover the upper and side peripheries of the shield part 160.

[0044] The heat transfer elastic body 150 is made of an elastic material that deforms with a relatively small force and has a reaction force. It also has insulating properties. For example, a material containing a mixture of acrylic rubber or silicone rubber is desirable. Alternatively, it may be a heat transfer sheet, which is a sheet-shaped resin material filled with a thermally conductive filler. The heat transfer sheet has a thermal conductivity that is approximately 1 / 10 to 1 / 100 of that of metal.

[0045] 2(a), the height dimension (height dimension) Da of the heat conducting component 170 is equal to or greater than the distance dimension (distance dimension) Sa from the upper surface of the circuit board 120 to the lower surface of the heat dissipation component 140 of the electronic device 100. In this case, it is desirable that Da>Sa. As a result, when the heat conducting component 170 is sandwiched and fixed between the heat dissipation component 140 and the circuit board 120, the reaction force of the heat transfer elastic body 150 presses the bottom 160b of the shield part 160 against the ground contact part 130, ensuring stable conduction.

[0046] 2(b), the thickness dimension (thickness dimension) Db of the upper portion of the heat conducting component 170 is equal to or greater than the distance dimension (distance dimension) Sb from the upper surface of the electrical component 110 to the lower surface of the heat dissipation component 140 of the electronic device 100. In this case, it is desirable that Db>Sb. Thus, when the heat conducting component 170 is sandwiched and fixed between the heat dissipation component 140 and the circuit board 120, the heat conducting component 170 contacts the upper surface of the electrical component 110 with a predetermined pressure, and the shield part 160 contacts the lower surface of the heat dissipation component 140 with a predetermined pressure. Furthermore, the contact surfaces between the electrical component 110 and the upper surface part 160u of the shield part 160, the contact surface between the shield part 160 and the heat transfer elastomer 150, and the contact surface between the heat transfer elastomer 150 and the heat dissipation component 140 are in contact due to the reaction force of one heat transfer elastomer 150 (one layer). Therefore, tight contact is possible without any air bubbles entering between the contact surfaces. This makes it possible to reduce the contact thermal resistance.

[0047] As described above, the heat conducting component 170 of this embodiment has the same configuration as that of the first embodiment, and therefore provides the same effects as those of the first embodiment.

[0048] Furthermore, the heat conduction component 170 of this embodiment has the above-described dimensions, ensuring stable electrical conduction and reducing contact thermal resistance. Furthermore, the distance between the electrical component 110 and the heat dissipation component 140 can be reduced, reducing the total thermal resistance and, as a result, increasing the amount of heat transfer. This improves cooling performance.

[0049] According to this embodiment, with a simple configuration, it is possible to improve the cooling performance while suppressing noise from the electronic device 100 including the electrical component 110 that generates a high amount of heat.

[0050] Furthermore, the shield section 160 is generally fixed to the circuit board 120 by solder or clips mounted on the circuit board 120. However, if the shield section 160 is fixed by solder, when replacing components inside the shield section 160 for maintenance or the like after assembly, it is necessary to melt and remove all of the solder, or to provide an openable component such as a lid on the shield section 160 in advance. Furthermore, if the shield section 160 is fixed by clips or the like, it is possible to easily remove the shield section 160. However, when high-frequency noise is to be prevented, the clips must be mounted at a narrow pitch. As a result, the number of components mounted increases, and costs increase.

[0051] However, with the heat conducting component 170 of this embodiment, there is no need to use solder, clips, etc. This improves maintainability and reduces costs.

[0052] <Variation 1> In the above embodiment, a heat transfer sheet made of a sheet-shaped resin material filled with a thermally conductive filler is used as the heat transfer elastic body 150. The shape of the heat transfer sheet is easy to control, and it can be processed to fit the shape of the intended use. The shield part 160 covered by the heat transfer elastic body 150 also has a thickness that allows it to deform in shape to follow the heat transfer elastic body 150. Therefore, the heat conduction part 170 as a whole is flexible.

[0053] 3(a), the shape of the heat conducting component 170 may be deformed during use according to the height of the electric component 110. Specifically, the upper bottom portion of the heat conducting component 170 (the upper surface portion 160u of the shield portion 160) is deformed according to the height of the electric component 110 so as to contact the entire upper surface (or a part) of the electric component 110.

[0054] For example, as shown in FIG. 3(a), this can be realized by fabricating the shape of the heat dissipation component 140 according to the height of the electrical component 110.

[0055] This allows the heat conducting component 170 of the same shape to be compatible with various types of electric components 110. There is no need to manufacture the heat conducting component 170 to match the electric component 110, which contributes to cost reduction.

[0056] <Variation 2> In the above embodiments and modifications, the heat conducting component 170 covers one electric component 110. However, the number of electric components 110 that the heat conducting component 170 covers is not limited to this. For example, as shown in FIG. 3(b), one heat conducting component 170 may cover multiple electric components 110.

[0057] In this case, too, the upper bottom portion of the heat conducting component 170 (the upper surface portion 160u of the shield portion 160) is deformed in accordance with the height of each electric component 110 so as to contact the entire (or part) of the upper surface of each electric component 110. For example, as shown in FIG. 3(b), this can be achieved by creating the shape of the heat dissipation component 140 in accordance with the height of each electric component 110.

[0058] <Variation 3> The heat transfer elastic body 150 may also be provided only on the upper surface of the shield part 160. In this case, for example, as shown in Fig. 4(a), the thickness of the side surface part 160s of the shield part 160 may be greater than the thickness of the upper surface part 160u of the shield part 160. In this case, the heat transfer elastic body 150 may be provided not on the entire upper part of the shield part 160 but on a part thereof.

[0059] <Variation 4> In the above embodiments, the heat conduction component 170 has been illustrated as being in the shape of a rectangular box, but the shape of the heat conduction component 170 is not limited to this. It may have any shape that can cover the electric component 110 mounted on the circuit board 120 and transfer heat generated by the electric component 110 to the heat dissipation component 140. For example, as shown in FIG. 4(b), the heat conduction component 170 may have a cylindrical shape with an upper base and no lower base. It may also have a polygonal prism shape with an upper base and no lower base.

[0060] Although the embodiments and modifications of the present invention have been described above, the present invention is not limited to the above-described embodiments and can be modified in various ways that would be understandable to a person skilled in the art. Each embodiment and modification can be combined with other embodiments as appropriate. Furthermore, for example, the configuration of each element shown in each drawing is an example to aid in understanding the present invention, and the present invention is not limited to the configuration shown in these drawings.

[0061] Finally, preferred embodiments of the present invention will be summarized below. Some or all of the above-described embodiments can be described as, but are not limited to, the following supplementary notes. (Appendix 1) The heat conducting component includes a shielding portion that covers the electrical components mounted on the circuit board and shields them from noise; a heat-transfer elastic body disposed on an upper surface of the shield portion and configured to transfer heat from the electrical component to a heat-dissipating component, The shielding portion is electrically connected to a grounding portion provided on the circuit board, and is in contact with the electrical component with a predetermined pressure. (Appendix 2) 2. The heat conducting device according to claim 1, the heat dissipation component is disposed above the electrical component; the heat conducting part is flexible; The height of the heat conducting component is preferably equal to or greater than the distance between the upper surface of the circuit board and the lower surface of the heat dissipating component. (Appendix 3) 3. The heat conducting component according to claim 1 or 2, the heat dissipation component is disposed above the electrical component; the heat conducting part is flexible; The thickness of the heat-transfer elastic body at the portion disposed on the upper surface of the shielding portion is preferably equal to or greater than the distance between the upper surface of the electrical component and the lower surface of the heat-dissipating component. (Appendix 4) In the heat conducting component according to any one of Supplementary Notes 1 to 3, It is desirable that the heat transfer elastic body is also disposed on the side surface of the shield portion. (Appendix 5) 5. The heat conducting component according to claim 1, The shielding portion is preferably made of a metal sheet. (Appendix 6) 6. The heat conducting component according to any one of claims 1 to 5, It has flexibility, It is desirable that the electrical component be disposed so as to be in contact with the upper portion of the electrical component. (Appendix 7) 6. The heat conducting component according to any one of claims 1 to 5, It is desirable that the insulating film be disposed so as to cover the electrical components mounted on the circuit board and to be in contact with the upper portions of the electrical components. (Appendix 8) A heat conducting component according to any one of claims 1 to 7, The shielding portion is preferably a metal sheet containing aluminum. (Appendix 9) The electronic device includes a heat conducting component according to any one of appendices 1 to 8; the circuit board; the electrical component mounted on the circuit board; the heat dissipation component that dissipates heat from the electrical component; The ground portion is provided on the circuit board. (Appendix 10) 10. The electronic device according to claim 9, the heat dissipation component is disposed above the electrical component; The heat conducting component is preferably sandwiched and fixed between the heat dissipating component and the circuit board.

[0062] The disclosures of the above-mentioned patent documents, etc. are incorporated herein by reference. Modifications and adjustments of the embodiments and variations are possible within the scope of the entire disclosure of the present invention (including the scope of the claims), and further based on the basic technical concept thereof. Furthermore, various combinations and selections of the various disclosed elements (including each element of each claim, each element of each embodiment or variation, each element of each drawing, etc.) are possible within the scope of the disclosure of the present invention. In other words, the present invention naturally includes various modifications and alterations that would be possible by a person skilled in the art in accordance with the entire disclosure and technical concept, including the scope of the claims. In particular, with regard to the numerical ranges set forth herein, any numerical value or subrange included within the range should be construed as being specifically set forth, even if not otherwise specified. [Explanation of symbols]

[0063] 100: electronic device, 110: electrical component, 120: circuit board, 130: grounding portion, 140: heat dissipation component, 150: heat transfer elastic body, 160: shielding portion, 160b: bottom portion, 160s: side portion, 160u: top portion, 170: heat conduction component

Claims

1. a shielding portion that covers electrical components mounted on the circuit board and shields them from noise; a heat-transfer elastic body disposed on an upper surface of the shield portion and configured to transfer heat from the electrical component to a heat-dissipating component, The shielding portion is electrically connected to a grounding portion provided on the circuit board, and is in contact with the electrical component with a predetermined pressure.

2. 2. The heat conducting component according to claim 1, the heat dissipation component is disposed above the electrical component; the heat conducting part is flexible; A heat conducting component, wherein the height dimension of the heat conducting component is equal to or greater than the distance dimension between the upper surface of the circuit board and the lower surface of the heat dissipation component.

3. 2. The heat conducting component according to claim 1, the heat dissipation component is disposed above the electrical component; the heat conducting part is flexible; A heat conducting component, wherein the thickness of the portion of the heat conducting elastic body disposed on the upper surface of the shielding portion is equal to or greater than the distance between the upper surface of the electrical component and the lower surface of the heat dissipating component.

4. 2. The heat conducting component according to claim 1, The heat transfer elastic body is further disposed on a side surface of the shield portion.

5. 2. The heat conducting component according to claim 1, The heat conducting component, wherein the shield portion is made of a metal sheet.

6. 2. The heat conducting component according to claim 1, It has flexibility, a heat-conducting component disposed in contact with the top of the electrical component;

7. 2. The heat conducting component according to claim 1, It has flexibility, a heat conducting component that covers the plurality of electrical components mounted on the circuit board and is disposed so as to be in contact with the top of each electrical component;

8. 2. The heat conducting component according to claim 1, The heat conducting component, wherein the shield portion is a metal sheet containing aluminum.

9. The heat conducting component according to claim 1; the circuit board; the electrical component mounted on the circuit board; the heat dissipation component that dissipates heat from the electrical component; the ground portion is provided on the circuit board.

10. 10. The electronic device according to claim 9, the heat dissipation component is disposed above the electrical component; The heat conducting component is sandwiched and fixed between the heat dissipation component and the circuit board.

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