Electric power conversion equipment

Abstract

To provide electric power conversion equipment that enhances cooling performance while achieving miniaturization.SOLUTION: Electric power conversion equipment 1 comprises a cooling plate 10 through which a cooling fluid circulates internally, a first substrate 20 fixed to a columnar body 12 provided on the cooling plate 10, an electronic component module 30 configured to include a plurality of electronic components for power conversion and positioned in a state capable of direct heat exchange with the cooling plate 10, and a second substrate 40 provided between the first substrate 20 and the electronic component module 30, and electrically connected to the first substrate 20 via a connector 50, and the electronic component has a lead terminal 33 that is inserted through a through-hole 41 in the second substrate 40.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a power conversion device mounted on a vehicle. [Background technology]

[0002] Conventionally, power conversion devices capable of charging vehicle batteries using a commercial power source have been used. It is desirable for such power conversion devices to be miniaturized for installation in vehicles. Examples of such miniaturization technologies include those described in Patent Documents 1 and 2, the sources of which are listed below.

[0003] Patent Document 1 describes an electronic component assembly. In this electronic component assembly, wiring boards on which wiring circuits are formed are arranged in multiple stages. Components are arranged on the wiring boards, with tall large components and small components being separated into these. At least some of the small components are arranged vertically, and are connected via leads extending vertically across the wiring boards provided above and below the small components.

[0004] Patent Document 2 describes an electronic control device for a vehicle. The electronic control device for a vehicle has a first circuit board and a second circuit board, each of which has a connector and an electronic component mounted thereon, that are arranged to overlap with a predetermined gap between them, and low-profile electronic components are mounted in the area where the first circuit board and the second circuit board overlap. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 5-275612 [Patent Document 2] Japanese Patent Application Laid-Open No. 2014-86671 Summary of the Invention [Problem to be solved by the invention]

[0006] A power conversion device includes, for example, a switching element, which generates heat when current is applied. For this reason, the power conversion device needs to be cooled. The techniques described in Patent Documents 1 and 2 do not consider cooling of electronic components, which is counter to miniaturization, where electronic components tend to be densely packed, and there is room for improvement in terms of cooling performance.

[0007] Therefore, there is a demand for a power conversion device that is compact and has improved cooling performance. [Means for solving the problem]

[0008] The characteristic configuration of the power conversion device according to the present invention comprises a cooling plate through which a cooling fluid flows, a first substrate fixed to a columnar body provided on the cooling plate, an electronic component module including a plurality of electronic components for power conversion and arranged in a state capable of direct heat exchange with the cooling plate, and a second substrate provided between the first substrate and the electronic component module and electrically connected to the first substrate via a connector, wherein the lead terminals of the electronic components are inserted into through holes in the second substrate.

[0009] With this characteristic configuration, by connecting the first and second boards via a connector, the height of the portion of the cooling plate on which the electronic component module is mounted can be reduced by the height of the connector. Therefore, the height of the portion of the cooling plate on which the second board is mounted can be reduced, thereby improving the cooling performance of the cooling plate for the electronic component module and reducing its weight. Furthermore, since the second board can be directly fixed to the electronic component module, misalignment of the second board with respect to the electronic component module can be reduced. Furthermore, since the terminals of the electronic component module do not need to be extended, it is easy to insert the terminals of the electronic component module into the through-holes of the second board. Thus, a power conversion device with the above configuration can improve cooling performance while being compact. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a side view of the power conversion device. [Figure 2] FIG. 10 is an explanatory diagram of a connector position adjustment function. [Figure 3] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 4] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 5] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 6] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 7] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 8] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 9] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 10] 1A and 1B are diagrams illustrating assembly of a power conversion device. [Figure 11] 10A and 10B are diagrams illustrating a connector according to another embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] The power conversion device according to the present invention is configured to be able to appropriately cool electronic components for power conversion. The power conversion device 1 according to the present embodiment will be described below. However, the power conversion device 1 is not limited to the following embodiment, and various modifications are possible within the scope of the gist thereof.

[0012] 1 is a side view of a power conversion device 1. As shown in FIG. 1, the power conversion device 1 is configured to include a cooling plate 10, a first substrate 20, an electronic component module 30, a second substrate 40, and a connector 50.

[0013] The cooling plate 10 has a flow path 11 through which a cooling fluid flows. The cooling fluid is circulated through the flow path 11 by a pump (not shown). The cooling fluid may be cooling water such as long-life coolant (LLC), insulating oil such as paraffin, or a refrigerant such as hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO).

[0014] The cooling plate 10 is constructed by stacking plate members on a main body portion in which a flow path 11 is engraved. The cooling plate 10 is made of a metal material with high thermal conductivity, such as aluminum. The cooling plate 10 has a plurality of pillars 12 standing upright on one surface 10A.

[0015] The first substrate 20 is fixed to the pillar 12. The pillar 12 has a screw hole 72 formed at the top thereof, into which a screw 71 can be fastened. The first substrate 20 is fastened to the top of the pillar 12 by the screw 71.

[0016] The first substrate 20 is configured using, for example, a printed circuit board, and has electronic components 81 (coils, capacitors, etc.) mounted thereon. In this embodiment, the electronic components 81 are mounted with their lead terminals 81A inserted into the through holes 21 of the first substrate 20 and their main body portions 81B positioned between the first substrate 20 and the cooling plate 10. Specifically, the main body portions 81B are mounted in a state spaced apart from the cooling plate 10.

[0017] The electronic component module 30 includes multiple electronic components for power conversion. Electronic components for power conversion are electronic components installed in a circuit that converts input power into other types of power. Specifically, these components include switching elements that constitute an AC / DC inverter or a DC / DC converter, and these switching elements generate a large amount of heat. Therefore, the electronic component module 30 is arranged so as to be able to directly exchange heat with the cooling plate 10. Specifically, the electronic component module 30 is arranged on a base 13, whose top 31 protrudes from the cooling plate 10, via a heat transfer material 61. The electronic component module 30 is fastened to the base 13 with screws 73. This allows the electronic component module 30 to efficiently exchange heat with the cooling fluid flowing through the flow path 11, thereby enabling appropriate cooling of the electronic components.

[0018] The second substrate 40 is provided between the first substrate 20 and the electronic component module 30. The second substrate 40 is placed on a substrate fixing portion 32 provided on the surface of the electronic component module 30 opposite the cooling plate 10, and is fastened to the substrate fixing portion 32 via screws 74. In this embodiment, the second substrate 40 is formed with an outer shape equivalent to that of the electronic component module 30 in a plan view. The second substrate 40 being formed with an outer shape equivalent to that of the electronic component module 30 means that the outer sizes of the second substrate 40 and the electronic component module 30 in a plan view are equal to each other. Of course, differences in the order of dimensional tolerances due to processing are included in the equivalent outer shapes. In this embodiment, the substrate fixing portion 32 is provided on the outer periphery of the electronic component module 30, and the second substrate 40 is fixed to the outer periphery of the electronic component module 30.

[0019] Like first substrate 20, second substrate 40 is configured using a printed circuit board. Second substrate 40 is provided with a plurality of through holes 41, through which lead terminals 33 of electronic components constituting electronic component module 30 are inserted. In this embodiment, all of the lead terminals 33 of the plurality of electronic components are inserted into each of the plurality of through holes 41.

[0020] The second substrate 40 is electrically connected to the first substrate 20 via the connector 50. As shown in FIG. 1, the power conversion device 1 of this embodiment includes two connectors 50. The number of connectors 50 is not limited to two, and may be one, three, or more. As shown in FIG. 2, the connector 50 includes a first connector portion 52 and a second connector portion 53. The connectors 50 are electrically connected by inserting terminals 52A of the first connector portion 52 into holes 53A of the second connector portion 53. In this embodiment, the first connector portion 52 is mounted on the first substrate 20, and the second connector portion 53 is mounted on the second substrate 40. Therefore, by inserting and connecting the terminals 52A of the first connector portion 52 into the holes 53A of the second connector portion 53, the pattern connected to the first connector portion 52 on the first substrate 20 and the pattern connected to the second connector portion 53 on the second substrate 40 are electrically connected.

[0021] The connector 50 has a structure for reducing misalignment of the second substrate 40 relative to the first substrate 20. The misalignment reduction structure is a structure configured so that, even if the position of the first connector portion 52 relative to the second connector portion 53 is misaligned in the X direction (e.g., length direction), Y direction (e.g., width direction), or Z direction (e.g., height direction) shown in FIG. 2 , the terminals 52A of the first connector portion 52 can be inserted into the holes 53A of the second connector portion 53, as long as the amount of misalignment is within a predetermined amount. For example, such a structure may be configured by setting the size (inner shape) of the holes 53A of the second connector portion 53 to be larger in each of the X direction, Y direction, and Z direction by an amount that allows for misalignment, and further configuring the terminal receiving portions provided in the holes 53A to be able to clamp the terminals 52A that are inserted misaligned. As a result, even if the position of the first connector portion 52 relative to the second connector portion 53 is misaligned, it is possible to connect the first connector portion 52 and the second connector portion 53 and electrically connect the pattern connected to the first connector portion 52 on the first substrate 20 with the pattern connected to the second connector portion 53 on the second substrate 40. Therefore, even if the position of the electronic component module 30 is misaligned relative to the first substrate 20, it is possible to appropriately electrically connect the electronic component module 30 and the first substrate 20. Note that the first connector portion 52 may be mounted on the second substrate 40, and the second connector portion 53 may be mounted on the first substrate 20.

[0022] By configuring the power conversion device 1 as described above, the first substrate 20 and the second substrate 40 can be spaced apart by the distance of the connector 50. As a result, as shown in Fig. 1, the height of the base portion 13 on which the electronic component module 30 is placed on the cooling plate 10 can be reduced, and the electronic component module 30 can be placed closer to the flow path 11 on the cooling plate 10 than in a case where the connector 50 is not used. Therefore, the electronic component module 30 can be appropriately cooled.

[0023] Furthermore, by electrically connecting the first substrate 20 and the second substrate 40 using a connector 50 having a misalignment reduction structure as described above, it is possible to allow for misalignment between the electronic component module 30 and the first substrate 20 and properly electrically connect the electronic component module 30 and the first substrate 20 compared to a configuration without using the connector 50.

[0024] Next, the assembly of the power conversion device 1 will be described with reference to Figures 3 to 10 (however, for ease of understanding, Figures 3 to 10 show only one connector 50). First, the second connector portion 53 of the connector 50 is mounted on the second substrate 40 (#1 in Figure 3). If the second connector portion 53 is a surface-mount type, it can be mounted by a reflow process using cream solder (#2 in Figure 4). Note that mounting is not limited to the reflow process, and laser soldering or the like may also be used.

[0025] Next, the second substrate 40, on which the second connector portion 53 has already been mounted, is placed on the substrate fixing portion 32 of the electronic component module 30, and the lead terminals 33 of the electronic components that make up the electronic component module 30 are inserted into the through holes 41 of the second substrate 40 on which the second connector portion 53 has already been mounted (#3 in FIG. 5). This mounting can be performed by a flow process using solder. Subsequently, the second substrate 40 is fastened to the substrate fixing portion 32 of the electronic component module 30 with screws 74.

[0026] Subsequently, electronic component module 30 is placed on base portion 13 of cooling plate 10 via heat transfer material 61, and is fastened and fixed to cooling plate 10 with screws 73 (#4 in FIG. 6).

[0027] Next, the first connector portion 52 of the connector 50 is mounted on the first substrate 20 (#5 in FIG. 7). If the second connector portion 53 is a surface-mount type, it can be mounted by a reflow process using cream solder. Next, the lead terminals 81A of the electronic components 81 are inserted into the through holes 21 of the first substrate 20 and mounted by a flow process using solder (#6 in FIG. 8). Finally, the terminals 52A of the first connector portion 52 are inserted into the holes 53A of the second connector portion 53, and the first substrate 20 is fastened and fixed to the pillars 12 of the cooling plate 10 with screws 71 (#7 in FIG. 9). In this manner, the power conversion device 1 can be assembled (#8 in FIG. 10).

[0028] Other Embodiments Next, other embodiments of the power conversion device 1 will be described.

[0029] In the above embodiment, the connector 50 has been described as including a first connector portion 52 and a second connector portion 53. However, the connector 50 may also use a guided pin header as shown in FIG. 11 . In this case, the guided pin header is mounted on the second substrate 40 by a reflow process with the guide pins 92 on one side of the guided pin header inserted into the pin holes 94 of the second substrate 40, and the terminals 93 of the guided pin header are inserted into the through holes 99 of the first substrate 20, while the guide pins 91 on the other side of the guided pin header are inserted into the pin holes 95 of the first substrate 20. In this case, the tips of the guide pins 91 are tapered into a C-shaped surface to accommodate misalignment of the second substrate 40 relative to the first substrate 20, thereby enabling insertion into the pin holes 95. This allows the first substrate 20 and the electronic component module 30 to be electrically connected even if there is misalignment between the first substrate 20 and the second substrate 40.

[0030] In the above embodiment, it has been described that all of the lead terminals 33 of the plurality of electronic components are inserted into each of the plurality of through holes 41 of the second substrate 40. However, it is also possible that some of the lead terminals 33 of the plurality of electronic components are inserted into each of the plurality of through holes 41 of the second substrate 40.

[0031] In the above embodiment, the connector 50 has been described as having a structure for reducing misalignment of the second substrate 40 relative to the first substrate 20. However, the connector 50 does not have to have a structure for reducing misalignment. Even in this case, the electronic component module 30 can be cooled by placing the electronic component module 30 close to the flow path 11.

[0032] In the above embodiment, the second substrate 40 has been described as being formed with an outer shape, in plan view, that is the same as the outer shape of the electronic component module 30. However, the second substrate 40 may be smaller or larger than the outer shape of the electronic component module 30, in plan view.

[0033] [Summary of the above embodiment] The following provides an overview of the power conversion device 1 described above.

[0034] (1) The power conversion device 1 comprises a cooling plate 10 through which a cooling fluid flows, a first substrate 20 fixed to a columnar body 12 provided on the cooling plate 10, an electronic component module 30 including a plurality of electronic components for power conversion and arranged in a state capable of direct heat exchange with the cooling plate 10, and a second substrate 40 provided between the first substrate 20 and the electronic component module 30 and electrically connected to the first substrate 20 via a connector 50, and the electronic components have lead terminals 33 inserted into through holes 41 provided in the second substrate 40.

[0035] According to this configuration, by connecting the first substrate 20 and the second substrate 40 via the connector 50, the height of the portion of the cooling plate 10 on which the electronic component module 30 is mounted can be reduced by the height of the connector 50. Therefore, the height of the portion of the cooling plate 10 on which the second substrate 40 is mounted can be reduced, thereby improving the cooling performance of the cooling plate 10 for the electronic component module 30 and reducing its weight. Furthermore, since the second substrate 40 can be directly fixed to the electronic component module 30, misalignment of the second substrate 40 with respect to the electronic component module 30 can be reduced. Furthermore, since the terminals (lead terminals 33) of the electronic component module 30 do not need to be extended, the terminals (lead terminals 33) of the electronic component module 30 can be easily inserted into the through holes 41 of the second substrate 40. As such, the power conversion device 1 configured as described above can improve cooling performance while being miniaturized.

[0036] (2) In the power converter 1 described in (1), it is preferable that all of the lead terminals 33 of the plurality of electronic components are inserted into the plurality of through holes 41 of the second substrate 40, respectively.

[0037] According to this configuration, the lead terminals 33 of all electronic components can be collected in the connector 50 and electrically connected to the first substrate 20. Therefore, even if the lead terminals 33 of multiple electronic components are arranged widely on the second substrate 40, the narrow terminal pitch of the connector 50 is utilized, thereby reducing the tolerance for variation of the lead terminals 33. This makes it possible to easily electrically connect the electronic components to the first substrate 20.

[0038] (3) In the power converter 1 described in (1) or (2), it is preferable that the connector 50 has a structure for reducing misalignment of the second board 40 relative to the first board 20.

[0039] According to this configuration, even if there is a positional misalignment of the second substrate 40 relative to the first substrate 20, the connector 50 reduces the positional misalignment, making it possible to properly establish an electrical connection between the first substrate 20 and the second substrate 40.

[0040] (4) In the power converter 1 according to any one of (1) to (3), the second substrate 40 is preferably formed to have an outer shape equivalent to an outer shape of the electronic component module 30 in a plan view.

[0041] This configuration facilitates miniaturization and facilitates alignment of the second substrate 40 with respect to the electronic component module 30. Therefore, the second substrate 40 can be easily attached to the electronic component module 30. [Industrial Applicability]

[0042] The technology disclosed herein can be used in a power conversion device mounted on a vehicle. [Explanation of symbols]

[0043] 1: power converter, 10: cooling plate, 12: columnar body, 20: first substrate, 30: electronic component module, 33: lead terminal, 40: second substrate, 41: through hole, 50: connector

Claims

1. a cooling plate through which a cooling fluid flows; a first substrate fixed to a columnar body provided on the cooling plate; an electronic component module including a plurality of electronic components for power conversion, the electronic component module being arranged in a state capable of directly exchanging heat with the cooling plate; a second substrate provided between the first substrate and the electronic component module and electrically connected to the first substrate via a connector, The power conversion device has a lead terminal of the electronic component inserted into a through hole of the second substrate.

2. 2. The power conversion device according to claim 1, wherein all of the lead terminals of the plurality of electronic components are inserted into the plurality of through holes of the second substrate, respectively.

3. The power conversion device according to claim 1 or 2, wherein the connector has a structure for reducing misalignment of the second board relative to the first board.

4. The power conversion device according to claim 1 or 2, wherein the second substrate has an outer shape, in a plan view, that is the same as an outer shape of the electronic component module.

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