Cutting device, and manufacturing method for cut product

Abstract

To provide a cutting device that can cut and inspect a cur product, with high productivity.SOLUTION: A cutting device 1 comprises: a first conveying mechanism 7 and a second conveying mechanism 11 which convey a cut product S1 while holding the product; a first inspecting mechanism 8 that inspects a first surface F1 of the cut product S1 in a state where the cut product S1 is arranged at a first inspection position Q1; and a second inspecting mechanism 9 that inspects a second surface F2 of the cut product S1, in a state where the cut product S1 is arranged at a second inspection position Q2. The first conveying mechanism 7 is configured to be able to convey a plurality of cut products S1 to both the first inspection position Q1 and the second inspection position Q2, and the second conveying mechanism 11 is also configured to be able to convey the plurality of cut products S1 to both the first inspection position Q1 and the second inspection position Q2.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present disclosure relates to a cutting device and a method for producing a cut product. [Background technology]

[0002] Japanese Patent Application Laid-Open Publication No. 2023-076250 (Patent Document 1) discloses an invention related to a cutting device. This cutting device cuts an object (package substrate) into a plurality of cut products (electronic components). This cutting device is equipped with separate inspection mechanisms for inspecting the bottom surfaces of the electronic components and for inspecting the top surfaces of the electronic components. More specifically, a first optical inspection camera is disposed upstream in the transport direction of the electronic components, and a second optical inspection camera is disposed downstream.

[0003] In the above-described cutting apparatus, a first optical inspection camera inspects the mold surface of the electronic component, and then a second optical inspection camera inspects the ball / lead surface of the electronic component. The inspection mechanism typically includes lighting appropriate for the object being inspected. In the above-described cutting apparatus, lighting used with the first optical inspection camera is suitable for inspecting the mold surface, and lighting used with the second optical inspection camera is suitable for inspecting the ball / lead surface. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Publication No. 2023-076250 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, the needs for cutting devices have become more diverse. For example, it is desirable to be able to efficiently cut a wider variety of cutting objects and efficiently inspect the cut products obtained by cutting. For example, there is a case where one surface of the cutting object is a molded surface entirely sealed with resin, and the other surface of the cutting object is a ball / lead surface partially sealed with resin. Suppose that the cutting device disclosed in Patent Document 1 (JP 2023-076250 A) is used to obtain multiple cut products from such a cutting object.

[0006] In order to properly cut the workpiece using the above-mentioned cutting device, the workpiece is fixed on the processing table with its mold surface facing upward, and the blade is brought close to the workpiece from the mold surface side to cut the workpiece. If the device configuration of Patent Document 1 is then used as is, the ball / lead surface of the workpiece is inspected by the first optical inspection camera on the upstream side, and the mold surface is inspected by the second optical inspection camera on the downstream side.

[0007] In this state, the lighting is not suitable for the object being inspected, so to perform a proper inspection, the lighting used with the first optical inspection camera must be changed to lighting suitable for inspecting the ball / lead surface, and the lighting used with the second optical inspection camera must be changed to lighting suitable for inspecting the mold surface, and adjustments must be made to the alignment and focus of each inspection mechanism. Such changes and adjustments take time and effort.

[0008] An object of the present disclosure is to provide a cutting device capable of performing cutting and inspection with high productivity, and a method for manufacturing a cut product. [Means for solving the problem]

[0009] The cutting device of the present disclosure comprises: a processing table for holding an object to be cut; a cutting mechanism for cutting the object held on the processing table into a plurality of individual cut products; a first conveying mechanism that holds and conveys a plurality of the cut products; a second conveying mechanism that holds and conveys a plurality of the cut products; a first inspection mechanism that inspects first surfaces of the plurality of cut products while the plurality of cut products are arranged at a first inspection position; a second inspection mechanism that inspects second surfaces of the plurality of cut products while the plurality of cut products are arranged at a second inspection position; the first transport mechanism is configured to be able to transport a plurality of the cut products to both the first inspection position and the second inspection position; The second transport mechanism is also configured to be able to transport a plurality of the cut products to both the first inspection position and the second inspection position.

[0010] The method for producing a cut product according to the present disclosure uses the above-described cutting device, cutting the object held on the processing table into a plurality of cut products; a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are placed at the second inspection position by the first conveying mechanism; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the plurality of cut products are placed at the first inspection position by the second transport mechanism.

[0011] The method for producing a cut product according to the present disclosure uses the above-described cutting device, cutting the object held on the processing table into a plurality of cut products; a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the plurality of cut products are placed at the first inspection position by the first conveying mechanism; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are placed at the second inspection position by the second transport mechanism. [Effects of the Invention]

[0012] According to the present disclosure, it is possible to obtain a cutting device and a method for manufacturing a cut product that are capable of cutting and inspecting with high productivity. [Brief explanation of the drawings]

[0013] [Figure 1] FIG. 1 is a plan view schematically showing a cutting device 1. [Figure 2] This is a front view schematically showing the area between the processing table 5M and the loading table 14 in the cutting device 1, and shows a state SA1 in which the first conveying mechanism 7 is positioned at the pick-up position T1 and adsorbs the cut product S1 held on the processing table 5M from above. [Figure 3] 10 shows a state SA2 in which the cut product S1 is placed at the first inspection position Q1 by the first transport mechanism 7. [Figure 4] 10 shows a state SA3 in which the second transport mechanism 11, which is located at the receiving position U1, receives the cut product S1 held by the first transport mechanism 7 from the first transport mechanism 7 and holds it. [Figure 5] 10 shows a state SA4 in which the cut product S1 is placed at the second inspection position Q2 by the second transport mechanism 11. [Figure 6] 10 shows a state SA5 in which the second transport mechanism 11 places the cut product S1 on the placement table 14 at the placement position U2. [Figure 7] The first transport mechanism 7 is positioned at the pick-up position T1, and shows a state SB1 in which the first transport mechanism 7 is sucking the cut product S1 held on the processing table 5M from above. [Figure 8] 10 shows a state SB2 in which the cut product S1 is placed at the second inspection position Q2 by the first transport mechanism 7. [Figure 9] 8 shows a state SB3 in which the second transport mechanism 11, which is located at the receiving position U1, receives the cut product S1 held by the first transport mechanism 7 from the first transport mechanism 7 and holds it. [Figure 10]10 shows a state SB4 in which the cut product S1 is placed at the first inspection position Q1 by the second transport mechanism 11. [Figure 11] 10 shows a state SB5 in which the second transport mechanism 11 places the cut product S1 on the placement table 14 at the placement position U2. [Figure 12] 10 shows a state SC5 in which the first transport mechanism 7 receives the cut product S1 held by the second transport mechanism 11 from the second transport mechanism 11 and holds it. [Figure 13] 10 shows a state SC6 in which the first transport mechanism 7 places the cut product S1 on the placement table 14 at the placement position U2. DETAILED DESCRIPTION OF THE INVENTION

[0014] The following describes embodiments of the present disclosure. In the embodiments described below, when numbers, quantities, etc. are mentioned, the scope of the present disclosure is not necessarily limited to those numbers, quantities, etc., unless otherwise specified. Each component is not necessarily essential to the present disclosure, unless otherwise specified. The same reference numbers are used for the same and corresponding components, and redundant descriptions may not be repeated.

[0015] (Cutting device 1) FIG. 1 is a plan view schematically showing a cutting apparatus 1. The cutting apparatus 1 includes a cutting module A1 (FIG. 1) and an inspection and storage module B1. The cutting apparatus 1 is equipped with a monitor 20 and a computer 50, and operates by receiving various input commands. In FIG. 1, the monitor 20 and the computer 50 are provided in the inspection and storage module B1, but they may also be provided in the cutting module A1. The cutting apparatus 1 cuts an object to be cut (package substrate) to separate the object into a plurality of cut products (package components). Below, details of the cutting apparatus 1 will be described, along with a method for manufacturing cut products S1 using the cutting apparatus 1.

[0016] (Cutting object P1) In the case of a package substrate, for example, a substrate or lead frame on which a semiconductor chip is mounted is sealed with resin. Examples of package substrates include a BGA (Ball Grid Array) package substrate, an LGA (Land Grid Array) package substrate, a CSP (Chip Size Package) package substrate, an LED (Light Emitting Diode) package substrate, and a QFN (Quad Flat No-leaded) package substrate.

[0017] The cutting device 1 further inspects each of the plurality of individual cut products (electronic components). An image of each cut product is captured, and each cut product is inspected based on the image. Inspection data is generated through the inspection, and each cut product is classified as either a "good product" or a "defective product."

[0018] Here, a package substrate is used as the cutting object P1 (FIG. 1), and the cutting object P1 is divided into a plurality of cut products S1 (FIG. 2) by the cutting device 1. In the following description, of both surfaces of the cutting object P1 or the cut product S1, the resin-sealed surface is referred to as the mold surface F1 (FIG. 2), and the surface opposite to the mold surface F1 is referred to as the ball / lead surface F2 (FIG. 2).

[0019] [Embodiment 1] (Cutting Module A1) The cutting module A1 cuts a cutting target P1 (Fig. 1) to produce a plurality of cut products S1 (Fig. 2). The inspection and storage module B1 inspects each of the plurality of cut products S1 and then stores the cut products S1 in a tray. In the cutting device 1, each component is detachable and replaceable with the other components.

[0020] The cutting module A1 includes a substrate supply unit 3, a positioning unit 4, processing tables 5M and 5N, a cutting mechanism 6, and a first transport mechanism 7. The substrate supply unit 3 pushes out the workpieces P1 one by one from the magazine M1, thereby supplying the workpieces P1 one by one to the positioning unit 4. The workpieces P1 are arranged with their ball / lead surfaces F2 (FIG. 2) facing upward.

[0021] The positioning unit 4 places the workpiece P1 pushed out from the substrate supply unit 3 on the rail unit 4a and positions the workpiece P1. The cutting device 1 has a twin-cut table configuration with two processing tables 5M and 5N. The positioning unit 4 transports the workpiece P1 to the processing tables 5M and 5N, and the processing tables 5M and 5N hold the workpiece P1.

[0022] Each of the processing tables 5M, 5N includes a holding member 5a, a rotation mechanism 5b, and a movement mechanism 5c. The holding member 5a holds the workpiece P1 transported by the positioning unit 4 by suction from below. The rotation mechanism 5b rotates the holding member 5a in the θ1 direction in FIG. 1 (i.e., rotates it on the XY plane in FIG. 1). The movement mechanism 5c moves the holding member 5a along the Y axis in the figure.

[0023] For example, after the processing table 5M picks up the workpiece P1, the first position confirmation camera 5d captures an image of the workpiece P1 and confirms the position of the workpiece P1. The confirmation using the first position confirmation camera 5d is, for example, confirmation of the position of a mark provided on the workpiece P1. The mark is, for example, a mark for determining the cutting position of the workpiece P1.

[0024] Thereafter, the processing table 5M moves toward the cutting mechanism 6 along the Y axis in the figure. After the processing table 5M moves below the cutting mechanism 6, alignment is performed, and then the processing table 5M and the cutting mechanism 6 are moved relatively to each other to cut the workpiece P1. The cutting mechanism 6 cuts the workpiece P1 using the blade 6a, thereby dividing the workpiece P1 into a plurality of cut products S1.

[0025] Every time the object P1 is cut by the blade 6a of the cutting mechanism 6, the object P1 (cut product S1) is imaged and confirmed by the second position confirmation camera 6b provided in the cutting mechanism 6. Confirmation using the second position confirmation camera 6b includes, for example, confirmation of the cut position and cut width of the object P1.

[0026] After cutting of the cutting target P1 is completed, the processing table 5M, with the plurality of individual cut products S1 held by suction, moves along the Y axis in the drawing in a direction away from the cutting mechanism 6. During this movement, the first cleaner 5e cleans and dries the top surfaces (ball / lead surfaces F2 (FIG. 2)) of the cut products S1.

[0027] 2 is a front view schematically showing the portion between the processing table 5M and the mounting table 14 in the cutting device 1. The first transport mechanism 7 has a main body 7a and a moving shaft 7b, and can transport the cut workpiece S1 along the moving shaft 7b while the main body 7a holds the cut workpiece S1.

[0028] After cleaning and drying by the first cleaner 5e (FIG. 1) is completed, the first transport mechanism 7 is positioned at pick-up position T1, as shown in FIG. 2, and picks up the cut products S1 held on the processing table 5M from above. FIG. 2 shows a state SA1 in which the first transport mechanism 7 is positioned at pick-up position T1 and picks up the cut products S1 held on the processing table 5M from above. After picking up the cut products S1 from the processing table 5M, the first transport mechanism 7 transports the cut products S1 toward the first inspection mechanism 8 and second inspection mechanism 9 of the inspection and storage module B1.

[0029] As shown in Fig. 3, the cut products S1 are transported upward (arrow AR1) and then positioned so as to face the cleaning nozzle 10a and drying nozzle 10b of the second cleaner 10, respectively (arrows AR2 and AR3), where the underside (mold surface F1) of the cut products S1 is cleaned and dried. The cut products S1 are then further transported by the first transport mechanism 7 and placed at a position (first inspection position Q1) facing the first inspection mechanism 8 (arrow AR4). Fig. 3 shows a state SA2 in which the cut products S1 are placed at the first inspection position Q1 by the first transport mechanism 7.

[0030] (Inspection and storage module B1) 1 and 3, the inspection and storage module B1 (FIG. 1) includes a first inspection mechanism 8, a second inspection mechanism 9, a second transport mechanism 11, a mounting table 14, and an extraction unit 15. The first inspection mechanism 8 has a first optical inspection camera 12 and a first illuminator 16. The first illuminator 16 is provided above the first optical inspection camera 12, and the first illuminator 16 irradiates light onto the cut product S1 during inspection by the first optical inspection camera 12.

[0031] 3, the first optical inspection camera 12 images the mold surface F1 (first surface) of the cut product S1 when the cut product S1 is placed at the first inspection position Q1 by the first conveying mechanism 7. The first optical inspection camera 12 is positioned near the cut product S1 placed at the first inspection position Q1 so as to image the area above.

[0032] Referring to Figure 4, after imaging by the first optical inspection camera 12, the first conveying mechanism 7 moves together with the cut product S1 (arrow AR5) to reach a position opposite the second conveying mechanism 11, and places the cut product S1 on the main body 11a of the second conveying mechanism 11.

[0033] The second conveying mechanism 11 has a main body 11a and a moving shaft 11b, and can convey the cut products S1 along the moving shaft 11b while the main body 11a is holding the cut products S1. The second conveying mechanism 11 shown in FIG. 4 is located at a receiving position U1. While located at the receiving position U1, the second conveying mechanism 11 receives and holds the cut products S1 held by the first conveying mechanism 7 from the first conveying mechanism 7. FIG. 4 shows a state SA3 in which the second conveying mechanism 11, located at the receiving position U1, receives and holds the cut products S1 held by the first conveying mechanism 7 from the first conveying mechanism 7.

[0034] As shown in Fig. 5, the main body 11a of the second transport mechanism 11 is turned upside down while holding the cut products S1. The cut products S1 are placed by the second transport mechanism 11 at a position (second inspection position Q2) facing the second inspection mechanism 9. Fig. 5 shows a state SA4 in which the cut products S1 have been placed at the second inspection position Q2 by the second transport mechanism 11.

[0035] The second inspection mechanism 9 has a second optical inspection camera 13 and a second illuminator 17. The second illuminator 17 is provided above the second optical inspection camera 13, and the second illuminator 17 irradiates the cut product S1 with light during inspection by the second optical inspection camera 13. When the cut product S1 is placed at the second inspection position Q2 by the second conveying mechanism 11, the second optical inspection camera 13 images the ball / lead surface F2 (second surface) of the cut product S1. The second optical inspection camera 13 is positioned near the cut product S1 placed at the second inspection position Q2 so as to image the area above.

[0036] 6, after imaging by the second optical inspection camera 13, the second transport mechanism 11 moves together with the cut products S1 to a position opposite the loading table 14 and places the cut products S1 on the loading table 14. The second transport mechanism 11 shown in Fig. 6 is located at loading position U2. Fig. 6 shows a state SA5 in which the second transport mechanism 11 places the cut products S1 on the loading table 14 at loading position U2.

[0037] In this embodiment, when a reference direction (X direction) extending linearly is defined, the positions in the reference direction are, from the left on the page, pick-up position T1 (FIG. 2), first inspection position Q1 (FIG. 3), second inspection position Q2 (FIG. 5), and placement position U2 (FIG. 6).

[0038] Referring again to FIG. 1, inspected cut products S1 are placed on the placement table 14. The placement table 14 is movable along the Y axis in the figure. The extraction unit 15 transfers the cut products S1 placed on the placement table 14 to a tray. The cut products S1 are sorted into "good products" or "defective products" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13. The extraction unit 15 transfers each cut product S1 to a tray 15a for good products or a tray 15b for defective products based on the results of the sorting.

[0039] [Embodiment 2] In the above-described first embodiment, when cutting of the object P1 is completed, the cut product S1 is arranged with the ball / lead surface F2 (FIG. 2) facing upward. On the other hand, even when the cut product S1 is arranged with the mold surface F1 (FIG. 2) facing upward when cutting of the object P1 is completed, that is, when the object P1 is supplied from the magazine M1 (FIG. 1) to the positioning unit 4, the cutting device 1 can efficiently perform inspection.

[0040] As shown in Fig. 7, when the first transport mechanism 7 is positioned at the pick-up position T1, the first transport mechanism 7 picks up the cut product S1 held on the processing table 5M from above. Fig. 7 shows a state SB1 in which the first transport mechanism 7 is positioned at the pick-up position T1 and picks up the cut product S1 held on the processing table 5M from above. After picking up the cut product S1 from the processing table 5M, the first transport mechanism 7 transports the cut product S1 toward the first inspection mechanism 8 and second inspection mechanism 9 of the inspection and storage module B1.

[0041] As shown in Figure 8, the cut product S1 is transported upward (arrow AR1) and then placed facing the cleaning nozzle 10a and drying nozzle 10b of the second cleaner 10, respectively (arrows AR2, AR3), where the underside (ball / lead surface F2) of the cut product S1 is cleaned and dried.

[0042] The cut products S1 are then further transported by the first transport mechanism 7 and placed at a position (second inspection position Q2) facing the second inspection mechanism 9 (arrow AR4). Figure 8 shows a state SB2 in which the cut products S1 are placed at the second inspection position Q2 by the first transport mechanism 7. With the cut products S1 placed at the second inspection position Q2 by the first transport mechanism 7, the second optical inspection camera 13 images the ball / lead surface F2 (second surface) of the cut products S1.

[0043] Referring to Figure 9, after imaging by the second optical inspection camera 13, the first conveying mechanism 7 moves together with the cut product S1 (arrow AR5) to reach a position opposite the second conveying mechanism 11, and places the cut product S1 on the main body 11a of the second conveying mechanism 11.

[0044] The second transport mechanism 11 shown in Fig. 9 is located at the receiving position U1. The second transport mechanism 11 receives and holds the cut products S1 held by the first transport mechanism 7 from the first transport mechanism 7 while located at the receiving position U1. Fig. 9 shows a state SB3 in which the second transport mechanism 11, located at the receiving position U1, receives and holds the cut products S1 held by the first transport mechanism 7 from the first transport mechanism 7.

[0045] As shown in Fig. 10, the main body 11a of the second conveying mechanism 11 is turned upside down while holding the cut product S1. The cut product S1 is placed by the second conveying mechanism 11 at a position (first inspection position Q1) facing the first inspection mechanism 8. Fig. 10 shows a state SB4 in which the cut product S1 has been placed at the first inspection position Q1 by the second conveying mechanism 11. With the cut product S1 placed at the first inspection position Q1 by the second conveying mechanism 11, the first optical inspection camera 12 captures an image of the mold surface F1 (first surface) of the cut product S1.

[0046] 11, after imaging by the first optical inspection camera 12, the second transport mechanism 11 moves together with the cut products S1 to a position opposite the loading table 14 and places the cut products S1 on the loading table 14. The second transport mechanism 11 shown in Fig. 11 is located at loading position U2. Fig. 11 shows a state SB5 in which the second transport mechanism 11 places the cut products S1 on the loading table 14 at loading position U2.

[0047] Thereafter, as in embodiment 1, in the extraction unit 15, the cut product S1 is sorted into "good" or "defective" based on the results of inspection using the first optical inspection camera 12 and the second optical inspection camera 13.

[0048] (Action and effect) As described in the above-mentioned embodiments 1 and 2, in the cutting device 1, the first conveying mechanism 7 is configured to be able to transport the cut product S1 to both the first inspection position Q1 (Figure 3) and the second inspection position Q2 (Figure 8), and the second conveying mechanism 11 is also configured to be able to transport the cut product S1 to both the first inspection position Q1 (Figure 10) and the second inspection position Q2 (Figure 5).

[0049] Therefore, when cutting of the cutting workpiece P1 is completed, whether the cut product S1 is placed with the ball / lead surface F2 (FIG. 2) facing up or the mold surface F1 (FIG. 7) facing up, inspection can be performed without changing the lighting or adjusting the first inspection mechanism 8 or the second inspection mechanism 9 (to optimize the inspection). Also, a cutting device equipped with two inspection mechanisms can provide high versatility as a cutting device, as it increases the number of inspection sequences. Therefore, the cutting device 1 provides high versatility as a cutting device, and can perform cutting and inspection with high productivity.

[0050] [Modification of the second embodiment] In the above-described second embodiment, after the first inspection mechanism 8 performs the inspection, the cut product S1 is placed on the placement table 14 with the mold surface F1 facing downward. As a variation thereof, as shown in Fig. 12, after the first inspection mechanism 8 performs the inspection, the main body 11a of the second transport mechanism 11 may be turned upside down while holding the cut product S1.

[0051] The first conveying mechanism 7 receives and holds the cut products S1 held by the second conveying mechanism 11 from the second conveying mechanism 11. Figure 12 shows a state SC5 in which the first conveying mechanism 7 receives and holds the cut products S1 held by the second conveying mechanism 11 from the second conveying mechanism 11.

[0052] The first transport mechanism 7 moves together with the cut products S1 to a position opposite the loading table 14 and loads the cut products S1 onto the loading table 14. The first transport mechanism 7 shown in Figure 13 is located at loading position U2. Figure 13 shows a state SC6 in which the first transport mechanism 7 is loading the cut products S1 onto the loading table 14 at loading position U2.

[0053] Here, the first transport mechanism 7 is configured to be movable between a pick-up position T1 where it picks up and holds multiple cut products S1 on the processing table 5M, and a placement position U2 where it places multiple cut products S1 on the placement table 14. With the above configuration, it is possible to place the cut products S1 on the placement table 14 with the ball / lead surface F2 facing downward.

[0054] [Note] The embodiments of the present disclosure have been described above, but the contents of the embodiments of the present disclosure can be summarized as shown in the following supplementary notes.

[0055] [Appendix 1] a processing table for holding an object to be cut; a cutting mechanism for cutting the object held on the processing table into a plurality of individual cut products; a first conveying mechanism that holds and conveys a plurality of the cut products; a second conveying mechanism that holds and conveys a plurality of the cut products; a first inspection mechanism that inspects first surfaces of the plurality of cut products while the plurality of cut products are arranged at a first inspection position; a second inspection mechanism that inspects second surfaces of the plurality of cut products while the plurality of cut products are arranged at a second inspection position; the first transport mechanism is configured to be able to transport a plurality of the cut products to both the first inspection position and the second inspection position; The second transport mechanism is also configured to be able to transport a plurality of the cut products to both the first inspection position and the second inspection position. Cutting device.

[0056] According to the configuration described in Supplementary Note 1, each of the first and second conveying mechanisms is configured to be capable of conveying multiple cut products to both the first and second inspection positions. Therefore, inspection of the cut products can be flexibly started, for example, whether the first side of the cut products faces downward (e.g., the first side faces toward the inspection mechanism) or the second side of the cut products faces downward at the time of starting inspection. For example, compared to a case where the first conveying mechanism is configured to be capable of conveying multiple cut products only to the first inspection position and the second conveying mechanism is configured to be capable of conveying multiple cut products only to the second inspection position, the configuration described in Supplementary Note 1 makes it easier to set the inspection order relatively freely, such as inspecting the first side before the second side, or inspecting the second side before the first side, and enables cutting and inspection to be performed with high productivity.

[0057] [Appendix 2] Further provided is a placement table on which a plurality of the cut products can be placed, The second transport mechanism is configured to be movable between a receiving position where it receives and holds the plurality of cut products held by the first transport mechanism from the first transport mechanism, and a placing position where it places the plurality of cut products on the placing table. 10. The cutting device of claim 1.

[0058] According to the configuration described in Appendix 2 above, the second conveying mechanism receives and holds multiple cut products from the first conveying mechanism at the receiving position, and then the second conveying mechanism moves to the loading position and loads the multiple cut products onto the loading table.

[0059] [Appendix 3] The first transport mechanism is configured to be movable between a pick-up position where the first transport mechanism picks up and holds the plurality of cut products on the processing table, and a placement position where the first transport mechanism places the plurality of cut products on the placement table. 10. A cutting device as described in Appendix 2.

[0060] According to the configuration described in Supplementary Note 3 above, for example, the following operations can be realized: the first conveying mechanism conveys a plurality of cut products to one of the first inspection position and the second inspection position and inspects the plurality of cut products, then the second conveying mechanism conveys the plurality of cut products to the other of the first inspection position and the second inspection position and inspects the plurality of cut products, and then the first conveying mechanism receives and holds the plurality of cut products from the second conveying mechanism, and then the first conveying mechanism moves to the placement position and places the plurality of cut products on the placement table. This makes it possible to select the state of the cut products (whether the first side or the second side faces down) when storing them in the non-defective product tray 15a or the defective product tray 15b.

[0061] [Appendix 4] the first transport mechanism receives the plurality of cut products held by the second transport mechanism from the second transport mechanism and holds them, the first transport mechanism moves together with the plurality of cut products to a position opposite the placement table, and places the plurality of cut products on the placement table; 10. A cutting device as described in Appendix 3.

[0062] According to the configuration described in Appendix 4 above, for example, the following operations can be realized: the first conveying mechanism conveys multiple cut products to one of the first inspection position and the second inspection position and performs inspection on the multiple cut products; then the second conveying mechanism conveys multiple cut products to the other of the first inspection position and the second inspection position and performs inspection on the multiple cut products; and then the first conveying mechanism receives and holds the multiple cut products from the second conveying mechanism, and then the first conveying mechanism moves to the loading position and places the multiple cut products on the loading table.

[0063] [Appendix 5] The second transport mechanism is configured to be able to reverse the orientation of the plurality of cut products while holding the plurality of cut products. 5. The cutting device according to any one of claims 1 to 4.

[0064] According to the configuration described in Appendix 5 above, for example, when carrying out an inspection, it becomes easier to switch between the first and second sides of the cut product to be inspected, and when placing the cut product, it becomes easier to set which of the first and second sides of the cut product should face up or down.

[0065] [Appendix 6] A method for producing a cut product using the cutting device according to any one of appendices 1 to 5, cutting the object held on the processing table into a plurality of cut products; a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are placed at the second inspection position by the first conveying mechanism; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the plurality of cut products are placed at the first inspection position by the second transport mechanism. Manufacturing method for cut products.

[0066] According to the configuration described in Appendix 6 above, each of the first conveying mechanism and the second conveying mechanism is configured to be capable of transporting multiple cut products to both the first inspection position and the second inspection position, making it possible to inspect the second surface before the first surface.This makes it possible to perform cutting and inspection with higher productivity than, for example, when the first conveying mechanism is configured to be capable of transporting multiple cut products only to the first inspection position and the second conveying mechanism is configured to be capable of transporting multiple cut products only to the second inspection position.

[0067] [Appendix 7] A method for producing a cut product using the cutting device according to any one of appendices 1 to 5, cutting the object held on the processing table into a plurality of cut products; a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the plurality of cut products are placed at the first inspection position by the first conveying mechanism; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are placed at the second inspection position by the second conveying mechanism. Manufacturing method for cut products.

[0068] According to the configuration described in Appendix 7 above, each of the first conveying mechanism and the second conveying mechanism is configured to be capable of transporting multiple cut products to both the first inspection position and the second inspection position, making it possible to inspect the first surface before the second surface, and cutting and inspection can be performed with higher productivity than, for example, when the first conveying mechanism is configured to be capable of transporting multiple cut products only to the first inspection position and the second conveying mechanism is configured to be capable of transporting multiple cut products only to the second inspection position.

[0069] [Appendix 8] A method for producing a cut product using the cutting device according to claim 3 or 4, cutting the object held on the processing table into a plurality of cut products; a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are placed at the second inspection position by the first conveying mechanism; transferring the plurality of cut products from the first conveying mechanism to the second conveying mechanism; a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the plurality of cut products are placed at the first inspection position by the second transport mechanism; transferring the plurality of cut products from the second conveying mechanism to the first conveying mechanism; and a step of placing the plurality of cut products on the placement table by the first transport mechanism. Manufacturing method for cut products.

[0070] According to the configuration described in Supplementary Note 8 above, for example, the posture of the cut products changes from a posture for inspecting the second side to a posture for inspecting the first side by transferring the cut products from the first transport mechanism to the second transport mechanism. Furthermore, by transferring the cut products from the second transport mechanism to the first transport mechanism, it becomes possible to change the posture from a posture for inspecting the first side to a posture suitable for the first transport mechanism to place the cut products on the placement table. Furthermore, it becomes possible to select the state of the cut products (whether the first side or the second side faces downward) when storing the cut products in the non-defective product tray 15a or the defective product tray 15b.

[0071] Although the embodiments of the present disclosure have been described above, the embodiments disclosed herein should be considered to be illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, and it is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0072] 1 cutting device, 3 substrate supply unit, 4 positioning unit, 4a rail unit, 5M, 5N processing table, 5a holding member, 5b rotation mechanism, 5c moving mechanism, 5d first position confirmation camera, 5e first cleaner, 6 cutting mechanism, 6a blade, 6b second position confirmation camera, 7 first conveying mechanism, 7a, 11a main body unit, 7b, 11b moving axis, 8 first inspection mechanism, 9 second inspection mechanism, 10 second cleaner, 10a cleaning nozzle, 10b drying nozzle, 11 second conveying mechanism, 12 first optical inspection camera, 13 second optical inspection camera, 14 loading table, 15 extraction unit, 15a tray for good products, 15b tray for defective products, 16 first lighting, 17 second lighting, 20 monitor, 50 computer, A1 cutting module, B1 inspection and storage module, F1 mold surface (first surface), F2 Lead surface (second surface), M1 magazine, P1 cutting object, Q1 first inspection position, Q2 second inspection position, S1 cutting product, T1 pick-up position, U1 receiving position, U2 placing position.

Claims

1. a processing table for holding an object to be cut; a cutting mechanism for cutting the object held on the processing table into a plurality of individual cut products; a first conveying mechanism that holds and conveys a plurality of the cut products; a second conveying mechanism that holds and conveys the plurality of cut products; a first inspection mechanism that inspects first surfaces of the plurality of cut products while the plurality of cut products are arranged at a first inspection position; a second inspection mechanism that inspects second surfaces of the plurality of cut products while the plurality of cut products are arranged at a second inspection position; the first transport mechanism is configured to be able to transport a plurality of the cut products to both the first inspection position and the second inspection position; The second transport mechanism is also configured to be able to transport a plurality of the cut products to both the first inspection position and the second inspection position. Cutting device.

2. Further provided is a placement table on which a plurality of the cut products can be placed, the second conveying mechanism is configured to be movable between a receiving position where it receives and holds the plurality of cut products held by the first conveying mechanism from the first conveying mechanism, and a placing position where it places the plurality of cut products on the placing table.

2. The cutting device of claim 1.

3. the first transport mechanism is configured to be movable between a pick-up position where the first transport mechanism picks up and holds the plurality of cut products on the processing table and a placement position where the first transport mechanism places the plurality of cut products on the placement table.

3. The cutting device of claim 2.

4. the first transport mechanism receives the plurality of cut products held by the second transport mechanism from the second transport mechanism and holds them, the first transport mechanism moves together with the plurality of cut products to a position opposite the placement table, and places the plurality of cut products on the placement table; 4. The cutting device of claim 3.

5. the second conveying mechanism is configured to be able to reverse the orientation of the plurality of cut products while holding the plurality of cut products.

5. A cutting device according to any one of claims 1 to 4.

6. A method for producing a cut product using the cutting device according to any one of claims 1 to 5, cutting the object held on the processing table into a plurality of cut products; a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are arranged at the second inspection position by the first transport mechanism; transferring the cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the first surfaces of the plurality of cut products by the first inspection mechanism in a state in which the plurality of cut products are arranged at the first inspection position by the second transport mechanism. Manufacturing method for cut products.

7. A method for producing a cut product using the cutting device according to any one of claims 1 to 5, cutting the object held on the processing table into a plurality of cut products; a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the plurality of cut products are placed at the first inspection position by the first transport mechanism; transferring the cut products from the first conveying mechanism to the second conveying mechanism; and inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are placed at the second inspection position by the second transport mechanism. Manufacturing method for cut products.

8. A method for producing a cut product using the cutting device according to claim 3 or 4, comprising the steps of: cutting the object held on the processing table into a plurality of cut products; a step of inspecting the second surfaces of the plurality of cut products by the second inspection mechanism while the plurality of cut products are arranged at the second inspection position by the first transport mechanism; transferring the cut products from the first conveying mechanism to the second conveying mechanism; a step of inspecting the first surfaces of the plurality of cut products by the first inspection mechanism while the plurality of cut products are placed at the first inspection position by the second transport mechanism; transferring the cut products from the second conveying mechanism to the first conveying mechanism; and a step of placing the plurality of cut products on the placement table by the first transport mechanism. Manufacturing method for cut products.

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