Solid-phase bonding device and control method of solid-phase bonding device

Abstract

To improve the bonding quality between a first work-piece and a second work-piece laminated on each other in a thickness direction through an adhesive.SOLUTION: A control device 30 executes a pressing process for making a first pressing member 11 and a second pressing member 12 press a first work-piece W1 and a second work-piece W2 to contact the first work-piece W1 with the second work-piece W2. Furthermore, the control device 30 supplies a first electrode 21 and a second electrode 22 with electric power, after performing the pressing process, and also further makes the first pressing member 11 and the second pressing member 12 further press the first work-piece W1 and the second work-piece W2 to bond the first work-piece W1 to the second work-piece W2, in a solid-phase state.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a solid-state joining apparatus and a control method for the solid-state joining apparatus, and more particularly to a solid-state joining apparatus that joins a first workpiece and a second workpiece in a solid-state state and a control method for the solid-state joining apparatus. [Background technology]

[0002] For example, Japanese Patent Application Laid-Open Publication No. 8-118031 discloses a welding device using a weld bond method. This welding device performs spot welding on a workpiece. The workpiece has two plates and an adhesive interposed between the two plates. This welding device sandwiches the workpiece between a pair of electrodes, and resistance welds the two plates by passing current through the pair of electrodes to the workpiece. The welding device then heats the adhesive so that it hardens. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 8-118031 Summary of the Invention [Problem to be solved by the invention]

[0004] The above-described welding device may encounter a problem in that it is difficult to secure a current path between a pair of electrodes for spot welding of a workpiece. To secure the current path, for example, a configuration using a conductive adhesive may be considered. However, even if this configuration is adopted, the above-described welding device may encounter a problem in that the adhesive is heated to harden, resulting in combustion or gasification of the adhesive, which may result in a decrease in joining quality.

[0005] An object of the present disclosure is to improve the quality of bonding between a first workpiece and a second workpiece that are stacked in the thickness direction via an adhesive. [Means for solving the problem]

[0006] The solid-state joining apparatus of the present disclosure is an apparatus for joining a first workpiece and a second workpiece in a solid state. An adhesive is interposed between the first workpiece and the second workpiece in the thickness direction. The solid-state joining apparatus includes a pair of pressing members that press the first workpiece and the second workpiece in the thickness direction, a pair of electrodes respectively arranged around the pair of pressing members, and a control device. The control device performs a pressing process in which the first workpiece and the second workpiece are pressed by the pair of pressing members to bring the first workpiece and the second workpiece into contact at the points pressed by the pair of pressing members. Furthermore, after the pressing process, the control device supplies power to the pair of electrodes and further presses the first workpiece and the second workpiece with the pair of pressing members, thereby joining the first workpiece and the second workpiece in a solid state.

[0007] The control method disclosed herein is a control method for a solid-state joining apparatus for joining a first workpiece and a second workpiece in a solid state. An adhesive is interposed between the first workpiece and the second workpiece in the thickness direction. The solid-state joining apparatus includes a pair of pressing members that press the first workpiece and the second workpiece in the thickness direction, and a pair of electrodes that are respectively arranged around the pair of pressing members. The control method includes performing a pressing process in which the first workpiece and the second workpiece are pressed by the pair of pressing members to bring the first workpiece and the second workpiece into contact at points pressed by the pair of pressing members. The control method also includes, after the pressing process, supplying power to the pair of electrodes and further pressing the first workpiece and the second workpiece with the pair of pressing members, thereby joining the first workpiece and the second workpiece in a solid state. [Effects of the Invention]

[0008] According to the present disclosure, it is possible to improve the quality of bonding between a first workpiece and a second workpiece that are stacked in the thickness direction via an adhesive. [Brief explanation of the drawings]

[0009] [Figure 1]1 is a diagram showing an example of a solid-state joining apparatus according to a first embodiment. [Figure 2] 1A to 1C are diagrams for explaining main steps of solid-state joining. [Figure 3] 10 is a timing chart when solid-state bonding of adhesive workpieces is performed. [Figure 4] 4 is a flowchart showing the flow of main processing of the control device. [Figure 5] 1A to 1C are diagrams showing the main steps of the solid-state joining process for non-bonded workpieces. [Figure 6] 10 is an example of a first control table. [Figure 7] FIG. 2 is a functional block diagram of a control device. [Figure 8] FIG. 10 is a diagram illustrating an example of a second control table. [Figure 9] FIG. 10 is a diagram illustrating an example of a third control table. [Figure 10] FIG. 10 is a diagram illustrating an example of a fourth control table. [Figure 11] FIG. 10 is a diagram illustrating an example of a fifth control table. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments of the present disclosure will be described in detail with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated.

[0011] <First Embodiment> [Configuration of solid-state bonding equipment] FIG. 1 is a diagram schematically illustrating a solid-state joining apparatus 1 according to a first embodiment. The solid-state joining apparatus 1 heats multiple workpieces (a first workpiece W1 and a second workpiece W2) stacked on top of each other by passing current through the multiple workpieces. The solid-state joining apparatus 1 then forms softened regions at the interfaces between the multiple workpieces through the heating. Furthermore, while forming the softened regions, the solid-state joining apparatus 1 plastically deforms the softened regions, thereby joining the multiple workpieces in a solid state without melting them. This joining achieves solid-state joining. FIG. 1 illustrates an example in which a first workpiece W1 and a second workpiece W2 are joined.

[0012] The first workpiece W1 and the second workpiece W2 are, for example, conductors, and more typically, are made of metal such as iron or aluminum. The first workpiece W1 and the second workpiece W2 are, for example, formed in the shape of a flat plate.

[0013] In this embodiment, the thickness direction of the first workpiece W1 and the second workpiece W2 is the Z-axis direction. The plane perpendicular to the Z-axis direction is the XY plane. In the example of Figure 1, the X-axis of the XY plane is shown.

[0014] Furthermore, the direction of gravity in the Z-axis direction is referred to as the Z1-axis direction, and the direction opposite to the Z1-axis direction is referred to as the Z2-axis direction. The Z1-axis direction is also referred to as the "first direction." The Z2-axis direction is also referred to as the "second direction." Furthermore, the example in FIG. 1 shows the X1-axis direction and the X2-axis direction.

[0015] In this embodiment, a bonded workpiece WA is applied to the solid-state bonding apparatus 1. The bonded workpiece WA has a first workpiece W1, a second workpiece W2, and an adhesive A. The first workpiece W1 and the second workpiece W2 are overlapped in the Z-axis direction. Furthermore, the adhesive A is interposed between the first workpiece W1 and the second workpiece W2 in the Z-axis direction. The first workpiece W1 and the adhesive A are bonded together, and the second workpiece W2 and the adhesive A are bonded together. The adhesive A has insulating properties. The adhesive A is also referred to as an adhesive layer. The first workpiece W1, the second workpiece W2, and the adhesive A extend in the XY plane.

[0016] 1, the solid-state bonding apparatus 1 includes a solid-state bonding apparatus 10 and a control device 30. The solid-state bonding apparatus 10 includes a first pressing member 11, a second pressing member 12, a first electrode 21, a second electrode 22, a sensor 40, a first elastic member 51, and a second elastic member 52. The first pressing member 11 and the second pressing member 12 are also referred to as a "pair of pressing members 15" (see FIG. 7 described later). The first electrode 21 and the second electrode 22 are also referred to as a "pair of electrodes 25" (see FIG. 7 described later).

[0017] The control device 30 drives at least one driving device (for example, an actuator) not shown to move the first pressing member 11, the second pressing member 12, the first electrode 21, and the second electrode 22 in the Z-axis direction. The control device 30 is capable of recognizing the movement distances of the first pressing member 11, the second pressing member 12, the first electrode 21, and the second electrode 22 based on the driving amount of the driving device. Furthermore, the solid-state joining apparatus 1 is supplied with power from a power source not shown. The control device 30 controls the amount of power supplied to the first electrode 21 and the second electrode 22 by driving at least one power device not shown.

[0018] First, the first pressing member 11 and the second pressing member 12 will be described. The first pressing member 11 and the second pressing member 12 have a shape extending in the Z-axis direction. The first pressing member 11 and the second pressing member 12 have, for example, a cylindrical shape. The first pressing member 11 is made of, for example, tungsten carbide. A first pressing portion 11a is formed at the tip of the first pressing member 11.

[0019] The second pressing member 12 has at least a part of the same configuration as the first pressing member 11. The first pressing member 11 and the second pressing member 12 are arranged so that the central axis of the first pressing member 11 in the Z-axis direction coincides with the central axis of the second pressing member 12 in the Z-axis direction. Furthermore, the first pressing member 11 and the second pressing member 12 are arranged so that the first pressing portion 11a and the second pressing portion 12a face each other in the Z-axis direction. In the example of FIG. 1, convex portions are formed on the first pressing portion 11a and the second pressing portion 12a.

[0020] Under the control of the control device 30, the first pressing member 11 moves in the Z1-axis direction to press the first workpiece W1. Also, under the control of the control device 30, the second pressing member 12 moves in the Z2-axis direction to press the second workpiece W2.

[0021] The sensor 40 is provided, for example, on the first pressing member 11. The control device 30 acquires (detects) the detection value of the sensor 40 as, for example, the load on the bonded workpiece WA by the pair of pressing members 15. In this embodiment, a load cell is used as the sensor 40. Note that the installation location of the sensor 40 is not limited to the first pressing member 11, and the sensor 40 may be installed in another location.

[0022] Next, the first electrode 21 and the second electrode 22 will be described. The first electrode 21 is formed in a cylindrical shape surrounding the first pressing member 11. A gap is provided between the inner peripheral surface of the first electrode 21 and the outer peripheral surface of the first pressing member 11. The first electrode 21 is made of, for example, copper. The first electrode 21 has a contact surface 21a that comes into contact with the first workpiece W1. The contact surface 21a is formed in an annular shape. However, the shape of the contact surface 21a is not limited to an annular shape.

[0023] The second electrode 22 has a configuration similar to at least a part of the above-described configuration of the first electrode 21. The second electrode 22 is capable of contacting a portion of the second workpiece W2 surrounding a portion that is pressed by the second pressing member 12. The first electrode 21 and the second electrode 22 are arranged so that the central axis of the first electrode 21 in the Z-axis direction coincides with the central axis of the second electrode 22 in the Z-axis direction. Furthermore, the first electrode 21 and the second electrode 22 are arranged so that the contact surface 21a of the first electrode 21 and the contact surface 22a of the second electrode 22 face each other.

[0024] The first electrode 21 is held by a first elastic member 51, and the second electrode 22 is held by a second elastic member 52. When the first electrode 21 is in contact with the first workpiece W1, the first elastic member 51 urges the first electrode 21 toward the first workpiece W1. When the second electrode 22 is in contact with the second workpiece W2, the second elastic member 52 urges the second electrode 22 toward the second workpiece W2. The protrusions W11, W21, and dashed line X in FIG. 1 will be described later.

[0025] The control device 30 includes a CPU 31 (Central Processing Unit), memory 32 (ROM (Read Only Memory) and RAM (Random Access Memory)), and an input / output device (not shown) for inputting and outputting various signals. The CPU 31 functions as a processing circuitry that deploys programs stored in the ROM into the RAM or the like and executes them. The programs stored in the ROM are programs that describe the processing procedures of the control device 30. The control device 30 controls each device in accordance with these programs. This control is not limited to software processing, but can also be processed by dedicated hardware (electronic circuitry). The CPU 31 is also referred to as a "control circuit" or "at least one processor."

[0026] An input device 61 and a display device 62 are connected to the control device 30. The display device 62 displays various screens under the control of the control device 30. Various information is input to the input device 61 by the user. The input information is output to the control device 30.

[0027] [Solid-state bonding process] FIG. 2 is a diagram illustrating the main steps of solid-state bonding. The first elastic member 51 and the second elastic member 52 are not shown in FIG. 2. FIG. 2(A) is a diagram illustrating the first pressing member 11, the second pressing member 12, the first electrode 21, and the second electrode 22 in their initial positions. FIG. 2(B) is a diagram illustrating the first pressing member 11, the second pressing member 12, the first electrode 21, and the second electrode 22 in contact with the bonded workpiece WA. FIG. 2(B) is also a diagram illustrating the start of the pressing process by the first pressing member 11 and the second pressing member 12.

[0028] 2(B) shows a first pressing point W12 on the first workpiece W1 by the first pressing portion 11a of the first pressing member 11. Also shown is a second pressing point W22 on the second workpiece W2 by the second pressing portion 12a of the second pressing member 12. Also shown in FIG. 2(B) is an adhesive portion A1. The adhesive portion A1 is a portion of the adhesive A that faces the pressing points (first pressing point W12 and second pressing point W22) by the first pressing member 11 and the second pressing member 12 (a pair of pressing members 15).

[0029] 2(C) is a diagram showing that the pressing process is continued by the first pressing member 11 and the second pressing member 12. As a result of this pressing process, a protrusion W11 extending in the Z1-axis direction is formed on the first workpiece W1. Also, as a result of this pressing process, a protrusion W21 extending in the Z2-axis direction is formed on the second workpiece W2.

[0030] The protrusions W11 and W21 penetrate the adhesive A, and the protrusions W11 and W21 come into contact with each other. In FIG. 2(C), the contact point is shown as a contact point WS. This contact point WS becomes a current path. The formation of this current path enables the first electrode 21 and the second electrode 22 to apply current to the bonded workpiece WA.

[0031] 2(D) is a diagram showing the solid-state joining apparatus 1 supplying power to the pair of electrodes 25 (first electrode 21 and second electrode 22) and further pressing the first workpiece W1 and the second workpiece W2 with the pair of pressing members 15 (first pressing member 11 and second pressing member 12). As shown in FIG. 2(D), the control device 30 starts further pressing and also starts energizing the first electrode 21 and the second electrode 22. This energizing process heats the first workpiece W1 and the second workpiece W2, centered around the contact point WS.

[0032] 2(D) and 1, the flow of current due to this current application process is indicated by the dashed line X. The contact point WS becomes the bonding interface, and the movement of atoms of the first workpiece W1 and the second workpiece W2 can be promoted at this bonding interface.

[0033] 2(E) is a diagram showing the completion of solid-state welding. As shown in FIG. 2(E), a nugget N is formed by pressing and energizing. As a result, the first workpiece W1 and the second workpiece W2 are joined in a solid-state state at the spot of the nugget N.

[0034] In conventional welding devices using the weld bond method, the adhesive is heated to harden, which can result in a problem of reduced joining quality due to combustion or gasification of the adhesive. In contrast, the solid-state joining device 1 of this embodiment can join the first and second workpieces WA in a solid state without heating the adhesive A. Therefore, combustion or gasification of the adhesive A can be suppressed, thereby improving joining quality compared to welding devices using conventional weld bond methods.

[0035] In addition, there are cases where the first workpiece W1 and the second workpiece W2 are made of different materials and the adhesive A is a so-called anti-illumination sealant. The solid-state joining apparatus 1 of this embodiment can appropriately realize solid-state joining of the first workpiece W1 and the second workpiece W2 even with such an adhesive workpiece WA. Furthermore, the solid-state joining apparatus 1 of this embodiment can also be applied to the creation of a joint using both the adhesive A and solid-state joining.

[0036] Furthermore, there are adhesives whose adhesive strength decreases when they harden due to heating. In conventional welding devices using the weld bond method, such adhesives are heated, which reduces the adhesive strength. In contrast, the solid-state joining device 1 of the present embodiment does not heat the adhesive itself, even when such adhesives are used, so the adhesive strength before hardening can be guaranteed and the reduction in adhesive strength can be suppressed.

[0037] Furthermore, in conventional welding devices using the weld bond method, it is necessary to place the adhesive in a position where it is easy to heat. In other words, there is a problem that the degree of freedom in placing the adhesive is reduced. In contrast, in the solid-state joining device 1 of the present embodiment, the adhesive is not heated, so it is possible to prevent the problem of reduced degree of freedom in placing the adhesive from occurring.

[0038] 2(B) and 2(C), the pressing process is a process of bringing the first workpiece W1 and the second workpiece W2 into contact with each other by moving (discharging) the adhesive portion A1 of the adhesive A that faces the pressing points (first pressing point W12 and second pressing point W22) of the pair of pressing members 15 to another location. Therefore, the solid-state joining apparatus 1 can suppress combustion or gasification of the adhesive A and ensure a current path, thereby improving the joining quality.

[0039] [Timing chart] FIG. 3 is a timing chart for when solid-state welding of the bonded workpiece WA is performed. The horizontal axis in FIGS. 3(A) to 3(C) represents time. The vertical axis in FIG. 3(A) represents the movement distance (stroke) of the first pressing member 11 from the initial position. FIG. 3(B) represents the load (value detected by the sensor 40) applied to the bonded workpiece WA. The vertical axis in FIG. 3(C) represents whether or not power is supplied to the pair of electrodes 25 (current is passed through the bonded workpiece WA).

[0040] At timing t0, the control device 30 starts the solid-state joining process. At timing t0, the control device 30 starts an approach process in which the first pressing member 11 and the second pressing member 12 are moved closer to the bonded workpiece WA by lowering the first pressing member 11 and raising the second pressing member 12 (see FIG. 2(A)).

[0041] Next, at timing t1, the control device 30 detects that the first pressing member 11 has contacted the first workpiece W1 (see FIG. 3(B)). For example, the control device 30 acquires the detection value of the sensor 40, and when the detection value reaches a first value F1 (for example, 1 kN), determines that the first pressing member 11 has contacted the first workpiece W1. The amount of movement of the first pressing member 11 and the second pressing member 12 when the contact of the first pressing member 11 with the first workpiece W1 is detected is set to D1 (see FIG. 3(A)).

[0042] At timing t2 after timing t1, the control device 30 further resumes the lowering of the first pressing member 11 and the raising of the second pressing member 12. This starts the pressing process of the first workpiece W1 and the second workpiece W2 (see FIG. 2(B)).

[0043] The control device 30 continues the pressing process until the amount of pressing by the first pressing member 11 reaches a first predetermined amount. Here, the pressing amount is the distance by which the first pressing member 11 is pressed into the first workpiece W1 (further downward in the Z1-axis direction) from a state in which the first pressing member 11 is in contact with the first workpiece W1. The first predetermined amount is, for example, a value for forming the contact point WS (current path) shown in FIG. 2(C), and is a value determined in advance through experiments or the like. In the example of FIG. 3, it is assumed that the amount of pressing reaches the first predetermined amount at timing t3. In the example of FIG. 3, the amount of movement at timing t3 is D2. The value obtained by subtracting D1 from D2 is the first predetermined amount. The detection value detected by the sensor 40 at timing t3 is a second value F2.

[0044] The control device 30 then continues the pressing process and ends the pressing process at timing t4. At timing t4, the contact point WS (current path) shown in FIG. 2(C) may be formed.

[0045] Next, at timing t5, the control device 30 starts supplying power to the pair of electrodes 25. This starts energizing the bonded workpiece WA.

[0046] Next, while the current continues to be applied to the bonded workpiece WA, at timing t6, the control device 30 starts a further pressing process. This further pressing process is a process in which the first pressing member 11 presses the workpiece WA until the pressing amount reaches a second predetermined amount. The second predetermined amount is greater than the first predetermined amount. In the example of FIG. 3, it is assumed that the pressing amount reaches the second predetermined amount at timing t7. In the example of FIG. 3, the movement amount at timing t7 is D3. The value obtained by subtracting D1 from D3 is the second predetermined amount. At timing 73, the detection value detected by the sensor 40 is a third value F3. The third value F3 is greater than the second value F2.

[0047] At timing t7, the control device 30 ends the pressing process and the current application process. Furthermore, the control device 30 starts a process of returning the first pressing member 11, the second pressing member 12, the first electrode 21, and the second electrode 22 to their initial positions. At subsequent timing t8, the first pressing member 11, the second pressing member 12, the first electrode 21, and the second electrode 22 are located at their initial positions.

[0048] [flowchart] 4 is a flowchart showing the main processing flow of the control device 30. First, in step S2, the first pressing member 11 and the second pressing member 12 are moved toward the first workpiece W1 and the second workpiece W2 (timing t0 in FIG. 3).

[0049] Next, in step S4, the control device 30 determines whether the first pressing member 11 has come into contact with the first workpiece W1. The control device 30 repeats the processes of steps S2 and S4 until it determines that the first pressing member 11 has come into contact with the first workpiece W1 (NO in step S4). Then, when the control device 30 determines that the first pressing member 11 has come into contact with the first workpiece W1 (YES in step S4, timing t1), the process proceeds to step S6.

[0050] In step S6, the control device 30 executes a pressing process to discharge (move to another location) the adhesive portion A1 (see FIG. 2(B)). Next, in step S8, the control device 30 determines whether the pushing amount has reached a first predetermined amount. The control device 30 repeats the process of step S8 until the pushing amount reaches the first predetermined amount (NO in step S8). Then, when the pushing amount has reached the first predetermined amount (YES in step S8, timing t3), the process proceeds to step S10.

[0051] In step S10, the control device 30 starts the energization process (timing t5). Next, in step S12, the control device 30 executes the energization process and the pressing process (timing t6). Next, in step S8, the control device 30 determines whether the pushing amount has reached a second predetermined amount. The control device 30 repeats the process of step S8 until the pushing amount reaches the second predetermined amount (NO in step S8). Then, when the pushing amount reaches the second predetermined amount (YES in step S8, timing t7), the process of FIG. 4 ends.

[0052] <Embodiment 2> In the first embodiment, an example is described in which solid-state welding of the first workpiece W1 and the second workpiece W2 in the bonded workpiece WA is performed. In the second embodiment, an example is described in which solid-state welding of the first workpiece W1 and the second workpiece W2 in the non-bonded workpiece WB is performed. The non-bonded workpiece WB is a workpiece in which the first workpiece W1 and the second workpiece W2 are superimposed in the Z-axis direction without any adhesive A interposed between them.

[0053] FIG. 5 shows the main steps of the solid-state welding process for non-bonded workpieces WB. FIG. 5(A) shows the initial state. FIG. 5(B) shows the state after the pressing process has been performed. As shown in FIG. 5(B), a protrusion W11 is formed on the first workpiece W1 at a location facing the first pressing portion 11a. A protrusion W21 is formed on the second workpiece W2 at a location facing the second pressing portion 12a. The protrusions W11 and W21 then contact each other, forming a current path. Although not shown, the control device 30 performs further pressing and current processes after the current path is formed. As a result, the first workpiece W1 and the second workpiece W2 are joined in a solid-state state.

[0054] 5, it is described that only the protrusions W11 and W21 are in contact. The amount of power supplied to the pair of electrodes 25 when only the protrusions W11 and W21 are in contact is referred to as the "ideal amount of power."

[0055] However, in reality, the first workpiece W1 and the second workpiece W2 may come into contact with each other at portions other than the protrusions W11 and W21. Therefore, multiple current paths are formed. The current flowing through the pair of electrodes 25 is split. Therefore, in order to achieve solid-state welding at the protrusions W11 and W21, the control device 30 actually supplies a larger amount of power to the pair of electrodes 25 than the above-mentioned ideal amount of power.

[0056] On the other hand, in the case of the bonded workpiece WA, even if the pressing process is performed, as shown in Fig. 2(C), the portions of the first workpiece W1 other than the protrusion W11 and the portions of the second workpiece W2 other than the protrusion W21 are adhered to the adhesive A. Therefore, in the bonded workpiece WA, it is difficult to form a current path other than at the contact point WS. Therefore, in the case of the bonded workpiece WA, the control device 30 can supply the amount of power to the pair of electrodes 25 to the same amount as the ideal amount of power or an amount of power close to the ideal amount of power.

[0057] In other words, when joining the first workpiece W1 and the second workpiece W2 in the bonded workpiece WA in a solid state, the control device 30 reduces the amount of power supplied to the pair of electrodes 25 compared to when joining the first workpiece W1 and the second workpiece W2 in the non-bonded workpiece WB in a solid state.

[0058] FIG. 6 is an example of a first control table held by the control device 30 of this embodiment. In the example of FIG. 6, the workpiece type is associated with the amount of power supplied to the pair of electrodes 25. The workpiece type is information indicating whether the workpiece is a bonded workpiece WA or a non-bonded workpiece WB. In FIG. 6, the bonded workpiece WA is associated with the amount of power supplied E1. Furthermore, the non-bonded workpiece WB is associated with the amount of power supplied E2. Furthermore, the amount of power supplied E2 is greater than the amount of power supplied E1.

[0059] 7 is a functional block diagram of the control device 30. The control device 30 has an acquisition unit 102, a processing unit 104, a control unit 106, and a storage unit 108. The acquisition unit 102, the processing unit 104, and the control unit 106 correspond to the CPU 31. The storage unit 108 corresponds to the memory 32.

[0060] The display device 62 displays an input screen (not shown) on which the user can input the work type. The user can input the work type on the input screen using the input device 61. As described in FIG. 6 and other figures, the work type is information indicating whether the work is a bonded work or a non-bonded work.

[0061] The acquisition unit 102 acquires the input workpiece type. The processing unit 104 temporarily stores a workpiece type flag indicating the input workpiece type in a predetermined storage area (for example, the storage unit 108). Then, the processing unit 104 refers to a first control table (see FIG. 6) stored in the storage unit 108 to identify the amount of supply power corresponding to the set workpiece type flag. The processing unit 104 outputs the identified amount of supply power to the control unit 106. The control unit 106 controls the power device so that the amount of supply power identified by the processing unit 104 is supplied to the pair of electrodes 25 (the first electrode 21 and the second electrode 22).

[0062] According to this embodiment, the solid-state welding apparatus 1 can ensure the welding quality of the solid-state welding of the first workpiece W1 and the second workpiece W2 in the bonded workpiece WA while suppressing the amount of power consumption.

[0063] Furthermore, the control device 30 determines whether the workpiece W is a bonded workpiece WA or a non-bonded workpiece WB in response to a user input. Therefore, the user can select between solid-state bonding of the bonded workpiece WA and solid-state bonding of the non-bonded workpiece WB, thereby improving user convenience.

[0064] <Third Embodiment> In the third embodiment, control according to the characteristics of adhesive A will be described. The configuration of FIG. 7 is applied to the control device 30 of the third embodiment. In the third embodiment, the user inputs the adhesive characteristics (in parentheses in FIG. 7) using the input device 61. The acquisition unit 102 acquires the adhesive characteristics. The processing unit 104 determines the pressing force of the pair of pressing members 15 or the amount of power to be supplied to the pair of electrodes 25 by referring to a control table (one of the second to fifth control tables described later) stored in the storage unit 108. Then, the control unit 106 controls the pressing force of the pair of pressing members 15 or the amount of power to be supplied to the pair of electrodes 25 based on the content determined by the processing unit 104.

[0065] [Example 1] First, a first example of the third embodiment will be described. The characteristics of the adhesive A in the first example include the thickness of the adhesive A (length in the Z-axis direction). FIG. 8 is a diagram showing an example of a second control table to which the first example is applied. In the example of FIG. 8, the thickness range of the adhesive is associated with the pressing force of the pair of pressing members 15.

[0066] In the example of FIG. 8, a first range a1, which is a range of adhesive thickness, is associated with a pressing force f1. A second range a2, which is a range of adhesive thickness, is associated with a pressing force f2. Here, the second range a2 is larger than the first range a1. The pressing force f2 is larger than the pressing force f1. In the present disclosure, the first range is a range equal to or greater than a minimum value M1 and less than a maximum value M2. In addition, the second range is defined as equal to or greater than a minimum value M3 and less than or equal to a maximum value M4. The relationship between these values ​​is maximum value M4 > minimum value M3 = maximum value M2 > minimum value M1. In this manner, in the present disclosure, the second range is configured to be larger than the first range.

[0067] The processing unit 104 identifies whether the thickness of the adhesive input by the user belongs to the first range a1 or the second range a2, and then controls the pair of pressing members 15 so that the pressing force corresponds to the range identified by the processing unit 104.

[0068] Generally, when the adhesive A is thick, it is preferable to increase the pressing force of the pair of pressing members 15 in order to bring the first workpiece W1 and the second workpiece W2 into contact with each other. Therefore, in the solid-state welding apparatus 1 of the first example, the thicker the adhesive A, the greater the pressing force of the pair of pressing members 15 is increased. Therefore, even when the adhesive A is thick, the solid-state welding apparatus 1 of the first example can bring the first workpiece W1 and the second workpiece W2 into contact with each other (can form a current path).

[0069] [Example 2] Next, a second example of the third embodiment will be described. In the second example, the characteristics of adhesive A include the viscosity of adhesive A. FIG. 9 is a diagram showing an example of a third control table to which the second example is applied. In the example of FIG. 9, the viscosity range of the adhesive is associated with the pressing force of the pair of pressing members 15.

[0070] In the example of Fig. 9, a first range b1, which is a viscosity range of the adhesive, is associated with a pressing force f1. A second range b2, which is a viscosity range of the adhesive, is associated with a pressing force f2. Here, the second range b2 is greater than the first range b1. The pressing force f2 is greater than the pressing force f1.

[0071] The processing unit 104 determines whether the viscosity of the adhesive input by the user belongs to the first range b1 or the second range b2, and then controls the pair of pressing members 15 so that the pressing force corresponds to the range determined by the processing unit 104.

[0072] Generally, when the viscosity of the adhesive A is high, it is preferable to increase the pressing force of the pair of pressing members 15 in order to bring the first workpiece W1 and the second workpiece W2 into contact with each other. Therefore, in the solid-state welding apparatus 1 of the second example, the higher the viscosity of the adhesive A, the greater the pressing force of the pair of pressing members 15 is increased. According to this second example, even when the viscosity of the adhesive A is high, the solid-state welding apparatus 1 can bring the first workpiece W1 and the second workpiece W2 into contact with each other.

[0073] [Example 3] Next, a third example of the third embodiment will be described. The characteristics of the adhesive A in the third example include the heat resistance temperature of the adhesive A. FIG. 10 is a diagram showing an example of a fourth control table to which the third example is applied. In the example of FIG. 10, the heat resistance temperature range of the adhesive and the amount of power supplied by the pair of pressing members 15 are associated with each other.

[0074] In the example of Fig. 10, a first range c1, which is the heat-resistant temperature range of the adhesive, is associated with a supplied amount of power E1. Also, a second range c2, which is the heat-resistant temperature range of the adhesive, is associated with a supplied amount of power E2. Here, the second range c2 is larger than the first range c1. Also, the supplied amount of power E2 is larger than the supplied amount of power E1.

[0075] The processing unit 104 identifies whether the heat resistance temperature of the adhesive input by the user belongs to the first range c1 or the second range c2. The control unit 106 then controls the amount of power supplied to the pair of electrodes 25 so that the amount of power supplied corresponds to the range identified by the processing unit 104.

[0076] Generally, to properly bond the first and second workpieces in a solid state, it is preferable to heat the first and second workpieces to a higher temperature. Therefore, the higher the heat resistance temperature of the adhesive, the greater the amount of power supplied to the pair of electrodes. Therefore, the heating temperature of the first and second workpieces can be increased while maintaining the adhesive bond.

[0077] A further modification of the third example will now be described. In this modification, for example, when the heat resistance temperature of the adhesive is low, the processing unit 104 reduces the amount of power supplied from the reference amount of power. Furthermore, the processing unit 104 increases the pressing force of the pair of pressing members 15 in accordance with the amount of reduction in the amount of power supplied from the reference amount of power. This configuration can suppress deterioration due to the heat resistance temperature of the adhesive and ensure the bonding strength of the first workpiece W1, adhesive A, and second workpiece W2.

[0078] [Example 4] Next, a fourth example of the third embodiment will be described. In the fourth example, the characteristics of adhesive A include the curing temperature of adhesive A. FIG. 11 is a diagram showing an example of a fifth control table to which the fourth example is applied. In the example of FIG. 11, the curing temperature range of the adhesive and the amount of power supplied by the pair of pressing members 15 are associated with each other.

[0079] In the example of Fig. 11, a first range d1, which is the curing temperature range of the adhesive, is associated with a supplied amount of power E1. Also, a second range d2, which is the curing temperature range of the adhesive, is associated with a supplied amount of power E2. Here, the second range d2 is greater than the first range d1. Also, the supplied amount of power E2 is greater than the supplied amount of power E1.

[0080] The processing unit 104 identifies whether the adhesive curing temperature input by the user belongs to the first range d1 or the second range d2, and then controls the amount of power supplied to the pair of electrodes 25 so that the amount of power supplied corresponds to the range identified by the processing unit 104.

[0081] With this configuration, the higher the curing temperature of the adhesive A, the greater the amount of power supplied to the pair of electrodes 25 by the control device 30. Therefore, not only can the first workpiece W1 and the second workpiece W2 be heated, but the adhesive can also be cured appropriately.

[0082] <Other embodiments> (1) In the second and third embodiments, as illustrated in FIG. 7, the configuration has been described in which the user inputs the type of workpiece and the characteristics of the adhesive. However, the solid-state welding apparatus 1 may determine at least one of the type of workpiece and the characteristics of the adhesive. For example, the solid-state welding apparatus 1 may be equipped with an imaging device (camera) that captures an image of the workpiece. Image data captured by the imaging device is output to the control device 30.

[0083] The control device 30 may perform image processing on the image data to identify at least one of the type of workpiece and the characteristics of the adhesive A. With the solid-state welding apparatus 1 having such a configuration, it is possible to perform solid-state welding according to at least one of the type of workpiece and the characteristics of the adhesive A while reducing the burden on the user.

[0084] (2) In the second and third embodiments, the control device 30 is described as being configured to determine the pressing force or the supplied power value using one of five parameters: the type of workpiece, the thickness of adhesive A, the viscosity of adhesive A, the heat resistance temperature of adhesive A, and the curing temperature of adhesive A. However, the control device 30 may be configured to determine at least one of the pressing force and the supplied power value using at least two of these five parameters.

[0085] For example, the control device 30 may input the at least two parameters to a predetermined function to derive at least one of the pressure force and the supplied power value. Furthermore, the control device 30 may use AI (Artificial Intelligence) to determine at least one of the pressure force and the supplied power value. For example, the control device 30 may apply the at least two parameters to a learned model to determine at least one of the pressure force and the supplied power value.

[0086] (3) In the second to fifth control tables described with reference to Figures 8 to 11, the number of types of ranges of adhesive properties is "2." However, the number of types of ranges of adhesive properties may be "3" or more.

[0087] <Additional Notes> (Item 1) The solid-state joining apparatus of the present disclosure is an apparatus for joining a first workpiece and a second workpiece in a solid state. An adhesive is interposed between the first workpiece and the second workpiece in the thickness direction. The solid-state joining apparatus includes a pair of pressing members that press the first workpiece and the second workpiece in the thickness direction, a pair of electrodes respectively disposed around the pair of pressing members, and a control device. The control device performs a pressing process in which the first workpiece and the second workpiece are pressed by the pair of pressing members to bring the first workpiece and the second workpiece into contact at the points pressed by the pair of pressing members. Furthermore, after the pressing process, the control device supplies power to the pair of electrodes and further presses the first workpiece and the second workpiece with the pair of pressing members, thereby joining the first workpiece and the second workpiece in a solid state.

[0088] This configuration allows the first and second workpieces to be joined in a solid state without heating the adhesive to harden, thereby preventing the adhesive from burning or gasifying, resulting in improved joining quality compared to welding devices using conventional weld bond methods.

[0089] (Item 2) In the solid-state joining apparatus described in item 1, the pressing process is a process of bringing the first workpiece and the second workpiece into contact by moving the adhesive portion that faces the pressing point by the pair of pressing members to another location.

[0090] With this configuration, the first workpiece and the second workpiece are brought into contact by moving the adhesive portion to another location through the pressing process, thereby ensuring a current path without burning or gasifying the adhesive, thereby improving joining quality.

[0091] (Item 3) In the solid-state joining apparatus according to item 1 or 2, the workpieces to be applied to the solid-state joining apparatus include bonded workpieces in which an adhesive is interposed between a first workpiece and a second workpiece, and non-bonded workpieces in which no adhesive is interposed between the first workpiece and the second workpiece. When bonding the first workpiece and the second workpiece in a bonded workpiece in a solid state, the control device reduces the amount of power supplied to the pair of electrodes compared to when bonding the first workpiece and the second workpiece in a non-bonded workpiece in a solid state.

[0092] According to this configuration, it is possible to suppress the amount of power consumption while ensuring the joining quality of the solid-state joining of the first workpiece and the second workpiece in the bonded workpiece.

[0093] (Item 4) In the solid-state joining apparatus according to item 3, the control device determines whether the workpiece is a bonded workpiece or a non-bonded workpiece in response to a user's input.

[0094] With this configuration, the user can select between solid-state welding of bonded workpieces and solid-state welding of non-bonded workpieces, thereby improving user convenience.

[0095] (Item 5) In the solid-state bonding apparatus according to items 1 to 4, the control device controls at least one of the pressing force of the pair of pressing members and the amount of power supplied to the pair of electrodes according to the properties of the adhesive.

[0096] With this configuration, solid-state bonding can be achieved according to the properties of the adhesive. (Item 6) In the solid-state bonding apparatus according to item 5, the characteristics of the adhesive include a thickness of the adhesive, and the control device increases the pressing force of the pair of pressing members as the thickness of the adhesive increases.

[0097] When the thickness of the adhesive is thick, it is preferable to increase the pressing force of the pair of pressing members in order to bring the first workpiece and the second workpiece into contact. With this configuration, even when the thickness of the adhesive is thick, the first workpiece and the second workpiece can be brought into contact.

[0098] (Item 7) In the solid-state bonding apparatus according to item 5, the properties of the adhesive include viscosity of the adhesive, and the control device increases the pressing force of the pair of pressing members as the viscosity of the adhesive increases.

[0099] When the viscosity of the adhesive is high, it is preferable to increase the pressing force of the pair of pressing members in order to bring the first workpiece and the second workpiece into contact. With this configuration, even when the viscosity of the adhesive is high, the first workpiece and the second workpiece can be brought into contact.

[0100] (Item 8) In the solid-state bonding apparatus according to item 5, the properties of the adhesive include a heat resistance temperature of the adhesive. The control device increases the amount of power supplied to the pair of electrodes as the heat resistance temperature of the adhesive increases.

[0101] Generally, to properly bond the first and second workpieces in a solid state, it is preferable to heat the first and second workpieces to a higher temperature. Therefore, the higher the heat resistance temperature of the adhesive, the greater the amount of power supplied to the pair of electrodes. Therefore, the heating temperature of the first and second workpieces can be increased while maintaining the adhesive bond.

[0102] (Item 9) In the solid-state bonding apparatus according to item 5, the characteristics of the adhesive include a curing temperature of the adhesive, and the control device increases the amount of power supplied to the pair of electrodes as the curing temperature of the adhesive increases.

[0103] With this configuration, the amount of power supplied to the pair of electrodes increases as the curing temperature of the adhesive increases, which not only heats the first workpiece and the second workpiece but also allows the adhesive to be cured appropriately.

[0104] (Item 10) In the solid-state bonding apparatus according to any one of items 5 to 9, the control device acquires the properties of the adhesive through an input by a user.

[0105] According to this configuration, the user can cause the solid-state welding apparatus to perform solid-state welding according to the properties of the adhesive, thereby improving user convenience.

[0106] (Item 11) A control method disclosed herein is a control method for a solid-state joining apparatus for joining a first workpiece and a second workpiece in a solid state. An adhesive is interposed between the first workpiece and the second workpiece in the thickness direction. The solid-state joining apparatus includes a pair of pressing members that press the first workpiece and the second workpiece in the thickness direction, and a pair of electrodes that are respectively arranged around the pair of pressing members. The control method includes performing a pressing process in which the first workpiece and the second workpiece are pressed by the pair of pressing members to bring the first workpiece and the second workpiece into contact at points pressed by the pair of pressing members. The control method also includes, after the pressing process, supplying power to the pair of electrodes and further pressing the first workpiece and the second workpiece with the pair of pressing members, thereby joining the first workpiece and the second workpiece in a solid state.

[0107] The embodiments disclosed herein should be considered to be illustrative in all respects and not restrictive. The scope of the present disclosure is defined by the claims, not by the description of the above embodiments, and is intended to include all modifications within the meaning and scope of the claims. [Explanation of symbols]

[0108] 1 solid-state bonding apparatus, 10 solid-state bonding equipment, 11 first pressing member, 11a first pressing portion, 12 second pressing member, 12a second pressing portion, 15 pair of pressing members, 21 first electrode, 22 second electrode, 25 pair of electrodes, 30 control device, 32 memory, 40 sensor, 51 first elastic member, 52 second elastic member, 61 input device, 62 display device, 102 acquisition unit, 104 processing unit, 106 control unit, 108 memory unit, A adhesive, A1 adhesive portion, W1 first workpiece, W2 second workpiece, W11, W21 protrusion, W12 first pressing location, W22 second pressing location.

Claims

1. A solid-state joining apparatus for joining a first workpiece and a second workpiece in a solid-state state, an adhesive is interposed between the first workpiece and the second workpiece in a thickness direction; The solid-state bonding apparatus comprises: a pair of pressing members that press the first workpiece and the second workpiece in the thickness direction; a pair of electrodes respectively disposed around the pair of pressing members; a control device; The control device performing a pressing process in which the first workpiece and the second workpiece are pressed by the pair of pressing members, and the first workpiece and the second workpiece are brought into contact with each other at pressing points by the pair of pressing members; a solid-state joining apparatus that, after the pressing process, supplies power to the pair of electrodes and further presses the first workpiece and the second workpiece with the pair of pressing members, thereby joining the first workpiece and the second workpiece in a solid-state state.

2. 2. The solid-state joining apparatus according to claim 1, wherein the pressing process is a process of bringing the first workpiece and the second workpiece into contact with each other by moving a portion of the adhesive facing the pressing point by the pair of pressing members to another location.

3. The workpiece to be applied to the solid-state joining apparatus is: a bonded workpiece in which the adhesive is interposed between the first workpiece and the second workpiece; a non-adhesive workpiece in which the adhesive is not interposed between the first workpiece and the second workpiece, 3. The solid-state joining apparatus according to claim 1, wherein the control device reduces the amount of power supplied to the pair of electrodes when joining the first workpiece and the second workpiece in the bonded workpiece in a solid state compared to when joining the first workpiece and the second workpiece in the non-bonded workpiece in a solid state.

4. The solid-state joining apparatus according to claim 3 , wherein the control device determines whether the workpiece is the bonded workpiece or the non-bonded workpiece in response to a user's input.

5. 2. The solid-state welding apparatus according to claim 1, wherein the control device controls at least one of the pressing forces of the pair of pressing members and the amounts of power supplied to the pair of electrodes in accordance with the characteristics of the adhesive.

6. the adhesive properties include a thickness of the adhesive; The solid-state joining apparatus according to claim 5 , wherein the control device increases the pressing force of the pair of pressing members as the thickness of the adhesive increases.

7. the adhesive properties include the viscosity of the adhesive; The solid-state joining apparatus according to claim 5 , wherein the control device increases the pressing force of the pair of pressing members as the viscosity of the adhesive increases.

8. The adhesive properties include a heat resistance temperature of the adhesive; The solid-state joining apparatus according to claim 5 , wherein the control device increases the amount of power supplied to the pair of electrodes as the heat resistance temperature of the adhesive increases.

9. the adhesive properties include a cure temperature of the adhesive; The solid-state welding apparatus according to claim 5 , wherein the control device increases the amount of power supplied to the pair of electrodes as the curing temperature of the adhesive increases.

10. The solid-state joining apparatus according to any one of claims 5 to 9, wherein the control device acquires the characteristics of the adhesive through a user's input.

11. A control method for a solid-state joining apparatus for joining a first workpiece and a second workpiece in a solid-state state, comprising: an adhesive is interposed between the first workpiece and the second workpiece in a thickness direction; The solid-state bonding apparatus comprises: a pair of pressing members that press the first workpiece and the second workpiece in the thickness direction; a pair of electrodes respectively disposed around the pair of pressing members; The control method includes: performing a pressing process in which the first workpiece and the second workpiece are pressed by the pair of pressing members to bring the first workpiece and the second workpiece into contact with each other at pressing points pressed by the pair of pressing members; after the pressing process, supplying power to the pair of electrodes and further pressing the first workpiece and the second workpiece with the pair of pressing members, thereby joining the first workpiece and the second workpiece in a solid state.

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