Component inspection device

Abstract

To provide a component inspection device that contributes to improving the tact of component inspection before mounting on substrates.SOLUTION: A component inspection device 100 comprises: a head unit 4 having a head 4H that holds a component C; a scan camera unit 6 which is movably mounted to the head unit 4 and captures an image of the component C held to the head 4H; and an inspection unit for inspecting the component C. The scan camera unit 6 includes a scan camera 62, and an optical system 7 that forms a first optical path V1 for capturing an underside view of the component C, a second optical path V2 for capturing a side view, and a third optical path V3 for capturing a diagonal view. The inspection unit executes a first inspection for performing component recognition by using at least one of the underside view and side view images and a second inspection for performing coplanarity measurement by using the underside view and diagonal view images.SELECTED DRAWING: Figure 7

Description

[Technical Field]

[0001] The present invention relates to a component inspection device that inspects a component held by a head. [Background technology]

[0002] A surface mounter that mounts electronic components on a printed circuit board is equipped with a head that picks up the components. The surface mounter is also equipped with an inspection device that inspects the holding posture of the component picked up by the head and whether the component is picked up at all. Patent Document 1 discloses an inspection device that has a first optical path that captures an image of the component picked up by the head from vertically below and a second optical path that captures an image of the component from an oblique direction, and switches between the first and second optical paths to capture an image of the component with a single camera. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-143419 Summary of the Invention [Problem to be solved by the invention]

[0004] Another inspection that is performed before components are mounted on a board is coplanarity measurement, which checks whether the height of the bonding surface of IC components with many lead terminals or ball terminals to the board is correct.

[0005] The component orientation and presence / absence described above are recognized based on component images acquired by a scan camera mounted on a head unit with multiple heads. The scan camera captures bottom and side views of the component. A separate camera device is used for coplanarity measurement. This is because coplanarity measurement requires oblique-view images of the component captured from an oblique direction, and scan cameras cannot capture oblique-view images. In this way, using multiple different cameras to inspect components before they are mounted on a board can hinder improvements in the takt time of the surface mounter.

[0006] An object of the present invention is to provide a component inspection device that contributes to improving the tact time of component inspection before mounting on a board. [Means for solving the problem]

[0007] A component inspection apparatus according to one aspect of the present invention comprises a head unit having a head for holding a component; a scan camera unit movably mounted on the head unit and capable of capturing images of the component held by the head; and an inspection unit for inspecting the component based on images acquired by the scan camera unit, wherein the scan camera unit includes a camera and an optical system that forms a first optical path through which an optical image of a bottom view of the component is incident on the camera, a second optical path through which an optical image of a side view of the component is incident, and a third optical path through which an optical image of an oblique view of the component is incident, and the inspection unit performs a first inspection for component recognition using at least one of the bottom view and side view images, and a second inspection for coplanarity measurement using the bottom view and oblique view images.

[0008] According to this aspect, the scan camera unit can capture bottom, side, and oblique view images of the component using the first, second, and third optical paths. The inspection unit uses these images to perform a first inspection for component recognition and a second inspection for coplanarity measurement. That is, component recognition and coplanarity measurement can be performed based solely on images acquired by the scan camera unit, without relying on other camera units. Therefore, in component inspection, which is performed after the component is held by the head and before it is mounted on the board, there is no need to move the head past the locations of the other camera units. This can improve the inspection takt time.

[0009] In the above-described component inspection device, it is desirable that the camera is one camera, and that the optical system causes each of the optical images of the first optical path, the second optical path, and the third optical path to be incident on the one camera.

[0010] According to this embodiment, the necessary images can be acquired with one camera, which simplifies the structure of the scan camera unit and reduces its size.

[0011] In the above-described component inspection device, the first optical path and the third optical path may share an optical path portion extending from the middle of these optical paths to the camera, and the optical system may further include a mirror unit that is arranged to be able to move forward and backward in the middle of the optical path and that switches the optical path incident on the camera between the first optical path and the third optical path.

[0012] According to this aspect, a portion of the first optical path and a portion of the third optical path are shared by both, which makes it possible to make the optical system more compact than when each optical path is an independent optical path. Also, by moving the mirror unit forward or backward into the optical path, it is possible to easily switch between using the shared optical path as the first optical path or the third optical path.

[0013] In the above-mentioned component inspection device, the camera may include an imaging element that photoelectrically converts an optical image, the imaging element may include a first area, a second area, and a third area that are imaging areas independent of one another, and the optical system may be configured to cause the optical image of the bottom view to be incident on the first area, the optical image of the side view to be incident on the second area, and the optical image of the oblique view to be incident on the third area, respectively.

[0014] According to this aspect, at least two images of the bottom view, side view, and oblique view of the component can be captured simultaneously using a single imaging element, which contributes to improving takt time.

[0015] In the above-described component inspection apparatus, it is desirable that the inspection unit evaluates the coplanarity of the component by referring to the result of the second inspection and the result of the component recognition based on the side view.

[0016] According to this aspect, coplanarity is evaluated taking into account the side view of the part, making it possible to detect coplanarity defects that cannot be detected by the coplanarity measurement in the second inspection.

[0017] In the above-mentioned component inspection device, the component is a component with terminals having a component body and a plurality of terminals extending from the component body, and the inspection unit may inspect the component with terminals for irregularities in terminal arrangement by referring to the results of the second inspection and the results of component recognition based on the side view.

[0018] According to this aspect, it is possible to detect coplanarity defects such as a terminal arrangement disorder in which the terminals arranged on the component are raised as a whole or tilted like a slope.

[0019] In the above-described component inspection device, the inspection unit may be configured to perform a first coplanarity measurement based on an image captured by the scan camera unit when the head is at a first rotation angle, and a second coplanarity measurement based on an image captured by the scan camera unit when the head is at a second rotation angle different from the first rotation angle, and to evaluate the coplanarity of the component by referring to the side views captured at the first rotation angle and the second rotation angle.

[0020] According to this aspect, in addition to measuring the coplanarity, the coplanarity is evaluated by referring to an oblique view of the target component at both the first rotation angle and the second rotation angle, thereby enabling more accurate component inspection before mounting on a board.

[0021] The above-described component inspection apparatus may further include another camera unit capable of performing the coplanarity measurement, and a selection unit that determines whether to select the scan camera unit or the other camera unit when capturing an image for the coplanarity measurement of the component to be inspected.

[0022] According to this aspect, the component held by the head can be inspected by selecting either the scan camera unit or the other camera unit, taking into consideration, for example, the component size and inspection takt time, thereby providing flexibility in the component inspection sequence. [Effects of the Invention]

[0023] According to the present invention, it is possible to provide a component inspection device that contributes to improving the tact time of component inspection before mounting on a board. [Brief explanation of the drawings]

[0024] [Figure 1] FIG. 1 is a plan view showing a schematic configuration of a surface mounter to which a component inspection device according to an embodiment of the present invention is applied. [Figure 2] FIG. 2 is a side view showing a schematic configuration of a head unit portion of the surface mounter. [Figure 3] FIG. 3 is a side view showing a schematic configuration of the main body camera unit. [Figure 4] FIG. 4 is a cross-sectional view showing a schematic configuration of the scan camera unit according to the first embodiment. [Figure 5] FIG. 5 is a perspective view of the optical system of the scan camera unit that forms the first optical path for capturing the bottom view. [Figure 6] FIG. 6 is a perspective view of the optics of the scan camera unit that form the second optical path for side view imaging. [Figure 7] Figure 7(A) is a plan view of the optical system of the scan camera unit that forms the third optical path for capturing oblique views, and Figure 7(B) is a diagram showing the state in which the mirror unit is retracted and the first optical path is enabled. [Figure 8] 8A and 8B are plan views of an optical system having a structure for switching between the first optical path V1 and the third optical path V3 according to a modified example. [Figure 9] FIG. 9 is a block diagram showing the electrical configuration of the component inspection device. [Figure 10] FIG. 10 is a schematic diagram showing a coplanarity measurement method. [Figure 11] 11A and 11B are diagrams showing images acquired by the scan camera unit of the first embodiment. [Figure 12] FIG. 12 is a table showing the criteria for using the main camera unit and the scan camera unit. [Figure 13] FIG. 13 is a cross-sectional view showing a schematic configuration of a scan camera unit according to the second embodiment. [Figure 14] 14A and 14B are diagrams showing images acquired by the scan camera unit of the second embodiment. [Figure 15] 15(A) and (B) are diagrams showing an example of measuring coplanarity with reference to a side view. [Figure 16] 16(A) and (B) are diagrams showing an example of measuring coplanarity with reference to a side view. DETAILED DESCRIPTION OF THE INVENTION

[0025] An embodiment of a component inspection device according to the present invention will be described in detail below with reference to the accompanying drawings. In the embodiments described below, a surface mounter is shown as an example of a device to which the component inspection device is applied. The surface mounter is a device that mounts various components on a printed circuit board. The components include, for example, chip components such as chip resistors and chip capacitors, IC package-type electronic components such as BGA (Ball Grid Array), QFP (Quad Flat Package), and SOP (Small Outline Package), power-related components such as capacitors and transformers, connectors, and heat sinks. The component inspection device according to the present invention is not limited to surface mounters, but can also be applied to other component holding devices and component moving devices that have heads. The components to be picked up may be mechanical components or molded parts made of metal, resin, rubber, wood, etc.

[0026] [Overall structure of surface mounter] Hereinafter, an embodiment of the present invention will be described in detail with reference to the drawings. First, a surface mounter 1 to which a component inspection device according to an embodiment of the present invention is applied will be described. FIG. 1 is a plan view showing a schematic configuration of the surface mounter 1, and FIG. 2 is a side view showing a schematic configuration of a head unit 4 portion of the surface mounter 1. The surface mounter 1 is a device that mounts various electronic components on a substrate P. XYZ direction indications are used in FIGS. 1 and 2, and similar direction indications are used in other figures. The X direction is the movement direction of the substrate P, which is also the movement direction of a scan camera unit 6 described later. The X direction may also be referred to as the left-right direction, the Y direction as the front-back direction, and the Z direction as the up-down direction.

[0027] The surface mounter 1 includes a base unit 10, a board transport unit 2, a component supply unit 3, a head unit 4, and a main body camera unit 11 (another camera unit) that are arranged on the base unit 10. The head unit 4 is equipped with a board recognition camera 5 and a scan camera unit 6.

[0028] The base unit 10 is a rectangular base with a flat top surface, and has a board transport unit 2 and a component supply unit 3 attached to it. The board transport unit 2 transports a board P on which components C (FIG. 3) are mounted. The board transport unit 2 has a pair of conveyors 21 and 22 that transport the board P left and right on the base unit 10. The conveyors 21 and 22 transport the board P from the right side into the surface mounter 1, transport it leftward to a predetermined work position, here the position of the board P shown in FIG. 1, and stop it there. At this work position, components are mounted on the board P. After the mounting operation, the conveyors 21 and 22 transport the board P leftward and out of the surface mounter 1.

[0029] The component supply units 3 supply components to be mounted on the board P. The component supply units 3 are arranged on both front and rear sides of the board transport unit 2. Each component supply unit 3 has multiple tape feeders 31 arranged in the left-right direction. Each tape feeder 31 holds a reel on which a tape is wound, which stores and holds electronic components such as ICs, transistors, resistors, and capacitors at predetermined intervals. The tape feeders 31 intermittently pay out tape from the reel and supply the components to the component supply position at the tip of the feeder. While a tape feeder 31 is shown here as an example, a tray on which large electronic components or other components are placed may also be attached to the component supply unit 3.

[0030] The head unit 4 takes out components from the component supply unit 3 and mounts them on the substrate P. The head unit 4 is arranged above the base unit 10 so as to be movable in the X and Y directions, takes out components from the tape feeder 31 at the component supply position, and mounts the components at predetermined positions on the substrate P at the work position. A support beam 23 extending in the X direction is erected above the base unit 10. The head unit 4 is movably supported on an X-axis fixed rail 24 fixed to the support beam 23.

[0031] Both ends of support beam 23 are supported by Y-axis fixed rails 25 extending in the Y direction, and support beam 23 is movable in the Y direction along these Y-axis fixed rails 25. An X-axis servo motor 26 and a ball screw shaft 27 are disposed relative to X-axis fixed rail 24. A Y-axis servo motor 28 and a ball screw shaft 29 are disposed relative to Y-axis fixed rail 25. Head unit 4 moves in the X direction as ball screw shaft 27 is rotationally driven by X-axis servo motor 26, and moves in the Y direction as ball screw shaft 29 is rotationally driven by Y-axis servo motor 28.

[0032] The head unit 4 is equipped with a plurality of heads 4H for holding and transporting components. In this embodiment, an example is shown in which a total of six heads 4H are arranged in a row in the X direction. Each head 4H includes a shaft 41 extending in the Z direction and a suction nozzle 42 attached to the lower end of the shaft 41. The shaft 41 can move up and down relative to the head unit 4 and rotate around the nozzle central axis (R axis). The suction nozzle 42 picks up and holds the component and mounts it on the surface of the substrate P.

[0033] The board recognition cameras 5 are fixedly mounted on both the left and right sides of the head unit 4. The board recognition cameras 5 capture images of various marks provided on the surface (top surface) of the board P that has been carried into the work position of the surface mounter 1 by the conveyors 21 and 22. In FIG. 1, a pair of fiducial marks FM provided on diagonal lines of the rectangular board P are shown as an example of the marks. The fiducial marks FM are marks for detecting the amount of positional deviation of the carried-in board P from the origin coordinates of the work position.

[0034] The scan camera unit 6 is mounted near the lower end of the head unit 4 so as to be movable in the X direction relative to the head unit 4. The scan camera unit 6 is a unit for image recognition of the state of a component being held by the suction nozzle 42. The scan camera unit 6 includes a scan camera 62 that captures an image of the component held by the suction nozzle 42. The scan camera 62 performs a predetermined imaging operation while the head unit 4 transports the component picked up by the suction nozzle 42 from the component supply position to the work position. The scan camera unit 6 moves in the X direction along a ball screw shaft 61 that extends in the X direction and is attached to the head unit 4. While the scan camera unit 6 is moving in the X direction during the component transport, the scan camera 62 captures an image of the component picked up by the suction nozzle 42.

[0035] The scan camera 62 of this embodiment can capture images of a component picked up by the suction nozzle 42, including a bottom view seen from vertically below, a side view seen from the side, and an oblique view seen from diagonally below. As will be described in detail below, the bottom view and side view are images used for component recognition, such as the holding posture of the component by the suction nozzle 42 and whether or not the component is picked up. The bottom view and oblique view are images used for measuring the coplanarity of the component held by the suction nozzle 42. Conventional scan camera units are equipped with the ability to capture bottom and side views for component recognition, but do not have the ability to capture oblique views. The scan camera unit 6 of this embodiment is equipped with the ability to capture oblique views in addition to bottom and side views, thereby enabling not only component recognition but also coplanarity measurement using only the images captured by the scan camera 62.

[0036] The main body camera unit 11 is incorporated into the base part 10. The main body camera unit 11 is a camera with an imaging field of view above the base part 10, and images the component held by the suction nozzle 42 from the underside. The main body camera unit 11 has the function of capturing images for component recognition and the function of capturing images for coplanarity measurement.

[0037] 3 is a side view showing the schematic configuration of the main camera unit 11. The main camera unit 11 includes a housing 110, and a multi-camera 12, a copla camera 13, a bottom illumination unit 14, and a copla illumination unit 15 housed within the housing 110. The housing 110 is an open-top housing and is disposed on the path along which the head 4H passes. The multi-camera 12 captures a bottom view of the component C held by the suction nozzle 42 and passing over the housing 110. The copla camera 13 captures an oblique view of the component C.

[0038] The bottom illumination unit 14 irradiates illumination light onto the component C from the bottom side of the suction nozzle 42 and from all directions of the component C held by the suction nozzle 42. The bottom illumination unit 14 includes a dome-shaped support plate with an opening at the top and a number of LEDs arranged on the inner surface of the support plate. The multi-camera 12 has an imaging optical axis that extends in the vertical direction of the component C transported to the imaging position in the housing 110. Of the illumination light emitted by the bottom illumination unit 14 and reflected from the component C, the reflected light that is directed vertically downward enters the multi-camera 12.

[0039] The coplanar illumination unit 15 irradiates illumination light onto the component C held by the suction nozzle 42 from diagonally below the component C. The coplanar camera 13 and the coplanar illumination unit 15 are arranged symmetrically with respect to a vertical axis extending directly below the component C. The coplanar illumination unit 15 irradiates the component C with coaxial illumination light, and the coplanar camera 13 captures the reflected light. The component can be recognized from the bottom view image acquired by the multi-camera 12. Furthermore, the coplanarity of the component C can be measured from the bottom view and the oblique view acquired by the coplanar camera 13. In this embodiment, the coplanarity of the component C can also be measured from the image acquired by the scan camera unit 6, so either of the two is selectively used depending on the component size, etc.

[0040] [Details of the Scan Camera Unit / First Embodiment] FIG. 4 is a cross-sectional view showing the configuration of the scan camera unit 6 according to the first embodiment. The scan camera unit 6 includes one scan camera 62 (camera), an optical system 7, and an illumination system 50. The scan camera 62 captures an image of the component C held by the suction nozzle 42 of the head 4H. The optical system 7 causes optical images of the component C from multiple angles to be incident on the scan camera 62. The multiple angles are the bottom view, side view, and oblique view mentioned above. The optical system 7 forms an optical path that guides the optical images of each of these views to the scan camera 62.

[0041] The scan camera 62 includes a lens unit 621 and an image sensor 622. The lens unit 621 forms an optical image of each view on the light receiving surface of the image sensor 622. The image sensor 622 photoelectrically converts the optical image. The image sensor 622 is a line sensor with a large number of pixels (e.g., 1024 pixels) arranged in a horizontal row. The image sensor 622 may be a CMOS sensor capable of specifying a region of interest (ROI) that determines the pixel readout range. Since one scan camera 62 is configured to capture three views, the number of parts in the scan camera unit 62 can be reduced and the size can be made smaller.

[0042] The illumination system 50 illuminates the component C with illumination light corresponding to each of the above views when capturing the view. The illumination system 50 includes a bottom illumination unit 51, a side illumination unit 52, and a copular illumination unit 53, all of which use multiple LEDs as light sources. The bottom illumination unit 51 is disposed below the component C and illuminates the component C with diffuse illumination light directed obliquely upward from all directions when capturing the bottom view. The bottom illumination unit 51 includes a dome-shaped support dish with an opening on the top and multiple LEDs arranged on the inner surface of the support dish. The side illumination unit 52 is disposed to the side of the component C and illuminates the component C with diffuse illumination light when capturing the side view. The copular illumination unit 53 is disposed diagonally below the component C and illuminates the component C with coaxial illumination light when capturing the oblique view.

[0043] The scan camera 62, optical system 7, and illumination system 50 are supported by a support frame 601. The support frame 601 has a support surface that supports the scan camera 62 on the +Y side and the optical system 7 on the -Y side. The support frame 601 is attached to the head unit 4 via a bracket 602. The upper end of the bracket 602 is screwed onto a ball screw shaft 61 disposed on the back surface of the head unit 4. The support frame 601 is cantilevered at the lower end of the bracket 602. When the ball screw shaft 61 is driven to rotate, the bracket 602 and the support frame 601 move in the X direction.

[0044] Next, details of the optical system 7 will be described with reference to Figs. 5 to 7. Fig. 5 is a perspective view of the optical system 7 that forms a first optical path V1 for capturing a bottom view of the scan camera unit 6. Fig. 6 is a perspective view of the optical system 7 that forms a second optical path V2 for capturing a side view. Fig. 7(A) is a plan view of the optical system 7 that forms a third optical path V3 for capturing an oblique view. The optical path lengths of the first optical path V1, the second optical path V2, and the third optical path V3 are the same.

[0045] The optical system 7 includes a first prism 71, a second prism 72, a third prism 73, and a mirror unit 74, which bend the optical path. The first optical path V1 shown in Figure 5 is composed of the first prism 71 and the second prism 72. The second prism 72 is disposed vertically below (on the -Z side of) the component C and has a reflective surface that reflects light in the +X direction. The first prism 71 is disposed offset a predetermined distance toward the +X side from the second prism 72, and further reflects the light reflected by the second prism 72 in the +Y direction, where the scan camera 62 is disposed.

[0046] When the bottom surface illumination unit 51 irradiates the component C with illumination light, the reflected light enters the scan camera 62 along the first optical path V1. More specifically, the reflected light traveling in the -Z direction from the component C is reflected by the second prism 72 in the +X direction. This reflected light is further reflected by the first prism 71 in the +Y direction. The reflected light is then collected by the lens unit 621 and formed into an image on the light-receiving surface of the image sensor 622. The formed optical image is a bottom surface view of the component C. Note that FIG. 5 shows only a portion of the bottom surface illumination unit 51, and in reality, illumination light is irradiated from all directions around the optical axis.

[0047] The second optical path V2 shown in Figure 6 is composed of a first prism 71 and a third prism 73. The third prism 73 is disposed on the -Y side of the component C and has an upper first reflecting surface 73A and a lower second reflecting surface 73B. The first reflecting surface 73A is a reflecting surface that reflects light from the -Y direction to the -Z direction. The second reflecting surface 73B is a reflecting surface that reflects light from the -Z direction to the +X direction.

[0048] When the side illumination unit 52 irradiates the component C with illumination light, a projected image of the component C enters the scan camera 62 along the second optical path V2. More specifically, when illumination light directed in the -Y direction is irradiated onto the component C from the +Y side of the component C, a projected image is created in which the portions of the component C that block the illumination light are cast in shadow. This projected image is reflected in the -Z direction by the first reflecting surface 73A of the third prism 73, and further reflected in the +X direction by the second reflecting surface 73B toward the first prism 71. The projected image is then condensed by the lens unit 621 and formed on the light-receiving surface of the image sensor 622. The formed projected image is a side view of the component C.

[0049] The third optical path V3 shown in FIG. 7(A) is composed of a first prism 71 and a mirror unit 74. Note that in FIG. 7(A), the optical path from the first prism 71 to the scan camera 62 is an optical path directed in the +Y direction and extends perpendicular to the plane of the paper in FIG. 7(A), but is drawn in the Z direction to represent the third optical path V3 in a planar manner. The mirror unit 74 includes a first mirror 741 and a second mirror 742 that reflect light, and a frame that holds these mirrors. The first mirror 741 on the upper side and the second mirror 742 on the lower side are attached to the frame so that they face each other while being tilted with respect to the Z direction.

[0050] The frame of the mirror unit 74 is connected to the mirror moving mechanism 54. The mirror unit 74 can be moved back and forth in the Y direction by driving the mirror moving mechanism 54. As the mirror moving mechanism 54, an air cylinder type actuator, a solenoid type actuator, a ball screw mechanism, or the like can be used.

[0051] When the copular illumination unit 53 irradiates illumination light onto the component C, reflected light from the component C enters the scan camera 62 along the third optical path V3. The reflected light traveling diagonally downward in the +X direction from the component C is reflected by the first mirror 741 in the upper stage of the mirror unit 74 toward the second mirror 742 in the lower stage. The second mirror 742 is disposed between the first prism 71 and the second prism 72. The reflected light from the component C is reflected by the second mirror 742 in the +X direction toward the first prism 71. The reflected light is then collected by the lens unit 621 and forms an image on the light-receiving surface of the image sensor 622. The formed optical image is an oblique view of the component C.

[0052] The first optical path V1 and the third optical path V3 share the optical path portion from the middle of these optical paths to the scan camera 62. The middle of the optical path is the position where the second mirror 742 is arranged. FIG. 7(B) shows a state in which the mirror unit 74 is retracted from the optical path by the mirror moving mechanism 54. In this case, the first optical path V1 is formed between the first prism 71 and the second prism 72. The third optical path V3 loses its route to the scan camera 62.

[0053] 7(A), when the mirror unit 74 moves between the first prism 71 and the second prism 72 and the second prism 72 is positioned to block the first optical path V1, the third optical path V3 is formed. In this way, the mirror unit 74 and the mirror movement mechanism 54 function to switch the optical path incident on the scan camera 62 between the first optical path V1 and the third optical path V3.

[0054] When capturing an oblique view for coplanarity measurement, the mirror unit 74 is in the advanced position shown in FIG. 7A. When capturing a bottom view for component recognition and coplanarity measurement, the mirror unit 74 is in the retracted position shown in FIG. 7B. In this embodiment, the first optical path V1 and a portion of the third optical path V3 are used as a shared optical path, which allows for a more compact optical system 7 than when each optical path is used as an independent optical path. Furthermore, by moving the mirror unit 74 toward or away from the optical path using the mirror moving mechanism 54, it is possible to easily switch between using the shared optical path as the first optical path V1 or the third optical path V3.

[0055] 8A and 8B are plan views of an optical system having a structure for switching between the first optical path V1 and the third optical path V3 according to a modified example. Similar to the embodiment shown in FIG. 7, the third optical path V3 is formed by a first mirror 741 and a second mirror 742. The difference is that in this modified example, only the second mirror 742 is driven. The second mirror 742 has a rotation axis and is capable of swinging around the rotation axis. The mirror movement mechanism 540 generates a driving force that swings the second mirror 742 around the rotation axis, switching the second mirror 742 between an upright position and a prostrate position. The mirror movement mechanism 540 can be, for example, an actuator using an air cylinder, magnetic force, spring force, or the rotational force of a motor.

[0056] FIG. 8(A) shows a state in which the second mirror 742 is in an upright position. The second mirror 742 protrudes into the first optical path V1, establishing a third optical path V3. That is, the reflected light of the component C reflected by the first mirror 741 is further reflected by the second mirror 742 and travels toward the scan camera 62. FIG. 8(B) shows a state in which the second mirror 742 is in a prostrate position. The second mirror 742 retracts from the first optical path V1, enabling the first optical path V1. That is, the reflected light of the component C reflected by the second prism 72 travels toward the scan camera 62. In this way, the oscillation of the second mirror 742 switches the optical path toward the scan camera 62 between the first optical path V1 and the third optical path V3.

[0057] [Control configuration] 9 is a block diagram showing the electrical configuration of component inspection device 100. In addition to the above-mentioned scan camera unit 6 and main body camera unit 11, component inspection device 100 is equipped with a head movement mechanism 43, a control unit 8, and an operation unit 86 (selection unit). Of the components of surface mounter 1, component inspection device 100 is a component closely related to the inspection of component C held by head 4H.

[0058] The head movement mechanism 43 generates driving forces to drive the head unit 4, head 4H, and scan camera unit 6. The head movement mechanism 43 includes an X-axis servo motor and a Y-axis servo motor that move the head unit 4 in the X and Y directions, a Z-axis servo motor that raises and lowers the head 4H, an R-axis servo motor that rotates the head 4H around its axis, and a camera axis motor that moves the scan camera unit 6 in the X direction.

[0059] The control unit 8 is made up of a processor and the like that operates by loading a predetermined program, and has functional parts including an axis control part 81, an imaging control part 82, an inspection processing part 83 (inspection unit), and a memory part 84, as well as an overall control part 85 that controls these functional parts. The axis control part 81 controls the head movement mechanism 43 to control the movement of the head unit 4 in the X and Y directions, the elevation and rotational movement of the head 4H, and the movement of the scan camera unit 6 in the X direction.

[0060] The imaging control unit 82 controls the imaging operation of the component C by the scan camera unit 6 and the main camera unit 11. The imaging control unit 82 includes a camera control unit 821, an illumination control unit 822, a mirror control unit 823, and an image memory 824. The camera control unit 821 controls the operation of the scan camera 62 provided in the scan camera unit 6, and the multi-camera 12 and copier camera 13 provided in the main camera unit 11. For example, the camera control unit 821 controls the shutter timing, speed, exposure time, etc. of these cameras.

[0061] Illumination control unit 822 controls the operation of the illumination systems provided in scan camera unit 6 and main camera unit 11. Specifically, illumination control unit 822 turns on bottom illumination unit 51, side illumination unit 52, and copler illumination unit 53 of scan camera unit 6 at predetermined timings. In addition, illumination control unit 822 turns on bottom illumination unit 14 and copler illumination unit 15 of main camera unit 11 at predetermined timings.

[0062] The mirror control unit 823 controls the operation of the mirror movement mechanism 54 of the scan camera unit 6. In other words, the mirror control unit 823 controls the switching of the optical path toward the scan camera 62 between the first optical path V1 and the third optical path V3 by moving the mirror unit 74 forward and backward. The image memory 824 temporarily stores images captured by the multi-camera 12, the copier camera 13, and the scan camera 62.

[0063] The inspection processing unit 83 performs processing for inspecting the component C held by the suction nozzle 42 based on images acquired by the scan camera unit 6 and the main body camera unit 11. The inspection processing unit 83 reads the images acquired by the scan camera unit 6 from the image memory 824 and performs the following first and second inspections on the component C. The first inspection is component recognition performed using at least one of bottom view and side view images. The second inspection is coplanarity measurement performed using bottom view and oblique view images. The inspection processing unit 83 also performs processing for component recognition and coplanarity measurement based on images acquired by the multi-camera 12 and coplanar camera 13 of the main body camera unit 11.

[0064] The inspection processing unit 83 includes an image processing unit 831 and a determination unit 832. The image processing unit 831 performs necessary image processing such as contrast and brightness correction, noise removal, and edge extraction on the image data of the component C acquired by the scan camera unit 6 and the main body camera unit 11.

[0065] As a component recognition inspection, the determination unit 832 recognizes the posture of the component C and the presence or absence of the component based on the image of each view that has been image-processed, and determines based on predetermined criteria whether or not the component C held by the suction nozzle 42 may be mounted on the board P. As a coplanarity inspection, the determination unit 832 recognizes the terminal arrangement state of the component C with terminals based on the image of each view that has been image-processed, and determines whether or not the component C with terminals that is being inspected may be mounted on the board P.

[0066] FIG. 10 is a schematic diagram illustrating a coplanarity measurement technique. FIG. 10 shows a leaded component 9A as an example of a component with terminals. The leaded component 9A consists of a component body 91 and multiple leads 92 extending from the component body 91. The multiple leads 92 are arranged at a constant pitch on the side of the component body 91. Coplanarity measurement requires bottom view and oblique view images of the component 9A. FIG. 10 shows an example in which the bottom view is captured by the multi-camera 12 and the oblique view is captured by the coplanar camera 13. The same applies to the bottom view and oblique view images captured by the scan camera 62.

[0067] Based on the bottom view image, the XY coordinates of the bonding surface 93, which is the bottom end surface of the lead 92 and will come into contact with the substrate P, are detected. For example, the center point of the bonding surface 93 is detected. Similarly, based on the oblique view image, the XY coordinates of the bonding surface 93 are detected. The bottom view image is taken along an imaging optical axis that is perpendicular to a horizontal axis HA parallel to the component 9A. The oblique view image is taken along an imaging optical axis that has a tilt angle θ relative to the horizontal axis HA that is smaller than a right angle. The Z coordinate (height h) of the bonding surface 93 of each lead 92 is calculated based on the difference between the XY coordinates of the bonding surface 93 in the bottom view and the XY coordinates of the bonding surface 93 in the oblique view. Specifically, the height h can be calculated, for example, using the amount of deviation dx between the XY coordinates of the bonding surface 93 in the two views and the relative angle (tilt angle θ) between the two views, using the following equation: h=dx×tanθ

[0068] Subsequently, based on the XYZ coordinates of the bonding surface 93 of each lead 92, a least squares plane LSP, which is a virtual plane, is calculated. The least squares plane LSP serves as a reference plane for determining coplanarity. FIG. 10 shows an example in which, out of six leads 92, five are normal leads 92A and one is an abnormal lead 92B deformed upward. Since the amount of deviation dxa of the XY coordinates for the abnormal lead 92B is larger than the amount of deviation dx of the XY coordinates for the normal lead 92A, the height ha of the bonding surface 93 of the lead 92 satisfies the relationship h < ha. As a result of the presence of the abnormal lead 92B, the least squares plane LSP becomes a plane positioned slightly above the bonding surface 93 of the normal lead 92A. The amount of deviation in the Z direction of the bonding surface 93 of each lead 92 with respect to the least squares plane LSP is obtained, and coplanarity is evaluated based on whether the difference between the maximum value and the minimum value exceeds a predetermined threshold. In the example of FIG. 10, since there is a lead 92B that is significantly lifted upward, it is determined that the coplanarity is poor.

[0069] FIGS. 11(A) and (B) are diagrams showing images acquired by the scan camera unit 6 of the first embodiment. Here, a BGA 9B having a component body 91 and ball electrodes 94 (terminals) is illustrated as a component held by the suction nozzle 42. The imaging element 622 of the scan camera 62 is a line sensor having N pixels (for example, 1024 pixels) arranged in a row, and is partitioned into two imaging areas: a first area E1 and a second area E2. The first area E1 and the second area E2 are imaging areas that are independent of each other in terms of control. FIG. 11(A) is a first image IM1 formed by imaging a side view in the first area E1 and imaging a bottom view in the second area E2. On the other hand, FIG. 11(B) is a second image IM2 formed by imaging a side view in the first area E1 and imaging an oblique view in the second area E2.

[0070] Due to the structure of the optical system 7, it is not possible to capture a bottom view and an oblique view simultaneously. The first image IM1 is a two-dimensional image in which line images sequentially captured by the scan camera 62 are arranged in the sub-scanning direction with the mirror unit 74 retracted from the first optical path V1, as shown in Fig. 7(B). On the other hand, the second image IM2 is a two-dimensional image in which line images sequentially captured by the scan camera 62 are arranged in the sub-scanning direction with the mirror unit 74 inserted into the middle of the first optical path V1 to activate the third optical path V3, as shown in Fig. 7(A).

[0071] The imaging control unit 82 controls the scan camera unit 6 to alternately capture the first image IM1 and the second image IM2. Specifically, to capture the first image IM1 at a predetermined first imaging timing, the illumination control unit 822 turns on the bottom illumination unit 51 and the side illumination unit 52. The mirror control unit 823 controls the mirror moving mechanism 54 to place the mirror unit 74 in the retracted position. Under this control, the camera control unit 821 causes the scan camera 62 to perform an imaging operation.

[0072] At a second imaging timing following the first imaging timing, the illumination control unit 822 turns on the side illumination unit 52 and the copula illumination unit 53 to capture a second image IM2. The mirror control unit 823 controls the mirror moving mechanism 54 to place the mirror unit 74 in the approach position. Under this control, the camera control unit 821 causes the scan camera 62 to perform an imaging operation. The significance of capturing a side view in the second image IM2 will be described later with reference to FIGS. 15 and 16.

[0073] The inspection processing unit 83 performs a first inspection for component recognition based on the bottom view and side view of the first image IM1. The determination unit 832 determines whether a BGA9B is being held by the suction nozzle 42. If the presence of a BGA9B is not confirmed in the image, the determination unit 832 issues a component suction error. If the presence of a BGA9B is confirmed, the determination unit 832 determines whether the posture of the BGA9B being picked up by the suction nozzle 42 is acceptable. If the image confirms that the BGA9B has been picked up eccentrically or tilted, the determination unit 832 issues a component posture error. On the other hand, if normal suction of the BGA9B is confirmed, the operation of the next step is executed.

[0074] Furthermore, the inspection processing unit 83 performs a second inspection for coplanarity measurement based on the bottom view of the first image IM1 and the oblique view of the second image IM2. The determination unit 832 calculates the height of the bottom end of each ball electrode 94 from the deviation of the XY coordinates acquired in the bottom view and the oblique view, respectively, and then finds the least-squares plane LSP. The determination unit 832 determines whether any ball electrodes 94 deviate from this least-squares plane LSP, for example, whether there is a ball chip where the ball electrode 94 is missing from the component body 91, or whether there is deformation or cracking of the ball electrode 94. If a ball chip or other defect is found, the determination unit 832 issues a coplanarity error. If the coplanarity is normal, the next step of operation is executed.

[0075] It is desirable to capture images for coplanarity measurement, i.e., to acquire the second image IM2, multiple times by changing the rotation angle of the component. The head 4H can rotate around its head axis. For example, a first coplanarity measurement is performed based on the second image IM2 captured by the scan camera unit 6 when the head 4H picks up a BGA9B and is at a first rotation angle (rotation angle = 0°). Next, a second coplanarity measurement is performed based on the second image IM2 captured by the scan camera unit 6 when the head 4H is at a second rotation angle (e.g., rotation angle = 90°) different from the first rotation angle. Because QFPs have leads on all four sides of the component body, it is desirable to capture the second image IM2 with the head 4H rotated at a 90° angle, for example, for more accurate coplanarity evaluation. In this case, it is more desirable to evaluate the coplanarity of the component by referring to the side views captured at the first and second rotation angles.

[0076] As described above, according to this embodiment, the scan camera unit 6 can capture bottom view, side view, and oblique view images of the component using the first optical path V1, the second optical path V2, and the third optical path V3. The inspection processing unit 83 uses these images to perform a first inspection for component recognition and a second inspection for coplanarity measurement. In other words, both component recognition and coplanarity measurement can be performed based solely on images acquired by the scan camera unit 6, without relying on other camera units. Therefore, during component inspection after the component is held by the head 4H and before mounting on the board P, there is no need to move the head 4H past the locations of the other camera units. This improves the inspection takt time.

[0077] In this embodiment, coplanarity measurement is possible using both the scan camera unit 6 and the main camera unit 11. Coplanarity measurement may be performed by selecting either the scan camera unit 6 or the main camera unit 11, taking into consideration the size of the component to be inspected and the inspection takt time. This selection may be performed manually by an operator using the operation unit 86 (selection unit), or automatically based on component data stored in the memory unit 84.

[0078] FIG. 12 shows Table TA, which illustrates the criteria for selecting between main camera unit 11 and scan camera unit 6 when the automatic selection described above is performed. Table TA assumes that main camera unit 11 is more suitable for imaging large components than scan camera unit 6. As shown in Table TA, the maximum component size and component height, which indicate the upper limit of measurable size, and the recognizable lead pitch or ball electrode height are set and stored in memory 84. The camera unit to be used for coplanarity measurement is then automatically selected based on which definition in Table TA the component being inspected meets. According to this embodiment, either scan camera unit 6 or main camera unit 11 can be selected to inspect the component held by head 4H, taking into account the component size and inspection takt time. This allows for flexibility in the component inspection sequence.

[0079] [Second embodiment] 13 is a cross-sectional view showing a schematic configuration of a scan camera unit 6A according to the second embodiment. In the first embodiment, an example was shown in which the mirror unit 74 was moved back and forth to mechanically switch between the first optical path V1 for a bottom view and the third optical path V3 for an oblique view. In the second embodiment, an example is shown in which a mechanical mechanism is omitted by setting areas on the image sensor 622 where optical images of the bottom view, side view, and oblique view can be incident.

[0080] Scan camera unit 6A includes scan camera 62 and optical system 7A that forms three optical paths V1, V2, and V3 through which an optical image of component C1 is incident on scan camera 62. Optical system 7A includes a first prism 71A, a second prism 72A, a third prism 731, and mirrors 743 and 744. Although illustration of an illumination system for capturing images in each optical path is omitted in Fig. 13, the illumination system of this embodiment is similar to illumination system 50 exemplified in the first embodiment.

[0081] The first optical path V1 is composed of a first prism 71A and a second prism 72A. The second prism 72A is disposed vertically below the component C and reflects the light reflected from the component C in the +X direction. The first prism 71A is disposed offset a predetermined distance on the +X side from the second prism 72A. The reflected light from the second prism 72A is further reflected by the first prism 71A in the +Y direction and enters the scan camera 62.

[0082] The second optical path V2 is composed of a first prism 71A and a third prism 731. The third prism 731 has two reflecting surfaces, similar to the third prism 73 in the first embodiment. The projected image of the component C is reflected successively by the two reflecting surfaces in the -Z direction and the +X direction, and then proceeds toward the first prism 71A. The first prism 71A further reflects the projected image in the +Y direction, causing it to enter the scan camera 62.

[0083] The third optical path V3 is composed of the first prism 71 and mirrors 743 and 744. When the coplanar illumination light is irradiated onto the component C, the reflected light from the component C is sequentially reflected by the mirrors 743 and 744 and travels toward the first prism 71A in the +X direction. This reflected light is further reflected by the first prism 71A and enters the scan camera 62. Unlike the first embodiment, the third optical path V3 and the first optical path V1 are independent optical paths that do not share a common optical path portion. Therefore, no optical path switching mechanism is required.

[0084] 14(A) and 14(B) are diagrams showing images acquired by the scan camera unit 6A of the second embodiment. A BGA9B is shown as an example of a component to be picked up. The image sensor 622 of the scan camera 62 has three image capturing areas: a first area E11, a second area E12, and a third area E13. The image sensor 622 is a line sensor, and has twice as many pixels as in the first embodiment (e.g., 2048 pixels) to ensure the three image capturing areas. The first area E11 is an area where an optical image of an oblique view is captured, the second area E12 is an area where an optical image of a side view is captured, and the third area E13 is an area where an optical image of a bottom view is captured.

[0085] The upper part of FIG. 14(A) shows image IM3 of the first pixel line acquired by the image sensor 622 at a predetermined first imaging timing. Image IM3 includes an oblique view and a side view. The lower part of FIG. 14(A) shows image IM4 of the second pixel line acquired by the image sensor 622 at a second imaging timing following the first imaging timing. Image IM4 includes a side view and a bottom view. Images IM3 and IM4 are subsequently acquired alternately. The inspection processing unit 83 performs a first inspection for component recognition based on the bottom view and side view of image IM4. The inspection processing unit 83 also performs a second inspection for coplanarity measurement based on the bottom view of image IM4 and the oblique view of image IM3.

[0086] Figure 14(B) shows image IM5 formed by simultaneously capturing the oblique view, side view, and bottom view. In other words, image IM5 is acquired for each pixel line at each imaging timing. Image IM5, which captures three views simultaneously, can be achieved by using light of a different wavelength for coplanarity measurement than the illumination light for the bottom view and side view. For example, if a red LED is used as the light source for bottom illumination unit 51 and a green LED is used as the light source for side illumination unit 52, a yellow or blue LED is used as the light source for coplanarity illumination unit 53. Each imaging area E11, E12, and E13 of the image sensor 622 is provided with a filter that allows only light of the corresponding wavelength to enter. This allows each imaging area E11, E12, and E13 to capture only the desired optical image.

[0087] [The significance of adding a side view to coplanarity evaluation] The second inspection for coplanarity measurement can be performed using a bottom view and an oblique view of component C. However, for a more accurate coplanarity evaluation, it is desirable to refer to the results of the second inspection and the results of component recognition based on a side view. By also taking into account the side view of component C, it is possible to detect coplanarity defects that cannot be detected by coplanarity measurement alone in the second inspection. This point will be explained with reference to FIGS. 15 and 16.

[0088] 15(A) to 16(B) are diagrams showing an example of coplanarity measurement with reference to a side view. Here, the component to be inspected is a leaded component 9A having a component body 91 and multiple leads 92 extending from the component body 91. In coplanarity measurement of the leaded component 9A, the irregularity in the arrangement of the leads 92, that is, the uniformity of the height of the bonding surface 93, which is the lower end surface of the leads 92, is measured.

[0089] The left side of Figure 15(A) shows the X-side view of a normal leaded component 9A with no so-called "lead lift." In a normal component, the height of the bonding surface 93 of each lead 92 is uniform. In this case, all bonding surfaces 93 are located on the least-squares plane LSP (see Figure 10) obtained from the bottom view and oblique view in the second inspection. Therefore, the coplanarity evaluation is determined to be "normal." The right side of Figure 15(A) shows a side view in the Y direction of a normal leaded component 9A held by the suction nozzle 42. In the side view of a normal component, only one lead 92 is visible on each side of the component body 91. Therefore, the side view also allows us to determine that the component 9A is normal and has no "lead lift."

[0090] The left image in Figure 15(B) shows the X-side view of an abnormal leaded component 9A with "lead lift." This figure shows a leaded component 9A in which the leftmost lead 92B is elevated by a height G at the bonding surface 93 compared to the other normal leads 92A. As with the example in Figure 10, the abnormal lead 92B is significantly elevated, so it is determined to be defective in a coplanarity evaluation based on the least-squares plane LSP. The right image in Figure 15(B) shows a side view in the Y direction of the abnormal leaded component 9A held by the suction nozzle 42. In the side view of an abnormal component, the elevated abnormal lead 92B and the normal lead 92A are reflected, resulting in an image in which two leads 92 are observed. Therefore, even from the side view, the component 9A can be determined to be an abnormal component with "lead lift."

[0091] Figure 16(A) shows an abnormal leaded component 9A in which the leads 92B arranged on one side of the component body 91 are lifted to a uniform height, resulting in a "one-side lead lift" condition. The abnormal component shown in Figure 16(A) is often not judged as defective in coplanarity evaluation. If the leads 92B on one side of the component body 91 are lifted overall while the leads 92A on the other side are normal, the least-squares plane LSP is an inclined plane that spans both bonding surfaces 93, as shown in the Y-side view of Figure 16(A). The deviation of each bonding surface 93 in the Z direction from this least-squares plane LSP is small. Therefore, a coplanarity evaluation may result in a normal result. However, when observing the Y-side view, it is possible to determine from the image that the leads 92B on one side of the component body 91 are deformed upward, making it an abnormal leaded component 9A. In other words, using a side view in combination can detect abnormalities that would be missed by coplanarity measurement.

[0092] Figure 16(B) shows an abnormal leaded component 9A in which the leads 92B arranged on one side of the component body 91 are tilted in a stepped manner, resulting in a "one-sided lead lift." In other words, this is an abnormal product in which the leads are arranged on a linearly sloping line from the bonding surface 93A of lead 91B1 at one end to the bonding surface 93N of lead 91BN at the other end. Note that the normal lead 92A on the opposite side is not shown in the left diagram of Figure 16(B).

[0093] 16(B) is often not judged as defective in a coplanarity evaluation. This is because the least squares plane LSP is a plane that conforms to the bonding surfaces 93 of each lead 92B, which are arranged in a stepped manner in the X direction. The deviation of each bonding surface 93 in the Z direction from this least squares plane LSP is small, and the component may be judged as normal in a coplanarity evaluation. When the leaded component 9A of this example is observed from a side view, it can be seen in the image that the lead 91B1 at one end is significantly deformed upward relative to the lead 91BN at the other end.

[0094] In general, coplanarity measurements based on bottom and oblique views are highly reliable in lead lift inspections. However, coplanarity measurements cannot identify abnormalities such as "complete lead lift on one side" or "step lift on one side." Therefore, if a leaded component 9A that was determined to be "normal" by coplanarity measurement is rechecked using a side view, it becomes possible to detect the above-mentioned abnormalities. In other words, the accuracy of coplanarity inspections can be improved by adding observation of the side view to regular coplanarity measurements. [Explanation of symbols]

[0095] 1. Surface mount machine 100 Parts inspection equipment 11 Main camera unit (other camera unit) 4 Head Unit 4H head 50 Lighting System 6, 6A Scan Camera Unit 62 Scan Camera (Camera) 622 Image sensor 7 Optical system 74 Mirror unit 8. Control Unit 83 Inspection processing section (inspection unit) 86 Operation unit 86 (selection unit) 9A Leaded components (terminal-equipped components) 9B BGA (component with terminals) 91 Part body 92 Lead (Terminal) 93 Joint surface C Electronic parts (parts) E11, E12, E13 Area 1, Area 2, Area 3 LSP Least Squares Plane V1, V2, V3 1st optical path, 2nd optical path, 3rd optical path

Claims

1. a head unit having a head for holding a component; a scan camera unit movably mounted on the head unit and capable of capturing an image of a component held by the head; an inspection unit that inspects the component based on the image acquired by the scan camera unit; the scan camera unit includes a camera and an optical system that forms a first optical path through which an optical image of a bottom view of the component is incident on the camera, a second optical path through which an optical image of a side view of the component is incident on the camera, and a third optical path through which an optical image of an oblique view of the component is incident on the camera; The inspection unit performs a first inspection to recognize a component using at least one of the bottom view and the side view images, and a second inspection to measure coplanarity using the bottom view and the oblique view images.

2. 2. The component inspection device according to claim 1, the camera is a single camera, The optical system causes each of the optical images of the first optical path, the second optical path, and the third optical path to be incident on the single camera.

3. 3. The component inspection device according to claim 2, the first optical path and the third optical path share an optical path portion extending from the middle of these optical paths to the camera, The optical system further includes a mirror unit that is arranged to be able to move back and forth along the optical path and that switches the optical path incident on the camera between the first optical path and the third optical path.

4. 3. The component inspection device according to claim 2, the camera includes an image sensor that photoelectrically converts an optical image; the imaging element includes a first area, a second area, and a third area which are imaging areas independent of one another; The optical system causes the bottom view light image to be incident on the first area, the side view light image to be incident on the second area, and the oblique view light image to be incident on the third area.

5. The component inspection device according to any one of claims 1 to 4, A component inspection apparatus, wherein the inspection unit evaluates the coplanarity of the component by referring to the result of the second inspection and the result of the component recognition based on the side view.

6. 6. The component inspection device according to claim 5, the component is a terminal-equipped component having a component body and a plurality of terminals extending from the component body, The inspection unit inspects the terminal-equipped component for irregularities in terminal arrangement by referring to the result of the second inspection and the result of component recognition based on the side view.

7. The component inspection device according to any one of claims 1 to 4, The inspection unit includes: performing a first coplanarity measurement based on an image captured by the scan camera unit when the head is at a first rotation angle, and a second coplanarity measurement based on an image captured by the scan camera unit when the head is at a second rotation angle different from the first rotation angle; a component inspection apparatus that evaluates the coplanarity of the component by referring to the side views captured at the first rotation angle and the second rotation angle, respectively.

8. The component inspection device according to any one of claims 1 to 4, Another camera unit capable of measuring the coplanarity; a selection unit that determines whether to select the scan camera unit or the other camera unit in imaging for the coplanarity measurement of the component to be inspected.

Images