Cooling plate

Abstract

To provide a cooling plate which can effectively cool a plurality of electronic components.SOLUTION: A cooling plate comprises: a pair of plate members 41 which comes in contact with a plurality of electronic components 66a, 67; a main flow path R1 which is formed between the pair of plate members 41 through which cooling fluid for cooling the plurality of electronic components 66a, 67 flows from an inlet 42 to an outlet 43; and a branch flow path R2 which is formed between the pair of plate members 41 through which the cooling fluid flowing in from the inlet 42 branches off from the main flow path R1 at a branch port 45 and flows, the branch flow path R2 merges with the main flow path R1 and is connected to the outlet 43, and the flow path cross-sectional area of the main flow path R1 is larger than the flow path cross-sectional area of the branch port 45 branching off from the main flow path R1.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cooling plate capable of cooling electronic components. [Background technology]

[0002] In recent years, automobiles equipped with motors as a driving source (such as hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs)) have become widespread. These automobiles are equipped with a vehicle drive system that drives the motor and other components, and this vehicle drive system is equipped with a power conversion device having multiple electronic components. This type of power conversion system is also equipped with a cooling plate for cooling the multiple electronic components.

[0003] Patent Document 1 describes a power conversion device that includes a semiconductor module that constitutes a power conversion circuit and a cooling case that cools the semiconductor module with a refrigerant, and is configured so that the semiconductor module, which is arranged on the upper wall surface of the cooling case, can be cooled by the refrigerant that flows through a flow path formed inside the cooling case. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-217553 Summary of the Invention [Problem to be solved by the invention]

[0005] Incidentally, the heat generation amount of electronic components cooled by the cooling case described in Patent Document 1 and the like varies depending on the type. Therefore, when cooling multiple electronic components with different heat generation amounts, for example, if electronic components with a large heat generation amount are cooled on the upstream side of the cooling flow path, the temperature of the refrigerant may rise, making it difficult to cool electronic components on the downstream side. In other words, the cooling case described in Patent Document 1 and the like may not be able to effectively cool multiple electronic components with different heat generation amounts.

[0006] Therefore, there is a demand for a cooling plate that can effectively cool multiple electronic components. [Means for solving the problem]

[0007] The cooling plate according to the present invention is characterized by comprising a pair of plate members with which a plurality of electronic components come into contact, a main flow path formed between the pair of plate members through which a cooling fluid for cooling the plurality of electronic components flows from an inlet to an outlet, and a branch flow path formed between the pair of plate members through which the cooling fluid flowing in from the inlet branches off from the main flow path at a branch outlet and flows, the branch flow path merges with the main flow path and is connected to the outlet, and the flow path cross-sectional area of ​​the main flow path is larger than the flow path cross-sectional area of ​​the branch outlet branching off from the main flow path.

[0008] In this configuration, the cross-sectional area of ​​the main flow path is larger than the cross-sectional area of ​​the branch outlet of the branch flow path, so the flow rate of the cooling fluid is relatively higher in the main flow path than in the branch flow path. In other words, the portion of the plate member where the main flow path is formed has a higher cooling capacity than the portion where the branch flow path is formed. Therefore, with the cooling plate of this configuration, multiple electronic components with different heat generation values ​​can be effectively cooled by arranging them in appropriate positions. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a vertical cross-sectional view of the vehicle drive device. [Figure 2] FIG. 2 is a cooling circuit diagram showing a cooling fluid flow path and a refrigerant flow path. [Figure 3] FIG. 3 is a cross-sectional view taken along the line III-III in FIG. [Figure 4] FIG. 4 is a cross-sectional view taken along the line IV-IV in FIG. [Figure 5] FIG. 10 is a cross-sectional view of a cooling plate according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] A cooling plate according to an embodiment of the present invention will be described below with reference to the drawings. The following description will be given taking as an example an embodiment in which the cooling plate cools multiple electronic components provided in a vehicle drive system. In addition, the following description and drawings have been simplified as appropriate for clarity.

[0011] [Basic configuration] Fig. 1 shows a vehicle drive device A that transmits the driving force of a traction motor M to the drive wheels (not shown) of a vehicle. This vehicle drive device A accommodates the traction motor M, a gear mechanism Ge that reduces the driving force of the traction motor M and transmits it to the drive wheels, a power conversion device B, and an inverter C in a housing AH. Hereinafter, a vehicle equipped with a traction motor M as a driving source will also be referred to as an electric vehicle. Examples of electric vehicles include hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs).

[0012] Since the vehicle drive device A is provided in the electric vehicle 100 in the vertical relationship shown in Fig. 1, in this embodiment, the vertical relationship will be described in accordance with the vertical direction shown in Fig. 1. Also, Fig. 1 shows a vertical cross section of the vehicle drive device A as seen in the front-to-rear direction, with the left-to-right direction in Fig. 1 being the width direction of the vehicle body and the direction perpendicular to the plane of Fig. 1 being the front-to-rear direction of the vehicle body.

[0013] Power conversion device B converts AC power from an AC power source (basically a commercial power source) supplied from outside electric vehicle 100 into high-voltage DC power. The converted high-voltage DC power is charged into a main battery (not shown) arranged outside vehicle drive device A. Power conversion device B can also convert DC power from the main battery to generate AC power similar to that of the commercial power source and supply it to the outside of electric vehicle 100.

[0014] The inverter C converts DC power from the main battery into three-phase AC power, controls the frequency, and supplies it to the traction motor M. This drives the drive wheels of the electric vehicle 100, causing the electric vehicle 100 to travel.

[0015] 1, the power conversion device B is configured with multiple layers in which multiple conversion modules (first conversion module Ba, second conversion module Bb, and third conversion module Bc) are arranged in an overlapping manner in the vertical direction. The inverter C is provided above the power conversion device B.

[0016] [Vehicle drive device] As shown in Fig. 1, the vehicle drive device A accommodates a travel motor M and a gear mechanism Ge in a lower space LS of a housing AH. In the vehicle drive device A, the outer side of the travel motor M in the lower space LS is closed by a motor cover 1, and the outer side of the gear mechanism Ge in the lower space LS is closed by a gear cover 2. The rotation axis A1 of the travel motor M is coaxial with the rotation axis of the gear mechanism Ge.

[0017] The vehicle drive device A accommodates a power conversion device B and an inverter C in an upper space HS of a housing AH. This upper space HS is closed by an upper cover 3. The lower space LS and the upper space HS are independent spaces that do not communicate with each other.

[0018] As shown in Figure 1, the power conversion device B has multiple layers in which multiple conversion modules (a first conversion module Ba, a second conversion module Bb, and a third conversion module Bc) are arranged in a stacked state, and an inverter C is provided on the upper surface of the power conversion device B.

[0019] In this embodiment, as described above, the power conversion device B and the inverter C are housed in an integrated state inside the housing AH of the vehicle drive device A, but the power conversion device B may be separated from the inverter C. Furthermore, the vehicle drive device A is configured to house both the power conversion device B and the inverter C inside, but at least one of the power conversion device B and the inverter C may be disposed on the outer wall surface of the housing AH of the vehicle drive device A or outside.

[0020] [Layer structure of power conversion device] 1, the power conversion device B has a first conversion module Ba, a second conversion module Bb, and a third conversion module Bc arranged in this order from top to bottom. In the power conversion device B, a first cooling plate 40 (an example of a cooling plate) is arranged on the upper stage, and a second cooling plate 50 is arranged below it at a set distance, and these are connected via a spacer or the like to maintain the set distance between the first cooling plate 40 and the second cooling plate 50.

[0021] In a specific arrangement, the power conversion device B has the first conversion module Ba and the second conversion module Bb arranged below the first cooling plate 40 and above the second cooling plate 50, and the third conversion module Bc arranged below the second cooling plate 50.

[0022] The first conversion module Ba is composed of a plurality of switching elements 15 mounted on the upper surface of a plate-shaped upper substrate 14. The upper substrate 14 is supported by the first cooling plate 40 while being spaced downward from the first cooling plate 40. The plurality of switching elements 15 constitute a part of an OBC (On Board Charger) unit.

[0023] 1, a plurality of switching elements 15 are shown as one block. These switching elements 15 are arranged in contact with or in close proximity to the lower surface of the first cooling plate 40.

[0024] 1, the second conversion module Bb is composed of a transformer T mounted on the lower surface of an upper substrate 14, a plurality of bulk capacitors 16, and a frame member 18. The frame member 18 functions as a spacer by protruding downward from the lower surface of the upper substrate 14 while surrounding at least a portion of the outer periphery of the transformer T.

[0025] As shown in FIG. 1, the third conversion module Bc includes a plurality of coil modules 21 and a plurality of AC filters 22 on the upper surface of a lower substrate 20 that is arranged below and separated from the lower surface of the second cooling plate 50.

[0026] The upper surfaces of the plurality of coil modules 21 and the upper surfaces of the plurality of AC filters 22 are arranged in contact with or in close proximity to the lower surface of the second cooling plate 50 .

[0027] [Inverter] The inverter C is made up of a main inverter unit 65 and an auxiliary inverter (not shown). The main inverter unit 65 has a motor drive circuit 66 and a smoothing capacitor 67 (an example of a second electronic component). The motor drive circuit 66 has a plurality of switching elements 66a (an example of a first electronic component) and supplies power to the traction motor M.

[0028] In this embodiment, the main inverter unit 65 constituting the inverter C is disposed above the first cooling plate 40. Specifically, the switching element 66a and smoothing capacitor 67 of the motor drive circuit 66 are disposed in contact with the upper surface of the first cooling plate 40. Note that the contact state between the switching element 66a and smoothing capacitor 67 and the first cooling plate 40 includes a state in which the switching element 66a and smoothing capacitor 67 are in direct contact with the first cooling plate 40 and a state in which they are in contact via a gap filler or the like made of a heat transfer material.

[0029] [Cooling circuit] As shown in Fig. 2, the vehicle drive device A includes a cooling circuit including a coolant flow path L1 for circulating a coolant as a cooling fluid, a refrigerant flow path L2 for circulating a refrigerant, and a lubricant flow path L3 for circulating a lubricant. The cooling fluid may be a cooling water such as long-life coolant (LLC), insulating oil such as paraffin, or a refrigerant or gas such as hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO). In this embodiment, a cooling water such as long-life coolant (LLC) (hereinafter also referred to as "coolant") is used as the cooling fluid.

[0030] The coolant flow path L1 circulates the coolant through the first cooling plate 40 and second cooling plate 50 of the power conversion device B, the oil cooler 32, the water-cooled condenser 31, and the radiator 34 in this order by driving the coolant pump 33. The main flow path R1 and branch flow paths R2 of the first cooling plate 40 and the flow path R3 of the second cooling plate 50, which will be described later, are part of the coolant flow path L1.

[0031] The refrigerant flow path L2 is configured to supply an externally cooled refrigerant to the water-cooled condenser 31. In this refrigerant flow path L2, a hydrofluorocarbon (HFC), a hydrofluoroolefin (HFO), or the like is used as the refrigerant.

[0032] The lubricating oil passage L3 supplies low-temperature lubricating oil (oil) to the inside of the traveling motor M and the gear mechanism Ge when driven by the hydraulic pump 35.

[0033] In this cooling circuit, the coolant cooled by the radiator 34 flows through the main flow path R1 and branch flow paths R2 of the first cooling plate 40 of the power conversion device B and the flow path R3 of the second cooling plate 50 (see also FIGS. 3 and 4). As a result, the coolant absorbs heat generated in the inverter C, the first conversion module Ba, the second conversion module Bb, and the third conversion module Bc, and cools the inverter C, the first conversion module Ba, the second conversion module Bb, and the third conversion module Bc. As a result, the temperature of the coolant rises.

[0034] The oil cooler 32 is disposed downstream of the power converter B in the coolant flow path L1, and exchanges heat between the oil and the coolant circulating through the coolant flow path L1. This further increases the temperature of the coolant and decreases the temperature of the oil. The oil with the decreased temperature is then circulated through the lubricant flow path L3. This suppresses the temperature increase of the drive motor M and gear mechanism Ge in the lower space LS of the housing AH, and lubricates the drive motor M and gear mechanism Ge. The coolant whose temperature has increased in the oil cooler 32 absorbs heat from the refrigerant in the water-cooled condenser 31, then its temperature is reduced by heat dissipation in the radiator 34, and it is then supplied to the power converter B again.

[0035] [Cooling mechanism] The power conversion device B and the inverter C are cooled by the coolant flowing through the first cooling plate 40 and the second cooling plate 50. As shown in Fig. 1, the first cooling plate 40 and the second cooling plate 50 are configured such that the flow paths are continuous between them by a communication passage 13 extending in the vertical direction.

[0036] 3, the first cooling plate 40 has a pair of plate members 41 with which a plurality of electronic components 66a, 67 come into contact. A main flow path R1 and a branch flow path R2 through which a cooling fluid (coolant) flows are formed between the pair of plate members 41. The first cooling plate 40 also has an inlet 42 connected to an outlet 53 of the second cooling plate 50 (described later) by a communication path 13, and an outlet 43 through which the coolant flows out to the outside.

[0037] In this embodiment, the pair of plate members 41 of the first cooling plate 40 are formed with a first portion 40A (an example of the first region), a second portion 40B (an example of the second region), a third portion 40C (an example of the second region), and a fourth portion 40D (an example of the second region) that are continuously formed. The first portion 40A extends in the short-side direction (front-rear direction of the vehicle body) of the lower substrate 20 (see FIG. 1 , the same applies below). The second portion 40B extends from one end of the first portion 40A in the long-side direction of the lower substrate 20. The third portion 40C is folded back from the end of the second portion 40B in the short-side direction of the lower substrate 20 and extends. The fourth portion 40D is folded back from the end of the third portion 40C in the long-side direction of the lower substrate 20 and extends to the other end of the first portion 40A. The first portion 40A has an inlet 42 formed at one end and an outlet 43 formed at the other end.

[0038] A plurality of pin fins 44 are formed on the inner walls of the flow paths in the first portion 40A of the first cooling plate 40. The plurality of pin fins 44 are provided to generate turbulence in the coolant in the flow paths that pass through the first portion 40A, thereby enhancing the cooling effect.

[0039] The main flow path R1 is a flow path through which the coolant flows from the inlet 42 to the outlet 43. The main flow path R1 in this embodiment is a flow path through which the coolant flows through the first portion 40A of the first cooling plate 40. In other words, the main flow path R1 is a flow path that extends from the inlet 42 to the outlet 43 along the short direction of the lower substrate 20. Furthermore, the flow path cross-sectional area of ​​the main flow path R1 varies slightly depending on whether or not pin fins 44 are provided, but is generally the same from the upstream end to the downstream end.

[0040] The branch flow passages R2 are flow passages through which the coolant flowing in from the inlet 42 branches off from the main flow passage R1. In this embodiment, the branch flow passages R2 are flow passages through the second portion 40B, the third portion 40C, and the fourth portion 40D of the first cooling plate 40 in this order. A branch port 45 of the branch flow passage R2 branching off from the main flow passage R1 is formed at an end of the second portion 40B of the first cooling plate 40 on the downstream side in the flow direction of the coolant, so as to penetrate the partition wall of the plate member 41. Furthermore, a plurality of (three in this embodiment) slit-shaped confluence ports 46, through which the branch flow passages R2 merge with the main flow passage R1, are formed at an end of the fourth portion 40D on the downstream side in the flow direction of the coolant, so as to penetrate the partition wall of the plate member 41.

[0041] In this embodiment, the branch port 45 of the branch flow path R2 is formed so that the branch angle is a predetermined angle (approximately 45° in this embodiment), which makes it easier for the coolant to flow from the main flow path R1 into the branch flow path R2.

[0042] Here, the cross-sectional area of ​​the main flow path R1 is larger than that of the branch port 45 of the branch flow path R2. Specifically, the cross-sectional area of ​​the main flow path R1 is larger than that of the branch port 45 over the entire length of the flow path. Therefore, the coolant flowing in from the inlet 42 mainly flows through the main flow path R1, and a portion of the coolant flows into the branch flow path R2 through the branch port 45. In other words, the flow rate of the coolant is relatively higher in the main flow path R1 than in the branch flow path R2. Therefore, the first portion 40A, in which the main flow path R1 is formed, has a higher cooling capacity than the second portion 40B, the third portion 40C, and the fourth portion 40D, in which the branch flow path R2 is formed. In other words, in a plan view, the first region of the plate member 41 overlapping with the main flow path R1 has a higher cooling capacity than the second region of the plate member 41 overlapping with the branch flow path R2. The cross-sectional area of ​​the main flow path R1 at the portion where the branch port 45 is formed may be larger than the cross-sectional area of ​​the branch port 45. In this case, it is preferable that the cross-sectional area of ​​the flow path from the portion where the branch port 45 is formed to the portion where the merging port 46 is formed is larger than the cross-sectional area of ​​the branch port 45. The ratio of the cross-sectional area of ​​the branch flow path R2 to the cross-sectional area of ​​the main flow path R1 may be appropriately set depending on the amount of heat generated by the electronic component to be cooled, so that the first region and the second region have appropriate cooling capabilities.

[0043] In this embodiment, the three junction ports 46 of the branch flow passage R2 have a backflow prevention structure that prevents the coolant from flowing from the main flow passage R1 into the branch flow passage R2. Specifically, the three junction ports 46 in this embodiment are formed so that the junction angle is a predetermined angle (approximately 45° in this embodiment). Therefore, the coolant is less likely to flow from the main flow passage R1 into the branch flow passage R2.

[0044] In this embodiment, the three junction ports 46 of the branch flow path R2 have approximately the same flow path cross-sectional area, and the total flow path cross-sectional area obtained by adding up the flow path cross-sectional areas of the three junction ports 46 is smaller than the flow path cross-sectional area of ​​the main flow path R1. This reduces the flow rate of the coolant flowing from the branch flow path R2 to the main flow path R1 through the junction ports 46, thereby extending the residence time of the coolant in the branch flow path R2. This therefore ensures the cooling capacity of the second portion 40B, the third portion 40C, and the fourth portion 40D (i.e., the cooling capacity of the second region) while reducing the amount of coolant consumed.

[0045] The second cooling plate 50 is made up of a pair of plate members 51 and has a flow path R3 therein. As shown in Fig. 4, the second cooling plate 50 has an inlet 52 through which the coolant flows into the flow path R3, and an outlet 53 connected to the inlet 42 of the first cooling plate 40 described above by a communication path 13.

[0046] The pair of plate members 51 of the second cooling plate 50 are formed with a first portion 50A, a second portion 50B, a third portion 50C, and a fourth portion 50D, which are successively formed. The flow path R3 is formed so that the coolant flows through the first portion 50A, the second portion 50B, the third portion 50C, and the fourth portion 50D in this order. The first portion 50A extends in the longitudinal direction of the lower substrate 20 (see FIG. 1 , and the same applies below) and has an inlet 52 at its upstream end in the flow direction of the coolant. The second portion 50B is bent back from the downstream end of the first portion 50A in the flow direction and extends in a curved manner. The third portion 50C is bent back from the downstream end of the second portion 50B in the flow direction and extends in the longitudinal direction of the lower substrate 20. The fourth portion 50D extends in the longitudinal direction of the lower substrate 20 from the downstream end of the third portion 50C in the flow direction and has an outlet 53 at its downstream end in the flow direction.

[0047] In this embodiment, the coolant that has been cooled by the radiator 34 or the like and reached the power conversion device B flows into the flow path R3 from the inlet 52 of the second cooling plate 50. Then, the coolant that has flowed through the first portion 50A, the second portion 50B, the third portion 50C, and the fourth portion 50D of the second cooling plate 50 in this order reaches the first cooling plate 40 through the connecting passage 13.

[0048] The coolant that has reached the first cooling plate 40 flows from the inlet 42 into the main flow path R1 of the first cooling plate 40, flows through the first portion 40A of the first cooling plate 40, and flows out of the power conversion device B from the outlet 43. Meanwhile, part of the coolant that has flowed into the main flow path R1 passes through the branch port 45 of the branch flow path R2 and flows through the second portion 40B, third portion 40C, and fourth portion 40D of the first cooling plate 40 in this order, passes through three junction ports 46 to merge with the main flow path R1, and flows out of the outlet 43 together with the coolant flowing through the main flow path R1.

[0049] When comparing the heat generation amounts of the electronic components that make up the main inverter unit 65 cooled by the first cooling plate 40, the switching element 66a of the motor drive circuit 66 generates a larger amount of heat than the smoothing capacitor 67.

[0050] Therefore, in this embodiment, a switching element 66a of the motor drive circuit 66 is arranged on the upper surface of the first portion 40A of the plate member 41 of the first cooling plate 40, and a smoothing capacitor 67 is arranged on the upper surfaces of the second portion 40B, the third portion 40C, and the fourth portion 40D of the plate member 41 (see Figures 1 and 3).

[0051] Therefore, according to this embodiment, among the electronic components cooled by the first cooling plate 40, the switching element 66a of the motor drive circuit 66, which generates a relatively large amount of heat, is cooled by being in contact with the first portion 40A, which has a high cooling capacity, and the smoothing capacitor 67, which generates a relatively small amount of heat, is cooled by the second portion 40B, the third portion 40C, and the fourth portion 40D, which have lower cooling capacity than the first portion 40A. Therefore, these electronic components 66a and 67 can be cooled effectively.

[0052] Second Embodiment In the second embodiment, as shown in Fig. 5, the three junction ports 46 of the branch flow passage R2 have baffle plates 47 as a backflow prevention structure. Specifically, the baffle plates 47 extend from a portion of the opening edge of each junction port 46 on the main flow passage R1 side, which is located upstream in the flow direction of the coolant flowing through the main flow passage R1, toward the main flow passage R1. In the second embodiment, the three junction ports 46 of the branch flow passage R2 are formed so that the junction angle is 90°. The other configurations are the same as those in the first embodiment.

[0053] As in the present embodiment, each junction port 46 has a baffle plate 47, and thus the baffle plate 47 prevents the coolant flowing through the main flow path R1 from flowing into the junction port 46. Therefore, the coolant is less likely to flow from the main flow path R1 into the branch flow paths R2.

[0054] [Another embodiment] The present invention may be configured as follows in addition to the above-described embodiment (common numbers and symbols as in the embodiment are used to designate components having the same functions as in the embodiment).

[0055] (a) In the above embodiment, the first cooling plate 40 is provided with the main flow path R1 and the branch flow path R2, but the present invention is not limited to this. For example, the second cooling plate 50 may be provided with the main flow path and the branch flow path.

[0056] (b) In the above embodiment, the first electronic component is the switching element 66a of the motor drive circuit 66, and the second electronic component is the smoothing capacitor 67. However, the present invention is not limited to this. Of the electronic components cooled by a cooling plate having a main flow path R1 and a branch flow path R2, the first electronic component may be the electronic component that generates a relatively large amount of heat, and the second electronic component may be the electronic component that generates a relatively small amount of heat.

[0057] (c) In the above embodiment, the branch flow path R2 has three junction ports 46, but the present invention is not limited to this. The number of junction ports 46 of the branch flow path R2 is not particularly limited, and may be one.

[0058] (d) In the above embodiment, the total cross-sectional area of ​​the branch flow path R2, which is the sum of the cross-sectional areas of the three junction ports 46, is smaller than the cross-sectional area of ​​the main flow path R1. However, the present invention is not limited to this. The total cross-sectional area may be equal to or larger than the cross-sectional area of ​​the main flow path R1.

[0059] (e) In the above embodiment, the junction port 46 of the branch flow path R2 has a backflow prevention structure, but the present invention is not limited to this. The junction port 46 of the branch flow path R2 may not have a backflow prevention structure. Even if the three junction ports 46 of the branch flow path R2 are formed so that the junction angle is 90°, as in the second embodiment, backflow from the main flow path R1 to the branch flow path R2 can be prevented by making the flow path cross-sectional area of ​​each junction port 46 somewhat smaller than the flow path cross-sectional area of ​​the main flow path R1.

[0060] (f) In the above embodiment, the first cooling plate 40 is disposed horizontally, but the present invention is not limited to this. The first cooling plate 40 may be disposed vertically depending on the structure of the vehicle drive device A. When the first cooling plate 40 is disposed vertically, the inlet 42 is disposed on the upper side and the outlet 43 is disposed on the lower side, and the coolant flows from top to bottom.

[0061] (g) In the above embodiment, the coolant flow path L1 circulated the coolant through the first and second cooling plates 40 and 50 of the power conversion device B, the oil cooler 32, the water-cooled condenser 31, and the radiator 34, in this order, by driving the coolant pump 33. Alternatively, the coolant flow path L1 may circulate the coolant through the first and second cooling plates 40 and 50 of the power conversion device B, the water-cooled condenser 31, the oil cooler 32, and the radiator 34, in this order, by driving the coolant pump 33.

[0062] Furthermore, the configurations disclosed in the above embodiments (including other embodiments, the same applies below) can be applied in combination with configurations disclosed in other embodiments, as long as no contradictions arise. Furthermore, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited to these, and can be modified as appropriate within the scope that does not deviate from the purpose of the present invention.

[0063] In the above-described embodiment, the following configurations are envisioned. <1> One aspect of the cooling plate (40) includes a pair of plate members (41) with which a plurality of electronic components (66a, 67) are in contact, a main flow path (R1) formed between the pair of plate members (41) through which a cooling fluid for cooling the plurality of electronic components (66a, 67) flows from an inlet (42) to an outlet (43), and a branch flow path (R2) formed between the pair of plate members (41) through which the cooling fluid flowing in from the inlet (42) branches from the main flow path (R1) at a branch port (45) and flows, the branch flow path (R2) merges with the main flow path (R1) and is connected to the outlet (43), and the flow path cross-sectional area of ​​the main flow path (R1) is larger than the flow path cross-sectional area of ​​the branch port (45) branching from the main flow path (R1).

[0064] In this embodiment, the cross-sectional area of ​​the main flow path (R1) is larger than the cross-sectional area of ​​the branch opening (45) of the branch flow path (R2), so that the flow rate of the cooling fluid is relatively higher in the main flow path (R1) than in the branch flow path (R2). In other words, the portion of the plate member (41) in which the main flow path (R1) is formed has a higher cooling capacity than the portion in which the branch flow path (R2) is formed. Therefore, with the cooling plate (40) of this embodiment, the electronic components (66a, 67) that generate different amounts of heat can be effectively cooled by arranging them in appropriate positions.

[0065] <2> the above <1> In the cooling plate (40), it is preferable that, in a plan view, a first electronic component (66a) is arranged in a first region (40A) of the plate member (41) overlapping with the main flow path (R1), and a second electronic component (67) having a smaller calorific value than the first electronic component (66a) is arranged in a second region (40B, 40C, 40D) of the plate member (41) overlapping with the branch flow path (R2).

[0066] According to the present embodiment, the first region (40A) of the plate member (41) overlapping with the main flow path (R1) has a higher cooling capacity than the second regions (40B, 40C, 40D) of the plate member (41) overlapping with the branch flow path (R2). The first electronic component (66a) is arranged and cooled in the first region (40A), and the second electronic component (67) that generates less heat than the first electronic component (66a) is arranged and cooled in the second regions (40B, 40C, 40D), thereby effectively cooling the plurality of electronic components (66a, 67).

[0067] <3> the above <1> or <2> In the cooling plate (40), it is preferable that the cross-sectional area of ​​the junction port (46) where the branch passage (R2) joins the main passage (R1) is smaller than the cross-sectional area of ​​the main passage (R1).

[0068] According to this embodiment, the junction port (46) of the branch flow path (R2) is smaller than the cross-sectional area of ​​the main flow path (R1), which reduces the flow rate of the cooling fluid flowing from the branch flow path (R2) to the main flow path (R1) through the junction port (46) and extends the residence time of the cooling fluid in the branch flow path (R2). This ensures the cooling capacity of the second region (40B, 40C, 40D) while reducing the consumption of the cooling fluid.

[0069] <4> the above <3> In the cooling plate (40), the confluence port (46) preferably has a backflow prevention structure (47) for preventing the cooling fluid from flowing from the main flow path (R1) into the branch flow path (R2).

[0070] According to this embodiment, the cooling fluid can be prevented from flowing from the main flow path (R1) into the branch flow path (R2). Therefore, for example, the cooling fluid whose temperature has increased after cooling an electronic component that generates a relatively large amount of heat can be prevented from flowing into the branch flow path (R2). As a result, the cooling capacity of the portion of the plate member (41) where the branch flow path (R2) is formed is less likely to decrease. [Industrial Applicability]

[0071] The present invention can be used in a cooling plate capable of cooling electronic components. [Explanation of symbols]

[0072] 40: first cooling plate (cooling plate), 40A: first portion (first region), 40B: second portion (second region), 40C: third portion (second region), 40D: fourth portion (second region), 41: pair of plate members (pair of plate members), 42: inlet, 43: outlet, 45: branch port, 46: merging port, 66a: switching element (first electronic component), 67: smoothing capacitor (second electronic component), 47: baffle plate (backflow prevention structure), R1: main flow path, R2: branch flow path

Claims

1. a pair of plate members with which a plurality of electronic components come into contact; a main flow path formed between the pair of plate members, through which a cooling fluid for cooling the plurality of electronic components flows from an inlet to an outlet; a branch flow path formed between the pair of plate members, through which the cooling fluid flowing in from the inlet branches from the main flow path at a branch port and flows, the branch flow path merges with the main flow path and communicates with the outlet, A cooling plate, wherein a flow path cross-sectional area of ​​the main flow path is larger than a flow path cross-sectional area of ​​the branch port branching from the main flow path.

2. 2. The cooling plate according to claim 1, wherein, in a plan view, a first electronic component is arranged in a first region of the plate member that overlaps with the main flow path, and a second electronic component that generates less heat than the first electronic component is arranged in a second region of the plate member that overlaps with the branch flow path.

3. The cooling plate according to claim 1 , wherein a cross-sectional area of ​​a junction port of each of the branch channels where the branch channels join the main channel is smaller than a cross-sectional area of ​​the main channel.

4. The cooling plate according to claim 3 , wherein the merging port has a backflow prevention structure that prevents the cooling fluid from flowing from the main flow path into the branch flow path.

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