Stretchable semiconductor device

Abstract

To provide a stretchable semiconductor device capable of obtaining electrical connection reliability with a flexible wiring substrate for an external connection.SOLUTION: A stretchable semiconductor device comprises: a frame member 16a that is arranged at least one side of an outer surface of a stretchable resin substrate 2 and a stretchable resin layer 15; non-stretchable wiring substrates 11 and 12 that are disposed at a position overlapping the frame member 16a in a plan view in a state of being electrically connected to an end part of wiring layers 9a and 10b extending to a position overlapping with the frame member 16a in a plan view among a plurality of wiring layers 9a, 9b, 10a, and 10b; and flexible wiring substrates 13a and 13b electrically connected to the non-stretchable wiring substrates 11 and 12 at the position overlapping the frame member 16a in the plan view and extending toward the outside of the frame member 16a. Inside the frame member 16a, the stretchable resin substrate 2 and the stretchable resin layer 15, together with the plurality of wiring layers 9a, 9b, 10a, and 10b, are stretchable in a convex or concave shape in a direction perpendicular to the surface.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device having elasticity. [Background technology]

[0002] For example, there are semiconductor devices with stretchability (see, for example, Patent Documents 1 and 2 below). Such stretchable semiconductor devices are necessary for driving electronic devices such as organic electroluminescence (EL) displays that can be deformed into three-dimensional shapes such as spherical or free-form surfaces, and pressure-sensitive sensors.

[0003] Specifically, Patent Document 1 below discloses a stretchable semiconductor element comprising a flexible substrate having a support surface and a semiconductor structure having a curved inner surface, at least a portion of the curved inner surface being bonded to the support surface of the flexible substrate.

[0004] Furthermore, Patent Document 2 below discloses a stretchable device in which one or more semiconductor elements are formed on a resin substrate, and a semiconductor-mounted substrate configured by covering the semiconductor elements with an inner sealing layer is embedded in one or more stretchable resin films made of elastomer, a conductive circuit connected to the semiconductor elements is formed in the stretchable resin film, and the periphery of the semiconductor-mounted substrate is covered with an outer sealing layer. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-281406 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-149364 Summary of the Invention [Problem to be solved by the invention]

[0006] In the above-described stretchable semiconductor device, a semiconductor element such as a thin film transistor (TFT) is formed on a stretchable substrate. However, in conventional semiconductor devices, when the substrate is stretched, peeling easily occurs between the substrate (stretchable portion) and the semiconductor element (non-stretchable portion), which can cause instability in the characteristics of the semiconductor element.

[0007] Furthermore, when the substrate is expanded or contracted, it becomes difficult to maintain electrical connection between the wiring on the expanding or contracting substrate side and the electrodes on the semiconductor element side, which may result in disconnection.

[0008] On the other hand, when connecting a flexible printed circuit (FPC) for external connection to a stretchable semiconductor device, the FPC connection terminals are pressed against an anisotropic conductive film (ACF) provided on the surface of the stretchable resin substrate and thermocompression bonded, thereby joining the FPC at the pressure-bonded portion with the ACF, and establishing an electrical connection.

[0009] However, at the pressure-bonded portion of the FPC to the ACF, elastic deformation of the stretchable resin substrate can prevent sufficient pressure from being applied to the pressure-bonded portion, resulting in insufficient bonding.

[0010] The present invention has been proposed in view of the above-mentioned conventional circumstances, and aims to provide a semiconductor device having elasticity that can reduce the impact of expansion and contraction on a semiconductor element and stabilize the operation of the semiconductor element by achieving reliable electrical connection with a flexible wiring board for external connection. [Means for solving the problem]

[0011] In order to achieve the above object, the present invention provides the following means. [1] A stretchable resin substrate that can be stretched freely; a plurality of non-stretchable resin substrates arranged side by side on the surface of the stretchable resin substrate; a plurality of semiconductor elements arranged on each surface of the plurality of non-elastic resin substrates; a plurality of wiring layers provided stretchably between adjacent ones of the plurality of non-stretchable resin substrates on a surface of the stretchable resin substrate facing the non-stretchable resin substrate; an elastic resin layer disposed so as to cover a surface side of the elastic resin substrate facing the plurality of non-elastic resin substrates; A frame material arranged on at least one side of the outer surfaces of the stretchable resin substrates and the stretchable resin layer so as to surround the periphery of the plurality of non-stretchable resin substrates in a plan view; A non-stretchable wiring substrate arranged at a position overlapping the frame material in a planar view in a state electrically connected to an end of a wiring layer among the plurality of wiring layers that extends to a position overlapping the frame material in a planar view; a flexible wiring board electrically connected to the non-stretchable wiring board at a position overlapping the frame material in a plan view and extending toward the outside of the frame material; A stretchable semiconductor device characterized in that, inside the frame material, the stretchable resin substrate and the stretchable resin layer, together with the plurality of wiring layers, are capable of stretching in a convex or concave shape in the direction perpendicular to the surface. [2] The stretchable semiconductor device according to [1], characterized in that the frame material is disposed on the outer surfaces of the stretchable resin substrate and the stretchable resin layer, respectively, so as to sandwich the joint portion between the non-stretchable wiring substrate and the flexible wiring substrate. [3] The stretchable semiconductor device according to [1], wherein the connection terminals of the flexible wiring board are bonded to the non-stretchable wiring board via an anisotropic conductive film by thermocompression bonding. [4] An electrode layer is disposed on the non-elastic resin substrate and electrically connected to the semiconductor element, The stretchable semiconductor device according to [1], wherein the wiring layer is electrically connected to the electrode layer. [5] The stretchable semiconductor device according to [1], wherein the wiring layer is formed from a fluid metal material in which metal particles are dispersed in a liquid metal. [6] The stretchable resin substrate has adhesiveness, The stretchable semiconductor device according to [1], wherein the non-stretchable resin substrate is attached to the stretchable resin substrate by the adhesive force of the stretchable resin substrate. [7] An adhesive layer is provided on the surface of the stretchable resin substrate facing the non-stretchable resin substrate, The stretchable semiconductor device according to [1], wherein the non-stretchable resin substrate is attached to the stretchable resin substrate via the adhesive layer. [Effects of the Invention]

[0012] As described above, according to the present invention, a semiconductor device having elasticity is provided that can reduce the effect of expansion and contraction on a semiconductor element and stabilize the operation of the semiconductor element by achieving reliable electrical connection with a flexible wiring board for external connection. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a plan view showing a configuration of a semiconductor device according to an embodiment of the present invention; [Figure 2] 2 is an enlarged plan view of a main part of the semiconductor device in the enclosed area A shown in FIG. [Figure 3] 3 is an enlarged cross-sectional view of a main part of the semiconductor device taken along line BB shown in FIG. 2. [Figure 4] 3 is an enlarged cross-sectional view of a main part of the semiconductor device taken along line CC shown in FIG. 2. [Figure 5] 2 is an enlarged cross-sectional view of a main part of the semiconductor device taken along line DD shown in FIG. 1. [Figure 6] 2A to 2C are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device shown in FIG. [Figure 7] 2A to 2C are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device shown in FIG. [Figure 8] 2A to 2C are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device shown in FIG. [Figure 9] 2A to 2C are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device shown in FIG. [Figure 10] 2A to 2C are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device shown in FIG. [Figure 11] 2A to 2C are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device shown in FIG. [Figure 12] 2A to 2C are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device shown in FIG. DETAILED DESCRIPTION OF THE INVENTION

[0014] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In the drawings used in the following description, characteristic portions may be enlarged for convenience in order to make the features easier to understand, and the dimensional ratios of each component may not be the same as in reality. Furthermore, the materials, dimensions, etc. exemplified in the following description are merely examples, and the present invention is not necessarily limited to them, and can be implemented with appropriate changes within the scope of the present invention.

[0015] In the drawings shown below, an XYZ Cartesian coordinate system is set, with the X-axis direction being a first direction X within the plane of the semiconductor device, the Y-axis direction being a second direction Y perpendicular to the first direction X within the plane of the semiconductor device, and the Z-axis direction being a third direction Z perpendicular to the plane of the semiconductor device.

[0016] (Semiconductor Devices) First, as one embodiment of the present invention, the configuration of a semiconductor device 1 having stretchability, as shown in, for example, FIGS. 1 to 6, will be described.

[0017] FIG. 1 is a plan view showing the configuration of the semiconductor device 1. FIG. 2 is an enlarged plan view of a main part of the semiconductor device 1 in the enclosed area A shown in FIG. 1. FIG. 3 is an enlarged cross-sectional view of a main part of the semiconductor device 1 taken along line BB shown in FIG. 2. FIG. 4 is an enlarged cross-sectional view of a main part of the semiconductor device 1 taken along line CC shown in FIG. 2. FIG. 5 is an enlarged cross-sectional view of a main part of the semiconductor device 1 taken along line DD shown in FIG. 1.

[0018] As shown in Figures 1 to 4, the semiconductor device 1 of this embodiment comprises a stretchable resin substrate 2 that is freely stretchable, a plurality of non-stretchable resin substrates 3 arranged in a line within the surface of the stretchable resin substrate 2, and a plurality of semiconductor elements 4 arranged on each surface of the non-stretchable resin substrate 3.

[0019] In the semiconductor device 1 of this embodiment, as an example of the semiconductor element 4, a configuration is illustrated in which light-emitting diode (LED) elements (hereinafter referred to as "LED elements 4" as necessary) are arranged in a matrix in a first direction X and a second direction Y that intersect each other (orthogonal in this embodiment) within the plane of the elastic resin substrate 2.

[0020] The stretchable resin substrate 2 is a film substrate containing an acrylic adhesive composition having adhesive properties, and among these, it is preferable to use an acrylic resin which has excellent transparency, weather resistance, and heat resistance, and has excellent conformability to uneven surfaces and excellent adhesive strength and holding power for curved surfaces.

[0021] For example, the stretchable resin substrate 2 can be made of an adhesive acrylic polymer containing 50% by mass or more of a monomer having an acryloyl group and a methacryloyl group as an adhesive acrylic adhesive composition. The stretchable resin substrate 2 may also be made of a tackifying resin, such as a rosin-based tackifying resin, a terpene-based tackifying resin, or an epoxy-based tackifying resin. The resin material constituting the film substrate of the stretchable resin substrate 2 is a resin with a tensile elongation of 100% or more, such as an acrylic resin, a silicone resin, or a styrene-butadiene resin. The thickness of the stretchable resin substrate 2 is preferably 0.005 to 1.5 mm, and more preferably 0.05 to 1 mm.

[0022] The adhesive strength of the stretchable resin substrate 2 is, for example, preferably 5 N / 20 mm or more, more preferably 7 N / 20 mm or more, in terms of 180° peel adhesive strength measured in accordance with "JIS Z 0237." The level of adhesive strength of the stretchable resin substrate 2 is a necessary element for preventing peeling from and integrating with the non-stretchable resin substrate 3, and there is no particular upper limit to the adhesive strength.

[0023] In order to improve the life span and durability of the stretchable resin substrate 2, it is preferable that the stretchable resin substrate 2 has the ability to return to its original shape after being stretched. Specifically, the recovery rate after being stretched 100% is preferably 70% or more, and more preferably 85% or more. If the recovery rate is low, it becomes difficult to obtain durability. It is known that the recovery rate can be adjusted by the degree of crosslinking and average molecular weight of the acrylic polymer, and adjustment is possible by this method.

[0024] The multiple non-stretchable resin substrates 3 are film substrates made of flexible resin (plastic), and are arranged in a matrix in a first direction X and a second direction Y that intersect each other (orthogonal in this embodiment) within the plane of the stretchable resin substrate 2. Furthermore, each non-stretchable resin substrate 3 can be attached to one surface (front surface) of the stretchable resin substrate 2 by the adhesive force of the stretchable resin substrate 2 described above.

[0025] For example, polyimide (PI), polyethylene naphthalate (PEN), polyethylene terephthalate (PET), polycarbonate (PC), nanocellulose, etc. can be used for the non-elastic resin substrate 3. Among these, it is preferable to use PI, which has excellent heat resistance and chemical resistance against thermal baking and chemical treatment required when forming semiconductor elements, etc. The thickness of the non-elastic resin substrate 3 is preferably 0.1 to 100 μm, and more preferably 1 to 10 μm.

[0026] Furthermore, the non-stretchable resin substrate 3 is preferably attached to the stretchable resin substrate 2 via an adhesive layer 5. The adhesive layer 5 is a layer for improving adhesion between the stretchable resin substrate 2, which will be the stretchable portion, and the non-stretchable resin substrate 3, which will be the non-stretchable portion, and is formed on the surface of the non-stretchable resin substrate 3 facing the stretchable resin substrate 2.

[0027] The adhesive layer 5 is made of, for example, a silicon oxide (SiO2) film or a silicon nitride (SiN x The adhesive layer 5 preferably has a thickness of 5 to 200 nm, more preferably 10 to 20 nm.

[0028] The LED element 4 is electrically connected to a first upper electrode layer 6 and a second upper electrode layer 7 disposed on one surface (top surface) of the non-elastic resin substrate 3. For the first upper electrode layer 6 and the second upper electrode layer 7, for example, metals such as titanium (Ti), chromium (Cr), aluminum (Al), molybdenum (Mo), gold (Au), silver (Ag), copper (Cu), alloys of these, or conductive films formed by laminating two or more of these metals can be used.

[0029] The first upper electrode layer 6 and the second upper electrode layer 7 are arranged so as to extend in a first direction X and a second direction Y that intersect each other (orthogonal in this embodiment) on the surface of the non-elastic resin substrate 3, and intersect each other three-dimensionally.

[0030] For this reason, an insulating layer 8 is provided at the intersection of the first upper electrode layer 6 and the second upper electrode layer 7 to electrically insulate the first upper electrode layer 6 from the second upper electrode layer 7. The insulating layer 8 may be made of, for example, silicon nitride (SiN x ) film or silicon oxide (SiO2), etc. can be used.

[0031] One end of the LED element 4 is electrically connected to the first upper electrode layer 6 via an electrode portion 6a protruding in the width direction from the first upper electrode layer 6. The other end of the LED element 4 is electrically connected to the second upper electrode layer 7.

[0032] The semiconductor device 1 of this embodiment may be configured such that a protective layer (not shown) covering at least a part of the LED element 4 is provided on the non-elastic resin substrate 3. The protective layer has the effect of suppressing distortion of the LED element 4 formed on the non-elastic resin substrate 3 and stabilizing the characteristics of the LED element 4.

[0033] The protective layer can be made of an organic film such as an epoxy resin, an olefin resin, an acrylic resin, or a polyimide resin. Among these, it is preferable to use a photoreactive epoxy resin, which can be made into a thick film of 1 μm or more and can be patterned by light. Specifically, a negative photoresist material such as SU-8 can be used. The thickness of the protective layer is preferably 0.1 to 5 μm, and more preferably 1 to 2 μm.

[0034] A pair of first wiring layers 9a, 9b and a pair of second wiring layers 10a, 10b, each having elasticity, are provided on one surface (upper surface) of the elastic resin substrate 2. The first wiring layers 9a, 9b and the second wiring layers 10a, 10b are formed of, for example, a fluid metal material in which metal particles are dispersed in a liquid metal.

[0035] The liquid metal can be, for example, a eutectic alloy containing gallium (Ga) and indium (In), or a eutectic alloy containing Ga, In, and tin (Sn).The melting point can be changed by adjusting the amount of In and Sn added to Ga as the main component.

[0036] Metal particles can be, for example, nickel (Ni), Au, Ag, Cu, or Si. The liquid metals mentioned above have very strong atomic forces, resulting in high surface energy and very poor wettability. Therefore, adding the above-mentioned metal particles can improve wettability.

[0037] For example, by mixing 1 to 20 mass % of Ni particles with an average particle size of 1 to 50 μm into a liquid metal containing gallium (Ga) and indium (In), a paste is formed, which makes it possible to form the first wiring layers 9a, 9b and the second wiring layers 10a, 10b by printing.

[0038] The pair of first wiring layers 9a, 9b are provided extending in the first direction X so as to electrically connect adjacent ones of the plurality of non-stretchable resin substrates 3 in the first direction X. In other words, the pair of first wiring layers 9a, 9b are shared between adjacent ones of the plurality of non-stretchable resin substrates 3 in the first direction X.

[0039] On the other hand, the pair of second wiring layers 10a, 10b are provided extending in the second direction Y so as to electrically connect the plurality of non-stretchable resin substrates 3 that are adjacent to each other in the second direction Y. In other words, the pair of second wiring layers 10a, 10b are shared between the plurality of non-stretchable resin substrates 3 that are adjacent to each other in the second direction Y.

[0040] One end side of the pair of first wiring layers 9a, 9b is disposed to extend onto the non-stretchable resin substrate 3 and is electrically connected to the first upper electrode layer 6. On the other hand, one end side of the pair of second wiring layers 10a, 10b is disposed to extend onto the non-stretchable resin substrate 3 and is electrically connected to the second upper electrode layer 7.

[0041] Furthermore, as shown in Figure 1, of the multiple first wiring layers 9a, 9b lined up in the second direction Y, the ends of each first wiring layer 9a extending from one side in the first direction X toward the side end of the stretchable resin substrate 2 are gathered together in the central portion along the edge portion of the stretchable resin substrate 2 and then electrically connected to the first non-stretchable wiring substrate 11.

[0042] On the other hand, of the multiple second wiring layers 10a, 10b arranged in the first direction X, the ends of each second wiring layer 10b extending from one side in the second direction Y toward the side end of the stretchable resin substrate 2 gather together in the central portion along the edge portion of the stretchable resin substrate 2 and then are electrically connected to the second non-stretchable wiring substrate 12.

[0043] The first non-stretchable wiring board 11 and the second non-stretchable wiring board 12 are film substrates made of flexible resin (plastic), and can be attached to one side (front surface) of the stretchable resin substrate 2 due to the adhesive strength of the stretchable resin substrate 2 described above.

[0044] The first and second non-stretchable wiring boards 11, 12 can be made of the same material as the non-stretchable resin substrate 3. The thickness of the first and second non-stretchable wiring boards 11, 12 is preferably 10 to 1000 μm, more preferably 50 to 500 μm, and even more preferably 100 to 200 μm.

[0045] The first non-stretchable wiring board 11 and the second non-stretchable wiring board 12 are disposed on the surface of the stretchable resin substrate 2 in the center along the edge of each board.

[0046] An end portion of each first wiring layer 9a is disposed extending onto the first non-stretchable wiring board 11, and is electrically connected to each upper wiring layer 11a disposed side by side on the surface of the first non-stretchable wiring board 11. Similarly, an end portion of each second wiring layer 10b is disposed extending onto the second non-stretchable wiring board 12, and is electrically connected to each upper wiring layer 12a disposed side by side on the surface of the second non-stretchable wiring board 12.

[0047] 1 and 5, a first flexible wiring board (hereinafter referred to as "first FPC") 13a for external connection is electrically connected to the first non-stretchable wiring board 11 via an anisotropic conductive film (hereinafter referred to as "ACF") 14. Similarly, a second flexible wiring board (hereinafter referred to as "second FPC") 13b for external connection is electrically connected to the second non-stretchable wiring board 12 via an ACF 14 on the outer side of the side end of the stretchable resin substrate 2, as shown in FIG.

[0048] When connecting the first and second FPCs 13a and 13b, the first and second FPCs 13a and 13b are thermocompression bonded while pressing the connection terminals of the first and second non-stretchable wiring boards 11 and 12 against the ACF 14. This bonds the first and second FPCs 13a and 13b at the pressure-bonded portions of the ACF 14, and electrically connects the upper wiring layers 11a and 12a of the first and second non-stretchable wiring boards 11 and 12 to the connection terminals of the first and second FPCs 13a and 13b via the ACF 14.

[0049] The semiconductor device 1 of this embodiment comprises an elastic resin layer 15 arranged to cover the side of the elastic resin substrate 2 facing the multiple non-elastic resin substrates 3, and a first frame material 16a and a second frame material 16b arranged on the outer surfaces of the elastic resin substrate 2 and the elastic resin layer 15, respectively, so as to sandwich the joint portions between the first and second non-elastic wiring boards 11, 12 and the first and second FPCs 13a, 13b.

[0050] The stretchable resin layer 15 can be made of the same material as the stretchable resin substrate 2 described above. The stretchable resin layer 15 may be a separate stretchable resin substrate that is bonded to the stretchable resin substrate 2, or may be formed by laminating stretchable resin layers that entirely cover the surfaces of the stretchable resin substrate 2 that face each of the non-stretchable resin substrates 3.

[0051] The first frame material 16a and the second frame material 16b are frame-shaped plate materials with a rectangular opening 16c formed in the center of a rigid flat plate made of resin (plastic) or metal, and have shapes that match each other.

[0052] The first frame material 16a can be attached to the outer peripheral edge of the outer surface of the stretchable resin substrate 2 by the adhesive force of the stretchable resin substrate 2 so that the multiple non-stretchable resin substrates 3 arranged in a matrix in the first and second directions X and Y are positioned inside the opening 16c in a planar view.

[0053] Similarly, the second frame material 16b can be attached to the outer peripheral edge of the outer surface of the elastic resin layer 15 by the adhesive force of the elastic resin layer 15 so that the multiple non-elastic resin substrates 3 arranged in a matrix in the first and second directions X and Y are positioned inside the opening 16c in a planar view.

[0054] As a result, inside the opening 16c of the first and second frame materials 16a, 16b, the elastic resin substrate 2 and the elastic resin layer 15, together with the multiple first and second wiring layers 9a, 9b, 10a, 10b, are able to freely expand and contract in a convex or concave shape in the direction perpendicular to the surface.

[0055] On the other hand, the outer peripheral edges of the stretchable resin substrate 2 and the stretchable resin layer 15 are sandwiched between the first frame material 16a and the second frame materials 16a, 16b, thereby forming portions where deformation is suppressed (hereinafter referred to as "deformation suppression portions"). Also, the joint portion between the first non-stretchable wiring board 11 and the first FPC 13a and the joint portion between the second non-stretchable wiring board 12 and the second FPC 13b are arranged at positions that overlap with the deformation suppression portions, i.e., the first and second frame materials 16a, 16b, in a plan view.

[0056] In the semiconductor device 1 of this embodiment having the above-described configuration, the stretchable resin substrate 2 is stretchable between adjacent ones of the plurality of non-stretchable resin substrates 3.

[0057] As a result, when the stretchable resin substrate 2 is stretched in the first direction X and the second direction Y, the LED element 4 is provided on the non-stretchable resin substrate 3, which becomes the non-stretchable portion, and therefore it is possible to reduce the effect of stretching and contracting of the stretchable resin substrate 2 on this LED element 4.

[0058] Furthermore, in the semiconductor device 1 of this embodiment, the joint portions between the above-mentioned first and second non-stretchable wiring boards 11, 12 and the first and second FPCs 13a, 13b are arranged in a sandwiched state between the first frame material 16a and the second frame material 16a, 16b.

[0059] In this configuration, when the stretchable resin substrate 2 and the stretchable resin layer 15 expand and contract together with the plurality of first and second wiring layers 9a, 9b, 10a, 10b inside the openings 16c of the first and second frame materials 16a, 16b, it is possible to prevent loads due to expansion and contraction from being applied to the joints between the first and second non-stretchable wiring substrates 11, 12 and the first and second FPCs 13a, 13b located in the deformation suppression section.

[0060] As a result, in the semiconductor device 1 of this embodiment, it is possible to obtain reliable electrical connections between the first and second non-stretchable wiring boards 11, 12 and the first and second FPCs 13a, 13b.

[0061] Therefore, in the semiconductor device 1 of this embodiment, it is possible to reduce the influence of expansion and contraction of the stretchable resin substrate 2 on the LED element 4, and to stabilize the operation of the LED element 4.

[0062] (Method of manufacturing a semiconductor device) Next, a method for manufacturing the semiconductor device 1 will be described with reference to FIGS. 6 to 12 are cross-sectional views for sequentially explaining the manufacturing process of the semiconductor device 1. In addition, FIGS. 6 to 12 show cross-sectional views corresponding to the line AA shown in FIG.

[0063] 6, a non-stretchable resin base material 30 that will become the plurality of non-stretchable resin substrates 3 is formed on a first support substrate 21. Specifically, a glass substrate is used as the first support substrate 21, and a coating liquid containing PI that will become the non-stretchable resin substrates 3 is applied onto the first support substrate 21 by spin coating to form a coating film, and then the coating film is dried (baked) to form the non-stretchable resin base material 30 made of a PI film.

[0064] Next, as shown in Figure 7, the surrounding areas of the non-stretchable resin base material 30 that will become each non-stretchable resin substrate 3 are removed by dry etching or wet etching using photolithography technology to form multiple non-stretchable resin substrates 3.

[0065] Next, as shown in FIG. 8, a first upper electrode layer 6, an insulating layer 8, and a second upper electrode layer 7 are formed on each of the non-stretchable resin substrates 3. As shown in FIG.

[0066] Next, as shown in FIG. 9, a second support substrate 23 is attached onto the plurality of non-stretchable resin substrates 3 via a removable film tape 22.

[0067] 10, the first support substrate 21 is peeled off. Specifically, using laser lift-off, laser light is irradiated from the first support substrate 21 side to ablate the interfaces between the plurality of non-stretchable resin substrates 3 and the first support substrate 21, thereby removing the first support substrate 21 peeled off from the plurality of non-stretchable resin substrates 3.

[0068] Next, as shown in FIG. 11, the stretchable resin substrate 2 is attached onto the plurality of non-stretchable resin substrates 3 via the adhesive layer 5.

[0069] 12, the second support substrate 23 is peeled off and removed from the plurality of non-stretchable resin substrates 3 together with the removable film tape 22. Thereafter, a first non-stretchable wiring substrate 11 and a second non-stretchable wiring substrate 12 (not shown in FIG. 12) are placed on the stretchable resin substrate 2. Furthermore, first wiring layers 9a, 9b and second wiring layers 10a, 10b are formed on the stretchable resin substrate 2 using the fluid metal material obtained by dispersing metal particles in the above-mentioned liquid metal.

[0070] To form the pattern of the first wiring layers 9a, 9b and the second wiring layers 10a, 10b, a printing method such as screen printing, inkjet printing, flexographic printing, gravure printing, offset printing, aerosol jet printing, or stencil printing, or an ejection method using a displacer, can be used to pattern a fluid metal material into the shape of the first wiring layers 9a, 9b and the second wiring layers 10a, 10b, thereby forming the first wiring layers 9a, 9b and the second wiring layers 10a, 10b having elasticity.

[0071] Thereafter, the LED elements 4 are mounted on each of the non-stretchable resin substrates 3 so as to be electrically connected to the first upper electrode layer 6 and the second upper electrode layer 7 of each of the non-stretchable resin substrates 3 .

[0072] Furthermore, after ACF 14 is placed on the surfaces of the first non-stretchable wiring board 11 and the second non-stretchable wiring board 12, the first FPC 13a and the second FPC 13b are bonded to the first non-stretchable wiring board 11 and the second non-stretchable wiring board 12 via the ACF 14 by thermocompression bonding.

[0073] Next, an elastic resin layer 15 is placed to cover the side of the elastic resin substrate 2 facing the multiple non-elastic resin substrates 3, and then a first frame material 16a and a second frame material 16b are placed on the outer surfaces of the elastic resin substrate 2 and the elastic resin layer 15 so as to sandwich the joint portions between the first and second non-elastic wiring boards 11, 12 and the first and second FPCs 13a, 13b. By going through the above steps, the semiconductor device 1 shown in FIG. 1 can be fabricated.

[0074] The manufacturing method of the semiconductor device 1 of this embodiment reduces the impact on the LED element 4 caused by the expansion and contraction of the above-mentioned elastic resin substrate 2, making it possible to manufacture the semiconductor device 1 with high yield, which enables stabilization of the operation of the LED element 4.

[0075] The present invention is not necessarily limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

[0076] For example, the above-mentioned stretchable resin substrate 2 is configured such that the first frame material 16a and the second frame material 16b are arranged on the outer surfaces of the stretchable resin substrate 2 and the stretchable resin layer 15. However, it is also possible to configure such that only one of the first frame material 16a and the second frame material 16b is arranged. Furthermore, the shape of the openings 16c of the first frame material 16a and the second frame material 16b is not necessarily limited to the rectangular shape described above, and may be, for example, a circular shape.

[0077] Furthermore, a configuration may be adopted in which multiple holes are formed around the first frame material 16a and the second frame material 16b, and fasteners such as bolts and nuts that pass through the multiple holes and penetrate the stretchable resin substrate 2 and the stretchable resin layer 15 are used to press down the joints between the first and second non-stretchable wiring boards 11, 12 and the first and second FPCs 13a, 13b.

[0078] Furthermore, the stretchable resin substrate 2 is not necessarily limited to those having the above-mentioned adhesiveness, and may be one that does not have adhesiveness. In this case, the non-stretchable resin substrate 3 may be attached to the stretchable resin substrate 2 via an adhesive layer 5. Furthermore, the stretchable resin layer 15 may also be attached onto the stretchable resin substrate 2 via an adhesive layer.

[0079] Furthermore, the first wiring layers 9a, 9b and the second wiring layers 10a, 10b may be configured to be embedded in grooves formed in the stretchable resin substrate 2, or may be configured to be embedded in an insulating layer (not shown) formed in the stretchable resin substrate 2.

[0080] Furthermore, the first wiring layers 9a, 9b and the second wiring layers 10a, 10b can be made of, for example, a conductive elastic material made conductive by dispersing conductive fillers in an elastic elastomer, or a conductive layer having elasticity, such as metal wiring of gold or the like, bent into an accordion-like shape.

[0081] As the elastomer, for example, silicone rubber, fluororubber, styrene-butadiene rubber, butadiene rubber (BR), butyl rubber, ethylene-propylene copolymer, nitrile rubber (NBR), chloroprene rubber (CR), chlorosulfonated polyethylene, urethane rubber, acrylic rubber, epichlorohydrin rubber, etc. can be used to impart flexibility.

[0082] Examples of conductive fillers that can be used include carbon nanotubes, metal nanowires, metal nanoparticles, metal nanoflakes, etc. In order to prevent loss of conductivity during expansion and contraction, it is preferable to use wire- or flake-shaped fillers, which can form a network structure during expansion and maintain a conductive path.

[0083] Furthermore, the semiconductor device 1 of this embodiment is configured to include LED elements 4 as semiconductor elements, but by forming TFTs or the like on each non-stretchable resin substrate 3 and each non-stretchable resin substrate 3 constituting one pixel device, it is possible to realize a stretchable display that can be stretched and contracted, and to form a display that can be deformed into a three-dimensional shape such as a spherical surface or a free-form surface. When configuring a pixel device, it is also possible to use light-emitting elements such as organic electroluminescence (EL) elements instead of the above-mentioned LED elements 4.

[0084] Furthermore, the semiconductor device to which the present invention is applied is not necessarily limited to a configuration having the above-mentioned light-emitting element, and it is also possible to use an electronic device having semiconductor elements such as a light-receiving element, a strain sensor, or a pressure sensor. [Explanation of symbols]

[0085] REFERENCE SIGNS LIST 1...Semiconductor device 2...Stretchable resin substrate 3...Non-stretchable resin substrate 4...Semiconductor element (LED element) 5...Adhesion layer 6...First upper electrode layer 7...Second upper electrode layer 8...Insulating layer 9a, 9b...First wiring layer 10a, 10b...Second wiring layer 11...First non-stretchable wiring board 12...Second non-stretchable wiring board 13a...First flexible wiring board (FPC) 13b...Second flexible wiring board (FPC) 14...Anisotropic conductive film (ACF) 15...Stretchable resin layer 16a...First frame material 16b...Second frame material

Claims

1. A stretchable resin substrate that can be stretched freely; a plurality of non-stretchable resin substrates arranged side by side on the surface of the stretchable resin substrate; a plurality of semiconductor elements arranged on each surface of the plurality of non-elastic resin substrates; a plurality of wiring layers provided stretchably between adjacent ones of the plurality of non-stretchable resin substrates on a surface of the stretchable resin substrate facing the non-stretchable resin substrate; an elastic resin layer disposed so as to cover a surface side of the elastic resin substrate facing the plurality of non-elastic resin substrates; A frame material arranged on at least one side of the outer surfaces of the stretchable resin substrates and the stretchable resin layer so as to surround the periphery of the plurality of non-stretchable resin substrates in a plan view; A non-stretchable wiring substrate arranged at a position overlapping the frame material in a planar view in a state electrically connected to an end of a wiring layer among the plurality of wiring layers that extends to a position overlapping the frame material in a planar view; a flexible wiring board electrically connected to the non-stretchable wiring board at a position overlapping the frame material in a plan view and extending toward the outside of the frame material; A stretchable semiconductor device characterized in that, inside the frame material, the stretchable resin substrate and the stretchable resin layer, together with the plurality of wiring layers, are capable of stretching in a convex or concave shape in the direction perpendicular to the surface.

2. The stretchable semiconductor device described in claim 1, characterized in that the frame material is arranged on the outer surfaces of the stretchable resin substrate and the stretchable resin layer, respectively, so as to sandwich the joint portion between the non-stretchable wiring substrate and the flexible wiring substrate.

3. 2. The stretchable semiconductor device according to claim 1, wherein connection terminals of the flexible wiring board are bonded to the non-stretchable wiring board via an anisotropic conductive film by thermocompression bonding.

4. an electrode layer disposed on the non-elastic resin substrate and electrically connected to the semiconductor element; The stretchable semiconductor device according to claim 1 , wherein the wiring layer is electrically connected to the electrode layer.

5. 2. The stretchable semiconductor device according to claim 1, wherein the wiring layer is formed from a fluid metal material in which metal particles are dispersed in a liquid metal.

6. The stretchable resin substrate has adhesiveness, 2. The stretchable semiconductor device according to claim 1, wherein the non-stretchable resin substrate is attached to the stretchable resin substrate by the adhesive force of the stretchable resin substrate.

7. an adhesive layer provided on a surface of the stretchable resin substrate facing the non-stretchable resin substrate; 2. The stretchable semiconductor device according to claim 1, wherein the non-stretchable resin substrate is attached to the stretchable resin substrate via the adhesive layer.

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