High pressure substrate processing apparatus

Abstract

To provide a high pressure substrate processing apparatus in which a sealing unit perfectly realizes air-tightness of an outer chamber.SOLUTION: A high-pressure substrate processing apparatus 100 includes: an inner chamber formed to accommodate a substrate to be processed and a reaction gas forming a first pressure higher than atmospheric pressure; an outer chamber 120 including an outer housing 121 accommodating the inner chamber, and an outer door 125 defining a protective space for accommodating a protective gas forming a second pressure set in relation to the first pressure together with the outer housing and the inner chamber, one of the outer housing and the outer door having a mounting groove 127 formed in its corresponding surface facing the other one of the outer housing and the outer door; and a sealing unit 150 accommodated in the mounting groove and in contact with the other one to isolate the protective gas from external air, and a vent channel extending along an intersecting direction that intersects the corresponding surface to discharge the protective gas flowing into the mounting groove.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a high-pressure substrate processing apparatus used to process substrates at high pressure. [Background technology]

[0002] Generally, semiconductor wafers undergo various processes during the manufacturing process of semiconductor devices, such as oxidation, nitridation, deposition, and ion implantation. Hydrogen or deuterium heat treatment processes are also used to improve interface properties of semiconductor devices.

[0003] A process gas used for processing is supplied to the chamber, and the process gas acts on the semiconductor wafer. The chamber must be airtight to prevent leakage of the process gas. To ensure airtightness, a sealing member may be installed between structures coupled to each other in the chamber.

[0004] The sealing member seals the gaps between the structures and prevents process gas from flowing out of the chamber or external air from flowing into the chamber. However, high-pressure gas in the chamber flows into the installation groove where the sealing member is installed, causing a pressure difference between the inside and outside of the installation groove when the chamber is opened. This pressure difference applies force to the sealing member, causing it to lift up or detach from the installation groove. If the sealing member detaches from its original position, it may cause a problem with the airtightness of the chamber.

[0005] The above-mentioned background art is technical information that the inventor possesses for the purpose of deriving embodiments of the present invention or that he / she acquired in the process of deriving the embodiments, and is not necessarily publicly known art that was made public to the general public prior to the filing of this application. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a high-pressure substrate processing apparatus that prevents a structure for maintaining airtightness of the chamber from floating up due to gas pressure when the chamber is opened.

[0007] Another object of the present invention is to provide a high pressure substrate processing apparatus in which the airtightness of the chamber is maintained perfectly. [Means for solving the problem]

[0008] According to one aspect of the present invention, there is provided a high-pressure substrate processing apparatus comprising: an inner chamber configured to accommodate a substrate to be processed and a reactive gas that forms a first pressure higher than atmospheric pressure; an outer housing that accommodates the inner chamber; and an outer door that, together with the outer housing and the inner chamber, defines a protective space for accommodating a protective gas that forms a second pressure set relative to the first pressure, wherein one of the outer housing and the outer door has a mounting groove formed in a corresponding surface facing the other of the outer housing and the outer door; and a sealing unit including a first crimping portion positioned to be crimped against the other one of the outer housing and the outer door, a second crimping portion positioned to be crimped against a bottom surface of the mounting groove, and a vent channel extending in a direction intersecting the corresponding surface to discharge the protective gas that has flowed into the mounting groove, wherein the vent channel may be located only in an inner region of a crimping line connecting the first crimping portion and the second crimping portion.

[0009] Here, the crimping lines may be arranged along a moving direction of the outer door to open or close the outer housing.

[0010] Here, each of the mounting groove and the sealing unit may have a closed loop shape, and the crimping line may extend continuously along an extension direction of the closed loop to form a crimped closed loop surface.

[0011] Here, the vent channel may be formed to communicate the mounting groove with the protective space when the protective space is closed.

[0012] The protective gas supply device may further include an exhaust module connected to the protective space and configured to exhaust the protective gas, and the protective gas flowing into the mounting groove may be exhausted to the protective space by operation of the exhaust module.

[0013] Here, the bottom of the vent channel may be positioned to be spaced apart from the inner wall surface of the mounting groove when the protective space is closed.

[0014] Here, the sealing unit may include a body having a closed loop shape, and the vent channel may include a groove formed on an inner circumferential surface of the body.

[0015] Here, a plurality of the grooves may be provided and may be arranged at equal intervals along the circumferential direction of the body.

[0016] Here, the mounting groove may have a semi-dovetail shape, and the vent channel may be disposed so as to face an inclined inner wall surface of the mounting groove.

[0017] Here, the outer door may be configured to move relative to the outer housing along a height direction to open and close the protected space, and the cross direction may be the same as the height direction.

[0018] According to another aspect of the present invention, a high-pressure substrate processing apparatus includes: a first casing; a second casing having a mounting groove formed in a corresponding surface facing the first casing and defining, together with the first casing, a process space for accommodating a substrate to be processed and a process gas at a pressure higher than atmospheric pressure; and a sealing unit having a first crimping portion positioned to be crimped against the first casing, a second crimping portion positioned to be crimped against a bottom surface of the mounting groove, and a vent channel extending along a direction intersecting the corresponding surface to discharge the process gas that has flowed into the mounting groove, wherein the vent channel may be positioned only in an inner region of a crimping line connecting the first crimping portion and the second crimping portion.

[0019] Here, the crimping lines may be arranged along a direction in which the second casing is tightly attached to the first casing.

[0020] Here, each of the mounting groove and the sealing unit may have a closed loop shape, and the crimping line may extend continuously along an extension direction of the closed loop to form a crimped closed loop surface.

[0021] Here, the vent channel may be formed to communicate the mounting groove with the processing space when the processing space is closed.

[0022] Here, the sealing unit may include a body having a closed loop shape, and the vent channel may include a groove formed on an inner circumferential surface of the body. [Effects of the Invention]

[0023] In the high-pressure substrate processing apparatus according to the present invention, the sealing unit disposed between the outer housing of the outer chamber accommodating the inner chamber and the outer door includes a vent channel extending in a direction intersecting the corresponding surface to exhaust protective gas that has entered the mounting groove. This prevents the sealing unit from floating up due to high-pressure protective gas remaining in the mounting groove when the outer chamber is opened. Even when the outer chamber is opened or closed and the protective gas pressure fluctuates, the sealing unit remains stably mounted in the mounting groove, thereby achieving complete airtightness of the outer chamber. [Brief explanation of the drawings]

[0024] [Figure 1] 1 is a conceptual diagram of a high-pressure substrate processing apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is a partial cross-sectional view showing an open state of the outer chamber of FIG. 1. [Figure 3] FIG. 3 is a perspective view showing the sealing unit of FIG. 2. [Figure 4] 3 is a partial cross-sectional view showing the outer chamber of FIG. 2 in a closed state. DETAILED DESCRIPTION OF THE INVENTION

[0025] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

[0026] The present invention is not limited to the embodiments disclosed below, but may be modified in various ways and realized in various different forms. However, the present embodiments are provided so that the disclosure of the present invention will be complete and will fully convey the scope of the invention to those skilled in the art. Therefore, the present invention is not limited to the embodiments disclosed below, and should be understood to include all modifications, equivalents, and alternatives within the technical spirit and scope of the present invention, as well as the substitution or addition of the configuration of any one embodiment with the configuration of another embodiment.

[0027] The accompanying drawings are merely for the purpose of facilitating understanding of the embodiments disclosed in this specification, and should not be construed as limiting the technical ideas disclosed in this specification, but should be understood to include all modifications, equivalents, or alternatives included within the idea and technical scope of the present invention. In the drawings, the size and thickness of components may be exaggerated or reduced for ease of understanding, but this should not be interpreted as limiting the scope of protection of the present invention.

[0028] The terms used in this specification are merely used to describe particular implementations or embodiments and are not intended to limit the present invention. Furthermore, singular terms include plural terms unless the context clearly dictates otherwise. In the specification, terms such as "comprises," "consists," and the like are intended to specify the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification. In other words, in the specification, terms such as "comprises," "consists," and the like should be understood not to preclude the possibility of the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0029] Terms including ordinal numbers such as first, second, etc. may be used to describe various components, but the components are not limited by the terms. The terms are used only to distinguish one component from another.

[0030] When a component is referred to as being "coupled / communicating" or "connected" to another component, it should be understood that the component may be directly coupled / communicating or connected to the other component, but that there may be other components in between. Conversely, when a component is referred to as being "directly coupled / communicating" or "directly connected" to another component, it should be understood that there are no other components in between.

[0031] When a component is referred to as being "on top of" or "under" another component, it should be understood that it may not only be located directly on top of the other component, but that there may also be other components in between.

[0032] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by a person of ordinary skill in the art to which this invention pertains. Terms commonly used and predefined should be interpreted as having a meaning consistent with the meaning they have in the context of the relevant art, and should not be interpreted as having an idealized or overly formal meaning unless expressly defined in this application.

[0033] FIG. 1 is a conceptual diagram of a high-pressure substrate processing apparatus according to one embodiment of the present invention.

[0034] Referring to this figure, a high pressure substrate processing apparatus 100 may include an inner chamber 110 , an outer chamber 120 , an air supply module 130 , and an exhaust module 140 .

[0035] The inner chamber 110 forms a processing area for processing a substrate. The inner chamber 110 may be made of a non-metallic material, such as quartz, to reduce the risk of contamination of the substrate in a high-temperature and high-pressure working environment. The temperature of the processing chamber (processing temperature) can reach several hundred to several thousand degrees Celsius by operating a heater unit (not shown) located outside the inner chamber 110. The substrate may be, for example, a semiconductor wafer mounted on a holder. The substrate is not limited to a wafer and may be any other basic structure for fabricating circuits. For example, the substrate may include glass for display manufacturing. The holder may be a boat capable of supporting one or more substrates.

[0036] The outer chamber 120 is disposed to house the inner chamber 110. Unlike the inner chamber 110, the outer chamber 120 may be made of a metal material because it is free from the problem of inducing contamination to the substrate. The outer chamber 120 has a hollow shape with an internal space that houses the inner chamber 110.

[0037] The gas supply module 130 supplies gas to the inner chamber 110 and the outer chamber 120. The gas supply module 130 includes a gas supplier 131 connected to a utility (gas supply facility) in a semiconductor factory. The gas supplier 131 may selectively supply a reactive gas, such as hydrogen gas (H), deuterium gas (D), fluorine gas (F), ammonia gas (NH), chlorine gas (Cl), or nitrogen gas (N), to the inner chamber 110. The gas supplier 131 may also supply a protective gas, such as an inert gas, such as nitrogen gas, to the outer chamber 120. These reactive gases and protective gases are introduced into the inner chamber 110 and the outer chamber 120 via a reactive gas line 133 and a protective gas line 135, respectively. The protective gas introduced into the outer chamber 120 is specifically supplied to the space (protective space) between the outer chamber 120 and the inner chamber 110. The reactive gas and protective gas may be simply referred to as process gases.

[0038] The process gas is supplied to the chambers 110 and 120 to form a pressure (high pressure) higher than atmospheric pressure, for example, several atmospheres to several tens of atmospheres. When the pressure in the inner chamber 110 due to the supply of the reaction gas is a first pressure and the pressure in the outer chamber 120 due to the supply of the protective gas is a second pressure, the pressures can be maintained within a set relationship (range). For example, the second pressure can be set to be substantially the same as or slightly higher than the first pressure. This pressure relationship has the advantage of preventing the reaction gas from leaking from the inner chamber 110 and preventing cracking of the inner chamber 110. The second pressure can also be set slightly lower than the first pressure, and in this case, similar effects to those of the above relationship can be achieved.

[0039] The exhaust module 140 is configured to exhaust the process gas. An exhaust line 141 may be connected to the top of the inner chamber 110 to exhaust the reaction gas from the inner chamber 110. Similarly, an exhaust line 145 may be connected to the outer chamber 120 to exhaust the protective gas from the outer chamber 120. When these exhaust lines 141 and 145 are integrated with each other, the reaction gas is diluted with the protective gas during the exhaust process, thereby reducing its concentration.

[0040] FIG. 2 is a partial cross-sectional view showing the outer chamber of FIG. 1 in an open state.

[0041] Referring to this figure, the outer chamber 120 includes an outer housing 121 and an outer door 125. The outer housing 121 has a hollow space, the lower portion of which is open. The outer door 125 has a shape that closes the open lower portion of the outer housing 121. The outer door 125, together with the outer housing 121 and the inner chamber 110, defines the protected space. The outer door 125 moves downward in a direction, specifically, a height direction (H), to open the protected space (open state, see FIG. 2). The movement direction is a direction in which the outer door 125 moves toward or away from the outer housing 121. As the outer door 125 moves upward in the height direction (H), the outer door 125 is connected to the outer housing 121 via a sealing unit 150, which will be described later. In this case, the protected space is said to be closed (closed state, see FIG. 4). Although the height direction (H) is illustrated as being vertical in the drawings, it is not necessarily limited to being vertical, and in some cases may be in a direction slightly inclined relative to the vertical line.

[0042] For reference, to further explain the internal chamber 110, the internal chamber 110 may also include an internal housing (not shown) and an internal door (not shown). The internal housing and the internal door may be entirely enclosed by an external housing 121 and an external door 125. The internal housing may be attached to the external housing 121. The internal door can open and close the processing chamber by moving in conjunction with the external door 125. Thus, the open state and the closed state can be implemented in substantially the same way for the internal chamber 110 as well as the external chamber 120. The substrate is loaded onto or unloaded from the holder in the open state.

[0043] Referring again to the outer chamber 120, a sealing unit 150 is disposed between the outer housing 121 and the outer door 125. The sealing unit 150 serves to isolate the protective gas in the protected space from the outside air. Although the sealing unit 150 ultimately makes the protected space a closed space, the protected space can also be generally described as being limited by the outer housing 121 and the outer door 125.

[0044] For installation of the sealing unit 150, the outer housing 121 and the outer door 125 may have mating surfaces 122 and 126 that face each other. One mating surface 122 may be the lower surface of the outer housing 121, and the other mating surface 126 may be the upper surface of the outer door 125. The mating surfaces 122 and 126 may be generally parallel to each other. The mating surface 122 of the outer housing 121 may have, for example, a closed loop shape.

[0045] The sealing unit 150 may also have a closed loop shape corresponding to the shape of the corresponding surface 122. Specifically, the sealing unit 150 may be an O-ring having a circular shape. The O-ring may contain silicone or the like to provide shock-absorbing properties, thereby providing airtightness to prevent gas leakage. The O-ring may be received in a mounting groove 127 formed in the corresponding surface 126 of the outer door 125. If the mounting groove is formed in the corresponding surface 122, the O-ring may be installed in the outer housing 121.

[0046] The mounting groove 127 may also have a closed loop shape corresponding to the sealing unit 150. In this embodiment, the cross section of the mounting groove 127 is exemplified as a semi-dovetail shape. As a result, the mounting groove 127 has an inner wall surface 127b that is inclined relative to a bottom surface 127a. The inner wall surface 127b may be a wall surface close to the center of the outer door 125. In alternative embodiments, the mounting groove 127 may have other shapes, such as a dovetail shape or a square shape.

[0047] A portion of the sealing unit 150 may be received in the mounting groove 127, and the remainder may protrude from the corresponding surface 126 in the height direction (H). The lower portion of the sealing unit 150 may contact the bottom surface 127a of the mounting groove 127, and the inner peripheral surface of the sealing unit 150 may contact the inclined inner wall surface 127b. The outer peripheral surface of the sealing unit 150 may also contact the outer wall surface 127c of the mounting groove 127.

[0048] A vent channel 155 may be formed on the inner peripheral surface of the sealing unit 150. The vent channel 155 may be positioned to face the inner wall surface 127b. The vent channel 155 may extend along a cross direction that crosses the corresponding surface 126. The cross direction may be substantially the same as the height direction (H). The cross direction is not limited to a straight line, but may also be a curved line.

[0049] FIG. 3 is a perspective view showing the sealing unit of FIG.

[0050] Referring to this figure, the sealing unit 150 has a body 151 in which the above-mentioned vent channel 155 is formed. The body 151 has a closed loop shape, and may specifically have a circular shape. The body 151 may be made of a material that is airtight and shock-absorbing, such as silicone.

[0051] The vent channel 155 is formed on the inner circumferential surface of the body 151. Specifically, the vent channel 155 may be a groove extending generally along the height direction (H). A plurality of the grooves may be provided. In this case, the plurality of grooves may be arranged at equal intervals along the circumferential direction of the body 151.

[0052] The groove may have a generally semicircular cross section, but is not limited thereto. In alternative embodiments, the groove may have a polygonal cross section, such as a triangular cross section, a square cross section, or a circular cross section. In the case of a circular cross section, the vent channel 155 must be formed through the body 151.

[0053] FIG. 4 is a partial cross-sectional view showing the outer chamber of FIG. 2 in a closed state.

[0054] Referring to this figure (and FIG. 2 ), as the outer door 125 rises in the height direction (H), the sealing unit 150 comes into contact with the outer housing 121. More specifically, the sealing unit 150 may be crimped along the height direction (H). The upper part of the sealing unit 150 is a first crimping portion 152 that is crimped against the corresponding surface 122, and the lower part of the sealing unit 150 is a second crimping portion 153 that is crimped against the bottom surface 127a. As the first crimping portion 152, the second crimping portion 153, and the central portion 156 of the body 151 are crimped, a crimping line (L) connecting the crimping portions 152, 153, and 156 may be formed. As the crimping line (L) is aligned to generally coincide with the movement direction (height direction (H)) of the outer door 125 relative to the outer housing 121, the sealing unit 150 is strongly crimped, thereby firmly maintaining the airtightness of the outer chamber 120 even under high pressure. The crimping line (L) is a concept defined based on the cross section of the sealing unit 150, and can also be defined as a crimped closed loop surface when the overall shape of the sealing unit 150 is taken into consideration. The crimped closed loop surface is a closed surface formed by continuously extending the crimping line along the extension direction of the closed loop. Here, the closed loop is a loop formed by the mounting groove 127 (and the sealing unit 150). The outer peripheral surface of the sealing unit 150 may be a third crimping portion 154 that is crimped against the outer wall surface 127c. The corresponding surfaces 122 and 126 are spaced apart from each other by a small distance, allowing the protective gas to flow between them.

[0055] When the sealing unit 150 is crimped, the outer chamber 120 enters the closed state. The protective space also enters the closed state. In the closed state, the vent channel 155 may be located inside the crimping line (L) connecting the first crimping portion 152 and the second crimping portion 153 (i.e., on the side of the space defined by the body 151 (see FIG. 3) when viewed from the crimping line (L)). The vent channel 155 may connect the mounting groove 127 to the protective space. In the closed state, the protective gas is supplied to the protective space at high pressure. The protective gas can flow into the mounting groove 127 through the passage (P) between the corresponding surfaces 122 and 126 (and the vent channel 155). The protective gas can remain mainly in the space defined by the bottom surface 127a, the inner wall surface 127b, and the sealing unit 150. The protective gas that flows into the mounting groove 127 cannot pass through the crimping line (L) to the outside. The third crimping portion 154 can be an additional line of defense to prevent the protective gas from progressing to the outside.

[0056] After the processing process is completed, the protective gas can be exhausted to the outside of the protective space through exhaust module 140 (see FIG. 1). During this exhaust process, the protective gas that has flowed into mounting groove 127 can be discharged to the protective space, which is connected to mounting groove 127, through vent channel 155. To this end, bottom 155a of vent channel 155 is positioned away from inner wall surface 127b, so that vent channel 155 does not become clogged even in the closed state.

[0057] When the outer door 125 is separated from the outer housing 121 after the exhaust of the protective gas is completed, the sealing unit 150 does not float up from the mounting groove 127. This is because the protective gas that flowed into the mounting groove 127 does not remain in the mounting groove 127, and therefore no force is generated to push up the sealing unit 150.

[0058] In the above embodiment, the sealing unit 150 is applied between the outer housing 121 and the outer door 125, but the present invention is not limited thereto. In an alternative embodiment, the sealing unit may also be applied between the inner housing and the inner door. In this case, the inner housing together with the inner door accommodates the substrate, and the sealing unit may seal the processing chamber accommodating the substrate from the protected space. The inner housing may be referred to as a first casing, and the inner door may be referred to as a second casing.

[0059] In the above embodiment, the high-pressure substrate processing apparatus 100 is described as having dual chambers 110 and 120, but the present invention is not limited to this.

[0060] In an alternative embodiment, the sealing unit may be directly applied to a substrate processing apparatus having a single chamber. The single chamber is formed by combining multiple structures to accommodate the substrate. A process gas for processing the substrate, e.g., a reaction gas, is supplied at high pressure to the space accommodating the substrate. Two of the multiple structures that are combined with each other may be referred to as the first casing and the second casing, since they define a process space in which a process is performed on the substrate. The sealing unit is disposed between the first casing and the second casing. The mounting groove may be formed in the first casing or the second casing.

[0061] In another alternative embodiment, the sealing unit can also be applied to a semi-double chamber. The semi-double chamber may have two housings (an inner housing and an outer housing) and one door. The two housings may be coupled to each other to form a closed space (corresponding to the protected space). The substrate is placed in the space defined by the inner housing and the door, and the reactive gas is injected into the closed space, and the protective gas is injected into the closed space. The door cannot be completely protected by the protective gas and is exposed to the outside. In this respect, the door can correspond to the outer door of a double chamber. The sealing unit may be disposed between the door and the inner housing (or the outer housing).

[0062] The concepts of the first casing and the second casing can be applied not only to the single chamber but also to the outer chamber 120 of the dual chambers 110 and 120. When focusing on the outer chamber 120 in which the sealing unit is installed, the outer housing 121 is considered to be the first casing, and the outer door 125 is considered to be the second casing. The concepts of the first casing and the second casing can also be applied to the semi-dual chamber. In that case, the inner or outer housing is considered to be the first casing, and the door is considered to be the second casing. Although a batch-type processing apparatus is exemplified in this specification, the present invention is not limited thereto. The present invention can also be applied to a single-wafer-type processing apparatus. [Explanation of symbols]

[0063] 100: High-pressure substrate processing equipment 110: Inner chamber 120: External chamber 121: External housing 125:Exterior door 127: Mounting groove 127a: Bottom 127b:Inner wall surface 150: Ceiling unit 151: Body 155: Vent channel

Claims

1. an interior chamber configured to contain a substrate to be processed and a reactant gas that forms a first pressure greater than atmospheric pressure; an outer chamber including an outer housing that accommodates the inner chamber, and an outer door that, together with the outer housing and the inner chamber, defines a protective space for containing a protective gas that forms a second pressure set relative to the first pressure, one of the outer housing and the outer door having a mounting groove formed in a corresponding surface facing the other of the outer housing and the outer door; and a sealing unit including a first crimping portion positioned to be crimped against the other one of the crimping portions, a second crimping portion positioned to be crimped against a bottom surface of the mounting groove, and a vent channel extending along a direction intersecting the corresponding surface to discharge the protective gas that has flowed into the mounting groove; The vent channel is The high-pressure substrate processing apparatus is located only in an inner region of a pressure bonding line connecting the first pressure bonding unit and the second pressure bonding unit.

2. The crimping line is The high pressure substrate processing apparatus according to claim 1 , wherein the outer door is arranged along a moving direction for moving to open and close the outer housing.

3. The mounting groove and the sealing unit each have: It has a closed loop shape, The crimping line is The high pressure substrate processing apparatus according to claim 1 , wherein the closed loop surface is formed by continuously extending along the extension direction of the closed loop.

4. The vent channel is The high-pressure substrate processing apparatus according to claim 1 , wherein the mounting groove is formed so as to communicate with the protective space when the protective space is closed.

5. Further comprising an exhaust module communicating with the protection space and configured to exhaust the protection gas; The protective gas flowing into the mounting groove is The high-pressure substrate processing apparatus according to claim 4 , wherein the exhaust module is activated to exhaust gas into the protective space.

6. The bottom of the vent channel is The high-pressure substrate processing apparatus according to claim 4 , wherein the protective space is positioned so as to be separated from an inner wall surface of the mounting groove when the protective space is closed.

7. The sealing unit comprises: It includes a body in the shape of a closed loop, The vent channel is The high pressure substrate processing apparatus of claim 1 , further comprising a groove formed on an inner circumferential surface of the body.

8. The groove is The high-pressure substrate processing apparatus according to claim 7 , wherein a plurality of the pressure adjusting members are provided and arranged at equal intervals along the circumferential direction of the body.

9. The mounting groove is It has a semi-dovetail shape, The vent channel is The high-pressure substrate processing apparatus according to claim 1 , wherein the mounting groove is disposed so as to face an inclined inner wall surface of the mounting groove.

10. The exterior door is The protective space is configured to move relative to the outer housing along a height direction to open and close the protective space, The cross direction is The high-pressure substrate processing apparatus according to claim 1 , wherein the direction is the same as the height direction.

11. a first casing; a second casing having a mounting groove formed in a corresponding surface facing the first casing, the second casing defining, together with the first casing, a process space for accommodating a substrate to be processed and a process gas having a pressure higher than atmospheric pressure; and a sealing unit including a first crimping portion positioned to be crimped to the first casing, a second crimping portion positioned to be crimped to a bottom surface of the mounting groove, and a vent channel extending in a direction intersecting the corresponding surface to discharge the process gas that has flowed into the mounting groove; The vent channel is The high-pressure substrate processing apparatus is located only in an inner region of a pressure bonding line connecting the first pressure bonding unit and the second pressure bonding unit.

12. The crimping line is The high pressure substrate processing apparatus according to claim 11 , wherein the second casing is arranged along a contact direction in which the second casing is in close contact with the first casing.

13. The mounting groove and the sealing unit each have: It has a closed loop shape, The crimping line is The high pressure substrate processing apparatus according to claim 11 , wherein the pressure-bonded closed loop surface is formed by continuously extending along the extension direction of the closed loop.

14. The vent channel is The high-pressure substrate processing apparatus according to claim 11 , wherein the mounting groove is formed to communicate with the processing space when the processing space is closed.

15. The sealing unit comprises: It includes a body in the shape of a closed loop, The vent channel is The high pressure substrate processing apparatus of claim 11 , further comprising a groove formed on an inner circumferential surface of the body.

Images