Semiconductor module and power electronics device

Abstract

To reduce deformation of a heat dissipation base caused by a thermal change.SOLUTION: A semiconductor module comprises: insulation circuit boards 20a-20d; and a heat dissipation base 30 which includes a top face 31e, where the insulation circuit boards 20a-20d are disposed, and in which fastening holes 31g penetrating in a thickness direction are formed in the corners of the top face 31e. The heat dissipation base 30 includes a pair of stationary parts 32a and 32b, in which fixing holes 32a1 and 32b1 penetrate in the thickness direction, respectively provided from central parts of a pair of opposed side faces 31b and 31d (first edge sides) toward the outside with respect to the pair of side faces 31b and 31d (first edge sides) in a length direction of the top face in a planar view. In such a semiconductor module, the stationary parts 32a and 32b of the pair of side faces 31b and 31d (first edge sides) are fixed to a top face of a cooling module together with the fastening holes 31g in the four corners of the heat dissipation base 30.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a semiconductor module and a power electronics device. [Background technology]

[0002] A semiconductor module includes a semiconductor chip (power device), an insulating circuit board on which the semiconductor chip is arranged, and a heat sink on which a plurality of the insulating circuit boards are arranged (see, for example, Patent Documents 1 to 8). In addition, a plurality of such semiconductor modules may be mounted in parallel on a heat sink base (see, for example, Patent Documents 1, 2, 6, and 8). In this case, the semiconductor modules are mounted on the heat sink base via a bonding member (for example, thermal grease, solder, or adhesive) (see, for example, Patent Documents 1 and 6). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-004880 [Patent Document 2] Japanese Patent Application Laid-Open No. 2004-319992 [Patent Document 3] Japanese Patent Application Laid-Open No. 2007-059902 [Patent Document 4] Japanese Patent Application Publication No. 04-229502 [Patent Document 5] Japanese Patent Application Laid-Open No. 2012-043915 [Patent Document 6] Patent No. 7258269 [Patent Document 7] Japanese Patent Publication No. 2023-085765 [Patent Document 8] International Publication No. 2013 / 145619 Summary of the Invention [Problem to be solved by the invention]

[0004] An object of the present invention is to provide a semiconductor module in which deformation of a heat dissipation base due to thermal changes is reduced, and a power electronics device including such a semiconductor module. [Means for solving the problem]

[0005] According to one aspect of the invention, there is provided a semiconductor module comprising: a plurality of insulated circuit boards; and a heat dissipation base including an upper surface on which the plurality of insulated circuit boards are arranged, the heat dissipation base having fastening holes formed at each corner of the upper surface, the fastening holes penetrating in the thickness direction, the heat dissipation base further including a pair of fixing portions, the fixing holes penetrating in the thickness direction, provided from the centers of a pair of opposing first edges extending along the longitudinal direction of the upper surface toward the outside of the pair of first edges in a plan view.

[0006] According to another aspect of the invention, there is provided a power electronics device including a cooling module having a top surface in which a plurality of the semiconductor modules are adjacent to each other, one first edge of each of the adjacent semiconductor modules is arranged opposite the other first edge, and each of the semiconductor modules is fixed by a fixing member through the fastening holes, and the adjacent semiconductor modules are fixed to the top surface of the cooling module by the fixing member through an opening formed by combining the concave fixing hole of one of the first edges with the concave fixing hole of the opposing other first edge.

[0007] According to another aspect of the invention, there is provided a power electronics device including a cooling module having a top surface in which a plurality of the semiconductor modules are adjacent to each other, one first edge of each of the adjacent semiconductor modules is arranged opposite the other first edge, and each of the semiconductor modules is fixed by a fixing member through the fastening holes, wherein the fixing portion of one first edge of each of the adjacent semiconductor modules is alternately fitted to the fixing portion of the other first edge of each of the adjacent semiconductor modules, and the adjacent semiconductor modules are fixed to the top surface of the cooling module by the fixing member through the respective fixing holes. [Effects of the Invention]

[0008] According to the disclosed technology, deformation of the heat dissipation base due to thermal changes can be reduced. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view of a semiconductor module according to a first embodiment. [Figure 2] FIG. 1 is a side view of a semiconductor module according to a first embodiment. [Figure 3] 1 is a side cross-sectional view of a semiconductor module according to a first embodiment. [Figure 4] 2 is a plan view of a heat dissipation base on which an insulating circuit board is arranged, which is included in the semiconductor module of the first embodiment. FIG. [Figure 5] FIG. 2 is a side view of the semiconductor module attached to the cooling module of the first embodiment. [Figure 6] FIG. 10 is a side view of a semiconductor module (at room temperature) attached to a cooling module of a reference example. [Figure 7] FIG. 10 is a side view of a semiconductor module (at high temperature) attached to a cooling module of a reference example. [Figure 8] 1 is a plan view of a power electronics device including a semiconductor module according to a first embodiment. [Figure 9] FIG. 10 is a plan view of a semiconductor module according to a second embodiment. [Figure 10] FIG. 10 is a plan view of a semiconductor module according to a third embodiment. [Figure 11] FIG. 10 is a plan view of a power electronics device including a semiconductor module according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described with reference to the drawings. In the following description, the terms "front surface" and "top surface" refer to the XY plane facing upward (+Z direction) in the semiconductor module and power electronics device shown in the drawings. Similarly, "top" refers to the upward (+Z direction) direction in the semiconductor module shown in the drawings. The terms "back surface" and "bottom surface" refer to the XY plane facing downward (-Z direction) in the semiconductor module and power electronics device shown in the drawings. Similarly, "bottom" refers to the downward (-Z direction) direction in the semiconductor module and power electronics device shown in the drawings. Similar orientations will be used in other drawings as necessary. The terms "front surface," "top surface," "top," "back surface," "bottom surface," "bottom," and "side surface" are merely convenient expressions for specifying relative positional relationships and do not limit the technical concept of the present invention. For example, "top" and "bottom" do not necessarily refer to the vertical direction relative to the ground. In other words, the "top" and "bottom" directions are not limited to the direction of gravity. In the following description, the term "main component" refers to a component containing 80 vol% or more of a component.

[0011] [First embodiment] A semiconductor module 10 according to a first embodiment will be described with reference to FIGS. 1 to 3. FIG. 1 is a plan view of the semiconductor module according to the first embodiment. FIG. 2 is a side view of the semiconductor module according to the first embodiment. FIG. 3 is a cross-sectional side view of the semiconductor module according to the first embodiment. Note that FIG. 3 is a cross-sectional view taken along dashed line II in FIG. 1. Wires are not shown in FIG. 3.

[0012] The semiconductor module 10 includes a heat dissipation base 30 disposed on the back surface thereof, and a case 40 disposed on the heat dissipation base 30 and covering the sides thereof. The semiconductor module 10 also includes a storage area 41g surrounded by the heat dissipation base 30 and the case 40, and the components within the storage area 41g are sealed with a sealing member 47. The storage area 41g contains components such as an insulating circuit board, a semiconductor chip disposed on the insulating circuit board, and wires connecting these components. FIG. 3 shows insulating circuit boards 20a and 20b and a semiconductor chip 24 as parts of the insulating circuit board. The semiconductor module 10 also includes external connection terminals 43 to 45.

[0013] The heat dissipation base 30 is a plate-like member in a plan view. The outer shape of the heat dissipation base 30 may correspond to the outer shape of the case 40, except for fixing portions 32a and 32b, which will be described later. The corners of the heat dissipation base 30 may be round-chamfered or C-chamfered. The heat dissipation base 30 is formed from a metal with excellent heat dissipation properties. Such metals include, for example, copper, aluminum, or an alloy containing at least one of these. The surface of the heat dissipation base 30 may be plated to improve corrosion resistance. Examples of plating materials used in this case include nickel, nickel-phosphorus alloy, and nickel-boron alloy. Details of the heat dissipation base 30 will be described later.

[0014] Insulated circuit boards 20a-20d and insulated circuit boards 20e and 20f (see FIG. 4) are bonded to the upper surface of heat dissipation base 30 via bonding members (not shown). Furthermore, semiconductor chips 24 are bonded to insulated circuit boards 20a-20d via bonding members. Each of insulated circuit boards 20a-20d includes an insulating plate 21, a metal plate 22 formed on the back surface of insulating plate 21, and a conductive circuit pattern 23 formed on the front surface of insulating plate 21. Insulated circuit boards 20e and 20f (secondary insulating circuit boards) are similarly configured.

[0015] The joining member is, for example, solder. Lead-free solder is used as the solder. Lead-free solder mainly contains at least one of the following alloys: a tin-silver-copper alloy, a tin-zinc-bismuth alloy, a tin-copper alloy, and a tin-silver-indium-bismuth alloy. Furthermore, the solder may contain additives. Examples of additives include nickel, germanium, cobalt, antimony, and silicon. The addition of additives to the solder improves its wettability, gloss, and bonding strength, thereby improving reliability. The joining member may be a sintered body. When joining using a sintered body, the sintered material is, for example, a powder of silver, iron, copper, aluminum, titanium, nickel, tungsten, or molybdenum.

[0016] The insulating plate 21 has a rectangular shape in a plan view. The corners of the insulating plate 21 may be rounded or chamfered. The insulating plate is made of ceramics with high thermal conductivity. Such ceramics are made of a material containing aluminum oxide, silicon nitride, or aluminum nitride as a main component, for example.

[0017] The metal plate 22 is formed mainly from a metal with excellent thermal conductivity. Such metals are, for example, copper, aluminum, or an alloy containing at least one of these. To improve the corrosion resistance of the metal plate, a plating process may be performed. In this case, the plating material used is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy.

[0018] The conductive circuit pattern 23 is formed from a metal with excellent conductivity. Such metals include, for example, copper, aluminum, or an alloy containing at least one of these. The surface of the circuit pattern may be plated to improve corrosion resistance. Examples of plating materials used in this case include nickel, nickel-phosphorus alloy, and nickel-boron alloy. Furthermore, semiconductor chips and external connection terminals 43 to 45 are mechanically and electrically connected to the conductive circuit pattern 23 as appropriate. The conductive circuit pattern 23 may have a shape and may include multiple shapes to realize a desired circuit.

[0019] Insulated circuit boards 20a-20f having such components may be, for example, DCB (Direct Copper Bonding) boards or AMB (Active Metal Brazed) boards. The conductive circuit patterns 23 of the insulated circuit boards 20a-20d may be bonded to the semiconductor chips 24, and the conductive circuit patterns 23 of the insulated circuit boards 20a-20d may be bonded to the external connection terminals 43-45 using the bonding materials already described.

[0020] Furthermore, for insulating circuit boards 20a-20d on which semiconductor chips 24 are mounted, wiring members may be used to mechanically and electrically connect between the main electrodes of semiconductor chip 24, between the main electrodes of semiconductor chip 24 and conductive circuit patterns 23, and between the multiple conductive circuit patterns 23. Examples of wiring members include wires and lead frames. Wires and lead frames are made of materials with excellent conductivity. Examples of such materials include gold, silver, copper, aluminum, and alloys containing at least one of these.

[0021] The semiconductor chip 24 may be a power MOSFET (Metal Oxide Semiconductor Field Effect Transistor) mainly composed of silicon carbide. The body diode of the power MOSFET may function as a FWD (Free Wheeling Diode). Such a semiconductor chip 24 has an input electrode (drain electrode) as a main electrode on the back surface, and an output electrode (source electrode) and a control electrode (gate electrode) as main electrodes on the front surface. The control electrode may be provided at the center of one side of the front surface of the semiconductor chip 24 or offset from the center along the side.

[0022] The semiconductor chip 24 may also include a switching element primarily made of silicon. The switching element may be, for example, an RC (Reverse-Conducting)-IGBT (Insulated Gate Bipolar Transistor). An RC-IGBT is a semiconductor element in which an IGBT and an FWD are arranged in anti-parallel within a single chip. Such a semiconductor chip 24 has an input electrode (collector electrode) as a main electrode on its back surface, and an output electrode (emitter electrode) and a control electrode (gate electrode) as main electrodes on its front surface. Note that the control electrode may be provided at the center of one side of the front surface of the semiconductor chip 24 or offset from the center along the side, as in the case of a power MOSFET.

[0023] Alternatively, the semiconductor chip 24 may be a semiconductor chip mainly composed of silicon and including a pair of a switching element and a diode element. Specifically, one semiconductor chip may be a switching element and the other semiconductor chip may be a diode element. The switching element may be, for example, a power MOSFET or an IGBT. The semiconductor chip including the switching element has, for example, an input electrode (a drain electrode in a power MOSFET or a collector electrode in an IGBT) as a main electrode on the back surface, and a gate electrode (a control electrode) and an output electrode (a source electrode in a power MOSFET or an emitter electrode in an IGBT) as a main electrode on the front surface. The diode element may be, for example, an SBD (Schottky Barrier Diode) or a PiN (P-intrinsic-N) diode as a FWD. The semiconductor chip including the diode element has, for example, an output electrode (a cathode electrode) as a main electrode on the back surface, and an input electrode (anode electrode) as a main electrode on the front surface.

[0024] The case 40 includes a frame portion 41, a lid portion 42 that covers the upper part of the frame portion 41, and external connection terminals 43 to 45. The frame portion 41 has a generally rectangular outer shape in a plan view, forming a frame shape. A storage area 41g is formed through the center of the frame portion 41. The frame portion 41 includes side walls 41a to 41d that surround the storage area 41g on all four sides. The side walls 41a and 41c correspond to the short sides, and the side walls 41b and 41d correspond to the long sides. A bottom surface 41f of the frame portion 41 is joined to the outer edge of the top surface of the heat dissipation base 30 with an adhesive or the like.

[0025] The external connection terminals 43 to 45 electrically connect the conductive circuit pattern 23 to an external device (not shown). The external connection terminals 43 to 45 are formed of a flat conductive material. A portion of the external connection terminals 44 and 45 is integrally held by a terminal holding portion 46.

[0026] One end of the external connection terminal 43 is exposed on the upper surface 41e of the frame portion 41 of the case 40 and forms an external connection portion 43a for connecting to an external device. The external connection terminal 43 also includes horizontal portions 43b and 43c, in this order, from the external connection portion 43a toward the other end. The horizontal portions 43b and 43c are horizontal with the bottom surface of the storage area 41g, with the horizontal portion 43b being lower than the external connection portion 43a, and the horizontal portion 43c being lower than the horizontal portion 43b. The external connection portion 43a and the horizontal portions 43b and 43c are formed, for example, by bending the flat external connection terminal 43, and the external connection portion 43a and the horizontal portion 43b, and the horizontal portion 43b and the horizontal portion 43c are both connected by connecting portions extending vertically.

[0027] External connection portion 43a is divided into three portions in the horizontal direction (Y direction). Furthermore, a connection portion (reference numeral omitted) extending downward is formed at the end of horizontal portion 43c. The connection portions are electrically and mechanically connected to conductive circuit patterns 23 of insulating circuit boards 20b and 20c via solder. This connection may be made directly by, for example, laser welding or ultrasonic bonding.

[0028] One end of the external connection terminal 44 is exposed at the top of the lid 42 of the case 40 and forms an external connection portion 44a for connection to an external device (not shown). The external connection terminal 44 includes a horizontal portion 44b extending from the external connection portion 44a toward the other end. The horizontal portion 44b is horizontal with the bottom surface of the storage area 41g, and is lower in height than the external connection portion 44a. The external connection portion 44a and the horizontal portion 44b are formed by bending the flat external connection terminal 44, and the external connection portion 44a and the horizontal portion 44b are connected by a connecting portion (reference numeral omitted) extending vertically.

[0029] Furthermore, external connection portion 44a is divided into two portions in the horizontal direction (Y direction). A connection portion (reference numeral omitted) extending downward is formed at the end of horizontal portion 44b. The connection portions are electrically and mechanically connected to conductive circuit patterns 23 of insulating circuit boards 20a and 20d via solder. Alternatively, they may be directly connected by, for example, laser welding or ultrasonic welding.

[0030] One end of the external connection terminal 45 is exposed on the upper surface 41e of the frame portion 41 of the case 40 and forms an external connection portion 45a for connecting to an external device (not shown). The external connection terminal 45 also includes horizontal portions 45b and 45c, in this order, from the external connection portion 45a toward the other end. The horizontal portions 45b and 45c are horizontal with the bottom surface of the storage area 41g, with the horizontal portion 45b being lower than the external connection portion 45a, and the horizontal portion 45c being lower than the horizontal portion 45b. The external connection portion 45a and the horizontal portions 45b and 45c are formed by bending the flat external connection terminal 45, and the external connection portion 45a and the horizontal portion 45b, and the horizontal portion 45b and the horizontal portion 45c are both connected by connecting portions (reference numerals omitted) extending vertically.

[0031] External connection portion 45a is divided into two parts in the horizontal direction (Y direction). A connection portion (reference numeral omitted) extending downward is formed at the end of horizontal portion 45c. The connection portions are electrically and mechanically connected to conductive circuit patterns 23 of insulating circuit boards 20b and 20c via solder. Alternatively, they may be directly connected by, for example, laser welding or ultrasonic welding.

[0032] The terminal holding portion 46 seals the connecting portion that connects the external connection portion 44a and the horizontal portion 44b of the external connection terminal 44, the connecting portions that connect the external connection portion 45a and the horizontal portions 45b and 45c of the external connection terminal 45, and the horizontal portion 45b. This maintains insulation even when the external connection terminals 44 and 45 are arranged close to each other. The terminal holding portion 46 may be made of the same material as the case 40.

[0033] Although not shown, a control terminal may be provided. One end of the control terminal is also exposed from the case 40 or the lid 42 of the case 40, and the other end is disposed within the storage area 41g. The other end of the control terminal is electrically connected to the control electrode of the semiconductor chip 24 via the insulating circuit boards 20e, 20f. The other end of the control terminal is electrically and mechanically connected to the conductive circuit pattern (not shown) of the insulating circuit boards 20e, 20f via solder. Alternatively, the control terminal may be directly connected by, for example, laser welding or ultrasonic welding. The insulating circuit boards 20e, 20f may be mechanically and electrically connected to the control electrode of the semiconductor chip 24 by a control wire.

[0034] The horizontal portions 43c of the external connection terminals 43, 44b of the external connection terminals 44, and 45c of the external connection terminals 45 are disposed at positions lower than the upper surface 47a of the sealing member 47 and are sealed by the sealing member 47. The horizontal portions 44b of the external connection terminals 44 and 45c of the external connection terminals 45 may be covered with a resin made of a different material from that of the sealing member 47. In this case, the upper surface 47a of the sealing member 47 may be located lower than the horizontal portions 45c of the external connection terminals 45. The upper surface 47a of the sealing member 47 may also be located lower than the horizontal portions 43c of the external connection terminals 43.

[0035] Case 40 may be integrally molded by insert molding, with frame 41 made of thermoplastic resin and including external connection terminals 43 to 45. Lid 42 is also molded in a similar manner. Examples of such resins include polyphenylene sulfide resin, polybutylene terephthalate resin, polybutylene succinate resin, polyamide resin, and acrylonitrile butadiene styrene resin.

[0036] A storage area 41g surrounded by the heat dissipation base 30 and the frame portion 41 of the case 40 is filled with a sealing member 47. The insulating circuit boards 20a to 20f, the semiconductor chip 24, the wiring members, and other components arranged in the storage area 41g are sealed with the sealing member 47. The sealing member 47 is an insulating polymer gel, and preferably contains silicone gel as its main component.

[0037] Next, heat dissipation base 30 having insulating circuit boards 20a-20f arranged on upper surface 31e will be described with reference to Fig. 4. Fig. 4 is a plan view of the heat dissipation base included in the semiconductor module of the first embodiment, on which insulating circuit boards are arranged. Fig. 4 is a plan view of heat dissipation base 30 on which insulating circuit boards 20a-20e are arranged, excluding case 40, sealing member 47, wires, etc. in Fig. 1.

[0038] 4, insulating circuit boards 20a-20f are shown in a simplified form. As described above, insulating circuit boards 20a-20d are rectangular in plan view. Insulated circuit boards 20a-20d each include side surfaces 20a1-20a4, 20b1-20b4, 20c1-20c4, and 20d1-20d4 surrounding the board on all four sides. Side surfaces 20a1, 20a3, 20b1, 20b3, 20c1, 20c3, 20d1, and 20d3 correspond to the short sides. Side surfaces 20a2, 20a4, 20b2, 20b4, 20c2, 20c4, 20d2, and 20d4 correspond to the long sides.

[0039] The heat dissipation base 30 includes a heat dissipation plate 31 and fixing portions 32a and 32b. The heat dissipation plate 31 and fixing portions 32a and 32b may be integrally connected and may be formed primarily from the metals described above. The heat dissipation base 30 may have a uniform thickness overall, including the heat dissipation plate 31 and fixing portions 32a and 32b. Alternatively, the thickness of the fixing portions 32a and 32b may be thinner than the thickness of the heat dissipation plate 31.

[0040] The heat sink 31 has a rectangular shape in a plan view. The heat sink 31 includes a rectangular upper surface 31e and a lower surface 31f (see FIGS. 2 and 3) opposite the upper surface 31e. The heat sink 31 further includes side surfaces 31a to 31d that surround the upper surface 31e and the lower surface 31f on all four sides. The side surfaces 31a and 31c correspond to the second edge, and the side surfaces 31b and 31d correspond to the first edge. The length of the side surfaces 31a and 31c (second edge) of the heat sink 31 is defined as Ly, and the length of the side surfaces 31b and 31d (first edge) is defined as Lx. The length Ly may be approximately 1.0 cm, and the length Lx may be approximately 1.4 cm.

[0041] The four corners of the heat sink 31 are respectively formed by side surfaces 31a and 31b, side surfaces 31b and 31c, side surfaces 31c and 31d, and side surfaces 31d and 31a. These corners of the heat sink 31 may be round-chamfered or C-chamfered. The heat sink 31 has fastening holes 31g formed at each of the four corners, penetrating the upper surface 31e and the lower surface 31f in the thickness direction (±Z direction). The four fastening holes 31g are located on the upper surface 31e of the heat sink 31 within a distance Gx (described later) from the side surfaces 31a and 31c, and overlap with a distance Gy (described later) from the side surfaces 31b and 31d.

[0042] Center lines Cx and Cy are set on the top surface 31e. The center line Cx is parallel to the side surfaces 31a and 31c (a pair of second edges) and passes through the centers of the side surfaces 31b and 31d (a pair of first edges). The center line Cy is parallel to the side surfaces 31b and 31d (a pair of first edges) and passes through the centers of the side surfaces 31a and 31c (a pair of second edges).

[0043] As described above, insulating circuit boards 20a to 20f are respectively arranged on upper surface 31e of heat sink 31. Insulating circuit boards 20a to 20d are respectively arranged in two rows and two columns on upper surface 31e of heat sink 31, with center lines Cx and Cy sandwiched between them.

[0044] Insulated circuit boards 20a and 20b are arranged with side surfaces 20a3 and 20b1 facing each other at an equal distance across center line Cx. Side surfaces 20a2 and 20b2 of insulating circuit boards 20a and 20b are located outside (in the +Y direction) a line connecting the centers of a pair of fastening holes 31g formed on side surface 31b of heat sink 31. The shortest distance from side surfaces 20a2 and 20b2 of insulating circuit boards 20a and 20b to side surface 31b of heat sink 31 is distance Gy. However, the pair of fastening holes 31g formed on side surface 31b of heat sink 31 are located closer to side surface 31b of heat sink 31 than are side surfaces 20a2 and 20b2 of insulating circuit boards 20a and 20b. That is, the side surfaces 20a2 and 20b2 of the insulating circuit boards 20a and 20b are located outside (in the +Y direction) the line connecting the centers of a pair of fastening holes 31g formed on the side surface 31b of the heat sink 31, but are not located outside (in the +Y direction) the pair of fastening holes 31g.

[0045] Insulated circuit boards 20d and 20c are arranged with side surfaces 20d3 and 20c1 facing each other at an equal distance across center line Cx. Side surfaces 20d4 and 20c4 of insulating circuit boards 20d and 20c are located outside (in the -Y direction) a line connecting the centers of a pair of fastening holes 31g formed on side surface 31d of heat sink 31. The shortest distance from side surfaces 20d2 and 20c4 of insulating circuit boards 20d and 20c to side surface 31d of heat sink 31 is also distance Gy. However, the pair of fastening holes 31g formed on side surface 31d of heat sink 31 are located closer to side surface 31d of heat sink 31 than side surfaces 20d4 and 20c4 of insulating circuit boards 20d and 20c. That is, side surfaces 20d4 and 20c4 of insulating circuit boards 20d and 20c are located outside (in the -Y direction) a line connecting the centers of a pair of fastening holes 31g formed on side surface 31d of heat dissipation plate 31, but are not located outside (in the -Y direction) the pair of fastening holes 31g. Distance Gy from these sides 31b and 31d of heat dissipation base 30 may be, for example, 5% or more and 15% or less of length Ly.

[0046] Insulated circuit boards 20a and 20d are arranged with side surfaces 20a4 and 20d2 facing each other at an equal distance across center line Cy. The shortest distance from side surfaces 20a1 and 20d1 of insulating circuit boards 20a and 20d to side surface 31a of heat sink 31 is distance Gx. Insulated circuit boards 20b and 20c are arranged with side surfaces 20b4 and 20c2 facing each other at an equal distance across center line Cy. The shortest distance from side surfaces 20b3 and 20c3 of insulating circuit boards 20b and 20c to side surface 31c of heat sink 31 is also distance Gx. The distance Gx from side surfaces 31a and 31c of heat sink base 30 may be, for example, 15% or more and 20% or less of length Lx.

[0047] Furthermore, the distance Gy from the side surfaces 31b and 31d of the heat dissipation base 30 is smaller than the distance Gx from the side surfaces 31a and 31c of the heat dissipation base 30. The gaps between the insulating circuit boards 20a to 20d need only be large enough to maintain insulation.

[0048] Furthermore, insulating circuit board 20e is provided between fastening holes 31g on the side surface 31a side of upper surface 31e of heat sink 31. Insulating circuit board 20f is provided between fastening holes 31g on the side surface 31c side of upper surface 31e of heat sink 31. A center line Cy passes through the centers of insulating circuit boards 20e and 20f.

[0049] The fixing portions 32a and 32b are provided at the center of the side surfaces 31b and 31d (first edges) of the heat sink 31, respectively, facing outward. In the first embodiment, the fixing portions 32a and 32b are provided at the center of the center line Cx of the side surfaces 31b and 31d. The center of the side surfaces 31b and 31d does not necessarily have to be the center of the center line Cx of the side surfaces 31b and 31d (first edges), but may include a certain width. For example, the center may have a width of 30% to 70% of the length Lx.

[0050] Fixing holes 32a1, 32b1 penetrate the fixing portions 32a, 32b in the thickness direction of the heat sink 31. Here, the fixing holes 32a1, 32b1 are each formed in a concave shape recessed toward the pair of side surfaces 31b, 31d (first edges) in plan view. The concave fixing holes 32a1, 32b1 may be line-symmetrical with respect to the center line Cx. Furthermore, the fixing holes 32a1, 32b1 are not limited to being concave, and may be circular opening holes in plan view. In this case, too, they may be line-symmetrical with respect to the center line Cx. Furthermore, the outer corners of the fixing portions 32a, 32b may be tapered.

[0051] That is, the heat dissipation base 30, which integrally includes the heat dissipation plate 31 and the fixing portions 32a, 32b, includes a pair of opposing side surfaces 31b, 31d (first edges) along the longitudinal direction of the upper surface 31e and the lower surface 31f, and a pair of opposing side surfaces 31a, 31b (second edges) along the lateral direction of the upper surface 31e and the lower surface 31f, and further includes fixing portions 32a, 32b extending outward from the pair of side surfaces 31b, 31d.

[0052] Next, the attachment of the semiconductor module 10 including such a heat dissipation base 30 to the cooling module will be described with reference to FIG. 5. FIG. 5 is a side view of the semiconductor module attached to the cooling module of the first embodiment. Note that FIG. 5 does not show the case 40 of the semiconductor module 10 shown in FIG. 1 that is provided for the cooling module 50. Therefore, FIG. 5 shows a case in which the heat dissipation base 30 provided with the insulating circuit boards 20a to 20d is attached to the cooling module 50. FIG. 5 also shows the semiconductor module 10 of FIG. 1 attached to the cooling module 50 as viewed in the +Y direction.

[0053] The cooling module 50 has an upper surface 51 on which the lower surface 31f of the heat dissipation base 30 of the semiconductor module 10 is placed. The upper surface 51 is wider than the lower surface of the lower surface 31f of the heat dissipation base 30 (including the fixing portions 32a and 32b) and is substantially flat. The cooling module 50 may be, for example, a radiator equipped with heat dissipation fins or a cooling device in which a refrigerant circulates inside.

[0054] The heat dissipation base 30 of the semiconductor module 10 is disposed on the upper surface 51 of the cooling module 50. Warping occurs in the heat dissipation base 30 due to thermal changes during the manufacturing process of the semiconductor module 10. Furthermore, screws 33 (fixing members) inserted through four fastening holes 31g and fixing holes 32a1, 32b1 (two fastening holes 31g and fixing hole 32b1 are shown in FIG. 5 ) are fastened (fixed) to the upper surface 51 of the cooling module 50, and such heat dissipation base 30 is attached to the upper surface 51 of the cooling module 50.

[0055] The lower surface 31f of the heat dissipation base 30 is disposed on the upper surface 51 of the cooling module 50 via a bonding member (not shown). The bonding member may be, for example, a thermal interface material (hereinafter, referred to as TIM). The TIM includes various materials such as thermally conductive grease, elastomer sheet, RTV (Room Temperature Vulcanization) rubber, gel, and phase change material.

[0056] Here, a reference example of the semiconductor module 10 (heat dissipation base 30) of the first embodiment will be described. The heat dissipation base 300 included in the semiconductor module of the reference example (illustration omitted) is the heat dissipation base 30 of the first embodiment without the fixing portions 32a and 32b. A semiconductor module 10 including such a heat dissipation base 300 and attached to a cooling module 50 will be described with reference to FIGS. 6 and 7. FIG. 6 is a side view of the semiconductor module (at room temperature) attached to the cooling module of the reference example. FIG. 7 is a side view of the semiconductor module (at high temperature) attached to the cooling module of the reference example.

[0057] 6 and 7 correspond to FIG. 5 and show the semiconductor module of the reference example as viewed in the +Y direction. Also, the case 40 is omitted from FIG. 6 and 7. Therefore, FIG. 6 and 7 show a case in which a heat dissipation base 300 on which insulating circuit boards 20a to 20f are provided is attached to a cooling module 50.

[0058] The heat dissipation base 300 of the semiconductor module of the reference example is also disposed on the upper surface 51 of the cooling module 50 via a bonding member (not shown). As described above, the heat dissipation base 300 is warped. Furthermore, screws 33 inserted through four fastening holes 31g (two fastening holes 31g are shown in FIGS. 6 and 7) are fastened to the upper surface 51 of the cooling module 50, and the heat dissipation base 300 is attached to the upper surface 51 of the cooling module 50. In this way, at room temperature when the semiconductor module of the reference example is not in operation, as shown in FIG. 6, the heat dissipation base 300 maintains the warpage it had immediately after the semiconductor module was manufactured.

[0059] Next, the semiconductor module attached to the cooling module 50 shown in Fig. 6 is operated. The semiconductor module of the reference example generates heat in response to operation and is cooled by the cooling module 50. When the semiconductor module 10 repeats such thermal changes, warping occurs in the heat dissipation base 300 (heat dissipation plate 31).

[0060] The heat dissipation base 300 is fixed to the upper surface 51 of the cooling module 50 via fastening holes 31g at its four corners. Furthermore, due to the difference in thermal expansion coefficient between the heat dissipation base 300 and the insulating circuit boards 20a to 20f, the heat dissipation base 300 tends to warp upward, as shown in FIG. 7 . When the heat dissipation plate 31 warps upward, a gap is created between the lower surface 31f of the heat dissipation plate 31 and the upper surface 51 of the cooling module 50. This causes the bonding material to leak out of the heat dissipation base 300 through this gap. This reduces the thermal conductivity of the heat dissipation base 300 to the cooling module 50.

[0061] Furthermore, if the heat dissipation base 300 is warped upward, the central portions of the insulating circuit boards 20a to 20d (insulating circuit boards 20d and 20c are shown in FIG. 7) joined to the upper surface 31e of the heat dissipation base 300 will peel off from the upper surface 31e of the heat dissipation base 300 in a plan view. This reduces the thermal conductivity of the insulating circuit boards 20a to 20d to the heat dissipation base 300.

[0062] On the other hand, in order to improve heat dissipation, it is possible to expand the heat dissipation base 300. However, in this case, it is not possible to miniaturize the semiconductor module. In particular, in the semiconductor module of the reference example, the insulating circuit boards 20a to 20f are arranged in a limited area on the upper surface 31e of the heat dissipation base 300 without expanding the upper surface 31e of the heat dissipation base 300. In the semiconductor module of the reference example, warping reduces heat dissipation, making it more susceptible to failure and reducing reliability.

[0063] Meanwhile, the semiconductor module 10 of the first embodiment includes a plurality of insulating circuit boards 20a-20f and a heat dissipation base 30 that includes an upper surface 31e on which the plurality of insulating circuit boards 20a-20f are arranged and that has fastening holes 31g formed at the corners of the upper surface 31e, penetrating the thickness direction. The heat dissipation base 30 further includes a pair of fixing portions 32a, 32b that are provided with fixing holes 32a1, 32b1 penetrating the thickness direction and that are respectively provided from the center of a pair of opposing side surfaces 31b, 31d (first edges) extending outward from the pair of side surfaces 31b, 31d (first edges) along the longitudinal direction of the upper surface 31e in a plan view. In this semiconductor module 10, the fixing holes 31g at the four corners of the heat dissipation base 30 and the fixing portions 32a, 32b at the pair of side surfaces 31b, 31d (first edges) are fixed to the upper surface 51 of the cooling module 50. This prevents the heat dissipation base 30 from warping upward, thereby preventing the bonding material from leaking out from between the heat dissipation base 30 and the upper surface 51 of the cooling module 50, and further prevents the insulating circuit boards 20a to 20f from peeling off from the heat dissipation base 30. As a result, the semiconductor module 10 is prevented from suffering a decrease in heat dissipation performance, and also from a decrease in reliability.

[0064] Furthermore, a plurality of such semiconductor modules 10 may be arranged in parallel and used as a power electronics device. The power electronics device in this case will be described with reference to FIG. 8. FIG. 8 is a plan view of a power electronics device including the semiconductor module of the first embodiment. Note that FIG. 8 omits the illustration of the case 40 of the semiconductor module 10.

[0065] The power electronics device 1 includes two semiconductor modules 10 and a cooling module 50 in which the two semiconductor modules 10 are arranged. The two semiconductor modules 10 are adjacent to each other on an upper surface 51 of the cooling module 50, with the side walls (first edges) of the adjacent semiconductor modules 10 facing each other. Furthermore, the two semiconductor modules 10 are fastened to the upper surface 51 of the cooling module 50 by screws 33 through fastening holes 31g.

[0066] Furthermore, two adjacent semiconductor modules 10 are fixed to the upper surface 51 of the cooling module 50 by a common screw 33 through an opening formed by combining a recessed fixing hole 32a1 and an opposing recessed fixing hole 32b1 provided on the first edge of each semiconductor module 10. The diameter of the opening corresponds to the diameter of the screw 33.

[0067] Therefore, the semiconductor modules 10 include the fixing portions 32a and 32b, which allows for easy connection of multiple semiconductor modules 10. When connecting, the opposing fixing portions 32a and 32b come together, allowing for the spacing between adjacent semiconductor modules 10 to be as narrow as possible.

[0068] The shape of the fixing portions 32a and 32b is merely an example, and is not limited to that of the first embodiment as long as the fixing holes 32a1 and 32b1 of the fixing portions 32a and 32b are aligned to form an opening through which the screw 33 can be inserted.

[0069] [Second embodiment] In the second embodiment, a case where two insulating circuit boards are provided in the semiconductor module 10 of the first embodiment will be described with reference to FIG. 9. FIG. 9 is a plan view of the semiconductor module of the second embodiment. Note that FIG. 9 shows a case where only insulating circuit boards 20a and 20b are provided in FIG. 4 of the first embodiment, and the size of the heat dissipation base 30 is adjusted to match the size of the insulating circuit boards 20a and 20b. Also, in FIG. 9, the insulating circuit boards 20e and 20f are omitted. Also, the insulating circuit boards 20a and 20b are shown in a simplified manner, and as described above, they have a rectangular shape in plan view.

[0070] The heat dissipation base 30a in the second embodiment also includes a heat dissipation plate 31 and fixing portions 32a and 32b. The heat dissipation plate 31 and fixing portions 32a and 32b may be integrally connected and may be formed mainly from the above-mentioned metal.

[0071] The heat sink 31 has a rectangular shape in a plan view. The heat sink 31 includes a rectangular upper surface 31e and a lower surface 31f (not shown) opposite the upper surface 31e. The heat sink 31 further includes side surfaces 31a to 31d that surround the upper surface 31e and the lower surface 31f on all four sides. The side surfaces 31a and 31c correspond to second edges along the short direction, and the side surfaces 31b and 31d correspond to first edges along the long direction. The side surfaces 31a and 31c (second edges) of the heat sink 31 have a length Ly, and the side surfaces 31b and 31d (first edges) have a length Lx. The length Ly may be approximately 0.5 cm, and the length Lx may be approximately 1.4 cm. As described above, the heat sink 31 of the second embodiment is different from the heat sink 31 of the first embodiment only in size, but has the same configuration, and the center lines Cx and Cy are set in the same way.

[0072] The fixing portions 32a and 32b also have the same shape and size as those in the first embodiment, and have fixing holes 32a1 and 32b1 formed therein, and are connected to the center of the side surfaces 31b and 31d of the heat sink 31 in the same manner as in the first embodiment.

[0073] Insulated circuit boards 20a and 20b are arranged such that side surfaces 20a3 and 20b1 face each other at an equal distance across center line Cx. Side surfaces 20a2 and 20b2 of insulating circuit boards 20a and 20b are located outside (in the +Y direction) a line connecting the centers of a pair of fastening holes 31g formed on side surface 31b of heat sink 31. The shortest distance from side surfaces 20a2 and 20b2 of insulating circuit boards 20a and 20b to side surface 31b of heat sink 31 is distance Gy. Side surfaces 20a4 and 20b4 of insulating circuit boards 20a and 20b are located outside (in the -Y direction) a line connecting the centers of a pair of fastening holes 31g formed on side surface 31d of heat sink 31. The shortest distance from side surfaces 20a4 and 20b4 of insulating circuit boards 20a and 20b to side surface 31d of heat sink 31 is distance Gy. Similarly to the first embodiment, the distance Gy from the side surfaces 31b and 31d of the heat dissipation base 30a may be, for example, 5% or more and 15% or less of the length Ly.

[0074] The insulating circuit boards 20a and 20b are arranged symmetrically with respect to the center line Cy. The shortest distance from the side surfaces 20a1 and 20b3 of the insulating circuit boards 20a and 20b to the side surfaces 31a and 31c of the heat dissipation plate 31 is defined as a distance Gx. Similarly to the first embodiment, the distance Gx from the side surfaces 31a and 31c of the heat dissipation base 30a may be, for example, 15% or more and 20% or less of the length Lx. The distance Gy from the side surfaces 31b and 31d of the heat dissipation base 30a is shorter than the distance Gx from the side surfaces 31a and 31c of the heat dissipation base 30a.

[0075] The heat dissipation base 30a of the second embodiment also includes a pair of fixing portions 32a, 32b, each of which has fixing holes 32a1, 32b1 penetrating through the thickness direction and extending from the center of a pair of opposing side surfaces 31b, 31d (first edges) of the top surface 31e toward the outside of the pair of side surfaces 31b, 31d (first edges) in a plan view. The semiconductor module 10 of the second embodiment is also fixed to the top surface 51 of the cooling module 50 by the fixing portions 32a, 32b of the pair of side surfaces 31b, 31d (first edges) together with the fastening holes 31g at the four corners of the heat dissipation base 30a. This prevents the heat dissipation base 30a from warping upward. Furthermore, this prevents the bonding material from leaking out from between the heat dissipation base 30a and the top surface 51 of the cooling module 50. Furthermore, this prevents the insulating circuit boards 20a-20d from peeling off from the heat dissipation base 30. As a result, the deterioration of the heat dissipation performance of the semiconductor module 10 is suppressed, and the deterioration of the reliability of the semiconductor module 10 is also suppressed.

[0076] Furthermore, the semiconductor module 10 (heat dissipation base 30a) of the second embodiment can also be fixed to the upper surface 51 of the cooling module 50 with a common screw 33 through an opening formed by joining the fixing holes 32a1 and 32b1 of the opposing fixing portions 32a and 32b, as in Figure 8.

[0077] [Third embodiment] A semiconductor module according to a third embodiment, in which the fixing portion has a shape different from that of the first embodiment, will be described with reference to Fig. 10. Fig. 10 is a plan view of the semiconductor module according to the third embodiment.

[0078] The heat dissipation base 30b may be made of the same material as the heat dissipation base 30 of the first embodiment, and includes a heat dissipation plate 31 and fixing portions 32a and 32b. The heat dissipation plate 31 may be the same as in the first embodiment. Also, the insulating circuit boards 20a to 20f are provided on the upper surface 31e of the heat dissipation plate 31, as in the first embodiment.

[0079] The fixing portions 32a and 32b are provided at the center of the side surfaces 31b and 31d (first edges) of the heat sink 31, respectively, facing outward. The fixing portions 32a and 32b may be trapezoidal in plan view. In this case, one side of the trapezoid connecting the upper and lower bases forms a right angle with the upper and lower bases. Therefore, the fixing portions 32a and 32b are offset to opposite sides in a direction perpendicular to the center line Cx passing through the centers of the side surfaces 31b and 31d (first edges) in plan view. Furthermore, the fixing portions 32a and 32b are point-symmetric with respect to the center point of the upper surface 31e of the heat sink 31.

[0080] Furthermore, fixing portions 32a and 32b have fixing holes 32a1 and 32b1 formed on the sides of their upper bases, which are shorter than their lower bases. Therefore, fixing holes 32a1 and 32b1 are provided in protruding portions of fixing portions 32a and 32b, respectively, and are offset in opposite directions from center line Cx and symmetrical about the center point of upper surface 31e of heat sink 31. In this way, fixing portions 32a and 32b (fixing holes 32a1 and 32b1) are not aligned in a straight line with center line Cx, but are provided within the aforementioned ranges in the central portions of side surfaces 31b and 31d.

[0081] In the semiconductor module of the third embodiment, similarly to the first embodiment, the fastening holes 31g at the four corners of the heat dissipation base 30b and the fixing portions 32a, 32b on the pair of side surfaces 31b, 31d (first edges) are fixed to the top surface 51 of the cooling module 50. This prevents the heat dissipation base 30b from warping upward, similarly to the first embodiment. This prevents the bonding material from leaking out from between the heat dissipation base 30b and the top surface 51 of the cooling module 50, and further prevents the insulating circuit boards 20a-20d from peeling off from the heat dissipation base 30b. As a result, the semiconductor module 10 of the third embodiment is prevented from having a reduced heat dissipation performance, and thus is also prevented from having a reduced reliability.

[0082] Also, in the third embodiment, a plurality of semiconductor modules may be arranged in parallel and used as a power electronics device. The power electronics device in this case will be described with reference to FIG. 11. FIG. 11 is a plan view of a power electronics device including the semiconductor module of the third embodiment. Note that FIG. 11 omits the illustration of the case 40 of the semiconductor module.

[0083] The power electronics device 1a includes two semiconductor modules (heat dissipation bases 30b) and a cooling module 50 similar to that of the first embodiment, in which the two semiconductor modules (heat dissipation bases 30b) are arranged. The two semiconductor modules (heat dissipation bases 30b) are adjacent to each other on an upper surface 51 of the cooling module 50, with the side walls (first edges) of the adjacent semiconductor modules (heat dissipation bases 30b) facing each other. Furthermore, the two semiconductor modules (heat dissipation bases 30b) are each fastened to the upper surface 51 of the cooling module 50 by screws 33 through fastening holes 31g.

[0084] Furthermore, two adjacent semiconductor modules (heat dissipation bases 30b) have trapezoidal fixing holes 32a1, 32b1 provided in their respective side walls (first edges) that alternately align with each other, and are fixed to the upper surface 51 of the cooling module 50 by screws 33 that are inserted through the fixing holes 32a1, 32b1, respectively.

[0085] Therefore, the semiconductor module (heat dissipation base 30b) of the third embodiment also includes the fixing portions 32a and 32b, so that multiple semiconductor modules (heat dissipation bases 30b) can be easily connected together. When connecting, the opposing fixing portions 32a and 32b are mated with each other, so that the gap between adjacent semiconductor modules (heat dissipation bases 30b) can be made as narrow as possible.

[0086] The shape of the fixing portions 32a, 32b in the third embodiment is merely an example, and is not limited to the shape of the third embodiment as long as the fixing holes 32a1, 32b1 of the fixing portions 32a, 32b are aligned with each other when the semiconductor modules (heat dissipation base 30b) are arranged adjacent to each other. [Explanation of symbols]

[0087] 1,1a Power electronics devices 10 Semiconductor Module 20a~20f Insulated circuit board 20a1~20a4,20b1~20b4,20c1~20c4,20d1~20d4 Side 21 Insulating plate 22 Metal plate 23 Conductive circuit pattern 24 Semiconductor Chips 30, 30a, 30b Heat dissipation base 31 Heat sink 31a,31b,31c,31d Side 31e Top 31f Bottom 31g fastening hole 32a,32b Fixed part 32a1,32b1 Fixed hole 33 screws 40 cases 41 Frame 41a,41b,41c,41d Side wall 41e Top 41f Bottom 41g storage area 42 Lid 43, 44, 45 External connection terminals 43a, 44a, 45a External connection parts 43b,43c,44b,45b,45c Horizontal part 46 Terminal holding part 47 Sealing member 47a Top side 50 Cooling Module 51 Top side

Claims

1. a plurality of insulating circuit boards; a heat dissipation base including an upper surface on which the plurality of insulating circuit boards are disposed, the heat dissipation base having fastening holes formed at corners of the upper surface and penetrating in a thickness direction; and The heat dissipation base further includes a pair of fixing portions, each having a fixing hole penetrating therethrough in the thickness direction, the fixing portions being provided from a center of a pair of opposing first edges along the longitudinal direction of the top surface toward an outer side of the pair of first edges in a plan view. Semiconductor module.

2. a shortest distance from a first side of the plurality of insulating circuit boards facing one first edge of the top surface to the one first edge is shorter than a shortest distance from a second side of the plurality of insulating circuit boards facing one second edge of a pair of opposing second edges along the short direction of the top surface to the one second edge; The semiconductor module according to claim 1 .

3. a secondary insulating circuit board smaller than the plurality of insulating circuit boards is further provided on the upper surface of the heat dissipation base between the one second edge and the second side; The semiconductor module according to claim 2 .

4. In the plurality of insulating circuit boards, the pair of opposing first sides are long sides, and the pair of opposing second sides are short sides. The semiconductor module according to claim 2 .

5. The plurality of insulating circuit boards are four insulating circuit boards, the plurality of insulating circuit boards are arranged on the upper surface in two rows and two columns, with a center line passing through the centers of the pair of first edges and the pair of second edges of the upper surface of the heat dissipation base interposed therebetween. The semiconductor module according to claim 4 .

6. The plurality of insulating circuit boards are two insulating circuit boards, the plurality of insulating circuit boards are arranged on the upper surface of the heat dissipation base with a center line passing through the centers of the pair of first edges of the upper surface of the heat dissipation base therebetween; The semiconductor module according to claim 4 .

7. The fixing holes of the pair of fixing portions each have a concave shape recessed toward the pair of first edge sides in a plan view. The semiconductor module according to claim 1 .

8. the pair of fixing portions protrude in a direction perpendicular to a center line passing through the centers of the pair of first edges, being offset from each other in a plan view, and are point-symmetrical with respect to a center point of the top surface of the heat dissipation base; The fixing holes are provided in the protruding portions of the pair of fixing portions, respectively. The semiconductor module according to claim 1 .

9. the pair of fixing portions are integrally formed on the pair of first edges of the heat dissipation base; The semiconductor module according to claim 1 .

10. a thickness in the thickness direction of the pair of fixing portions is equal to or smaller than a thickness of the heat dissipation base; The semiconductor module according to claim 9 .

11. the fastening holes are formed on the insulating circuit board closer to the pair of first edges of the heat dissipation base than the side surfaces of the insulating circuit board that face the pair of first edges of the heat dissipation base; The semiconductor module according to claim 1 .

12. A plurality of the semiconductor modules according to claim 7; a cooling module including an upper surface to which the plurality of semiconductor modules are adjacent, with first edges of the adjacent semiconductor modules facing each other, and fixed by fixing members through the fastening holes; Including, the adjacent semiconductor module is fixed to the top surface of the cooling module by the fixing member through an opening formed by combining the concave fixing hole in the one first edge and the concave fixing hole in the other opposing first edge; Power electronics devices.

13. A plurality of the semiconductor modules according to claim 8; a cooling module including an upper surface to which the plurality of semiconductor modules are adjacent, with first edges of the adjacent semiconductor modules facing each other, and fixed by fixing members through the fastening holes; Including, The adjacent semiconductor modules are fixed to the top surface of the cooling module by the fixing members through the fixing holes, with the fixing portions of the first edges of the adjacent semiconductor modules being alternately mated with the fixing portions of the other first edges of the adjacent semiconductor modules. Power electronics devices.

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