Semiconductor device, terminal component, and manufacturing method for semiconductor device

Abstract

To provide a semiconductor device capable of suppressing deformation of an external terminal due to an external force when a terminal part taken out to an outside is fixed by bending.SOLUTION: In a semiconductor device, a substrate 12 is housed in a case body 16, a terminal block 26 is provided on an outer surface of a lid member 18 that closes an opening, and an external terminal 20 is disposed between a substrate and the terminal block. The external terminal 20 includes: an internal bonding terminal part 22; an external fixing terminal part 24; and a support leg part 25. The internal bonding terminal part 22 is bonded to a predetermined position of a semiconductor circuit by extending a plate-like member in parallel with the substrate and bending a tip thereof toward the substrate. The external fixing terminal part extends from a rear part of the internal bonding terminal part toward the lid member in a direction perpendicular to the substrate, passes through a terminal through hole 30 formed in the lid member at the tip end thereof, is taken out to the outside, and is bent and fixed to the terminal block. The support leg part 25 supports a terminal intermediate part with respect to the substrate so as to suppress deformation due to an external force applied when the tip of the external fixing terminal part 24 is bent and fixed to the terminal block.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a semiconductor device such as a power module, a terminal component, and a method for manufacturing the semiconductor device. [Background technology]

[0002] 2. Description of the Related Art Conventionally, semiconductor devices such as power modules are provided with external terminals that electrically and mechanically connect a semiconductor circuit section within the device to a terminal block outside the device.

[0003] Fig. 14(A) shows an example of a conventional semiconductor device. As shown in Fig. 14(A), conventional semiconductor device 100 has a substrate 1012, on which a semiconductor circuit using semiconductor elements is mounted, housed in the bottom of a case body 1016, a lid member 1018 is disposed in the upper opening of case body 1016, and external terminals 1020 are disposed between the circuit pattern on substrate 1012 and terminal block 1026 of lid member 1018, and external terminals 1020 have a shape formed by bending a part of a conductive plate-like member such as steel.

[0004] 14, the X, Y, and Z directions are perpendicular to each other. Specifically, when viewing one surface of semiconductor device 100 from the front, the X direction is the left-right direction, the Y direction is the up-down direction, and the Z direction is the front-to-back direction. The +X side in the X direction is the right side, the -X side is the left side, the +Y side in the Y direction is the top side, the -Y side is the bottom side, and the +Z side in the Z direction is the front side, and the -Z side is the back side. This also applies to FIGS. 1 to 13, which are embodiments of the present invention.

[0005] The external terminal 1020 of the semiconductor device 100 includes an internal joint terminal portion 1022 and an external fixed terminal portion 1024. The circuit joint terminal portion 1022 is formed by bending a plate-like member that has been extended parallel to the substrate 1012, and then soldering the bent tip to the circuit pattern. The external fixed terminal portion 1024 is bent to the right of the internal joint terminal portion 1022 in a direction perpendicular to the substrate 1012, and then inserted into a terminal through-hole in the cover member 1018 and taken out, and then bent and fixed to a terminal block 1026 using rollers 1044.

[0006] Incidentally, the terminal extraction structure of the external terminal 1020 of the conventional semiconductor device 100 is a terminal extraction structure in which the external terminal 1020 is inserted into a terminal through-hole in the cover member 1018 and extracted to the outside without being held in the case main body 1016. In addition to this terminal extraction structure, a terminal extraction structure is known in which the strength to support the external terminal is increased by extracting a portion of the external terminal 1020 to the outside while it is embedded and held in the case main body 1016 (Patent Document 1).

[0007] However, in the terminal lead-out structure of Patent Document 1, when the case body is manufactured by resin molding, a resin molding is required to form a structure in which a portion of the bent external terminal is embedded and fixed in the case body, which makes manufacturing time-consuming and costs-increasing. For this reason, as shown in Figure 14(A), a simple terminal lead-out structure is used in which the external terminal 1020 is not held by the case body 1016, but is inserted into a terminal through-hole in the cover member 1018 to be led out to the outside and fixed to a terminal block 1026, thereby reducing costs. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-091787 Summary of the Invention [Problem to be solved by the invention]

[0009] However, in the conventional terminal lead-out structure shown in Fig. 14(A), when roller processing is performed to bend and fix the portion of the external terminal 1020 that has been taken out of the cover member 1018 to the terminal block 1026, a force is applied that presses the external terminal 1020 toward the substrate, which may cause the external terminal 1020 to bend and deform, as shown in Fig. 13(B). If the external terminal 1020 is deformed in this way, the deformed portion of the external terminal 1020 may come into contact with the substrate 1012, or the spatial distance (creepage distance) required to ensure insulation may not be maintained. Furthermore, even if the external terminal 1020 is deformed during roller processing, it cannot be confirmed from the outside, which may impair the reliability of the semiconductor device.

[0010] To solve this problem, it is conceivable to place a spacer 1050 between the external terminal 1020 and the substrate 1012, as shown in Figure 14(C), so that the force applied to the external terminal 1020 by roller processing is received by the spacer 1050, thereby suppressing deformation of the external terminal 1020. However, since it is necessary to place a new spacer 1050, this will increase costs, and furthermore, the addition of a process for positioning and fixing the spacer 1050 may reduce productivity.

[0011] An object of the present invention is to provide a semiconductor device, a terminal component, and a method for manufacturing a semiconductor device that can suppress deformation of external terminals due to external forces when terminal portions taken out to the outside are fixed by bending. [Means for solving the problem]

[0012] (Semiconductor Devices) The present invention provides a substrate on which a semiconductor circuit is mounted; a box-shaped case body disposed on the substrate so as to surround the semiconductor circuit; a cover member disposed on the opening of the case body to close it, the cover member having a terminal block formed on its outer surface; an external terminal provided with an internal joint terminal portion formed by bending a conductive plate-like member, the tip of which is bent toward the substrate and joined to a predetermined position of the semiconductor circuit, and an external fixed terminal portion which extends from the rear of the internal joint terminal portion toward the cover member, the tip of which is inserted into a slit-shaped terminal through-hole formed in the terminal block, taken out to the outside, and then bent and fixed to the terminal block; A semiconductor device comprising: The external terminal is characterized in that, in addition to the internal joining terminal portion and the external fixed terminal portion, a support leg portion is integrally provided for supporting the intermediate portion of the terminal relative to the board. Here, the support leg portion supports the intermediate portion of the terminal relative to the board so as to prevent deformation due to an external force applied when the tip of the external fixed terminal portion is bent and fixed to the terminal block.

[0013] (Support of terminal corners by support legs) The support leg portion of the external terminal serves as a terminal intermediate portion, and supports the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected or a predetermined position in the vicinity thereof relative to the substrate.

[0014] (First structure of external terminal) The plate-shaped member of the external terminal has a predetermined plate width and is bent and fixed to a rectangular base formed on the terminal block, An external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into at least two parts, with an internal joint terminal portion formed on one branch side and a support leg portion formed on the other branch side.

[0015] (Second structure of external terminal) The plate-shaped member of the external terminal has a predetermined plate width and is bent and fixed to a rectangular base formed on the terminal block, An external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into three branches, with an internal joint terminal formed on the central branch and support legs formed on both branch sides.

[0016] (Connection of support legs of external terminal) The tip of the support leg is bonded to the substrate.

[0017] (contact of the support legs of the external terminal) The tip of the support leg is brought into contact with the substrate.

[0018] (Roller processing of external fixed terminals) The external fixed terminal portion is bent and fixed to the terminal block by applying an external force by a roller device.

[0019] (Terminal parts) The present invention provides a terminal component used for an external terminal of a semiconductor device, in which a box-shaped case body is placed on a substrate so as to surround a semiconductor circuit mounted on the substrate, and a lid member having a terminal block formed on its outer surface is placed on the opening of the case body to close it, A conductive plate-like member, an internal joining terminal portion whose tip is bent toward the substrate and joined to a predetermined position of the semiconductor circuit portion; an external fixed terminal portion extending from a rear portion of the internal joint terminal portion toward the cover member and having a tip inserted into a terminal through-hole formed in the terminal block and taken out to the outside; a support leg portion that supports the intermediate portion of the terminal on the board; The supporting leg supports the intermediate portion of the terminal relative to the substrate so as to prevent deformation due to an external force applied when the tip of the external fixed terminal is bent and fixed to the terminal block.

[0020] (Terminal corners are supported by support legs) The support leg serves as a terminal intermediate portion, supporting the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected or a predetermined position in the vicinity thereof, relative to the substrate.

[0021] (First structure of terminal component) The plate-shaped member of the terminal component has a predetermined plate width and is bent and fixed to a rectangular base formed on the terminal block, An external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into at least two parts, with an internal joint terminal portion formed on one branch side and a support leg portion formed on the other branch side.

[0022] (Second structure of terminal parts) The plate-shaped member of the terminal component has a predetermined plate width and is bent and fixed to a rectangular base formed on the terminal block, An external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into three branches, with an internal joint terminal formed on the central branch and support legs formed on both branch sides.

[0023] (Method of manufacturing a semiconductor device) The present invention provides a method for manufacturing a semiconductor device, comprising: Mounting circuit components of a semiconductor circuit on a substrate, and arranging terminal components having internal joint terminals, external fixed terminals, and support legs, and joining at least the internal joint terminals to the substrate; A box-shaped case body is placed on the board so as to surround the semiconductor circuit, a cover member having a terminal block formed on its outer surface is placed on the opening of the case body to close it, and the external fixed terminal portions of the terminal components placed on the board are inserted through the terminal through-holes formed in the terminal block of the cover member to be taken out to the outside; The terminal component is removed from the cover member, and an external force is applied to the external fixed terminal portion of the terminal component to bend and fix it to the terminal block.

[0024] (Terminal component configuration) A method for manufacturing a semiconductor device, comprising: The internal joint terminal portion of the terminal component is formed by bending the tip of a conductive plate-like member toward the substrate and joining it to a predetermined position on the semiconductor circuit portion, The external fixed terminal portion of the terminal component extends from the rear portion of the internal joint terminal portion toward the cover member, and its tip is passed through a terminal through-hole formed in the terminal block and taken out to the outside, The support leg of the terminal component supports the intermediate terminal portion relative to the board so as to prevent deformation due to an external force applied when the tip of the external fixed terminal portion is bent and fixed to the terminal block.

[0025] (Support of terminal corners by support legs) A method for manufacturing a semiconductor device, comprising: The support leg portion of the terminal component serves as a terminal intermediate portion, and supports the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected or a predetermined position in the vicinity thereof, relative to the board.

[0026] (First structure of terminal plate member) A method for manufacturing a semiconductor device, comprising: the plate-like member has a predetermined width and is bent and fixed to a rectangular base formed on the terminal block; An external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into at least two parts, with an internal joint terminal portion formed on one branch side and a support leg portion formed on the other branch side.

[0027] (Second structure of terminal plate member) A method for manufacturing a semiconductor device, comprising: The plate-shaped member of the external terminal has a predetermined plate width and is bent and fixed to a rectangular base formed on the terminal block, An external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into three branches, with an internal joint terminal formed on the central branch and support legs formed on both branch sides.

[0028] (Joining of support legs of terminal parts) A method for manufacturing a semiconductor device, comprising: When the terminal component is placed on the board, the tip of the support leg is joined to the board.

[0029] (contact of the support legs of the terminal parts) A method for manufacturing a semiconductor device, comprising: When the terminal component is placed on the board, the tip of the support leg abuts against the board.

[0030] (Roller processing of external fixed terminal parts of terminal parts) A method for manufacturing a semiconductor device, comprising: The external fixed terminal portion is bent and fixed to the terminal block by applying an external force by a roller device.

[0031] (Filling of soft sealing material inside the case body) A method for manufacturing a semiconductor device, comprising: When the lid member is placed over the opening of the case body to close it, the case body is filled with a soft sealing material to seal it. [Effects of the Invention]

[0032] (Effects of semiconductor devices) The present invention relates to a semiconductor device comprising: a substrate on which a semiconductor circuit is mounted; a box-shaped case body arranged on the substrate so as to surround the periphery of the semiconductor circuit; a lid member arranged on the opening of the case body to close it and having a terminal block formed on its outer surface; and an external terminal provided with an internal joint terminal portion formed by bending a conductive plate-like member and having a tip bent toward the substrate and joined to a predetermined position of the semiconductor circuit; and an external fixed terminal portion extending from a rear portion of the internal joint terminal portion toward the lid member, having a tip inserted into a terminal through-hole formed in the terminal block and taken out to the outside, and then bent and fixed to the terminal block, wherein the external terminal is In addition to the mating terminal portion and the external fixed terminal portion, a support leg portion that supports the intermediate terminal portion relative to the substrate is integrally provided. More specifically, the support leg portion supports the intermediate terminal portion relative to the substrate so as to prevent deformation due to an external force applied when the tip of the external fixed terminal portion is bent and fixed to the terminal block. Therefore, when the external terminal is taken out from the cover member and an external force is applied to bend and fix the external fixed terminal portion to the terminal block, the external force applied to the external terminal is distributed and applied to the support leg portion that supports the intermediate terminal portion of the external terminal relative to the substrate, making it possible to reliably prevent deformation such as bending the external terminal midway.

[0033] (Effect of supporting the terminal corners with the support legs) Furthermore, the support leg portion of the external terminal is configured to support the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected to the substrate as the terminal intermediate portion. Therefore, by supporting the corner portion of the external terminal, which is most vulnerable when both ends of the external terminal are supported and fixed, or a predetermined position in the vicinity thereof, to the substrate, deformation of the external terminal can be reliably suppressed.

[0034] (Effect of the first structure of the external terminal) Furthermore, the plate-like member of the external terminal has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, and an external fixed terminal portion is formed at one end of the plate-like member, and the other end of the plate-like member is branched into at least two branches, with an internal joining terminal portion formed on one branch side and a support leg portion formed on the other branch side.Therefore, by punching and bending the conductive plate-like member, it is possible to simply and easily manufacture an external terminal that has a new support leg portion formed integrally with the internal joining terminal portion and external fixed terminal portion, and even if a new support leg portion is provided, the increase in manufacturing costs as a part is only slight.Furthermore, the manufacturing process for assembling and fixing the external terminal to the semiconductor device can be the same as before, and it is possible to effectively utilize the advantages of a terminal take-out structure in which a part of the external terminal is inserted into a lid member and taken out and fixed to the outside without being held in the case body.

[0035] (Effect of the second structure of the external terminal) Furthermore, the plate-like member of the external terminal has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, and an external fixed terminal portion is formed on one end of the plate-like member, and the other end of the plate-like member is branched into three branches, with an internal joint terminal portion formed on the central branch side and support legs formed on both branch sides.As a result, in addition to the effect of the external terminal structure 1 described above, the formation of support legs on both sides of the internal joint terminal portion increases the support strength and support balance of the external terminal relative to the board.

[0036] (Effect of joining the support legs of the external terminal) Furthermore, since the tip of the support leg is joined to the substrate, the support leg is reliably fixed to the substrate, ensuring sufficient support strength when subjected to an external force.

[0037] (Effect of contact of the support legs of the external terminal) Furthermore, since the tip of the support leg is not joined to the substrate, the support strength is ensured even when it comes into contact with the substrate and is subjected to external force, and since it is not joined to the substrate, the manufacturing process can be simplified.

[0038] (Effect of roller processing on external fixed terminal) Furthermore, since the external fixed terminal portion is bent and fixed to the terminal block by applying an external force by a roller device, when roller processing is performed to bend and fix the external fixed terminal portion of the external terminal, which has been inserted into the cover member and taken out in an upright state to the outside, to the terminal block by rolling the roller, the external terminal is supported on the board by the support legs, and therefore deformation of the external terminal is suppressed even when an external force is applied by roller processing. This makes it possible to increase the degree of freedom in setting the roller movement speed, roller pressure force, etc. in roller processing, and enables optimization of roller processing conditions.

[0039] (Effect of terminal parts) The present invention provides a terminal component for use in an external terminal of a semiconductor device having a box-shaped case body disposed on a substrate so as to surround a semiconductor circuit mounted on the substrate, and a lid member having a terminal block formed on its outer surface disposed over the opening of the case body to close the opening, the terminal component comprising an internal connecting terminal portion bent toward the substrate and joined to a predetermined position on the semiconductor circuit portion, an external fixed terminal portion extending from the rear of the internal connecting terminal portion toward the lid member and having its tip inserted into a terminal through-hole formed in the terminal block and extending to the outside, and support legs for supporting an intermediate portion of the terminal relative to the substrate, the terminal component being integrally formed with the conductive plate-like member, so that when an external force is applied to bend and fix the external fixed terminal portion to the terminal block after it is extended from the lid member to the outside, the external force is dispersed to the support legs supporting the intermediate portion of the terminal of the external terminal relative to the substrate, thereby reliably preventing deformation such as bending of the external terminal. Note that other features of the terminal component are similar to those of the corresponding part of the semiconductor device, and therefore description thereof will be omitted.

[0040] (Effects of the manufacturing method of the semiconductor device) The present invention is a method for manufacturing a semiconductor device, which includes mounting circuit components of a semiconductor circuit on a substrate, arranging terminal components having internal connecting terminal portions, external fixed terminal portions, and support legs, and joining at least the internal connecting terminal portions to the substrate, placing a box-shaped case body on the substrate so as to surround the periphery of the semiconductor circuit, and placing a lid member having a terminal block on its outer surface over the opening of the case body to close it, inserting the external fixed terminal portions of the terminal components arranged on the substrate into terminal through-holes formed in the terminal block of the lid member to be taken out, and applying an external force to the external fixed terminal portions of the terminal components taken out of the lid member to bend and fix them to the terminal block.Therefore, when an external force is applied to bend and fix the external fixed terminal portions taken out of the lid member to the terminal block, the external force applied to the external terminals is dispersed to the support legs supporting the terminal intermediate portions of the external terminals with respect to the substrate, making it possible to reliably prevent deformation such as bending of the external terminals, and making it possible to properly manufacture a semiconductor device in which external terminals are incorporated.

[0041] (Effect of filling the case body with soft sealant) In addition, in the method for manufacturing a semiconductor device, when a lid member is placed over the opening of the case body to close it, the case body is filled with a soft sealing material, such as soft silicone gel, to seal it, thereby protecting the semiconductor element and connecting parts within the semiconductor device from mechanical and chemical stress, thereby ensuring durability and reliability. Note that other features of the method for manufacturing a semiconductor device are similar to the effects of the corresponding parts of the semiconductor device, and therefore description thereof will be omitted. [Brief explanation of the drawings]

[0042] [Figure 1] FIG. 1 is an explanatory diagram showing the appearance of a semiconductor device. [Figure 2] 2A and 2B are explanatory views showing the semiconductor device of FIG. 1 from above and from the front. [Figure 3] 2A and 2B are explanatory diagrams showing a cross section of the semiconductor device of FIG. 1 as viewed from above and from the side; [Figure 4] FIG. 4 is an explanatory diagram showing the semiconductor circuit of FIG. [Figure 5]2 is an explanatory diagram showing a first external terminal incorporated in the semiconductor device of FIG. 1; FIG. [Figure 6] 6A to 6C are explanatory views showing the first external terminal of FIG. 5 from three sides. [Figure 7] 10 is an explanatory diagram showing a punched part punched in the manufacture of an external terminal. FIG. [Figure 8] 8 is an explanatory view showing a terminal part obtained by bending the punched part of FIG. 7.

[0023] FIG. [Figure 9] 9A to 9C are explanatory views showing the terminal part of FIG. 8 from three sides. [Figure 10] 2 is an explanatory diagram showing a second external terminal incorporated in the semiconductor device of FIG. 1; FIG. [Figure 11] 1A to 1C are explanatory diagrams showing a manufacturing process of a semiconductor device. [Figure 12] 12 is an explanatory diagram showing the manufacturing process of the semiconductor device following FIG. 11. [Figure 13] 10A and 10B are explanatory diagrams showing other embodiments of the external terminals. [Figure 14] 1 is an explanatory diagram showing a conventional semiconductor device external terminal assembly structure and problems. DETAILED DESCRIPTION OF THE INVENTION

[0043] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of a semiconductor device, a terminal component, and a method for manufacturing a semiconductor device according to the present invention will be described in detail below with reference to the accompanying drawings. However, the present invention is not limited to the following embodiments.

[0044] [Basic concept of the embodiment] First, the basic concept of the embodiment will be described. The embodiment generally relates to a semiconductor device.

[0045] Here, a "semiconductor device" is a device that is composed of a substrate on which a semiconductor circuit is mounted, a box-shaped case body that is placed on the substrate so as to surround the periphery of the semiconductor circuit, and a lid member that is placed over the opening of the case body to close it and has a terminal block formed on its outer surface, and is a device in which a semiconductor circuit is housed and packaged in a case, and is a concept that includes, for example, a power module or a power semiconductor module.

[0046] Furthermore, the "semiconductor device" is provided with external terminals. Here, the "external terminals" are terminal members for mechanically and electrically connecting a circuit pattern within the device to an external terminal block, and are formed by bending a conductive plate-like member such as a steel plate, with an "internal joining terminal portion" formed on one end and an "external fixed terminal portion" formed on the other end.

[0047] The "internal connecting terminal" is a terminal portion that extends parallel to the substrate, has its tip bent toward the substrate, and is connected to a predetermined position on the semiconductor circuit. The "external fixed terminal" is a terminal portion that extends from the rear of the internal connecting terminal portion toward the cover member perpendicular to the substrate, has its tip taken out through a slit-shaped terminal through-hole formed in the terminal block, and is then bent and fixed to the terminal block by applying an external force. Note that "parallel" does not necessarily mean strictly parallel to the object (substrate) but also includes being approximately parallel to the object, and "perpendicular" does not necessarily mean strictly perpendicular to the object (substrate) but also includes being approximately perpendicular to the object.

[0048] Therefore, the external terminals of the embodiment have a terminal extraction structure in which they are not held in the case body but are inserted through a cover member and taken out to the outside, and do not include a terminal extraction structure in which a portion of the external terminal is embedded and held in the case body.

[0049] The semiconductor device of the embodiment is characterized in that the external terminal is provided with a "support leg" Here, the "support leg" is a terminal portion that supports the intermediate portion of the terminal relative to the substrate, and is provided integrally with the internal joining terminal portion and the external fixed terminal portion, and more specifically, the "support leg" is a terminal portion that supports the intermediate portion of the terminal relative to the substrate so as to suppress deformation due to an external force applied when the tip of the external fixed terminal portion is bent and fixed to the terminal block.

[0050] According to the semiconductor device of this embodiment, when the semiconductor device is taken out from the cover member and an external force is applied to bend and fix the external fixed terminal portion of the external terminal to the terminal block, the external force applied to the external terminal is distributed to the support leg portion that supports the terminal middle portion of the external terminal against the substrate, making it possible to reliably prevent the external terminal from being deformed in such a way that it bends midway.

[0051] Furthermore, the "support leg of the external terminal" is configured as a terminal intermediate portion, supporting the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected or a predetermined position near the corner portion relative to the substrate. When the bent external terminal is electrically and mechanically connected between the circuit pattern on the substrate and the terminal block on the cover member, the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected is supported in a floating state and is the portion most susceptible to deformation when an external force is applied to the external terminal. Therefore, by supporting the corner portion of the external terminal or a predetermined position near the corner portion, which is a weak portion where stress concentrates when an external force is applied to the external terminal, relative to the substrate, deformation of the external terminal can be reliably suppressed. The "predetermined position of the corner portion of the external terminal" refers to a position slightly away from the corner portion that will deform when an external force is applied to the external terminal, including a predetermined position within, for example, a range of less than 10% of the horizontal portion following the corner portion.

[0052] Furthermore, the "plate-shaped member of the external terminal" has a first structure in which it has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, an external fixed terminal portion is formed on one end side of the plate-shaped member, the other end side of the plate-shaped member is branched into at least two branches, an internal joint terminal portion is formed on one branch side, and a support leg portion is formed on the other branch side.

[0053] Therefore, before the external terminal is assembled to the semiconductor device, the terminal component can be simply and easily manufactured by punching and bending a conductive plate-like member to form an external terminal that has an internal joining terminal portion, an external fixed terminal portion, and a new support leg portion integrally formed therewith. Furthermore, even if the external terminal is provided with a new support leg portion, the increase in manufacturing cost as a part is minimal, and the manufacturing process for assembling and fixing the external terminal to the semiconductor device can be the same as in the conventional case, making it possible to effectively utilize the advantage of low cost for a terminal take-out structure in which a part of the external terminal is inserted through a cover member and fixed to the outside without being held in the case body.

[0054] In addition, the "plate-shaped member of the external terminal" has a second structure in which it has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, an external fixed terminal portion is formed on one end of the plate-shaped member, the other end of the plate-shaped member is branched into three branches, an internal joint terminal portion is formed on the central branch side, and support legs are formed on both branch sides.

[0055] Therefore, according to the second structure, which is a "plate-shaped member of the external terminal," in addition to the effect of the first structure described above, by forming support legs on both sides of the internal joint terminal portion, it is possible to increase the support strength and support balance of the external terminal relative to the board.

[0056] The tips of the "support legs of the external terminals" are joined to the board by soldering, etc. This ensures that the support legs are securely fixed to the board, ensuring sufficient holding strength when subjected to external force.

[0057] Furthermore, the tip of the "support leg of the external terminal" does not necessarily have to be joined to the board, and the tip of the support leg may be in abutting state against the board. In this case, too, the support strength when subjected to an external force is ensured, and since it is not joined to the board, the assembly process can be simplified.

[0058] Furthermore, the external fixed terminal portion of the external terminal taken out to the outside is bent and fixed to the terminal block by applying an external force by a roller device, but since the external terminal is supported on the substrate by the support legs, deformation of the external terminal is suppressed even when an external force is applied by roller processing, which makes it possible to increase the degree of freedom in setting the roller movement speed, roller pressure force, etc. in roller processing, and enables optimization of roller processing conditions.

[0059] Here, the "internal joining terminal portion," "external fixed terminal portion," and "support leg portion" of the external terminal are names corresponding to their functions, but are not limited to this, and there is no prohibition on, for example, calling the "internal joining terminal portion" the "first terminal portion," the "external fixed terminal portion" the "second terminal portion," and the "support fixed leg portion" the "third terminal portion," provided that they have the same configuration.

[0060] The embodiments relate to a terminal component used as an external terminal of a semiconductor device. The "terminal component" in the embodiments is a component assembled as an external terminal of a semiconductor device in which a box-shaped case body is placed on a substrate so as to surround a semiconductor circuit portion mounted on the substrate, and a lid member having a terminal block formed on its outer surface is placed over the opening of the case body to close it.

[0061] Furthermore, the "terminal component" is a conductive plate-like member on which an internal joining terminal portion, an external fixed terminal portion, and a supporting leg portion are integrally formed. Here, the internal joining terminal portion, the external fixed terminal portion, and the supporting leg portion are the same as those in the external terminal of a semiconductor device, but in the terminal component, the "external fixed terminal portion" is a terminal portion that extends from the rear of the internal joining terminal portion toward the cover member perpendicular to the substrate and has its tip taken out through a slit-shaped through-hole formed in the terminal block, which is different from the structure in which the external fixed terminal portion of an external terminal assembled to a semiconductor device is bent and fixed to the terminal block.

[0062] Therefore, according to the "terminal component" of the embodiment, when an external force is applied to bend and fix the external fixed terminal portion to the terminal block after the external terminal is taken out from the cover member, the external force applied to the external terminal is dispersed to the support legs that support the terminal middle portion of the external terminal on the board, thereby enabling the supply of an external terminal component that can reliably prevent deformation such as bending of the external terminal. In addition, other features of the "terminal component" are the same as those of the "semiconductor device" described above.

[0063] The embodiments also relate to a "semiconductor device manufacturing method." The "semiconductor device manufacturing method" includes the following steps (processes).

[0064] First, circuit components of a semiconductor circuit are mounted on a substrate, and terminal components having internal connecting terminals, external fixed terminals, and support legs are arranged, and at least the internal connecting terminals are joined to the substrate.

[0065] Second, a box-shaped case body is placed on the board so as to surround the periphery of the semiconductor circuit.

[0066] Third, a lid member having a terminal block formed on its outer surface is placed on the opening of the case body to close it, and the external fixed terminal portion of the terminal component placed on the board is inserted through a slit-shaped terminal through-hole formed in the terminal block of the lid member to be taken out to the outside.

[0067] Fourth, an external force is applied to the external fixed terminal portion of the terminal component removed from the cover member to bend and fix it to the base of the terminal block.

[0068] According to this manufacturing method for a semiconductor device, in the fourth step (process), when an external force is applied to bend and fix the external fixed terminal portion to the terminal block after the external terminal is removed from the lid member, the external force applied to the external terminal is dispersed to the support legs that support the terminal middle portion of the external terminal against the substrate, thereby making it possible to reliably prevent the external terminal from being bent midway. In addition, other features of the "manufacturing method for a semiconductor device" are the same as those of the "semiconductor device" described above.

[0069] Furthermore, in the "semiconductor device manufacturing method," when a lid member is placed over the opening of the case body to close it in the third step (procedure), the case body is filled with a soft sealing material, such as soft silicone gel, to seal it, thereby protecting the semiconductor elements and connection parts within the semiconductor device from mechanical and chemical stress, thereby ensuring durability and reliability.

[0070] Specific embodiments will be described below. In the specific embodiments shown below, the "semiconductor circuit" is a "diode bridge circuit," four "external terminals" are provided corresponding to the two inputs and two outputs of the semiconductor circuit, the "external terminals" are manufactured as "terminal components" by punching and bending a conductive plate-like member, and the external terminals are bent and fixed to the terminal block by a "roller device."

[0071] The semiconductor device, the terminal component, and the method for manufacturing the semiconductor device will be described in more detail below. a. Overview of semiconductor device b. Internal structure of semiconductor device c. Structure of the first external terminal c1. Structure of external terminals after assembly c2. Structure as a terminal part before incorporating external terminals c3. Structure of the second external terminal d. Manufacturing method of semiconductor device d1. 1st process d2. 2nd process d3. 3rd process d4. 4th step e. Other embodiments of external terminals f. Modifications of the present invention

[0072] [a. Overview of semiconductor device] First, an overview of the semiconductor device in the embodiment will be described. In this description, reference will be made to Fig. 1, which shows the external appearance of the semiconductor device, and Fig. 2, which shows the semiconductor device in Fig. 1 from a plan view and a front view. Fig. 2(A) shows the plan view, and Fig. 2(B) shows the front view.

[0073] 1 and 2, a semiconductor device 10 according to an embodiment is known as a power module or a power semiconductor module, and has a substrate on which a predetermined semiconductor circuit is mounted housed in the lower part (bottom) of a case body 16 molded from insulating resin, and a lid member 18 molded from insulating resin is attached to the upper opening of the case body 16. Any semiconductor circuit may be mounted on the substrate housed in the semiconductor device 10, but for example, a diode bridge circuit (rectifier circuit) is mounted.

[0074] Four external terminals 20 (20-1) to 20 (20-4) corresponding to the diode bridge circuits mounted on the circuit board are provided on the cover member 18 of the semiconductor device 10. Here, the external terminals 20 (20-1) and 20 (20-2) are input terminals of the diode bridge circuit, and the external terminals 20 (20-3) and 20 (20-4) are output terminals of the diode bridge circuit.

[0075] For the external terminals 20 (20-1) to 20 (20-4), taking the external terminal 20 (20-1) as an example, a trapezoidal terminal block 26 is formed on the upper surface of the cover member 18, and a slit-shaped terminal through-hole 30 is formed on the outside of the terminal block 26. The external terminal fixing portion 24 of the external terminal 20 (20-1) is inserted through the terminal through-hole 30 to be taken out from the inside of the semiconductor device 10 and bent and fixed to the seat surface of the terminal block 26. The shape of the terminal through-hole 30 corresponds to the shape of the external terminal fixing portion 24.

[0076] A screw hole 32 is formed in the external fixed terminal portion 24 that is bent and fixed to the terminal block 26, and a hexagonal hole formed in the seat surface of the terminal block 26 below the screw hole 32 houses a nut 36, providing a screw fastening structure that screws and fastens external wiring to the terminal block 26.

[0077] The structure of the external terminal 20 (20-1) is the same as that of the other external terminals 20 (20-2) to 20 (20-4). A partition wall is arranged between the external terminals 20 (20-1) and 20 (20-2) that serve as input terminals to ensure an insulation distance, and a partition wall is also arranged between the external terminals 20 (20-3) and 20 (20-4) that serve as output terminals to ensure an insulation distance.

[0078] Furthermore, mounting holes 17 are formed in two diagonally opposite corners of the case body 16, allowing the semiconductor device 10 to be mounted and fixed to an appropriate target device or equipment.

[0079] [b. Internal structure of semiconductor device] Next, the internal structure of the semiconductor device will be described. In this description, reference will be made to Fig. 4, which shows cross sections of the semiconductor device in Fig. 1 as viewed from the top and side, and Fig. 4, which shows the semiconductor circuit in Fig. 3. Note that Fig. 3(A) shows a cross section taken along line bb in Fig. 3(B), and Fig. 3(B) shows a cross section taken along line aa in Fig. 3(A).

[0080] 3, a substrate 12 is disposed on the bottom of the case body 16. The substrate 12 has an insulating layer formed on the surface of a metal plate such as a copper plate, a conductive circuit pattern corresponding to a predetermined semiconductor circuit formed on the insulating layer, and semiconductor elements 14 constituting the predetermined semiconductor circuit are electrically and mechanically connected to the circuit pattern by soldering. Furthermore, when the substrate 12 is disposed in the case body 16, a metal surface is exposed on the bottom, which functions as a heat sink.

[0081] Any semiconductor circuit may be mounted on the substrate 12, but for example, as shown in Fig. 4, a diode bridge circuit in which four diodes are bridge-connected, i.e., a rectifier circuit that converts AC power to DC power, is mounted as the semiconductor element 14. Here, the semiconductor device 10 of the embodiment known as a power module has, for example, a rated voltage of several tens to several thousand volts and a rated current of predetermined values ​​within the ranges of several tens to several thousand amperes, and therefore the diodes provided as the semiconductor elements 14 are power diodes that can handle the large currents that flow during power conversion.

[0082] In the diode bridge circuit formed by the semiconductor element 14, points a and b are AC inputs and points c and d are rectified outputs, so that input external terminals 20 (20-1) and 20 (20-2) are connected to points a and b, and output external terminals 20 (20-3) and 20 (20-4) are connected to points c and d.

[0083] As shown in Fig. 3(A), four semiconductor elements (power diodes) 14 are arranged on the substrate 12 in correspondence with the diode bridge circuit formed by the semiconductor elements 14 in Fig. 4, and external terminals 20 (20-1) to 20 (20-4) are also arranged. Note that Fig. 3(A) shows only the internal joint terminal portions 22 of the external terminals 20 (20-1) to 20 (20-4) that are connected to the circuit pattern of the substrate 12.

[0084] Here, taking the external terminal 20 (20-1) as an example, as shown in Figure 3 (B), it has a shape formed by bending a conductive plate-like member, and has an internal joining terminal portion 22 located inside and an external fixed terminal portion 24 taken out to the outside.

[0085] The internal joining terminal portion 22 of the external terminal 20 (20-1) is formed by a conductive plate-like member that is extended parallel to the substrate 12 at a predetermined interval, and then bent toward the substrate 12, with the tip joined by solder to a predetermined position on the circuit pattern.

[0086] In addition, the external fixed terminal portion 24 of the external terminal 20 (20-1) extends from the rear of the internal joint terminal portion 22 perpendicular to the substrate 12 toward the cover member 18, and after its tip is taken out to the outside through a slit-shaped terminal through-hole 30 formed in the terminal block 26, it is bent and fixed to the terminal block 26 by applying an external force.

[0087] Furthermore, the external terminal 20 (20-1) is integrally formed with a support leg 25 in addition to the internal joint terminal portion 22 and the external fixed terminal portion 24. The support leg 25 supports the terminal intermediate portion relative to the substrate 12 so as to prevent deformation due to an external force applied when the tip of the external fixed terminal portion 24 is bent and fixed to the terminal block 26. Here, the intermediate portion of the external terminal 20 (20-1) supported by the support leg 25 is the corner portion extending from the internal joint terminal portion 22 to the external fixed terminal portion 24. When the external terminal 20 (20-1) is supported and fixed at both ends, the corner portion can be said to be the portion most vulnerable to external forces. Therefore, by supporting the corner portion relative to the substrate 12 with the support leg 25, the mechanical support strength of the external terminal 20 (20-1) is increased.

[0088] The tips of the support legs 25 that come into contact with the substrate 12 are joined to the substrate 12 by soldering. More specifically, a conductor pattern separated from the circuit pattern is formed as an island pattern on the surface of the substrate where the tips of the support legs 25 come into contact, and the tips of the support legs 25 are joined by soldering while being in contact with the island pattern. Therefore, the joining of the support legs 25 to the substrate 12 does not include the function of electrical joining, but only the function of mechanical joining. Note that the tips of the support legs 25 may be joined to the substrate 12 by soldering, or may be joined to the substrate 12 without being soldered.

[0089] A terminal block 26 is formed on the outer surface (top surface) of the cover member 18 corresponding to the external fixed terminal portion 24 of the external terminal 20 (20-1). A hexagonal hole 34 is formed in the seat surface of a base 28 of the terminal block 26, and a nut 36 is stored in the hexagonal hole 34. A screw storage hole 38 is formed adjacent to the hexagonal hole 34, and can store the protruding portion of the tip of a connecting screw that is screwed into the nut 34 when connecting external wiring to the terminal block 26.

[0090] Furthermore, a slit-shaped terminal through-hole 30 is formed in a predetermined position of the terminal block 26 formed in the cover member 18 near the side wall of the case body 16, and the external fixed terminal portion 24 of the external terminal 20 (20-1) can be inserted into the terminal through-hole 30 and taken out to the outside. The external fixed terminal portion 24 that has been inserted into the terminal through-hole 30 and taken out to the outside is bent and fixed to the base 28 by applying an external force pushing it from the right side.

[0091] The inside of the case body 16, whose bottom is closed by the substrate 12 and whose top is closed by the lid member 18, is filled with, for example, soft silicone gel 42 as a sealing material for sealing and protecting the semiconductor element 14, the external connection terminals 20 (20-1) to 20 (20-4) and their respective connection parts.

[0092] Here, among the external terminals 20(20-1) to 20(20-4) provided on the semiconductor device 10, the external terminals 20(20-1), 20(20-3), and 20(20-4) have the same planar shape of the internal joint terminal portion 22 as shown in Figure 3(A), but the external terminal 20(20-2) has a different planar shape that is wider laterally. Therefore, in the following description, the external terminals 20(20-1), 20(20-3), and 20(20-4) will be referred to as first external terminals, and the external terminal 20(20-2) will be referred to as a second external terminal.

[0093] [c. Structure of the first external terminal] Next, the structure of the first external terminal will be described. Here, the first external terminal refers to external terminals 20 (20-1), 20 (20-3), and 20 (20-4), but external terminal 20 (20-1) will be described as a representative. Furthermore, because the external terminals incorporated into the semiconductor device have different structures before and after incorporation into the semiconductor device, the structure before incorporation will be described as a terminal component, and the structure after incorporation will be described as an external terminal.

[0094] (c1. Structure of the first external terminal after assembly) First, the structure of the first external terminal after being incorporated into the semiconductor device will be described. In this description, reference will be made to Fig. 5, which shows the first external terminal incorporated into the semiconductor device of Fig. 1, and Fig. 6, which shows the first external terminal of Fig. 5 from three sides. Fig. 6(A) shows a side view, Fig. 6(B) shows a front view, and Fig. 6(C) shows a plan view.

[0095] As shown in Figures 5 and 6, the external terminal 20 (20-1), which will become the first external terminal after being incorporated into the semiconductor device, is created by punching and bending a conductive plate member, and integrally comprises an internal joining terminal portion 22, an external fixed terminal portion 24, and a support leg portion 25.

[0096] The external fixed terminal portion 24 is a conductive plate-like member having a width corresponding to the width of the base 28 of the terminal block 26 shown in Figures 1 and 2, and following the vertical terminal portion, a horizontal portion is formed that is bent by an external force during the manufacturing stage of the semiconductor device, and a screw through hole 32 is formed in the horizontal portion.In addition, on both sides of the bent portion extending from the vertical portion to the horizontal portion, a narrowed portion 2410 cut out in the shape of a small arc is formed to facilitate bending by an external force and make it possible to identify the bending position.

[0097] In addition, as a first structure of the external terminal, the vertical portion of the external fixed terminal portion 24 is bifurcated at the bottom, and an internal joining terminal portion 22 is formed on one side of the bifurcation, and a support leg portion 25 is formed on the other side of the bifurcation.

[0098] The internal joint terminal portion 22 is formed by bending downward the tip side of a horizontal portion 2210, which is a conductive plate-like member extending horizontally, to form a bent portion 2212, and by bending the lower end of the bent portion 2212 slightly horizontally to form a solder joint portion 2214, and a notched groove 2216 is formed on the tip surface of the solder joint portion 2214 to promote solder penetration and increase the bonding strength.

[0099] The support leg 25 extends below the vertical portion of the external fixed terminal 22, and the height of the tip of the support leg 25 is set so that it is flush with the lower surface of the solder joint 2214 formed at the tip of the internal joint terminal 22. Also, a notched groove 2510 is formed in the tip surface of the support leg 25 to promote solder penetration and increase bonding strength. Note that the notched groove 2510 is not necessary if the tip of the support leg 25 is to be abutted on the board without being joined by soldering.

[0100] (c2. Structure as a terminal part before incorporating external terminals) Next, the structure of the terminal component before being incorporated into a semiconductor device as an external terminal will be described. In this description, reference will be made to Fig. 7, which shows a punched component punched in the manufacture of an external terminal, Fig. 8, which shows a terminal component obtained by bending the punched component of Fig. 7, and Fig. 9, which shows the terminal component of Fig. 8 from three sides. Figs. 7(A) and 9(A) show side views, Figs. 7(B) and 9(B) show front views, and Fig. 9(C) shows a plan view.

[0101] When manufacturing the external terminal 20 (20-1) as a terminal part serving as a first external terminal to be incorporated into a semiconductor device, a stamped part 300 is manufactured by stamping a conductive metal plate such as a steel plate having a predetermined thickness, as shown in Fig. 7. The stamped part 300 has an external fixed terminal portion 24 having a predetermined plate width formed at the upper end, minute arc-shaped necked portions 2410 formed on both sides that become the bent portion, and a screw through-hole 32 formed in the bent portion on the upper end side.

[0102] The lower side of the external fixed terminal portion 24 is punched out so as to branch into two parts to form terminal portions of different lengths. The punched-out longer branch portion will become the internal joining terminal portion 22 by subsequent bending, and has a notched groove 2216 formed at its tip. The punched-out shorter branch portion will become the support terminal portion 25 as is, and has a notched groove 2510 formed at its tip.

[0103] The stamped part 300 thus stamped out from the metal plate is then bent to form the internal joint terminal portion 22, resulting in the terminal part 200 shown in Figures 8 and 9. The internal joint terminal portion 22 is bent by bending the longer, bifurcated terminal portion by 90° relative to the external fixed terminal portion 24 positioned in the vertical direction to form a horizontal portion 2210, bending the tip of the horizontal portion 2210 downward to form a bent portion 2212, and further bending the tip of the bent portion 2212 horizontally to form a joint portion 2214.

[0104] The support leg 25 has a shape produced by punching out the vertical portion of the external fixed terminal 24, which extends downward.

[0105] The terminal parts produced through the punching and bending processes are then cleaned to remove oil and other contaminants, and then plated with a specific metal, such as tin or nickel, and through the semiconductor device manufacturing process, they are assembled and fixed into the semiconductor device as shown in Figures 5 and 6.

[0106] (c3. Structure of the second external terminal) Next, the structure of the second external terminal, which is the external terminal 20 (20-2), will be described. In this description, reference will be made to FIG. 10, which shows the second external terminal incorporated in the semiconductor device of FIG. 1. Note that FIG. 10(A) shows the second external terminal incorporated in the semiconductor device, and FIG. 10(B) shows a punched part used in manufacturing the second external terminal. The second external terminal in FIG. 10(A) is shown with imaginary lines as a terminal part before the external fixed terminal portion is bent and fixed.

[0107] As shown in Figure 10(A), the external terminal 20 (20-2) as the second external terminal is, like the first external terminal, produced by punching and bending a conductive plate member, and integrally comprises an internal joining terminal portion 22, an external fixed terminal portion 24, and a support leg portion 25.

[0108] The external fixed terminal portion 24 has a vertical terminal portion followed by a horizontal portion that is bent by an external force during the manufacturing stage of the semiconductor device, and a screw-through hole 32 is formed in the horizontal portion. In addition, on both sides of the bent portion extending from the vertical portion to the horizontal portion, a narrowed portion 2410 cut out in a minute arc is formed to facilitate bending by an external force and make it possible to identify the bending position.

[0109] The vertical portion of the external fixed terminal portion 24 is bifurcated at the bottom, with the internal joining terminal portion 22 formed on one side and the support leg portion 25 formed on the other side.

[0110] The internal joint terminal portion 22 has a horizontal portion 2210 that extends horizontally after spreading outward from the vertical portion of the external fixed terminal portion 24, and the tip side of the horizontal portion 2210 is bent downward to form a bent portion 2212, and the lower end of the bent portion 2212 is bent slightly horizontally to form a solder joint portion 2214, and a notched groove 2216 is formed on the tip surface of the solder joint portion 2214.

[0111] The support leg 25 extends below the vertical portion of the external fixed terminal 22, and the height of the tip of the support leg 25 is set so that it is flush with the lower surface of the solder joint 2214 formed at the tip of the internal coupling terminal 22. A notched groove 2510 is formed in the tip surface of the support terminal 25 to promote solder penetration and increase bonding strength. Note that the notched groove 2510 is not necessary if the tip of the support leg 25 is to be abutted on the board without being joined by soldering.

[0112] In this way, the external terminal 20 (20-2) as the second external terminal differs from the external terminals 20 (20-1), 20 (20-3), and 20 (20-4) as the first external terminals only in the planar shape of the horizontal portion 2210 of the internal joint terminal portion 22, but is similar in that the vertical portion of the external fixed terminal portion 24 is bifurcated at the bottom, and a support leg portion 25 is formed on the other side of the split.

[0113] When manufacturing the external terminal 20 (20-2) as the second external terminal shown in Fig. 10(A) as a terminal part, a punched part 302 is manufactured by punching a conductive metal plate such as a steel plate having a predetermined thickness, as shown in Fig. 10(B). The punched part 302 has an external fixed terminal portion 24 having a predetermined plate width formed at the upper end, minute arc-shaped necked portions 2410 formed on both sides that become the bent portion, and a screw through-hole 32 formed in the bent portion on the upper end side.

[0114] The lower side of the external fixed terminal portion 24 is bifurcated to form terminal portions of different lengths, and the longer branched portion will become the internal joining terminal portion 22 by subsequent bending, so it is widened laterally and then extended in the branching direction, with a punched shape having a notch groove 2216 formed at its tip. The shorter branched portion punched out becomes the support terminal portion 25 as is, and has a notch groove 2510 formed at its tip.

[0115] The punched part 302 punched out from the metal plate in this manner is then bent to form the internal joining terminal portion 22, resulting in the terminal part 200 shown in Figure 10(A) before the tip of the external fixed terminal portion 24 is bent and fixed.

[0116] [d. Manufacturing Method of Semiconductor Device] Next, a method for manufacturing the semiconductor device of this embodiment will be described with reference to Fig. 11, which shows the manufacturing process of the semiconductor device, and Fig. 12, which shows the manufacturing process of the semiconductor device subsequent to Fig. 11.

[0117] The semiconductor device of this embodiment is manufactured through a first process shown in FIG. 11(A), a second and third process shown in FIG. 11(B), and a fourth process shown in FIGS. 12(C) and 12(D).

[0118] (d1. 1st step) First, the first step in the method for manufacturing a semiconductor device will be described. As shown in Fig. 11(A), the first step involves preparing a substrate 12 on which an insulating layer is formed on one side of a conductive metal plate and a circuit pattern of, for example, the diode bridge circuit shown in Fig. 4 is formed on the surface of the insulating layer, applying solder paste to the joints of the circuit pattern, and then performing a component insertion process in which a semiconductor element 14 and terminal components 200 are placed, followed by a reflow soldering process in which heating is performed in a heating furnace to melt the solder paste and then cooling, thereby joining the internal joint terminal portions 22 of the semiconductor element 14 and terminal components 200 to the circuit pattern on the substrate 12 and holding them electrically and mechanically.

[0119] Here, the terminal parts 200 constituting the external terminals are mechanically held in place by soldering the tips of the internal joint terminal parts 22 and the support legs 25. When the tips of the support legs 25 are brought into contact with the substrate, solder cream should not be applied to the contact surfaces of the support legs 25 on the substrate 12.

[0120] (d2. 2nd step) Next, the second step in the manufacturing method of the semiconductor device will be described. As shown in Fig. 11(B), in the second step, the substrate 12 on which the semiconductor element 14 and the terminal parts 200 have been arranged in the first step is adhesively fixed to the bottom of the case body 16 manufactured by resin molding. Next, the inside of the case body 16 is filled with a soft silicone gel 42 as a sealant to seal it.

[0121] (d3. 3rd step) Next, the third step in the manufacturing method of the semiconductor device will be described. As shown in Figure 11(B), in the third step, the lid member 18 is adhesively fixed to the top of the case body 16. At this time, a nut 36 is placed in a hexagonal hole 34 provided in a terminal block 26 of the lid member 18, and the external fixed terminal portion 24 of the terminal component 200 standing up from the board 12 is inserted into a slit-shaped terminal through-hole 30 formed on the outside of the terminal block 26, thereby adhesively fixing the lid member 18 to the case body 16.

[0122] (d4. 4th step) Next, the fourth step in the manufacturing method of the semiconductor device will be described. As shown in Fig. 12(C), in the fourth step, a roller 44 provided in a roller processing device is moved from right to left for the external fixed terminal 24 that has been taken out upward from the terminal block 26 of the cover member 18 in the third step in Fig. 11(B), for example, the external fixed terminal 24 that has been taken out on the right side, thereby performing roller processing to bend the external fixed terminal 24 and fix it to the terminal block 26, as shown in Fig. 12(D), thereby completing it as the external terminal 20 (20-1).

[0123] Next, the roller 44 provided on the roller processing device is moved in the opposite direction from left to right on the external fixed terminal 24 extending from the left side of the cover member 18 of the semiconductor device, thereby performing roller processing to bend the external fixed terminal portion 24 and fix it to the terminal block 26, and the external terminal 20 (20-1) is completed as shown in Figure 3(B).

[0124] Here, as shown in Figure 12 (C), when the external fixed terminal portion 24 is bent and fixed to the terminal block 26 by moving the roller 44, a force is applied that pushes the terminal part 200 in a direction perpendicular to the substrate 12, which becomes a force that deforms the terminal part 200.

[0125] However, in this embodiment, since the support legs 25 are formed integrally with the terminal component 200, the force that presses the terminal component 200 in a direction perpendicular to the substrate 12 due to bending of the external fixed terminal portion 24 is dispersed and received by the support legs 25. This suppresses deformation of the corner portion 40, which is the connecting portion between the horizontal internal joining terminal portion 22 and the vertical external fixed terminal portion 24, and when the external terminal 20 is completed, there is no change in the distance to the substrate 12 or no problems such as contact with other components, making it possible to improve manufacturing yield.

[0126] [e. Other embodiments of external terminals] Next, another embodiment of the external terminal will be described. In this description, reference will be made to Fig. 13, which shows three sides of another embodiment of the external terminal. Fig. 13(A) shows the external terminal of the other embodiment, and Fig. 13(B) shows a punched part manufactured by bending the part shown in Fig. 13(A).

[0127] 13(A), the external terminal 20 (20-1) of this embodiment is another embodiment of the first external terminal shown in FIGS. 5 and 6, and is characterized in that, as a second structure of the external terminal, the lower side of the vertical portion of the external fixed terminal portion 24 is branched into three, an internal terminal joint portion 22 is formed at the central branch portion, and the branch portions on both sides serve as support legs 25. In addition, the internal terminal joint portion 22 formed at the central branch portion has a wide horizontal portion 2210 that is bent into a rectangle so that the solder joint portion 2214 at the tip extends forward of one of the support legs 25.

[0128] 13(B), a punched part 304 is produced by punching a conductive metal plate such as a steel plate having a predetermined thickness. The punched part 304 has an external fixed terminal portion 24 having a predetermined width formed at the upper end, minute arc-shaped necked portions 2410 formed on both sides that become the bent portion, and a screw through-hole 32 formed in the bent portion on the upper end side.

[0129] The lower side of the external fixed terminal 24 is punched out so as to branch into three parts to form terminal portions of different lengths. The punched central branch portion will become the internal joining terminal 22 by subsequent bending, and has a notched groove 2216 formed at its tip. The punched shorter branch portions on both sides will become the support terminal portions 25 as they are, and have notched grooves 2510 formed at their tips.

[0130] In the external terminal 20 (20-1) of this embodiment, as shown in FIG. 3, when it is joined to the circuit pattern of the substrate 12 by soldering, the internal joining terminal portion 22 located in the center is supported and fixed to the substrate 12 by a pair of support legs 25 formed on both sides, and by forming the support legs 25 on both sides, it is possible to support and fix the external terminal 20 (20-1) to the substrate 12 with increased support strength and support balance.

[0131] Furthermore, when the external fixed terminal portion 24 is bent and fixed to the terminal block 26, even if a force is applied in a direction pushing the external terminal 20 vertically, the force can be received by the pair of support legs 25 and supported in a balanced manner, making it possible to more reliably suppress deformation of the external terminal 20.

[0132] The structure of this embodiment, in which the lower side of the vertical portion of the external fixed terminal portion 24 is branched into three, the internal terminal joint portion 22 is formed at the central branch portion, and the branch portions on both sides are the support legs 25, can also be applied to the external terminal 20 (20-2) as the second external terminal shown in Fig. 10. In this case, the internal joint terminal portion 22 formed at the center of the trifurcated portion may have a plate surface shape that extends toward the tip and then extends laterally, and then extends toward the tip as well.

[0133] [f. Modifications of the present invention] Modifications of the semiconductor device, terminal component, and method of manufacturing the semiconductor device according to the present invention will be described. The semiconductor device, terminal component, and method of manufacturing the semiconductor device according to the present invention include the following modifications in addition to the above-described embodiments.

[0134] (Semiconductor Devices) The above embodiment takes as an example a semiconductor device as a power module housing a diode bridge circuit (rectifier circuit) using power diodes as a semiconductor circuit, but is not limited to this and includes power modules used in devices equipped with appropriate semiconductor circuits constituted by power diodes, power transistors, etc., such as inverter devices, DC motor power supplies, DC power supplies for batteries, DC power supplies for industrial machinery, etc. The number of external terminals provided on a power module as a semiconductor device is the required number corresponding to the semiconductor circuits housed therein.

[0135] (Terminal block structure) The terminal block structure in the above embodiment is a structure in which the external fixed terminal portion of the external terminal is bent and fixed with a nut housed in a hexagonal hole formed in the base of the terminal block, but is not limited to this and includes any structure as long as it is a structure in which the external fixed terminal portion of the external terminal is bent and fixed to the terminal portion, and for example, a terminal structure in which a screw hole is formed integrally with the base of the terminal block provided on a cover member molded from insulating resin may be used.

[0136] (others) Furthermore, the present invention includes appropriate modifications that do not impair the objects and advantages thereof, and further, the present invention is not limited to the numerical values ​​shown in the above embodiment. [Explanation of symbols]

[0137] 10: Semiconductor device 12: Circuit board 14: Semiconductor element 16: Case body 18: Lid component 20(20-1)~20(20-4): External terminals 200: Terminal parts 22: Internal joint terminal part 2210:Horizontal part 2212: Bend 2214: Solder joint 2216, 2510: Notched groove 24: External fixed terminal section 2410: Hanging part 25: Support legs 26:Terminal block 28: Pedestal 30: Terminal hole 32: Screw hole 34:Hexagonal hole 36: Nut 38:Screw storage hole 40: Corner part 42: Soft silicone gel 44: Laura 300, 302, 304: Punched parts

Claims

1. a substrate on which a semiconductor circuit is mounted; a box-shaped case body disposed on the substrate so as to surround the semiconductor circuit; a cover member disposed on the opening of the case body to close it, the cover member having a terminal block formed on its outer surface; an external terminal provided with an internal joining terminal portion formed by bending a conductive plate-like member, the tip of which is bent toward the substrate and joined to a predetermined position of the semiconductor circuit portion; and an external fixed terminal portion which extends from a rear portion of the internal joining terminal portion toward the lid member, the tip of which is passed through a through-hole formed in the terminal block and taken out to the outside, and then is bent and fixed to the terminal block; A semiconductor device comprising: The semiconductor device is characterized in that the external terminal is provided integrally with a support leg portion for supporting an intermediate portion of the terminal relative to the substrate, in addition to the internal joining terminal portion and the external fixed terminal portion.

2. 2. The semiconductor device according to claim 1, The semiconductor device is characterized in that the support leg portion supports the terminal intermediate portion relative to the substrate so as to prevent deformation due to an external force applied when the tip of the external fixed terminal portion is bent and fixed to the terminal block.

3. 3. The semiconductor device according to claim 2, The semiconductor device is characterized in that the support leg portion of the external terminal supports the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected or a predetermined position in the vicinity thereof as the terminal intermediate portion relative to the substrate.

4. 2. The semiconductor device according to claim 1, the plate-shaped member of the external terminal has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, The external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is bifurcated into two branches, one of which has the internal joint terminal portion formed thereon and the other of which has the support leg portion formed thereon.

5. 2. The semiconductor device according to claim 1, the plate-shaped member of the external terminal has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, The external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into three parts, the internal joint terminal portion being formed on the central branch side, and the support legs being formed on both branch sides.

6. 2. The semiconductor device according to claim 1, The semiconductor device is characterized in that the tip of the support leg is joined to the substrate.

7. 2. The semiconductor device according to claim 1, The semiconductor device is characterized in that the tip of the support leg abuts against the substrate.

8. 2. The semiconductor device according to claim 1, The semiconductor device is characterized in that the external fixed terminal portion is bent and fixed to the terminal block by applying an external force by a roller device.

9. A terminal component used for an external terminal of a semiconductor device, in which a box-shaped case body is placed on a substrate so as to surround a periphery of a semiconductor circuit portion mounted on the substrate, and a lid member having a terminal block formed on an outer surface is placed on an opening of the case body to close the opening, A conductive plate-like member, an internal connection terminal portion whose tip is bent toward the substrate and connected to a predetermined position of the semiconductor circuit portion; an external fixed terminal portion extending from a rear portion of the internal joint terminal portion toward the cover member and having a tip inserted into a terminal through-hole formed in the terminal block and taken out to the outside; a support leg portion that supports the terminal intermediate portion on the substrate; A terminal part characterized in that:

10. The terminal part according to claim 9, The terminal component is characterized in that the support leg portion supports the terminal intermediate portion relative to the substrate so as to prevent deformation due to an external force applied when the tip of the external fixed terminal portion is bent and fixed to the terminal block.

11. The terminal part according to claim 10, The terminal component is characterized in that the support leg portion serves as the terminal intermediate portion, supporting the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected or a predetermined position in the vicinity thereof, relative to the board.

12. The terminal part according to claim 10, the plate-like member has a predetermined width and is bent and fixed to a rectangular base formed on the terminal block; The external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into at least two parts, with the internal joint terminal portion formed on one branch side and the support leg portion formed on the other branch side.

13. The terminal part according to claim 10, the plate-shaped member of the external terminal has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, The external fixed terminal portion is formed on one end side of the plate-like member, The other end of the plate-like member is branched into three parts, the internal joint terminal portion being formed on the central branch side, and the support leg portions being formed on both branch sides.

14. A method for manufacturing a semiconductor device, comprising: Mounting circuit components of a semiconductor circuit on a substrate, and arranging terminal components having internal joint terminals, external fixed terminals, and support legs, and joining at least the internal joint terminals to the substrate; a box-shaped case body is disposed on the substrate so as to surround the periphery of the semiconductor circuit; a cover member having a terminal block formed on its outer surface is placed on the opening of the case body to close it, and the external fixed terminal portion of the terminal component placed on the board is inserted into a slit-shaped terminal through-hole formed in the terminal block of the cover member to be taken out to the outside; a method for manufacturing a semiconductor device, comprising: applying an external force to an external fixed terminal portion of the terminal component removed from the cover member, thereby bending and fixing the external fixed terminal portion to the terminal block;

15. 15. The method for manufacturing a semiconductor device according to claim 14, The internal joint terminal portion of the terminal component is formed by bending a tip of a conductive plate-like member toward the substrate and joining it to a predetermined position of the semiconductor circuit portion, the external fixed terminal portion of the terminal component extends from the rear portion of the internal joint terminal portion toward the cover member, and has a tip end that passes through a terminal through-hole formed in the terminal block and is taken out to the outside; The method for manufacturing a semiconductor device, wherein the support leg portion of the terminal component is arranged so as to support the intermediate portion of the terminal relative to the substrate.

16. 16. The method for manufacturing a semiconductor device according to claim 15, A method for manufacturing a semiconductor device, characterized in that the support leg portion of the terminal component supports the intermediate portion of the terminal relative to the substrate so as to prevent deformation due to external force applied when the tip of the external fixed terminal portion is bent and fixed to the terminal block.

17. 16. The method for manufacturing a semiconductor device according to claim 15, A method for manufacturing a semiconductor device, characterized in that the support leg portion of the terminal component supports the corner portion where the internal joining terminal portion and the external fixed terminal portion are connected or a predetermined position in the vicinity thereof as the terminal intermediate portion relative to the substrate.

18. 18. The method for manufacturing a semiconductor device according to claim 17, the plate-like member has a predetermined width and is bent and fixed to a rectangular base formed on the terminal block; The external fixed terminal portion is formed on one end side of the plate-like member, A method for manufacturing a semiconductor device, characterized in that the other end of the plate-shaped member is branched into at least two branches, the internal joint terminal portion is formed on one branch side, and the support leg portion is formed on the other branch side.

19. 18. The method for manufacturing a semiconductor device according to claim 17, the plate-shaped member of the external terminal has a predetermined plate width that is bent and fixed to a rectangular base formed on the terminal block, The external fixed terminal portion is formed on one end side of the plate-like member, A method for manufacturing a semiconductor device, characterized in that the other end of the plate-shaped member is branched into three, the internal joint terminal portion is formed on the central branch side, and the support leg portions are formed on both branch sides.

20. 18. The method for manufacturing a semiconductor device according to claim 17, A method of manufacturing a semiconductor device, characterized in that when the terminal component is placed on the substrate, the tip of the support leg is joined to the substrate.

21. 18. The method for manufacturing a semiconductor device according to claim 17, A method of manufacturing a semiconductor device, characterized in that when the terminal component is placed on the substrate, the tip of the support leg is brought into contact with the substrate.

22. 18. The method for manufacturing a semiconductor device according to claim 17, The method for manufacturing a semiconductor device, wherein the external fixed terminal portion is bent and fixed to the terminal block by applying an external force by a roller device.

23. 18. The method for manufacturing a semiconductor device according to claim 17, A method for manufacturing a semiconductor device, wherein when the lid member is placed over the opening of the case body to close it, the case body is filled with a soft sealing material for sealing.

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