Holding member

Abstract

To provide a technology capable of enhancing heat conductivity of the whole adhesive member while maintaining flexibility, in the adhesive member.SOLUTION: A holding member comprises a first member, a second member, and an adhesive member for bonding the first and second members together. The adhesive member contains a filler. The filler contains a spherical filler and an amorphous filler. An average diameter of the spherical filler is smaller than a maximum value of a minor axis of the amorphous filler.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a retaining member. [Background technology]

[0002] As a holding member for holding an object, an electrostatic chuck that holds a wafer as the object by electrostatic attraction is known. For example, Patent Document 1 discloses an electrostatic chuck that includes a ceramic dielectric having electrodes formed on its surface, a ceramic substrate that supports the ceramic dielectric, and an adhesive member that bonds the ceramic dielectric to the ceramic substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5557164 Summary of the Invention [Problem to be solved by the invention]

[0004] In the electrostatic chuck described in Patent Document 1, the spherical filler and amorphous filler contained in the adhesive member were not designed to maintain the flexibility of the adhesive member while improving the thermal conductivity of the entire adhesive member. Therefore, there has been a demand for a technology that can increase the thermal conductivity of the entire adhesive member while maintaining the flexibility of the adhesive member.

[0005] The present invention has been made to solve at least part of the above-mentioned problems, and aims to provide a technology that can increase the thermal conductivity of an adhesive member as a whole while maintaining its flexibility. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following forms. (1) According to one aspect of the present invention, there is provided a holding member comprising a first member, a second member, and an adhesive member that bonds the first member and the second member, the adhesive member including a filler, the filler including spherical filler and amorphous filler, and an average diameter of the spherical filler being smaller than the maximum minor axis of the amorphous filler.

[0007] When the amorphous filler and the spherical filler have the same volume, the surface area of ​​the amorphous filler is larger than that of the spherical filler. Therefore, compared to the spherical filler contained in the adhesive member, the amorphous filler contained in the adhesive member has a larger contact area with the material containing the filler, resulting in higher thermal conductivity to the material, thereby increasing the thermal conductivity of the entire adhesive member. On the other hand, if the filler contained in the adhesive member is entirely amorphous, the filler cannot be packed into the adhesive member at a high density, limiting the degree to which the adhesive member can achieve high thermal conductivity. According to the above-described configuration, the adhesive member contains spherical filler and amorphous filler, but the average diameter of the spherical filler is smaller than the maximum minor axis of the amorphous filler. Therefore, compared to when the filler contained in the adhesive member is entirely amorphous, the filler can be packed into the adhesive member at a high density, thereby increasing the thermal conductivity of the adhesive member. Furthermore, according to the above-mentioned configuration, the amorphous filler contained in the amorphous filler has a relatively large volume, which increases the thermal conductivity to the material containing the filler, and the inclusion of spherical filler ensures flexibility, so that the thermal conductivity of the entire adhesive member can be increased while maintaining flexibility.

[0008] (2) In the holding member of the above embodiment, the maximum value of the major axis of the spherical filler may be equal to or greater than the maximum value of the major axis of the amorphous filler. The physical properties of the filler with the larger maximum major axis, either the spherical filler or the amorphous filler, contained in the adhesive member are significantly reflected in the physical properties of the adhesive member. Amorphous fillers tend to have a longer major axis than spherical fillers. Therefore, if the maximum major axis of the amorphous filler is equal to or greater than the maximum major axis of the spherical filler, there is a concern that the adhesive member will vary in thickness and that the filler will frequently protrude from the adhesive member surface, making it difficult to form a thin adhesive member. In contrast, according to the above-described configuration, the maximum major axis of the spherical filler is equal to or greater than the maximum major axis of the amorphous filler, making the adhesive member less variable in thickness and less likely to protrude from the adhesive member surface, thereby enabling the adhesive member to be formed thin. Furthermore, because spherical fillers contribute more to flexibility than amorphous fillers, this configuration enhances the flexibility of the adhesive member, thereby reducing thermal stresses that occur between the first and second members bonded via the adhesive member. As a result, deformations such as warping of the holding member due to thermal stress can be suppressed.

[0009] (3) In the holding member of the above embodiment, the proportion of the spherical filler particles contained in the filler, based on the number of particles, may be greater than the proportion of the amorphous filler particles contained in the filler, based on the number of particles. With this configuration, the proportion of the spherical filler particles by number is greater than the proportion of the amorphous filler particles by number, so the physical properties of the spherical filler particles are significantly reflected in the physical properties of the adhesive member. In other words, with this configuration, the adhesive member can be filled with filler particles at a high density while maintaining flexibility, and the thermal conductivity of the entire adhesive member can also be increased.

[0010] (4) In the holding member of the above embodiment, the thickness of the adhesive member is 100 μm or less, The maximum major axis of the spherical filler and the maximum major axis of the amorphous filler may be smaller than the thickness of the adhesive member. With this configuration, the adhesive member is relatively thin, which reduces the thermal resistance of the adhesive member and also makes it difficult for both the spherical filler particles and the amorphous filler particles to protrude from the surface of the adhesive member.

[0011] (5) In the holding member of the above embodiment, the maximum value of the major axis of the filler may be greater than a value obtained by multiplying the thickness of the adhesive member by 1 / 2. Generally, in the filler and the material containing the filler that constitute the adhesive member, the thermal conductivity of the filler is higher than the thermal conductivity of the material containing the filler. According to this configuration, the filler contains fillers with a major axis greater than 1 / 2 the thickness of the adhesive member. Therefore, when heat is conducted by such fillers, the heat is conducted more efficiently than when heat is conducted only by the material containing the filler, thereby reducing the thermal resistance of the adhesive member.

[0012] The present invention can be realized in various forms, for example, a holding member, an electrostatic chuck including an electrostatic electrode that generates electrostatic attraction between the holding member and the holding surface of the holding member, a vacuum chuck, a ceramic heater, a semiconductor manufacturing apparatus, a component including any of these, and a manufacturing method for these. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is an explanatory diagram showing a cross-sectional configuration of a holding member according to an embodiment of the present invention. [Figure 2] FIG. 2 is an enlarged view showing a cross-sectional configuration of an adhesive member. [Figure 3] FIG. 1 is an explanatory diagram of a spherical filler and an amorphous filler. [Figure 4] FIG. 3 is an explanatory diagram showing the particle size distribution of a filler contained in an adhesive member. [Figure 5] 10A and 10B are explanatory diagrams comparing the adhesive member of the present embodiment with an adhesive member of a comparative example. DETAILED DESCRIPTION OF THE INVENTION

[0014] FIG. 1 is an explanatory diagram schematically illustrating a cross-sectional configuration of a holding member 1 according to an embodiment of the present invention. The holding member 1 is an electrostatic chuck that attracts and holds a semiconductor wafer W, which is an object, by electrostatic attraction. The arrows in FIG. 1 indicate the direction in which the semiconductor wafer W is attracted to the holding member 1. The holding member 1 is used, for example, to fix the semiconductor wafer W in a vacuum chamber of a semiconductor manufacturing device. The holding member 1 includes a ceramic member 10, a base member 20, an adhesive member 30, an electrostatic electrode 40, and a heater electrode 50.

[0015] The ceramic member 10 is a disk-shaped member made of ceramic. Examples of materials that can be used to form the ceramic member 10 include aluminum oxide (alumina, Al2O3) and aluminum nitride (AlN), and in this embodiment, the ceramic member 10 is made of alumina. The ceramic member 10 has an adsorption surface 10f. The adsorption surface 10f is a circular surface that adsorbs the semiconductor wafer W. The adsorption surface 10f can also be considered a holding surface that holds the semiconductor wafer W as an object.

[0016] The base member 20 is a disk-shaped member having a larger diameter than the ceramic member 10, and is made of metal or various composite materials. The metal used to form the base member 20 is preferably aluminum (Al), titanium (Ti), or an alloy thereof. The composite material used to form the base member 20 is preferably a composite material obtained by melting an aluminum alloy, the main component of which is aluminum, into a porous ceramic, the main component of which is silicon carbide (SiC), and then pressurizing and infiltrating the melted aluminum alloy. The aluminum alloy contained in the composite material may contain silicon (Si) or magnesium (Mg), or may contain other elements as long as they do not affect the properties, etc.

[0017] A coolant flow path 21 is formed inside the base member 20. When a coolant (e.g., a fluorine-based inert liquid or water) flows through the coolant flow path 21, the base member 20 is cooled. At this time, the ceramic member 10 is also cooled by heat transfer (heat dissipation) between the base member 20 and the ceramic member 10 via the adhesive member 30, and the semiconductor wafer W attracted to the attracting surface 10f of the ceramic member 10 is also cooled.

[0018] The adhesive member 30 is disposed between the ceramic member 10 and the base member 20 and bonds the ceramic member 10 and the base member 20. The ceramic member 10 and the base member 20 correspond to a first member and a second member bonded to each other via the adhesive member 30. The terms "first member" and "second member" are used to refer to the members bonded to each other via the adhesive member 30. The adhesive member 30 is a resin layer R (shown in FIG. 2, which will be described later) that bonds the ceramic member 10 and the base member 20. The resin layer R contains a filler F (shown in FIG. 2, which will be described later). When the sum of the volume percentage of the resin layer R in the adhesive member 30 and the volume percentage of the filler F in the adhesive member 30 is 100 vol%, the volume percentage of the filler F in the adhesive member 30 is 60 vol%. The thickness Th of the adhesive member 30 is 100 μm.

[0019] For example, silicone resin, acrylic resin, or epoxy resin can be used as the resin constituting the resin layer R. Among these resins, silicone resin has a relatively low elastic modulus, and therefore has a high function of alleviating thermal stress generated in the adhesive member 30, and the adhesive member 30 also has a relatively high heat resistance temperature, making it desirable as the resin constituting the resin layer R. In this embodiment, the resin constituting the resin layer R is silicone resin.

[0020] Examples of materials that can be used as the filler F include aluminum nitride (AlN), aluminum oxide (alumina: Al2O3), zirconium oxide (zirconia: ZrO2), yttrium oxide (yttria: Y2O3), yttrium fluoride (YF3), silicon carbide (SiC), silicon nitride (Si3N4), silicon dioxide (silica: SiO2), barium sulfate, and calcium carbonate. Among these materials, aluminum nitride, aluminum oxide, and silicon carbide are desirable materials for the filler F because they have relatively high thermal conductivities and therefore make it easier to reduce the thermal resistance of the adhesive member 30. In this embodiment, the material used for the filler F is aluminum nitride.

[0021] The electrostatic electrode 40 is a disk-shaped member provided inside the ceramic member 10 and is made of a conductive material such as tungsten or molybdenum. When power is supplied to the electrostatic electrode 40 from an external power source (not shown), the electrostatic electrode 40 generates an electrostatic attraction force on the attraction surface 10f. The semiconductor wafer W is attracted toward the attraction surface 10f by this electrostatic attraction force and is thereby held on the attraction surface 10f.

[0022] The heater electrode 50 is provided inside the ceramic member 10 and is made of a conductive material such as tungsten or molybdenum. The heater electrode 50 generates heat when power is supplied from an external power source (not shown). This heat warms the ceramic member 10, and the semiconductor wafer W attracted to the attracting surface 10f of the ceramic member 10 is also heated.

[0023] 2 is an enlarged view of the cross-sectional configuration of the adhesive member 30. As described above, the adhesive member 30 is a resin layer R containing a filler F. In FIG. 2, the portion of the adhesive member 30 other than the filler F represents the resin layer R. In general, the thermal conductivity of the filler F is higher than the thermal conductivity of the resin layer R.

[0024] FIG. 3 is an explanatory diagram of spherical filler Fs and amorphous filler Fa. Filler F includes spherical filler Fs and amorphous filler Fa. Spherical filler Fs is a filler F with an aspect ratio of less than 1.4. Amorphous filler Fa is a filler F with an aspect ratio of 1.4 or more. The aspect ratio is the value obtained by dividing the major axis length of filler F by the minor axis length of filler F. The aspect ratio is calculated using the major axis and minor axis length of each filler F, which are approximated as an ellipse after binarizing a cross-sectional image of the adhesive member 30 photographed with a scanning electron microscope (SEM). The cross-sectional image of the adhesive member 30 was photographed after processing the cross-section of the adhesive member 30 with a Cross-Section Polisher (registered trademark) (CP) and then imparting conductivity to the cross-section by carbon vapor deposition. The conditions for photographing with the scanning electron microscope are preferably an acceleration voltage of 15 kV and a magnification of 300x. In order to ensure a sufficient number of particles for evaluating the particle size distribution (see FIG. 4), which will be described later, the magnification factor when capturing a cross-sectional image may be adjusted as appropriate. Furthermore, in order to ensure a sufficient number of particles for evaluating the particle size distribution (see FIG. 4), which will be described later, the cross-sectional image may be captured at multiple locations. Figure 2(A) illustrates a spherical filler Fs, which is a filler with an aspect ratio (long diameter L / short diameter S) of less than 1.4. Figure 2(B) illustrates an amorphous filler Fa, which is a filler with an aspect ratio (long diameter L / short diameter S) of 1.4 or more. The short diameter S shown in FIG. 2 indicates the short diameter S of the amorphous filler Fa.

[0025] FIG. 4 is an explanatory diagram showing the particle size distribution of the filler F contained in the adhesive member 30. In detail, FIG. 4 shows the particle size distribution when 100 fillers F were randomly selected from a cross-sectional image of the adhesive member 30 taken with an SEM. The horizontal axis of FIG. 4 shows the particle size (diameter) of each filler F. The vertical axis of FIG. 4 shows the frequency of occurrence of fillers F of each particle size based on the number. The dashed-dotted line DL shows the frequency of occurrence of fillers F by particle size. The thick line HL shows the frequency of occurrence of spherical fillers Fs by particle size. The thin line TL shows the frequency of occurrence of amorphous fillers Fa by particle size.

[0026] The average diameter of the spherical filler Fs contained in the adhesive member 30 is smaller than the maximum value of the minor axis of the amorphous filler Fa contained in the adhesive member 30. The average diameter of the spherical filler Fs was determined by binarizing a cross-sectional image of the adhesive member 30 photographed by SEM and then dividing the area of ​​each filler F by the area of ​​a perfect circle (πr 2 ) approximation, this corresponds to the median diameter (2r) of each filler F. The maximum minor axis of the amorphous filler Fa is the maximum length of the minor axes of each amorphous filler Fa. In the particle size distribution shown in Figure 4, the average diameter of the spherical filler Fs was 7.651 μm, and the maximum minor axis of the amorphous filler Fa was 22.45 μm.

[0027] Furthermore, the maximum value of the major axis of the spherical filler Fs contained in the adhesive member 30 is equal to or greater than the maximum value of the major axis of the amorphous filler Fa contained in the adhesive member 30. The maximum value of the major axis of the spherical filler Fs is the maximum length value of the major axes of each of the spherical filler Fs. Similarly, the maximum value of the major axis of the amorphous filler Fa is the maximum length value of the major axes of each of the amorphous filler Fa. In the particle size distribution shown in FIG. 4, the maximum value of the major axis of the spherical filler Fs was 53.57 μm, and the maximum value of the major axis of the amorphous filler Fa was 38.62 μm.

[0028] Furthermore, in the adhesive member 30, the proportion by number of spherical filler Fs contained in the filler F is greater than the proportion by number of amorphous filler Fa contained in the filler F. In the particle size distribution shown in FIG. 4, the proportion by number of spherical filler Fs contained in the filler F was 62%, and the proportion by number of amorphous filler Fa contained in the filler F was 38%.

[0029] Furthermore, in the adhesive member 30, the maximum major axis value of the spherical filler Fs contained in the adhesive member 30 and the maximum major axis value of the amorphous filler Fa contained in the adhesive member 30 are smaller than the thickness of the adhesive member 30. As described above, in the particle size distribution shown in Fig. 4, the maximum major axis value of the spherical filler Fs is 53.57 µm, and the maximum major axis value of the amorphous filler Fa is 38.62 µm. Meanwhile, the thickness Th of the adhesive member 30 is 100 µm.

[0030] Furthermore, in the adhesive member 30, the maximum value of the major axis of the filler F is larger than the value obtained by multiplying the thickness of the adhesive member 30 by 1 / 2. As described above, in the particle size distribution shown in Fig. 4, the maximum value of the major axis of the spherical filler Fs is 53.57 µm, and the maximum value of the major axis of the amorphous filler Fa is 38.62 µm, so the maximum value of the major axis of the filler F is 53.57 µm. Meanwhile, the thickness Th of the adhesive member 30 is 100 µm, so the value obtained by multiplying the thickness of the adhesive member 30 by 1 / 2 is 50 µm.

[0031] FIG. 5 is an explanatory diagram comparing the physical properties of the adhesive member 30 of this embodiment and an adhesive member 30c of a comparative example. The adhesive member 30c of the comparative example differs from the adhesive member 30 in that the volume percentage of the filler F in the adhesive member 30c is 40 vol%. The adhesive member 30c of the comparative example also differs from the adhesive member 30 in that the average diameter of the spherical filler Fs contained in the adhesive member is larger than the maximum minor axis of the amorphous filler Fa. The adhesive member 30c of the comparative example also differs from the adhesive member 30 in that the maximum major axis of the spherical filler Fs is smaller than the maximum major axis of the amorphous filler Fa. The adhesive member 30c of the comparative example also differs from the adhesive member 30 in that the proportion of the spherical filler Fs contained in the filler F, based on the number of particles, is smaller than the proportion of the amorphous filler Fa contained in the filler F, based on the number of particles. The adhesive member 30c of the comparative example differs from the adhesive member 30 in that the maximum value of the major axis of the filler F is smaller than the value obtained by multiplying the thickness of the adhesive member by 1 / 2. On the other hand, the adhesive member 30c of the comparative example is the same as the adhesive member 30 in that the thickness of the adhesive member is 100 μm, and the maximum value of the major axis of the spherical filler Fs and the maximum value of the major axis of the amorphous filler Fa are smaller than the thickness of the adhesive member 30.

[0032] As shown in FIG. 5 , the adhesive member 30 of this embodiment had a modulus of elasticity (MPa) of 3.1, while the adhesive member 30c of the comparative example had a modulus of elasticity (MPa) of 2.6. The adhesive member 30 of this embodiment had a rubber hardness (Shore A) of 61, while the adhesive member 30c of the comparative example had a rubber hardness (Shore A) of 52. The adhesive member 30 of this embodiment had a thermal conductivity (W / mk) of 2.4, while the adhesive member 30c of the comparative example had a thermal conductivity (W / mk) of 1.2. These results confirm that the adhesive member 30 of this embodiment and the adhesive member 30c of the comparative example have comparable flexibility, while the adhesive member 30 of this embodiment has a higher thermal conductivity than the adhesive member 30c of the comparative example.

[0033] The elastic modulus of the adhesive member 30 can be measured by the following measurement method. A known tensile tester (e.g., Shimadzu Corporation's Autograph (AG-X plus 5kN)) was used to measure the tensile modulus of the adhesive member 30 during a tensile test. Test specimens for measurement were prepared by coating the adhesive member 30, curing it at 100°C for 10 hours, and then curing it at 150°C for 50 hours, followed by cutting it into a 10 mm wide x 70 mm long strip. The thickness of the adhesive member 30 was 100 μm. The tensile modulus of the adhesive member 30 was measured by holding each 20 mm long section from each end of the test specimen with a jig, and measuring the tensile modulus at a 30 mm long section in the middle. Specifically, the test specimen (adhesive member 30) was pulled at a pulling rate of 50 mm / min until it broke, and the change in load with sample length was measured. The tensile stress is calculated by dividing the load by the cross-sectional area of ​​the test piece (width 10 mm × thickness 100 μm). The tensile modulus was calculated by calculating the slope of a graph in which the tensile stress is in the range of 0.2 to 0.5 MPa, with the strain calculated by the following formula (1) on the horizontal axis and the tensile stress on the vertical axis. Strain (%) = [Sample length during tension (mm) – Original sample length (mm)] / Original sample length (mm) (1)

[0034] The rubber hardness (Shore A) can be measured using a durometer type A specified in JIS-K6253. For example, the adhesive member 30 is placed in a PTFE dish having a diameter of 30 mm and a depth of 10 mm, cured at 100°C for 10 hours, and then further cured at 150°C for 50 hours, after which it can be removed from the PTFE dish and measured.

[0035] When the amorphous filler Fa and the spherical filler Fs have the same volume, the surface area of ​​the amorphous filler Fa is larger than the surface area of ​​the spherical filler Fs. Therefore, the amorphous filler Fa contained in the adhesive member 30 has a larger contact area with the resin (resin layer R) containing the filler F in the adhesive member 30 than the spherical filler Fs contained in the adhesive member 30, and therefore has higher thermal conductivity to the resin (resin layer R), thereby increasing the thermal conductivity of the entire adhesive member 30. On the other hand, when the filler F contained in the adhesive member 30 is entirely amorphous filler Fa, the filler F cannot be packed into the adhesive member 30 at a high density, and therefore there is a limit to how high the thermal conductivity of the adhesive member 30 can be achieved. In the adhesive member 30 of the embodiment described above, the adhesive member 30 contains spherical filler Fs and amorphous filler Fa, but the average diameter of the spherical filler Fs contained in the adhesive member 30 is smaller than the maximum minor axis of the amorphous filler Fa contained in the adhesive member 30. Therefore, compared to when all the filler F contained in the adhesive member 30 is amorphous filler Fa, the filler F can be packed into the adhesive member 30 at a higher density, thereby increasing the thermal conductivity of the adhesive member 30. Furthermore, the amorphous filler Fa contained in the amorphous filler Fa, which has a relatively large volume, also increases the thermal conductivity to the resin layer R, and the inclusion of spherical filler Fs ensures flexibility, so that the thermal conductivity of the entire adhesive member 30 can be increased while maintaining flexibility.

[0036] The physical properties of the adhesive member 30 are largely influenced by the physical properties of the filler F, which has a larger maximum major axis value between the spherical filler Fs and the amorphous filler Fa. The amorphous filler Fa tends to have a longer major axis value than the spherical filler Fs. Therefore, if the maximum major axis value of the amorphous filler Fa contained in the adhesive member 30 is equal to or greater than the maximum major axis value of the spherical filler Fs contained in the adhesive member 30, there is a concern that the thickness Th of the adhesive member 30 will vary and that the filler F will frequently protrude from the surface of the adhesive member 30, making it difficult to form the adhesive member 30 thin. In contrast, in the adhesive member 30 of the above-described embodiment, the maximum major axis value of the spherical filler Fs contained in the adhesive member 30 is equal to or greater than the maximum major axis value of the amorphous filler Fa contained in the adhesive member 30. Therefore, the thickness Th of the adhesive member 30 is less likely to vary, and the filler F is less likely to protrude from the surface of the adhesive member 30. Therefore, the adhesive member 30 can be formed thin. Furthermore, since the spherical filler Fs contributes more to flexibility than the amorphous filler Fa, the flexibility of the adhesive member 30 of the above-described embodiment is increased, and therefore it is possible to alleviate thermal stress occurring between the ceramic member 10 and the base member 20 bonded via the adhesive member 30. As a result, it is possible to suppress deformation such as warping occurring in the holding member 1 due to thermal stress.

[0037] Furthermore, in the adhesive member 30 of the above-described embodiment, the proportion by number of spherical fillers Fs contained in the filler F is greater than the proportion by number of amorphous fillers Fa contained in the filler F, and therefore the physical properties of the spherical fillers Fs are significantly reflected in the physical properties of the adhesive member 30. That is, in the adhesive member 30 of the above-described embodiment, the filler F can be packed at a high density while maintaining flexibility, and therefore the thermal conductivity of the entire adhesive member 30 can also be increased.

[0038] Furthermore, in the adhesive member 30 of the above-described embodiment, the thickness Th of the adhesive member 30 is 100 μm, and the maximum value of the major axis of the spherical filler Fs contained in the adhesive member 30 and the maximum value of the major axis of the amorphous filler Fa contained in the adhesive member 30 are smaller than the thickness of the adhesive member 30. Therefore, since the thickness Th of the adhesive member is relatively thin, it is possible to reduce the thermal resistance of the adhesive member 30. It is also possible to make it difficult for both the spherical filler Fs and the amorphous filler Fa to protrude from the surface of the adhesive member 30.

[0039] Generally, in the filler F constituting the adhesive member 30 and the resin (resin layer R) containing the filler F, the filler F has a higher thermal conductivity than the resin. In the adhesive member 30 of the above-described embodiment, the filler F contains filler F having a major axis greater than the value obtained by multiplying the thickness Th of the adhesive member 30 by 1 / 2. Therefore, when heat is conducted by such filler F, the heat is conducted more efficiently than when heat is conducted only by the resin (resin layer R) containing the filler F, and the thermal resistance of the adhesive member 30 can be reduced.

[0040] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0041] In the above embodiment, the ceramic member 10 and the base member 20 correspond to the first member and the second member bonded to each other via the adhesive member 30, but this is not limiting. As long as the members are bonded to each other via the adhesive member 30 in the holding member that holds the object, the bonded members correspond to the first member and the second member.

[0042] In the above embodiment, the thickness Th of the adhesive member 30 is 100 μm, but is not limited to this. The thickness Th of the adhesive member 30 may be any thickness as long as it is 100 μm or less. Of course, it is desirable that the thickness Th of the adhesive member 30 be as thin as possible in order to reduce the thermal resistance caused by the adhesive member 30.

[0043] In the above embodiment, the adhesive member 30 has an average diameter of the spherical filler Fs contained in the adhesive member 30 that is smaller than the maximum value of the minor axis of the amorphous filler Fa contained in the adhesive member 30, and the maximum value of the major axis of the spherical filler Fs contained in the adhesive member 30 is equal to or greater than the maximum value of the major axis of the amorphous filler Fa contained in the adhesive member 30, and the proportion of the spherical filler Fs contained in the filler F on a number basis is greater than the proportion of the amorphous filler Fa contained in the filler F on a number basis, but is not limited to this. For example, the adhesive member 30 may have an average diameter of the spherical filler Fs contained in the adhesive member 30 that is smaller than the maximum value of the minor axis of the amorphous filler Fa contained in the adhesive member 30, but may satisfy either one of the following: the maximum value of the major axis of the spherical filler Fs contained in the adhesive member 30 is equal to or greater than the maximum value of the major axis of the amorphous filler Fa contained in the adhesive member 30; or the proportion of the spherical filler Fs contained in the filler F, by number, is greater than the proportion of the amorphous filler Fa contained in the filler F by number. Of course, from the viewpoints of forming the adhesive member 30 thin, filling the filler F at a high density, and maintaining the flexibility of the adhesive member 30, it is preferable that both of these conditions be satisfied.

[0044] In the adhesive member 30 of the above embodiment, the maximum value of the major axis of the filler F is larger than the value obtained by multiplying the thickness of the adhesive member 30 by 1 / 2, but this is not limited to this. The maximum value of the major axis of the filler F may be smaller than the value obtained by multiplying the thickness of the adhesive member 30 by 1 / 2. Of course, from the viewpoint of reducing the thermal resistance of the adhesive member 30, it is preferable that the maximum value of the major axis of the filler F is larger than the value obtained by multiplying the thickness of the adhesive member 30 by 1 / 2.

[0045] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate.

[0046] The present invention can also be realized in the following forms. [Application example 1] A holding member, A first member; A second member; an adhesive member that bonds the first member and the second member, the adhesive member includes a filler, The filler includes a spherical filler and an amorphous filler, A holding member, wherein the average diameter of the spherical filler is smaller than the maximum value of the minor axis of the amorphous filler. [Application example 2] The holding member according to Application Example 1, A holding member, characterized in that the maximum value of the major axis of the spherical filler is equal to or greater than the maximum value of the major axis of the amorphous filler. [Application example 3] The holding member according to Application Example 1 or Application Example 2, A retaining member, characterized in that the proportion of the spherical filler particles contained in the filler, based on the number of particles, is greater than the proportion of the amorphous filler particles contained in the filler, based on the number of particles. [Application example 4] The holding member according to any one of Application Examples 1 to 3, The adhesive member has a thickness of 100 μm or less, A holding member, characterized in that the maximum major axis value of the spherical filler and the maximum major axis value of the amorphous filler are smaller than the thickness of the adhesive member. [Application example 5] The holding member according to any one of Application Examples 1 to 4, A holding member, wherein the maximum value of the major axis of the filler is greater than a value obtained by multiplying the thickness of the adhesive member by 1 / 2. [Explanation of symbols]

[0047] 1...Holding member 10...Ceramics components 10f…Adsorption surface 20...Base member 21... Refrigerant flow path 30...Adhesive material 40...Electrostatic electrode 50...Heater electrode F...Filler Fs: spherical filler Fa...amorphous filler R…Resin layer

Claims

1. A holding member, A first member; A second member; an adhesive member that bonds the first member and the second member, the adhesive member includes a filler, The filler includes a spherical filler and an amorphous filler, A holding member, wherein the average diameter of the spherical filler is smaller than the maximum value of the minor axis of the amorphous filler.

2. The holding member according to claim 1, A holding member, characterized in that the maximum value of the major axis of the spherical filler is equal to or greater than the maximum value of the major axis of the amorphous filler.

3. The holding member according to claim 1 or 2, A retaining member, characterized in that the proportion of the spherical filler particles contained in the filler, based on the number of particles, is greater than the proportion of the amorphous filler particles contained in the filler, based on the number of particles.

4. The holding member according to claim 1 or 2, The adhesive member has a thickness of 100 μm or less, A holding member, characterized in that the maximum major axis value of the spherical filler and the maximum major axis value of the amorphous filler are smaller than the thickness of the adhesive member.

5. The holding member according to claim 1 or 2, A holding member, wherein the maximum value of the major axis of the filler is greater than a value obtained by multiplying the thickness of the adhesive member by 1 / 2.

Images