Alignment device, film deposition apparatus and film deposition method

Abstract

To provide an alignment device that can reduce or avoid the influence of natural vibration in a structure to improve control performance and achieve high alignment accuracy while keeping device costs low even with a substrate of a larger size.SOLUTION: An alignment device includes: a substrate holder for holding a substrate; a mask holder for holding a mask so as to face the substrate; a support member for supporting the substrate holder and the mask holder; position detection means for detecting a first relative position between the substrate holder and the mask holder; and a first drive mechanism for generating an electromagnetic force between the substrate holder and the mask holder on the basis of information on the first relative position. The substrate holder is supported on the support member in a noncontact manner via a first vibration isolation mechanism or via a first flotation mechanism. The mask holder is supported on the support member in a non-contact manner via a second vibration isolation mechanism or via a second flotation mechanism.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an alignment apparatus, a film formation apparatus, and a film formation method. [Background technology]

[0002] Organic electroluminescence (EL) display devices (organic EL displays) are well known as one type of display device. Their application fields are expanding beyond smartphones, televisions, and automotive displays to include virtual reality head-mounted displays (VR HMDs). In particular, displays used in VR HMDs require highly accurate pixel patterns, i.e., high resolution, to reduce dizziness in users.

[0003] In the manufacture of organic EL displays, when forming the organic light-emitting elements (organic EL elements; OLEDs) that make up the organic EL display, film-forming material emitted from a film-forming source in a film-forming device is deposited on a substrate through a mask with a pixel pattern formed on it, thereby forming the organic material layers and metal layers of the organic EL elements.

[0004] In such a film formation apparatus, an alignment process is performed before the film formation process to improve film formation accuracy. The alignment process is a process in which the relative positions of the substrate and the mask are measured before the film formation process, and if there is any deviation in the relative positions, the relative positions of the substrate and the mask are moved to adjust the positions.

[0005] In the film formation apparatus described in Patent Document 1, relative positional deviation is detected by an alignment camera that photographs alignment marks provided on the substrate and mask, and alignment is performed by an alignment stage mechanism that drives the substrate support unit and mask table.

[0006] However, in recent years, as substrate sizes have increased, the substrate support units and mask stages driven by the alignment stage mechanisms have become heavier, and the distance between the drive mechanisms and the substrates and masks that need to be aligned has become greater, making it impossible to ignore the effects of device vibrations after alignment.

[0007] Therefore, Patent Document 2 describes a film deposition apparatus having a substrate holder drive mechanism, a mask holder drive mechanism, and a position detection mechanism that detects the relative position between the substrate holder and the mask holder. The film deposition apparatus described in Patent Document 2 is configured such that a vibration suppression member is installed between at least one of the drive mechanisms and a support member. This film deposition apparatus enables control by detecting the relative positions of the substrate and the mask, and can prevent deterioration of control performance due to vibration disturbance during driving, thereby suppressing deterioration of alignment accuracy. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2012-33468 [Patent Document 2] Patent Publication No. 2021-80558 Summary of the Invention [Problem to be solved by the invention]

[0009] However, in the configuration described in Patent Document 2, if the rigidity of the structures constituting the support member, substrate holder, and mask holder is low, their natural vibrations can be a factor in reducing control performance. In particular, with the recent increase in substrate size mentioned above, the mass of the substrate holder and mask holder increases, and it is difficult to avoid a significant increase in the cost of the device in order to ensure the rigidity of the structures, including the rod parts extending from the top plate of the device that supports them.

[0010] The object of the present invention is to provide an alignment device that can improve control performance by reducing or avoiding the effects of the natural vibrations of a structure, and that can achieve high alignment accuracy while keeping device costs low even when substrates become larger. [Means for solving the problem]

[0011] According to one aspect of the present invention, there is provided an alignment device comprising: a substrate holder for holding a substrate; a mask holder for holding a mask opposite the substrate; a support member for supporting the substrate holder and the mask holder; position detection means for detecting a first relative position between the substrate holder and the mask holder; and a first drive mechanism for generating an electromagnetic force between the substrate holder and the mask holder based on information regarding the first relative position, wherein the substrate holder is supported by the support member in a non-contact manner via a first vibration isolation mechanism or a first levitation mechanism, and the mask holder is supported by the support member in a non-contact manner via a second vibration isolation mechanism or a second levitation mechanism. [Effects of the Invention]

[0012] According to the present invention, the influence of the natural vibration of a structure can be reduced or avoided to improve control performance, and high alignment accuracy can be achieved while keeping equipment costs low even when the substrate size increases. [Brief explanation of the drawings]

[0013] [Figure 1] 1 is a schematic cross-sectional view showing the overall configuration of a film forming apparatus according to a first embodiment of the present invention. [Figure 2A] 1 is a schematic top view showing the configuration of a relative position detection unit and an alignment mechanism in a film deposition apparatus according to a first embodiment of the present invention. FIG. [Figure 2B] 1 is a schematic cross-sectional view showing the configuration of a relative position detection unit and an alignment mechanism in a film deposition apparatus according to a first embodiment of the present invention. [Figure 3] FIG. 1 is a schematic cross-sectional view of a film forming apparatus described in Patent Document 2. [Figure 4A]FIG. 1 is a schematic diagram showing a spring-mass model of a film forming apparatus described in Patent Document 2. [Figure 4B] FIG. 2 is a schematic diagram showing a spring-mass model of the film deposition apparatus according to the first embodiment of the present invention. [Figure 5] 4C is a graph showing frequency characteristics of the transfer function of the spring-mass model shown in FIGS. 4A and 4B. [Figure 6] 1 is a schematic diagram showing a system configuration of a film forming apparatus according to a first embodiment of the present invention. [Figure 7] 4 is a flowchart showing the operation of the film forming apparatus according to the first embodiment of the present invention. [Figure 8] FIG. 4 is a schematic cross-sectional view showing the overall configuration of a film forming apparatus according to a second embodiment of the present invention. [Figure 9] FIG. 10 is a schematic diagram showing a system configuration of a film forming apparatus according to a second embodiment of the present invention. [Figure 10] 10 is a flowchart showing the operation of the film forming apparatus according to the second embodiment of the present invention. [Figure 11] FIG. 10 is a schematic cross-sectional view showing the overall configuration of a film forming apparatus according to a third embodiment of the present invention. [Figure 12] FIG. 10 is a schematic cross-sectional view showing the overall configuration of a film forming apparatus according to a fourth embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0014] [First embodiment] An alignment apparatus according to a first embodiment of the present invention will be described with reference to Figures 1 to 7. In the first to fourth embodiments, a film forming apparatus having an alignment function will be described as the alignment apparatus.

[0015] First, the configuration of the film formation apparatus according to this embodiment will be described with reference to Figures 1 to 2B. Figure 1 is a schematic cross-sectional view showing the overall configuration of the film formation apparatus 1 according to this embodiment. Figure 2A is a schematic top view showing the configuration of the relative position detection means 17 and alignment mechanism 18 in the film formation apparatus 1 according to this embodiment. Figure 2B is a schematic cross-sectional view showing the configuration of the relative position detection means 17 and alignment mechanism 18 in the film formation apparatus 1 according to this embodiment.

[0016] In the following description, an XYZ Cartesian coordinate system is used, with the vertical (perpendicular) direction defined as the Z direction and the horizontal plane perpendicular to the vertical direction defined as the XY plane, with the axis along the Z direction defined as the Z axis, the axis along the X direction in the XY plane defined as the X axis, and the axis along the Y direction in the XY plane defined as the Y axis. The rotation angle around the X axis is defined as θx, the rotation angle around the Y axis is defined as θy, and the rotation angle around the Z axis is defined as θz. The X, Y, and Z axes are not limited to being orthogonal to each other, and may intersect each other.

[0017] The film formation apparatus 1 according to this embodiment includes a vacuum vessel 11, a substrate holder 12 that holds a substrate W, and a mask holder (mask table) 13 that holds a mask M. The film formation apparatus 1 also includes a support member 14 that supports the substrate holder 12 and the mask holder 13, a film formation source 15, a Z lifting mechanism 16, and a vacuum pump P. The substrate holder 12, the mask holder 13, and the film formation source 15 are installed inside the vacuum vessel 11. The support member 14 is a member that supports the substrate holder 12 and the mask holder 13, and includes a mask holder rod 141, a support top plate 142, a substrate holder rod 143, a support member 144, and a vacuum bellows 145. The vacuum vessel 11 also functions as the support member 14.

[0018] The vacuum vessel 11 is placed on the floor by support members 111. The vacuum vessel 11 is a vessel in which film formation on the substrate W is carried out. During film formation, the interior of the vacuum vessel 11 is maintained at a vacuum atmosphere of a predetermined vacuum level by a vacuum pump P connected to the vacuum vessel 11. By maintaining the vacuum atmosphere, the film formation material released from the film formation source 15 can be attached to the substrate W with a uniform film thickness. A film formed by forming the film formation material on the substrate W is referred to as an article.

[0019] The substrate holder 12 and the mask holder 13 disposed inside the vacuum vessel 11 are supported by a support member 14 as follows.

[0020] The substrate holder 12 is an electrostatic chuck that uses electrical force to attract and hold the substrate W, and can hold even a large substrate W without bending. The substrate holder 12 holds the substrate W with the surface of the substrate W on which a film is to be formed facing downward. Note that the substrate holder 12 is not particularly limited as long as it can hold the substrate W, and various types other than an electrostatic chuck can be used.

[0021] The upper surface of the substrate holder 12 is fastened to four substrate holder rods 143 via a vibration isolation mechanism 121. The number of substrate holder rods 143 is not limited to four and may be any number other than four. The four substrate holder rods 143 are fixed to support members 144 arranged above the substrate holder 12 outside the vacuum vessel 11. The outer periphery of the substrate holder rods 143 is covered with a vacuum bellows 145. The vacuum bellows 145 has a structure that allows expansion and contraction in the vertical direction. The vacuum bellows 145 ensures the airtightness of the vacuum vessel 11, and the substrate holder 12 inside the vacuum vessel 11 is connected to the support members 144 outside the vacuum vessel 11 via the substrate holder rods 143. The support members 144 are attached to a Z lifting mechanism 16. In this way, the substrate holder 12 is connected to the Z lifting mechanism 16 via the substrate holder rods 143 and the support members 144. The substrate holder 12 is configured to be driven up and down in the Z direction by a Z lifting mechanism 16 .

[0022] The Z lifting mechanism 16 has a lifting motor 161, a ball screw 162, and a linear guide 163. The Z lifting mechanism 16 is installed on the upper surface of the support top plate 142, which is located outside the vacuum vessel 11 between the top plate of the vacuum vessel 11 and the support member 144. The Z lifting mechanism 16 is configured to be able to drive the support member 144 and the substrate holder 12 connected thereto up and down in the Z direction along the linear guide 163 by the linear motion of the ball screw 162 driven by the lifting motor 161. The Z lifting mechanism 16 drives the substrate holder 12 to an elevated position when loading or unloading the substrate W, and drives the substrate holder 12 to a lower position below the elevated position during alignment drive for aligning the substrate W with the mask M and during film formation.

[0023] The mask holder 13 is a mask table on which the mask M is placed. The mask M is placed on the mask holder 13 so as to face the surface of the substrate W held by the substrate holder 12 on which a film is to be formed. The lower surface of the mask holder 13 is fastened to four mask holder rods 141 via a vibration isolation mechanism 131. The number of mask holder rods 141 is not limited to four and may be any number other than four. The four mask holder rods 141 are fixed to a support top plate 142 disposed outside the vacuum chamber 11 between the vacuum chamber 11 and a support member 144. The mask holder 13 is not particularly limited as long as it can hold the mask M so as to face the substrate W held by the substrate holder 12, and various types other than a mask table can be used.

[0024] In this way, the substrate holder 12 and the mask holder 13 are supported by a common support member 14 including a support top plate 142 that is separate from the vacuum vessel 11. This makes the substrate holder 12 and the mask holder 13 less susceptible to the effects of deformation of the vacuum vessel 11 when the vacuum vessel 11 is evacuated.

[0025] A camera unit 20 is installed on the support top plate 142, with the imaging direction facing the top plate side of the vacuum vessel 11. A glass window 11a is provided on the top plate of the vacuum vessel 11. The camera unit 20 can capture images of alignment marks formed on the substrate W and mask M through the glass window 11a, and obtain the relative positional relationship between the substrate W and mask M.

[0026] The film formation source 15 is configured to evaporate or sublimate and release the film formation material stored therein by heating the film formation material. A rack 151 is installed on the bottom surface of the vacuum vessel 11. A pinion 152 is also installed in the film formation source 15. The film formation source 15 can be driven in the Y direction by a rack and pinion mechanism consisting of the rack 151 and the pinion 152. The film formation source 15 deposits the evaporated or sublimated and released film formation material onto the substrate W via the mask M to form a film, thereby manufacturing a film-formed product. An adhesion prevention plate 112 is installed inside the vacuum vessel 11 to prevent the film formation material from adhering to areas other than the underside of the substrate W and the underside of the mask M.

[0027] The film forming apparatus 1 according to this embodiment further includes a relative position detection means 17 and an alignment mechanism 18. The dashed frame in Fig. 1 is an enlarged cross-sectional view showing the relative position detection means 17 and the alignment mechanism 18. The relative position detection means 17 and the alignment mechanism 18 are installed between the substrate holder 12 and the mask holder 13.

[0028] The relative position detection means 17 is a sensor that detects the relative position between the substrate holder 12 and the mask holder 13. In this embodiment, an optical encoder 171 is provided on the substrate holder 12 side, and an optical scale 172 is provided on the mask holder 13 side at a position opposite the optical encoder 171. The optical encoder 171 and the optical scale 172 constitute the relative position detection means 17. In this case, the relative position detection means 17 detects the relative position between the substrate holder 12 and the mask holder 13 in the X direction or the Y direction by the optical encoder 171 reading the optical scale 172. The relative position detection means 17 is provided with one for the X direction and one for the Y direction. Note that the type of detection sensor used as the relative position detection means 17 is not particularly limited. The detection sensor may be, for example, a magnetic encoder and scale, or may be a laser interferometer including a laser interferometer and a reflecting mirror, a capacitance sensor, an eddy current sensor, or the like. The relative position detection means 17 outputs position information relating to the relative positions between the substrate holder 12 and the mask holder 13 detected as described above.

[0029] The alignment mechanism 18 is an actuator that functions as a drive mechanism that applies electromagnetic force between the substrate holder 12 and the mask holder 13 to drive them. The alignment mechanism 18 generates electromagnetic force between the substrate holder 12 and the mask holder 13 based on position information regarding the relative positions obtained by the relative position detection means 17. In this manner, the alignment mechanism 18 adjusts the relative positions of the substrate holder 12 and the mask holder 13 to adjust the relative positions of the substrate W and the mask M, thereby aligning the substrate W and the mask M. In this embodiment, a permanent magnet unit 181 is installed on the substrate holder 12 side, and a coil unit 182 is installed on the mask holder 13 side at a position facing the permanent magnet unit 181. The permanent magnet unit 181 is composed of multiple permanent magnets. The coil unit 182 is composed of multiple coils. The permanent magnet unit 181 and the coil unit 182 constitute the alignment mechanism 18. When a current flows through the coil of the coil unit 182, an electromagnetic force is generated between the permanent magnet unit 181 and the coil unit 182, and the electromagnetic force acts between the substrate holder 12 and the mask holder 13. The coil of the coil unit 182 may be a type that has an iron core (also called a core), or a type that does not have an iron core. Furthermore, the installation locations of the permanent magnet unit 181 and the coil unit 182 may be reversed, with the permanent magnet unit 181 installed on the mask holder 13 side and the coil unit 182 installed on the substrate holder 12 side. That is, it is sufficient that the permanent magnet unit 181 is installed on one side of the substrate holder 12 and the mask holder 13, and the coil unit 182 is installed on the other side of the substrate holder 12 and the mask holder 13.

[0030] 2A is a diagram showing the arrangement of the relative position detection means 17 and the alignment mechanism 18, and is a top view of the mask holder 13. For ease of explanation, part of the permanent magnet unit 181 installed on the substrate holder 12 side and the outline of the mask M are shown with hidden lines. FIG. 2B is a cross-sectional view taken along line AA as viewed from the direction of the arrow in FIG. 2A, and shows the relative position detection means 17 and the alignment mechanism 18.

[0031] Here, to distinguish between relative position detection means 17 and alignment mechanisms 18 for the X direction and those for the Y direction, the subscript indicating the X direction is designated x, the subscript indicating the Y direction is designated y, the subscript indicating the left side as viewed in the +X direction is designated L, and the subscript indicating the right side is designated R. Then, as shown in Fig. 2A, relative position detection means 17 includes relative position detection means 17xL, 17xR, 17yL, and 17yR, and alignment mechanisms 18xL, 18xR, 18yL, and 18yR are arranged as alignment mechanism 18. These relative position detection means 17 and alignment mechanisms 18 are arranged at the four corners of substrate holder 12 and mask holder 13, with two sets for each of the X direction and Y direction arranged diagonally. That is, a set of relative position detection means 17xR and alignment mechanism 18xR for the X direction, and a set of relative position detection means 17xL and alignment mechanism 18xL for the X direction are arranged diagonally inclined from right to left toward the +X direction. Also, a set of relative position detection means 17yL and alignment mechanism 18yL for the Y direction, and a set of relative position detection means 17yR and alignment mechanism 18yR for the Y direction are arranged diagonally inclined from left to right toward the +X direction. In this way, the relative position detection means 17xL, 17xR, 17yL, and 17yR are arranged point-symmetrically with respect to the center point O of the mask holder 13.

[0032] In the alignment mechanism 18, the permanent magnet unit 181 is composed of an N-pole magnet 181N and an S-pole magnet 181S. The coil unit 182 is composed of three coils 182a, 182b, and 182c. Therefore, the alignment mechanism 18 can generate, as electromagnetic forces acting between the permanent magnet unit 181 and the coil unit 182, a force in the q-axis direction (horizontal direction), i.e., forces in the X and Y directions, and a force in the d-axis direction (vertical direction), i.e., force in the Z direction.

[0033] The relative position detection means 17 further includes a Z sensor 173 and a Z sensor detection block 174 for detecting the relative position between the substrate holder 12 and the mask holder 13 in the Z direction. The Z sensor 173 is, for example, an eddy current sensor that measures the distance to the Z sensor detection block 174 by detecting the magnitude of eddy currents generated on the surface of the Z sensor detection block 174, a metal object. The material of the Z sensor detection block 174 is not particularly limited as long as it is conductive, but iron, for example, can be used to increase the detection distance. As with the optical encoder 171, the type of detection sensor that detects the relative position in the Z direction is not particularly limited, and various sensors can be used. The relative position detection means 17 outputs position information regarding the relative position between the substrate holder 12 and the mask holder 13 detected as described above.

[0034] The above-described configuration enables calculation of the relative position and orientation between the substrate holder 12 and the mask holder 13 in a total of six axes, namely, the X direction, Y direction, Z direction, θx direction, θy direction, and θz direction, based on information about the relative position detected by the relative position detection means 17. The θx direction is the direction of rotation around the X axis, the θy direction is the direction of rotation around the Y axis, and the θz direction is the direction of rotation around the Z axis. The drive controller 602, described below, can calculate such positions and orientations. Six-axis control is performed by outputting torque in the q-axis and d-axis directions to each coil according to the position and orientation calculated by the drive controller 602. Note that, in this specification, torque includes both force and force moment, and torque in a direction along an axis such as the X direction, Y direction, or Z direction refers to force.

[0035] Here, the relative position detection means 17xL outputs sensor information x1 indicating the relative position in the X direction and sensor information z1 indicating the relative position in the Z direction. Furthermore, the relative position detection means 17xR outputs sensor information x2 indicating the relative position in the X direction and sensor information z2 indicating the relative position in the Z direction. Furthermore, the relative position detection means 17yL outputs sensor information y1 indicating the relative position in the Y direction and sensor information z3 indicating the relative position in the Z direction. Furthermore, the relative position detection means 17yR outputs sensor information y2 indicating the relative position in the Y direction and sensor information z4 indicating the relative position in the Z direction.

[0036] Furthermore, it is assumed that alignment mechanism 18xL generates a torque FqxL in the q-axis direction (X-direction) and a torque FdxL in the d-axis direction (Z-direction). It is assumed that alignment mechanism 18xR generates a torque FqxR in the q-axis direction (X-direction) and a torque FdxR in the d-axis direction (Z-direction). It is assumed that alignment mechanism 18yL generates a torque FqyL in the q-axis direction (Y-direction) and a torque FdyL in the d-axis direction (Z-direction). It is assumed that alignment mechanism 18yR generates a torque FqyR in the q-axis direction (Y-direction) and a torque FdyR in the d-axis direction (Z-direction).

[0037] Furthermore, the distance in the X direction between optical encoder 171 of relative position detection means 17xL and optical encoder 171 of relative position detection means 17xR is defined as Wx. The distance in the Y direction between optical encoder 171 of relative position detection means 17yL and optical encoder 171 of relative position detection means 17yR is defined as Ly. The distance in the X direction between Z sensor 173 of relative position detection means 17yL and Z sensor 173 of relative position detection means 17xR is defined as Wz. The distance in the Y direction between Z sensor 173 of relative position detection means 17yL and Z sensor 173 of relative position detection means 17xL is defined as Lz. The distance in the X direction between Z sensor 173 of relative position detection means 17xL and Z sensor 173 of relative position detection means 17yR is also Wz. The distance in the Y direction between Z sensor 173 of relative position detection means 17xR and Z sensor 173 of relative position detection means 17yR is also Lz.

[0038] Then, the relative position and orientation of the mask holder 13 with respect to the substrate holder 12 are expressed by the following equations (1) to (6). X=(x1+x2) / 2 (1) Y=(y1+y2) / 2 (2) Z=(z1+z2+z3+z4) / 4 (3) θx=((z1+z3) / 2-(z2+z4) / 2) / Wz ···(4) θy=((z1+z4) / 2-(z2+z3) / 2) / Lz ···(5) θz=((x1-x2) / Wx+(y1-y2) / Ly) / 2 ···(6)

[0039] In this embodiment, the case where the relative position detection means 17 are arranged point-symmetrically with respect to the center point O has been described, but the relative position detection means 17 do not have to be symmetrical, such as point-symmetrical, and the number of relative position detection means 17 is not particularly limited. If the arrangement of the relative position detection means 17 is not symmetrical or if the number of relative position detection means 17 is increased, the position and orientation can be determined by finding a regression line or a regression plane using the least squares method based on the mounting position information of the sensors of the relative position detection means 17 with respect to the center point O.

[0040] The drive controller 602, which will be described later, calculates the torques (Tx, Ty, Yz, Tθx, Tθy, Tθz) to be applied in the directions of each axis from the six-axis position and attitude information thus obtained, and distributes these to the torques generated by each alignment mechanism 18, thereby performing six-axis control. Tx, Ty, and Tz are the X-, Y-, and Z-direction components of the force, respectively. Furthermore, Tθx, Tθy, and Tθz are the θx-, θy-, and θz-direction components of the torque, respectively. The drive controller 602 can control the torque to be applied by controlling the coil current flowing through the coil of the coil unit 182 of the alignment mechanism 18.

[0041] For example, when applying torque in the +X direction, the drive controller 602 applies current to each coil so that torques FqxL and FqxR become torques in the +X direction. When applying torque in the +Y direction, the drive controller 602 applies current to each coil so that torques FqyL and FqyR become torques in the +Y direction. When applying torque in the +Z direction, the drive controller 602 applies current to each coil so that torques FdxL, dxR, FdyL, and FdyR become torques in the +Z direction.

[0042] Similarly, in the rotation direction, when applying torque in the +θx direction, the drive controller 602 passes current through each coil so that the torques FdxL and FdyL become torque in the +Z direction, and the torques FdxR and FdyR become torque in the -Z direction.When applying torque in the +θy direction, the drive controller 602 passes current through each coil so that the torques FdxL and FdyR become torque in the -Z direction, and the torques FdxR and FdyL become torque in the +Z direction.

[0043] It is preferable that at least one set of alignment mechanisms 18 be installed for the X direction and two sets for the Y direction, or two sets for the X direction and one set for the Y direction. Conversely, depending on the arrangement space, required thrust, and other factors, a greater number of alignment mechanisms 18 may be installed. The arrangement of alignment mechanisms 18 is not particularly limited, and various arrangements can be adopted. In this embodiment, by arranging alignment mechanisms 18 point-symmetrically, it is not necessary to consider interference with other axes when calculating position or distributing torque, which simplifies the implementation of control software.

[0044] Furthermore, Z sensor 173 and Z sensor detection block 174 do not need to be installed when alignment is performed only in the three horizontal axes (X direction, Y direction, and θz direction) that directly affect the film formation quality. Advantages of controlling alignment also in the three vertical axes (Z direction, θx direction, and θy direction) include the ease of adjusting the plane between substrate holder 12 and mask holder 13 and the ability to suppress residual vibrations during Z lifting / lowering drive by Z lifting mechanism 16.

[0045] In the film formation apparatus 1 according to the present embodiment described above, a vibration isolation mechanism 121 is provided for the substrate holder 12, and a vibration isolation mechanism 131 is provided for the mask holder 13. In this embodiment, these vibration isolation mechanisms 121 and 131 can suppress transmission of floor vibrations and vibrations that may cause disturbances in the position control by the relative position detection means 17 and the alignment mechanism 18, as well as vibrations that may occur when the film formation source is driven.

[0046] Furthermore, the film forming apparatus 1 according to this embodiment is configured such that the alignment mechanism 18 directly exerts an electromagnetic force between the substrate holder 12 and the mask holder 13. With this configuration, in this embodiment, the influence of resonant vibration of the support member 14 can be reduced or avoided, and position control by the relative position detection means 17 and the alignment mechanism 18 can be performed stably up to higher frequencies. As a result, the alignment accuracy between the substrate holder 12 and the mask holder 13 can be improved.

[0047] Next, the influence of the support member 14 on the control of resonant vibration will be described with reference to FIGS.

[0048] FIG. 3 is a schematic cross-sectional view showing a film formation apparatus 311 described in Patent Document 2. As shown in FIG. 3, a substrate holder 324 for holding a substrate W, a mask holder 323 for holding a mask M, and a film formation source 325 are arranged inside a vacuum chamber 321. An alignment camera unit 327 is installed on the upper outside of the vacuum chamber 321. The film formation apparatus 311 described in Patent Document 2 is configured to perform alignment using a substrate holder driving mechanism 322 and a mask holder driving mechanism 328. The film formation apparatus 311 has a control unit 330 that controls the substrate holder driving mechanism 322 and the mask holder driving mechanism 328. The substrate holder 324 is fixed to a support member 317 via a substrate holder support member 315. The mask holder 323 is fixed to the support member 317 via a mask holder support member 316, a mask holder driving mechanism 328, and a vibration isolation mechanism 329. Fine alignment of the substrate W and the mask M is performed by a substrate holder driving mechanism 322. The position of the substrate W is detected by position detection mechanisms 331 and 332. The substrate holder driving mechanism 322 is a magnetic levitation type stage mechanism that operates by applying an electromagnetic force between the substrate holder support member 315 and the substrate holder 324.

[0049] FIG. 4A is a schematic diagram showing a spring-mass model of a film formation apparatus 311 described in Patent Document 2. FIG. 4B is a schematic diagram showing a spring-mass model of a film formation apparatus 1 according to this embodiment. For ease of explanation, both models are represented by mass points m1 to m5. In FIG. 4A, m1 is a support member 317, m2 is a substrate holder support member 315, m3 is a mask holder driving mechanism 328, m4 is a substrate holder 324, and m5 is a mask holder 323. In FIG. 4B, m1 is a vacuum vessel 11, m2 and m3 are support members 14, m4 is a substrate holder 12, and m5 is a mask holder 13. In addition, in FIGS. 4A and 4B, the displacement of the substrate holders 12 and 324 is represented by x1, the displacement of the mask holders 13 and 323 is represented by x2, and the force applied by the alignment mechanism is represented by F.

[0050] The difference between the model shown in FIG. 4A and the model shown in FIG. 4B is the location where the vibration isolation mechanism is inserted and the location where the force is applied. In the model shown in FIG. 4A, a vibration isolation mechanism 329 is provided between the support member 317 (m1) and the mask holder driving mechanism 328 (m3). On the other hand, in the model shown in FIG. 4B, a vibration isolation mechanism 121 on the substrate holder 12 side is provided between the support member 14 (m2) and the substrate holder 12 (m4), and a vibration isolation mechanism 131 on the mask holder 13 side is provided between the support member 14 (m3) and the mask holder (m5). In addition, in the model shown in FIG. 4A, a force F is applied between the substrate holder support member 315 (m2) and the substrate holder 324 (m4). On the other hand, in the model shown in FIG. 4B, a force F is applied between the substrate holder 12 (m4) and the mask holder 13 (m5).

[0051] Figure 5 is a graph showing the results of analyzing the transfer function of the spring-mass model shown in Figures 4A and 4B. The graphs in Figure 5 show the frequency characteristics when the input is force (F) and the output is the relative position (x1-x2) between the substrate holder and the mask holder, with the upper graph showing the gain characteristics and the lower graph showing the phase characteristics. The horizontal axis of the upper and lower graphs represents frequency [Hz], the vertical axis of the upper graph represents gain [dB], and the vertical axis of the lower graph represents phase [deg]. In Figure 5, the areas indicated by dashed lines are areas that appear characteristically in the model shown in Figure 4A.

[0052] In Fig. 5, the rise in the gain characteristic indicated by ωdump is the resonance frequency produced by the spring-mass model of the vibration isolation mechanisms 329, 121, and 131. The resonance frequencies of these vibration isolation mechanisms 329, 121, and 131 are set to be the lowest among the spring-mass models shown in Fig. 4A and Fig. 4B, at about 2 to 3 Hz. The effect of setting the resonance frequencies of the vibration isolation mechanisms 329, 121, and 131 low is that the vibration amplitude of frequencies higher than the resonance frequency is reduced, making it possible to suppress the effects of disturbance vibrations transmitted to the substrate holder drive mechanism 322 in Fig. 4A and the alignment mechanism 18 in Fig. 4B.

[0053] In the model of the film deposition apparatus described in Patent Document 2 shown in FIG. 4A, a peak in the gain characteristic and a drop in the phase characteristic occurred at the frequency indicated by ω0 in FIG. 5. This is due to the resonant frequency of the support member. Even with the vibration transmission suppression effect of the vibration isolation mechanism 329 described above, such a resonant peak can occur depending on the magnitude of the resonant frequency of the support member and the front-to-rear mass ratio. The conditions for this analysis were set so that all mass ratios were 1:1, and the resonant frequency ωdump of the vibration isolation mechanisms 329, 121, and 131 was 2.5 Hz, and the resonant frequency ω0 of the substrate holder support member 315 and the support member 14 was 15 Hz. Note that a resonant peak can also occur due to factors other than the resonant frequency of the support member, such as a low resonant frequency of the support member 111 supporting the vacuum vessel 11.

[0054] When the above-mentioned resonance peak occurs in the gain and phase characteristics, the phase falls below -180°, and the controllable band of the controller cannot be increased above ω0. As a result, the control responsiveness cannot be improved, and improvement of alignment accuracy is hindered.

[0055] On the other hand, the model of the film formation apparatus 1 according to this embodiment shown in FIG. 4B does not exhibit the resonance peaks observed in the model shown in FIG. 4A. This is because the input force (F) and the output relative position (x1-x2) between the substrate holder and the mask holder are isolated from other structures by the vibration isolation mechanisms 121 and 131. With this configuration, in this embodiment, the structures that may affect the frequency characteristics of the controller are limited to the substrate holder 12 and the mask holder 13. Furthermore, in the film formation apparatus 1, the substrate holder 12 and the mask holder 13 are generally formed in a plate shape, making it relatively easy to fabricate them with high rigidity in the horizontal direction, which directly affects film formation quality. By making the substrate holder 12 and the mask holder 13 highly rigid, the influence of the natural vibrations of the structures constituting the support member 14, the substrate holder 12, the mask holder 13, etc. can be reduced or avoided, improving control performance. As a result, this embodiment improves control responsiveness and alignment accuracy. Furthermore, even if the substrate W becomes larger, there is no need to add a special configuration to accommodate the larger size, so the cost of the device can be reduced.

[0056] As described above, according to this embodiment, the influence of the natural vibration of the structure is reduced or avoided, improving control performance, and high alignment accuracy can be achieved while keeping equipment costs low even when the substrate W is large.

[0057] Next, the configuration of a control system for controlling the film forming apparatus 1 according to this embodiment will be described with reference to Fig. 6. Fig. 6 is a schematic diagram showing the configuration of the control system 6 for controlling the film forming apparatus 1 according to this embodiment. The control system 6 can constitute a part of the film forming apparatus 1.

[0058] 6, the control system 6 has an integrated controller 601, a drive controller 602, a camera controller 603, and a Z elevation controller 604. The control system 6 functions as a control unit that controls the alignment mechanism 18, the camera unit 20, and the Z elevation mechanism 16. The drive controller 602, the camera controller 603, and the Z elevation controller 604 are communicably connected to the integrated controller 601. The integrated controller 601 controls each controller to control the overall operation of the film forming apparatus 1.

[0059] The drive controller 602 is connected to a plurality of coil units 182, a plurality of optical encoders 171, and a plurality of Z sensors 173. The coil units 182 are connected to a current sensor 611 and a current controller 610. The current sensor 611 detects the value of a current flowing through the coil of the connected coil unit 182. The current controller 610 controls the amount of current flowing through the coil of the connected coil unit 182.

[0060] The drive controller 602 calculates a current command value and, based on the calculated current command value, issues a command for a desired current amount to the current controller 610. The current controller 610 detects a current value detected by a current sensor 611 and controls the current amount so that a desired current amount flows through the coil of the coil unit 182.

[0061] A counter board 612 is connected to the optical encoder 171. The counter board 612 calculates a count value based on a signal from the optical encoder 171 and transmits the count value to the drive controller 602.

[0062] A sensor amplifier 613 is connected to Z sensor 173. Sensor amplifier 613 converts the detection value of Z sensor 173 into position information and transmits it to drive controller 602.

[0063] The drive controller 602 calculates the relative position and orientation between the substrate holder 12 and the mask holder 13 based on the count value received from the counter board 612 and the position information received from the sensor amplifier 613. The drive controller 602 controls the current flowing through the coil of the coil unit 182 based on the calculated position and orientation. In this way, the drive controller 602 controls the torque generated in each alignment mechanism 18, and controls the relative position and orientation between the substrate holder 12 and the mask holder 13 in six axes.

[0064] The configuration of the control system 6 is not limited to the configuration shown in Fig. 6. For example, the counter board 612 and the sensor amplifier 613 may be configured as a common sensor controller. Alternatively, a control controller having a calculation unit that calculates the position and attitude and a calculation unit that calculates a current command value, which is separate from the drive controller 602, may be provided. In this case, the drive controller 602 is communicably connected to the control controller, and performs current control of the coil unit 182 based on the position and attitude and the current command value received from the control controller.

[0065] Next, the operation of the film forming apparatus 1 according to this embodiment will be described with reference to Fig. 7. Fig. 7 is a flowchart showing the operation of the film forming apparatus 1 according to this embodiment. The operation of the film forming apparatus 1 described below is controlled by a control system 6 including an integrated controller 601, a drive controller 602, etc.

[0066] In the initial state (START state) at the start of film formation, the mask M is placed on the mask holder 13, and the substrate W is not held by the substrate holder 12. Also, in the START state, the Z lifting mechanism 16 is raised to the retracted position, the relative position detection means 17 is out of the detection range, and the alignment mechanism 18 is also out of the control range.

[0067] First, the hand of the transport robot (not shown) holding the substrate W moves to the substrate transfer position (step S1). Next, the substrate receiving claws (not shown) supporting the outer periphery of the substrate W rise to the substrate receiving position and scoop up the substrate W from the transport robot hand (step S2).

[0068] Next, the transfer robot hand moves to the retreat position (step S3). Next, the Z lifting mechanism 16 descends to the substrate receiving position, and the substrate holder 12 turns on the electrostatic chuck. As a result, the substrate holder 12 receives and holds the substrate W from the substrate receiving claws (step S4).

[0069] Next, the substrate receiving claws move to the retracted position (step S5), and then the Z lifting mechanism 16 descends to the alignment position (step S6). This allows the relative position detection means 17 to detect the relative position between the substrate holder 12 and the mask holder 13. Once the relative position can be detected, the alignment mechanism 18 is switched from servo-off to servo-on, and position control begins (step S7). Note that, during descent to the alignment position, a sensor such as a fiber sensor (not shown) installed on the mask holder 13 may detect that the substrate holder 12 has entered a controllable range, and the alignment mechanism 18 may be automatically configured to servo-on. Furthermore, by enabling control of the three vertical axes (Z direction, θx direction, and θy direction) of the alignment mechanism 18, it is possible to suppress undershoot and residual vibration that occur when the Z lifting mechanism 16 descends.

[0070] Next, the camera unit 20 captures images of the alignment marks on the substrate W and the mask M (Step S8). Next, based on the results of capturing the alignment marks, correction amounts for three horizontal axes (X direction, Y direction, and θz direction) are calculated. The calculated correction amounts are used to correct the misalignment between the two alignment marks, i.e., the relative positions of the substrate holder 12 and the mask holder 13. Then, the alignment mechanism 18 moves the relative positions by the calculated correction amounts (Step S9). After the movement is complete, the camera unit 20 again captures images of the alignment marks on the substrate W and the mask M (Step S10). The amount of misalignment between the two is calculated based on the results of capturing the alignment marks, and if the amount of misalignment is within a set value, the Z lift mechanism 16 descends to the film formation position (Step S11). If the amount of deviation is greater than the set value, the correction amount for the relative position is calculated again, and the alignment mechanism 18 moves the relative position by the calculated correction amount (step S9). In this way, an electromagnetic force is applied between the substrate holder 12 that holds the substrate W and the mask holder 13 that holds the mask M to correct the relative positions of the two, thereby aligning the substrate W and the mask M.

[0071] After the substrate W is lowered to the film formation position by the lowering of the Z lifting mechanism 16, the film formation source 15 heats the evaporation source and releases the film formation material, and then the film formation source 15 is driven in the Y direction at a constant speed while maintaining the temperature. This performs a film formation process in which a film is formed on the substrate W using the film formation material (step S12). When the film formation process is completed, the Z lifting mechanism 16 rises to the substrate transfer position (step S13), and the substrate receiving claws move to the substrate receiving position. Thereafter, the electrostatic chuck of the substrate holder 12 is turned off, and the substrate W is transferred from the substrate holder 12 to the substrate receiving claws (step S14).

[0072] Thereafter, the Z lifting mechanism 16 rises to the retreat position (step S15), and the transport robot hand enters the substrate receiving position (step S16). Finally, the substrate receiving claws descend to the substrate receiving standby position and hand over the film-formed substrate W to the transport robot hand (step S17). The transport robot hand that has received the substrate W moves with the substrate W to the retreat position and transports the substrate W to the next process (step S18). Thereafter, the system returns to the START state, and the above operation is repeated for other substrates W that are to undergo the film forming process.

[0073] [Second embodiment] A film forming apparatus according to a second embodiment of the present invention will be described with reference to Figures 8 and 9. Note that components similar to those in the first embodiment are given the same reference numerals, and descriptions thereof will be omitted or simplified.

[0074] First, the configuration of the film forming apparatus according to this embodiment will be described with reference to Fig. 8. Fig. 8 is a schematic cross-sectional view showing the overall configuration of the film forming apparatus 1 according to this embodiment.

[0075] 8, the film formation apparatus 1 according to this embodiment has a configuration that includes a coarse alignment mechanism 50 in addition to the configuration of the film formation apparatus 1 according to the first embodiment. The coarse alignment mechanism 50 is a drive mechanism that drives the substrate holder 12 relative to the vacuum chamber 11. The coarse alignment mechanism 50 has a larger operating stroke than the alignment mechanism 18, and therefore can control the relative positions of the substrate holder 12 and the mask holder 13 over a wide range, although with coarse accuracy.

[0076] In the film formation apparatus 1 according to this embodiment, similarly to the first embodiment, a substrate holder 12, a mask holder 13, and a film formation source 15 are installed in a vacuum chamber 11, and the substrate holder 12 and the mask holder 13 are supported by a support member 14. The mask holder 13, the support member 14, and the film formation source 15 have the same configurations as in the first embodiment, and therefore a description thereof will be omitted.

[0077] 8 is an enlarged cross-sectional view showing the relative position detection means 17 and alignment mechanism 18 installed between the substrate holder 12 and the mask holder 13, as in the first embodiment. In this embodiment, to distinguish it from the coarse movement alignment mechanism 50, the relative position detection means 17 will be referred to as the fine movement relative position detection means 17, and the alignment mechanism 18 will be referred to as the fine movement alignment mechanism 18.

[0078] As in the first embodiment, substrate holder 12 is fastened to substrate holder rod 143 via vibration isolation mechanism 121, and support member 144 to which substrate holder rod 143 is fixed is attached to Z lifting mechanism 16. As a result, as in the first embodiment, substrate holder 12 is configured to be driven up and down in the Z direction by the Z lifting mechanism 16.

[0079] The Z lifting mechanism 16 has a lifting motor 161, a ball screw 162, and a linear guide 163, and drives the substrate holder 12 to an elevated position when loading and unloading the substrate W, and drives the substrate holder 12 to a lowered position when driving for alignment between the substrate W and the mask M and during film formation.

[0080] In this embodiment, the coarse alignment mechanism 50 is installed on the upper surface of the support top plate 142. The Z lifting mechanism 16 is fixed to the coarse alignment mechanism 50. The Z lifting mechanism 16 is configured to move or rotate in the X direction, Y direction, and θz direction by the coarse alignment mechanism 50. By moving or rotating the Z lifting mechanism 16 by the coarse alignment mechanism 50, the substrate holder 12 can be driven to move or rotate via the vibration isolation mechanism 121. The installation location of the coarse alignment mechanism 50 is not particularly limited. The coarse alignment mechanism 50 may be installed in the vacuum chamber 11, in addition to being installed on the support member 14.

[0081] The coarse alignment mechanism 50 has a lower fixed stage plate 504, an upper movable stage plate 501, a coarse relative position detection means 502, and a linear drive unit 503 for moving the movable stage plate 501. The coarse relative position detection means 502 detects the relative position between the fixed stage plate 504 and the movable stage plate 501, and outputs position information relating to the relative position.

[0082] The coarse movement relative position detecting means 502 can be configured to detect the position using, for example, an optical encoder and an optical scale. As with the fine movement relative position detecting means 17, the type of detection sensor used as the coarse movement relative position detecting means 502 is not particularly limited.

[0083] The linear drive unit 503 is configured to drive the movable stage plate 501 using, for example, a linear guide and a ball screw. The driving method of the linear drive unit 503 is not particularly limited, and may be, for example, a linear motor system including a coil unit and a permanent magnet unit. By driving the movable stage plate 501, the linear drive unit 503 drives the Z lift mechanism 16 and the support member 14 attached thereto, thereby driving the substrate holder 12 via the vibration isolation mechanism 121. The coarse alignment mechanism 50 is configured such that its operating stroke is relatively larger than that of the fine alignment mechanism 18 due to the linear drive unit 503. The operating stroke can also be expressed as the minimum amount of movement in a predetermined direction when performing a movement operation in that direction.

[0084] The camera unit 20 may include a rough alignment camera used to roughly adjust the relative position between the substrate W and the mask M, and a fine alignment camera used to highly accurately adjust the relative position between the substrate W and the mask M. The rough alignment camera has a relatively wide viewing angle and low resolution. The fine alignment camera has a relatively narrow viewing angle but high resolution compared to the rough alignment camera.

[0085] The coarse alignment mechanism 50 drives the substrate holder 12 when roughly adjusting the relative position between the substrate W and the mask M. On the other hand, the fine alignment mechanism 18 directly drives the substrate holder 12 and the mask holder 13 when highly accurately adjusting the relative position between the substrate W and the mask M.

[0086] As described above, the film forming apparatus 1 according to this embodiment also includes the coarse alignment mechanism 50, which reduces the operating stroke required for the driving range of the fine alignment mechanism 18. Therefore, in this embodiment, the permanent magnets of the permanent magnet unit 181 and the coils of the coil unit 182 in the fine alignment mechanism 18 can be made smaller. As a result, the fine alignment mechanism 18 can be easily installed even inside the vacuum vessel 11, which has many installation space restrictions. Furthermore, by making the coils smaller, the time constant of the coils can be reduced, thereby improving the rise speed of the current in the coils, and therefore, the fine alignment mechanism 18 can achieve position control with even higher response.

[0087] Furthermore, in this embodiment, in the operation of the film forming apparatus 1 described below, when the substrate W is transferred to the substrate holder 12, the fine movement alignment mechanism 18 can correct the suction position of the substrate W. This allows the precision with which the robot hand transports the substrate W to be relaxed, and the time required for alignment can be shortened.

[0088] Next, the configuration of a control system for controlling the film forming apparatus 1 according to this embodiment will be described with reference to Fig. 9. Fig. 9 is a schematic diagram showing the configuration of a control system for controlling the film forming apparatus 1 according to this embodiment. The control system 6 can constitute a part of the film forming apparatus 1.

[0089] As shown in FIG. 9 , the control system 6 includes an integrated controller 601, a drive controller 602, a camera controller 603, a Z lift controller 604, and a coarse movement controller 905. The drive controller 602 controls the fine movement alignment mechanism 18. The coarse movement controller 905 controls the coarse movement alignment mechanism 50. In this embodiment, the drive controller 602 will be referred to as the fine movement controller 602 to distinguish it from the coarse movement controller 905. The control system 6 functions as a control unit that controls the fine movement alignment mechanism 18, the camera unit 20, the Z lift controller 16, and the coarse movement alignment mechanism 50. The fine movement controller 602, the camera controller 603, the Z lift controller 604, and the coarse movement controller 905 are communicably connected to the integrated controller 601. The integrated controller 601 controls each controller to control the overall operation of the film forming apparatus 1. The fine movement controller 602, camera controller 603, and Z elevation controller 604 have the same configuration as in the first embodiment, and therefore their description will be omitted.

[0090] The coarse movement controller 905 is connected to the coarse movement alignment mechanism 50. As described above, the coarse movement alignment mechanism 50 has the coarse movement relative position detection means 502 and the linear drive unit 503. The coarse movement relative position detection means 502 and the linear drive unit 503 are connected to the coarse movement controller 905.

[0091] The coarse movement controller 905 calculates a command pulse signal based on the position information from the coarse movement relative position detection means 502, and controls the current flowing through the linear drive unit 503 in accordance with the command pulse signal, thereby controlling the position of the movable stage plate 501. Note that instead of a configuration in which the coarse movement controller 905 performs everything from calculating the command pulse signal to controlling the current, a configuration in which a coarse movement driver is disposed between the coarse movement controller 905 and the linear drive unit 503 may be employed. In that case, the coarse movement controller 905 calculates a command pulse signal and sends it to the coarse movement driver, and the coarse movement driver controls the current flowing through the linear drive unit 503 in accordance with the command pulse signal received, thereby controlling the position of the movable stage plate 501.

[0092] 9, the coarse movement controller 905 and the fine movement controller 602 may be connected so that they can communicate with each other. In this case, the coarse movement controller 905 and the fine movement controller 602 can synchronously control the coarse movement alignment mechanism 50 and the fine movement alignment mechanism 18. This allows the rough alignment operation and the fine alignment operation, which will be described later, to be performed simultaneously, thereby shortening the time required for alignment.

[0093] Next, the operation of the film forming apparatus 1 according to this embodiment will be described with reference to Fig. 10. Fig. 10 is a flowchart showing the operation of the film forming apparatus 1 according to this embodiment. The operation of the film forming apparatus 1 described below is controlled by a control system 6 including an integrated controller 601, a drive controller 602, etc.

[0094] In the initial state (START state) at the start of film formation, the mask M is placed on the mask holder 13, and the substrate W is not held by the substrate holder 12. In the START state, the Z lifting mechanism 16 is raised to the retracted position, the fine movement relative position detection means 17 is out of the detection range, and the fine movement alignment mechanism 18 is also out of the control range.

[0095] First, the hand of the transport robot (not shown) holding the substrate W moves to the substrate transfer position (step S101). Next, the substrate receiving claws (not shown) supporting the outer periphery of the substrate W rise to the substrate receiving position and scoop up the substrate W from the transport robot hand (step S102).

[0096] Next, the transfer robot hand moves to the retracted position (step S103). Next, the Z lifting mechanism 16 descends to the substrate receiving position. Next, the rough alignment camera of the camera unit 20 captures images of the alignment marks on the substrate W and the alignment marks on the mask M (step S104). Next, based on the captured images of the alignment marks, correction amounts for the three horizontal axes (X direction, Y direction, and θz direction) are calculated. The calculated correction amounts are amounts for correcting misalignment between the two alignment marks, and are amounts for correcting the position of the substrate holder 12. Then, the coarse movement alignment mechanism 50 moves the substrate holder 12 by the calculated correction amounts. In this way, the substrate holder 12 is positioned by moving the substrate holder 12, and the substrate holder 12 turns on the electrostatic chuck. As a result, the substrate holder 12 receives and holds the substrate W from the substrate receiving claws (step S105).

[0097] Next, the substrate receiving claws move to the retracted position (step S106), and the Z lifting mechanism 16 descends to the alignment position (step S107). This allows the fine movement relative position detection means 17 to detect the relative position between the substrate holder 12 and the mask holder 13. Once the relative position can be detected, the fine movement alignment mechanism 18 is switched from servo-off to servo-on, and speed control begins (step S108). Speed ​​control is performed so that the speed of the fine movement alignment mechanism 18, i.e., the relative speed between the substrate holder 12 and the mask holder 13, becomes zero. This makes it possible to suppress residual vibrations of the substrate holder 12 and shaking due to external vibrations when the coarse movement alignment mechanism 50 is driven in the next step. At this time, if the coarse movement controller 905 and the fine movement controller 602 are connected so as to be able to communicate with each other as described above, it is also possible to servo-on the fine movement alignment mechanism 18 during position control.

[0098] It should be noted that when descending to the alignment position, a sensor such as a fiber sensor (not shown) installed on mask holder 13 may detect that substrate holder 12 has entered a controllable range, and fine-motion alignment mechanism 18 may be configured to automatically turn on the servo. Furthermore, by enabling control of the three vertical axes (Z direction, θx direction, θy direction) of alignment mechanism 18, it is possible to suppress undershoot and residual vibration that occur when Z lifting mechanism 16 descends.

[0099] Next, the alignment marks on the substrate W and the alignment marks on the mask M are captured by the rough alignment camera of the camera unit 20 (step S109). Next, based on the captured images of the alignment marks, correction amounts for three horizontal axes (X direction, Y direction, and θz direction) are calculated. The calculated correction amounts are used to correct misalignment between the two alignment marks, and are used to correct the position of the substrate holder 12. Then, the coarse alignment mechanism 50 moves the substrate holder 12 by the calculated correction amounts (step S110). In this way, rough alignment between the substrate holder 12 and the mask holder 13 is performed by the rough alignment operation of the coarse alignment mechanism 50.

[0100] When the coarse alignment mechanism 50 is in operation, the fine alignment mechanism 18 operates in response to the residual vibrations caused by the coarse alignment mechanism 50, i.e., operates to suppress the residual vibrations. Specifically, when the coarse alignment mechanism 50 is in operation, the fine alignment mechanism 18 operates at a speed such that the relative speed between the substrate holder 12 and the mask holder 13 becomes zero, as described above, thereby suppressing the residual vibrations caused by the coarse alignment mechanism 50.

[0101] After the coarse alignment mechanism 50 is stopped to end the rough alignment and the movement of the substrate holder 12 is completed, the fine alignment camera of the camera unit 20 captures images of the alignment marks on the substrate W and the alignment marks on the mask M (step S111). Next, based on the captured images of the alignment marks, correction amounts for the three horizontal axes (X direction, Y direction, and θz direction) are calculated. The calculated correction amounts are used to correct the misalignment between the two alignment marks, and are used to correct the relative positions of the substrate holder 12 and the mask holder 13. If the correction amounts are within a set value, i.e., within the driving range of the fine alignment mechanism 18, the fine alignment mechanism 18 is switched from speed control to position control (step S112). In this way, the fine alignment mechanism 18 operates under position control when the coarse alignment mechanism 50 is stopped. If the correction amount is greater than the set value, the coarse alignment mechanism 50 moves the substrate holder 12 again by the calculated correction amount (step S110).

[0102] Next, the fine alignment mechanism 18 moves the relative position by the correction amount calculated above (step S113). In this way, fine alignment between the substrate holder 12 and the mask holder 13 is performed by the fine alignment operation of the fine alignment mechanism 18. Here, the fine alignment mechanism 18 detects the relative position between the substrate holder 12 and the mask holder 13 and directly drives the substrate holder 12 and the mask holder 13, so it can perform an alignment operation with higher accuracy than the coarse alignment mechanism 50. After the movement is completed, the fine alignment camera of the camera unit 20 again captures images of the alignment marks on the substrate W and the mask M (step S114). The amount of deviation between the two is calculated based on the image of the alignment marks, and if the amount of deviation is within a set value, the Z lift mechanism 16 descends to the film formation position (step S115). If the amount of deviation is greater than the set value, the amount of correction for the relative position is calculated again, and the fine movement alignment mechanism 18 moves the relative position by the calculated amount of correction (step S113). In this way, an electromagnetic force is applied between the substrate holder 12 that holds the substrate W and the mask holder 13 that holds the mask M to correct the relative positions of the two, thereby aligning the substrate W and the mask M.

[0103] After the substrate W is lowered to the film formation position by the lowering of the Z lifting mechanism 16, the film formation source 15 heats the evaporation source to release the film formation material, and then the film formation source 15 is driven in the Y direction at a constant speed while maintaining the temperature. This performs a film formation process in which a film is formed on the substrate W using the film formation material (step S116). When the film formation process is completed, the Z lifting mechanism 16 rises to the substrate transfer position (step S117), and the substrate receiving claws move to the substrate receiving position. Thereafter, the electrostatic chuck of the substrate holder 12 is turned off, and the substrate W is transferred from the substrate holder 12 to the substrate receiving claws (step S118).

[0104] Thereafter, the Z lifting mechanism 16 rises to the retreat position (step S119), and the transport robot hand enters the substrate receiving position (step S120). Finally, the substrate receiving claws descend to the substrate receiving standby position and hand over the substrate W on which the film has been formed to the transport robot hand (step S121). The transport robot hand that has received the substrate W moves with the substrate W to the retreat position and transports the substrate W to the next process (step S122). Thereafter, the system returns to the START state, and the above operation is repeated for other substrates W on which the film forming process is to be performed.

[0105] In this embodiment, the coarse alignment mechanism 50 is configured to drive the substrate holder 12, but this is not limiting. The coarse alignment mechanism 50 may be configured to drive the mask holder 13 instead of the substrate holder 12. In this case, the linear drive unit 503 of the coarse alignment mechanism 50 may be configured to drive the support member 14, thereby driving the mask holder 13 via the vibration isolation mechanism 121. Furthermore, the coarse alignment mechanism 50 may be configured to drive both the substrate holder 12 and the mask holder 13. In this way, the coarse alignment mechanism 50 may be configured to drive at least one of the substrate holder 12 and the mask holder 13.

[0106] [Third embodiment] A film forming apparatus according to a third embodiment of the present invention will be described with reference to Fig. 11. Note that components similar to those in the first and second embodiments are given the same reference numerals, and descriptions thereof will be omitted or simplified.

[0107] The film formation apparatus according to this embodiment differs from the film formation apparatus 1 according to the first embodiment in that the mask holder 13 is supported by the support member 14 in a non-contact manner via a levitation mechanism instead of a vibration isolation mechanism 131. The configuration of the film formation apparatus according to this embodiment will be described below with reference to Fig. 11. Fig. 11 is a schematic cross-sectional view showing the overall configuration of the film formation apparatus 1 according to this embodiment.

[0108] 11, compared to the first embodiment, the film forming apparatus 1 according to this embodiment has a mask holder magnetic levitation stage 52 instead of the vibration isolation mechanism 131. The mask holder magnetic levitation stage 52 is a levitation mechanism that drives the mask holder 13 relative to the vacuum chamber 11 to levitate the mask holder 13. The mask holder 13 is supported by the support member 14 in a non-contact manner via the mask holder magnetic levitation stage 52. Therefore, in this embodiment, the vibration isolation mechanism 131 on the mask holder 13 side is not necessary.

[0109] In the film formation apparatus 1 according to this embodiment, similarly to the first embodiment, a substrate holder 12, a mask holder 13, and a film formation source 15 are installed in a vacuum chamber 11, and the substrate holder 12 and the mask holder 13 are supported by a support member 14. In this embodiment, similarly to the first embodiment, the substrate holder 12 is supported by the support member 14 via a vibration isolation mechanism 121, whereas the mask holder 13 is supported by the support member 14 in a non-contact manner via a mask holder magnetic levitation stage 52. The substrate holder 12, the support member 14, and the film formation source 15 have the same configurations as those in the first embodiment, and therefore a description thereof will be omitted.

[0110] 11 is an enlarged cross-sectional view showing the relative position detection means 17 and alignment mechanism 18 installed between the substrate holder 12 and the mask holder 13, as in the first embodiment. In addition, in this embodiment, a mask holder position detection means 51 and a mask holder magnetic levitation stage 52 are installed between the mask holder 13 and the mask holder rod 141.

[0111] As in the first embodiment, the relative position detection means 17 is a sensor that detects the relative position between the substrate holder 12 and the mask holder 13, and the alignment mechanism 18 is an actuator that applies electromagnetic force between the substrate holder 12 and the mask holder 13 to drive the relative positions of the two.

[0112] In this embodiment, the mask holder 13 is configured to be magnetically levitated relative to the support member 14 by a mask holder position detection means 51 and a mask holder magnetic levitation stage 52 .

[0113] The mask holder position detecting means 51 is a sensor that detects the relative position between the mask holder rod 141 that constitutes the support member 14 and the mask holder 13. An optical encoder 511 is installed on the mask holder rod 141 side, and an optical scale 512 is installed at a position facing the optical encoder 511 on the mask holder 13 side. The optical encoder 511 and optical scale 512 configure the mask holder position detecting means 51. In this case, the mask holder position detecting means 51 detects the relative position between the mask holder rod 141 and the mask holder 13 in the X direction or Y direction by the optical encoder 511 reading the optical scale 512, and outputs the position information. Two mask holder position detecting means 51 are installed, one for the X direction and one for the Y direction.

[0114] Furthermore, the mask holder position detection means 51 has a magnetic levitation Z sensor and a magnetic levitation Z sensor block (not shown) for detecting the relative position in the Z direction between the mask holder rod 141 and the mask holder 13. The magnetic levitation Z sensor is installed on the mask holder rod 141 side. The magnetic levitation Z sensor block is installed in a position facing the magnetic levitation Z sensor on the mask holder 13 side. The mask holder position detection means 51 measures the distance to the magnetic levitation Z sensor block using the magnetic levitation Z sensor, thereby detecting the relative position in the Z direction between the mask holder rod 141 and the mask holder 13, and outputs that position information.

[0115] There is no particular limitation on the type of detection sensor that detects the relative position in the mask holder position detection means 51. The detection sensor may be, for example, one configured with a magnetic encoder and scale, or may also be a laser interferometer including a laser interferometer and a reflecting mirror, a capacitance sensor, an eddy current sensor, or the like.

[0116] The mask holder magnetic levitation stage 52 is a magnetic levitation stage that is driven by applying an electromagnetic force between the mask holder rod 141 and the mask holder 13. A coil unit 521 is installed on the mask holder rod 141 side, and a permanent magnet unit 522 is installed at a position facing the coil unit 521 on the mask holder 13 side. The coil unit 521 and the permanent magnet unit 522 constitute the mask holder magnetic levitation stage 52. When a current flows through the coil of the coil unit 521, an electromagnetic force is generated between the coil unit 521 and the permanent magnet unit 522, and the electromagnetic force acts between the mask holder rod 141 and the mask holder 13. The mask holder magnetic levitation stage 52 applies an electromagnetic force between the mask holder rod 141 and the mask holder 13 based on the relative positions of the mask holder rod 141 and the mask holder 13 detected by the mask holder position detection means 51.

[0117] In the mask holder magnetic levitation stage 52, the coil of the coil unit 521 may be either cored (iron core) or coreless, but a coil with a core is preferable from the viewpoint of suppressing the control current for maintaining the levitation of the mask holder 13. Furthermore, the coil unit 521 and the permanent magnet unit 522 may be installed upside down. That is, the coil unit 521 may be installed on the mask holder 13 side, and the permanent magnet unit 522 may be installed on the mask holder rod 141 side.

[0118] Furthermore, it is preferable that the coil unit 521 and permanent magnet unit 522 of the mask holder magnetic levitation stage 52 are larger than the coil unit 182 and permanent magnet unit 181 of the alignment mechanism 18, respectively. In this case, the mask holder magnetic levitation stage 52 can perform rough alignment operations with a large operating stroke, similar to the coarse alignment mechanism 50 according to the second embodiment. Therefore, as in the second embodiment, the stroke required as the driving range of the fine alignment mechanism 18 can be reduced, and the permanent magnet unit 181 and coil unit 182 can be made smaller.

[0119] As described above, in this embodiment, the mask holder 13 is configured to be magnetically levitated relative to the support member 14 by the mask holder magnetic levitation stage 52 used in place of the vibration isolation mechanism 131. In this embodiment, compared to the case of the vibration isolation mechanism 131 or the like in which the structures are in contact with each other, the mask holder 13 is supported by the support member 14 in a non-contact manner by magnetic levitation. Therefore, in this embodiment, the natural frequency can be designed to be even smaller, specifically, for example, 1 Hz or less, and the vibration isolation performance can be further improved.

[0120] Furthermore, the attitude of the mask holder 13 can be controlled in six axes by driving the mask holder magnetic levitation stage 52. Therefore, it is also possible to perform angle correction on the attitude of the mask holder 13 so that the plane of the upper surface of the mask M coincides with the plane of the lower surface of the substrate W. Such angle correction makes it possible to uniformly manage the gap between the upper surface of the mask M and the lower surface of the substrate W, and to prevent or suppress degradation of the film formation quality, particularly around the outer periphery of the substrate W.

[0121] As described above, according to this embodiment, floor vibrations and vibrations during driving of the film formation source can be suppressed by configuring the mask holder 13 to be magnetically levitated. Also, as in the first and second embodiments, by generating an electromagnetic force between the substrate holder 12 and the mask holder 13 to directly drive them, highly accurate relative position control and therefore highly accurate alignment operation can be realized.

[0122] In this embodiment, the mask holder 13 is configured to be magnetically levitated relative to the support member 14 by the mask holder magnetic levitation stage 52, but the present invention is not limited to this. The substrate holder 12 may be configured to be magnetically levitated relative to the support member 14 using a configuration similar to that of the mask holder magnetic levitation stage 52. In this case, the mask holder 13 can be fastened to the mask holder rod 141 via the vibration isolation mechanism 131, as in the first embodiment.

[0123] Also in the configuration of the second embodiment, the mask holder 13 can be configured to be magnetically levitated relative to the support member 14 by the mask holder magnetic levitation stage 52, as in this embodiment.

[0124] [Fourth embodiment] A film forming apparatus according to a fourth embodiment of the present invention will be described with reference to Fig. 12. Note that the same components as those in the first to third embodiments are given the same reference numerals, and descriptions thereof will be omitted or simplified.

[0125] The film formation apparatus according to this embodiment differs from the film formation apparatus 1 according to the first embodiment in that the substrate holder 12 and the mask holder 13 are supported by a support member 14 in a non-contact manner via a levitation mechanism instead of the vibration isolation mechanisms 121 and 131, respectively. The configuration of the film formation apparatus according to this embodiment will be described below with reference to Fig. 12. Fig. 12 is a schematic cross-sectional view showing the overall configuration of the film formation apparatus 1 according to this embodiment.

[0126] 12, compared to the first embodiment, the film forming apparatus 1 according to this embodiment has a mask holder magnetic levitation stage 52 instead of the vibration isolation mechanism 131, and a substrate holder magnetic levitation stage 54 instead of the vibration isolation mechanism 121. As in the third embodiment, the mask holder magnetic levitation stage 52 is a levitation device that drives the mask holder 13 relative to the vacuum vessel 11 to levitate the mask holder 13. The substrate holder magnetic levitation stage 54 is a levitation device that drives the substrate holder 12 relative to the vacuum vessel 11 to levitate the substrate holder 12. The mask holder 13 is supported by the support member 14 via the mask holder magnetic levitation stage 52 in a non-contact manner. The substrate holder 12 is supported by the support member 14 via the substrate holder magnetic levitation stage 54 in a non-contact manner. For these reasons, in this embodiment, the vibration isolation mechanisms 121 and 131 on the substrate holder 12 side and the mask holder 13 side are both unnecessary.

[0127] In the film formation apparatus 1 according to this embodiment, as in the first embodiment, a substrate holder 12, a mask holder 13, and a film formation source 15 are installed in a vacuum chamber 11, and the substrate holder 12 and the mask holder 13 are supported by a support member 14. In this embodiment, the substrate holder 12 is supported by the support member 14 in a non-contact manner via a substrate holder magnetic levitation stage 54. Furthermore, the mask holder 13 is supported by the support member 14 in a non-contact manner via a mask holder magnetic levitation stage 52. The support member 14 and the film formation source 15 have the same configuration as in the first embodiment, and therefore a description thereof will be omitted.

[0128] 12 is an enlarged cross-sectional view showing the relative position detection means 17 and alignment mechanism 18 installed between the substrate holder 12 and the mask holder 13, as in the first embodiment. In addition to these, in this embodiment, a mask holder position detection means 51 and a mask holder magnetic levitation stage 52 are installed between the mask holder 13 and the mask holder rod 141. Furthermore, a substrate holder position detection means 53 and a substrate holder magnetic levitation stage 54 are installed between the mask holder 13 and the substrate holder rod 143.

[0129] As in the first embodiment, the relative position detection means 17 is a sensor that detects the relative position between the substrate holder 12 and the mask holder 13, and the alignment mechanism 18 is an actuator that applies electromagnetic force between the substrate holder 12 and the mask holder 13 to drive the relative positions of the two.

[0130] Furthermore, the mask holder position detecting means 51 and the mask holder magnetic levitation stage 52 have the same configuration as in the third embodiment. The mask holder position detecting means 51 is a sensor that detects the relative position between the mask holder rod 141 and the mask holder 13. The mask holder magnetic levitation stage 52 is a magnetic levitation stage that drives the mask holder 13 based on position information from the mask holder position detecting means 51. In this embodiment as well, the mask holder 13 is configured to be magnetically levitated relative to the support member 14 by the mask holder position detecting means 51 and the mask holder magnetic levitation stage 52.

[0131] In this embodiment, the substrate holder 12 is also configured to be magnetically levitated relative to the support member 14 by a substrate holder position detection means 53 and a substrate holder magnetic levitation stage 54 .

[0132] The substrate holder position detection means 53 is a sensor that detects the relative position between the substrate holder rod 143 and the substrate holder 12 that constitute the support member 14. An optical encoder 531 is installed on the substrate holder rod 143 side, and an optical scale 532 is installed in a position facing the optical encoder 531 on the substrate holder 12 side. The optical encoder 531 and optical scale 532 configure the substrate holder position detection means 53. In this case, the substrate holder position detection means 53 detects the relative position between the substrate holder rod 143 and the substrate holder 12 in the X direction or Y direction by the optical encoder 531 reading the optical scale 532, and outputs the position information. Two substrate holder position detection means 53 are installed: one for the X direction and one for the Y direction.

[0133] Furthermore, the substrate holder position detection means 53 has a magnetic levitation Z sensor and a magnetic levitation Z sensor block (not shown) for detecting the relative position in the Z direction between the substrate holder rod 143 and the substrate holder 12. The magnetic levitation Z sensor is installed on the substrate holder rod 143 side. The magnetic levitation block is installed in a position facing the magnetic levitation Z sensor on the mask holder 13 side. The substrate holder position detection means 53 measures the distance to the magnetic levitation Z sensor block using the magnetic levitation Z sensor, thereby detecting the relative position in the Z direction between the support member 14 and the substrate holder 12 and outputting that position information.

[0134] There is no particular limitation on the type of detection sensor that detects the relative position in the substrate holder position detection means 53. The detection sensor may be, for example, one configured with a magnetic encoder and scale, or may also be a laser interferometer including a laser interferometer and a reflecting mirror, a capacitance sensor, an eddy current sensor, or the like.

[0135] The substrate holder magnetic levitation stage 54 is a magnetic levitation stage that is driven by applying an electromagnetic force between the substrate holder rod 143 and the substrate holder 12. A coil unit 541 is installed on the substrate holder rod 143 side, and a permanent magnet unit 542 is installed in a position facing the coil unit 541 on the substrate holder 12 side. The coil unit 541 and the permanent magnet unit 542 constitute the substrate holder magnetic levitation stage 54. When a current flows through the coil of the coil unit 541, an electromagnetic force is generated between the coil unit 541 and the permanent magnet unit 542, and the electromagnetic force acts between the substrate holder rod 143 and the substrate holder 12. The substrate holder magnetic levitation stage 54 applies an electromagnetic force between the substrate holder rod 143 and the substrate holder 12 based on the relative positions of the substrate holder rod 143 and the substrate holder 12 detected by the substrate holder position detection means 53.

[0136] In the substrate holder magnetic levitation stage 54, the coil of the coil unit 541 may be either cored or coreless, but from the viewpoint of suppressing the control current for maintaining levitation, a cored coil is preferable. Furthermore, the coil unit 541 and the permanent magnet unit 542 may be installed upside down. That is, the coil unit 541 may be installed on the substrate holder 12 side, and the permanent magnet unit 542 may be installed on the substrate holder rod 143 side.

[0137] As in the third embodiment, the coil unit 521 and permanent magnet unit 522 of the mask holder magnetic levitation stage 52 are preferably larger than the coil unit 182 and permanent magnet unit 181 of the alignment mechanism 18, respectively. Furthermore, the coil unit 541 and permanent magnet unit 542 of the substrate holder magnetic levitation stage 54 are preferably larger than the coil unit 182 and permanent magnet unit 181 of the alignment mechanism 18, respectively. In these cases, the mask holder magnetic levitation stage 52 and the substrate holder magnetic levitation stage 54 can perform rough alignment operations with a large operating stroke, similar to the coarse alignment mechanism 50 of the second embodiment. Therefore, as in the second embodiment, the stroke required as the driving range of the fine alignment mechanism 18 can be reduced, and the permanent magnet unit 181 and coil unit 182 can be made smaller.

[0138] As described above, in this embodiment, similar to the third embodiment, the mask holder 13 is configured to be magnetically levitated relative to the support member 14 by the mask holder magnetic levitation stage 52 used in place of the vibration isolation mechanism 131. Furthermore, in this embodiment, the substrate holder 12 is configured to be magnetically levitated relative to the support member 14 by the substrate holder magnetic levitation stage 54 used in place of the vibration isolation mechanism 121. In this embodiment, compared to the vibration isolation mechanisms 121, 131, etc., in which the structures are in contact with each other, the mask holder 13 and the substrate holder 12 are supported by the support member 14 in a non-contact manner by magnetic levitation. Therefore, in this embodiment, the natural frequency can be designed to be even smaller, specifically, for example, 1H or less, and high vibration isolation performance can be achieved on both the mask holder 13 side and the substrate holder 12 side.

[0139] Furthermore, the attitudes of the mask holder 13 and the substrate holder 12 can be controlled along six axes by driving the mask holder magnetic levitation stage 52 and the substrate holder magnetic levitation stage 54. This allows angle correction to be made to the attitudes of the mask holder 13 and the substrate holder 12 so that the planes of the upper surface of the mask M and the lower surface of the substrate W are aligned. Such angle correction makes it possible to uniformly manage the gap between the upper surface of the mask M and the lower surface of the substrate W, thereby preventing or suppressing degradation in film formation quality, particularly around the outer periphery of the substrate W.

[0140] As described above, according to this embodiment, floor vibrations and vibrations during driving of the film formation sources can be further suppressed by configuring the mask holder 13 and the substrate holder 12 to be magnetically levitated. Also, as in the first to third embodiments, by generating an electromagnetic force between the substrate holder 12 and the mask holder 13 to drive them directly, highly accurate relative position control and therefore highly accurate alignment operation can be realized.

[0141] In this embodiment, the case where both the mask holder 13 and the substrate holder 12 are configured to be magnetically levitated has been described, but the present invention is not limited to this. Either the mask holder 13 or the substrate holder 12 may be configured to be magnetically levitated.

[0142] Also in the configuration of the second embodiment, the mask holder 13 and the substrate holder 12 can be configured to be magnetically levitated, similarly to this embodiment.

[0143] [Modified embodiment] The present invention is not limited to the above-described embodiments and can be modified in various ways. For example, an example in which part of the configuration of one embodiment is added to another embodiment, or an example in which part of the configuration of another embodiment is replaced with another embodiment, is also an embodiment of the present invention.

[0144] The present invention can also be realized by supplying a program that realizes one or more functions of the above-described embodiments to a system or device via a network or a storage medium, and having one or more processors in the computer of the system or device read and execute the program.The present invention can also be realized by a circuit (e.g., ASIC) that realizes one or more functions.

[0145] It should be noted that the above-described embodiments are merely examples of specific embodiments for carrying out the present invention, and the technical scope of the present invention should not be construed as being limited by these embodiments. In other words, the present invention can be carried out in various forms without departing from its technical concept or main features.

[0146] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) a substrate holder for holding a substrate; a mask holder for holding a mask so as to face the substrate; a support member that supports the substrate holder and the mask holder; a position detecting means for detecting a first relative position between the substrate holder and the mask holder; a first drive mechanism that generates an electromagnetic force between the substrate holder and the mask holder based on information about the first relative position; the substrate holder is supported by the support member in a non-contact manner via a first vibration isolation mechanism or a first levitation mechanism; The mask holder is supported by the support member in a non-contact manner via a second vibration isolation mechanism or a second levitation mechanism. An alignment device characterized by: (Configuration 2) The first driving mechanism has a coil provided on one side of the substrate holder and the mask holder, and a permanent magnet provided on the other side of the substrate holder and the mask holder, and generates the electromagnetic force between the substrate holder and the mask holder by the coil and the permanent magnet. 2. The alignment device according to configuration 1, (Configuration 3) a second driving mechanism that is installed on the support member and drives at least one of the substrate holder and the mask holder; 3. The alignment device according to configuration 1 or 2, (Configuration 4) The second driving mechanism drives the substrate holder via the first vibration isolation mechanism. 4. The alignment device according to configuration 3, (Configuration 5) The second driving mechanism drives the mask holder via the second vibration isolation mechanism. 5. The alignment device according to configuration 3 or 4, wherein: (Configuration 6) The second drive mechanism has a larger operating stroke than the first drive mechanism. 6. The alignment device according to any one of configurations 3 to 5, wherein: (Configuration 7) The first drive mechanism operates under speed control when the second drive mechanism is operating, and operates under position control when the second drive mechanism is stopped. 7. The alignment device according to any one of configurations 3 to 6, wherein: (Configuration 8) The first drive mechanism operates in response to vibrations generated by the second drive mechanism. 8. The alignment device according to any one of configurations 3 to 7, wherein: (Configuration 9) The first drive mechanism operates to suppress the vibration caused by the second drive mechanism. 9. The alignment apparatus according to configuration 8, (Configuration 10) The vibration caused by the second driving mechanism is a residual vibration. 10. The alignment device according to configuration 8 or 9, (Configuration 11) a second position detecting means for detecting a second relative position between the substrate holder and the support member; the substrate holder is supported by the support member via the first levitation mechanism; The first levitation mechanism applies an electromagnetic force between the substrate holder and the support member based on information about the second relative position. 11. The alignment device according to any one of configurations 1 to 10, wherein: (Configuration 12) a third position detecting means for detecting a third relative position between the mask holder and the support member; the mask holder is supported by the support member via the second levitation mechanism; The second levitation mechanism applies an electromagnetic force between the mask holder and the support member based on information about the third relative position. 11. The alignment device according to any one of configurations 1 to 10, wherein: (Configuration 13) a second position detecting means for detecting a second relative position between the substrate holder and the support member; a third position detecting means for detecting a third relative position between the mask holder and the support member; the substrate holder is supported by the support member via the first levitation mechanism; the mask holder is supported by the support member via the second levitation mechanism; the first levitation mechanism applies an electromagnetic force between the substrate holder and the support member based on information about the second relative position; The second levitation mechanism applies an electromagnetic force between the mask holder and the support member based on information about the third relative position. 11. The alignment device according to any one of configurations 1 to 10, wherein: (Configuration 14) A container and an alignment device according to any one of aspects 1 to 13, the alignment device being installed inside the container; a film forming source disposed inside the container and emitting a film forming material; A film forming apparatus comprising: (Method 1) A method for manufacturing an article using the film forming apparatus according to configuration 14, the electromagnetic force is exerted between the substrate holder that holds the substrate and the mask holder that holds the mask, thereby aligning the substrate and the mask; After the alignment, a film is formed on the substrate using the film formation material; Manufacture goods; A film forming method characterized by: [Explanation of symbols]

[0147] 1 Film deposition equipment 6. Control System 11 Vacuum container 12 Substrate holder 13 Mask holder 14 Support member 15 Film deposition source 16 Z lift mechanism 17 Relative position detection means 18 Alignment mechanism 50 Coarse alignment mechanism 51 Mask holder position detection means 52 Mask holder magnetic levitation stage 53 Substrate holder position detection means 54 Substrate holder magnetic levitation stage 121, 131 Vibration isolation mechanism 181 Permanent Magnet Unit 182 Coil unit

Claims

1. a substrate holder for holding a substrate; a mask holder for holding a mask so as to face the substrate; a support member that supports the substrate holder and the mask holder; a position detecting means for detecting a first relative position between the substrate holder and the mask holder; a first drive mechanism that generates an electromagnetic force between the substrate holder and the mask holder based on information about the first relative position; the substrate holder is supported by the support member in a non-contact manner via a first vibration isolation mechanism or a first levitation mechanism; The mask holder is supported by the support member in a non-contact manner via a second vibration isolation mechanism or a second levitation mechanism. An alignment device characterized by:

2. The first driving mechanism has a coil provided on one side of the substrate holder and the mask holder, and a permanent magnet provided on the other side of the substrate holder and the mask holder, and generates the electromagnetic force between the substrate holder and the mask holder by the coil and the permanent magnet.

2. The alignment device according to claim 1, wherein:

3. a second driving mechanism that is installed on the support member and drives at least one of the substrate holder and the mask holder; 3. An alignment apparatus according to claim 1 or 2.

4. The second driving mechanism drives the substrate holder via the first vibration isolation mechanism.

4. The alignment apparatus according to claim 3.

5. The second driving mechanism drives the mask holder via the second vibration isolation mechanism.

4. The alignment device according to claim 3.

6. The second drive mechanism has a larger operating stroke than the first drive mechanism.

4. The alignment apparatus according to claim 3.

7. The first drive mechanism operates under speed control when the second drive mechanism is operating, and operates under position control when the second drive mechanism is stopped.

4. The alignment device according to claim 3.

8. The first drive mechanism operates in response to vibrations generated by the second drive mechanism.

4. The alignment device according to claim 3.

9. The first drive mechanism operates to suppress the vibration caused by the second drive mechanism.

9. The alignment apparatus according to claim 8.

10. The vibration caused by the second driving mechanism is a residual vibration.

9. The alignment apparatus according to claim 8.

11. a second position detecting means for detecting a second relative position between the substrate holder and the support member; the substrate holder is supported by the support member via the first levitation mechanism; The first levitation mechanism applies an electromagnetic force between the substrate holder and the support member based on information about the second relative position.

3. An alignment apparatus according to claim 1 or 2.

12. a third position detecting means for detecting a third relative position between the mask holder and the support member; the mask holder is supported by the support member via the second levitation mechanism, The second levitation mechanism applies an electromagnetic force between the mask holder and the support member based on information about the third relative position.

3. An alignment apparatus according to claim 1 or 2.

13. a second position detecting means for detecting a second relative position between the substrate holder and the support member; a third position detecting means for detecting a third relative position between the mask holder and the support member; the substrate holder is supported by the support member via the first levitation mechanism; the mask holder is supported by the support member via the second levitation mechanism, the first levitation mechanism applies an electromagnetic force between the substrate holder and the support member based on information about the second relative position; The second levitation mechanism applies an electromagnetic force between the mask holder and the support member based on information about the third relative position.

3. An alignment apparatus according to claim 1 or 2.

14. A container and an alignment device according to claim 1 or 2, which is installed inside the container; a film forming source disposed inside the container and emitting a film forming material; A film forming apparatus comprising:

15. A method for manufacturing an article using the film forming apparatus according to claim 14, the electromagnetic force is exerted between the substrate holder that holds the substrate and the mask holder that holds the mask, thereby aligning the substrate and the mask; After the alignment, a film is formed on the substrate using the film formation material; Manufacture goods; A film forming method characterized by:

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