Conductive coating material

Abstract

To provide a conductive coating material from which a coating film that maintains necessary coating film performance and has good smoothness can be obtained.SOLUTION: A conductive coating material contains a hydroxyl group-containing resin (A) containing no epoxy group, a blocked carboxylic acid (B) having a potential carboxyl group, conductive powder (C), and a curing agent (D) having a group reactive with a hydroxyl group possessed by the hydroxyl group-containing resin (A), wherein the blocked carboxylic acid (B) is represented by one of the following formulae (1) to (4), and 0.05 mass% or more and 4.1 mass% or less of the blocked carboxylic acid (B) is contained in 100 mass% in which a volatile matter content is deducted from the whole conductive coating material.SELECTED DRAWING: None

Description

[Technical Field]

[0001] The present invention relates to a conductive paint. [Background technology]

[0002] Conductive paints, which contain resin and conductive powder, can easily impart conductivity to an object by simply applying them to the object and curing them. Because the process is simple and the paints can be produced at low cost, they are widely used in the electronic device field. For example, Patent Document 1 discloses a conductive adhesive containing an epoxy resin, a phenolic resin, a reactive diluent, an imidazole compound, silver powder and / or silver-coated metal powder, and further containing a latent glutaric acid-generating compound in the range of 0.05 to 5 mass %. Patent Document 2 discloses a conductive paste containing a metal powder (A), a resin (B) having an epoxy group or an oxetane group, and a latent carboxyl group-generating compound (C). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 5200662 [Patent Document 2] JP 2004-355933 A Summary of the Invention [Problem to be solved by the invention]

[0004] In recent years, as electronic devices have become smaller and thinner, electronic components have become even more miniaturized. As electronic components become more miniaturized, the performance required of conductive paints has also become more sophisticated. In order to make electronic components smaller and thinner, one of the performance requirements for conductive paint is the smoothness of the coating film. However, although coating films formed using conventional conductive paints such as those disclosed in Patent Documents 1 and 2 have good conductive properties, they have unevenness and insufficient smoothness.

[0005] Therefore, the inventors tried to increase the ratio of solvent in the conductive paint in order to improve the smoothness of the coating film obtained from the conductive paint. As a result, it was found that increasing the ratio of solvent improved the smoothness, but made the film prone to sagging. Furthermore, when the particle size of the conductive powder contained in the conductive paint was reduced, the smoothness of the coating film improved, but the resistivity increased. In view of the above circumstances, an object of the present invention is to provide a conductive coating material that can provide a coating film with good smoothness while maintaining the necessary coating film performance. [Means for solving the problem]

[0006] In order to solve the above problems, the present invention employs the following configuration. [1] A hydroxyl group-containing resin (A) that does not contain an epoxy group, a blocked carboxylic acid (B) having a latent carboxyl group; A conductive powder (C); a curing agent (D) having a group reactive with the hydroxyl group of the hydroxyl group-containing resin (A); A conductive material comprising: the blocked carboxylic acid (B) is at least one selected from a compound having a structural unit represented by the following formula (1) and a compound represented by any one of the following formulas (2) to (4), The conductive material contains the blocked carboxylic acid (B) in an amount of 0.05% by mass or more and 4.1% by mass or less, based on 100% by mass obtained by subtracting volatile components from the entire conductive coating material. [ka] (R in Equation (1) 1 is a single bond, a divalent saturated hydrocarbon group having 1 to 15 carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, and R 2 is a divalent saturated hydrocarbon group having 1 to 15 carbon atoms which may contain an etheric oxygen atom. [ka] (R in Equation (2) 3 and R 5 is a hydrogen atom or a monovalent saturated hydrocarbon group having 1 to 16 carbon atoms, and R 4 R is a divalent saturated hydrocarbon group having 1 to 15 carbon atoms which may contain an etheric oxygen atom. 3 and R 5 may be the same or different.) [ka] (R in Equation (3) 6 is a hydrogen atom or a monovalent saturated hydrocarbon group having 1 to 16 carbon atoms, and R 7 is a monovalent saturated hydrocarbon group having 1 to 18 carbon atoms which may contain an etheric oxygen atom. [ka] (R in Equation (4) 8 and R 10 is a monovalent saturated hydrocarbon group having 1 to 18 carbon atoms which may contain an etheric oxygen atom, and R 9 is a single bond, a divalent saturated hydrocarbon group having 1 to 15 carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, and R 8 and R 10 may be the same or different.)

[0007] [2] The conductive coating material according to [1], wherein the hydroxyl group-containing resin (A) is one or more selected from polyester polyols, polycarbonate polyols, acrylic polyols, polyether polyols, polycaprolactone polyols, polyolefin polyols, polyurethane polyols, phenolic resins, and xylene resins.

[0008] [3] The conductive coating material according to [1] or [2], wherein the curing agent (D) is an isocyanate-based curing agent. [Effects of the Invention]

[0009] The conductive coating material of the present invention can provide a coating film with good smoothness while maintaining the necessary coating film performance. DETAILED DESCRIPTION OF THE INVENTION

[0010] As used in the specification and claims, the following terms have the following definitions: "Vinyl (thio) ether" is a general term for vinyl ethers and vinyl thioethers. The symbol "to" indicating a range of values ​​means that the values ​​before and after it are included as the lower and upper limits.

[0011] The conductive coating material of this embodiment contains a hydroxyl-containing resin (A) that does not contain an epoxy group, a blocked carboxylic acid (B) that has a latent carboxyl group, a conductive powder (C), and a curing agent (D). It is also preferable that the conductive coating material further contains a solvent (E).

[0012] <Hydroxyl group-containing resin (A)> The hydroxyl-containing resin (A) is a resin having a hydroxyl group, except for those containing an epoxy group. Examples of the hydroxyl group-containing resin (A) include polyester polyols, polycarbonate polyols, acrylic polyols, polyether polyols, polycaprolactone polyols, polyolefin polyols, polyurethane polyols, phenolic resins, and xylene resins. Among these, polyester polyols, polycarbonate polyols, and xylene resins are preferred because they provide coating films with excellent smoothness.

[0013] Examples of xylene resins include a polymer composition in which m-xylene is crosslinked with methylene bonds or ether bonds and some of the terminals have OH groups; an alkylphenol-modified xylene resin in which the polymer composition is modified with an alkylphenol resin; a novolac-type xylene resin in which the polymer composition is modified with a phenol resin; a resol-type xylene resin in which the polymer composition is modified with a phenol resin; a xylene resin in which the polymer composition is modified with a polyol; and a xylene resin in which the polymer composition is modified with ethylene oxide.

[0014] As the xylene resin, commercially available products can be used as appropriate, and examples thereof include the Nikanol series (for example, GHP-150, NP-100, P-100, etc.) manufactured by Fudow Co., Ltd. Among the xylene resins, novolac-type xylene resins obtained by modifying the polymer composition with a phenolic resin, resol-type xylene resins obtained by modifying the polymer composition with a phenolic resin, and xylene resins obtained by modifying the polymer composition with a polyol are preferred because they improve the chemical resistance of the coating film.

[0015] The hydroxyl group-containing resin (A) may be used alone or in combination of two or more. When used in combination, a combination of polyester polyol and polycarbonate polyol, or polyester polyol and xylene resin is preferred because it allows for a coating film with good smoothness to be obtained.

[0016] The preferred range of the number average molecular weight (Mn) of the hydroxyl group-containing resin (A) varies depending on the type and application of the resin, but is preferably 500 to 50,000. When the number average molecular weight (Mn) of the hydroxyl group-containing resin (A) is at least the preferred lower limit, the mechanical strength of the cured coating film is excellent. When it is at most the preferred upper limit, the coating workability (printing characteristics) is improved. The number average molecular weight (Mn) of the hydroxyl group-containing resin (A) is a polystyrene-equivalent molecular weight measured by gel permeation chromatography (GPC) using tetrahydrofuran as an eluent, with a calibration curve prepared using polystyrene polymers with known molecular weights.

[0017] When a polyester polyol is used as the hydroxyl group-containing resin (A), the number average molecular weight (Mn) of the polyester polyol in the hydroxyl group-containing resin (A) is preferably 1,000 to 50,000, more preferably 1,000 to 10,000. When a polycarbonate diol is used as the hydroxyl group-containing resin (A), the number average molecular weight (Mn) of the polycarbonate diol in the hydroxyl group-containing resin (A) is preferably 500 to 3,000. When a xylene resin is used as the hydroxyl group-containing resin (A), the number average molecular weight (Mn) of the xylene resin in the hydroxyl group-containing resin (A) is preferably 500 to 50,000.

[0018] The hydroxyl value of the hydroxyl-containing resin (A) varies depending on the type and application of the resin, but is preferably 1 to 500 mgKOH / g, more preferably 1 to 300 mgKOH / g. When a polyester polyol is used as the hydroxyl group-containing resin (A), the hydroxyl value of the polyester polyol in the hydroxyl group-containing resin (A) is preferably from 1 to 500 mgKOH / g, more preferably from 1 to 300 mgKOH / g.

[0019] When a polycarbonate diol is used as the hydroxyl group-containing resin (A), the hydroxyl value of the polycarbonate diol in the hydroxyl group-containing resin (A) is preferably 20 to 500 mgKOH / g. When a xylene resin is used as the hydroxyl group-containing resin (A), the hydroxyl value of the polycarbonate diol in the hydroxyl group-containing resin (A) is preferably 1 to 500 mgKOH / g, more preferably 1 to 300 mgKOH / g.

[0020] <Blocked Carboxylic Acid (B)> Blocked carboxylic acid (B) has a latent carboxyl group, i.e., a carboxyl group blocked with a protecting group. Blocked carboxylic acid (B) is obtained by adding a protecting group such as vinyl ether to a carboxylic acid. When blocked carboxylic acid (B) is heated, the protecting group dissociates, generating the carboxylic acid.

[0021] The thermal decomposition starting temperature at which the protecting group dissociates from the blocked carboxylic acid (B) is preferably 170°C or lower, more preferably 80 to 150°C. When the thermal decomposition starting temperature is equal to or higher than the preferred lower limit, storage stability is improved. When the thermal decomposition starting temperature is equal to or lower than the preferred upper limit, the protecting group is quickly removed during use of the conductive coating material, and the activity of the carboxylic acid is easily expressed. The thermal decomposition starting temperature here refers to the temperature at which a sample loses 1% of its mass when the change in mass is measured while the sample is heated at 10°C / min.

[0022] The amount of unblocked carboxyl groups in the blocked carboxylic acid (B) can be evaluated by the acid value. The acid value of the blocked carboxylic acid (B) is preferably 50 mgKOH / g or less, more preferably 35 mgKOH / g or less, even more preferably 25 mgKOH / g or less, and particularly preferably 10 mgKOH / g or less.

[0023] It is preferable to carry out the reaction so that all of the carboxyl groups of the carboxylic acid used to produce the blocked carboxylic acid (B) are blocked, that is, the acid value of the blocked carboxylic acid (B) is as close as possible to 0 mgKOH / g. However, if the acid value is within the above range, the storage stability of the conductive coating material will be good.

[0024] The blocked carboxylic acid (B) is one or more selected from the following blocked carboxylic acids (B1) to (B4). The blocked carboxylic acid (B) may be used alone or in combination of two or more kinds. In addition, although the formulas of the blocked carboxylic acids (B1) to (B4) below are expressed in a form in which all carboxyl groups are blocked, some unblocked carboxyl groups may remain as long as the acid value is within an appropriate range.

[0025] [Blocked carboxylic acid (B1)] The blocked carboxylic acid (B1) is a compound having repeating structural units represented by the following formula (1). Both ends of the blocked carboxylic acid (B1) are hydrogen atoms or groups selected from a carboxy group and a vinyl group.

[0026] [ka]

[0027] R in formula (1) 1 is a single bond, a divalent saturated hydrocarbon group having 1 to 15 carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, and R 2 is a divalent saturated hydrocarbon group having 1 to 15 carbon atoms which may contain an etheric oxygen atom. R 2 may be either a straight chain or a branched chain, and may also have a cyclic structure.

[0028] R 1 When is a single bond or a divalent saturated hydrocarbon group having 15 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, the smoothness of the coating film is improved. R 1 is preferably a single bond, a divalent saturated hydrocarbon group having 8 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, more preferably a single bond, a divalent saturated hydrocarbon group having 6 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, and even more preferably a single bond, a divalent saturated hydrocarbon group having 4 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 4 or less carbon atoms.

[0029] R 2 When the number of carbon atoms is 15 or less, the blocks are easily removed by heating, and the reactivity during production is good. R 2 is particularly preferably a group represented by any one of the following formulas (5) to (8).

[0030] [ka]

[0031] [ka]

[0032] [ka]

[0033] [ka]

[0034] The weight average molecular weight (Mw) of the blocked carboxylic acid (B1) is preferably 1,000 to 20,000, more preferably 3,000 to 15,000. When the weight average molecular weight (Mw) of the blocked carboxylic acid (B1) is at least the lower limit, the storage stability is improved. When it is at most the upper limit, the smoothness of the coating film is improved.

[0035] The weight average molecular weight (Mw) of the blocked carboxylic acid (B) is a polystyrene-equivalent molecular weight measured by gel permeation chromatography (GPC) using tetrahydrofuran as an eluent, with a calibration curve prepared using polystyrene polymers of known molecular weights.

[0036] The blocked carboxylic acid (B1) can be obtained by subjecting a divalent saturated aliphatic carboxylic acid to an addition reaction with a vinyl (thio)ether having two vinyl ether groups. Specific examples of divalent saturated aliphatic carboxylic acids and vinyl (thio)ethers having two vinyl ether groups will be described later.

[0037] [Blocked Carboxylic Acid (B2)] The blocked carboxylic acid (B2) is a compound represented by the following formula (2).

[0038] [ka]

[0039] R in equation (2) 3 and R 5 is a hydrogen atom or a monovalent saturated hydrocarbon group having 1 to 16 carbon atoms, and R 4 R is a divalent saturated hydrocarbon group having 1 to 15 carbon atoms which may contain an etheric oxygen atom. 3 and R 5 may be the same or different from each other. R 4 may be either a straight chain or a branched chain, and may also have a cyclic structure.

[0040] R 3 and R 5 When is a hydrogen atom or a monovalent saturated hydrocarbon group having 16 or less carbon atoms, the smoothness of the coating film is improved. R 3 and R 5 is preferably a hydrogen atom or a monovalent saturated hydrocarbon group having 8 or less carbon atoms, more preferably a hydrogen atom or a monovalent saturated hydrocarbon group having 6 or less carbon atoms, and even more preferably a hydrogen atom or a monovalent saturated hydrocarbon group having 4 or less carbon atoms. R 4 When the number of carbon atoms is 15 or less, the blocks are easily removed by heating, and the reactivity during production is good. R 4 is particularly preferably a group represented by any one of the formulas (5) to (8).

[0041] The blocked carboxylic acid (B2) can be obtained by adding a vinyl(thio)ether having two vinyl ether groups to a saturated aliphatic monocarboxylic acid. Specific examples of the saturated aliphatic monocarboxylic acid and the vinyl(thio)ether having two vinyl ether groups will be described later.

[0042] [Blocked carboxylic acid (B3)] The blocked carboxylic acid (B3) is a compound represented by the following formula (3).

[0043] [ka]

[0044] R in equation (3) 6 is a hydrogen atom or a monovalent saturated hydrocarbon group having 1 to 16 carbon atoms, and R 7 is a monovalent saturated hydrocarbon group having 1 to 18 carbon atoms which may contain an etheric oxygen atom. R 7 may be either a straight chain or a branched chain, and may also have a cyclic structure.

[0045] R 6 When is a hydrogen atom or a monovalent saturated hydrocarbon group having 16 or less carbon atoms, the smoothness of the coating film is improved. R 6 is preferably a hydrogen atom or a monovalent saturated hydrocarbon group having 8 or less carbon atoms, more preferably a hydrogen atom or a monovalent saturated hydrocarbon group having 6 or less carbon atoms, and even more preferably a hydrogen atom or a monovalent saturated hydrocarbon group having 4 or less carbon atoms.

[0046] R 7 By having 18 or less carbon atoms, the blocks are easily removed by heating, resulting in good reactivity during production. 7 The number of carbon atoms in the group is preferably 1 to 8, more preferably 1 to 6, and particularly preferably 1 to 4. R 7 is a propyl group (-C3H7), a butyl group (-C4H9), an octyl group (-C8H 17 ) is most preferred.

[0047] The blocked carboxylic acid (B3) can be obtained by adding a vinyl (thio)ether having one vinyl ether group to a monovalent saturated aliphatic carboxylic acid. Specific examples of monovalent saturated aliphatic carboxylic acids and vinyl (thio)ethers having one vinyl ether group will be described later.

[0048] [Blocked carboxylic acid (B4)] The blocked carboxylic acid (B4) is a compound represented by the following formula (4).

[0049] [ka]

[0050] R in equation (4) 8 and R 10 is a monovalent saturated hydrocarbon group having 1 to 18 carbon atoms which may contain an etheric oxygen atom, and R 9 R is a single bond, a divalent saturated hydrocarbon group having 1 to 15 carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms. 8 and R 10 may be the same or different from each other. R 8 and R 10 may be either a straight chain or a branched chain, and may also have a cyclic structure.

[0051] R 9 When is a single bond, a divalent saturated hydrocarbon group having 15 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, the smoothness of the coating film is improved. R 9 is preferably a hydrogen atom or a divalent saturated hydrocarbon group having 8 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, more preferably a hydrogen atom or a divalent saturated hydrocarbon group having 6 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, and even more preferably a hydrogen atom or a divalent saturated hydrocarbon group having 4 or less carbon atoms, or a divalent unsaturated hydrocarbon group having 4 or less carbon atoms.

[0052] R 8 and R 10 By having 18 or less carbon atoms, the blocks are easily removed by heating, resulting in good reactivity during production. 8 and R 10 The number of carbon atoms in the group is preferably 1 to 8, more preferably 1 to 6, and particularly preferably 1 to 4. R 8 and R 10is a propyl group (-C3H7), a butyl group (-C4H9), an octyl group (-C8H 17 ) is most preferred.

[0053] The blocked carboxylic acid (B4) can be obtained by adding a vinyl (thio)ether having one vinyl ether group to a divalent saturated aliphatic carboxylic acid. Specific examples of divalent saturated aliphatic carboxylic acids and vinyl (thio)ethers having one vinyl ether group will be described later.

[0054] [Carboxylic Acid] Examples of the carboxylic acid that can be used as a raw material for the blocked carboxylic acid (B) include monovalent or divalent saturated aliphatic carboxylic acids, and divalent unsaturated carboxylic acids.

[0055] Examples of the monovalent saturated aliphatic carboxylic acid include formic acid, ethanoic acid, propanoic acid, butanoic acid, pentanoic acid, hexanoic acid, heptanoic acid, octanoic acid, nonanoic acid, decanoic acid, dodecanoic acid, tetradecanoic acid, hexadecanoic acid, and heptadecanoic acid.

[0056] Examples of divalent saturated aliphatic carboxylic acids include ethanedioic acid, propanedioic acid, butanedioic acid, pentanedioic acid, hexanedioic acid, heptanedioic acid, octanedioic acid, nonanedioic acid, decanedioic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, and 2,4-diethylpentanedioic acid. An example of the divalent unsaturated carboxylic acid is maleic acid.

[0057] Among these, carboxylic acids with a relatively small number of carbon atoms and a short molecular chain are particularly preferred, because they have high reactivity, allow easy production of the blocked carboxylic acid (B), and result in good coating film smoothness. For these reasons, methanoic acid, ethanedioic acid, propanedioic acid, butanedioic acid, pentanedioic acid, hexanedioic acid, heptanedioic acid, octanedioic acid, nonanedioic acid, decanedioic acid, undecanedioic acid, dodecanedioic acid, tridecanedioic acid, tetradecanedioic acid, pentadecanedioic acid, hexadecanedioic acid, heptadecanedioic acid, and maleic acid are particularly preferred.

[0058] [Vinyl (thio) ether] Examples of vinyl (thio)ethers that can be used as raw materials for the blocked carboxylic acid (B) include aliphatic vinyl ethers, alicyclic vinyl ethers, aliphatic vinyl thioethers, alicyclic vinyl thioethers, cyclic vinyl ethers, and cyclic vinyl thioethers.

[0059] Examples of aliphatic vinyl ethers having one vinyl ether group include monovinyl ether compounds such as methyl vinyl ether, ethyl vinyl ether, isopropyl vinyl ether, n-propyl vinyl ether, n-butyl vinyl ether, isobutyl vinyl ether, tert-pentyl vinyl ether, n-pentyl vinyl ether, hexyl vinyl ether, heptyl vinyl ether, nonyl vinyl ether, decyl vinyl ether, dodecyl vinyl ether, tetradecyl vinyl ether, hexadecyl vinyl ether, heptadecyl vinyl ether, octadecyl vinyl ether, 2-ethylhexyl vinyl ether, hydroxyethyl vinyl ether, and hydroxybutyl vinyl ether.

[0060] Examples of aliphatic vinyl ethers having two vinyl ether groups include divinyl ether compounds such as (2-vinyloxyethyl)vinyl ether, 1,3-propanediol divinyl ether, 1,4-butanediol divinyl ether, 1,3-butanediol divinyl ether, 1,2-butanediol divinyl ether, 2,3-butanediol divinyl ether, 1,5-pentanediol divinyl ether, 1,6-hexanediol divinyl ether, 1,9-nonanediol divinyl ether, (2-vinyloxyethyl)vinyl ether, diethylene glycol divinyl ether, dipropylene glycol divinyl ether, triethylene glycol divinyl ether, trimethylene glycol divinyl ether, tripropylene glycol divinyl ether, and tetrapropylene glycol divinyl ether.

[0061] Examples of alicyclic vinyl ethers having one vinyl ether group include monovinyl ether compounds such as cyclohexyl vinyl ether and cyclohexanedimethanol monovinyl ether. Examples of alicyclic vinyl ethers having two vinyl ether groups include divinyl ether compounds such as 1,4-cyclohexanedimethanol divinyl ether, 4,4-bis(vinyloxymethyl)cyclohexene, 1,4-bis(ethenyloxy)benzene, bisphenol A divinyl ether, and bisphenol F divinyl ether.

[0062] Examples of the aliphatic vinyl thioether include thio compounds in which the etheric oxygen of the compounds exemplified as the aliphatic vinyl ethers is replaced with sulfur. Examples of the alicyclic vinyl thioether include thio compounds in which the etheric oxygen of the compounds exemplified as the alicyclic vinyl ethers is replaced with sulfur.

[0063] Examples of cyclic vinyl ethers include 2,3-dihydrofuran, 3,4-dihydrofuran, 2,3-dihydro-2H-pyran, 3,4-dihydro-2H-pyran, 3,4-dihydro-2-methoxy-2H-pyran, 3,4-dihydro-4,4-dimethyl-2H-pyran-2-one, 3,4-dihydro-2-ethoxy-2H-pyran, and sodium 3,4-dihydro-2H-pyran-2-carboxylate. Examples of the cyclic vinyl thioether include thio compounds in which the etheric oxygen of the compounds exemplified as the cyclic vinyl ethers is replaced with sulfur.

[0064] Among these, n-propyl vinyl ether, n-butyl vinyl ether, 2-ethylhexyl vinyl ether, tetraethylene glycol divinyl ether, 1,4-butanediol divinyl ether, 1,3-butanediol divinyl ether, 1,2-butanediol divinyl ether, 2,3-butanediol divinyl ether, 1,4-cyclohexanedimethanol divinyl ether, diethylene glycol divinyl ether, and triethylene glycol divinyl ether are preferred in terms of raw material availability and the ease with which blocks are rapidly released by heating.

[0065] [Production of Blocked Carboxylic Acid (B)] The reaction ratio of carboxylic acid to vinyl (thio)ether is usually 1.0:1.0 to 5.0, preferably 1.0:1.0 to 4.0, and particularly preferably 1.0:1.0 to 3.0, in terms of equivalent ratio. The reaction temperature between the carboxylic acid and the vinyl (thio) ether is preferably 30 to 150°C, more preferably 30 to 100°C. The reaction time is preferably 10 minutes to 6 hours, more preferably 20 minutes to 5 hours. The end point of the reaction is determined, for example, by the acid value of the reaction system decreasing to an appropriate value.

[0066] <Conductive powder (C)> The conductive powder (C) imparts conductivity to the coating film. The conductive powder (C) is not particularly limited as long as it is used in conductive coating materials, but examples thereof include metals such as gold, silver, copper, platinum, and nickel; graphite, etc. Among these, silver is preferred from the viewpoints of excellent conductivity and resistance to oxidation.

[0067] The conductive powder (C) may be composed of two or more elements, and for example, an alloy of the metals listed above can be used. Alternatively, a metal, an alloy, or a resin coated with the above-mentioned metal may be used. Among these, a metal other than silver, an alloy, or a resin coated with silver is preferred from the viewpoint of excellent conductivity and resistance to oxidation.

[0068] The conductive powder (C) preferably contains a conductive powder that has been surface-treated with a fatty acid, and more preferably consists of a conductive powder that has been surface-treated with a fatty acid, as this improves workability (printing characteristics). Examples of the fatty acid used for the surface treatment of the conductive powder (C) include oleic acid, stearic acid, and lauric acid. Examples of a method for surface-treating the conductive powder (C) with a fatty acid include mixing the fatty acid diluted in a solvent with the conductive powder in a ball mill or the like, followed by drying. The conductive powder (C) may be used alone or in combination of two or more types.

[0069] The average particle size of the conductive powder (C) is preferably from 0.1 to 15 μm, more preferably from 0.2 to 10 μm, even more preferably from 0.3 to 7.5 μm, and particularly preferably from 0.5 to 5.0 μm. When the average particle size of the conductive powder (C) is at least the preferred lower limit, the conductivity of the coating film is improved, and when it is at most the preferred upper limit, the smoothness of the coating film is improved. The average particle size of the conductive powder (C) is the cumulative 50% diameter in the volume-based particle size distribution measured by a laser diffraction / scattering particle size distribution measuring device.

[0070] The shape of the conductive powder (C) is not particularly limited, and various shapes such as flakes (which can also be referred to as scale-like, flat, plate-like, or thin-film-like), spheres, cubes, needles, granules (irregular spheres), beads, shapes with protrusions on the surface like sugar candy, irregular shapes, and aggregates can be used. In the present invention, "irregular shape" means a mixture of two or more different shapes, such as spherical, cubic, needle-like, granular, bead-like, or shapes with protrusions on the surface like candy canes, and the shape cannot be limited.

[0071] In addition, in the present invention, the term "aggregate" refers to an aggregate in which the primary particles have one or more shapes selected from the group consisting of spherical, cubic, needle-like, granular, bead-like, and shapes with protrusions on the surface, such as sugar candy. The amorphous particles preferably include granular particles. The aggregates preferably include granular primary particles, and more preferably include only granular primary particles.

[0072] Of these, the conductive powder (C) is preferably in the form of flakes, granules, irregular shapes, aggregates, a combination of flakes and granules, a combination of flakes and irregular shapes, or a combination of flakes and aggregates. When the conductive powder (C) is flake-shaped, a combination of flakes and granules, a combination of flakes and irregular shapes, or a combination of flakes and aggregates, the resistivity of the conductive paint film becomes better.When the conductive powder (C) is granular, irregular, or aggregate, the flexibility and printing properties of the conductive paint film become better.

[0073] <Curing agent> The conductive coating material of this embodiment further contains a curing agent (D). The curing agent has a group that reacts with the hydroxyl group of the hydroxyl group-containing resin (A).

[0074] Examples of curing agents include amine-based curing agents, epoxy-based curing agents, isocyanate-based curing agents, melamine-based curing agents, aziridine-based curing agents, hydrazine-based curing agents, aldehyde-based curing agents, oxazoline-based curing agents, metal alkoxide-based curing agents, metal chelate-based curing agents, metal salt-based curing agents, and ammonium salt-based curing agents, and can be selected appropriately depending on the required coating material performance and coating film performance. Among these, isocyanate-based curing agents are preferred because blocked curing agents are readily available, allowing selection between blocked and non-blocked types, and because they have excellent reactivity with hydroxyl groups. One type of curing agent may be used alone, or two or more types may be used in combination.

[0075] Examples of the isocyanate curing agent include triphenylmethane triisocyanate, polymethylene polyphenyl isocyanate, etc.; divalent isocyanates such as methylene diisocyanate, isopropylene diisocyanate, butane-1,4-diisocyanate, 2,2,4-trimethylhexamethylene diisocyanate, hexamethylene diisocyanate, diphenylmethane diisocyanate, isophorone diisocyanate, tolylene diisocyanate, xylylene diisocyanate, tetramethylxylylene diisocyanate, and naphthalene diisocyanate; biuret types, adduct types, isocyanurate types, etc. of the above-mentioned compounds; and block types of polyisocyanates of the above-mentioned compounds. The isocyanate-based crosslinking agent may be used alone or in combination of two or more kinds.

[0076] When an isocyanate-based curing agent is used as the curing agent, the isocyanate index (molar number of NCO in the curing agent / molar number of OH in the hydroxyl group-containing resin (A) × 100) is preferably 0.8 to 15.0, more preferably 1.0 to 10.0. When the isocyanate index is equal to or greater than the preferred lower limit, curability is improved. When the isocyanate index is equal to or less than the preferred upper limit, conductivity is improved.

[0077] <Solvent> If the conductive coating material contains a solvent, the viscosity can be easily adjusted. The solvent is preferably one that can dissolve the hydroxyl group-containing resin (A). Examples of the solvent include alcohol-based solvents such as methanol, ethanol, n-propanol, i-propanol, n-butanol, t-butanol, allyl alcohol, benzyl alcohol, terpineol, n-dodecanol, ethylene glycol, 3-methoxy-3-methyl-1-butanol, diethylene glycol, and propylene glycol.

[0078] Other examples include ester solvents such as methyl acetate, ethyl acetate, propyl acetate, butyl acetate, γ-butyrolactone, and 2,2,4-trimethyl-1,3-pentanediol monoisobutyrate. Other examples include ether solvents such as dimethyl ether, diethyl ether, diethylene glycol monoethyl ether, and diethylene glycol monobutyl ether.

[0079] Other examples include ketone solvents such as diethyl ketone, methyl propyl ketone, methyl butyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, methyl amyl ketone, diisopropyl ketone, methyl ethyl ketone, acetone, diacetone alcohol, and isophorone.

[0080] Other examples include aromatic hydrocarbon solvents such as toluene, xylene, diamylbenzene, triamylbenzene, benzene, ethylbenzene, propylbenzene, and isopropylbenzene. Other examples include hydrocarbons such as cyclohexane and n-hexane. Other examples include amides such as N,N-dimethylacetamide and N,N-dimethylformamide.

[0081] Further, examples thereof include glycol ethers such as ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monobutyl ether, tripropylene glycol monomethyl ether, propylene glycol monomethyl ether, and diethylene glycol dibutyl ether.

[0082] Further examples include ether esters such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, triethylene glycol diacetate, propylene glycol monomethyl ether acetate, and ethylene glycol monoethyl ether acetate.

[0083] The solvent may be used alone or in combination of two or more. The solvent is preferably blended so that the proportion of solids in the conductive coating material, excluding volatile content, is 60 to 95 mass %, more preferably 70 to 90 mass %.

[0084] <Other ingredients> The conductive coating material of this embodiment may contain other components as needed, such as dispersants, surface conditioners, thixotropic agents, adhesion promoters, resin modifiers, catalysts, coupling agents, and non-conductive fillers that are conventionally known and can be used in conductive coating materials.

[0085] <Proportion of each ingredient> The total content of the hydroxyl group-containing resin (A) and the curing agent (D) in the conductive coating material of this embodiment is preferably 5 to 30 mass %, more preferably 5 to 25 mass %, based on 100 mass % obtained by subtracting volatile components from the total conductive coating material. When the total content of the hydroxyl group-containing resin (A) and the curing agent (D) is equal to or greater than the preferred lower limit, a uniform conductive coating material can be obtained. When the total content is equal to or less than the preferred upper limit, the conductivity is improved.

[0086] The content of the blocked carboxylic acid (B) in the conductive coating material is preferably 0.05% by mass or more, more preferably 0.1% by mass or more, based on 100% by mass of the entire conductive coating material minus volatile content. The content of the blocked carboxylic acid (B) in the conductive coating material is preferably 4.1% by mass or less, more preferably 2.5% by mass or less, based on 100% by mass of the entire conductive coating material minus volatile content. When the content of the blocked carboxylic acid (B) is within the above range, the smoothness of the coating film is improved.

[0087] The content of the conductive powder (C) in the conductive paint is preferably 70% by mass or more, more preferably 75% by mass or more, based on 100% by mass of the entire conductive paint minus the volatile content. The content of the conductive powder (C) in the conductive paint is preferably 95% by mass or less, more preferably 92% by mass or less, based on 100% by mass of the entire conductive paint minus the volatile content. When the content of the conductive powder (C) is equal to or greater than the preferred lower limit, the resistivity is more likely to decrease. When the content is equal to or less than the preferred upper limit, the adhesive strength is more likely to be ensured and unnecessary increases in costs can be avoided.

[0088] <Manufacturing method> The conductive coating material can be obtained by mixing the above-mentioned hydroxyl group-containing resin (A), blocked carboxylic acid (B), conductive powder (C), and, if necessary, other components. For mixing, a mixer such as a roll mill or a planetary mixer may be used.

[0089] <Action and effect> The conductive coating material of the above embodiment contains the above-mentioned hydroxyl group-containing resin (A), blocked carboxylic acid (B), and conductive powder (C), and therefore can form a coating film with good smoothness without reducing the coatability or conductivity.

[0090] In studying the present invention, the inventors first compared various resins and found that the use of an epoxy resin in a conductive coating material resulted in poor smoothness, while the use of a hydroxyl-containing resin (A) that does not contain an epoxy group improved the smoothness. The mechanism by which the use of resins containing epoxy groups results in poor smoothness is unknown, but it is thought that the properties of the resin due to the presence of epoxy groups and the properties resulting from the chemical bond between the resin before hardening and the curing agent affect the smoothness when the conductive paint is applied.

[0091] Furthermore, the present inventors have investigated various types of carboxylic acids and vinyl ethers that are raw materials for the blocked carboxylic acid (B), and have found that the smoothness varies significantly depending on the type of carboxylic acid used. Specifically, it has been found that the smoothness deteriorates when a carboxylic acid having 18 or more carbon atoms or a carboxylic acid having a bulky structure is used, while the smoothness is good when a carboxylic acid having a small number of carbon atoms and not having a bulky structure is used. Examples of carboxylic acids with bulky structures include carboxylic acids with a benzene ring, and carboxylic acids that can only be expressed three-dimensionally, such as n-propyl vinyl ether-blocked dimethyl adamantane dicarboxylic acid and norbornadiene.

[0092] Next, the inventors investigated various conductive powders (C) and found that the presence or absence of fatty acid treatment had little effect on the smoothness of silver. Furthermore, they found that the presence or absence of blocked carboxylic acid (B) had a greater effect on smoothness than the conductive powder (C).

[0093] From these results of investigation, the following is considered to be the reason why the conductive coating film of the present invention has good smoothness. First, when a conductive paint containing silver treated with a fatty acid such as stearic acid does not contain a blocked carboxylic acid (B), the smoothness of the conductive paint deteriorates. This is thought to be because the silver becomes bulky due to the fatty acid, which adversely affects the fluidity of the conductive paint film, resulting in poor smoothness.

[0094] In contrast, in conductive paints that contain blocked carboxylic acid (B) in addition to silver treated with a fatty acid such as stearic acid, the carboxylic acid that is generated by dissociation from the blocked carboxylic acid (B) replaces the fatty acid such as stearic acid that is bonded to the surface of the silver, which is thought to reduce the bulk of the silver, change the fluidity of the conductive paint film, and improve smoothness.

[0095] On the other hand, when a conductive paint containing silver that has not been treated with a fatty acid does not contain blocked carboxylic acid (B), the smoothness of the conductive paint may deteriorate because the silver that has not been treated with a fatty acid is inorganic and therefore does not mix well with the hydroxyl-containing resin (A), which is an organic substance. This poor compatibility between silver and the hydroxyl-containing resin (A) adversely affects the fluidity of the conductive paint coating, resulting in poor smoothness.

[0096] In contrast, conductive paints containing blocked carboxylic acid (B) in addition to non-fatty acid treated silver are thought to have the carboxylic acid generated by dissociation from blocked carboxylic acid (B) bond to the silver surface, which makes the silver and hydroxyl group-containing resin (A) more compatible and improves smoothness.

[0097] <Application> The conductive coating material of this embodiment can be used for circuits of electronic components. The coating film can be obtained, for example, by applying the conductive coating material of this embodiment onto a substrate and drying it. The substrate is not particularly limited.

[0098] A printed wiring board can be obtained by forming a circuit on an insulating substrate using a coating film (conductive coating film) obtained using the conductive coating material of the above embodiment. As the insulating substrate, any known substrate used as a wiring board can be used, including, for example, substrates made of inorganic materials such as glass substrates, ceramic substrates, and silicon substrates; and substrates made of organic materials.

[0099] Examples of organic materials that can be used to form the insulating substrate include polyesters such as polyethylene terephthalate and polyethylene naphthalate. Other examples include silicones such as polydimethylsiloxane, polydiphenylpolysiloxane, and polyfluorosiloxane.

[0100] Further, for example, urethane such as thermoplastic polyurethane elastomer can be used. Other examples include polyolefins such as polyethylene and polypropylene. Other examples include polyimide, polyphenylene sulfide, polyamide, polystyrene, acrylic, polyvinyl alcohol, ethylene propylene diene, epoxy, and polycarbonate.

[0101] The thickness of the insulating substrate may be appropriately set depending on the application of the printed wiring board, and is preferably, for example, 20 to 600 μm. The method for forming a circuit on an insulating substrate is not particularly limited, but an example thereof is a method in which the conductive paint of the above embodiment is applied to an insulating substrate so as to form a desired circuit pattern, and then dried to form a circuit consisting of a coating film.

[0102] That is, one embodiment of the method for manufacturing a printed wiring board includes a pattern forming step of applying the conductive paint of the above embodiment onto an insulating substrate to form a circuit pattern, and a drying step of drying the circuit pattern. Examples of methods for applying the conductive paint include gravure printing, offset printing, and screen printing, but screen printing is preferred for forming fine circuits. Examples of methods for applying the paint to large areas include roll coating, bar coating, and spray coating.

[0103] Methods for drying and curing the conductive coating material after application include, for example, a hot air drying oven such as a box oven or tunnel oven, an infrared curing oven, an ultraviolet curing oven, an electron beam irradiation device, etc. The drying temperature is preferably, for example, 70 to 160° C. The drying or curing time is preferably, for example, 2 to 60 minutes. [Example]

[0104] The present invention will be explained in more detail below based on examples, but the present invention is not limited to these examples.

[0105] <Raw materials> The raw materials used in each example are as follows:

[0106] Resin (A) Polyester resin 1: ADEKA Corporation, product name "NS-2400", number average molecular weight 2,000, hydroxyl value 56 mg KOH / g. Polyester resin 2: Nippon Synthetic Chemical Industry Co., Ltd., trade name "Polyester (registered trademark) SNT", number average molecular weight 10,000, hydroxyl value 8 mg KOH / g.

[0107] Polyester resin 3: Toyobo MC Co., Ltd., trade name "Vylon (registered trademark) 300", number average molecular weight 23,000, hydroxyl value 5.0 mgKOH / g. Polycarbonate resin: Asahi Kasei Corporation, product name "T4691", number average molecular weight 1,000, hydroxyl value 119.4 mg KOH / g. Xylene resin: Fudo Co., Ltd., product name "HP-100", number average molecular weight 1200, hydroxyl value 140mgKOH / g. Phenolic resin: Meiwa Kasei Co., Ltd., product name "MEH8005", novolac type phenolic resin that is liquid at room temperature, weight average molecular weight 520.

[0108] [Resin (AX)] Epoxy resin: Mitsubishi Chemical Corporation, product name "jER (registered trademark) 807", a liquid epoxy resin at room temperature, bisphenol F type.

[0109] [Carboxylic acid (b1)] · Methanoic acid: monovalent, molecular weight 46.03 g / mol. · Ethanedioic acid: divalent, molecular weight 90.03 g / mol. · Pentanedioic acid: divalent, molecular weight 132.12 g / mol. · Decanedioic acid: divalent, molecular weight 202.25 g / mol. [carboxylic acid (b1x)] · Eicosanedioic acid: divalent, molecular weight 342.52 g / mol.

[0110] [Vinyl ether (b2)] 1,4-Butanediol divinyl ether: divalent, molecular weight 142.20 g / mol.

[0111] [Conductive powder] Silver powder 1: Manufactured by Ames Advanced Materials Corporation, product name "Silver Powder SPS", average particle size 3 μm, granular, fatty acid treated. Silver powder 2: Manufactured by Ames Advanced Materials Corporation, product name "Silver Powder K-1", average particle size 1.89 μm, granular, not fatty acid treated.

[0112] [Hardening agent (D)] Isocyanate 1: Asahi Kasei Corporation, product name "17B-60P", biuret type blocked HDI, solid content 60 mass%, available NCO 9.5 mass%. [Solvent (E)] · Ethylene glycol monobutyl ether acetate.

[0113] [others] Imidazole compound: Shikoku Chemicals Corporation, product name "2PHZ", imidazole-based epoxy curing accelerator. Reactive diluent: Nippon Kayaku Co., Ltd., trade name "GOT", glycidyl orthotoluidine.

[0114] <Examples 1 to 15 and Comparative Examples 1 to 7> [Production of Blocked Carboxylic Acid (B)] (b1) and (b2) were mixed according to the formulations shown in Tables 1 to 5 and reacted at 70° C. for 1 hour, and the reaction was terminated when the acid value of the reaction system became 10 mgKOH / g or less. It should be noted that no blocked carboxylic acid (B) was produced in Comparative Examples 2 to 4. In Comparative Example 5, (b1x) was used instead of (b1).

[0115] [Conductive paint manufacturing] The materials were mixed according to the formulations shown in Tables 1 to 5 to obtain the conductive coating materials of each example. In Comparative Examples 2 to 4, one or both of the compounds corresponding to (b1) and (b2) were used as monomers instead of the blocked carboxylic acid (B).

[0116] <Performance evaluation> [Creating test specimen (I)] For each example, each conductive paint was applied by silkscreen printing to a PET film (Lumirror S: manufactured by Toray Industries, Inc.) (width 15 mm, length 70 mm, thickness 100 μm) that had been annealed at 155°C for 1 hour, in a pattern 1 mm wide and 50 mm long. Thereafter, the coating was dried at 150°C for 30 minutes to harden the coating, and a test specimen (I) was prepared on which a conductive circuit having a dry film thickness of 8 to 11 µm was formed.

[0117] [Evaluation of smoothness] The surface roughness of the test specimen (I) was measured using a surface roughness measuring device (Surfcorder SE3500, manufactured by Kosaka Laboratory Co., Ltd.). Five maximum and minimum values ​​were selected from the waveform obtained, and the average values ​​of each were calculated. The difference between the average values ​​of the maximum and minimum values ​​was calculated, and this difference was used as an index for evaluating smoothness. The results are shown in Tables 1 to 3.

[0118] [Evaluation of printing characteristics] The test specimen (I) was evaluated according to the following criteria, and the results are shown in Tables 1 to 3. Evaluation criteria: Good: The conductive paint film is uniform and the circuit is in good condition with no sagging or defects. △: There is no practical problem, but unevenness, sagging, or defects in the conductive paint film are observed in minute areas. ×: Unevenness, sagging, defects, etc. in the conductive paint film are observed in multiple locations.

[0119] [Creation of test specimen (II)] The same procedure as for specimen (I) was carried out except that each conductive paint was applied by silk screen printing to form a pattern of 20 mm wide and 200 mm long. Test specimens (II) were prepared by forming conductive circuits with dry film thicknesses of 8 to 11 μm for each conductive paint coating.

[0120] [Evaluation of resistivity] For the specimen (II), the resistance value (R), film thickness (A), electrode width (B), and distance between electrodes (C) were measured, and the resistivity ρ was calculated using the following formula. The results are shown in Tables 1 to 5. The resistance value was measured using a digital multimeter (trade name: R6581D) manufactured by ADVANTEST, and the film thickness was measured using a surface roughness meter (trade name: SE3500) manufactured by Kosaka Laboratory Co., Ltd. ρ=R×{(A×B) / C}

[0121] [Evaluation of pencil hardness] The test piece (II) was placed on a hard, flat surface and evaluated in accordance with JIS K 5600-5-4 (1999). The results are shown in Tables 1 to 5.

[0122] [Evaluation of storage tank stability] The storage stability of the conductive paint was evaluated according to the following criteria based on the viscosity after leaving the paint to stand for 7 days at 50° C. The results are shown in Tables 1 to 5. Evaluation criteria: ○: The viscosity is the same as when it was first manufactured, or there is a slight change in viscosity, but there is no problem as a product. ×: Viscosity has changed significantly compared to the initial stage of production, or gelation has occurred.

[0123] [Table 1]

[0124] [Table 2]

[0125] [Table 3]

[0126] [Table 4]

[0127] [Table 5]

[0128] As shown in Tables 1 to 3, each example obtained satisfactory results for all evaluation items. However, in Example 3, the molecular weight of the polyester polyol in the resin (A) was large, resulting in slightly inferior printing properties. In Example 9, the number of carbon atoms in the carboxylic acid used as the raw material for the blocked carboxylic acid (B) was large, resulting in slightly inferior smoothness. In Example 11, the content of the blocked carboxylic acid (B) was low, resulting in slightly inferior smoothness. In Example 12, the silver powder used in the conductive powder (C) was not treated with a fatty acid, resulting in slightly inferior printing properties.

[0129] On the other hand, as shown in Tables 4 and 5, Comparative Example 1, which contained an epoxy resin, had poor smoothness. Comparative Examples 2 and 4, which used unblocked carboxylic acids, had poor storage stability. Comparative Example 3, which did not use carboxylic acids, had poor smoothness. Comparative Example 5, in which the carboxylic acid used as the raw material for blocked carboxylic acid (B) had too many carbon atoms, had poor smoothness. Comparative Example 6, in which the content of blocked carboxylic acid (B) was too low, had poor smoothness.

Claims

1. a hydroxyl-containing resin (A) that does not contain an epoxy group; a blocked carboxylic acid (B) having a latent carboxyl group; A conductive powder (C); a curing agent (D) having a group reactive with the hydroxyl group of the hydroxyl group-containing resin (A); A conductive paint comprising: the blocked carboxylic acid (B) is at least one selected from a compound having a structural unit represented by the following formula (1) and a compound represented by any one of the following formulas (2) to (4), The conductive coating material contains the blocked carboxylic acid (B) in an amount of 0.05% by mass or more and 4.1% by mass or less, based on 100% by mass obtained by subtracting volatile components from the total amount of the conductive coating material. 【Chemical 1】 (R in formula (1) １ is a single bond, a divalent saturated hydrocarbon group having 1 to 15 carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms, and R ２ is a divalent saturated hydrocarbon group having 1 to 15 carbon atoms which may contain an etheric oxygen atom. 【Chemistry 2】 (R in formula (2) ３ and R ５ is a hydrogen atom or a monovalent saturated hydrocarbon group having 1 to 16 carbon atoms, and R ４ R is a divalent saturated hydrocarbon group having 1 to 15 carbon atoms which may contain an etheric oxygen atom. ３ and R ５ may be the same or different.) 【Chemistry 3】 (R in formula (3) ６ is a hydrogen atom or a monovalent saturated hydrocarbon group having 1 to 16 carbon atoms, and R ７ is a monovalent saturated hydrocarbon group having 1 to 18 carbon atoms which may contain an etheric oxygen atom. 【Chemistry 4】 (R in formula (4) ８ and R １０ is a monovalent saturated hydrocarbon group having 1 to 18 carbon atoms which may contain an etheric oxygen atom, and R ９ is a single bond, a divalent saturated hydrocarbon group having 1 to 15 carbon atoms, or a divalent unsaturated hydrocarbon group having 2 to 5 carbon atoms. ８ and R １０ may be the same or different.)

2. 2. The conductive coating material according to claim 1, wherein the hydroxyl group-containing resin (A) is at least one selected from polyester polyols, polycarbonate polyols, acrylic polyols, polyether polyols, polycaprolactone polyols, polyolefin polyols, polyurethane polyols, phenolic resins, and xylene resins.

3. The conductive coating material according to claim 1 or 2, wherein the curing agent (D) is an isocyanate-based curing agent.

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