Information processing device, resin sealing device, information processing method, and information processing program
The information processing device addresses the challenge of inconsistent molding pressures in resin-sealing devices by calculating load adjustments based on volume differences, allowing for simultaneous sealing of diverse molded products with consistent pressure.
Patent Information
- Application Number
- JP2024038314
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-12
- Publication Date
- 2025-09-26
AI Technical Summary
Conventional resin sealing devices struggle to simultaneously resin-seal multiple large-volume molded products of different types with consistent molding pressure, leading to improper sealing during a single molding operation.
An information processing device calculates the load to be applied to a movement mechanism of a resin sealing device, considering the volume differences between molded products, ensuring all cavities receive molding pressures within a predetermined range by adjusting the movement mechanism's load distribution.
Enables simultaneous resin-sealing of multiple different types of molded products with resin in a single molding operation, maintaining consistent molding pressures across all cavities.
Smart Images

Figure 2025139398000001_ABST
Abstract
Description
[Technical Field]
[0001] The disclosed embodiments relate to an information processing device, a resin sealing device, an information processing method, and an information processing program. [Background technology]
[0002] Conventionally, a resin sealing device has been known which has a plurality of pots connected to different cavities via different resin flow paths, and which simultaneously moves the resin material supplied to each pot with different plungers to push the resin material into the cavities and resin-seal a molded product such as a semiconductor element placed on a substrate.
[0003] Regarding this type of resin sealing device, for example, Patent Document 1 discloses a technology in which multiple plungers that push out resin tablets supplied into a pot into a cavity are simultaneously pressed and driven by a moving mechanism via different springs, thereby maintaining a constant injection pressure when supplying a resin material to a cavity. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Utility Model Application Publication No. 1-146919 Summary of the Invention [Problem to be solved by the invention]
[0005] However, when attempting to simultaneously resin-seal multiple large-volume molded products of different types, such as power cards, with the resin sealing device described in Patent Document 1, the molding pressure (pressure for injecting the resin material) into some of the multiple cavities may not satisfy the allowable range. In this case, the resin sealing device described in Patent Document 1 cannot properly resin-seal and mold multiple molded products in a single molding operation.
[0006] One aspect of the embodiment has been made in consideration of the above, and aims to provide an information processing device, a resin sealing device, an information processing method, and an information processing program that can calculate the load to be applied to a moving mechanism of a resin sealing device that can simultaneously seal multiple different types of molded workpieces with resin in a single molding operation. [Means for solving the problem]
[0007] According to one aspect of the embodiment, an information processing device includes an acquisition unit and a calculation unit. The acquisition unit acquires information indicating the types of each of a plurality of molded products to be simultaneously resin-sealed in a single molding operation in different cavities among the plurality of cavities. The calculation unit calculates, based on the information indicating the types of each of the plurality of molded products acquired by the acquisition unit, a load to be applied to a movement mechanism that moves, via different springs, a plurality of plungers that push resin material into the plurality of cavities. The calculation unit includes a volume difference calculation unit that calculates, for each of the remaining molded products, a volume difference between a selected reference molded product and the remaining molded products, and a load calculation unit that calculates, based on the volume difference calculated by the volume difference calculation unit, a load to be applied to the movement mechanism so that all of the molding pressures applied to each of the plurality of cavities are within a predetermined range of molding pressure. [Effects of the Invention]
[0008] According to one aspect of the embodiment, it is possible to calculate the load to be applied to a movement mechanism of a resin sealing device that can simultaneously seal multiple different types of molded workpieces with resin in a single molding operation. [Brief explanation of the drawings]
[0009] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a resin sealing apparatus according to an embodiment. [Figure 2] FIG. 2 is a view of a main body of the resin sealing apparatus according to the embodiment. [Figure 3]FIG. 3 is a diagram for explaining a load applied to a plurality of plungers by a movement mechanism when resin sealing is performed at the same time by the resin sealing apparatus according to the embodiment. [Figure 4] FIG. 4 is a diagram showing an example of a partial configuration including an information processing device in the resin sealing apparatus according to the embodiment. [Figure 5] FIG. 5 is a diagram illustrating an example of volume information stored in the storage unit in the information processing device according to the embodiment. [Figure 6] FIG. 6 is a diagram illustrating an example of main body information stored in the storage unit in the information processing device according to the embodiment. [Figure 7] FIG. 7 is a diagram illustrating an example of the configuration of a calculation unit in the processing unit of the information processing device according to the embodiment. [Figure 8] FIG. 8 is a diagram for explaining an example of a method for calculating a load in the processing unit of the information processing device according to the embodiment. [Figure 9] FIG. 9 is a diagram for explaining another example of the method for calculating the load in the processing unit of the information processing device according to the embodiment. [Figure 10] FIG. 10 is a flowchart illustrating an example of information processing by the control unit of the information processing device according to the embodiment. [Figure 11] FIG. 11 is a diagram illustrating an example of the hardware configuration of a processing unit in an information processing device of the resin sealing apparatus according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION
[0010] Hereinafter, embodiments of an information processing device, a resin sealing device, an information processing method, and an information processing program disclosed in the present application will be described in detail with reference to the accompanying drawings. Note that the present invention is not limited to the following embodiments.
[0011] 1, a resin sealing apparatus 1 according to an embodiment includes a main body 10 and an information processing device 20. The main body 10 includes a mold 11 having an upper mold and a lower mold (not shown). The resin sealing apparatus 1 seals a plurality of molded products with resin simultaneously in a single molding operation.
[0012] The mold 11 is provided with a plurality of pots 121, 122, 123, 124, 125, 126, 127, and 128 to which resin members (not shown) are each supplied, and a plurality of resin flow paths 131, 132, 133, and 134 each connected to two corresponding pots among the plurality of pots 121, 122, 123, 124, 125, 126, 127, and 128.
[0013] Specifically, the resin flow path 131 is connected to the pots 121 and 122, the resin flow path 132 is connected to the pots 123 and 124, the resin flow path 133 is connected to the pots 125 and 126, and the resin flow path 134 is connected to the pots 127 and 128.
[0014] Furthermore, the mold 11 is formed with a plurality of cavities 141, 142, 143, and 144, which are spaces respectively connected to corresponding resin flow paths among the plurality of resin flow paths 131, 132, 133, and 134. The cavity 141 is connected to the resin flow path 131, the cavity 142 is connected to the resin flow path 132, the cavity 143 is connected to the resin flow path 133, and the cavity 144 is connected to the resin flow path 134.
[0015] In the following, when each of the multiple pots 121, 122, 123, 124, 125, 126, 127, and 128 is referred to without distinction, it may be referred to as pot 12. Furthermore, in the following, when each of the multiple resin flow paths 131, 132, 133, and 134 is referred to without distinction, it may be referred to as resin flow path 13, and when each of the multiple cavities 141, 142, 143, and 144 is referred to without distinction, it may be referred to as cavity 14.
[0016] A corresponding one of the workpieces 31, 32, 33, and 34 is placed in each of the multiple cavities 141, 142, 143, and 144. Specifically, the workpiece 31 is placed in the cavity 141, the workpiece 32 is placed in the cavity 142, the workpiece 33 is placed in the cavity 143, and the workpiece 34 is placed in the cavity 144. Hereinafter, when the workpieces 31, 32, 33, and 34 are referred to without being individually distinguished, they may be referred to as the workpiece 3.
[0017] The workpiece 3 includes one or more components for a package with a large molding volume, such as a power card, etc. The components included in the workpiece 3 include, but are not limited to, a substrate such as a lead frame, a semiconductor element, a circuit board, and a heat sink.
[0018] As shown in Fig. 3, plungers 151, 152, 153, 154, 155, 156, 157, and 158 are provided in the main body 10. In the example shown in Fig. 3, plungers 152, 154, 156, and 158 are hidden from view by plungers 151, 153, 155, and 157. Hereinafter, when plungers 151, 152, 153, 154, 155, 156, 157, and 158 are referred to individually without distinction, they may be referred to as plungers 15.
[0019] Plungers 151, 152, 153, 154, 155, 156, 157, and 158 are provided for corresponding pots among the plurality of pots 121, 122, 123, 124, 125, 126, 127, and 128, respectively, and the number of plungers 15 is the same as the number of pots 12.
[0020] As shown in FIG. 3, the main body 10 includes a movement mechanism 17 to which plungers 151, 152, 153, 154, 155, 156, 157, and 158 are attached via corresponding ones of springs 161, 162, 163, 164, 165, 166, 167, and 168, respectively.
[0021] 3, springs 162, 164, 166, and 168 are hidden from view by springs 161, 163, 165, and 167. In the following description, when springs 161, 162, 163, 164, 165, 166, 167, and 168 are referred to individually without distinction, they may be referred to as springs 16.
[0022] As the moving mechanism 17 moves upward, that is, toward the cavity 14, the plurality of plungers 151, 152, 153, 154, 155, 156, 157, and 158 attached to the springs 16 move upward.
[0023] As the plungers 151, 152, 153, 154, 155, 156, 157, and 158 move upward, a load is applied to the resin members 181, 182, 183, 184, 185, 186, 187, and 188 supplied to the pots 121, 122, 123, 124, 125, 126, 127, and 128. Hereinafter, when the resin members 181, 182, 183, 184, 185, 186, 187, and 188 are referred to without being individually distinguished, they may be referred to as resin members 18.
[0024] Each plunger 15 applies a load to the resin material 18 supplied into the corresponding pot 12 among the plurality of pots 12. As a result, the resin material 18 supplied into each pot 12 melts and flows into the corresponding cavity 14 through the corresponding resin flow path 13, thereby resin-sealing the molded article 3 placed in the corresponding cavity 14. The resin flow path 13 includes a cull resin path, a runner resin path, etc.
[0025] Specifically, a load is applied to resin member 181 supplied to pot 121 by the movement of plunger 151, and a load is applied to resin member 182 supplied to pot 122 by the movement of plunger 152. Resin members 181 and 182 to which loads are applied by plungers 151 and 152 are injected as molten resin into cavity 141 via resin flow path 131 and filled therein.
[0026] Furthermore, a load is applied to resin member 183 supplied to pot 123 by the movement of plunger 153, and a load is applied to resin member 184 supplied to pot 124 by the movement of plunger 154. Resin members 183, 184 to which loads are applied by plungers 153, 154 are injected as molten resin into cavity 142 via resin flow path 132 and fill it.
[0027] Furthermore, a load is applied to resin member 185 supplied to pot 125 by the movement of plunger 155, and a load is applied to resin member 186 supplied to pot 126 by the movement of plunger 156. Resin members 185, 186 to which loads are applied by plungers 155, 156 are injected as molten resin into cavity 143 via resin flow path 133 and fill it.
[0028] Furthermore, a load is applied to resin member 187 supplied to pot 127 by the movement of plunger 157, and a load is applied to resin member 188 supplied to pot 128 by the movement of plunger 158. Resin members 187, 188 to which loads are applied by plungers 157, 158 are injected as molten resin into cavity 144 via resin flow path 134 and fill it.
[0029] 1 and 3, mold 11 is provided with four cavities 14, and two plungers 15 are used to inject and fill each cavity 14 with resin, but this is not a limitation. For example, mold 11 may have two or three cavities 14, or may have five or more cavities 14. Furthermore, mold 11 may have one or three or more plungers 15 for each cavity 14.
[0030] 1, the information processing device 20 includes a control unit 21, a storage unit 22, a code reading unit 23, and an imaging unit 24. The control unit 21 controls the main body unit 10 to simultaneously perform resin sealing of multiple molded articles 3 in a single molding operation. For example, the control unit 21 controls a drive unit provided in the main body unit 10 to cause the drive unit (not shown) to move a lower mold, and causes the lower mold to hold multiple base materials on which molded articles 3 are placed, which are carried in from a transport device (not shown).
[0031] Then, the control unit 21 controls a drive unit (not shown) provided in the main body 10 to move the lower mold or the upper mold with the drive unit, thereby bringing the upper mold and the lower mold into contact with each other. The control unit 21 then moves the movement mechanism 17 with a pre-calculated load. Note that the load may be calculated during or after the upper mold and the lower mold come into contact with each other.
[0032] The storage unit 22 is realized by, for example, a semiconductor memory element such as a RAM (Random Access Memory) or a flash memory, or a storage device such as a hard disk, etc. The storage unit 22 stores information used by the control unit 21 to calculate the load.
[0033] The code reading unit 23 reads information about a code given to the molding workpiece 3 that is being carried in or has been carried in the main body 10, and outputs the read code information. The code given to the molding workpiece 3 is a two-dimensional code such as a QR code (registered trademark) (Quick Response Code), but may also be a barcode or other code.
[0034] The code read by the code reading unit 23 is attached to the molded article 3, for example, by being printed or engraved on the molded article 3, but a sticker with the code printed on it may also be attached to the molded article 3. The code is attached to a base material such as a lead frame of the molded article 3, for example, but is not limited to this example. The code reading unit 23 is configured to have one reader for multiple molded articles 3, but may also be configured to have a reader that reads the code for each molded article 3.
[0035] The imaging unit 24 captures images of the multiple molding targets 3 being carried in or that have been carried into the main body 10, and outputs the captured images. The imaging unit 24 includes an imaging element such as a CMOS (Complementary Metal-Oxide-Semiconductor) image sensor and a lens. The imaging unit 24 is configured to have one combination of imaging element and lens for the multiple molding targets 3, but may also be configured to have a combination of imaging element and lens for each molding target 3.
[0036] Here, the load applied to the plurality of plungers 15 by the movement mechanism 17 when the same type of molded product 3 is simultaneously resin-sealed in one molding operation by the resin sealing device 1 will be described.
[0037] 3, a total load of Pa [kgf] is applied by the movement mechanism 17 to the plurality of plungers 151, 152, 153, 154, 155, 156, 157, and 158. Note that the plurality of sets of two plungers 15, two springs 16, two pots 12, one resin flow path 13, and one cavity 14 have the same physical configuration (same shape, spring constant, etc.).
[0038] When the four molded products 31, 32, 33, and 34 are of the same size, the load Pa [kgf] applied by the movement mechanism 17 is evenly distributed, and a load of Pa / 8 [kgf] is applied to each of the plungers 151, 152, 153, 154, 155, 156, 157, and 158 via the springs 161, 162, 163, 164, 165, 166, 167, and 168. Therefore, the molding pressure applied to each of the cavities 141, 142, 143, and 144 is the same.
[0039] On the other hand, for example, if some of the four workpieces 31, 32, 33, and 34 are of a type different in size from the remaining workpieces 3, the volume of resin filled into some of the cavities 14 will be different from the volume of resin filled into the remaining cavities 14. In this case, the volume of resin remaining in the pots 12 corresponding to some of the cavities 14 will be different from the volume of resin remaining in the pots 12 corresponding to the remaining cavities 14. As a result, the amount of deflection of the springs 16 attached to the plungers 15 corresponding to some of the cavities 14 will be different from the amount of deflection of the springs 16 attached to the plungers 15 corresponding to the remaining cavities 14.
[0040] Therefore, the molding pressure applied to some of the cavities 14 differs from the molding pressure applied to the remaining cavities 14, and the load Pa [kgf] applied by the movement mechanism 17 is not evenly distributed as the molding pressure applied to each of the cavities 14. Furthermore, for example, if all of the four molded products 31, 32, 33, and 34 are different sizes, the molding pressures applied to the cavities 141, 142, 143, and 144 will be different from one another.
[0041] Therefore, the control unit 21 of the information processing device 20 calculates the load Pa to be applied by the moving mechanism unit 17 to the multiple plungers 15 based on the type of each of the multiple molded products 3 so that all of the molding pressures applied to each of the multiple cavities 14 are within a predetermined range of molding pressure, and moves the moving mechanism unit 17 with the calculated load Pa.
[0042] The molding pressure within the predetermined range is set to properly perform resin sealing of the molded product 3. The information processing device 20 controls the movement mechanism 17 so that the movement mechanism 17 presses the plurality of plungers 15 with the calculated load Pa. This allows the resin sealing device 1 to simultaneously perform resin sealing of a plurality of different types of molded products 3 in a single molding operation.
[0043] As shown in Figure 4, the memory unit 22 stores type information, which is information about each type of molded product 3, volume information, which indicates the volume of the molded product 3 for each type of molded product 3, and main body information, which includes information about the main body 10.
[0044] The type information includes information indicating a code assigned to the molded article 3 for each type of molded article 3, and information indicating a captured image of the molded article 3 for each type of molded article 3. The volume of the molded article 3 indicated by the volume information is the volume of the entire molded article 3, but may also be the volume of the molded article 3 within the cavity 14.
[0045] In the volume information shown in FIG. 5, the volumes of the workpieces 3 of type A, type B, type C, type D, type E, type F, type G, and type H are 80 mm 3 ], 70 [mm 3 ], 60 [mm 3 ], 50 [mm 3 ], 40 [mm 3 ], 30 [mm 3 ], 20 [mm 3 ], 10 [mm 3 ] is shown.
[0046] The main body information includes, as information relating to the main body 10, pot diameter information indicating the diameter of the pots 12, pot total number information indicating the total number of pots 12, spring constant information indicating the spring constant, pot allocation number information indicating the number of pots 12 per molded product, target molding pressure information indicating the target molding pressure, and allowable molding pressure range information including information indicating the allowable molding pressure range.
[0047] The information indicating the spring constant is information indicating the spring constant of the spring 16. The information indicating the target molding pressure is information indicating the target value of the pressure applied to the cavity 14 in which the reference workpiece, which is the workpiece 3 selected by the control unit 21, is placed. The target molding pressure is set based on, for example, variations in the volume of the workpiece 3, variations in the amount of resin in the resin member 18, and other variations in the mold, so that the molding pressure applied to each cavity 14 falls within the allowable molding pressure range.
[0048] The information indicating the allowable molding pressure range is the allowable range of molding pressure applied to the cavity 14 that is required for resin sealing of the molded product 3. The allowable molding pressure range is the same regardless of the type of molded product 3, but may be set for each type of molded product 3.
[0049] In the main body information shown in Figure 6, the diameter of the pot 12 indicated by the pot diameter information is 16 [mm], the total number of pots 12 indicated by the pot total number information is 8, and the spring constant of the spring 16 indicated by the spring constant information is 22.14 [kg / mm].
[0050] In addition, in the main body information shown in Figure 6, the number of pots 12 per molded product indicated by the pot allocation number information is 2, the target molding pressure indicated by the target molding pressure information is 12 [MPa], and the allowable molding pressure range indicated by the allowable molding pressure range information is 10 to 15 [MPa].
[0051] 4, the control unit 21 includes a determination unit 30, an acquisition unit 31, a calculation unit 32, and a drive processing unit 33. The determination unit 30 acquires code information, which is information on the codes read by the code reading unit 23 and assigned to the multiple molded products 31, 32, 33, and 34, and determines the type of each of the multiple molded products 31, 32, 33, and 34 based on the acquired code information.
[0052] For example, the judgment unit 30 acquires the type information stored in the memory unit 22, and judges for each molded product 3 the type of the molded product 3 that corresponds to a code included in the type information that matches the code indicated in the code information.
[0053] For example, when the code information of one or more of the multiple molded products 3 cannot be read by the code reading unit 23, the judgment unit 30 judges the type of the one or more molded products 3 whose codes cannot be read by the code reading unit 23 based on the imaging results by the imaging unit 24.
[0054] For example, the determination unit 30 acquires the type information stored in the storage unit 22, and determines for each molded product 3 the type of the molded product 3 corresponding to the captured image included in the type information that matches the captured image shown as the imaging result by the imaging unit 24 to a threshold value or higher. The determination unit 30 determines the type of the molded product 3 by, for example, pattern matching processing or image recognition processing using a learning model obtained by machine learning.
[0055] The acquisition unit 31 acquires information indicating the type of each of a plurality of molded products 31, 32, 33, 34 that are each sealed with resin simultaneously in one molding operation in different cavities 14 out of a plurality of cavities 141, 142, 143, 144.
[0056] For example, the acquisition unit 31 acquires information indicating the type of each of the multiple molded articles 3 determined by the determination unit 30. The acquisition unit 31 can also acquire information indicating the type of each of the multiple molded articles 3, which is transmitted from an information processing device (not shown), for example.
[0057] The calculation unit 32 calculates the load Pa to be applied to the movement mechanism unit 17 based on the information indicating the type of each of the plurality of molded products 31-34 acquired by the acquisition unit 31. Here, the movement mechanism unit 17 moves the plurality of plungers 151-158, which push the plurality of resin members 181-188 into the plurality of cavities 141-144, via different springs 161-168.
[0058] The calculation unit 32 calculates the load Pa, for example, when the combination of types of multiple molded products 3 about which information is acquired by the acquisition unit 31 is different from the combination of types of multiple molded products 3 when the load Pa was calculated last time, or when a new load Pa is to be calculated.
[0059] 7, the calculation unit 32 includes a selection unit 40, a volume difference calculation unit 41, and a load calculation unit 42. As shown in FIG. 7, the load calculation unit 42 includes a first calculation processing unit 50 and a second calculation processing unit 51.
[0060] Based on information indicating the type of each of the multiple molded products 3 acquired by the acquisition unit 31, the selection unit 40 selects a molded product 3 that meets predetermined conditions as a reference molded product from among the multiple molded products 31, 32, 33, 34 whose type has been determined by the determination unit 30.
[0061] The workpiece 3 that satisfies the predetermined condition is, for example, the workpiece 3 with the smallest volume among the multiple workpieces 31, 32, 33, and 34. For example, when the workpiece 3 with the smallest volume among the multiple workpieces 31, 32, 33, and 34 is the workpiece 34, the selection unit 40 selects the workpiece 34 as the reference workpiece.
[0062] The selection unit 40 can select a molded product 3 that satisfies predetermined conditions, for example, by obtaining information indicating the volume corresponding to the type of multiple molded products 31, 32, 33, and 34 determined by the determination unit 30 from the volume information stored in the memory unit 22.
[0063] The workpiece 3 that satisfies the predetermined conditions may be the workpiece 3 with the largest volume among the plurality of workpieces 31, 32, 33, and 34. In this case, for example, if the workpiece 3 with the largest volume among the plurality of workpieces 31, 32, 33, and 34 is the workpiece 31, the selection unit 40 selects the workpiece 31 as the reference workpiece.
[0064] The volume difference calculation unit 41 calculates the volume difference between a reference workpiece 3, which is one workpiece 3 selected by the selection unit 40 from among the multiple workpieces 3, and the remaining workpieces 3, for each of the remaining workpieces 3.
[0065] The workpiece 3 that satisfies the predetermined conditions is the workpiece 3 with the smallest volume, and as shown in FIG. 8, the volume of the workpieces 31, 32, 33, and 34 is 80 mm 3 ], 60 [mm 3 ], 40 [mm 3 ], 20 [mm 3], the selection unit 40 selects the workpiece 34 as the reference workpiece because the workpiece 34 is the workpiece 3 with the smallest volume.
[0066] When the reference workpiece is the workpiece 34, the volume difference calculation unit 41 calculates the volume difference between the workpiece 34 and the workpieces 31, 32, and 33 for each of the workpieces 31, 32, and 33. Specifically, as shown in FIG. 8, the volume difference between the workpiece 31 and the workpiece 34 is 60 mm 3 The difference in volume between the workpiece 32 and the workpiece 34 is 40 mm 3 The difference in volume between the molding workpiece 33 and the molding workpiece 34 is 20 mm 3 The difference in volume between the molding target 34 and the molding target 34 is 0 [mm 3 ].
[0067] When the workpiece 3 that satisfies the predetermined conditions is the workpiece 3 with the largest volume and the volumes of the workpieces 31, 32, 33, and 34 are as shown in Figure 8, the selection unit 40 selects the workpiece 31 as the reference workpiece because the workpiece 31 is the workpiece 3 with the largest volume.
[0068] When the reference workpiece is the workpiece 34, the volume difference calculation unit 41 calculates the volume difference between the workpiece 31 and the workpieces 32, 33, and 34 for each of the workpieces 32, 33, and 34. In this case, the volume difference between the workpiece 34 and the workpiece 31 is -60 mm 3 ], and the volume difference between the molding workpiece 33 and the molding workpiece 31 is -40 [mm 3 ], and the volume difference between the molding workpiece 32 and the molding workpiece 31 is -20 [mm 3 The difference in volume between the molding target 31 and the molding target 31 is 0 [mm 3 ].
[0069] In the above example, the selection unit 40 selected the workpiece 3 with the smallest volume or the workpiece 3 with the largest volume as the workpiece 3 that satisfies the predetermined conditions, but it is also possible to select a workpiece 3 other than these workpieces 3. For example, the selection unit 40 can select the workpiece 3 that is closest to the middle of the volume ranges of the multiple workpieces 3 as the workpiece 3 that satisfies the predetermined conditions.
[0070] The load calculation unit 42 calculates the load Pa to be applied to the movement mechanism unit 17 so that all of the molding pressures applied to each of the multiple cavities 141, 142, 143, and 144 are within a predetermined range, based on the volume difference calculated by the volume difference calculation unit 41. The predetermined range of molding pressure is the allowable molding pressure range stored in the storage unit 22 (the range indicated by the allowable molding pressure range information included in the main body information), and is 10 to 15 MPa in the example shown in Fig. 6.
[0071] The load calculation unit 42 includes a first calculation processing unit 50 and a second calculation processing unit 51. Based on the volume difference calculated by the volume difference calculation unit 41, the first calculation processing unit 50 calculates the molding pressure or load to be applied to each of the plurality of cavities 141, 142, 143, and 144 during resin sealing so that all of the molding pressures applied to each of the plurality of cavities 141, 142, 143, and 144 are within a predetermined range.
[0072] Based on the volume difference calculated by the volume difference calculation unit 41, the first calculation processing unit 50 calculates the molding pressure or load to be applied to each of the multiple cavities 141, 142, 143, 144 during resin sealing, for example, so that the pressure applied to the cavity 14 in which the reference molded product selected by the selection unit 40 is placed becomes a predetermined molding pressure.
[0073] The first calculation processing unit 50 calculates the cross-sectional area of the pot 12 based on the main body information stored in the storage unit 22. The cross-sectional area of the pot 12 is calculated based on the diameter of the pot 12. For example, when the main body information is in the state shown in FIG. 8, the first calculation processing unit 50 calculates the cross-sectional area of the pot 12 as 201.1 (= 8 × 8 × π) [mm 2 The main body information may include information indicating the cross-sectional area of the pot 12.
[0074] First, we will explain the calculation of the molding pressure applied to each cavity 14 by the first calculation processor 50. The first calculation processor 50 calculates the increase or decrease in molding pressure for each of the cavities 141, 142, 143, and 144 according to the volume difference.
[0075] The first calculation processing unit 50 calculates the increase or decrease in the load reaction force by, for example, dividing the volume difference by the number of pots 12 per molded product and the pot cross-sectional area, and multiplying the result by a spring constant. Next, the first calculation processing unit 50 divides the increase or decrease in the load reaction force by the pot cross-sectional area, and multiplies the division result by 9.8 to calculate the increase or decrease in the molding pressure corresponding to the volume difference.
[0076] The first calculation processing unit 50 sets the molding pressure of the reference workpiece selected by the selection unit 40 as the target molding pressure. Here, the target molding pressure is the pressure indicated by the target molding pressure information in the main body information. The first calculation processing unit 50 then calculates the molding pressure of each cavity 14 in which a workpiece 3 other than the reference workpiece is placed by adding or subtracting the increase or decrease in the molding pressure calculated as described above to or from the molding pressure of the reference workpiece.
[0077] For example, if the difference in volume between the molding workpieces 31, 32, and 33 and the molding workpiece 34 is 60 mm as shown in FIG. 3 ], 40 [mm 3 ], 20 [mm 3 ], and the cross-sectional area of the pot 12 is 201.1 (= 8 × 8 × π) [mm 2], the spring constant is 22.14 [kg / mm], the number of pots 12 per molded product is 2, and the target molding pressure is 12 [MPa].
[0078] In this case, as shown in FIG. 8, the increase in molding pressure in cavities 141, 142, and 143 is 0.16 (= 30 / 201.1 × 22.14 × 9.8 / 201.1) [MPa], 0.11 (= 20 / 201.1 × 22.14 × 9.8 / 201.1) [MPa], and 0.05 (= 10 / 201.1 × 22.14 × 9.8 / 201.1) [MPa].
[0079] Since the target molding pressure, which is the molding pressure applied to the cavity 14 in which the reference workpiece is placed, is 12 [MPa], the molding pressures in cavities 141, 142, and 143 calculated by the first calculation processing unit 50 are 12.16 (= 12 + 0.16) [MPa], 12.11 (= 12 + 0.11) [MPa], and 12.05 (= 12 + 0.05) [MPa], as shown in Figure 8.
[0080] Since the target molding pressure is set to 12 MPa, which is a value near the middle of the allowable molding pressure range of 10 to 15 MPa, the first calculation processing unit 50 can calculate all molding pressures within the allowable molding pressure range.
[0081] Furthermore, when the workpiece 3 with the smallest volume is selected by the selection unit 40 as the reference workpiece, the first calculation processing unit 50 can set the molding pressure to be applied to each cavity 14 to be equal to or greater than the target molding pressure, or set the load to be applied to each cavity 14 to be equal to or greater than the load corresponding to the target molding pressure.
[0082] Therefore, an operator of the resin sealing apparatus 1 can appropriately calculate the molding pressure or load to be applied to each cavity 14 by, for example, setting the minimum molding pressure that the operator wants to ensure as the target molding pressure.
[0083] Furthermore, when the workpiece 3 with the largest volume is selected by the selection unit 40 as the reference workpiece, the first calculation processing unit 50 can set the molding pressure to be applied to each cavity 14 to be equal to or less than the target molding pressure, or set the load to be applied to each cavity 14 to be equal to or less than the load corresponding to the target molding pressure.
[0084] Therefore, when an operator of the resin sealing device 1 wants to increase the molding pressure as much as possible, the operator can, for example, set the upper limit molding pressure as the target molding pressure, thereby appropriately calculating the molding pressure or load to be applied to each cavity 14.
[0085] If some of the calculated molding pressures fall outside the allowable molding pressure range, the first calculation processing unit 50 can change the target molding pressure and recalculate the molding pressure to be applied to each cavity 14 based on the changed target molding pressure.
[0086] For example, if some of the calculated molding pressures are lower than the minimum value of the allowable molding pressure range, the first calculation processing unit 50 can make a change to increase the target molding pressure and recalculate the molding pressure to be applied to each cavity 14 based on the changed target molding pressure.
[0087] Furthermore, if some of the calculated molding pressures are higher than the maximum value of the allowable molding pressure range, the first calculation processing unit 50 makes a change to reduce the target molding pressure, and can recalculate the molding pressure to be applied to each cavity 14 based on the changed target molding pressure.
[0088] If the target molding pressure is set so that the molding pressure of each cavity 14 falls within the allowable molding pressure range, the recalculation process described above is not performed. In this case, the main body information does not need to include allowable molding pressure range information.
[0089] Next, a description will be given of the calculation of the load applied to each cavity 14 by the first calculation processing unit 50. Hereinafter, the load applied to the cavity 14 may be referred to as a cavity load.
[0090] In this case, the first calculation processing unit 50 calculates the increase or decrease in the cavity load corresponding to the volume difference for each cavity 14. The first calculation processing unit 50 calculates the increase or decrease in the cavity load corresponding to the volume difference, for example, by dividing the volume difference by the pot cross-sectional area and multiplying the result by a spring constant to calculate the increase or decrease in the load reaction force.
[0091] The first calculation processing unit 50 calculates the cavity load of the reference molded product selected by the selection unit 40 by multiplying the result of dividing the target molding pressure indicated in the target molding pressure information of the main body information by 9.8 by the cross-sectional area of the pot 12 and the number of pots 12 indicated in the pot allocation number information.
[0092] Then, the first calculation processing unit 50 calculates the molding pressure of each cavity 14 in which a molded workpiece 3 other than the reference molded workpiece is placed by adding or subtracting the increase or decrease in the cavity load calculated as described above to the cavity load of the reference molded workpiece.
[0093] For example, if the difference in volume between the molding workpieces 31, 32, and 33 and the molding workpiece 34 is 60 mm as shown in FIG. 3 ], 40 [mm 3 ], 20 [mm 3 ], and the cross-sectional area of the pot 12 is 201.1 (= 8 × 8 × π) [mm 2 ], the spring constant is 22.14 [kg / mm], and the target molding pressure is 12 [MPa].
[0094] In this case, as shown in FIG. 9, the increases in cavity load in cavities 141, 142, and 143 are 6.60 (=60 / 201.1×22.14) [kgf], 4.40 (=40 / 201.1×2×22.14) [kgf], and 2.20 (=20 / 201.1×2×22.14) [kgf].
[0095] Since the target molding pressure to be applied to the cavity 14 in which the reference workpiece is placed is 12 [MPa], the first calculation processing unit 50 calculates 492.4 (= 12 × 201.1 × 2) [kgf] as the cavity load of the reference workpiece.
[0096] Then, the first calculation processing unit 50 calculates the cavity loads of the cavities 141, 142, 143 in which the molded products 3 other than the reference molded product are placed as 499.0 (= 492.4 + 6.6) [kgf], 496.8 (= 492.4 + 4.4) [kgf], and 494.6 (= 492.4 + 2.2) [kgf].
[0097] If some of the calculated molding pressures fall outside the allowable molding pressure range, the first calculation processing unit 50 can change the target molding pressure and recalculate the cavity load of each cavity 14 based on the changed target molding pressure.
[0098] For example, the first calculation processing unit 50 calculates a cavity load range, which is a range of cavity loads corresponding to the allowable molding pressure range. For example, the first calculation processing unit 50 calculates the maximum value of the cavity load range by multiplying the maximum value of the allowable molding pressure range by the pot cross-sectional area and the number of pots 12 per molded product, and dividing the multiplication result by 9.8.
[0099] In addition, the first calculation processing unit 50 calculates the minimum value of the cavity load range by multiplying the minimum value of the allowable molding pressure range by the pot cross-sectional area and the number of pots 12 per molded product, and dividing the multiplication result by 9.8.
[0100] If some of the calculated cavity loads are lower than the minimum value of the cavity load range, the first calculation processing unit 50 can make a change to increase the target molding pressure and recalculate the cavity load of each cavity 14 based on the changed target molding pressure.
[0101] Furthermore, if some of the calculated cavity loads are higher than the maximum value of the cavity load range, the first calculation processing unit 50 can make a change to reduce the target molding pressure and recalculate the cavity load of each cavity 14 based on the changed target molding pressure.
[0102] If the target molding pressure is set so that the molding pressure of each cavity 14 falls within the cavity load range, the recalculation process described above is not performed. In this case, the main body information does not need to include information on the allowable molding pressure range.
[0103] The second calculation processing unit 51 calculates the load Pa to be applied to the movement mechanism unit 17 based on the molding pressure or load to be applied to each of the plurality of cavities 14 calculated by the first calculation processing unit 50.
[0104] For example, when the molding pressure to be applied to each of the multiple cavities 14 is calculated by the first calculation processing unit 50, the second calculation processing unit 51 converts each molding pressure calculated by the first calculation processing unit 50 into a cavity load.
[0105] The molding pressure is converted into the cavity load by multiplying the molding pressure by the cross-sectional area of the pot 12 and the number of pots 12 indicated in the pot allocation number information, and then multiplying the result by 9.8. The second calculation processing unit 51 then adds up the converted cavity loads of each cavity 14 to calculate the load Pa to be applied to the movement mechanism unit 17.
[0106] Furthermore, when the cavity loads of the cavities 14 are calculated by the first calculation processing unit 50, the second calculation processing unit 51 calculates the load Pa to be applied to the movement mechanism unit 17 by adding up the cavity loads of the cavities 14.
[0107] The drive processing unit 33 outputs information about the load Pa calculated by the calculation unit 32 to the drive unit 19 provided in the main body unit 10. As a result, the drive unit 19 drives the movement mechanism unit 17 so that the load Pa applied by the movement mechanism unit 17 to the plurality of plungers 15 becomes the load Pa calculated by the calculation unit 32.
[0108] Next, a procedure for information processing by the control unit 21 of the information processing device 20 according to the embodiment will be described. As shown in Fig. 10, the control unit 21 of the information processing device 20 determines whether or not it is time to obtain information (step S10). The information obtaining timing is, for example, the timing when the code reading unit 23 outputs information about the code to be output.
[0109] When the control unit 21 determines that it is time to obtain information (step S10: Yes), it determines the type of each workpiece 3 based on the code information output from the code reading unit 23 (step S11).
[0110] When the process of step S11 is completed or when it is determined that the timing for acquiring information has not come (step S10: No), the control unit 21 determines whether the timing for calculating the load has come (step S12). In step S12, the control unit 21 determines that the timing for calculating the load has come, for example, when the determination of the types of the multiple molded products 3 in step S11 is the first determination, or when the combination of the types of the multiple molded products 3 determined this time in step S11 is different from the combination of the types of the multiple molded products 3 determined last time.
[0111] When the control unit 21 determines that it is time to calculate the load (step S12: Yes), it selects a reference molded workpiece (step S13) and calculates the volume difference between the reference molded workpiece and a molded workpiece 3 other than the reference molded workpiece (step S14).
[0112] Next, the control unit 21 calculates the molding pressure or load to be applied to each cavity 14 based on the volume difference between each of the workpieces 3 other than the reference workpiece and the reference workpiece (step S15).Then, the control unit 21 calculates the load Pa to be applied to the movement mechanism unit 17 based on the molding pressure or load to be applied to each cavity 14 (step S16).
[0113] When the process of step S16 is completed or when it is determined that the load calculation timing has not come (step S12: No), the control unit 21 determines whether the operation end timing has come (step S17). The control unit 21 determines that the operation end timing has come when, for example, the power of the information processing device 20 is turned off.
[0114] If the control unit 21 determines that the operation end time has not yet arrived (step S17: No), it proceeds to step S10, and if it determines that the operation end time has arrived (step S17: Yes), it terminates the processing shown in Figure 10.
[0115] Next, a description will be given of the hardware configuration of the control unit 21 in the information processing device 20. As shown in Fig. 11, the control unit 21 has a processor 80, a memory 81, an input / output interface (I / F) 82, and a media interface (I / F) 83. The processor 80, the memory 81, the input / output interface 82, and the media interface 83 are connected by a bus 85.
[0116] The processor 80 includes, for example, one or more of a central processing unit (CPU), a micro processing unit (MPU), and a system large scale integration (LSI). The memory 81 is a RAM such as a static random access memory (SRAM) or a dynamic random access memory (DRAM), or a semiconductor memory element.
[0117] The processor 80 acquires information from the code reading unit 23 and the imaging unit 24 via the input / output interface 82, and outputs information on the calculated load Pa to the driving unit 19. The processor 80 acquires data from the input device via the input / output interface 82. The processor 80 also outputs the generated data to the output device via the input / output interface 82.
[0118] The media interface 83 reads a program or data stored in a recording medium 84 and provides the read data or program (an example of an information processing program) to the processor 80 via the memory 81. The processor 80 loads the program from the recording medium 84 onto the memory 81 via the media interface 83 and executes the loaded program. The recording medium 84 is, for example, an optical recording medium such as a DVD (Digital Versatile Disc) or a PD (Phase Change Rewritable Disc), a magneto-optical recording medium such as an MO (Magneto-Optical disk), a tape medium, a magnetic recording medium, or a semiconductor memory.
[0119] The processor 80 executes programs using the memory 81 or the like as a working area, thereby realizing the functions of the determination unit 30, the acquisition unit 31, the calculation unit 32, and the drive processing unit 33. Note that the control unit 21 may be partially or entirely realized by an integrated circuit such as an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or a DSP (Digital Signal Processor).
[0120] As described above, the information processing device 20 according to the embodiment includes an acquisition unit 31 and a calculation unit 32. The acquisition unit 31 acquires information indicating the types of each of the multiple workpieces 3 to be resin-sealed simultaneously in a single molding operation in different cavities 14 among the multiple workpieces 3. The calculation unit 32 calculates, based on the information indicating the types of the multiple workpieces 3 acquired by the acquisition unit 31, a load Pa to be applied to the movement mechanism 17 that moves, via different springs 16, the multiple plungers 15 that push the resin members 18 into the multiple cavities 14. The calculation unit 32 also includes a volume difference calculation unit 41 that calculates, for each of the remaining workpieces 3, a volume difference between a selected reference workpiece 3 among the multiple workpieces 3 and the remaining workpieces 3, and a load calculation unit 42 that calculates, based on the volume difference calculated by the volume difference calculation unit 41, a load Pa to be applied to the movement mechanism 17 so that all of the molding pressures applied to the multiple cavities 14 are within a predetermined range of molding pressure. This allows the information processing device 20 to appropriately calculate the load Pa to be applied to the moving mechanism 17, which can simultaneously perform resin sealing on three different types of workpieces in a single molding operation. Furthermore, since the information processing device 20 uses the volume difference between the selected reference workpiece 3 and the remaining workpieces 3, it can calculate the load Pa using, for example, one selected workpiece 3 as a reference, and can easily calculate the molding pressure or load for the remaining workpieces 3 based on the molding pressure or load calculated as the molding pressure or load to be applied to the reference workpiece 3.
[0121] The load calculation unit 42 also includes a first calculation processing unit 50 and a second calculation processing unit 51. Based on the volume difference calculated by the volume difference calculation unit 41, the first calculation processing unit 50 calculates the molding pressure or load to be applied to each of the multiple cavities 14 during resin sealing so that all of the molding pressures applied to each of the multiple cavities 14 are within a predetermined range. The second calculation processing unit 51 calculates the load to be applied to the movement mechanism unit 17 based on the molding pressure or load to be applied to each of the multiple cavities 14 calculated by the first calculation processing unit 50. This allows the information processing device 20 to appropriately calculate the load Pa to be applied to the movement mechanism unit 17.
[0122] The first calculation processing unit 50 also calculates the molding pressure to be applied to each of the multiple cavities 14 so that the pressure applied to the cavity 14 in which the reference workpiece 3 is placed becomes a preset molding pressure. The target molding pressure is an example of a preset molding pressure. This allows the information processing unit 20 to appropriately calculate the load Pa to be applied to the movement mechanism unit 17.
[0123] The calculation unit 32 also includes a selection unit 40 that selects a workpiece 3 that satisfies predetermined conditions from among the multiple workpieces 3 as a reference workpiece 3. This allows the information processing device 20 to appropriately calculate the load Pa to be applied to the movement mechanism unit 17.
[0124] Furthermore, the selection unit 40 selects the molding workpiece 3 with the smallest volume from the multiple molding workpieces 3. This allows the information processing device 20 to appropriately calculate the load Pa to be applied to the movement mechanism unit 17. An operator or the like who operates the resin sealing device 1 can, for example, set the minimum molding pressure that they want to ensure as the target molding pressure, thereby causing the calculation unit 32 to appropriately calculate the molding pressure or load to be applied to each cavity 14.
[0125] Furthermore, the selection unit 40 selects the molding workpiece 3 with the largest volume among the multiple molding workpieces 3. This allows the information processing device 20 to appropriately calculate the load Pa to be applied to the movement mechanism unit 17. When an operator of the resin sealing device 1 wishes to increase the molding pressure as much as possible, for example, the operator can set the upper limit molding pressure as the target molding pressure, thereby causing the calculation unit 32 to appropriately calculate the molding pressure or load to be applied to each cavity 14.
[0126] Furthermore, the calculation unit 32 calculates the load Pa when the combination of the types of the multiple workpieces 3, the information of which is acquired by the acquisition unit 31, differs from the combination of the types of the multiple workpieces when the load Pa was calculated by the calculation unit 32. This allows the information processing device 20 to reduce the calculation load of the load Pa to be applied to the movement mechanism unit 17.
[0127] The information processing device 20 also includes a code reading unit 23 that reads information about codes assigned to the multiple molded products 3, and a determination unit 30 that determines the type of each of the multiple molded products 3 based on the information about the codes read by the code reading unit 23. The acquisition unit 31 acquires information indicating the type of each of the multiple molded products 3 determined by the determination unit 30. This allows the information processing device 20 to appropriately calculate the load Pa to be applied to the movement mechanism unit 17.
[0128] The information processing device 20 also includes an imaging unit 24 that images the multiple molded articles 3, and when the code reading unit 23 cannot read the code information of one or more of the multiple molded articles 3, the determination unit 30 determines the type of the one or more molded articles 3 based on the imaging results obtained by the imaging unit 24. This allows the information processing device 20 to appropriately calculate the load Pa to be applied to the movement mechanism unit 17.
[0129] The resin sealing device 1, which simultaneously seals a plurality of molded articles 3 with resin in a single molding operation, includes an information processing device 20 and a movement mechanism 17. This allows the resin sealing device 1 to appropriately calculate the load Pa to be applied to the movement mechanism 17.
[0130] Further advantages and modifications will readily occur to those skilled in the art. Therefore, the invention in its broader aspects is not limited to the specific details and representative embodiments shown and described above. Accordingly, various modifications may be made without departing from the spirit or scope of the general inventive concept as defined by the appended claims and their equivalents. [Explanation of symbols]
[0131] 1 Resin sealing equipment 31,32,33,34 Molded products 10 Main body 11 Mold 12,121~128 pots 13,131~134 Resin flow path 14,141~144 cavities 15,151~158 plunger 16,161~168 spring 17 Moving mechanism section 18,181~188 Resin materials 19 Drive unit 20 Information processing equipment 21 Control section 22 Memory section 23 Code reader 24 Imaging unit 30 Judgment section 31 Acquisition Department 32 Calculation section 33 Drive processing unit 40 Selection section 41 Volume difference calculation unit 42 Load calculation section 50 First calculation processing unit 51 Second calculation processing unit
Claims
1. an acquisition unit that acquires information indicating the types of each of a plurality of molded products that are simultaneously resin-sealed in different cavities among the plurality of cavities in a single molding operation; a calculation unit that calculates a load to be applied to a movement mechanism unit that moves a plurality of plungers that push resin members into the plurality of cavities via different springs, based on information indicating the types of each of the plurality of molded products acquired by the acquisition unit, The calculation unit a volume difference calculation unit that calculates a volume difference between a reference workpiece selected from the plurality of workpieces and each of the remaining workpieces; and a load calculation unit that calculates the load to be applied to the movement mechanism unit based on the volume difference calculated by the volume difference calculation unit so that all of the molding pressures applied to the plurality of cavities are within a predetermined range of molding pressure.
1. An information processing device comprising:
2. The load calculation unit a first calculation processing unit that calculates a molding pressure or a load to be applied to each of the plurality of cavities based on the volume difference calculated by the volume difference calculation unit so that all of the molding pressures applied to each of the plurality of cavities are within a predetermined range; a second calculation processing unit that calculates the load to be applied to the movement mechanism unit based on the molding pressure or the load to be applied to each of the plurality of cavities calculated by the first calculation processing unit.
2. The information processing apparatus according to claim 1, wherein:
3. The first calculation processing unit A molding pressure to be applied to each of the plurality of cavities is calculated so that the pressure applied to the cavity in which the reference workpiece is placed becomes a preset molding pressure.
3. The information processing apparatus according to claim 2, wherein:
4. The calculation unit a selection unit that selects a workpiece that satisfies predetermined conditions from among the plurality of workpieces as the reference workpiece; 4. The information processing device according to claim 1, wherein the information processing device is a computer.
5. The selection unit Selecting the workpiece with the smallest volume from among the plurality of workpieces 5. The information processing apparatus according to claim 4,
6. The selection unit Selecting the workpiece with the largest volume from among the plurality of workpieces 5. The information processing apparatus according to claim 4,
7. The calculation unit When the combination of the types of the plurality of workpieces, the information of which is acquired by the acquisition unit, differs from the combination of the types of the plurality of workpieces when the load is calculated by the calculation unit, the calculation unit calculates the load.
4. The information processing device according to claim 1, wherein the information processing device is a computer.
8. a code reading unit that reads information about codes given to the plurality of molding workpieces; a determination unit that determines the type of each of the plurality of workpieces based on the information of the code read by the code reading unit, The acquisition unit 4. The information processing apparatus according to claim 1, further comprising: acquiring information indicating the type of each of the plurality of molded products determined by the determination unit.
9. an imaging unit that images the plurality of molding workpieces; The determination unit When the code information of one or more of the plurality of molding workpieces cannot be read by the code reading unit, the type of the one or more molding workpieces is determined based on the image pickup result by the image pickup unit.
9. The information processing apparatus according to claim 8,
10. A resin sealing apparatus for simultaneously sealing the plurality of molding workpieces with resin in a single molding operation, An information processing device according to any one of claims 1 to 3; The moving mechanism unit A resin sealing device characterized by:
11. an acquiring step of acquiring information indicating the types of each of a plurality of molded products to be simultaneously resin-sealed in a single molding operation in different cavities among the plurality of cavities; a calculation step of calculating a load to be applied to a movement mechanism that moves a plurality of plungers that push resin members into the plurality of cavities via different springs, based on information indicating the types of each of the plurality of molded products acquired in the acquisition step, The calculation step a volume difference calculation step of calculating a volume difference between a reference workpiece selected from the plurality of workpieces and each of the remaining workpieces; a load calculation step of calculating the load to be applied to the movement mechanism unit based on the volume difference calculated in the volume difference calculation step so that all of the molding pressures applied to the plurality of cavities are within a predetermined range of molding pressure. An information processing method comprising:
12. an acquisition step of acquiring information indicating the types of each of a plurality of molded products to be simultaneously resin-sealed in a single molding operation in different cavities among the plurality of cavities; a calculation step of calculating a load to be applied to a movement mechanism that moves, via different springs, a plurality of plungers that push resin members into the plurality of cavities, based on information indicating the types of each of the plurality of molded products acquired by the acquisition step; The calculation procedure is as follows: a volume difference calculation step of calculating a volume difference between a reference workpiece selected from the plurality of workpieces and each of the remaining workpieces; a load calculation step of calculating the load to be applied to the movement mechanism unit based on the volume difference calculated by the volume difference calculation step so that all of the molding pressures applied to the plurality of cavities are within a predetermined range of molding pressure. An information processing program characterized by:
Citation Information
Patent Citations
Mold for transfer molding
JP1989146919U