Cutting device

Abstract

To provide a cutting device that has a simple configuration and is capable of separating a cut object from a cutting target without deforming the cut object.SOLUTION: A cutting device 1 includes: a cutting die 10 having a cutting portion 12; a cutting base plate 20; a cut object discharge plate 50; and a cut object discharge tool. The cut object discharge tool may also serve as the cutting die 10. The cutting base plate 20 is positioned opposite the cutting die 10 across a cutting target W0, and receives the cutting edge 11 of the cutting die 10 when cutting the cutting target W0. The cut object discharge plate 50 is replaced with the cutting base plate 20 after cutting the cutting target W1, and has a cut object discharge hole 51 large enough to allow the cut object W1 to fall naturally. After the cut object discharge plate 50 is replaced with the cutting base plate 20, the cutting die 10 is lowered to pull down and separate the cut object W1 from the cutting target W0, so as to discharge the separated cut object into the cut object discharge hole 51.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cutting device. [Background technology]

[0002] As a cutting means for separating cut pieces from a cutting object such as a sheet, there are cutting devices having blade types such as an etching blade type, a Pinnacle (registered trademark) blade type, a Thomson blade type, etc. However, such cutting devices have a problem in reliably separating and recovering the cut pieces from the cutting object.

[0003] Patent Document 1 discloses a cutting device that forms through holes in a resin film as an object to be cut, allowing the cut pieces to be separated and collected from the object after cutting. This cutting device includes a blade, a first elastic body housed inside the blade, and a second elastic body arranged to surround the blade. Both the first elastic body and the second elastic body protrude beyond the cutting edge, with the first elastic body protruding from the cutting edge by a greater amount than the second elastic body.

[0004] The cutting device configured in this manner can cut a resin film placed on a cutting support plate using the blade die. The first elastic body and the second elastic body press against the resin film until the cutting process is completed. The pressing force of the first elastic body against the resin film is greater than the pressing force of the second elastic body. After the blade die punches out the resin film, the blade die, the first elastic body, and the second elastic body return to their initial positions before punching. However, they move away from the resin film in the following order: blade die, second elastic body, first elastic body. In other words, at least the first elastic body holds down the punched waste until the cutting edge leaves the resin film. Therefore, in the punching device described above, the object to be cut easily leaves the cutting support plate after cutting, and the cut material remains on the cutting support plate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 2020-97092 Summary of the Invention [Problem to be solved by the invention]

[0006] The cutting device described in Patent Document 1 uses a first elastic body to prevent the cut material from floating up from the cutting base plate while adhering to the blade die, making it possible to separate the cut material from the resin film. Therefore, the cut material remains attached to the cutting base plate and is prevented from scattering on the resin film. However, since the cut material remains attached to the cutting base plate, a separating device is provided to separate the cut material from the cutting base plate.

[0007] Therefore, the present invention has been made to solve such problems, and aims to realize a cutting device that has a simple configuration and can separate the cut material from the object to be cut without deforming it, and can easily recover it, without the need for a separation device as in the prior art described above. [Means for solving the problem]

[0008] [1] The cutting device of the present invention is characterized by having a blade mold having a cutting portion, a cutting base plate that is positioned opposite the blade mold across the object to be cut and receives the cutting edge of the blade mold when cutting the object to be cut, a cutting material discharge plate that can be replaced with the cutting base plate after the object to be cut and has a cutting material discharge hole large enough to allow the cutting material to fall naturally, and a cutting material discharge tool that separates the cutting material from the object to be cut and discharges it into the cutting material discharge hole.

[0009] [2] In the cutting device of the present invention, it is preferable that the cutting material discharge tool is the blade type, the blade type is in the same planar position as during cutting, and after the cutting base plate and the cutting material discharge plate are interchanged, the cutting edge can be lowered to a position where the cutting material is removed from the cutting object.

[0010] [3] In the cutting device of the present invention, it is preferable that the blade mold further has an elastic cutting material receiving member housed inside the blade portion, the cutting material receiving member has suction holes for adsorbing the cutting material cut from the object to be cut, and the cutting material discharge plate is configured to be replaceable with the cutting material support plate after the cutting material receiving member has adsorbed the cutting material.

[0011] [4] In the cutting device of the present invention, it is preferable that the cut-piece discharge tool is a cut-piece discharge punch, and that the cut-piece discharge punch has a punch portion having an outer shape smaller than the outer shape of the cut-piece.

[0012] [5] In the cutting device of the present invention, it is preferable that the cutting material ejection punch has an adsorption hole for adsorbing and holding the cutting material on the cutting base plate, the cutting material ejection punch can be replaced with the blade after cutting the cutting object, and the cutting material ejection plate can be replaced with the cutting base plate after the cutting material ejection punch has adsorbed the cutting material.

[0013] [6] The cutting device of the present invention preferably further includes an elastic plate that is located on the opposite side of the cutting base plate to the object to be cut and that comes into contact with the cutting base plate at least during cutting. [Effects of the Invention]

[0014] The cutting device cuts a workpiece placed on a cutting support plate with a blade die having the outer shape of the workpiece. The cutting support plate and the workpiece discharge plate are replaced while the cut workpiece remains unseparated from the workpiece. The workpiece discharge tool then pushes down on the workpiece to remove it from the workpiece. The workpiece discharge tool has a workpiece discharge hole large enough to allow the workpiece to fall naturally, so the separated workpiece falls through the cutpiece discharge hole. Because the workpiece discharge tool simply pushes down on the workpiece, it can be separated from the workpiece with almost no load and without deforming it.

[0015] Therefore, the cutting device of the present invention can separate the cut object from the object to be cut without deformation, with a simple configuration, without providing a separating device as in the prior art described above. [Brief explanation of the drawings]

[0016] [Figure 1] 1 is a diagram illustrating a configuration of a cutting device 1 according to a first embodiment. [Figure 2] 1 is a view showing a cutting die 10 equipped with a cutting material receiving member 55. FIG. [Figure 3] 1A to 1C are diagrams illustrating a cutting method using the cutting device 1 according to the first embodiment. [Figure 4] 10A and 10B are diagrams illustrating the configuration of a cutting device 2 according to a second embodiment. [Figure 5] 10A to 10C are diagrams illustrating a cutting method using a cutting device 2 according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, cutting devices 1 and 2 according to embodiments of the present invention will be described with reference to the drawings. Note that the drawings described below are schematic diagrams in which the shape, aspect ratio, and scale differ from the actual ones.

[0018] (First embodiment) FIG. 1 is a diagram illustrating the configuration of a cutting device 1 according to a first embodiment. FIG. 1(a) is a front view, and FIG. 1(b) is a view from a direction perpendicular to FIG. 1(a). In FIG. 1(a), the left-right direction of the paper is the X direction, the depth direction of the paper is the Y direction, and the direction perpendicular to the XY plane is the Z direction (or height direction). Note that the following drawings will also be described in the directions illustrated in FIG. 1(a). The cutting device 1 has a cutting die 10 and a cutting base plate 20 that faces the cutting die 10 across the workpiece W0 and receives the cutting edge 11 of the cutting die 10 when cutting the workpiece W0. The cutting device 1 performs a complete cutting process (cutting-out process) on the workpiece W0. Note that in the following description, the member that is cut out by complete cutting and the cut-out member will be referred to as the workpiece W1 (see FIG. 3). This embodiment includes a case where the cut object W1 is treated as a product, and a case where the cutting target object W2 (see FIG. 3(d)) from which the cut object W1 has been removed is treated as a product.

[0019] The blade 10 is, for example, an etching blade, a Pinnacle (registered trademark) blade, or a Thomson blade, and is composed of a blade support 13 that is integrated with an annular blade 12 relative to a cutting edge 11. In other words, the blade 12 has a cylindrical shape. The cutting device 1 has a blade elevating mechanism 14 that raises and lowers the blade 10 toward the workpiece W0. The workpiece W0 can be a sheet of metal, resin, paper, or the like, a film, a tape, or the like, and also includes those with adhesive layers and laminated substrates.

[0020] The cutting base plate 20 is made of metal such as a stainless steel plate, and has hardness and flexibility that prevents it from being cut by the cutting edge 11 of the cutting die 10 when cutting the entire workpiece W0.

[0021] An elastic plate 30 is disposed below the cutting underlay plate 20 (on the opposite side from the cutting die 10). The elastic plate 30 can be made of, for example, urethane rubber. The cutting die 10 descends until the cutting edge 11 penetrates the workpiece W0 and contacts the cutting underlay plate 20. The elastic plate 30 is compressed by the cutting force required for the cutting die 10 to cut, and applies a pressing force to the cutting underlay plate 20 from below. By providing the elastic plate 30, the cutting underlay plate 20 can be reused, although an indentation of the cutting edge 11 remains. The cutting underlay plate 20 and the elastic plate 30 may be integrally configured as layers, or may be configured separately. In the following description, the cutting underlay plate 20 and the elastic plate 30 may be collectively referred to as a cutting underlay plate unit 31.

[0022] The workpiece W0 is supported by a workpiece fixing table 41 arranged on a base 40. The workpiece fixing table 41 can be arranged around the cutting base plate 20 and the elastic plate 30, on both sides in the X direction, on both sides in the Y direction, or in a dotted pattern along the outer periphery. Although not shown, the workpiece fixing table 41 has suction holes that adsorb the workpiece W0. Fig. 1(a) shows an example in which the workpiece fixing table 41 is arranged at a position spaced from both sides in the X direction of the cutting base plate 20 and the elastic plate 30.

[0023] The cutting device 1 has a cutting base plate unit moving mechanism 42 that moves the cutting base plate unit 31 between a position directly below the cutting die 10 and a position retracted from the cutting die 10. As shown in FIG. 1(b), the cutting device 1 also has a cut material discharge plate 50 that is disposed at a position spaced apart from the cutting base plate unit 31 in the Y direction. The cut material discharge plate 50 has a cut material discharge hole 51. The cut material discharge hole 51 is larger than the outer periphery of the annular cutting edge 11 and has a size that allows the cut material W1 (see FIG. 3(d)) to fall naturally.

[0024] The cutting device 1 has a cutting material discharge plate moving mechanism 52 that moves the cutting material discharge plate 50 between a position directly below the blade die 10 and a position retracted from the cutting material discharge plate unit 31. After the cutting workpiece W0 is cut by the blade die 10, the above-mentioned cutting material discharge plate unit moving mechanism 42 moves the cutting material discharge plate unit 31 from directly below the blade die 10 in the opposite direction to the cutting material discharge plate 50 (retracts it from the position of the blade die 10). In other words, the cutting material discharge plate unit moving mechanism 42 reciprocates the cutting material discharge plate unit 31 between a position where the cutting workpiece W0 can be cut and a position where it does not interfere with the cutting material discharge plate 50 that moves below the blade die 10 after cutting.

[0025] The cutting material discharge plate moving mechanism 52 moves the cutting material discharge plate 50 in response to the retraction of the cutting material base plate unit 31 until the cutting material discharge hole 51 is located directly below the blade section 12. In other words, the cutting material discharge plate moving mechanism 52 reciprocates between a position where the cutting material discharge hole 51 is located directly below the blade section 12 and a position where it is separated from the cutting material base plate unit 31. The workpiece W0 is held by suction on the cutting material fixing base 41 and does not move.

[0026] The cutting base plate unit moving mechanism 42 and the cutting material discharge plate moving mechanism 52 can be linked together to form a single continuous moving mechanism. For example, if the cutting base plate unit 31 and the cutting material discharge plate 50 are arranged at a fixed distance and moved simultaneously, it becomes possible to repeatedly switch between cutting and discharge. In the first embodiment, the position of the blade die 10 does not change during cutting and discharge.

[0027] However, in the cutting device 1, after the entire object W0 has been cut, there is a risk that the object W1 to be cut may become misaligned with respect to the object W0. For example, if the object W0 has an adhesive layer, the object W1 may adhere to the blade portion 12 and the cutting die 10, and move upward. Therefore, it is preferable that the cutting die 10 include a cutting object receiving member 55 housed inside the annular cutting portion 12.

[0028] FIG. 2 is a diagram showing the blade die 10 equipped with a cut piece receiving member 55. The cut piece receiving member 55 is housed inside the blade section 12. The cut piece receiving member 55 has suction holes 56 for adsorbing the cut piece W1. The cut piece receiving member 55 is made of an elastic material such as sponge. If the elastic material itself is breathable, the suction holes 56 do not need to be provided. The blade section support section 13 of the blade die 10 has ventilation holes 13a that communicate with the suction holes 56. The cut piece receiving member 55 has a thickness that is the same as or slightly greater than the height of the blade section 12 from the blade section support section 13.

[0029] The cut piece receiving member 55 can be formed by punching out a sheet-like base material with the blade die 10. That is, by applying an adhesive or the like to the blade support portion 13 surrounded by the blade portion 12 and punching out the base material, the cut piece receiving member 55 is fixed inside the blade portion 12. Note that when the cut piece receiving member 55 is formed by the above-described method, the base material after punching out the cut piece receiving member 55 can also be placed on the outer periphery of the blade portion 12. In this way, it is possible to prevent the object W0 from warping or wrinkling, which may occur when the object W0 is cut with the blade die 10. Next, a cutting method using the cutting device 1 according to the first embodiment will be described.

[0030] FIG. 3 is a diagram illustrating a cutting method using the cutting device 1 according to the first embodiment. The description will be made with reference to FIGS. 1 and 2. Here, the case where a cutting object receiving member 55 is provided will be described as an example. FIG. 3(a) is a diagram illustrating the state before cutting begins. Before cutting begins, however, the cutting object receiving member 55 can be omitted if the cutting object W1 does not adhere to the blade portion 12 or if the cutting object W1 has a shape that does not cause displacement relative to the cutting object W0. A gap is provided between the cutting edge 11 and the cutting object W0, allowing the cutting object W0 to be transported. The cutting object receiving member 55 is in its initial state.

[0031] FIG. 3(b) shows the cutting state. The blade die 10 descends until the cutting edge 11 abuts the cutting base plate 20, completely cutting the workpiece W0. At this time, the elastic plate 30 is compressed by the cutting edge 11, generating a repulsive force toward the cutting edge 11. In other words, the cutting edge 11 descends with a stroke that includes a predetermined amount of compression of the elastic plate 30. The cutting piece receiving member 55 is also compressed by at least the thickness of the workpiece W0, and adsorbs the workpiece W1. At this time, the workpiece W1 has been completely cut, but remains on the workpiece W0, sandwiched between the cutting piece receiving member 55 and the cutting base plate 20.

[0032] FIG. 3(c) shows the state immediately before the cut material W1 is dropped. After cutting, the cutting die 10 releases the workpiece W1 from the workpiece receiving member 55 and is raised until the cutting edge 11 is separated from the workpiece W0. The workpiece receiving member 55 is released from compression and returns to its initial state, with the workpiece W1 remaining on the workpiece W0. The cutting base plate unit 31 is then moved by the cutting base plate unit moving mechanism 42 from directly below the cutting die 10 to a retracted position. In conjunction with this retraction, the cutting material discharge plate moving mechanism 52 moves the cutting material discharge plate 50 to a position where the cutting material discharge hole 51 is directly below the cutting edge 11. If the cutting material discharge plate 50 is moved below the cutting edge 11 before the cutting base plate unit 31 is completely retracted from directly below the cutting edge 11, the posture and position of the workpiece W1 during cutting can be maintained. The cutting support plate unit moving mechanism 42 and the cut product discharge plate moving mechanism 52 may or may not be driven synchronously.

[0033] FIG. 3(d) shows the state in which the blade die 10 discharges the cut material W1 from the workpiece W0 into the cut material discharge hole 51. That is, in the cutting device 1 according to the first embodiment, the blade die 10 also serves as a discharge block. The blade die 10 is lowered to a position where it penetrates the workpiece W0 in the same planar position as during cutting. The cut material W1 is removed from the workpiece W0 and falls. If a through-hole 40a is provided in the base 40 and a collection container 53 is placed below the through-hole 40a, the cut material W1 can be easily collected. The operation of the blade die 10 during removal follows the trajectory during cutting, so there is no risk of misalignment.

[0034] Although the cutting device 1 shown in FIG. 3 has the cutting material receiving member 55, it is also applicable to a configuration without the cutting material receiving member 55.

[0035] (Second embodiment) FIG. 4 is a diagram illustrating the configuration of a cutting device 2 according to a second embodiment. The cutting device 2 according to the second embodiment is configured by adding a cutting material discharge punch 60, which is a discharge block for punching out the cutting material W1 from the cutting material W0, to the above-described cutting device 1. Therefore, the same components as those in the first embodiment are denoted by the same reference numerals as in FIGS. 1 to 3, and detailed descriptions thereof will be omitted. The cutting device 2 includes a cutting die 10, a cutting base plate 20, an elastic plate 30, a cutting material discharge plate 50, and a cutting material discharge punch 60. The cutting material W0 is supported by a cutting material fixing base 41 (see FIG. 1(a)). The cutting device 2 includes a cutting base plate unit moving mechanism 42 that moves the cutting base plate unit 31, and a cutting material discharge plate moving mechanism 52 that moves the cutting material discharge plate 50. The cutting base plate unit moving mechanism 42 and the cutting material discharge plate moving mechanism 52 can be configured the same as those in the first embodiment.

[0036] The cut material discharge punch 60 is preferably disposed at a position separated from the blade die 10 and at approximately the same height as the blade die 10. The cut material discharge punch 60 has a punch portion 61, which has a shape suitable for punching the cut material W1 out of the workpiece W0. In other words, the outer shape of the punch portion 61 is formed smaller than the outer periphery of the cut material discharge hole 51 and the blade portion 12. The cut material discharge punch 60 has a punch moving mechanism 63 that moves the punch portion 61 until it reaches above the cut material W1, and further moves it down to a position where the punch portion 61 can punch out the cut material W1 from the workpiece W0.

[0037] The cutting device 2 also has a blade movement mechanism 65 that lowers the blade 10 toward the workpiece W0 and moves the blade 10 between a cutting position and a position away from the cutting position (retracted). In other words, the cut-piece discharge punch 60 is in a position away from the blade 10 (retracted position) while the blade 10 is performing the cutting process. When the cutting process is completed and the blade 10 has retracted, the punch movement mechanism 63 moves the punch unit 61 to the cutting position and lowers the punch unit 61 above the workpiece W1 that has not fallen out of the workpiece W0, thereby cutting the workpiece W1 (see FIG. 5). At this time, the cut-piece discharge plate 50 has moved to the position where the cutting support plate unit 31 is located.

[0038] On the other hand, during cutting, the blade 10 is positioned at a position where it can cut the workpiece W0, and is configured to be able to retreat to a position where it does not interfere with the cut-piece discharge punch 60, which moves to a position where it can drop the cut-piece W1 after cutting is completed.

[0039] It is preferable that the blade section 12 accommodates a cut piece receiving member 55 therein. The cut piece receiving member 55 adsorbs the cut piece W1 that has not fallen off the workpiece W0 after cutting, and supports the cut piece W1 until the cut piece discharge plate 50 is replaced with the cutting support plate unit 31. However, if the cut piece W1 does not adhere to the blade section 12 or if the cut piece W1 has a shape that does not cause it to slip out of place relative to the workpiece W0, the cut piece receiving member 55 can be omitted. Next, a cutting method using the cutting device 2 according to the second embodiment will be described.

[0040] FIG. 5 is a diagram illustrating a cutting method using the cutting device 2 according to the second embodiment. The description will be made with reference to FIGS. 3 and 4. The process up to when the cutting die 10 cuts the workpiece W0 is the same as that shown in FIGS. 3(a) and 3(b) in the first embodiment, and therefore will not be repeated. FIG. 5(a) shows the state in which the cutting material discharge punch 60 adsorbs the workpiece W1. As shown in FIG. 5(a), after cutting the workpiece W0, the cutting die 10 releases the adsorption of the workpiece W1, raises the cutting edge 11 until it is separated from the workpiece W0, and then retracts the cutting base plate unit 31 in a planar direction. At this time, the cutting base plate unit 31 is in its initial position, so there is no displacement of the workpiece W1.

[0041] The cut-piece ejection punch 60 moves to a position where the punch portion 61 is within the range of the cutting area W3, and sandwiches and adsorbs the cut-piece W1 between the cutting base plate 20. The cut-piece W1 can be maintained in the same position as when it was cut by the cut-piece ejection punch 60. In Figure 5(a), the solid arrows indicate the movement of the cutting die 10, and the dotted arrows indicate the movement of the cut-piece ejection punch 60.

[0042] 5(b) shows the state in which the cut product discharge plate 50 moves below the cut product discharge punch 60. As shown in FIG. 5(b), after cutting, the cutting base plate unit 31 is replaced with the cut product discharge plate 50. The cut product discharge punch 60 is adsorbing the cut product W1. Then, the cutting base plate unit 31 is moved below the cutting die 10, and the cut product discharge punch 60 is moved to a position where the cut product discharge hole 51 can drop the cut product W1. Because the cut product W1 is adsorbed by the cut product discharge punch 60, the cut product W1 does not shift in position while the cut product discharge punch 60 moves.

[0043] FIG. 3(d) shows the state in which the cutting-piece discharge punch 60 discharges the cut pieces W1 from the workpiece W0 into the cutting-piece discharge hole 51. As shown in FIG. 5(c), the cutting device 2 lowers the cutting-piece discharge punch 60 to remove and separate the cut pieces W1 from the workpiece W0. After releasing the suction of the cut pieces W1, the cutting-piece discharge punch 60 is lowered to a position inside the cutting position W3 where the punch portion 61 penetrates the workpiece W0. The cut pieces W1 are removed from the workpiece W0 and fall. If a through-hole 40a is formed in the base 40 and a collection container 53 is disposed below the through-hole 40a, the cut pieces W1 can be easily collected. After the cut pieces W1 are removed, the cutting device 2 returns to the initial position shown in FIG. 4.

[0044] The cutting devices 1 and 2 cut the workpiece W0 placed on the cutting base plate 20 with a blade die 10 having the outer shape of the workpiece W1. Then, the cutting base plate 20 is replaced with a workpiece discharge plate 50 while the cut workpiece W1 remains unseparated from the workpiece W0. Then, for example, the blade die 10 or the workpiece discharge punch 60 serving as a workpiece discharge tool pushes down the workpiece W1, thereby removing and separating the workpiece W1 from the workpiece W0. The workpiece discharge plate 50 has a workpiece discharge hole 51 large enough to allow the workpiece W1 to fall naturally, so the separated workpiece W1 falls from the workpiece discharge hole 51. Because the workpiece discharge tool simply pushes down the cut workpiece W1, it can separate the workpiece W1 from the workpiece W0 with almost no load.

[0045] Therefore, the cutting device 1 and cutting device 2 according to the first and second embodiments can separate the cutting object W0 from the cutting object W1 without deformation, with a simple configuration, without the need for a separation device as in the conventional technology described above.

[0046] The cutting device 1 uses a cutting tool as a cutting die 10. After the cutting base plate 20 and the cutting material discharge plate 50 are replaced, the cutting edge 11 descends to a position where it can remove the cutting material W1 from the cutting object W0. Because the planar position of the cutting die 10 has not changed since cutting, the cutting edge 11 can remove the cutting material W1 from the cutting object W0 along the same trajectory as during cutting.

[0047] The cutting die 10 has an elastic cutting material receiving member 55 housed inside the blade portion 12. The cutting material receiving member 55 adsorbs and supports the cutting material W1 in a state in which it has been cut from the cutting workpiece W0. After the cutting material receiving member 55 adsorbs the cutting material W1, the cutting material discharge plate 50 is replaced with the cutting base plate 20, and the cutting material discharge tool, the cutting die 10, is lowered. In this way, the cutting material W1 does not shift in posture or position when the cutting material discharge plate 50 is replaced with the cutting base plate 20, so it is possible to reliably separate the cutting material W1 from the cutting workpiece W0 without deformation.

[0048] The cutting device 2 has a cut-off material discharge punch 60 as a cut-off material discharge tool. The cut-off material discharge punch 60 has a punch portion 61 having an outer shape smaller than the outer shape of the cut-off material W1. After cutting the cut-off material W1, the punch portion 61 descends to a position where the cut-off material W1 can be dropped from the cut-off object W0, thereby making it possible to drop the cut-off material W1 from the cut-off object W0.

[0049] In the cutting device 2, the cutting material discharge punch 60 has suction holes 62 that suction-hold the cutting material W1 on the cutting base plate 20. After cutting the cutting material W0, the blade 10 and the cutting material discharge punch 60 are replaced, and the cutting material discharge punch 60 suction-supports the cutting material W1 using the suction holes 62. Then, the cutting device 2 replaces the cutting material discharge plate 20 with the cutting material discharge plate 50, and then lowers the cutting material discharge punch 60. In this way, the cutting material W1 does not shift in posture or position when the cutting material discharge plate 50 is replaced with the cutting material discharge plate 20, so that the cutting material W1 can be reliably separated from the cutting material W0 without being deformed.

[0050] Furthermore, the cutting devices 1 and 2 are located on the opposite side of the cutting base plate 20 from the object W0, and have an elastic plate 30 that comes into contact with the cutting base plate 20 during cutting. The cutting edge 11 comes into contact with the cutting base plate 20, thereby completely cutting the object W0. At this time, the elastic plate 30 is compressed, and a repulsive force is generated toward the cutting edge 11, ensuring reliable cutting of the object W0. With this configuration, the cutting devices 1 and 2 are able to completely cut the object W0, and also increase the durability of the blade die 10 and cutting base plate 20, allowing for repeated use.

[0051] In the first and second embodiments described above, the workpiece W0 is fixed, the positions of the cutting base plate unit 31 and the cutting material discharge plate 50 are interchanged, and further the positions of the blade 10 and the cutting material discharge punch 60 are interchanged. However, it is also possible to fix the positions of the cutting base plate unit 31 and the cutting material discharge plate 50, and the positions of the blade 10 and the cutting material discharge punch 60, and move the workpiece W0. [Explanation of symbols]

[0052] 1, 2...Cutting device, 10...Blade, 11...Blade tip, 12...Blade portion, 20...Cutting base plate, 30...Elastic plate, 50...Cutting material discharge plate, 51...Cutting material discharge hole, 55...Cutting material receiving member, 56...Suction hole, 60...Cutting material discharge punch (Cutting material discharge tool), 61...Punch portion, 62...Suction hole, W0...Cutting material, W1...Cutting material, W2...Punched cutting material

Claims

1. a blade mold having a blade portion; a cutting base plate that is positioned opposite the blade die across the object to be cut and that receives the cutting edge of the blade die when cutting the object to be cut; a cutting material discharge plate that can be replaced with the cutting base plate after the cutting object has been cut and has a cutting material discharge hole that is large enough to allow the cutting material to fall naturally; a cutting material discharge tool that separates the cutting material from the object to be cut and discharges it into the cutting material discharge hole; It has A cutting device characterized by:

2. 2. The cutting device according to claim 1, The cutting material ejection tool is the blade type, The blade is in the same plane position as during cutting, and is configured so that after the cutting base plate and the cut material discharge plate are interchanged, the blade tip can be lowered to a position where the cut material is removed from the cut object. A cutting device characterized by:

3. 3. The cutting device according to claim 2, The blade die further includes an elastic cutting material receiving member accommodated inside the blade portion, the cut piece receiving member has suction holes for suctioning the cut pieces that have been cut from the object to be cut, The cutting material receiving member is configured to be able to replace the cutting material discharge plate with the cutting material support plate after the cutting material is adsorbed by the cutting material receiving member. A cutting device characterized by:

4. 2. The cutting device according to claim 1, The cutting material ejection tool is a cutting material ejection punch, The cut-off material ejection punch has a punch portion with an outer shape smaller than the outer shape of the cut-off material. A cutting device characterized by:

5. 5. The cutting device according to claim 4, the cut-piece discharge punch has a suction hole for suction-holding the cut piece on the cutting base plate, the cutting object ejection punch can be replaced with the blade die after cutting the cutting object, The cutting material ejection plate is configured to be replaceable with the cutting material support plate after the cutting material ejection punch has adsorbed the cutting material. A cutting device characterized by:

6. 2. The cutting device according to claim 1, The cutting machine further includes an elastic plate located on the opposite side of the cutting object from the cutting base plate and contacting the cutting base plate at least during cutting. A cutting device characterized by:

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