Method for manufacturing base material including conductive pattern, method for manufacturing electronic device, method for manufacturing electromagnetic wave shield film, method for manufacturing planar heating element, intermediate structure for manufacturing base material including conductive pattern, and base material including conductive pattern

Abstract

To form a fine circuit pattern and / or form a highly precise circuit pattern, in formation of a conductive pattern using a conductive composition containing conductive particles.SOLUTION: A method for manufacturing a base material including a conductive pattern includes: an embedding step of bringing a provisional pattern provided on the surface of an easily peelable base material by a conductive composition containing conductive particles, into contact with a resin-containing layer provided on the surface of a base material different from the easily peelable base material, and obtaining an embedded pattern where at least a part of the provisional pattern is embedded in the resin-containing layer; and a pressing step of applying at least pressure to the embedded pattern to obtain a conductive pattern.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a substrate having a conductive pattern, a method for manufacturing an electronic device, a method for manufacturing an electromagnetic wave shielding film, a method for manufacturing a sheet heating element, an intermediate structure for manufacturing a substrate having a conductive pattern, and a substrate having a conductive pattern. More specifically, the present invention relates to a method for manufacturing a substrate having a conductive pattern using a conductive composition containing conductive particles. [Background technology]

[0002] A known technique involves forming a pattern on a substrate using a conductive composition containing conductive particles and then heating the pattern to obtain a conductive pattern. This technique is thought to be applicable to printed electronics, which has been actively developed in recent years. Printed electronics is a technology that uses printing technology to form electronic circuits, sensors, elements, etc. on a substrate such as a film.

[0003] Patent Document 1 discloses a method for forming a conductive film pattern, which includes the steps of forming a first conductive film pattern on a separation substrate provided with a porous receiving layer, and separating the first conductive film pattern from the separation substrate by adhering it to a substrate.

[0004] Patent Document 2 discloses a transfer substrate used to temporarily hold a pattern and transfer the held pattern to a transfer target, the transfer substrate having at least a porous layer on a support and a release layer on the porous layer, the porous layer containing at least one compound selected from glycerin and polyglycerin. Patent Document 2 discloses that a conductive pattern is obtained by using this transfer substrate to form a pattern using ink or paste containing conductive fine particles.

[0005] Patent Document 3 discloses a method for manufacturing a smooth wired circuit board, which includes (1) forming a B-stage adhesive layer on an amorphous insulating substrate using a thermosetting resin, and (2) adhesively transferring a conductive pattern formed on a film-like temporary substrate by screen printing or the like to this adhesive layer. According to the description in Patent Document 3, a smooth wired circuit board is provided in which, in a printed wiring board used for a switch substrate such as a slide switch, the conductive pattern serving as the switch contact point is smoothly and favorably embedded to obtain stable switch characteristics.

[0006] Patent Document 4 discloses a transfer object characterized by having a substrate on which a pattern is formed using a conductive material transferred from a relief printing plate, and an adhesive layer applied to the surface of the substrate and used to adhere the conductive material.

[0007] Patent Document 5 discloses a method for manufacturing a wiring board in which a conductor pattern is transferred onto a substrate by intaglio printing. Specifically, this manufacturing method includes: (1) an intaglio printing process for forming grooves on the surface of a flexible film; (2) a filling process for filling the grooves with a conductive paste after the intaglio printing process; (3) a drying process for evaporating and drying the solvent contained in the conductive paste after the filling process; (4) a transfer process for bonding the dried intaglio with the conductive paste to the substrate, which has been previously coated with a thermoplastic adhesive, after the drying process; (5) a film peeling process for peeling the film from the substrate and transferring the conductive paste onto the substrate to form a conductor pattern; and (6) a firing process for firing the conductive paste after the film peeling process. A heating process is inserted between the film peeling process and the firing process to prevent the adhesive from flowing during the firing process. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-281658 [Patent Document 2] Japanese Patent Application Publication No. 2020-161619 [Patent Document 3] Japanese Patent Application Publication No. 7-45159 [Patent Document 4] Japanese Patent Application Laid-Open No. 2004-095882 [Patent Document 5] Japanese Patent Application Laid-Open No. 2004-319731 Summary of the Invention [Problem to be solved by the invention]

[0009] In principle, the formation of a conductive pattern using a conductive composition containing conductive particles is disadvantageous in terms of forming a fine circuit pattern or a high-precision circuit pattern compared to pattern formation by photolithography or etching. However, due to the increasing expectations for cost reduction in circuit pattern formation and printed electronics suitable for mass production, there is a growing demand for the formation of a fine circuit pattern or a high-precision circuit pattern even in the formation of a conductive pattern using a conductive composition.

[0010] The present invention has been made in view of the above circumstances, and an object of the present invention is to form a fine circuit pattern and / or a high-precision circuit pattern when forming a conductive pattern using a conductive composition containing conductive particles. [Means for solving the problem]

[0011] The present inventors have completed the invention provided below and solved the above problems.

[0012] 1. an embedding step of bringing a temporary pattern formed on the surface of an easily peelable substrate using a conductive composition containing conductive particles into contact with a resin-containing layer formed on the surface of a substrate different from the easily peelable substrate, thereby obtaining an embedded pattern in which at least a portion of the temporary pattern is embedded in the resin-containing layer; a pressing step of applying at least pressure to the embedded pattern to obtain a conductive pattern; A method for manufacturing a substrate having a conductive pattern, comprising: 2. 1. A method for manufacturing a substrate having the conductive pattern according to claim 1, the resin-containing layer is curable, The method for manufacturing a substrate provided with a conductive pattern includes a curing step for curing or semi-curing the resin-containing layer between the embedding step and the pressing step. 3. A method for manufacturing a substrate having a conductive pattern according to 1. or 2., In the embedding step, the resin-containing layer is softened by heat. 4. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 3., 10. A method for manufacturing a substrate having a conductive pattern, wherein the conductive particles in the temporary pattern are substantially not sintered. 5. A method for manufacturing a substrate having the conductive pattern according to any one of 1. to 4., A method for manufacturing a substrate having a conductive pattern, wherein the temporary pattern is substantially uncured. 6. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 5., a step of removing an oxide film, after the embedding step and before or simultaneously with the pressing step, of penetrating a component X capable of removing an oxide film on the surface of the conductive particles into the embedded pattern. 7. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 6., In the pressing step, the embedded pattern is pressed while being heated. 8. 7. A method for manufacturing a substrate having the conductive pattern according to claim 7, A method for manufacturing a substrate provided with a conductive pattern, wherein in the pressing step, the embedded pattern is pressed with a pressure of 1 to 5000 MPa and heated at a temperature of 80 to 400°C. 9. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 8., The method for manufacturing a substrate having a conductive pattern, wherein the conductive composition is in a paste state at room temperature. 10. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 9., The method for producing a substrate having a conductive pattern, wherein the amount of the resin component in the conductive composition is 15 parts by mass or less per 100 parts by mass of the conductive particles. 11. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 10., A method for producing a substrate having a conductive pattern, wherein the conductive composition does not substantially contain a curable component other than the conductive particles. 12. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 11., The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. 50 A method for producing a substrate provided with a conductive pattern, wherein the thickness is 0.5 to 100 μm. 13. A method for producing a conductive substrate according to any one of 1. to 12., In the pressing step, the exposed surface of the embedded pattern is covered with a member, and then the embedded pattern is at least pressed. 14. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 13., The method for producing a substrate having a conductive pattern, wherein the easily peelable substrate is a resin film or a release paper. 15. 14. A method for manufacturing a substrate having a conductive pattern according to claim 14, A method for producing a substrate provided with a conductive pattern, comprising a peeling step of peeling off the easily peelable substrate before the pressing step. 16. A method for manufacturing a substrate provided with the conductive pattern according to any one of 1. to 15., A method for manufacturing a substrate having a conductive pattern, wherein the provisional pattern has a shape adjusted by laser processing. 17. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 16., The height of the provisional pattern is H i and the height of the conductive pattern is H f When H f / H i A method for producing a substrate provided with a conductive pattern, wherein the value of is 0.4 to 0.8. 18. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 17., The height of the provisional pattern is H i When the thickness of the resin-containing layer is T, H i A method for producing a substrate having a conductive pattern, wherein / T is 2 or less. 19. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 18., The method for manufacturing a substrate having a conductive pattern, wherein the substrate is flexible. 20. A method for manufacturing a substrate having a conductive pattern according to any one of 1. to 19., A method for manufacturing a substrate having a conductive pattern, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. twenty one. A method for manufacturing an electronic device, comprising manufacturing an electronic device using a substrate having a conductive pattern obtained by the method for manufacturing a substrate having a conductive pattern according to any one of 1. to 20. twenty two. 21. A method for producing an electronic device according to claim 21, comprising: The method for manufacturing an electronic device, wherein the electronic device is an RF tag. twenty three. A method for producing an electromagnetic wave shielding film, comprising producing an electromagnetic wave shielding film using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to any one of 1. to 20. twenty four. A method for producing a sheet heating element, comprising producing a sheet heating element using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern described in any one of 1. to 20. twenty five. A substrate; a resin-containing layer provided on the surface of the substrate; a temporary pattern comprising conductive particles at least partially embedded in said resin-containing layer; 1. An intermediate structure for the production of a substrate provided with a conductive pattern, comprising: 26. 25. An intermediate structure according to claim 25, an intermediate structure, wherein said conductive particles in the temporary pattern are substantially unsintered; 27. 25. or 26. An intermediate structure according to claim 25, The amount of the resin component in the temporary pattern is 15 parts by mass or less relative to 100 parts by mass of the conductive particles. 28. 25. An intermediate structure according to any one of 25. to 27., an intermediate structure, wherein the temporary pattern does not substantially contain a curable component other than the conductive particles; 29. 25. An intermediate structure according to any one of 25. to 28., The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. 50 The intermediate structure has a particle size of 0.5 to 100 μm. 30. 25. An intermediate structure according to any one of 25. to 29., The height of the provisional pattern is H i When the thickness of the resin-containing layer is T, H i / T is less than or equal to 2, intermediate structure. 31. The intermediate structure according to any one of 25 to 30, The substrate is flexible. 32. An intermediate structure according to any one of 25. to 31., The intermediate structure, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. 33. A substrate; a resin layer provided on the surface of the substrate; a conductive pattern formed by sintering conductive particles, at least a portion of which is embedded in the resin layer; A substrate provided with a conductive pattern. 34. 33. A substrate provided with a conductive pattern according to claim 33, The resin layer is a cured product of a curable resin material, and the substrate is provided with a conductive pattern. 35. A substrate having a conductive pattern according to 33. or 34., The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. 50 A substrate provided with a conductive pattern, wherein the thickness is 0.5 to 100 μm. 36. A substrate provided with the conductive pattern according to any one of 33 to 35, The substrate is flexible and has a conductive pattern. 37. A substrate provided with the conductive pattern according to any one of 33 to 36, The substrate provided with a conductive pattern is at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. [Effects of the Invention]

[0013] According to the present invention, when a conductive pattern is formed using a conductive composition containing conductive particles, a fine circuit pattern and / or a highly accurate circuit pattern can be formed. [Brief explanation of the drawings]

[0014] [Figure 1] 3A to 3C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to the first embodiment. [Figure 2] 3A to 3C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to the first embodiment. [Figure 3] 10A to 10C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to a second embodiment. [Figure 4] 10A to 10C are diagrams illustrating a method for manufacturing a substrate provided with a conductive pattern according to a second embodiment. [Figure 5] 1A and 1B are diagrams for explaining the shape of a conductive pattern formed in an example. [Figure 6] 1 is an enlarged image of a cross section of a substrate provided with a conductive pattern obtained in Example 1. DETAILED DESCRIPTION OF THE INVENTION

[0015] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, similar components are denoted by similar reference numerals and descriptions thereof will be omitted where appropriate. To avoid complexity, (i) when there are multiple identical components in the same drawing, only one of them is given a symbol, and not all of them, or (ii) particularly in Figure 2 and subsequent figures, components similar to those in Figure 1 are not given a symbol again. All drawings are for illustrative purposes only, and the shapes and dimensional ratios of the components in the drawings do not necessarily correspond to the actual products.

[0016] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass."

[0017] In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." In this specification, the term "electronic device" is used to encompass elements, devices, final products, etc. to which electronic engineering technology is applied, such as semiconductor chips, semiconductor elements, printed wiring boards, electric circuit display devices, information and communication terminals, light-emitting diodes, physical batteries, and chemical batteries.

[0018] <Method for manufacturing a substrate with a conductive pattern: Overview> The method for manufacturing a substrate having a conductive pattern of this embodiment includes the steps of: an embedding step of bringing a temporary pattern formed on the surface of an easily peelable substrate using a conductive composition containing conductive particles into contact with a resin-containing layer formed on the surface of a substrate different from the easily peelable substrate, thereby obtaining an embedded pattern in which at least a portion of the temporary pattern is embedded in the resin-containing layer; a pressing step of applying at least pressure to the embedded pattern to obtain a conductive pattern; Includes:

[0019] In this embodiment, at least pressure is applied to the pattern formed by the conductive composition in the pressing step, thereby increasing the conductivity of the embedded pattern and obtaining a conductive pattern. However, if the pattern formed by the conductive composition is simply pressed, there is a concern that the pattern may be deformed, making it impossible to obtain a thin conductive pattern or a highly accurate conductive pattern (close to the intended dimensions and shape). In consideration of this concern, in this embodiment, (i) a temporary pattern is formed on the surface of an easily peelable substrate using a conductive composition containing conductive particles, (ii) at least a portion of the temporary pattern is "embedded" in a resin-containing layer of a substrate on which the resin-containing layer is provided, thereby obtaining an embedded pattern, and (iii) at least pressure is applied to the embedded pattern. In this manner, pressure is applied to the pattern formed using the conductive composition containing conductive particles while at least a portion of the pattern is "embedded" in the resin-containing layer. The presence of the resin-containing layer limits deformation of the pattern when pressure is applied to the pattern, making it easier to obtain a thin conductive pattern or a high-precision conductive pattern (close to the intended dimensions and shape). In other words, the resin-containing layer acts as a "wall" for the temporary pattern embedded in the resin-containing layer, limiting deformation of the temporary pattern.

[0020] By the way, the above "restriction on deformation of the pattern" means that, for example, the height of the provisional pattern is H i The height of the conductive pattern is H f When H f / H i This can be quantitatively expressed by saying that the value of H is preferably 0.4 to 0.8. If the pattern is pressed without "embedding" the pattern as shown in this embodiment, f / H i The value of is expected to be less than 0.4. Provisional pattern height H i Specifically, the height H of the conductive pattern 3B in FIG. 1P2 is f Specifically, this refers to the height (maximum thickness) of pattern 3C in FIG. 2I, which will be shown later.

[0021] Additionally, the conductive pattern obtained tends to be less likely to peel due to the presence of the resin-containing layer and embedding the temporary pattern therein. In particular, peeling of the pattern may be further suppressed by a portion of the resin-containing layer penetrating into the embedded pattern.

[0022] The above is an outline of the method for manufacturing a substrate provided with a conductive pattern according to this embodiment. As more specific embodiments, a first embodiment and a second embodiment will be described below.

[0023] <Method for manufacturing a substrate provided with a conductive pattern: First embodiment (FIGS. 1 and 2)> 1 and 2 are diagrams for explaining a method for manufacturing a substrate having a conductive pattern according to the first embodiment. Hereinafter, the method for manufacturing a substrate having a conductive pattern according to the first embodiment will be described with reference to FIGS. 1 and 2.

[0024] (Formation of temporary patterns on the surface of an easily peelable substrate: Figure 1P1, Figure 1P2) In the first embodiment, a temporary pattern can be provided on the surface of the easily peelable substrate by using a conductive composition containing conductive particles. Specifically, first, as shown in Fig. 1P1, a pattern 3 made of a conductive composition containing conductive particles, typically in the form of a paste containing a solvent, is formed on the surface of an easily peelable substrate 5. Thereafter, by volatilizing the solvent in the pattern 3, a temporary pattern (pattern 3B) can be obtained on the easily peelable substrate 5, as shown in Fig. 1P2.

[0025] The method for forming the pattern 3 is not particularly limited. Various coating and printing techniques can be applied. The pattern 3 may be provided on the entire surface of the easily peelable substrate 5, or on only a portion of the surface of the easily peelable substrate 5. In the former case, the pattern 3 can be formed by coating using a device such as a blade coater, air knife coater, doctor coater, roll coater, bar coater (rod coater), or curtain coater. In the latter case, the pattern 3 can be formed by various printing methods, such as screen printing, gravure printing, letterpress printing, lithographic printing (offset printing), inkjet printing, and transfer printing. By appropriately designing the "pattern" during printing, it is possible to produce a substrate having a pattern structure, such as a conductive film (circuit pattern) that can function as a circuit or a mesh pattern with electromagnetic wave shielding properties. When the pattern 3 is provided on only a portion of the surface of the easily peelable substrate 5, it is preferable that the printing "pattern" be appropriately designed depending on the intended use of the substrate having the final conductive pattern. In order to prevent the pattern 3 from being formed in any location other than the desired location on the easily peelable substrate 5, for example, a film with holes cut out therein may be placed on the easily peelable substrate 5, a conductive composition may be applied or printed on top of it, and then the film may be removed.

[0026] The easily peelable substrate 5 is not particularly limited as long as it can be easily peeled in the peeling step described below, that is, as long as the temporary pattern (pattern 3B) can be easily separated. Specific examples of the easily peelable substrate 5 include resin films. More specifically, examples include resin films with a silicone resin applied to the surface and resin films with a silicone resin kneaded into them. The main material of these resin films is not particularly limited, but in consideration of strength and cost, polyester-based materials are preferred, and polyethylene terephthalate is more preferred. In addition, various films commercially available under names such as "release film" and "peeling film" can also be used as the easily peelable substrate 5. Furthermore, release paper can also be used as the easily releasable substrate 5. Release paper typically refers to laminated paper in which a thin film-like resin is laminated on paper to give it easy releasability. Release paper is sometimes expressed as release paper. As for the release paper, various types of commercially available release paper can be used as appropriate. The easily peelable substrate 5 may be disposable or may be reused.

[0027] The easily peelable substrate 5 may be in the form of a film or sheet as shown in FIG. 1P1 or 1P2, or may be in the form of a roll, for example. For example, a roll whose surface is made of metal or resin, on which a temporary pattern can be formed and from which the temporary pattern can be easily separated, may be used as the easily peelable substrate 5. Use of a roll-shaped easily peelable substrate 5 can be expected to improve the productivity of substrates having conductive patterns.

[0028] The surface of the easily peelable substrate 5 is usually flat. The surface of the easily peelable substrate 5 usually does not have any recesses or protrusions. The easily peelable substrate 5 is usually not an intaglio or relief printing plate.

[0029] When the easily peelable substrate 5 is in the form of a film or sheet, its thickness is not particularly limited, but taking into consideration the handleability and transfer accuracy of the easily peelable substrate 5, it is preferably 10 to 250 μm, more preferably 10 to 100 μm.

[0030] The heating conditions for volatilizing the solvent in pattern 3 to obtain a temporary pattern (pattern 3B) can be, for example, 50 to 150°C for 1 to 60 minutes. However, it is preferable to set the temperature at a level that does not damage the easily peelable substrate 5. Heating can be performed, for example, by applying hot air to pattern 3, or by placing the easily peelable substrate 5 and pattern 3 on a hot plate. As a further example, heating by light is also possible. Specific examples include heating using a far-infrared heating furnace (IR oven) or Adphos NIR (ultra-near infrared), heating with a high-brightness LED, and laser heating.

[0031] The height of the provisional pattern (pattern 3B) is preferably 0.5 to 100 μm, more preferably 5 to 60 μm, and even more preferably 10 to 40 μm. When this height is 0.5 μm or more, the conductivity of the final conductive pattern can be improved. On the other hand, when this height is 100 μm or less, the entire substrate provided with the final conductive pattern can be made thinner. This is preferable, for example, from the viewpoint of miniaturization and weight reduction of electronic devices.

[0032] It is preferable that the conductive particles in the temporary pattern (pattern 3B) are not substantially sintered. Incidentally, in the first embodiment, the conductive particles are usually sintered in the pressing step described below. Furthermore, it is preferable that the temporary pattern (pattern 3B) is substantially uncured. Specifically, even if the conductive composition contains a curable resin, a crosslinking agent, or the like, it is preferable that the curable resin or crosslinking agent in the temporary pattern (pattern 3B) is substantially unreacted before the pressing step. Alternatively, the temporary pattern may not contain a curable resin component such as a curable resin or a crosslinking agent in the first place.

[0033] The conductive composition for forming the temporary pattern (pattern 3B) is preferably in a paste state at room temperature (for example, 25° C.) from the viewpoints of ease of pattern formation and shape retention. From the viewpoint of further increasing the conductivity of the finally obtained conductive pattern, the amount of the resin component in the conductive composition is preferably 15 parts by mass or less, i.e., 0 to 15 parts by mass, more preferably 0 to 10 parts by mass, and even more preferably 0 to 5 parts by mass, per 100 parts by mass of the conductive particles. The remaining component in the conductive composition is preferably conductive particles. If there is no problem with pattern formability, the conductive composition may not contain a resin component. From the viewpoint of improving conductivity, it is preferable that the conductive composition does not substantially contain a curable component other than the conductive particles. On the other hand, from the viewpoint of improving the pattern formability, i.e., the printability and coatability of the conductive composition, the conductive composition may contain a resin component such as a resin or a binder. From the viewpoint of fully obtaining the effect of using the resin component, the amount of the resin component in the conductive composition is preferably 1 to 15 parts by mass, more preferably 1 to 10 parts by mass, and even more preferably 1 to 5 parts by mass, per 100 parts by mass of the conductive particles. The remaining component in the conductive composition is preferably the conductive particles. Specific examples of resin components that can be contained in the conductive composition include polyvinylpyrrolidone, polyester, epoxy resin, phenoxy resin, (meth)acrylic resin, polyvinyl acetal, cellulose resin (e.g., ethyl cellulose), and phenol resin.

[0034] The conductive composition may contain a solvent. When the conductive composition contains a solvent, the conductive composition can be easily applied or printed onto a substrate. The solvent typically contains an organic solvent. The solvent may contain water as long as the conductive particles can be appropriately dispersed in the solvent. The type of solvent is not particularly limited, as long as it does not substantially alter the components in the conductive composition. The amount of the solvent used may be adjusted as appropriate depending on the coating / printing method of the conductive composition, etc. The amount of the solvent used is, for example, 3 to 30 mass %, preferably 5 to 25 mass %, and more preferably 10 to 20 mass % of the total conductive composition.

[0035] The conductive particles contained in the conductive composition preferably contain at least one element selected from the group consisting of silver and copper, from the viewpoints of availability and good conductivity. Specifically, the conductive particles preferably include at least one selected from the group consisting of particles primarily composed of silver and particles primarily composed of copper. Here, the expression "primarily composed of silver" means that the ratio of silver element to all constituent elements in the particles is preferably 50 mol% or more, more preferably 75 mol% or more, even more preferably 90 mol% or more, and particularly preferably 95 mol% or more. Similarly, the expression "primarily composed of copper" means that the ratio of copper element to all constituent elements in the particles is preferably 50 mol% or more, more preferably 75 mol% or more, even more preferably 90 mol% or more, and particularly preferably 95 mol% or more. Just to be clear, the conductive particles may contain elements other than silver and copper as long as the desired conductivity is obtained. Examples of elements other than silver and copper include gold, aluminum, platinum, palladium, iridium, tungsten, nickel, tantalum, lead, and zinc. Of course, the conductive particles do not have to be substantially free of elements other than silver and copper. "Substantially free" means that the conductive particles may unavoidably contain elements other than silver and copper as impurities, but they do not intentionally or artificially contain elements other than silver and copper.

[0036] The conductive particles may contain only one element, or may contain two or more elements. For example, conductive particles in which the surface of copper particles is silver-plated (silver-coated copper particles) are preferably used in this embodiment. Silver-coated copper particles are particles whose main component is copper, and the surface of the copper particles is plated with silver in an amount of, for example, up to 35 mass% based on the total mass of the particles.

[0037] The particle diameter D at which the cumulative frequency reaches 50% in the volume-based cumulative particle diameter distribution curve obtained when the particle diameter of conductive particles is measured by the laser diffraction scattering method. 50 is preferably 0.5 to 100 μm, more preferably 0.6 to 50 μm, even more preferably 0.7 to 30 μm, and particularly preferably 0.7 to 20 μm. D 50By making the ρ appropriately large, the number of grain boundaries between conductive particles per unit volume can be reduced, which is thought to lead to a smaller specific resistance of the resulting conductive pattern. D 50 It is believed that by not making the size too large, the "gaps" between the conductive particles are reduced, which leads to a smaller specific resistance of the resulting conductive pattern. By the way, D 50 By setting D to an appropriate value (on the order of μm), it is possible that a part of the resin-containing layer 2 penetrates into the gaps between the conductive particles in the temporary pattern (pattern 3B) in the filling step described later. This is thought to lead to improved adhesion of the finally obtained conductive pattern. 50 It is believed that an appropriate value of ρ also contributes to further improving adhesion. With nano-sized conductive particles, it is unlikely that part of the resin-containing layer 2 will penetrate into the gaps between the conductive particles.

[0038] Conductive particles can be purchased from, for example, DOWA Electronics Co., Ltd., Fukuda Metal Foil and Powder Co., Ltd. Two or more different conductive particles may be mixed together for the purpose of adjusting or optimizing the particle size distribution or for other purposes.

[0039] From the viewpoint of further reducing the resistivity of the final conductive pattern, it is preferable that the proportion of conductive particles in the conductive composition is high. Specifically, the proportion of conductive particles in the total non-volatile components of the conductive composition is preferably 95% by mass or more, more preferably 97% by mass or more, even more preferably 98% by mass or more, and particularly preferably 99% by mass or more. In other words, from the viewpoint of further reducing the resistivity of the resulting conductive pattern, it is preferable that the conductive composition is substantially free of resin components such as resins and binders. Here, "substantially free of resin components" means that the composition does not contain any resin components at all, or that the amount of resin components contained is so small that the expected effect of using the resin components cannot be obtained (for example, 1% by mass or less, specifically 0.5% by mass or less, of the total non-volatile components of the conductive composition). The conductive composition does not need to contain resins or binders as long as the desired conductive pattern can be obtained.

[0040] The conductive composition may or may not contain various additive components found in conventional ink compositions and conductive pastes.

[0041] (Formation of a resin-containing layer on a substrate surface: Figures 1A, 1B, and 1C) 1A, 1B, and 1C show an example of a process for providing a resin-containing layer 2 on the surface of a substrate 1. Here, the process is shown in which a resin-containing layer 2 that has been formed into a film shape in advance is attached to the surface of the substrate 1 to provide the resin-containing layer 2 on the surface of the substrate 1. Just to be clear, the resin-containing layer 2 may be provided by a method other than laminating a film. For example, the resin-containing layer 2 may be provided by applying or printing a resin-containing coating liquid onto the surface of the substrate 1. Furthermore, in order to adjust and optimize the thickness of the resin-containing layer 2, the resin-containing layer 2 may be provided by laminating two or more films or by applying or printing two or more resin-containing coating liquids.

[0042] 1A, a resin-containing layer 2 having release sheets 6 attached to both sides thereof is prepared, and one of the release sheets 6 attached to both sides thereof is peeled off. The specific method for peeling off the release sheet 6 is not particularly limited.

[0043] 1B, one side of the resin-containing layer 2 exposed by peeling off the release sheet 6 is brought into contact with the surface of the substrate 1. Then, the resin-containing layer 2 is attached to the surface of the substrate 1. At this time, it is preferable to increase the adhesion (adhesion strength) between the substrate 1 and the resin-containing layer 2 by sandwiching the substrate 1, the resin-containing layer, and the release sheet 6 between, for example, two opposing rolls 10A and 10B and transporting them between the two rolls. Incidentally, the adhesion (adhesion strength) between the substrate 1 and the resin-containing layer 2 may be increased by a method other than using two opposing rolls. As one example, the laminate of the substrate 1, the resin-containing layer 2, and the release sheet 6 may be sandwiched between two flat plates and pressed (flat press). As another example, the laminate of the substrate 1, the resin-containing layer 2, and the release sheet 6 may be placed on a flat plate, and a roll may be applied from above and rolled. As yet another example, a method may be considered in which a roll is applied from below the substrate 1, the resin-containing layer 2, and the release sheet 6 and rolled.

[0044] 1B, the substrate 1 having the resin-containing layer 2 provided on the surface thereof can be obtained as shown in Fig. 1C. The specific method for peeling off the release sheet 6 here is not particularly limited.

[0045] The resin-containing layer 2 is preferably curable. Specifically, the resin-containing layer 2 can be cured by an external stimulus such as light or heat, which causes a curing reaction such as a crosslinking reaction to proceed. The "light" here is preferably ultraviolet light. The resin-containing layer 2 may be one that hardens in response to light only, one that hardens in response to heat only, or one that hardens in response to both light and heat.

[0046] The resin-containing layer 2 can be formed, for example, by attaching a curable film-like resin material to one surface of the substrate 1. For example, commercially available OCA (Optically Clear Adhesive) films, die attach films, etc. can be preferably used to form the resin-containing layer 2. Of course, instead of using a film-like resin material, the resin-containing layer 2 may be provided on one side of the substrate 1 by coating or printing. For example, various adhesives (preferably photocurable and / or thermosetting) known for use in the manufacture of electronic devices can be preferably used to form the resin-containing layer 2. In terms of chemical composition, the resin-containing layer 2 is preferably made of a (meth)acrylic resin-based curable material or an epoxy resin-based curable material.

[0047] The thickness of the resin-containing layer 2 is not particularly limited, but is usually 3 to 50 μm, preferably 10 to 30 μm, from the viewpoint of burying the temporary pattern (pattern 3B) sufficiently deeply and reducing the influence of curing shrinkage and the like. In relation to the height of the provisional pattern (pattern 3B), from the viewpoint of embedding the provisional pattern (pattern 3B) appropriately, the height of the provisional pattern (pattern 3B) is set to H i When the thickness of the resin-containing layer is T, H i / T is preferably 2 or less, more preferably 1 to 2, and even more preferably 1 to 1.5.

[0048] The substrate 1 is usually in the form of a film, sheet or plate, and from the viewpoint of industrial productivity, the shape of the substrate 1 is preferably any of these. The substrate 1 is preferably flexible. By employing a flexible substrate 1, a flexible printed circuit (FPC) can be manufactured. By using a flexible substrate 1, pressing using a "roll" becomes easier in the pressing step described below. This is preferable from the viewpoint of mass production. Just to be clear, the substrate 1 may be a rigid substrate that does not have flexibility.

[0049] Considering cost and end use, the substrate 1 is preferably at least one selected from the group consisting of polyesters such as PET (polyethylene terephthalate) and PEN (polyethylene naphthalate), polyolefins such as polyethylene and polypropylene, polycarbonate, polyimide, and paper. Here, the paper may be coated paper (paper whose surface is coated with a coating agent) or ordinary uncoated paper. Furthermore, the substrate 1 is not limited to PET and other materials, and general resin films can also be used. Furthermore, the substrate 1 may be transparent or opaque. Examples of opaque resin films include foamed resin films such as foamed PET film and foamed resin sheets. In the first embodiment, a conductive pattern with sufficiently low resistivity can be obtained without heating or by heating at a relatively low temperature in the pressing step described below. Therefore, a substrate 1 with low heat resistance, such as polyester, polyolefin, polycarbonate, or paper, can also be suitably used as the substrate. Furthermore, when a substrate 1 with high heat resistance, such as polyimide, is used, the resistivity of the finally obtained conductive pattern can be further reduced by performing high-temperature heating in the pressing step.

[0050] The thickness of the substrate 1 is not particularly limited and can be appropriately set depending on the final use (electronic device, RF tag, electromagnetic wave shielding film, planar heating element, etc.) and various other circumstances, as described below. The thickness of the substrate 1 is typically 10 to 250 μm, and preferably 30 to 100 μm. However, from the viewpoint of suppressing curling due to shrinkage when the resin-containing layer 2 is cured, it is preferable that the substrate 1 be somewhat thick. Specifically, the thickness of the substrate 1 is preferably 100 to 250 μm, and more preferably 100 to 150 μm. The substrate 1 may have a single layer structure or a laminated structure of two or more layers.

[0051] (Embedding step: Figure 2D) In the embedding step, the temporary pattern (pattern 3B) provided on the surface of the easily peelable substrate 5, obtained, for example, as described above, is brought into contact with the resin-containing layer 2 provided on the surface of the substrate 1. Then, an embedded pattern (pattern 3B) is obtained in which at least a part of the temporary pattern (pattern 3B) is embedded in the resin-containing layer 2. 2D, the entire temporary pattern (pattern 3B) is embedded in the resin-containing layer 2. That is, the distance from the interface between the substrate 1 and the resin-containing layer 2 to the furthest part of the pattern 3B can be equal to or less than the maximum thickness of the resin-containing layer 2.

[0052] In the embedding step, pressing is preferably performed to sufficiently embed the temporary pattern (pattern 3B) in the resin-containing layer 2. For example, as shown in FIG. 2D, it is preferable to embed the temporary pattern (pattern 3B) in the resin-containing layer 2 by sandwiching the laminate of the substrate 1, the resin-containing layer 2, the temporary pattern (pattern 3B), and the easily peelable substrate 5 between two opposing rolls 12A and 12B and transporting the laminate between the two rolls. Of course, the temporary pattern (pattern 3B) may also be sufficiently embedded in the resin-containing layer 2 by a method other than using two opposing rolls. As an example, the laminate of the substrate 1, the resin-containing layer 2, the temporary pattern (pattern 3B), and the easily peelable substrate 5 may be sandwiched between two flat plates and pressed (flat press). As another example, the laminate of the substrate 1, the resin-containing layer 2, the temporary pattern (pattern 3B), and the easily peelable substrate 5 may be placed on a flat plate, and a roll may be placed on top of the laminate and rolled. As yet another example, a method may be considered in which a roll is applied from below to the laminate of the substrate 1, the resin-containing layer 2, the temporary pattern (pattern 3B), and the easily peelable substrate 5, and the roll is rolled. The pressure of the pressing is preferably 0.5 to 3 MPa, more preferably 0.5 to 2 MPa, in consideration of sufficient embedding of the provisional pattern and suppression of deformation of the provisional pattern.

[0053] In the embedding step, the resin-containing layer 2 is preferably softened by heat. This allows the temporary pattern (pattern 3B) to be embedded in the resin-containing layer 2 more smoothly while further suppressing changes in its shape and dimensions. This is thought to enable the formation of thinner / higher-precision circuit patterns. The resin-containing layer 2 can be softened by selecting an appropriate material for forming the resin-containing layer 2 and applying appropriate heating in the embedding step. Additionally, the resin-containing layer 2 may be softened by preheating before the embedding step. In other words, the resin-containing layer 2 may be softened by heat at the stage of FIG. 1B or FIG. 1C. Incidentally, according to the knowledge of the present inventors, some commercially available OCA films and die attach films become softer than room temperature when heated to about 50 to 100° C., and undergo a curing reaction and harden when heated to above 100° C. A resin-containing layer 2 having such properties is particularly preferable. Incidentally, whether the resin-containing layer 2 softens due to heating in the embedding process can be determined, for example, by referring to the results obtained by measuring the viscoelastic properties of the material (film, etc.) that forms the resin-containing layer 2 while raising the temperature.

[0054] When the resin-containing layer 2 has the property of being softened by heating, the heating conditions for softening the resin-containing layer 2 may be appropriately set based on the chemical structure and properties of the material constituting the resin-containing layer 2. The heating temperature for softening the resin-containing layer 2 may be 60 to 120°C, specifically 70 to 100°C. Just to be clear, the resin-containing layer 2 does not have to have the property of being softened by heating. For example, if at least a part of the temporary pattern (pattern 3B) is embedded in the resin-containing layer 2 at room temperature (unheated), heating in the embedding step is not necessary.

[0055] (Curing process: Figure 2E) If the resin-containing layer 2 is curable, it is preferable to carry out a curing step between the above-mentioned embedding step and the pressing step described below to cure or semi-cure the resin-containing layer 2 to form the cured resin layer 2B. 2, the curing step is shown between the embedding step (D) and the peeling step (F). However, if the curing step is performed, it is sufficient that the curing step is performed between the embedding step (D) and immediately before the pressing step (H) described below.

[0056] When the resin-containing layer 2 is curable, the resin-containing layer 2 remains uncured (i.e., relatively soft) until the embedding process is completed, and therefore the temporary pattern (pattern 3B) can be smoothly embedded in the resin-containing layer 2 while suppressing changes in its shape and dimensions, thereby forming an embedded pattern (pattern 3B). The resin-containing layer 2 is then cured or semi-cured (harder than when uncured) just before the pressing step, and becomes the cured resin layer 2B. This effectively limits deformation of the pattern 3B when pressure is applied to the pattern 3B during the pressing step. In other words, the cured resin layer 2B functions as a "wall" that effectively suppresses deformation of the pattern 3B. This makes it easier to obtain thinner conductive patterns and conductive patterns with higher precision (closer to the intended dimensions and shape). From the viewpoint of suppressing deformation of the pattern 3B during the pressing step, it is preferable that the resin-containing layer 2 be cured (substantially completely cured). In other words, it is preferable that the cured resin layer 2B is a substantially completely cured product of the curable resin material. Here, "substantially completely cured product" means that it does not contain any reactive groups other than reactive groups (crosslinkable groups, polymerizable groups, etc.) that inevitably remain even when a sufficient amount of external stimulus (heat, light, etc.) is applied to the curable resin material. However, as long as the cured resin layer 2B functions as a "wall" that suppresses deformation of the pattern 3B during the pressing step, the cured resin layer 2B may be in a semi-cured state.

[0057] In addition, when the resin-containing layer 2 is curable, it is considered that the resin-containing layer 2 is uncured until the completion of the embedding step, which makes it easier for the resin component to penetrate into some of the voids between the conductive particles that make up the pattern 3B. It is considered that the resin component penetrates into some of the voids between the conductive particles and then hardens, further improving the adhesion between the substrate and the pattern.

[0058] The specific method for curing or semi-curing the resin-containing layer 2 to form the cured resin layer 2B is not particularly limited. If the resin-containing layer 2 is thermosetting, the resin-containing layer 2 may be heated. If the resin-containing layer 2 is photocurable, the resin-containing layer 2 may be irradiated with light (typically ultraviolet light). If the resin-containing layer 2 is photocurable and the substrate 1 is light-transmitting, the resin-containing layer 2 can be cured or semi-cured by irradiating it with light from the substrate 1 side. Of course, light may be irradiated from the resin-containing layer 2 side, but in this case, it may be necessary to consider the fact that part of the light is blocked by the pattern 3B, and to increase the amount of light irradiated or to irradiate the light at an angle so that the light reaches below the pattern 3B. When the resin-containing layer 2 is thermosetting, the heating temperature and time may be adjusted appropriately taking into consideration the ease of thermosetting of the resin-containing layer 2 and the heat resistance of the substrate 1. When the resin-containing layer 2 is thermosetting, the heating temperature and time are, for example, 80 to 150°C, 1 to 30 minutes, specifically 100 to 120°C, and 5 to 20 minutes. Of course, the heating temperature and time do not have to be within these numerical ranges. When the resin-containing layer 2 is photocurable, the amount of light irradiation is, for example, an integrated amount of UVA light of 100 to 6000 mJ / cm 2 2 Specifically, 200 to 3000 mJ / cm 2 Of course, the amount of light irradiation does not have to be within this range.

[0059] (Peeling process: Figure 2F) Before the pressing step described below, a peeling step is preferably carried out in which the easily peelable substrate 5 is peeled off from the pattern 3B. Just to be clear, in FIG. 2, the peeling step is depicted immediately before the oxide film removing step (G), but the peeling step may be performed, for example, between the embedding step (D) and the curing step (E) as long as a substrate having a desired conductive pattern is finally obtained. As long as the easily peelable substrate 5 can be appropriately peeled from the pattern 3B, the specific peeling method and conditions are not particularly limited.

[0060] (Oxide film removal process: Figure 2G) In the first embodiment, it is preferable to include an oxide film removal step in which a component X capable of removing an oxide film on the surface of the conductive particles in the embedded pattern (pattern 3B) is penetrated into the embedded pattern (pattern 3B) after the embedding step and before or simultaneously with the pressing step described below. By carrying out the oxide film removal step, sintering of the conductive particles tends to proceed more easily in the pressing step described below, and the conductivity of the finally obtained conductive pattern tends to be further increased.

[0061] It is preferable that component X penetrates into the embedded pattern (pattern 3B) through the gaps between the conductive particles that make up the embedded pattern (pattern 3B). This tends to further increase the conductivity of the finally obtained conductive pattern. For this reason, in the oxide film removal step, the embedded pattern (pattern 3B) in contact with component X may be pressed to promote penetration of component X into the embedded pattern (pattern 3B). In this case, the oxide film removal step and the pressing step described below may be performed simultaneously. Of course, the oxide film removing step may be performed as a separate step from the pressing step.

[0062] The oxide film removal step can be carried out by contacting, and preferably penetrating, a liquid 7 containing component X capable of removing oxide films on the surfaces of conductive particles into the embedded pattern (pattern 3B), as shown in FIG. 2G. While FIG. 2G shows an embodiment in which the liquid 7 containing component X is dropped or sprayed onto the embedded pattern (pattern 3B), the embedded pattern (pattern 3B) may also be immersed in the liquid containing component X. Alternatively, the liquid 7 containing component X may be brought into contact with the embedded pattern (pattern 3B) using an inkjet method or a dispenser method. The liquid 7 containing component X is preferably water in which component X is dissolved or dispersed. The use of water is preferable from the viewpoints of reducing the environmental load and process safety (non-flammability). Of course, an organic solvent in which component X is dissolved or dispersed can also be used. Instead of using the liquid 7 containing the component X, the oxide film removal step may be carried out by bringing the component X in a gaseous state into contact with the embedded pattern (pattern 3B). It is also possible to bring a sheet containing component X into contact with the embedded pattern (pattern 3B) and, preferably, apply pressure to cause component X to penetrate into the embedded pattern (pattern 3B). Specific examples of the sheet include paper or nonwoven fabric containing component X, and resin sheets having component X coated or printed on their surfaces. Additionally, the method for bringing component X into contact with and permeating the embedded pattern (pattern 3B) is not particularly limited.

[0063] Component X is not particularly limited as long as it is capable of removing the oxide film on the surface of the conductive particles. In this specification, "removal" of an oxide film includes not only the removal of the oxide itself present on the surface of a conductive particle, but also the case where the oxide undergoes a chemical change such as reduction, thereby returning the oxide to a non-oxide.

[0064] According to the findings of the present inventors, it is preferable to include at least one selected from the group consisting of organic acids, phosphorus oxoacids, and hydrazine or its derivatives, which are particularly suitable when the conductive particles include copper or silver.

[0065] Examples of organic acids include carboxylic acids such as citric acid, formic acid, acetic acid, malonic acid, malic acid, tartaric acid, ascorbic acid, succinic acid, fumaric acid, and propionic acid. Specific examples of phosphorus oxoacids include phosphinic acid, phosphonic acid, phosphorous acid, phosphoric acid, diphosphoric acid, triphosphoric acid, and metatriphosphoric acid. Of these, phosphinic acid is particularly preferred. Examples of hydrazine or its derivatives include hydrazine itself; hydrazine salts such as hydrazine monohydrochloride, hydrazine dihydrochloride, hydrazine monohydrobromide, and hydrazine sulfate; and other compounds having an -NH-NH2 structure.

[0066] Additionally, from the viewpoint of removing an oxide film, a compound having a small pKa in water can be used as component X. Specifically, a compound having a pKa in water of -5.0 to 5.0 is preferred as component X, and a compound having a pKa of -4.0 to 4.5 is more preferred as component X. Incidentally, when component X is a polybasic acid, it is preferred that the smallest pKa among the multiple pKas is within the above range. Considering only the small pKa and the resulting ability to remove oxide films, it is conceivable to use an inorganic acid such as hydrochloric acid, nitric acid, or sulfuric acid as component X. However, taking into consideration the inconvenience that may occur if the acid remains in pattern 3B, an organic acid is preferred as component X. The pKa value used here can be a value at room temperature (e.g., 25°C). However, from the viewpoint of the removability of the oxide film in the actual process, it can be said that it is preferable to use a pKa value at the temperature in the penetration step or conductive film formation step.

[0067] Additionally, any compound capable of returning an oxide film to a non-oxidized state by a reduction reaction can also be used as component X. For example, a compound having an aldehyde group can be used as component X because it may be able to reduce an oxide.

[0068] Furthermore, compounds that have a small pKa in water and can return an oxidized film to a non-oxidized state through a reduction reaction are also preferably used as component X. An example of such a compound is formic acid. Formic acid has the advantage that it is easily volatile and therefore does not easily remain in the pattern.

[0069] In addition to the above, examples of component X include pyrogallol, phenidone, hydroquinone, and orthoaminophenol, which are known to function as reducing agents in the field of silver halide photography. If a conductive pattern having a lower resistivity can be obtained by infiltrating a certain compound A into pattern 3B compared to a conductive pattern without infiltrating the compound A, then the compound A can be used as component X.

[0070] When a liquid in which component X is dissolved or dispersed is brought into contact with pattern 3B, the concentration of component X in the liquid may be adjusted as appropriate. The concentration may be adjusted from the viewpoints of allowing a sufficient amount of component X to penetrate into pattern 3B and reducing the amount of residual component X to suppress corrosion or deterioration of the conductive pattern. The concentration of component X in the liquid is, for example, 0.05 to 50 mol / L, preferably 0.1 to 40 mol / L, more preferably 0.1 to 30 mol / L, even more preferably 0.1 to 10 mol / L, and particularly preferably 0.15 to 5.0 mol / L. Of course, a liquid containing component X at a concentration lower than the concentrations shown here may be used, or a liquid containing component X at a concentration higher than the concentrations shown here (for example, saturation concentration) may be used.

[0071] (Pressing process: Figure 2H) In the pressing step, at least pressure is applied to the embedded pattern (pattern 3B). This increases the conductivity of the embedded pattern (pattern 3B) to obtain the conductive pattern 3C. Preferably, the pressing step sinters the conductive particles in the embedded pattern (pattern 3B).

[0072] As shown in FIG. 2H, the pressure is preferably applied by covering the exposed surface of the embedded pattern (pattern 3B) with member 9 and then at least pressurizing the embedded pattern (pattern 3B). As an example, the pressure can be applied by sandwiching a laminate of the substrate 1, cured resin layer 2B, embedded pattern (pattern 3B), and member 9 between two opposing rolls 14A and 14B and transporting the laminate between the two rolls. Member 9 is preferably a film-like material. 2H, the liquid 7 containing component X, which can remove the oxide film on the surface of the conductive particles as described in FIG. 2G, is present above the embedded pattern (pattern 3B). In this case, it is thought that component X penetrates into the embedded pattern (pattern 3B) by applying pressure, removing the oxide film from the conductive particles while simultaneously sintering the conductive particles. In other words, FIG. 2H can be said to represent an embodiment in which the oxide film removal step and the pressing step are performed simultaneously.

[0073] There are several advantages to using the member 9 when applying pressure. Examples of the advantages include the following: Damage to the roll 14A can be suppressed. In addition, it may be possible to suppress the embedded pattern (pattern 3B) from peeling off partially or entirely and adhering to the roll 14A. Direct contact of the roll 14A with the embedded pattern (pattern 3B) is avoided, making it easier to prevent unintended deformation or collapse of the embedded pattern (pattern 3B). The member 9 functions as a "buffer," making it easier to apply pressure uniformly to the embedded pattern (pattern 3B). This leads to, for example, an improvement in the yield of the substrate having the final conductive pattern. Furthermore, when the oxide film removal step and the pressing step are performed simultaneously, applying pressure uniformly to the embedded pattern (pattern 3B) is also preferable because it leads to the component X penetrating uniformly into the embedded pattern (pattern 3B).

[0074] From one viewpoint, the material of the member 9 can be the same as that of the base material 1. That is, the member 9 can be preferably a polyester film such as a PET film. From another perspective, in order to prevent peeling or damage to the embedded pattern (pattern 3B), an easily peelable film or release paper can be preferably used as the member 9. A specific example of the easily peelable film or release paper is the easily peelable substrate 5 mentioned in FIG. From another perspective, the member 9 may be made of a non-resin material such as aluminum foil.

[0075] On the other hand, in order to simplify the manufacturing process and reduce waste by reducing the amount of process materials, pressurization may be performed without using the member 9. Furthermore, when the member 9 is used, it may be used only once or may be used repeatedly.

[0076] FIG. 2H shows an embodiment in which the embedded pattern (pattern 3B) is pressed by two opposing rolls 14A and 14B, but it goes without saying that the embedded pattern (pattern 3B) may be pressed by other methods. As one example, the laminate of the substrate 1, cured resin layer 2B, embedded pattern (pattern 3B), and component 9 may be sandwiched between two flat plates and pressed (flat press). As another example, the laminate of the substrate 1, cured resin layer 2B, embedded pattern (pattern 3B), and component 9 may be placed on a flat plate, and a roll may be applied from above to pressurize the embedded pattern (pattern 3B) while rolling. As yet another example, a roll may be applied from below to pressurize the embedded pattern (pattern 3B) while rolling the roll.

[0077] In the pressing step, it is preferable to apply pressure to the embedded pattern (pattern 3B) while heating it, which tends to improve the conductivity of the conductive pattern 3C. Preferably, the embedding pattern (pattern 3B) is pressed at a pressure of 1 to 5000 MPa and heated at a temperature of 80 to 400°C. More preferably, the embedding pattern (pattern 3B) is pressed at a pressure of 30 to 1000 MPa and heated at a temperature of 80 to 200°C. Even more preferably, the embedding pattern (pattern 3B) is pressed at a pressure of 50 to 300 MPa and heated at a temperature of 80 to 150°C. Incidentally, when the oxide film removal step and the pressing step are performed simultaneously, the heating temperature is preferably set in consideration of the volatilization or evaporation of liquid 7 and component X. The lower limit of the temperature, "80°C," described above is a value that takes into consideration the moderate rate of evaporation when liquid 7 is a mixture of water and a low-boiling point alcohol, etc. When the pressing step is performed using two opposing rolls 14A and 14B as shown in FIG. 2H, it is preferable to use rolls with built-in heaters that can adjust the temperature.

[0078] (Other optional steps: Figure 2I, etc.) The method for manufacturing a substrate provided with a conductive pattern according to this embodiment may include steps other than the steps described above. For example, if the member 9 is used in the pressing step, the member 9 is removed after the pressing step is completed (FIG. 2I). As another example, after the pressing step, a removal step may be performed to remove component X remaining on the surface or inside the obtained conductive pattern. Specific examples include a step of immersing the substrate provided with the obtained conductive pattern in a liquid (water or an organic solvent) capable of dissolving or dispersing component X, or a step of pouring a liquid (water or an organic solvent) onto the surface of the conductive pattern to wash away the remaining component X. Another possible step is to vaporize and remove the remaining component X by heating the substrate provided with the obtained conductive pattern at a temperature that does not damage the substrate 1.

[0079] <Method for manufacturing a substrate provided with a conductive pattern: Second embodiment> 3 and 4 are diagrams for explaining a method for manufacturing a substrate provided with a conductive pattern according to the second embodiment. The method for manufacturing a substrate having a conductive pattern according to the second embodiment differs from the method for manufacturing a substrate having a conductive pattern according to the first embodiment in terms of the method for forming a temporary pattern on the surface of the easily peelable substrate. The following will focus on this difference.

[0080] In the second embodiment, as shown in FIGS. 3P1, 3P2 and 3P3, a pattern 3 is formed on the surface of the easily peelable substrate 5, and then a pattern 3B (temporary pattern) can be formed.

[0081] Specific embodiments of the pattern 3 and the easily peelable substrate 5 in FIG. 3P1 can be similar to specific embodiments of the pattern 3 and the easily peelable substrate 5 in FIG. 1P1.

[0082] The second embodiment differs from the first embodiment in particular in the portion P2 of FIG. 3. P2 of FIG. 3 shows that the shape and width of pattern 3 are adjusted by irradiating laser light 20 onto pattern 3. It can be difficult to adjust the shape and width of pattern 3 using a conventional printing method. In particular, it is difficult to form a conductive pattern with a small line width or a pattern with a rectangular cross-sectional shape using conventional printing methods alone. Therefore, an improvement can be considered in which pattern 3 is laser-processed to obtain a pattern 3 with an adjusted shape, or a pattern 3B (temporary pattern) with an adjusted shape. In Figures 3P2 and 3P3, first, the shape and width of pattern 3 are adjusted by irradiating laser light 20 onto pattern 3, and then pattern 3 whose shape and width have been adjusted is heated to volatilize the solvent, thereby obtaining pattern 3B (provisional pattern). However, the order may be reversed. That is, first, pattern 3 is formed as shown in Figure 3P1, then the solvent in pattern 3 is volatilized to form pattern 3B, and then laser light 20 is irradiated onto pattern 3B to adjust the shape of pattern 3B.

[0083] As already mentioned, in the method for manufacturing a conductive pattern of this embodiment, the presence of the resin-containing layer 2 (or the cured resin layer 2B) limits deformation of the pattern 3B when pressure is applied to the pattern 3B. Therefore, even if a pressing step is performed, the shape of the pattern 3B (temporary pattern) whose shape has been adjusted by laser processing is likely to be reflected in the shape of the final conductive pattern. In other words, by embedding the pattern 3B (temporary pattern) whose shape has been adjusted by laser processing into the resin-containing layer 2, it is expected that a thinner circuit pattern or a circuit pattern with higher precision can be formed.

[0084] There are no particular limitations on the wavelength of the laser light 20 or the light source that generates the laser light 20. Any laser light can be used as the laser light 20 as long as it can adjust the shape of the pattern 3 or pattern 3B (temporary pattern). Preferred lasers include UV lasers and near-infrared lasers.

[0085] As described above, the method for manufacturing a substrate having a conductive pattern of the second embodiment differs from the method for manufacturing a substrate having a conductive pattern of the first embodiment in terms of the method for forming a temporary pattern on the surface of the easily peelable substrate. However, "except" for the method of forming a temporary pattern on the surface of an easily peelable substrate, the method of manufacturing a substrate having a conductive pattern of the second embodiment can be the same as the method of manufacturing a substrate having a conductive pattern of the first embodiment. Figures 3A, 3B, and 3C can be the same as Figures 1A, 1B, and 1C, respectively. Figures 2 and 4 can be the same except for the shapes of patterns 3B and 3C. Therefore, explanations of figures other than Figures 3P1 to 3P3 will be omitted.

[0086] <Intermediate structure for manufacturing a substrate with a conductive pattern> The structure as shown in FIG. 2D or FIG. 4D (excluding rolls 12A and 12B) may be useful as an "intermediate structure" for manufacturing a substrate having a conductive pattern. As an example, the structure as shown in FIG. 2D or FIG. 4D (excluding rolls 12A and 12B) may be manufactured in one location, and then the structure may be moved to another location for subsequent processing. As another example, the structure as shown in FIG. 2D or FIG. 4D (excluding rolls 12A and 12B) may be manufactured in large quantities, and then subsequent processing may be performed according to the demand for the final product. Some of the physical characteristics of this intermediate structure are summarized below.

[0087] An intermediate structure for manufacturing a substrate having a conductive pattern includes (i) a substrate 1, (ii) a resin-containing layer 2 provided on the surface of the substrate 1, and (iii) a temporary pattern (pattern 3B) containing conductive particles, partially or entirely embedded in the resin-containing layer 2. While an easily peelable substrate 5 is also depicted in FIG. 2D or FIG. 4D, the intermediate structure may or may not include the easily peelable substrate 5. The inclusion of the easily peelable substrate 5 is considered preferable, for example, from the viewpoint of suppressing deterioration of the temporary pattern (pattern 3B). On the other hand, from the viewpoint of simplifying the manufacturing process of a substrate having a conductive pattern using the intermediate structure, it is preferable not to include the easily peelable substrate 5. Preferably, the conductive particles in the temporary pattern (pattern 3B) are substantially not sintered. The amount of the resin component in the temporary pattern (pattern 3B) is preferably 15 parts by mass or less, i.e., 0 to 15 parts by mass, more preferably 0 to 10 parts by mass, and even more preferably 0 to 5 parts by mass, per 100 parts by mass of the conductive particles. The remaining component in the conductive composition is preferably the conductive particles. It is preferable that the temporary pattern (pattern 3B) does not substantially contain a curable component other than the conductive particles. The particle diameter D at which the cumulative frequency reaches 50% in the volume-based cumulative particle diameter distribution curve obtained when the particle diameters of the conductive particles in the provisional pattern (Pattern 3B) are measured by the laser diffraction scattering method. 50 is preferably 0.5 to 100 μm, more preferably 5 to 60 μm, and even more preferably 10 to 40 μm. For details of the conductive particles, see the explanation in the section (Formation of a temporary pattern on the surface of an easily peelable substrate: FIGS. 1P1 and 1P2) of the first embodiment. The substrate 1 is preferably flexible. The substrate 1 is preferably at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. For details of the substrate 1, see the description in the section (Formation of a resin-containing layer on the substrate surface: Figures 1A, 1B, and 1C) of the first embodiment. The height of the provisional pattern (pattern 3B) is Hi and the thickness of the resin-containing layer 2 is T, H i / T is preferably 2 or less, more preferably 1 to 2, and even more preferably 1 to 1.5. For other matters regarding the intermediate structure that are not specified here, reference can be made to the matters explained in the first and second embodiments as appropriate.

[0088] <Substrate with conductive pattern> The substrate provided with the conductive pattern obtained as in the first or second embodiment (schematically shown in FIG. 2I and FIG. 4I) is suitably applied to various uses. Some of the characteristics of the substrate provided with the conductive pattern are summarized below.

[0089] The substrate with a conductive pattern includes a substrate 1, a resin layer (preferably a cured resin layer 2B) provided on the surface of the substrate 1, and a conductive pattern 3C. Part or all of the conductive pattern 3C is embedded in the resin layer (preferably the cured resin layer 2B). The conductive pattern 3C is formed by sintering a plurality of conductive particles. As described above, the resin layer is preferably a cured resin layer 2B, i.e., a cured product of a curable resin material. For specific aspects of the curable resin material, see the description in the section (Formation of a resin-containing layer on a substrate surface: Figures 1A, 1B, and 1C) of the first embodiment. The particle diameter D at which the cumulative frequency is 50% in the volume-based cumulative particle diameter distribution curve obtained when the particle diameters of the conductive particles forming the conductive pattern 3C are measured by a laser diffraction scattering method 50 is preferably 0.5 to 100 μm, more preferably 5 to 60 μm, and even more preferably 10 to 40 μm. For details of the conductive particles, see the explanation in the section (Formation of a temporary pattern on the surface of an easily peelable substrate: FIGS. 1P1 and 1P2) of the first embodiment. The substrate 1 is preferably flexible. The substrate 1 is preferably at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper. For details of the substrate 1, see the description in the section (Formation of a resin-containing layer on the substrate surface: Figures 1A, 1B, and 1C) of the first embodiment. For other matters not specified here regarding the substrate having a conductive pattern, reference can be made to the matters explained in the first and second embodiments as appropriate.

[0090] <Electronic device manufacturing method> An electronic device can be manufactured using a substrate having a conductive pattern obtained as in the first or second embodiment. By appropriately designing the temporary pattern, a substrate having a conductive pattern (circuit pattern) that can function as a circuit can be manufactured. Then, by combining this substrate with other electronic elements, an electronic device can be manufactured.

[0091] Here, some examples of electronic devices will be described. However, it should be noted that the electronic devices including the substrate with the conductive pattern obtained by the manufacturing method of this embodiment are not limited to these examples. Sensors: For example, a substrate having a conductive pattern obtained by the manufacturing method of this embodiment can be applied to conductive members / circuits in sensors such as pressure sensors and vital sensors. Solar cells: For example, a substrate having a conductive pattern obtained by the manufacturing method of this embodiment can be applied to the current collecting wiring of a solar cell. Membrane switch: A membrane switch is a thin sheet-like switch made by printing circuits and contacts on a film and then laminating it. The method for manufacturing a substrate with a conductive pattern according to this embodiment can be applied to form the circuits and contacts. Touch sensor / touch panel: For example, the method for manufacturing a substrate having a conductive pattern of this embodiment can be applied to form lead wiring in a touch sensor / touch panel. It is also conceivable that the method for manufacturing a substrate having a conductive pattern of this embodiment can be applied to form transparent electrodes in a touch sensor / touch panel. Flexible substrate: Conventionally, a circuit is formed by first coating the entire surface of a flexible film with a metal film and then removing unnecessary parts of the metal film using chemicals. Instead of this conventional method, it is possible to form a circuit using the manufacturing method of a substrate with a conductive pattern of this embodiment.

[0092] In particular, in electronic devices where circuits have conventionally been formed using conductive paste, by using the manufacturing method of this embodiment to form circuits, the resistivity of the circuits can be reduced, and improved performance of the electronic devices can be expected.

[0093] A particularly preferred example of the electronic device is an RF tag. That is, the method for producing a conductive substrate of this embodiment is preferably used to produce a conductive circuit such as an antenna portion of an RF tag. For the specific structure of the RF tag, reference can be made to, for example, Japanese Patent Application Laid-Open No. 2003-332714 and Japanese Patent Application Laid-Open No. 2020-46834.

[0094] <Method of manufacturing electromagnetic wave shielding film> As an application other than electronic devices, the method for manufacturing a substrate having a conductive pattern according to the present embodiment can be used to manufacture an electromagnetic wave shielding film. Specifically, in the lamination step, the conductive composition is printed in a pattern specific to the electromagnetic wave shielding film (such as a mesh pattern), thereby manufacturing the electromagnetic wave shielding film.

[0095] <Method of manufacturing a sheet heating element> As another application, the method for manufacturing a substrate having a conductive pattern according to this embodiment may be used to manufacture a sheet heating element. A sheet heating element is an element that generates heat by passing an electric current through electrical wiring provided on a substrate. A specific example of a sheet heating element is a sheet heating element for preventing fogging or cold weather, such as on the rear window of a passenger car.

[0096] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0097] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples.

[0098] <Production of Conductive Composition> 15% by mass of commercially available phenoxy resin and 85 parts by mass of organic solvent were weighed and placed in a glass bottle. The glass bottle was placed in a hot air circulating oven and heated at 120°C for 6 hours. This allowed the resin to completely dissolve. A 15% by mass solution of phenoxy resin was then prepared. Fukuda Metal Foil and Powder Co., Ltd.'s D 50 82 parts by mass of copper powder with a particle size of 5 μm and 18 parts by mass of the 15% by mass solution of the phenoxy resin were weighed and kneaded with a spatula. Then, the mixture was stirred using a planetary stirrer. In this way, a conductive composition was obtained. The ratio of resin to copper powder in the obtained conductive composition was 3.4% by mass.

[0099] <Example 1: Production of a substrate with a conductive pattern> A substrate having a conductive pattern was manufactured by the following process. (i) Formation of a temporary pattern on the surface of an easily peelable substrate: corresponding to Figure 1P1 and Figure 1P2 (ii) Formation of a resin-containing layer on a substrate: corresponding to Figures 1A to 1C (iii) Embedding process: corresponds to Figure 2D (iv) Curing step (curing of the resin-containing layer): corresponds to Figure 2E (v) Peeling process: corresponds to Figure 2F (vi) Oxide film removal process and pressing process: corresponding to Figure 2G and Figure 2H (vii) Removal of the material (film-like material): corresponds to Figure 2I

[0100] Each process will be described in detail below. Here, we will provide additional information regarding the temperature and pressure when roll pressing is performed in the following process. Roll temperature Although the roll press machine is equipped with a non-contact temperature sensor, the roll temperature was measured by attaching a contact thermometer to the roll itself to obtain more accurate temperature measurements. Pressure during roll pressing The pressure during roll pressing was calculated by the following calculation. Roll width: 165 mm, contact width between rolls: 3 mm, pressure area: 495 mm 2 This 495mm 2 When a force F is applied to the area, F ÷ 495 mm 2 The pressure was calculated by the following calculation.

[0101] (i) Formation of a temporary pattern on the surface of an easily peelable substrate: corresponding to Figure 1P1 and Figure 1P2 The conductive composition, the manufacturing method of which is explained in the above section (Manufacturing of Conductive Composition), was screen-printed onto an easily peelable substrate to form a provisional pattern on the surface of the easily peelable substrate. The specific conditions were as follows: -Easy-to-peel substrate: PET film with a silicone resin surface coating, manufactured by Fujimori Kogyo Co., Ltd. Printing machine: A screen printing machine, Desk Top 38SA type (Micro-Tec) was used. Screen: 325 mesh, wire diameter 16 μm, emulsion thickness 28 μm. Printing conditions: printing pressure 0.18 MPa, squeegee speed 30 mm / sec, clearance (distance between screen and substrate) 2.0 mm, attack angle 80°. Overall shape of the pattern: The antenna pattern was as shown in Figure 5. In this pattern, the width of the thin line portion was 200 μm.

[0102] The easily peelable substrate after screen printing was placed in a hot air circulating atmospheric oven and heated at 100°C for 15 minutes, thereby volatilizing the solvent. In this manner, a provisional pattern having a height of 50 μm was formed on the surface of the easily peelable substrate.

[0103] (ii) Formation of a resin-containing layer on a substrate: corresponding to Figures 1A to 1C Two commercially available 15 μm thick thermosetting OCA films were laminated onto one side of a polyethylene terephthalate (PET) film "Cosmoshine A4360" (188 μm thick) manufactured by Toyobo Co., Ltd. This resulted in a laminate with a 30 μm thick resin-containing layer formed on one side of the PET film. The specific lamination method was roll pressing using two opposing rolls using a load-adjustable roll press machine SA-602 (Tester Sangyo Co., Ltd.) under the following conditions: Roll temperature: 80°C, pressure: 2 MPa, conveying speed: 0.1 m / min, gap: 240-250 μm

[0104] (iii) Embedding process: corresponds to Figure 2D The provisional pattern obtained in (i) above was embedded in the resin-containing layer obtained in (ii) above. Specifically, the provisional pattern obtained in (i) above was pressed together with the easily peelable substrate against the resin-containing layer side of the PET film-resin-containing layer laminate obtained in (ii) above. More specifically, the laminated structure (overlapping structure) shown in FIG. 2D was subjected to roll pressing with two opposing rolls using a load-adjustable roll press machine SA-602 (Tester Sangyo Co., Ltd.) under the following conditions: Roll temperature: 80°C, pressure: 2 MPa, conveying speed: 0.1 m / min, gap: 260-270 μm

[0105] Incidentally, in the case of the OCA film used to form the resin-containing layer, it is thought that the roll pressing at 80°C as described above softened the resin-containing layer more than at room temperature, making it easier to embed the temporary pattern.

[0106] (iv) Curing step (curing of the resin-containing layer): corresponds to Figure 2E After the above step (iii) was completed, the entire laminated structure (overlapping structure) was placed in a hot air circulating atmospheric oven and heated at 120°C for 15 minutes, thereby curing the resin-containing layer (OCA film) to form a cured resin layer.

[0107] (v) Peeling process: corresponds to Figure 2F After the above (iv) was completed, the easily peelable substrate was peeled off by hand.

[0108] (vi) Oxide film removal process and pressing process: corresponding to Figure 2G and Figure 2H An oxide film removal solution (formic acid solution) was sprayed onto the pattern (embedded pattern) after (v) above. The amount sprayed was approximately 20 μL for an area of ​​approximately 30 mm × 20 mm on the substrate. A film-like member (the same as the easily peelable substrate on which the provisional pattern was formed, manufactured by Fujimori Kogyo Co., Ltd.) was then placed on top of it. In this state, a roll press treatment was performed using a load-adjustable roll press machine SA-602 (Tester Sangyo Co., Ltd.) equipped with two opposing rolls. The treatment conditions were as follows: Roll temperature: 110°C, pressure: 20 MPa, conveying speed: 0.1 m / min, gap: 180-190 μm

[0109] (vii) Removal of the material (film-like material): corresponds to Figure 2I After the treatment (vi) and cooling, the film-like member (manufactured by Fujimori Kogyo Co., Ltd.) was removed.

[0110] <Evaluation> (Pattern formation accuracy) The conductive pattern obtained in Example 1 was observed under magnification to determine whether the provisional pattern formed on the easily peelable substrate maintained its shape and became a conductive pattern. Specifically, it was evaluated whether a portion of the provisional pattern with a line width of 200 μm became a conductive pattern within a line width variation range of ±20 μm. A line width variation within ±20 μm was evaluated as good, and a line width variation exceeding ±20 μm was evaluated as bad. The smaller the absolute value of the line width variation, the easier it is to form a desired pattern. In other words, the smaller the absolute value of the line width variation, the easier it is to form a thin circuit pattern or a circuit pattern with high precision.

[0111] (resistance value) In the pattern obtained in Example 1 and having the shape shown in Fig. 5, the resistance value between points 1 and 2 and the resistance value between points 3 and 4 were measured. The smaller of the two measured resistance values ​​is shown in the table below.

[0112] (adhesion) The substrate provided with the conductive pattern obtained in Example 1 was bent by hand and returned to its original flat shape, and this operation was repeated five times. Thereafter, the presence or absence of peeling of the conductive pattern was confirmed by visual inspection and observation under magnification. The case where no peeling of the conductive pattern was observed was evaluated as good, and the case where peeling of the conductive pattern was observed was evaluated as bad.

[0113] The above evaluation results are summarized in the table below.

[0114] [Table 1]

[0115] As shown in the above table, a pattern could be formed with high precision by going through the embedding step and pressing step as in Example 1. From this, it can be understood that the method for manufacturing a substrate provided with a conductive pattern described in this specification is advantageous for forming a fine circuit pattern and a circuit pattern with high precision. Furthermore, considering that the resistance value of an already-used aluminum foil antenna (similar in shape and overall size to the antenna in Figure 5) measured in the same manner as above (Resistance Value) is approximately 6.2 Ω, the resistance value of "6.0 Ω" of the antenna manufactured in Example 1 is sufficiently low and can be said to be a value that can withstand practical use. It is believed that the conductive particles were sintered by carrying out the pressing process, etc., resulting in a low-resistance circuit pattern. Furthermore, the adhesion evaluation was good, indicating that the pattern was not easily peeled off, which is thought to be due in particular to the presence of the cured resin layer.

[0116] (Reference: Cross-sectional image of the pattern) Figure 6 shows an enlarged image of the cross section of the substrate with the conductive pattern obtained in Example 1. There are "walls" made of the cured resin layer on both sides of the conductive pattern, and it is believed that the presence of these walls resulted in a conductive pattern with reduced line width variation even after the pressing step. [Explanation of symbols]

[0117] 1 Base material 2 Resin-containing layer 2B Cured resin layer 3 patterns 3B Pattern (provisional pattern, embedded pattern) 3C Conductive Pattern 5. Easy-to-peel substrate 6 Peel-off sheet 7. Liquid (liquid containing component X capable of removing oxide film on the surface of conductive particles) 9. Member (preferably film-like material) 10A roll 10B roll 12A roll 12B roll 14A roll 14B roll 20 Laser Light

Claims

1. an embedding step of bringing a temporary pattern formed on the surface of an easily peelable substrate using a conductive composition containing conductive particles into contact with a resin-containing layer formed on the surface of a substrate different from the easily peelable substrate, thereby obtaining an embedded pattern in which at least a portion of the temporary pattern is embedded in the resin-containing layer; a pressing step of applying at least pressure to the embedded pattern to obtain a conductive pattern; A method for manufacturing a substrate having a conductive pattern, comprising:

2. A method for manufacturing a substrate provided with the conductive pattern according to claim 1, comprising: the resin-containing layer is curable, The method for manufacturing a substrate provided with a conductive pattern includes a curing step for curing or semi-curing the resin-containing layer between the embedding step and the pressing step.

3. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: In the embedding step, the resin-containing layer is softened by heat.

4. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising:

10. A method for manufacturing a substrate having a conductive pattern, wherein the conductive particles in the temporary pattern are substantially not sintered.

5. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the temporary pattern is substantially uncured.

6. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: a step of removing an oxide film, after the embedding step and before or simultaneously with the pressing step, of penetrating a component X capable of removing an oxide film on the surface of the conductive particles into the embedded pattern.

7. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: In the pressing step, the embedded pattern is pressed while being heated.

8. A method for manufacturing a substrate provided with the conductive pattern according to claim 7, comprising: In the pressing step, the embedded pattern is pressed with a pressure of 1 to 5000 MPa and heated at a temperature of 80 to 400°C.

9. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the conductive composition is in a paste state at room temperature.

10. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the amount of the resin component in the conductive composition is 15 parts by mass or less per 100 parts by mass of the conductive particles.

11. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for producing a substrate having a conductive pattern, wherein the conductive composition does not substantially contain a curable component other than the conductive particles.

12. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. ５０ A method for manufacturing a substrate having a conductive pattern, wherein the thickness is 0.5 to 100 μm.

13. A method for producing the conductive substrate according to claim 1 or 2, In the pressing step, the exposed surface of the embedded pattern is covered with a member, and then the embedded pattern is at least pressed.

14. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for producing a substrate having a conductive pattern, wherein the easily peelable substrate is a resin film or a release paper.

15. A method for manufacturing a substrate provided with the conductive pattern according to claim 14, comprising: A method for producing a substrate provided with a conductive pattern, comprising a peeling step of peeling off the easily peelable substrate before the pressing step.

16. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the provisional pattern has a shape adjusted by laser processing.

17. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The height of the provisional pattern is H ｉ and the height of the conductive pattern is H ｆ When H ｆ / H ｉ A method for manufacturing a substrate having a conductive pattern, wherein the value of is 0.4 to 0.

8.

18. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The height of the provisional pattern is H ｉ When the thickness of the resin-containing layer is T, H ｉ A method for manufacturing a substrate having a conductive pattern, wherein / T is 2 or less.

19. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: The method for manufacturing a substrate having a conductive pattern, wherein the substrate is flexible.

20. A method for manufacturing a substrate provided with the conductive pattern according to claim 1 or 2, comprising: A method for manufacturing a substrate having a conductive pattern, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper.

21. A method for producing an electronic device, comprising the steps of: producing an electronic device using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

22. 22. The method of manufacturing an electronic device according to claim 21, comprising: The method for manufacturing an electronic device, wherein the electronic device is an RF tag.

23. A method for producing an electromagnetic wave shielding film, comprising producing an electromagnetic wave shielding film using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

24. A method for producing a sheet heating element, comprising producing a sheet heating element using a substrate having a conductive pattern obtained by the method for producing a substrate having a conductive pattern according to claim 1 or 2.

25. A substrate; a resin-containing layer provided on the surface of the substrate; a temporary pattern comprising conductive particles at least partially embedded in said resin-containing layer; 1. An intermediate structure for the production of a substrate provided with a conductive pattern, comprising:

26. 26. The intermediate structure of claim 25, an intermediate structure, wherein said conductive particles in the temporary pattern are substantially unsintered;

27. 27. An intermediate structure according to claim 25 or 26, The amount of the resin component in the temporary pattern is 15 parts by mass or less per 100 parts by mass of the conductive particles.

28. 27. An intermediate structure according to claim 25 or 26, an intermediate structure, wherein the temporary pattern does not substantially contain a curable component other than the conductive particles;

29. 27. An intermediate structure according to claim 25 or 26, The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. ５０ The intermediate structure has a thickness of 0.5 to 100 μm.

30. 27. An intermediate structure according to claim 25 or 26, The height of the provisional pattern is H ｉ When the thickness of the resin-containing layer is T, H ｉ / T is 2 or less, intermediate structure.

31. 27. An intermediate structure according to claim 25 or 26, The substrate is flexible.

32. 27. An intermediate structure according to claim 25 or 26, The intermediate structure, wherein the substrate is at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper.

33. A substrate; a resin layer provided on the surface of the substrate; a conductive pattern formed by sintering conductive particles, at least a portion of which is embedded in the resin layer; A substrate provided with a conductive pattern.

34. A substrate provided with the conductive pattern according to claim 33, The resin layer is a cured product of a curable resin material, and the substrate is provided with a conductive pattern.

35. A substrate provided with the conductive pattern according to claim 33 or 34, The particle diameter D at which the cumulative frequency reaches 50% in a volume-based cumulative particle diameter distribution curve obtained when the particle diameter of the conductive particles is measured by a laser diffraction scattering method. ５０ A substrate provided with a conductive pattern, wherein the thickness is 0.5 to 100 μm.

36. A substrate provided with the conductive pattern according to claim 33 or 34, The substrate is flexible and has a conductive pattern.

37. A substrate provided with the conductive pattern according to claim 33 or 34, The substrate provided with a conductive pattern is at least one selected from the group consisting of polyester, polyolefin, polycarbonate, polyimide, and paper.

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