Method for manufacturing resin-encapsulated objects

Abstract

To solve the problem that a polishing object cannot be precisely processed at a predetermined polishing position.SOLUTION: A polishing object 102 is resin-sealed in a resin-sealed sample 105. The resin-sealed sample 105 is gripped by a robot arm retainer 721, and the bottom face of the resin-sealed sample 105 is pressed against a polishing table 107 to polish a processed face 602. The polishing table 107 is coated with a cleaning liquid out of a cleaning liquid supply nozzle 207. The processed face 602 is coated with the cleaning liquid. Light from a light irradiator 201 penetrates a polarizer 202a and the processed face 602 irradiated with polarization light 205a. Reflected light reflected by the polarization light 205a on the processed face 602 penetrates a polarizer 202b, so that the reflected light 205b comes incident into a camera 206.SELECTED DRAWING: Figure 8

Description

[Technical Field]

[0001] The present invention relates to a method for observing the surface condition of an object to be polished (a polishing sample, an object to be polished), a method for evaluating an object to be polished, a polishing method for achieving good cross-sectional polishing, and a method for producing an object to be polished.

[0002] The present invention relates to a polished surface observation device for an object to be polished (a resin-sealed sample, a polished sample, a polished object), a polishing device, an evaluation device for an object to be polished (a resin-sealed sample, a polished sample, a polished object), a processing device for an object to be polished, a cutting device for an object to be polished, a control device for a polishing device, an illumination device for an object to be polished (a resin-sealed sample, a polished sample, a polished object), a polishing robot, a robot arm, a robot drive mechanism, and a robot control method.

[0003] The present invention relates to a processing device for electronic components such as semiconductor elements and semiconductor parts, and a method for analyzing and evaluating defects in processed electronic components. The present invention also relates to an observation device, an evaluation device, and an observation method for semiconductor elements and the like.

[0004] The present invention relates to an object to be polished (a resin-sealed sample, a polished sample, a polished object), a stand for a resin-sealed sample, an object to be polished (a resin-sealed sample, a polished sample, a polished object), a device for arranging a resin-sealed sample, an object to be polished (a resin-sealed sample, a polished sample, a polished object), a device for arranging a resin-sealed sample, and a device for organizing a resin-sealed sample. [Background technology]

[0005] The density of semiconductor devices continues to increase with no apparent limit, and various technologies and methods are being developed to achieve this increase in density.

[0006] As densities increase, defects such as poor connections at the terminals of electric elements, electronic elements, electric components, electronic parts, semiconductor elements, semiconductor ICs, semiconductor components, and semiconductor modules, as well as cracks at solder connections, occur frequently. In addition, static electricity and overload can cause defects such as short circuit damage and thermal damage in the components. To analyze the defective parts, it is necessary to polish the cross section of the defective part and then observe, analyze, or evaluate it.

[0007] Furthermore, for semiconductor ICs and semiconductor devices, the bonding state of each layer in the element configuration must be observed and analyzed using a scanning electron microscope (SEM) or the like.

[0008] As semiconductor ICs and devices become increasingly finer, it is becoming more difficult to observe and analyze defective areas and joints. This makes it increasingly important to polish defective areas and joints with precision.

[0009] Semiconductor devices are used as power semiconductor elements in automobiles and other devices. Even a slight connection failure in power semiconductor elements can cause defects that directly lead to destruction. Furthermore, elements that make up power semiconductor circuits are often destroyed by large currents. For this reason, when designing and developing power semiconductor ICs, it is important to observe and evaluate the state of deterioration and changes over time of the elements that make up the semiconductor circuit using a scanning electron microscope (SEM).

[0010] Therefore, for the element design and defect analysis of power semiconductor elements, it has become an essential technique to polish the elements and to analyze in detail the element bonding state and defect occurrence locations.

[0011] In order to perform good cross-section polishing and polishing, it is important to prepare samples for analysis, characterization, or evaluation. It is also important to establish a technique for preparing a large number of polished samples stably and in a short time.

[0012] (Cross-section) Polishing work is a heavy burden on workers and prone to mistakes. By automating polishing using AI (Artificial Intelligence) learning and robotics technology, it is possible to reduce the physical burden, reduce human error, and pass on the skills of skilled workers. [Prior art documents] [Patent documents]

[0013] [Patent Document 1] Patent Publication No. 2002-178257 Summary of the Invention [Problem to be solved by the invention]

[0014] Patent Document 1 discloses a polishing device having a light projector / receiver, a transparent window provided in a polishing body, and a reflecting mirror facing the light projector / receiver, which are provided in a polishing table. However, the polishing body must be made of a light-transmitting material, and there is a problem that the transparent window is contaminated with the abrasive, making it impossible to observe the polished part of the polishing body.

[0015] Polishing while constantly visually observing the polishing state of the polishing body takes a long time. Furthermore, mechanical polishing operations result in distortion and variation in the polished shape, making it difficult to perform polishing with high precision. Furthermore, manually processing each object to be polished one by one presents the problem of requiring a long work time. [Means for solving the problem]

[0016] The method for manufacturing a resin-sealed sample of the present invention is characterized by comprising a first step of adhering an object to be polished (a polishing sample, a polished object) to an adhesive sheet having an adhesive material disposed on a substrate, a second step of arranging a sealing pipe so as to surround the object to be polished (a polishing sample, a polished object), a third step of filling the sealing pipe with a sealing resin, a fourth step of hardening the sealing resin, and a fifth step of peeling off the adhesive sheet.

[0017] The polishing apparatus 700 of the present invention comprises a polishing machine for polishing the bottom surface of the object to be polished 102 or the workpiece 105 (such as a resin-sealed sample 105), a light generator 201 for generating illumination light that is incident on the cylindrical side surface of the object to be polished 102 or the workpiece 105 (such as a resin-sealed sample 105) and illuminates the object to be polished 102, etc., and an observation means for forming a liquid film 604 on the bottom surface of the workpiece 105 (such as a resin-sealed sample 105) and observing the reflected light reflected on the bottom surface of the workpiece 105 (such as a resin-sealed sample 105) from the cylindrical side surface of the workpiece 105 (such as a resin-sealed sample 105).

[0018] The polishing apparatus 700 of the present invention comprises a polishing machine for polishing the bottom surface of the object to be polished 102 or the workpiece 105 (such as a resin-sealed sample 105), a light generator 201 for generating illumination light that is incident from the cylindrical side surface of the workpiece 105 (such as a resin-sealed sample 105) and illuminates the object to be polished 102, and an observation means 206 for forming a liquid film 604 on the bottom surface of the workpiece 105 (such as a resin-sealed sample 105) and observing a reflected image of the object to be polished 102 and a real image of the object to be polished 102 simultaneously from the cylindrical side surface of the workpiece 105 (such as a resin-sealed sample 105).

[0019] The polishing processing apparatus 700 of the present invention comprises a pressing tool 104 that presses the workpiece 105 (such as a resin-sealed sample 105) formed in a pipe 103 and removes it from the pipe 103, a polishing machine that polishes the upper end of the workpiece 105 (such as a resin-sealed sample 105) and polishes the bottom surface of the workpiece 105 (such as a resin-sealed sample 105), a light generator that generates illumination light that enters the cylindrical side surface of the workpiece 105 (such as a resin-sealed sample 105) and illuminates the object to be polished 102, etc., and an observation means 206 that forms a liquid film 604 on the bottom surface of the workpiece 105 (such as a resin-sealed sample 105) and simultaneously observes the reflected light reflected from the bottom surface and the reflected light reflected from the object to be polished 102, etc., from the cylindrical side surface of the workpiece 105 (such as a resin-sealed sample 105).

[0020] The polishing processing apparatus 700 of the present invention comprises a polishing table 107 for polishing the object to be polished 102 in which the object to be polished 102 is sealed, a resin-sealed sample 105, an illumination light irradiator for irradiating illumination light onto the object to be polished 102, etc., a polarizing plate arranged on at least one of the light emission side of the illumination light irradiator and the light reflected from the object to be polished 102, etc., and an optical observation means 206 for observing the light reflected from the polishing surface 602 of the resin-sealed sample 105, etc.

[0021] Since the object to be polished 102 is sealed with the sealing resin 115 and configured as a resin-sealed sample 105, it becomes easy to hold it and to observe the polishing position of the object to be polished 102, as shown in Figures 7 and 8. In addition, polishing processing by the polishing processing device 700 becomes easy.

[0022] In the polishing apparatus 700 of the present invention, a plurality of robot arms are arranged on one polishing table 107, and each robot arm 801 holds a resin-encapsulated sample 105 and applies pressure to the polishing surface to process the polishing surface 602. The robot arm 801 moves the resin-encapsulated sample 105 from the inside to the outside of the polishing table 107 to perform the polishing process.

[0023] In the polishing apparatus 700 of the present invention, the object to be polished 102 is resin-encapsulated in the resin-encapsulated sample 105. The resin-encapsulated sample 105 is held by a holder 721 of a robot arm, and the bottom surface of the resin-encapsulated sample 105 is pressed against the polishing table 107 to polish the processing surface 602. A cleaning liquid is applied to the polishing table 107 from a cleaning liquid supply nozzle 207. The processing surface 602 is covered with the cleaning liquid. Light from the light irradiator 201 passes through a polarizing plate 202a, and polarized light 205a is irradiated onto the processing surface 602. The reflected light of the polarized light 205a reflected by the processing surface 602 passes through a polarizing plate 202b, and reflected light 205b is incident on the camera 206. Sounds generated during the polishing process are collected by a microphone 306.

[0024] The polishing method of the present invention involves illuminating the object to be polished 102 within the workpiece 105 (such as a resin-sealed sample 105) with illumination light, forming a liquid film 604 on the bottom surface of the workpiece 105 (such as a resin-sealed sample 105), and simultaneously observing the reflected image of the object to be polished 102 at the bottom surface of the workpiece 105 (such as a resin-sealed sample 105) and the actual image of the object to be polished from the cylindrical side surface of the workpiece.

[0025] The polishing method of the present invention involves illuminating the object to be polished 102 in the workpiece 105 (such as a resin-sealed sample 105) with illumination light, rotating the workpiece 105 (such as a resin-sealed sample 105), forming a liquid film 604 on the bottom surface of the workpiece 105 (such as a resin-sealed sample 105), and synchronizing with the rotational position of the workpiece 105 (such as a resin-sealed sample 105), simultaneously observing the reflected image of the object to be polished 102 on the bottom surface and the actual image of the object to be polished 102 from the side of the workpiece 105 (such as a resin-sealed sample 105).

[0026] The polishing method of the present invention involves cleaning the polishing surface 602 of an object sealed with an object to be polished (a resin-sealed sample, a polishing sample, an object to be polished) and forming a solution film or a cleaning liquid film on the polishing surface 602 to achieve a mirror finish. The method is characterized by irradiating the object to be polished 102 or the like with polarized light and observing an optical image of the object to be polished on the polishing surface 602.

[0027] The polishing processing apparatus 700 of the present invention comprises a holder 721 for holding the resin-sealed sample 105, a rotation control device for controlling the polishing table 107, and a pressure control device for pressing the resin-sealed sample 105 against the polishing surface 602 of the polishing table 107, and the pressing force can be periodically changed to a plurality of pressing forces.

[0028] The polishing apparatus 700 of the present invention irradiates the observation portion or processing surface 602 of the workpiece 102 with laser light 465 from a laser device 464. The observation portion or processing surface 602 of the workpiece 102 is heated or warmed by the laser light 465, and the optical reflectance and other parameters change. These changes and their distribution are measured with a thermometer 455 such as a thermal viewer, thermometer, temperature sensor, or thermocouple. From the temperature, temperature distribution, optical reflectance, and reflectance distribution, information data can be obtained about defective or observed areas in the polishing process, such as cracks 439, voids 436, breaks in the plating film, and the shading of the plating film. A large amount of information data can be obtained from the measurement results of the polishing process, and this information data is reflected in the polishing process. [Effects of the Invention]

[0029] The polished sample sealing pipe is adhered to an adhesive sheet, and then the sealing pipe is filled with sealing resin and cured. After curing, the adhesive sheet is peeled off. This allows the object to be polished within the resin-sealed sample to be positioned with high precision. The polishing state of the object to be polished, the resin-sealed sample, is stable during polishing, allowing for high-precision polishing. Furthermore, it is possible to produce a resin-sealed sample that is easy to polish, and also to produce the resin-sealed sample in a short time and at low cost.

[0030] Furthermore, the object to be polished and the resin-sealed sample can be positioned accurately in the polishing device. Also, the cross-section processing can be performed accurately at the target processing position of the object to be polished and the resin-sealed sample. Furthermore, the processing location can be clearly observed during the polishing process, so that the polishing process can be performed accurately.

[0031] By generating a light-reflecting surface on the polishing surface and illuminating it with polarized light, the polishing state of the resin-encapsulated sample can be clearly observed, and highly accurate polishing processing can be achieved.In addition, processing can be performed with high precision at the target cross-section processing position.

[0032] By creating a light-reflecting surface on the polished surface and illuminating it with polarized light, it is possible to suppress the generation of stray light in the resin-encapsulated sample. This allows for good observation of the polished state of the polished surface and enables polishing to be performed with high precision.

[0033] During polishing, the polishing position is analyzed using AI learning with an X-ray CT scanner, and the results are reflected in the polishing process at the polishing position. The database is updated with the results of the polishing process. This allows for good polishing. It also allows for precise processing at the target cross-section processing position.

[0034] By polishing a defective or observation portion of an electronic component such as a semiconductor element and observing the polished portion with polarized light, it is possible to realize good defect analysis and evaluation of the defective portion without being affected by ambient light.

[0035] An electronic component such as a semiconductor element is sealed in a cylindrical resin-sealed sample, the bottom surface is polished, a liquid film is formed on the bottom surface, and at least one of a real image and a reflected image of the electronic component is observed simultaneously, thereby enabling the polishing state to be processed with high precision and also enabling good analysis and evaluation of defective areas.

[0036] The present invention is equipped with a microphone, etc. By performing polishing based on the sound generated during polishing using the microphone, etc., it is possible to achieve good polishing. In addition, it is possible to perform polishing with high precision at the target cross-section processing position.

[0037] The present invention uses a positioning device, rotates the positioning device, and determines the coordinates for rotating the object to be polished. The object to be polished is then rotated at the determined coordinates, and head grinding is performed. During polishing, strong and weak pressure is applied repeatedly in a cyclical manner. [Brief explanation of the drawings]

[0038] [Figure 1] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 2] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 3] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 4] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 5] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 6] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 7] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 8] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 9] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 10] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 11] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 12] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 13] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 14] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 15] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 16] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 17] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 18] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 19] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 20] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 21] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 22] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 23] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 24] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 25] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 26] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 27] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 28] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 29] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 30] 1 is a diagram illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of a polishing method. [Figure 31] 1 is a diagram illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of a polishing method. [Figure 32] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 33] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 34] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 35] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 36] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 37] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 38] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 39] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 40] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 41] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 42] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 43] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 44]1A and 1B are explanatory diagrams of an object to be polished and a manufacturing method thereof according to the present invention. [Figure 45] 1A and 1B are explanatory diagrams of an object to be polished and a manufacturing method thereof according to the present invention. [Figure 46] 1A and 1B are explanatory diagrams of an object to be polished and a manufacturing method thereof according to the present invention. [Figure 47] 1A and 1B are explanatory diagrams of an object to be polished and a manufacturing method thereof according to the present invention. [Figure 48] 1A to 1C are explanatory diagrams illustrating a method for producing an object to be polished according to the present invention. [Figure 49] 1A to 1C are explanatory diagrams illustrating a method for producing an object to be polished according to the present invention. [Figure 50] 1 is an explanatory diagram of an apparatus and method for manufacturing an object to be polished according to the present invention; [Figure 51] 1A to 1C are explanatory diagrams of a polishing method and an observation method of the present invention. [Figure 52] 1A to 1C are explanatory diagrams of a polishing method and an observation method of the present invention. [Figure 53] 1A to 1C are explanatory diagrams of a polishing method and an observation method of the present invention. [Figure 54] 1A to 1C are explanatory diagrams of a polishing method and an observation method of the present invention. [Figure 55] 1A to 1C are explanatory diagrams of a polishing method and an observation method of the present invention. [Figure 56] 1A to 1C are explanatory diagrams illustrating a method for producing an object to be polished according to the present invention. [Figure 57] 1A to 1C are explanatory diagrams illustrating a method for producing an object to be polished according to the present invention. [Figure 58] 1 is a diagram illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of a polishing method. [Figure 59] 1A to 1C are explanatory diagrams of a polishing method and an observation method of the present invention. [Figure 60] 1A to 1C are explanatory diagrams of a polishing method and an observation method of the present invention. [Figure 61] FIG. 1 is an explanatory diagram of an observation method according to the present invention. [Figure 62] 1 is a diagram illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of a polishing method. [Figure 63] 1 is a diagram illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of a polishing method. [Figure 64]1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 65] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 66] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 67] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 68] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 69] 1 is an explanatory diagram of a polishing method of the present invention. [Figure 70] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 71] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 72] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 73] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 74] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 75] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 76] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 77] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 78] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 79] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 80] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 81] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 82] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 83]1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 84] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 85] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 86] 1 is a configuration diagram and an explanatory diagram of a polishing device according to the present invention; [Figure 87] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 88] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 89] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 90] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 91] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 92] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 93] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 94] 1A and 1B are diagrams illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of an observation method [Figure 95] 1 is a diagram illustrating a configuration of a polishing apparatus according to the present invention and an explanatory diagram of a polishing method. DETAILED DESCRIPTION OF THE INVENTION

[0039] The present invention will be described below with reference to the drawings showing the embodiments. The drawings may be omitted, enlarged, reduced, or illustrated schematically to facilitate understanding or drawing. The embodiments of the present invention described in this specification and the drawings can be combined in part or in whole with each other.

[0040] The object to be polished 102, such as a substrate, semi-conductor element, semiconductor component, electronic component, electrical component, mounted component, electrode terminal, plating film, via hole, bump, or through hole 110, to be observed or polished, is sealed with a resin such as epoxy resin or silicone resin, as shown in Figure 44 etc. The object to be polished 102 is formed, fabricated, or configured as a processed product sealed in a resin-sealed sample 105.

[0041] In the embodiments of the present invention, the object to be polished 102 is described as being sealed with sealing resin 115 to form a resin-sealed sample 105, but the present invention is not limited to sealing the object to be polished 102 with sealing resin 115 or the like. The object to be polished 102 may be directly polished without being sealed with sealing resin 115. That is, in the polishing process or in the preparation of the object to be polished, the object to be polished 102 may be sealed with resin to prepare a resin-sealed sample 105, or the object to be polished 102 may be polished without being sealed with resin.

[0042] In one embodiment, the polishing target (polishing sample) 102 is sealed with sealing resin 115 and fabricated or configured as a cylindrical structure. The cylindrical structure in which the polishing target 102 is sealed is called a resin-sealed sample 105.

[0043] However, the resin-sealed sample 105 is used as an example for the purpose of facilitating the explanation and understanding of the embodiment, and is not limited to the sealing resin 115. The object to be polished 102 may be sealed with an inorganic material such as glass. The resin-sealed sample 105 is not limited to a resin material such as the sealing resin 115, and may be sealed with other materials. The resin-sealed sample 105 is a polished object or a processed object, and may have any configuration or material.

[0044] 44, 45, 46, etc. are explanatory diagrams of a method for producing a polished sample of the present invention. The embodiment of Fig. 44 is an example in which a printed circuit board 489 on which an electronic component 454, which is the object to be polished 102, is mounted is sealed with resin. It goes without saying that only the electronic component 454, which is the object to be polished 102, may be sealed with resin.

[0045] 44, the state in which the object to be polished 102 is sealed with sealing resin 115a is called a sealed piece 120. In order to identify defective areas, a substrate on which electronic components, electrical components, and mechanical components are mounted is sealed with sealing resin 115, and cross-section polishing is performed on the sealed piece 120 to identify the defective areas.

[0046] The resin-sealed sample 105 in FIG. 44 is cut or polished along lines AA', BB', CC', DD', EE', and FF' to form a sealed piece 120 in the shape of FIG. 45(a).

[0047] Fig. 45(a) shows the sealed piece 120 produced in Fig. 44. The sealed piece 120 in Fig. 45(a) is further sealed with sealing resin 115b to form a cylindrical resin-sealed sample 105.

[0048] The method for producing the resin-sealed sample 105 of the present invention is as follows: as shown in Figure 44, the object to be polished 102 is sealed or fixed with sealing resin 115a, cut out as a sealed piece 120 so as to include a portion including the object to be polished 102, and processed into the sealed piece 120 shown in Figure 45(a).

[0049] 45(d), the sealing piece 120 is placed in the polished sample sealing pipe 103, and the polished sample sealing pipe 103 is filled or poured with sealing resin 115b, and the sealing resin 115b is then hardened. It is preferable to use an epoxy resin as the sealing resin 115, which has good polishing processability.

[0050] The sealing resin 115a and the sealing resin 115b use materials with approximately the same refractive index. Preferably, the sealing resin 115a and the sealing resin 115b use materials with the same refractive index and the same resin material. Furthermore, the sealing resin 115 uses a resin material with an optical transparency of 60% or more. Note that the sealing resin 115 is not limited to resin, and an inorganic material with optical transparency, such as glass, may also be used. The adhesive sheet 111 shown in FIGS. 45(b) and 45(c) has an adhesive material 114 applied or formed on a substrate 112.

[0051] A periodic uneven shape, concave shape, or convex shape is formed on the substrate 112, and an adhesive material 114 is applied or placed on the uneven shape. Examples of the substrate 112 include nonwoven fabric, vinyl chloride, polyethylene, polypropylene, and polyester. Polyester is preferred as the substrate 112 because of its advantages of releasability and peelability from the sealing resin 115.

[0052] The thickness of base material 112 is preferably 0.08 mm or more and 0.3 mm or less. In addition, it is preferable to apply a fluororesin material to the uneven surface of base material 112 in order to improve releasability from sealing resin 115. Fluororesin is a plastic material containing fluorine atoms.

[0053] The uneven shape has a height difference between the concave and convex parts in the range of 10 μm to 200 μm. 2 It is preferable that the number of the particles formed or arranged in the area is 10 to 200.

[0054] Since the base material 112 is made of a flexible material, the convex or concave portions are deformed and flattened by pressing the object to be polished 102 from the surface on which the adhesive material 114 is formed. Therefore, the base material 112 is made of or formed from a flexible material.

[0055] The uneven shape is not limited to a two-dimensional shape or a matrix shape. For example, a material having groove-shaped or linear concave or convex shapes may be used. Examples of adhesive material 114 include acrylic adhesive, silicone adhesive, urethane adhesive, and rubber adhesive. It is preferable to use an adhesive formed to a thickness of 2 μm or more and 30 μm or less. Acrylic adhesives are adhesives made from acrylic polymers and can be designed to have a range of adhesive properties, from weak to strong.

[0056] Silicone adhesives are made from polymers with siloxane bonds in their main structure. They adhere to silicone rubber and fluororesin and have a wide usable temperature range. Silicone low-adhesion adhesives are excellent at releasing air during application, allowing them to be applied to smooth surfaces without trapping air bubbles.

[0057] Urethane adhesives are made from polyurethane, which is obtained by condensing compounds containing isocyanate and hydroxyl groups. They have excellent air release properties during application and excellent removability, allowing them to be removed without leaving any adhesive residue. Rubber-based adhesives have good adhesion and tackiness to a wide range of substrates, but their weather resistance and heat resistance are inferior to other adhesives.

[0058] An acrylic adhesive or a silicone adhesive is preferable as the adhesive material 114. In particular, an acrylic adhesive synthesized with an acrylic ester as the main component is preferable. When the sealing resin 115 is an epoxy resin, the acrylic adhesive penetrates into the adhesive material 114, and the sealing resin 115 reaches the surface of the substrate 112. Therefore, the adhesive sheet 111 and the resin-sealed sample 105 can be easily peeled off.

[0059] The adhesive 114 may be replaced with a bonding material 114. Furthermore, it is not limited to materials having adhesive or bonding functions. For example, any material may be used as long as it has a certain viscosity and adheres or holds the polishing object 102, polishing sample sealing pipe 103, and substrate 112 or film 112 together, such as paint, powder aqueous solution, relatively viscous liquid, oil, aqueous solution, etc. These paints, powder aqueous solutions, etc. prevent or suppress the penetration of the polishing resin.

[0060] The adhesive 114 or bonding material 114 is preferably colored. By coloring, the positions of the object to be polished 102 and the polished sample sealed pipe 103 become clear and easy to distinguish. It can also be used to check the polishing state. By coloring, there is an effect of suppressing stray light generated inside the sealed sample 105.

[0061] Black and dark colors have low light transmittance, which may make it difficult to recognize the position of the object to be polished 102. Therefore, it is preferable to color it in green or a color close to green, which has good visibility. In addition, it is preferable to color it in a color that can be easily distinguished from the color of the object to be polished 102.

[0062] It goes without saying that the adhesive material 114 or the bonding material (adhesive) 114 may be formed or configured using any method or technique such as coating, transfer, printing, spray irradiation, or the like.

[0063] In this embodiment, an adhesive sheet 111 is described as an example, but the present invention is not limited to this. It may be a plate-like material instead of a sheet. It may also be a tape-like or flexible material. An example of a tape-like material is masking tape. The surface of the base material 112 of the masking tape is formed or configured with an uneven shape, and the material of the masking tape contains fibers, and the uneven shape is formed or configured by the fibers.

[0064] The sealing piece 120 (FIG. 45(a)) cut out in FIG. 44 is placed or attached to the adhesive material 114 of the adhesive sheet 111 or the surface to which the adhesive material 114 is applied, as shown in FIG. 45(b).

[0065] The adhesive material 114 between the sealing piece 120 and the adhesive sheet 111 is spread or removed. Also, the protruding portion of the base material 112 is pressed, and the resin-sealed sample 105 and the adhesive sheet 111 are brought into close contact with each other.

[0066] 45(d), the polished sample sealing pipe 103 is placed so as to surround the sealing piece 120. The polished sample sealing pipe 103 is placed or attached to the surface of the adhesive sheet 111 on which the adhesive material 114 is applied.

[0067] The adhesive material 114 between the polished sample sealing pipe 103 and the adhesive sheet 111 is spread out. The protruding portions of the substrate 112 are pressed flat. The polished sample sealing pipe 103 and the adhesive sheet 111 are brought into close contact with each other. As shown in FIGS. 46(a), 49, and 56, the polished sample sealing pipe 103 is injected or filled with sealing resin 115, and the sealing piece 120 is sealed with the resin.

[0068] 46(a), the sealing piece 120 and the adhesive sheet 111 are in close contact with each other, so the sealing resin 115 does not penetrate to the bottom surface of the sealing piece 120. The sealing piece 120 and the base material 112 are fixed together by the adhesive material 114. The sealing piece 120 may be fixed to the base material 112 with an adhesive. The sealing piece 120 may also be fixed to the base material 112 using a mechanical method such as pressure bonding or pressure welding, or a material method such as fusion or melting.

[0069] Instead of sealing the object to be polished 102 with the sealing resin 115a, as shown in Figures 48(a) and 48(b), a sample holding block 601 may be attached to the object to be polished 102, and may be fixed to a substrate 112 or an adhesive sheet 111, for example, as shown in Figure 48(c). Sealing resin 115b is filled around the object to be polished 102 inside the polishing sample sealing pipe 103, and the sealing resin 115b is then hardened.

[0070] As shown in Fig. 46(a), the upper surface of the sealing resin 115 has a concave shape. The concave shape is processed by polishing with a head grinding device as described with reference to Figs. 3 and 16, and processed into the shape shown in Fig. 57(a). The positions indicated by arrows C and C' in Figure 56 are polished using a polishing device (head grinding device) to form or configure the shape shown in Figure 57(a). By hardening the sealing resin 115b, the sealing piece 120 is filled with the sealing resin 115b, and the sealing piece 120 is sealed with the sealing resin 115b.

[0071] An elastic material such as a rubber sheet or rubber film, or a buffer material may be used instead of the adhesive material 114. By using an elastic material to form the base material 112 and the adhesive material 114, the elastic material deforms, and the sealing pipe 103 and the object to be polished 102 adhere closely to the base material 112, preventing the intrusion of the sealing resin 115.

[0072] The substrate 112 may be made of a celluloid film, celluloid sheet, or the like, and may be capable of generating or charging static electricity. Any material may be used as long as it can attract the sealing pipe 103 with static electricity. In this embodiment, the adhesive material 114 is not required. The substrate 112 and the polished sample sealing pipe 103 are charged, and the polishing target 102 or the sealing piece 120 and the substrate 112 are attracted to each other and tightly adhered to each other.

[0073] It is also effective to construct the substrate 112 from a flexible or deformable material. When pressed by the polished sample sealing pipe 103, the substrate 112 deforms, and the substrate 112, the polished sample sealing pipe 103, and the object to be polished 102 bite into each other and come into close contact with each other. Any material can be used as long as the polished sample sealing pipe 103 and the object to be polished can be tightly fixed to the substrate 112.

[0074] In one embodiment, in this example, the substrate 112 is made of a flexible or deformable cushioning material or soft material such as rubber, etc. In this example, the adhesive material 114 is not required.

[0075] 46(a), the sealing resin 115 does not penetrate into the back surface portion A of the object 102 to be polished, and in the other portion B, the sealing resin 115 penetrates into the adhesive material 114 or the adhesive material 114 and the sealing resin 115 are mixed together. The adhesive material 114 may be replaced with an adhesive material 114.

[0076] 45(c), the resin-sealed sample 105 sealed with the sealing resin 115 is placed on the adhesive sheet 111, but this is not limiting. If the object to be polished 102 has a relatively large width or is a self-standing shape, it is of course possible to place the object to be polished 102 on the adhesive sheet 111 and fill it with sealing resin 115b without sealing it with the sealing resin 115.

[0077] The sealing resin 115b is cured by at least one of heating the sealing resin 115b and irradiating the sealing resin 115b with ultraviolet light. After the sealing resin 115b is cured, the base material 112 arranged on the back surface or bottom surface is peeled off.

[0078] 46(b) shows the back surface of the resin-sealed sample 105 from which the base material 112 has been peeled off. Note that Figure 46 and the like are shown schematically. The same applies to the other figures.

[0079] As shown in Figure 46(b), the sealing resin 115b has not penetrated into the back surface portion A of the object to be polished 102, or the penetration of the sealing resin 115b is suppressed. Therefore, the cut surface of the object to be polished 102 is exposed. In the other portion B, the sealing resin 115b has penetrated into the adhesive material 114, or the adhesive material 114 and the sealing resin 115b are mixed, and the sealing resin 115b in the mixed portion is hardened. Therefore, the pattern (concave and convex) of the base material 112 is transferred.

[0080] Therefore, the position A of the object 102 to be polished and the other portion B of the sealing resin 115b can be clearly distinguished and visually recognized. In addition, the mixed portion of the sealing resin 115b and the adhesive material 114 has a weak adhesive or bonding strength, and has the advantage of being easily peeled off from the base material 112.

[0081] When performing polishing, it is necessary to recognize the object 102 to be polished using a camera 206 or the like and perform positioning work, etc. In the embodiment of the present invention shown in Figure 46(b), the uneven pattern of the base material 112 is not transferred to position A of the object 102 to be polished, but is transferred to part B of the other sealing resin 115b. Therefore, the position and state of the object 102 to be polished can be clearly identified and observed.

[0082] In the above examples, the substrate 112 has been described as a film-like material, but the present invention is not limited to this. The substrate 112 may be plate-like. It may also be block-like. Alternatively, the polished sample sealing pipe 103 may be placed directly on a work table (not shown) on which a textured pattern or the like is formed, and the object to be polished 102 may be placed inside the polished sample sealing pipe 103, and the sealing resin 115b may be filled in. Alternatively, the substrate may be formed by applying an adhesive or bonding material to a plate-like substrate. Alternatively, the surface of the plate may be processed into a textured shape or the like, and an adhesive may be applied to the processed surface.

[0083] The uneven shape of the substrate 112 can be used to clarify the position of the object to be polished 102 in the resin-sealed sample 105. It can also be used to determine the polishing position of the object to be polished 102. By forming a pattern or processing pattern on the substrate 112, it is possible to form a pattern or transfer the processing pattern to the bottom surface of the resin-sealed sample 105.

[0084] In particular, it is preferable to use adhesive material 114 that is mixed with sealing resin 115. For example, it is preferable to use a water-soluble resin such as acrylic resin or polyvinyl alcohol (PVA).

[0085] 47 and the like, it is preferable that the pattern or processing pattern to be formed on the substrate 112 is a marking line (marker) 507. Using the marking line (marker) 507 as a reference, the position of the object 102 to be polished can be recognized or the polishing position can be determined.

[0086] 46(c), it is also preferable to form or configure, for example, a circular recess 119 in the substrate 112 so as to correspond to the shape of the polished sample sealing pipe 103. The polished sample sealing pipe 103 can be fitted and fixed in the recess 119.

[0087] In the embodiment of Figure 46(c), the polished sample sealing pipe 103 is fitted into the recess 119, and the substrate 112 and the polished sample sealing pipe 103 are tightly attached to each other. Therefore, the sealing resin 115b can be filled into the polished sample sealing pipe 103 without leaking out. The object 102 to be polished is adhered to the substrate 112 by an adhesive 114 or the like. As shown in Figure 47, etc., markers 507 or the like are formed on the surface of the substrate 112. Alternatively, a concave-convex pattern is formed.

[0088] An adhesive may be used instead of the adhesive material 114. Also, instead of the adhesive material 114 or the adhesive (adhesive) 114, any material may be used as long as it is made of a viscous material, a liquid, or a flexible material and can adsorb the polished sample sealing pipe 103 to the substrate 112. For example, instead of the adhesive material 114, a rubber sheet, a rubber film, or the like made of an elastic material may be used.

[0089] Fig. 47(a) is an explanatory diagram of an embodiment in which markers 507a and markers 507b are processed or formed on the substrate 112. The markers 507, uneven shapes, etc. are formed on the substrate 112, and the markers 507, uneven shapes, etc. are transferred to the sealing resin 115b. In the embodiment of Fig. 47(a), multiple cross-shaped markers 507 (markers 507a and markers 507b) are formed.

[0090] The vertical and horizontal positions and rotation angles of the markers 507 (markers 507a and 507b) can be recognized by forming rectangular auxiliary markers at the upper left of the two markers 507. Therefore, the rotation or angle of the encapsulated sample 105 and the position, rotation or angle of the polishing object 102 can be easily recognized.

[0091] The object to be polished 102 and the polished sample sealing pipe 103 are placed on the substrate 112, which has the shapes of markers 507a and 507b formed thereon. Sealing resin 115b is filled or poured into the polished sample sealing pipe 103. After the sealing resin 115b is hardened, the substrate 112 is peeled off. The markers 507 and the like are transferred to the sealing resin 115b from which the substrate 112 has been peeled off.

[0092] 47(a), markers 507a and 507b are transferred to the resin-sealed sample 105. The position of the object to be polished 102 can be actually measured by measuring, observing, and visually checking the object to be polished 102 at position A from the positions of the markers 507a and 507b.

[0093] Therefore, the resin-encapsulated sample 105 can be accurately positioned on the polishing robot arm 801 and the polishing head 106. Furthermore, the initial positions (origin positions) of the polishing head 106 and the robot arm 801 can be accurately determined using the marker 507 as a reference.

[0094] The base material 112 has concentric markers 507a, radial markers 507b, unevenness, and dimension line shapes formed or configured thereon, and the polishing object 102 and polishing sample sealing pipe 103 are placed on the base material 112. The radial markers 507 formed on the base material 112 are configured to be convex. By configuring them to have a convex shape, the convex parts are in close contact with the polishing object 102, and the sealing resin 115 does not penetrate into the bottom surface of the polishing object 102.

[0095] The sealing resin 115b is filled and hardened, and then peeled off from the substrate 112. The mixture of the adhesive material 114 and the sealing resin 115b has weak adhesion or bond strength to the substrate 112, making it easy to peel the resin-sealed sample 105 off from the substrate 112.

[0096] Therefore, it is preferable to use adhesive 114 or bonding material 114 that can be easily mixed with sealing resin 115. Even if adhesive 114 and sealing resin 115 are not mixed, adhesive 114 can be easily separated from hardened sealing resin 115, so that base material 112 can be easily peeled off.

[0097] 47(b), grooves of concentric markers 507a and radial markers 507b are formed or configured in the base material 112. Therefore, as shown in FIG. 47(b), the concentric markers 507a and the radial markers 507b are transferred to the resin-sealed sample 105 by the grooves of the concentric markers 507a and the radial markers 507b.

[0098] By using the concentric markers 507a and the radial markers 507b, it is possible to grasp the position A of the object to be polished 102. Furthermore, by using the radial markers 507 of the object to be polished 102 at position A to recognize the position of the object to be polished 102 and measure the size of the object to be polished 102, it is possible to position the object to be polished 102 and process the object to be polished 102.

[0099] The concentric circle marker 507 can also be used as the reference circle 804 in Fig. 22 etc. The reference circle 804 allows the resin-sealed sample 105 to be positioned and centered.

[0100] 47(c), the object to be polished 102 and the polished sample sealing pipe 103 are placed on a substrate 112 on which a grid pattern of markers 507 is formed. The grid pattern markers 507 are configured so that the grid pattern markers 507 formed on the object to be polished 102 and the substrate have a convex shape.

[0101] After filling and curing the sealing resin 115b, the substrate 112 is peeled off from the resin-sealed sample 105. As shown in FIG. 47(c), a checkerboard-shaped marker 507 is transferred onto the resin-sealed sample 105. In one embodiment, the size of the checkerboard is set to a specified value, such as 5 mm square, for each rectangle. By measuring the length of the polishing object 102 at position A from the position of the checkerboard marker 507, the position of the polishing object 102 and the positioning of the positioner 800 and the polishing head 106 can be easily confirmed.

[0102] In one embodiment, the substrate 112 may be a mesh-shaped substrate such as a resin mesh or a wire mesh. The object to be polished 102 and the polished sample sealing pipe 103 are placed on the mesh-shaped substrate 112. After filling and curing the sealing resin 115, the substrate 112 is peeled off from the resin-sealed sample 105.

[0103] 47(d), a mesh pattern is transferred to the resin-sealed sample 105. Since the mesh size is a specified value, the object 102 to be polished at position A can be identified by counting the number of meshes.

[0104] For example, as shown in Fig. 22, it goes without saying that the marker 507 may be used as the reference line 803. Alternatively, a cut may be made in the polished sample sealing pipe 103 so that a line or groove is formed in the filled sealing resin 115. The line or groove may also be used as the reference line 803 as shown in Figs. 22 and 55.

[0105] 46 and 47, it has been described that the uneven pattern and marking line 507 are formed or configured. Also, it has been exemplified that the uneven pattern and marking line 507 are formed or configured on the substrate 112, and the uneven pattern and marking line 507 are transferred to form or configure the resin-sealed sample 105, and the presence or absence of the uneven pattern and marking line 507 is recognized and observed. However, the present invention is not limited to this.

[0106] The substrate 112 may be flat or smooth, without any textured pattern, marking lines 507, or other processing. Even if the substrate 112 is flat or smooth, the sealing resin 115 does not penetrate into the back surface A of the object to be polished 102, as shown in FIGS. 46(b) and 47. In the other portion B, the sealing resin 115 penetrates into the adhesive 114, or the adhesive 114 and the sealing resin 115 are mixed together. Therefore, the presence or absence or state of the adhesive 114 differs between the back surface A of the object to be polished 102 and the other portion B, resulting in differences in the optical reflectance, light diffusion state, surface state, and the like between portions A and B, enabling the position recognition and positioning of the object to be polished 102.

[0107] The back surface of the resin-sealed sample 105 may be formed or configured to be flat, and the uneven pattern, marking line 507, reference line 803, marking line 507, etc. may be formed on the flat surface by cutting or irradiating with laser light.

[0108] The position of the object 102 to be polished can be detected by detecting, photographing, and observing the optical reflectance, light diffusion state, surface state, etc. at parts A and B shown in Figure 47 using a camera 206, etc. Furthermore, the object 102 to be polished can be positioned with high precision during polishing.

[0109] As shown in Figures 45, 47, etc., the uneven pattern, concentric circles, radial lines, mesh lines, checkerboard lines, etc. of the base material 112 are detected or visually recognized, and the polishing work is carried out using them as a reference for the position and processing of the object to be polished 102. Furthermore, the polishing processing state and results are used to create training data through AI learning of the present invention, and the polishing results are updated and stored in a database.

[0110] The substrate 112 may be a flat, planar, or smooth object without a concave-convex pattern, marking line 507, or the like. Alternatively, the concave-convex pattern or marking line 507 may be formed, produced, or configured by forming or configuring concave-convex or film thickness variations in the adhesive material 114. Alternatively, a sheet, cloth, net, or the like on which the concave-convex or marking line 507, or the like, is formed, produced, or configured may be placed or sandwiched between the adhesive material 114 and the resin-encapsulated sample 105 and cured.

[0111] It goes without saying that the above matters can be applied to other embodiments of the present invention, and that they can be combined in part or in whole with other embodiments.

[0112] Figure 48 is an explanatory diagram of a method for producing an object to be polished in another embodiment of the present invention. Figure 48(a) is a schematic diagram of an object to be polished 102 for explaining the embodiment of the present invention. However, it goes without saying that the object to be polished 102 may be one which is sealed with sealing resin 115a and cut out, as shown in Figure 45(a).

[0113] 48 etc., the object to be polished 102 will be described by taking as an example a semiconductor chip (object to be polished, polishing sample) 102 mounted on a printed circuit board 489 of Fig. 44 etc. An electrode terminal 101 is formed or arranged on one side of the semiconductor chip (object to be polished, polishing sample) 102.

[0114] As shown in FIG. 48(a) and FIG. 57(a), in this embodiment, a description will be given of an embodiment in which cross-section polishing is performed at a cross-sectional position 706 indicated by line CC', which is the center of the electrode terminal 101 portion. The object to be polished 102 is encapsulated in a resin-encapsulated sample 105 in various states as shown in FIGS.

[0115] The resin-sealed sample 105 will be described assuming that the object to be polished 102 is sealed with sealing resin 115, but this is not limiting. Needless to say, sealing may be performed with an inorganic material such as glass other than resin. It is also possible to seal with a soft material such as sponge or seaweed, or with a material such as rubber. It is also possible to polish the object to be polished 102 directly without sealing it with resin.

[0116] As shown in FIG. 48(a), marking lines 507 are formed on the object 102 to be polished. The marking lines 507 are formed by marking the X-direction and Y-direction lines using a laser marker (not shown). As shown in FIG. 49(b), the marking lines 507 are formed parallel to the cutting line AA' in the X-direction and parallel to the electrode terminal 101 in the Y-direction. The marking lines in the X-direction and Y-direction are formed so as to intersect at right angles. The marking lines may be formed by printing. Alternatively, they may be formed by scraping the object 102 to be polished.

[0117] When polishing the object 102 to be polished, the marking line 507 is monitored or detected by a video camera, an image recognition device, or the like, and the polishing operation is carried out using the marking line 507 as a reference.

[0118] In one embodiment, a marking line 507 is formed on the object 102 to be polished, as shown in Fig. 48(a). The marking line 507 is formed by marking lines in the X and Y directions using a laser marker device 464. Alternatively, as shown in Fig. 58, the marking line 507 is formed or configured by emitting infrared light, ultraviolet light, or visible light.

[0119] The marking position is recognized by irradiating the marking line 507 with ultraviolet light or visible light. By recognizing and observing the marking line 507, the position and processing state of the workpiece 102 during polishing can be grasped with the polishing device 700 of the present invention. The polishing position is recognized and determined based on the marking line 507, the workpiece 102 is positioned, and polishing is performed.

[0120] 49(b), the marking lines 507 are marked in the X direction parallel to the cutting line AA', and in the Y direction parallel to the electrode terminals 101. The marking lines in the X and Y directions are formed so as to intersect at right angles.

[0121] When polishing the object 102 to be polished, the marking line 507 is monitored or detected by the video camera 206, the 3D macro device 462 (3D macroscope), an image recognizer, etc., and the polishing work is carried out based on the marking line 507. In addition, the polishing position and polishing state are recognized using the devices and methods described in Figures 44, 45, 47, 50, 81, 82, 87, 88, etc., and polishing and positioning are carried out.

[0122] The 3D macroscope 462 is a device that projects fringe light and measures the distortion of the fringe projection image by photographing it. Although the accuracy is lower than that of a laser microscope, it can measure a wide area in a short time.

[0123] 48(b), the object to be polished 102 is cut into small pieces, and then a sample holding block 601 made of or configured from acrylic resin or the like is attached to the back surface of the chip, etc. The attachment and fixing are performed using an adhesive, a pressure sensitive adhesive, or double-sided tape.

[0124] By attaching the sample holding block 601 to the object to be polished 102, the object to be polished 102 can stand on its own. The object to be polished 102 can be stably placed inside the polishing sample sealing pipe 103. Furthermore, the object to be polished 102 is stably held when the sealing resin is injected.

[0125] 48(c) is a perspective view of the polished sample sealing pipe 103 used to produce the resin-sealed sample 105. Examples of the polished sample sealing pipe 103 include an acrylic pipe, a polycarbonate pipe, a stainless steel pipe, an aluminum pipe, a vinyl chloride pipe, and a glass pipe.

[0126] The polished sample sealing pipe 103 is preferably cylindrical. After the sealing resin 115 has hardened, the resin-sealed sample 105 can be removed from the polished sample sealing pipe 103 by pressing it with a pressing tool 104 or by hitting the pressing tool 104 with a hammer or the like, as shown in Figure 49(a). Furthermore, the resin-sealed sample 105 can be taken out of the polished sample sealing pipe 103 by applying pressure to the resin-sealed sample 105.

[0127] The inner surface of the polished sample sealing pipe is preferably coated or formed with a resin such as fluororesin (fluorocarbon resin) that has excellent properties such as slipperiness, non-stickiness, chemical resistance, and low friction.

[0128] For example, the resin to be applied can be polytetrafluoroethylene. Polytetrafluoroethylene is a polymer of tetrafluoroethylene, a fluororesin (fluorocarbon resin) consisting only of fluorine atoms and carbon atoms. It is chemically stable and has excellent heat and chemical resistance.

[0129] A polishing object 102 as an object to be polished is placed in a polishing sample sealing pipe 103, and a sealing resin (molding resin) is injected or filled into the polishing sample sealing pipe 103. The sealing resin (molding resin) is a liquid sealing material (thermosetting or ultraviolet light (UV light) curing resin, etc.), and liquid sealing materials are classified into thermosetting / thermoplastic, solvent / solventless, one-component / two-component types, etc. depending on the type of resin and formulation.

[0130] The main constituent materials of liquid sealing materials are acrylic resin and epoxy resin. If necessary, resins such as plastic polymers, and additives such as coupling agents, diluents, flame retardants, and antifoaming agents are also used. Other examples include polyvinyl alcohol (PVA). Acrylic resin, epoxy resin, and polyvinyl alcohol resin are preferable because they have little optical anisotropy (difference in extraordinary refractive index from ordinary refractive index) with respect to polarized light.

[0131] In one embodiment of this example, the sealing resin (mold resin) is a resin whose main component is epoxy resin. Epoxy resin has a high refractive index, and the difference in refractive index between the processed surface 602 and air (refractive index 1.0) is large. For example, this is illustrated and explained in Figures 8, 15, 16, 65, 66, and 67.

[0132] Therefore, it is preferable because a good mirror surface (reflecting surface) is formed or configured on the processed surface 602. It is preferable to use a light-transmitting epoxy resin with a refractive index of 1.52 or more and 1.7 or less as the sealing resin.

[0133] Silicone resins are also an example of sealing resins. Compared to epoxy resins, silicone resins can slow the rate at which the material deteriorates and its light transmittance decreases. While epoxy resins absorb a maximum of several percent of light, silicone resins reduce this to less than 1%. This slows the rate at which the resin deteriorates, making it easier to observe the object to be polished using polarized light irradiation. This also makes it easier to observe the object to be polished 102 using a camera 206 or the like.

[0134] Polyvinyl alcohol resin has little optical anisotropy (difference in extraordinary refractive index from ordinary refractive index) with respect to polarized light, and is therefore effective in embodiments in which the workpiece 102 to be polished is observed using polarized light, as shown in the embodiments in Figures 8, 15, 16, 65, 66, 67, 68, 70, 73, 74, 75, 76, 77, 78, 79, 81, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, etc.

[0135] If necessary, a plastic polymer is mixed or added. Examples of the plastic polymer include polyamide resin, polyimide resin, urethane resin, silicone resin, and phenoxy resin. The polishing speed, degree of friction during polishing, and polishing pressure are set according to the type of sealing resin used.

[0136] The object to be polished 102 is placed in the polished sample sealing pipe 103, and after filling with sealing resin 115, the sealing resin 115 is hardened. Examples of the hardening method of the sealing resin 115 include photo-hardening, thermal hardening, or a combination of these.

[0137] 49 is a diagram illustrating the configuration of an apparatus for producing an object to be polished according to the present invention and an explanatory diagram of a method for producing the object to be polished, and is also an explanatory diagram illustrating the removal of a resin-sealed sample 105, which seals an object to be polished 102, from a polished sample sealing pipe 103.

[0138] Removal of the resin-sealed sample 105 from the polished sample sealing pipe 103 is relatively easy because the polished sample sealing pipe 103 is cylindrical and pipe-shaped. As shown in Fig. 49(a), a cylindrical pressing tool 104 presses the resin-sealed sample 105 from above the polished sample sealing pipe 103. By pressing, the resin-sealed sample 105 is peeled off from the polished sample sealing pipe 103, and the object to be polished 102 is removed in a resin-sealed state, as shown in Fig. 49(b).

[0139] The cylindrical pressing tool 104 is a cylindrical object made of resin or metal and smaller in diameter than the polished sample sealing pipe 103. The resin-sealed sample 105 can be removed by hitting the cylindrical pressing tool 104 from above with a hammer or the like.

[0140] 50 is an explanatory diagram of a manufacturing apparatus and manufacturing method for a resin-sealed sample 105 of the present invention. It is also an explanatory diagram of a method for sealing an object to be polished 102. The belt conveyor is composed of rollers 117 (roller 117a, roller 117b, roller 117c) and a belt 118. An adhesive sheet 111 on which an adhesive material 114 is formed or applied is placed on the belt 118 of the belt conveyor. Alternatively, the adhesive material 114 is applied to the belt 118.

[0141] Adhesive sheet 111 is supplied from roller 116a and taken up by roller 116b. Instead of adhesive sheet 111, substrate 112 on which adhesive material 114 is applied or formed may be used.

[0142] An adhesive material 114 is formed or placed on a base material 112 of the adhesive sheet 111. At position a on the left end of FIG. 50, the object to be polished 102 is attached to the adhesive material 114 of the adhesive sheet 111. The adhesive sheet 111 is taken up by a roller 116b and moves sequentially to the right in FIG. 50. It goes without saying that the object to be polished 102 may be a sealing piece 120 as shown in FIG. 45(a). The sealing piece 120 is attached to the adhesive material 114 of the adhesive sheet 111.

[0143] 50, the polished sample sealing pipe 103 is attached to the adhesive material 114 of the adhesive sheet 111. The adhesive sheet 111 is taken up by a roller 116b and moved sequentially to the right in FIG.

[0144] 50, sealing resin 115b is filled or injected into polished sample sealing pipe 103. Adhesive sheet 111 is taken up by roller 116b and moved sequentially to the right in FIG.

[0145] At position d in Figure 50, ultraviolet light 128 from an ultraviolet light (UV light) lamp 121 is irradiated onto the sealing resin 115 in the polished sample sealing pipe 103 to harden the sealing resin 115. Alternatively, the sealing resin 115 is hardened by heating. After the sealing resin 115 has hardened, the polished sample sealing pipe 103 and the resin-sealed sample 105 are peeled off from the substrate 112. After peeling, the procedure and method of Figure 49 are carried out as one embodiment.

[0146] As described above, an adhesive material is applied to a flexible, uneven substrate to form the adhesive sheet 111. After the object to be polished 102 is adhered to the adhesive sheet 111 of the substrate, the polished sample sealing pipe 103 is placed so as to surround the object to be polished 102. An epoxy resin or acrylic resin is filled or injected into the polished sample sealing pipe 103 as the sealing resin 115b, and the sealing resin 115b is then cured.

[0147] 50, sealing resin 115b is preferably cured by irradiating it from above with ultraviolet light 128a generated by ultraviolet light (UV light) lamp 121a and from below with ultraviolet light 128b generated by ultraviolet light (UV light) lamp 121b. When base material 112 is used, base material 112 is made of a material that transmits ultraviolet light.

[0148] Because the workpiece 102 is adhered with an adhesive, the sealing resin 115 does not penetrate to the back surface of the workpiece 102, but the sealing resin in other areas penetrates the adhesive and reaches the base material. After the sealing resin has hardened, when the adhesive sheet 111 is peeled off, the uneven shape of the belt 118 or base material 112 is transferred to the areas other than the workpiece 102.

[0149] In the examples of Figures 45, 46, 50, etc., adhesive sheets have been described as examples, but the present invention is not limited to this. Instead of adhesive sheets, plate-shaped objects may be used. Tape-shaped objects may also be used. For example, in one embodiment, adhesive tapes and masking tapes are exemplified as tapes.

[0150] 50, roller 116a supplies masking tape 111, and roller 116b collects used masking tape 111. By forming adhesive sheet 111 into a tape-like shape, as shown in FIG. 50, the supply and collection of tape 111 can be automated.

[0151] The sheet 111 (tape 111) is not limited to one coated with the adhesive material 114, and an adhesive may be used instead of the adhesive material 114. Furthermore, instead of the adhesive material 114 or the adhesive (bonding agent) 114, any material made of a viscous body, liquid, or flexible material may be used as long as it can adsorb the polished sample sealing pipe 103 to the substrate 112. For example, a rubber sheet, a rubber film, or the like can be used instead of the adhesive material 114.

[0152] 45, 46, 50, etc., the object to be polished 102 is adhered to the adhesive sheet 111, and then the polished sample sealing pipe 103 is adhered to the adhesive sheet 111. However, the present invention is not limited to this. The polished sample sealing pipe 103 may be adhered to the adhesive sheet 111, and then the object to be polished 102 may be adhered. The polished sample sealing pipe 103 and the object to be polished 102 may be adhered to the adhesive sheet 111 at the same time.

[0153] Furthermore, the present invention is not limited to the adhesive sheet 111. For example, the polishing object 102 coated with adhesive material 114 may be attached to the substrate 112, and the polished sample sealing pipe 103 coated with adhesive material 114 may be attached, and then the polished sample sealing pipe 103 may be filled with sealing resin 115, and the sealing resin 115 may be cured.

[0154] On a substrate or sheet with good releasability or peelability, the adhesive material 114 or bonding material 114 may be formed to a predetermined thickness using a coater such as a roll coater, bar coater, spin coater, etc. The predetermined thickness is preferably formed or configured to be 2 μm or more and 20 μm or less.

[0155] A roll coater is a method of obtaining an optimal coating surface by combining multiple rollers of various types. Roller-based coating systems can accommodate coating fluids of various viscosities and coating film thicknesses by combining and subdividing a wide variety of technologies.

[0156] A bar coater (also known as a wire bar or Mayer bar) has a stainless steel rod (shaft) wrapped around it with a stainless steel wire, and by changing the wire diameter, the desired wet film thickness can be easily applied.

[0157] A spin coater, also known as a spinner, is a device that applies a coating liquid to the top surface of a generally flat object to be coated, and then spins it at high speed to create a thin film using the centrifugal force generated. It can form and configure the desired film thickness.

[0158] It goes without saying that the adhesive material 114 or the bonding material 114 may be formed using a technique such as screen printing with a squeegee or the like. The adhesive material 114 or the bonding material 114 is not limited to an adhesive material, and may be any material that can prevent or suppress the intrusion of the sealing resin 115. For example, it may be a liquid or semi-liquid material such as Vaseline or oil.

[0159] 56, the upper surface of the removed resin-sealed sample 105 has a raised shape along the polished sample sealing pipe 103. This is because capillary action and interfacial tension occur along the interface of the polished sample sealing pipe 103.

[0160] Fig. 56(a) is an explanatory diagram schematically showing a cross section of the resin-sealed sample 105 of Fig. 49(b) taken vertically along line AA'. Fig. 56(b) is an explanatory diagram schematically showing a cross section of the resin-sealed sample 105 of Fig. 49(b) taken vertically along line BB'.

[0161] As shown in Fig. 56, the polishing object 102 is sealed with sealing resin 115. As shown by the arrow in Fig. 56, the periphery of the resin-sealed sample 105 is raised due to the interfacial tension of the cylindrical sealing pipe 103 for the polishing sample.

[0162] Fig. 3 is a diagram showing one embodiment of a portion of a polishing apparatus 700. As shown in Fig. 3, the polishing apparatus 700 of the present invention includes a polishing table 107 to which a polishing pad 506 having a polishing surface 505 is attached. A resin-encapsulated sample 105 is attached to a polishing sample holder (such as a polishing head 106).

[0163] As shown in FIG. 4 and other figures, the polished sample holder and the like are equipped with a rotation mechanism (or vibration mechanism) 753, a force sensor 702, a pressure sensor 126, and the like, but are omitted from the drawing.

[0164] The cleaning liquid supply nozzle 207 supplies the cleaning liquid to the polishing surface 505. The cleaning liquid supply nozzle 207 also supplies the cleaning liquid between the resin-sealed sample 105 and the polishing surface 505.

[0165] A polishing liquid containing an abrasive is supplied from the polishing liquid supply nozzle 307 to the polishing surface 505. Furthermore, the polishing liquid supply nozzle 307 supplies the polishing liquid between the resin-sealed sample 105 and the polishing surface 505.

[0166] The polishing processing apparatus 700 and polishing robot of the present invention are equipped with microphones 306 that collect or measure sounds generated during polishing above or near the polishing surface 505 (microphone 306a), near the resin-encapsulated sample 105, and on the backside of the polishing table 107 (microphone 306b). Microphone 306 is a means for collecting or measuring sound. While there are various types of microphones, such as dynamic microphones and condenser microphones, a unidirectional one is selected.

[0167] The vibration detection means is not limited to a microphone, and may be a vibration detection means (vibration sensor 309) that can detect the magnitude and period of vibration of polishing surface 505. For example, the vibration detection means may be a vibration sensor 309 that brings a contact object into contact with the workpiece to be processed, such as resin-sealed sample 105, or polishing surface 505, or polishing pad 506, and detects vibrations transmitted to the contact object. For example, a piezoelectric force sensor, a piezoelectric crystal, an electromagnetic coil, etc. may be used.

[0168] The sounds measured or acquired by the microphone 306 are not limited to the audible range. Frequencies below the audible range of several tens of hertz (Hz) are also referred to as sounds. Furthermore, sounds do not only include a single frequency, but also include a fundamental frequency superimposed with a higher frequency. Therefore, sound is a vibration of air, and is a conceptual concept of vibration.

[0169] The controller circuit 711 comprehensively judges or processes the fundamental frequency, overlapping frequencies, intermittent frequencies, etc. from the microphone 306, and controls, varies, and adjusts the polishing area, polishing pressure, rotation speed (rmm) of the polishing table 107, etc.

[0170] The microphone 306 collects the sound generated during polishing, measures or collects the frequency, frequency change, sound intensity, change in sound intensity, and periodicity of the generated sound, and sends the data (frequency, sound, periodicity, etc.) to the controller circuit 711.

[0171] The vibration sensor 309 measures the vibrations generated during polishing, and measures or observes the frequency of the measured vibrations, frequency changes, vibration strength, changes in vibration strength, and periodicity of the generated vibrations, and sends the data (frequency, sound, periodicity, etc.) to the controller circuit 711.

[0172] The controller circuit 711 analyzes data (frequency, sound, periodicity, etc.) from the microphone 306 and data (frequency, sound, periodicity, etc.) from the vibration sensor 309, and also considers at least one of the rotation speed of the polishing table 107 or the polishing surface 505, the amount of cleaning liquid supplied from the cleaning liquid supply nozzle 207, the amount of polishing liquid supplied from the polishing liquid supply nozzle 307, and the area (processed area) of the resin-sealed sample 105 in contact with the polishing surface 505, to grasp the processing state of the resin-sealed sample 105. Furthermore, the controller circuit 711 analyzes and evaluates the processing state, and controls the stopping of processing of the resin-sealed sample 105, the change of the processing state, the processing speed, etc.

[0173] The polishing processing apparatus and polishing robot of the present invention are equipped with a liquid film sensor 303 that measures or observes the thickness of the polishing liquid film formed or applied to the polishing surface 505, the change in the film thickness of the polishing liquid, the thickness of the cleaning liquid film formed or applied to the polishing surface 505, and the change in the film thickness of the cleaning liquid.

[0174] The sound generated by the polishing device 700 changes depending on the film thickness of the polishing liquid, the change in the film thickness of the polishing liquid, the film thickness of the cleaning liquid, and the change in the film thickness of the cleaning liquid, and thus the sound during processing of the resin-encapsulated sample 105 changes. The sound intensity, sound changes, and sound frequency are collected by the microphone 306. The collected sound data (frequency, sound, periodicity, etc.) is processed taking into consideration at least one of the following data: the amount of cleaning liquid supplied from the cleaning liquid supply nozzle 207, the amount of polishing liquid supplied from the polishing liquid supply nozzle 307, the area (processed area) of the resin-encapsulated sample 105 in contact with the polishing surface 505 and the polishing pad 506, the rotation speed of the polishing surface 505, the position of the resin-encapsulated sample 105 on the polishing surface 505, and the pressing force on the polishing surface of the resin-encapsulated sample 105.

[0175] For example, applying a supply of cleaning liquid reduces the noise generated by the resin-sealed sample 105 and the polished surface 505. Furthermore, the frequency of the noise generated before and after the supply of cleaning liquid changes.

[0176] 39 is an explanatory diagram conceptually and schematically illustrating the relationship between the data measured or observed by a sound collecting means such as the microphone 306 and the rotation speed of the polishing table 107. Figures 39 and 40 are schematic diagrams for ease of understanding and explanation.

[0177] 39(b), the polishing table 107 is rotated, and the resin-sealed sample 105 is pressed against the polishing table 107 to polish the resin-sealed sample 105. During the polishing process, a sound (frequency (Hz)) associated with the process is generated. Furthermore, the sound associated with the process is not a sine wave, but is composed of multiple frequency components, each of which changes relatively randomly.

[0178] 39(a) conceptually and schematically illustrates the situation in which the generated frequency (Hz) is measured by microphone 306. The generated frequency varies depending on the materials of resin-sealed sample 105 and object to be polished 102, the processing speed, the processing pressure, the condition of the abrasive, the material of the abrasive, the amount of cleaning liquid, etc.

[0179] The rotation speed (rpm) of the polishing table 107 is gradually increased from time 0, and is maintained at a constant speed of 100 (rpm) during the period from time t1 to time t3.

[0180] The rotation speed (rpm) of the polishing table 107 increases linearly from time t3 to time t6, and is maintained at a constant speed of 200 (rpm) from time t6 to time t9.

[0181] The rotation speed (rpm) of the polishing table 107 is linearly increased from time t9 to time t12, and is maintained at a constant rotation speed of 300 (rpm) after time t12. FIG. 39( a ) shows the change in frequency (Hz) generated from the polishing table 107 , the resin-sealed sample 105 , etc., and measured by the microphone 306 .

[0182] 39(a), as the rotation speed (rpm) of the polishing table 107 gradually increases from time 0, the generated frequency increases to H1. During the period from time t1 to time t3, the rotation speed (rpm) is maintained at a constant 100 rpm, so the generated frequency changes little and remains approximately constant.

[0183] The rotation speed (rpm) of the polishing table 107 increases linearly from time t3 to time t6, so the generated frequency rises to H3. In one embodiment, the rotation speed (rpm) is maintained constant at 200 rpm from time t6 to time t9, so the generated frequency changes little and remains approximately constant.

[0184] In one embodiment, from time t9 to time t12, the rotation speed (rpm) increases linearly, so the generated frequency rises to H5. From time t12 onwards, the rotation speed (rpm) remains constant at 200 rpm, so there is little change in the generated frequency, and it remains approximately constant.

[0185] As described above, the generated frequency (Hz) changes depending on the change in rotation speed (rpm), the pressing force during polishing of the resin-encapsulated sample 105, the polishing state, the polishing speed, and the processed area. Therefore, by observing and measuring the frequency (Hz) acquired by the microphone 306, the polishing state can be grasped. In addition, it becomes possible to control the end and stop of the processing.

[0186] In the above embodiment, the microphone 306 may be replaced with a vibration sensor 309. The vibration measured by the vibration sensor 309 is converted to frequency (Hz). During polishing, vibrations associated with the processing occur. Furthermore, the vibrations associated with the processing are not sinusoidal waves, but are composed of multiple frequency components, each of which changes relatively randomly.

[0187] 40 is an explanatory diagram conceptually and schematically illustrating the relationship between data measured or observed by a sound collection means such as the microphone 306 and the processing area of ​​the processing surface 602 of the resin-sealed sample 105. When the area of ​​the processing surface 602 changes, the contact area with the polishing table 107 also changes, and therefore the generated frequency (Hz) also changes.

[0188] As shown in FIG. 40(b), the polishing table 107 is rotated, and the resin-sealed sample 105 is pressed against the polishing table 107 to polish the resin-sealed sample 105. During the polishing process, a sound (frequency (Hz)) is generated due to the process. When the area of ​​the processed surface 602 changes, the generated frequency (Hz) also changes. The generated frequency (Hz) is measured by the microphone 306.

[0189] The generated frequency varies depending on the material of the resin-sealed sample 105 and the object to be polished 102, the area being processed, the processing speed, the pressure against the polishing table 107, the condition of the abrasive, the material of the abrasive, the amount of cleaning liquid, etc.

[0190] The processing area at the start (t0) of processing the resin-sealed sample 105 is 0. The processing area increases during the period up to time t1, and no processing is performed from time t1 to time t3, so the processing area does not increase. During this period, the resin-sealed sample 105 is also polished, but polishing is performed to make polishing scratches shallower and to obtain a better processed surface 602. During this period, polarized light is irradiated onto the object 102 to be polished as illumination light, and the processed state, polished state, state of processing scratches, and processing position of the object 102 to be polished are observed.

[0191] The rotation speed (rpm) of the polishing table 107 increases the processed area during the period from time t3 to time t6. The resin-encapsulated sample 105 is polished, and the frequency changes as the processing proceeds. During the period from time t6 to time t9, no processing is performed and the processed area does not increase. The resin-encapsulated sample 105 is polished during this period as well, but polishing is performed to make the polishing scratches shallower and to obtain a better processed surface 602. For example, the number of polishing abrasive grains is changed to a higher number.

[0192] During the period from time t9 to time t12, the processed area is increased. The resin-sealed sample 105 is polished, and the frequency changes with the polishing. After time t12, no polishing is performed, and the processed area does not increase. FIG. 40( a ) shows the change in frequency (Hz) generated from the polishing table 107 , the resin-sealed sample 105 , etc., and measured by the microphone 306 .

[0193] In one embodiment, as shown in Figure 40(a), the generated frequency increases as the machining area of ​​the machining surface 602 increases. During the period from time t1 to time t3, the machining area remains constant, so the generated frequency changes little and remains approximately constant. Note that the term "constant frequency" is a conceptual expression for the purpose of explanation.

[0194] In one embodiment, during the period from time t3 to time t6, the machining area of ​​the machining surface 602 increases, so the generated frequency increases when the machining area changes, and then the generated frequency increases. During the period from time t6 to time t9, the machining area is maintained at a constant area, so the generated frequency changes little and is maintained at an approximately constant frequency. Note that the term "constant frequency" is a conceptual expression for the purpose of explanation.

[0195] In one embodiment, from time t9 to time t12, the machining area of ​​the machining surface 602 increases, so that the generated frequency increases when the machining area changes, and then the generated frequency increases.

[0196] As described above, the generated frequency (Hz) changes depending on the change in the processed area, the pressing force during polishing of the resin-sealed sample 105, the polishing state, the polishing speed, and the processed area. Therefore, by observing and measuring the frequency (Hz) acquired by the microphone 306, it is possible to grasp the change in the processed area and the polishing state. It also becomes possible to control the end and stop of processing. In the above embodiment, the microphone 306 may be replaced with a vibration sensor 309. The vibration measured by the vibration sensor 309 is converted into a frequency (Hz).

[0197] The liquid film sensor 303 measures the thickness of the liquid film, cleaning liquid film, and polishing liquid film on the polishing surface 505. Examples of the liquid film sensor 303 include a laser displacement meter, a film thickness measurement meter using optical interference, and a film thickness meter that estimates film thickness changes from changes in reflectance. The data processed by the controller circuit 711 is carried out taking into consideration the data from the liquid film sensor 303.

[0198] The liquid film sensor 303 is attached to a moving stage 310. The liquid film sensor 303 is configured so that it can be positioned by moving from the central axis of the polishing table 107 to the periphery. As shown in Figures 1, 2 and 3, the liquid film sensor 303 is positioned by moving in directions A and B.

[0199] The liquid film sensor 303 is moved and positioned above the polished surface 505 by the moving stage 310. The liquid film sensor 303 is aligned with the position where the resin-sealed sample 105 is processed, as shown by the dotted arrows in FIGS.

[0200] For example, when the resin-sealed sample 105 is processed at a position 15 cm from the center position of the polishing surface 505, the liquid film sensor 303 moves to a position 15 cm from the center position of the polishing surface 505. Therefore, the liquid film sensor 303 can measure, evaluate, and observe the liquid film on the polishing surface 505 on which the resin-sealed sample 105 is processed, the polishing state, and the state of the polishing liquid.

[0201] The positioning positions are concentric, as indicated by the dotted arrows, on which the resin-sealed sample 105 and the object to be polished 102 are arranged. The resin-sealed sample 105 and the like are polished, and the state of the liquid film on the polishing table 107 changes based on the processing state, the application state of the cleaning liquid, and the application state of the polishing liquid. The changing state is measured and observed by the liquid film sensor 303. The measurement data of the liquid film sensor 303 reflects the processing state of the resin-sealed sample 105 and the like.

[0202] The liquid film sensor 303 can observe and measure not only the state of the liquid film of the cleaning liquid, etc., but also the state of the polishing material and the polishing liquid. The microphone 306 measures the sound and vibration generated on the polishing surface 505, and the control circuit 711 controls and sets the rotation speed of the polishing table 107, the polishing pressure of the resin-encapsulated sample 105, etc. based on the measurement data from the liquid film sensor 303 and the microphone 306.

[0203] The data processing of the controller circuit 711 is carried out taking into consideration the data of the liquid film sensor 303. The controller circuit 711 controls the discharge amount of the cleaning liquid and the discharge amount of the polishing liquid based on the data of the liquid film sensor 303. The controller circuit 711 also adjusts and controls the rotation speed of the polishing table 107 and the polishing pressure of the resin-encapsulated sample 105.

[0204] The polishing sample holder (such as the polishing head 106) can be moved up (U1) and down (D1) as shown in Figures 3 and 41. By raising (U1) the polishing sample holder (such as the polishing head 106), the object to be polished 102 can be separated from the polishing surface 505 and the polishing pad 506. By lowering (D1) the polishing sample holder (such as the polishing head 106), the object to be polished 102 can be pressed against the polishing surface 505 and the polishing pad 506.

[0205] The robot arm 801 of the polishing processing device 700 is configured and formed by the polishing shaft 301, the rotating part 302, etc. Ascent (U1) and descent (D1) are performed by the robot arm 801, etc., as shown in FIG.

[0206] The pressure with which the polishing object 102 is pressed against the polishing surface 505 can be adjusted by adjusting the amount of lowering (D1) or raising (U1) of the polishing sample holder (polishing head 106, etc.). The pressure is adjusted based on the output data from the microphone 306 (sound intensity, changes in sound intensity, sound frequency, rate of change in sound frequency, etc.) or the vibration state, frequency, vibration change, and rate of vibration change of the polishing surface 505 measured by the vibration sensor 309. The pressure is also adjusted based on the output data from the liquid film sensor 303.

[0207] It is preferable that the lowering (D1) and raising (U1) be performed intermittently and in short increments. The raising (U1) and lowering (D1) operations will be explained using Figures 32, 33, 34, 35, 36, 37, 38, etc.

[0208] The lowering (D1) and the rising (U1) are synchronized with the timing of supplying the cleaning liquid and abrasives from the cleaning liquid supply nozzle 207 and the polishing liquid supply nozzle 307. They are also synchronized with the optical detection and photography means 206 that observes the processed surface 602.

[0209] The polishing processing apparatus 700 of the present invention includes a polishing head 106 that presses the object to be polished 102 against a polishing pad 506 on a polishing table 107 to polish it, a polishing liquid supply nozzle 307 that supplies a polishing liquid (e.g., slurry) to the polishing pad 506, a cleaning liquid supply nozzle 207 that supplies a cleaning liquid, and a controller circuit 711 that controls the polishing of the object to be polished 102.

[0210] The polishing table 107 is connected to a table motor 509 disposed below the table via a table shaft 108. The table motor 509 allows the polishing table 107 to rotate in the direction indicated by the arrow.

[0211] A microphone 306a is placed near the contact portion of the resin-sealed sample 105. Preferably, a microphone 306b is placed on the back surface of the polishing table 107. Also, a liquid film sensor 303 is placed to measure the thickness and change in thickness of the liquid film on the polishing surface 505.

[0212] As shown in Figures 1, 2, 3, 4, 9, 13, 16, 41, 84, 85, etc., the resin-sealed sample 105 is held, controlled, moved, and rotated by a robot arm 801 or the like.

[0213] A polishing pad 506 is attached to a pad support surface 508 of the polishing table 107. The pad support surface 508 is disposed on the upper surface of the polishing table 107. However, the polishing pad 506 may be on an arc as shown in FIG. 14(a). Alternatively, the polishing pad 506 may be configured to be disposed or positioned in an oblique direction as shown in FIG. 14(b).

[0214] 3, the upper surface of the polishing pad 506 constitutes a polishing surface 505 for polishing the object 102, the resin-encapsulated sample 105. Before polishing is completed, it is preferable to replace the polishing pad 506 with a buff.

[0215] 3 and 32, the polishing table 107 can move in an upward direction (U2) and a downward direction (D2). The resin-sealed sample 105 can be moved up and down. Furthermore, by lowering the polishing table 107 (in the D2 direction), the object to be polished 102 and the resin-sealed sample 105 can be moved away from the polishing surface 505. By raising the polishing table 107 (in the U2 direction), the object to be polished 102 and the resin-sealed sample 105 can be pressed against the polishing surface 505.

[0216] By adjusting the amount of lowering (in the D1 direction) or raising (in the U1 direction) of the polishing table 107, it is possible to adjust the pressure with which the object to be polished 102 and the resin-sealed sample 105 are pressed against the polishing surface 505. It is preferable to change the pressing state by repeatedly varying the strength of the pressure, as shown in Figures 32, 33, 34, 35, 36, 37, 38, 43, etc., and also by changing the moving speed.

[0217] By raising the polishing head 106 (in the U1 direction, the A direction), the object 102 to be polished can be moved away from the polishing surface 505. By lowering the polishing head 106 (in the D1 direction, the B direction), the object 102 to be polished can be pressed against the polishing surface 505.

[0218] A space is formed between the resin-sealed sample 105 and the polishing surface 505, and a polishing liquid containing an abrasive is supplied into the space from the polishing liquid supply nozzle 307, thereby polishing the resin-sealed sample 105.

[0219] A space is formed between the resin-sealed sample 105 and the polished surface 505, and a cleaning liquid such as water is supplied into the space from the cleaning liquid supply nozzle 207, thereby cleaning the polished surface of the resin-sealed sample 105.

[0220] By forming a film made of water, cleaning liquid, oil, surfactant, etc. on the polished surface, a film is formed on the polished surface 602. The formation of the film makes it possible to generate a good reflecting surface (mirror surface, optical image surface) as explained in Figures 66 and 67, and the polished state can be observed well.

[0221] By blowing air from the air exhaust pipe 795 onto the processed surface 602 of the resin-sealed sample 105, it is possible to remove polishing dust, water droplets, abrasives, etc. from the processed surface 602. Furthermore, by rotating the resin-sealed sample 105, it is possible to remove polishing dust, water droplets, abrasives, etc. from the processed surface 602.

[0222] By blowing air from the air exhaust pipe 795 and rotating the resin-sealed sample 105, the liquid film 604 on the processed surface 602 becomes uniform in thickness, polishing scratches are prevented from being visible, and a better reflective surface is obtained.

[0223] As shown in Figure 3(a), the polishing head 106 is configured to be rotatable in the direction of the arrow. The rotation direction is configured to be changeable. The rotation direction is also configured to be changeable periodically. The rotation speed is also changeable.

[0224] The polishing surface 505 rotates around the table axis 108. By rotating the polishing head 106 at high speed and supplying a cleaning liquid by high-pressure jet onto the polishing surface of the object 102 to be polished, the processed surface 602 can be cleaned. The polishing surface 505 may be fixed and the resin-sealed sample 105 may be moved over the polishing surface 505 to polish the resin-sealed sample 105.

[0225] 16 is an explanatory diagram for explaining the polishing method of the present invention. The polishing head 106, angle adjustment unit (rotating unit) 302, and polishing shaft 301 are illustrated schematically or conceptually for ease of understanding and drawing.

[0226] In one embodiment of the present invention, as shown in FIG. 4 etc., the resin-sealed sample 105 is held by a robot arm 801 etc., rotated, the accuracy of the resin-sealed sample 105 is adjusted, and the pressure with the polishing surface 505 is adjusted or controlled, thereby processing the resin-sealed sample 105.

[0227] In the embodiment of the present invention, the resin-sealed sample 105 is held and polished by the robot arm 801 or the like, but the present invention is not limited to this. For example, it goes without saying that the object to be polished 102 may be held by the robot arm 801 or the like and polished.

[0228] 16, the polishing head 106 is connected to the lower end of the polishing shaft 301. In the embodiment of FIG. 4, for example, the polishing shaft 301 and the angle adjustment unit (rotating unit) 302 are composed of a polishing shaft 301a, a polishing shaft 301b, a polishing shaft 301c, a polishing shaft 301d, an angle adjustment unit (rotating unit) 302a, an angle adjustment unit (rotating unit) 302b, an angle adjustment unit (rotating unit) 302c, an equipment mounting unit 703, a force sensor 702, a pressure sensor 126, a robot arm 801 such as a head mounting mechanism 754, etc.

[0229] The polishing head 106, polishing shaft 301, etc. are configured, for example, by a robot arm 801. The polishing head 106 is configured to hold the sample using a holder 721, or to hold the object to be polished 102 using vacuum suction technology, etc. The polishing shaft 301 is configured so that the angle of the resin-sealed sample 105 can be adjusted using an angle adjustment unit (rotation unit, position setting unit) 302.

[0230] The polishing shaft 301 is configured to move up and down and left and right by the operation of the up and down and left and right movement mechanism. Also, the polishing pressure of the resin-encapsulated sample 105 can be adjusted and controlled by detecting the polishing pressure with a force sensor 702.

[0231] The force sensor 702 is set to have the load of the force sensor 702 as the origin when the load is below a certain value, such as no load, when the force sensor 702 is under 0.1 kg. The load is set to the origin at a predetermined set value. At the origin, the push-in amount of the resin-sealed sample 105 is set to 1 mm, for example. The push-in amount is sequentially set to 0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, etc., and controlled to process the resin-sealed sample 105.

[0232] 32, 33, 34, 35, 36, 37, 38, etc. are performed based on the pressure applied to the force sensor 702. Tc is a pressure cycle, and one cycle consists of a time Tu when the pressure is high and a time Td when the pressure is low.

[0233] 33, if the polishing friction and polishing pressure increase when pressure Pa is applied during period Tu, the pressure is reduced to pressure Pb during period Td even if it is within period Tu. If the polishing friction and polishing pressure decrease below a predetermined value when pressure Pb is applied during period Tb, the pressure is increased to pressure Pa during period Tu even if it is within period Td.

[0234] The amount of pressure and the pressure cycle are variable and set based on the output data of the microphone 306. The amount of pressure and the pressure cycle are also variable and set based on the output data of the liquid film sensor 303.

[0235] The values ​​of the pressures Pa and Pb are changed based on the data detected by the force sensor 702 and the pressure sensor 126. In addition, Tc, Tu, and Td are changed and set. In addition, the values ​​of the pressures are changed and set based on the data detected by the force sensor 702 and the pressure sensor 126, as shown in Figures 32, 33, 34, 35, 36, 37, 38, etc. In addition, the values ​​of the pressures are changed and set based on the output data of the microphone 306 and the output data of the liquid film sensor 303.

[0236] The pressure value and the revolutions per minute (rpm) value are set and changed based on directional data such as X, Y, and Z directions detected by the force sensor 702 and the pressure sensor 126. The polishing position of the resin-sealed sample 105 on the polishing table 107 is also changed. Needless to say, the polishing controls shown in FIGS. 42 and 43 may be performed simultaneously.

[0237] The polishing head 106 and the polishing table 107 are rotated in the directions indicated by the arrows, and a polishing liquid (not shown) is supplied from the polishing liquid supply nozzle 307 onto the polishing pad 506. In this state, the polishing head 106 presses the object 102 to be polished against the polishing surface 505 of the polishing pad 506.

[0238] 32, 33, 34, 35, 36, 37, 38, etc., pressure adjustments are performed. Polishing controls are also performed as shown in Figures 41, 42, and 43. The surface of the workpiece 102 is polished by the mechanical action of the abrasive grains contained in the polishing liquid, or by the mechanical action of the abrasive grains and the chemical action of the polishing liquid.

[0239] Either the polishing head 106 or the polishing table 107 moves up and down to adjust the pressure applied to the polishing surface of the workpiece 102. As explained in Figures 32, 33, 34, 35, 36, 37, 38, etc., intermittent pressure fluctuations improve the dispersion of the polishing liquid (slurry) and the uniformity of the polished surface. Furthermore, by implementing the polishing control shown in Figures 42 and 43, the condition of the polished surface and the accuracy of the polishing position are improved.

[0240] It goes without saying that other embodiments of the present invention such as those shown in Figures 41, 42, 43, etc. can be applied to the embodiments of the present invention shown in Figures 3, 16, etc. It goes without saying that they can be combined in part or in whole with other embodiments.

[0241] The polishing processing apparatus 700 of the present invention is equipped with an optical image detection / photography means 206a for detecting and photographing an optical image from the side of the object to be polished 102 or the resin-sealed sample 105, and an optical image detection / photography means 206b for observing or photographing the object to be polished 102 or the reflected image of the object to be polished 102 from above or to the side of the object to be polished 102 or the resin-sealed sample 105.

[0242] The observation means 206, or optical image detection / photographing means 206, corresponds to an observer's eye, a camera, a still camera, a digital camera, a video camera, an optical member / element such as a photosensor, a photographing device, an imaging instrument, a visual system, an image recognition device, a position detection device, etc.

[0243] The polishing apparatus 700 of the present invention is equipped with an optical measuring device (thickness measuring device) (not shown) that measures the thickness of the object to be polished 102 and the resin-sealed sample 105. The optical measuring device (not shown) is equipped with a sensor module (not shown) that acquires an optical signal that changes in accordance with the thickness of the object to be polished 102 and the resin-sealed sample 105, and a processing unit that determines the thickness from the optical signal. It also has a distance sensor 757 that measures the distance from the polishing pad 506.

[0244] The sensor module (not shown) is disposed inside the polishing table 107, and the processing section is connected to a polishing control section (not shown). The sensor module (not shown) includes a sensor head that guides light to the surface of the object 102 to be polished and receives reflected light from the object 102 to be polished and the resin-sealed sample 105.

[0245] The sensor head rotates integrally with the polishing table 107 and acquires an optical signal of the object 102 to be polished held by the polishing head 106. The sensor module (not shown) is connected to a processing unit, and the optical signal acquired by the sensor module (not shown) is sent to the processing unit.

[0246] 16 is a schematic diagram and explanatory view showing a polishing apparatus 700 equipped with an optical measuring device of the present invention as one embodiment. The polishing table 107 is connected to a table motor 509 via a connecting means (not shown) such as a belt, and is rotated by the table motor 509. The rotation of the polishing table 107 causes the polishing head 106 to rotate in the direction shown by the arrow in FIG.

[0247] The rotation speed of the polishing head 106 differs when polishing the workpiece 102 and when cleaning the polished surface of the workpiece 102. When cleaning the polished surface of the workpiece 102, the polishing head 106 rotates at a high speed to clean the polished surface, form a film of moisture or the like on the polished surface, and remove moisture and abrasives from the polished surface. When cleaning the polished surface, a cleaning liquid is supplied from a cleaning liquid supply nozzle 207. In addition, air is blown onto the polished surface (machined surface) 602 from an air exhaust pipe 795 to remove dust, moisture, etc. from the machined surface 602.

[0248] When forming a liquid film 604 on the processing surface 602, a cleaning liquid mixed with a surfactant is supplied from the cleaning liquid supply nozzle 207. Examples of surfactants include soap and detergent solutions. The proportion of the surfactant in the aqueous solution is preferably 0.1% or more and 3.0% or less.

[0249] The polishing apparatus and polishing method of the present invention form a liquid film 604 on the surface 602 to be polished using a cleaning liquid or the like. The liquid film 604 flattens polishing scratches on the surface 602 to form a good mirror surface (reflective surface). By using the reflective surface, the polishing state and polishing position of the object 102 to be polished can be accurately grasped and measured. In addition, the polishing state of the object 102 to be polished can be clearly observed.

[0250] It is sufficient that either the illumination light illuminating the object to be polished 102, the reflected light reflected by the object to be polished 102, or the reflected light reflected by the processing surface 602 is polarized. Preferably, both the illumination light and the reflected light are polarized. By using polarized light to observe the object to be polished 102, the influence of stray light generated within the resin-encapsulated sample 105 can be reduced, and the polishing state of the object to be polished 102 can be observed well.

[0251] A liquid film 604 is formed or generated on the processed surface 602 of the resin-sealed sample 105. The liquid film 604 can be easily formed or generated by leaving a cleaning liquid or the like used during processing on the processed surface 602. Alternatively, the liquid film 604 may be formed or generated by separately applying a surfactant that forms or generates the liquid film 604 to the processed surface 602.

[0252] A cleaning liquid is supplied from the cleaning liquid supply nozzle 207. The cleaning liquid is also supplied with a surfactant mixed therein. The cleaning liquid washes away the abrasive grains on the machined surface 602. After cleaning, the cleaning liquid or the solution mixed with the surfactant forms a liquid film 604 on the polishing scratches, improving the reflectivity of the machined surface 602. Furthermore, the machined surface 602 becomes more mirror-finished, or the polishing scratches become less noticeable.

[0253] Therefore, at a stage where the abrasive grain number is small, the processed surface 602 becomes closer to a mirror finish, and the reflected image of the electrode terminal 101 of the workpiece 102, etc., reflected in the mirror surface can be observed. Also, the cross-sectional processed state due to the polishing process can be clearly observed. Furthermore, if necessary, air is blown onto the processed surface 602 from the air exhaust pipe 795 to remove the abrasive grains and polishing liquid from the processed surface 602.

[0254] When polishing, you can achieve a fine finish by starting with the coarseest number and gradually moving to larger numbers. First, use #80 and #150, then #400 and #800, and for the finishing touch, use #2000, etc. The # indicates the number of the abrasive paper, etc.

[0255] Numbers such as #1000 and #3000 indicate the size of the abrasive grain. Abrasive grains are abrasive materials, and by polishing from small, coarse numbers to gradually increasing numbers, the processed surface (polished surface, cut surface) 602 can be finished beautifully.

[0256] When the abrasive grain size is #400 or less, there are polishing scratches on the processed surface 602 of the resin-sealed sample 105, and the observation state of the image of the electrode terminal 101 on the processed surface (polished surface, cut surface) 602 is poor. When the abrasive grain size is #1000 or more, the polishing scratches on the processed surface (polished surface) 602 are reduced, and the observation state of the image of the electrode terminal 101 on the processed surface (polished surface, cut surface) 602 is good.

[0257] In the present invention, the object 102 to be polished is illuminated with illumination light, and the processed surface 602 of the object 102 to be polished is used as a light-reflecting surface. The image of the object 102 reflected by the light-reflecting surface is observed. Polarized light is used as the illumination light or the reflected light of the reflected image. It is preferable that both the illumination light and the reflected light are polarized.

[0258] In the polishing method of the present invention, an image reflected by the processing surface 602, for example, an image reflected from the electrode terminal 101 of the object 102 to be polished, is observed. By understanding the processing state at the early stage of the polishing process and carrying out the polishing process, good polishing can be achieved. At the early stage of the polishing process, the abrasive grain number is small. When the abrasive grain number is small, the processing scratches on the processing surface are large. Therefore, it is important to be able to observe the processing surface 602 at the stage when the abrasive grain number is small.

[0259] The present invention forms or generates a liquid film 604 on the processed surface 602 and fills the polishing scratches with the liquid film 604, thereby flattening the processed surface 602, reducing the effects of the polishing scratches, and making the processed surface 602 closer to a mirror finish. Therefore, even when the abrasive grain number (#) is small, the reflected image of the processed surface 602 can be clearly observed.

[0260] 16(a), light 205 is emitted from a light irradiator 201, and the light 205 is converted into polarized light 205a by a polarizing plate (polarizing element, polarizing film) 202a. The polarized light 205a illuminates the object to be polished 102, the resin-sealed sample 105, or the object to be polished 102 inside the resin-sealed sample 105.

[0261] Light reflected within the resin-sealed sample 105 passes through the polarizing plate 202c and enters the camera 206b. Unpolarized light (random light) is scattered within the object to be polished 102 and the resin-sealed sample 105, becoming stray light. The occurrence of stray light makes the outline and position of the object to be polished 102 unclear. In the embodiment of FIG. 16, the object to be polished 102 and the like are imaged using polarized light 205c, so the polishing state of the object to be polished 102 can be clearly grasped and recognized.

[0262] In the present invention, the processing surface 602 is mirror-finished by forming or generating a liquid film 604 on the processing surface 602. Polarized light is reflected by the mirror surface of the processing surface 602, and the object 102 to be polished is imaged using the reflected polarized light, allowing for excellent observation of the polishing state of the object 102 to be polished. In addition, the polishing state of the object 102 to be polished can be observed in real time.

[0263] In the polishing apparatus and polishing method of the present invention, a liquid film 604 is formed on the processing surface 602, so that polishing scratches on the processing surface 602 are flattened by the liquid film 604, and a good mirror surface (reflective surface) can be constructed and formed. Therefore, the polishing state and polishing position of the object 102 to be polished can be accurately grasped and measured.

[0264] Note that one of the polarizing plates 202a and 202c may be omitted. In other words, it is sufficient if either the illumination light illuminating the workpiece 102, the reflected light reflected by the workpiece 102, or the reflected light reflected by the processing surface 602 is polarized. It is preferable to polarize both the illumination light and the reflected light.

[0265] In the example shown in FIG. 16(a), the resin-sealed sample 105 is tilted and the processed surface 602b is processed. By polishing the processed surface (polished surface) 602b, a flat processed surface 602b is formed. The flat surface of the processed surface 602b has scratches caused by the abrasive. However, the processed surface 602b is cleaned during polishing, and a liquid film 604 is formed on the polished surface by the cleaning liquid, giving the processed surface 602b a mirror finish and enabling it to reflect light well. In addition, air is blown onto the processed surface from the air exhaust pipe 795 to remove the abrasive particles and polishing liquid from the processed surface 602b.

[0266] As the polishing area increases, the reflective surface also increases. Furthermore, as the polishing nears completion, the polishing number increases, polishing scratches become smaller, and a good polished surface is formed. Therefore, the reflection on the processed surface 602b becomes good, and the polishing position of the workpiece 102 can be observed clearly. If there are polishing scratches on the processed surface 602, the polishing scratches will scatter light, making it difficult to observe the image of the electrode terminal 101 reflected on the processed surface 602a.

[0267] As the polishing process progresses, the area of ​​the processed surface 602 increases. As the area of ​​the processed surface 602 changes, the frequency, intensity, etc. of the sound generated on the polishing surface also change. The frequency and intensity of the sound are collected by the microphone 306, and the controller circuit 711 adjusts or changes the pressure applied to the resin-sealed sample 105 during the polishing process.

[0268] The frequency, intensity, etc. of the sound generated on the processed surface 602 change depending on the amount or timing of the cleaning liquid supplied from the cleaning liquid supply nozzle 207. The frequency and intensity of the sound are collected by the microphone 306, and the controller circuit 711 adjusts or changes the pressure applied to the resin-sealed sample 105 during polishing.

[0269] The amount or timing of the cleaning liquid is detected by the liquid film sensor 303. The detected data is transmitted to the controller circuit 711. The controller circuit 711 adjusts or changes the pressure (pressure) applied to the resin-sealed sample 105 during polishing.

[0270] A cleaning liquid is supplied from the cleaning liquid supply nozzle 207. The cleaning liquid is also supplied with a surfactant mixed therein. The cleaning liquid washes away the abrasive grains on the machined surface 602. After cleaning, the cleaning liquid or a solution mixed with a surfactant forms a film on the polishing scratches, giving the machined surface 602 a mirror finish or making the polishing scratches less noticeable. Therefore, when the abrasive grain number is small, the machined surface 602 becomes closer to a mirror finish, allowing for clear observation of the reflected image of the electrode terminal 101 reflected on the machined surface 602.

[0271] After washing away the abrasive grains on the processing surface 602 with a cleaning liquid, the cleaning liquid or the like is supplied between the polishing table 107 and the processing surface 602, and the cleaning liquid or the like is filled or interposed between the polishing table 107 and the processing surface 602. A liquid film 604 is formed on the processing surface 602, and the processing scratches on the processing surface 602 are filled with the liquid film, thereby reducing the effect of polishing scratches on the processing surface 602.

[0272] The refractive index of air is 1.0, and the refractive index of the resin of the resin-sealed sample 105 is approximately 1.6. Therefore, the difference in refractive index between the resin-sealed sample 105 and air causes a light-reflecting surface to be generated on the processed surface 602. This reduces the influence of polishing scratches generated on the processed surface 602, and makes it possible to clearly observe the image of the electrode terminal 101 reflected on the processed surface 602a (mirror surface, optical image-forming surface).

[0273] Instead of a cleaning solution, vaseline, lubricating oil, or the like may be applied to the processing surface 602. For example, colored vaseline is an example. White vaseline is a purified product made by bleaching a mixture of hydrocarbons obtained from petroleum.

[0274] Vaseline is a bleached and refined mixture of hydrocarbons obtained from petroleum, containing mostly branched-chain paraffins (isoparaffins) and alicyclic hydrocarbons (cycloparaffins, naphthenes). In other words, it forms a viscous, light-transmitting material that can be applied or formed onto the work surface 602.

[0275] Another example of a material that can be applied or formed on the processing surface 602 is oil. Oil is a hydrophobic chemical substance that phase separates from water and is extracted from animals, plants, minerals, etc., and is usually a mixture of many compounds. In a narrow sense, it refers to fats and oils, but in a broad sense, it also refers to things other than fats and oils, such as petroleum, which is primarily composed of hydrocarbons, and essential oils, which are primarily composed of terpenoids.

[0276] Viscous Vaseline and oil can fill polishing scratches on the processed surface 602 more effectively than water, and can therefore form or generate a better reflective surface on the processed surface 602. The liquid film 604 formed on the processed surface of the present invention includes relatively viscous liquids such as Vaseline and oil. Therefore, the liquid film 604 may be any material that is fluid and optically transparent. In the embodiment of the present invention, the liquid film 604 formed or generated on the processing surface 602 is water, and will be described as a water film.

[0277] Figure 16(b) is an explanatory diagram illustrating a state in which polishing of the protrusions C and C' indicated by the arrows in Figure 56 has been completed and polishing is being performed to flatten the central portion of the resin-sealed sample 105. The processing changes from Figure 16(a) to Figure 16(b) can be achieved by controlling the angle adjustment unit 302. The angle adjustment unit 302 is a rotating unit having a rotation mechanism.

[0278] 16(b), the processed surface 602a is flattened and a liquid film 604 made of water or the like is formed on the processed surface 602. The formation or generation of the liquid film 604 makes the processed surface 602 a better reflecting surface.

[0279] Light emitted from the light irradiator 201 is polarized by a polarizing plate 202a to form polarized light 205a. Examples of the light irradiator 201 include a white LED, an incandescent lamp, a xenon lamp, a metal halide lamp, a tungsten lamp, and a laser as a light source. The LED may be a single color such as red, green, or blue.

[0280] When the observation means 206 is the human eye, it is preferable to use green light (wavelength 450 to 600 nm) as illumination light, which has high visibility. When the observation means 206 is an infrared camera, it is preferable to use infrared light with a wavelength of 650 nm or more as illumination light. When infrared light is used, the influence of external light is reduced and the reflective state of the processed surface 602 is often good, which is preferable. By turning on and off the irradiation of the light 205 and synchronizing it with the observation timing of the camera 206 as a photographing means, the observation state and observation accuracy are improved. When observing the processed surface 602a, a space (air layer) is formed between the processed surface 602a and the polishing pad 506. In addition, a liquid film 604 is formed on the processed surface 602a.

[0281] Because the polarized light 205a is incident from the side surface of the resin-sealed sample 105, the angle of incidence of the light on the surface of the resin-sealed sample 105 is small. Therefore, the incidence angle of the light is far from the critical angle for total reflection, and the proportion of reflected light is small. Therefore, the illumination light 205a is incident on the surface of the resin-sealed sample 105 with almost no reflection, and stray light is unlikely to occur.

[0282] In the resin-sealed sample 105, by bringing the angle of light incident on the processed surface 602 closer to the critical angle, the proportion of light reflected by the processed surface 602 increases, and stronger reflected light 205b can be obtained. Therefore, the angle of the illumination light 205a incident from the side surface of the resin-sealed sample 105 is adjusted so that the reflected light 205b reflected by the processed surface 602 increases. In the present invention, the illumination light 205a is incident from the side surface of the cylindrical resin-sealed sample 105, so that adjustment of the illumination light 205 is easy.

[0283] At the processed surface 602a of the resin-sealed sample 105, the polarized light 205a is at or above the critical angle, and basically, it is possible to achieve total reflection or a state close to total reflection, or to obtain an intensity of reflected light 205b that is easy to observe.

[0284] Because a liquid film 604 is formed on the processed surface 602, polishing scratches are filled with the liquid film 604, and the processed surface 602 functions as a good mirror surface. Polarized light 205a is reflected by the processed surface 602 and exits from the side surface of the resin-sealed sample 105. The exiting light 205b passes through the polarizing plate 202b and enters the imaging means 206a.

[0285] In particular, when the sealing resin of the resin-sealed sample 105 is a resin with a relatively high refractive index, such as epoxy resin, the difference in refractive index with air becomes large, resulting in a high reflectance. Furthermore, total reflection can be achieved even if the critical angle θs is small. By increasing the reflectance, the generation of stray light within the resin-sealed sample 105 can be reduced, making it easier to observe the processed state of the polishing object 102.

[0286] The polarization axes of the polarizing plates 202a and 202b are aligned, or adjusted to maximize the transmittance of light passing through the two polarizing plates 202. By using at least one of the illumination light 205a and the reflected light 205b as polarized light, the influence of stray light generated within the resin-encapsulated sample 105 can be reduced, making it easier to observe the processed state of the object 102 to be polished.

[0287] Ultrasonic waves are applied to the resin-sealed sample 105 to vibrate it so that the liquid film 604 is well formed on the processed surface 602a. By vibrating it, the liquid film 604 is well formed or generated on the polishing scratches on the processed surface 602, and the reflectance of the processed surface 602 becomes good.

[0288] Light 205c reflected by the processing surface 602a toward the cylindrical axis side of the resin-sealed sample 105 passes through the polarizing plate 202c and enters the image capturing device 206b. The polishing state of the processing surface 602a and the polishing state and position of the object 102 to be polished can be observed using the images captured or observed by the image capturing devices 206a and 206b. By rotating the rotating unit 302, the angle at which the captured image is optimized can be adjusted, or the angle of the light irradiator 201 can be adjusted.

[0289] As the polishing of the object to be polished progresses, polishing scratches on the processed surface 602 decrease at the stage of polishing with a higher abrasive grain number. In this case, by lowering the polishing table 107 (in the direction D2) or raising the polishing head 106 (in the direction U1), an air layer can be created between the object to be polished 102 or the resin-encapsulated sample 105 and the polishing surface 505. In addition, air is blown into the air layer from the air exhaust pipe so that the liquid film 604 is coated with an appropriate thickness. The movements in the U1 / D1 direction and the U2 / D2 direction (FIG. 3, etc.) are synchronized with the image capturing timing of the camera 206.

[0290] The refractive index of the air layer is 1.0, and the refractive index of the resin-sealed sample 105 is 1.55 because it is made of epoxy resin etc. Due to the difference in refractive index between the air layer and the resin-sealed sample 105 and the object 102 to be polished, a light-reflecting surface is generated on the processed surface 602.

[0291] Therefore, the reflectivity of the processed surface 602 is improved, and the image of the electrode terminal 101 reflected on the processed surface 602 can be clearly observed. The water or solution adhering to the processed surface 602 can be removed by centrifugal force by rotating the polishing head 106 at high speed. Alternatively, the water or solution can be removed by centrifugal force by rotating the resin-encapsulated sample 105 at high speed. The centrifugal force allows a liquid film 604 with a uniform thickness to be formed on the processed surface 602.

[0292] As shown in Fig. 56, the sealing resin is raised at the portion (C) indicated by the arrow on the upper part of the resin-sealed sample 105. This is because, in the method for producing the polishing object shown in Fig. 49, the sealing resin 115 adheres to the periphery of the sealing pipe 103 of the polishing sample, and an interface phenomenon, a capillary phenomenon, etc. occur.

[0293] The resin-sealed sample 105 is first polished at the portion (C) indicated by the arrow in FIG. 56. As shown in FIG. 16(a), the resin-sealed sample 105 is held by a polishing head 106. The polishing head 106 is attached to a polishing shaft 301, and the polishing angle is adjusted, set, or changed by an angle adjustment unit 302. The polishing head 106 is also rotated. The polishing shaft 301 and other components are configured by a robot arm 801.

[0294] The polishing table 107 rotates, and a polishing liquid (slurry) (not shown) is supplied from a polishing liquid supply nozzle 307. The resin-sealed sample 105 is pressed against the polishing surface 505, thereby polishing the portion indicated by the arrow in FIG. 56. The pressure adjustment to the resin-sealed sample 105 is set or changed taking into consideration the output data of the microphone 306 and the liquid film sensor 303.

[0295] Figure 57 shows the state after polishing the arrowed portion. The processing of portion C is called "head grinding." The processing device that performs "head grinding" is called the "head grinding processing device." After the head grinding is performed, portion B is processed, and then portion D is processed. By processing portion C, resin-sealed sample 105 has the shape shown in Figure 54(b), and by processing portion B, resin-sealed sample 105 has the shape shown in Figure 54(c).

[0296] Fig. 57(a) is a side view of the resin-sealed sample 105, and Fig. 57(b) is a top view of the resin-sealed sample 105. After polishing the portion indicated by the arrow in Fig. 56, the processed surface 602b shown in Fig. 57(a) is polished and processed into a mirror finish.

[0297] 16(b), the resin-sealed sample 105 is turned upside down and attached to the polishing head 106. The polishing head 106 or the polishing shaft 301 is moved to position the processing surface 602a of the resin-sealed sample 105 so that it contacts the polishing surface 505, and the processing surface 602a is then processed. The polishing head 106 is also rotated.

[0298] The polishing table 107 rotates, and a polishing liquid (slurry) (not shown) is supplied from the polishing liquid supply nozzle 307. The resin-encapsulated sample 105 is pressed against the polishing surface 505, thereby polishing the processed surface 602a.

[0299] 3(b), the processed state of the electrode terminal 101 is observed from the side of the resin-sealed sample 105 by the optical image detection / photography means 206a. The observation means 206a and the optical image detection / photography means 206a may be the observer's visual sense (eyes), or may be an imaging / display device consisting of a camera, a monitor, etc.

[0300] Images of the electrode terminals 101 are observed from the top surface of the resin-sealed sample 105 and from the bottom surface (processed surface 602b) of the resin-sealed sample 105 by the optical image detection / photographing means 206b.

[0301] As shown in FIGS. 48, 56 and 57, in the embodiment of the present invention, cross-section polishing is performed at a cross-sectional position 706 of line CC', which is the center of the electrode terminal 101.

[0302] When polishing the object 102, it is necessary to know the actual or relative dimensions of the object 102. Therefore, it is necessary to measure the height H and width W of the object 102.

[0303] As shown in Figure 57 etc., the resin-sealed sample 105 has a cylindrical shape. The H2 direction is the planar direction of the cylinder, so the length H2 can be measured. On the other hand, the length W2 is in the cylindrical direction and is curved (circular), as shown in Figure 57(b), so it is bent by the refractive index and cannot be measured directly.

[0304] However, if the length of H2 can be measured, the relative length of W2 can be determined from the length of H2. Also, if the length H1, which is known as the length H1 formed by a laser marker device (not shown), is known, the actual length of H2 can be determined from H1.

[0305] The formation of H1 and H2 is not limited to using a laser marker device. They may be formed on the workpiece 102 from the beginning. Also, the length of the electrode terminal 101 formed or placed on the workpiece 102 may be measured in advance and used.

[0306] If the length W1, which is determined as the length W1 formed by a laser marker device (not shown), is known, the actual length from W1 to W2 can be determined. The lengths H2 and W2 can be measured by the optical image detection / photography means 206. The length A of the electrode terminal 101 can be determined from the length H2 or H1. Polarized light is used as the illumination light during measurement.

[0307] Since the resin-sealed sample 105 is cylindrical and the cylindrical resin-sealed sample 105 is surrounded by air, the image of the object to be polished 102 is distorted when the object to be polished 102 is observed.

[0308] As shown in Figure 72, when a rectangular container is filled with the solution and a resin-sealed sample 105 is immersed in the solution, the difference in refractive index between the resin that makes up the resin-sealed sample 105 and the solution disappears or becomes small, and the actual dimensions of W (W1, W2), H (H1, H2), and A in Figure 57 can be measured or understood.

[0309] Epoxy resin or acrylic resin is used as the sealing resin for the sealed sample 105. The refractive index of epoxy resin is 1.55 to 1.61, and the refractive index of acrylic is generally 1.49. Therefore, it is preferable to use a solution with a refractive index close to that of the sealing resin to be used.

[0310] Examples of optical coupling liquid 200 include edible oil, 2-propanol, methyl salicylate (refractive index 1.538), ethylene glycol (refractive index 1.431), carbon tetrachloride (refractive index 1.46), benzene (refractive index 1.50), and paraffin oil (refractive index 1.48). The refractive index of water is 1.33. It is preferable to use a gel or liquid with a refractive index of 1.30 or more and 1.65 or less as the optical coupling liquid 200.

[0311] The optical coupling liquid 200 may be in either a gel or liquid state. Furthermore, it is not limited to a high refractive index solution, and may be, for example, water (refractive index: 1.33). The optical coupling liquid 200 reduces the amount of light reflected from the interface, making observation and measurement easier.

[0312] The container 109 is made of soda glass or light lime glass, and is filled with an optical coupling solution 200, and the resin-sealed sample 105 is immersed in the optical coupling solution 200. A light-absorbing film such as black paint is formed or placed on the outer or inner surfaces (Sa, Sb, Sc, Sd) of the container 109 to absorb stray light.

[0313] Examples of black paints and light-absorbing films include those made by incorporating carbon into organic materials such as acrylic resins, or those made by dispersing black beads in similar organic materials. Other examples include those made by incorporating cyanine black, a phthalocyanine pigment with high electrical insulation properties, into a resin vehicle, and polarizing films (polarizing plates).

[0314] By forming black paint or a light-absorbing film on the outer or inner surface (Sa, Sb, Sc, Sd) of the container 109, stray light and reflected light at the interface of the container 109 are reduced, allowing for good observation of the object to be polished or the resin-sealed sample 105.

[0315] The observation condition is improved when polarized light is used as the observation light. When polarized light is used, it is effective to configure the polarizing plate 202 so that its absorption axis is perpendicular to the absorption axis of the polarizing plate or polarizing film disposed on the outer surface of the container 109.

[0316] According to the embodiment of the present invention shown in FIG. 72, the influence of the cylindrical shape of the resin-sealed sample 105 is eliminated, and the actual dimensions of W (W1, W2), H (H1, H2), and A in FIG. 57 can be measured or grasped.

[0317] 66 is an explanatory diagram of the polishing method of the present invention. As an example, this is a method of polishing the cross section of the electrode terminal 101 at the cross section position 706 of the line CC'. The polishing device 700 has been explained in FIGS. 3 and 16, so a description thereof will be omitted.

[0318] 66, the photographed image 308a is an image and a schematic illustration of a photographed image seen from approximately the side direction of the resin-sealed sample 105. The photographed image 308b is an image and a schematic illustration of a photographed image of the processed surface 602b of the resin-sealed sample 105.

[0319] The captured image 308b below the processing surface 602a is a reflected image 208 consisting of light reflected from the electrode terminal 101 of the workpiece 102 that is reflected by the processing surface 602. The captured image 308a above the processing surface 602a shows a real image of the electrode terminal 101 that is reflected from the electrode terminal 101 of the workpiece 102. The state in which the reflected image 208 of the electrode terminal 101 and the real image of the electrode terminal 101 are simultaneously observed by the observation means 206 is schematically illustrated.

[0320] When the processed surface of resin-sealed sample 105 is processed, the length of distance D becomes shorter. The length A of the electrode terminal does not change. To be precise, when polishing resin-sealed sample 105, A of reflected image 208 observed from the side of resin-sealed sample 105 and A of real image differ depending on the length of the optical path distance. Therefore, Figures 66 and 67 are schematic drawings to make explanation and understanding easier.

[0321] The processed surface 602a of the resin-sealed sample 105 is polished as shown in Figure 16(b). As shown in Figure 66, the polishing proceeds from the processed surface 602a in the direction of the arrow. The length of the electrode terminal 101 is A. A liquid film 604 is formed on the processed surface 602a, which functions as a reflective surface.

[0322] For ease of understanding and explanation, at the start of polishing, as shown in Figure 66(a), the distance between the electrode terminal 101 in the photographed image 308a and the reflected image 208 of the electrode terminal 101 in the photographed image 308b is defined as D. Half of the distance D is the length from the bottom end of the electrode terminal 101 to the processing surface 602. The reflected image 208 is an image reflected on the processing surface 602, and is illustrated as a reflected image of the bottom end of the real image at a position half the distance D from the bottom end of the real image on the processing surface 602.

[0323] As the polishing process progresses, the distance from the bottom end of the electrode terminal 101 to the processed surface 602 becomes shorter. In other words, as the polishing process progresses, the distance D becomes shorter. Figure 66(b) shows the state where the distance D has become 0. Figure 66(b) shows the state where the bottom end of the electrode terminal 101 becomes the processed surface 602.

[0324] The processed surface 602a is polished flat, and a liquid film 604 is formed on the processed surface 602a, and the liquid penetrates into the polishing scratches, turning the processed surface into a reflective surface. The liquid film 604 is formed on the processed surface 602a, and it functions as a reflective surface.

[0325] The fewer polishing scratches on the reflective surface, the better the reflection of light from the processed surface 602. A water film is formed on the processed surface 602, generating a reflected image 208 of the electrode terminal 101. Note that distances and lengths such as A and D are not actual distances (actual dimensions), but are lengths described for ease of understanding. As the polishing of the resin-sealed sample 105 progresses, the distance between the bottom end of the electrode terminal 101 and the processed surface 602 becomes shorter, and the length D becomes shorter.

[0326] In Figure 66(b), the distance D between the electrode terminal 101 and the reflected image 208 is 0. The state of distance D is a state in which the bottom end of the electrode terminal 101 coincides with the processing surface 602. At this time, the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 appear to be connected, and the total length of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is 2A. Illumination light 205a is reflected by the electrode terminal 101 of the workpiece, and the light reflected by the workpiece becomes reflected light 205b on the processing surface 602. As the polishing process continues, the electrode terminal 101 is polished and shortened. Figure 66(c) shows the state in which the length of the electrode terminal 101 has been polished to half its original length.

[0327] As shown in Figure 66(c), the combined length of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is A. Figure 66(c) shows the state in which the electrode terminal 101 has been polished by half the distance. The electrode terminal 101 has been cross-section polished at cross-section position 706 of line CC'. Therefore, when the polishing process is completed in Figure 66(c), the electrode terminal 101 has been cross-section polished to the half position (center).

[0328] By using polarized light for at least one of the illumination light 205a and the reflected light 205b used during processing, it is possible to reduce or prevent light unnecessary for observation, such as stray light generated within the resin-sealed sample 105.

[0329] As described above, a liquid film 604 is formed or generated on the processing surface 602, and polishing is performed while observing or grasping the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101. By simultaneously observing the real image and reflected image of the object 102 to be polished, cross-section processing at a predetermined position can be achieved. In the example of Figure 66(c), a cross-section of the object can be polished at the center of the electrode terminal 101. Also, a cross-section of the object can be polished at a predetermined position of the electrode terminal 101. As shown in FIG. 66(d), by further performing polishing processing from FIG. 66(c), it is possible to obtain polished objects at locations other than the electrode terminals 101.

[0330] Fig. 66 is an explanatory diagram of a case where the object to be polished 102 is arranged vertically on the resin-sealed sample 105. Fig. 67 is an explanatory diagram of a case where the object to be polished 102 is arranged obliquely on the resin-sealed sample 105.

[0331] The case of Figure 67 is similar to Figure 66. The processed surface 602a of the resin-sealed sample 105 is polished as shown in Figure 16(b) etc. As shown in Figure 67(a), the polishing proceeds from the processed surface 602a in the direction of the arrow. It is preferable to use polarized light 205 as illumination light during observation. A reflected image 208 of the electrode terminal 101 is projected onto the processed surface 602.

[0332] 67(a), the object 102 to be polished, which is resin-sealed in the resin-sealed sample 105, is sealed at an angle. Therefore, the distance (D1 / 2) from the bottom end of the electrode terminal 101a to the processing surface 602 is different from the distance (D2 / 2) from the bottom end of the electrode terminal 101b to the processing surface 602. Therefore, it is necessary to achieve polishing processing that corrects the inclination of the object 102 to be polished.

[0333] As shown in Figure 67(a), the distance between electrode terminal 101a and reflected image 208a of electrode terminal 101 is D1, and the distance between electrode terminal 101b and reflected image 208b of electrode terminal 101 is D2. Therefore, D2 > D1. It is necessary to shorten the distance D2 so that electrode terminal 101 and reflected image 208 of electrode terminal 101 have a linear relationship as shown in Figure 66.

[0334] The angle is adjusted using angle adjustment unit 302 of polishing apparatus 700 of the present invention shown in Figure 16 etc., and the distance D2 is shortened compared to D1 as shown in Figure 67(a)->Figure 67(b)->Figure 67(c)->Figure 67(d), and polishing is performed so that the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 have a linear relationship as shown in Figure 66. The angle during polishing is adjusted using rotation unit 302 of polishing head 106 etc.

[0335] In Figure 67(c), the electrode terminal 101b and the reflected image 208b of the electrode terminal 101 form a straight line. In Figure 67(d), similar to Figure 66(c), when the polishing process is completed in Figure 67(d), the cross section of the electrode terminal 101 is polished at the 1 / 2 position (center).

[0336] As shown in Figure 67(d), the combined length of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 is A. Figure 66(c) shows the state in which the electrode terminal 101 has been polished by half the distance. The electrode terminal 101 has been cross-sectionally polished at cross-sectional position 706 of line CC'. Therefore, when the polishing process is completed at Figure 67(d), the electrode terminal 101 has been cross-sectionally polished at the half position (center). When exposing the cross section at approximately the center of the electrode terminal 101, the cutting is stopped at a distance 2A to a distance A between FIG. 66(b) and FIG. 66(c).

[0337] As described above, by observing or understanding the image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 and performing polishing, it is possible to obtain a cross-section polished object at the center of the electrode terminal 101. It is also possible to obtain a cross-section polished object at a predetermined position of the electrode terminal 101.

[0338] In the above embodiment, the processed surface 602 is observed, and the resin-sealed sample 105 or the like is polished to a predetermined position in the polishing step or polishing method. However, the present invention is not limited to this. FIG. 62 is an explanatory diagram of an embodiment of a method for polishing the resin-sealed sample 105 etc. to a predetermined position by measuring the weight.

[0339] 62(a), an object to be polished 102 is sealed in a resin-sealed sample 105. The weight of the object to be polished 102 in the resin-sealed sample 105 is small, and the sealing resin 115 accounts for most of the weight.

[0340] As shown in Figure 62(a), when polishing the resin-sealed sample 105 up to the CC' line, if the height of the resin-sealed sample 105 is L, the polishing process is completed when the resin-sealed sample 105 is polished down to a length K and reaches a height N.

[0341] 48 and 49, the resin-sealed sample 105 is formed from the polished sample sealing pipe 103, and therefore the upper and lower surfaces of the resin-sealed sample 105 are cylindrical and have the same area. The length of the resin-sealed sample 105 is proportional to the weight.

[0342] When the weight of the resin-sealed sample 105 in a state of length L is M, if a length K of the resin-sealed sample 105 is polished and removed, the weight is M×(LK) / L. Alternatively, the weight is M×N / L. Therefore, the polished length (polished amount) can be obtained by measuring the weight of the resin-sealed sample 105 with a weighing scale 122, as shown in FIG. 62(b).

[0343] In the embodiment of the present invention, the resin-sealed samples 105 are available in three sizes: large diameter L size, medium diameter M size, and small diameter S size. Since the weights of the L, M, and S sizes differ, the sizes can be distinguished by measuring the weight of the resin-sealed sample 105, as shown in Fig. 62(b).

[0344] Furthermore, even if the resin-sealed samples 105 have the same diameter, they differ in length L in FIG. 62(a). The difference in length L can be determined by the weight of the resin-sealed samples 105. Therefore, by polishing the processed surface 602a in FIG. 62(a) and measuring the weight, it can be determined that the length L has been reached when a predetermined weight is reached. Next, by processing the length K, polishing can be performed at the predetermined CC' line.

[0345] 62, the weight of the resin-sealed sample 105 is measured by the weight scale 122, but the weight change can be detected, measured, and grasped by detecting and measuring the pressure change to the pressure sensor 126. Therefore, it goes without saying that the length K can be obtained.

[0346] 63(a), the resin-sealed sample 105 having a height of L is polished to the target CC' line down to the position K1. When the weight of the resin-sealed sample 105 is measured, it is found that a length of L-(N+K1) has been removed from the resin-sealed sample 105 by the polishing process.

[0347] 63(b), the resin-sealed sample 105 having a height of L is polished to the target CC' line down to the position K2. When the weight of the resin-sealed sample 105 is measured, it is found that a length of L-(N+K2) has been removed from the resin-sealed sample 105 by the polishing process.

[0348] When the resin-sealed sample 105 having a height L is polished to the target CC' line, the weight of the resin-sealed sample 105 is M×N / L, and the polishing operation can be stopped at the CC' line.

[0349] 1, 2, 4, etc., a polishing apparatus 700 of the present invention holds a resin-sealed sample 105 on a polishing head 106 and performs polishing. The resin-sealed sample 105 is placed on a sample stage 715.

[0350] As shown in Figure 30, if a measurement support 123 is placed or formed in a recess 717 of a sample stage 715 and the weight of the resin-sealed sample 105 is measured via the measurement support 123, polishing can be performed up to the target position or near the target position.

[0351] Before polishing the resin-sealed sample 105, the weight of the resin-sealed sample 105 is measured, and the length to the polishing position CC' is measured or set. During the polishing process, the resin-sealed sample 105 is moved to the sample stage 715 according to the progress of the polishing process, and the weight of the resin-sealed sample 105 is measured. In the polishing process, the resin-sealed sample 105 is moved to the sample 105 at appropriate times by switching the polishing abrasive grains, so measuring the weight is not a particular issue.

[0352] When the resin-sealed sample 105 is placed on the sample stage 715, the measurement support 123 is pressed down by the weight of the resin-sealed sample 105. The amount of pressing down of the measurement support 123 is measured by the weight meter 122.

[0353] 30, the measurement support 123 is formed and arranged to correspond to the diameter of the resin-sealed sample 105. The recess 717 is configured to be deeper in stages, from recess 717a to recess 717b to recess 717c.

[0354] When the resin-sealed sample 105 is inserted into the recess 717, the weight of the resin-sealed sample 105 is applied to the measurement support 123. The measurement support 123 is disposed so as to correspond to the diameter of the recess 717.

[0355] A measurement support 123a is arranged corresponding to the recess 717a. When the resin-sealed sample 105 having a diameter of L is inserted into the recess 717a, the measurement support 123a is pressed, and the weight of the resin-sealed sample 105 having a diameter of L is measured by the weighing scale 122.

[0356] A measurement support 123b is arranged corresponding to the recess 717b. When the resin-sealed sample 105 having a diameter of M size is inserted into the recess 717b, the measurement support 123b is pressed, and the weight of the resin-sealed sample 105 having a diameter of M size is measured by the weighing scale 122.

[0357] A measurement support 123c is arranged corresponding to the recess 717c. When the resin-sealed sample 105 having a diameter of S size is inserted into the recess 717c, the measurement support 123c is pressed, and the weight of the resin-sealed sample 105 having a diameter of S size is measured by the weighing scale 122.

[0358] 62 and other examples have been described in which the amount of polishing, the length K, and the like are measured or determined by measuring the weight of the resin-sealed sample 105, but the present invention is not limited to this. For example, the length L of the resin-sealed sample 105 may be measured using a distance sensor 757 or a laser length measuring device.

[0359] 62(a), laser light from a laser length measuring device (not shown) is incident on the processing surface 602a and the laser light reflected by the processing surface 602b is detected, thereby making it possible to obtain in real time the length L of the resin-sealed sample 105. The laser light is incident on the processing surface 602a from multiple points and the length of the resin-sealed sample 105 at each point is measured, thereby making it possible to obtain the tilt of the resin-sealed sample 105 during polishing.

[0360] 30 and 62, the weight of the resin-sealed sample 105 is measured using a weighing scale 122 or the like, but the present invention is not limited to this. The device or mechanism for measuring the weight of the resin-sealed sample 105 may be formed or configured in the arm 801 in FIG. 4 or the polishing head 106 in FIG. 5.

[0361] By configuring the arm 801 and the polishing head 106 so that the weight of the resin-sealed sample 105 can be measured while it is held thereon, the weight can be measured in real time during polishing, and the processed length K in Figure 62 can be grasped or determined.

[0362] The electrode terminals 101 and the like described in Figures 66 and 67 are illuminated by a light irradiator 201 and detected or observed by an optical image detection / photography means 206. The illumination light 205a emitted from the light irradiator 201 is polarized, and the polarized light is irradiated onto the workpiece 102 to be polished. Furthermore, the reflected light 205b passes through a polarizing plate 202b, and the real image and reflected image are observed as polarized light, thereby reducing the influence of stray light and enabling better real image and reflected image observation. By polarizing at least one of the illumination light 205a and the reflected light 205b, the effect of reducing the influence of stray light is achieved.

[0363] When changing the polarization axes of the illumination light 205a and the reflected light 205b, wave plates (λ / 2 plate 210, λ / 4 plate 204) are used. The 1 / 2 wavelength plate 210 rotates the polarization direction of linearly polarized light. The 1 / 4 wavelength plate 204 converts linearly polarized light into circularly polarized light. By adjusting the rotation direction of the polarization axis or circular polarization, more stray light can be reduced and the observation can be made in an easier-to-see state. For the adjustment or setting of the rotation direction, a rotating device as shown in FIG. 64(c) is used.

[0364] Wave plates function by shifting the phase between two perpendicular polarization components of light waves. A typical wave plate is a birefringent crystal with the direction of the optical axis and thickness determined. When the crystal direction is selected so that the optical axis of the crystal is parallel to the surface of the plate and the crystal is cut into a plate, two axes, the ordinary axis with a refractive index of no and the extraordinary axis with a refractive index of ne, are obtained in the cut plane.

[0365] The ordinary axis is perpendicular to the optical axis, and the extraordinary axis is parallel to the optical axis. In the case of a light wave incident perpendicular to the plate, the polarization component along the ordinary axis travels through the crystal at a speed vo = c / no, while the polarization component along the extraordinary axis moves at a speed ve = c / ne. When the incident light exits the crystal, a phase difference occurs between the two components. When ne < no as in calcite, the extraordinary axis is called the fast axis and the ordinary axis is called the slow axis. When ne > no, the fast axis and the slow axis are reversed.

[0366] A 1 / 2 wavelength plate (Half-wave Retarders: λ / 2 plate) gives a phase difference of π(=λ / 2) to the electric field vibration direction (polarization plane) of the incident light. When the polarization plane of the incident light is incident at an azimuth angle of θ° with respect to the fast axis (or slow axis) of the wave plate, its vibration direction can be rotated by (2×θ°).

[0367] Therefore, when incident at an azimuth angle of 45°, the maximum rotation angle (=90°) is obtained. When it is desired to change the direction of the polarization plane of the irradiation light, the polarization plane can be moved only by the 1 / 2 wavelength plate without physically rotating it. When circularly polarized light is incident on a half-wave plate, it can reverse the direction of rotation of the polarization.

[0368] A half-wave plate outputs the two perpendicularly polarized components of incident light with a phase difference of π (= λ / 2). When the polarization direction of the incident light is at an azimuth angle of θ relative to the fast axis (or slow axis) of the wave plate, the polarization direction can be rotated by 2θ before output. In other words, when incident at an azimuth angle of 45°, the maximum rotation angle is 90° (DEG.). When the polarization components of the incident light are circularly or elliptically polarized, their direction can be reversed by passing them through a half-wave plate.

[0369] Quarter-wave retarders (λ / 4 plates) impart a phase difference of λ / 4 to the electric field oscillation direction (plane of polarization) of incident light. When the polarization plane of the incident light is incident at an azimuth angle of 45° (degrees) relative to the fast axis (or slow axis) of the wave plate, they can change linearly polarized light to circularly polarized light. They can also reversibly change circularly polarized light to linearly polarized light. When incident at an azimuth angle other than 45° (degrees), the light becomes elliptically polarized light.

[0370] A quarter-wave plate can be used in pairs with a polarizing filter to construct an optical isolator. In the present invention, the quarter-wave plate is used to remove unwanted back reflections and glare.

[0371] A quarter-wave plate outputs light with a phase difference of π / 2 (=λ / 4) between the two perpendicularly polarized components of the incident light. If the polarization direction of the incident light is at an azimuth angle other than 45° to the fast axis (or slow axis) of the wave plate, the output light will be elliptically polarized, and if it is at an azimuth angle of 45°, the output light will be circularly polarized.

[0372] When the polarization axis of the incident light is at 0° to the fast axis or slow axis, the polarization does not change and the outgoing light is also linearly polarized, when it is greater than 0° but less than 45° it becomes elliptically polarized, and when it is 45° it becomes circularly polarized. It is also possible to reversibly change circularly polarized or elliptically polarized incident light into linearly polarized light and output it. 64 is an explanatory diagram of a polishing apparatus 700 according to the present invention. The object to be polished 102 in the resin-sealed sample 105 is illuminated with light emitted from a light irradiator 201.

[0373] Examples of the light irradiator 201 include a monochromatic laser device, a white laser device, a xenon lamp irradiation device, a tungsten lamp irradiation device, an LED irradiation device, a backlight lighting fixture, and a fiber irradiation device.

[0374] In the polishing apparatus 700 of the present invention, as shown in FIGS. 19, 70, and 81, a laser beam 465 is irradiated from a laser device 464 onto the observation area or processing surface 602 of the workpiece 102. The laser beam 465 heats the observation area or processing surface 602 of the workpiece 102, causing changes in optical reflectance, etc. These changes and their distribution are measured with a thermometer 455 such as a thermal viewer, thermometer, temperature sensor, or thermocouple. From the temperature, temperature distribution, optical reflectance, and reflectance distribution, information data can be obtained about defective areas or observation areas in the polishing process, such as cracks 439, voids 436, breaks in the plating film, and the shading of the plating film. A large amount of information data can be obtained from the measurement results of the polishing process, and this information data is reflected in the polishing process.

[0375] In the above embodiment, the polishing portion, the processed surface 602, or the observation point is irradiated with the laser light 465. However, it goes without saying that the object 102 to be polished may be irradiated with X-rays or the like instead of the laser light 465, and changes, change distribution, etc. of the processed surface 602, the processed point, or the observation point may be measured or information data may be obtained.

[0376] In particular, when the polishing area is a solder joint, it is important to irradiate the solder joint with laser light 465 and measure or observe temperature changes, etc. Voids 436, cracks 439, etc. occur in the solder joint. It is also important to measure and store temperature data of the solder 486 area. Based on the obtained temperature data, the conditions for the polishing method and the observation method are set.

[0377] The observation device 206 may be an X-ray imaging device. Instead of the laser light 465, the object 102 to be polished is irradiated with X-rays or the like. The X-ray image (data) and optical image (data) of the object 102 to be polished change due to the laser light 465 or X-rays. Therefore, the temperature of the observation location is changed or set to acquire an X-ray image (data) and an optical image (data), and each data is recorded in the database of the structural analysis device. The temperature is measured using a thermometer 455 such as a radiation thermometer. In addition, the temperature or temperature distribution of the object or the target location is measured using a thermometer, temperature sensor, or thermocouple.

[0378] Since the resin-sealed sample 105 has a cylindrical shape, the light from the light irradiator 201 is diffusely reflected inside the resin-sealed sample 105, which can generate stray light. This causes a distribution of light intensity in the illumination state of the object to be polished 102, making it difficult to observe the state of the electrode terminals 101 of the object to be polished 102 and the state of the polishing process.

[0379] To address the above-mentioned issues, it is preferable to place a polarizing plate (polarizing film, polarizing sheet) 202 on the light-emitting side or light-incident side of the light irradiator 201, as shown in the embodiments of the present invention in Figures 64, 65, 68, 70, 73, 74, 75, 76, 77, 78, 79, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, and 94. It is also preferable to place a wavelength plate such as a λ / 4 or λ / 2 wavelength plate. Light 205a from the light irradiator 201 passes through the polarizing plate 202a and becomes polarized light 205b, which then illuminates the workpiece 102.

[0380] In Figure 64 etc., as an example, vertically linearly polarized light is shown with an up-down arrow, and horizontally linearly polarized light is shown with a left-right arrow. It goes without saying that the polarization direction is not limited to the up-down and left-right directions, but can also be freely set and changed to an oblique direction, etc., by changing the angle of the polarization axis of the polarizing plate.

[0381] As shown in Figure 64(c), the polishing processing apparatus 700 of the present invention is configured so that the polarizing plate 202, 1 / 4 wavelength plate (λ / 4 plate) 204, and 1 / 2 wavelength plate (λ / 2 plate) 210 can be arbitrarily adjusted or set at a positive angle (+θ) or a negative angle (-θ) relative to 0° (DEG.).

[0382] The quarter-wave plate 204 outputs the incident light with a phase difference of π / 2 (=λ / 4) between the two perpendicularly polarized components. If the polarization direction of the incident light is incident at an azimuth angle other than 45° with respect to the fast axis (or slow axis) of the wave plate, the output light becomes elliptically polarized light, and if it is incident at an azimuth angle of 45°, the output light becomes circularly polarized light.

[0383] 64(c), the elliptically polarized light to the circularly polarized light can be changed by rotating the fast axis (or slow axis) of the quarter-wave plate 204. By changing the state of elliptically polarized light to the circularly polarized light, the object 102 to be polished can be adjusted so that it is easiest to observe.

[0384] A half-wave plate outputs light with a phase difference of π (=λ / 2) between the two perpendicularly polarized components of the incident light. When the polarization direction of the incident light is at an azimuth angle of θ relative to the fast axis (or slow axis) of the wave plate, the polarization direction can be rotated by 2θ before output. In other words, when the light is incident at an azimuth angle of 45°, the maximum rotation angle is 90°.

[0385] If the polarization component of the incident light is circularly polarized or elliptically polarized, its direction can be reversed by passing it through a half-wave plate. By rotating the fast axis (or slow axis) of the half-wave plate 204, the elliptically polarized light can be changed to circularly polarized light. By rotating the polarization direction by 2θ and changing the state of elliptically polarized light to circularly polarized light, adjustments can be made so that the object 102 to be polished and the reflected image of the processing surface 602 can be most easily observed.

[0386] 64(a), the light 205b becomes reflected light 205c on the object to be polished 102. A part of the light 205c reflected on the object to be polished 102 becomes stray light and is diffused within the resin-sealed sample 105. In addition, the phase axis of the light 205c rotates.

[0387] 64(a), the λ / 2 plate 210 is arranged and set so that light is incident at an azimuth angle of approximately 45°. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are arranged to be perpendicular to each other.

[0388] The reflected light 205c is rotated by 90° by the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizing plate 202b and becomes reflected light 205d. The reflected light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the processing surface 602 of the workpiece 102 is observed.

[0389] The optical image detection / photographing means 206 is an optical detection means, etc., and corresponds to a digital camera, video camera, camera, image capture device, and also corresponds to a light receiving member, light receiving element, etc. of a photosensor, a photosensor module device, etc. Also corresponds to a display device, such as an LCD or organic EL, or a monitor, and also corresponds to a combination of a camera, etc. with these display devices, etc. Furthermore, the optical image detection / photographing means 206 is the observer's vision. It corresponds to grasping, recognizing, and evaluating an object by the human eye, vision, or observation. Other examples include an ultrasonic microscope, a metallurgical microscope, a stereo microscope, etc.

[0390] A 3D macro device 462 (3D macroscope) can be used as the optical image detection and photographing means 206. The 3D macroscope 462 is a device that irradiates fringe projection light and photographs and measures the distortion of the fringe projection image. Although the accuracy is lower than that of a laser microscope, it is possible to measure a wide range in a short time.

[0391] It is also effective to use infrared or ultraviolet light as the light source of the 3D macroscope in the 3D macro device 462. Infrared light is absorbed by the solder 486, but is less absorbed by the electrode terminal 101 and the resist 484. By detecting or measuring the difference in absorptance, the area, surface condition, height difference, and formation range of the solder 486 can be obtained with high precision. In addition, the temperature change, temperature, optical reflectance / transmittance, and optical reflectance / transmittance distribution of the object are measured by irradiation with infrared light or ultraviolet light using a thermometer 455 such as a radiation thermometer, temperature sensor, or thermocouple.

[0392] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the reflected light 205c is rotated by 90° by the λ / 2 plate 210, so that the polarizing plate 202b blocks stray light in the resin-sealed sample 105. The stray light is out of phase and does not match the polarization axis of the polarizing plate 202b.

[0393] Therefore, the amount of stray light that reaches the optical image detection / photography means 206 is reduced, allowing the polishing state to be observed clearly. In order to obtain the best possible observation, the angle θ of the phase axis of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set as shown in Figure 64(c).

[0394] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integrated structure. The same applies to the other embodiments of the present invention.

[0395] Figure 64(b) is a configuration diagram and explanatory diagram of a polishing apparatus 700 according to another embodiment of the present invention. In Figure 64(b), a λ / 4 plate 204a is arranged on the light-exiting side of a polarizing plate 202a. A λ / 4 plate 204b is arranged on the light-incident side of a polarizing plate 202b.

[0396] The quarter-wave plate is positioned at approximately 45° (degrees) with respect to the polarization axis of the polarizing plate 202. The quarter-wave plate gives a phase difference of π / 2 (=λ / 4) between the two perpendicularly polarized components of the incident light and outputs the light. When the polarization direction of the incident light is at an azimuth angle of 45°, it becomes circularly polarized light.

[0397] When circularly polarized light is reflected, its direction of rotation is reversed. Light transmitted through a circular polarizer is reversed at the reflecting surface (right rotation -> left rotation). This is because the direction of rotation of the polarized light remains the same, but the direction of the light travels is reversed. When this light passes through the quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° (degrees) compared to the outward path.

[0398] When the polarization axis of the incident light is at 0° to the fast axis or slow axis, the polarization does not change and the outgoing light is also linearly polarized, when it is greater than 0° but less than 45° it becomes elliptically polarized, and when it is 45° it becomes circularly polarized. It is also possible to reversibly change circularly polarized or elliptically polarized incident light into linearly polarized light and output it.

[0399] In the embodiment of the present invention, the rotation direction of the circularly polarized light is indicated by a rotating arrow in Figure 64 etc. The λ / 4 plate 204 is arranged and set so that light is incident at an azimuth angle of approximately 45°. The polarization axis of the polarizer 202a and the polarization axis of the polarizer 202b are arranged so as to be perpendicular to each other.

[0400] Light 205a emitted from the light irradiator 201 is converted into linearly polarized light (up and down) by polarizing plate 202a. The linearly polarized light becomes circularly polarized light 205b by λ / 4 plate 204a. When circularly polarized light 205b is reflected by the object to be polished 102, it becomes circularly polarized light 205c, which has a rotation direction opposite to that of circularly polarized light 205b. Circularly polarized light 205c is converted into linearly polarized light by λ / 4 plate 204b. The polarization axis of linearly polarized light 205d is perpendicular to the polarization axis of the polarized light that exited polarizing plate 202a. Therefore, the light becomes linearly polarized after passing through λ / 4 plate 204b and then passes through polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the object 102 to be polished is observed.

[0401] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the λ / 4 plate 204b rotates the direction of rotation of the circularly polarized light, which is the reflected light 205c, in the opposite direction, thereby blocking stray light within the resin-sealed sample 105 with the polarizing plate 202b. Therefore, the amount of stray light that reaches the optical image detection / photography means 206 is reduced, allowing the polishing state to be observed clearly.

[0402] In Fig. 64, light is irradiated from a light irradiator 201 in a vertical direction onto the workpiece 102 to be polished, and the light reflected by the workpiece 102 is detected by an optical image detection and photography means 206 arranged in the vertical direction. However, the present invention is not limited to this.

[0403] As shown in Figure 65, the light irradiator 201 may irradiate the object 102 to be polished in an oblique direction, and the light reflected by the object 102 to be polished, the processing surface 602a, may be detected by an optical image detection / photographing means 206 arranged in an oblique direction.

[0404] In Fig. 65, an interface with air is formed on the processed surface 602a of the resin-sealed sample 105 to form a reflecting surface, as in Fig. 64. Also, a liquid film 604 is formed or generated on the processed surface 602a.

[0405] In FIG. 64(a), the polarizing plates 202a and 202b may be combined into one polarizing plate 202, and the polarization axis of the polarizing plate 202 may be configured to be the same for the incident light 205a and the outgoing light 205c.

[0406] 64(a), the λ / 2 plate 210 may be arranged on the light output side of the polarizing plate 202a. Also, in FIG. 64(a), the λ / 2 plate 210 may be arranged on the light output side of the polarizing plate 202a, and the λ / 2 plate 210 on the light input side of the polarizing plate 202b may be omitted.

[0407] In FIG. 64(b), the λ / 4 plates 204a and λ / 4 plates 204b may be combined into one λ / 4 plate 204, and the phase (optical) axis of the λ / 4 plate 204 may be configured to be in the same direction as the incident light 205a and the outgoing light 205c.

[0408] In FIG. 64(b), the polarizing plates 202a and 202b may be combined into one polarizing plate 202, and the polarization axis of the polarizing plate 202 may be configured to be the same for the incident light 205a and the outgoing light 205c. In FIG. 64(b), a λ / 4 plate 204 may be disposed on either the light exit side of the polarizing plate 202a or the light incident side of the polarizing plate 202b.

[0409] It goes without saying that the above matters can also be applied to Figure 65 and other drawings of the present invention and the embodiments in the specification. It also goes without saying that the embodiments of the present invention can be combined with each other or in part to form embodiments.

[0410] In the example of Fig. 73(a), light 205d is emitted from the processed surface 602b, and in the example of Fig. 73(b), light 205a is incident on the processed surface 602b. The processed surface 602b is processed so that the reflectance of the processed surface 602 is increased in the example of Fig. 16 etc. so that there is no problem with the emission of light 205d and the incidence of light 205a.

[0411] 65 is placed or installed on a moving (rotating) stage 603a. The moving (rotating) stage 603a moves in the X-axis direction and the Y-axis direction, and also rotates the angle of the illumination light 205a emitted from the light irradiator 201.

[0412] The optical image detection / photography means 206 is placed or installed on a moving (rotating) stage 603b. The moving (rotating) stage 603a moves in the X-axis direction and the Y-axis direction, and also rotates the angle so that the reflected light 205d is incident on the optical image detection / photography means 206.

[0413] By independently rotating or moving the moving (rotating) stage 603a and the moving (rotating) stage 603b, the incident angles of the illumination light 205a and the reflected light 205e can be changed or set to the most convenient state for observation.

[0414] By rotating or moving the movable (rotating) stage 603a and the movable (rotating) stage 603b and observing the real image and reflected image of the object 102 to be polished from multiple angles, it is possible to more precisely observe the processed state of the processed surface 602 and the state of the object 102 to be polished. Also, by rotating the angle of the resin-sealed sample 105 with the rotating part 302, it is possible to observe the processed surface 602 and the object 102 to be polished in good detail.

[0415] It is possible to vary the intensity of the illumination light 205a from the light irradiator 201. It is also possible to adjust the sensitivity of the optical image detection / photographing means 206 that receives the reflected light 205d.

[0416] The microphone 306 collects the sound generated during polishing, measures or collects the frequency, frequency change, sound intensity, change in sound intensity, and periodicity of the generated sound, and sends the data (frequency, sound, periodicity, etc.) to the controller circuit 711.

[0417] The controller circuit 711 analyzes data (frequency, sound, periodicity, etc.) from the microphone 306 and also considers at least one of the rotation speed of the polishing surface 505, the amount of cleaning liquid supplied from the cleaning liquid supply nozzle 207, the amount of polishing liquid supplied from the polishing liquid supply nozzle 307, and the area of ​​the resin-sealed sample 105 in contact with the polishing surface 505 (processed area) to grasp, analyze, and evaluate the processing state of the resin-sealed sample 105 and perform control such as stopping processing of the resin-sealed sample 105, changing the processing state, and controlling the processing speed. Needless to say, the above matters can also be applied to Figure 65. Furthermore, they can be implemented in combination with other embodiments of the present invention in part or in whole.

[0418] The light irradiator 201a is mounted (placed, implemented, placed) on a moving (rotating) stage 603, and adjusts, sets, or changes the angle of light incident on the resin-sealed sample 105. The optical image detection / photographing means 206 is mounted (placed, implemented, placed) on the moving (rotating) stage 603, and adjusts, sets, or changes the angle of light emitted from the resin-sealed sample 105 to a favorable incident angle. In FIG. 65(a), similarly to FIG. 64(a), the polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are arranged perpendicular to each other.

[0419] 65(a) is arranged, set, and configured so that the optical axis of light 205d is incident at an azimuth angle of approximately 45° with respect to the optical axis of the λ / 2 plate 210. The polarization axis of polarizing plate 202a and the polarization axis of polarizing plate 202b are arranged to be perpendicular to each other.

[0420] The polarization axis of the reflected light 205c is rotated by 90° by the λ / 2 plate 210. Therefore, the reflected light 205c passes through the polarizing plate 202b and becomes reflected light 205d. The reflected light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the workpiece 102 is observed.

[0421] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the reflected light 205c is rotated by 90° by the λ / 2 plate 210, so that stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b.

[0422] The stray light generated in the resin-sealed sample 105 is out of phase and therefore does not coincide with the polarization axis of the polarizing plate 202b. Therefore, the amount of stray light that reaches the optical image detection / photography means 206 is reduced, the contrast of the optical image is improved, and the polishing state can be observed clearly.

[0423] Also, to ensure the best observation, the angle θ of the phase axis of the λ / 2 plate 210 (λ / 4 plate 204) is adjusted or set as shown in Fig. 64(c) . The angle θ is adjusted or set while monitoring the image captured by the optical image detection / capturing means 206.

[0424] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integrated structure. By bonding the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) together, the number of interfaces where the polarizing plate 202, the λ / 2 plate, etc. come into contact with air is reduced, improving light transmittance. FIG. 65(a) also shows a configuration in which at least one of the λ / 2 plate 210 and the polarizing plate 202b is omitted. The contents, matters, and configurations described in the above embodiments can be combined in part or in whole with other embodiments of the present invention.

[0425] Figure 65(b) is a configuration diagram and explanatory diagram of a polishing apparatus 700 according to another embodiment of the present invention. In Figure 65(b), a λ / 4 plate 204a is arranged on the light-exiting side of a polarizing plate 202a. A λ / 4 plate 204b is arranged on the light-incident side of a polarizing plate 202b.

[0426] The quarter-wave plate is positioned at approximately 45° (DEG.) with respect to the polarization axis of the polarizer 202. The quarter-wave plate adjusts the display contrast and other parameters appropriately by changing the angle θ as shown in Figure 64(c). The quarter-wave plate outputs the two perpendicularly polarized components of the incident light with a phase difference of π / 2 (=λ / 4) between them. When the polarization direction of the incident light is at an azimuth angle of 45°, it ideally becomes circularly polarized light.

[0427] When circularly polarized light is reflected, its direction of rotation is reversed. Light transmitted through a circular polarizer is reversed at the reflecting surface (right rotation -> left rotation). When this light passes through the quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° compared to the outward path.

[0428] When the polarization axis of the incident light is at an angle of 0° to the fast or slow axis, the polarization does not change. The outgoing light is also linearly polarized, but when it is greater than 0° but less than 45°, it becomes elliptically polarized, and when it is 45°, it becomes circularly polarized. Therefore, it is possible to convert circularly polarized or elliptically polarized incident light into linearly polarized light and output it. The λ / 4 plate 204 is disposed and set so that light is incident at an azimuth angle of approximately 45°. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are disposed orthogonal to each other. Light 205a emitted from light irradiator 201 passes through polarizing plate 202a and becomes linearly polarized light (vertical direction). The linearly polarized light becomes circularly polarized light 205b by λ / 4 plate 204a.

[0429] When circularly polarized light 205b is reflected by the object to be polished 102, it becomes circularly polarized light 205c, which has a rotation direction opposite to that of circularly polarized light 205b. Circularly polarized light 205c is converted into linearly polarized light by λ / 4 plate 204b. The polarization axis of linearly polarized light 205d is perpendicular to the polarization axis of the polarized light that exited polarizing plate 202a. After passing through λ / 4 plate 204b, the light becomes linearly polarized and passes through polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photographing means 206, and the polishing state of the object 102 to be polished is observed.

[0430] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the direction of rotation of the circularly polarized light that is the reflected light 205c is rotated in the opposite direction by the λ / 4 plate 204b, so that stray light within the resin-sealed sample 105 is blocked by the polarizing plate 202b and does not enter the optical image detection / photography means 206, or is reduced. Therefore, the amount of stray light that reaches the optical image detection / photography means 206 is reduced, allowing the polishing state to be observed well.

[0431] Figures 64(a), 64(b), 65(a), and 65(b) mainly describe an embodiment in which light from a light irradiator is irradiated onto the electrode terminal 101, and the electrode terminal 101 or its vicinity is observed to observe the polishing state.

[0432] As shown in Figures 65(c) and 65(d), by moving the moving (rotating) stage 603 to change or adjust the direction of light irradiation on the object to be polished 102 and the light detection direction of the optical image detection / photography means 206, the reflected image 208 can be observed, and the reflected image 208 described in Figures 66 and 67 and the electrode terminal 101 can be observed simultaneously. It goes without saying that the above embodiment can also be applied to the embodiments of FIGS.

[0433] In Figures 65(c) and 65(d), light enters from the side of the resin-sealed sample 105 and illuminates the object to be polished 102, and light exits from the side of the resin-sealed sample 105 and is detected and observed by the optical image detection and photography means 206.

[0434] In Figure 65(c), light 205a emitted from the light irradiator 201 is polarized by the polarizing plate 202a, and polarized light 205b enters the side of the resin-sealed sample 105. The polarized light 205b is reflected by the object to be polished 102. The object to be polished 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processing surface 602a.

[0435] The reflected image 208 becomes clearer as the mirror finish of the processed surface 602 progresses. This is because smaller abrasive grains (#) are used for polishing. If the abrasive grains are #400 or smaller, there are polishing scratches on the processed surface 602a, and the observation quality of the image of the electrode terminal 101 on the processed surface 602a is poor. If the abrasive grains are #1000 or larger, there are fewer polishing scratches on the processed surface 602a, and the observation quality of the image of the electrode terminal 101 on the processed surface 602a becomes good.

[0436] Even if the processed surface 602a has scratches, the present invention forms or generates a liquid film 604 such as water on the processed surface 602a during polishing, filling the scratches with water, cleaning liquid, oil, Vaseline, etc., making the processed surface 602a closer to a mirror surface or reducing the impact of the scratches that have occurred. The coating effect of the liquid film 604 allows the processed surface 602a to be used as a reflective surface.

[0437] By generating or forming the reflected image 208 (optical image), the processed surface 602a can be clearly observed even when the abrasive grain number (#) is small. Also, the electrode terminal 101 described in the examples of Figures 66 and 67 can be processed at the target position up to the polished cross section.

[0438] As the target cross-sectional polishing position is approached, the number (#) of the abrasive grains increases, reducing polishing scratches on the processing surface 602a. Furthermore, by generating a liquid film 604 on the processing surface 602a, the processing surface 602a is polished to a good mirror finish, thereby achieving polishing with good processing position accuracy.

[0439] It goes without saying that the above embodiments can also be applied to the embodiments in Figures 41, 68, 69, 70, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, and 94. It also goes without saying that the above embodiments can be implemented in combination with other embodiments in part or in whole.

[0440] When the polishing position is near the target position, the processed surface 602a is mirror-finished. The processed surface 602a is cleaned, and the polishing head 106 is raised in the U1 direction in FIG. 3(b) and rotated at high speed to remove water or the like from the processed surface 602a or to form a liquid film 604 of water or the like. The processed surface 602a of the resin-sealed sample 105 is brought into contact with an air layer.

[0441] 33, 34, 35, and 36, the pressure Pb is set to 0, and the processed surface 602 of the resin-sealed sample 105 is controlled so as to be in contact with an air layer. At the pressure Pb, the processed surface 602 is irradiated with light 205 and observed.

[0442] The microphone 306 collects the sound generated during polishing, measures or collects the frequency, frequency change, sound intensity, change in sound intensity, and periodicity of the generated sound, and sends the data (frequency, sound, periodicity, etc.) to the controller circuit 711.

[0443] The controller circuit 711 analyzes the data (frequency, sound, periodicity, etc.) from the microphone 306, and also takes into consideration at least one of the rotation speed of the polishing surface 505, the amount of cleaning liquid supplied from the cleaning liquid supply nozzle 207, the amount of polishing liquid supplied from the polishing liquid supply nozzle 307, and the area of ​​the resin-sealed sample 105 in contact with the polishing surface 505 (processed area), to grasp, analyze, and evaluate the processing state of the resin-sealed sample 105, and perform control such as stopping the processing of the resin-sealed sample 105, changing the processing state, and controlling the processing speed.

[0444] The refractive index of the epoxy resin of the resin-sealed sample 105 is approximately 1.55, and the refractive index of air is 1.0. Alternatively, the refractive index of water in the liquid film 604 generated or formed on the processed surface 602a of the resin-sealed sample 105 is approximately 1.33, and the refractive index of air is 1.0. The liquid film 604 can significantly reduce the reflectance on the surface.

[0445] The liquid film 604 functions to reduce or make less noticeable the steps and grooves of polishing scratches. Because the liquid film 604 is a thin film, even if there is a slight difference in the refractive index of the sealing resin, the reflection image of the object to be polished, etc. is formed well. Therefore, the processing surface 602a can reflect light well, and a good reflection image 208 is generated. As a result, the reflection image of the polishing position can be clearly observed, and polishing with good processing position accuracy can be achieved.

[0446] They are arranged, set, and configured so that light is incident at an azimuth angle of approximately 45° with respect to the polarization axis of the λ / 2 plate 210. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are arranged so as to be perpendicular to each other.

[0447] The polarization axis of the reflected light 205d is rotated by 90° by the λ / 2 plate 210. Therefore, the reflected light 205d passes through the polarizing plate 202b. The reflected light 205e is detected by the optical image detection / photographing means 206, and the processed surface 602 of the resin-sealed sample 105 and the polishing state of the object 102 to be polished are observed.

[0448] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the reflected light 205e is rotated by 90° by the λ / 2 plate 210, so that stray light in the resin-sealed sample 105 is blocked by the polarizing plate 202b.

[0449] The stray light generated in the resin-sealed sample 105 is not in phase with the light, or does not coincide with the polarization axis of the polarizing plate 202b. Therefore, the amount of stray light that reaches the optical image detection / photography means 206 is reduced, the contrast of the optical image is improved, and the polishing state can be observed clearly.

[0450] For best observation, the angle θ of the phase axis of the λ / 2 plate 210 is adjusted or set as shown in Fig. 64(c) . The angle θ is adjusted or set while monitoring the image captured by the optical image detection / capturing means 206.

[0451] It goes without saying that the polarizing plate 202 and the λ / 2 plate 210 (λ / 4 plate 204) may be bonded together to form an integrated structure. By bonding the polarizing plate 202 and the λ / 2 plate 210 together, the number of interfaces where the polarizing plate 202, the λ / 2 plate, etc. come into contact with air is reduced, improving light transmittance.

[0452] Figure 65(d) is a configuration diagram and explanatory diagram of a polishing apparatus 700 according to another embodiment of the present invention. In Figure 65(d), a λ / 4 plate 204a is arranged on the light exit side of a polarizing plate 202a. A λ / 4 plate 204b is arranged on the light incident side of a polarizing plate 202b.

[0453] In Figure 65(d), light enters from the side (cylindrical portion) of the resin-sealed sample 105 and illuminates the object to be polished 102, and light exits from the side (cylindrical portion) of the resin-sealed sample 105 and is detected and observed by the optical image detection and photography means 206.

[0454] In Figure 65(d), light 205a emitted from the light irradiator 201 is polarized by the polarizing plate 202a, and polarized light 205b enters the side of the resin-sealed sample 105. The polarized light 205b is reflected by the object to be polished 102. The object to be polished 102 is illuminated by the polarized light 205, and a reflected image 208 of the electrode terminal 101 is generated on the processing surface 602a.

[0455] The quarter-wave plate is positioned at 45° (DEG.) with respect to the polarization axis of the polarizer 202. When circularly polarized light is reflected, its direction of rotation is reversed. Light transmitted through the circular polarizer is reversed at the reflection surface (right rotation -> left rotation). When this light passes through the previous quarter-wave plate, it returns to linearly polarized light. The direction of the polarization plane changes by 90° relative to the outbound path. Therefore, it is possible to convert circularly polarized or elliptically polarized incident light into linearly polarized light and output it.

[0456] The λ / 4 plate 204 is arranged, set, and configured so that light is incident at an azimuth angle of approximately 45° (DEG.). The polarization axis of the polarizer 202a and the polarization axis of the polarizer 202b are arranged orthogonal to each other. Light 205a emitted from light irradiator 201 passes through polarizing plate 202a and becomes linearly polarized light (vertical direction). The linearly polarized light becomes circularly polarized light 205b by λ / 4 plate 204a.

[0457] When the circularly polarized light 205b is reflected by the object 102 to be polished, it becomes circularly polarized light 205c, which has a rotation direction opposite to that of the circularly polarized light 205b. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b. After passing through the λ / 4 plate 204b, the light becomes linearly polarized light and passes through the polarizing plate 202b. The linearly polarized light 205d is detected by the optical image detection / photography means 206, and the polishing state of the object 102 to be polished is observed.

[0458] The reflected image 208 becomes clearer as the mirror finish of the processed surface 602 progresses. However, the clarity decreases if there are polishing scratches on the processed surface 602a. By cleaning the processed surface 602a and forming or generating a liquid film 604 made of a cleaning liquid or the like on the processed surface 602a, the processed surface 602a can be made mirror-finished and the light reflectance of the processed surface 602a can be improved.

[0459] The polarization axes of the polarizing plate 202a and the polarizing plate 202b are perpendicular to each other, and the λ / 4 plate 204b rotates the direction of rotation of the circularly polarized light, which is the reflected light 205c, in the opposite direction, thereby blocking stray light within the resin-sealed sample 105. Therefore, the amount of stray light that reaches the optical image detection / photography means 206 is reduced, and the polishing state of the object 102 to be polished and the resin-sealed sample 105 can be observed well.

[0460] 64 and 65, the polarization axis of polarizing plate 202a and the polarization axis of polarizing plate 202b are described as being orthogonal to each other, but the present invention is not limited to this. For example, the polarization axis of polarizing plate 202a and the polarization axis of polarizing plate 202b may be configured to be approximately aligned.

[0461] The azimuth angle of the λ / 2 plate 210 and the λ / 4 plate 204 may be set to −θ, and the rotation axis of the circularly polarized light may be in the opposite direction. Also, the light is not limited to circularly polarized light, and elliptically polarized light may be used.

[0462] 65(c) and 65(d), the λ / 2 plate 210 may be omitted. The λ / 4 plate 204 may be omitted. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b may be configured to be approximately aligned.

[0463] As shown in Figures 65(c) and 65(d), by arranging the diaphragm 504 and narrowing the directionality of the light incident on the optical image detection and photography means 206, the influence of stray light is reduced or eliminated, and images of the workpiece 102 to be polished can be observed with high contrast. In addition, real images and reflected images become clear.

[0464] 71 is a configuration diagram and an explanatory diagram of a polishing apparatus 700 of the present invention. The resin-sealed sample 105 is attached to and held by a polishing head 106. The polishing head 106 presses the resin-sealed sample 105 against a polishing surface 505, and the polishing head 106 rotates.

[0465] The optical image detection / photographing means 206 observes the polished state of the resin-sealed sample 105. The optical image detection / photographing means 206 is synchronized with the rotation position of the resin-sealed sample 105.

[0466] The optical image detection / photographing means 206a photographs or observes the object 102 to be polished in the resin-sealed sample 105 when the object 102 faces the front (point C). Similarly, the optical image detection / photographing means 206b photographs or observes a reflected image 208 of the electrode terminal 101 of the object 102 to be polished when the object 102 faces the front (point C). The reflected image 208 is reflected on the processing surface 602a.

[0467] As shown in Figures 3, 4, 8, 15, 16, and 19, a space is formed between the resin-sealed sample 105 and the polished surface 505, and a cleaning liquid such as water is supplied into the space from the cleaning liquid supply nozzle 207, thereby cleaning the polished surface (processed surface 602a) of the resin-sealed sample 105 and forming a coating of water or the like on the processed surface 602a.

[0468] The polishing surface, ie, the processed surface 602a, can be cleaned by rotating the polishing head 106 at high speed and supplying a cleaning solution at high pressure to the polishing surface of the workpiece 102. The solution supplied during polishing and the solution supplied during cleaning may be the same, but it is preferable that they are different.

[0469] 16, the polishing head 106 is connected to the lower end of a polishing shaft 301. An optical image detection / photographing means 206b is disposed on the polishing shaft 301 so that a reflected image 208 can be observed.

[0470] Figure 71(a) shows the case where the electrode terminal 101 and the reflected image 208 are arranged in a straight line as in Figure 66, and Figure 71(b) shows the case where the electrode terminal 101 and the reflected image 208 are arranged at an angle as in Figure 67. In either case, the rotational position of the resin-sealed sample 105 and the optical image detection / photographing means 206 are synchronized to observe or detect the polishing state. It goes without saying that the above embodiment can also be applied to the embodiments of FIGS.

[0471] In the embodiment of the present invention, the resin-sealed sample 105 is described as having a cylindrical shape, but the present invention is not limited to this. The resin-sealed sample 105 may have other shapes, such as a spherical shape, a triangular pyramid shape, a cube shape, a rectangular parallelepiped shape, or a hexagonal prism shape.

[0472] Figure 79 is an explanatory diagram of a resin-sealed sample 105 in the polishing apparatus 700 of the present invention. In Figure 79, Figure 79(a) is an explanatory diagram of the resin-sealed sample 105 as seen from the side. Figure 79(b) is an explanatory diagram of the resin-sealed sample 105 as seen from the front. Figure 79(c) is an explanatory diagram of the resin-sealed sample 105 as seen from above.

[0473] In the resin-sealed sample 105 shown in Figure 79(b), one side of the upper side of the cylindrical pillar is cut or polished at an angle θ. The angle θ is preferably set to 40° or more and 60° or less in relation to the light incident angle. The cut processed surface 602b is polished to a mirror finish. The polishing method is the same as for the processed surface 602a.

[0474] 79, by cutting the resin-sealed sample 105 at an angle θ, light 205a from the light irradiator 201 is less attenuated by surface reflection of the resin-sealed sample 105 and can be incident on the resin-sealed sample 105. The light 205a illuminates the object 102 to be polished. The light reflected by the object 102 to be polished is emitted from the resin-sealed sample 105 as light 205b. The emitted light 205b is incident on the optical image detection / photography means 206.

[0475] A portion of the light incident on the resin-sealed sample 105 is reflected by the object to be polished 102 and scattered within the resin-sealed sample 105, generating stray light. The generation of stray light makes it difficult or impairs observation of the electrode terminal 101 and the object to be polished 102.

[0476] In this embodiment, in order to deal with stray light, as shown in Figure 80, a light absorbing film 606 is formed on the resin-sealed sample 105 in areas other than the processing surface 602, the light incident surface that illuminates the polishing object 102, and the light exit surface that is used to observe the optical image of the polishing object 102.

[0477] The light absorbing film 606 can be made of an organic material such as acrylic resin containing carbon, or a similar organic material with black beads dispersed therein. Another example is a resin vehicle containing cyanine black, a phthalocyanine pigment with high electrical insulation properties.

[0478] In the resin-sealed sample 105 of other examples, it is also effective to form or apply a light-absorbing film 606 to a location or portion other than the optical path of the illumination light or the path of the reflected light. For example, in Fig. 57 etc., after the resin-sealed sample 105 is produced, a light-absorbing film 606 is formed on the surface of the resin-sealed sample 105, and then the processed surface 602 etc. are processed.

[0479] The object 102 to be polished is sealed in a resin-sealed sample 105. During polishing, it is important to accurately measure, observe, detect, and confirm the position of the object 102 to be polished in the resin-sealed sample 105. By accurately determining the position of the object 102 to be polished, it is possible to appropriately set the polishing speed, polishing position, polishing end position, etc. during polishing, and it is possible to perform high-quality polishing of the object 102 to be polished.

[0480] The examples in Figures 81, 82, 83, etc. are explanatory diagrams of a method and apparatus for measuring, observing, detecting, and confirming the position, etc. of the object to be polished 102 sealed in the resin-sealed sample 105. They are also explanatory diagrams of a method for photographing and observing the resin-sealed sample 105 of the present invention. For example, Figure 82(a2) shows a photograph or observation of the processed surface 602b of the resin-sealed sample 105 taken with the camera 206b in Figure 81.

[0481] As shown in Figure 46(b), Figure 82(a2), etc., the sealing resin 115 has not penetrated into the back surface portion A of the object to be polished 102, so that the cut surface of the object to be polished 102 can be directly viewed. In other parts, the sealing resin 115 has penetrated into the adhesive material 114 or the adhesive material 114 and the sealing resin 115 are mixed together. Therefore, the sealing resin 115 has hardened, and the pattern (concave and convex) of the base material 112 has been transferred to the processed surface of the sealed sample 105.

[0482] As shown in Figure 47, position A of the object to be polished 102 and part B of the other sealing resin can be clearly distinguished and visually recognized. Position A of the object to be polished 102 and part B of the other sealing resin can be clearly separated visually. Furthermore, part A and part B can be clearly distinguished even by a camera, so the position of the object to be polished 102 can be recognized with high precision. This makes it easy to align the object to be polished 102 and process the object to be polished 102.

[0483] The resin-sealed sample 105 is rotated at a predetermined interval by the rotation mechanism 753, and the images shown in Figure 82(a2), Figure 82(b2), and Figure 82(c2) are acquired at each rotation position. The acquired images are recorded and stored in a captured image database.

[0484] The drawing of the embodiment of the present invention shown in Figure 82(b2) was taken by observing and photographing the side of the resin-sealed sample 105 with the camera 206. The drawing of the embodiment of the present invention shown in Figure 82(c2) was taken by observing and photographing the processed surface 602a on the top surface of the resin-sealed sample 105 with the camera 206.

[0485] 81 shows an embodiment in which the resin-sealed sample 105 can be rotated by a rotation mechanism 753 (rotation device 463) and can be rotated on line AA' by the rotation mechanism 753. In one embodiment, there are three cameras 206 as the optical image detection / photographing means 206.

[0486] The light irradiator 201 is mounted on a moving and rotating stage 603, and irradiates the resin-sealed sample 105 with illumination light 205 from the side thereof, thereby illuminating the object 10 to be polished of the resin-sealed sample 105. The light irradiator 201 is configured so that the angle of the illumination light irradiated onto the resin-sealed sample 105 can be adjusted by the moving and rotating stage 603.

[0487] It goes without saying that the rotation mechanism 753 or the rotation device 463 can be used to rotate, rotate, and align the resin-sealed sample 105 as appropriate in other embodiments of the present invention.

[0488] The camera 206a is mounted on a moving and rotating stage 603a, and is configured so that the position and angle of the camera 206a can be moved. The camera 206a takes images from the processed surface 602a on the upper surface side of the resin-sealed sample 105.

[0489] The camera 206b is mounted on a moving and rotating stage 603b, and is configured so that the position and angle of the camera 206b can be moved. The camera 206b takes an image from the processed surface 602b on the lower surface side of the resin-sealed sample 105.

[0490] The camera 206c is mounted on a moving and rotating stage 603c, and is configured so that the position of the camera 206c and the angle of the camera 206b can be changed. The camera 206c takes an image from the side of the resin-sealed sample 105.

[0491] The three cameras 206 can capture 3D photographed images of the object 102 to be polished of the resin-sealed sample 105. By using the 3D photographed images during polishing, the object 102 to be polished can be polished to a predetermined position, and good processing accuracy can be obtained at the predetermined position.

[0492] 83(a) is an explanatory diagram showing a state in which the processed surface 602b of the resin-sealed sample 105 is observed and photographed by the camera 206. The angle of the camera 206 is adjusted and set by the rotation stage 603. The resin-sealed sample 105 is rotated by a predetermined angle by the operation and manipulation of the rotation mechanism 753b, and is positioned at the rotated position.

[0493] During the measurement in Figure 83(a), the marking line 507, reference line 803, etc. shown in Figures 47, 63(b), and 82(a2) are formed or configured on the processed surface 602 of the resin-sealed sample 105, making it easy to recognize, grasp, and measure the position of the object to be polished 102.

[0494] The resin-sealed sample 105 is rotated on line AA' by the rotation mechanism 753b, etc., and images are acquired at each angle. The position of the object 102 to be polished at each angle can be recognized and measured. The acquired images are also recorded and stored in a database of captured images.

[0495] 83(b) is an explanatory diagram showing a state in which the side surface of the resin-sealed sample 105 is observed and photographed by the camera 206. By the operation of the rotation mechanism 753a, the resin-sealed sample 105 is rotated 90° from the position shown in FIG. 83(a) and positioned. The angle of the camera 206 is adjusted and set by the rotation stage 603.

[0496] At the position determined by the rotation mechanism 753a, the resin-sealed sample 105 is rotated concentrically about line AA' by the rotation mechanism 753b. The resin-sealed sample 105 is also rotated by a predetermined angle, and images are acquired at each rotation position. The acquired images are recorded and stored in a captured image database.

[0497] The data stored in the captured image database and the images captured by the camera 206 are learned and processed by AI (Artificial Intelligence). The AI ​​processing allows the resin-encapsulated sample 105 and the object to be polished 102 to be recognized, detected, and positioned.

[0498] 83(c) is an explanatory diagram of a state in which the upper processed surface 602b or the lower processed surface 602a of the resin-sealed sample 105 is observed and photographed by the camera 206. By the operation of the rotation mechanism 753a, the resin-sealed sample 105 is rotated 90° from the position shown in FIG. 83(b) and positioned. The angle of the camera 206 is adjusted and set by the rotation stage 603.

[0499] At the position determined by the rotation mechanism 753a, the resin-sealed sample 105 is rotated on line AA' by the rotation mechanism 753b, and images (image data, etc.) are acquired at each angle. The position of the object 102 to be polished at each angle can be recognized and measured. The acquired images are also recorded and stored in a captured image database.

[0500] 83, one camera 206 is used, and the resin-sealed sample 105 is rotated and positioned by a rotation mechanism 753 to create 3D images of the resin-sealed sample 105 and the object to be polished 102. The 3D images make it possible to optically analyze the processed area, observe and analyze the processed state of the object to be polished 102, and observe and analyze the polished area.

[0501] 83 shows an embodiment in which the resin-sealed sample 105 can be rotated on a plane by a rotation mechanism 753a and a rotation device 463, and can be rotated on line AA' by a rotation mechanism 753b. There is one camera 206, and the camera 206 is mounted on a rotation stage 603.

[0502] It goes without saying that the rotation mechanism 753 or the rotation device 463 can be used to rotate, rotate, and align the resin-sealed sample 105 as appropriate in other embodiments of the present invention.

[0503] 83(a) is an explanatory diagram showing a state in which the processed surface 602b of the resin-sealed sample 105 is observed or photographed by the camera 206. The angle of the camera 206 is adjusted and set by the rotation stage 603. The resin-sealed sample 105 is rotated by a predetermined angle by the operation and manipulation of the rotation mechanism 753b, and is positioned at the rotated position.

[0504] During the measurement in Figure 83(a), the marking line 507, reference line 803, etc. shown in Figures 47, 63(b), and 82(a2) are formed or configured on the processed surface 602 of the resin-sealed sample 105, making it easy to recognize, grasp, and measure the position of the object to be polished 102.

[0505] The resin-sealed sample 105 is rotated on line AA' by the rotation mechanism 753b, etc., and images are acquired at each angle. The position of the object to be polished 102 at each angle can be recognized and measured. The acquired images are also recorded and stored in a database of captured images.

[0506] 83(b) is an explanatory diagram showing a state in which the side surface of the resin-sealed sample 105 is observed and photographed by the camera 206. By the operation of the rotation mechanism 753a, the resin-sealed sample 105 is rotated by 90° from the position shown in FIG. 83(a) and positioned. The angle of the camera 206 is adjusted and set by the rotation stage 603.

[0507] At the position determined by the rotation mechanism 753a, the resin-sealed sample 105 is rotated concentrically about line AA' by the rotation mechanism 753b. The resin-sealed sample 105 is also rotated by a predetermined angle, and images are acquired at each rotation position. The acquired images are recorded and stored in a captured image database.

[0508] The data stored in the captured image database and the images captured by the camera 206 are learned and processed by AI (Artificial Intelligence). The AI ​​processing allows the resin-encapsulated sample 105 and the object to be polished 102 to be recognized, detected, and positioned.

[0509] 83(c) is an explanatory diagram of a state in which the upper processed surface 602b or the lower processed surface 602a of the resin-sealed sample 105 is observed and photographed by the camera 206. By the operation of the rotation mechanism 753a, the resin-sealed sample 105 is rotated 90° from the position shown in FIG. 83(b) and positioned. The angle of the camera 206 is adjusted and set by the rotation stage 603.

[0510] At the position determined by the rotation mechanism 753a, the resin-sealed sample 105 is rotated on line AA' by the rotation mechanism 753b, and images (image data, etc.) are acquired at each angle. The position of the object 102 to be polished at each angle can be recognized and measured. The acquired images are also recorded and stored in a captured image database.

[0511] 83, one camera 206 is used, and the resin-sealed sample 105 is rotated and positioned by a rotation mechanism 753 to create 3D images of the resin-sealed sample 105 and the object to be polished 102. The 3D images make it possible to optically analyze the processed area, observe and analyze the processed state of the object to be polished 102, and observe and analyze the polished area.

[0512] As in the embodiments of Figures 81 and 82, in the embodiment of Figure 83, 3D (three-dimensional or three dimensions) images are measured, observed, or acquired. Also, 3D images are measured, observed, or acquired during polishing. By using the 3D images and having AI learn the polishing process and polishing conditions, it becomes possible to precisely process the polished portion.

[0513] 73 is a diagram illustrating the configuration of a polishing device 700 according to the present invention. This is a method for observing a reflected image 208 of a processed surface 602a, which is the bottom surface of the resin-sealed sample 105.

[0514] A diaphragm (light blocking device) 504 is arranged in front of the light irradiator 201. In addition, a diaphragm (light blocking device) 504 is also arranged on the light incident side of the optical image detection / photographing means 206 as required.

[0515] Examples of the diaphragm (light blocking device) 504 include a Waterhouse diaphragm, which is a type in which a plate with holes is inserted through a slit on the side of the lens; a sluice gate diaphragm, which is a type in which a flat rod with large and small holes is moved up and down in front of or inside the lens; a rotary diaphragm, which is a type in which a disk with small holes is rotated in front of or inside the lens; and an iris diaphragm, which is made by stacking multiple plates (diaphragm blades) to allow for fine adjustments.

[0516] In the device of this embodiment, it is preferable to use an iris diaphragm as the diaphragm 504. The center position of the iris diaphragm is configured to be the center of the light beam of light (optical path) 205. By changing the size of the opening of the iris diaphragm, it is possible to control the directivity of light 205 in the optical path. Therefore, it is possible to achieve control equivalent to changing the F-number of lens 605. By changing the opening of the iris diaphragm, it is possible to adjust or set the contrast and clarity of the optical image.

[0517] 73(a), light 205a emitted from the light irradiator 201 is polarized by the polarizing plate 202a and circularly polarized by the λ / 4 plate. The light 205a is incident obliquely from the side of the resin-sealed sample 105 and becomes light 205b. Since the refractive index of the resin-sealed sample 105 is higher than that of air, the incident angle of light 205b is θ2 (θ1>θ2) according to Snell's law. The circularly polarized light 205b illuminates the workpiece 102, and a portion of the circularly polarized light 205b is reflected and becomes circularly polarized light 205c with the opposite rotation.

[0518] The processed surface 602a of the resin-sealed sample 105 is in contact with air, or a liquid film 604 is formed on the processed surface 602a of the resin-sealed sample 105, and the liquid film 604 is in contact with air. Therefore, the circularly polarized light 205c is totally reflected or partially reflected by the processed surface 602a. The circularly polarized light 205c forms a reflected image 208 of the electrode terminal 101 on the processed surface 602a. The observer 206 can observe the reflected image of the processed surface 602a. In addition, the optical image detection / photographing means 206 can photograph the reflected image of the processed surface 602a.

[0519] The circularly polarized light 205c and the circularly polarized light 205b are reflected inside the resin-sealed sample 105, and a part of the light becomes reflected light 205d and enters the optical image detection / photography means 206, which then detects or observes a reflected image 208. In addition, the light 205d has narrow directionality due to the diaphragm 504b, and stray light entering the optical image detection / photography means 206 is reduced.

[0520] The light irradiator 201 is placed (mounted, implemented) on a moving (rotating) stage 603. The moving (rotating) stage 603 changes the angle of light incident on the resin-sealed sample 105, and adjusts it so that the observation image observed or photographed by the optical image detection / photographing means 206 is optimal.

[0521] The reflected light 205d is converted into linearly polarized light by the λ / 4 plate 204b and passes through the polarizing plate 202b. The polarization axes of the polarizing plate 202ba and the polarizing plate 202b are configured to be orthogonal to each other.

[0522] During polishing, polishing scratches occur on the processed surface 602a. By forming, applying, or leaving a liquid film on the polishing scratches, the polishing scratches are filled, reducing the scattering or disturbance of incident light by the polishing scratches. Therefore, the processed surface 602a can be used as a reflecting surface for reflected light.

[0523] When the abrasive grain size is #400 or less, polishing scratches are generated on the processed surface 602a, and the observation condition of the image of the electrode terminal 101 on the processed surface 602 is poor. When the abrasive grain size is #1000 or more, polishing scratches on the processed surface 602 are reduced, and the observation condition of the image of the electrode terminal 101 on the processed surface 602 is good. At the beginning of the polishing process, use a low abrasive number, and as the polishing process nears completion, use a higher abrasive number.

[0524] The important thing about polishing is to make the cutting position exactly as intended as the polishing completion time approaches. Therefore, precision of the polishing position is not necessary in the first stage of the polishing process. Precision of the polishing position becomes necessary in the final stage of the polishing process.

[0525] Polishing is initially performed at a high speed, and the polishing speed is slowed down as the specified polishing position is approached. By slowing the polishing speed and making the processed surface 602 a good reflective surface, the polishing grain number is increased. Increasing the polishing grain number reduces polishing scratches. A better reflective surface can be formed by forming a liquid film 604 on the processed surface 602. When illumination light is incident from the side of the resin-sealed sample 105, the illumination light is easily reflected by the processed surface 602, allowing for good observation of the polishing state of the object 102 to be polished.

[0526] In the present invention, the processed surface 602 of the object 102 to be polished is used as a mirror surface, and the polishing process is carried out by observing the image of the electrode terminal 101 reflected on the mirror surface. Therefore, it is important to be able to observe the processed surface 602 at the stage when the abrasive grain number is small.

[0527] In the initial steps of the polishing process, if there are polishing scratches on the processed surface 602, the polishing scratches will scatter light, and the image of the electrode terminal 101 reflected on the processed surface 602a will be poorly observed. However, since the target position for polishing is far away, there is no need to observe the polishing state.

[0528] A cleaning liquid is supplied from the cleaning liquid supply nozzle 207. It is preferable to supply the cleaning liquid mixed with a surfactant. The cleaning liquid washes away abrasive grains and the like from the polished surface 602a. The surfactant allows a good liquid film 604 to be formed on the polished surface 602a. The liquid film 604 is not limited to water. It is a liquid or gel film, and any material may be used as long as the liquid is optically transparent.

[0529] After the water film cleaning, a cleaning liquid or a solution mixed with a surfactant is applied to the polishing scratches, forming a liquid film 604 on the processed surface 602a. The liquid film 604 covers the polishing scratches on the processed surface 602a, reducing the unevenness of the polishing scratches on the processed surface 602a and making the processed surface 602a a mirror-finished or light-reflecting surface. Alternatively, the liquid film 604 increases the light reflectivity of the processed surface 602a and reduces stray light.

[0530] When a liquid film 604 is formed on the processed surface 602a and the processed surface 602a is flattened, polishing scratches become less noticeable. Therefore, when the abrasive grains are small, the processed surface 602a becomes closer to a mirror surface, and the reflectivity of the processed surface 602a increases, making it possible to observe, for example, a reflected image 208 of the electrode terminal 101 of the workpiece 102 reflected by the processed surface 602a.

[0531] After washing away the abrasive grains from the processing surface 602, a cleaning liquid or the like is supplied between the polishing table 107 and the processing surface 602a to form a liquid film 604. The liquid film 604 is generated by filling or placing the cleaning liquid or the like between the polishing table 107 and the processing surface 602. The liquid film 604 reduces the effects of polishing scratches on the processing surface 602a. In addition, a light-reflecting surface is generated due to the difference in refractive index between the cleaning liquid or the like and the object 102 to be polished. Therefore, the processing surface 602a becomes more mirror-finished, and the actual image of the electrode terminal 101 and the reflected image 208 of the electrode terminal 101 reflected on the processing surface 602a can be clearly observed.

[0532] As the polishing of the object progresses and abrasive grains with larger numbers (numbers 200 or higher) are used, polishing scratches on the processed surface 602 become smaller and shallower. By forming a liquid film 604 of a cleaning liquid or the like on the processed surface 602a, the processed surface 602a becomes mirror-finished, and the contrast and clarity of the reflected image 208 are improved.

[0533] During the polishing process, precise polishing can be achieved by taking into consideration the change in sound measured by the microphone 306 or the like. As the polishing grains become smaller, the sound generated on the processed surface becomes smaller and the frequency of the generated sound becomes higher. It is preferable to measure the change in the sound volume and frequency with the microphone 306 and process the resin-sealed sample 105 and the object to be polished 102 based on the measured sound or frequency. As the polishing of the object progresses, in the final stage of the polishing process using abrasive grains with a larger number (number 200 or more), polishing scratches on the processed surface 602 disappear.

[0534] As shown in Figure 3, etc., at this stage, by lowering the polishing table 107 (in the D2 direction) or raising the polishing head 106 (in the U1 direction), an air layer can be placed between the object to be polished 102 or the resin-sealed sample 105 and the polishing surface 505.

[0535] The air layer has a refractive index of 1.0, while the resin-sealed sample 105, which is made of epoxy resin or the like, has a refractive index of about 1.55. A light-reflecting surface is generated due to the difference in refractive index between the air layer and the resin-sealed sample 105. In addition, a light-reflecting surface is generated due to the difference in refractive index between the air layer and the object 102 to be polished.

[0536] Therefore, the processed surface 602 becomes a mirror surface, and the reflected image 208 of the electrode terminal 101 reflected on the processed surface 602a can be clearly observed. The water or solution adhering to the processed surface 602a is removed by centrifugal force by rotating the polishing head 106 at high speed.

[0537] By rotating at high speed, a liquid film 604 is formed as a thin coating on the processed surface 602, and the liquid film 604 penetrates into the polishing scratches, improving the light reflectance of the processed surface 602. A thin water film or solution film can be formed on the processed surface 602a, further reducing polishing scratches, and the processed surface 602a can be used as a mirror or reflective surface.

[0538] By placing a diaphragm 504a on the light emission side of the light irradiator 201 and a diaphragm 504b on the light incidence side of the optical image detection / photography means 206, and narrowing the directionality of the light or specifying the directionality, it is possible to suppress the generation and reception of stray light, and to detect and observe optical images with high contrast.

[0539] A diaphragm 504b is disposed on the light incident side of the optical image detection / photographing means 206, and by adjusting the aperture diameter of the diaphragm 504b, the F-number of the incident light can be controlled, allowing for good contrast adjustment of the observed image.

[0540] 73(a), the light emitted by the light irradiator 201 is incident on the side surface of the resin-sealed sample 105, and the light 205d emitted from the top surface of the resin-sealed sample 105 is received by the optical image detection / photographing means 206. However, the present invention is not limited to this.

[0541] The light emitted by the light irradiator 201 may be incident on the resin-sealed sample 105 from the top surface (processed surface 602b) of the resin-sealed sample 105, and the light 205d emitted from the side surface of the resin-sealed sample 105 may be received by the optical image detection / photography means 206.

[0542] 73(a), a configuration in which the λ / 4 plates 204a and 204b are omitted may be sufficient for practical use. Also, the polarization axes of the polarizing plates 202a and 202b may be set in the same direction. As shown in Figure 73(a), the light 205b becomes reflected light 205c by the object to be polished 102 etc. A part of the light 205c reflected by the object to be polished 102 becomes stray light.

[0543] The λ / 4 plate 204a is disposed at an azimuth angle of approximately 45° (degrees) with respect to the polarization axis of the polarizing plate 202a. The polarization axis of the polarizing plate 202a and the polarization axis of the polarizing plate 202b are disposed orthogonal to each other.

[0544] The polarized light that passes through the λ / 4 plate 204a becomes circularly polarized light 205a. The circularly polarized light 205a enters the side surface of the resin-sealed sample 105, becomes light 205b, and is reflected by the object to be polished 102, etc. The reflected circularly polarized light 205c becomes circularly polarized light that rotates in the opposite direction to the circularly polarized light 205b. A portion of the circularly polarized light 205c is totally reflected by the processing surface 602a, and forms a reflected image 208 of the electrode terminal 101 on the processing surface 602a. The light inside the resin-sealed sample 105 is emitted to the outside of the resin-sealed sample 105 as reflected light 205d.

[0545] The reflected light 205d is converted into linearly polarized light by the λ / 4 plate 204b. Therefore, the reflected light 205b passes through the polarizing plate 202b and is detected by the optical image detection / photographing means 206, and the polishing state of the workpiece 102 is observed.

[0546] When circularly polarized light is reflected, its direction of rotation is reversed. Light transmitted through a circular polarizer is reversed at the reflecting surface (right rotation -> left rotation). This is because the direction of rotation of the polarized light remains the same, but the direction of the light travels is reversed. When this light passes through the quarter-wave plate, it returns to linearly polarized light, but the direction of the polarization plane changes by 90° compared to the outward path.

[0547] The λ / 4 plate 204a converts the light into circularly polarized light 205a, and the λ / 4 plate 204b converts the light into circularly polarized light with the opposite rotation to that of the circularly polarized light 205a, thereby blocking stray light within the resin-encapsulated sample 105 with the polarizing plate 202b. Therefore, the stray light that reaches the optical image detection / photography means 206 is reduced, allowing the polishing state to be observed clearly. In addition, to enable the best observation, the angle θ of the phase axis of the λ / 4 plate 204 is adjusted or set as shown in Figure 64(c).

[0548] It goes without saying that the polarizing plate 202 and the λ / 4 plate 204 may be bonded together to form an integrated structure. The same applies to the other embodiments of the present invention.

[0549] The polishing table 107 can move up (U2) and down (D2) as shown in Figures 3, 8, 15, 16(b), 32, 33, 34, 35, 36, 37, 38, etc. It can also move up (U1) and down (D1).

[0550] By lowering (D2) the polishing table 107, the object 102 can be moved away from the polishing surface 505. By raising (U2) the polishing table 107, the object 102 can be pressed against the polishing surface 505. In addition, by adjusting the amount of lowering (D1) or raising (U1) the polishing table 107, the pressure with which the object 102 is pressed against the polishing surface 505 can be adjusted.

[0551] By taking into consideration the change in sound measured by the microphone 306 during the ascent (U1) and descent (D1), high-precision positioning and high-precision polishing can be achieved. For example, when going from ascent (U1) to descent (D1), the sound generated during processing increases and the frequency of the sound changes. For example, when going from descent (D1) to ascent (U1), the sound generated on the processing surface decreases and the frequency of the generated sound increases.

[0552] By measuring or observing the changes in sound volume and frequency using a microphone 306 or the like, the positioning position and pressure of the resin-sealed sample 105 and the object to be polished 102 during the ascent (U1) and descent (D1) can be adjusted or set.

[0553] The lowering (D1, D2) and raising (U1, U2) operations are performed intermittently as shown in Figures 32, 33, 34, 35, 36, 37, and 38. Alternatively, processing is performed by repeatedly applying strong and weak pressure.

[0554] For example, if the downward movement is continuously maintained and polishing is continuously performed, the abrasive material etc. will get into the resin-sealed sample 105 and the polishing pad 506, and the granularity of the abrasive material will change, deteriorating the polished condition of the processed surface 602. By repeating the downward movement (D1, D2) and upward movement (U1, U2), the abrasive material will get into the resin-sealed sample 105 and the polishing pad 506 appropriately, the granularity of the abrasive material will not change, and a good processed surface 602 will be obtained.

[0555] The intermittent cycles Tc, Tu, Td and the pressure (pressure) during polishing are pattern-learned. Also, measurements are taken with a microphone 306, and adjustments and controls for increasing and decreasing the pressure are performed based on changes in sound volume and frequency.

[0556] 32, 33, 34, 35, 36, 37, and 38, the period when the pressure (pressing force) increases is Tu, and the period when the pressure (pressing force) decreases (drops) (or is 0 pressure) is Td. The period when the pressure (pressing force) increases Tu plus the period when the pressure (pressing force) decreases (drops) Td is the pressure cycle Tc. The intermittent polishing process is performed not only on part C in FIG. 54, but also on parts B and D.

[0557] A space is formed between the resin-sealed sample 105 and the polished surface 505, and a cleaning liquid such as water is supplied into the space from the cleaning liquid supply nozzle 207 to clean the polished surface of the resin-sealed sample 105, thereby forming a liquid film 604 made of water or the like on the processed surface 602a. The liquid film 604 made of water or the like reduces the optical scattering of light caused by polishing scratches on the processed surface 602a, making the processed surface 602a closer to a mirror surface. The mirror surface becomes a reflective surface, and can generate the reflective surfaces described in Figures 66 and 67.

[0558] The polishing head 106 is configured to be rotatable in the direction of the arrow. By rotating the polishing head 106 at high speed or at an appropriate speed and supplying a cleaning liquid at high pressure to the polishing surface of the object 102, the polishing surface (processed surface 602a) can be cleaned. The sound generated by the rotation speed and direction is measured by a microphone 306, and the rotation speed is adjusted and controlled based on the changes in the sound volume and frequency.

[0559] It goes without saying that the above embodiments can also be applied to the embodiments of Figures 68 and 69. It also goes without saying that these embodiments can be combined in part or in whole with other embodiments.

[0560] During the Td period, an air layer is generated between the processing surface 602 and the polishing pad 506, and a liquid film 604 or the like is formed on the processing surface 602, thereby making the processing surface 602 mirror-finished, and making it possible to clearly observe the processing state of the object to be polished 102 and the resin-sealed sample 105. Furthermore, by using polarized light as the observing light 205, it is possible to clearly observe the processing state of the object to be polished 102 and the resin-sealed sample 105.

[0561] Since the cycle Tc includes a period Td, if the processed surface 602 is observed during the period Td, the processed surface 602 can be observed periodically. It is also preferable to release the cleaning liquid in synchronization with Tc or at regular intervals. Furthermore, the resin-encapsulated sample 105 is rotated in synchronization with the cycle Tc.

[0562] It goes without saying that the above-mentioned embodiments can be combined in whole or in part with other embodiments, such as the embodiments shown in Figures 68 and 69. It also goes without saying that other embodiments can be combined in whole or in part with other embodiments.

[0563] As shown in Fig. 16, the polishing head 106 is connected to the lower end of a polishing shaft 301. The polishing head 106 is configured to be able to hold the object to be polished 102. The polishing shaft 301 is configured to be able to adjust the angle of the resin-encapsulated sample 105 by means of an angle adjustment part 302. The polishing shaft 301 is configured to be able to move up and down and left and right by the operation of a vertical and left and right movement mechanism.

[0564] As shown in Fig. 16, the polishing head 106 is connected to the lower end of the polishing shaft 301. In the embodiment of Fig. 4, for example, the polishing shaft 301 and the angle adjustment unit (rotating unit) 302 are composed of a polishing shaft 301a, a polishing shaft 301b, a polishing shaft 301c, a polishing shaft 301d, an angle adjustment unit (rotating unit) 302a, an angle adjustment unit (rotating unit) 302b, an angle adjustment unit (rotating unit) 302c, an equipment mounting unit 703, a force sensor 702, a robot arm 801 such as a head mounting mechanism 754, etc. Also, a pressure sensor 126 shown in Fig. 23 may be provided. Needless to say, both the force sensor 702 and the pressure sensor 126 may be used.

[0565] The polishing head 106, polishing shaft 301, etc. are specifically composed of a robot arm 801, etc. The polishing head 106 holds the resin-sealed sample 105 with a holder 721. The polishing head 106 is also configured to be able to hold the resin-sealed sample 105 by vacuum suction.

[0566] The polishing shaft 301 is configured so that the angle of the resin-sealed sample 105 can be adjusted by an angle adjustment unit (rotating unit, position setting unit) 302. The polishing shaft 301 is configured so that it can move up and down and left and right by the operation of a vertical and left and right movement mechanism. It is also configured so that the polishing pressure of the resin-sealed sample 105 can be detected by a force sensor 702 and the polishing pressure of the resin-sealed sample 105 can be adjusted and controlled. It is also configured so that the inclination of the resin-sealed sample 105, the pressing direction of the resin-sealed sample 105, and the pressing angle of the resin-sealed sample 105 can be detected by a pressure sensor 126.

[0567] As shown in FIG. 23, the holding member 125 is made of insulating plastic. A circular pressure sensor 126 is formed or placed in a recess in the holding member 125. The pressure sensor 126 is exemplified by a PTF (Polymer Thick Film) sensor. When pressure is applied to the sensor portion, the resistance value decreases. Because the resin-sealed sample 105 is cylindrical, it is preferable to use a circular pressure sensor 126.

[0568] As shown in FIG. 23(b), the pressure sensor 126 is disposed between the holding member 125 and the resin-sealed sample 105, and the pressure of the resin-sealed sample 105 causes the pressure sensor 126 to deform, changing the resistance value of the conductive rubber or the like of the pressure sensor 126.

[0569] 24, the holding member 125 is attached to or held by the polishing head 106. A pressure-sensitive sensor 126 is disposed between the holding member 125 and the resin-sealed sample 105. Depending on the pressure applied to the resin-sealed sample 105 and the inclination of the resin-sealed sample 105, the whole or part of the pressure-sensitive sensor 126 is pressed and deformed.

[0570] In one embodiment, the sensor portion is circular. The diameter of the pressure sensor 126 is configured to match the diameter of the resin-sealed sample 105. As an example, the diameter is approximately 1 cm. In an embodiment of the present invention, the resin-sealed samples 105 are available in three sizes: large, medium, and small. Three types of holding members 125 and pressure sensors 126 are also manufactured to match the diameters of the resin-sealed samples 105. Alternatively, the holding members 125 and pressure sensors 126 are large, and the fixing portions are configured to be adjustable by screw fastening, so that they can be used with the resin-sealed samples 105 of large, medium, and small sizes.

[0571] The resistance value of the pressure sensor 126 when no pressure is applied is 20 MΩ or more. When pressure is applied, the resistance value decreases. As shown in FIG. 23(a), the pressure sensor 126 can detect the position on the pressure sensor 126 where pressure is being applied, as well as the magnitude of the applied pressure, as indicated by 0 to 11.

[0572] The pressure application time, pressure position, and pressure magnitude can be measured and understood from the position where the resistance value changes and the resistance value. As shown in FIG. 23(a), the pressure sensor 126 can detect, for example, the pressing portion 129a and the pressing portion 129b separately. Furthermore, the pressure magnitude of the pressing portion 129a and the pressing portion 129b is output as signal data independently. When adjusting or measuring the pressure magnitude, the sound generated during polishing is measured by the microphone 306. The pressure magnitude is adjusted and controlled based on the changes in the sound volume and frequency.

[0573] For ease of explanation, the pressing portion 129 is described and illustrated as a pressed portion. The pressing portion 129 is not only the pressed portion, but also the portion, location, or position where the pressing or pressure has changed. The pressure sensor 126 can measure the rate of change in pressure by observing or measuring the resistance value in real time.

[0574] Furthermore, the pressure magnitude and the rate of pressure change are adjusted and controlled based on the change in the sound magnitude and frequency measured by the microphone 306. Furthermore, the tilt of the resin-sealed sample 105 and the like is adjusted and controlled based on the change in the sound magnitude and frequency measured by the microphone 306.

[0575] The positions of the pressed portions 129 and the unpressed portions 129 vary depending on the polishing state of the resin-sealed sample 105. When the resin-sealed sample 105 is not in contact with the polishing table 107, all positions become unpressed pressed portions 129. When the resin-sealed sample 105 is removed from the polishing table 107, the positions of removal (unpressed pressed portions 129) change sequentially, and the inclination of the resin-sealed sample 105 also changes.

[0576] As shown in FIG. 23 as positions 0 to 11 of the pressure sensor 126, the pressing portion 129 can detect which position of the pressure sensor 126 pressure is being applied and the magnitude of the applied pressure. In addition, multiple pressed pressing portions 129 are generated, and multiple unpressed pressing portions 129 are generated simultaneously. From the position where the pressure sensor 126 is being pressed and changes in the resistance value of the pressure sensor 126, the polishing state, tilt, etc. of the resin-sealed sample 105 and the object to be polished 102 can be detected in real time. Using this information, polishing, observation, and measurement are performed, and the polishing device is controlled.

[0577] It is preferable to perform polishing and control the polishing device by combining not only the positions 0 to 11 and pressure information of the pressure sensor 126, but also information from the force sensor 702 (for example, directional information, etc.), information from the microphone 306, and information from the vibration sensor 309.

[0578] The present invention can detect in real time a change in pressure by the pressure sensor 126. Therefore, the pressing force and tilt of the resin-sealed sample 105 can be detected in real time, and the tilt adjustment and presence or absence of pressing force of the resin-sealed sample 105 described in Fig. 15, Fig. 18, Fig. 67, etc. can be detected and controlled.

[0579] In addition, pressure control, pressure application time, intermittent pressure adjustment, setting of polishing position, change of polishing position, adjustment of polishing angle, observation state, and observation method during polishing processing as shown in Figures 3, 32, 33, 34, 35, 36, 37, 38, 41, 42, 43, 68, 69, 70, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, and 94 can be adjusted and controlled in real time.

[0580] The pressure sensor 126 can easily detect pressure changes in real time. The detected coordinate position (X, Y) of the pressing part and pressing force are output from the signal wiring 127 and transferred to the controller circuit 711, which controls the robot arm 801 and the polishing table 107. The detected coordinate position (X, Y) of the pressing part, pressing force, and polishing processing state are recorded and stored in a database and are classified into patterns corresponding to the detected coordinate position (X, Y) of the pressing part, pressing force, and polishing processing state. In addition, AI learning is performed for each pattern classification.

[0581] In the above embodiment, the polishing pressure is detected by the force sensor 702 and adjusted and controlled for the polishing pressure of the resin-sealed sample 105, but the present invention is not limited to this. For example, as shown in Fig. 23, the polishing pressure may be detected by a pressure sensor 126 and adjusted and controlled for the polishing pressure of the resin-sealed sample 105.

[0582] Furthermore, both the force sensor 702 and the pressure sensor 126 may be used to adjust and control the polishing pressure and polishing process of the resin-sealed sample 105 and the object to be polished 102. This is particularly effective when processing is performed by adjusting or setting the polishing angle of the resin-sealed sample 105, as in the embodiment of FIG.

[0583] It goes without saying that the above embodiments can also be applied to the embodiments in Figures 68 and 69. It goes without saying that the matters described in Figures 23 and 24 can also be applied to other embodiments, for example, Figures 68, 70, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, 94, etc. It goes without saying that the embodiments described in this specification and drawings can be combined in part or in whole.

[0584] The value of the force sensor 702 is set as the origin at a load of a predetermined set value. For example, when the load falls below 0.1 kg, the force sensor 702 is set to no load, or the load of the force sensor 702 is set as the origin at a certain value or less. At the origin position, the push-in amount of the resin-sealed sample 105 is set to 1 mm, for example. Also, predetermined push-in amounts are set, such as 0.5 mm, 1.0 mm, 1.5 mm, etc., and the push-in amount is sequentially set and controlled to process the resin-sealed sample 105.

[0585] 32, 33, 34, 35, 36, 37, and 38 are performed based on the pressure applied to, or detected or measured by, the force sensor 702 and the pressure sensor 126. Also, the rotation speed of the polishing table 107 is controlled.

[0586] It is preferable to carry out the movement control of the resin-sealed sample 105 in Fig. 42 and the movement speed control in Fig. 43. For example, in Fig. 33, if the polishing friction and polishing pressure increase when pressure Pa is applied during period Tu, the pressure is reduced to pressure Pb during period Td even if it is within period Tu. If the polishing friction and polishing pressure decrease below a predetermined value when pressure Pb is applied during period Tb, the pressure is increased to pressure Pa during period Tu even if it is within period Td.

[0587] The values ​​of pressure Pa and pressure Pb are changed based on the pressure data and pressure position data detected by the pressure sensor 126 and the force sensor 702. Also, the tilt and polishing position of the resin-sealed sample 105 are adjusted and set. The tilt and polishing position of the resin-sealed sample 105 and the object to be polished 102 in Figures 67 and 69 are adjusted and set. Also, Tc, Tu, and Td are changed and set.

[0588] Based on the data detected by the force sensor 702, the pressure value is changed and set as shown in Figures 32, 33, 34, 35, 36, 37, and 38. The revolutions per minute (rpm) is set and changed. The revolutions per minute (rpm) is the rotational speed of the polishing table 107 or the polishing object 102.

[0589] The pressure value and the rotations per minute (rpm) are set and changed based on directional data such as X, Y, and Z directions detected by the force sensor 702. The polishing position of the resin-sealed sample 105 on the polishing table 107 is also changed. The movement control of the resin-sealed sample 105 shown in FIG. 42 and the movement speed control shown in FIG. 43 are also performed.

[0590] The polishing apparatus of the present invention shown in Figure 73(a) is equipped with an optical image detection / photographing means 206a that is applied from the upper surface of the resin-sealed sample 105, and a light irradiator 201 that irradiates light from the side of the resin-sealed sample 105. However, the present invention is not limited to this.

[0591] Figure 73(b) shows a configuration in which light 205a emitted by a light irradiator 201 from the top surface of the resin-sealed sample 105 is incident on the resin-sealed sample 105, and light 205d emitted from the side surface of the resin-sealed sample 105 is detected by an optical image detection / photography means 206.

[0592] FIG. 74(a) is a diagram showing a state in which water (cleaning liquid) 209 is sandwiched between the processing surface 602a of the resin-sealed sample 105 and the polishing table 107. The refractive index of the epoxy resin constituting the resin-sealed sample 105 is 1.55 to 1.65, and the refractive index of water (cleaning liquid) is 1.33. Therefore, there is a difference in refractive index between the epoxy resin and the water (cleaning liquid) 209, and light is reflected by the processing surface 602a. The reflected light exits the resin-sealed sample 105 as reflected light 205c and enters the optical image detection / photography means 206.

[0593] A liquid film 604 of cleaning liquid or a solution mixed with a surfactant is formed on the polishing scratches, which gives the machined surface 602 a mirror finish or makes the polishing scratches less noticeable. Therefore, when the abrasive grain number is small, the machined surface 602 becomes closer to a mirror finish, and the image of the electrode terminal 101 reflected on the machined surface 602 can be observed.

[0594] As the polishing of the object progresses and abrasive grains with larger numbers are used, polishing scratches on the processed surface 602 become smaller and shallower. By forming a film of cleaning fluid or the like on the processed surface 602a, the cleaning fluid or the like penetrates into the polishing scratches, turning the processed surface 602a into a mirror-like finish, and improving the contrast and clarity of the reflected image 208. This is particularly noticeable when polarized light is used as illumination light. As the polishing operation of the object to be polished progresses, in the final stage of the polishing process using abrasive grains with a larger number, polishing scratches on the processed surface 602 disappear or become very slight.

[0595] After washing away the abrasive grains from the processing surface 602, a cleaning liquid or the like is supplied between the polishing table 107 and the processing surface 602, and a cleaning liquid 209 or the like is filled or interposed between the polishing table 107 and the processing surface 602, thereby reducing polishing scratches on the processing surface 602. In addition, a light-reflecting surface is generated due to the difference in refractive index between the cleaning liquid or the like and the refractive index of the object 102 to be polished. Therefore, the processing surface 602 becomes a mirror surface, and the image of the electrode terminal 101 reflected on the mirror surface can be clearly observed. FIG. 74(b) shows a configuration in which an air layer (gap, space) is provided between the resin-sealed sample 105 and the polishing table 107.

[0596] As the polishing of the object to be polished progresses, and the polishing stage using high-grade abrasive grains (such as grains with a number as high as 400) is reached, polishing scratches on the processed surface 602 disappear. In this case, by lowering the polishing table 107 (in the direction D2) or raising the polishing head 106 (in the direction U1), an air gap can be created between the object to be polished 102 or the resin-encapsulated sample 105 and the polishing surface 505. The lifting and lowering are performed intermittently, as shown in FIG. 32. The intermittent cycle period Tc, consisting of the lifting (high pressure) period Tu and the lowering (low pressure or near zero) period Td, is preferably 4 seconds or less. Preferably, it is between 0.5 seconds and 2 seconds.

[0597] The ratio of the rising (high pressure) period Tu to the falling (low pressure or 0 or near 0) period Td is determined by the output data of the force sensor 702 and the observation data of the camera 206. Alternatively, at the start of processing, the Tu period is set shorter than the Td period, and as processing progresses, the ratio of the Tu period is increased. The resin-sealed sample 105 is rotated, and immediately after the rotation, the ratio of Tu to Tc is decreased, and thereafter, the ratio of Tu to Tc is increased.

[0598] The refractive index of the air layer is 1.0, and the refractive index of the resin-sealed sample 105 is 1.55 to 1.65 because it is made of epoxy resin. Due to the difference in refractive index between the air layer and the resin-sealed sample 105 and the object 102 to be polished, a light-reflecting surface is generated on the processing surface 602a.

[0599] Therefore, the processed surface 602 becomes a reflective surface, and the image of the electrode terminal 101 reflected on the reflective surface can be clearly observed. Excess water or solution adhering to the processed surface 602a can be removed by centrifugal force by rotating the polishing head 106 at high speed or appropriately. A liquid film 604 is formed uniformly on the processed surface 602 by centrifugal force. A thin liquid film 604 can also be formed on the processed surface 602a by centrifugal force. It is also preferable to form the liquid film 604 by applying wax or the like to the processed surface 602a.

[0600] Although Figure 74(b) shows a configuration in which an air layer (gap, space) is arranged between the resin-sealed sample 105 and the polishing table 107, it is also preferable to form a coating (coating) 604 made of a cleaning solution or water on the processing surface 602a of the resin-sealed sample 105 so that the coating (coating) 604 comes into contact with air.

[0601] The liquid film 604 penetrates into the polishing scratches on the processed surface 602 and flattens the scratches. Therefore, the processed surface 602 can be made mirror-finished. The resin-sealed sample 105 has a refractive index of 1.5 to 1.65, and the liquid film 604 has a refractive index of 1.33 to 1.5. The refractive index of air is 1.0. If a surfactant, oil, wax, Vaseline, adhesive, or the like is applied to the processed surface 602a, the polishing scratches are filled with the oil, wax, Vaseline, adhesive, or the like, and the processed surface 602a can be flattened.

[0602] It is preferable to use a material such as wax whose refractive index differs by 0.25 or less from that of the resin-sealed sample 105. It is more preferable to use a material whose refractive index differs by 0.20 or less from that of the resin-sealed sample 105. Water is suitable for the liquid film 604 because it has a refractive index of 1.33, is inexpensive, is easy to handle, and serves as a good optical coupling liquid.

[0603] The refractive index of the sealing resin constituting the resin-sealed sample 105 is preferably 1.5 or more and 1.65 or less. When the liquid film 604 is formed by coating, it is preferable to use a material with a refractive index of 1.45 to 1.55 or less.

[0604] The liquid film 604 is not limited to a cleaning solution. A cleaning solution mixed with a surfactant or a surfactant may be sprayed or applied to form a liquid film 604, a liquid film 604, or a gel film 604 on the processing surface 602. The liquid film 604 or gel film 604 uses a solution or gel with a light transmittance of 70% or more.

[0605] It is preferable to use a material with good wettability for the liquid film 604. Wettability mainly indicates the affinity (ease of adhesion) of a liquid to a solid surface. When the liquid is a solution, wettability can also be expressed as hydrophilicity or hydrophobicity.

[0606] A coating agent such as a surfactant, wax, or photocurable resin may be applied or formed on the processing surface 602. For example, a photocurable resin made of acrylic resin may be applied and then cured by ultraviolet light. In other words, a liquid film 604 may be formed or applied on the processing surface 602, and then the liquid film 604 may be cured by applying heat or irradiating it with ultraviolet light. These methods and processes are also within the technical scope of the present invention.

[0607] The present invention is a method or configuration for improving the light reflectance of the processed surface 602 by filling polishing scratches on the processed surface 602 with a liquid or solid, and flattening the processed surface 602 or reducing light scattering or light diffusion.

[0608] In FIG. 75, light 205 emitted from a light irradiator 201 is split into P-polarized light 205P and S-polarized light 205S by a polarization splitting surface 501 of a polarizing beam splitter (PBS) 502.

[0609] The polarizing beam splitter (PBS) 502 is a polarizer that extracts light with a specific vibration (P polarization, S polarization) from natural light. There are cube type and plate type, but either is acceptable. The wavelength band is adapted to the wavelength of the light emitted by the light irradiator 201.

[0610] The lens 605 is a relay lens and is disposed so as to condense the light 205, illuminate the workpiece 102, and allow the light from the workpiece 102 to be incident on the optical image detection / photography means 206 in a satisfactory manner.

[0611] Of the light 205, S-polarized light 205S is reflected and P-polarized light 205P is transmitted by the separation surface 501. The S-polarized light 205S is converted into circularly polarized light 205b by the λ / 4 plate 204. The circularly polarized light 205b enters the resin-encapsulated sample 105 and is irradiated onto the object 102 to be polished.

[0612] The circularly polarized light 205b reflected by the object to be polished 102 or the like becomes circularly polarized light 205c, which is opposite in direction to the circularly polarized light 205b, and is emitted from the resin-sealed sample 105. The circularly polarized light 205c is converted into P-polarized light 205d by the λ / 4 plate 204. The P-polarized light 205d passes through the separation surface 501 and enters the optical image detection / photographing means 206.

[0613] In the embodiment of Figure 75, light 205b is incident from a side surface of the resin-sealed sample 105, and light 205c is emitted from the same side surface. Furthermore, the incident light 205b and the emitted light 205c pass through the same λ / 4 plate 204. Therefore, linearly polarized light can be converted to circularly polarized light, and circularly polarized light can be converted to linearly polarized light reversibly. Furthermore, the optical paths of the light entering and exiting the resin-sealed sample 105 can be made to coincide.

[0614] When the diaphragm 504a is completely closed, the light 205 from the light irradiator 201 is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206.

[0615] By adjusting the aperture diameter of the diaphragm 504a, the directivity of light incident on the optical image detection / photography means 206 can be adjusted. Reducing the aperture diameter of the diaphragm 504a narrows the directivity of light. This is therefore equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. Increasing the aperture diameter of the diaphragm 504a widens the directivity of light. This is therefore equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased. 75 shows a configuration in which incident light 205b and outgoing light 205c are incident on or outgoing from the side surface of the resin-sealed sample 105. The present invention is not limited to this.

[0616] As shown in FIG. 76, a configuration may be adopted in which light 205c is incident from the side surface of the resin-sealed sample 105 and light 205d is emitted from the side surface of the resin-sealed sample 105, while light 205a is incident from the top surface of the resin-sealed sample 105 and light 205b is emitted from the top surface of the resin-sealed sample 105.

[0617] Light 205a emitted from light irradiator 201a is converted into linearly polarized light by polarizing plate 202a, condensed by relay lens 605a, and reflected by total reflection mirror 503. The light is reflected by total reflection mirror 503, its direction is changed, and it is incident on the upper surface of resin-sealed sample 105.

[0618] The linearly polarized light is converted into circularly polarized light 205a by the λ / 4 plate 204a. The circularly polarized light 205a is incident on the resin-sealed sample 105. Light 205b reflected by the resin-sealed sample 105 becomes circularly polarized light 205b which is opposite in direction to the circularly polarized light 205a and is emitted from the resin-sealed sample 105.

[0619] The circularly polarized light 205b is converted into linearly polarized light by the λ / 4 plate 204a, reflected by the total reflection mirror 503, condensed by the relay lens 605b, transmitted through the polarizing plate 202b, and incident on the optical image detection / photographing means 206a. The polarizing plates 202a and 202b are arranged so that their polarization axes are orthogonal to each other.

[0620] Light 205 emitted from the light irradiator 201b is converted into linearly polarized light by the polarizing plate 202c. The linearly polarized light is converted into circularly polarized light 205c by the λ / 4 plate 204a. The circularly polarized light 205c is incident on the side surface of the resin-sealed sample 105.

[0621] The light 205d reflected within the resin-sealed sample 105 becomes circularly polarized light 205 in the opposite direction to the circularly polarized light 205c, and is emitted from the resin-sealed sample 105. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204b, passes through the polarizing plate 202d, and enters the optical image detection / photographing means 206b.

[0622] When the diaphragm 504a is completely closed, the light 205a from the light irradiator 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206a.

[0623] When the diaphragm 504b is completely closed, the light 205c from the light irradiator 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206b. By adjusting the opening diameters of the diaphragms 504a and 504b, the directivity of the light from the light irradiators 201a and 201b can be adjusted.

[0624] Reducing the aperture diameter of the diaphragms 504a and 504b narrows the directivity of light. This is therefore equivalent to increasing the F-number of the lens, and the contrast of the optical image can be increased. Reducing the aperture diameter of the diaphragms 504a and 504b widens the directivity of light. This is therefore equivalent to decreasing the F-number of the lens, and the brightness of the optical image can be increased.

[0625] In Fig. 95, the object 102 to be polished is illuminated with polarized light from a light irradiator 201. A camera 206a mainly observes reflected light 205b from the processing surface 602. The camera 206a mainly observes reflected light 205c of a real image of the object 102 to be polished. The polarization direction of the reflected light 205b observed by the camera 206a and the polarization direction of the reflected light 205c observed by the camera 206b are set to the same direction.

[0626] It goes without saying that a plurality of light irradiators 201 may be used. For example, a light irradiator 201a that illuminates the workpiece 102 and a light irradiator 201b that illuminates the processing surface 602 may be arranged. It is preferable that the polarized light from the light irradiators 201a and 201b be orthogonal to each other. It is also preferable that the polarized light incident on the cameras 206a and 206b be orthogonal to each other.

[0627] It goes without saying that the above embodiments can also be applied to the embodiments in Figures 68, 69, 84, 85, 86, 87, 88, 89, 90, 91, 92, 93, and 94. It also goes without saying that they can be combined.

[0628] Figure 77 is an explanatory diagram of a polishing apparatus 700 according to another embodiment of the present invention. As shown in Figure 77, light 205d is incident from the side surface of the resin-sealed sample 105, and light 205e is emitted from the side surface of the resin-sealed sample 105. Light 205b is incident from the top surface of the resin-sealed sample 105, and light 205c is emitted from the top surface of the resin-sealed sample 105.

[0629] Light 205a emitted from light irradiator 201a is separated into P-polarized light and S-polarized light by light separation surface 501 of PBS 502. S-polarized light 205b is reflected by separation surface 501, and the linearly polarized light is converted into circularly polarized light by λ / 4 plate 204a.

[0630] It should be noted that, of the light 205, S-polarized light 205S is reflected by the separation surface 501, and P-polarized light 205P is transmitted. Although the S-polarized light 205S is reflected by the total reflection mirror 503b, this is not limitative. It is also possible to use a PBS 502 in which P-polarized light 205P is reflected by the separation surface 501, and S-polarized light 205S is transmitted.

[0631] The circularly polarized light 205b is incident on the resin-sealed sample 105. The light 205c reflected by the resin-sealed sample 105 becomes circularly polarized light in the opposite direction to the circularly polarized light 205b, and is emitted from the resin-sealed sample 105. The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204a, passes through the separation surface 501, and is incident on the optical image detection / photography means 206a.

[0632] The light 205 emitted from the light irradiator 201b is converted into linearly polarized light by the polarizing plate 202c. The linearly polarized light is converted into circularly polarized light by the λ / 4 plate 204b. The circularly polarized light is incident on the side surface of the resin-sealed sample 105.

[0633] The light 205e reflected within the resin-sealed sample 105 becomes circularly polarized light in the opposite direction to the circularly polarized light 205d, and is emitted from the resin-sealed sample 105. The circularly polarized light 205e is converted into linearly polarized light by the λ / 4 plate 204b, passes through the polarizing plate 202b, and enters the optical image detection / photographing means 206a.

[0634] When the diaphragm 504a is completely closed, the light 205a from the light irradiator 201a is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photography means 206a. The dark level is measured and dark correction is performed.

[0635] Dark correction corrects dark current noise by taking advantage of the fact that its occurrence depends on exposure time and temperature. Specifically, immediately after capturing an image, an image of a light-shielded space is captured using the same exposure time to obtain dark current noise, and this noise data is then subtracted from the original image.

[0636] When the diaphragm 504b is completely closed, the light 205c from the light irradiator 201b is blocked. In this state, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206b.

[0637] 78 is an explanatory diagram and configuration diagram of a polishing apparatus 700 according to another embodiment. Light 205 emitted from a light irradiator 201 is split by a polarization splitting surface 501 of a polarizing beam splitter (PBS) 502 into P-polarized light 205P and S-polarized light 205S.

[0638] The lenses 605 (lenses 605a and 605b) are relay lenses. The lenses 605 are arranged to condense the light 205, illuminate the workpiece 102, and allow the light from the workpiece 102 to be effectively incident on the optical image detection / photography means 206.

[0639] Of the light 205, S-polarized light 205S is reflected by the separation surface 501, and P-polarized light 205P is transmitted. The S-polarized light 205S is reflected by a total reflection mirror 503b. The S-polarized light 205S is converted into circularly polarized light by a λ / 4 plate 204b. The circularly polarized light is incident on the processed surface 602b of the resin-sealed sample 105. The light reflected by the resin-sealed sample 105, the object to be polished 102, the processing surface 602a, etc. becomes circularly polarized light 205c, which is the opposite rotation of the incident circularly polarized light.

[0640] The circularly polarized light 205c is converted into linearly polarized light by the λ / 4 plate 204a, reflected by the total reflection mirror 503a, and enters the PBS 502. The light that entered the PBS 502 enters the optical image detection / photographing means 206 at the light separation surface 501. The circularly polarized light 205 c that is not converted into linearly polarized light by the λ / 4 plate 204 a passes through the light separation surface 501 of the PBS 502 .

[0641] The diaphragm 504a is opened and the diaphragm 504b is closed when the light 205c is made incident on the optical image detection / photography means 206. The diaphragm 504b is opened and the diaphragm 504a is closed when the light 205d is made incident on the optical image detection / photography means 206.

[0642] When the diaphragm 504a is completely closed, the light 205c reflected mainly from the surface 602a to be processed is blocked. When the diaphragm 504b is opened, the light reflected from the workpiece 102 can be incident on the optical image detection / photographing means 206.

[0643] When the diaphragm 504b is completely closed, it blocks light 205d that is mainly reflected by the workpiece 102. When the diaphragm 504a is opened, it allows light that is mainly reflected by the processing surface 602a to be incident on the optical image detection / photographing means 206.

[0644] 78, light 205S is incident from a side surface of the resin-sealed sample 105, and light 205d is emitted from the same side surface. Therefore, linearly polarized light can be converted to circularly polarized light, and circularly polarized light can be converted to linearly polarized light reversibly. In addition, the optical path and optical axis of the light entering and exiting the resin-sealed sample 105 can be aligned.

[0645] Furthermore, light 205P is incident from the top surface of the resin-sealed sample 105, and light 205c is emitted from the same top surface. Therefore, linearly polarized light can be converted to circularly polarized light, and circularly polarized light can be converted to linearly polarized light reversibly. Furthermore, the optical path and optical axis of the light entering and exiting the resin-sealed sample 105 can be aligned. When both the apertures 504a and 504b are completely stopped down, the dark level can be measured by measuring the amount of light incident on the optical image detection / photographing means 206.

[0646] Furthermore, by adjusting the aperture diameters of the diaphragms 504a and 504b, it is possible to adjust the directivity of light incident on the optical image detection / photographing means 206. Reducing the aperture diameter of the diaphragm 504 narrows the directivity of light. This is therefore equivalent to increasing the F-number of the lens, and it is possible to increase the contrast of the optical image.

[0647] Increasing the aperture diameter of the diaphragm 504 broadens the directivity of light, which is equivalent to decreasing the F-number of the lens, and can increase the brightness of the optical image.

[0648] The opening diameter of the diaphragm 504 can adjust the directivity of the illumination light illuminating the resin-sealed sample 105 and the directivity of the emitted light from the resin-sealed sample 105. By adjusting the directivity, it is possible to adjust and suppress the generation of stray light occurring within the resin-sealed sample 105.

[0649] 76, 77, and 78 show that light is incident on the resin-sealed sample 105 from two directions, that is, the top surface and the side surface of the resin-sealed sample 105, but the present invention is not limited to this. It goes without saying that light may be incident on the resin-sealed sample 105 from one direction, that is, the top surface or the side surface of the resin-sealed sample 105, and the light emitted from the resin-sealed sample 105 may be detected or observed by the optical image detection / photographing means 206.

[0650] In the present invention, the polished surface of the resin-sealed sample 105, in which components are sealed with resin, is washed during the polishing process. The polished surface is cleaned by washing, and polishing scratches are covered with a cleaning liquid, which functions as a liquid film 604a. The liquid film 604a causes the processed surface 602a to function as a reflective surface.

[0651] The refractive index of the sealing resin of the resin-sealed sample 105 is high, ranging from 1.52 to 1.65, and the difference in refractive index between the sealing resin and the air covered with the cleaning liquid is large, so the reflectance of the illumination light inside the resin-sealed sample 105 is high.

[0652] By making the processing surface 602a function as a reflective mirror, it is possible to observe the object 102 to be polished reflected on the processing surface 602a. Therefore, the polishing state of the object 102 to be polished can be observed well, and precision processing can be achieved.

[0653] Furthermore, by using polarized illumination light, the object 102 to be polished can be illuminated with reduced influence of stray light. Furthermore, by passing polarized reflected light through a polarizing plate for observation, the influence of stray light within the resin-sealed sample 105 can be reduced. Therefore, the object 102 to be polished can be observed well, and the target polishing position of the object 102 to be polished can be processed with high precision.

[0654] An optical image of a member such as the object to be polished 102 is projected onto the processing surface 602a, and a real image of the member (for example, an electrode terminal) 101 and an optical image (reflected image, mirror image) 208 of the polishing surface can be observed simultaneously.

[0655] As shown and explained in Figures 66 and 67, by observing the real image and the reflected image simultaneously and carrying out the polishing method of the present invention, the resin-sealed sample 105 and the object to be polished 102 can be processed with high precision.

[0656] Light irradiated from light irradiator 201 passes through polarizing plate 202a to become polarized light, and the polarized light is converted into circularly polarized light 205a by λ / 4 plate 204a to illuminate object to be polished 102. Light 205d emitted from resin-sealed sample 105 is converted into polarized light by λ / 4 plate 204b, and the light transmitted through polarizing plate 202b is observed by imaging camera (photography camera, monitor screen, display monitor) 206 or the like. By polarizing the illumination light and then circularly polarizing it with the λ / 4 plate, stray light within resin-sealed sample 105 is reduced, allowing the polished surface to be observed clearly.

[0657] 1, 2, 3 and 4 are diagrams and explanatory views of a polishing device 700 of the present invention. The polishing shaft 301 in FIG. 16 is composed of a robot arm 801 and the like.

[0658] The polishing processing apparatus 700 of the present invention is configured by arranging, installing, and configuring the polishing table 107, arm fixing base 705, etc. on the polishing stand 704. In the embodiment of Fig. 4, the polishing shaft is configured by polishing shaft 301a, polishing shaft 301b, polishing shaft 301c, and polishing shaft 301d, and each polishing shaft 301 is connected by angle adjustment unit (rotating unit) 302 (angle adjustment unit (rotating unit) 302a, angle adjustment unit (rotating unit) 302b, angle adjustment unit (rotating unit) 302c). The polishing shaft 301a is fitted with a device mounting portion 703 for mounting the camera 206 and color sensor 701, and also with a force sensor 702 attached.

[0659] The force sensor 702 is an electronic component that resolves "forces" applied from various directions and "torque," which is the moment of a rotational force, into components in the X, Y, and Z directions and converts them into electrical signals for detection. The electrical signals detected or output by the force sensor 702 are used to adjust the pressure and the position of the resin-encapsulated sample 105.

[0660] The force sensor 702 can measure the magnitude of forces and torques acting in multiple directions in real time. It is also called a load cell. The force sensor 702 can measure the state of multiple forces, such as three-axis or six-axis forces, in real time.

[0661] The force sensor 702 measures and detects the pressure applied to the resin-sealed sample 105, the pressure and pressure direction applied to polish the edge portion of the resin-sealed sample 105 shown in Fig. 13(b) and the like, and controls the polishing status of the resin-sealed sample 105. When polishing the edge portion shown in Fig. 13(b) and the like, polishing is started with a small pressure at first.

[0662] As shown in Figure 15, as the edge portion is polished and the area of ​​the flat portion becomes larger, the pressing pressure must be increased. The pressure is changed and set according to the polishing condition. Preferably, as shown and explained in Figures 81, 82, 83, and 84, the 3D (solid) shape and 3D (solid) size of the resin-sealed sample 105 to be polished are measured using a camera 206 or the like. The measured 3D (solid) shape and 3D (solid) size are also stored. The polishing process is performed using the 3D (solid) shape and 3D (solid) size.

[0663] The pressure during polishing is adjusted, set, and changed according to the 3D (solid) shape and 3D (solid) size. It is also effective to use the distance (length) data output by the distance sensor 757 to determine the position (distance) of the object to be polished 102, the resin-sealed sample 105, and the polishing pad 506. The distance (length) data output by the distance sensor 757 is used after averaging the data during the period when the polishing table 107 rotates.

[0664] The height of the resin-sealed sample 105 varies from sample to sample. The distance sensor 757 measures the height and diameter of the resin-sealed sample 105. If necessary, the distance sensor 757 scans with a measuring light to obtain the 3D shape of the resin-sealed sample 105. The distance sensor 757 is not limited to one that measures distance. A laser microscope or the like that has a function of measuring thickness and height may also be used.

[0665] By forming or generating a liquid film 604 on the processing surface 602 of the resin-sealed sample 105, it is possible to observe the polishing processing state of the object 102 to be polished. In addition, it is possible to measure the position of the object 102 to be polished of the resin-sealed sample 105.

[0666] The height of the resin-sealed sample 105 can also be determined by forming or generating a liquid film 604 on the processed surface 602 and observing the reflected image of the processed surface 602 and the electrode terminal 101 with the optical image detection / photography means 206.

[0667] 33, 34, 35, 36, 37, 38, etc., pressures Pa, Pb, etc. are shown as fixed values ​​for ease of explanation. Pressures Pa, Pb, etc. vary depending on the 3D (three-dimensional) shape and 3D (three-dimensional) size of resin-sealed sample 105. Furthermore, pressures may be set or changed based on output data from force sensor 702.

[0668] 34, 35, 36, 37, and 38 are changed according to the polishing conditions and polishing positions. Pm, Pc, Pa, Pd, and Pb are set based on the 3D shape and 3D size of each resin-sealed sample 105. The pressure values ​​used to simplify the pressure changes are also set, changed, or varied based on the 3D shape, 3D size, and polishing position of each resin-sealed sample 105.

[0669] The polishing shaft 301 (polishing shaft 301a, polishing shaft 301b, polishing shaft 301c) is rotated, moved up and down, and moved left and right by the rotating part 302 (rotating part 302a, rotating part 302b, rotating part 302c).

[0670] The polishing table 107 of the polishing stand 704 controls the start of rotation and the rotation speed of the polishing pad 506 based on the vertical position and pressing pressure of the resin-encapsulated sample 105. Also, the polishing shaft 301 (polishing shaft 301a, polishing shaft 301b, polishing shaft 301c) is rotated and moved up and down by the rotating part 302 (rotating part 302a, rotating part 302b, rotating part 302c), thereby performing a polishing method using intermittent pressure such as that shown in FIG.

[0671] The distance sensor 757 not only measures distance, but also uses changes in distance to detect and measure the state of the polishing surface 505, the unevenness of the polishing pad 506, and the rotation speed of the polishing table 107. It can also measure and observe the state (particles, viscosity) of the abrasive on the polishing pad 506. The shape is recognized by measuring the relative distance to the surface of the polishing pad 506 like a contour line.

[0672] By using the distance sensor 757, the distance and distance changes between the resin-sealed sample 105 and the polishing pad 506, etc. can be monitored. Therefore, the polishing pressure can be controlled to a predetermined value, or the pressure change can be controlled to a predetermined value or within a predetermined range. Furthermore, the position of the resin-sealed sample 105 can be controlled and the amount of displacement can be measured. Furthermore, the application state of the polishing liquid from the polishing liquid supply nozzle 307 and the application state of the cleaning liquid from the cleaning liquid supply nozzle 207 can be detected and controlled.

[0673] The distance sensor 757 may be any of those using laser light, electromagnetic waves, and ultrasonic waves. The distance sensor 757 is used to measure the height of the resin-sealed sample 105. The distance sensor 757 is also used to measure the "head shape" of the resin-sealed sample 105 at part C and the like.

[0674] 5 is a configuration diagram and explanatory diagram focusing on the polishing head 106. The polishing head 106 is composed of a head mounting mechanism 754, a head unit 722, a holder 721, etc. A distance sensor 757 is attached to the head mounting mechanism 754.

[0675] Three holders 721 (holders 721a, 721b, and 721c) are arranged and attached to the head portion 722. Under the control of the controller circuit 711, the holders 721 (holders 721a, 721b, and 721c) move in the center direction b and the circumferential direction a.

[0676] The holders 721 also move in the upward direction c and downward direction d. By moving in the holder ab direction and the holder 721 in the cd direction, the resin-sealed sample 105 is sandwiched between the three holders 721 (holders 721a, 721b, and 721c). The resin-sealed sample 105 is also moved, and the resin-sealed sample 105 is released.

[0677] In ...

Claims

1. A method for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides in which a polished object is sealed with a light-transmitting resin, The substrate has an uneven or concave shape, or a convex shape, and at least one of an adhesive or bonding agent is applied to or placed on the first surface of the substrate. The first step is to place the abrasive on the first surface and arrange the pipe so as to surround the abrasive, A second step involves filling the pipe with liquid resin and curing the resin, A method for producing a resin encapsulant, characterized by comprising a third step of peeling off the substrate and removing the resin encapsulant in which the polished material is sealed with the resin from the pipe.

2. A method for producing a resin encapsulation having a top surface, a bottom surface, and a cylindrical side surface in which a polished object is sealed with a light-transmitting resin, The substrate has an uneven or concave shape, or a convex shape, and at least one of an adhesive or bonding agent is applied to or placed on the first surface of the substrate. The first step is to place the abrasive on the first surface and arrange the pipe so as to surround the abrasive, A second step involves filling the pipe with liquid resin and curing the resin, A third step involves peeling off the substrate and removing the resin-sealed object from the pipe in which the polished material is sealed with the resin, A method for producing a resin encapsulant, characterized by comprising a fourth step of polishing the peripheral portion of the upper surface of the resin encapsulant.

3. A method for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides in which a polished object is sealed with a light-transmitting resin, The substrate has an uneven or concave shape, or a convex shape, and at least one of an adhesive or bonding agent is applied to or placed on the first surface of the substrate. A fifth step involves attaching a holder for holding the polished work, The first step is to place the abrasive on the first surface and arrange the pipe so as to surround the abrasive, A second step involves filling the pipe with liquid resin and curing the resin, A method for producing a resin encapsulant, characterized by comprising a third step of peeling off the substrate and removing the resin encapsulant in which the polished material is sealed with the resin from the pipe.

4. A method for producing a resin encapsulation having a top surface, a bottom surface, and cylindrical sides in which a polished object is sealed with a light-transmitting resin, The substrate has an uneven or concave shape, or a convex shape, and at least one of an adhesive or bonding agent is applied to or placed on the first surface of the substrate. A sixth step of forming a first marking line and a second marking line substantially perpendicular to the first marking line on the polished work, The first step is to place the abrasive on the first surface and arrange the pipe so as to surround the abrasive, A second step involves filling the pipe with liquid resin and curing the resin, A method for producing a resin encapsulant, characterized by comprising a third step of peeling off the substrate and removing the resin encapsulant in which the polished material is sealed with the resin from the pipe.

5. In the third step, A method for producing a resin encapsulant according to claim 1, 2, 3, or 4, characterized in that the resin encapsulant is removed from the pipe using an extruder.

6. The substrate has an uneven shape formed or configured on it, The difference in height between the recesses and protrusions of the aforementioned uneven shape is 10 μm or more and 200 μm or less. The method for producing a resin encapsulant according to claim 1, 2, 3, or 4, characterized in that the aforementioned uneven shapes are formed or arranged in an area of ​​100 mm² in number of 10 to 200.

7. The method for producing a resin encapsulated article according to claim 1, claim 2, claim 3, or claim 4, characterized in that the base material is a nonwoven fabric, polyvinyl chloride, polyethylene, polypropylene, or polyester.

8. A method for producing a resin-encapsulated object according to claim 1, claim 2, claim 3, or claim 4, further comprising a seventh step of polishing the bottom surface and polishing the object to a predetermined position.

9. The method for producing a resin encapsulant according to claim 1, claim 2, claim 3, or claim 4, characterized in that the resin is a light-transmitting epoxy resin with a refractive index of 1.55 or more and 1.7 or less.

10. A method for producing a resin sealant according to claim 1, claim 2, claim 3, or claim 4, characterized in that a fluorocarbon resin is applied or formed on the inner surface of the pipe.

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