Substrate holding device and substrate processing apparatus

Abstract

To provide a substrate holding device and a substrate processing device capable of holding a substrate appropriately according to a processing content of the substrate.SOLUTION: A spin chuck SC includes a spin base 20. Fixed holding parts 30A and 30B and movable holding parts 40A and 40B are provided on a peripheral edge part of the spin base 20. The movable holding parts 40A and 40B are provided so as to be capable of shifting between a holding state in which they are in contact with an outer peripheral end part of a substrate W disposed on the spin base 20 and a release state in which they are separated from the substrate W. A magnet lifting device 50A is configured to be capable of switching a state of the movable holding part 40A by a lifting magnet 59. A magnet lifting device 50B is configured to be capable of switching a state of the movable holding part 40B by the lifting magnet 59. A control part 900 selectively performs control of simultaneously switching the states of the movable holding parts 40A and 40B and control of switching the states of the movable holding parts 40A and 40B at different times.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate holding device for holding a substrate and a substrate processing apparatus. [Background technology]

[0002] Substrate processing apparatuses are used to perform various processes on substrates such as semiconductor substrates, substrates for FPDs (Flat Panel Displays) such as liquid crystal display devices or organic EL (Electro Luminescence) display devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photomasks, ceramic substrates, or substrates for solar cells. In a single-wafer type substrate processing apparatus that processes substrates one by one, a substrate holding device is used to hold the substrate to be processed.

[0003] For example, the substrate processing apparatus described in Patent Document 1 has a chuck unit as a substrate holding device that holds a substrate in a horizontal position. The chuck unit includes a flat rotating table that is circular in plan view, and two fixed pins and two movable pins for holding the outer edge of the substrate on the rotating table. The two fixed pins and two movable pins are arranged at equal intervals on the periphery of the rotating table so that the fixed pin and the movable pin face each other across the center of the rotating table in plan view.

[0004] The movable pins are configured to be switchable by a switching mechanism between a state in which they can hold a substrate and a state in which they can hand over a substrate. This allows the substrate to be placed between the two fixed pins and the two movable pins when each movable pin is in a state in which it can hand over a substrate. Furthermore, when a substrate is placed between the two fixed pins and the two movable pins, the movable pins are switched to a state in which they can hold a substrate, thereby holding the substrate. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Publication No. 2022-86362 Summary of the Invention [Problem to be solved by the invention]

[0006] The movable pin switching mechanism described in Patent Document 1 is configured to switch the states of two movable pins simultaneously. In this case, the time from when the substrate is placed between the two fixed pins and the two movable pins to when the substrate is held is shorter than when the states of the two movable pins are switched separately.

[0007] Incidentally, a notch, orientation flat, or other cutout is provided in a portion of the outer peripheral edge of a substrate to determine the crystal orientation of the substrate or to position the substrate according to predetermined conditions. Therefore, when one of two movable pins fits into the cutout in the substrate, the two movable pins may contact the outer peripheral edge of the substrate with a slight time difference, which may result in the outer peripheral edge of the substrate not being held by all pins (four pins). In other words, the outer peripheral edge of the substrate may be held by three pins. Holding a substrate by three pins may not be permitted depending on the processing content of the substrate.

[0008] An object of the present invention is to provide a substrate holding device and a substrate processing apparatus that are capable of holding a substrate appropriately according to the processing content of the substrate. [Means for solving the problem]

[0009] A substrate holding device according to one aspect of the present invention is a substrate holding device that holds a substrate, and comprises: a rotating member rotatable around an axis extending in an up-down direction; a rotation drive unit that rotates the rotating member around the axis; a plurality of movable holding parts that are provided on the peripheral portion of the rotating member and are switchable between a holding state in which they abut against the outer peripheral edge of the substrate and hold the substrate, and a released state in which they are separated from the outer peripheral edge of the substrate; a state switching unit that switches the plurality of movable holding parts between the holding state and the released state; and a control unit that selects and performs first control or second control on the state switching unit, wherein the first control is control that simultaneously switches the plurality of movable holding parts from the released state to the holding state, and the second control is control that switches some of the plurality of movable holding parts from the released state to the holding state and switches other of the plurality of movable holding parts from the released state to the holding state at different times.

[0010] A substrate processing apparatus according to another aspect of the present invention includes the above-described substrate holding device for holding a substrate, and a processing section for performing a predetermined process on the substrate held and rotated by the substrate holding device. [Effects of the Invention]

[0011] According to the present invention, it is possible to hold a substrate in an appropriate manner according to the processing content of the substrate. [Brief explanation of the drawings]

[0012] [Figure 1] 1 is a schematic side view showing a basic configuration of a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. 2 is a schematic plan view of the substrate processing apparatus of FIG. [Figure 3] 3 is a perspective view of the external appearance of the magnetic lifting device seen through the spin base from a position above the fixed holder in FIG. 2. FIG. [Figure 4] 4 is a diagram for explaining a switching function of the magnetic lifting device of FIG. 3. FIG. [Figure 5] 2 is a block diagram showing the configuration of a control system of the substrate processing apparatus of FIG. 1. FIG. [Figure 6] 5 is a flowchart showing an example of a substrate holding process according to the first embodiment. [Figure 7] 7A to 7C are schematic plan views showing, in time sequence, transitions in the states of the substrate and the spin chuck when the substrate holding process of FIG. 6 is performed. [Figure 8] 7A to 7C are schematic plan views showing, in time sequence, transitions in the states of the substrate and the spin chuck when the substrate holding process of FIG. 6 is performed. [Figure 9] FIG. 10 is a schematic plan view of a substrate processing apparatus according to a second embodiment. [Figure 10] FIG. 10 is a diagram showing a control system of a substrate processing apparatus according to a second embodiment. [Figure 11] 10 is a flowchart showing an example of a substrate holding process according to a second embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0013] A substrate holding device and a substrate processing apparatus according to an embodiment of the present invention will be described below with reference to the drawings. In the following description, the term "substrate" refers to a substrate for an FPD (Flat Panel Display) used in a liquid crystal display device or an organic EL (Electroluminescence) display device, a semiconductor substrate, an optical disk substrate, a magnetic disk substrate, a magneto-optical disk substrate, a photomask substrate, a ceramic substrate, or a solar cell substrate. The substrate described below is a circular substrate, at least a portion of which is circular, and has a positioning notch formed in part of its outer periphery. The length of the notch in the circumferential direction of the substrate is, for example, 2.62 mm or more and 3.76 mm or less.

[0014] 1. First embodiment <1> Basic configuration of substrate processing equipment Fig. 1 is a schematic side view showing the basic configuration of a substrate processing apparatus according to a first embodiment. Fig. 2 is a schematic plan view of the substrate processing apparatus 1 of Fig. 1. In Fig. 2, some of the components shown in Fig. 1 (a control unit 900, a processing liquid supply device 70, and an imaging device 80, which will be described later) are not shown.

[0015] 1 and 2, the substrate processing apparatus 1 according to the first embodiment includes a rotation drive unit 10, a spin base 20, two fixed holders 30A and 30B, two movable holders 40A and 40B, two magnetic lifting devices 50A and 50B, a cup 60, a processing liquid supply device 70, an imaging device 80, and a control unit 900. Each of these components is housed in, for example, a chamber (not shown).

[0016] The rotation drive unit 10 is, for example, a motor, and is fixed to the bottom of the chamber. The rotation drive unit 10 has a rotation shaft 11 that extends upward. A central axis CA of the rotation shaft 11 extends in the vertical direction. A spin base 20 is connected to the upper end of the rotation shaft 11. The spin base 20 has a disk shape and is supported by the rotation shaft 11 so that it can rotate in a horizontal position.

[0017] As shown in FIG. 2, two fixed holders 30A and 30B and two movable holders 40A and 40B are attached to the peripheral edge of the spin base 20. The fixed holder 30A, the fixed holder 30B, the movable holder 40A, and the movable holder 40B are arranged clockwise along the outer periphery of the spin base 20 in this order in a plan view. In this substrate processing apparatus 1, the spin base 20, the two fixed holders 30A and 30B, and the two movable holders 40A and 40B are assembled together to form a so-called spin chuck. In the following description, the assembly of the spin base 20, the two fixed holders 30A and 30B, and the two movable holders 40A and 40B will be referred to as a spin chuck SC. In FIGS. 1 and 2, the substrate W held by the spin chuck SC is indicated by a two-dot chain line. Note that notches are not shown on the substrate W in FIGS. 1 and 2 and subsequent figures.

[0018] The two fixed holders 30A and 30B have the same configuration. In Fig. 1, an enlarged side view of the fixed holders 30A and 30B is shown in the bubble BL1. As shown in the bubble BL1, each fixed holder 30A and 30B is mainly composed of a support 31, a shaft 32, and a shaft fixing member 33.

[0019] Four through holes 21 extending in the vertical direction are provided in the attachment portions of the four holding portions (30A, 30B, 40A, 40B) of the spin base 20. Each through hole 21 has a circular shape in a plan view. The shaft portions 32 of the fixed holding portions 30A and 30B are rod-shaped members with a circular cross section and have an outer diameter slightly smaller than the inner diameter of the through holes 21. The shaft portions 32 are inserted into the through holes 21 so as to pass through the spin base 20.

[0020] On the upper surface of the spin base 20, a support 31 is attached and fixed to the upper end of the shaft 32. As shown in FIG. 2, the support 31 of each fixed holder 30A, 30B has a circular shape in plan view. As shown in speech bubble BL1 in FIG. 1, the support 31 has a flat inclined surface 31s that is slightly inclined with respect to the horizontal. The inclined surface 31s is configured to be able to support the outer peripheral edge and lower peripheral edge of the substrate W from below. The support 31 also has a pin 31p that protrudes further upward from the upper end portion of the inclined surface 31s. When the support 31 is attached to the shaft 32, the pin 31p is located at a position separated from the central axis 32c of the shaft 32. The pin 31p is formed in a cylindrical shape and has a diameter of, for example, 2.50 mm or more and 6.00 mm or less.

[0021] A shaft fixing member 33 is attached and fixed to the lower end of the shaft portion 32 on the underside of the spin base 20. The shaft fixing member 33 is further fixed to the underside of the spin base 20. In this state, the pin 31p of the support 31 is positioned further outward from the central axis 32c of the shaft portion 32 on the spin base 20.

[0022] The two movable holders 40A, 40B have the same configuration. In FIG. 1, an enlarged side view of movable holders 40A, 40B is shown in bubble BL2. As shown in bubble BL2, each movable holder 40A, 40B is mainly composed of a support 41, a shaft 42, a magnet connecting member 43, and a magnet 44. The shaft 42 of movable holders 40A, 40B is a rod-shaped member with a circular cross section, and is inserted into through-hole 21 so as to pass through spin base 20.

[0023] A support 41 is attached and fixed to the upper end of a shaft 42 on the upper surface of the spin base 20. The support 41 has the same shape as the support 31 of the fixed holders 30A and 30B. That is, the support 41 has a flat inclined surface 41s that is slightly inclined with respect to the horizontal plane. The inclined surface 41s is configured to be able to support the outer peripheral edge and lower peripheral edge of the substrate W from below. The support 41 also has a pin 41p that protrudes further upward from the upper end portion of the inclined surface 41s. When the support 41 is attached to the shaft 42, the pin 41p is located at a position separated from the central axis 42c of the shaft 42.

[0024] Here, a bearing BR is provided between the shaft portions 42 of the movable holding portions 40A, 40B and the inner circumferential surface of the through hole 21 of the spin base 20. The bearing BR supports the shaft portion 42 arranged in the through hole 21 so that it can rotate around the central axis 42c of the shaft portion 42 relative to the inner circumferential surface of the through hole 21. The bearing BR also supports the shaft portion 42 arranged in the through hole 21 so that it cannot move in the direction of the central axis 42c (up and down direction) relative to the inner circumferential surface of the through hole 21.

[0025] A magnet 44 is attached and fixed to the lower end of a shaft 42 on the lower surface of the spin base 20 via a magnet connecting member 43. The magnet 44 is held with its north pole and south pole aligned in a horizontal plane.

[0026] A plurality of components (a holding magnet 45 and magnet lifting devices 50A and 50B, which will be described later) are provided around the magnet 44 to apply a magnetic field to the magnet 44 from the outside and to adjust the direction of the magnetic field acting on the magnet 44. By adjusting the direction of the magnetic field acting on the magnet 44, the support 41 can be rotated around the central axis 42c of the shaft portion 42.

[0027] For example, the substrate W is placed on the inclined surfaces 31s, 41s of the four holders (30A, 30B, 40A, 40B). In this state, as shown in the upper part of balloons BL11, BL12 extending from the thick dashed-dotted frame in FIG. 2, the supports 41 of the movable holders 40A, 40B rotate counterclockwise in a plan view. In this case, the substrate W on the four supports 31, 41 is held by being sandwiched between the four pins 31p, 41p. This state of the movable holders 40A, 40B when the spin chuck SC holds the substrate W is called the holding state. In the holding state, the movable holders 40A, 40B abut against the outer peripheral edge of the substrate W to hold the substrate W.

[0028] Meanwhile, as shown in the lower part of balloons BL11 and BL12 in Fig. 2, for example, with the substrate W held by the spin chuck SC, the supports 41 of the movable holders 40A and 40B rotate clockwise in a plan view. In this case, two of the four pins 31p and 41p move away from the outer peripheral edge of the substrate W. This allows the substrate W released on the inclined surfaces 31s and 41s of the four supports 31 and 41 to be removed. The state of the movable holders 40A and 40B when the spin chuck SC releases the substrate W is called a released state.

[0029] As shown in FIG. 1 , the magnetic lifting devices 50A and 50B are fixed to the bottom of the chamber so as to correspond to the movable holders 40A and 40B, respectively. The magnetic lifting devices 50A and 50B support two lifting magnets 59 corresponding to the magnets 44 of the movable holders 40A and 40B, respectively, so that the magnets can be raised and lowered at predetermined planar positions. The two lifting magnets 59 are used to adjust the direction of the magnetic field acting on the magnets 44 of the movable holders 40A and 40B and switch the states of the movable holders 40A and 40B. In the following description, the function of the magnetic lifting devices 50A and 50B to switch the states of the movable holders 40A and 40B using the lifting magnets 59 is referred to as a switching function. Details of the magnetic lifting devices 50A and 50B and the switching function will be described later.

[0030] The cup 60 is disposed so as to surround the rotation drive unit 10 and the spin base 20 in a plan view. The cup 60 is disposed so as to be movable in the vertical direction between an upper cup position and a lower cup position by a cup lifting device 61 (FIG. 5) described later. The lower cup position is a height position (vertical position) at which the upper end of the cup 60 is located below the spin chuck SC. The upper cup position is a height position at which the upper end of the cup 60 is located above the substrate W held by the spin chuck SC.

[0031] When the substrate W is processed, a processing liquid is supplied from a processing liquid supply device 70, which will be described later, to the substrate W, which is held and rotated by the spin chuck SC. Therefore, the cup 60 is disposed at the upper cup position when the substrate W is processed. This allows the cup 60 to catch the processing liquid that splashes from the rotating substrate W. On the other hand, the cup 60 is disposed at the lower cup position when the substrate W is not being processed in the substrate processing apparatus 1.

[0032] The processing liquid supply device 70 includes a nozzle 71 and a processing liquid supply system 72. The processing liquid supply system 72 includes one or more fluid-related devices such as pipes, joints, valves, pumps, tanks, etc., and is connected to a processing liquid supply source. The processing liquid supply system 72 supplies the processing liquid from the processing liquid supply source to the nozzle 71.

[0033] The nozzle 71 is supported by a nozzle moving device 73 (FIG. 5) described later so as to be movable between a processing position above the spin chuck SC and a standby position to the side of the spin chuck SC within the chamber of the substrate processing apparatus 1. With the nozzle 71 positioned at the processing position, a processing liquid is supplied to the nozzle 71 from a processing liquid supply system 72. As a result, the processing liquid is discharged from the nozzle 71 onto the substrate W, and the substrate W is processed.

[0034] The imaging device 80 is, for example, a camera, and includes multiple lenses and a color CCD (charge-coupled device) sensor. The imaging device 80 captures an image of the entire substrate W held by the spin chuck SC from a position diagonally above the spin chuck SC. At this time, the imaging device 80 captures images of the pins 31p, 41p of the multiple holders (30A, 30B, 40A, 40B) in addition to the substrate W. The control unit 900 controls the operation of each unit of the substrate processing apparatus 1. The control unit 900 will be described in detail later.

[0035] <2> Magnetic lifting device 50A, 50B 3 is an external perspective view of the magnetic lifting devices 50A and 50B seen through the spin base 20 from a position above the fixed holder 30B in FIG. 2. In FIG. 3, a portion of the spin base 20 is indicated by a dashed line. The multiple holders (30A, 30B, 40A, 40B) are not shown.

[0036] 3, the magnetic lifting device 50A includes an air cylinder 51, a lifting shaft 52, a support plate 53, a driving device 54, and a lifting magnet 59. The air cylinder 51 is attached to the chamber via a bracket.

[0037] The lifting shaft 52 is provided to extend upward from a piston provided inside the air cylinder 51. A support plate 53 is attached to the upper end of the lifting shaft 52. The support plate 53 is a plate member processed into a predetermined shape, and extends in one direction in a horizontal plane from the upper end of the lifting shaft 52.

[0038] An elevator magnet 59 is provided at the tip of the support plate 53. As shown in Fig. 2, the elevator magnet 59 is held at a position spaced a predetermined distance from the outer peripheral edge of the spin base 20 toward the central axis CA in a plan view. The predetermined distance is slightly larger than the diameter of the support 41.

[0039] 3 includes, for example, a pump or an electro-pneumatic regulator, and drives the air cylinder 51. Specifically, the drive device 54 adjusts the pressure of the air supplied into the air cylinder 51. This causes the lifting shaft 52 to move up and down together with the piston in the air cylinder 51, and the height position of the lifting magnet 59 is adjusted between an upper magnet position and a lower magnet position. The lower magnet position is a position that is a certain distance below the magnet 44 of the movable holding unit 40A. The upper magnet position is at the same height as the magnet 44 of the movable holding unit 40A.

[0040] The magnetic lifting device 50B has basically the same configuration as the magnetic lifting device 50A, and is provided adjacent to the magnetic lifting device 50A. As shown in Fig. 2, the position where the lifting magnet 59 of the magnetic lifting device 50B is held is shifted by 90° in the circumferential direction of the spin base 20 with respect to the central axis CA in a plan view, relative to the position of the lifting magnet 59 of the magnetic lifting device 50A.

[0041] Magnetic lifting devices 50A and 50B can be operated independently, and therefore the height positions of lifting magnet 59 of magnetic lifting device 50A and lifting magnet 59 of magnetic lifting device 50B can be adjusted individually, as shown by the two hollow arrows in Figure 3.

[0042] Fig. 4 is a diagram for explaining the switching function of the magnetic lifting devices 50A and 50B in Fig. 3. Fig. 4 shows a schematic plan view of multiple components provided on the lower surface of the spin base 20, the magnetic lifting devices 50A and 50B, and the rotation drive unit 10, when viewed through the spin base 20. In this example, similar to the examples in Figs. 1 and 2, the rotational position (rotational angle) of the spin chuck SC is adjusted so that the movable holders 40A and 40B are located near the lifting magnets 59 of the magnetic lifting devices 50A and 50B, respectively, in plan view.

[0043] In Fig. 4, the outline of the spin base 20 is indicated by a dashed line. Also, the outline of the substrate W held by the spin chuck SC is indicated by a dashed line. Note that the cup 60 in Fig. 1 is not shown in Fig. 4.

[0044] 4, holding magnets 45 are attached to the underside of spin base 20 at positions near magnets 44 of each of movable holders 40A and 40B. Adjacent magnets 44 and holding magnets 45 are aligned in the circumferential direction of spin base 20.

[0045] 4, each holding magnet 45 is arranged so that its north pole and south pole are aligned in this order in a plan view along the outer circumferential edge of spin base 20, away from magnet 44. Furthermore, each lifting magnet 59 of magnetic lifting devices 50A and 50B is arranged so that its north pole and south pole are aligned in this order in a radial direction from the center of spin base 20 toward the outer circumferential edge, away from magnet 44.

[0046] As shown in the upper part of speech bubbles BL21 and BL22, it is assumed that the lifting magnet 59 of the magnetic lifting device 50A, 50B is positioned at the lower magnet position. In this case, the lifting magnet 59 is positioned a certain distance below the magnet 44 of the movable holder 40A, 40B. In other words, the lifting magnet 59 is spaced a certain distance from the magnet 44. Therefore, the magnetic field generated by the lifting magnet 59 does not easily act on the magnet 44 of the movable holder 40A, 40B. The magnetic field generated by the holding magnet 45 acts mainly on the magnet 44. As a result, the magnet 44 is held with its south pole facing the holding magnet 45. If the south pole of the magnet 44 does not face the holding magnet 45, a rotational force is generated in the magnet 44 to turn its south pole toward the holding magnet 45.

[0047] On the other hand, as shown in the lower part of speech bubbles BL21 and BL22, it is assumed that lifting magnets 59 of magnetic lifting devices 50A and 50B are positioned at the upper magnet position. In this case, lifting magnets 59 are positioned at the same height as magnets 44 of corresponding movable holders 40A and 40B. In other words, lifting magnets 59 are on the same plane as corresponding magnets 44 and holder magnets 45. Furthermore, lifting magnets 59 are close to magnets 44.

[0048] As a result, the magnetic field generated by the holding magnet 45 and the magnetic field generated by the lift magnet 59 act on the magnet 44 of each of the movable holding units 40A, 40B. Here, a magnet having a magnetic force sufficiently stronger than that of the holding magnet 45 is used as the lift magnet 59 in this embodiment. Therefore, the magnet 44 is affected by the magnetic field generated by the lift magnet 59 and is held with its N pole facing the lift magnet 59. If the N pole of the magnet 44 does not face the lift magnet 59, a rotational force is generated in the magnet 44 to turn its N pole toward the lift magnet 59.

[0049] In each movable holding portion 40A, 40B, the support 41 is attached to the shaft portion 42 so that the magnet 44 is in a holding state when the south pole thereof faces the holding magnet 45, and is in a released state when the north pole thereof faces the lifting magnet 59 located at the upper magnet position.

[0050] As described above, the magnetic lifting devices 50A, 50B can switch the movable holders 40A, 40B from the holding state to the release state by moving the lifting magnet 59 from the lower magnet position to the upper magnet position. Also, the magnetic lifting devices 50A, 50B can switch the movable holders 40A, 40B from the release state to the holding state by moving the lifting magnet 59 from the upper magnet position to the lower magnet position.

[0051] <3> Control system of substrate processing apparatus 1 The control system of the substrate processing apparatus 1 will be described together with the configuration of the control unit 900 in FIG. 1. FIG. 5 is a block diagram showing the configuration of the control system of the substrate processing apparatus 1 in FIG. 1. As shown in FIG. 5, the control unit 900 includes a CPU (Central Processing Unit) 901, a RAM (Random Access Memory) 902, a ROM (Read Only Memory) 903, and a storage device 904. The RAM 902 is used as a working area for the CPU 901. The ROM 903 stores a system program. The storage device 904 includes a storage medium such as a hard disk or semiconductor memory, and stores a liquid processing program. The liquid processing program in this example is a program for supplying a processing liquid to a substrate W.

[0052] The storage device 904 also stores a substrate holding program. The substrate holding program is a program for a substrate holding process for causing the spin chuck SC to properly hold the substrate W. The substrate holding process will be described in detail later.

[0053] Furthermore, the storage device 904 stores holding determination information for determining whether the substrate W is properly held by the spin chuck SC during a substrate holding process described later. The holding determination information may include, for example, image data obtained by imaging the substrate W with the imaging device 80 while the substrate W is properly held by the spin chuck SC.

[0054] 5 may be provided in a state stored on a recording medium such as CD-ROM 909 and installed in ROM 903 or storage device 904. Alternatively, the liquid processing program and substrate holding program may be distributed from a server external to substrate processing apparatus 1 via a communication network and installed in ROM 903 or storage device 904. CPU 901 executes either the liquid processing program or the substrate holding program to control the operation of each part of substrate processing apparatus 1.

[0055] The rotation drive unit 10 is provided with a rotary encoder 12 that detects the amount of rotation of a rotor (not shown) of the rotation drive unit 10 and outputs a signal indicating the amount of rotation. The control unit 900 controls the rotation drive unit 10 based on the signal output from the rotary encoder 12. This causes the spin chuck SC to rotate at a predetermined speed. Also, the rotation position (rotation angle) of the spin chuck SC is adjusted.

[0056] The control unit 900 also controls the nozzle moving device 73, which moves the nozzle 71 in FIG. 1 between a processing position and a standby position in the chamber. The control unit 900 also controls the processing liquid supply system 72, which supplies the processing liquid to the nozzle 71 in FIG. 1.

[0057] The control unit 900 also controls the cup lifting device 61. As a result, the cup 60 in FIG. 1 moves between the upper cup position and the lower cup position in accordance with the timing of the transfer of the substrate W to the spin chuck SC and the timing of the supply of the processing liquid to the substrate W.

[0058] The control unit 900 also controls the magnetic lifting devices 50A and 50B, thereby switching the states of the movable holders 40A and 40B of the spin chuck SC between a holding state and a release state. The control unit 900 also controls the imaging device 80, thereby causing the imaging device 80 to capture an image of the substrate W, for example, immediately after the substrate W is held by the spin chuck SC.

[0059] As shown in FIG. 5, the substrate processing apparatus 1 further includes an alarm device 500 and an operation unit 600. The alarm device 500 is an output device that outputs an alarm. The alarm device 500 may include a display device that displays an image of the abnormality, a warning light that notifies the user of the abnormality, or an audio output device that outputs audio of the abnormality. The control unit 900 controls the alarm device 500. As a result, when an abnormality occurs in the spin chuck SC, for example, an alarm is output from the alarm device 500.

[0060] The operation unit 600 includes a keyboard and a pointing device, and is configured to be operable by a user. The user can set various operating conditions of the substrate processing apparatus 1 by operating the operation unit 600.

[0061] <4> Substrate holding process In the following description, the rotational positions of the spin chuck SC when the movable holders 40A and 40B are positioned near the lifting magnets 59 of the magnetic lifting devices 50A and 50B in a plan view as shown in Figures 2 and 4 will be referred to as a reference position. Also, it is assumed that the control unit 900 has a built-in counter.

[0062] Fig. 6 is a flowchart showing an example of a substrate holding process according to the first embodiment. Fig. 7 and Fig. 8 are schematic plan views showing, in time series, the transition of states of the substrate W and the spin chuck SC when the substrate holding process of Fig. 6 is performed. In the schematic plan views of Fig. 7 and Fig. 8, only pins 31p, 41p of fixed holding parts 30A, 30B and movable holding parts 40A, 40B are shown in an exaggerated manner.

[0063] As described above, the substrate holding process is a process for causing the spin chuck SC to properly hold the substrate W. This process is performed, for example, by the CPU 901 of the control unit 900 executing a substrate holding program stored in the storage device 904 in response to the substrate W being placed on the spin chuck SC.

[0064] In the initial state, the rotational position of the spin chuck SC is adjusted to the reference position. The magnet lifting devices 50A and 50B hold the lifting magnet 59 at the upper magnet position. As a result, both of the movable holders 40A and 40B are in a released state. Furthermore, as shown in the upper part of FIG. 7, a substrate W is placed on the spin chuck SC. Specifically, the substrate W is supported by four supports 31 and 41. In the example shown in the upper part of FIG. 7, none of the pins 31p and 41p of the four holders (30A, 30B, 40A, and 40B) abuts against the outer peripheral edge of the substrate W.

[0065] When the substrate holding process is started, the control unit 900 controls the magnetic lifting devices 50A and 50B to switch the two movable holders 40A and 40B from the release state to the holding state (step S11). Specifically, the control unit 900 lowers the two lifting magnets 59 of the magnetic lifting devices 50A and 50B from the upper magnet positions to the lower magnet positions. This switches the two movable holders 40A and 40B from the release state to the holding state.

[0066] In this case, for example, as shown in the middle left of Figure 7, the substrate W is sandwiched between two pins 31p, 41p of the fixed holder 30A and the movable holder 40A, which face each other. Also, the substrate W is sandwiched between two pins 31p, 41p of the fixed holder 30B and the movable holder 40B, which face each other. In this way, when a total of four pins 31p, 41p abut against and hold the outer circumferential edge of the substrate W, the holding state of the substrate W is considered to be normal (four-point support).

[0067] However, when the two movable holders 40A, 40B are switched from the release state to the holding state as described above, if one of the two pins 41p fits into a notch in the substrate W, the timing at which the two pins 41p abut the substrate W will differ. In this case, when one of the pins 41p abuts the substrate W, the substrate W is sandwiched between the pin 41p and the pin 31p facing it, and then the other pin 41p fits into the notch in the substrate W. As a result, even if the other pin 41p pushes the substrate W toward the pin 31p facing it, the substrate W may not move. In this case, as shown in the middle right of FIG. 7 , the substrate W will be held by two pins 41p and one pin 31p (three-point support). Therefore, in the substrate holding process according to the first embodiment, when the above-described three-point support occurs, a process of retrying the holding operation of the substrate W is performed. Furthermore, a process is performed to determine whether the occurrence of the three-point support is due to an abnormality (such as a malfunction) of the substrate processing apparatus 1.

[0068] Specifically, after the process of step S11, the control unit 900 resets the value of the counter (step S12). Furthermore, the control unit 900 determines whether the substrate W is normally held on the spin chuck SC (step S13). In this embodiment, the process of step S13 is performed, for example, as follows.

[0069] First, the substrate W held on the spin chuck SC is imaged using the imaging device 80 of Fig. 1. As a result, image data showing images of the substrate W and the multiple holders (30A, 30B, 40A, 40B) is generated. Thereafter, the generated image data is compared with the holding determination information stored in the storage device 904, and a difference is detected. As described above, the holding determination information includes, for example, image data obtained by imaging the substrate W with the imaging device 80 while the substrate W is properly held by the spin chuck SC. As a result, based on the magnitude of the detected difference, it is determined whether the substrate W is properly held on the spin chuck SC.

[0070] The control unit 900 may make the above determination based on whether or not there is a gap between any of the plurality of pins 31p and the substrate W, based on image data obtained by imaging.

[0071] In step S13, if the substrate W is properly held on the spin chuck SC, the substrate holding process ends. On the other hand, if the substrate W is not properly held on the spin chuck SC, the control unit 900 determines whether the counter value is smaller than a predetermined specified value (step S14). Here, the specified value is a value set by the user using the operation unit 600 to determine whether an abnormality has occurred in the substrate processing apparatus 1. In this embodiment, the specified value may be "1," "2," or "3." Alternatively, the specified value may be a value equal to or greater than "4."

[0072] If the counter value is smaller than the specified value, the control unit 900 switches one of the two movable holders 40A, 40B, the movable holder 40A, from the holding state to the release state (step S15). In this case, as shown in the lower part of FIG. 7, the pin 41p of the movable holder 40A moves away from the outer peripheral edge of the substrate W. Therefore, no holding force is generated between the fixed holder 30A and the two pins 31p, 41p of the movable holder 40A. At this time, the substrate W is pressed toward the fixed holder 30B by the movable holder 40B in the holding state. As a result, the substrate W moves to a position where it abuts against the fixed holder 30B, as indicated by the thick dotted arrow in the lower part of FIG. 7, and is sandwiched between the fixed holder 30B and the two pins 31p, 41p of the movable holder 40B.

[0073] Next, the control unit 900 switches one of the movable holders 40A from the released state to the holding state (step S16). In this case, the pin 41p of the movable holder 40A abuts against the outer periphery of the substrate W, as shown in the upper part of FIG.

[0074] Next, the control unit 900 switches the other of the two movable holders 40A, 40B, the movable holder 40B, from the holding state to the release state (step S17). In this case, as shown in the middle of FIG. 8, the pin 41p of the movable holder 40B moves away from the outer circumferential edge of the substrate W. Therefore, no holding force is generated between the fixed holder 30B and the two pins 31p, 41p of the movable holder 40B. At this time, the substrate W is pressed toward the fixed holder 30A by the movable holder 40A in the holding state. As a result, the substrate W moves to a position where it abuts against the fixed holder 30A, as indicated by the thick dotted arrow in the middle of FIG. 8, and is sandwiched between the fixed holder 30A and the two pins 31p, 41p of the movable holder 40A.

[0075] Next, the control unit 900 switches the other movable holder 40B from the released state to the held state (step S18). In this case, as shown in the lower part of FIG. 8, the pin 41p of the movable holder 40B abuts against the outer circumferential edge of the substrate W. The control unit 900 also increments the counter value (step S19). Thereafter, the process proceeds to step S13.

[0076] In step S14, if the counter value is equal to or greater than the specified value, the control unit 900 controls the alarm device 500 to output an alarm indicating that there is an abnormality in the substrate processing apparatus 1, and stops the operation of the substrate processing apparatus 1 (step S21). Then, the substrate holding process ends.

[0077] <5> effect In the substrate processing apparatus 1, the magnet lifting devices 50A and 50B can be controlled simultaneously or individually with the rotational position of the spin chuck SC set to the reference position.

[0078] When the movable holders 40A and 40B are simultaneously switched from the release state to the holding state, the time required to hold the substrate W can be shortened compared to when the movable holders 40A and 40B are individually switched from the release state to the holding state.

[0079] On the other hand, when the movable holders 40A, 40B are individually switched from the released state to the holding state, the pin 41p of the movable holder 40A and the pin 41p of the movable holder 40B sequentially abut against the outer circumferential edge of the substrate W. When the movable holder 40B abuts against the substrate W while the movable holder 40A is not abutting against the substrate W, the positioning of the substrate W by the movable holder 40B is not affected by the abutment state between the movable holder 40A and the substrate W. Also, when the movable holder 40A abuts against the substrate W while the movable holder 40B is not abutting against the substrate W, the positioning of the substrate W by the movable holder 40A is not affected by the abutment state between the movable holder 40B and the substrate W. This improves the reliability of holding the substrate W by the multiple movable holders 40A, 40B.

[0080] According to the above-described substrate holding process, the movable holders 40A, 40B are simultaneously switched from the released state to the holding state, and then the movable holders 40A, 40B are individually controlled based on the holding state of the substrate W. Therefore, it is possible to improve the reliability of holding the substrate W while shortening the time required to hold the substrate W.

[0081] 2. Second embodiment The substrate processing apparatus according to the second embodiment will be described below in terms of differences from the substrate processing apparatus 1 according to the first embodiment. FIG. 9 is a schematic plan view of the substrate processing apparatus 1 according to the second embodiment. The schematic plan view of FIG. 9 corresponds to the schematic plan view of FIG. 2. Therefore, in FIG. 9 as well, some of the components of the substrate processing apparatus 1 according to the second embodiment (configurations corresponding to the control unit 900, processing liquid supply device 70, and imaging device 80 in FIG. 1) are omitted from illustration.

[0082] 9, in the substrate processing apparatus 1 according to this embodiment, the spin chuck SC has a configuration in which six movable holders 40A, 40B, 40C, 40D, 40E, and 40F are provided at equal intervals on the periphery of the spin base 20. Six magnetic lifting devices 50A, 50B, 50C, 50D, 50E, and 50F are provided below the spin base 20, corresponding to the six movable holders 40A, 40B, 40C, 40D, 40E, and 40F, respectively.

[0083] Each of the movable holders 40A to 40F according to the present embodiment has the same configuration as the movable holders 40A and 40B according to the first embodiment. Furthermore, the magnetic lifting devices 50A to 50F also basically have the same configuration as the magnetic lifting devices 50A and 50B according to the first embodiment. Therefore, each of the magnetic lifting devices 50A to 50F has a lifting magnet 59 for switching the state of the movable holders 40A to 40F.

[0084] FIG. 10 is a diagram showing a control system of the substrate processing apparatus 1 according to the second embodiment. The control unit 900 according to this embodiment is capable of individually controlling the magnetic lifting devices 50A-50F. That is, the control unit 900 can independently switch between the holding state and the release state for each of the plurality of movable holders 40A-40F. The substrate processing apparatus 1 according to this embodiment does not have the alarm device 500. In this embodiment as well, the storage device 904 stores a substrate holding program. The substrate holding process according to this embodiment will be described below.

[0085] 11 is a flowchart showing an example of a substrate holding process according to the second embodiment. The series of processes described below are performed, for example, by the CPU 901 of the control unit 900 executing a substrate holding program stored in the storage device 904 in response to the substrate W being placed on the spin chuck SC.

[0086] In this embodiment, the rotational position of the spin chuck SC when the movable holding parts 40A, 40B, 40C, 40D, 40E, and 40F are positioned near the lifting magnets 59 of the magnetic lifting devices 50A, 50B, 50C, 50D, 50E, and 50F, respectively, in a planar view is called the reference position.

[0087] In the initial state, the rotational position of the spin chuck SC is adjusted to the reference position. The magnet lifting devices 50A to 50F hold the lifting magnet 59 at the upper magnet position. As a result, the movable holders 40A to 40F are all in a released state. Furthermore, a substrate W is placed on the spin chuck SC.

[0088] When the substrate holding process is started, the control unit 900 controls the magnetic lifting devices 50A-50F to switch all of the movable holders 40A-40F from the release state to the holding state (step S31). Specifically, the control unit 900 lowers the six lifting magnets 59 of the magnetic lifting devices 50A-50F from the upper magnet positions to the lower magnet positions. This switches the six movable holders 40A-40F from the release state to the holding state.

[0089] During this operation, the pins 41p of the six movable holders 40A to 40F simultaneously move toward the central axis CA of the rotation drive unit 10. As a result, the substrate W on the spin chuck SC is simultaneously positioned (centered) by the six pins 41p so that the center of the substrate W is positioned on the central axis CA. However, depending on the initial position of the substrate W, if one of the six pins 41p fits into a notch in the substrate W, the substrate W may not be centered accurately.

[0090] Therefore, in this embodiment, if it is determined that accurate centering has not been performed, that is, if one of the six pins 41p fits into a notch in the substrate W, a process is performed to retry the holding operation of the substrate W.

[0091] Specifically, after the process of step S31, the control unit 900 determines whether or not one of the six pins 41p is fitted into a notch of the substrate W (step S32). In the present embodiment, the process of step S32 is performed, for example, as follows.

[0092] First, the substrate W held on the spin chuck SC is imaged by the imaging device 80 of Fig. 1, and image data showing images of the substrate W and the plurality of movable holding parts 40A-40F is generated. Then, based on the generated image data, it is determined whether one pin 41p of the six pins 41p is fitted into a notch of the substrate W.

[0093] In step S32, the substrate holding process ends if none of the six pins 41p is fitted into a notch in the substrate W. On the other hand, if one of the six pins 41p is fitted into a notch in the substrate W, the control unit 900 identifies the movable holder that is fitted into the notch based on the image data generated in the process of step S32 (step S33).

[0094] Next, the control unit 900 controls the magnetic lifting devices 50A-50F to switch all of the movable holders 40A-40F from the holding state to the release state (step S34).The control unit 900 also switches the movable holders that are not fitted into the notches of the substrate W from the release state to the holding state (step S35).

[0095] In this case, the substrate W is centered by five of the six pins 41p that are not affected by the notch of the substrate W. This improves the accuracy of centering the substrate W.

[0096] Next, the control unit 900 switches one movable holder that has been fitted into the notch from the release state to the holding state (step S36). As a result, the remaining one pin 41p fits into the notch of the substrate W that has been centered and held by the five pins 41p. This reinforces the holding state of the substrate W without moving the substrate W. Thereafter, the substrate holding process ends.

[0097] In the substrate processing apparatus 1 according to this embodiment, the magnetic lifting devices 50A-50F corresponding to the plurality of movable holders 40A-40F can also be individually controlled by the control unit 900. As a result, when the spin chuck SC holds the substrate W, the movable holders 40A-40F are simultaneously switched from a release state to a holding state, and then the movable holders 40A-40F are individually controlled based on the holding state of the substrate W. This makes it possible to shorten the time required to hold the substrate W and improve the reliability of the substrate W holding.

[0098] 3. Other embodiments (a) In the substrate holding process according to the first embodiment, first, the movable holders 40A, 40B are controlled together (control corresponding to step S11 in FIG. 6) to hold the substrate W. Then, depending on whether the substrate W is being held properly, the movable holders 40A, 40B are controlled individually (control corresponding to steps S12 to S19, S21 in FIG. 6) to hold the substrate W. However, the present invention is not limited to the above example.

[0099] If the processing content of the substrate W does not require appropriate holding by the four holders (30A, 30B, 40A, 40B), the holding operation of the substrate W by individually controlling the movable holders 40A, 40B does not have to be performed. In other words, the processing of steps S12 to S19 and S21 in Fig. 6 does not have to be performed.

[0100] On the other hand, when the processing content of the substrate W requires appropriate holding by the four holders (30A, 30B, 40A, 40B), the holding operation of the substrate W under common control of the movable holders 40A and 40B does not have to be performed. In other words, the processing of step S11 in FIG. 6 does not have to be performed.

[0101] Therefore, the control unit 900 may perform only one of the common control and the individual control of the movable holders 40A, 40B (selection of control) depending on the processing content of the substrate W. Furthermore, the control unit 900 may select and perform either the common control or the individual control of the movable holders 40A, 40B based on a command from the user given from the operation unit 600.

[0102] (b) In the substrate holding process according to the second embodiment, when it is not necessary to center the substrate W with high accuracy, the holding operation of the substrate W by the individual control of the movable holders 40A to 40F (control corresponding to steps S32 to S36 in FIG. 11) does not have to be performed. On the other hand, when it is necessary to center the substrate W with high accuracy, it is not necessary to perform the holding operation of the substrate W by the common control of the movable holders 40A to 40F (control corresponding to step S31 in FIG. 11).

[0103] Therefore, the control unit 900 may perform only one of the common control and the individual control of the movable holders 40A to 40F (selection of control) depending on the processing content of the substrate W. Furthermore, the control unit 900 may select and perform either the common control or the individual control of the movable holders 40A to 40B based on a command from the user given from the operation unit 600.

[0104] (c) In the substrate processing apparatus 1 according to the first embodiment, the spin chuck SC has two fixed holders 30A, 30B and two movable holders 40A, 40B provided on the periphery of the spin base 20, but the present invention is not limited to this. All of the holders provided on the spin chuck SC may be composed of movable holders.

[0105] In this case, by maintaining two of the four movable holders in a holding state during the substrate holding process, the same process as in the example of FIG. 6 can be performed.

[0106] (d) In the substrate processing apparatus 1 according to the first embodiment, the spin chuck SC has a configuration in which four holding portions (30A, 30B, 40A, 40B) are provided on the periphery of the spin base 20, but the present invention is not limited to this.

[0107] The spin chuck SC according to the first embodiment may have a configuration in which six holders are arranged at equal intervals around the periphery of the spin base 20. In this case, the six holders may be configured such that, for example, two opposing holders are composed of a fixed holder and a movable holder. In this way, by individually controlling the three movable holders, the substrate W can be clamped between each pair of opposing holders.

[0108] Alternatively, the spin chuck SC according to the first embodiment may have a configuration in which eight holders are arranged at equal intervals around the periphery of the spin base 20. In this case, the eight holders may be configured such that, for example, two opposing holders are composed of a fixed holder and a movable holder. In this way, by individually controlling the four movable holders, the substrate W can be clamped between each pair of opposing holders.

[0109] (e) In the substrate processing apparatus 1 according to the second embodiment, the spin chuck SC has a configuration in which six holding portions (40A to 40F) are provided on the periphery of the spin base 20, but the present invention is not limited to this.

[0110] The spin chuck SC according to the second embodiment may have a configuration in which four holding parts are arranged at equal intervals on the periphery of the spin base 20. In this case, the substrate W is centered by the four holding parts.

[0111] Alternatively, the spin chuck SC according to the second embodiment may have a configuration in which eight holding parts are arranged at equal intervals on the periphery of the spin base 20. In this case, the substrate W is centered by the eight holding parts.

[0112] (f) In the substrate processing apparatus 1 according to the second embodiment, two opposing holders (40A-40F) are placed in a holding state and the other four are placed in a released state. The two groups of holders may be sequentially changed. For example, a first group consisting of corresponding holders 40A and 40D, a second group consisting of holders 40B and 40E, and a third group consisting of holders 40C and 40F will be described. In a first stage, two members of the first group are placed in a holding state, and four members of the second and third groups are placed in a released state. In a second stage after the first stage, two members of the second group are placed in a holding state, and four members of the first and third groups are placed in a released state. In a third stage after the second stage, two members of the third group are placed in a holding state, and four members of the first and second groups are placed in a released state. In a fourth stage after the third stage, all six holders (40A-40F) are placed in a holding state. In this case, the substrate W is centered by the six holders (40A to 40F).

[0113] (g) In the above embodiment, an example has been described in which a notch is formed in the substrate W to be processed by the substrate processing apparatus 1, but the present invention is not limited to this. Instead of the above-described notch, an orientation flat may be formed on the outer peripheral edge of the substrate W as a cutout for positioning. Even in this case, the above-described substrate holding process can be effectively used to prevent poor holding of the substrate W caused by one of the multiple holding parts abutting against the orientation flat.

[0114] (h) Although the substrate processing apparatus 1 according to the first and second embodiments is configured to supply a processing liquid to the upper surface of the substrate W held by the spin chuck SC, the present invention is not limited to this. The spin chuck SC may be configured to hold multiple portions of the outer peripheral edge of the substrate W from above the substrate W. In this case, the processing liquid supply device 70 may be configured to discharge the processing liquid from below the substrate W toward the underside of the substrate W.

[0115] (i) In the substrate processing apparatus 1 according to the first and second embodiments, the processing liquid supply device 70 is provided as a configuration for performing processing on the substrate W held by the spin chuck SC, but the present invention is not limited to this. The configuration for performing processing on the substrate W held by the spin chuck SC may include a device for brush cleaning the substrate W or a device for spraying gas onto the substrate W.

[0116] (j) In the substrate processing apparatus 1 according to the first and second embodiments, the support 31 is provided as part of each of the fixed holders 30A, 30B, and the support 41 is provided as part of each of the movable holders 40A, 40B. However, the present invention is not limited to this. A separate support may be provided that supports the substrate W by abutting the substrate W from below against the spin chuck SC of the substrate processing apparatus 1. In this case, the support corresponds to the support of the present invention.

[0117] 4. Correspondence between each part of the embodiment and each element of the claims The following describes examples of correspondence between the elements of the claims and the elements of the embodiments. Various other elements having the configurations or functions described in the claims may also be used as the elements of the claims.

[0118] In the above embodiment, the configuration of the substrate processing apparatus 1 including at least the rotation drive unit 10, the magnetic lifting devices 50A, 50B, 50C, 50D, 50E, 50F, and the spin chuck SC is an example of a substrate holding device, the supports 31, 41 are examples of supports, the spin base 20 is an example of a rotating member, the rotation drive unit 10 is an example of a rotation drive unit, and the movable holding units 40A, 40B, 40C, 40D, 40E, 40F are examples of multiple movable holding units.

[0119] Furthermore, magnetic lifting devices 50A, 50B, 50C, 50D, 50E, and 50F are examples of state switching units, control unit 900 is an example of a control unit, control based on the processing of step S11 in FIG. 6 and step S31 in FIG. 11 is an example of a first control, and control based on the processing of steps S15 to S18 in FIG. 6 and steps S35 and S36 in FIG. 11 is an example of a second control.

[0120] Furthermore, the imaging device 80 and the control unit 900 are examples of a state determination unit, the fixed holding units 30A and 30B are examples of multiple fixed holding units, the alarm device 500 is an example of an alarm output unit, the processing liquid supply device 70 is an example of a processing unit, and the substrate processing device 1 is an example of a substrate processing device.

[0121] 5. Summary of the embodiment (Item 1) The substrate holding device according to item 1 comprises: A substrate holding device for holding a substrate, a support for supporting a substrate; a rotating member that is rotatable around an axis that extends in the vertical direction; a rotation drive unit that rotates the rotation member around the axis; a plurality of movable holders provided on a peripheral portion of the rotating member that are switchable between a holding state in which the holder holds the substrate by contacting the outer peripheral edge of the substrate and a release state in which the holder moves away from the outer peripheral edge of the substrate; a state switching unit that switches the plurality of movable holding units between the holding state and the release state; a control unit that selectively performs first control or second control on the state switching unit, the first control is a control for simultaneously switching the plurality of movable holding parts from the release state to the holding state, The second control is a control that switches some of the plurality of movable holding parts from the released state to the held state and switches other of the plurality of movable holding parts from the released state to the held state at different times.

[0122] In this substrate holding device, a substrate is held on the rotating member by a plurality of movable holders provided on the rotating member being in a holding state. In this state, the rotating member is rotated around an axis extending in the vertical direction by a rotation drive unit. This allows various processes to be performed on one side of the rotating substrate. Furthermore, when the rotation of the rotating member is stopped and the plurality of movable holders are in a released state, the substrate on the rotating member can be removed from the substrate holding device.

[0123] According to the above configuration, the control unit can selectively perform the first control or the second control of the state switching unit. According to the first control, when holding a substrate to be handed over to the substrate holding device, the multiple movable holders are switched from the release state to the holding state at once. This reduces the time required to hold the substrate.

[0124] On the other hand, according to the second control, some movable holders and other movable holders sequentially abut against the outer peripheral edge of the substrate. In this case, when some movable holders abut against the substrate while other movable holders are not abutting against the substrate, the positioning of the substrate by some movable holders is less affected by the abutment state between the other movable holders and the substrate. Also, when some movable holders abut against the substrate while other movable holders are not abutting against the substrate, the positioning of the substrate by other movable holders is less affected by the abutment state between the some movable holders and the substrate. This improves the reliability of holding the substrate by multiple movable holders.

[0125] Therefore, when the processing content of the substrate does not require proper holding of the substrate, the first control can be adopted to shorten the time required to hold the substrate. On the other hand, when the processing content of the substrate requires proper holding of the substrate, the second control can be adopted to improve the reliability of substrate holding. As a result, it is possible to hold the substrate appropriately according to the processing content of the substrate.

[0126] (Item 2) In the substrate holding device according to item 1, the substrate holding device, a state determination unit that determines whether the substrate held by the plurality of movable holders is in a predetermined first state or a predetermined second state when the plurality of movable holders are in the holding state; The control unit maintaining the plurality of movable holders in the holding state when the substrate is in the first state; When the substrate is in the second state, the second control may be performed after at least some of the plurality of movable holders are switched from the holding state to the release state.

[0127] In this case, when the plurality of movable holders are in the holding state, the second control is performed by either maintaining the plurality of movable holders in the holding state or switching some of the plurality of movable holders to the released state depending on the state of the substrate. As a result, when the substrate is in the first state, the time required to hold the substrate can be shortened. Furthermore, when the substrate is in the second state, the second control is performed, thereby improving the reliability of substrate holding.

[0128] (Item 3) In the substrate holding device according to item 2, the substrate holding device, a plurality of fixed holding parts provided on the peripheral edge of the rotating member and configured to restrict the substrate held by the plurality of movable holding parts in the holding state from moving outward from the rotating member; the first state is a state in which the outer peripheral edge of the substrate is in contact with the plurality of fixed holders, The second state may be a state in which the outer peripheral edge of the substrate is separated from any of the plurality of fixed holders.

[0129] In this case, the substrate held by the substrate holding device is positioned between multiple fixed holders and multiple movable holders. In the first state, the outer peripheral edge of the substrate is in contact with the multiple fixed holders. Therefore, the substrate is properly held by the multiple fixed holders and the multiple movable holders. On the other hand, in the second state, the outer peripheral edge of the substrate is separated from at least one fixed holder. Therefore, the substrate is not properly held. Therefore, the second control is performed. This improves the reliability of substrate holding in the substrate holding device.

[0130] (Item 4) In the substrate holding device according to item 3, each fixed holding portion is disposed to face one of the plurality of movable holding portions across the center portion of the rotary member; When in the holding state, each movable holding part may press the substrate toward a fixed holding part disposed opposite the movable holding part.

[0131] In this case, the substrate pressed by each movable holder abuts on the fixed holder opposite the movable holder. In this state, movement of the substrate from the movable holder to the fixed holder opposite the movable holder is restricted. This improves the accuracy of the position at which the substrate is held on the rotating member.

[0132] (Item 5) In the substrate holding device according to any one of items 2 to 4, the first state is a state in which the substrate is at a predetermined position relative to the rotating member; The second state may be a state in which the substrate is not at a predetermined position relative to the rotating member.

[0133] In this case, whether to maintain the held state of the substrate or to perform the second control is selected depending on the position of the substrate relative to the rotating member. Therefore, by setting the position of the substrate relative to the rotating member when the substrate is properly held by the substrate holding device to the predetermined position, the reliability of the substrate holding by the substrate holding device is improved.

[0134] (Item 6) In the substrate holding device according to any one of Items 2 to 5, the substrate holding device, further comprising an alarm output unit that outputs an alarm; The control unit may cause the alarm output unit to output an alarm when the state determination unit determines that the substrate is in the second state a predetermined number of times in succession.

[0135] In this case, the user can easily recognize that there is an abnormality in the operation of the substrate holding device based on the alarm output from the alarm output unit.

[0136] (Item 7) In the substrate holding device according to any one of items 1 to 6, The control unit may perform the first control when the plurality of movable holders are in the released state and the substrate is disposed between the plurality of movable holders.

[0137] In this case, when the substrate is transferred to the substrate holding device, the substrate is held by the plurality of movable holding parts in a short time.

[0138] (Item 8) The substrate processing apparatus according to item 8 is A substrate holding device according to any one of items 1 to 7 that holds a substrate; a processing section for performing a predetermined process on the substrate held and rotated by the substrate holding device;

[0139] The substrate processing apparatus includes the substrate holding device described above. This allows an appropriate substrate holding method to be selected depending on the processing content of the substrate. Therefore, the first control shortens the time required to hold the substrate, thereby improving the throughput of substrate processing in the substrate processing apparatus. Furthermore, the second control allows the substrate holding device to maintain high reliability during substrate processing. This prevents the substrate from unintentionally coming off the substrate holding device during substrate processing.

[0140] (Item 9) The substrate holding device according to item 9 is A substrate holding device for holding a substrate, a support for supporting a substrate; a rotating member that is rotatable around an axis that extends in the vertical direction; a rotation drive unit that rotates the rotation member around the axis; a plurality of movable holders provided on a peripheral portion of the rotating member that are switchable between a holding state in which the holder holds the substrate by contacting the outer peripheral edge of the substrate and a release state in which the holder moves away from the outer peripheral edge of the substrate; a state switching unit that switches the plurality of movable holding units between the holding state and the release state; a control unit that controls the state switching unit, While the substrate is supported by the support body, the control unit switches some of the plurality of movable holding units from the released state to the held state and switches other of the plurality of movable holding units from the released state to the held state at different times.

[0141] According to the above configuration, some of the movable holders and the other movable holders sequentially abut against the outer peripheral edge of the substrate. In this case, when some of the movable holders abut against the substrate while the other movable holders are not abutting against the substrate, the positioning of the substrate by some of the movable holders is less affected by the abutment state between the other movable holders and the substrate. Also, when some of the movable holders abut against the substrate while the other movable holders are not abutting against the substrate, the positioning of the substrate by the other movable holders is less affected by the abutment state between the some of the movable holders and the substrate. This improves the reliability of holding the substrate by the multiple movable holders. [Explanation of symbols]

[0142] 1...substrate processing apparatus, 10...rotation drive unit, 11...rotation shaft, 12...rotary encoder, 20...spin base, 21...through hole, 30A, 30B...fixed holding unit, 31, 41...support, 31p, 41p...pin, 31s, 41s...inclined surface, 32, 42...shaft portion, 32c, 42c...central shaft, 33...shaft fixing member, 40A, 40B, 40C, 40D, 40E, 40F...movable holding unit, 43...magnet connecting member, 44...magnet, 45...holding magnet, 50A, 50B, 50C, 50D, 50E, 50F...machine Magnet lifting device, 51...air cylinder, 52...lifting shaft, 53...support plate, 54...drive device, 59...lifting magnet, 60...cup, 61...cup lifting device, 70...processing liquid supply device, 71...nozzle, 72...processing liquid supply system, 73...nozzle moving device, 80...imaging device, 500...alarm device, 600...operation unit, 900...control unit, 901...CPU, 902...RAM, 903...ROM, 904...storage device, 909...CD-ROM, BR...bearing, CA...center axis, SC...spin chuck, W...substrate

Claims

1. A substrate holding device for holding a substrate, a support for supporting a substrate; a rotating member that is rotatable around an axis that extends in the vertical direction; a rotation drive unit that rotates the rotation member around the axis; a plurality of movable holders provided on a peripheral portion of the rotating member that are switchable between a holding state in which the holder holds the substrate by contacting the outer peripheral edge of the substrate and a release state in which the holder moves away from the outer peripheral edge of the substrate; a state switching unit that switches the plurality of movable holding units between the holding state and the release state; a control unit that selectively performs first control or second control on the state switching unit, the first control is a control for simultaneously switching the plurality of movable holding units from the release state to the holding state, The second control is a control for switching some of the plurality of movable holding parts from the released state to the holding state and switching other of the plurality of movable holding parts from the released state to the holding state at different times.

2. a state determination unit that determines whether the substrate held by the plurality of movable holders is in a predetermined first state or a predetermined second state when the plurality of movable holders are in the holding state; The control unit maintaining the plurality of movable holders in the holding state when the substrate is in the first state; The substrate holding device according to claim 1 , wherein, when the substrate is in the second state, the second control is performed after at least some of the plurality of movable holders are switched from the holding state to the release state.

3. a plurality of fixed holding parts provided on the peripheral edge of the rotating member and configured to restrict the substrate held by the plurality of movable holding parts in the holding state from moving outward from the rotating member; the first state is a state in which an outer peripheral edge of the substrate is in contact with the plurality of fixed holders, 3. The substrate holding device according to claim 2, wherein the second state is a state in which an outer peripheral edge of the substrate is spaced apart from any one of the plurality of fixed holders.

4. each fixed holding portion is disposed to face one of the plurality of movable holding portions across the center portion of the rotary member; 4. The substrate holding device according to claim 3, wherein each movable holder, when in the holding state, presses the substrate toward a fixed holder disposed opposite the movable holder.

5. the first state is a state in which the substrate is at a predetermined position relative to the rotating member; 5. The substrate holding device according to claim 2, wherein the second state is a state in which the substrate is not at a predetermined position relative to the rotating member.

6. further comprising an alarm output unit that outputs an alarm; A substrate holding device as described in any one of claims 2 to 4, wherein the control unit causes the alarm output unit to output an alarm when the state determination unit determines that the substrate is in the second state a predetermined number of times in succession.

7. A substrate holding device described in any one of claims 1 to 4, wherein the control unit performs the first control when the multiple movable holding parts are in the released state and the substrate is positioned between the multiple movable holding parts.

8. a substrate holding device according to any one of claims 1 to 4 for holding a substrate; a processing section for performing a predetermined process on the substrate held and rotated by the substrate holding device.

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