IC module, and inlet, non-contact IC card, and RFID tag equipped with the IC module

Abstract

To provide an IC module, in which a bump formed on an IC chip and an antenna are bonded, so as to more reliably prevent the antenna from being separated from the IC chip due to external force applied to the IC chip and the antenna.SOLUTION: The present invention relates to an IC module including an IC chip 2 having a pair of bumps 16, 16 formed on one surface 15, and an antenna 3 for wireless communication formed from a single antenna wire and joined to each bump 16. The antenna 3 includes a coil portion 7 in which the antenna wire is wound in a spiral shape, and a pair of lead portions 8, 8 which are the start and end of the antenna wire and are led out in a same direction toward an inside of an area surrounded by the coil portion 7. Each lead portion 8 is disposed along an upper surface 15 of the IC chip 2 so as to pass over the bump 16, and the lead portion 8 that overlaps the bump 16 is bonded to the bump 16. The lead portion 8 is covered with a connection body 19 and fixed to the upper surface 15 of the IC chip 2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a contactless communication IC module having an IC chip and an antenna for wireless communication joined to the IC chip, as well as an inlet, a contactless IC card, and an RFID tag that include this IC module. [Background technology]

[0002] An example of an application of this type of IC module is a contactless IC card. A known method for manufacturing such a contactless IC card involves forming an IC module, then forming an inlet containing the IC module, and then disposing various sheets on the top and bottom surfaces of the inlet to obtain a contactless IC card. A known example of an inlet is Patent Document 1 by the present applicant, in which nonwoven fabric sheets are disposed on the top and bottom surfaces of an IC module (module body) including an IC chip and an antenna disposed on a chip base, and a protective layer is formed on the covering portion of the IC chip to form an inlet.

[0003] Specifically, each lead (each connection terminal) of the antenna is welded to a bump formed on the IC chip, electrically connecting the IC chip and the antenna. The IC chip and antenna are then integrated into an IC module, which is then sandwiched between a pair of upper and lower nonwoven fabric sheets. A protective layer covering the IC chip is then formed on the chip base. The protective layer is formed by welding the two nonwoven fabric sheets together, then impregnating the chip-covering portion of the nonwoven fabric sheet with a liquid UV-curable resin, which is then cured. This results in an IC module in which the IC chip is covered with a protective layer made of nonwoven fabric and UV-curable resin. The UV-curable resin used to form the protective layer is a material with a Shore hardness of 20 or more and 90 or less after curing. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2011-159049 Summary of the Invention [Problem to be solved by the invention]

[0005] Providing a protective layer on an IC chip as in Patent Document 1 makes it possible for the protective layer to disperse and reduce impacts on the IC chip, thereby improving the IC module's resistance to external stresses, such as impact resistance. However, with the inlet of Patent Document 1, if an external force is applied to the IC module before the protective layer is formed, that is, if the nonwoven fabric sheets are twisted and an external force is applied to the IC module during the process of sandwiching the IC module between a pair of nonwoven fabric sheets, the process of welding the pair of nonwoven fabric sheets sandwiching the IC module, and the process of applying and curing a UV-curable resin, the joints (welded parts) between the bumps and leads may break, causing the antenna to separate from the IC chip.

[0006] In addition, in recent years, the external dimensions of IC chips have become smaller, and as a result, the bumps formed on the IC chips have become smaller, and the bondable area of ​​the bumps has also become smaller. More specifically, the external dimensions of IC chips in recent years have been reduced to approximately 1mm square to 4mm square in planar size. As the external dimensions of the bumps formed on such miniaturized IC chips become even smaller, it becomes increasingly difficult to ensure the bonding strength between the bumps and the antenna, and fractures at the bonding points between the bumps and the lead portions during the inlet formation process become more likely.

[0007] The present invention aims to more reliably prevent the antenna from separating from the IC chip due to external forces applied to the IC chip or antenna in an IC module in which bumps formed on the IC chip are bonded to the antenna. An object of the present invention is to provide an inlet, a contactless IC card, and an RFID tag that are resistant to damage due to external stress and have excellent reliability. [Means for solving the problem]

[0008] The present invention relates to an IC module including an IC chip 2 having a pair of bumps 16 formed on one surface 15, and a wireless communication antenna 3 formed of a single antenna wire and joined to each bump 16. The antenna 3 has a coil portion 7 in which the antenna wire is spirally wound, and a pair of lead portions 8, 8 which are the start and end of the antenna wire and extend in the same direction toward the inside of the coil portion 7. Each lead portion 8 is disposed along one surface 15 of the IC chip 2 so as to pass over the bump 16, and the lead portion 8 that overlaps the bump 16 is joined to the bump 16. The lead portions 8 are covered with a connector 19 and fixed to one surface 15 of the IC chip 2.

[0009] When viewed in a plane, the lead portion 8 arranged between the edge E1 of the IC chip 2 located on the base end side of the lead portion 8 and the side T1 of the bump 16 facing the edge E1 of the IC chip 2 is defined as the base end lead L1, and the base end lead L1 is covered with a connecting body 19 and fixed to the IC chip 2.

[0010] When viewed in a plane, the lead portion 8 arranged between the edge E2 of the IC chip 2 located on the leading tip side of the lead portion 8 and the side T2 of the bump 16 facing the edge E2 of the IC chip 2 is defined as the tip side lead L2, and the tip side lead L2 is covered with the connecting body 19 and fixed to the IC chip 2.

[0011] When the lead portion 8 disposed on the bump 16 is defined as an overlapping lead L3 in plan view, the overlapping lead L3 is covered with a connecting body 19 and fixed to the IC chip 2.

[0012] The IC chip 2 is formed in a rectangular shape in a plan view, with an edge E1 located on the base end side of the lead portion 8 and an edge E2 located on the tip end side of the lead portion 8. A pair of bumps 16, 16 are arranged side by side on the left and right at positions biased from the center C of the top surface 15 of the IC chip 2 toward the edge E2 located on the tip end side of the lead portion 8.

[0013] The connector 19 is formed by solidifying a liquid resin 20 .

[0014] The inlet of the present invention includes any one of the IC modules 1 described above and a carrier sheet 4 that holds the IC module 1.

[0015] The contactless IC card of the present invention includes any one of the IC modules 1 described above.

[0016] The RFID tag of the present invention includes any one of the IC modules 1 described above. [Effects of the Invention]

[0017] When the lead portions 8 are covered with the connector 19 and fixed to one surface 15 of the IC chip 2, as in the IC module of the present invention, even if an external force is applied to the IC module 1 in the process of forming the inlet 5, the connector 19 prevents the lead portions 8 from being displaced relative to the IC chip 2, thereby preventing breakage of the joints between the bumps 16 and the lead portions 8. As described above, the IC module of the present invention can reliably prevent the antenna 3 from being separated from the IC chip 2 due to an external force applied to the IC chip 2 or the antenna 3. [Brief explanation of the drawings]

[0018] [Figure 1] 1 is a plan view showing a main part of an IC module according to a first embodiment of the present invention. [Figure 2] FIG. 2 is a plan view of an IC module held on a carrier sheet. [Figure 3] FIG. 2 is a cross-sectional view taken along line AA in FIG. [Figure 4] FIG. 2 is a cross-sectional view taken along line BB in FIG. [Figure 5] 10A and 10B are diagrams for explaining a method of forming a connector. [Figure 6] FIG. 1 is an exploded perspective view of a contactless IC card equipped with an IC module. [Figure 7] FIG. 1 is a plan view of an RFID tag equipped with an IC module. [Figure 8] FIG. 10 is a plan view showing a main part of an IC module according to a second embodiment of the present invention. [Figure 9] FIG. 10 is a plan view showing a main part of an IC module according to a third embodiment of the present invention. [Figure 10] FIG. 10 is a plan view showing a main part of an IC module according to a fourth embodiment of the present invention. [Figure 11] FIG. 10 is a plan view showing a main part of an IC module according to a fifth embodiment of the present invention. [Figure 12] FIG. 10 is a plan view showing a main part of an IC module according to a sixth embodiment of the present invention. [Figure 13] FIG. 13 is a plan view showing a main part of an IC module according to a seventh embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0019] (First Embodiment) FIGS. 1 to 6 show a first embodiment of an IC module according to the present invention. In this embodiment, the terms "front, back, left, right, top, bottom" refer to the crossed arrows shown in FIGS. 1 and 5 and the symbols near each arrow. The up-down direction corresponds to the thickness direction of the IC module, and the dimensions such as thickness in each figure are shown schematically and not as actual dimensions. In FIG. 2, IC module 1 comprises an IC chip 2 on which information is recorded, an antenna 3 for wireless communication joined to IC chip 2, and other components. After IC module 1 is formed, it is processed into inlet 5, in which IC module 1 is sandwiched and held between a pair of support sheets 4, each made of an upper and lower nonwoven fabric sheet, to facilitate handling and transport of module 1.

[0020] Antenna 3 is formed from a single copper wire with an insulating coating on its surface, and is a loop coil antenna having coil portion 7 wound in a square spiral shape and a pair of lead portions 8, 8 extending from coil portion 7. Coil portion 7 is wound so as to form a straight portion extending forward and backward and a straight portion extending left and right on the same horizontal plane extending in the front-to-back and left-to-right directions, and the pair of lead portions 8, 8 are extended parallel to each other toward the front inside the coil portion 7.

[0021] 1 and 5, the IC chip 2 has front and rear edges 11 and 12 and left and right edges 13 and 14, and is formed in a regular quadrangle (rectangle) in plan view. A pair of bumps 16, 16 consisting of electrode terminals to which the antenna 3 is welded (joined) are formed on the top surface (one surface) 15 (pad) of the IC chip 2. Each bump 16 is formed in a rectangular shape and is arranged side by side at a position biased toward the front edge 11 from the center C of the top surface 15 of the IC chip 2. Specifically, each bump 16 is formed near the corner where the front edge 11 and the left edge 13 intersect, and near the corner where the front edge 11 and the right edge 14 intersect.

[0022] The antenna 3 is disposed relative to the IC chip 2 so that the base end of the lead portion 8 crosses the rear edge portion 12 of the IC chip 2 and the tip end of the lead portion 8 crosses the front edge portion 11 of the IC chip 2 from the joining position of the two (IC chip 2, antenna 3). Each lead portion 8 is disposed along the upper surface 15 of the IC chip 2 so as to pass over the bumps 16, and the lead portion 8 that overlaps the bump 16 is welded to the bump 16. This welding forms an IC module 1 in which the IC chip 2 and the antenna 3 are electrically connected. The tip portion of the antenna 3 protrudes forward of the IC chip 2, and it is preferable to make the length of the protruding lead portion 8 as short as possible.

[0023] Here, in a plan view, the lead portion 8 disposed between the edge E1 of the IC chip 2 located on the derivation base end side of the lead portion 8 and the side T1 of the bump 16 facing the edge E1 of the IC chip 2 is defined as the base end lead L1, the lead portion 8 disposed between the edge E2 of the IC chip 2 located on the derivation tip end side of the lead portion 8 and the side T2 of the bump 16 facing the edge E2 of the IC chip 2 is defined as the tip end lead L2, and the lead portion 8 disposed on the bump 16 is defined as the overlapping lead L3. The edge E1 of the IC chip 2 located on the derivation base end side of the lead portion 8 corresponds to the rear edge 12 of the IC chip 2, and the edge E2 of the IC chip 2 located on the derivation tip side of the lead portion 8 corresponds to the front edge 11 of the IC chip 2. Furthermore, the side T1 of the bump 16 facing the edge E1 (rear edge 12) of the IC chip 2 corresponds to the rear edge of the bump 16, and the side T2 of the bump 16 facing the edge E2 (front edge 11) of the IC chip 2 corresponds to the front edge of the bump 16. In this embodiment, the bump 16 is disposed at a position biased toward the front edge 11 from the center C of the top surface 15 of the IC chip 2, so that the base-side lead L1 is configured to be longer than the tip-side lead L2.

[0024] A connector 19 is formed on the top surface of the IC chip 2. This connector 19 is formed by solidifying liquid resin 20, and covers the lead portions 8 to fix them to the IC chip 2. As described above, the IC chip 2 and the antenna 3 are integrated by welding the lead portions 8 to the bumps 16 and by fixing the lead portions 8 to the IC chip 2 by the connector 19, thereby forming an IC module 1. In this embodiment, the base end lead L1, tip end lead L2, and overlapping lead L3 of the lead portions 8, i.e., the entire lead portions 8 arranged along the top surface 15 of the IC chip 2, are covered with the connector 19 and fixed to the IC chip 2.

[0025] The connector 19 is made of ultraviolet-curing resin and is formed after welding the overlapping leads L3 (lead portions 8) to the bumps 16 using a resistance welding device. Specifically, as shown in FIG. 5, the connector 19 is formed by applying liquid resin 20 dropwise to the top surface 15 of the IC chip 2 using a dispenser 21 and then irradiating the applied liquid resin 20 with ultraviolet light to harden it. When the liquid resin 20 is applied dropwise, as shown in FIGS. 3 and 4, the surface tension of the liquid resin 20 causes the liquid resin 20 to swell and cover the top surfaces of the lead portions 8 at the portions of the lead portions 8 (base-end leads L1 and tip-end leads L2) arranged along the top surface 15 of the IC chip 2 and at the portions of the lead portions 8 welded to the bumps 16 (overlapping leads L3). After irradiation with ultraviolet light, the liquid resin 20 hardens while maintaining the shape it had when applied, and the lead portions 8 are fixed to the IC chip 2 while covered with the connector 19.

[0026] The UV-curable resin constituting the connector 19 can be an acrylic or epoxy UV-curable resin. In addition to the UV-curable resin, the connector 19 may also be a photo-curable resin that is cured by light other than UV, a thermosetting resin, a moisture-curable resin, a curing agent mixed curable resin, etc. The IC chip 2 may be fixed on a chip base that reinforces it.

[0027] As mentioned above, to facilitate handling and transportation, the IC module 1 is sandwiched and held between a pair of upper and lower support sheets 4·4 to form the inlet 5. Specifically, the IC module 1 is placed on the top surface of the lower support sheet 4, and then the upper support sheet 4 is placed on top of that. The upper and lower support sheets 4·4, which are stacked with the IC module 1 sandwiched between them, are partially heat-welded to form an integrated unit, thereby forming the inlet 5 in which the IC module 1 is held by the support sheets 4·4. Note that the support sheet 4 may be a single sheet, in which case the IC module 1 is held on the top or bottom surface of the support sheet 4 with an adhesive or the like.

[0028] The IC module 1 of this embodiment can be used as a primary product when it is attached to the inlet 5. Furthermore, the IC module 1 attached to the inlet 5 can be used in various secondary products, such as a contactless IC card 24. As shown in FIG. 6 , the contactless IC card 24 can be formed by integrating a base sheet 25 disposed below the inlet 5, an upper cover sheet 26 disposed on the top surface of the inlet 5, and a lower cover sheet 27 disposed below the base sheet 25 by welding. A clearance hole 28 is formed in the base sheet 25 in a vertically penetrating manner in a portion corresponding to the IC chip 2, and in the state of the contactless IC card 24, the IC chip 2 is housed in the clearance hole 28. The contactless IC card 24 may be configured such that decorative sheets are provided on the outer surfaces of the upper and lower cover sheets 26 and 27.

[0029] The IC module 1 of this embodiment can be used in secondary products by itself without being made into an inlet, for example, as an RFID tag 31 that constitutes a tag or label for clothing, etc. As shown in Fig. 7, the RFID tag 31 has the IC module 1 carried between a pair of base sheets 32. The base sheet 32 ​​is preferably made of paper or a resin sheet on whose surface printing or the like can be performed directly.

[0030] Second Embodiment FIG. 8 shows a second embodiment of an IC module according to the present invention. This embodiment differs from the first embodiment in that the connector 19 between the pair of base-end leads L1·L1 is omitted. In this way, the connector 19 does not need to be provided over substantially the entire top surface 15 of the IC chip 2, and the connector 19 can be omitted from portions that do not contribute to fixing the lead portions 8. In this embodiment, the amount of liquid resin 20 used can be reduced compared to the first embodiment, thereby reducing the manufacturing cost of the IC module 1. Since the rest is the same as in the first embodiment, the same components are denoted by the same reference numerals and their description will be omitted. This also applies to the following embodiments.

[0031] (Third embodiment) Figure 9 shows a third embodiment of an IC module according to the present invention. This embodiment differs from the first embodiment in that only the base-end leads L1 of the lead portions 8 are covered with connectors 19 and fixed to the IC chip 2. The length dimension in the front-to-rear direction of each connector 19 is formed to be shorter than the length dimension of the base-end leads L1. Of course, the longer the length dimension of the base-end leads L1 (lead portions 8) joined to the top surface 15 of the IC chip 2 by the connectors 19, the more firmly the IG chip 2 and the antenna 3 are fixed to each other.

[0032] 10 shows a fourth embodiment of an IC module according to the present invention. This embodiment differs from the third embodiment in that a separate connector 19 is formed for each base-end lead L1 of each lead portion 8. This embodiment also uses less liquid resin 20 than the third embodiment, thereby reducing the manufacturing cost of the IC module 1.

[0033] 11 shows a fifth embodiment of an IC module according to the present invention. This embodiment differs from the first embodiment in that only the overlapping lead L3 of the lead portion 8 is covered with a connector 19 and fixed to the IC chip 2. Strictly speaking, this is not limited to a configuration in which only the overlapping lead L3 is covered with the connector 19, and a configuration in which a portion of the base-end lead L1 and / or the tip-end lead L2 continuous with the overlapping lead L3 is covered with the connector 19 may also be used.

[0034] 12 shows a sixth embodiment of an IC module according to the present invention. This embodiment differs from the first embodiment in that a pair of left and right bumps 16 are disposed at positions shifted toward the rear edge 12 from the center C of the top surface 15 of the IC chip 2, and that the tip-side leads L2 of the lead portion 8 are covered with a connector 19 and fixed to the IC chip 2.

[0035] 13 shows a seventh embodiment of an IC module according to the present invention. This embodiment differs from the first embodiment in that a pair of left and right bumps 16 of the IC chip 2 are disposed in the center of the IC chip 2 in the front-rear direction (positions corresponding to the center C of the top surface 15 of the IC chip 2), and that the base end lead L1 and the tip end lead L2 of the lead portion 8 are covered with a connector 19 and fixed to the IC chip 2. In this manner, in a configuration in which the lead portion 8 is fixed to the IC chip 2 by the connector 19, excluding the overlapping lead L3, it is also possible to first form the connector 19 and fix the lead portion 8 to the IC chip 2, and then weld the lead portion 8 to the bump 16.

[0036] As in the above embodiments, various configurations can be used to fix the lead portions 8 to the IC chip 2 using the connector 19. In the above embodiments, the antenna 3 is configured so that only the lead portions 8 are arranged along the top surface 15 of the IC chip 2. However, in a configuration in which the coil portion 7 and lead portions 8 of the antenna 3 are arranged along the top surface 15 of the IC chip 2, the coil portion 7 can also be fixed to the top surface 15 of the IC chip 2 using the connector 19. The bumps 16 and the lead portions 8 can be joined by crimping, gluing, brazing, or the like, in addition to welding (fusion bonding). In an IC module 1 that is held by a carrier sheet 4 after formation to form an inlet 5, it is also possible to form the connector 19 by applying a liquid resin 20 to the top surface 15 of the IC chip 2 through the carrier sheet 4 and then curing the liquid resin. The connector 19 can also be configured using an adhesive tape that adheres the IC chip 2 and the antenna 3.

[0037] In the IC module 1 according to each of the above embodiments, the lead portions 8 are covered with the connector 19 and fixed to the top surface 15 of the IC chip 2, so that even if an external force is applied to the IC module 1 in the process of forming the inlet 5, the connector 19 prevents the lead portions 8 from being displaced relative to the IC chip 2, thereby preventing breakage of the welded portions between the bumps 16 and the lead portions 8. As described above, with this IC module 1, it is possible to reliably prevent the antenna 3 from being separated from the IC chip 2 due to an external force applied to the IC chip 2 or the antenna 3.

[0038] Incidentally, conventional structures with protective layers use a relatively soft UV-curable resin with a Shore hardness of 20 to 90, and the combination of nonwoven fabric and UV-curable resin improves the IC chip's resistance to external stress. However, this configuration can result in insufficient fixation of the bumps and antenna. Even if the protective layer can compensate for the reduced bonding strength between the bumps and antenna, there are problems such as the inability to ensure sufficient bonding strength in inlets that do not use a chip base. However, in the present invention, the connector 19 prevents the lead portion 8 from displacing relative to the IC chip 2, thereby solving the above-mentioned problem.

[0039] In plan view, the base-end lead L1 of the lead portion 8, which is disposed between the rear edge 12 of the IC chip 2 (the edge E1 of the IC chip 2 located on the derived base end side of the lead portion 8) and the rear side of the bump 16 (the side T1 of the bump 16 facing the rear edge 12 of the IC chip 2), is covered with a connector 19 and fixed to the IC chip 2. In this way, with the IC module 1 in which the base-end lead L1 is fixed to the IC chip 2 with the connector 19, the external force that is likely to act on the coil portion 7 of the antenna 3, which is formed relatively large, can be received by the connector 19, and the welded portion between the bump 16 and the lead portion 8 can be more effectively prevented from breaking.

[0040] In addition to the base-end lead L1, the tip-end lead L2 of the lead portion 8, which is disposed between the front edge 11 of the IC chip 2 (the edge E2 of the IC chip 2 located on the leading tip side of the lead portion 8) and the front side of the bump 16 (the side T2 of the bump 16 facing the front edge 11 of the IC chip 2), is covered with a connector 19 and fixed to the IC chip 2. In this way, with the IC module 1 in which the base-end lead L1 and the tip-end lead L2 are fixed to the IC chip 2 with the connector 19, it is possible to prevent the lead portion 8 from being displaced relative to the IC chip 2 due to an external force applied to the IC module 1 on both sides of the welded portion with the bump 16, and it is possible to more reliably prevent the welded portion between the bump 16 and the lead portion 8 from breaking and the antenna 3 from being separated from the IC chip 2.

[0041] According to the IC module 1 in which the overlapping lead L3 is covered with a connector 19 and fixed to the IC chip 2, the welded points between the bumps 16 and the lead portions 8 are not only welded together, but also the lead portions 8 are fixed to the IC chip 2 by the connector 19, so that it is possible to more reliably prevent the welded points between the bumps 16 and the lead portions 8 from breaking and separating the antenna 3 from the IC chip 2.

[0042] Since the pair of bumps 16·16 are arranged side by side at a position biased toward the front edge 11 (toward the edge E2 located at the leading tip of the lead portion 8) from the center C of the upper surface 15 of the IC chip 2, it is possible to increase the length dimension of the base end lead L1 compared to when the pair of bumps 16·16 are arranged toward the rear edge 12 from the center C of the upper surface 15 of the IC chip 2, and the lead portion 8 can be more firmly fixed to the IC chip 2 by the connecting body 19, more reliably preventing the antenna 3 from separating from the bump 16.

[0043] By using the connecting body 19 formed by solidifying the liquid resin 20, if there is space above the IC chip 2 to allow the liquid resin 20 to drip, it is possible to fix the lead portion 8 to the IC chip 2 with the connecting body 19, and it is possible to easily create a structure to prevent the antenna 3 from separating even for the IC chips 2 that have become smaller in recent years.

[0044] The inlet including the IC module 1 and the carrier sheet 4 that holds the IC module 1 can prevent the welded portions between the bumps 16 and the leads 8 from breaking even when external stress or the like is applied, thereby making it possible to obtain a contactless IC card or RFID tag that is more resistant to breakage and has excellent reliability. Furthermore, it is possible to reduce the occurrence of defective products when forming the inlet 5 from the IC module 1, thereby preventing a decrease in the manufacturing yield of the inlet 5.

[0045] A contactless IC card or RFID tag equipped with the IC module 1 can prevent the welded portions between the bumps 16 and the leads 8 from breaking even when external stress or the like is applied, thereby making it possible to obtain a contactless IC card or RFID tag that is more resistant to breakage and has excellent reliability. Furthermore, it is possible to reduce the occurrence of defective products when forming contactless IC cards or RFID tags, thereby preventing a decrease in the manufacturing yield of contactless IC cards or RFID tags.

[0046] The IC module of the present invention can contribute to Goal 9 (Build resilient infrastructure, promote inclusive and sustainable industrialization, foster innovation and promote resilience) and Goal 12 (Promote responsible consumption and production) of the Sustainable Development Goals (SDGs) advocated by the United Nations. [Explanation of symbols]

[0047] 1 IC module 2 IC chip 3 Antennas 5 Inlet 7 Coil section 8 Lead section 15 One side of the IC chip (top side of the IC chip) 16 Bump 19 Connector 20 Liquid Resin 24 Contactless IC card 31 RFID tags E1: The edge of the IC chip located on the base end side of the lead E2 The edge of the IC chip located at the leading end of the lead L1 proximal lead L2 distal lead L3 overlapping lead T1: The edge of the bump facing the edge of the IC chip located on the lead-out base end side of the lead T2: The edge of the bump facing the edge of the IC chip located on the leading end side of the lead

Claims

1. An IC module comprising an IC chip (2) having a pair of bumps (16, 16) formed on one surface (15) thereof, and an antenna (3) for wireless communication formed by a single antenna wire and joined to each bump (16), The antenna (3) has a coil section (7) around which an antenna wire is wound in a spiral shape, and a pair of lead sections (8, 8) which are the start and end of the antenna wire and are led out in the same direction toward the inside of the coil section (7), Each lead portion (8) is disposed along one surface (15) of the IC chip (2) so as to pass over the bump (16), and the lead portion (8) overlapping the bump (16) is joined to the bump (16); The IC module is characterized in that the lead portion (8) is covered with a connector (19) and fixed to one surface (15) of the IC chip (2).

2. An IC module as described in claim 1, wherein when the lead portion (8) arranged between the edge portion (E1) of the IC chip (2) located on the base end side of the lead portion (8) in a plan view and the side portion (T1) of the bump (16) facing the edge portion (E1) of the IC chip (2) is defined as a base end lead (L1), the base end lead (L1) is covered with a connecting body (19) and fixed to the IC chip (2).

3. 3. An IC module according to claim 2, wherein when the lead portion (8) arranged between the edge portion (E2) of the IC chip (2) located at the leading tip side of the lead portion (8) and the side portion (T2) of the bump (16) facing the edge portion (E2) of the IC chip (2) is defined as a tip side lead (L2), the tip side lead (L2) is covered with a connecting body (19) and fixed to the IC chip (2).

4. 4. An IC module according to claim 2 or 3, wherein when the lead portion (8) arranged on the bump (16) in plan view is defined as an overlapping lead (L3), the overlapping lead (L3) is covered with a connecting body (19) and fixed to the IC chip (2).

5. The IC chip (2) is formed in a rectangular shape in a plan view, having an edge portion (E1) located on the lead base end side of the lead portion (8) and an edge portion (E2) located on the lead tip side of the lead portion (8), 3. An IC module according to claim 2, wherein a pair of bumps (16, 16) are arranged side by side at a position biased toward the edge (E2) located on the leading tip side of the lead portion (8) from the center (C) of one surface (15) of the IC chip (2).

6. 2. The IC module according to claim 1, wherein the connector (19) is formed by solidifying a liquid resin (20).

7. An inlet comprising an IC module (1) according to any one of claims 1 to 6 and a carrier sheet (4) for holding the IC module (1).

8. A contactless IC card comprising an IC module (1) according to any one of claims 1 to 6.

9. An RFID tag comprising an IC module (1) according to any one of claims 1 to 6.

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