Cover tape and electronic component packaging body

Abstract

To provide a cover tape which can suppress the generation of fuzz when it is peeled from a paper carrier tape.SOLUTION: A cover tape comprises a base material layer, and a sealant layer provided at one face side of the base material layer, and is used for sealing a paper carrier tape. In this cover tape, the sealant layer is present at the outer most surface of the cover tape. Then, the size of cohesive force F obtained by the following procedures (1) to (3) is 0.02 to 0.09 N / mm: the procedure (1) in which the cover tapes cut to a length of 200 mm and a width of 15 mm are prepared by two pieces; the procedure (2) in which the sealant layers of the two cover tapes are brought into contact with each other, are thermally bonded under the conditions of a temperature of 180°C, a load of 15 N and a time of 0.2 seconds, and are cooled to a room temperature; and the procedure (3) in which the average value of force measured when the two cover tapes thermally bonded in the procedure (2) are peeled off at a peel angle of 180° and at a fixed peel speed of 300 mm / min, is defined as the cohesive force F.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a cover tape and an electronic component package, and more specifically to a cover tape used to seal a paper carrier tape, and an electronic component package in which the cover tape is adhered to the paper carrier tape. [Background technology]

[0002] When storing or transporting electronic components, the electronic components are sometimes placed in recesses in a paper carrier tape having recesses, and a cover tape is then adhered to the paper carrier tape to seal the electronic components. Some carrier tapes are made of synthetic resin, but paper carrier tapes are sometimes preferred for cost and environmental reasons.

[0003] Patent Document 1 discloses a cover tape that is thermally bonded to a paper carrier tape for transporting chip-type electronic components. This cover tape is made of a laminate having at least a plastic film layer, a polyethylene layer, and an antistatic adhesive layer. The antistatic adhesive layer is characterized by being formed to a thickness of 0.5 to 1.0 μm from a composition in which a quaternary ammonium salt-type cationic surfactant is dispersed in an acrylic resin.

[0004] Patent Document 2 discloses a cover tape having an adhesive layer that is heat-sealed to a carrier tape having pockets for storing electronic components. In this cover tape, the adhesive layer provided on one side of the base film of the cover tape is formed by applying and drying an aqueous dispersion liquid, mainly composed of a polyolefin resin dispersed with an anionic surfactant. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 4202685 [Patent Document 2] Japanese Patent Application Laid-Open No. 2007-276799 Summary of the Invention [Problem to be solved by the invention]

[0006] One of the issues with using paper carrier tape is the issue of "fuzz" that occurs when peeling the cover tape from the paper carrier tape. Fuzz can cause problems during the electronic component mounting process, such as camera inspection errors, component short circuits, mounting defects, and circuit board contamination.

[0007] The present invention has been made in view of the above circumstances, and one of the objects of the present invention is to provide a cover tape that is less likely to become frayed when peeled from a paper carrier tape. [Means for solving the problem]

[0008] The present inventors have completed the invention provided below and solved the above problems.

[0009] 1. A cover tape for sealing a paper carrier tape, comprising a base layer and a sealant layer provided on one side of the base layer, the sealant layer is present on the outermost surface of the cover tape, A cover tape having a cohesive force F of 0.02 to 0.09 N / mm, determined by the following procedure. [procedure] (1) Prepare two pieces of the cover tape cut to a length of 200 mm and a width of 15 mm. (2) The sealant layers of the two cover tapes are brought into contact with each other and thermally bonded under conditions of a temperature of 180°C, a load of 15 N, and a time of 0.2 seconds, and then allowed to cool to room temperature. (3) The two cover tapes heat-bonded in (2) above are peeled off at a constant peel angle of 180° and a peel speed of 300 mm / min. The average force measured is taken as the cohesive strength F. 2. 1. The cover tape according to claim 1, The cover tape, wherein the sealant layer comprises a polyolefin resin (a) and at least one polystyrene resin (b) selected from the group consisting of a styrene monomer / aliphatic monomer copolymer, a styrene monomer / aromatic monomer copolymer, and an α-methylstyrene polymer. 3. 2. The cover tape according to claim 1, The cover tape, wherein the polyolefin resin (a) includes a polyethylene resin. 4. 2. or 3. The cover tape according to claim 1, A cover tape in which, when the amount of the polyolefin resin (a) in the sealant layer is Ma and the amount of the polystyrene resin (b) is Mb, the value of Mb / Ma is 0.05 to 0.20. 5. The cover tape according to any one of 2. to 4., A cover tape in which the proportion of the polystyrene resin (b) in the sealant layer is 4 to 12% by mass. 6. The cover tape according to any one of 2. to 5., A cover tape in which the proportion of the polyolefin resin (a) in the sealant layer is 45 to 95% by mass. 7. The cover tape according to any one of 2. to 6., The cover tape, wherein the sealant layer further contains at least one resin (c) selected from the group consisting of poly(meth)acrylic resins and styrene-based monomer / (meth)acrylic monomer copolymers. 8. 7. The cover tape according to claim 7, A cover tape in which the content of the resin (c) in the sealant layer is 5 to 30% by mass. 9. The cover tape according to any one of 2. to 8., The cover tape, wherein the sealant layer further comprises an antistatic agent. 10. The cover tape according to any one of 1. to 9., The cover tape has a sealant layer having a thickness of 5 to 15 μm. 11. The cover tape according to any one of 1. to 10., The cover tape includes an intermediate layer between the base layer and the sealant layer. 12. A paper carrier tape having electronic components housed in recesses and the cover tape according to any one of 1. to 11. An electronic component package in which the sealant layer is adhered to the paper carrier tape so as to seal the electronic component. [Effects of the Invention]

[0010] When the cover tape of the present invention is adhered to a paper carrier tape and then peeled off, fluffing is unlikely to occur. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 2 is a diagram illustrating a layer structure of a cover tape. [Figure 2] FIG. 10 is a perspective view showing an example of a state in which a cover tape is sealed to a paper carrier tape. [Figure 3] 10 is an image of the surface of the carrier tape taken with an electron microscope after evaluation of peel strength in Example 3. [Figure 4] 1 is an image of the surface of the carrier tape in Comparative Example 1 taken with an electron microscope after evaluation of peel strength. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In all the drawings, similar components are denoted by similar reference numerals and descriptions thereof will be omitted where appropriate. To avoid complexity, (i) when there are multiple identical components in the same drawing, only one of them is given a symbol, and not all of them, or (ii) particularly in Figure 2 and subsequent figures, components similar to those in Figure 1 are not given a symbol again. All drawings are for illustrative purposes only, and the shapes and dimensional ratios of the components in the drawings do not necessarily correspond to the actual products.

[0013] In this specification, unless otherwise specified, the expression "X to Y" in the description of a numerical range means at least X and at most Y. For example, "1 to 5% by mass" means "at least 1% by mass and at most 5% by mass." In this specification, the unit "gf" represents gram force and "kgf" ​​represents kilogram force. These are non-SI units, but can be converted to SI units by multiplying by the acceleration due to gravity.

[0014] In this specification, the term "(meth)acrylic" represents a concept that encompasses both acrylic and methacrylic. The same applies to similar terms such as "(meth)acrylate." In this specification, the term "electronic device" is used to encompass elements, devices, final products, etc. to which electronic engineering technology is applied, such as semiconductor chips, semiconductor elements, printed wiring boards, electric circuit display devices, information and communication terminals, light-emitting diodes, physical batteries, and chemical batteries.

[0015] <Cover tape> FIG. 1 is a diagram showing the layer structure of the cover tape (cover tape 10) of this embodiment. The cover tape 10 includes at least a base layer 1 and a sealant layer 3 provided on one side of the base layer 1. The sealant layer 3 is present on the outermost surface of the cover tape 10. In other words, one side of the sealant layer 3 is exposed and in contact with air. The cover tape 10 preferably comprises an intermediate layer 2 between the substrate layer 1 and the sealant layer 3 . The cover tape 10 is used to seal the paper carrier tape.

[0016] In the cover tape 10, the magnitude of the cohesive force F determined by the following procedure is 0.02 to 0.09 N / mm. [procedure] (1) Prepare two pieces of the cover tape cut to a length of 200 mm and a width of 15 mm. (2) The sealant layers of the two cover tapes are brought into contact with each other and thermally bonded under conditions of a temperature of 180°C, a load of 15 N, and a time of 0.2 seconds, and then allowed to cool to room temperature. (3) The two cover tapes heat-bonded in (2) above are peeled off at a constant peel angle of 180° and a peel speed of 300 mm / min. The average force measured is taken as the cohesive strength F. (The "average force value" is the value found by dividing the area (integral value) of a graph, which is a plot of the force measured during peeling on the vertical axis against the measurement time on the horizontal axis, by the measurement time. In peeling tests such as those described in (3) above, fluctuations in the force value may occur during measurement, so it is preferable to use the "average force value" as an index of cohesion strength.)

[0017] The inventors of the present invention considered it important to appropriately control the peeling mode in order to suppress fuzzing when peeling the cover tape from the paper carrier tape. Specifically, peeling modes when peeling the cover tape from the paper carrier tape include (i) interfacial peeling, which occurs between the carrier tape and the sealant layer of the cover tape; (ii) interlayer peeling, which occurs between the sealant layer and the intermediate layer of the cover tape; and (iii) cohesive peeling, which occurs when the sealant layer of the cover tape is destroyed. Furthermore, if the peeling mode is (i) interfacial peeling, force is likely to be applied to the paper carrier tape during peeling, and peeling proceeds in a manner that lifts the paper fibers, which is thought to easily cause fuzzing.

[0018] On the other hand, in cohesive peeling and interlayer peeling, peeling occurs inside the cover tape, making it difficult to lift the paper fibers during peeling, which is thought to reduce the likelihood of fuzzing. In particular, the advantage of cohesive peeling is that the peel strength can be easily adjusted by sealant design, allowing for easy film formation using an extrusion film-forming method. Therefore, the inventors decided to use a sealant layer that is easy to cohesively peel for the cover tape. In this case, the magnitude of the cohesive force F obtained by the above procedure was used as an index that is thought to correlate with the ease of cohesive peeling. They found that a cover tape with an F of 0.02 to 0.09 N / mm can appropriately suppress fuzzing of paper carrier tape.

[0019] The cover tape of this embodiment can be manufactured by selecting appropriate materials and performing an appropriate manufacturing process. As will be described in detail later, an example of the selection of appropriate materials is to use a polyolefin resin and a specific polystyrene resin in an appropriate ratio when forming the sealant layer 3.

[0020] Incidentally, there is a concern that adjusting the cohesive force F may result in a decrease in the adhesive strength (heat seal strength) to the carrier tape, which is required of the cover tape. However, to the best of the inventor's knowledge, no significant decrease in adhesive strength (heat seal strength) has been observed in this embodiment. In this embodiment, it is believed that the adhesive strength (heat seal strength) to the carrier tape can be ensured while adjusting the cohesive force F, probably by appropriately blending the sealant layer, for example, by using the polystyrene-based resin (b) described below.

[0021] The cover tape of this embodiment will now be described.

[0022] (Base material layer 1) There are no particular limitations on the material that constitutes the base material layer 1. Typically, a material that provides sufficient mechanical strength to withstand external forces when producing the cover tape 10 and adhering the cover tape 10 to the carrier tape is preferred. Also, a material that is heat-resistant enough to withstand the heat generated when adhering the cover tape 10 to the carrier tape is preferred. The material constituting the base layer 1 is preferably in the form of a film from the viewpoint of ease of processing.

[0023] Specific examples of materials constituting the base material layer 1 include polyester-based resins, polyamide-based resins, polyolefin-based resins, polyacrylate-based resins, polymethacrylate-based resins, polyimide-based resins, polycarbonate-based resins, ABS resins, etc. Among these, polyester-based resins are preferred from the viewpoint of improving the mechanical strength of the cover tape 10 and from the viewpoint of cost, and polyethylene terephthalate (PET)-based resins are more preferred. The base layer 1 may or may not contain additives such as a lubricant or an antistatic agent.

[0024] The base layer 1 may be a single layer or may have two or more layers. For example, the base layer 1 may be formed of a multilayer film in which the above-mentioned materials are laminated. The film used to form the base layer 1 may be an unstretched film or a uniaxially or biaxially stretched film. From the viewpoint of further improving the mechanical strength of the cover tape 10, a uniaxially or biaxially stretched film is preferred.

[0025] There are no particular limitations on the thickness of the base layer 1. The thickness of the base layer 1 is preferably 5 to 50 μm, more preferably 9 to 40 μm, and even more preferably 12 to 30 μm. By setting the thickness of the base layer 1 to 50 μm or less, the rigidity of the cover tape 10 is not too high. As a result, even if a torsional stress is applied to the carrier tape after sealing, the cover tape 10 can easily follow the deformation of the carrier tape. Therefore, it is possible to prevent the cover tape 10 from unintentionally peeling off from the carrier tape. A thickness of the base material layer 1 of 5 μm or more can provide sufficiently good mechanical strength to the cover tape 10. Therefore, even when the cover tape 10 is peeled off from the carrier tape at high speed, for example, the cover tape 10 can be prevented from breaking.

[0026] The total light transmittance of the base layer 1 is preferably 80% or more, and more preferably 85% or more. This ensures the transparency required to inspect whether the electronic components are properly housed in the electronic component package made up of the cover tape 10 and the carrier tape. In other words, by making the total light transmittance of the base layer 1 80% or more, the electronic components housed inside the package made up of the cover tape 10 and the carrier tape can be easily visually confirmed from the outside. The total light transmittance can be measured in accordance with JIS-K-7361.

[0027] (Middle Class 2) When the cover tape 10 includes an intermediate layer 2, the intermediate layer 2 is typically present between the substrate layer 1 and the sealant layer 3. The intermediate layer 2 does not necessarily have to be in direct contact with the sealant layer 3 or the substrate layer 1. That is, there may be an additional layer between the substrate layer 1 and the intermediate layer 2, or there may be an additional layer between the sealant layer 3 and the intermediate layer 2. Of course, the intermediate layer 2 may also be in contact with the substrate layer 1 and the sealant layer 3. Providing the cover tape 10 with the intermediate layer 2 can improve the cushioning properties and impact resistance of the cover tape 10. Also, providing the cover tape 10 with the intermediate layer 2 tends to level out the pressing force during heat sealing to an appropriate degree, making it easier to obtain a consistent level of adhesion.

[0028] Examples of materials for the intermediate layer 12 include olefin resins, styrene resins, and cyclic olefin resins. Of these, from the viewpoint of improving the cushioning properties of the entire cover tape 10, olefin resins are preferred. Examples of olefin resins include polyethylene and polypropylene. Of these, polyethylene is preferred. In particular, from the viewpoint of cushioning properties, low-density polyethylene (LDPE) or linear low-density polyethylene (L-LDPE) is more preferred. Furthermore, high-density polyethylene (HDPE) is also preferred from the viewpoint of achieving both cushioning properties and strength. The intermediate layer 2 may or may not contain various additives. Examples of additives include those listed for the base layer 1.

[0029] When the intermediate layer 2 is provided, the intermediate layer 2 may be a single layer or a multilayer. When the intermediate layer 2 is provided, its thickness is preferably 10 to 50 μm, more preferably 10 to 40 μm, from the viewpoint of improving the cushioning properties of the entire cover tape without excessively impairing other performances.

[0030] (Sealant layer 3) The sealant layer 3 is capable of heat-sealing the cover tape 10 to the carrier tape (it melts appropriately when heated). In this embodiment, the sealant layer 3 is preferably made of an appropriate material in order to set the magnitude of the cohesive force F to 0.02 to 0.09 N / mm.

[0031] Specifically, the sealant layer 3 is a polyolefin resin (a); At least one polystyrene resin (b) selected from the group consisting of a styrene monomer / aliphatic monomer copolymer, a styrene monomer / aliphatic monomer copolymer, and an α-methylstyrene polymer; It is preferred that the compound contains: When the sealant layer 3 contains a polyolefin resin (a), it may contain only one polyolefin resin (a), or may contain two or more polyolefin resins (a). When the sealant layer 3 contains the polystyrene resin (b), it may contain only one polystyrene resin (b), or it may contain two or more polystyrene resins (b).

[0032] The polyolefin resin (a) preferably contains a polyethylene resin, and the polyethylene resin preferably contains low-density polyethylene (LDPE). When the sealant layer 3 contains the polyolefin resin (a), it may contain only one polyolefin resin, or may contain two or more polyolefin resins. The proportion of the polyolefin resin (a) in the sealant layer 3 is preferably 45 to 95 mass %, more preferably 50 to 80 mass %, still more preferably 55 to 75 mass %, and particularly preferably 60 to 70 mass %.

[0033] Examples of the "styrene-based monomer" in the polystyrene-based resin (b) include styrene and α-methylstyrene. Examples of the aliphatic monomer in the styrene monomer / aliphatic monomer copolymer include polybutene compounds, polyisobutylene compounds, and polyisoprene compounds. Examples of the aromatic monomer in the styrene monomer / aromatic monomer copolymer include indene and coumarone. When the sealant layer 3 contains the polystyrene resin (b), it may contain only one polystyrene resin, or may contain two or more polystyrene resins. The proportion of the polystyrene resin (b) in the sealant layer 3 is preferably 4 to 12 mass %, more preferably 6 to 10 mass %. Materials corresponding to the polystyrene-based resin (b) can be purchased from, for example, Mitsui Chemicals, Inc.

[0034] When the amount of polyolefin resin (a) in the sealant layer 3 is Ma and the amount of polystyrene resin (b) is Mb, the value of Mb / Ma is preferably 0.05 to 0.20, more preferably 0.07 to 0.15, and even more preferably 0.09 to 0.13.

[0035] The sealant layer 3 preferably further contains at least one resin (c) selected from the group consisting of poly(meth)acrylic resins and styrene monomer / (meth)acrylic monomer polymers.

[0036] Specific examples of poly(meth)acrylic resins include polymers containing structural units derived from (meth)acrylic acid and / or structural units derived from (meth)acrylic acid esters. Examples of the (meth)acrylic acid include acrylic acid and methacrylic acid. Examples of the (meth)acrylic acid ester include one or more selected from methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate, and ethylhexyl (meth)acrylate.

[0037] The poly(meth)acrylic resin may be a copolymer with other monomers, as long as it does not fall under the category of a styrene monomer / (meth)acrylic monomer copolymer described below. For example, the poly(meth)acrylic resin may be a copolymer containing one or more monomers selected from the group consisting of an ethylene-methyl(meth)acrylate copolymer, an ethylene-ethyl(meth)acrylate copolymer, an ethylene-(meth)acrylate copolymer, and an ethylene-vinyl acetate copolymer. The poly(meth)acrylic resin contains, for example, 5% by mass or more, preferably 10% by mass or more, and more preferably 15% by mass or more of structural units derived from a (meth)acrylic acid ester.

[0038] The styrene monomer in the styrene monomer / (meth)acrylic monomer copolymer can be styrene, α-methylstyrene, or the like. Examples of the (meth)acrylic monomer in the styrene monomer / (meth)acrylic monomer copolymer include (meth)acrylic acid and (meth)acrylic acid esters. Examples of the (meth)acrylic acid esters include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, hexyl (meth)acrylate, and ethylhexyl (meth)acrylate.

[0039] When the sealant layer 3 contains a resin (c), it may contain only one resin (c), or may contain two or more resins (c). When the sealant layer 3 contains the resin (c), the proportion of the resin (c) in the sealant layer 3 is preferably 5 to 30 mass %, more preferably 8 to 25 mass %.

[0040] The sealant layer 3 may or may not contain various additional components. From the viewpoint of suppressing adverse effects of static electricity on electronic components, the sealant layer 3 preferably contains an antistatic agent.

[0041] The antistatic agent that can be used is not particularly limited, but examples thereof include the following. Polymers containing a polyether structure (for example, polyamide copolymers such as polyetheresteramide, block polymers of polyolefin and polyether, polymers consisting of polyethylene ether and glycol, etc.), carboxylate group-containing polymers such as potassium ionomers, quaternary ammonium group-containing copolymers, etc. Metal-containing fillers (metal oxide particles, etc.) such as tin oxide, zinc oxide, and titanium oxide. Conductive polymers such as polyethylenedioxythiophene / polystyrene sulfonate (PEDOT / PSS), polyacetylene, and polyaniline. -Surfactant type, specifically non-ionic surfactants.

[0042] When an antistatic agent is used, only one antistatic agent may be used, or two or more antistatic agents may be used in combination. When an antistatic agent is used, the amount thereof in the sealant layer 3 is preferably 1 to 30% by mass, more preferably 5 to 20% by mass.

[0043] The sealant layer 3 may or may not contain a tackifier in order to adjust the adhesiveness. Examples of tackifiers include petroleum resins, hydrogenated petroleum resins, rosin resins, terpene resins, styrene resins, and coumarone-indene resins. Among these, petroleum resins, hydrogenated petroleum resins, and styrene resins are preferred due to their resistance to adhesion of electronic components, heat sealing properties for carrier tape, and gas barrier properties. Commercially available products include Arakawa Chemical Industries' hydrogenated petroleum resins, trade name "Alcon" series.

[0044] When a tackifier is used, one type may be used alone, or two or more types may be used in combination. When the sealant layer 3 contains a tackifier, the amount of the tackifier in the sealant layer 3 is preferably 1 to 20% by mass, more preferably 3 to 15% by mass. In this embodiment, it is more preferable that the sealant layer 3 does not contain a tackifier.

[0045] The sealant layer 3 may be a single layer or a multilayer, and is preferably a single layer. The thickness of the sealant layer 3 is preferably 5 to 15 μm, more preferably 8 to 12 μm, from the viewpoint of appropriate heat sealing properties and the above-mentioned peeling mechanism.

[0046] (Other layers) The cover tape 10 may or may not have additional layers other than those described above. Examples of additional layers include an anchor coat layer for improving adhesion between layers.

[0047] (Cover tape width and length) The width and length of the cover tape 10 can be appropriately set mainly depending on the width and length of the carrier tape. Typically, the cover tape 10 has a width of about 1 to 100 mm and a length of about 100 to 30,000 m.

[0048] (Cover tape manufacturing method) Although details of the method for manufacturing the cover tape 10 are given in the examples below, an outline will be given here. There are no particular limitations on the method for manufacturing the cover tape 10. For example, it can be manufactured by applying a known method such as extrusion, lamination, or coating. As an example, the cover tape 10 can be manufactured by an extrusion lamination method.

[0049] More specifically, the cover tape 10 can be manufactured by the following steps (1) to (4). (1) A film corresponding to the base layer 1 is prepared. (2) On one side of the film prepared in (1), a layer corresponding to the intermediate layer 2 is formed by extrusion lamination, thereby obtaining a film having a two-layer structure of the base layer 1 and the intermediate layer 2. (3) On the surface of the two-layer film (2) where the intermediate layer 2 is exposed, a layer corresponding to the sealant layer 3 is formed by extrusion lamination, thereby obtaining a three-layer film. (4) If necessary, the resulting three-layer film is cut to an appropriate length and width.

[0050] In the extrusion lamination step (2), a resin material in a molten state is formed on one side of the film corresponding to the base layer 1. Examples of the resin material include the resins and various additives listed above in the section (Intermediate layer 2). When the resin material contains two or more materials, it is preferable that they are appropriately mixed (in a molten state) before film formation. In the extrusion lamination step (3), a molten resin material is formed on the surface of the two-layer film where the intermediate layer 2 is exposed. Examples of the resin material include the resins and various additives listed above in the section (Sealant layer 3). When the resin material contains two or more materials, it is preferable that they are appropriately mixed (in a molten state) before film formation. The extrusion temperature in steps (2) and (3) may be adjusted appropriately, for example, between 150 and 350°C.

[0051] <Electronic component packaging> An electronic component package can be obtained from the above-described cover tape (cover tape 10) and a carrier tape having electronic components housed in recesses, as will be described with reference to FIG.

[0052] In FIG. 2, the cover tape 10 is used as a lid material for a strip-shaped paper carrier tape 20 on which recessed pockets 21 are continuously provided to fit the shapes of electronic components. Specifically, the cover tape 10 is adhered (usually heat sealed) to the surface of the paper carrier tape 20 so as to cover the entire opening of the pocket 21 of the paper carrier tape 20. Hereinafter, the structure obtained by adhering the cover tape 10 and the paper carrier tape 20 together will be referred to as the electronic component packaging body 100.

[0053] The electronic component packaging body 100 can be produced, for example, by the following procedure. First, electronic components are placed in the pockets 21 of the paper carrier tape 20 . Next, the cover tape 10 is adhered to the surface of the paper carrier tape 20 by a heat sealing method so as to cover the entire opening of the pocket 21 of the paper carrier tape 20. At this time, the sealant layer 3 of the cover tape 10 is in contact with the paper carrier tape 20 (that is, the heat sealing is performed so that the "back surface" of the cover tape 10 in FIG. 2 becomes the sealant layer 3). In this way, a structure (electronic component packaging body 100) in which electronic components are hermetically housed is obtained. The specific method and conditions for heat sealing are not particularly limited as long as the cover tape 10 is sufficiently strongly adhered to the paper carrier tape 20. Typically, a known taping machine is used, and the heat sealing can be performed at a temperature of 100 to 240°C, a load of 0.1 to 10 kgf, and a time of 0.0001 to 1 second.

[0054] The material of the paper carrier tape 20 is not particularly limited as long as it includes paper and the cover tape 10 can be adhered by heat sealing.

[0055] The electronic component package 100 is wound, for example, on a reel and then transported to a work area where the electronic components are mounted on an electronic circuit board, etc. The reel may be made of metal, paper, plastic, or the like.

[0056] After the electronic component package 100 is transported to the work area, the cover tape 10 is peeled off from the paper carrier tape 20, and the housed electronic components are taken out.

[0057] There are no particular limitations on the electronic components housed in the electronic component packaging 100. Examples include general components used in the manufacture of electrical and electronic devices, such as semiconductor chips, transistors, diodes, capacitors, piezoelectric elements, optical elements, LED-related members, connectors, and electrodes.

[0058] Although the embodiments of the present invention have been described above, these are merely examples of the present invention, and various other configurations may be adopted. Furthermore, the present invention is not limited to the above-described embodiments, and modifications and improvements within the scope of achieving the object of the present invention are included in the present invention. [Example]

[0059] The embodiments of the present invention will be described in detail based on Examples and Comparative Examples. However, it should be noted that the present invention is not limited to the Examples. In the following, exponential notation may be indicated by the symbol "E." For example, 1.3E+06 is 1.3 x 10 6 means.

[0060] <Cover tape manufacturing> First, a PET film (manufactured by Toyobo Co., Ltd., E7415) with a thickness of 16 μm was prepared as a material for the base layer. On this, the material shown in the "Intermediate layer" column in the table below was extrusion laminated at an extrusion temperature of 300°C to form a film with the thickness shown in the table. In this way, an intermediate layer was formed. However, in Comparative Example 3, no intermediate layer was provided. A sealant layer was further formed on the formed intermediate layer (substrate layer in Comparative Example 3) by extrusion lamination at an extrusion temperature of 280°C using a homogeneously melted material having the composition shown in Table 1 (numbers are parts by mass). The thickness of the film was as shown in the table. In Comparative Examples 2 and 3, a dispersion containing Electrostripper TS-7B (manufactured by Kao Corporation) was further applied to the surface of the sealant layer using a gravure roll to form an antistatic layer. At this time, the coating amount after drying was 0.5 g / m 2 The amount of coating was adjusted so that In this manner, the cover tapes of the examples and comparative examples were manufactured.

[0061] <Measurement of cohesive strength F> (1) The cover tape produced as described above was cut into two measurement samples having a width of 15 mm and a length of 200 mm. (2) The sealant layers of the two test samples were brought into contact with each other and heat-sealed at 180°C under a load of 15 N for 0.2 seconds, then allowed to cool to room temperature. A known automatic cup sealer was used for this process. The width and length of the seal were 15 mm x 20 mm, meaning that the test samples were heat-sealed near the center. (3) The two cover tapes heat-bonded in (2) above were peeled at a constant peeling angle of 180° and a peeling speed of 300 mm / min, and the force measured was continuously measured. The average force was taken as the cohesive strength F.

[0062] <Evaluation> (Fuzz amount) A paper carrier tape without a pocket (product number: HOCTO-40SE, manufactured by Totec Co., Ltd.) was prepared. A cover tape was heat-sealed to this paper carrier tape under the following conditions. conditions: The cover tape cut to a width of 5.3 mm was applied to the surface of the paper carrier tape using a taping machine (Tokyo Wells Co., Ltd.: TWA-6621) at 180°C and 4 kg / cm to achieve a seal width of 0.4 mm. 2 The heat sealing was performed under the conditions of 0.01 seconds.

[0063] After the heat sealing and cooling, the cover tape was peeled off at a constant speed of 300 mm / min at a peel angle of 180°. A 3cm long area of ​​the peeled cover tape was observed using a microscope at 30x magnification. The number of fluff (paper fibers) adhering to the cover tape was then counted. The fewer the number, the less fluff there was.

[0064] (Peel strength (heat seal strength)) The cover tape cut to a width of 5.3 mm was applied to the surface of a paper carrier tape (manufactured by Totec Co., Ltd.) using a taping machine (manufactured by Tokyo Wells Co., Ltd.: TWA-6621) at 180°C and 4 kg / cm 2 The sample was heat-sealed for 0.01 seconds. The peel strength was measured immediately after heat sealing. The peel strength was measured using a peel tester at a peel speed of 300 mm / min and a peel angle of approximately 180°.

[0065] (Surface resistivity) Based on JIS K 6911, the surface resistivity of the surface on the sealant layer side of the cover tape was measured using a surface resistance measuring instrument (manufactured by SIMCO) in an environment of a temperature of 23°C and a relative humidity of 50%.

[0066] The various information is summarized in the table below.

[0067] [Table 1]

[0068] Details of each component in Table 1 are as follows: PET1: Biaxially oriented polyester film (Toyobo Co., Ltd., E7415) LDPE1: Low-density polyethylene (Sumitomo Chemical Co., Ltd., Sumikathene L705) EVA1: Ethylene-vinyl acetate copolymer (Tosoh Corporation, Ultrathene 537) EVA2: Ethylene-vinyl acetate copolymer (Dow Mitsui Polychemicals, Evaflex EV260) Antistatic agent 1: Antistatic agent containing lithium ions (Pelectron LMP, manufactured by Sanyo Chemical Industries, Ltd.) Antistatic agent 2: Nonionic surfactant (Kao Corporation, Electrostripper TS-7B) Styrene-acrylic resin 1: styrene-based monomer / (meth)acrylic monomer copolymer (Toyo Styrene Co., Ltd., Estyrene MS-600) (Meth)acrylic acid ester copolymer 1: methyl methacrylate homocopolymer (Sumitomo Chemical Co., Ltd., Sumipex MGSV) Tackifier 1: Hydrogenated petroleum resin of alicyclic saturated hydrocarbon resin type (Arakawa Chemical Co., Ltd., Alcon P-100) Styrene-based polymer 1: styrene-based monomer / aliphatic monomer copolymer (Mitsui Chemicals, Inc., FTR6125) Styrene-based polymer 2: α-methylstyrene polymer (Mitsui Chemicals, Inc., FTR0120)

[0069] As shown in Table 1, the cover tapes of Examples 1 to 5, which have a cohesive force F of 0.02 to 0.09 N / mm, showed less fuzzing when peeled from the paper carrier tape than the cover tapes of Comparative Examples 1 to 3. This is believed to be because the peeling mode in Examples 1 to 5 was cohesive peeling (see the next paragraph for more information). The peel strength (heat seal strength) of the cover tapes of Examples 1 to 5 was similar to that of the Comparative Examples, and was sufficient. Furthermore, the surface resistivity of the cover tapes of Examples 1 to 5 was 1.0 x 10 10This was less than Ω, which was a value that would not cause any problems in practical use.

[0070] (Reference: Peeling mechanism) For the cover tapes of Example 3 and Comparative Example 1, the surfaces of the carrier tapes after the evaluation of the peel strength (heat seal strength) were photographed using an electron microscope. In Example 3, a large amount of the sealant layer of the cover tape remained on the carrier tape side (FIG. 3). From this, it can be said that the peeling mode in Example 3 was cohesive peeling. In contrast, in Comparative Example 1, the sealant layer of the cover tape hardly remained on the carrier tape side (FIG. 4). From this, it can be said that the mode of peeling in Comparative Example 1 was interfacial peeling. [Explanation of symbols]

[0071] 1 Base material layer 2. Middle class 3 Sealant Layer 10 Cover Tape 20 Paper carrier tape 21 pockets 100 Electronic component packaging body

Claims

1. A cover tape for sealing a paper carrier tape, comprising a base layer and a sealant layer provided on one side of the base layer, the sealant layer is present on the outermost surface of the cover tape, A cover tape having a cohesive force F of 0.02 to 0.09 N / mm, determined by the following procedure. [procedure] (1) Prepare two pieces of the cover tape cut to a length of 200 mm and a width of 15 mm. (2) The sealant layers of the two cover tapes are brought into contact with each other and thermally bonded under conditions of a temperature of 180° C., a load of 15 N, and a time of 0.2 seconds, and then allowed to cool to room temperature. (3) The two cover tapes heat-bonded in (2) above are peeled apart at a constant peel angle of 180° and a peel speed of 300 mm / min. The average force measured is taken as the cohesive strength F.

2. 2. The cover tape of claim 1, The cover tape includes a sealant layer comprising a polyolefin resin (a) and at least one polystyrene resin (b) selected from the group consisting of a styrene monomer / aliphatic monomer copolymer, a styrene monomer / aromatic monomer copolymer, and an α-methylstyrene polymer.

3. 3. The cover tape according to claim 2, The cover tape, wherein the polyolefin resin (a) includes a polyethylene resin.

4. The cover tape according to claim 2 or 3, The cover tape has a value of Mb / Ma of 0.05 to 0.20, where Ma is the amount of the polyolefin resin (a) in the sealant layer and Mb is the amount of the polystyrene resin (b).

5. The cover tape according to claim 2 or 3, The cover tape has a content of the polystyrene-based resin (b) in the sealant layer of 4 to 12% by mass.

6. The cover tape according to claim 2 or 3, The cover tape has a sealant layer containing the polyolefin resin (a) in an amount of 45 to 95% by mass.

7. The cover tape according to claim 2 or 3, The cover tape, wherein the sealant layer further contains at least one resin (c) selected from the group consisting of poly(meth)acrylic resins and styrene-based monomer / (meth)acrylic monomer copolymers.

8. 8. The cover tape according to claim 7, The cover tape has a content of the resin (c) in the sealant layer of 5 to 30% by mass.

9. The cover tape according to claim 2 or 3, The cover tape, wherein the sealant layer further comprises an antistatic agent.

10. The cover tape according to any one of claims 1 to 3, The cover tape has a thickness of the sealant layer of 5 to 15 μm.

11. The cover tape according to any one of claims 1 to 3, The cover tape includes an intermediate layer between the base layer and the sealant layer.

12. A paper carrier tape having electronic components housed in recesses and the cover tape according to any one of claims 1 to 3, An electronic component package in which the sealant layer is adhered to the paper carrier tape so as to seal the electronic component.

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