Substrate processing apparatus and method for controlling substrate processing apparatus

Abstract

To provide a substrate processing apparatus and a method for controlling the substrate processing apparatus that can prevent a substrate from being scratched.SOLUTION: A substrate processing apparatus 1 includes a mapping sensor 43 and the like that acquires substrate shape information including information about the shapes of a plurality of substrates W, a transport robot IR having a hand 51, and a control unit. The control unit 81 controls the speed and acceleration of the hand 51 as follows when the hand 51 supporting a substrate W moves within a carrier C. The control unit 81 acquires the thickness of the substrate W using the substrate shape information, calculates the weight of the first substrate on the basis of the thickness, and determines the speed and acceleration of the hand when supporting the first substrate according to the weight of the first substrate. The control unit 81 moves the hand supporting the first substrate within the first slot using the determined speed and acceleration.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus for processing substrates and a method for controlling the substrate processing apparatus. Examples of the substrate include semiconductor substrates, FPD (Flat Panel Display) substrates, photomask glass substrates, optical disk substrates, magnetic disk substrates, ceramic substrates, and solar cell substrates. Examples of the FPD include liquid crystal display devices and organic EL (electroluminescence) display devices. [Background technology]

[0002] The substrate processing apparatus includes an indexer unit and a processing block (see, for example, Patent Document 1). The indexer unit includes a carrier placement unit and a transport mechanism. The transport mechanism transports a substrate from a carrier on the carrier placement unit. The transport mechanism includes a hand that supports one substrate in a horizontal position. The transport mechanism moves the hand. The speed and acceleration of the hand when the transport mechanism is not supporting a substrate are greater than the speed and acceleration of the hand when the transport mechanism is supporting a substrate.

[0003] Patent document 2 discloses that when a substrate stored in a substrate storage container is determined to be a special substrate (a wafer for temperature measurement, a wafer for pressure measurement, or a wafer for ion density detection) that is different from a product substrate based on the automatically determined type of substrate, the transport speed of the special substrate is controlled to be slower than the transport speed of the product substrate. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent Publication No. 2021-048359 [Patent Document 2] Patent No. 6697984 Summary of the Invention [Problem to be solved by the invention]

[0005] In recent years, substrates that do not comply with SEMI (Semiconductor Equipment and Materials International) standards (for example, substrates made by bonding two substrates together, or substrates with warpage) have been processed, and therefore transfer robots are required to be able to transport such substrates.

[0006] When transporting non-SEMI standard substrates, the clearance between two vertically adjacent substrates in the carrier may be smaller than when transporting SEMI standard substrates. Therefore, for example, when a hand enters the clearance between the two substrates, the hand may scratch the underside of the upper substrate. In this case, for example, particles may be generated, which may contaminate the substrate.

[0007] Furthermore, as the weight of the substrate increases, the up and down amplitude of the hand increases when the substrate is transported, which can cause the substrate to come into contact with a shelf in the carrier when the substrate is stored in the carrier, resulting in the substrate being scratched by the shelf.

[0008] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate processing apparatus and a method for controlling the substrate processing apparatus that can prevent a substrate from being scratched. [Means for solving the problem]

[0009] In order to achieve the above object, the present invention has the following configuration. That is, the substrate processing apparatus of the present invention for processing a plurality of substrates comprises: a carrier mounting section for mounting a carrier having a plurality of slots arranged vertically at a predetermined pitch; a substrate shape information acquisition section for acquiring substrate shape information including information on the shapes of the plurality of substrates stored in each of the plurality of slots; a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot removing the first substrate from a first slot of the plurality of slots by moving the hand horizontally and vertically, and storing the first substrate in the first slot; and a control section, wherein the control section controls the speed and acceleration of the hand when the hand supporting the first substrate moves within the carrier as follows: (1) acquires the thickness of the first substrate using the substrate shape information; (2) calculates the weight of the first substrate based on the thickness; (3) determines the speed and acceleration of the hand when supporting the first substrate according to the weight of the first substrate; and (4) moves the hand supporting the first substrate within the first slot using the determined speed and acceleration.

[0010] According to the substrate processing apparatus of the present invention, the thickness of the first substrate is obtained using substrate shape information, the weight of the first substrate is calculated based on the thickness, and the speed and acceleration of the hand when supporting the first substrate are determined according to the weight of the first substrate. As a result, vibrations due to the speed and acceleration of the hand can be suppressed, and the substrate can be prevented from being scratched inside the carrier.

[0011] In the substrate processing apparatus described above, the control unit preferably determines the velocity and acceleration of the hand such that the velocity and acceleration of the hand decrease as the weight of the first substrate increases, thereby determining the velocity and acceleration of the hand such that the velocity and acceleration of the hand decrease as the weight of the first substrate increases.

[0012] In the substrate processing apparatus described above, the control unit preferably determines the speed and acceleration of the hand supporting the first substrate so that the total amplitude of the hand vibrating up and down in response to the weight of the first substrate when the hand moves within the carrier, thereby determining the speed and acceleration of the hand so that the total amplitude of the hand vibrating up and down is within the slot height of the first slot.

[0013] In the substrate processing apparatus described above, the control unit preferably determines the speed and acceleration of the hand so that the total amplitude of the hand, which vibrates in the vertical direction in response to the weight of the first substrate, falls within a corrected height obtained by subtracting the slot height of the first slot by the thickness of the first substrate. The speed and acceleration of the hand can be determined based on the corrected height taking the thickness of the first substrate into consideration.

[0014] In the substrate processing apparatus, the control unit preferably determines the speed and acceleration of the hand using a lookup table, which makes it easy to determine the speed and acceleration of the hand.

[0015] In the substrate processing apparatus described above, an example of the substrate shape information acquisition unit is a photoelectric sensor. In the substrate processing apparatus described above, an example of the substrate shape information acquisition unit is a camera. The camera can collect information over a wide range, so that, for example, the clearance between two substrates can be obtained while grasping the state of warpage of the substrates.

[0016] Furthermore, in the above-mentioned substrate processing apparatus, it is preferable that the control unit controls the speed and acceleration of the hand when the hand not supporting a substrate moves within the carrier as follows: (1) using the substrate shape information, obtain the clearance between the first substrate stored in the first slot and the second substrate stored in a second slot of the plurality of slots adjacent to the lower side of the first slot; (2) determine the speed and acceleration of the hand so that the total amplitude of the hand vibrating in the vertical direction when the hand not supporting a substrate moves within the carrier is contained within the clearance; and (3) use the determined speed and acceleration to move the hand not holding a substrate between the first substrate and the second substrate.

[0017] The speed and acceleration of the hand are determined so that the total amplitude of the hand not supporting the substrate falls within the clearance, thereby suppressing vibrations caused by the speed and acceleration of the hand and preventing the hand from scratching the substrate.

[0018] In the substrate processing apparatus described above, the control unit preferably determines the speed and acceleration of the hand so that the total amplitude of the hand not supporting a substrate falls within a corrected clearance obtained by subtracting the thickness of the hand from the clearance. The speed and acceleration of the hand can be determined based on the corrected clearance that takes the thickness of the hand into consideration.

[0019] Also, a substrate processing apparatus according to the present invention for processing a plurality of substrates includes a carrier placement unit for placing a carrier having a plurality of slots arranged vertically at a preset pitch; a substrate shape information acquisition unit for acquiring substrate shape information including information on the shapes of the plurality of substrates stored in each of the plurality of slots; a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot removing the first substrate from a first slot of the plurality of slots by moving the hand horizontally and vertically, and storing the first substrate in the first slot; and a control unit, wherein the control unit is configured to control the hand not supporting a substrate to be in a forward position. When moving within the carrier, the speed and acceleration of the hand are controlled as follows: (1) using the substrate shape information, the clearance between the first substrate stored in the first slot and the second substrate stored in a second slot of the plurality of slots adjacent to the lower side of the first slot is obtained; (2) when the hand not supporting a substrate moves within the carrier, the speed and acceleration of the hand are determined so that the total amplitude of the hand vibrating in the vertical direction is contained within the clearance; and (3) using the determined speed and acceleration, the hand not holding a substrate is moved between the first substrate and the second substrate.

[0020] Also, according to the present invention, there is provided a method for controlling a substrate processing apparatus for processing a plurality of substrates, the substrate processing apparatus including: a carrier placement unit for placing a carrier having a plurality of slots arranged vertically at a preset pitch; a substrate shape information acquisition unit for acquiring substrate shape information including information on the shapes of the plurality of substrates stored in each of the plurality of slots; and a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot moving the hand in horizontal and vertical directions to remove the first substrate from a first slot of the plurality of slots and store the first substrate in the first slot. and the control method includes the steps of controlling the speed and acceleration of the hand supporting the first substrate when the hand moves within the carrier through the following steps: (1) a thickness acquisition step of acquiring a thickness of the first substrate using the substrate shape information; (2) a weight calculation step of calculating a weight of the first substrate based on the thickness; (3) a determination step of determining the speed and acceleration of the hand when supporting the first substrate according to the weight of the first substrate; and (4) a hand movement step of moving the hand supporting the first substrate within the first slot using the determined speed and acceleration.

[0021] Further, the present invention provides a control method for a substrate processing apparatus for processing a plurality of substrates, the substrate processing apparatus comprising: a carrier placement unit for placing a carrier having a plurality of slots arranged vertically at a preset pitch; a substrate shape information acquisition unit for acquiring substrate shape information including information on the shapes of the plurality of substrates stored in each of the plurality of slots; and a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot removing the first substrate from a first slot of the plurality of slots by moving the hand horizontally and vertically, and storing the first substrate in the first slot, the control method comprising: The method is characterized in that it includes controlling the speed and acceleration of the hand through the following steps: (1) a clearance amount acquisition step that uses the substrate shape information to acquire the clearance between the first substrate stored in the first slot and the second substrate stored in a second slot of the plurality of slots adjacent to the lower side of the first slot; (2) a determination step that determines the speed and acceleration of the hand so that the total amplitude of the hand vibrating in the vertical direction when the hand not supporting a substrate moves within the carrier is within the clearance; and (3) a hand movement step that uses the determined speed and acceleration to move the hand not holding a substrate between the first substrate and the second substrate. [Effects of the Invention]

[0022] According to the substrate processing apparatus and the method for controlling the substrate processing apparatus of the present invention, it is possible to prevent the substrate from being scratched. [Brief explanation of the drawings]

[0023] [Figure 1] 1 is a plan view showing a substrate processing apparatus according to a first embodiment. [Figure 2] FIG. [Figure 3] FIG. [Figure 4]FIG. [Figure 5] 1A is a longitudinal cross-sectional view showing a normal substrate, FIG. 1B is a longitudinal cross-sectional view showing a thick-rimmed substrate, and FIG. 1C is a longitudinal cross-sectional view showing a bonded substrate. [Figure 6] 1 is a vertical cross-sectional view showing a substrate processing apparatus according to a first embodiment. [Figure 7] FIG. [Figure 8] FIG. 10 is a plan view showing the mapping sensor positioned at a standby position. [Figure 9] FIG. 4 is a plan view showing a mapping sensor located at a detection position. [Figure 10] FIG. 2 is a block diagram showing a control system of the substrate processing apparatus. [Figure 11] 10 shows the evaluation results showing the relationship between the weight of the substrate and the total amplitude of the hand when the moving speed and acceleration of the hand are changed. [Figure 12] 10 is a flowchart illustrating an operation of the substrate processing apparatus. [Figure 13] FIG. 10 is a vertical cross-sectional view for explaining a mapping operation. [Figure 14] FIG. 10 is a diagram showing an example of board shape information. [Figure 15] 13 is a flowchart showing details of the operation of step S03 in FIG. 12. [Figure 16] FIG. 10 is a diagram showing the relationship between the weight of the substrate and the hand for each of a plurality of combinations of speed and acceleration. [Figure 17] FIG. 1 is a diagram for explaining velocity and acceleration. [Figure 18] FIG. [Figure 19] 13 is a flowchart showing details of the operation of step S04 in FIG. 12. [Figure 20] FIG. 10 is a vertical cross-sectional view illustrating the forward movement of a hand that is not supporting any substrate. [Figure 21] 10 is a longitudinal cross-sectional view illustrating a retreating operation of a hand supporting a substrate. FIG. [Figure 22]FIG. 10 is a vertical cross-sectional view illustrating the forward movement of the hand supporting the substrate. [Figure 23] FIG. 10 is a vertical cross-sectional view illustrating the retreating operation of a hand that is not supporting any substrate. [Figure 24] FIG. 10 is a vertical cross-sectional view showing a substrate processing apparatus according to a second embodiment. [Figure 25] 10A is a diagram for explaining a corrected height according to a modified example, and FIG. 10B is a diagram for explaining a corrected clearance according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0024] Examples of the present invention will be described below. [Example]

[0025] A first embodiment of the present invention will be described below with reference to the drawings. Fig. 1 is a plan view showing a substrate processing apparatus according to the first embodiment. When substrates W1 to W25 are not distinguished from one another, they will be called "substrate W." When normal substrates WA, thick-edge substrates WB, and bonded substrates WC are not distinguished from one another, they will also be called "substrate W." When clearances CL1 to CL24 are not distinguished from one another, they will be called "clearance CL."

[0026] For convenience, in this specification, the direction in which the indexer block 3 and the processing block 5 are aligned is referred to as the "front-rear direction X." The front-rear direction X is horizontal. Within the front-rear direction X, for example, the direction from the processing block 5 toward the indexer block 3 is referred to as the "front." The direction opposite to the front is referred to as the "rear." The horizontal direction perpendicular to the front-rear direction X is referred to as the "width direction Y." One direction in the "width direction Y" is referred to as the "right" as appropriate. The direction opposite to the right is referred to as the "left." The direction perpendicular to the horizontal direction is referred to as the "vertical direction Z." For reference, in each figure, front, rear, right, left, top, and bottom are indicated as appropriate.

[0027] <1. Configuration of the substrate processing apparatus> 1, the substrate processing apparatus 1 processes a substrate W. The substrate processing apparatus 1 includes an indexer block 3 and a processing block 5.

[0028] <1-1. Indexer Block> The indexer block 3 includes a plurality of (for example, two) carrier placement units 7, a transport robot IR, a housing 9, and a plurality of (for example, two) lid attachment / detachment units 11.

[0029] A carrier C is placed on each carrier placement section 7. The carrier C stores a plurality of substrates W (e.g., 25 substrates W) in a horizontal position and arranged in the vertical direction Z at a preset pitch (e.g., 10 mm (millimeter) pitch). For example, a FOUP (Front Opening Unify Pod) is used as the carrier C, but is not limited to this. For example, the carrier may be what is called a cassette (open cassette) that does not have a lid 17 (described below) that covers an extraction opening 15 (described below).

[0030] <1-1-1. Career> Figure 2 is a cross-sectional view of carrier C. Figure 3 is a front view of carrier C. Carrier C comprises a container 13, an outlet 15, and a lid 17. Container 13 stores multiple substrates W. Outlet 15 is provided on the front of container 13. Outlet 15 is an opening for loading and unloading multiple substrates W. Substrates W in container 13 of carrier C are removed through outlet 15. Substrates W are also stored through outlet 15. When carrier C is transported, outlet 15 is closed by lid 17.

[0031] Furthermore, the carrier C has a plurality of shelves 19 and a plurality of slots. In this embodiment, for example, the carrier C has 25 shelves 19 and 25 slots SL1 to SL25. The container 13 has 25 shelves 19 therein.

[0032] The 25 shelves 19 are arranged in the vertical direction Z at a preset pitch (for example, 10 mm pitch). Each shelf 19 includes a pair of shelves 19A, 19B. Therefore, the carrier C includes 25 pairs of shelves 19A, 19B. As shown in FIG. 3, the shelf 19A is provided on the left inner wall 13A of the container 13, and the shelf 19B is provided on the right inner wall 13B of the container 13. One substrate W is placed on each shelf 19 (each pair of shelves 19A, 19B).

[0033] As shown in FIG. 3, a groove-shaped space between two shelves 19 adjacent in the vertical direction Z is called a "slot." In the case of the top shelf 19, the space above the top shelf 19 is called a "slot." The 25 slots SL1 to SL25 are arranged in the vertical direction Z at a preset pitch (for example, a 10 mm pitch). The lowest slot is slot SL1, and the top slot is slot SL25. The 25 slots SL1, SL2, SL3, . . . SL23, SL24, SL25 are arranged upward in this order. Each of the 25 slots SL1 to SL25 stores 25 substrates W.

[0034] <1-1-2. Types of circuit boards> Here, the types of substrate W will be described. Fig. 4 is a plan view of the substrate W. The basic shape of the substrate W will be described. The substrate W is formed in a disk shape. The substrate W has a peripheral portion 21 and a main portion 23. The main portion 23 is a portion located inside the peripheral portion 21. In Fig. 4, the boundary between the peripheral portion 21 and the main portion 23 is indicated by a dashed line.

[0035] 5(a) to 5(c), the substrates W are classified into several types depending on their shapes. For example, the substrates W include normal substrates WA, thick-rimmed substrates WB, and bonded substrates WC.

[0036] See FIG. 5(a). The normal substrate WA is a normal circular substrate with a uniform thickness. That is, the normal substrate WA is a substrate in which the thickness of the peripheral portion 21 is the same as the thickness of the main portion 23. The normal substrate WA is formed of, for example, silicon. The normal substrate WA is a substrate W that complies with the SEMI standard. For example, the diameter of the normal substrate WA is 300 mm, and its thickness is 0.775 mm.

[0037] See Figure 5(b). The thick-rimmed substrate WB is a circular substrate with a thick peripheral edge 21 and a thin inner portion (main portion 23). The upper surface of the main portion 23 is subjected to a back-grinding process. As shown in Figure 5(b), a flexible resin film FM may be attached to the lower surface of the thick-rimmed substrate WB, or the resin film FM may be absent. The resin film FM is bonded to the thick-rimmed substrate WB via an adhesive layer 25. The resin film FM is formed in a disk shape. The thickness of the resin film FM is, for example, approximately the same as the thickness of the main portion 23. The lower surface of the thick-rimmed substrate WB is the device surface (semiconductor device surface) on which devices are formed.

[0038] See Figure 5(c). The bonded substrate WC has a thick-edged substrate 27 and a support substrate 29. The thick-edged substrate 27 is configured in a manner similar to the thick-edged substrate WB without a resin film shown in Figure 5(b). A device is formed on the underside of the thick-edged substrate 27. The thick-edged substrate 27 is made of, for example, silicon. The support substrate 29 is bonded to the underside of the thick-edged substrate 27. The support substrate 29 is adhered to the thick-edged substrate 27 via an adhesive layer 25. The support substrate 29 is made of glass.

[0039] <1-1-3. Lid attachment / detachment unit and mapping sensor> See Figures 1, 6 and 7. The two carrier mounting sections 7 are arranged in the front portion of the indexer block 3. That is, the two carrier mounting sections 7 are provided on the outside of the front wall section 9A of the housing 9. The wall section 9A has a passage opening 31 at a position corresponding to the removal opening 15 of the carrier C mounted on the carrier mounting section 7. Therefore, the wall section 9A has two passage openings 31 (see Figure 1). Each passage opening 31 is formed to be approximately the same size as the removal opening 15.

[0040] Each passage opening 31 is opened and closed by a shutter portion 33 of the lid attaching / detaching portion 11. Each of the two lid attaching / detaching portions 11 includes a shutter portion 33, a shutter advance / retreat portion 35, a shutter lifting / lowering portion 37, and a height sensor 38. The shutter portion 33 further removes the lid portion 17 from the carrier C and attaches the lid portion 17 to the carrier C. The shutter portion 33 holds the removed lid portion 17.

[0041] The shutter advancing / retreating unit 35 advances and retreats the shutter unit 33 in the front-to-rear direction X. The shutter lifting / lowering unit 37 moves the shutter unit 33 in the vertical direction Z, and also moves a mapping sensor 43 (described later) in the vertical direction Z. The shutter advancing / retreating unit 35 and the shutter lifting / lowering unit 37 each include a screw shaft 39, a guide rail 40, and an electric motor (not shown). The height sensor 38 is configured by, for example, a linear encoder or a rotary encoder. The height sensor 38 measures the height position of the shutter unit 33 and also measures the height position of the mapping sensor 43 (described later) in the vertical direction Z.

[0042] 8 and 9, the indexer block 3 further includes a mapping sensor 43 and a sensor moving unit 45. The mapping sensor 43 is provided on the upper surface of the shutter unit 33 via the sensor moving unit 45. The sensor moving unit 45 includes a sensor support member 47.

[0043] The sensor support member 47 is formed in a C-shape. The mapping sensor 43 includes a light projector 43A and a light receiver 43B. The light projector 43A is provided at a first end of the C-shaped sensor support member 47, and the light receiver 43B is provided at a second end of the sensor support member 47. The light projector 43A and the light receiver 43B face each other. An optical axis LT connecting the light projector 43A and the light receiver 43B extends horizontally in the width direction Y.

[0044] The sensor moving unit 45 includes a guide rail, a screw shaft, and an electric motor (all not shown). The sensor moving unit 45 moves the mapping sensor 43 into the carrier C placed on the carrier placement unit 7. In FIG. 8, the mapping sensor 43 has been moved to a standby position by the sensor moving unit 45. In contrast, in FIG. 9, the mapping sensor 43 has been moved to a detection position by the sensor moving unit 45. At this time, the optical axis LT of the mapping sensor 43 extending in the width direction Y intersects with the peripheral edge of the substrate W in a plan view.

[0045] The light emitted from the light-emitter 43A is received by the light-receiver 43B. When the light-receiver 43B receives the light, it detects that there is no substrate W on the optical axis LT. Furthermore, if the light emitted from the light-emitter 43A is blocked by the substrate W, the light-receiver 43B cannot receive the light. In this case, the light-receiver 43B detects that there is a substrate W on the optical axis LT. At the detection position, the mapping sensor 43, in which the light-emitter 43A and the light-receiver 43B are in operation, is moved in the vertical direction Z. This allows substrate shape information, which is information on the shapes of the 25 substrates W stored in each of the 25 slots SL1 to SL25 of the carrier C (information on the presence or absence of 25 substrates W within a predetermined range in the vertical direction Z), to be acquired.

[0046] It should be noted that although a transmission type photoelectric sensor, for example, is used as the mapping sensor 43, a reflection type photoelectric sensor may also be used. The height sensor 38 and mapping sensor 43 correspond to the board shape information acquisition unit of the present invention.

[0047] <1-1-4.Transport robot> See Figures 1 and 6. The transport robot IR is, for example, a horizontal articulated robot that transports a substrate W. The transport robot IR is equipped with a hand 51. The hand 51 can support one substrate W in a horizontal position. The transport robot IR moves the hand 51 in the horizontal direction (front-rear direction X and width direction Y) and the vertical direction Z. This allows the transport robot IR to take out a substrate W25 from, for example, slot SL25 of the 25 slots SL1 to SL25 of the carrier C, and store a substrate W in slot SL25.

[0048] In addition to the hand 51, the transport robot IR includes an articulated arm 53, a lifting platform 55, and a height sensor 57. The hand 51 is connected to the tip end of the articulated arm 53. The base end of the articulated arm 53 is connected to the lifting platform 55 so as to be rotatable around a vertical axis. The articulated arm 53 moves the hand 51 in the horizontal direction and changes the orientation of the hand 51. The lifting platform 55 moves the hand 51 and the articulated arm 53 in the vertical direction Z. The articulated arm 53 and the lifting platform 55 each include, for example, an electric motor. The height sensor 57 measures the height position of the hand 51 in the vertical direction Z. The height sensor 57 is configured, for example, by a linear encoder or a rotary encoder.

[0049] <1-2. Processing block> Referring to Figure 1, the processing block 5 includes a plurality of processing units 61, a center robot CR, and a substrate platform PS. The substrate platform PS is provided between the transport robot IR and the center robot CR. The substrate platform PS can place one or more substrates W thereon.

[0050] The processing units 61 perform a predetermined process on the substrate W. For example, each processing unit 61 includes a holding / rotating part 63 and a nozzle 65. The holding / rotating part 63 includes a spin chuck that holds one substrate W in a horizontal position, and an electric motor that rotates the spin chuck around a vertical axis that passes through the center of the substrate W. The nozzle 65 ejects a processing liquid onto the upper surface of the substrate W held by the holding / rotating part 63.

[0051] The center robot CR has a hand 67 that supports one substrate W in a horizontal position. The center robot CR can move the hand 67. The center robot CR can transport the substrate W between the plurality of processing units 61 and the substrate platform PS.

[0052] In addition to the hand 67, the center robot CR is equipped with an advancing / retreating unit 69 and an elevation / rotation unit 71. The advancing / retreating unit 69 moves the hand 67 forward and backward. The elevation / rotation unit 71 rotates the hand 67 and the advancing / retreating unit 69 about a vertical axis AX1 to change the orientation of the hand 67. The elevation / rotation unit 71 also raises and lowers the hand 67 and the advancing / retreating unit 69 in the vertical direction Z. The advancing / retreating unit 69 and the elevation / rotation unit 71 each include one or more electric motors. The advancing / retreating unit 69 also includes, for example, a screw shaft and a guide rail.

[0053] <1-3. Control system of substrate processing equipment> 10 is a block diagram showing a control system of the substrate processing apparatus 1. The substrate processing apparatus 1 includes a control unit 81 and a storage unit 83. The control unit 81 controls each component of the substrate processing apparatus 1 (e.g., the transport robot IR and the lid attaching / detaching unit 11). The control unit 81 includes one or more processors, such as a central processing unit (CPU). The storage unit 83 includes at least one of a read-only memory (ROM), a random-access memory (RAM), and an auxiliary storage device (e.g., a hard disk). The storage unit 83 stores computer programs required to control each component of the substrate processing apparatus 1.

[0054] Here, an overview of the characteristics of this embodiment will be described. Fig. 11 shows evaluation results showing the relationship between the weight of the substrate W and the total amplitude (total amplitude and peak to peak amplitude) of the hand when the moving speed and acceleration of the hand are changed. The horizontal axis represents the weight of the substrate W (gf: gram force). The vertical axis represents the total amplitude (mm) in the vertical direction Z. In the evaluation of Fig. 11, the transport robot IR has two hands 51 of different heights.

[0055] In addition, "100%, 100%" in FIG. 11 respectively indicate 100% of the preset speed and 100% of the preset acceleration. The shaded circular mark "100%, 100%, UP" indicates "100% speed, 100% acceleration, upper hand." Furthermore, the black triangular mark "100%, 100%, LW" indicates "100% speed, 100% acceleration, lower hand."

[0056] Also, "50%, 50%" in FIG. 11 indicates a speed that is 50% of the preset speed and an acceleration that is 50% of the preset acceleration, respectively. The white circular mark "50%, 50%, UP" indicates "50% speed, 50% acceleration, upper hand." The white triangular mark "50%, 50%, LW" indicates "50% speed, 50% acceleration, lower hand."

[0057] The evaluation results in Figure 11 show that the total amplitude increases as the weight of the substrate W increases. It can also be seen that the total amplitude increases as the speed and acceleration increase. In Figure 11, the weight of the standard substrate WA in the SEMI standard shown in Figure 5(a) is 125 gf.

[0058] 11, when the hand 51 is not supporting the substrate W, the control unit 81 moves the hand 51 as follows. For example, when the clearance between two substrates W is small, the control unit 81 moves the hand 51 while reducing the speed and acceleration of the hand 51. This makes it possible to suppress vibration of the hand 51.

[0059] Furthermore, when the hand 51 supports the substrate W, the hand 51 is moved as follows: The control unit 81 calculates the weight (estimated weight) of the substrate W from the thickness (mm) of the substrate W, and determines the speed and acceleration of the hand 51 so that the speed and acceleration of the hand 51 decrease as the weight of the substrate W increases. Then, the control unit 81 moves the hand 51 at the determined speed and acceleration. This makes it possible to suppress vibration of the hand 51.

[0060] The memory unit 83 also stores the diameter of the substrate W (e.g., 300 mm), substrate shape information SH, the slot height SHT of each slot in the vertical direction Z, information on the type of each substrate W stored in the carrier C, substrate information in the carrier C, the thickness TK of the substrate W, the clearance CL, the weight of the substrate W, and the speed and acceleration of the hand 51.

[0061] <2. Operation of the substrate processing device> The operation of the substrate processing apparatus 1 will be described with reference to the flowchart of Fig. 12. A carrier C is placed on the carrier mounting part 7 shown in Fig. 1.

[0062] Carrier C stores 25 substrates W to be used as products. The 25 substrates W include at least one type of substrate: normal substrates WA, thick-edge substrates WB, and bonded substrates WC. For example, the 25 substrates W may be a mixture of normal substrates WA, thick-edge substrates WB, and bonded substrates WC. Alternatively, the 25 substrates W may be composed of 25 bonded substrates WC. A host computer (not shown) may transmit information about the type of each substrate W stored in carrier C to substrate processing apparatus 1.

[0063] [Step S01] Mapping The lid attaching / detaching unit 11 shown in FIG. 6 uses the shutter unit 33 to remove the lid unit 17 of the carrier C placed on the carrier placement unit 7 from the container 13 of the carrier C. Then, while the shutter unit 33 holds the lid unit 17, the shutter advance / retract unit 35 of the lid attaching / detaching unit 11 moves the shutter unit 33 rearward (retracts) so as to move away from the carrier C. This opens the passage opening 31 in the wall 9A. Then, the shutter lifting / lowering unit 37 of the lid attaching / detaching unit 11 slightly lowers the shutter unit 33 to a height position that allows the mapping sensor 43 to enter the carrier C.

[0064] Thereafter, the sensor moving unit 45 moves the mapping sensor 43 forward (forward) from the standby position shown in FIG. 8 to the detection position shown in FIG. 9. As a result, the mapping sensor 43 enters the carrier C on the carrier mounting unit 7. Thereafter, as shown in FIG. 13, the lid attaching / detaching unit 11, with the mapping sensor 43 activated, causes the shutter lifting / lowering unit 37 to lower the shutter unit 33 and the mapping sensor 43. This performs the mapping operation. Note that the mapping operation may also be performed by raising the mapping sensor 43.

[0065] Through the mapping operation, the mapping sensor 43 and the height sensor 38 acquire, for example, substrate shape information SH shown in FIG. 14. The substrate shape information SH includes information on the shapes of the 25 substrates W stored in the 25 slots SL1 to SL25, respectively. Specifically, when the light receiver 43B detects light from the light projector 43A of the mapping sensor 43, the light receiver 43B detects that the substrate W is not on the optical axis LT. Furthermore, when the light receiver 43B does not detect light from the light projector 43A, the light receiver 43B detects that the substrate W is on the optical axis LT. Furthermore, the height position of the mapping sensor 43, i.e., the optical axis LT, is measured by the height sensor 38. The acquired substrate shape information SH is stored in the memory unit 83.

[0066] [Step S02] Obtaining the thickness of the substrate and the clearance between two adjacent substrates The control unit 81 uses the substrate shape information SH to obtain the thicknesses TK (mm: millimeters) of the 25 substrates W. Specifically, the control unit 81 obtains the 25 thicknesses TK (TK1 to TK25) of the 25 substrates W from the substrate shape information SH stored in the storage unit 83, as shown in FIG.

[0067] For example, in the case of the thick-rimmed substrate WB shown in Fig. 5(b), the total thickness TK of the thick-rimmed substrate WB and the resin film FM is obtained. In the case of the bonded substrate WC shown in Fig. 5(c), the total thickness TK of the thick-rimmed substrate 27 and the support substrate 29 is obtained.

[0068] 14, the control unit 81 uses the substrate shape information SH to obtain, for example, a clearance CL24 (mm) between a substrate W25 stored in a slot SL25 and a substrate W24 stored in an adjacent slot SL24 below the slot SL25. Specifically, the control unit 81 obtains 24 clearances CL1 to CL24 between two adjacent substrates W in all combinations of the 25 substrates W.

[0069] [Step S03] Determining the speed and acceleration of the hand when supporting the substrate The operation of step S03 will be described with reference to the flowchart of FIG.

[0070] [Step S31] Calculate the weight of the board The control unit 81 calculates the weight of the substrate W based on the calculated thickness TK of the substrate W. For example, if the substrate W is a normal substrate WA, a thick-edge substrate WB, or a bonded substrate WC shown in Figures 5(a) to 5(c), the weight is calculated using the following equations (1) to (3). The memory unit 83 stores information about the substrates in the carrier C sent from the host computer.

[0071] Weight of normal substrate WA = (thickness TK of normal substrate WA) × (diameter of normal substrate WA) × (specific gravity of normal substrate WA) Equation (1) Weight of thick-edged substrate WB = {(total thickness TK of thick-edged substrate WB and resin film FM) - (thickness of resin film FM)} x (diameter of thick-edged substrate WB) x (specific gravity of thick-edged substrate WB) - (weight of grinding space GR1) + (weight of resin film FM) Formula (2) Weight of bonded substrate WC=(total thickness TK of thick-edge substrate 27 and support substrate 29)×(diameter of thick-edge substrate 27)×(specific gravity of thick-edge substrate 27)−(weight of grinding space GR2) Equation (3)

[0072] For example, suppose carrier C stores normal substrates WA, thick-edge substrates WB, and bonded substrates WC. In this case, the substrate information in carrier C includes the diameter and specific gravity of normal substrate WA. For thick-edge substrate WB, the substrate information in carrier C includes, in addition to the diameter and specific gravity, the weight of the grinding space GR1, the weight of resin film FM, and the thickness of resin film FM. For bonded substrate WC, the substrate information in carrier C includes, in addition to the diameter and specific gravity of thick-edge substrate 27, the weight of the grinding space GR2. Note that when support substrate 29 is made of glass, the specific gravity of support substrate 29 is approximately the same as the specific gravity of thick-edge substrate 27.

[0073] The calculated weights of the substrates W (the weight of the normal substrate WA, the weight of the thick-edge substrate WB, and the weight of the bonded substrate WC) are stored in the storage unit 83.

[0074] [Step S32] Obtaining the total amplitude of the hand The control unit 81 determines the speed and acceleration of the hand 51 supporting the substrate W so that the total amplitude of vibration in the up-and-down direction (vertical direction Z) according to the weight of the substrate W falls within, for example, the slot height SHT of the slot SL25. This operation will be described in detail. First, the total amplitude of the hand 51 corresponding to the weight of the substrate W is obtained. FIG. 16 is a diagram showing the relationship between the weight of the substrate W and the hand 51 for each of a plurality of speed and acceleration conditions SA10 to SA6. FIG. 16 is also a two-dimensional lookup table LUT that determines the speed and acceleration conditions SA10 to SA6 of the hand 51 from the weight of the substrate W and the clearance (slot height). FIG. 17 is a diagram for explaining the speed and acceleration. FIG. 18 is a diagram showing the total amplitude.

[0075] The condition SA10 is a speed that is 100% of a preset normal speed SP10 (i.e., normal speed SP10) and a speed that is 100% of a preset normal acceleration AC10 (i.e., normal acceleration AC10). The condition SA9 is a speed SP9 that is 90% of the normal speed SP10 and an acceleration AC9 that is 90% of the normal acceleration AC10. The condition SA7 is a speed SP7 that is 70% of the normal speed SP10 and an acceleration AC7 that is 70% of the normal acceleration AC10.

[0076] The same applies to conditions SA8 and SA6. Therefore, the following relationships exist: normal speed SP10 > speed SP9 > speed SP8 > speed SP7 > speed SP6. Also, normal acceleration AC10 > acceleration AC9 > acceleration AC8 > acceleration AC7 > acceleration AC6 (see Figure 17).

[0077] 16, for example, when the substrate W has a weight WT1, the control unit 81 acquires total amplitudes MA10, MA9, MA8, MA7, and MA6 as candidates for the total amplitude. Also, for example, when the substrate W has a weight WT2, the control unit 81 acquires total amplitudes MB10, MB9, MB8, MB7, and MB6 as candidates for the total amplitude.

[0078] [Step S33] Determine the speed and acceleration so that the total amplitude is less than the slot height The 25 slot heights SHT (see FIG. 13) of the 25 slots SL1 to SL25 are the same size. For example, each of the 25 slot heights SHT is 6 mm. The control unit 81 acquires the slot heights SHT from the storage unit 83.

[0079] 16, for example, when the substrate W has a weight WT1, all five amplitudes MA10 to MA6 are less than the slot height SHT. Therefore, the control unit 81 determines the normal speed SP10 and normal acceleration AC10 of the condition SA10, which are closest to the slot height SHT, as the speed and acceleration of the hand 51.

[0080] Furthermore, for example, when the substrate W has a weight WT2, all four amplitudes MB9 to MB6 are less than the slot height SHT, so the control unit 81 determines the speed SP9 and acceleration AC9 of the condition SA9, which are closest to the slot height SHT, as the speed and acceleration of the hand 51.

[0081] 16, the speed and acceleration of the hand 51 may be determined from the weight of the substrate W and the slot height SHT. In this case, for example, one condition SA9 for speed and acceleration is acquired from the weight WT2 of the substrate W and the slot height SHT. The speed and acceleration of the hand 51 are determined for each of the 25 substrates W.

[0082] [Step S34] Are there no solutions for velocity and acceleration? If the control unit 81 cannot determine the speed and acceleration that provide a solution, it may stop the transport of the substrate W by the transport robot IR and notify the operator of this by means of an alarm unit (for example, a buzzer, lamp, or display).

[0083] [Step S04] Determining the speed and acceleration of the hand when the substrate is not supported The operation in step S04 will be described with reference to FIG.

[0084] [Step S41] Obtaining the total amplitude of the hand The control unit 81 determines the speed and acceleration of the hand 51 so that the total amplitude of the hand 51 not supporting any substrate W falls within the clearance CL24 (CL). This operation will be described in detail. First, the total amplitude of the hand 51 corresponding to the weight of the hand 51 not supporting any substrate W is obtained.

[0085] 16. When the hand 51 is not supporting any substrate W, the weight WT3 of the substrate W is 0 (zero) grab weight (gf). When the substrate W has weight WT3 (0 gf), the control unit 81 acquires total amplitudes MC10, MC9, MC8, MC7, and MC6 as candidates for the total amplitude.

[0086] [Step S42] Determine the speed and acceleration so that the total amplitude is less than the clearance The control unit 81 reads out 24 clearances CL (CL1 to CL24) from the storage unit 83. When the substrate W has a weight WT3 (0 gf), the total amplitudes MC7 and MC6 are less than, for example, the clearance CL24. Therefore, the control unit 81 determines the speed SP7 and acceleration AC7 of the condition SA7 that is closest to the clearance CL24 as the speed and acceleration of the hand 51. The control unit 81 similarly determines the speed and acceleration of the hand 51 for each of the remaining 23 clearances CL1 to CL23.

[0087] [Step S43] Are there no solutions for velocity and acceleration? If the control unit 81 cannot determine the speed and acceleration that provide a solution, it may stop the transport of the substrate W by the transport robot IR and notify the operator of this by means of an alarm unit (for example, a buzzer, lamp, or display).

[0088] [Step S05] Transferring the substrate from the carrier The control unit 81 moves the hand 51 using the speed and acceleration determined in steps S03 and S04. The control unit 81 also controls the transport robot IR to take out the substrate W from the carrier C placed on the carrier platform 7 and transport the substrate W to the substrate platform PS. This operation will now be described in detail.

[0089] 20, the control unit 81 advances the hand 51 that is not holding any of the substrates W using, for example, the speed SP7 and acceleration AC7 determined in step S04, and then causes the hand 51 to enter between the two substrates W25, W24. The hand 51 is moved at a speed SP7 that is 70% of the normal speed SP10 and at an acceleration AC7 that is 70% of the normal speed AC10. This prevents the speed and acceleration of the hand 51 from being reduced too much, thereby suppressing vibration and preventing the substrates W from being scratched.

[0090] See Figure 21. Thereafter, the control unit 81 raises the hand 51 to receive the substrate W25 from the slot SL25. Thereafter, the control unit 81 moves the substrate W25 within the slot SL25 using, for example, the speed SP9 and acceleration AC9 determined in step S03, while retracting the hand 51 supporting the substrate W25. This removes the substrate W25 from the carrier C. At this time, the hand 51 moves at a speed SP9 that is 90% of the normal speed SP10 and an acceleration AC9 that is 90% of the normal speed AC10. Therefore, vibration can be suppressed without reducing the speed and acceleration of the hand 51 too much, thereby preventing the substrate W from being scratched.

[0091] Thereafter, the control unit 81 transports the substrate W25 taken out of the carrier C to the substrate rest part PS. At this time, the hand 51 may transport it at a normal speed SP10 and a normal acceleration AC10. The remaining 24 substrates W in the carrier C are also transported from the carrier C to the substrate rest part PS in the same way. Note that the 25 substrates W are taken out of the carrier C in order from top to bottom, but the order in which the 25 substrates W are taken out is not limited to this.

[0092] [Step S06] Substrate processing The center robot CR in the processing block 5 receives the substrate W from the substrate rest part PS and transports the substrate W to one of the plurality of processing units 61. Each processing unit 61 performs a predetermined process (e.g., cleaning process) on the transported substrate W. Thereafter, the center robot CR receives the processed substrate W from the plurality of processing units 61 and returns the substrate W to the substrate rest part PS.

[0093] [Step S07] Transferring the substrate to the carrier The transport robot IR of the indexer block 3 receives, for example, a substrate W25 from the substrate platform PS and returns the substrate W25 to the slot SL25 of the carrier C on the carrier platform 7. The transport robot IR transports the substrate W25 supported by the hand 51 from the substrate platform PS to near the carrier C.

[0094] See Fig. 22. Thereafter, the control unit 81 causes the substrate W25 to enter the carrier C using the speed SP9 and acceleration AC9 determined in step S03, and also causes the hand 51 supporting the substrate W25 to advance while moving the substrate W25 within the slot SL25. At this time, the hand 51 is moved at a speed SP9 that is 90% of the normal speed SP10 and at an acceleration AC9 that is 90% of the normal acceleration AC10. This prevents the substrate W25 from being scratched.

[0095] See Figure 23. Thereafter, the control unit 81 lowers the hand 51 by a preset distance, thereby placing the substrate W supported by the hand 51 on the shelf 19 at the bottom of the slot SL25. Thereafter, the control unit 81 uses the speed SP7 and acceleration AC7 determined in step S04 to retract the hand 51 that is not holding any substrate W, and causes the hand 51 to withdraw from the carrier C.

[0096] At this time, if the substrate W24 is stored in the slot SL24, the hand 51 that is not holding any of the substrates W is retracted between the two substrates W25, W24. This prevents the two substrates W25, W24 from being caught by the hand 51. Also, if no substrate W is stored in the slot SL24, the hand 51 that is not holding any of the substrates W is retracted between the substrate W25 and the substrate W24 that is assumed to be present. This prevents the substrate W25 from being caught by the hand 51.

[0097] The control unit 81 similarly transports the remaining 24 substrates W from the substrate platform PS to the carrier C. When all 25 processed substrates W are stored in the carrier C, the lid attaching / detaching unit 11 closes the removal opening 15 of the carrier C with the lid unit 17. Thereafter, the carrier C is transported from the carrier platform 7.

[0098] According to this embodiment, the thickness TK of the substrate W is obtained using the substrate shape information SH, the weight of the substrate W is calculated based on the thickness TK, and the speed and acceleration of the hand 51 when supporting the substrate W are determined according to the weight of the substrate W. Therefore, vibrations due to the speed and acceleration of the hand 51 can be suppressed, and the substrate W can be prevented from being scratched inside the carrier C.

[0099] Furthermore, the speed and acceleration of the hand 51 are determined so that the speed and acceleration of the hand 51 decrease as the weight of the substrate W increases. Furthermore, the speed and acceleration of the hand 51 are determined so that the total amplitude of the hand 51 vibrating in the up and down direction (vertical direction Z) falls within the slot height SHT.

[0100] Furthermore, the speed and acceleration of the hand 51 are determined so that the total amplitude of the hand 51 that is not supporting the substrate W falls within the clearance CL. Therefore, vibrations due to the speed and acceleration of the hand 51 can be suppressed, and the substrate can be prevented from being scratched by the hand 51.

[0101] Furthermore, if the lookup table LUT shown in FIG. 16 is used to determine the speed and acceleration of the hand 51, the speed and acceleration of the hand 51 can be easily determined.

[0102] Each substrate W corresponds to the first substrate of the present invention. When substrate W25 corresponds to the first substrate of the present invention, substrate W24 corresponds to the second substrate of the present invention. Furthermore, when slot SL25 corresponds to the first slot of the present invention, slot SL24 corresponds to the second slot of the present invention. [Example]

[0103] Next, a second embodiment of the present invention will be described with reference to the drawings. Note that descriptions that overlap with those of the first embodiment will be omitted. Fig. 24 is a vertical cross-sectional view showing a substrate processing apparatus 1 according to the second embodiment.

[0104] In the first embodiment, the mapping sensor 43 and the height sensor 38 are provided as the board information acquisition unit. In this regard, in the second embodiment, a camera 91 may be provided as the board information acquisition unit.

[0105] See Figure 24. The transport robot IR may further include a camera 91. The camera 91 is provided, for example, at the tip of the articulated arm 53. After the lid attaching / detaching unit 11 lowers the shutter unit 33 that holds the lid unit 17 of the carrier C, the camera 91 photographs the 25 substrates W inside the carrier C from the front of the carrier C. The camera 91 photographs the entire or part of each substrate W. The camera 91 photographs the 25 substrates W at a preset focus. The camera 91 may acquire images of the 25 substrates W by capturing images multiple times. The acquired images correspond to the substrate shape information of the present invention.

[0106] The control unit 81 obtains the thickness TK of each of the 25 substrates W from the acquired images (at least two-dimensional images). The control unit 81 also obtains 24 clearances CL between every two adjacent substrates W among the 25 substrates W from the acquired images. The control unit 81 detects the contour of the substrate W, for example, by extracting the edge of the substrate W in the acquired images. The control unit 81 obtains the thickness TK and clearance CL from the contour.

[0107] According to this embodiment, the camera 91 can collect information over a wide range, so that, for example, the clearance CL between two substrates W can be obtained while grasping the state of warpage of the substrates W.

[0108] The present invention is not limited to the above-described embodiment, but can be modified as follows.

[0109] (1) In each of the above-described embodiments, the mapping sensor 43 is provided on the upper surface of the shutter unit 33 via the sensor moving unit 45. However, the mapping sensor 43 may be provided on both sides of the C-shaped hand 51 of the transport robot IR. In this case, the mapping sensor 43 provided on the hand 51 and the height sensor 57 of the transport robot IR correspond to the substrate shape information acquisition unit of the present invention.

[0110] The mapping sensor 43 and the sensor moving unit 45 do not have to be provided in the lid attaching / detaching unit 11. In this case, the sensor moving unit 45 may be configured to move the mapping sensor 43 in the front-rear direction X and the vertical direction Z. The sensor moving unit 45 may also include a height sensor (not shown) to detect the height position of the mapping sensor 43 in the vertical direction Z.

[0111] (2) In each of the above-described embodiments and modified example (1), the control unit 81 may determine the speed and acceleration of the hand 51 when supporting the substrate W25 so that the total amplitude of the vibration in the vertical direction in accordance with the weight of the substrate W25 falls within the corrected height RHT obtained by subtracting the thickness TK of the substrate W25 from the slot height SHT of the slot SL25 (see FIG. 25(a)). The speed and acceleration of the hand 51 can be determined based on the corrected height taking into account the thickness TK of the substrate W25. The control unit 81 prepares 25 corrected heights RHT corresponding to the 25 slot heights SHT of the 25 slots SL1 to SL25, respectively.

[0112] (3) In each of the above-described embodiments and modifications, the control unit 81 may determine the speed and acceleration of the hand 51 so that the total amplitude of the hand 51 not supporting any substrate W falls within the corrected clearance CL obtained by subtracting the thickness HTK of the hand 51 from the clearance CL (see FIG. 25(b)). The speed and acceleration of the hand 51 can be determined using the corrected clearance RCL that takes into account the thickness HTK of the hand 51. The control unit 81 prepares 24 corrected clearances RCL corresponding to the 24 clearances CL, respectively.

[0113] (4) In each of the above-described embodiments and modifications, in steps S03 and S04, the speed and acceleration of the hand 51 are determined using the lookup table LUT of Fig. 16. In this regard, in step S03, the speed and acceleration may be determined using a second lookup table different from the first lookup table in step S04.

[0114] (5) In each of the above-described embodiments and modifications, the transport robot IR may further include one hand 51, for a total of two hands 51. The transport robot IR may also include three or more hands 51 arranged at different heights. The transport robot IR may not include the articulated arm 53, but may instead include a forward / backward movement unit similar to the forward / backward movement unit 69 of the center robot CR.

[0115] (6) In each of the above-described embodiments and modifications, the speed of the hand 51 may be 100% or more (for example, 110%) of the normal speed SP10. Also, the acceleration of the hand 51 may be 100% or more of the normal acceleration.

[0116] (7) In each of the above-described embodiments and modifications, the normal speed SP10 and normal acceleration AC10 of the hand 51 when supporting the substrate W are the same as the normal speed SP10 and normal acceleration AC10 of the hand 51 when not supporting the substrate W. In this regard, the normal speed SP10 and normal acceleration AC10 of the hand 51 when supporting the substrate W may be different from the normal speed SP10 and normal acceleration AC10 of the hand 51 when not supporting the substrate W.

[0117] (8) In each of the above-described embodiments and modifications, the bonded substrate WC shown in FIG. 5(c) may have a substrate in which the thickness of the peripheral portion 21 is the same as the thickness of the main portion 23, instead of the thick-edge substrate 27. [Explanation of symbols]

[0118] 1... Substrate processing equipment 7 ... Carrier placement area IR...Transport robot 11 … Lid attachment / detachment part SL1~SL25 … Slots 37...Shutter lifting section 38... Height sensor 43 ... Mapping sensor 43A...Floodlight 43B … Receiver 45 ... Sensor moving part 51...Hand 81 ... Control section 83 … Storage section 91... Camera SHT...Slot height RHT... corrected height CL1~CL24(CL) ... Clearance RCL... Clearance LUT...Look-up table C...Career W: Substrate

Claims

1. A substrate processing apparatus for processing a plurality of substrates, a carrier placement section for placing a carrier having a plurality of slots arranged in a vertical direction at a preset pitch; a substrate shape information acquisition unit that acquires substrate shape information including information on the shapes of the plurality of substrates accommodated in the plurality of slots; a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot removing the first substrate from a first slot of the plurality of slots and storing the first substrate in the first slot by moving the hand in horizontal and vertical directions; a control unit, The control unit controls a speed and an acceleration of the hand when the hand supporting the first substrate moves within the carrier as follows: (1) obtaining a thickness of the first substrate using the substrate shape information; (2) calculating the weight of the first substrate based on the thickness; (3) determining a speed and an acceleration of the hand when supporting the first substrate in accordance with a weight of the first substrate; (4) moving the hand supporting the first substrate within the first slot using the determined velocity and acceleration; A substrate processing apparatus characterized by:

2. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus according to claim 1, wherein the control unit determines the speed and acceleration of the hand so that the speed and acceleration of the hand decrease as the weight of the first substrate increases.

3. 2. The substrate processing apparatus according to claim 1, The control unit determines the speed and acceleration of the hand supporting the first substrate as it moves within the carrier so that the total amplitude of the hand, which vibrates vertically in accordance with the weight of the first substrate, is within the slot height of the first slot.

4. 2. The substrate processing apparatus according to claim 1, The control unit determines the speed and acceleration of the hand so that the total amplitude of the hand, which vibrates vertically in accordance with the weight of the first substrate, falls within a corrected height obtained by subtracting the slot height of the first slot by the thickness of the first substrate.

5. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus, wherein the control unit determines the speed and acceleration of the hand using a lookup table.

6. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the substrate shape information acquisition unit is a photoelectric sensor.

7. 2. The substrate processing apparatus according to claim 1, The substrate processing apparatus is characterized in that the substrate shape information acquisition unit is a camera.

8. 8. The substrate processing apparatus according to claim 1, The control unit controls the speed and acceleration of the hand when the hand not supporting a substrate moves within the carrier as follows: (1) using the board shape information, acquiring a clearance between the first board accommodated in the first slot and a second board accommodated in a second slot of the plurality of slots adjacent to the lower side of the first slot; (2) determining the speed and acceleration of the hand so that the total amplitude of the hand vibrating in the vertical direction when the hand not supporting a substrate moves within the carrier is within the clearance; (3) Using the determined velocity and acceleration, the hand not holding a substrate is moved between the first substrate and the second substrate. A substrate processing apparatus characterized by:

9. 9. The substrate processing apparatus according to claim 8, The control unit determines the speed and acceleration of the hand so that the total amplitude of the hand not supporting a substrate falls within a corrected clearance obtained by subtracting the thickness of the hand from the clearance.

10. A substrate processing apparatus for processing a plurality of substrates, a carrier placement section for placing a carrier having a plurality of slots arranged in a vertical direction at a preset pitch; a substrate shape information acquisition unit that acquires substrate shape information including information on the shapes of the plurality of substrates accommodated in the plurality of slots; a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot removing the first substrate from a first slot of the plurality of slots and storing the first substrate in the first slot by moving the hand in horizontal and vertical directions; a control unit, The control unit controls the speed and acceleration of the hand when the hand not supporting a substrate moves within the carrier as follows: (1) using the board shape information, acquiring a clearance between the first board accommodated in the first slot and a second board accommodated in a second slot of the plurality of slots adjacent to the lower side of the first slot; (2) determining the speed and acceleration of the hand so that the total amplitude of the hand vibrating in the vertical direction when the hand not supporting a substrate moves within the carrier is within the clearance; (3) Using the determined velocity and acceleration, the hand not holding a substrate is moved between the first substrate and the second substrate. A substrate processing apparatus comprising:

11. A method for controlling a substrate processing apparatus that processes a plurality of substrates, comprising: The substrate processing apparatus includes: a carrier placement section for placing a carrier having a plurality of slots arranged in a vertical direction at a preset pitch; a substrate shape information acquisition unit that acquires substrate shape information including information on the shapes of the plurality of substrates accommodated in the plurality of slots; a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot removing the first substrate from a first slot of the plurality of slots and storing the first substrate in the first slot by moving the hand in horizontal and vertical directions; The control method includes controlling the speed and acceleration of the hand when the hand supporting the first substrate moves within the carrier through the following steps: (1) a thickness acquisition step of acquiring a thickness of the first substrate using the substrate shape information; (2) a weight calculation step of calculating a weight of the first substrate based on the thickness; (3) a determination step of determining a speed and an acceleration of the hand when supporting the first substrate in accordance with a weight of the first substrate; (4) a hand moving step of moving the hand supporting the first substrate within the first slot using the determined velocity and acceleration; A method for controlling a substrate processing apparatus, comprising:

12. A method for controlling a substrate processing apparatus that processes a plurality of substrates, comprising: The substrate processing apparatus includes: a carrier placement section for placing a carrier having a plurality of slots arranged in a vertical direction at a preset pitch; a substrate shape information acquisition unit that acquires substrate shape information including information on the shapes of the plurality of substrates accommodated in the plurality of slots; a transport robot having a hand capable of supporting a first substrate in a horizontal position, the transport robot removing the first substrate from a first slot of the plurality of slots and storing the first substrate in the first slot by moving the hand in horizontal and vertical directions; The control method includes controlling the speed and acceleration of the hand when the hand not supporting a substrate moves within the carrier through the following steps: (1) a clearance amount acquisition step of acquiring a clearance between the first substrate accommodated in the first slot and a second substrate accommodated in a second slot of the plurality of slots adjacent to and below the first slot, using the substrate shape information; (2) determining a speed and acceleration of the hand so that the total amplitude of the hand vibrating in the vertical direction when the hand not supporting a substrate moves within the carrier is within the clearance; (3) a hand moving step of moving the hand not holding a substrate between the first substrate and the second substrate using the determined velocity and acceleration; A method for controlling a substrate processing apparatus, comprising:

Images