Method for manufacturing disc-like substrate and apparatus for manufacturing dick-like substrate

Abstract

To provide a method and an apparatus for manufacturing a disc-like substrate which restricts foreign matters removed from the adsorption face of an adsorption part from redeposition on a disk-like substrate.SOLUTION: This method for manufacturing a disc-like substrate include: a first process of supplying the adsorption face of an adsorption part which sucks one face of a disk-like substrate with a liquid for a period where the disc-like substrate is not sucked to remove foreign matters deposited on the adsorption face, a second process of sucking foreign matters the foreign matters removed from the adsorption face while executing the liquid supply in the first process, a third process of making the adsorption face having supplied with the liquid suck one face of the disc-like substrate, and a fourth process of executing at least one treatment selected pol of a group consisting of a cutting treatment, a grinding treatment and a polishing treatment on the disc-like substrate sucked by the adsorption face.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present disclosure relates to a method and an apparatus for manufacturing a disk-shaped substrate. [Background technology]

[0002] As a method for manufacturing a disk-shaped substrate, Patent Documents 1 and 2 disclose a method for manufacturing a magnetic disk substrate, which includes a cutting step of cutting a disk blank. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-032363 [Patent Document 2] Japanese Patent Publication No. 2020-107384 Summary of the Invention [Problem to be solved by the invention]

[0004] When cutting a disk-shaped substrate, one side of the disk-shaped substrate is sometimes held by suction before the other side is cut. In this case, to prevent foreign matter from adhering to the suction surface of the suction part that adsorbs the disk-shaped substrate, a method can be considered in which a fluid is supplied to the suction surface to remove foreign matter adhering to the suction surface. Here, if the foreign matter removed from the suction surface becomes suspended in the air, for example, there is a risk that it may re-adhere to the disk-shaped substrate, etc. If the foreign matter re-adheres to the disk-shaped substrate, the foreign matter may become trapped between the disk-shaped substrate and the suction surface, causing a concave defect in the disk-shaped substrate. Examples of foreign matter include chips and small pieces generated by cutting the disk-shaped substrate.

[0005] Therefore, an object of the present disclosure is to provide a method and an apparatus for manufacturing a disk-shaped substrate that prevent foreign matter removed from the suction surface of the suction part from re-adhering to the disk-shaped substrate. [Means for solving the problem]

[0006] The present disclosure includes the following aspects. <1> a first step of supplying a fluid to an adsorption surface of an adsorption unit that adsorbs one surface of a disk-shaped substrate while the disk-shaped substrate is not being adsorbed, thereby removing foreign matter adhering to the adsorption surface; a second step of sucking the foreign matter removed from the suction surface while continuing to supply the fluid in the first step; a third step of adsorbing one surface of the disk-shaped substrate onto the adsorption surface to which the fluid has been supplied; a fourth step of performing at least one treatment selected from the group consisting of a cutting treatment, a grinding treatment, and a polishing treatment on the disk-shaped substrate adsorbed on the adsorption surface; A method for manufacturing a disk-shaped substrate comprising: <2> a supply unit for supplying the fluid is provided in a holder that holds the disk-shaped substrate and transfers the disk-shaped substrate to the suction surface, a suction unit that sucks the foreign matter removed from the suction surface is provided on the holding unit; <1> 10. A method for producing the disk-shaped substrate according to claim 1 . <3> the supply unit and the suction unit move together with the holder, and before the disk-shaped substrate is transferred to the suction surface, the supply unit supplies the fluid to the suction surface, and the suction unit suctions the removed foreign matter. <2> 10. A method for producing the disk-shaped substrate according to claim 1 . <4> In a state where the holder holds the disk-shaped substrate with the one surface facing the suction surface, the supply unit supplies the fluid to the suction surface, and the suction unit sucks the removed foreign matter. <2> or <3> 10. A method for producing the disk-shaped substrate according to claim 1 . <5> supplying the fluid to the suction surface while the disk-shaped substrate is not being suctioned to the suction surface while the suction surface is being rotated, thereby removing foreign matter adhering to the suction surface; <1> ~ <4> 10. A method for producing a disk-shaped substrate according to any one of the above. <6> In the first step, the fluid is intermittently supplied to the suction surface during a period when the disk-shaped substrate is not being suctioned, and foreign matter adhering to the suction surface is removed. <1> ~ <5> 10. A method for producing a disk-shaped substrate according to any one of the above. <7> a processing device including a suction unit that suctions one surface of a disk-shaped substrate, and a processing unit that performs at least one process selected from the group consisting of a cutting process, a grinding process, and a polishing process on the disk-shaped substrate suctioned to the suction unit; a foreign matter removal device including a supply unit that supplies a fluid to the suction surface of the suction unit, and that supplies the fluid to the suction surface while the disk-shaped substrate is not being suctioned, thereby removing foreign matter adhering to the suction surface; a foreign matter suction device that sucks foreign matter removed from the adsorption surface when the foreign matter removal device supplies the fluid; An apparatus for manufacturing a disk-shaped substrate comprising: <8> the supply unit is provided in a holding unit that holds the disk-shaped substrate and transfers the disk-shaped substrate to the adsorption unit; <7> The disk-shaped substrate manufacturing apparatus according to claim 1. <9> the foreign matter removal device intermittently supplies the fluid during a period when the disk-shaped substrate is not being attracted to the attraction surface, thereby removing foreign matter adhering to the attraction surface. <7> or <8> The disk-shaped substrate manufacturing apparatus according to claim 1. [Effects of the Invention]

[0007] According to the present disclosure, it is possible to provide a method for manufacturing a disk-shaped substrate and an apparatus for manufacturing a disk-shaped substrate that prevent foreign matter removed from the suction surface of the suction part from re-adhering to the disk-shaped substrate. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view illustrating a manufacturing apparatus according to an embodiment of the present disclosure. [Figure 2] FIG. 10 is a perspective view illustrating a state in which the arm is positioned at a receiving position in the manufacturing apparatus according to the embodiment of the present disclosure. [Figure 3]FIG. 2 is a perspective view showing a state in which an arm is positioned at a delivery position in the manufacturing apparatus according to the embodiment of the present disclosure. [Figure 4] FIG. 1 is a perspective view showing a state in which cutting is performed on a disk-shaped substrate in a manufacturing apparatus according to an embodiment of the present disclosure. [Figure 5] FIG. 10 is a perspective view showing a state in which foreign matter is being removed in the manufacturing apparatus according to the embodiment of the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments of the present disclosure will be described. However, the present disclosure is not limited to the following embodiments. In the following embodiments, components are not essential unless otherwise specified. When embodiments are described with reference to the drawings in this disclosure, the configuration of the embodiment is not limited to the configuration shown in the drawings. Furthermore, the sizes of components in each drawing are conceptual. Therefore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component, and the front-to-back, left-to-right, and top-to-bottom dimensional ratios between components, are not limited to the illustrated dimensional ratios. Furthermore, the front-to-back, left-to-right, and top-to-bottom dimensional ratios of each component may differ from the actual dimensional ratios. Furthermore, unless otherwise specified in this disclosure, the number of each component element of this disclosure is not limited to one, and may be present in plural. Note that in the following description of the drawings, similar parts are denoted by similar reference numerals.

[0010] <Manufacturing equipment 90> As an example of the disk-shaped substrate manufacturing apparatus of the present disclosure, a manufacturing apparatus 90 will be described with reference to the drawings. Note that the disk-shaped substrate manufacturing apparatus of the present disclosure is not limited to the manufacturing apparatus 90. As shown in Fig. 4, the manufacturing apparatus 90 is an apparatus for manufacturing a disk-shaped substrate 200 from an unprocessed disk-shaped substrate 100. The disk-shaped substrate 200 is a processed disk-shaped substrate obtained by processing the disk-shaped substrate 100. As shown in Fig. 1, the manufacturing apparatus 90 includes a foreign matter removal device 50, a cutting device 60, and a foreign matter suction device 30. The disk-shaped substrate 100, each part of the manufacturing apparatus 90, and modified examples of the manufacturing apparatus 90 will be described below.

[0011] <Disc-shaped substrate 100> The disk-shaped substrate 100 is a substrate formed in a disk shape, as shown in FIG. 4. Specifically, the disk-shaped substrate 100 is formed in an annular shape having an inner circumference 100A and an outer circumference 100B in a plan view. The plan view here refers to the case where the disk-shaped substrate 100 is viewed from one side in the thickness direction of the disk-shaped substrate 100. The disk-shaped substrate 100 is cut by the cutting device 60. This is the board before it was assembled.

[0012] Furthermore, the disk-shaped substrate 100 is formed in a plate shape having one surface 100J and the other surface 100K. Hereinafter, the one surface 100J will be referred to as the first surface 100J. Hereinafter, the other surface 100K will be referred to as the second surface 100K. The boundary between the first surface 100J and the inner periphery 100A of the disk-shaped substrate 100 may be considered to be part of the first surface 100J. The boundary between the first surface 100J and the outer periphery 100B of the disk-shaped substrate 100 may be considered to be part of the first surface 100J. The boundary portion between the second surface 100K and the inner periphery 100A of the disk-shaped substrate 100 may be considered to be part of the second surface 100K. The boundary portion between the second surface 100K and the outer periphery 100B of the disk-shaped substrate 100 may be considered to be part of the second surface 100K. The aforementioned boundary portion may also be considered to be a ridge portion.

[0013] The disk-shaped substrate 100 may be, for example, a substrate for a magnetic recording medium. The disk-shaped substrate 100 may be a substrate made of a metal material such as aluminum or an aluminum alloy substrate, or glass. The surface of the metal material may be subjected to a surface treatment such as plating. In this case, the surface to be subjected to cutting or other treatment may be a plating layer. Aluminum substrates are advantageous in that they are easy to process and can reduce manufacturing costs. In this disclosure, aluminum substrate is a general term that includes aluminum alloy substrates as well as aluminum substrates.

[0014] On the other hand, a glass reinforced layer may be formed on the surface of the glass substrate. In this case, the target surface for cutting or the like may be the glass reinforced layer. Formation of a glass reinforced layer is not essential for the glass substrate. The present disclosure is also applicable to cases where cutting or the like is performed on the surface of a pure glass substrate on which no glass reinforced layer is formed. Glass substrates are superior to aluminum substrates in strength, surface flatness, heat resistance, etc., and therefore, it is easy to achieve miniaturization and high density of disk-shaped substrates. Although the disk-shaped substrate 100 is for use in a magnetic recording medium, this disclosure is not limited to this, and various disk-shaped substrates can be used whose uses, materials, types, etc. are not limited to those described above.

[0015] <Cutting device 60> The cutting device 60 is a device that performs cutting processing on the disk-shaped substrate 100. Specifically, as shown in FIG. 1, the cutting device 60 has, for example, an adsorption unit 70, a cutting unit 64, and a holding unit 68.

[0016] The suction unit 70 has a function of suctioning the first surface 100J of the disk-shaped substrate 100. Specifically, as shown in FIG. 1 , the suction unit 70 has, for example, an adsorption body 72, a support 74, and a rotation mechanism 76.

[0017] The adsorbent 72 is formed in a cylindrical shape. The adsorbent 72 has an adsorption surface 71 that is formed in a circular shape when viewed in the axial direction of the adsorbent 72. The adsorbent 72 has a suction port 73 that opens at the adsorption surface 71. The suction port 73 is formed in, for example, a circular ring shape when viewed in the axial direction of the adsorbent 72. The adsorption unit 70 adsorbs the first surface 100J of the disk-shaped substrate 100 to the adsorption surface 71 by sucking air through the suction port 73.

[0018] The support 74 supports the adsorber 72 rotatably around an axis along the axial direction of the adsorber 72. A rotation mechanism 76 rotates the adsorber 72 around the axis. In the adsorber 70, with the disk-shaped substrate 100 adsorbed to the adsorption surface 71, the rotation mechanism 76 rotates the adsorber 72, thereby rotating the disk-shaped substrate 100.

[0019] The cutting unit 64 is an example of a processing unit and has a function of cutting the disk-shaped substrate 100. The cutting unit 64 cuts the second surface 100K of the disk-shaped substrate 100 by bringing a cutting blade into contact with the rotating disk-shaped substrate 100 while being adsorbed to the adsorption surface 71. The cutting unit 64 may, for example, cut the second surface 100K and the boundary portion between the second surface 100K and the outer periphery 100B of the disk-shaped substrate 100. The cutting unit 64 may also, for example, cut the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B of the disk-shaped substrate 100. Note that when cutting the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B, the disk-shaped substrate 100 is inverted and the cutting is performed with the second surface 100K adsorbed to the adsorption surface 71. The cutting target to be cut by the cutting unit 64 may be, for example, only the outer periphery 100B, or in addition to or instead of the outer periphery 100B, the first surface 100J, the second surface 100K, or both of these surfaces. The cutting target may be any portion of the disk-shaped substrate 100 other than the portion adsorbed by the adsorption unit 70.

[0020] The holding unit 68 has a function of holding the disk-shaped substrate 100 and transferring the disk-shaped substrate 100 to the adsorption surface 71. Specifically, the holding unit 68 has, for example, a shaft 80, an arm 81, a moving mechanism 83, and a holding mechanism 84. The shaft portion 80 is formed in a cylindrical shape with a hollow interior, and is supported by a support body (not shown) so as to be movable in the axial direction and rotatable.

[0021] One end 81A of the arm 81 is attached to one axial end 80A of the shaft 80, and rotates integrally with the shaft 80. The arm 81 extends radially outward from one end 80A of the shaft 80. A first hole 81D, through which the nozzle 56 of the foreign matter removal device 50 is passed, is formed in one end 81A of the arm 81. Furthermore, a second hole 81E, through which the nozzle 56 is passed, is formed in an intermediate portion 81C of the arm 81. The intermediate portion 81C of the arm 81 is a portion between one end 81A and the other end 81B of the arm 81.

[0022] The holding mechanism 84 is a mechanism that holds the disk-shaped substrate 100. The holding mechanism 84 is provided at the other end 81B of the arm 81, and rotates integrally with the arm 81. Specifically, the holding mechanism 84 has, for example, a plurality of claws arranged along the circumferential direction of the inner periphery 100A of the disk-shaped substrate 100, and holds the disk-shaped substrate 100 by pressing the claws against the inner periphery 100A.

[0023] The movement mechanism 83 is a mechanism that, for example, rotates the arm 81 around the axis of the shaft portion 80 and moves the arm 81 along the axial direction of the shaft portion 80. Specifically, the movement mechanism 83 rotates the arm 81 between the opposing position and the receiving position. Furthermore, the movement mechanism 83 moves the arm 81 in the axial direction of the shaft portion 80 between the opposing position and the delivery position.

[0024] The facing position is the position shown in Fig. 1, the receiving position is the position shown in Fig. 2, and the delivery position is the position shown in Fig. 3. The facing position is a position where the disk-shaped substrate 100 held by the arm 81 faces the suction surface 71 while being spaced apart from the suction surface 71 . The receiving position is a position where the arm 81 receives the disk-shaped substrate 100, and where the disk-shaped substrate 100 held by the arm 81 does not face the suction surface 71. The receiving position is set, for example, to a position where the arm 81 is rotated 180 degrees from the facing position. The delivery position is a position where the arm 81 delivers the disk-shaped substrate 100 to the suction unit 70. At the delivery position, the disk-shaped substrate 100 held by the arm 81 comes into contact with the suction surface 71, for example.

[0025] <Cutting process by cutting device 60> In the cutting device 60, for example, cutting processing of the disk-shaped substrate 100 is performed as follows. That is, in the cutting device 60, first, at the receiving position, the holding mechanism 84 provided on the arm 81 holds the disk-shaped substrate 100, and the arm 81 receives the disk-shaped substrate 100. At this time, the disk-shaped substrate 100 is held by the holding mechanism 84 with the second surface 100K facing the arm 81.

[0026] Next, the arm 81 that has received the disk-shaped substrate 100 is rotated from the receiving position to the opposing position by the movement mechanism 83. Next, the arm 81 is moved from the opposing position to the delivery position by the movement mechanism 83. Next, the suction unit 70 sucks air through the suction port 73, thereby suctioning the first surface 100J of the disk-shaped substrate 100 to the suction surface 71. At this time, the holding mechanism 84 releases the hold of the disk-shaped substrate 100.

[0027] 4, the rotation mechanism 76 rotates the adsorber 72 around an axis along the axial direction of the adsorber 72, while the cutting unit 64 brings the cutting blade into contact with the disk-shaped substrate 100. This cuts the disk-shaped substrate 100. The cutting is performed on, for example, the second surface 100K of the disk-shaped substrate 100 and the boundary portion between the second surface 100K and the outer periphery 100B.

[0028] When cutting the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B, the disk-shaped substrate 100 is inverted using an inversion mechanism (not shown), and cutting is performed with the second surface 100K adsorbed onto the adsorption surface 71.

[0029] <Modification of cutting device 60> The suction unit 70 in the cutting device 60 is not limited to the configuration described above. The suction unit of the present disclosure may be one that suctions the disk-shaped substrate by means other than suction. Therefore, the suction unit of the present disclosure may be one that suctions one surface of the disk-shaped substrate. The cutting unit 64 in the cutting device 60 is not limited to the above-described configuration. The cutting unit of the present disclosure may be any unit that cuts the disk-shaped substrate held by the suction unit. The holding unit 68 in the cutting device 60 is not limited to the above-described configuration. As the holding unit of the present disclosure, for example, the arm of the holding unit may move linearly instead of rotating, and various holding units can be used.

[0030] In this embodiment, the cutting device 60 is used as an example of the processing device of the present disclosure, but this is not limiting. An example of the processing device of the present disclosure may be, for example, a device that performs at least one of physical polishing and chemical polishing on the disk-shaped substrate 100. An example of the processing device of the present disclosure may be a device that performs at least one process selected from the group consisting of cutting, grinding, and polishing. The cutting, grinding, and polishing processes may generate foreign matter during processing, such as chips, small particles, and the like generated from the disk-shaped substrate 100 during the processing of the disk-shaped substrate 100, or processing agents such as abrasives.

[0031] <Foreign matter removal device 50> The foreign matter removal device 50 is a device that supplies air to the suction surface 71 of the suction unit 70 while the disk-shaped substrate 100 is not being suctioned, and removes foreign matter adhering to the suction surface 71.

[0032] As shown in Fig. 5, the foreign matter removal device 50 has a supply unit 52 that supplies air to the suction surface 71. The supply unit 52 intermittently supplies air to the suction surface 71 during a period when the disk-shaped substrate 100 is not being suctioned, thereby removing foreign matter adhering to the suction surface 71. Specifically, as shown in Fig. 5, the supply unit 52 includes a supply source 53, a supply pipe 54, an on-off valve 55, and a nozzle. It has Zulu 56 and.

[0033] The supply source 53 supplies air to the supply pipe 54. As the supply source 53, for example, a compressor that generates compressed air and supplies the compressed air to the supply pipe 54 can be used. The supply pipe 54 is a pipe that supplies air from the supply source 53 to the nozzle 56.

[0034] The nozzle 56 is provided on the arm 81 of the holding unit 68 of the cutting device 60, and supplies air from the supply pipe 54 toward the suction surface 71. Specifically, the nozzle 56 is connected to the supply pipe 54 inside the shaft 80, and passes through a first hole 81D and a second hole 81E of the arm 81. The on-off valve 55 is a valve that opens and closes the flow path of the supply pipe 54. The on-off valve 55 opens and closes the flow path, thereby intermittently supplying air from the nozzle 56 to the suction surface 71. Note that the on-off valve 55 may also open and close the flow path in the nozzle 56 portion.

[0035] The supply unit 52 may be, for example, a pulse air blower that controls the opening and closing of an on-off valve 55 using a pulse signal. The air supply period by the supply unit 52 can be set according to the processing time of the entire processing step from the viewpoint of removing foreign matter, and is appropriately set, for example, from 0.1 seconds or more, 0.5 seconds or more, or 1 second or more, but not exceeding 2 seconds. This supply period is the period during which the supply unit 52 supplies air in one supply operation. The supply interval in the intermittent air supply varies depending on the length of the supply period, but is appropriately set from the viewpoint of removing foreign matter from the range of, for example, 0.05 seconds or more, 0.1 seconds or more, or 0.2 seconds or more, but not exceeding 1 second. Note that the supply interval is the interval from the start of air supply to the start of the next air supply in the intermittent air supply. The air discharge pressure from the nozzle 56 is set, from the viewpoint of removing foreign matter, to, for example, 0.05 MPa or more, 0.1 MPa or more, 0.2 MPa or more, or 0.5 MPa or more. There is no particular upper limit to the air discharge pressure, but it can be set to, for example, 2 MPa or less.

[0036] As described above, in the supply unit 52, the nozzle 56 is provided on the arm 81 of the holding unit 68 of the cutting device 60, and air can be supplied to the suction surface 71 from the arm 81 side.

[0037] <Modification of the foreign matter removal device 50> Although the foreign matter removal device 50 supplies air to the adsorption surface 71, this is not limiting. The foreign matter removal device of the present disclosure may supply, for example, a gas such as nitrogen or a liquid such as water. The foreign matter removal device of the present disclosure may supply any fluid that can be supplied to the adsorption surface. Furthermore, in the foreign matter removal device 50, the supply unit 52 is provided in the holding unit 68 of the cutting device 60, but this is not limited to this. In the foreign matter removal device of the present disclosure, the supply unit may be provided, for example, in the main body of the cutting device. In the foreign matter removal device of the present disclosure, the supply unit can be installed in various locations. Furthermore, in the foreign matter removal device 50, the supply unit 52 intermittently supplies air to the suction surface 71 during the period when the disk-shaped substrate 100 is not being suctioned, but this is not limited thereto. The supply unit of the present disclosure may, for example, supply air continuously. Specifically, the supply unit of the present disclosure may, for example, supply air at a constant rate from the start to the end of the period when the disk-shaped substrate 100 is not being suctioned.

[0038] <Foreign matter suction device 30> The foreign matter suction device 30 is a device that suctions foreign matter removed from the adsorption surface 71 by the foreign matter removal device 50. In this embodiment, the foreign matter suction device 30 performs suction of foreign matter when the foreign matter removal device 50 supplies air. As shown in FIG. 1 , the foreign matter suction device 30 has, for example, a suction unit 32 and a drive unit 36. The suction unit 32 has a tip portion 34 having a suction port 33, and a suction tube 35. One end of the suction tube 35 is connected to the tip portion 34. At this one end, the interior of the suction tube 35 communicates with the suction port 33. The other end of the suction tube 35 is connected to a drive unit 36. At this other end, the interior of the suction tube 35 communicates with the drive unit 36. The suction unit 32 is provided on an arm 81 of the holding unit 68 of the cutting device 60. Specifically, for example, the suction pipe 35 of the suction unit 32 is arranged from one end 81A to the other end 81B of the arm 81 on the side opposite to the holding mechanism 84 of the arm 81.

[0039] The driving unit 36 ​​is a driving source that sucks air inside the suction unit 32. As the driving unit 36, for example, a suction pump, a suction fan, an ejector, or the like can be used. In the foreign body suction device 30, the drive unit 36 ​​is driven to create a negative pressure inside the suction tube 35 of the suction unit 32, and foreign bodies removed from the adsorption surface 71 are sucked through the suction port 33. In this embodiment, for example, the drive unit 36 ​​of the foreign body suction device 30 is driven while the supply unit 52 of the foreign body removal device 50 is supplying air, thereby suctioning foreign bodies. That is, in this embodiment, there is a period during which foreign body removal and foreign body suction are performed simultaneously. Note that the timing at which foreign body suction begins may be the same as the timing at which foreign body removal begins, or may be shifted. For example, foreign body suction may begin after foreign body removal begins. Furthermore, the timing at which foreign body suction ends may be the same as the timing at which foreign body removal ends, or may be shifted. For example, foreign body suction may end after foreign body removal ends.

[0040] <Modification of the foreign matter suction device 30> In the foreign body suction device 30, the suction unit 32 is provided in the holding unit 68 of the cutting device 60, but this is not limited to this. In the foreign body suction device of the present disclosure, the suction unit may be provided, for example, in the device body of the cutting device. In the foreign body suction device of the present disclosure, the suction unit can be installed in various locations.

[0041] <Modification of Manufacturing Apparatus 90> In the manufacturing apparatus 90, the cutting device 60 cuts the disk-shaped substrate 100 as described above, thereby manufacturing the disk-shaped substrate 200. In the present disclosure, the manufacturing apparatus 90 may include, for example, one or more other devices necessary for manufacturing the disk-shaped substrate 200. Examples of the other devices include a grinding device that grinds the disk-shaped substrate 100, a polishing device that polishes the disk-shaped substrate 100, a cleaning device that cleans the disk-shaped substrate 100, a drying device that dries the disk-shaped substrate 100, a transport device that transports the disk-shaped substrates 100 and 200, and a storage rack that stores the disk-shaped substrates 100 and 200.

[0042] <Method of manufacturing the disk-shaped substrate 200> The manufacturing method of this embodiment is a method for manufacturing a disk-shaped substrate 200. The disk-shaped substrate 200 is a processed disk-shaped substrate obtained by processing the disk-shaped substrate 100. In this embodiment, the method for manufacturing the disk-shaped substrate 200 includes removing foreign matter adhering to the suction surface 71 of the suction unit 70 that suctions the first surface 100J of the disk-shaped substrate 100, then suctioning the disk-shaped substrate 100 to the suction unit 70, and then performing a cutting process. In the present disclosure, the method for manufacturing the disk-shaped substrate 200 may be configured to include one or more other commonly known processes required to manufacture the disk-shaped substrate 200, depending on the type of disk-shaped substrate 200.

[0043] For example, in the case of an aluminum substrate, the method for manufacturing the disk-shaped substrate 200 includes the following steps. Blank substrate preparation step: An aluminum alloy ingot is rolled to obtain an aluminum alloy plate material with a thickness of approximately 2 mm or less, and the obtained aluminum alloy plate material is punched into a disk shape to prepare an aluminum substrate of the desired dimensions. Cutting step: The prepared aluminum alloy substrate is subjected to chamfering of the inner and outer diameters and cutting of both main surfaces. Grinding process: In order to reduce the surface roughness and waviness of the aluminum alloy substrate after cutting, grinding is performed on both main surfaces of the aluminum alloy substrate using a grinding wheel. Plating process: After grinding, the surface of the aluminum alloy substrate is plated with NiP or other plating to impart surface hardness and reduce surface defects. Polishing step: Both main surfaces of the aluminum alloy substrate on which the plating film has been formed are polished.

[0044] In the case of a glass substrate, the method for manufacturing the disk-shaped substrate 200 includes, for example, the following steps. Blank substrate preparation process: A glass blank, which will be the material for a plate-shaped glass substrate for a magnetic recording medium and has a pair of main surfaces, is produced by press molding, and a circular hole is formed in the center of the produced glass blank to form a ring shape. Next, the glass blank is shaped to obtain a glass substrate with a chamfered surface. The inner and outer peripheral end surfaces of the shaped glass substrate are ground and polished. Grinding process: The main surfaces of the glass substrate after edge polishing are ground using fixed abrasive grains. Polishing step: The main surfaces of the glass substrate after the grinding step are polished with a predetermined abrasive. During the polishing step, the glass substrate may be subjected to a chemical strengthening treatment.

[0045] The manufacturing method according to this embodiment will be described in detail below. The manufacturing method of this embodiment includes a foreign matter removal step, a foreign matter suction step, an adsorption step, and a cutting step. In the manufacturing method of this embodiment, the foreign matter removal step, the adsorption step, and the cutting step are performed in this order. The manufacturing method of this embodiment can be performed, for example, by using the manufacturing apparatus 90 described above. The foreign matter removal step, the foreign matter suction step, the adsorption step, and the cutting step are each an example of the first step, the second step, the third step, and the fourth step, respectively.

[0046] In the foreign matter removal process, as shown in FIG. 5, air is supplied to the suction surface 71 of the suction unit 70 while the disk-shaped substrate 100 is not being suctioned, thereby removing foreign matter adhering to the suction surface 71. In the foreign matter suction step, the foreign matter removed from the suction surface 71 is sucked while air is being supplied in the foreign matter removal step. This makes it difficult for the foreign matter removed from the suction surface 71 to float in the air, and prevents it from re-adhering to the disk-shaped substrate 100 or the like.

[0047] In this embodiment, the supply unit 52 for supplying air may be provided in the holding unit 68 that holds the disk-shaped substrate 100 and transfers the disk-shaped substrate 100 to the adsorption surface 71. In this case, in the foreign matter removal step, the supply unit 52 for supplying air may be provided in the holding unit 68 that transfers the disk-shaped substrate 100 to the adsorption surface 71. Air is supplied to the adsorption surface 71 from the supply unit 52 . In this embodiment, a suction unit 32 may be further provided in the holder 68. In this case, in the foreign matter suction step, the suction unit 32 provided in the holder 68 on which the suction unit 32 is provided sucks up the foreign matter removed from the suction surface 71. This makes it possible to suck up the foreign matter near a location where the foreign matter is likely to float. As a result, the foreign matter removed from the suction surface 71 is less likely to float in the air, and is prevented from re-adhering to the disk-shaped substrate 100 and the holder 68. According to this manufacturing method, when the disk-shaped substrate 100 is transferred from the holder 68 to the adsorption surface 71, foreign matter can be removed from the adsorption surface 71 and the removed foreign matter can be sucked. Specifically, according to this manufacturing method, for example, the foreign matter can be removed and the removed foreign matter can be sucked immediately before the disk-shaped substrate 100 is transferred.

[0048] In this embodiment, the supply unit 52 and the suction unit 32 may move together with the holder 68, and before the disk-shaped substrate 100 is delivered to the suction surface 71, the supply unit 52 may supply air to the suction surface 71, and the suction unit 32 may suck up the removed foreign matter. According to this manufacturing method, the supply unit 52 and the suction unit 32 move together with the holder 68, so that air can be supplied to a wide area of ​​the suction surface 71, and the removed foreign matter can be sucked up over a wide area. As a result, foreign matter is prevented from remaining on the suction surface 71 and from re-adhering. In this case, air may be supplied from supply unit 52 to suction surface 71 and suction unit 32 may suck the removed foreign matter while holding unit 68 is moved in the movement direction in which supply unit 52 and suction unit 32 move along suction surface 71. At this time, arm 81 may be rotated forward and backward to move the tips of nozzle 56 and suction unit 32 back and forth along suction surface 71.

[0049] Furthermore, in this embodiment, when the holding unit 68 holds the disk-shaped substrate 100 with the first surface 100J facing the adsorption surface 71, the supply unit 52 may supply air to the adsorption surface 71, and the suction unit 32 may suck up the removed foreign matter. As a result, after the air supply and the foreign matter suction are performed, the disk-shaped substrate 100 can be sucked onto the suction surface 71 without changing the orientation of the disk-shaped substrate 100, thereby improving work efficiency.

[0050] In this embodiment, air may be supplied from the supply unit 52 to the adsorption surface 71 while the rotation mechanism 76 rotates the adsorption surface 71 . According to this manufacturing method, air is supplied to the suction surface 71 while the suction surface 71 is rotating, so that air can be supplied over a wide area of ​​the suction surface 71. As a result, foreign matter is prevented from remaining on the suction surface 71. In the foreign matter removal process of this embodiment, air is supplied to the suction surface 71, for example, after the arm 81 has rotated to the facing position and before it moves to the delivery position.

[0051] In the foreign matter removal step, air may be intermittently supplied to the suction surface 71 of the suction unit 70 while the disk-shaped substrate 100 is not being suctioned. This causes variations in the amount of air supplied compared to supplying a constant amount of air from the start to the end of the period, making it easier for foreign matter adhering to the adsorption surface 71 to peel off from the adsorption surface 71. As a result, foreign matter is prevented from remaining on the adsorption surface 71. Furthermore, according to this embodiment, foreign matter easily peels off from the suction surface 71, so that it is possible to prevent foreign matter from remaining on the suction surface 71 without extending the air supply period, thereby improving the yield of the disk-shaped substrates 200 manufactured.

[0052] In the suction step, the first surface 100J of the disk-shaped substrate 100 is suctioned onto the suction surface 71 to which air has been supplied. Specifically, the suction unit 70 sucks air through the suction port 73, thereby suctioning the first surface 100J of the disk-shaped substrate 100 onto the suction surface 71.

[0053] In the cutting step, the disk-shaped substrate 100 adsorbed to the adsorption surface 71 is cut. Specifically, as shown in Fig. 4, the rotation mechanism 76 rotates the adsorption body 72 around an axis along the axial direction of the adsorption body 72, while the cutting unit 64 brings the cutting blade into contact with the disk-shaped substrate 100, thereby cutting the disk-shaped substrate 100. The cutting is performed on, for example, the second surface 100K of the disk-shaped substrate 100 and the boundary portion between the second surface 100K and the outer periphery 100B.

[0054] When cutting the first surface 100J and the boundary portion between the first surface 100J and the outer periphery 100B, the disk-shaped substrate 100 is inverted by an inversion mechanism (not shown), and cutting is performed with the second surface 100K adsorbed to the adsorption surface 71. In the manufacturing method, before the foreign matter removal step is performed, a manufacturing apparatus 90 including a foreign matter removal device 50 and a cutting device 60 is prepared.

[0055] <Modification of manufacturing method> In the manufacturing method of this embodiment, air is supplied to the suction surface 71 from a supply unit 52 provided in the holding unit 68 that transfers the disk-shaped substrate 100 to the suction surface 71, but this is not limited to this. In the manufacturing method of the present disclosure, air may be supplied to the suction surface from a supply unit provided in a location other than the holding unit, such as the main body of the cutting device. In the manufacturing method of the present disclosure, air can be supplied from various locations.

[0056] In addition, in the manufacturing method of this embodiment, air is supplied from the supply unit 52 to the adsorption surface 71 while the holding unit 68 is moved in the movement direction in which the supply unit 52 moves along the adsorption surface 71, but this is not limited to this. In the manufacturing method of the present disclosure, for example, air may be supplied from the supply unit to the adsorption surface while the holding unit is stopped.

[0057] In the manufacturing method of this embodiment, the rotation mechanism 76 rotates the suction surface 71 while supplying the However, the present disclosure is not limited to this. For example, in the manufacturing method of the present disclosure, air may be supplied from the supply unit to the adsorption surface while the adsorption surface is stopped.

[0058] In the manufacturing method of this embodiment, air is supplied to the suction surface 71, for example, after the arm 81 rotates to the facing position and before it moves to the delivery position, but this is not limiting. In the manufacturing method of the present disclosure, air can be supplied to the suction surface 71 at various times.

[0059] Furthermore, although the manufacturing method of this embodiment includes a foreign matter removal step as one step in manufacturing the disk-shaped substrate 200, this is not limiting. The foreign matter removal step may be performed independently as a foreign matter removal method, independent of the manufacturing method of this embodiment.

[0060] In this embodiment, the manufacturing apparatus 10 has been described as an apparatus including a cutting device as a processing device, but this is not limited to this, and the manufacturing apparatus 10 may also be an apparatus including a grinding device or an apparatus including a polishing device. In this embodiment, in the method for manufacturing a disk-shaped substrate, foreign matter removal is performed during the cutting process, but this is not limited to this, and foreign matter removal may be performed during any one of the cutting process, grinding process, and polishing process, or during two selected from these processes, or during all three of these processes. [Example]

[0061] The present disclosure will be specifically described below using examples, but the scope of the present disclosure is not limited to these examples.

[0062] (Aluminum alloy substrate manufacturing) The aluminum alloy plate used was equivalent to A5086 (Mg: 4 mass%, Mn: 0.5 mass%, Fe: 0.3 mass%, Cr: 0.2 mass%, Si: 0.2 mass%, Zn: 0.2 mass%, balance: Al). This plate was produced by rolling an aluminum alloy ingot obtained by semi-continuous casting.

[0063] Next, the 1.2 mm thick plate material was punched into a doughnut-shaped disk to obtain an aluminum alloy substrate having a diameter of 97 mm and a center hole, which was then annealed at 380° C. for 1 hour. Thereafter, the aluminum alloy substrate was subjected to the above-mentioned foreign matter removal step, adsorption step, and cutting step to obtain an aluminum alloy substrate having a diameter of 95 mm and a thickness of 0.8 mm.

[0064] In each example and comparative example, the foreign matter removal process was carried out by changing the air supply operation, the number of discharges per supply operation, and the discharge pressure, as shown in the following Table 1. Note that the air supply operation and the number of discharges per supply operation were the same conditions in each example and comparative example. In each example and comparative example, the manufacturing method including the foreign matter removal step, the adsorption step, and the cutting step was carried out with or without the foreign matter suction step. In each example and comparative example, the steps other than the foreign matter removal step and the foreign matter suction step were carried out under the same conditions.

[0065] [Comparative Examples 1 and 2] In Comparative Examples 1 and 2, the air discharge pressure from the nozzle was set to 0.1 MPa or 0.2 MPa, respectively, as shown in Table 1, and air was intermittently supplied to the suction surface 71 of the suction unit 70 at 0.1 second intervals. Therefore, in Comparative Examples 1 and 2, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 10. In Comparative Examples 1 and 2, the manufacturing method according to the present embodiment, including the foreign matter removal step, the adsorption step, and the cutting step, was performed without performing the foreign matter suction step. That is, in Comparative Examples 1 and 2, the manufacturing method was performed with the drive unit 36 ​​of the foreign matter suction device 30 stopped.

[0066] [Examples 1 and 2] In Examples 1 and 2, the air discharge pressure from the nozzle was set to 0.1 MPa or 0.2 MPa, respectively, as shown in Table 1, and air was intermittently supplied to the suction surface 71 of the suction unit 70 at 0.1 second intervals. In Examples 1 and 2, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 10. In Examples 1 and 2, the manufacturing method according to this embodiment was performed, including the foreign matter removal step, foreign matter suction step, adsorption step, and cutting step. That is, in Examples 1 and 2, the foreign matter suction step was performed, in which the foreign matter removed from the adsorption surface 71 was sucked while air was being supplied in the foreign matter removal step.

[0067] [Table 1]

[0068] For the following Reference Examples and Reference Comparative Examples, the manufacturing method according to this embodiment was also carried out, as shown in Table 2. In each Reference Example and Reference Comparative Example, the foreign matter removal process was carried out by changing the air supply operation, the number of discharges per supply operation, and the discharge pressure. In each Reference Example and Reference Comparative Example, the manufacturing method according to this embodiment, including the foreign matter removal process, the adsorption process, and the cutting process, was carried out without carrying out the foreign matter suction process. In each Reference Example and Reference Comparative Example, the processes except for the foreign matter removal process were carried out under the same conditions.

[0069] [Reference Comparative Examples 1, 2, and 3] In Reference Comparative Examples 1, 2, and 3, the air discharge pressure from the nozzle was set to 0.1 MPa, 0.2 MPa, or 0.5 MPa, respectively, as shown in Table 2, and air was supplied continuously for one second to the adsorption surface 71 of the adsorption part 70. Therefore, in Reference Comparative Examples 1, 2, and 3, the air supply period in one supply operation was one second, and air was discharged from the nozzle once in one supply operation.

[0070] [Reference Comparative Examples 4 and 5] In Comparative Examples 4 and 5, the air discharge pressure from the nozzle was set to 0.1, as shown in Table 2. The pressure was set to 0.5 MPa or 0.5 MPa, and air was supplied to the adsorption surface 71 of the adsorption part 70 continuously for two seconds. Therefore, in Reference Comparative Examples 4 and 5, the air supply period in one supply operation was two seconds, and air was ejected from the nozzle once in one supply operation.

[0071] [Reference examples 1, 2, 3] In Reference Examples 1, 2, and 3, the air discharge pressure from the nozzle was set to 0.1 MPa, 0.2 MPa, or 0.5 MPa, respectively, as shown in Table 2, and air was intermittently supplied to the adsorption surface 71 of the adsorption unit 70 at intervals of 0.05 seconds. In Reference Examples 1, 2, and 3, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 20 times.

[0072] [Reference examples 4, 5, 6] In Reference Examples 4, 5, and 6, the air discharge pressure from the nozzle was set to 0.1 MPa, 0.2 MPa, or 0.5 MPa, respectively, as shown in Table 2, and air was intermittently supplied to the adsorption surface 71 of the adsorption part 70 at 0.1 second intervals. In Reference Examples 4, 5, and 6, the air supply period in one supply operation was 1 second, and the number of times air was discharged from the nozzle in one supply operation was 10.

[0073] [Table 2]

[0074] (Evaluation of pit defects) The entire surfaces of the aluminum alloy substrates obtained in Examples 1 and 2, Comparative Examples 1 and 2, Reference Examples 1 to 6, and Reference Comparative Examples 1 to 5 were observed using an optical inspection machine (OSA7100 manufactured by KLA Tencor Corporation), and the number of concave defects on the entire surface of the substrate was counted. Both surfaces of 50 aluminum alloy substrates (100 surfaces in total) for each Reference Comparative Example and Reference Example were evaluated for concave defects.

[0075] (Processing time evaluation) When the processing time in the foreign matter removal step did not exceed the predetermined standard time, it was evaluated as "no extension." When the processing time in the foreign matter removal step exceeded the predetermined standard time, the number of seconds N by which it exceeded the standard time was evaluated as "N-second extension."

[0076] As shown in Table 1, no pit defects were generated in Examples 1 and 2, whereas pit defects were generated in Comparative Examples 1 and 2.

[0077] As shown in Table 2, in Reference Examples 1 to 6, the number of pit defects was one or less. Furthermore, in Reference Examples 1 to 6, the processing time was not extended and the processing efficiency was also good. In Reference Comparative Examples 1 to 5, the number of pit defects was two or more. Furthermore, in Reference Comparative Examples 4 and 5, the processing time in the foreign matter removal step exceeded the predetermined reference time of one second. [Explanation of symbols]

[0078] 30 Foreign matter suction device 32 Suction part 50 Foreign matter removal device 52 Supply section 60 Cutting equipment 64 Cutting part 68 Holding part 70 Adsorption part 71 Adsorption surface 90 Manufacturing equipment 100 disc-shaped substrate

Claims

1. a first step of supplying a fluid to an adsorption surface of an adsorption unit that adsorbs one surface of a disk-shaped substrate while the disk-shaped substrate is not being adsorbed, thereby removing foreign matter adhering to the adsorption surface; a second step of sucking the foreign matter removed from the suction surface while continuing to supply the fluid in the first step; a third step of adsorbing one surface of the disk-shaped substrate onto the adsorption surface to which the fluid has been supplied; a fourth step of performing at least one treatment selected from the group consisting of a cutting treatment, a grinding treatment, and a polishing treatment on the disk-shaped substrate adsorbed on the adsorption surface; A method for manufacturing a disk-shaped substrate comprising:

2. a supply unit for supplying the fluid is provided in a holder that holds the disk-shaped substrate and transfers the disk-shaped substrate to the suction surface, a suction unit that sucks the foreign matter removed from the suction surface is provided on the holding unit; The method for producing the disk-shaped substrate according to claim 1 .

3. the supply unit and the suction unit move together with the holder, and before the disk-shaped substrate is transferred to the suction surface, the supply unit supplies the fluid to the suction surface, and the suction unit suctions the removed foreign matter. The method for producing the disk-shaped substrate according to claim 2 .

4. In a state where the holder holds the disk-shaped substrate with the one surface facing the suction surface, the supply unit supplies the fluid to the suction surface, and the suction unit sucks the removed foreign matter. The method for producing the disk-shaped substrate according to claim 2 .

5. supplying the fluid to the suction surface while the disk-shaped substrate is not being suctioned to the suction surface while the suction surface is being rotated, thereby removing foreign matter adhering to the suction surface; The method for producing the disk-shaped substrate according to claim 1 .

6. In the first step, the fluid is intermittently supplied to the suction surface during a period when the disk-shaped substrate is not being suctioned, and foreign matter adhering to the suction surface is removed. The method for producing the disk-shaped substrate according to claim 1 .

7. a processing device including a suction unit that suctions one surface of a disk-shaped substrate, and a processing unit that performs at least one process selected from the group consisting of a cutting process, a grinding process, and a polishing process on the disk-shaped substrate suctioned to the suction unit; a foreign matter removal device including a supply unit that supplies a fluid to the suction surface of the suction unit, and that supplies the fluid to the suction surface while the disk-shaped substrate is not being suctioned, thereby removing foreign matter adhering to the suction surface; a foreign matter suction device that sucks foreign matter removed from the adsorption surface when the foreign matter removal device supplies the fluid; An apparatus for manufacturing a disk-shaped substrate comprising:

8. the supply unit is provided in a holding unit that holds the disk-shaped substrate and transfers the disk-shaped substrate to the adsorption unit; The apparatus for manufacturing a disk-shaped substrate according to claim 7 .

9. the foreign matter removal device intermittently supplies the fluid during a period when the disk-shaped substrate is not being attracted to the attraction surface, thereby removing foreign matter adhering to the attraction surface. The apparatus for manufacturing a disk-shaped substrate according to claim 7 .

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