Chip suction tool
The chip suction tool addresses the challenge of securely holding thin and large semiconductor chips by employing a collet and holder configuration with a controlled gap and surrounding side walls, ensuring effective suction and stress-free handling.
Patent Information
- Application Number
- JP2024050745
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-10-09
Smart Images
Figure 2025150066000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a chip suction tool used when picking up a semiconductor chip. [Background technology]
[0002] When picking up semiconductor chips obtained by dividing a wafer attached to dicing tape, a needle pushes up the semiconductor chip from the back side of the dicing tape, and the chip is held by suction with a chip suction tool (see, for example, Patent Document 1). The chip suction tool used in this case generally has a configuration in which a collet made of an elastic body with a chip suction surface is fixed to a metal holder.
[0003] FIG. 11 shows a representative example of such a chip suction tool. FIG. 11(a) is a view from the chip suction surface that holds the semiconductor chip, and FIG. 11(b) is a cross-sectional view taken along line AA in FIG. 11(a). The chip suction tool 1000 in FIG. 11 has a collet 3 shown in FIG. 12 fixed to a holder 2000 shown in FIG. 13. Here, FIG. 12(a) is a view from the chip suction surface, and FIG. 12(b) is a cross-sectional view taken along line AA in FIG. 12(a). Also, FIG. 13(a) is a view from the side that holds the collet, and FIG. 13(b) is a cross-sectional view taken along line AA in FIG. 13(a). Note that in FIG. 13, the holder body 20 and the protrusions 22 are depicted with different fill patterns for convenience in order to distinguish them from each other, but they do not necessarily need to be made of different materials; they are generally molded integrally from the same material.
[0004] 11, the protrusion 220 of the holder 2000 is fitted into the recess 32 of the collet 3. Here, by making the recess 32 shown in FIG. 12 slightly smaller than the protrusion 220 shown in FIG. 12, when fitted, the elasticity of the collet 3 causes the inner surface of the recess 32 to adhere tightly to the outer periphery of the protrusion 220, and the collet 3 is fixed to the holder 2000.
[0005] As shown in FIG. 11, when the collet 3 is fixed to the holder 2000, the through-hole 21 provided to penetrate the protrusion 220 and the holder body 20 and the suction hole 31 of the collet 3 are connected.
[0006] Incidentally, for the sake of simplicity, the collet 3 shown in Figure 12 only has suction holes 31 on the flat surface 33, but grooves are often used to attract a wide area of the semiconductor chip C. As an example, Figure 14 shows a collet 300 with grooves formed along diagonal lines. Here, Figure 14(a) is a view of the collet 300 as seen from the chip suction surface side, and Figure 14(b) is a cross-sectional view of the AA line portion of Figure 14(a). Hereinafter, when describing the collet 3, collets with grooves such as collet 300 also apply.
[0007] As described above, in the chip suction tool 1000 shown in Fig. 11, the suction holes 31 and the through holes 21 are connected, and the outer periphery of the protrusion 32 is sealed with an elastic body. Therefore, by connecting the through holes 21 to a decompression system, it is possible to suck in the semiconductor chip that is in close contact with the flat portion 33. This makes it possible to suck and hold the semiconductor chip C as shown in Fig. 15. In other words, it is possible to receive the semiconductor chip C that has been pushed up from the dicing sheet.
[0008] However, as mentioned above, the size (design dimensions) of the recess 32 is smaller than the protrusion 220, making it difficult to achieve a secure fit. This can result in an incomplete fit, as shown in Figure 16(a). If an attempt is made to chuck a semiconductor chip C in this state, the cross section will be boat-shaped, i.e., a dent will occur near the chuck ridge 31 in the flat portion 33, as shown in Figure 16(b). As a result, stress is applied to the semiconductor chip C being chucked and held, which can cause deformation and cracks or breakage in the case of a thin semiconductor chip. Even if no cracks or breakage occur, the function of the semiconductor element may be impaired.
[0009] On the other hand, a chip suction tool for suction-holding a thin semiconductor chip has a configuration as shown in Fig. 17 (Patent Document 2). Chip suction tool 1001 in Fig. 17 is formed by fitting collet 3001 shown in Fig. 18 into (between side walls 23 of) holder 2001 shown in Fig. 19, and since the design dimensions of lx and ly of collet 3001 are slightly larger than Lx and Ly of holder 2001, it is fixed in place by elastic force.
[0010] In the case of the chip suction tool 1001 of FIG. 17, the cross section does not deform into a boat shape as shown in FIG. 16(b), and it is possible to hold a thin semiconductor chip without deformation. [Prior art documents] [Patent documents]
[0011] [Patent Document 1] Japanese Patent Application Laid-Open No. 2017-130499 [Patent Document 2] Japanese Patent Application Laid-Open No. 2006-161588 Summary of the Invention [Problem to be solved by the invention]
[0012] In recent years, as electronic devices have become smaller, there has been a trend to incorporate more functions into a single semiconductor chip in order to make the overall device smaller. As a result, the number of larger semiconductor chips has been increasing, while at the same time, the thickness of the chips has been decreasing. For this reason, chip suction tools that can handle thin and large semiconductor chips are required. However, the chip suction tool shown in Figure 11 is not suitable for thin semiconductor chips. Due to leakage, we attempted to pick up thin and large semiconductor chips using the chip suction tool shown in Figure 17, but we found that there were cases where the tool was unable to hold the chips by suction, particularly when picking them up from dicing tape. In other words, we found that there were cases where the suction force was insufficient to hold the large semiconductor chips.
[0013] Therefore, we investigated the cause of this and found that, as shown in Figure 20, a small gap occurs at the surface where the collet 3001 and the chip suction tool 2001 come into contact, and due to a small leak (leaks LW1 and LW2 become inflow OM0), the pressure inside the suction hole 31 cannot be sufficiently reduced, and therefore, sufficient suction force to hold the large semiconductor chip C cannot be secured. The present invention has been made in consideration of the above problems, and provides a chip suction tool that can ensure holding force even when picking up thin and large semiconductor chips, without applying stress that could damage the semiconductor chips. [Means for solving the problem]
[0014] In order to solve the above problem, the invention described in claim 1 is as follows: A chip suction tool used to suction and hold a semiconductor chip, a collet having a flat portion that comes into close contact with the semiconductor chip and having a suction hole formed in the flat portion; a holder for holding the collet; The holder has a protrusion on the surface that holds the collet, with a through hole that communicates with the suction hole, and a side wall that fits tightly around the collet, and the collet is a chip suction tool that has a recess formed in it that fits into the protrusion of the holder.
[0015] The invention described in claim 2 is the chip suction tool described in claim 1, This is a chip suction tool in which the outer periphery of the protrusion of the holder and the inner periphery of the recess of the collet do not come into close contact with each other, leaving a gap.
[0016] The invention described in claim 3 is the chip suction tool described in claim 1, The chip suction tool has a groove formed along the inner periphery of the side wall on the surface of the holder that holds the collet.
[0017] The invention described in claim 4 is a chip suction tool according to any one of claims 1 to 3, The side wall of the holder is a chip suction tool that surrounds the entire periphery of the collet.
[0018] The invention described in claim 5 is a chip suction tool according to any one of claims 1 to 3, The side wall of the holder is a chip suction tool that is divided into multiple parts.
[0019] The invention described in claim 6 is the chip suction tool described in claim 4, The member forming the holder is a chip suction tool having higher rigidity than the collet.
[0020] The invention described in claim 7 is the chip suction tool described in claim 5, The member forming the holder is a chip suction tool having higher rigidity than the collet.
[0021] The invention described in claim 8 is the chip suction tool described in claim 7, The shape of the surface of the collet that comes into close contact with the holder is rectangular, The side walls of the rectangular chip suction tool are divided at the four corners.
[0022] The invention described in claim 9 is the chip suction tool described in claim 8, This is a chip suction tool with opposing side walls that have different rigidities. [Effects of the Invention]
[0023] According to the present invention, it is possible to pick up a thin and large semiconductor chip while ensuring a holding force and without applying stress that may damage the semiconductor chip. [Brief explanation of the drawings]
[0024] [Figure 1] 1A is a view of a chip suction tool according to a first embodiment of the present invention, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view thereof. [Figure 2] 1A is a view of a collet constituting a chip suction tool according to a first embodiment of the present invention, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view thereof. [Figure 3] 1A is a view of a holder constituting a chip suction tool according to a first embodiment of the present invention, as seen from the side holding a collet, and FIG. 1B is a cross-sectional view thereof. [Figure 4] 1A is a view of a tip suction tool according to a first modified example of the first embodiment of the present invention, as seen from the tip suction surface side, and FIG. 1B is a cross-sectional view. [Figure 5] 10A is a view of a holder constituting a tip suction tool according to a second modified example of the first embodiment of the present invention, as seen from the side holding a collet, and FIG. 10B is a cross-sectional view thereof. [Figure 6] 1A is a view of a tip suction tool according to a second modified example of the first embodiment of the present invention, as seen from the tip suction surface side, and FIG. 1B is a cross-sectional view. [Figure 7] 10A is a view of a holder constituting a chip suction tool according to a second embodiment of the present invention, as seen from the side holding a collet, and FIG. 10B is a cross-sectional view thereof. [Figure 8] 10A is a view of a chip suction tool according to a second embodiment of the present invention, as seen from the chip suction surface side, and FIG. 10B is a cross-sectional view thereof. [Figure 9] 10A is a view of a holder constituting a tip suction tool according to a modified example of the second embodiment of the present invention, as seen from the side holding a collet, and FIG. 10B is a cross-sectional view thereof. [Figure 10] 10A is a view of a tip suction tool according to a modified example of the second embodiment of the present invention, as seen from the tip suction surface side, and FIG. 10B is a cross-sectional view. [Figure 11] 1A and 1B are diagrams showing an example of a conventional chip suction tool, in which (a) is a view from the chip suction surface side, and (b) is a cross-sectional view. [Figure 12] 1A is a view of a collet constituting a conventional chip suction tool, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view thereof. [Figure 13] 1A and 1B are diagrams showing an example of a holder constituting a conventional chip suction tool, in which (a) is a view from the side holding the collet, and (b) is a cross-sectional view. [Figure 14] FIG. 10 is an example of a collet having a groove on its chip adsorption surface, where (a) is a view from the chip adsorption surface side, and (b) is a cross-sectional view. [Figure 15] FIG. 1 is a diagram showing a state in which an example of a conventional chip suction tool is holding a semiconductor chip. [Figure 16] 1A is a diagram showing a state in which the holder and collet are not fully fitted together in an example of a conventional chip suction tool, and FIG. 1B is a diagram showing how a semiconductor chip is sucked up in the same state. [Figure 17] 1A is a view of a collet constituting another example of a conventional chip suction tool, as seen from the chip suction surface side, and FIG. 1B is a cross-sectional view thereof. [Figure 18] 1A is a view of a holder constituting another example of a conventional chip suction tool, as seen from the side holding the collet, and FIG. 1B is a cross-sectional view thereof. [Figure 19] 1A is a view of another example of a conventional chip suction tool as seen from the side holding the collet, and FIG. 1B is a cross-sectional view thereof. [Figure 20] 10A and 10B are diagrams for explaining problems that arise in another example of a conventional chip suction tool. DETAILED DESCRIPTION OF THE INVENTION
[0025] An embodiment of the present invention will be described with reference to the drawings. Fig. 1 shows a chip suction tool 1 according to the first embodiment of the present invention, in which Fig. 1(a) is a view from the chip suction surface on the side holding the semiconductor chip, and Fig. 1(b) is a cross-sectional view taken along line AA in Fig. 1(a).
[0026] The chip suction tool 1 in FIG. 1 is a collet 3 shown in FIG. 2 fixed to a holder 2 shown in FIG. 3. Here, FIG. 2(a) is a view of the collet 3 seen from the chip suction surface side, and FIG. 2(b) is a cross-sectional view taken along line AA in FIG. 2(a). Also, FIG. 3(a) is a view of the holder 2 seen from the side holding the collet, and FIG. 3(b) is a cross-sectional view taken along line AA in FIG. 3(a). In FIG. 3, the holder body 20, the protrusions 22, and the side walls 23 are conveniently depicted with different fill patterns to distinguish them, but they do not necessarily need to be made of different materials; they are generally molded integrally from the same material.
[0027] The collet 3 is preferably made of an elastic material, such as natural or synthetic rubber, commonly known as rubber. The holder body 20, protrusions 22, and side walls 23 that make up the holder 20 are made of a rigid material that is at least more rigid than the collet 3, and is generally selected from metals such as aluminum, titanium, and stainless steel, taking into consideration strength and weight, but is not limited to metals and may also be made of glass or ceramics.
[0028] The collet 3 constituting the chip suction tool 1 shown in Figure 1 is basically the same as that shown in Figure 12, and may also have a groove 34 provided in the flat portion 33, as in the collet 300 shown in Figure 14.
[0029] On the other hand, the holder 2 has a protrusion 22 having a through-hole 21 penetrating the holder body 20, and side walls 23 that sandwich the periphery of the collet 3.
[0030] For this reason, although the chip suction tool 1 appears to be a simple combination of the chip suction tool 1000 shown in Figure 11 and the chip suction tool 1001 shown in Figure 17, the dimensional relationship between the protrusion 22 of the holder 2 and the recess 32 of the collet 3 is different from that of the chip suction tool 1000 shown in Figure 11.
[0031] Specifically, in the chip suction tool 1000 shown in FIG. 11 , the collet 33 is in close contact with the protrusion 220 of the holder 2000, whereas in the chip suction tool 1, a gap is formed between the outer periphery of the protrusion 22 of the holder 2 and the inner periphery of the recess 32 of the collet 3. That is, the width D220 of the protrusion 220 of the holder 2000 is slightly larger (by up to approximately 1000 μm) than the design dimension of the width D32 of the recess 32 of the collet 3, whereas the width D22 of the protrusion 22 of the holder 2 constituting the chip suction tool 1 is smaller than the design dimension of the width D32 of the recess 32. Note that in the first embodiment, the protrusion 22 is shaped like a rectangular prism. However, this is not necessarily required, although a polygonal shape is preferable. It is also preferable that the recess 32 be shaped to match the shape of the protrusion 22. The gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22 is preferably 0 μm to 200 μm, more preferably 100 μm or less. Here, a gap of 0 μm means that even if part of the outer periphery is in close contact, it is acceptable as long as there is a gap in other parts.
[0032] Because there is a gap between the inner surface of recess 32 and the outer periphery of protrusion 22, holder 2 cannot hold collet 3 with protrusion 22. For this reason, the design dimensions of lx and ly of collet 3 shown in Figure 2(a) are made slightly larger (by 20 to 500 μm depending on the size of Lx and Ly) than Lx and Ly of holder 2 shown in Figure 3(a), so that collet 3 is fixed by elastic force.
[0033] 1(b), the chip suction tool 1 configured as described above has a larger pressure loss in the process from the leak LW1 or leak LW2 to the inflow OM1 than the chip suction tool 1001 shown in FIG. 17. Therefore, the inflow OM1 is extremely small, and the reduced pressure in the suction hole 31 ensures a suction force sufficient to hold a large semiconductor chip C. Incidentally, the gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22 is set to 200 μm or less (preferably 100 μm or less) as mentioned above in order to ensure pressure loss.
[0034] Furthermore, because the chip suction tool 1 has a gap between the inner surface of the recess 32 and the outer periphery of the protrusion 22, the periphery of the opening of the recess of the collet 3 can be tightly attached to the holder 2 when the collet 3 is fitted into the holder 2. This prevents the cross section from becoming boat-shaped as shown in Figure 16(b) when the semiconductor chip C is suctioned. In other words, no stress is generated that could deform and damage the semiconductor chip C.
[0035] In the chip suction tool 1 of the first embodiment shown in Figure 1, the surface where the collet 3 comes into close contact with the holder 2 is rectangular, and side walls 23 are provided that surround this rectangle with the four corners cut off. However, in such an arrangement of side walls 23, it is also possible to provide a difference in rigidity between the side walls at opposing positions. An example of this is the chip suction tool 100, which is a first modification of the first embodiment shown in Figure 4. In the chip suction tool 100, the side wall 23S is made of a material with lower rigidity than the side wall 23H, and may be an elastic body such as rubber.
[0036] The chip suction tool 100 shown in Figure 4 is characterized in that it is relatively easy to fit the collet 3, and when a force is applied perpendicularly to the surface formed by the flat portion 33, the side wall 23S absorbs the force applied laterally (X direction, Y direction) to the collet 3, thereby maintaining the flatness of the flat portion 33.
[0037] Holder 201 shown in Fig. 5 constitutes chip suction tool 101, which is Modification 2 of Embodiment 1 shown in Fig. 6. A feature of holder 201 compared to holder 2 in Fig. 3 is that a groove 24 is provided along the inner periphery of side wall 23 on the surface that holds collet 3. By providing this groove 24, it is possible to prevent the outer periphery of collet 3 from swelling up when collet 3 is fitted into holder 201 as shown in Fig. 6. In other words, when holder main body 20 and side wall 23 are integrally molded, it is possible to eliminate the influence of the R (so-called corner R) remaining in the corner formed by the inside of side wall 23 and the surface of holder main body 20.
[0038] The holder 202 shown in Fig. 7 constitutes the chip suction tool 102 according to the second embodiment of the present invention shown in Fig. 8. Unlike the holder 2 shown in Fig. 3, the holder 202 shown in Fig. 7 has the following features: The sidewall 230 has a shape that surrounds the entire periphery of the collet 3. Therefore, the chip suction tool 102 shown in FIG. 8 does not cause a leak at the bottom surface of the collet 3, and the leak is limited to the leak LW1 shown in FIG. 8(b). Therefore, it is possible to have a suction force greater than that of the chip suction tool 1 shown in FIG. 1. However, it is difficult to securely fit the collet 3 inside the sidewall 230, and care must be taken as torsional stress may remain in the collet 3.
[0039] Furthermore, even in a configuration in which the side wall 230 covers the entire circumference of the collet 3, rounding is likely to remain in the corner formed by the inside of the side wall 230 and the surface of the holder body 20. For this reason, it is desirable to use a chip suction tool 103 in which the collet 3 is fitted into a holder 203 in which a groove 240 is formed along the inner circumference of the side wall 230, as shown in FIG.
[0040] As described above, the various chip suction tools shown as embodiments of the present invention can pick up thin and large semiconductor chips while ensuring a sufficient holding force and without applying stress that could damage the semiconductor chips. This makes it possible to reliably pick up even thin and large semiconductor chips that are tightly attached to a dicing tape. [Explanation of symbols]
[0041] 1, 100, 101, 102, 103, 1000, 1001 Chip suction tool 2,200, 201, 202, 203, 2000, 2001 holders 3, 300, 3001 Collet 20 Holder body 21 Through hole 22, 220 protrusion 23 Side wall 23H elastic sidewall 23S rigid sidewall 24 groove 30 Elastic Body 31 Adsorption hole 32 recess 33 Flat area 34 Groove 230 (all-around) sidewall 240 (all-around) grooves
Claims
1. A chip suction tool used to suction and hold a semiconductor chip, a collet having a flat portion that comes into close contact with the semiconductor chip and having a suction hole formed in the flat portion; a holder for holding the collet; the holder has, on a surface for holding the collet, a protrusion with a through hole communicating with the suction hole, and a side wall that fits tightly around the periphery of the collet; The collet is a chip suction tool having a recess formed therein that fits with the protrusion of the holder.
2. The chip suction tool according to claim 1, A chip suction tool in which the outer periphery of the protrusion of the holder and the inner periphery of the recess of the collet do not adhere to each other, leaving a gap.
3. The chip suction tool according to claim 1, A chip suction tool in which a groove is formed along the inner periphery of the side wall on the surface of the holder that holds the collet.
4. The chip suction tool according to any one of claims 1 to 3, A chip suction tool in which the side wall of the holder surrounds the entire periphery of the collet.
5. The chip suction tool according to any one of claims 1 to 3, A chip suction tool in which the side wall of the holder is divided at multiple locations.
6. The chip suction tool according to claim 4, A chip suction tool in which the member forming the holder has higher rigidity than the collet.
7. The chip suction tool according to claim 5, A chip suction tool in which the member forming the holder has higher rigidity than the collet.
8. The chip suction tool according to claim 7, The shape of the surface of the collet that comes into close contact with the holder is rectangular, A chip suction tool in which the side walls are divided at the four corners of the rectangle.
9. The chip suction tool according to claim 8, A chip suction tool with opposing side walls that differ in rigidity.
Citation Information
Patent Citations
Control device of internal combustion engine
JP2006161588A
Chip component pickup device, and needle and collet alignment method using the same
JP2017130499A