Exposure system, method for producing article, and exposure method

Abstract

To provide an exposure system capable of readily suppressing an increase of a tact time when holding capture boards in common by multiple exposure devices.SOLUTION: An exposure system according to the present invention comprises multiple exposure apparatuses, a first number of image capturing units, and, when exposure is performed in each of a second number of exposure apparatuses greater than the first number, a control unit that performs: a time acquisition step of acquiring the time required for processing exposure in each of the second number of exposure apparatuses; a classification step of classifying the second number of exposure apparatuses into a first number of groups based on the acquired time obtained in the time acquisition step; and an adjustment step of adjusting the imaging periods during processing in each of the classified multiple exposure apparatuses in each group classified in the classification step so that they are different from each other.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to an exposure system, an article manufacturing method, and an exposure method. [Background technology]

[0002] Conventionally, in an exposure system that includes a plurality of exposure apparatuses and a predetermined component that is exclusively shared by the plurality of exposure apparatuses, it is required to suppress an increase in takt time by reducing the waiting period of other exposure apparatuses when a predetermined exposure apparatus uses the predetermined component. Patent Document 1 discloses a technique for suppressing an increase in takt time in a substrate processing system that includes a plurality of substrate processing sections and at least one transport means that is exclusively shared by the plurality of substrate processing sections. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-093227 Summary of the Invention [Problem to be solved by the invention]

[0004] Meanwhile, conventionally, there is known an exposure system that includes a plurality of exposure apparatuses and a capture board that is exclusively shared by the plurality of exposure apparatuses. Specifically, in the exposure system, images of the master mark formed on the master and the substrate mark formed on the substrate, which are acquired in each exposure device to align the master and the substrate, are captured by the capture board.

[0005] In this case, if a request arises to simultaneously capture more signals for the images acquired by each of the multiple exposure devices than the number of channels on the capture board, a waiting period will be required to capture at least one of the signals later, increasing the takt time. On the other hand, it is possible to suppress the increase in the takt time by increasing the number of capture boards and thereby suppressing the occurrence of the waiting period, but in this case, costs increase.

[0006] Furthermore, by using the technology disclosed in Patent Document 1 to set an appropriate waiting period for each channel when capturing such a large number of signals using the capture board, it may be possible to reduce the overall waiting period. However, the process of providing an appropriate waiting period for each channel is very complicated.

[0007] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide an exposure system that can easily suppress an increase in takt time when a capture board is shared by a plurality of exposure apparatuses. [Means for solving the problem]

[0008] The exposure system of the present invention comprises a plurality of exposure devices, each having an imaging unit that images an original mark formed on an original and a substrate mark formed on a substrate, and that project an image of the original pattern onto the substrate and expose the substrate; a first number of image acquisition units, each configured to acquire an image of the original mark and the substrate mark acquired by the imaging unit provided in a predetermined exposure device; and a control unit that controls exposure in the exposure device corresponding to the image acquired based on the image acquired by the predetermined image acquisition unit, wherein when exposure is performed in each of a second number of exposure devices greater than the first number, the control unit performs an acquisition process that acquires the time required for exposure processing in each of the second number of exposure devices, a classification process that classifies the second number of exposure devices into a first number of groups based on the time acquired by the acquisition process, and an adjustment process that adjusts the imaging period for processing in each of the multiple exposure devices classified in each group into which the multiple exposure devices are classified by the classification process so that they are different from each other. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide an exposure system that can easily suppress an increase in takt time when a capture board is shared by a plurality of exposure apparatuses. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 2 is a schematic projection view of the exposure apparatus provided in the exposure system according to the first embodiment in the XZ plane. [Figure 2] FIG. 1 is a block diagram of an exposure system according to a first embodiment. [Figure 3] 5 is a flowchart showing processing for grouping exposure apparatuses in the exposure system according to the first embodiment. [Figure 4] FIG. 4 is a diagram showing an example of takt time design values ​​of jobs executed in each exposure apparatus provided in the exposure system according to the first embodiment. [Figure 5] 5 is a diagram showing an execution sequence of a job that is executed in each exposure apparatus provided in the exposure system according to the first embodiment. FIG. [Figure 6] FIG. 10 is a diagram showing an execution sequence of a job that is executed in some exposure apparatuses provided in an exposure system according to a second embodiment. [Figure 7] FIG. 10 is a partial block diagram of an exposure system according to a third embodiment. [Figure 8] 10 is a flowchart showing a process of switching control of a capture board for manual assistance in an exposure system according to a third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0011] The exposure system according to this embodiment will be described in detail below with reference to the accompanying drawings. Note that the drawings may be drawn at a scale different from the actual scale in order to facilitate understanding of this embodiment. In the following, the direction perpendicular to the substrate holding surface of the substrate stage 9 (the direction parallel to the optical axis of the projection optical system 7) is defined as the Z direction, the direction in which the substrate 8 is scanned in a plane parallel to the substrate holding surface is defined as the Y direction, and the direction perpendicular to the Y direction is defined as the X direction. Furthermore, the rotation directions around the Z direction, X direction, and Y direction are defined as the θ direction, pitch direction, and roll direction, respectively.

[0012] [First embodiment] Conventionally, when manufacturing flat panel displays (FPDs), semiconductor devices, etc., an exposure apparatus is used to transfer a pattern formed on an original such as a mask onto a substrate such as a glass plate or wafer coated with a photosensitive agent. In such an exposure apparatus, it is important to align the shot area on the substrate and the pattern formed on the original with high precision.

[0013] Generally, this alignment is performed by measuring the positions of a master mark formed on the master and a substrate mark formed on the substrate using a light beam having a wavelength other than the exposure wavelength. Specifically, the alignment is performed by measuring the relative positional deviation between the original mark and the substrate mark via a projection optical system, or by measuring the absolute positional deviation of the substrate mark without using a projection optical system.

[0014] In recent years, there has been a demand for improved alignment accuracy between the original and the substrate in exposure apparatuses, and exposure apparatuses have been proposed that aim to improve this by providing multiple position detection optical systems to observe multiple marks simultaneously. In this case, it is not possible to connect a greater number of position detection optical systems to a given capture board than the number of channels on that capture board, and therefore preparing multiple capture boards in this case increases costs.

[0015] On the other hand, in order to prevent such cost increases, it is also possible to consider a method in which a specified capture board is shared by multiple position detection optical systems, that is, the position detection optical system that captures the mark image using the specified capture board can be switched as needed. However, with such a method, if there are simultaneous requests to capture mark images detected by more position detection optical systems than the number of channels on a given capture board, it becomes necessary to wait for the capture of the mark image detected by a given position detection optical system. In this case, the waiting period increases the takt time.

[0016] Furthermore, conventionally, techniques have been proposed for synchronizing a plurality of units provided in an exposure apparatus with one another. However, in this technology, when the processing times of the multiple units are different from one another, synchronization is achieved by providing a waiting period in each unit with a relatively short processing time, so an increase in takt time cannot be suppressed.

[0017] Furthermore, conventionally, a technique has been proposed for suppressing an increase in takt time by reducing the standby period in each of at least one unit shared by a plurality of exposure apparatuses. However, in this technology, waiting periods are appropriately set in consideration of the processing time in each unit, which makes the processing extremely complicated. Therefore, an object of this embodiment is to provide an exposure system that can easily suppress an increase in takt time when a capture board is shared by a plurality of exposure apparatuses.

[0018] FIG. 1 shows a schematic projection view in the XZ plane of an exposure apparatus 100a provided in an exposure system 200 according to the first embodiment. Exposure apparatus 100a is a photolithography apparatus that performs a photolithography process included in the manufacturing process of flat panel displays (FPDs), semiconductor devices, and the like.

[0019] As shown in FIG. 1, the exposure apparatus 100a includes an illumination optical system 1, a slit 3, an original stage 5, laser interferometers 6a and 6b, a projection optical system 7, a substrate stage 9, an alignment measurement unit 10 (imaging unit), and a control unit 20a. The illumination optical system 1 includes an exposure light source such as a mercury lamp or an LED lamp (not shown), a wavelength selection filter, a lens group, and an exposure shutter 2, and is configured to irradiate the original 4 with exposure light having a wavelength suitable for exposure.

[0020] Furthermore, in the exposure apparatus 100a, the exposure shutter 2 provided in the illumination optical system 1 blocks the exposure light from the exposure light source, making it possible to interrupt exposure without turning off the exposure light source. Then, after the slit 3 extracts the exposure light from the exposure light source provided in the illumination optical system 1, the extracted exposure light is irradiated onto the original 4.

[0021] The original stage 5 is configured to be movable while holding the original 4, and specifically, is scanned in the Y direction by a drive mechanism (not shown), thereby controlling the irradiation position of the exposure light from the illumination optical system 1 on the original 4. The laser interferometer 6a is configured to constantly manage the position of the original stage 5 by irradiating measurement light from outside the original stage 5 toward the original stage 5 and receiving the measurement light reflected by the original stage 5.

[0022] The projection optical system 7 is composed of lenses, mirrors, etc. that form a magnification correction unit (not shown), and guides the exposure light that has passed through the original 4 to the substrate 8 so that the image of the pattern formed on the original 4 is projected onto the substrate surface of the substrate 8. In addition, the lenses and mirrors provided in the projection optical system 7 can be moved in the Z direction, pitch direction, and roll direction by a drive mechanism (not shown). This allows the image of the pattern formed on the original 4 to be projected onto the surface of the substrate 8 while generating any desired magnification, shift, or focus.

[0023] The projection optical system 7 may be an equal-magnification imaging optical system that projects an image of the pattern formed on the original 4 onto the substrate surface of the substrate 8 at equal magnification, or an enlarged imaging optical system that projects an enlarged image onto the substrate surface, or a reduced imaging optical system that projects a reduced image. The projection optical system 7 may be a mirror projection system using a huge mirror, or may be a multi-lens system using multiple lenses.

[0024] The substrate stage 9 is configured to be movable while holding the substrate 8, and specifically, is scanned in the Y direction by a drive mechanism (not shown), and can also move in the X, Z, θ, Pitch, and Roll directions, thereby controlling the position on the surface of the substrate 8 where the exposure light is guided by the projection optical system 7. The laser interferometer 6b is configured to constantly manage the position of the substrate stage 9 by irradiating measurement light from outside the substrate stage 9 toward the substrate stage 9 and receiving the measurement light reflected by the substrate stage 9.

[0025] In the exposure apparatus 100a, the original stage 5 and the substrate stage 9 are driven in synchronization with each other, so that an image of the pattern of the original 4 held by the original stage 5 is projected onto the substrate surface of the substrate 8 held by the substrate stage 9. In the exposure apparatus 100a, the original 4 held by the original stage 5 and the substrate 8 held by the substrate stage 9 are arranged at positions optically conjugate with each other.

[0026] As described above, in exposure apparatus 100a, the image of the pattern of original 4 is projected onto the surface of substrate 8 via projection optical system 7, and substrate 8 is exposed. After the exposure of the substrate 8 is completed, the substrate 8 is transferred to a substrate transport robot (not shown) by a lift bar (not shown) provided on the substrate stage 9 and carried out. When the substrate 8 is carried into the exposure apparatus 100 a, the lift bar receives the substrate 8 from the substrate transport robot, and then places the received substrate 8 on the substrate holding surface of the substrate stage 9 .

[0027] The pattern formed on the original 4 is the pattern of one layer of a laminated structure when manufacturing an FPD or semiconductor device by a photolithography process. Then, an image of the pattern is projected onto the surface of the substrate 8 coated with a photosensitive material, forming a latent image of the pattern in the photosensitive material of the substrate 8, and the formed latent image is developed in the development process to be converted into a physical resist pattern.

[0028] The alignment measurement unit 10 is configured to measure the positions of the master marks formed on the master 4 and the substrate marks formed on the substrate 8, respectively. Specifically, the alignment measurement unit 10 can be moved in the X and Y directions by a drive mechanism (not shown) provided therein. Then, by combining the movement of the alignment measurement unit 10 with the movements of the original stage 5 and the substrate stage 9, it is possible to measure the positions of the original marks and the substrate marks.

[0029] The alignment measurement unit 10 also includes a position detection optical system 11a. When measuring the positions of the original mark and the substrate mark, a signal detected by the position detection optical system 11a is captured by a capture board 12 (image capture unit) provided outside the exposure apparatus 100a in the exposure system 200 (capture step). Then, the image data generated by the capture board 12 is transferred to the control unit 20a.

[0030] The control unit 20a uses the measurement results of the positions of the original mark and the substrate mark by the alignment measurement unit 10 to control the drive of the original stage 5 and the substrate stage 9, thereby making it possible to correct the positions of the original 4 and the substrate 8 when exposing the substrate 8. Specifically, the control unit 20a can obtain the position information of each of the master marks and the board marks by performing image processing on the image data obtained from the capture board 12.

[0031] FIG. 2 shows a block diagram of an exposure system 200 according to this embodiment. As shown in FIG. 2, the exposure system 200 includes exposure apparatuses 100a, 100b, and 100c, capture boards 12a and 12b, a switching control unit 210, and a connection switcher 220 (connection unit). The exposure apparatuses 100b and 100c have the same configuration as the above-described exposure apparatus 100a.

[0032] The switching control unit 210 includes a communication unit 211 , a storage unit 212 , a calculation unit 213 , and a control unit 214 . The communication unit 211 is configured to acquire job information and apparatus information transmitted from the control units 20a, 20b, and 20c provided in the exposure apparatuses 100a to 100c, respectively.

[0033] The storage unit 212 is configured to store the job information and device information acquired by the communication unit 211. Furthermore, the storage unit 212 stores in advance the number of exposure devices and the number of capture boards provided in the exposure system 200 .

[0034] The calculation unit 213 is configured to calculate a design value of the takt time of the corresponding job based on the job information and device information acquired by the communication unit 211. The design value of the takt time of a job here means the expected takt time of the job, in other words, the expected processing time of the job, or in other words, the time required to process the job. Note that hereinafter, the design value of the takt time may be simply referred to as the takt design value. The control unit 214 is configured to instruct the connection switch 220 to switch between the capture boards 12a and 12b based on the calculation results of the calculation unit 213, and to control the capture of images by the switched capture board. In the exposure system 200 according to this embodiment, a single control unit may take on the functions of the switching control unit 210 and the control units 20a, 20b, and 20c.

[0035] The switching control unit 210, with the above configuration, instructs the connection switcher 220 to switch between the capture boards 12a and 12b. Based on a switching instruction from the switching control unit 210, the connection switcher 220 switches the connection between the capture boards 12a and 12b and the position detection optical systems 11a, 11b, and 11c provided in the exposure apparatuses 100a to 100c.

[0036] In the exposure system 200 according to this embodiment, a signal detected by one of the position detection optical systems 11a to 11c is captured by one of the capture boards 12a and 12b. Next, image data is generated by the capture board that has captured the signal, and the generated image data is acquired by the control unit 214. Then, the control unit 214 determines which of the exposure devices 100a to 100c to transfer the acquired image data to based on the connection information stored in the memory unit 212, and the communication unit 211 transfers the image data to the control unit provided in the determined exposure device.

[0037] In the exposure system 200 according to this embodiment, exclusive control is applied to each of the capture boards 12a and 12b. That is, each of the capture boards 12a and 12b cannot simultaneously capture signals detected by a plurality of exposure tools among the exposure tools 100a to 100c.

[0038] Therefore, in the exposure system 200 according to this embodiment, the alignment measurement commanded first is executed in the exposure apparatuses 100a to 100c based on the processing described in detail below, and the alignment measurement commanded later that cannot be processed due to exclusive control is put on hold. Then, after the previously instructed alignment measurement is completed, the waiting alignment measurement is executed.

[0039] FIG. 3 is a flowchart showing the grouping process of exposure apparatuses 100a to 100c in exposure system 200 according to this embodiment.

[0040] When this process starts, first, control unit 214 in switching control unit 210 monitors the execution status, including the start, execution, and end of a job in each of exposure apparatuses 100a to 100c (step S301). Specifically, in step S301, the control unit 214 in the switching control unit 210 acquires information indicating the execution status of the job from each of the exposure apparatuses 100a, 100b, and 100c via the communication unit 211.

[0041] Next, switching control unit 210 compares the job execution states of exposure apparatuses 100a to 100c acquired in step S301 with the job execution states of exposure apparatuses 100a to 100c stored in memory unit 212. Then, in at least one of exposure apparatuses 100a to 100c, it determines whether the execution state acquired in step S301 has changed from the execution state stored in memory unit 212 (step S302). The change in the execution state of the job referred to here includes, for example, a change to exposure with different exposure conditions.

[0042] If the execution state acquired in step S301 and the execution state saved in storage unit 212 are the same in any of exposure apparatuses 100a to 100c (No in step S302), the process proceeds to step S303. In step S303, control unit 214 in switching control unit 210 uses the execution status of exposure apparatuses 100a to 100c acquired in step S301 to update the saved data of the execution status of exposure apparatuses 100a to 100c saved in memory unit 212. Then, the process returns to step S301, and continues monitoring the execution status of the job in each of exposure apparatuses 100a to 100c.

[0043] On the other hand, in at least one of exposure apparatuses 100a to 100c, if the execution state acquired in step S301 and the execution state saved in storage unit 212 differ from each other (Yes in step S302), the process proceeds to step S304. In step S304, control unit 214 in switching control unit 210 uses the execution states of exposure apparatuses 100a to 100c acquired in step S301 to update the saved data on the execution states of exposure apparatuses 100a to 100c saved in memory unit 212. Control unit 214 in switching control unit 210 then acquires job information and apparatus information for jobs that have started to be executed or are being executed in each of exposure apparatuses 100a to 100c, and saves this in memory unit 212. Here, in step S304, it is assumed that the job execution status has changed so that job A, job B, and job C are being executed in exposure apparatuses 100a to 100c, respectively.

[0044] Next, it is determined whether the number of exposure apparatuses 100a to 100c that are currently executing jobs is greater than the number of capture boards (step S305, first determination step). If the job is executed in all three (second number) exposure apparatuses 100a to 100c, which is greater than the two (first number) that is the number of capture boards 12a and 12b (Yes in step S305), the process proceeds to step S306.

[0045] That is, when jobs A to C are executed in exposure apparatuses 100a to 100c, respectively, as described above, the process proceeds to step S306. In step S306, calculation unit 213 in switching control unit 210 calculates the takt time design value of the job to be executed based on the job information and apparatus information for each of exposure apparatuses 100a to 100c acquired in step S304.

[0046] FIG. 4 shows an example of the takt time design values ​​for jobs A to C executed in exposure apparatuses 100a to 100c. The tact design values ​​for each of jobs A to C indicated by arrows in FIG. 4 include measured processing time and non-measured processing time.

[0047] Specifically, the measurement processing time is the time required for the alignment measurement processing, and the non-measurement processing time before the measurement processing time includes the time required for the loading processing of the substrate 8, and the non-measurement processing time after the measurement processing time includes the time required for the exposure processing and unloading processing of the substrate 8. More specifically, the time required for the alignment measurement process can be calculated from the number of shot areas on the substrate 8 to be subjected to the exposure process, which is included in the job information.

[0048] Furthermore, the time required for the exposure process of the substrate 8 can be calculated from the exposure speed included in the job information, the acceleration of the substrate stage 9 included in the apparatus information, and the like. The time required for each of the loading and unloading processes of the substrate 8 can be calculated from the speed of the lift bar provided on the substrate stage 9 and the like.

[0049] Then, in switching control unit 210, control unit 214 stores the calculated tact design values ​​for jobs A to C in exposure apparatuses 100a to 100c in storage unit 212. In step S306, instead of calculating the design takt time values ​​for each of jobs A to C, the design takt time values ​​for each of jobs A to C may be acquired from exposure apparatuses 100a to 100c (acquisition step).

[0050] Next, in switching control unit 210, control unit 214 groups jobs A to C based on the takt time design values ​​of jobs A to C for exposure tools 100a to 100c calculated in step S306 (step S307, classification step). Specifically, in step S307, grouping is performed to assign (classify) each of the exposure tools 100a to 100c into a group corresponding to the capture board 12a or a group corresponding to the capture board 12b.

[0051] Such grouping can be performed by using the well-known k-means method for the tact design values, for example, with the number of capture boards 12a and 12b, that is, 2, as the number of groups. However, the grouping is not limited to this, and other known cluster analysis methods may also be used. Furthermore, in the exposure system 200 according to this embodiment, the above grouping is performed based on the principle that the smaller the difference between the takt time design values ​​of the jobs executed by each of the two exposure apparatuses, the more likely it is that the measurement processing periods for each job will overlap with each other.

[0052] Then, of the jobs A to C shown in FIG. 4, the jobs A and B having a relatively small difference in tact design value are assigned to a group corresponding to the capture board 12a, for example. On the other hand, the remaining job C is assigned to the group corresponding to the capture board 12b.

[0053] Next, in the switching control unit 210, the control unit 214 causes the connection switch 220 to connect the exposure device corresponding to each job to the capture board corresponding to the group to which each job is assigned (step S308). That is, in the above example, the exposure apparatuses 100a and 100b that execute jobs A and B, respectively, are connected to the capture board 12a, while the exposure apparatus 100c that executes job C is connected to the capture board 12b. Thereafter, the process returns to step S301, and continues to monitor the job execution status in each of exposure apparatuses 100a to 100c.

[0054] For example, if switching control is performed so that the capture board 12a captures a signal detected by one of the exposure devices 100a and 100b while the other captures a signal detected by the other exposure device, it becomes difficult to generate normal image data from the captured signal. In other words, the capture board 12a is required to be switched, i.e., exclusively controlled, by the control unit 214 of the switching control unit 210 so that after processing of the signal detected by one of the capture boards is completed, the capture board 12a processes the signal detected by the other capture board. Therefore, in exposure system 200 according to this embodiment, the start times of alignment measurement processes for jobs A to C in exposure apparatuses 100a to 100c are adjusted, as will be described in detail later.

[0055] Returning to step S305, consider the case where the number of exposure apparatuses on which the job is executed is two or less, which is the number of capture boards, that is, the case where the job is executed by only one or two (a third number) of the exposure apparatuses 100a to 100c (No in step S305). In this case, proceed to step S309. In step S309, the control unit 214 in the switching control unit 210 does not perform the grouping shown in step S307, but causes the connection switcher 220 to connect each of the exposure apparatuses that will execute the job to the corresponding capture board.

[0056] For example, if exposure apparatuses 100a and 100b execute jobs A and B, respectively, while exposure apparatus 100c executes no jobs, exposure apparatuses 100a and 100b can be connected to capture boards 12a and 12b, respectively. That is, at least one exposure apparatus on which a job is executed can be connected one-to-one to the same number of capture boards as the number of the at least one exposure apparatus. Thereafter, the process returns to step S301, and continues to monitor the job execution status in each of exposure apparatuses 100a to 100c.

[0057] FIG. 5 shows the execution sequences of jobs A to C that are executed in exposure apparatuses 100a to 100c, respectively, in exposure system 200 according to this embodiment, with the start times of the alignment measurement processes adjusted. In Figure 5, to simplify the explanation, the takt design values ​​of jobs A and B assigned to the group corresponding to the capture board 12a and the timing for starting the alignment measurement process within those takt design values ​​are assumed to be identical.

[0058] As described above, only the exposure device 100c is connected to the capture board 12b. Therefore, requests to capture signals detected by a plurality of exposure devices are not made to the capture board 12b at the same time.

[0059] On the other hand, exposure devices 100a and 100b are connected to the capture board 12a. Furthermore, as described above, the design takt values ​​of jobs A and B executed in exposure apparatuses 100a and 100b, and the timings for starting alignment measurement processing within the design takt values, are the same.

[0060] Therefore, if jobs A and B start simultaneously in exposure apparatuses 100a and 100b, respectively, the timing of the alignment measurement processes for jobs A and B will overlap with each other. As described above, the capture board 12a is exclusively controlled so that while it is capturing a signal detected by one of the exposure devices 100a and 100b, it will not capture a signal detected by the other one.

[0061] Therefore, in exposure system 200 according to this embodiment, jobs A and B are executed simultaneously in exposure apparatuses 100a and 100b, respectively, as shown in FIG. Thereafter, before the first alignment measurement process in job B is executed, a waiting period is provided until the first alignment measurement process in job A is completed (adjustment step).

[0062] As a result, the first alignment measurement process in job B is executed immediately after the first alignment measurement process in job A is completed. Such a waiting period can be calculated by the calculation unit 213 in the switching control unit 210 from the job information and device information for each of the exposure apparatuses 100a and 100b stored in the memory unit 212, and can be set in the control unit 20b of the exposure apparatus 100b by the control unit 214.

[0063] As described above, the tact design values ​​of jobs A and B and the timings for starting alignment measurement processing within the tact design values ​​are the same. Therefore, the second and subsequent alignment measurement processes in job B can be performed without overlapping with the alignment measurement process in job A without providing a waiting period. This allows the capture board 12a to sequentially capture signals detected in the alignment measurement processes for jobs A and B, respectively.

[0064] It should be noted that, due to waiting or the like occurring during the loading of substrate 8 in at least one of exposure apparatuses 100a and 100b, the timing of alignment measurement processing for a job being executed in at least one of the exposure apparatuses may change. In other words, in this case, there is a risk that the periods of alignment measurement processing for jobs A and B will overlap with each other.

[0065] In this case, when the periods of the alignment measurement processes for jobs A and B overlap each other, a predetermined waiting period may be provided again before the predetermined alignment measurement process for job B starts, as described above. This allows the alignment measurement processing periods for jobs A and B to be set so that they do not overlap each other again.

[0066] As described above, in the exposure system 200 according to this embodiment, when a job is executed in a plurality of exposure apparatuses, the number of which is greater than the number of capture boards, the tact design value of the job in each of the plurality of exposure apparatuses is calculated. Next, based on the calculated takt design value, grouping is performed in which each of the plurality of exposure tools is assigned to a group corresponding to each capture board.

[0067] In a given group, a given waiting period is provided before a given measurement processing period for at least one job so that the timings of alignment measurement processing for jobs executed by each of the multiple exposure apparatuses assigned to that group do not overlap with each other. This makes it possible to perform exclusive control over the process in which a predetermined capture board captures signals detected by each of the multiple exposure devices, while sufficiently suppressing an increase in the takt time of the job executed by each of the multiple exposure devices. That is, it is possible to achieve both cost reduction by suppressing an increase in the number of capture boards and suppression of an increase in the takt time of each job due to the exclusive control of each capture board, that is, suppression of a decrease in throughput.

[0068] Although the exposure system 200 according to this embodiment is provided with three exposure apparatuses 100a to 100c and two capture boards 12a and 12b, the numbers of exposure apparatuses and capture boards are not limited to these.

[0069] [Second embodiment] FIG. 6 shows the execution sequences of jobs A and B that are executed in exposure apparatuses 100a and 100b, respectively, in which the start times of alignment measurement processes have been adjusted in an exposure system according to the second embodiment. The exposure system according to this embodiment has the same configuration as exposure system 200 according to the first embodiment, except that the process for adjusting the start times of the alignment measurement processes for jobs A to C executed in exposure apparatuses 100a to 100c is different. Therefore, the same components are given the same reference numerals and descriptions thereof will be omitted. Specifically, in the exposure system according to this embodiment, even if a calibration measurement process of the position detection optical system 11 occurs in a specific job being executed by a specific exposure apparatus, as described in detail below, the timing of the alignment measurement process in each job can be adjusted.

[0070] As shown in FIG. 6, jobs A and B being executed in exposure apparatus 100a and 100b, respectively, are adjusted so that the measurement processing period for job A in exposure apparatus 100a starts after the measurement processing period for job B in exposure apparatus 100b ends. Then, consider the case where calibration measurement processing of position detection optical system 11b occurs in exposure apparatus 100b as shown in FIG.

[0071] Specifically, the calibration measurement process is performed periodically in a predetermined job before a predetermined alignment measurement process. Then, if the calibration measurement process occurs before a predetermined alignment measurement process in job B of exposure apparatus 100b, the start time of the predetermined alignment measurement process is shifted to after the end time of the calibration measurement process. In this case, there is a risk that the period of the shifted predetermined alignment measurement process for job B in exposure apparatus 100b and the period of the predetermined alignment measurement process for job A in exposure apparatus 100a will overlap with each other.

[0072] Therefore, in the exposure system according to this embodiment, when a predetermined alignment measurement process is shifted due to the occurrence of a calibration measurement process in a job of a predetermined exposure apparatus in a predetermined group, the following adjustment is made. That is, the periods for the calibration measurement process and the predetermined alignment measurement process are adjusted so that they do not overlap with the periods for the alignment measurement processes in the jobs of the other exposure apparatuses.

[0073] 6, a waiting period is provided between times T1 and T2 so that the calibration measurement process that occurs in job B of exposure apparatus 100b is executed at the time when a predetermined alignment measurement process in job A of exposure apparatus 100a has finished. That is, in this case, the calibration measurement process starts at time T2. Accordingly, the start times of the alignment measurement processes subsequent to the calibration measurement process in job B of exposure apparatus 100b are also shifted to later times.

[0074] More specifically, the switching control unit 210 acquires the execution timing of the calibration measurement process in the job of a predetermined exposure apparatus via the communication unit 211 from the predetermined exposure apparatus. Next, the calculation unit 213 calculates the period of the calibration measurement process based on the acquired execution timing of the calibration measurement process.

[0075] Next, the switching control unit 210 compares the duration of the calibration measurement process and the alignment measurement process executed thereafter in the job for the specified exposure apparatus with the duration of the alignment measurement process in each job for the other exposure apparatuses. If the period of at least one of the calibration measurement process of the specified exposure apparatus and the alignment measurement process executed thereafter overlaps with the period of alignment measurement process of at least one other exposure apparatus, the following adjustment is made.

[0076] That is, in a job for the specified exposure apparatus, a waiting period is provided so that the period for the calibration measurement process and the period for the alignment measurement process executed thereafter do not overlap with the period for the alignment measurement process for each job for the other exposure apparatuses. Specifically, the waiting period is provided before the period of the calibration measurement process.

[0077] Next, consider a case where jobs A and B being executed in exposure apparatus 100a and 100b, respectively, are adjusted so that the measurement processing period for job B in exposure apparatus 100b starts after the measurement processing period for job A in exposure apparatus 100a ends. Then, consider the case where a calibration measurement process occurs before a predetermined alignment measurement process in job B of exposure apparatus 100b.

[0078] In this case, the periods for the calibration measurement process in job B of exposure apparatus 100b and the alignment measurement process executed thereafter do not overlap with the period for the alignment measurement process in job A of exposure apparatus 100a. Therefore, in job B of exposure apparatus 100b, there is no need to provide a waiting period before the calibration measurement process.

[0079] Furthermore, the switching control unit 210 stores in the storage unit 212 the timing of the alignment measurement process for the job in which the above adjustments have been made for each exposure apparatus in a predetermined group. When calibration measurement processing occurs again in a job of a specified exposure apparatus within the specified group, the switching control unit 210 acquires the timing of alignment measurement processing in the job of each exposure apparatus within the specified group, which is stored in the memory unit 212. The switching control unit 210 then makes the above adjustment based on the timing of the alignment measurement process in the job of each exposure tool that has been acquired.

[0080] As described above, in the exposure system according to this embodiment, when a job is executed in a plurality of exposure apparatuses, the number of which is greater than the number of capture boards, the tact design value of the job is calculated for each of the plurality of exposure apparatuses. Next, based on the calculated takt design value, grouping is performed in which each of the plurality of exposure tools is assigned to a group corresponding to each capture board.

[0081] In a given group, a given waiting period is provided before a given measurement processing period for at least one job so that the timings of alignment measurement processing for jobs executed by each of the multiple exposure apparatuses assigned to that group do not overlap with each other. This makes it possible to perform exclusive control over the process in which a predetermined capture board captures signals detected by each of the multiple exposure devices, while sufficiently suppressing an increase in the takt time of the job executed by each of the multiple exposure devices. That is, it is possible to achieve both cost reduction by suppressing an increase in the number of capture boards and suppression of an increase in the takt time of each job due to the exclusive control of each capture board, that is, suppression of a decrease in throughput.

[0082] Additionally, in the exposure system according to this embodiment, when a calibration measurement process occurs in a job of a predetermined exposure apparatus in a predetermined group, the following process is carried out. That is, a waiting period is provided in the job of the specified exposure apparatus so that the periods of the calibration measurement process and the alignment measurement process executed thereafter do not overlap with the periods of the alignment measurement processes in the jobs of the other exposure apparatuses. This allows each job being executed in other exposure devices among the multiple exposure devices that share a capture board in a specified group, where calibration measurement processing is not performed, to continue while sufficiently suppressing an increase in takt time.

[0083] [Third embodiment] FIG. 7 shows a partial block diagram of an exposure system 300 according to the third embodiment. The exposure system according to this embodiment has the same configuration as the exposure system 200 according to the first embodiment, except for the newly installed capture board 12c for manual assistance. Therefore, the same components are given the same reference numerals and their explanations are omitted.

[0084] In the exposure system according to this embodiment, a manual assist capture board 12c is provided for capturing signals detected in a specified exposure device as desired, for example, when an error occurs in the alignment measurement process in the specified exposure device. In other words, in the exposure system according to this embodiment, a predetermined number of the multiple capture boards are set as capture boards for manual assistance, and the remaining are set as capture boards for alignment measurement processing in the job being executed. That is, the capture board 12c for manual assistance (image acquisition unit for manual assistance) can be connected to the exposure tools 100a to 100c via the connection switch 220 in the same way as the capture boards 12a and 12b.

[0085] FIG. 8 is a flowchart showing the process of switching control of the manual assist capture board 12c in the exposure system according to this embodiment. In the exposure system according to this embodiment, the process shown in the flowchart of FIG. 8 and the process shown in the flowchart of FIG. 3 are executed in parallel.

[0086] In the following description, it is assumed that the exposure apparatuses 100a and 100b that execute jobs A and B, respectively, are connected to the capture board 12a by being assigned to a group corresponding to the capture board 12a. On the other hand, it is assumed that the exposure apparatus 100c that executes job C is connected to the capture board 12b by being assigned to a group corresponding to the capture board 12b.

[0087] When the processing shown in the flowchart of FIG. 8 starts, first, switching control unit 210 determines whether each of exposure apparatuses 100a to 100c has transitioned to the manual assist state (step S801, second determination step). Specifically, in step S801, it is monitored whether a transition to a state requiring manual assistance has occurred due to an abnormality occurring in the alignment measurement process in each of exposure apparatuses 100a to 100c, for example.

[0088] If the switching control unit 210 detects that none of the exposure apparatuses 100a to 100c have transitioned to the manual assist state (No in step S801), it continues to monitor the transition. On the other hand, if switching control unit 210 detects that at least one of exposure apparatuses 100a to 100c has transitioned to the manual assist state (Yes in step S801), the following process is performed.

[0089] That is, in the switching control unit 210, the control unit 214 acquires information that the at least one exposure apparatus has transitioned to the manual assist state via the communication unit 211. Thereafter, the process proceeds to step S802. Here, it is assumed that switching control unit 210 detects that exposure apparatus 100a has transitioned to the manual assist state in step S801.

[0090] Next, the switching control unit 210 causes the connection switch 220 to connect the at least one exposure apparatus, ie, the exposure apparatus 100a, to the manual assist capture board 12c (step S802). At this time, the exposure apparatus 100b continues to be connected to the capture board 12a.

[0091] Then, manual assist processing is executed in at least one exposure apparatus that has transitioned to the manual assist state, namely exposure apparatus 100a (step S803). Specifically, in step S803, manually assisted alignment measurement processing is executed in the at least one exposure apparatus, namely exposure apparatus 100a.

[0092] Next, in step S803, if the manual-assisted alignment measurement process has ended normally, the at least one exposure apparatus, namely exposure apparatus 100a, ends the manual-assisted state and notifies switching control unit 210 of the end. Then, upon receiving the notification of completion, the switching control unit 210 connects the at least one exposure apparatus, namely the exposure apparatus 100a, to the capture board 12a using the connection switch 220, and then returns to step S801 to continue the monitoring described above.

[0093] On the other hand, consider the case where switching control unit 210 detects that exposure apparatus 100c has transitioned to the manual assist state in step S801, and exposure apparatus 100c connects to manual assist capture board 12c in step S802. At this time, the exposure devices 100a and 100b are connected to the capture board 12a, while none of the exposure devices 100a to 100c is connected to the capture board 12b.

[0094] Therefore, in this case, it is preferable to perform grouping according to the process shown in FIG. 3 in exposure apparatuses 100a and 100b that execute jobs A and B, respectively. As a result, for example, the exposure apparatus 100a is connected to the capture board 12a, while the exposure apparatus 100b is connected to the capture board 12b.

[0095] Then, when exposure apparatus 100c ends the manual assist state in step S803, grouping can be performed again according to the process shown in FIG. 3 in exposure apparatuses 100a to 100c that execute jobs A to C, respectively. As a result, for example, the exposure apparatuses 100a and 100b are connected to the capture board 12a, while the exposure apparatus 100c is connected to the capture board 12b.

[0096] As described above, in the exposure system according to this embodiment, when a job is executed in a plurality of exposure apparatuses, the number of which is greater than the number of capture boards, the tact design value of the job is calculated for each of the plurality of exposure apparatuses. Next, based on the calculated takt design value, grouping is performed in which each of the plurality of exposure tools is assigned to a group corresponding to each capture board.

[0097] In a given group, a given waiting period is provided before a given measurement processing period for at least one job so that the timings of alignment measurement processing for jobs executed by each of the assigned exposure apparatuses do not overlap with each other. This makes it possible to perform exclusive control over the process in which a predetermined capture board captures signals detected by each of the multiple exposure devices, while sufficiently suppressing an increase in the takt time of the job executed by each of the multiple exposure devices.

[0098] That is, it is possible to achieve both cost reduction by suppressing an increase in the number of capture boards and suppression of an increase in the takt time of each job due to the exclusive control of each capture board, that is, suppression of a decrease in throughput. Additionally, in the exposure system according to this embodiment, when a predetermined exposure apparatus transitions to a manual assist state, a switching instruction can be issued to connect the predetermined exposure apparatus to a capture board for manual assist.

[0099] It is also possible that no other exposure devices are assigned to the group to which a specified exposure device that has transitioned to the manual assist state is assigned, i.e., the specified exposure device exclusively has the capture board corresponding to that group. In this case, there is no need to connect the predetermined exposure device to the capture board for manual assistance 12c, and the manual assistance process can be performed on the predetermined exposure device while it is connected to the capture board.

[0100] Furthermore, when each of the plurality of exposure tools transitions to the manual assist state, all of the plurality of exposure tools are connected to the manual assist capture board 12c. Incidentally, like the capture boards 12a and 12b, the manual assist capture board 12c is also subjected to exclusive control that allows it to capture only signals detected by a single exposure device.

[0101] Therefore, in the exposure system according to this embodiment, by first transitioning to the manual assist state, alignment measurement processing with manual assistance is performed in a predetermined exposure device connected to the capture board for manual assistance 12c. After the manual assist state of the predetermined exposure apparatus has ended, the exposure apparatus transitions to the next manual assist state, whereby alignment measurement processing with manual assistance is performed in another exposure apparatus connected to the manual assist capture board 12c. This makes it possible to sufficiently suppress an increase in takt time even when each of the multiple exposure devices transitions to the manual assist state.

[0102] The exposure system according to this embodiment is provided with three exposure apparatuses 100a to 100c, two capture boards 12a and 12b, and one manual assist capture board 12c. However, the number of exposure devices, capture boards, and manual assist capture boards is not limited to this.

[0103] [Production method] Next, a method for manufacturing an article according to this embodiment will be described.

[0104] The products manufactured here include semiconductor devices, display devices, color filters, optical components, and MEMS (Micro Electro Mechanical Systems). For example, a semiconductor device is manufactured through a pre-process for creating a circuit pattern on a substrate 8 and a post-process including a processing step for completing the circuit chip created in the pre-process as a finished product.

[0105] The pre-processing includes an exposure process in which the substrate 8 coated with a photosensitive agent is exposed using the exposure apparatus 100a, and a development process in which the photosensitive agent exposed in the exposure process is developed. Then, a circuit pattern is formed on the substrate 8 by carrying out an etching process, an ion implantation process, etc. using the developed photosensitive agent pattern as a mask.

[0106] By repeating these steps of exposure, development, etching, etc., a circuit pattern consisting of multiple layers is formed on the substrate 8. In the post-process, dicing is performed on the substrate 8 on which the circuit pattern has been formed, and chip mounting, bonding and inspection processes are carried out.

[0107] A display device is manufactured through a process of forming a transparent electrode. The process of forming a transparent electrode includes the steps of applying a photosensitive agent to a glass substrate 8 on which a transparent conductive film has been vapor-deposited, and exposing the substrate 8 on which the photosensitive agent has been applied using an exposure apparatus 100a. The step of forming the transparent electrode also includes a step of developing the exposed photosensitive agent.

[0108] According to the method for manufacturing an article according to this embodiment, it is possible to manufacture an article with higher quality and higher productivity than conventional methods. Although the preferred embodiments have been described above, the present invention is not limited to these embodiments and various modifications and changes are possible within the scope of the gist thereof.

[0109] The disclosure of this embodiment includes the following configurations and methods. (Configuration 1) an exposure system comprising: a plurality of exposure devices, each having an imaging unit that images an original mark formed on an original and a substrate mark formed on a substrate, and that project an image of the pattern of the original onto the substrate and expose the substrate; a first number of image acquisition units, each configured to acquire an image of the original mark and the substrate mark acquired by the imaging unit provided in a predetermined exposure device; and a control unit that controls exposure in the exposure device corresponding to the acquired image based on the image acquired by the predetermined image acquisition unit, wherein when exposure is performed in each of a second number of exposure devices greater than the first number, the control unit performs an acquisition step of acquiring the time required for exposure processing in each of the second number of exposure devices; a classification step of classifying the second number of exposure devices into a first number of groups based on the time acquired by the acquisition step; and an adjustment step of adjusting the imaging periods for processing in each of the plurality of exposure devices classified in each group into which the plurality of exposure devices are classified by the classification step so that they are different from each other. (Configuration 2) The exposure system according to configuration 1 is characterized in that it comprises a connection unit that connects a predetermined exposure device to a predetermined image capture unit, and the control unit performs a process of connecting at least one exposure device classified in each group to the corresponding image capture unit via the connection unit. (Configuration 3) The exposure system described in configuration 2 is characterized in that each of the multiple exposure apparatuses has an original stage that can move while holding an original and a substrate stage that can move while holding a substrate, and the control unit performs an image capture process in which, when an image is acquired in a predetermined exposure apparatus, the image is captured by an image capture unit to which the predetermined exposure apparatus is connected, and a process in which the position of the substrate stage provided in the predetermined exposure apparatus is adjusted based on the image of the predetermined exposure apparatus captured in the capture process. (Configuration 4) 4. The exposure system according to any one of configurations 1 to 3, wherein the control unit performs a first determination step of determining whether exposure is to be performed in each of the exposure devices whose number is greater than the first number. (Configuration 5) An exposure system according to configuration 4, further comprising a connection unit that connects a predetermined exposure device to a predetermined image capture unit, wherein when the control unit determines in the first judgment step that exposure will be performed in each of a third number of exposure devices that is less than the first number, it performs a step of connecting the third number of exposure devices to the third number of image capture units in a one-to-one relationship via the connection unit. (Configuration 6) 6. The exposure system according to any one of configurations 1 to 5, wherein the obtaining step includes a step of calculating the time in each of the second number of exposure devices. (Configuration 7) The exposure system according to any one of configurations 1 to 6, wherein the adjustment process includes a process of providing a predetermined waiting period before a predetermined imaging period in the processing of at least one exposure apparatus in each group into which the multiple exposure apparatuses are classified by the classification process. (Configuration 8) The exposure system according to any one of configurations 1 to 7, characterized in that the adjustment process includes a process of adjusting the calibration period of the imaging unit provided in a predetermined exposure apparatus in each group into which the multiple exposure apparatuses are classified by the classification process so that the calibration period and the imaging period in each exposure apparatus other than the predetermined exposure apparatus are different from each other. (Configuration 9) 9. The exposure system according to any one of configurations 1 to 8, wherein the control unit performs a second determination step of determining whether at least one exposure apparatus out of the second number of exposure apparatuses has transitioned to a manual assist state. (Configuration 10) The exposure system described in configuration 9 is characterized in that it comprises a manual assist image capture unit configured to capture images captured by an imaging unit provided in a predetermined exposure device, and the control unit, when it determines through the second judgment process that at least one exposure device has transitioned to a manual assist state, connects at least one of the second number of exposure devices to the manual assist image capture unit, and performs a process of classifying the remaining exposure devices into a first number of groups based on the time acquired through the acquisition process. (Configuration 11) An exposure system according to any one of configurations 1 to 10, characterized in that the classification process includes a process of classifying the second number of exposure tools into the first number of groups by using a k-means method for the times acquired by the acquisition process. (Method 1) A method for manufacturing an article, comprising the steps of exposing a substrate using the exposure system described in any one of configurations 1 to 11 and developing the exposed substrate, and manufacturing an article from the developed substrate. (Method 2) An exposure method for exposing a substrate by projecting an image of a pattern on an original onto the substrate using an exposure system comprising a plurality of exposure devices, each having an imaging unit that images an original mark formed on the original and a substrate mark formed on the substrate, and a first number of image acquisition units, each configured to acquire an image of the original mark and the substrate mark acquired by the imaging unit provided in a predetermined exposure device, wherein, when exposure is performed in each of a second number of exposure devices greater than the first number, the exposure method comprises: an acquisition step of acquiring the time required for exposure processing in each of the second number of exposure devices; a classification step of classifying the second number of exposure devices into a first number of groups based on the time acquired by the acquisition step; and an adjustment step of adjusting the imaging period for processing in each of the plurality of exposure devices classified in each group into which the plurality of exposure devices are classified by the classification step so that they are different from each other. [Explanation of symbols]

[0110] 4 Original version 8 PCB 11 Position detection optical system (imaging unit) 12 Capture board (image capture unit) 20a, 20b, 20c control section 100a, 100b, 100c exposure device 200 Exposure System 210 Switching control unit (control unit)

Claims

1. a plurality of exposure devices, each having an imaging unit that images a master mark formed on a master and a substrate mark formed on a substrate, and that projects an image of a pattern of the master onto the substrate and exposes the substrate; a first number of image capture units each configured to capture an image of the master mark and the image of the substrate mark acquired by the imaging unit provided in a predetermined exposure device; a control unit that controls the exposure in the exposure device corresponding to the image captured by a predetermined image capture unit based on the image captured by the image capture unit; Equipped with The control unit an acquisition step of acquiring a time required for the exposure process in each of the second number of exposure devices when the exposure is performed in each of the second number of exposure devices, the second number being greater than the first number; a classification step of classifying the second number of the exposure tools into the first number of groups based on the time acquired by the acquisition step; an adjusting step of adjusting the imaging periods in the processing for each of the exposure tools classified into each group by the classification step so that the imaging periods are different from one another; An exposure system comprising:

2. a connection unit for connecting a predetermined exposure device to a predetermined image capture unit; 2. The exposure system according to claim 1, wherein the control unit performs a step of connecting at least one of the exposure devices classified in each group to the corresponding image capture unit via the connection unit.

3. each of the plurality of exposure apparatuses includes an original stage that is movable while holding the original, and a substrate stage that is movable while holding the substrate; The control unit a capturing step of capturing the image by the image capturing unit connected to a predetermined exposure device when the image is acquired by the predetermined exposure device; a step of adjusting a position of the substrate stage provided in the predetermined exposure apparatus based on the image of the predetermined exposure apparatus captured in the capturing step; 3. The exposure system according to claim 2, wherein:

4. 2. The exposure system according to claim 1, wherein the control unit performs a first determination step of determining whether the exposure is performed in each of the exposure devices whose number is greater than the first number.

5. a connection unit for connecting a predetermined exposure device to a predetermined image capture unit; The exposure system according to claim 4, characterized in that when the control unit determines in the first judgment process that the exposure will be performed in each of a third number of the exposure devices, which is less than the first number, it performs a process of connecting the third number of the exposure devices and the third number of the image acquisition units one-to-one using the connection unit.

6. 2. The exposure system according to claim 1, wherein the acquiring step includes a step of calculating the time in each of the second number of exposure tools.

7. 2. The exposure system according to claim 1, wherein the adjustment step includes a step of providing a predetermined waiting period before a predetermined imaging period in the processing for at least one of the exposure apparatuses in each group into which the plurality of exposure apparatuses are classified by the classification step.

8. 2. The exposure system according to claim 1, wherein the adjustment step includes a step of adjusting a period for calibration of the imaging unit provided in a predetermined exposure apparatus in each group into which the plurality of exposure apparatuses are classified by the classification step, and a period for imaging in each exposure apparatus other than the predetermined exposure apparatus, so that the periods are different from each other.

9. 2. The exposure system according to claim 1, wherein the control unit performs a second determination step of determining whether at least one of the second number of exposure apparatuses has transitioned to a manual assist state.

10. a manual assist image capture unit configured to capture the image acquired by the imaging unit provided in a predetermined exposure device, 10. The exposure system according to claim 9, wherein, when the control unit determines that the at least one exposure apparatus has transitioned to the manual assist state through the second determination process, the control unit connects the at least one exposure apparatus out of the second number of exposure apparatuses to the manual assist image acquisition unit, and performs a process of classifying the remaining exposure apparatuses into the first number of groups based on the time acquired through the acquisition process.

11. 2. The exposure system according to claim 1, wherein the classification step includes a step of classifying the second number of exposure tools into the first number of groups by using a k-means algorithm for the times acquired by the acquisition step.

12. Exposing a substrate by an exposure system according to any one of claims 1 to 11; developing the exposed substrate; Including, A method for manufacturing an article, comprising manufacturing an article from the developed substrate.

13. An exposure method for projecting an image of a pattern of an original onto a substrate and exposing the substrate using an exposure system including a plurality of exposure apparatuses each having an imaging unit that images an original mark formed on an original and a substrate mark formed on a substrate, and a first number of image capture units each configured to capture an image of the original mark and the substrate mark acquired by the imaging unit provided in a predetermined exposure apparatus, the method comprising: an acquisition step of acquiring a time required for the exposure process in each of the second number of exposure devices when the exposure is performed in each of the second number of exposure devices, the second number being greater than the first number; a classification step of classifying the second number of the exposure tools into the first number of groups based on the time acquired by the acquisition step; an adjusting step of adjusting the imaging periods in the processing for each of the exposure tools classified into each group by the classification step so that the imaging periods are different from one another; An exposure method comprising:

Images