Laminate and package

Abstract

To provide a laminate and a package which can convey and store an anisotropic conductive member that is mechanically brittle such as fragile.SOLUTION: A laminate has an insulating base material having electric insulation property, an anisotropic conductive member which is provided so as to penetrate in a thickness direction of the insulating base material, and has a plurality of conduction paths including a projection part projecting from at least one surface of the insulating base material, and an organic film which is arranged on at least one surface of two surfaces facing each other in the thickness direction of the insulating base material of the anisotropic conductive member. The organic film has gas permeation of 2.3×108 to 4.6×109 ml / (m2 day MPa).SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a laminate in which an anisotropically conductive member and an organic film are laminated, and a package containing the laminate, and in particular to a laminate and package in which the anisotropically conductive member has a conductive path penetrating through the insulating base material in the thickness direction, and the organic film has gas permeability. [Background technology]

[0002] 2. Description of the Related Art There is an anisotropic conductive member having conductive paths formed by filling a plurality of through holes formed in an insulating substrate with a conductive material such as metal. Anisotropically conductive materials can be inserted between an electronic component such as a semiconductor element and a circuit board and electrically connected to the electronic component by simply applying pressure between the electronic component and the circuit board. Therefore, they are widely used as electrical connecting members for electronic components such as semiconductor elements, and as testing connectors for functional testing. In particular, downsizing of electronic components such as semiconductor elements is remarkable. Conventional methods for directly connecting wiring boards, such as wire bonding, flip-chip bonding, and thermocompression bonding, may not be able to fully ensure the stability of electrical connections of electronic components, and therefore anisotropically conductive materials have attracted attention as electronic connecting materials. When an anisotropically conductive member is used as an electronic connecting member, the anisotropically conductive member is placed on a printed circuit board using a surface mounting machine such as a chip mounter. In this case, the anisotropically conductive member is transported and stored using a carrier tape or the like.

[0003] For example, Patent Document 1 describes a package having a carrier tape with an electronic component storage section and a cover tape that seals the electronic component storage section. The cover tape has a base layer whose surface is provided with antistatic properties, an adhesive layer, and an electrostatic induction prevention layer provided between the base layer and the adhesive layer. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2005-178073 Summary of the Invention [Problem to be solved by the invention]

[0005] Patent Document 1 describes that a package is obtained by continuously sealing both longitudinal edges of the cover tape with a width of 0.3 to 1.0 mm, packaging the product, and winding it up on a reel. It also describes that electronic components and the like are stored or transported in this packaged form. Patent Document 1 also describes that the cover tape is peeled off, and the electronic components and the like are removed using a pickup device while checking their presence, orientation, and position. The anisotropically conductive member has an insulating substrate having electrical insulation properties. Insulating substrates are generally known to be more mechanically fragile than metal materials, and there is a possibility that the anisotropically conductive member may be damaged by vibration due to an external force when being transferred to a printed circuit board or during storage. However, Patent Document 1 does not take into consideration the handling of mechanically fragile objects that are easily damaged by vibrations or the like. An object of the present invention is to provide a laminate and a package that can transport and store anisotropically conductive members that are mechanically fragile and easily damaged. [Means for solving the problem]

[0006] In order to achieve the above object, the invention [1] provides an anisotropically conductive member having an insulating substrate having electrical insulation properties, and a plurality of conductive paths penetrating the insulating substrate in the thickness direction and having protrusions protruding from at least one surface of the insulating substrate, and an organic film disposed on at least one surface of two surfaces of the anisotropically conductive member that face each other in the thickness direction of the insulating substrate, the organic film having a gas permeability of 2.3 × 10 8 ~4.6×10 9 ml / (m 2 ·day·MPa).

[0007] Invention [2] is the laminate according to invention [1], in which the organic films are disposed on two surfaces of the insulating substrate that face each other in the thickness direction. The invention [3] is the laminate according to the invention [1] or [2], in which the organic film has a spacer disposed on the surface that contacts the anisotropically conductive member. Invention [4] is a laminate according to any one of inventions [1] to [3], which has a winding core, and the anisotropically conductive member and the organic film are wound around the winding core in a laminated state. Invention [5] is the laminate according to invention [4], in which the core is formed into a cylinder, and flanges having a diameter larger than the diameter of the core are provided at both ends of the core in the axial direction.

[0008] The invention [6] is the laminate according to any one of the inventions [1] to [5], in which the organic film is a porous film. The invention [7] is the laminate according to any one of the inventions [1] to [6], wherein a plurality of anisotropically conductive members are arranged in one direction on at least one surface of the organic film. Invention [8] is the laminate according to any one of inventions [1] to [7], wherein the anisotropically conductive members are disposed on two opposing surfaces of the organic film in the thickness direction.

[0009] The invention [9] comprises the laminate according to any one of the inventions [1] to [8] and a storage bag for storing the laminate, wherein the storage bag has a gas permeability of 1×10 -5 ~1ml / (m 2 ·day·MPa). Invention

[10] is the packaging body according to invention [9], wherein the storage bag has a light transmittance of up to 1% or less in the wavelength range of 100 to 780 nm. [Effects of the Invention]

[0010] According to the present invention, it is possible to provide a laminate and a package that can transport and store anisotropically conductive members that are mechanically fragile, such as those that are easily damaged. [Brief explanation of the drawings]

[0011] [Figure 1] FIG. 1 is a schematic cross-sectional view showing a first example of a laminate according to an embodiment of the present invention. [Figure 2] FIG. 1 is a schematic cross-sectional view showing an example of a stacked state of a first example of a laminate according to an embodiment of the present invention. [Figure 3] FIG. 3 is a schematic cross-sectional view showing another example of the stacked state of the first example of the laminate according to the embodiment of the present invention. [Figure 4] FIG. 2 is a schematic cross-sectional view showing a second example of a laminate according to an embodiment of the present invention. [Figure 5] FIG. 3 is a schematic cross-sectional view showing an example of a stacked state of a second example of a laminate according to an embodiment of the present invention. [Figure 6] FIG. 4 is a schematic cross-sectional view showing another example of the stacked state of the second example of the laminate according to the embodiment of the present invention. [Figure 7] FIG. 2 is a schematic plan view showing a third example of a laminate according to an embodiment of the present invention. [Figure 8] FIG. 3 is a schematic cross-sectional view showing a third example of a laminate according to an embodiment of the present invention. [Figure 9] FIG. 10 is a schematic perspective view showing a fourth example of a laminate according to an embodiment of the present invention. [Figure 10] FIG. 10 is a schematic cross-sectional view showing a fifth example of a laminate according to an embodiment of the present invention. [Figure 11] 1 is a schematic diagram showing a first example of a packaging body according to an embodiment of the present invention. [Figure 12] FIG. 2 is a schematic perspective view showing a second example of a packaging body according to an embodiment of the present invention. [Figure 13] 1 is a schematic cross-sectional view showing an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention. [Figure 14] FIG. 2 is a schematic plan view illustrating an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The laminate and packaging body of the present invention will be described in detail below based on preferred embodiments shown in the accompanying drawings. The drawings described below are merely illustrative and simplified for the purpose of explaining the present invention, and therefore the present invention is not limited to the drawings shown below. In the following, the range of values ​​indicated by "~" includes the values ​​written on both sides. For example, when ε is the value ε α ~number ε β That is, the range of ε is the number ε α and the number ε β The range includes ε α ≦ε≦ε β is. Unless otherwise specified, the terms "parallel" and "orthogonal" include a generally acceptable error range in the relevant technical field.

[0013] [First example of laminate] Fig. 1 is a schematic cross-sectional view showing a first example of a laminate according to an embodiment of the present invention. Fig. 2 is a schematic cross-sectional view showing an example of a laminated state of the first example of a laminate according to an embodiment of the present invention. Fig. 3 is a schematic cross-sectional view showing another example of a laminated state of the first example of a laminate according to an embodiment of the present invention. Although a plurality of anisotropically conductive members 12 are shown in FIGS. 1 to 3, the number of anisotropically conductive members 12 is not particularly limited to the number shown in FIGS. 1 has a configuration in which an anisotropically conductive member 12 and an organic film 14 are stacked together. The direction in which the anisotropically conductive member 12 and the organic film 14 are stacked together is the stacking direction Ds. In the laminate 10, an organic film 14 is disposed on at least one of two surfaces opposing each other in the thickness direction of an insulating base material 50 (see FIG. 13) of the anisotropically conductive member 12. In FIG. 1, the organic film 14 is disposed on a front surface 12a of the anisotropically conductive member 12. A back surface 14b of the organic film 14 contacts the front surface 12a of the anisotropically conductive member 12. The organic film 14 is, for example, an elongated member extending in one direction D1. A plurality of anisotropically conductive members 12 are arranged on the rear surface 14b of the organic film 14 at intervals along the one direction D1.

[0014] The front surface 12a of the anisotropically conductive member 12 is the front surface 50a (see FIG. 13) of the insulating base material 50 (see FIG. 13). The back surface 12b of the anisotropically conductive member 12 is the back surface 50b (see FIG. 13) of the insulating base material 50 (see FIG. 13). The front surface 12a and the back surface 12b of the anisotropically conductive member 12 are surfaces that face each other in the thickness direction Dt (see FIG. 13) of the insulating base material 50.

[0015] As will be described in detail later, the anisotropically conductive member 12 has an electrically insulating substrate 50 (see FIG. 13) and a plurality of conductive paths 52 (see FIG. 13) that penetrate the insulating substrate 50 in the thickness direction Dt (see FIG. 13) and have protrusions 52a (see FIG. 13) that protrude from at least one surface of the insulating substrate 50. As described above, insulating substrates are generally known to be more mechanically fragile than metal materials.

[0016] The organic film 14 has a gas permeability of 2.3×10 8 ~4.6×10 9 ml / (m 2 ·day·MPa). The gas permeability of the organic film 14 was measured using a hydrodynamic method at a differential pressure of 0.95166 kg / cm 2 It can be calculated by measuring the flow rate per minute per unit volume in an environment with a pressure of 700mmHg and a temperature of 25°C. The fluid dynamic method is a method in which the organic membrane to be measured is attached to a gas permeation test device, an arbitrary pressure difference is created, and the speed at which the gas passes through the organic membrane, or the change in flow, is measured to determine the gas permeability. The organic film 14 has a gas permeability of 2.3×10 8 ~4.6×10 9 ml / (m 2 If the pressure is 0.1 MPa (0.1 MPa), for example, when a chip mounter (not shown) is used to bring the head 19 into contact with the surface 14a of the organic film 14 and suck the organic film 14, the anisotropically conductive member 12 can be sucked through the organic film 14, and the anisotropically conductive member 12 can be held by the head 19. Therefore, even if the organic film 14 is between the head 19 and the anisotropically conductive member 12, the anisotropically conductive member 12 can be transported.

[0017] By providing the organic film 14 on the surface 12a of the anisotropically conductive member 12, when, for example, a chip mounter (not shown) is used to suck the organic film 14 with the head 19 to transport the anisotropically conductive member 12, the organic film 14 exists between the head 19 and the anisotropically conductive member 12, and therefore the organic film 14 acts as a buffer to prevent damage to the anisotropically conductive member 12, such as chipping and cracking of the insulating substrate. Furthermore, the anisotropically conductive member 12 has multiple conductive paths 52 (see FIG. 13) each having a protrusion 52a (see FIG. 13), and the organic film 14 exists between the head 19 and the anisotropically conductive member 12, and damage to the protrusion 52a (see FIG. 13) is also prevented by the organic film 14 existing between the head 19 and the anisotropically conductive member 12. In this way, it is possible to transport an anisotropically conductive member 12 that is mechanically fragile, such as being easily damaged. Damage to the anisotropically conductive member 12 includes chipping and cracking of the insulating substrate, deformation and loss of the protruding portions of the conductive paths, and the like, as described above. For example, if the insulating substrate has a chip or the like, a portion of the insulating substrate may peel off, potentially causing contamination. Furthermore, if the anisotropically conductive member is used as an electronic connecting member when a protruding portion is deformed and in contact with an adjacent protruding portion, proper electrical connection may not be possible. For this reason, it is necessary to suppress damage to the anisotropically conductive member 12.

[0018] Furthermore, in the laminate 10, by providing the organic film 14 on the surface 12a of the anisotropically conductive member 12 as described above, the organic film 14 acts as a buffer material, and therefore damage to the anisotropically conductive member 12 is suppressed even if vibrations due to external forces are applied to the anisotropically conductive member 12 during storage. This allows the anisotropically conductive member 12, which is mechanically fragile and prone to damage, to be stored stably while suppressing damage.

[0019] The laminate 10 may have a configuration in which nothing is provided on the back surface 12b of the anisotropically conductive member 12 on which the organic film 14 is not provided. In this configuration, for example, when the laminate 10 is placed on a support (not shown), the back surface 12b of the anisotropically conductive member 12 comes into contact with the support. The laminate 10 may also have a configuration in which anisotropically conductive members 12 are stacked in a stacking direction Ds as shown in Fig. 2. In Fig. 2, the anisotropically conductive members 12 are stacked one on top of the other in the stacking direction Ds. In this case, the anisotropically conductive members 12 are disposed on two opposing surfaces in the thickness direction of the organic film. The stacking of the laminate 10 is not limited to stacking the anisotropically conductive members 12 in the stacking direction Ds. For example, as shown in FIG. 3, the anisotropically conductive members 12 on the lower side in the stacking direction Ds may be disposed in a region 13 between the anisotropically conductive members 12 on the upper side in the stacking direction Ds in one direction D1, so that the anisotropically conductive members 12 do not overlap in the stacking direction Ds. As shown in FIG. 3, by configuring the anisotropically conductive members 12 so that they do not overlap, the force acting on the anisotropically conductive members 12 in the stacking direction Ds can be reduced compared to when the anisotropically conductive members 12 are stacked in the stacking direction Ds, thereby further suppressing damage to the insulating substrates and protruding portions of the anisotropically conductive members 12. Note that a specific configuration for stacking the laminate 10 will be described later.

[0020] [Second example of laminate] Fig. 4 is a schematic cross-sectional view showing a second example of a laminate according to an embodiment of the present invention. Fig. 5 is a schematic cross-sectional view showing an example of a laminated state of the second example of a laminate according to an embodiment of the present invention. Fig. 6 is a schematic cross-sectional view showing another example of a laminated state of the second example of a laminate according to an embodiment of the present invention. Although a plurality of anisotropically conductive members 12 are shown in FIGS. 4 to 6, the number of anisotropically conductive members 12 is not particularly limited to the number shown in FIGS. 4 to 6, the same components as those in the laminate 10 shown in FIGS. 1 to 3 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0021] The laminate 10 shown in Figure 4 differs from the laminate 10 shown in Figure 1 in that the organic film 14 is arranged on two opposing surfaces in the thickness direction of the insulating substrate of the anisotropically conductive member 12, but otherwise has the same configuration as the laminate 10 shown in Figure 1. 4, an organic film 14 is provided on each of a front surface 12a and a back surface 12b of an anisotropically conductive member 12. This configuration protects the two surfaces of the anisotropically conductive member 12, further suppressing damage to the anisotropically conductive member 12. Therefore, an anisotropically conductive member 12 that is easily damaged or otherwise mechanically fragile can be transported and stored stably while suppressing damage. Furthermore, when the anisotropically conductive member 12 is transported using a chip mounter (not shown) as described above, the organic film 14 arranged on either the front surface 12a side or the back surface 12b side of the anisotropically conductive member 12 can be sucked by the head 19, and therefore the degree of freedom in transporting the anisotropically conductive member 12 is high. Furthermore, for example, when the laminate 10 is unwound from a wound state, the organic film 14 is present on the front surface 12a and rear surface 12b of the anisotropically conductive member 12, so there is a high degree of freedom in unwinding.

[0022] Furthermore, the laminate 10 may have a configuration in which the anisotropically conductive members 12 are stacked in the stacking direction Ds, as shown in FIG. 5. In FIG. 5, the anisotropically conductive members 12 are stacked in an overlapping manner in the stacking direction Ds. The stacking of the laminate 10 is not limited to stacking the anisotropically conductive members 12 in the stacking direction Ds. For example, as shown in FIG. 6, the anisotropically conductive members 12 on the lower side in the stacking direction Ds may be disposed in a region 13 between the anisotropically conductive members 12 on the upper side in the stacking direction Ds in one direction D1, so that the anisotropically conductive members 12 do not overlap in the stacking direction Ds. As shown in FIG. 6, by configuring the anisotropically conductive members 12 not to overlap, the force acting on the anisotropically conductive members 12 in the stacking direction Ds can be reduced compared to when the anisotropically conductive members 12 are stacked in the stacking direction Ds, thereby further suppressing damage to the insulating substrate and protrusions of the anisotropically conductive members 12. The specific configuration for stacking the laminate 10 will be described later.

[0023] 4 has a configuration in which the organic films 14 are provided on the front surface 12a side and the back surface 12b side of the anisotropically conductive member 12, but the present invention is not limited to this. Either one of the organic films 14 on the front surface 12a side and the back surface 12b side of the anisotropically conductive member 12 does not have to be the organic film 14. For example, instead of the organic film 14, a tape formed of polystyrene (PS), polyethylene terephthalate (PET), or polypropylene (PP) other than the organic film 14 may be disposed. A carrier tape used in electronic component mounting devices can be used as a tape in place of the organic film 14. Alternatively, an embossed carrier tape in which a plurality of recesses for accommodating the anisotropically conductive members 12 are arranged along one extending direction can be used as a tape in place of the organic film 14. In the embossed carrier tape, one anisotropically conductive member is arranged in one recess, so that the anisotropically conductive members 12 can be more stably accommodated. When using an embossed carrier tape, the anisotropically conductive members 12 may be placed in the recesses, and then the organic film 14 may be placed thereon to seal them.

[0024] [Third example of laminate] Fig. 7 is a schematic plan view showing a third example of a laminate according to an embodiment of the present invention. Fig. 8 is a schematic cross-sectional view showing a third example of a laminate according to an embodiment of the present invention. Fig. 8 shows a cross section taken along line AA in Fig. 7. Although a plurality of anisotropically conductive members 12 are shown in FIGS. 7 and 8, the number of anisotropically conductive members 12 is not particularly limited to the number shown in FIGS. 7 and 8, the same components as those in the laminate 10 shown in FIGS. 4 to 6 are denoted by the same reference numerals, and detailed description thereof will be omitted.

[0025] The laminate 10 shown in Figures 7 and 8 differs from the laminate 10 shown in Figure 4 in that the organic film 14 has a spacer arranged on the surface that contacts the anisotropically conductive member 12, but otherwise has the same configuration as the laminate 10 shown in Figure 4. 7 and 8, in the laminate 10, spacers 16 are arranged on both sides of the surface 14a of the organic film 14 on the lower side in the stacking direction Ds in the width direction Dw, which is orthogonal to one direction D1 of the organic film 14 in the plane. These spacers 16 restrict movement of the anisotropically conductive member 12 in the width direction Dw, and reduce the force acting on the anisotropically conductive member 12 in the stacking direction Ds. This makes it possible to further suppress damage to the anisotropically conductive member 12. The spacer 16 is made of a tape made of, for example, polytetrafluoroethylene (PTFE), polystyrene (PS), polyethylene terephthalate (PET), or polypropylene (PP). Furthermore, the thickness of the spacer 16 in the stacking direction Ds is preferably the same as the thickness in the stacking direction Ds of the anisotropically conductive member 12. This limits movement of the anisotropically conductive member 12 in the stacking direction Ds, and further suppresses damage to the anisotropically conductive member 12 even if vibrations due to external forces are applied to the anisotropically conductive member 12 during transfer, transportation, or storage.

[0026] [Fourth example of laminate] FIG. 9 is a schematic perspective view showing a fourth example of the laminate according to the embodiment of the present invention. In FIG. 9, the same components as those in the laminate 10 shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted. The laminate 11 shown in Figure 9 has a winding core 22, and is different in that the anisotropically conductive member 12 and the organic film 14 are wound around the winding core 22 in a stacked state, but otherwise has the same configuration as the laminate 10 shown in Figure 1.

[0027] 9, the laminate 11 in which the anisotropically conductive member 12 and the organic film 14 are stacked is called a laminated material 17. The laminated material 17 is wound around a core 22 of a reel 20. The reel 20 includes, for example, a cylindrical winding core 22, and flanges 24, each of which has a diameter larger than that of the winding core 22, provided at both axial ends of the winding core 22. The winding core 22 has a through-hole 23. A rotating shaft (not shown) for rotating the reel 20 is inserted into the through-hole 23. The flange 24 is, for example, made of a flat plate and has a circular outer shape. As described above, the diameter of the flange 24 is larger than the diameter of the winding core 22. When the outer shape of the flange 24 is circular, the diameter of the flange 24 is the diameter. When the outer shape of the winding core 22 is circular, the diameter of the winding core 22 is the diameter. The laminated material 17 has one end in one direction D1 connected to the winding core 22 and is wound around the winding core 22 between the flanges 24.

[0028] The material of the reel 20 is not particularly limited, but may be made of various types of plastic, for example. Furthermore, the winding core 22 is not particularly limited to a cylindrical shape, and may have any known winding core shape. The diameter and axial length of the winding core 22 are also not particularly limited, and are determined appropriately depending on the application, etc. When the curvature of the laminate 17 wound around the winding core 22 is X(1 / m) and the radius of curvature is R(m), it is preferable that 5≦X(1 / m)≦40, i.e., 0.025≦R(m)≦0.2. When the winding core 22 is cylindrical, the diameter, or when it is not cylindrical, the equivalent circle diameter, is set so that when the laminate 17 is wound around the winding core 22, the curvature X(1 / m) and radius of curvature R(m) of the laminate 17 are set to the above-mentioned 5≦X(1 / m)≦40, i.e., 0.025≦R(m)≦0.2. Although the reel 20 has a flange 24, the present invention is not limited to this and may have a configuration without the flange 24. However, the flange 24 regulates the position of the organic film 14 in the width direction Dw and prevents the anisotropically conductive member 12 from falling off the organic film 14, so it is preferable that the reel 20 has the flange 24. 4, the laminated material 17 may have a configuration in which organic films 14 are disposed on both sides of the anisotropically conductive member 12. When the laminated material 17 is wound around the winding core 22, the anisotropically conductive member 12 is in a laminated state as shown in, for example, FIGS.

[0029] [Fifth example of laminate] FIG. 10 is a schematic cross-sectional view showing a fifth example of the laminate according to the embodiment of the present invention. In FIG. 10, the same components as those in the laminate 10 shown in FIG. 1 are denoted by the same reference numerals, and detailed description thereof will be omitted. The laminate 11a shown in Figure 10 has a storage container 30, an anisotropically conductive member 12, and an organic film 14, and is different from the laminate 10 shown in Figure 1 in that the anisotropically conductive member 12 and the organic film 14 are stacked inside the storage container 30, but otherwise has the same configuration as the laminate 10 shown in Figure 1. The storage container 30 has a container body 32 and a lid 34. The container body 32 is made up of, for example, a cylindrical member having a bottom 32b. The container body 32 is open above the bottom 32b, and has an opening 32c. The lid 34 is a member that closes the opening 32c of the container body 32. The container body 32 and the lid 34 are, for example, cylindrical members, and the opening 32c of the container body 32 has a circular outer shape. The storage container 30 can be, for example, a silicon wafer case.

[0030] In the interior 32a of the container body 32, the anisotropically conductive member 12 and the organic film 14 are repeatedly stacked in this order from the bottom 34b side, so that the anisotropically conductive member 12 and the organic film 14 are arranged. In the laminate 11a, for example, the anisotropically conductive members 12 on the lower side in the stacking direction Ds are disposed between the anisotropically conductive members 12 on the upper side in the stacking direction Ds in a gap 18 in the lateral direction Dm perpendicular to the stacking direction Ds, so that the anisotropically conductive members 12 do not overlap in the stacking direction Ds. This reduces the force acting on the anisotropically conductive members 12 in the stacking direction Ds, and further suppresses damage to the insulating substrates and protruding portions of the anisotropically conductive members 12.

[0031] In Figure 11, five layers of anisotropically conductive material 12 and organic film 14 are arranged, but the number of layers to be arranged is determined appropriately depending on the size of storage container 30 or the size of anisotropically conductive material 12, and is not particularly limited to the configuration shown in Figure 11. 11, by storing the anisotropically conductive members 12 in a stacked state in the storage container 30, many anisotropically conductive members 12 can be stored stably while preventing damage, and can also be transported as is in the storage container 30. Even when the storage container 30 is transported, damage to the anisotropically conductive members 12 is prevented.

[0032] Although the anisotropically conductive members 12 are stacked so as not to overlap in the stacking direction Ds, this is not limitative, and the anisotropically conductive members 12 may be stacked so as to overlap in the stacking direction Ds as shown in FIG. Alternatively, the organic films 14 may be disposed on the front surface 12a and the back surface 12b of the anisotropically conductive member 12, and the anisotropically conductive member 12 and the organic films 14 may be repeatedly stacked in this order inside the container body 32.

[0033] Furthermore, the above-mentioned spacers 16 (see FIG. 8) may be provided between adjacent anisotropically conductive members 12 in a lateral direction Dm perpendicular to the stacking direction Ds. The spacers 16 restrict movement of the anisotropically conductive members 12 in the lateral direction Dm and reduce the force acting on the anisotropically conductive members 12 in the stacking direction Ds. This further reduces damage to the anisotropically conductive members 12. In the laminate 11a as well, it is preferable that the thickness of the spacer 16 in the stacking direction Ds is the same as the thickness in the stacking direction Ds of the anisotropically conductive member 12. This limits movement of the anisotropically conductive member 12 in the stacking direction Ds, and further suppresses damage to the anisotropically conductive member 12 even if vibrations due to external forces are applied to the anisotropically conductive member 12 during transportation or storage.

[0034] [First example of packaging] FIG. 11 is a schematic diagram showing a first example of a package according to an embodiment of the present invention. In FIG. 11, the same components as those in the laminate 11 shown in FIG. 9 are denoted by the same reference numerals, and detailed description thereof will be omitted. 11 includes the laminate 11 and a storage bag 37 that stores the laminate 11. The storage bag 37 stores the laminate 11 in an interior 37a thereof. The storage bag 37 has a gas permeability of 1×10 -5 ~1ml / (m 2 ·day·MPa). The gas permeability of the storage bag 37 is measured, for example, using JIS (Japanese Industrial Standards) K 7126-1:2006 Plastics - Films and Sheets - Gas Permeability Test Method. The storage bag 37 of the packaging body 36 prevents oxygen from entering the interior 37a, and if the conductive path of the anisotropically conductive member 12 is made of metal, oxidation of the conductive path is suppressed. Therefore, during transportation and storage of the anisotropically conductive member 12, the anisotropically conductive member 12 can be transported and stored in a state where it is wound around the reel 20, while suppressing deterioration of performance such as conductivity.

[0035] In addition, the packaging body 36 may be provided with an oxygen absorber 38 in the interior 37a of the storage bag 37, or may be provided with a moisture absorbent (not shown) in addition to the oxygen absorber 38. Furthermore, the interior 37a of the storage bag 37 may be inert gas replacement packaging in which the atmosphere is replaced with an inert gas such as argon gas or nitrogen gas, or may be vacuum packaged. Furthermore, in order to prevent light from entering the interior 37a of the storage bag 37, it is preferable that the storage bag 37 has a light-blocking property. In this case, it is preferable that the light transmittance of the storage bag 37 is a maximum of 1% or less in the wavelength range of 100 to 780 nm. The light transmittance of the storage bag 37 is measured using a spectrophotometer in the wavelength range of 100 nm to 780 nm.

[0036] [Second example of packaging] FIG. 12 is a schematic perspective view showing a second example of a package according to an embodiment of the present invention. In FIG. 12, the same components as those in the laminate 11a shown in FIG. 10 and the package 36 shown in FIG. 11 are denoted by the same reference numerals, and detailed description thereof will be omitted. 12 includes a laminate 11a and a storage bag 39 that stores the laminate 11a. The storage bag 39 stores the laminate 11a in an interior 39a thereof. The storage bag 39 of the packaging body 36a prevents oxygen from entering the interior 39a, and if the conductive paths of the anisotropically conductive member 12 are made of metal, oxidation of the conductive paths is suppressed. Therefore, during transportation and storage of the anisotropically conductive member 12, the anisotropically conductive member 12 can be transported and stored in a state stored in the storage container 30 while suppressing deterioration of performance such as conductivity.

[0037] In addition, the packaging body 36a may be provided with an oxygen absorber 38 in the interior 39a of the storage bag 39, or may be provided with a moisture absorbent (not shown) in addition to the oxygen absorber 38. Furthermore, the interior 39a of the storage bag 39 may be inert gas replacement packaging in which the air therein is replaced with an inert gas such as argon gas or nitrogen gas, or may be vacuum packaged. Furthermore, in order to prevent light from entering the interior 39a of the storage bag 39, it is preferable that the storage bag 39 has a light-blocking property. In this case, it is preferable that the light transmittance of the storage bag 39 is a maximum of 1% or less in the wavelength range of 100 to 780 nm. The light transmittance of the storage bag 39 is measured in the same manner as the method for measuring the light transmittance of the storage bag 37 described above.

[0038] (organic film) As mentioned above, the organic film has a gas permeability of 2.3 × 10 8 ~4.6×10 9 ml / (m 2 The organic film is preferably a porous film so as to easily attract the anisotropically conductive member. The organic film includes a polymer, and the polymer contains, for example, fluorine atoms. The organic film is made of, for example, PTFE (polyethylene terephthalate). More specifically, the organic film may be the Poreflon (registered trademark) membrane FP series manufactured by Sumitomo Electric Fine Polymer, Inc. The organic film has a flexural modulus at a temperature of 25°C of, for example, 100 to 10,000 (MPa).

[0039] (storage bag) As mentioned above, the storage bag has a gas permeability of 1 x 10 -5 ~1ml / (m 2 ·day·MPa). For example, gas barrier bags (PTS bags (product name) and aluminum bags (product name)) used in the RP System (registered trademark) manufactured by Mitsubishi Gas Chemical Company, Inc. can be used as the storage bag. Furthermore, when the storage bag is to suppress the incidence of light as described above, it is preferable that the storage bag has light-blocking properties. In this case, the light transmittance of the storage bag is preferably 1% or less at most in the wavelength range of 100 to 780 nm. The method for measuring the light transmittance of the storage bag is as described above. The light transmittance of the storage bag is the light transmittance of the film material that forms the storage bag. For example, if the storage bag is made by sealing a resin film material, the light transmittance of the storage bag is the light transmittance of the resin film material.

[0040] (anisotropic conductive material) Fig. 13 is a schematic cross-sectional view showing an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention. Fig. 14 is a schematic plan view showing an example of an anisotropically conductive member of a laminate according to an embodiment of the present invention. Fig. 14 is a plan view seen from the surface side of the anodized film of Fig. 13, showing a state without resin layer 54. 13 includes an insulating substrate 50 having electrical insulation properties, and a plurality of conductive paths 52 that penetrate the insulating substrate 50 in the thickness direction Dt, are electrically insulated from one another, and have protrusions that protrude from at least one surface. The anisotropically conductive member 12 also includes a resin layer 54 that covers at least one surface of the insulating substrate 50. The anisotropically conductive member 12 is conductive in the thickness direction Dt of the insulating substrate 50. In the above-described laminate 10 (see FIG. 1), the anisotropically conductive member 12 is laminated with the organic film 14 such that the thickness direction Dt of the insulating base material 50 and the lamination direction Ds of the laminate 10 are parallel to each other. In the anisotropically conductive member 12, the resin layer 54 is not necessarily required, and the anisotropically conductive member 12 may have a configuration without the resin layer 54.

[0041] The plurality of conductive paths 52 are provided in the insulating base material 50 in a state in which they are electrically insulated from one another. In this case, for example, the insulating base material 50 has a plurality of pores 51 penetrating in the thickness direction Dt. The conductive paths 52 are provided in the plurality of pores 51. The conductive paths 52 protrude from the front surface 50a of the insulating base material 50. The conductive paths 52 also protrude from the back surface 50b of the insulating base material 50. The conductive paths 52 may protrude from one surface of the insulating base material 50 in the thickness direction Dt. For example, a resin layer 54 is provided on the surface of the insulating base material 50 from which the conductive paths 52 protrude. The resin layer 54 covers the protruding portions 52a of the conductive paths 52, and the protruding portions 52a are embedded in the resin layer 54. The resin layer 54 also covers the protruding portions 52b of the conductive paths 52, and the protruding portions 52b are embedded in the resin layer 54. The insulating base material 50 is made of, for example, an anodic oxide film, which is formed by anodizing a valve metal, for example. The front surface 50a of the insulating base material 50 and the back surface 50b of the insulating base material 50 are surfaces that face each other in the thickness direction Dt of the insulating base material 50.

[0042] The anisotropically conductive member 12 has anisotropic conductivity, and as described above, has conductivity in the thickness direction Dt, but the conductivity in the direction parallel to the surface 50a of the insulating base material 50 is sufficiently low. The anisotropically conductive member 12 has, for example, a rectangular outer shape as shown in Fig. 14. The outer shape and size of the anisotropically conductive member 12 are determined appropriately according to the application and the like. For example, the anisotropically conductive member 12 is bonded in a state where there is no resin layer 54, or in a state where there is a resin layer 54 but nothing is present on the surface 54a.

[0043] The structure of the anisotropically conductive member will be described in more detail below. The anisotropically conductive member has the same structure as that of the structure described in WO 2022 / 163260, for example, and can be manufactured in the same manner as the above-mentioned structure.

[0044] <Insulating substrate> The insulating substrate 50 is made of a conductor and electrically insulates the plurality of conductive paths 52 from one another. As described above, the insulating substrate 50 has electrical insulation properties. The insulating substrate 50 also has a plurality of pores 51 in which the conductive paths 52 are formed. The composition of the insulating substrate 50 will be described later. The length of the insulating substrate 50 in the thickness direction Dt, i.e., the thickness ht of the insulating substrate 50, is preferably in the range of 1 to 1000 μm, more preferably in the range of 5 to 500 μm, and even more preferably in the range of 10 to 300 μm. When the thickness ht of the insulating substrate 50 is in this range, the insulating substrate 50 becomes easy to handle. From the viewpoint of ease of winding, the thickness ht of the insulating base material 50 is preferably 30 μm or less, and more preferably 5 to 20 μm.

[0045] The thickness of the insulating substrate can be measured by cutting the insulating substrate in the thickness direction Dt using a focused ion beam (FIB) and capturing an image of the cross section at a magnification of 50,000 times using a field emission scanning electron microscope (FE-SEM). In the captured image, the length of 10 points corresponding to the thickness of the insulating substrate is measured, and the average length of the 10 measured points is calculated. This average value is the thickness of the insulating substrate.

[0046] <Average pore diameter> The average diameter of pores 51 is preferably 1 μm or less, more preferably 5 to 500 nm, even more preferably 20 to 400 nm, even more preferably 40 to 200 nm, and most preferably 50 to 100 nm. When the average diameter d of pores 51 is 1 μm or less and within the above range, conductive paths 52 having the above average diameter can be obtained. The average diameter of the pores 51 can be measured by photographing the surface of the insulating substrate 50 from directly above at a magnification of 100 to 10,000 times using a scanning electron microscope (SEM). In the photographed image, at least 20 pores that are connected in a ring shape are extracted, and their diameters are measured to determine the opening diameter. The average of these opening diameters is calculated as the average diameter of the pores. The magnification can be appropriately selected within the above-mentioned range so as to obtain a photographed image from which 20 or more pores can be extracted. The opening diameter is measured as the maximum distance between the ends of the pore portion. That is, the shape of the opening of the pore is not limited to a substantially circular shape, so when the opening shape is non-circular, the maximum value of the distance between the ends of the pore portion is taken as the opening diameter. Therefore, for example, even in the case of a pore having a shape in which two or more pores are integrated, this is considered to be a single pore, and the maximum value of the distance between the ends of the pore portion is taken as the opening diameter.

[0047] <Conduction Path> As described above, the plurality of conductive paths 52 are provided in the insulating substrate 50, for example, in the anodized film, in a state in which they are electrically insulated from one another. The plurality of conductive paths 52 are electrically conductive. The conductive paths are made of a conductive material. The conductive material is not particularly limited, and examples thereof include metals. Specific examples of metals include gold (Au), silver (Ag), copper (Cu), aluminum (Al), magnesium (Mg), nickel (Ni), zinc (Zn), and cobalt (Co). From the viewpoint of electrical conductivity, copper, gold, aluminum, nickel, and cobalt are preferred, copper and gold are more preferred, and copper is most preferred. Metals have superior ductility and are more easily deformed than oxide conductors, and are also more easily deformed by compression during bonding, so it is preferable to form the conductive paths from metal. The height of the conductive paths 52 in the thickness direction Dt is preferably 10 to 300 μm, and more preferably 20 to 30 μm.

[0048] <<Conduit shape>> The average diameter d of the conductive paths 52 is preferably 1 μm or less, more preferably 5 to 500 nm, even more preferably 20 to 400 nm, even more preferably 40 to 200 nm, and most preferably 50 to 100 nm. The density of the conductive paths 52 is 20,000 pieces / mm 2 It is preferable that the density is 2 million / mm or more. 2 More preferably, it is 10 million particles / mm2 More preferably, it is 50 million particles / mm or more. 2 It is particularly preferable that the number is 100 million / mm or more. 2 More preferably, it is equal to or greater than this. Furthermore, the center-to-center distance p between adjacent conductive paths 52 is preferably 20 nm to 500 nm, more preferably 40 nm to 200 nm, and even more preferably 50 nm to 140 nm.

[0049] The average diameter of the conductive paths is measured by photographing the surface of the insulating substrate from directly above using a scanning electron microscope at a magnification of 100 to 10,000. At least 20 conductive paths that are connected in a circular shape are extracted from the photographed image, and their diameters are measured to determine the opening diameter. The average of these opening diameters is then calculated as the average diameter of the conductive paths. The magnification can be appropriately selected within the above-mentioned range so as to obtain a captured image in which 20 or more conductive paths can be extracted. Furthermore, if the opening has a non-circular shape, the maximum distance between the ends of the conductive path portion is taken as the opening diameter. Therefore, for example, even if a conductive path has a shape in which two or more conductive paths are integrated, this is considered to be a single conductive path, and the maximum distance between the ends of the conductive path portion is taken as the opening diameter. The average diameter d of the conductive paths 52 is the same as the average diameter of the protrusions. The center-to-center distance p between adjacent conductive paths 52 is determined by further identifying the identified center positions (not shown) of the conductive paths in the photographed image of the insulating substrate 50 obtained as described above. The distance between the center positions of adjacent conductive paths was determined at 10 locations. The average value of these distances was used as the center distance p between adjacent conductive paths 52. The center positions are the center positions of the areas corresponding to the conductive paths 52 in the photographed image. Note that a known image analysis method is used to calculate the center positions of the areas in the photographed image.

[0050] <<Protrusion>> The protrusion is a part of the conductive path and is columnar, and is preferably cylindrical in shape because it can increase the contact area with the object to be joined. The average protrusion length ha of the protrusions 52a and the average length hb of the protrusions 52b are preferably 10 nm to 1000 nm, more preferably 50 nm to 500 nm. When the average protrusion length ha and the average length hb are 10 nm to 1000 nm, the adhesion between the resin layer 54 and the insulating base material 50 is good. The average protrusion length ha of the protrusion 52a and the average length hb of the protrusion 52b are the average values ​​measured by obtaining cross-sectional images of the protrusions using a scanning electron microscope as described above, and measuring the height of the protrusions at 10 points based on the cross-sectional images.

[0051] With regard to the conductive paths 52, the distance between adjacent protrusions is preferably 20 nm to 200 nm, and more preferably 40 nm to 100 nm. When the distance between adjacent protrusions is within the above range, the distance between the conductive paths 52 can be maintained on the front surface 50a or the back surface 50b of the insulating substrate 50. This prevents short circuits in the conductive paths 52 when they are bonded to a connection target such as a semiconductor device, further improving reliability during bonding.

[0052] <<Resin layer>> As described above, the resin layer covers at least one of the front and back surfaces of the insulating substrate, protecting the insulating substrate and the conductive paths. For example, if the conductive paths have protrusions, the resin layer buries the protrusions. That is, the resin layer covers the ends of the conductive paths protruding from the insulating substrate, protecting the protrusions. In order to exert the above-mentioned functions, the resin layer preferably exhibits fluidity in a temperature range of, for example, 50° C. to 200° C. and hardens at temperatures equal to or higher than 200° C. The resin layer is, for example, a thermoplastic layer made of a thermoplastic resin, and the resin layer will be described in detail later. The average thickness hm of the resin layer 54 is preferably 10 μm or less, more preferably 5 μm or less, and even more preferably 1 μm or less. If the average thickness hm of the resin layer 54 is 10 μm or less, the resin layer 54 can sufficiently protect the protruding portions of the conductive paths 52 and fill the area around the electrodes when bonding to a connection target such as a semiconductor device. The average thickness hm of the resin layer 54 is the average distance from the surface 50a of the insulating substrate 50 or the average distance from the back surface 50b of the insulating substrate 50. The average thickness hm of the resin layer 54 is determined by cutting the resin layer in the thickness direction Dt of the anisotropically conductive member 12 and obtaining an image of the cut cross section using a scanning electron microscope. In the image, the distance from the surface 50a of the insulating substrate 50 corresponding to the resin layer is measured at 10 points, and the average length of the 10 measured points is calculated. This average value is the average thickness hm of the resin layer 54 on the surface 50a side of the insulating substrate 50. Furthermore, the distance from the back surface 50b of the insulating base material 50 is measured at 10 points. The lengths measured at the 10 points are averaged to obtain the average thickness hm of the resin layer 54 on the back surface 50b side of the insulating base material 50.

[0053] The resin layer may have the following composition: The composition of the resin layer will be described below: For example, the resin layer contains a polymer material and may also contain an antioxidant material. Specific examples of the resin material constituting the resin layer include thermoplastic resins such as ethylene copolymers, polyamide resins, polyester resins, polyurethane resins, polyolefin resins, acrylic resins, acrylonitrile resins, and cellulose resins. Polyacrylonitrile can also be used as the resin material constituting the resin layer 54. In addition to the above, the resin layer may contain, for example, a main composition containing an acrylic polymer described in WO 2022 / 163260, an acrylic monomer, and a maleimide compound.

[0054] The present invention is basically configured as described above. Although the laminate and package of the present invention have been described in detail above, the present invention is not limited to the above-described embodiments, and various improvements and modifications may be made without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0055] 10, 11, 11a laminate 12 Anisotropic conductive material 12a, 14a, 50a, 54a surface 12b, 14b, 50b back side 13 areas 14 Organic film 16 spacer 17 Laminated wood 18 hours 19 heads 20 reels 22 Roll core 23 Through hole 24 flange 30 Storage Container 32 Container body 32a, 37a, 39a internal 32b bottom 32c opening 34 Lid 34b bottom 36 Packaging 36a Packaging 37, 39 Storage bag 38 Oxygen absorber 50 Insulating substrate 51 pores 52 Conduction Path 52a, 52b protrusion 54 Resin layer D1 one way Dm horizontal Ds stacking direction Dt thickness direction Dw width direction d average diameter hm average thickness ht Thickness p Center distance

Claims

1. an anisotropically conductive member having an insulating base material having electrical insulation properties and a plurality of conductive paths provided to penetrate the insulating base material in a thickness direction and having protrusions protruding from at least one surface of the insulating base material; an organic film disposed on at least one of two surfaces of the anisotropically conductive member that face each other in a thickness direction of the insulating base material; The organic film has a gas permeability of 2.3×10 8 ~4.6 x 10 9 ml / (m 2 · day · MPa).

2. The laminate according to claim 1 , wherein the organic film is disposed on the two surfaces of the insulating base material that face each other in a thickness direction.

3. The laminate according to claim 2 , wherein the organic film has a spacer disposed on a surface that contacts the anisotropically conductive member.

4. The laminate according to claim 1 , further comprising a winding core, wherein the anisotropically conductive member and the organic film are wound in a layered state around the winding core.

5. 5. The laminate according to claim 4, wherein the core is formed of a cylinder, and flanges having a diameter larger than the diameter of the core are provided at both axial ends of the core.

6. The laminate according to claim 1 , wherein the organic film is a porous film.

7. The laminate according to claim 1 , wherein a plurality of the anisotropically conductive members are arranged in one direction on at least one surface of the organic film.

8. The laminate according to claim 1 , wherein the anisotropically conductive members are disposed on two surfaces of the organic film that face each other in a thickness direction of the organic film.

9. A device comprising the laminate according to any one of claims 1 to 8 and a storage bag for storing the laminate, The storage bag has a gas permeability of 1×10 -5 ~1 ml / (m 2 .day.MPa).

10. The packaging body according to claim 9, wherein the storage bag has a light transmittance of up to 1% or less in a wavelength range of 100 to 780 nm.

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