Solid emblem production method and solid emblem
Patent Information
- Application Number
- JP2024051748
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-10-09
Smart Images
Figure 2025150713000001_ABST
Abstract
Description
[Technical Field]
[0001] The present invention relates to a method for manufacturing a three-dimensional emblem, and to a three-dimensional emblem. [Background technology]
[0002] Three-dimensional emblems are known as emblems used to decorate the surface of automobile bodies. For example, the three-dimensional emblem proposed in Patent Document 1 below is used. The three-dimensional emblem in Patent Document 1 uses a retroreflective sheet. Therefore, when light is irradiated onto the three-dimensional emblem at night or in a dark place, the light is retroreflected, allowing a viewer to clearly recognize the three-dimensional emblem even at night or in a dark place. This retroreflective sheet uses a microsphere-type retroreflective sheet.
[0003] When manufacturing the three-dimensional emblem of Patent Document 1, a laminate including a retroreflective sheet is heated and embossed using a mold to form recesses, which are then filled with resin. The resin filled in the recesses hardens, thereby maintaining the shape of the three-dimensional emblem. In Patent Document 1, as shown in Figure 2 and other figures, a thermoplastic resin layer is provided between the retroreflective sheet and the hardened resin to reinforce the rigidity of the three-dimensional emblem. The embossing is performed on the thermoplastic resin layer. [Prior art documents] [Patent documents]
[0004] [Patent Document 1] Japanese Patent Application Publication No. 2022-82988 Summary of the Invention [Problem to be solved by the invention]
[0005] However, the present inventors discovered that forming recesses in a three-dimensional emblem with a thermoplastic resin layer, as in Patent Document 1, can result in fine irregularities on the surface of the three-dimensional emblem, resulting in a yuzu peel-like appearance. This yuzu peel is thought to be caused by the microspheres in the retroreflective sheeting during embossing. Specifically, when forming recesses in the three-dimensional emblem, the microspheres in the retroreflective sheeting are pushed up toward the surface of the three-dimensional emblem, resulting in the formation of a yuzu peel (fine irregularities) on the surface of the three-dimensional emblem. One possible way to suppress this yuzu peel is to thicken the surface protective layer. However, increasing the thickness of the surface protective layer to a level sufficient to suppress the yuzu peel makes embossing difficult and reduces shape reproducibility. Furthermore, reducing the thickness of the surface protective layer to a level sufficient to maintain shape reproducibility results in insufficient suppression of the yuzu peel. The yuzu peel-like surface and reduced shape reproducibility detract from the design of the three-dimensional emblem. Therefore, a method for producing three-dimensional emblems with superior design is needed.
[0006] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method for producing a three-dimensional emblem that is capable of producing a three-dimensional emblem with excellent design, and to provide the three-dimensional emblem itself. [Means for solving the problem]
[0007] In order to achieve the above-mentioned object, the manufacturing method of the three-dimensional emblem of the present invention includes a molding step in which a laminate including a surface protective layer having one exposed surface and a retroreflective sheet laminated on the other surface side of the surface protective layer is embossed using a mold, the retroreflective sheet including a holder layer, a microsphere layer containing a plurality of light-transmitting microspheres arranged in a plane and held so that a portion of the microspheres is exposed on the side of the holder layer opposite the surface protective layer, a specular reflection layer facing the exposed portion of the microspheres on the holder layer, and a light-transmitting focus forming layer filling the gap between the microspheres and the specular reflection layer, the thickness from the surface of the holder layer facing the surface protective layer before the molding step being 200 μm or more and 450 μm or less, and in the molding step, the mold contacts the specular reflection layer and presses the laminate to form a recess on the retroreflective sheet side of the laminate.
[0008] As a result of extensive research, the inventors have found that by providing a thickness of 200 μm or more and 450 μm or less from the surface of the support layer facing the surface protective layer to the exposed surface of the surface protective layer, and by performing embossing in which a mold contacts the specular reflective layer and presses the laminate to form recesses on the retroreflective sheet side of the laminate, it is possible to prevent the formation of fine irregularities on one side of the surface protective layer. Furthermore, it has been found that if the thickness is less than 200 μm, the embossed laminate tends to become distorted, while if the thickness is greater than 450 μm, the shape of the mold may not be fully transferred to the laminate. In other words, it has been found that if the thickness is within this range, it is possible to prevent a decrease in shape reproducibility during embossing. Therefore, this method of manufacturing a three-dimensional emblem can prevent the surface from becoming citron-peel-like and also prevent a decrease in shape reproducibility, resulting in the production of a three-dimensional emblem with excellent design.
[0009] The surface protective layer preferably includes a polycarbonate resin layer.
[0010] In this case, a three-dimensional emblem with excellent heat resistance can be produced.
[0011] When the surface protective layer includes a polycarbonate resin layer, the surface protective layer preferably includes an acrylic resin layer on the one surface side and the polycarbonate resin layer on the other surface side.
[0012] In this case, the polycarbonate resin layer can provide excellent heat resistance, and the acrylic resin layer can provide excellent weather resistance.
[0013] The thickness of the support layer from the surface on the surface protection layer side to the one surface of the surface protection layer is preferably 275 μm or more and 375 μm or less.
[0014] In this case, the resulting three-dimensional emblem has excellent shape reproducibility.
[0015] Preferably, the method further comprises a filling step of filling the recesses with a resin, and the resin filled into the recesses is a non-thermoplastic resin.
[0016] In this case, a three-dimensional emblem with superior heat resistance can be produced compared to when the resin filled in the recess is a thermoplastic resin.
[0017] The three-dimensional emblem of the present invention comprises a surface protective layer having one exposed surface and a retroreflective sheet laminated on the other surface of the surface protective layer, a laminate having a recess on the retroreflective sheet side, and a resin filled in the recess, the laminate including a parallel portion surrounding the recess that extends generally parallel to a surface including the opening edge of the recess, the retroreflective sheet including a holder layer, a microsphere layer containing a plurality of light-transmitting microspheres that are held and arranged in a planar manner so that a portion of the holder layer is exposed on the side opposite the surface protective layer, a specular reflection layer facing the exposed portions of the microspheres from the holder layer, and a light-transmitting focus forming layer filling the space between the microspheres and the specular reflection layer, the thickness from the surface of the holder layer facing the surface protective layer in the parallel portion to the one surface of the surface protective layer being 200 μm or more and 450 μm or less, the resin being a non-thermoplastic resin that is in contact with the specular reflection layer. [Effects of the Invention]
[0018] As described above, the present invention can provide a method for manufacturing a three-dimensional emblem that can produce a three-dimensional emblem with excellent design, and a three-dimensional emblem itself. [Brief explanation of the drawings]
[0019] [Figure 1] 1 is a front view showing an example of a three-dimensional emblem according to an embodiment of the present invention. FIG. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 2 is a diagram showing a cross section of a laminate in the thickness direction, etc.; [Figure 4] 2 is a flowchart showing a method for manufacturing the three-dimensional emblem of FIG. 1. [Figure 5] FIG. 10 is a diagram showing the state after the preparation step. [Figure 6] FIG. 10 is a diagram showing the state before embossing in the molding step. [Figure 7] FIG. 10 is a diagram showing the state after embossing in the molding step. [Figure 8] FIG. 2 is a diagram showing a filling device used in the filling step. [Figure 9] FIG. 10 is a diagram showing a state before filling in a filling step. [Figure 10] 10A and 10B are diagrams showing a state during filling in a filling process. DETAILED DESCRIPTION OF THE INVENTION
[0020] Below, a method for manufacturing a three-dimensional emblem according to the present invention and embodiments for implementing the three-dimensional emblem are illustrated with the accompanying drawings. The embodiments illustrated below are intended to facilitate understanding of the present invention and are not intended to limit the present invention. The present invention may be modified or improved from the following embodiments without departing from the spirit and scope of the claims. Furthermore, in the drawings accompanying this specification, the dimensions of each component may be exaggerated to facilitate understanding.
[0021] Fig. 1 is a front view showing an example of a three-dimensional emblem according to this embodiment, and Fig. 2 is a cross-sectional view taken along line II-II in Fig. 1.
[0022] 1 and 2, the three-dimensional emblem 1 is an emblem formed by three-dimensionally molding a sheet into a predetermined shape. The three-dimensional emblem 1 of this embodiment is mainly composed of a laminate 100 in which a surface protection layer 10 and a retroreflective sheet 20 are laminated, a cured resin 30, and a tape layer 40.
[0023] As shown in FIG. 2, the laminate 100 is embossed so that one side, which faces the surface protection layer 10, protrudes and the other side, which faces the retroreflective sheet 20, forms a recess 100D. As shown in FIG. 1, in this embodiment, the laminate 100 protrudes as described above, so that the three-dimensional emblem 1 has a three-dimensional shape that rises roughly in a T-shape in a plan view. The three-dimensional emblem 1 of this embodiment has a roughly trapezoidal cross-sectional shape. Therefore, in the area surrounding the recess 100D, the laminate 100 includes a parallel portion 100P that extends roughly parallel to a plane including the opening edge 100E of the recess 100D, and an inclined portion 100S that connects to the parallel portion 100P. The thickness of the inclined portion 100S is smaller than the thickness of the parallel portion 100P.
[0024] The cured resin 30 is filled in the recess 100D. The cured resin 30 is filled up to the opening edge 100E, and a surface 30F of the cured resin 30 opposite the laminate 100 side is exposed from the recess 100D. The surface 30F is planar. Therefore, the surface 30F generally coincides with the plane including the opening edge 100E and is generally parallel to the parallel portion 100P. The material used for the cured resin 30 is, for example, a non-thermoplastic resin. Examples of the non-thermoplastic resin include a thermosetting resin and a reaction-curing resin. Examples of the thermosetting resin include a urethane resin, an epoxy resin, and a silicone resin. Furthermore, a two-component type reaction-curing resin may be used in which a base resin and a crosslinking agent are mixed immediately before use. An example of such a two-component cured resin is a two-component curing non-foaming urethane resin. The cured resin 30 may contain one or more of the following components: a cross-linking agent, a polymerization initiator, a stabilizer, a flame retardant, an antioxidant, an antistatic agent, an antifungal agent, and the like.
[0025] The tape layer 40 is provided on the opposite side of the cured resin 30 from the laminate 100. In this embodiment, the tape layer 40 is a tape-shaped member that seals the cured resin 30. The thickness of the tape layer 40 is, for example, 120 μm or more and 130 μm or less. The tape layer 40 in this embodiment has an adhesive layer 41 that adheres to both the surface 30F of the cured resin 30 exposed from the recess 100D and to the laminate 100, and a release paper 42 attached to one side of the adhesive layer 41. When using the three-dimensional emblem 1, the release paper 42 is peeled off to expose the adhesive layer 41, and the adhesive layer 41 is attached to the object, thereby attaching the three-dimensional emblem 1 to the object.
[0026] As shown in Fig. 2, the surface protective layer 10 is a light-transmitting layer that covers the surface of the retroreflective sheet 20 and is the outermost layer of the three-dimensional emblem 1. In this embodiment, light enters and exits the three-dimensional emblem 1 from one exposed surface 10F1 of the surface protective layer 10. The total light transmittance of the surface protective layer 10 is preferably 80% or more.
[0027] Examples of materials for the surface protective layer 10 include resins such as acrylic resin, alkyd resin, fluororesin, vinyl chloride resin, polyester resin, urethane resin, and polycarbonate resin, or combinations thereof. From the viewpoints of weather resistance and processability, acrylic resin, polyester resin, and vinyl chloride resin are preferred, and from the viewpoints of coating suitability and dispersibility of colorants during coloring, acrylic resin and polyester resin are preferred. Furthermore, from the viewpoint of heat resistance, polycarbonate resin is preferred.
[0028] The thickness of the surface protection layer 10 in the parallel portion 100P is preferably 125 μm or more and 375 μm or less, and more preferably 200 μm or more and 300 μm or less.
[0029] The surface protective layer 10 may be a single layer or may have a laminated structure of two or more layers. When the surface protective layer 10 has a laminated structure, the total thickness of the laminated structure is 125 μm or more and 375 μm or less, and more preferably 200 μm or more and 300 μm or less, in the parallel portion 100P. When the surface protective layer 10 has a laminated structure, the thickness of each layer may be adjusted appropriately depending on the purpose. For example, when the surface protective layer 10 consists of two layers, an acrylic resin layer and a polycarbonate resin layer, the thickness ratio of the acrylic resin layer to the polycarbonate resin layer is preferably 1:1 to 1:10, and more preferably 1:3 to 1:7. In this case, it is preferable that the acrylic resin layer is located on one surface 10F1 and the polycarbonate resin layer is located on the other surface 10F2.
[0030] The surface protective layer 10 may be formed using a commercially available film, such as Iupilon Film DF02PU manufactured by Mitsubishi Gas Chemical Company, Inc., Technoloy S001G, C000, and C003 manufactured by Sumika Acrylic Sales Co., Ltd., Shinetec AW-10SU manufactured by Wavelock Advanced Technology Co., Ltd., and Toughlon LC-1700 manufactured by Idemitsu Kosan Co., Ltd.
[0031] A light-transmitting adhesive layer 11 is provided on the other surface 10F2 of the surface protective layer 10. One surface of the retroreflective sheet 20 is attached to the surface 10F2 of the surface protective layer 10 via the adhesive layer 11. Examples of materials for the adhesive layer 11 include acrylic resins, epoxy resins, phenolic resins, vinyl acetate resins, nitrile rubber resins, and silicone rubber resins. The thickness of the adhesive layer 11 is, for example, 20 μm or more and 60 μm or less at the parallel portion 100P.
[0032] To improve the design of the three-dimensional emblem 1, a printed layer may be provided on the other surface 10F2 of the surface protective layer 10. The printed layer can be provided by, for example, gravure printing, screen printing, flexographic printing, inkjet printing, or the like, using a light-transmitting or light-opaque resin ink. When a printed layer is provided, the printed layer is provided on the surface of the other surface 10F2 of the surface protective layer 10, and an adhesive layer 11 is provided on the printed layer. Note that when a light-opaque ink is used for the printed layer, the printed layer is provided on part of the other surface 10F2, but not on the other part.
[0033] Next, the retroreflective sheet 20 will be described in detail.
[0034] FIG. 3 is a diagram showing a cross section of the laminate 100 in the thickness direction. As shown in FIG. 3, the retroreflective sheeting 20 of this embodiment is a microsphere-type retroreflective sheeting. The retroreflective sheeting 20 includes a surface layer 21, a holder layer 22, a microsphere layer 23 containing a plurality of microspheres 23b held by the holder layer 22, a specular reflection layer 25 facing the microspheres 23b, and a focus formation layer 24 filling the gap between the microspheres 23b and the specular reflection layer 25, and is configured by laminating these layers. The thickness of this retroreflective sheeting 20 may be, for example, 90 μm or more and 270 μm or less.
[0035] The surface layer 21 is a layer exposed on the surface of the retroreflective sheet alone, and in the laminate 100, it is a layer that contacts the adhesive layer 11 and is fixed to the adhesive layer 11. The surface layer 21 is a light-transmitting layer, and the total light transmittance of the surface layer 21 is preferably 80% or more. Examples of materials for the surface layer 21 include resins such as acrylic resin, alkyd resin, fluororesin, vinyl chloride resin, polyester resin, urethane resin, polycarbonate resin, and combinations thereof. From the viewpoints of weather resistance and processability, acrylic resin, polyester resin, and vinyl chloride resin are preferred, and from the viewpoints of coating suitability and dispersibility of colorants during coloring, it is preferable to use acrylic resin or polyester resin. Furthermore, from the viewpoint of heat resistance, polycarbonate resin is preferred.
[0036] The thickness of the surface layer 21 in the parallel portion 100P is preferably 25 μm or more and 75 μm or less, and more preferably 40 μm or more and 60 μm or less. As will be described later, the thickness in the parallel portion 100P from the surface 22F1 of the support layer 22 on the surface protective layer 10 side to one surface 10F1 of the surface protective layer 10 is 200 μm or more and 450 μm or less.
[0037] A printed layer may be provided on the surface of the surface layer 21 facing the adhesive layer 11 or on the surface opposite to the adhesive layer 11. This printed layer is similar to the printed layer that may be provided on the other surface 10F2 of the surface protection layer 10.
[0038] A support layer 22 is provided on the surface layer 21 opposite the adhesive layer 11 side. The support layer 22 is a layer that supports the microspheres 23b of the microsphere layer 23 and is optically transparent. In the example of FIG. 3, the surface 22F1 of the support layer 22 facing the surface protective layer 10 is in contact with the surface layer 21. The microsphere layer 23 is supported on the other surface of the support layer 22. The total light transmittance of the support layer 22 is preferably 80% or more. Examples of materials for forming the support layer 22 include acrylic resin, alkyd resin, fluororesin, vinyl chloride resin, polyester resin, urethane resin, polycarbonate resin, etc., or combinations thereof. From the viewpoints of weather resistance and processability, acrylic resin, polyester resin, and vinyl chloride resin are preferred, and from the viewpoints of coating suitability and dispersibility of colorants during coloring, acrylic resin is preferred. The thickness of the parallel portion 100P of the support layer 22, in the area that supports the microspheres 23b, is preferably 5 μm or more and 25 μm or less. The thickness of the support layer 22 at the portion supporting the microspheres 23b is equal to the distance from the vertex of the microspheres 23b in the thickness direction to the surface 22F1 of the support layer 22 on the surface protection layer 10 side.
[0039] The microspheres 23b of the microsphere layer 23 are optically transparent and function as lenses, and are therefore sometimes called microlenses. The microspheres 23b are arranged in a planar manner on the side of the holder layer 22 opposite the surface protection layer 10, with some of the microspheres 23b covered and some of the microspheres exposed, and are held by the holder layer 22. In the example shown in FIG. 3, roughly half of the surface of each microsphere 23b is covered by the holder layer 22. Note that the microspheres 23b are arranged in a planar manner, meaning that the microspheres 23b are arranged in a roughly planar manner. Furthermore, the portions of each microsphere 23b that are not covered by the holder layer 22 are covered by the focus forming layer 24. Therefore, the holder layer 22 and the focus forming layer 24 are in contact with each other between the microspheres 23b. The microspheres 23b are made of, for example, glass. The average particle size of the microspheres 23b is, for example, 50 μm to 100 μm, and the particle size distribution of the microspheres 23b is, for example, 75% or more within a range of ±10 μm of the average particle size. The average particle size and particle size distribution of the microspheres 23b are measured, for example, as follows: First, 10 g of the microspheres 23b to be used as a measurement sample are placed in a dry glass container. Next, approximately 230 ml of an electrolyte solution manufactured by BECKMAN (product name: Coulter Isoton III Diluent) is added to the container and stirred with a glass rod until the microspheres 23b are uniformly dispersed, thereby preparing a dispersion solution of the microspheres 23b. Next, this dispersion solution is placed in a Beckman Coulter Counter (Multisizer 2) and measured.
[0040] The focus forming layer 24 is a light-transmitting member, and is provided so that light that enters through the surface protective layer 10 and passes through the holder layer 22 and the microspheres 23b is focused on the specular reflection layer 25. The total light transmittance of the focus forming layer 24 is preferably 80% or more. The thickness of the focus forming layer 24 is determined based on the refractive index of the microspheres 23b and the focus forming layer 24, etc., so that the incident light is focused on the specular reflection layer 25, and is, for example, 10 μm to 60 μm.
[0041] Examples of materials for forming the focus forming layer 24 include acrylic resin, alkyd resin, fluororesin, vinyl chloride resin, polyester resin, urethane resin, polycarbonate resin, butyral resin, and combinations thereof. Acrylic resin is preferred from the viewpoints of weather resistance, coatability, and thermal stability.
[0042] The specular reflection layer 25 is a layer for reflecting light and is provided on the surface of the focus forming layer 24 opposite the microspheres 23b side. The surface of the specular reflection layer 25 facing the microspheres 23b faces the microspheres 23b at a certain distance and serves as a reflective region. The thickness of the specular reflection layer 25 is, for example, 0.05 μm to 0.2 μm in the parallel portion 100P. Examples of materials for the specular reflection layer 25 include metals such as aluminum, silver, chromium, nickel, magnesium, gold, and tin. The specular reflection layer 25 is formed by forming a film of such a metal by, for example, vacuum deposition or sputtering.
[0043] The retroreflective sheet 20 does not have a layer laminated on the side of the specular reflection layer 25 opposite to the focus forming layer 24 side. Therefore, the cured resin 30 filled in the recess 100D is in contact with the specular reflection layer 25 within the recess 100D. By having the cured resin 30 in contact with the specular reflection layer 25, the laminate 100 is supported by the cured resin 30 and is prevented from deforming.
[0044] As shown in Figure 3, when light L enters surface 10F1 of surface protection layer 10, it enters surface layer 21 from one side of retroreflective sheeting 20, passes through holder layer 22, microspheres 23b, and focus forming layer 24, is focused on specular reflection layer 25, and is reflected by specular reflection layer 25. The reflected light then propagates along the reverse path to that described above and is retroreflected. Light L is thus emitted from surface 10F1 to the outside of three-dimensional emblem 1.
[0045] Next, a method for manufacturing the three-dimensional emblem of this embodiment will be described.
[0046] Fig. 4 is a flowchart showing a manufacturing method for the three-dimensional emblem 1. As shown in Fig. 4, the manufacturing method for the three-dimensional emblem 1 mainly comprises a preparation step P1, a molding step P2, a filling step P3, a curing step P4, and a trimming step P5.
[0047] <Preparation process P1> This step is a step of preparing a laminate 100. FIG. 5 shows the state after this step. In this step, a surface protective layer 10 is adhered via an adhesive layer 11 to the surface of the retroreflective sheet 20 opposite the specular reflective layer 25, i.e., the surface of the surface layer 21 opposite the support layer 22. In this way, a laminate 100 is obtained in which the surface protective layer 10 and the retroreflective sheet 20 are laminated via the adhesive layer 11. Note that this step may be performed by a method different from that described above, as long as a laminate 100 in which the surface protective layer 10 and the retroreflective sheet 20 are laminated can be obtained.
[0048] The thickness of each portion of the laminate 100 prepared in this step is approximately equal to the thickness of each portion of the parallel portion 100P described above.
[0049] <Forming process P2> This step is a step of embossing the laminate 100 using a mold. FIG. 6 is a diagram showing the state before embossing in this step, and FIG. 7 is a diagram showing the state after embossing in this step. As shown in FIG. 6, in this step, the laminate 100 is embossed using a convex mold 80. The mold 80 includes a flat plate-shaped portion 81 and a protruding portion 82 protruding from the flat plate portion 81. The protruding portion 82 is formed in a trapezoidal shape whose width narrows as it moves away from the flat plate portion 81. In this step, first, the laminate 100 is placed on the protruding portion 82 of the mold 80 so that the specular reflective layer 25 of the retroreflective sheet 20 contacts the protruding portion 82.
[0050] Next, in this process, the laminate 100 is heated to soften it, and then embossed by, for example, vacuum / pressure forming or the like, so that the surface protection layer 10 of the laminate 100 protrudes, as shown in FIG. 7 . That is, in this process, a mold 80 contacts the specular reflective layer 25 and presses the laminate 100, forming a recess 100D on the specular reflective layer 25 side of the laminate 100. Alternatively, the laminate 100 may be heated to soften it, and a concave mold (not shown) may be placed over the mold 80 to press the laminate 100, thereby embossing the surface protection layer 10 side of the laminate 100 so that the surface protection layer 10 protrudes. In this way, a parallel portion 100P and an inclined portion 100S are formed. At this time, the laminate 100 is not significantly stretched in the parallel portion 100P, so that the thickness of the laminate 100 changes very little. Therefore, the thickness of each portion of the parallel portion 100P is approximately equal to the thickness of each portion of the laminate prepared in the preparation step P1. On the other hand, the inclined portion 100S is stretched to form the recess 100D, and the thickness of the laminate 100 becomes smaller.
[0051] In this way, the predetermined embossed shape is transferred to the laminate 100. In this embodiment, the retroreflective sheet 20 side of the laminate 100 is formed concave, and the surface protective layer 10 side of the laminate 100 is formed convex. Therefore, after this step, the laminate 100 has concave portions 100D on the specular reflective layer 25 side and convex portions 100C on the surface protective layer 10 side.
[0052] <Filling process P3> This step is a step of filling resin into recesses 100D on the specular reflective layer 25 side of the laminate 100. Fig. 8 is a diagram showing an example of the configuration of a filling device used in this step. As shown in Fig. 8, the filling device 90 of this embodiment includes a conveying path 91, a pressure roller 92, a resin injection nozzle 93, and a base 94 as main components.
[0053] The conveying path 91 is, for example, a belt conveyor type conveying path. The base 94 is disposed on the conveying path 91 and moves as the conveying path 91 moves to D1. A storage space SP capable of storing the protrusion 100C formed on the laminate 100 in the molding process P2 is provided on the placement surface of the base 94 opposite to the conveying path side.
[0054] The pressure roller 92 is disposed above the conveying path 91, and in this embodiment is an elevation roller that moves up and down in directions toward and away from the conveying path 91. The pressure roller 92 rotates so that the lower surface of the pressure roller 92 moves in the same direction as the conveying direction D1, which is the direction of movement of the conveying path 91. The surface of the pressure roller 92 is made of, for example, rubber.
[0055] The tape layer 40 is disposed between the pressure roller 92 and the conveying path 91. The release paper 42 side of the tape layer 40 faces the roller surface of the pressure roller 92, and the adhesive layer 41 side of the tape layer 40 faces the conveying path 91. The tape layer 40 is moved at a predetermined speed in the conveying direction D1 of the conveying path 91 by a feed mechanism (not shown).
[0056] The resin injection nozzle 93 is disposed above the conveying path 91 and upstream of the pressure roller 92 in the conveying direction D1, and injects a specified amount of hardened resin 30, which will be described later.
[0057] Fig. 9 is a diagram showing the state before filling in this step, and Fig. 10 is a diagram showing the state during filling in this step. As shown in Fig. 9, first, the protrusion 100C of the laminate 100 is accommodated in the accommodation space SP of the base 94, and the laminate 100 is placed on the base 94.
[0058] In addition, in order to prevent the protrusion 100C of the laminate 100 from being deformed by pressure, it is preferable that the depth of the storage space SP is such that there is a gap between the protrusion 100C of the laminate 100 placed on the base 94.
[0059] Next, a specified amount of cured resin 30 is injected from the resin injection nozzle 93 onto the surface of the laminate 100 on the specular reflective layer 25 side, except for the recessed portion 100D, and the cured resin 30 is placed on the retroreflective sheeting 20 of the laminate 100. At this time, the cured resin 30 is placed on the specular reflective layer 25 of the retroreflective sheeting 20.
[0060] Next, a pressure roller 92 is placed on the opening edge 100E of the recess 100D of the laminate 100, downstream of the recess 100D in the conveying direction D1. Next, the base 94 is moved in the conveying direction D1, and the pressure roller 92 is pressed against the base 94 and rotated. In this way, as shown in FIG. 10 , the pressure roller 92 presses the tape layer 40 against the laminate 100. At this time, the cured resin 30 is pressed by the tape layer 40 and moves into the recess 100D, filling the recess 100D. In this way, a surface 30F of the cured resin 30 opposite the laminate 100 side is exposed from the recess 100D, and the surface 30F roughly coincides with a plane including the opening edge 100E of the recess 100D. When the pressure roller 92 passes above the recess 100D, The tape layer 40 is pressure-bonded to the periphery of the recesses 100D in the retroreflective sheet 20, and the cured resin 30 is sealed in the recesses 100D. In this way, the cured resin 30 is filled in the recesses 100D with the cured resin 30 in contact with the specular reflection layer 25.
[0061] Furthermore, the excess cured resin 30 that has not been filled into the recess 100D is pressed by the tape layer 40 and moved to the upstream end of the laminate 100. Alternatively, if a plurality of recesses 100D are formed, the cured resin 30 that has not been filled into one recess 100D may be filled into the next recess 100D on the upstream side.
[0062] After the cured resin 30 is filled into the recesses 100D of the laminate 100, the laminate 100 may be pressed again from the surface on the retroreflective sheet 20 side. Also, a squeegee or the like may be used instead of the pressure roller 92.
[0063] <Curing process P4> This step is a step of hardening the curable resin 30 filled in the recess 100D. When the curable resin 30 is a thermosetting resin, for example, the curable resin 30 is aged for a predetermined time at a predetermined temperature at which the curable resin 30 hardens. When the curable resin 30 is a reactive curable resin, for example, the curable resin may be left at room temperature to harden, or instead of being left at room temperature, the curable resin may be heated to harden in a short time.
[0064] In this way, the curable resin 30 filled in the recess 100D is cured.
[0065] <Trimming process P5> This step is a step of cutting the laminate 100 with the tape layer 40 attached to it to a predetermined size. Note that before or after cutting out the laminate 100, resin that protrudes from the laminate 100 and the tape layer 40 may be removed. Furthermore, burrs may be removed after cutting out the laminate 100.
[0066] Through the above steps, the three-dimensional emblem 1 shown in Figs. 1 and 2 is manufactured.
[0067] As explained above, the manufacturing method for the three-dimensional emblem 1 of this embodiment includes a molding step P2 in which a laminate 100 including a surface protective layer 10 with one surface 10F1 exposed and a retroreflective sheeting 20 laminated on the other surface 10F2 of the surface protective layer 10 is embossed using a mold 80. The retroreflective sheeting 20 further includes a holder layer 22, a microsphere layer 23 including a plurality of light-transmitting microspheres 23b arranged in a plane and held so that a portion of the microspheres 23b is exposed on the side of the holder layer 22 opposite the surface protective layer 10, a specular reflection layer 25 facing the exposed portions of the microspheres 23b on the holder layer 22, and a light-transmitting focus forming layer 24 filling the gap between the microspheres 23b and the specular reflection layer 25. Before the molding process P2, the thickness from the surface 22F1 of the support layer 22 facing the surface protection layer 10 to one surface 10F1 of the surface protection layer 10 is 200 μm or more and 450 μm or less, and in the molding process P2, the mold 80 contacts the specular reflective layer 25 and presses the laminate 100, forming a recess 100D on the retroreflective sheet 20 side of the laminate 100.
[0068] As in the examples described below, the thickness from the surface 22F1 of the support layer 22 facing the surface protective layer 10 to one surface 10F1 of the surface protective layer 10 before molding step P2 is 200 μm or more and 450 μm or less, and the mold 80 contacts the specular reflective layer 25 and presses the laminate 100 to perform embossing to form recesses 100D on the specular reflective layer 25 side of the retroreflective sheeting 20, thereby preventing the formation of fine irregularities on one surface 10F1 of the surface protective layer 10 and improving the shape reproducibility of the shape of the mold 80. Therefore, the method for manufacturing a three-dimensional emblem of the embodiment can prevent the surface from becoming citron-peel-like and can produce a three-dimensional emblem 1 with excellent design, with reduced loss of shape reproducibility. Furthermore, if a thermoplastic resin layer is present on the side opposite the focus forming layer 24 of the specular reflective layer 25, it is thought that during embossing, the thermoplastic resin layer will excessively push up the microspheres 23b in the retroreflective sheet 20, making it easier for a yuzu peel to form on the surface of the three-dimensional emblem 1.
[0069] The three-dimensional emblem 1 of this embodiment comprises a laminate 100 including a surface protective layer 10 with one surface 10F1 exposed and a retroreflective sheet 20 laminated on the other surface 10F2 of the surface protective layer 10, the laminate 100 having a recess 100D on the retroreflective sheet 20 side, and resin 30 filled in the recess 100D. Furthermore, the laminate 100 includes, in a region surrounding the recess 100D, a parallel portion 100P that extends generally parallel to a plane including the opening edge 100E of the recess 100D. The retroreflective sheet 20 further includes a holder layer 22, a microsphere layer 23 containing a plurality of light-transmitting microspheres 23b arranged in a plane and held so that some of the microspheres are exposed on the side of the holder layer 22 opposite the surface protective layer 10, a specular reflection layer 25 facing the exposed portions of the microspheres 23b from the holder layer 22, and a light-transmitting focus forming layer 24 filling the gap between the microspheres 23b and the specular reflection layer 25, and the thickness of the surface protective layer from the surface 22F1 of the holder layer 22 facing the surface protective layer 10 at the parallel portion 100P to one surface 10F1 of the surface protective layer 10 is 200 μm or more and 450 μm or less, and the resin 30 is a non-thermoplastic resin and is in contact with the specular reflection layer 25.
[0070] Such a three-dimensional emblem 1 has the recesses filled with the resin 30, which is a non-thermoplastic resin, and therefore has superior heat resistance compared to when the recesses are filled with a thermoplastic resin. [Example]
[0071] Next, the present invention will be described in more detail with reference to the results of evaluation using examples and comparative examples.
[0072] Example 1 The three-dimensional emblem 1 of this example was produced in the following manner.
[0073] First, a laminate 100 was prepared according to the preparation step P1. First, a surface protective layer 10 was prepared. The surface protective layer 10 had a laminated structure of an acrylic resin layer and a polycarbonate resin (PC) layer. Polymethyl methacrylate resin (PMMA) was used as the acrylic resin. The acrylic resin layer had a thickness of 60 μm, and the polycarbonate resin layer had a thickness of 240 μm. Therefore, the thickness of the surface protective layer 10 was 300 μm. Furthermore, a retroreflective sheet 20 was prepared. The average size of the microspheres 23b in this retroreflective sheet 20 was 50 to 65 μm. The thickness of the portion of the support layer 22 holding the microspheres 23b was 17 μm. Furthermore, the thickness of the surface layer 21 was 50 μm. An adhesive layer 11 was provided by coating on the surface of the surface protective layer 10 facing the polycarbonate resin layer. The thickness of the adhesive layer 11 was 25 μm. Thereafter, the adhesive layer 11 was pressed onto the surface of the surface layer 21 of the retroreflective sheeting 20 opposite the support layer 22 side to obtain a laminate 100. The total thickness of the surface layer 21, adhesive layer 11, and surface protective layer 10, from the surface 22F1 of the support layer 22 facing the surface protective layer 10 to one exposed surface 10F1 of the surface protective layer 10, was 375 μm.
[0074] Next, according to the molding step P2, recesses 100D were formed in the laminate 100. Specifically, the laminate 100 was heated to 120°C, and the recesses 100D were formed by vacuum pressure molding so that the specular reflective layer 25 of the retroreflective sheeting 20 was in contact with the convex mold 80. Thereafter, the laminate 100 was cooled, and then removed from the mold 80.
[0075] Next, according to the filling step P3, the recess 100D was filled with the curable resin 30. A two-component curable non-foaming urethane resin was used as the curable resin.
[0076] Next, in accordance with the curing step P4, the laminate 100 filled with the curable resin 30 was left at room temperature for a predetermined time to cure the curable resin 30.
[0077] Next, unnecessary laminate 100 was removed in accordance with the trimming step P5.
[0078] In this way, a three-dimensional emblem 1 was obtained under the above conditions.
[0079] <Examples 2 to 8> A three-dimensional emblem 1 was produced in the same manner as in Example 1, except that the configuration of the surface protective layer 10 was changed from that in Example 1. In each Example, the thickness of the surface protective layer 10 was as shown in Table 1, and the thicknesses of the surface layer 21 and adhesive layer 11 were the same as in Example 1. Therefore, the thickness from the surface 22F1 of the support layer 22 facing the surface protective layer 10 to one surface 10F1 where the surface protective layer 10 is exposed was as shown in Table 1. In Example 2, the thickness of the acrylic resin layer was 40 μm, and the thickness of the polycarbonate resin layer was 160 μm. In Example 3, the thickness of the acrylic resin layer was 30 μm, and the thickness of the polycarbonate resin layer was 120 μm. In Example 4, the thickness of the acrylic resin layer was 25 μm, and the thickness of the polycarbonate resin layer was 100 μm. In Example 5, the thickness of the acrylic resin layer was 60 μm, and the thickness of the polycarbonate resin layer was 315 μm. In Examples 6 to 8, the surface protection layer 10 was a single layer.
[0080] <Comparative Examples 1 and 2> A three-dimensional emblem 1 was produced in the same manner as in Example 1, except that the configuration of the surface protective layer 10 and the retroreflective sheeting 20 was changed from those in Example 1. In Comparative Example 1, the surface protective layer 10 was a single layer, and the thickness of the surface protective layer 10 was as shown in Table 1. In Comparative Example 2, the thickness of the acrylic resin layer was 30 μm, the thickness of the polycarbonate resin layer was 120 μm, and the thickness of the surface protective layer 10 was as shown in Table 1. Furthermore, the retroreflective sheeting 20 of Comparative Examples 1 and 2 had the same configuration as Example 1, except that an adhesive layer was applied to the side of the specular reflective layer 25 opposite the focus forming layer 24 side, and a thermoplastic resin layer was attached to the adhesive layer, and the thickness of the surface protective layer 10 was changed. The thermoplastic resin layer was made of acrylonitrile-butadiene-styrene resin (ABS resin), and had a thickness of 200 μm. In Comparative Examples 1 and 2, the thickness from the surface 22F1 of the support layer 22 on the surface protective layer 10 side to one surface 10F1 where the surface protective layer 10 is exposed is as shown in Table 1.
[0081] <Comparative Examples 3 to 5> A three-dimensional emblem 1 was produced in the same manner as in Example 1, except that the configuration of the surface protective layer 10 was changed from that in Example 1. In each comparative example, the thickness of the surface protective layer 10 was as shown in Table 1. In comparative example 3, the thickness of the acrylic resin layer was 10 μm, and the thickness of the polycarbonate resin layer was 40 μm. In comparative example 4, the thickness of the acrylic resin layer was 20 μm, and the thickness of the polycarbonate resin layer was 80 μm. In comparative example 5, the thickness of the acrylic resin layer was 60 μm, and the thickness of the polycarbonate resin layer was 340 μm. In comparative examples 3 to 5, the thickness from the surface 22F1 of the support layer 22 facing the surface protective layer 10 to one surface 10F1 where the surface protective layer 10 is exposed was as shown in Table 1.
[0082] Table 1 is shown. TIFF2025150713000002.tif110170
[0083] <Yuzu Skin Evaluation> The three-dimensional emblems 1 of Examples 1 to 8 and Comparative Examples 1 to 5 were evaluated for yuzu peel. The produced three-dimensional emblems 1 were placed under fluorescent lights and visually evaluated. Three-dimensional emblems 1 in which no fine irregularities were observed on the surface and it was determined that no yuzu peel had been formed were rated as ◯. Three-dimensional emblems 1 in which slight fine irregularities were observed on the surface and slight yuzu peel had been formed but which were acceptable for practical use were rated as △. Three-dimensional emblems 1 in which many fine irregularities were observed on the surface and significant yuzu peel had been formed and which were not acceptable for practical use were rated as ×. Note that "acceptable for practical use" in this section means that the three-dimensional emblems 1 are acceptable for practical use from a design perspective.
[0084] <Evaluation of shape reproducibility> The three-dimensional emblems 1 of Examples 1 to 8 and Comparative Examples 1 to 5 were evaluated for shape reproducibility relative to the shape of the mold 80. Three-dimensional emblems 1 that faithfully reproduced the shape of the surface of the mold 80 were rated as ◯. Three-dimensional emblems 1 that were slightly distorted from the shape of the surface of the mold 80 but were acceptable for practical use were rated as △. Three-dimensional emblems 1 that were significantly distorted from the shape of the surface of the mold 80 and were therefore unacceptable for practical use were rated as ×. Note that "acceptable for practical use" in this section means that the emblems are acceptable for practical use from a design perspective.
[0085] <Heat resistance evaluation> The heat resistance of the three-dimensional emblems 1 of Examples 1 to 8 and Comparative Examples 1 to 5 was evaluated. In this evaluation, the three-dimensional emblem 1 was placed in an 80°C thermostatic chamber for one hour, then placed in a 110°C thermostatic chamber for three hours, then left at room temperature for 30 minutes, and then placed in the 110°C thermostatic chamber for three hours. This cycle constituted one cycle, and four cycles were repeated, with the three-dimensional emblem 1 left at room temperature for 30 minutes between cycles. Three-dimensional emblems 1 that showed no change from before heating were rated as "Good." Three-dimensional emblems 1 in which the surface protective layer 10 peeled slightly from the retroreflective sheeting 20 or the retroreflective sheeting 20 peeled slightly from the cured resin 30 after heating but were acceptable for practical use were rated as "Good." Three-dimensional emblems 1 in which the surface protective layer 10 peeled significantly from the retroreflective sheeting 20 or the retroreflective sheeting 20 peeled significantly from the cured resin 30 after heating, and therefore were unacceptable for practical use, were rated as "Poor."
[0086] The results are shown in Table 2. TIFF2025150713000003.tif99170
[0087] As shown in Table 2, if the thickness from the surface 22F1 of the support layer 22 facing the surface protective layer 10 to the exposed surface 10F1 of the surface protective layer 10 is 200 μm or more and 450 μm or less, and the three-dimensional emblem 1 is embossed by pressing the laminate 100 with a mold in contact with the specular reflective layer 25, the formation of yuzu peel can be suppressed, and the deterioration of shape reproducibility can also be suppressed, resulting in practically acceptable results.
[0088] Furthermore, when the thickness from the surface 22F1 of the support layer 22 facing the surface protective layer 10 to the exposed surface 10F1 of the surface protective layer 10 is 275 μm or more and 375 μm or less, the shape reproducibility is better than when the thickness is less than 275 μm or more than 375 μm.
[0089] Furthermore, when the surface protective layer 10 contained a polycarbonate resin layer, the heat resistance was found to be better than when the surface protective layer 10 did not contain a polycarbonate resin layer.
[0090] Furthermore, even when the thickness from the surface 22F1 of the support layer 22 on the surface protective layer 10 side to the exposed surface 10F1 of the surface protective layer 10 was 200 μm or more and 450 μm or less, as in Comparative Example 2, a citron peel was observed in the case of a laminate in which a thermoplastic resin layer was disposed between the specular reflective layer 25 and the mold 80. This is thought to be because the microspheres 23b were pressed excessively by the thermoplastic resin layer.
[0091] Although the present invention has been described above using the above embodiment as an example, the present invention is not limited to this.
[0092] For example, the shape of the three-dimensional emblem 1 is not limited to that shown in FIG. 1, and may be other shapes.
[0093] Furthermore, although the surface protection layer 10 and the retroreflective sheet are laminated via the adhesive layer 11, they may be integrated without the adhesive layer 11, in which case the surface protection layer 10 and the retroreflective sheet 20 may be formed continuously. [Industrial Applicability]
[0094] According to the present invention, a method for manufacturing a three-dimensional emblem that can produce a three-dimensional emblem with excellent design, and a three-dimensional emblem are provided, which can be used in fields such as stickers and decals. [Explanation of symbols]
[0095] 1. 3D emblem 100D recess 10...Surface protective layer 20. Retroreflective sheet 22...Holder layer 23...Microsphere layer 23b...microsphere 24...focal formation layer 25...Specular reflective layer P1...preparation process P2...Molding process P3...Filling process P4...Curing process P5: Trimming process
Claims
1. a molding step of embossing a laminate including a surface protective layer having one surface exposed and a retroreflective sheet laminated on the other surface side of the surface protective layer, using a mold; The retroreflective sheet includes a support layer, a microsphere layer containing a plurality of light-transmitting microspheres arranged in a plane and held so that a portion of the microspheres is exposed on the side of the support layer opposite to the surface protective layer side, a specular reflection layer facing the exposed portion of the microspheres from the support layer, and a light-transmitting focusing layer filling the gap between the microspheres and the specular reflection layer, a thickness from the surface of the support layer on the surface protective layer side to the one surface of the surface protective layer before the molding step is 200 μm or more and 450 μm or less; In the molding step, the mold is in contact with the specular reflective layer and presses the laminate, forming a recess on the retroreflective sheet side of the laminate. A method for manufacturing a three-dimensional emblem.
2. The surface protective layer includes a polycarbonate resin layer.
2. The method for manufacturing a three-dimensional emblem according to claim 1.
3. The surface protective layer includes an acrylic resin layer on the one surface side and a polycarbonate resin layer on the other surface side.
3. The method for manufacturing a three-dimensional emblem according to claim 2.
4. The thickness from the surface of the support layer on the surface protection layer side to the one surface of the surface protection layer is 275 μm or more and 375 μm or less.
3. The method for manufacturing a three-dimensional emblem according to claim 1 or 2.
5. The method further includes a filling step of filling the recess with resin, The resin filled in the recess is a non-thermoplastic resin.
3. The method for manufacturing a three-dimensional emblem according to claim 1 or 2.
6. a laminate including a surface protective layer having one surface exposed and a retroreflective sheet laminated on the other surface side of the surface protective layer, the laminate having a recess on the retroreflective sheet side; a resin filled in the recess; Equipped with the laminate includes a parallel portion that extends generally parallel to a surface that includes an opening edge of the recess, in a portion that surrounds the recess; The retroreflective sheet includes a support layer, a microsphere layer containing a plurality of light-transmitting microspheres arranged in a plane and held so that a portion of the microspheres is exposed on the side of the support layer opposite the surface protective layer side, a specular reflection layer facing the exposed portion of the microspheres from the support layer, and a light-transmitting focusing layer filling the gap between the microspheres and the specular reflection layer, a thickness of the parallel portion from the surface of the support layer facing the surface protective layer to the one surface of the surface protective layer is 200 μm or more and 450 μm or less; The resin is a non-thermoplastic resin, and is in contact with the specular reflection layer. A distinctive three-dimensional emblem.
Citation Information
Patent Citations
Three-dimensional emblem
JP2022082988A