Carrier structure

Abstract

To provide a carrier structure capable of enhancing the efficiency of separating and recovering harmful components.SOLUTION: A carrier structure 10 disclosed herein is used for supporting an active substance, the carrier structure 10 comprising a porous resin matrix 20, porous particles 30 having a plurality of pores 32, and a sheet-shaped wire mesh member 40, wherein the wire mesh member 40 is disposed with at least a part thereof embedded in the resin matrix 20, and the porous particles 30 are disposed within pores 22 of the resin matrix 20.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to support structures for supporting active materials such as adsorbents and catalysts. [Background technology]

[0002] Exhaust gases emitted from thermal power plants, factories, automobiles, and the like contain various harmful components, and there is a demand for the development of materials and technologies for selectively separating and recovering these components. For example, carbon dioxide (CO2), one example of a harmful component, is a greenhouse gas, and therefore there is a pressing need to significantly reduce emissions. In order to efficiently separate and recover such components, materials are used that include an active substance such as an adsorbent or catalyst, and a carrier that supports the active substance. Patent Documents 1 and 2 are examples of related technologies. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Special Publication No. 2014-506836 [Patent Document 2] Japanese Patent Application Publication No. 2018-187574 Summary of the Invention [Problem to be solved by the invention]

[0004] Examples of carriers that support active substances such as adsorbents and catalysts include those that use a honeycomb structure or a nonwoven fabric as a substrate. These carriers have the problem that the amount of active substance supported per volume is small because the carrier is disposed only on the surface of the substrate.

[0005] Furthermore, when using the above-mentioned active substance and a carrier supporting the active substance to separate and recover harmful substances, for example, a method is used in which the harmful substances are adsorbed onto the active substance, and then heated gas (air) is passed through the carrier to raise the temperature of the active substance and recover the harmful substances adsorbed onto the active substance. Further studies by the present inventors have revealed that in order to improve the efficiency of separation and recovery of harmful substances, it is necessary not only to increase the amount of the active substance supported, but also to increase the thermal conductivity of the entire carrier.

[0006] The technology disclosed herein has been made in view of the above circumstances, and its main purpose is to provide a carrier structure with improved separation and recovery efficiency of harmful components. [Means for solving the problem]

[0007] The carrier structure disclosed herein is a carrier structure for supporting an active substance, and comprises a porous resin matrix, porous particles having a plurality of mesopores, and a sheet-like wire mesh member, the sheet-like wire mesh member being arranged in a state where at least a portion of the sheet-like wire mesh member is embedded in the resin matrix, and the porous particles are arranged within the pores of the resin matrix.

[0008] According to this configuration, the amount of the active substance supported can be increased by disposing the porous particles in the pores of the resin matrix. Furthermore, by disposing the sheet-like wire mesh member so that at least a part of it is embedded in the resin matrix, the temperature of the entire carrier structure can be increased without obstructing the gas (air) flow path within the carrier structure. This realizes the provision of a carrier structure with improved separation and recovery efficiency of harmful components.

[0009] In a preferred embodiment of the carrier structure disclosed herein, the void ratio of the wire mesh member is 50% or more and 80% or less.

[0010] In a preferred embodiment of the support structure disclosed herein, the resin matrix has an average pore size A of 0.5 μm or more and 5 μm or less, and the porous particles have an average pore size B of 10 nm or more and 40 nm or less.

[0011] In a preferred embodiment of the support structure disclosed herein, the ratio (A / B) of the average pore diameter A of the resin matrix to the average pore diameter B of the porous particles is 20 or more and 200 or less.

[0012] In a preferred embodiment of the support structure disclosed herein, the porosity based on Archimedes' method is 75% or more and 90% or less.

[0013] In one preferred embodiment of the carrier structure disclosed herein, it comprises a wire mesh member having a mesh structure.

[0014] In a preferred embodiment of the carrier structure disclosed herein, the opening of the wire mesh member is 0.02 mm or more and 15 mm or less.

[0015] In a preferred embodiment of the carrier structure disclosed herein, the wire mesh member comprises a heating element that generates heat when energized.

[0016] In a preferred embodiment of the carrier structure disclosed herein, the wire mesh member is a heat exchange member. [Brief explanation of the drawings]

[0017] [Figure 1] FIG. 1 is a diagram schematically showing the structure of a carrier structure according to one embodiment. [Figure 2] FIG. 2 is an enlarged view schematically showing the structure of a carrier structure according to one embodiment. [Figure 3] FIG. 3 is a cross-sectional view schematically showing the structure of a carrier structure according to one embodiment. [Figure 4] FIG. 4 is a cross-sectional SEM image (200x magnification) showing a cross section of the support structure of Example 1. [Figure 5] FIG. 5 is a cross-sectional SEM image (50x magnification) showing a cross section of the support structure of Example 1. DETAILED DESCRIPTION OF THE INVENTION

[0018] Preferred embodiments of the technology disclosed herein will be described below with reference to the drawings. Matters necessary for implementation other than those specifically mentioned in this specification can be understood based on the technical content taught by this specification and the general technical common sense of a person skilled in the art. The technology disclosed herein can be implemented based on the content disclosed in this specification and the general technical common sense of a person skilled in the art. In this specification, the expression "A to B" indicating a range means A or more and B or less.

[0019] In the following drawings, components and parts that perform the same function are denoted by the same reference numerals. Dimensional relationships (length, width, thickness, etc.) in each drawing do not reflect actual dimensional relationships. Arrows X, Y, and Z in the drawings indicate three mutually perpendicular directions, with X indicating the longitudinal direction, Y indicating the width direction, and Z indicating the thickness direction (vertical direction). The directions of up, down, left, right, front, and rear are represented by arrows U, D, L, R, F, and Rr, respectively, in the drawings. The directions of up, down, left, right, front, and rear are defined merely for the convenience of explanation and do not limit the content of the technology disclosed herein unless otherwise specified.

[0020] <Carrier structure> FIG. 1 is a diagram schematically illustrating the structure of a carrier structure 10 disclosed herein. FIG. 2 is an enlarged view schematically illustrating the structure of the carrier structure 10 disclosed herein. FIG. 3 is a longitudinal cross-sectional view schematically illustrating the structure of the carrier structure 10 disclosed herein. In FIGS. 1 and 2, a wire mesh member 40 is indicated by a dashed line. In FIG. 3, hatching of the resin matrix 20 is omitted. In FIGS. 1 and 3, porous particles 30 are omitted. As shown in FIGS. 1 and 2, the carrier structure 10 disclosed herein includes a resin matrix 20, porous particles 30, and a wire mesh member 40. The carrier structure 10 disclosed herein is a carrier structure capable of supporting active substances such as various adsorbents and catalysts. The active substance is preferably a CO2 adsorbent that chemically adsorbs carbon dioxide (CO2). Specific examples of CO2 adsorbents include amine compounds having primary to tertiary amino groups, such as aminoorganosilanes, aliphatic amines, and aliphatic polyamines. The carrier structure 10 disclosed herein can be suitably used as a CO2 adsorption material by supporting a CO2 adsorbent such as an amine compound capable of absorbing CO2.

[0021] The support structure 10 can be formed into a sheet shape, a rectangular parallelepiped shape, a cube shape, a prism shape, a cylinder shape, a sphere shape, or the like. Although not particularly limited, the support structure 10 is preferably a support sheet formed into a sheet shape. When the support structure 10 is in a sheet shape, it is preferable that the thickness is, for example, 0.02 mm or more and 15 mm or less.

[0022] The resin matrix 20 included in the support structure 10 disclosed herein has a porous structure having pores 22, as shown in FIG. 2. The resin matrix 20 can function as a skeleton in the support structure 10. The resin matrix 20 can be formed, for example, by bonding resin crystal particles. The pores 22 can be interconnected pores. A plurality of porous particles 30 are disposed in the pores 22. Each porous particle 30 has a plurality of pores 32. It is preferable that most of the porous particles 30 are present in the pores 22 while being separated from the resin matrix 20. The support structure 10 includes a wire mesh member 40. The presence of the resin matrix 20, the porous particles 30, and the wire mesh member 40 in the support structure 10 can be confirmed, for example, by observing the surface or cross section of the support structure 10 with a scanning electron microscope (SEM).

[0023] Conventionally, the following method has been used to separate and recover harmful substances using an active substance and a carrier supporting the active substance. First, gas (air) is passed through the carrier in the thickness direction, and harmful substances contained in the gas (air) are adsorbed onto the active substance supported on the carrier and separated. Then, heated gas (air) (e.g., to about 100°C) is passed through the carrier in the thickness direction to heat the active substance, and the harmful substances adsorbed onto the active substance are recovered.

[0024] In the carrier structure 10 disclosed herein, porous particles 30 are disposed in the pores 22 of the resin matrix 20. This allows a larger amount of active substance to be supported than conventional carrier structures. Therefore, the amount of active substance (porous particles 30) supported per volume increases, improving the recovery and separation performance of harmful components. While not intending to limit the technology disclosed herein, the reason for this effect is presumed to be as follows. In the carrier structure 10, the porous particles 30 are disposed in the pores 22 of the resin matrix 20, allowing the porous particles 30 to exist in a state where the pores 32 of the porous particles 30 are not crushed or filled with resin. Furthermore, since the resin matrix 20 also has suitable pores 22, the active substance can be supported in these pores 22 as well, allowing the porous particles 30 to be disposed not only on the surface of the carrier structure 10 but also inside the carrier structure 10. Furthermore, the pores 22 of the resin matrix 20 facilitate the flow of gas (air). According to the carrier structure 10 having such a configuration, when gas (air) is circulated in the thickness direction of the carrier structure 10, the gas (air) reaches the porous particles 30 arranged inside the carrier structure 10, thereby improving the efficiency of separation and recovery of harmful components.

[0025] The carrier structure 10 disclosed herein further includes a sheet-like wire mesh member 40. As shown in FIG. 3 , the wire mesh member 40 is disposed so that at least a portion of the wire mesh member 40 is embedded in the resin matrix 20. This improves the thermal conductivity of the carrier structure 10. More specifically, when heated gas (air) is circulated through the carrier structure 10 in the thickness direction, the wire mesh member 40 retains the heat of the gas (air). Since heat is conducted throughout the carrier structure 10 via the wire mesh member 40, the temperature of the entire carrier structure 10 can be rapidly increased to the interior. This improves the recovery efficiency of harmful substances adsorbed on the porous particles 30. Furthermore, the use of the wire mesh member 40 prevents the flow path of the gas (air) passing through the carrier structure 10 from being obstructed during use, thereby preventing a reduction in the contact area between the active substance of the carrier structure 10 and the gas (air). This allows the active substance disposed inside the carrier structure 10 to contact harmful components more efficiently, improving the separation and recovery efficiency of the harmful components.

[0026] Although not particularly limited, the porosity of the carrier structure 10 disclosed herein based on the Archimedes method is preferably 65% ​​or more, more preferably 70% or more, and even more preferably 75% or more. This allows the components to be recovered (e.g., CO2) to be favorably contacted with the active substance (e.g., an amine compound). On the other hand, since air has low thermal conductivity, the lower the porosity of the carrier structure 10, the more improved the thermal conductivity of the carrier structure 10. For this reason, the porosity of the carrier structure 10 based on the Archimedes method is preferably, for example, 90% or less, and may be 86% or less. The "porosity of the carrier structure" can be calculated based on the Archimedes method. More specifically, the dry weight W of the carrier structure Air , underwater weight W Aq , water weight W a+w The porosity (P) can be calculated based on the following formula (1). Porosity P (%) = (W a+w -W Air ) / (W a+w -W Aq )×100 (1)

[0027] Although not particularly limited, the water absorption rate of the carrier structure 10 disclosed herein based on Archimedes' method is preferably 140% or more, more preferably 145% or more, even more preferably 147% or more, and may be 190% or more, or may be 200% or more. Typically, the higher the water absorption rate of the carrier structure 10, the higher the water absorption rate of the carrier structure 10. This increases the amount of active substance carried per volume, and improves the separation and recovery performance of harmful components. From this perspective, a higher water absorption rate is preferable, and there is no particular upper limit. For example, the water absorption rate of the carrier structure 10 based on Archimedes' method may be 400% or less, 370% or less, or 350% or less. The "water absorption rate of the carrier structure" can be calculated based on Archimedes' method. More specifically, the dry weight W of the carrier structure Air , underwater weight W Aq , water weight W a+w The water absorption (Aw) can be calculated based on the following formula (2). Water absorption rate Aw(%)=(W a+w -W Air ) / W Air ×100 (2)

[0028] Although not particularly limited, it is preferable that the support structure 10 has high hot water resistance. The hot water resistance of the support structure 10 is preferably 120°C or higher, more preferably 140°C or higher, and may be 150°C or higher, or may be 160°C or higher. This allows the support structure 10 disclosed herein to be suitably used in environments exceeding 100°C or in relatively humid environments. The hot water resistance of the support structure 10 is preferably 250°C or lower, and may be 200°C or lower, for example. The "hot water resistance of the support structure" can be evaluated by immersing the support structure in hot water in an autoclave, drying it, and measuring its strength using a conventionally known tensile test.

[0029] The resin matrix 20 is a porous body containing a plurality of pores 22. The average pore diameter A of the resin matrix 20 is preferably 0.4 μm or more, more preferably 0.5 μm or more, even more preferably 0.6 μm or more, and may be 1 μm or more. This allows the porous particles 30 to be favorably supported on the support structure 10. If the average pore diameter A of the resin matrix 20 is too large, the porous particles 30 may be detached from the resin matrix 20. From this perspective, the average pore diameter A of the resin matrix 20 is, for example, preferably 7 μm or less, more preferably 5 μm or less, and even more preferably 3 μm or less. The "average pore diameter of the resin matrix" can be determined by mercury intrusion porosimetry using a commercially available mercury porosimeter.

[0030] The resin matrix 20 contains a resin and can be formed by bonding crystalline particles of the resin. Although not particularly limited, the resin matrix 20 preferably contains a resin having a glass transition temperature (Tg) of 70°C or higher. This improves the heat resistance of the carrier structure 10. The glass transition temperature of the resin contained in the resin matrix 20 is preferably 70°C or higher, and may be 100°C or higher, or may be 120°C or higher. The glass transition temperature of the resin contained in the resin matrix 20 may be, for example, 260°C or lower, or 250°C or lower. The "glass transition temperature of the resin" can be measured by conventionally known methods such as differential scanning calorimetry (DSC) measurement or dynamic viscoelasticity measurement (DMA).

[0031] Furthermore, although not particularly limited, it is preferable that the resin matrix 20 contains a resin having high hot water resistance. This can improve the hot water resistance of the carrier structure 10. The hot water resistance of the resin contained in the resin matrix 20 is preferably 120°C or higher, more preferably 140°C or higher, and may be 150°C or higher, or may be 160°C or higher. The hot water resistance of the resin contained in the resin matrix 20 is, for example, preferably 300°C or lower, may be 250°C or lower, or may be 200°C or lower. Note that the "hot water resistance of the resin" in this specification can be determined by measuring the deflection temperature under load in accordance with JIS K 7191-2:2015.

[0032] The resin content is not particularly limited, but is preferably 2% by mass to 20% by mass, more preferably 3% by mass to 15% by mass, and even more preferably 5% by mass to 10% by mass, when the total mass of the carrier structure 10 is taken as 100% by mass, which can suitably improve the water absorption of the carrier structure 10.

[0033] Although not particularly limited, resin components contained in the resin matrix 20 include acrylic resins, cellulose resins, and resins classified as super engineering plastics. The resin matrix 20 may contain any one of the above resins alone or a combination of two or more of them.

[0034] The porous particles 30 may be any inorganic porous material capable of supporting an active substance such as an adsorbent or a catalyst. For example, a porous material with a relatively large specific surface area is preferred. For example, oxides of metalloid elements and metal elements or solid solutions thereof are preferably used as the porous particles 30. Specific examples include silica particles, zeolite particles, metal organic framework (MOF) particles, alumina particles, ceria particles, zirconia particles, and titania particles. Any one or more of these may be used without any particular limitation. It is particularly preferred that the porous particles 30 include at least one selected from silica particles, zeolite particles, and metal organic framework (MOF) particles.

[0035] The porous particle 30 has a plurality of pores 32. The porous particle 30 may be, for example, a mesoporous material having mesopores. "Mesopores" refers to pores with a pore diameter ranging from 2 nm to less than 50 nm, based on the IUPAC classification. The average pore diameter B of the porous particle 30 is, for example, preferably 2 nm or more, more preferably 10 nm or more, and even more preferably 12 nm or more. This allows the active substance to be efficiently introduced into the pores 32 when it is supported. The average pore diameter B of the porous particle 30 is, for example, preferably 100 nm or less, more preferably 70 nm or less, even more preferably 50 nm or less, and particularly preferably 40 nm or less. This allows the specific surface area of ​​the porous particle 30 to be efficiently increased, thereby improving the adsorption efficiency of harmful components. The "average pore diameter of the porous particle" can be measured by measuring the pore size distribution of the support structure using a commercially available pore size distribution analyzer and a gas adsorption method based on the BJH method.

[0036] The average particle size of the porous particles 30 is not particularly limited. If the average particle size of the porous particles 30 is too small, they tend to be difficult to disperse in the support structure 10. From this perspective, the average particle size of the porous particles 30 is, for example, 100 nm or more, and may be 1 μm or more, 3 μm or more, or 5 μm or more. On the other hand, as described above, the porous particles 30 contain many voids (pores 32). Therefore, if the average particle size is too large, the porous particles 30 may be easily broken due to collisions between the porous particles. From this perspective, the average particle size of the porous particles 30 is, for example, 100 μm or less, 50 μm or less, or 15 μm or less. In this specification, the "average particle size of the porous particles" refers to the arithmetic mean value of the circle-equivalent diameter measured based on observation with an optical microscope. Here, the circle-equivalent diameter refers to the diameter of a circle having the same area as the area of ​​an ellipse formed by the major axis, which is the longest diameter of a porous particle observed in a microscope image, and the minor axis, which is the longest diameter of a line intersecting the major axis at a right angle. In this specification, the average particle size of porous particles refers to the arithmetic mean value of the circle-equivalent diameters of 200 randomly selected porous particles.

[0037] From the viewpoint of increasing the contact area between the active substance and harmful components, it is preferable that the specific surface area of ​​the porous particles 30 is large. Although not particularly limited, the specific surface area of ​​the porous particles 30 measured by the BET method (BET specific surface area) is, for example, 70 m 2 / g or more 500m 2 / g or less, and 150m 2 / g or more 400m 2 / g or less is more preferable. In this specification, the "BET specific surface area of ​​the porous particles" can be measured by a nitrogen adsorption method using a commercially available specific surface area measuring device.

[0038] Furthermore, from the viewpoint of increasing the amount of active substance carried, it is preferable that the oil absorption of the porous particles 30 be high. Although not particularly limited, the oil absorption of the porous particles 30 is preferably, for example, 100 ml / 100 g or more and 400 ml / 100 g or less, and more preferably 130 ml / 100 g or more and 380 ml / 100 g or less. The "oil absorption of the porous particles" can be measured using a general absorption measurement device and DBP (dibutyl phthalate) as the reagent liquid in accordance with JIS K6217-4:2008.

[0039] The content of the porous particles 30 is not particularly limited, but is preferably 5% by mass to 35% by mass, more preferably 8% by mass to 30% by mass, even more preferably 10% by mass to 25% by mass, and may be 13% by mass to 20% by mass, when the total mass of the carrier structure 10 is taken as 100% by mass. This makes it possible to suitably improve the efficiency of adsorption of harmful components by the porous particles 30.

[0040] Although not particularly limited, in the support structure 10, the ratio (A / B) of the average pore diameter A of the resin matrix 20 to the average pore diameter B of the porous particles 30 is preferably 20 or more and 200 or less, more preferably 24 or more and 165 or less, and may be 50 or more and 120 or less. That is, the support structure 10 preferably has both relatively small pores (e.g., mesopores of less than 50 nm) derived from the porous particles 30 and relatively large pores (e.g., pores of 0.5 μm or more) derived from the pores 22 of the resin matrix 20. This can suitably improve the adsorption efficiency of harmful components by the support structure 10.

[0041] Although not particularly limited, in the carrier structure 10, the mass ratio of the porous particles 30 to the resin constituting the resin matrix 20 is, for example, preferably 20:80 to 70:30, more preferably 30:70 to 65:35, and even more preferably 40:60 to 65:35. This allows the balance between the average pore diameter A derived from the resin matrix 20 and the average pore diameter B derived from the porous particles 30 to be suitably adjusted, thereby improving the adsorption efficiency of harmful components by the carrier structure 10.

[0042] The wire mesh member 40 is a sheet-like member having a plurality of through holes. The wire mesh member 40 is disposed in a state where at least a portion of the wire mesh member 40 is embedded in the resin matrix 20. The wire mesh member 40 may preferably have a mesh structure formed by interweaving metal wires. However, this is not limited thereto. For example, the wire mesh member 40 may be made of a punched metal. The metal used for the wire mesh member 40 is not particularly limited, but it is preferable to use a metal (metal wire) with good thermal conductivity. For example, stainless steel (SUS), iron-based, copper-based, nickel-based, titanium-based, aluminum-based, molybdenum-based, or tungsten-based alloy material or pure metal material is preferably used. The weave of the wire mesh member 40 is not particularly limited, and for example, a wire mesh member constructed using a known weave such as plain weave, twill weave, Japanese tatami weave, or Japanese tatami twill weave can be used. The thickness of the wire mesh member 40 is not particularly limited and may be, for example, 0.02 mm or more and 15 mm or less.

[0043] Although not limited thereto, when a mesh structure is used as the wire mesh member 40, the wire diameter of the wire mesh member 40 is preferably 0.016 mm or more, more preferably 0.02 mm or more, and even more preferably 0.03 mm or more. This makes it possible to suitably improve the thermal conductivity of the carrier structure 10. On the other hand, from the viewpoint of ensuring a sufficient gas (air) flow path and from the viewpoint of more efficient contact between the active substance arranged inside the carrier structure 10 and harmful components, the wire diameter of the wire mesh member 40 is preferably 2 mm or less, more preferably 1.5 mm or less, and even more preferably 1 mm or less. The "wire diameter of the wire mesh member" can be measured using a vernier caliper or the like.

[0044] Although not limited thereto, when a mesh structure is used as the wire mesh member 40, the mesh size of the wire mesh member 40 is preferably 0.01 mm or more, more preferably 0.015 mm or more, and even more preferably 0.02 mm or more. This prevents obstruction of the gas (air) flow path through the carrier structure 10, allowing for more efficient contact between the active substance disposed inside the carrier structure 10 and harmful components. On the other hand, from the viewpoint of suitably improving the thermal conductivity of the carrier structure 10, the mesh size of the wire mesh member 40 is preferably 20 mm or less, more preferably 15 mm or less, and even more preferably 10 mm or less. The "opening size of the wire mesh member" is determined by first counting the number of holes within one inch (25.4 mm) of the wire mesh member. The obtained mesh size and wire diameter (mm) can then be calculated using the formula "opening size of the wire mesh member (mm) = (25.4 / mesh number) - wire diameter (mm)."

[0045] The void ratio of the wire mesh member 40 is preferably 30% or more, more preferably 40% or more, and even more preferably 50% or more. This suppresses obstruction of the flow path of the gas (air) passing through the carrier structure 10, and enables more efficient contact between the active substance arranged inside the carrier structure 10 and harmful components. On the other hand, from the viewpoint of suitably improving the thermal conductivity of the carrier structure 10, the void ratio of the wire mesh member 40 is preferably 90% or less, more preferably 85% or less, and even more preferably 80% or less. Note that, when a wire mesh member having a mesh structure is used as the wire mesh member, the void ratio of the wire mesh member (%) is calculated by the following formula: 2 / (opening (mm) + wire diameter (mm)) 2 × 100". When a punched metal is used as the wire mesh member, the open area ratio (%) can be calculated using a formula according to the shape, diameter, pitch, arrangement, etc. of the holes, and the obtained open area ratio (%) can be used as the "void ratio of the wire mesh member". Note that such formulas are well known to those skilled in the art, and therefore will not be described here.

[0046] As shown in Fig. 3, in this embodiment, one (one) wire mesh member 40 is provided for one carrier structure 10. However, the number of wire mesh members provided for one carrier structure is not limited to this. A plurality (two or more) wire mesh members may be provided depending on the shape (thickness) of the carrier structure, the desired thermal conductivity of the carrier structure, etc.

[0047] 3, in this embodiment, the wire mesh member 40 is disposed at approximately the center in the thickness direction of the carrier structure 10. However, without being limited to this, the wire mesh member 40 may be disposed biased toward the upper or lower side in the thickness direction of the carrier structure 10. Furthermore, the wire mesh member 40 may be disposed in a state where a part of it is exposed from the surface of the resin matrix 20 (the upper or lower side in the thickness direction).

[0048] 1, in this embodiment, the wire mesh member 40 is disposed over the entire area of ​​the resin matrix 20 in a plan view. However, this is not limited thereto, and the wire mesh member 40 may be disposed in a partial area of ​​the resin matrix 20 in a plan view. Furthermore, the wire mesh member 40 may be disposed so as to protrude (be exposed) from the ends of the resin matrix 20 in the width direction and / or the length direction. Although not limited thereto, from the viewpoint of suitably improving the thermal conductivity of the carrier structure 10, when the area of ​​the resin matrix 20 in a plan view is taken as 100%, the wire mesh member 40 is preferably disposed over an area of ​​20% or more, and more preferably over an area of ​​30% or more.

[0049] Although not limited thereto, in some preferred embodiments, the wire mesh member 40 may be provided with a heating element that generates heat when electricity is applied. For example, the wire mesh member 40 is connected to an electrode (not shown) and an electric current is passed through the wire mesh member 40. This causes the wire mesh member 40 to generate heat, and the temperature of the carrier structure 10 can be raised from the inside. As the heating element, for example, an iron-chromium-aluminum alloy (kanthal wire), an alloy mainly composed of nickel and chromium (nichrome wire), molybdenum, tungsten, platinum, tantalum, tungsten, silicon carbide, molybdenum silicide, lanthanum chromite, carbon, molybdenum disilicide, etc. can be used.

[0050] Although not limited thereto, in some preferred embodiments, the wire mesh member 40 may be provided as a heat exchange member. For example, the wire mesh member 40 is connected to a heating means (not shown) provided outside the carrier structure 10. This allows the wire mesh member 40 to be heated via the heating means. This allows the temperature of the carrier structure 10 to be raised from the inside. As the heat exchange member, for example, a shell-and-tube heat exchanger, a plate heat exchanger, a fin-tube heat exchanger, a coil heat exchanger, a spiral heat exchanger, a jacket heat exchanger, a non-metallic heat exchanger, a spiral heat exchanger, a direct contact heat exchanger, an air-cooled heat exchanger, a water-cooled heat exchanger, a immersion heat exchanger, etc. may be used.

[0051] Although not particularly limited, the support structure 10 may further include thermally conductive fibers. This can more suitably improve the thermal conductivity performance of the support structure 10. Although not particularly limited, examples of the thermally conductive fibers that can be used include carbon fibers, metal fibers, and the like. The distribution of the thermally conductive fibers in the support structure 10 is not particularly limited, but from the viewpoint of transferring heat throughout the support structure 10, it is preferable that the thermally conductive fibers are uniformly dispersed in the resin matrix 20. The length of the thermally conductive fibers is not particularly limited, but may be, for example, 10 μm or more and 0.5 mm or less. When the support structure 10 includes thermally conductive fibers, the proportion of the thermally conductive fibers in the entire support structure 10 is not particularly limited because it can be adjusted depending on the thermally conductive fibers used and the temperature at which the support structure 10 is used, and may be, for example, 5% by mass or more and 30% by mass or less when the total mass of the support structure 10 is 100% by mass.

[0052] <Method of manufacturing the carrier structure> Next, an example of a method for manufacturing the carrier structure 10 disclosed herein will be described. The carrier structure 10 disclosed herein can include a preparation step of preparing a carrier structure forming slurry, a molding step of producing a molded body from the carrier structure forming slurry, an immersion step of immersing the molded body in an aqueous solvent, and a drying step of drying the molded body after the immersion step. Note that the carrier structure 10 disclosed herein is not limited to those manufactured by the following manufacturing method.

[0053] In the preparation step, a slurry-like composition (slurry for forming a carrier structure) containing at least the porous particles 30, a resin, and an organic solvent is prepared. In this specification, the term "paste" is used to encompass forms called "slurry" and "ink." As an example, in the preparation step, the porous particles 30 are introduced into an organic solvent and stirred. This disperses the porous particles 30 in the organic solvent. Next, the resin is introduced into the organic solvent in which the porous particles 30 are dispersed and stirred. This dissolves the resin in the organic solvent. Although not particularly limited, in the preparation step, the porous particles 30 and the resin may be introduced into the organic solvent and stirred while heated to 40°C to 60°C.

[0054] The porous particles 30 may be suitably selected from those described above. Among these, silica particles are preferred. Resins that dissolve in organic solvents and precipitate in a network structure during the immersion process described below are suitable for use. Among these, PEI (polyetherimide), PES (polyethersulfone), PPSU (polyphenylsulfone), PVDF (polyvinylidene fluoride), and PSU (polysulfone) are preferred. The porous particles 30 and resin are preferably mixed in a mass ratio of, for example, 20:80 to 70:30, more preferably 30:70 to 65:35, and even more preferably 55:45 to 65:35.

[0055] The organic solvent is not particularly limited as long as it can dissolve the resin. Examples of the organic solvent include amides such as diethylformamide, dimethylacetamide, dimethylformamide, N-methylpyrrolidone, and dimethylimidazolidinone; alkyl ketones such as dimethyl sulfoxide, acetone, and methyl ethyl ketone; ethers such as tetrahydrofuran, dioxane, and diglyme; and glycol ethers such as ethylene glycol and diethylene glycol. These may be used alone or in combination of two or more. The mass ratio of the organic solvent contained in the support structure forming slurry is not particularly limited. The content of the organic solvent in the support structure forming slurry is preferably, for example, 30% by mass to 80% by mass. This allows a molded body to be suitably produced in the molding step.

[0056] Furthermore, conventionally known additives may be added to the support structure forming slurry as long as they do not significantly impair the effects of the technology disclosed herein. Examples of such additives include dispersants, plasticizers, antifoaming agents, thickeners, etc. For example, glycerin and nonionic surfactants (e.g., Pluronic F-127 (BASF)) can be preferably used as additives. The content of the additives in the support structure forming slurry is, for example, preferably 30% by mass or less, and may be 20% by mass or less, or may be 10% by mass or less.

[0057] In the molding step, a molded body is molded using the carrier structure forming slurry prepared above and the wire mesh member 40. The wire mesh member 40 described above can be suitably used as the wire mesh member 40. For example, a sheet-like molded body can be produced by supplying the carrier structure forming slurry to a predetermined thickness on a glass substrate using a squeegee. Alternatively, a molded body of a desired shape can be produced by using a doctor blade method, extruding the carrier structure forming slurry into a predetermined shape, printing it on a metal plate or metal mesh, or dip coating it on a core material.

[0058] For example, when the molding process is performed using a squeegee, it can be performed in the following manner. First, the wire mesh member 40 is placed on an aluminum substrate. At this time, the wire mesh member 40 is placed so as to leave a gap between the aluminum substrate and the wire mesh member 40. This gap can be adjusted appropriately according to the thickness of the carrier structure 10 to be manufactured. Next, a carrier structure forming slurry is supplied onto the wire mesh member 40. Then, by squeezing the supplied carrier structure forming slurry using the squeegee, a portion of the carrier structure forming slurry passes through the mesh of the wire mesh member 40 and moves between the wire mesh member 40 and the glass substrate. As a result, at least a portion of the wire mesh member 40 becomes embedded in the carrier structure forming slurry. At this time, the position of the wire mesh member 40 placed on the carrier structure 10 after manufacture can be adjusted by adjusting the squeezing conditions of the squeegee (e.g., the distance between the squeegee and the surface of the wire mesh member 40, the force applied to the squeegee, etc.).

[0059] In the immersion step, the molded body prepared in the molding step is immersed in an aqueous solvent (e.g., water). As a result, the organic solvent contained in the molded body is replaced with the aqueous solvent, and the resin is precipitated. The areas where the organic solvent contained in the molded body has been replaced with the aqueous solvent become pores 22, and when the resin precipitates, the resin matrix 20 as described above is suitably formed. Since the porous particles 30 are dispersed in the organic solvent, the resin matrix 20 is formed so as to envelop the porous particles 30, and the porous particles 30 are arranged in the pores 22 of the resin matrix 20.

[0060] The aqueous solvent used in the immersion step is not particularly limited. The aqueous solvent may be, for example, water, a mixed solution of water and alcohol, or water to which a surfactant may be added. Preferred aqueous solvents include ion-exchanged water (deionized water), pure water, ultrapure water, and distilled water.

[0061] In the drying step, the compact after the immersion step is dried to remove the aqueous solvent from the compact. This allows the carrier structure 10 having the structure described above to be suitably produced. The drying means used in the drying step is not particularly limited, and for example, a hot air dryer, a low-humidity air dryer, a vacuum dryer, various infrared dryers, an electromagnetic induction dryer, a microwave dryer, dry air, etc., or drying promotion means such as air blowing, reduced pressure, and heating can be used alone or in combination. The drying temperature in the drying step (such as the set temperature of the dryer) can be appropriately selected depending on the type and amount of solvent in the mixture, and can be set, for example, to 40°C to 120°C, preferably 60°C to 100°C. The drying time can also be appropriately selected depending on the type and amount of aqueous solvent, and is not particularly limited.

[0062] In this manner, it is possible to suitably prepare a carrier structure 10 that achieves both improved performance in separating and recovering harmful components and improved heat conduction performance. Such a carrier structure 10 can be suitably used as a carrier for supporting an active substance, in particular, a carrier for supporting an amine liquid that absorbs CO2.

[0063] <Test example> Test examples relating to the technology disclosed herein will be described below, but it is not intended that the technology disclosed herein be limited to such test examples.

[0064] <Preparation of carrier structure> (Example 1) First, 135 g of porous silica particles (SiO2, average particle diameter 9 μm) as porous particles, 80 g of polyetherimide (PEI) as resin, 330 g of dimethyl sulfoxide (DMSO) as organic solvent, and 35 g of glycerin as additive were prepared. Thus, a slurry for forming a carrier structure of Example 1 was prepared. Next, a metal mesh was arranged so that the entire surface of the aluminum substrate and the metal mesh were in contact with each other. Then, the slurry for forming a carrier structure of Example 1 was applied to the metal mesh to a thickness of 2 mm, and then, using a squeegee, the slurry for forming a carrier structure was squeezed onto the aluminum substrate and the metal mesh at a speed of 200 mm / min. This resulted in a sheet-like molded body. The sheet-like molded body was immersed in water for 24 hours. Then, the molded body after immersion in water was dried at 80°C for 5 hours to obtain a sheet-like carrier structure (carrier sheet) of Example 1. As the wire mesh member of Example 1, a plain woven metal mesh having the following configuration was used. Material: SUS304 Number of meshes: 60 Wire diameter: 0.14 mm Aperture: 0.283 mm Space ratio: 44.4%

[0065] (Example 2) In Example 2, the same slurry for forming a carrier structure as in Example 1 was prepared, and the metal mesh was not placed on the glass substrate, and the slurry for forming a carrier structure was applied to a thickness of 2 mm on the glass substrate. Except for this, the same procedure was followed as in Example 1. In this way, a carrier structure of Example 2 formed in a sheet shape was obtained.

[0066] <Measurement of thermal conductivity> The thermal conductivity (mW / m K) in the thickness direction of the support structure of each example was measured using the guarded hot plate method (GHP method). The measurement equipment and conditions were as follows. The results are shown in Table 1. Measurement equipment: NETZSCH GHP456s (main heating plate size 8cm square) Sample size: 200 x 150 mm Measurement temperature: 20℃ (heating plate 35℃, cooling plate 15℃) Measurement atmosphere: Nitrogen gas flow Ambient pressure: Atmospheric pressure

[0067] <Observation of carrier structure> A scanning electron microscope (SEM) was used to observe the cross section of the support structure of Example 1. Figure 4 shows an SEM photograph of Example 1 (magnification: 200x), and Figure 5 shows an SEM photograph of Example 1 (magnification: 50x).

[0068] [Table 1]

[0069] As shown in Table 1, Example 1, which included a wire mesh member, had a higher thermal conductivity than Example 2, which did not include a wire mesh member. This is thought to be due to the structure in which the sheet-like wire mesh member is arranged with at least a portion embedded in the resin matrix.

[0070] While specific examples of the technology disclosed herein have been described in detail above, these are merely examples and do not limit the scope of the claims. The technology described in the claims includes various modifications and alterations of the specific examples exemplified above.

[0071] As described above, specific aspects of the technology disclosed herein include those described in the following items.

[0072] [Item 1] A carrier structure for carrying an active substance, comprising: a porous resin matrix; Porous particles having a plurality of mesopores; A sheet-like wire mesh member; It is equipped with the sheet-like wire mesh member is disposed in a state where at least a portion of the wire mesh member is embedded in the resin matrix, the porous particles are disposed within the pores of the resin matrix; Carrier structure.

[0073] [Item 2] Item 2. The carrier structure according to item 1, wherein the porosity of the wire mesh member is 50% or more and 80% or less.

[0074] [Item 3] The resin matrix has an average pore diameter A of 0.5 μm or more and 5 μm or less, 3. The carrier structure according to item 1 or 2, wherein the porous particles have an average pore diameter B of 10 nm or more and 40 nm or less.

[0075] [Item 4] 4. The support structure according to any one of items 1 to 3, wherein the ratio (A / B) of the average pore diameter A of the resin matrix to the average pore diameter B of the porous particles is 20 or more and 200 or less.

[0076] [Item 5] 5. The support structure according to any one of items 1 to 4, having a porosity based on Archimedes' method of 75% or more and 90% or less.

[0077] [Item 6] 6. The carrier structure according to any one of items 1 to 5, comprising the wire mesh member having a mesh structure.

[0078] [Item 7] 7. The carrier structure according to item 6, wherein the opening of the wire mesh member is 0.02 mm or more and 15 mm or less.

[0079] [Item 8] 8. The carrier structure according to any one of items 1 to 7, wherein the wire mesh member comprises a heating element that generates heat when electricity is applied thereto.

[0080] [Item 9] 9. The carrier structure according to any one of items 1 to 8, wherein the wire mesh member comprises a heat exchange member. [Explanation of symbols]

[0081] 10. Carrier structure 20 Resin Matrix 22 pores 30 porous particles 32 pores 40 Wire mesh member

Claims

1. A carrier structure for carrying an active substance, comprising: a porous resin matrix; Porous particles having a plurality of mesopores; A sheet-like wire mesh member; It is equipped with the sheet-like wire mesh member is disposed in a state where at least a portion of the wire mesh member is embedded in the resin matrix, the porous particles are disposed within the pores of the resin matrix; Carrier structure.

2. 2. The carrier structure according to claim 1, wherein the porosity of the wire mesh member is 50% or more and 80% or less.

3. The average pore diameter A of the resin matrix is ​​0.5 μm or more and 5 μm or less, 3. The carrier structure according to claim 1, wherein the average pore diameter B of the porous particles is 10 nm or more and 40 nm or less.

4. 3. The carrier structure according to claim 1, wherein a ratio (A / B) of an average pore diameter A of the resin matrix to an average pore diameter B of the porous particles is 20 or more and 200 or less.

5. 3. The support structure according to claim 1, wherein the porosity based on Archimedes' method is 75% or more and 90% or less.

6. The carrier structure according to claim 1 or 2, comprising the wire mesh member having a mesh structure.

7. 7. The carrier structure according to claim 6, wherein the mesh size of the wire mesh member is 0.02 mm or more and 15 mm or less.

8. The carrier structure according to claim 1 or 2, wherein the wire mesh member comprises a heating element that generates heat when electricity is applied thereto.

9. The carrier structure according to claim 1 or 2, wherein the wire mesh member comprises a heat exchange member.

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