Connector packaging substrate

Abstract

To solve a problem in which lands for connecting reinforcing terminals are located on both ends of a connector, such that they cannot be connected by simply applying solder, and this requires heating all three points at the same time, which makes recycling difficult.SOLUTION: A connector packaging substrate is capable of connecting a connector having at least two reinforcing terminals for fixing a member and a connection terminal capable of performing electrical communication, and the connector packaging substrate includes a first land portion and a second land portion that can be connected to the two reinforcing terminals arranged at positions corresponding to both ends of the connector but do not perform electrical communication, a third land portion that can be connected to the connection terminal of the connector, and a fourth land portion for connecting the first land portion and the second land portion.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present invention relates to a connector mounting board. [Background technology]

[0002] The number of countries and regions around the world announcing carbon neutrality (CN) targets is rapidly increasing, accounting for 90% of the world's total GDP. Excessive reliance on increasingly unstable fossil fuels poses direct national-level risks in both security and economic terms, further accelerating the investment race toward achieving green transformation (GX). GX refers to a major shift in industrial and energy policy, shifting from a fossil fuel-centered industrial structure and socio-economy to one centered on clean energy sources with less impact on the natural environment, such as solar and hydrogen. Europe is leading the way in reducing greenhouse gases through GX and in developing rules and initiatives toward CN. For example, Japan is advancing industry-specific GX initiatives to balance CO2 emissions reduction with economic growth and development. In order to comply with European and American regulations, the country aims to reduce CO2 emissions by 90% compared to 2000 levels by 2050. Thus, the world is expected to simultaneously achieve decarbonization and economic growth, and even achieve CN.

[0003] To meet GX standards, circuit board design is required to be even more energy-efficient than before and to build sustainable systems. For example, by making components on the circuit board easily removable, it is possible to create a system that allows reuse and recycling, and to build a structure where components can be recycled and used.

[0004] Regarding this board design, optical pickup devices and the like may use a connector-mounted board in which a surface-mounted connector is mounted on a wiring board such as a printed circuit board or a flexible board. This surface-mounted connector has connection terminals that are electrically connected to the lands on the wiring board, as well as reinforcing terminals that ensure the bonding strength between the connector and the wiring board when the connector is mounted on the wiring board.

[0005] The connector mounting board is a wiring board on which a connector is mounted by soldering the connection terminals and reinforcing terminals to the land portions of the wiring board.

[0006] Prior Art Document 1 describes a case in which a jumper connection is used to electrically connect non-adjacent wires on a wiring board or non-adjacent connection terminals of a connector. In this case, a step of mounting the jumper on the land portion of the wiring board is required, which increases the number of steps, resulting in a decrease in productivity and being disadvantageous for increasing the density of wiring patterns, and therefore an improvement is desired. As an improvement, a first land portion, a second land portion disposed with a gap between the first land portion and the second land portion, and a wiring pattern extending into the gap are provided on the wiring board, and the connection terminal and reinforcing terminal straddle the wiring pattern to electrically connect the first land portion and the second land portion. [Prior art documents] [Patent documents]

[0007] [Patent Document 1] Japanese Patent Application Laid-Open No. 2007-227743 Summary of the Invention [Problem to be solved by the invention]

[0008] Special tools are required to remove multi-pin surface-mounted components from wiring boards. When removing them by hand soldering, all of the individual lands must be heated at the same time, which is difficult.

[0009] For example, in the case of a connector with a lock (reinforcing terminal), there are three lands: the land where the signal line pin is located, and one land and the other land of the reinforcing terminal. In conventional work, it is possible to connect multiple pins to the land where the signal line pin is located by applying solder. However, the lands to which the reinforcing terminal is connected are located on both ends of the connector, so they cannot be connected by applying solder. This requires heating all three points at the same time, making recycling difficult. [Means for solving the problem]

[0010] The present invention provides a connector mounting board to which a connector having at least two reinforcing terminals for fixing a member and a connection terminal for performing electrical communication can be connected, The connector mounting board is characterized by having a first land portion and a second land portion that can be connected to the two reinforcing terminals arranged at positions corresponding to both ends of the connector but do not electrically communicate with each other, a third land portion that can be connected to the connection terminal of the connector, and a fourth land portion for connecting the first land portion and the second land portion. [Effects of the Invention]

[0011] According to the present invention, it is possible to easily recycle lands to which reinforcing terminals arranged on both ends of a connector are connected. [Brief explanation of the drawings]

[0012] [Figure 1] Diagram showing the land area of ​​the locking connector [Figure 2] A diagram showing cream solder placed on the non-electrical land portion to which the reinforcing terminal of a locking connector is connected. [Figure 3] A diagram of a connector with a lock mounted on the land area [Figure 4] A diagram showing a case where there is one land part that does not conduct electrical communication and to which the reinforcing terminal of a locking connector is connected. [Figure 5] A diagram showing cream solder placed on the non-electrical land portion to which the reinforcing terminal of a locking connector is connected. [Figure 6] A diagram of a connector with a lock mounted on the land area [Figure 7] A diagram showing the case where the connecting terminal of a locking connector and the land part of the reinforcing terminal are placed close to each other. [Figure 8] A diagram showing cream solder placed on the non-electrical land portion to which the reinforcing terminal of a locking connector is connected. [Figure 9]A diagram of a connector with a lock mounted on the land area DETAILED DESCRIPTION OF THE INVENTION

[0013] Each embodiment of the present invention will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention as claimed, and not all of the combinations of features described in each embodiment are necessarily essential to the solution of the present invention. In this embodiment, an image forming apparatus will be used as an example of an information processing apparatus, but the present invention is not limited to this. Example 1 In the first embodiment, FIGS. 1 to 3 illustrate a conventional configuration, and FIGS. 4 to 6 illustrate the configuration of this embodiment.

[0014] The wiring board 100 shown in FIG. 1 is made of, for example, glass woven fabric made from glass fibers impregnated with epoxy resin, and is called FR-4 (Flame Retardant Type 4). The wiring board 100 is composed of solder resist, copper foil, a core material, and prepreg. The solder resist is an ink that covers the surface of the board and acts as an insulating film to protect the circuit pattern. This solder resist prevents solder from adhering to unnecessary areas during component mounting. For example, the core material is called NP-155FTL, and the prepreg is called NP-155FB, but these are not limited to these materials in this embodiment.

[0015] FIG. 1 is a top view illustrating the land portion for mounting a surface-mounted connector 400 on a wiring board 100. In this embodiment, it is assumed that the surface-mounted connector 400 has six pins. The surface-mounted connector 400 has connection terminals for communication and reinforcing terminals for fixing components. The wiring board 100 has connection terminal lands 110 to 115 and reinforcing terminal lands 120 and 121, which are lands corresponding to the respective terminals. The reinforcing terminal land 120 (first land) and the reinforcing terminal land 121 (second land) are arranged on both ends of the connector.

[0016] The connection terminal land portions 110-115 (third land portions) are land portions for signals that perform electrical communication, and are connected to pins for signals that perform electrical communication that the surface mount connector 400 has. The connection terminal land portions 110-115 are connected to the wiring pattern of the signal lines that perform electrical communication on the wiring board 100. The reinforcing terminal land portions 120, 121 are land portions that do not perform electrical communication, and are connected to reinforcing terminals of the surface mount connector 400.

[0017] 2 is a top view of the state in which cream solder 30 has been placed on the reinforcing terminal lands 120, 121 shown in Fig. 1. This cream solder 30 is used in reflow mounting to mount a surface mount component such as a surface mount connector 400 on a wiring board 100. Mounting refers to connecting the connector 400 to the wiring board 100.

[0018] Here, we will explain the reflow mounting process. In the reflow mounting process, a tool called a metal mask is used to separate the areas where the cream solder 30 will be applied from the areas where it will not. One metal mask is required for each side of the board.

[0019] Also, when mounting surface-mounted components on one side, the surface-mounted components on the other side are in the air, so they may be fixed with glue to prevent them from falling. This explanation will be written with the assumption that glue will also be applied.

[0020] After the cream solder 30 and bond are applied to the wiring board 100, surface mount components are mounted on the wiring board 100, and heat is applied to the wiring board 100 in a facility called a reflow furnace. By doing so, the cream solder 30 melts on the wiring board 100, blends with the components, and heat is applied to the bond to harden it so that the components do not come off until the mounting process.

[0021] The reflow mounting process is completed by performing this process on both sides. The temperature at which the cream solder 30 melts and the temperature at which the bond hardens are different, so in the reflow mounting process, the temperature is adjusted appropriately to minimize the load on the wiring board 100.

[0022] Fig. 3 is a top view for explaining the mounting of a surface-mounted connector 400 on the land portion of Fig. 1. The pins of electrical communication signals possessed by the surface-mounted connector 400 come into contact with the connection terminal land portions 110-115 and are connected by melting the solder. The reinforcing terminals of the surface-mounted connector 400 come into contact with the reinforcing terminal land portions 120, 121 and are connected by melting the solder. Therefore, when connecting the reinforcing terminals to the reinforcing terminal land portions 120, 121, it is necessary to melt the solder on each land portion to connect them.

[0023] When mounting the surface mount type connector 400, it is recommended to use reflow mounting in order to melt and connect the solder of all of these lands. However, this does not apply when removing the surface mount type connector 400; a soldering iron may be used to remove it, just like with general electrical components.

[0024] FIG. 4 is a top view illustrating the reinforcing terminal connecting land portion 200 (fourth land portion) that connects the reinforcing terminal lands 120 and 121 shown in FIG. The reinforcing terminal lands 120 and 121 and the reinforcing terminal connecting land portion 200 are copper foil and surrounded by solder resist. When either the reinforcing terminal land portion 120 or 121 is heated with a soldering iron to a temperature above the solder melting temperature, the molten solder flows along the copper foil without flowing into the solder resist. The molten solder that has flowed into the copper foil flows through the reinforcing terminal land portion 200 to the other land portion. Even if any of the reinforcing terminal lands 120 and 121 and the reinforcing terminal connecting land portion 200 is heated with a soldering iron to a temperature above the solder melting temperature, the molten solder flows to all three land portions, making it possible to heat the solder.

[0025] Fig. 5 is a top view of the state in which cream solder 30 has been placed on the reinforcing terminal land portions 120, 121 shown in Fig. 4. Furthermore, cream solder 30 is not placed on the reinforcing terminal connection land portion 200. Therefore, the amount of cream solder 30 placed on the wiring board 100 is the same as in Fig. 2. Descriptions common to Fig. 2 will be omitted.

[0026] FIG. 6 is a top view illustrating the surface-mounted connector 400 mounted on the land portion of FIG. 4. Descriptions common to FIG. 3 are omitted. The reinforcing terminal land portion 200 is disposed on the wiring board 100 so as not to come into contact with the surface-mounted connector 400. The surface-mounted connector 400 can be easily removed by heating any of the reinforcing terminal land portions 120, 121 and the reinforcing terminal connecting land portion 200 with a soldering iron, since the solder on all three land portions can be heated. This contributes to recycling and reuse, and achieves resource circulation. Example 2 7 is a top view illustrating extended reinforcing terminal connection lands 300 and 301 arranged near the electrical communication lands 110 and 115 for the connection terminals in the top view shown in FIG. 4. The extended reinforcing terminal connection lands 300 and 301 are copper foil and surrounded by solder resist. When either the extended reinforcing terminal connection land 300 or 301 is heated with a soldering iron to a temperature above the solder melting point, the molten solder flows along the copper foil without flowing into the solder resist.

[0027] The molten solder that has flowed onto the copper foil of the extended reinforcing terminal connecting land portion 300 flows through the reinforcing terminal connecting land portion 120 and the reinforcing terminal connecting land portion 200 to the other land portion.

[0028] Therefore, by heating any of the extended reinforcing terminal connection lands 300, 301, reinforcing terminal connection lands 120, 121, and reinforcing terminal connection land 200 with a soldering iron, the solder on all of the lands can be heated. In addition, the connection terminal land 110 near the extended reinforcing terminal connection land 300 and the connection terminal land 115 near the extended reinforcing terminal connection land 301 are at a distance that can be heated simultaneously with a soldering iron. Therefore, when recycling or reusing, by connecting the connection terminal lands 110 to 115 with solder in advance, it is possible to heat all of the lands simultaneously with one soldering iron.

[0029] Fig. 8 is a top view showing the state in which cream solder 30 has been applied to the reinforcing terminal lands 120, 121 shown in Fig. 7. Furthermore, cream solder 30 is not applied to the reinforcing terminal connecting land 200 and the extended reinforcing terminal connecting lands 300, 301. Therefore, the amount of cream solder 30 applied to the wiring board 100 is the same as in Figs. 2 and 5. Descriptions common to Figs. 2 and 5 will be omitted.

[0030] 9 is a top view illustrating the surface mount connector 400 mounted on the land portion of FIG. 7. Descriptions common to FIGS. 3 and 6 will be omitted. The extended reinforcing terminal land portions 300, 301 are arranged on the wiring board 100 so as not to come into contact with the surface mount connector 400. When recycling and reusing the surface mount connector 400, the connection terminal land portions 110-115 are first connected with solder, and then the extended reinforcing terminal land portion 300 or 301 is heated simultaneously with one soldering iron. This makes it possible to easily remove the surface mount connector 400 with one soldering iron, which contributes to recycling and reuse and achieves resource circulation.

[0031] (Other embodiments) While various examples and embodiments of the present invention have been shown and described, the spirit and scope of the present invention is not limited to the specific descriptions within this specification. [Explanation of symbols]

[0032] 100 wiring board 110 Land area for connection terminal 111 Land area for connection terminal 112 Land area for connection terminal 113 Land area for connection terminal 114 Land area for connection terminal 115 Land area for connection terminal 120 Reinforcement terminal land 121 Reinforcement terminal land

Claims

1. A connector mounting board to which a connector having at least two reinforcing terminals for fixing a member and a connection terminal for performing electrical communication can be connected, The connector mounting board has a first land portion and a second land portion that can be connected to the two reinforcing terminals arranged at positions corresponding to both ends of the connector but do not electrically communicate with each other, and also has a third land portion that can be connected to the connection terminal of the connector, and a fourth land portion for connecting the first land portion and the second land portion.

2. 2. The connector mounting board according to claim 1, wherein the fourth land portion is a land portion that does not perform electrical communication.

3. 2. The connector mounting board according to claim 1, wherein the first land portion, the second land portion, and the fourth land portion are connected in a configuration that allows molten solder to flow therein.

4. The connector mounting board according to claim 3, characterized in that when the first land portion, the second land portion, and the fourth land portion are connected by the molten solder, it is possible to heat all of the first land portion, the second land portion, and the fourth land portion by heating any one of the first land portion, the second land portion, and the fourth land portion.

5. The connector-mounted board according to claim 1 , wherein the connector having the connection terminals and the reinforcing terminals is a surface-mounted connector.

6. The connector mounting board according to claim 1 , wherein the first land portion and the second land portion that do not electrically communicate with the connector having the connection terminal and the reinforcing terminal are connected via solder.

7. 2. The connector mounting board according to claim 1, wherein the first land portion, the second land portion, the third land portion, and the fourth land portion are made of copper foil and are surrounded by solder resist.

8. 2. The connector mounting board according to claim 1, wherein a signal line is connected to the connection terminal.

9. 2. The connector mounting board according to claim 1, wherein no signal line is connected to the reinforcing terminal.

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