Manufacturing method for multilayer ceramic electronic components

Abstract

To provide a manufacturing method for multilayer ceramic electronic components that suppresses the occurrence of cracks during angled cutting and cutting in a push-cutting method.SOLUTION: A method includes a first cutting step of using asymmetric cutting blades 150 having different cutting edge angles to press, for cutting, a blade surface with a smaller cutting edge angle toward a product portion at a first cutting position PX1 located closer to the outer periphery than the boundary between the product portion and the outer periphery of an uncut mother block 100, a second cutting step of pressing for cutting, after the first cutting step, the mother block with the blade surface with the smaller cutting edge angle toward the opposite side from the first cutting position at a second cutting position PX2, which is the boundary between the product portion and the outer periphery, and a third cutting step of pressing for cutting, after the second cutting step, the mother block with the blade surface with the smaller cutting edge angle toward the opposite side from the second cutting position at a third cutting position PX3, which is located closer to the product portion than the boundary between the product portion and the outer periphery.SELECTED DRAWING: Figure 13

Description

[Technical Field]

[0001] The present invention relates to a method for manufacturing a multilayer ceramic electronic component. [Background technology]

[0002] When manufacturing multilayer ceramic electronic components, a process of cutting a plate-shaped ceramic block (hereinafter also referred to as a mother block) before firing is performed to obtain multiple chips from the ceramic block. Known methods for cutting the ceramic block include, for example, a dicing method using a dicing saw and a push-cutting method in which a cutting blade is moved perpendicular to the main surface of the ceramic block.

[0003] However, with the latter press-cutting method, a problem called "oblique cutting" can occur when cutting a ceramic block, in which the cut surface is at an angle. Such oblique cutting can cause defects in the shape of the chips obtained by cutting the ceramic block. Furthermore, with the press-cutting method, in which a cutting blade penetrates the ceramic block, structural defects such as cracks can occur inside the chips during cutting.

[0004] Patent Document 1 discloses a method for manufacturing ceramic electronic components, which includes at least a step of cutting a plate-shaped ceramic block before firing by operating a cutting blade in a direction perpendicular to a main surface of the ceramic block to obtain a plurality of chips from the ceramic block, and is characterized in that the cutting step is carried out with the cutting blade inclined at a predetermined angle with respect to the direction in which the cutting blade is operated. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Japanese Patent Application Publication No. 4-255207 Summary of the Invention [Problem to be solved by the invention]

[0006] According to Patent Document 1, the inclination given to the cutting blade has the effect of correcting the oblique cut that occurs when the cutting blade cannot be tilted, making it possible to perform cutting with reduced oblique cuts while maintaining low cost.

[0007] The present invention has been made to solve the above problems, and aims to provide a method for manufacturing a multilayer ceramic electronic component from a different perspective than Patent Document 1, which is capable of suppressing oblique cutting in the push-cutting method and suppressing the occurrence of cracks during cutting. [Means for solving the problem]

[0008] The method for manufacturing a multilayer ceramic electronic component of the present invention includes the following steps: a mother block preparation step for preparing a mother block formed by stacking multiple ceramic green sheets and having a main surface with two sides parallel to the X-axis direction and two sides parallel to the Y-axis direction, where the X-axis and Y-axis directions are orthogonal to each other; an X-axis cutting step for cutting the mother block by moving a cutting blade arranged along the X-axis direction along a Z-axis direction perpendicular to the main surface of the mother block to obtain multiple green block bodies; and a Y-axis cutting step for cutting the multiple green block bodies by moving the cutting blade arranged along the Y-axis direction along the Z-axis to obtain multiple chips from the multiple green block bodies. The mother block includes a product portion in which the multiple chips before cutting are arranged and an outer periphery surrounding the product portion. The cutting blade is an asymmetric blade having two cutting faces with different cutting edge angles at its tip. The X-axis direction cutting process includes: a first X-axis direction cutting process in which, for the mother block that has not been cut along the X-axis direction, the blade surface of the cutting blade with the smaller blade edge angle is directed toward the product portion at a first X-axis direction cutting position that is closer to the outer periphery than the boundary between the product portion and the outer periphery, and the mother block is pressed through; a second X-axis direction cutting process in which, for the mother block after the first X-axis direction cutting process, the blade surface of the cutting blade with the smaller blade edge angle is directed opposite to the first X-axis direction cutting position at an X-axis direction cutting position that is closer to the product portion than the boundary between the product portion and the outer periphery, and the mother block is pressed through; and a third X-axis direction cutting process in which, for the mother block after the second X-axis direction cutting process, the blade surface of the cutting blade with the smaller blade edge angle is directed opposite to the second X-axis direction cutting position, and the mother block is pressed throughThe Y-axis direction cutting process includes: a first Y-axis direction cutting process in which the cutting blade, having the smaller cutting edge angle, is directed toward the product portion to cut through the plurality of green block bodies that have not been cut along the Y-axis direction at a first Y-axis direction cutting position that is closer to the outer periphery than the boundary between the product portion and the outer periphery; a second Y-axis direction cutting process in which the cutting blade, having the smaller cutting edge angle, is directed toward the opposite side to the first Y-axis direction cutting position to cut through the plurality of green block bodies that have been cut along the Y-axis direction at a second Y-axis direction cutting position that is the boundary between the product portion and the outer periphery, to cut through the plurality of green block bodies that have been cut along the Y-axis direction; and a third Y-axis direction cutting process in which the cutting blade, having the smaller cutting edge angle, is directed toward the opposite side to the second Y-axis direction cutting position to cut through the plurality of green block bodies that have been cut along the Y-axis direction at a third Y-axis direction cutting position that is closer to the product portion than the boundary between the product portion and the outer periphery, to cut through the plurality of green block bodies that have been cut along the Y-axis direction. [Effects of the Invention]

[0009] According to the present invention, it is possible to provide a method for manufacturing a multilayer ceramic electronic component that can suppress oblique cutting in a push-cutting method and also suppress the occurrence of cracks during cutting. [Brief explanation of the drawings]

[0010] [Figure 1] FIG. 1 is a perspective view schematically showing an example of a multilayer inductor produced by a method for producing a multilayer ceramic electronic component according to one embodiment of the present invention. [Figure 2] FIG. 2 is an exploded perspective view schematically showing an example of a laminate that constitutes the laminated inductor shown in FIG. [Figure 3] FIG. 3 is an exploded perspective view schematically showing an example of a mother block. [Figure 4]FIG. 4 is a perspective view schematically showing an example of a green block obtained by cutting a mother block along the X-axis direction. [Figure 5] FIG. 5 is a perspective view schematically showing an example of a chip obtained by cutting the green block along the Y-axis direction. [Figure 6] FIG. 6 is a schematic diagram for explaining an example of the mechanism by which an oblique cut occurs. [Figure 7] FIG. 7 is an enlarged view schematically showing an example of the cutting blade used in FIG. [Figure 8] FIG. 8 is a schematic diagram for explaining an example of a mechanism for suppressing oblique cutting. [Figure 9] FIG. 9 is an enlarged view schematically showing an example of the cutting blade used in FIG. [Figure 10] FIG. 10 is a schematic diagram for explaining an example of a mechanism by which an oblique cut occurs in the opposite direction to that in FIG. [Figure 11] FIG. 11 is a schematic diagram illustrating an example of the first cutting step in the X-axis direction. [Figure 12] FIG. 12 is a schematic diagram illustrating an example of the X-axis direction second cutting step. [Figure 13] FIG. 13 is a schematic diagram illustrating an example of the third cutting step in the X-axis direction. [Figure 14] FIG. 14 is a schematic diagram showing an example of a green block obtained by the X-axis cutting step. [Figure 15] FIG. 15 is a schematic diagram illustrating an example of the Y-axis direction first cutting step. [Figure 16] FIG. 16 is a schematic diagram illustrating an example of the Y-axis direction second cutting step. [Figure 17] FIG. 17 is a schematic diagram illustrating an example of the Y-axis direction third cutting step. [Figure 18] FIG. 18 is a schematic diagram showing an example of a chip obtained by the Y-axis cutting step. [Figure 19]FIG. 19 is a schematic diagram for explaining an example of a mechanism by which cracks occur in the X-axis direction second cutting step. [Figure 20] FIG. 20 is a graph showing the relationship between DX1 / DX2 and DY1 / DY2 and the crack occurrence rate. [Figure 21] FIG. 21 is a graph showing the relationship between DX1 / DX2 and DY1 / DY2 and the amount of oblique cutting. [Figure 22] FIG. 22 is a schematic diagram for explaining an example of a method for measuring the amount of oblique cutting. DETAILED DESCRIPTION OF THE INVENTION

[0011] A method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention will now be described. However, the present invention is not limited to the following embodiments and can be appropriately modified and applied within the scope of the present invention. A combination of two or more of the individual preferred configurations of the present invention described in the following embodiments also constitutes the present invention.

[0012] In this specification, terms indicating the relationship between elements (e.g., "perpendicular," "parallel," "orthogonal," etc.) and terms indicating the shape of elements are not expressions that only express a strict meaning, but are expressions that also include a range of substantial equivalence, for example, a difference of a few percent.

[0013] The drawings shown below are schematic diagrams, and the dimensions, aspect ratio, and other scales may differ from those of the actual product. In the drawings, the same or equivalent parts will be designated by the same reference numerals. In addition, the same elements will be designated by the same reference numerals in each drawing, and duplicate explanations will be omitted.

[0014] [Multilayer ceramic electronic components] First, a multilayer ceramic electronic component manufactured by a method for manufacturing a multilayer ceramic electronic component according to an embodiment of the present invention will be described with reference to the drawings.

[0015] In the following, a multilayer inductor will be described as an example of one embodiment of a multilayer ceramic electronic component. Note that the present invention can also be applied to multilayer ceramic electronic components other than multilayer inductors. Examples of such multilayer ceramic electronic components include multilayer ceramic capacitors, multilayer LC composite components, and multilayer varistors.

[0016] Fig. 1 is a perspective view schematically showing an example of a laminated inductor fabricated by a method for manufacturing a laminated ceramic electronic component according to an embodiment of the present invention. Fig. 2 is an exploded perspective view schematically showing an example of a laminate constituting the laminated inductor shown in Fig. 1. Note that the shapes and arrangements of the laminated inductor and its components are not limited to those shown in the example.

[0017] 1 includes a laminate 10 and external electrodes 21 and 22. A coil 30 is built into the laminate 10. The external electrodes 21 and 22 are each electrically connected to the coil 30.

[0018] In the laminated inductor 1 and the laminate 10, the length direction, thickness direction, and width direction are defined as the L direction, T direction, and W direction in Figures 1 and 2. Here, the length direction L, thickness direction T, and width direction W are perpendicular to each other.

[0019] 1, the laminate 10 has a rectangular parallelepiped shape in which the dimension in the length direction L is greater than the dimensions in the width direction W and the thickness direction T. In Fig. 1, the laminate 10 has a first main surface 11 and a second main surface 12 facing opposite to each other in the length direction L, a third main surface 13 and a fourth main surface 14 facing opposite to each other in the thickness direction T, and a fifth main surface 15 and a sixth main surface 16 facing opposite to each other in the width direction W.

[0020] 1, the corners and ridges of the laminate 10 may be rounded. A corner of the laminate 10 is a portion where three surfaces of the laminate 10 intersect, and a ridge of the laminate 10 is a portion where two surfaces of the laminate 10 intersect.

[0021] Of the external electrodes 21 and 22, the external electrode 21 is provided on the first main surface 11 located in the longitudinal direction L of the laminate 10, for example, as shown in Fig. 1. In the example shown in Fig. 1, the external electrode 21 covers the entire first main surface 11 of the laminate 10, and extends from the first main surface 11 to cover part of the third main surface 13, part of the fourth main surface 14, part of the fifth main surface 15, and part of the sixth main surface 16.

[0022] Of the external electrodes 21 and 22, the other external electrode 22 is provided on the second main surface 12 located in the longitudinal direction L of the laminate 10, for example, as shown in Fig. 1. In the example shown in Fig. 2, the external electrode 22 covers the entire second main surface 12 of the laminate 10, and extends from the second main surface 12 to cover part of the third main surface 13, part of the fourth main surface 14, part of the fifth main surface 15, and part of the sixth main surface 16.

[0023] When mounting the laminated inductor 1 having the external electrodes 21 and 22 arranged as described above on a substrate, any one of the third main surface 13, the fourth main surface 14, the fifth main surface 15, and the sixth main surface 16 of the laminate 10 becomes the mounting surface.

[0024] As shown in Fig. 2, the laminate 10 is formed by stacking a plurality of insulating layers 31 in a stacking direction. In the example shown in Fig. 2, the plurality of insulating layers 31 are stacked in a length direction L, and therefore the length direction L is the stacking direction. There are no particular limitations on the size, shape, number of stacked layers, etc. of the insulating layers 31.

[0025] In the laminated structure of the insulating layer 31 of the laminate 10, the boundaries between the layers are not clearly visible in reality.

[0026] The insulating layers 31 may be made of a magnetic material such as a ferrite material.

[0027] The coil 30 built into the laminate 10 is configured by electrically connecting a plurality of coil conductor layers 32 stacked together with insulating layers 31 in the stacking direction (length direction L in FIG. 2).

[0028] 2, the coil conductor layers 32 are provided on the main surfaces of the insulating layers 31, that is, on the main surfaces on the positive side in the longitudinal direction L. The length, shape, number of layers, etc. of the coil conductor layers 32 are not particularly limited.

[0029] The coil conductor layers 32 adjacent to each other in the stacking direction (length direction L in FIG. 2) are electrically connected through via conductors 33.

[0030] The via conductors 33 are provided so as to penetrate the insulating layers 31 in the stacking direction (length direction L in FIG. 2). The size, shape, etc. of the via conductors 33 are not particularly limited.

[0031] Lands to be connected to the via conductors 33 are preferably provided on the main surface of the insulating layer 31. In this case, the size of the lands is preferably slightly larger than the line width of the coil conductor layer 32.

[0032] Examples of materials constituting each of the coil conductor layers 32 (including the lands) and each of the via conductors 33 include Ag, Au, Cu, Pd, Ni, Al, and alloys containing at least one of these metals.

[0033] 2 are stacked in the longitudinal direction L, the coil conductor layers 32 are electrically connected through the via conductors 33. As a result, a solenoid coil 30 having a coil axis extending in the longitudinal direction L is formed in the laminate 10, as shown in FIG.

[0034] 2, via conductors 33 provided in insulating layers 31 where no coil conductor layers 32 are provided become lead conductors 41 within the laminate 10 and are exposed on the first main surface 11 of the laminate 10, as shown in FIG. 1. The lead conductors 41 connect the external electrodes 21 and the coil 30 within the laminate 10.

[0035] 2, via conductors 33 provided in insulating layers 31 on which no coil conductor layers 32 are provided become lead conductors 42 within the laminate 10 and are exposed on the second main surface 12 of the laminate 10, as shown in FIG. 1. The lead conductors 42 connect the external electrodes 22 and the coil 30 within the laminate 10.

[0036] At the end portion of the laminate 10 in the negative direction in the length direction L shown in Fig. 2, there may be one or two or more insulating layers 31 on which no coil conductor layers 32 are provided. Similarly, at the end portion of the laminate 10 in the positive direction in the length direction L shown in Fig. 2, there may be one or two or more insulating layers 31 on which no coil conductor layers 32 are provided. The number of insulating layers 31 on which no coil conductor layers 32 are provided may be the same as or different from the number of insulating layers 31 on which no coil conductor layers 32 are provided in the positive and negative directions in the length direction L of the laminate 10.

[0037] When viewed from the longitudinal direction L, the coil 30 may have a shape (e.g., a polygonal shape) composed of straight portions as shown in FIG. 1, a shape (e.g., a circular shape) composed of curved portions, or a shape composed of straight and curved portions.

[0038] The stacking direction of the insulating layers 31 and the direction of the coil axis of the coil 30 may be parallel to the mounting surface of the laminate 10 or may be perpendicular to the mounting surface of the laminate 10.

[0039] [Manufacturing method for multilayer ceramic electronic components] A method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention will now be described. In the method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention, a plurality of multilayer ceramic electronic components are simultaneously manufactured.

[0040] A method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention includes a mother block preparation step, an X-axis cutting step, and a Y-axis cutting step. Preferably, the method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention further includes a firing step and an external electrode formation step.

[0041] <Mother block preparation process> FIG. 3 is an exploded perspective view schematically showing an example of a mother block.

[0042] 3, a mother block 100 is prepared, which is made up of a plurality of laminated ceramic green sheets 131. The mother block 100 has a main surface that is composed of two sides parallel to the X-axis direction and two sides parallel to the Y-axis direction, of which the X-axis and Y-axis directions are orthogonal to each other. For example, the mother block 100 has a rectangular main surface.

[0043] The mother block 100 is an assembly of unsintered laminates 10 (see FIG. 2). Hereinafter, the unsintered laminates are also referred to as chips. Therefore, the mother block 100 has a plurality of chips (see FIG. 5, which will be described later) arranged thereon.

[0044] 3, the mother block 100 includes a product portion in which a plurality of chips before cutting are arranged, and an outer periphery surrounding the product portion. The outer periphery of the mother block 100 is preferably provided along the four sides of the mother block 100.

[0045] For example, Fe2O3, ZnO, CuO, and NiO are weighed out to give a predetermined ratio.

[0046] Next, these weighed materials and pure water are placed in a ball mill together with PSZ (partially stabilized zirconia) media, mixed, and then pulverized. The mixing and pulverization time is, for example, 4 hours or more and 8 hours or less.

[0047] The resulting pulverized material is then dried and then calcined at a calcination temperature of, for example, 700° C. to 800° C. for, for example, 2 hours to 5 hours.

[0048] In this manner, a powdered magnetic material, more specifically, a powdered magnetic ferrite material is produced.

[0049] As the ferrite material, for example, a Ni-Cu-Zn based ferrite material is used.

[0050] For example, when the total amount is taken as 100 mol%, the Ni-Cu-Zn ferrite material contains 40 mol% or more and 49.5 mol% or less of Fe calculated as Fe2O3, 2 mol% or more and 35 mol% or less of Zn calculated as ZnO, 6 mol% or more and 13 mol% or less of Cu calculated as CuO, and 10 mol% or more and 45 mol% or less of Ni calculated as NiO.

[0051] The Ni-Cu-Zn ferrite material may further contain additives such as Co, Bi, Sn, and Mn.

[0052] The Ni—Cu—Zn ferrite material may further contain inevitable impurities.

[0053] The obtained magnetic material, an organic binder such as polyvinyl butyral (PVB) resin, an organic solvent such as ethanol or toluene, a plasticizer, etc. are mixed in a ball mill together with PSZ media, and then pulverized to produce a slurry.

[0054] Next, the slurry is formed into a sheet of a predetermined thickness by a doctor blade method or the like, and then punched into a predetermined shape to produce the ceramic green sheet 131. The thickness of the ceramic green sheet 131 is, for example, 20 μm or more and 30 μm or less. The shape of the ceramic green sheet 131 is, for example, rectangular.

[0055] As the material of the ceramic green sheet 131, instead of a magnetic material, a non-magnetic material such as borosilicate glass material may be used, or a mixed material of a magnetic material and a non-magnetic material may be used.

[0056] Predetermined locations of the obtained ceramic green sheet 131 are irradiated with a laser to form via holes.

[0057] Next, a conductive paste such as an Ag paste is applied to the surface of the ceramic green sheet 131 while filling the via holes by a screen printing method or the like. Thereby, a conductor pattern 133 for a via conductor is formed in the via holes with respect to the ceramic green sheet 131, and a conductor pattern 132 for a coil conductor layer connected to the conductor pattern 133 for a via conductor is formed on the surface. In this way, a coil sheet in which the conductor pattern 132 for a coil conductor layer and the conductor pattern 133 for a via conductor are formed on the ceramic green sheet 131 is produced. In the coil sheet, a conductor pattern 132 for a coil conductor layer corresponding to the coil conductor layer 32 shown in FIG. 2 and a conductor pattern 133 for a via conductor corresponding to the via conductor 33 shown in FIG. 2 (excluding the portions corresponding to the lead conductors 41 and 42 shown in FIG. 1) are formed. Further, separately from the coil sheet, a via sheet in which conductor patterns 141 and 142 for lead conductors corresponding to the lead conductors 41 and 42 shown in FIG. 1 are formed in via holes is produced.

[0058] As shown in FIG. 3, an area where the conductor pattern 132 for a coil conductor layer, the conductor pattern 133 for a via conductor, the conductor pattern 141 for a lead conductor, and the conductor pattern 142 for a lead conductor are not formed is provided at the periphery of the ceramic green sheet 131. In the mother block 100, the formation area of the conductor pattern constitutes the product part, and the non-formation area of the conductor pattern constitutes the outer peripheral part.

[0059] The obtained coil sheet and via sheet are laminated in the stacking direction (the length direction L in FIG. 2) in the order corresponding to FIG. 2, and then thermocompression bonded to produce the mother block 100.

[0060] As long as the mother block 100 includes two or more chips, the number of chips arranged along the X-axis direction of the mother block 100 is not particularly limited, and may be one or two or more. Also, the number of chips arranged along the Y-axis direction of the mother block 100 is not particularly limited, and may be one or two or more.

[0061] <X-axis Direction Cutting Process> FIG. 4 is a perspective view schematically showing an example of a green block body obtained by cutting a mother block along the X-axis direction.

[0062] A cutting blade (not shown) arranged along the X-axis direction is operated along the Z-axis direction perpendicular to the main surface of the mother block 100 (see FIG. 3) to cut through the mother block 100, and a plurality of green block bodies 110 are obtained from the mother block 100. Specifically, when a cutting blade not shown enters the mother block 100 along the Z-axis direction, the mother block 100 is cut through.

[0063] At this time, in FIG. 3, the operation of cutting through the mother block 100 along the X-axis direction cutting line CLX at the first position and the operation of moving the cutting blade and / or the mother block 100 to the X-axis direction cutting line CLX at the next position are repeated until the X-axis direction cutting line CLX at the last position.

[0064] [[ID=q]]<Y-axis direction cutting process> FIG. 5 is a perspective view schematically showing an example of a chip obtained by cutting a green block body along the Y-axis direction.

[0065] A cutting blade (not shown) arranged along the Y-axis direction is operated along the Z-axis direction perpendicular to the main surface of the mother block 100 (see FIG. 3) to cut through the plurality of green block bodies 110 (see FIG. 4), and a plurality of chips 120 are obtained from the plurality of green block bodies 110. Specifically, when a cutting blade not shown enters the green block body 110 along the Z-axis direction, the green block body 110 is cut through.

[0066] At this time, in FIG. 4, the operation of cutting through the green block body 110 along the Y-axis direction cutting line CLY at the first position and the operation of moving the cutting blade and / or the green block body 110 to the Y-axis direction cutting line CLY at the next position are repeated until the Y-axis direction cutting line CLY at the last position.

[0067] As a result of the above, a plurality of chips 120 are obtained by dividing the mother block 100.

[0068] The X-axis direction cutting step and the Y-axis direction cutting step will be described in detail later.

[0069] <Firing process> In the firing step, the chips 120 separated from the mother block 100 are fired.

[0070] The firing temperature is, for example, 900° C. or higher and 920° C. or lower, and the firing time is, for example, 2 hours or higher and 4 hours or lower.

[0071] When the individual chips 120 are fired, the ceramic green sheets 131 of the coil sheet and via sheet become the insulating layers 31.

[0072] Furthermore, when the singulated chip 120 is fired, the conductor pattern 132 for the coil conductor layer formed on the surface of the coil sheet becomes the coil conductor layer 32, the conductor pattern 133 for the via conductor formed in the via hole of the coil sheet becomes the via conductor 33, and the conductor patterns 141 and 142 for the lead conductor formed in the via hole of the via sheet become the lead conductors 41 and 42. As a result, a coil 30 is produced in which a plurality of coil conductor layers 32 stacked together with the insulating layer 31 are electrically connected via the via conductors 33.

[0073] In this manner, a plurality of insulating layers 31 are stacked in the stacking direction, and the laminate 10 incorporating the coil 30 is fabricated.

[0074] The corners and ridges of the laminate 10 may be rounded by, for example, barrel polishing.

[0075] <External electrode formation process> In the external electrode forming step, the external electrodes 21 and 22 electrically connected to the coil 30 are formed on the surface of the laminate 10.

[0076] First, a conductive paste layer is formed by applying a conductive paste such as a paste containing Ag and glass frit to the end faces of the outer surface of the laminate 10 from which the lead conductors 41 and 42 are led out.

[0077] Next, the conductive paste layer is baked to form the base electrodes of the external electrodes 21 and 22. The baking temperature is, for example, 800° C. or higher and 820° C. or lower. The thickness of the base electrodes is, for example, 5 μm.

[0078] Then, a Ni-plated electrode and a Sn-plated electrode are formed in this order on the surface of the base electrode by, for example, electrolytic plating, etc. This forms the external electrodes 21 and 22 each having the base electrode, Ni-plated electrode, and Sn-plated electrode in this order.

[0079] In this way, the laminated inductor 1 is manufactured.

[0080] As described above, in the method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention, a push-cutting method is adopted as a method for cutting a mother block to obtain a plurality of chips, in which a cutting blade is moved in a direction perpendicular to the main surface of the ceramic block.

[0081] However, as explained in the background art, the push-cutting method can result in "oblique cuts" where the cut surface is oblique.

[0082] Fig. 6 is a schematic diagram for explaining an example of the mechanism by which an oblique cut occurs. Fig. 7 is an enlarged view showing an example of the cutting blade used in Fig. 6. Fig. 6 shows the cutting direction CD.

[0083] In the example shown in FIG. 6, the mother block 100 is placed on a table 200 of a cutting device together with an adhesive sheet 210.

[0084] 6, the mother block 100 is preferably held on a table 200 via an adhesive sheet 210. The adhesive sheet 210 includes a base film 211 and an adhesive layer 212 from the table 200 side.

[0085] In the example shown in Fig. 6, the mother block 100 is pushed through by moving the cutting blade 150a shown in Fig. 7 along the Z-axis direction perpendicular to the main surface of the mother block 100. The cutting blade 150a shown in Fig. 7 is a symmetrical blade having two cutting surfaces at the tip with equal cutting edge angles α0 and β0.

[0086] As shown in FIG. 6, the displacement S in the uncut portion of the mother block 100 (the portion on the right side of the cutting blade 150a in FIG. 6) is F0 and the displacement S at the cut portion where the mother block 100 has already been cut (the portion to the left of the cutting blade 150a in FIG. 6). B0 Specifically, the displacement S in the uncut portion F0 The amount of displacement S at the cut section compared to B0 As a result, the cut surface of the mother block 100 becomes oblique, and it is thought that an oblique cut occurs in the direction indicated by the arrow d1 in FIG.

[0087] In the example shown in FIG. 6, the mother block 100 is pressed along the X-axis direction. However, when the green block body 110 is pressed along the Y-axis direction, the cut surface of the green block body 110 becomes slanted, resulting in a diagonal cut.

[0088] To address the above problem, the present inventors have come up with the idea of ​​using an asymmetric cutting blade having two cutting surfaces with different cutting edge angles at the tip to suppress oblique cutting.

[0089] Fig. 8 is a schematic diagram for explaining an example of a mechanism for suppressing oblique cutting, and Fig. 9 is an enlarged view showing a schematic example of a cutting blade used in Fig. 8.

[0090] In the example shown in Fig. 8, the mother block 100 is pushed through by moving the cutting blade 150 shown in Fig. 9 along the Z-axis direction perpendicular to the main surface of the mother block 100. The cutting blade 150 shown in Fig. 9 is an asymmetric blade having two cutting surfaces at its tip, with cutting edge angles α and β different from each other. Note that while the cutting blade shown in Fig. 9 is a single-stage blade, the asymmetric blade in the present disclosure may be a single-stage blade, a two-stage blade, or an n-stage blade with three or more stages (n is a natural number). Even if the cutting blade is a two-stage blade or an n-stage blade with three or more stages, it is considered to be an asymmetric blade if the cutting edge angles of the first stage, which is the most distal end, are different.

[0091] Specifically, the cutting blade 150 shown in FIG. 9 is moved along the Z-axis direction with the blade surface with the smaller cutting edge angle (the blade surface on the cutting edge angle β side in FIG. 9) facing the positive side of the cutting progression direction CD (the right side in FIG. 8) and the blade surface with the larger cutting edge angle (the blade surface on the cutting edge angle α side in FIG. 9) facing the negative side of the cutting progression direction CD (the left side in FIG. 8), thereby cutting through the mother block 100. When the cutting blade 150, which is an asymmetric blade, is used, the direction of travel of the cutting blade 150 advances toward the side with the smaller cutting edge angle, so that the displacement amount S in the uncut portion of the mother block 100 (the portion to the right of the cutting blade 150 in FIG. 8) F and the displacement S at the cutting portion of the mother block 100 (the portion to the left of the cutting blade 150 in FIG. 8). B It is believed that the oblique cut caused by the difference between

[0092] However, when an asymmetric blade having two cutting surfaces at the tip with different cutting edge angles α and β is used as the cutting blade 150, it was found that when pushing through the uncut mother block 100, a diagonal cut occurs in the opposite direction to that shown in Figure 6.

[0093] FIG. 10 is a schematic diagram for explaining an example of a mechanism by which an oblique cut occurs in the opposite direction to that in FIG.

[0094] In the example shown in FIG. 10 , the cutting blade 150 shown in FIG. 9 is moved along the Z-axis with the blade surface with the smaller bevel angle (the blade surface on the bevel angle β side in FIG. 9 ) facing the positive side of the cutting direction CD (the right side in FIG. 10 ) and the blade surface with the larger bevel angle (the blade surface on the bevel angle α side in FIG. 9 ) facing the negative side of the cutting direction CD (the left side in FIG. 10 ), thereby cutting through the uncut mother block 100. In this case, unlike the state shown in FIG. 8 , there is no cut portion of the mother block 100 before or after the cutting blade 150, so there is no difference in the amount of displacement. On the other hand, by using an asymmetric cutting blade 150, the cutting blade 150 moves in the direction of the smaller bevel angle. Therefore, it is thought that an oblique cut occurs in the direction indicated by arrow d2 in FIG. 10 .

[0095] Therefore, in a method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention, when the mother block is cut using an asymmetric cutting blade, the outer periphery surrounding the product portion is first cut, and then the product portion is cut. As a result, although the first cut causes oblique cuts on the cut surface of the outer periphery (see FIG. 10), in subsequent cuts, it is possible to suppress oblique cuts on the cut surface of the product portion (see FIG. 8).

[0096] First, the X-axis direction cutting step will be described in detail.

[0097] The X-axis direction cutting step includes a first X-axis direction cutting step, a second X-axis direction cutting step, and a third X-axis direction cutting step.

[0098] FIG. 11 is a schematic diagram illustrating an example of the first cutting step in the X-axis direction.

[0099] As shown in FIG. 11, in the first cutting step in the X-axis direction, a mother block 100 that has not been cut along the X-axis direction is cut into a product portion R PRO and outer periphery R OUT The outer periphery R is closer to the boundary with OUTAt the first cutting position PX1 in the X-axis direction located on the side of the product R, the cutting edge of the cutting blade 150 with a smaller cutting edge angle (the cutting edge on the cutting edge angle β side in FIG. 9) is PRO Push the mother block 100 towards the side.

[0100] In the first cutting step in the X-axis direction, as explained in FIG. 10, there is no cutting portion of the mother block 100 before or after the cutting blade 150, so no difference in the amount of displacement occurs. On the other hand, by using the cutting blade 150, which is an asymmetric blade, the direction of travel of the cutting blade 150 advances to the side with the smaller cutting edge angle. Therefore, the outer periphery R OUT 11. In this case, it is considered that a diagonal cut occurs in the direction indicated by the arrow d2 in FIG.

[0101] FIG. 12 is a schematic diagram illustrating an example of the X-axis direction second cutting step.

[0102] As shown in FIG. 12, in the second cutting step in the X-axis direction, the mother block 100 after the first cutting step in the X-axis direction is cut into a product portion R PRO and outer periphery R OUT At the second cutting position PX2 in the X-axis direction, which is the boundary between the first cutting position PX1 and the second cutting position PX2, the cutting blade 150 is pushed through by directing the blade surface with the smaller cutting edge angle (the blade surface on the cutting edge angle β side in Figure 9) toward the opposite side to the first cutting position PX1 in the X-axis direction.

[0103] In the second cutting step in the X-axis direction, as described in FIG. 8, the cutting blade 150 moves in the direction of the smaller cutting edge angle, so that the displacement amount S F and the displacement S at the cutting portion of the mother block 100 (the portion on the left side of the cutting blade 150 in FIG. 12). B This can suppress the oblique cut caused by the difference between

[0104] FIG. 13 is a schematic diagram illustrating an example of the third cutting step in the X-axis direction.

[0105] As shown in FIG. 13, in the third cutting step in the X-axis direction, the mother block 100 after the second cutting step in the X-axis direction is cut into a product portion R PRO and outer periphery R OUT The product part R is closer to the boundary with PRO At the third cutting position PX3 in the X-axis direction, which is located on the side of the mother block 100, the cutting blade 150 has its blade surface with a smaller cutting edge angle (the blade surface on the cutting edge angle β side in FIG. 9) facing away from the second cutting position PX2 in the X-axis direction, and the mother block 100 is pushed through.

[0106] As in the second cutting step in the X-axis direction, oblique cutting can also be suppressed in the third cutting step in the X-axis direction.

[0107] FIG. 14 is a schematic diagram showing an example of a green block obtained by the X-axis cutting step.

[0108] As shown in FIG. 14, by pushing the mother block 100 all the way to the final cutting line CLX in the X-axis direction (see FIG. 3), a plurality of green blocks 110 can be obtained from the mother block 100.

[0109] Next, the Y-axis direction cutting step will be described in detail.

[0110] The Y-axis direction cutting step includes a first Y-axis direction cutting step, a second Y-axis direction cutting step, and a third Y-axis direction cutting step.

[0111] FIG. 15 is a schematic diagram illustrating an example of the Y-axis direction first cutting step.

[0112] As shown in FIG. 15, in the first cutting step in the Y-axis direction, a plurality of green blocks 110 that are not cut along the Y-axis direction are cut into product portions R PRO and outer periphery R OUT The outer periphery R is closer to the boundary with OUT At the first cutting position PY1 in the Y-axis direction located on the side of the product R, the cutting edge of the cutting blade 150 with a smaller cutting edge angle (the cutting edge on the cutting edge angle β side in FIG. 9) is PROThe green blocks 110 are pushed through toward the side.

[0113] In the first cutting step in the Y-axis direction, as explained in FIG. 10, there is no cut portion of the green block body 110 before or after the cutting blade 150, so no difference in the amount of displacement occurs. On the other hand, by using the cutting blade 150, which is an asymmetric blade, the direction of travel of the cutting blade 150 advances to the side with the smaller cutting edge angle. Therefore, the outer peripheral portion R OUT 15. In this case, it is considered that a diagonal cut occurs in the direction indicated by the arrow d2 in FIG.

[0114] FIG. 16 is a schematic diagram illustrating an example of the Y-axis direction second cutting step.

[0115] As shown in FIG. 16, in the second cutting step in the Y-axis direction, the green blocks 110 after the first cutting step in the Y-axis direction are cut into product portions R PRO and outer periphery R OUT At the second cutting position PY2 in the Y-axis direction, which is the boundary between the first cutting position PY1 and the second cutting position PY2, the cutting blade 150 is pushed through by directing the blade surface with the smaller cutting edge angle (the blade surface on the cutting edge angle β side in Figure 9) toward the opposite side to the first cutting position PY1 in the Y-axis direction.

[0116] In the second cutting step in the Y-axis direction, as described in FIG. 8, the cutting blade 150 moves in the direction of the smaller cutting edge angle, so that the displacement S F and the displacement S at the cutting portion of the green block body 110 (the portion on the left side of the cutting blade 150 in FIG. 16). B This can suppress the oblique cut caused by the difference between

[0117] FIG. 17 is a schematic diagram illustrating an example of the Y-axis direction third cutting step.

[0118] As shown in FIG. 17, in the third cutting step in the Y-axis direction, the green blocks 110 after the second cutting step in the Y-axis direction are cut into product portions R PRO and outer periphery ROUT The product part R is closer to the boundary with PRO At the third cutting position PY3 in the Y-axis direction, which is located on the side of the second cutting position PY2 in the Y-axis direction, the cutting edge of the cutting blade 150 with the smaller cutting edge angle (the cutting edge with the cutting edge angle β in FIG. 9) is directed toward the opposite side to the second cutting position PY2 in the Y-axis direction to cut through the plurality of green block bodies 110.

[0119] As in the second cutting step in the Y-axis direction, oblique cutting can also be suppressed in the third cutting step in the Y-axis direction.

[0120] FIG. 18 is a schematic diagram showing an example of a chip obtained by the Y-axis cutting step.

[0121] As shown in FIG. 18, by pushing a plurality of green block bodies 110 all the way to the Y-axis direction cut line CLY (see FIG. 3) at the final position, a plurality of chips 120 can be obtained from the plurality of green block bodies 110.

[0122] For example, when manufacturing the laminated inductor 1 shown in FIG. 1, the chip 120, which is the unsintered laminate 10, has a rectangular parallelepiped shape in which the dimension in the length direction L is greater than the dimension in the width direction W and the dimension in the thickness direction T. In this case, the length direction L of the chip 120 may be parallel to the Z-axis direction in which the cutting blade 150 is operated. When the mother block 100 is pressed through by operating the cutting blade 150 along the length direction L of the chip 120, the penetration distance of the cutting blade 150 becomes long, which makes it more likely that oblique cuts will occur on the cut surface of the mother block 100. Even in such a case, the outer peripheral portion R OUT By pushing through, Product Department R PRO This is preferable because it can prevent the green block body 110 from being obliquely cut.

[0123] 14, the distance DX1 between the first cutting position PX1 in the X-axis direction and the second cutting position PX2 in the X-axis direction is not particularly limited. However, by reducing the distance DX1 between the first cutting position PX1 in the X-axis direction and the second cutting position PX2 in the X-axis direction, the product part R PRO From the side, outer periphery R OUT This reduces the distortion in the direction toward the product side. PRO is the outer periphery R OUT Therefore, the amount of oblique cutting in the second cutting step in the X-axis direction is reduced. Also, cracks are less likely to occur in the second cutting step in the X-axis direction.

[0124] FIG. 19 is a schematic diagram for explaining an example of a mechanism by which cracks occur in the X-axis direction second cutting step.

[0125] In the example shown in FIG. 19, the area below the tip of the cutting blade 150 is the product portion R PRO From the side, outer periphery R OUT The product part R is pulled by the strain in the direction toward the side. PRO is the outer periphery R OUT In this case, it is thought that a crack 300 will occur along the Z-axis direction in which the cutting blade 150 operates, as shown in FIG.

[0126] From the viewpoint of suppressing the occurrence of cracks in the second cutting process in the X-axis direction, in FIG. 14, the distance DX1 between the first cutting position PX1 in the X-axis direction and the second cutting position PX2 in the X-axis direction is preferably greater than 0 and not greater than 3.00 times the distance DX2 between the second cutting position PX2 in the X-axis direction and the third cutting position PX3 in the X-axis direction, and more preferably greater than 0 and not greater than 2.00 times.

[0127] Furthermore, from the viewpoint of reducing the amount of diagonal cutting in the second cutting step in the X-axis direction, in FIG. 14, it is preferable that the distance DX1 between the first cutting position PX1 in the X-axis direction and the second cutting position PX2 in the X-axis direction is greater than 0 times and not more than 1.75 times the distance DX2 between the second cutting position PX2 in the X-axis direction and the third cutting position PX3 in the X-axis direction.

[0128] 18, the distance DY1 between the first cutting position PY1 in the Y-axis direction and the second cutting position PY2 in the Y-axis direction is not particularly limited. However, by reducing the distance DY1 between the first cutting position PY1 in the Y-axis direction and the second cutting position PY2 in the Y-axis direction, the product portion R PRO From the side, outer periphery R OUT This reduces the distortion in the direction toward the product side in the second cutting process in the Y-axis direction. PRO is the outer periphery R OUT Therefore, the amount of oblique cutting in the second cutting step in the Y-axis direction is reduced. Also, cracks are less likely to occur in the second cutting step in the Y-axis direction.

[0129] From the viewpoint of suppressing the occurrence of cracks in the second cutting process in the Y-axis direction, in Figure 18, the distance DY1 between the first cutting position PY1 in the Y-axis direction and the second cutting position PY2 in the Y-axis direction is preferably greater than 0 and less than 3.00 times the distance DY2 between the second cutting position PY2 in the Y-axis direction and the third cutting position PY3 in the Y-axis direction, and more preferably greater than 0 and less than 2.00 times.

[0130] Furthermore, from the viewpoint of reducing the amount of diagonal cutting in the second cutting process in the Y-axis direction, in Figure 18, it is preferable that the distance DY1 between the first cutting position PY1 in the Y-axis direction and the second cutting position PY2 in the Y-axis direction is greater than 0 times and not more than 1.75 times the distance DY2 between the second cutting position PY2 in the Y-axis direction and the third cutting position PY3 in the Y-axis direction.

[0131] In a method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention, the X-axis direction cutting step and the Y-axis direction cutting step may be performed in this order.

[0132] In addition, in the method for manufacturing a multilayer ceramic electronic component according to one embodiment of the present invention, the first Y-axis cutting step may be performed immediately after the first X-axis cutting step, and then the remaining X-axis cutting step and Y-axis cutting step may be performed in this order.

[0133] [Experimental Example] In the following experimental example, a mother block made of ferrite material, measuring 150 mm in the X-axis direction, 150 mm in the Y-axis direction, and 1.84 mm in the Z-axis direction, was subjected to a push-cut using an asymmetric cutting blade.

[0134] The cutting dimensions of the product part were 0.94 mm in both the X-axis and Y-axis directions, and the dimensions of the outer periphery were 13.80 mm in both the X-axis and Y-axis directions.

[0135] In Samples 1 to 11, both the distance DX1 between the first cut position in the X-axis direction and the second cut position in the X-axis direction and the distance DY1 between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction were changed. On the other hand, in Sample 12, the first cut process in the X-axis direction and the first cut process in the Y-axis direction were not performed. As described above, since the cut dimensions of the product part are 0.94 mm in both the X-axis direction and the Y-axis direction, the distance DX2 between the second cut position in the X-axis direction and the third cut position in the X-axis direction and the distance DY2 between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction are both 0.94 mm.

[0136] <Crack occurrence rate> Samples 1 to 12 were checked for the presence or absence of cracks as described in Figure 19. The crack occurrence rates for Samples 1 to 12 are shown in Table 1. Figure 20 is a graph showing the relationship between DX1 / DX2 and DY1 / DY2 and the crack occurrence rate. The results for Samples 9 to 12 were calculated by simulation.

[0137] [Table 1]

[0138] Table 1 and Figure 20 show that the crack occurrence rate decreases by reducing DX1 / DX2 and DY1 / DY2. From these results, it is considered that DX1 is preferably greater than 0 and not greater than 3.00 times DX2, and more preferably greater than 0 and not greater than 2.00. Similarly, it is considered that DY1 is preferably greater than 0 and not greater than 3.00 times DY2, and more preferably greater than 0 and not greater than 2.00.

[0139] <Amount of diagonal cut> The amount of oblique cutting was measured for Samples 1 to 12. The results of the amount of oblique cutting for Samples 1 to 12 are shown in Table 2. Fig. 21 is a graph showing the relationship between DX1 / DX2 and DY1 / DY2 and the amount of oblique cutting. The results for Samples 9 to 12 were calculated by simulation.

[0140] FIG. 22 is a schematic diagram for explaining an example of a method for measuring the amount of oblique cutting.

[0141] As shown in Fig. 22, the amount of oblique cutting I relative to the tip position P0 of the cutting blade is measured. In the example shown in Fig. 22, the tip position P0 of the cutting blade is located rearward relative to the cutting direction CD, but there are also cases where the tip position P0 of the cutting blade is located forward relative to the cutting direction CD.

[0142] [Table 2]

[0143] Table 1 and Figure 21 show that the amount of oblique cutting decreases by reducing DX1 / DX2 and DY1 / DY2. From these results, it is considered preferable that DX1 is greater than 0 and not greater than 1.75 times DX2. Similarly, it is considered preferable that DY1 is greater than 0 and not greater than 1.75 times DY2.

[0144] The present specification discloses the following:

[0145] <1> a mother block preparation step of preparing a mother block formed by stacking a plurality of ceramic green sheets, the mother block having a main surface formed by two sides parallel to the X-axis direction and two sides parallel to the Y-axis direction, of X-axis and Y-axis directions which are orthogonal to each other; an X-axis direction cutting step in which a cutting blade arranged along the X-axis direction is moved along a Z-axis direction perpendicular to the main surface of the mother block to cut through the mother block, thereby obtaining a plurality of green block bodies from the mother block; a Y-axis direction cutting step of moving the cutting blades arranged along the Y-axis direction along the Z-axis direction to cut through the plurality of green blocks, thereby obtaining a plurality of chips from the plurality of green blocks; the mother block includes a product portion in which the plurality of chips before cutting are arranged, and an outer peripheral portion surrounding the product portion; The cutting blade is an asymmetric blade having two cutting surfaces at the tip, the cutting surfaces having different cutting edge angles, The X-axis cutting process is an X-axis direction first cutting step of pushing through the mother block that has not been cut along the X-axis direction at a first cutting position in the X-axis direction that is located closer to the outer periphery than a boundary between the product portion and the outer periphery, with the blade surface of the cutting blade having a smaller cutting edge angle facing the product portion; an X-axis direction second cutting step of cutting the mother block after the X-axis direction first cutting step at a second cutting position in the X-axis direction, which is a boundary between the product portion and the outer periphery, by directing the blade surface of the cutting blade having the smaller cutting edge angle toward an opposite side to the X-axis direction first cutting position. and an X-axis direction third cutting step of cutting the mother block after the X-axis direction second cutting step at an X-axis direction third cutting position located closer to the product portion than the boundary between the product portion and the outer periphery, with the blade surface of the cutting blade having the smaller cutting edge angle facing away from the X-axis direction second cutting position, The above Y-axis cutting process is a Y-axis direction first cutting step of cutting through the plurality of green blocks that have not been cut along the Y-axis direction at a Y-axis direction first cutting position that is located closer to the outer periphery than the boundary between the product portion and the outer periphery, with the blade surface of the cutting blade having the smaller cutting edge angle facing the product portion; a Y-axis direction second cutting step of cutting through the plurality of green blocks after the Y-axis direction first cutting step at a Y-axis direction second cutting position, which is a boundary between the product portion and the outer periphery, by directing the blade surface of the cutting blade having the smaller cutting edge angle toward the side opposite to the Y-axis direction first cutting position. and a Y-axis direction third cutting step of cutting through the plurality of green blocks after the Y-axis direction second cutting step by directing the blade surface having the smaller cutting edge angle of the cutting blade toward the side opposite to the Y-axis direction second cutting position at a Y-axis direction third cutting position located closer to the product portion than the boundary between the product portion and the outer periphery. Manufacturing method for multilayer ceramic electronic components.

[0146] <2> a distance between the first cut position in the X-axis direction and the second cut position in the X-axis direction is greater than 0 times and less than or equal to 3.00 times a distance between the second cut position in the X-axis direction and the third cut position in the X-axis direction; <1> 10. A method for producing the multilayer ceramic electronic component according to claim 9.

[0147] <3> a distance between the first cut position in the X-axis direction and the second cut position in the X-axis direction is greater than 0 times and less than or equal to 2.00 times a distance between the second cut position in the X-axis direction and the third cut position in the X-axis direction; <1> 10. A method for producing the multilayer ceramic electronic component according to claim 9.

[0148] <4> a distance between the first cut position in the X-axis direction and the second cut position in the X-axis direction is greater than 0 times and less than or equal to 1.75 times a distance between the second cut position in the X-axis direction and the third cut position in the X-axis direction; <1> 10. A method for producing the multilayer ceramic electronic component according to claim 9.

[0149] <5> a distance between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction is greater than 0 and less than or equal to 3.00 times a distance between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction; <1> ~ <4> 10. A method for producing a multilayer ceramic electronic component according to any one of claims 1 to 9.

[0150] <6> a distance between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction is greater than 0 times and less than or equal to 2.00 times a distance between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction; <1> ~ <4> 10. A method for producing a multilayer ceramic electronic component according to any one of claims 1 to 9.

[0151] <7> a distance between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction is greater than 0 times and less than or equal to 1.75 times a distance between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction; <1> ~ <4> 10. A method for producing a multilayer ceramic electronic component according to any one of claims 1 to 9.

[0152] <8> The chip has a rectangular parallelepiped shape in which the length direction dimension is greater than the width direction dimension and the thickness direction dimension, The length direction of the tip is parallel to the Z-axis direction in which the cutting blade operates. <1> ~ <7> 10. A method for producing a multilayer ceramic electronic component according to any one of claims 1 to 9.

[0153] <9> The X-axis direction cutting step and the Y-axis direction cutting step are performed in this order. <1> ~ <8> 10. A method for producing a multilayer ceramic electronic component according to any one of claims 1 to 9.

[0154] <10> The first cutting step in the Y-axis direction is performed immediately after the first cutting step in the X-axis direction. <1> ~ <8> 10. A method for producing a multilayer ceramic electronic component according to any one of claims 1 to 9. [Explanation of symbols]

[0155] 1. Multilayer inductors (multilayer ceramic electronic components) 10 Laminate 11 first main surface 12 Second main surface 13 Third principal surface 14 Fourth main surface 15 Fifth Plane 16 Sixth main surface 21, 22 External electrode 30 coils 31 Insulating layer 32 Coil conductor layer 33 Via conductor 41, 42 Lead conductor 100 Mother Block 110 Green Block Letters 120 chips (unfired laminate) 131 Ceramic green sheet 132 Conductor pattern for coil conductor layer 133 Conductor pattern for via conductor 141, 142 Conductor pattern for lead-out conductor 150, 150a cutting blade 200 tables 210 Adhesive Sheet 211 Base film 212 Adhesive layer 300 Crack CD Cut Direction CLX X-axis direction cut line CLY Y-axis cut line d1, d2 Diagonal cut direction DX1 Distance between the first cut position in the X-axis direction and the second cut position in the X-axis direction DX2 Distance between the second cut position in the X-axis direction and the third cut position in the X-axis direction DY1 Distance between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction DY2 Distance between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction I Diagonal cut amount P0 cutting blade tip position PX1 First cutting position in the X-axis direction PX2 Second cutting position in the X-axis direction PX3 Third cut position in the X-axis direction R OUT outer periphery R PRO Product department S B , S B0 , S F , S F0 Displacement α, α0, β, β0 cutting edge angle L lengthwise T thickness direction W width direction

Claims

1. a mother block preparation step of preparing a mother block formed by stacking a plurality of ceramic green sheets, the mother block having a main surface formed by two sides parallel to the X-axis direction and two sides parallel to the Y-axis direction, of X-axis and Y-axis directions which are orthogonal to each other; an X-axis direction cutting step in which a cutting blade arranged along the X-axis direction is moved along a Z-axis direction perpendicular to the main surface of the mother block to cut through the mother block, thereby obtaining a plurality of green block bodies from the mother block; a Y-axis direction cutting step of moving the cutting blades arranged along the Y-axis direction along the Z-axis direction to cut through the plurality of green blocks, thereby obtaining a plurality of chips from the plurality of green blocks; the mother block includes a product portion in which the plurality of chips before cutting are arranged, and an outer peripheral portion surrounding the product portion, the cutting blade is an asymmetric blade having two cutting surfaces at a tip end, the cutting surfaces having different cutting edge angles; The X-axis direction cutting step a first X-axis cutting step of cutting the mother block that has not been cut along the X-axis direction, by pushing the mother block through at a first X-axis cutting position that is located closer to the outer periphery than a boundary between the product portion and the outer periphery, with the blade surface of the cutting blade having a smaller cutting edge angle facing the product portion; a second X-axis cutting step of cutting the mother block after the first X-axis cutting step, by directing the blade surface having the smaller cutting edge angle of the cutting blade toward an opposite side to the first X-axis cutting position at a second X-axis cutting position that is a boundary between the product portion and the outer periphery. and a third X-axis cutting step of cutting the mother block after the second X-axis cutting step, at a third X-axis cutting position located closer to the product portion than the boundary between the product portion and the outer periphery, by directing the blade surface of the cutting blade having the smaller cutting edge angle toward the side opposite to the second X-axis cutting position, The Y-axis direction cutting step a Y-axis direction first cutting step of cutting through the plurality of green blocks that have not been cut along the Y-axis direction at a Y-axis direction first cutting position that is located closer to the outer periphery than the boundary between the product portion and the outer periphery, with the blade surface of the cutting blade having the smaller cutting edge angle facing the product portion; a Y-axis direction second cutting step of cutting through the plurality of green blocks after the Y-axis direction first cutting step at a Y-axis direction second cutting position, which is a boundary between the product portion and the outer periphery, by directing the blade surface having the smaller cutting edge angle of the cutting blade toward an opposite side to the Y-axis direction first cutting position. and a third Y-axis cutting step of cutting through the plurality of green blocks after the second Y-axis cutting step by orienting the blade surface of the cutting blade having the smaller cutting edge angle opposite to the second Y-axis cutting position at a third Y-axis cutting position located closer to the product portion than the boundary between the product portion and the outer periphery. Manufacturing method for multilayer ceramic electronic components.

2. 2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein a distance between the first cut position in the X-axis direction and the second cut position in the X-axis direction is greater than 0 times and less than or equal to 3.00 times a distance between the second cut position in the X-axis direction and the third cut position in the X-axis direction.

3. 2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein a distance between the first cut position in the X-axis direction and the second cut position in the X-axis direction is greater than 0 times and less than or equal to 2.00 times a distance between the second cut position in the X-axis direction and the third cut position in the X-axis direction.

4. 2. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein a distance between the first cut position in the X-axis direction and the second cut position in the X-axis direction is greater than 0 times and less than or equal to 1.75 times a distance between the second cut position in the X-axis direction and the third cut position in the X-axis direction.

5. 5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the distance between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction is greater than 0 times and less than or equal to 3.00 times the distance between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction.

6. 5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the distance between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction is greater than 0 times and less than or equal to 2.00 times the distance between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction.

7. 5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the distance between the first cut position in the Y-axis direction and the second cut position in the Y-axis direction is greater than 0 times and less than or equal to 1.75 times the distance between the second cut position in the Y-axis direction and the third cut position in the Y-axis direction.

8. The chip has a rectangular parallelepiped shape in which the length direction dimension is greater than the width direction dimension and the thickness direction dimension, 5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the length direction of the chip is parallel to the Z-axis direction in which the cutting blade operates.

9. 5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the X-axis direction cutting step and the Y-axis direction cutting step are performed in this order.

10. 5. The method for manufacturing a multilayer ceramic electronic component according to claim 1, wherein the first cutting step in the Y-axis direction is performed immediately after the first cutting step in the X-axis direction.

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