Multilayer ceramic electronic component, and method of manufacturing multilayer ceramic electronic component
The multilayer ceramic electronic component addresses the issue of bending cracks in miniaturized components by employing a laminated structure with controlled pore ratios and densities, ensuring the capacitance section remains intact.
JP2025153974APending Publication Date: 2025-10-10TAIYO YUDEN KK
Patent Information
- Application Number
- JP2024056719
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Filing Date
- 2024-03-29
- Publication Date
- 2025-10-10
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Figure 2025153974000001_ABST
Abstract
To provide a multilayer ceramic electronic component which suppresses a structure defect upon a capacitance part and secures the capacitance part.SOLUTION: In a multilayer ceramic capacitor 100, a lamination part 20 comprises: a capacitance formation part 40 in which internal electrodes 12 and 13 are laminated in a Z axis direction via a first ceramic layer 11; a pair of internal electrode lead-out regions 50 which is disposed between a pair of cover parts 30, in which the first ceramic layer, the internal electrodes and a second ceramic layer 14 are laminated in the Z axis direction and which is opposed in a Y axis direction while holding the capacitance formation part therebetween; and a pair of margin regions which is disposed between the pair of cover parts and opposed in an X axis direction that is orthogonal to the Z axis direction and the Y axis direction while holding the capacitance formation part and the internal electrode lead-out regions therebetween. In the cover parts, a porosity in a central region 30A adjacent to the capacitance formation part is less than 2.0%, and a porosity in a peripheral edge region 30B enclosing the central region, both a porosity in the internal electrode lead-out regions and a porosity in the margin regions are 2.0% or more.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
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