Wiring body, and display device

Abstract

To provide a wiring body and a display device capable of reducing sheet resistance, while improving the flatness of the wiring body.SOLUTION: According to a wiring body 200, a mesh-like conductor layer 5 provided on a light-transmissive substrate 1 is covered with a multilayer resin layer 9 composed of a first resin layer 7 and a second resin layer 8. As a result, any unevenness that may occur on the surface of the wiring body 200 due to the conductor layer 5 can be absorbed by the resin layer 9. Therefore, the flatness of the surface of the wiring body 200 can be improved. In the embodiment, an upper surface 8a of the second resin layer 8 constitutes the surface of the wiring body 200. Furthermore, the conductor layer 5 penetrates the first resin layer 7 on the light-transmissive substrate 1 side. As a result, it is possible to ensure the volume of the conductor while suppressing the thickness of conductor lines 50 of the conductor layer 5. Therefore, the sheet resistance of the wiring body 200 can be reduced. Thus, the flatness of the wiring body 200 can be improved while reducing the sheet resistance.SELECTED DRAWING: Figure 6

Description

[Technical Field]

[0001] The present disclosure relates to a wiring body and a display device. [Background technology]

[0002] Conventionally, a wiring body has been known that includes a substrate, a mesh-shaped conductor pattern provided on the substrate, and a resin layer provided on the substrate (for example, Patent Document 1). A trench is formed in the resin layer, and a conductive line of the conductor pattern is formed in the trench. The lower surface of the conductive line is located at a position separated from the main surface of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent Publication No. 2021-163571 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-described wiring body, since the conductive wires are exposed on the surface of the resin layer, it is required to improve the flatness of the surface of the wiring body, and it is also required to reduce the sheet resistance of the conductor layer of the wiring body.

[0005] Therefore, an object of the present disclosure is to provide a wiring body and a display device that can reduce the sheet resistance while improving the flatness of the wiring body. [Means for solving the problem]

[0006] A wiring body according to one aspect of the present disclosure comprises a substrate, a mesh-shaped conductor layer provided on the substrate, and a resin layer covering the conductor layer, the resin layer having, in order from the substrate side, a first resin layer and a second resin layer, and the conductor layer penetrates the first resin layer.

[0007] A display device according to one aspect of the present disclosure includes the wiring body described above. [Effects of the Invention]

[0008] According to one aspect of the present disclosure, it is possible to provide a wiring body and a display device that can reduce sheet resistance while improving the flatness of the wiring body. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view illustrating an embodiment of a conductive film including a wiring body. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] FIG. 10 is a cross-sectional view showing a conductive film according to a modified example. [Figure 4] 1 is a cross-sectional view showing an embodiment of a display device. [Figure 5] FIG. 2 is a plan view of an antenna including a wiring body. [Figure 6] FIG. [Figure 7] FIG. 7 is an enlarged cross-sectional view showing the structure in the vicinity of the conductive line shown in FIG. [Figure 8] FIG. 1 is a diagram for explaining how to derive formula (1). [Figure 9] 1 is a graph for explaining how to derive equation (1). DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, several embodiments of the present disclosure will be described in detail, but the present disclosure is not limited to the following embodiments.

[0011] FIG. 1 is a plan view showing a conductive film including a wiring body 200 according to an embodiment of the present disclosure, and FIG. 2 is a cross-sectional view taken along line II-II in FIG. 1 . The conductive film 20 includes an antenna 300, and the antenna 300 includes the wiring body 200. The conductive film 20 shown in FIGS. 1 and 2 includes a film-like light-transmitting substrate 1 (substrate), a conductor layer 5 provided on one main surface 1S of the light-transmitting substrate 1, and a resin layer 9 covering the conductor layer 5. The conductor layer 5 includes a conductor portion 3 that extends in a direction along the main surface 1S of the light-transmitting substrate 1 and includes a portion having a pattern including a plurality of openings 3a. The resin layer 9 includes, in order from the light-transmitting substrate 1 side, a first resin layer 7 and a second resin layer 8. The first resin layer 7 is provided on one main surface 1S of the light-transmitting substrate 1. The first resin layer 7 has an insulating resin portion 7A that fills the opening 3a of the conductor portion 3, and a light-transmitting resin layer 7B that is provided on the outer periphery of the conductor portion 3. The second resin layer 8 is provided so as to cover the first resin layer and the conductor layer 5. In FIG. 2, the conductor layer 5 is shown in a deformed state, with the width of the conductor portion 3 emphasized. The thickness of each layer is also shown in a deformed state. Details of the thickness of each layer will be described later. In the example shown in FIG. 1, the conductor layer 5 is formed near one short side of the conductive film 20, but the position where the conductor layer 5 is formed is not particularly limited, and the conductor layer 5 may be formed near the long side.

[0012] The light-transmitting substrate 1 has a degree of light transparency required when the conductive film 20 is incorporated into a display device. Specifically, the total light transmittance of the light-transmitting substrate 1 may be 90 to 100%. The haze of the light-transmitting substrate 1 may be 0 to 5%.

[0013] The light-transmitting substrate 1 may be, for example, a transparent resin film, examples of which include films of polyethylene terephthalate (PET), polycarbonate (PC), polyethylene naphthalate (PEN), cycloolefin polymer (COP), or polyimide (PI). Alternatively, the light-transmitting substrate 1 may be a glass substrate.

[0014] For example, as shown in FIG. 3 , the light-transmitting substrate 1 may be a laminate having a light-transmitting support film 11, and an intermediate resin layer 12 and an underlayer 13 provided in this order on the support film 11. The support film 11 may be the transparent resin film described above. The underlayer 13 is a layer provided for forming the conductor portion 3 by electroless plating or the like. When the conductor portion 3 is formed by another method, the underlayer 13 does not necessarily have to be provided. The intermediate resin layer 12 does not have to be provided between the support film 11 and the underlayer 13.

[0015] The thickness of the light-transmitting substrate 1 or the support film 11 constituting it may be 10 μm or more, 20 μm or more, or 35 μm or more, and may be 500 μm or less, 200 μm or less, or 100 μm or less.

[0016] The intermediate resin layer 12 can improve the adhesion between the support film 11 and the underlayer 13. If the underlayer 13 is not provided, the intermediate resin layer 12 can be provided between the support film 11 and the light-transmitting resin layer 7B to improve the adhesion between the support film 11 and the light-transmitting resin layer 7B.

[0017] The intermediate resin layer 12 may be a layer containing a resin and an inorganic filler. An example of the resin constituting the intermediate resin layer 12 is an acrylic resin. An example of the inorganic filler is silica.

[0018] The thickness of the intermediate resin layer 12 may be, for example, 5 nm or more, 100 nm or more, or 200 nm or more, and may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0019] The underlayer 13 may be a layer containing a catalyst and a resin. The resin may be a cured product of a curable resin composition. Examples of the curable resin contained in the curable resin composition include acrylic resins, amino resins, cyanate resins, isocyanate resins, polyimide resins, epoxy resins, oxetane resins, polyesters, allyl resins, phenolic resins, benzoxazine resins, xylene resins, ketone resins, furan resins, COPNA resins, silicone resins, dicyclopentadiene resins, benzocyclobutene resins, episulfide resins, ene-thiol resins, polyazomethine resins, polyvinylbenzyl ether compounds, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo polymerization under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0020] The catalyst contained in the underlayer 13 may be an electroless plating catalyst. The electroless plating catalyst may be a metal selected from Pd, Cu, Ni, Co, Au, Ag, Pd, Rh, Pt, In, and Sn, or may be Pd. The catalyst may be one type alone or a combination of two or more types. Typically, the catalyst is dispersed in the resin as catalyst particles.

[0021] The catalyst content in the underlayer 13 may be 3 mass% or more, 4 mass% or more, or 5 mass% or more, based on the total amount of the underlayer 13, and may be 50 mass% or less, 40 mass% or less, or 25 mass% or less.

[0022] The thickness of the underlayer 13 may be 10 nm or more, 20 nm or more, or 30 nm or more, and may be 500 nm or less, 300 nm or less, or 150 nm or less.

[0023] The light-transmitting substrate 1 may further have a protective layer provided on the main surface of the support film 11 opposite to the light-transmitting resin layer 7B and the conductor portion 3. By providing the protective layer, scratches on the support film 11 are suppressed. The protective layer may be the same layer as the intermediate resin layer 12. The thickness of the protective layer may be 5 nm or more, 50 nm or more, or 500 nm or more, or may be 10 μm or less, 5 μm or less, or 2 μm or less.

[0024] The conductor portion 3 constituting the conductor layer 5 includes a portion having a pattern including openings 3a. The pattern including openings 3a is a mesh-like pattern including a plurality of regularly arranged openings 3a formed by a plurality of linear portions intersecting each other. The conductor portion 3 having a mesh-like pattern can function well as, for example, a radiation conductor and a feed line of the antenna 300. The conductor portion 3 may also have a planar pattern without openings 3a that functions as a terminal and a ground pad portion. Details of the pattern configuration of the conductor portion 3 in the conductor layer 5 will be described later.

[0025] The conductor portion 3 may contain a metal. The conductor portion 3 may contain at least one metal selected from copper, nickel, cobalt, palladium, silver, gold, platinum, and tin, or may contain copper. The conductor portion 3 may be a metal plating formed by a plating method. The conductor portion 3 may further contain a non-metallic element such as phosphorus, as long as appropriate conductivity is maintained.

[0026] The conductor part 3 may be a laminate composed of multiple layers. The conductor part 3 may also have a blackened layer as a surface layer on the side opposite to the light-transmitting substrate 1. The blackened layer can contribute to improving the visibility of a display device incorporating the conductive film.

[0027] The insulating resin portion 7A is made of a resin having optical transparency, and is provided so as to fill the opening 3a of the conductor portion 3.

[0028] The light-transmitting resin layer 7B is formed of a resin having light transparency. The light-transmitting resin layer 7B may have a total light transmittance of 90 to 100%. The light-transmitting resin layer 7B may have a haze of 0 to 5%.

[0029] The difference between the refractive index of the light-transmitting substrate 1 (or the refractive index of the support film constituting the light-transmitting substrate 1) and the refractive index of the light-transmitting resin layer 7B may be 0.1 or less. This makes it easier to ensure good visibility of the displayed image. The refractive index (nd25) of the light-transmitting resin layer 7B may be, for example, 1.0 or more, or 1.7 or less, 1.6 or less, or 1.5 or less. The refractive index can be measured using a reflectance spectroscopic film thickness meter. From the viewpoint of uniformity of the optical path length, the conductor portion 3, the insulating resin portion 7A, and the light-transmitting resin layer 7B may have substantially the same thickness.

[0030] The resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B may be a cured product of a curable resin composition (a photocurable resin composition or a thermosetting resin composition). The curable resin composition forming the insulating resin portion 7A and / or the light-transmitting resin layer 7B includes a curable resin, examples of which include acrylic resin, amino resin, cyanate resin, isocyanate resin, polyimide resin, epoxy resin, oxetane resin, polyester, allyl resin, phenol resin, benzoxazine resin, xylene resin, ketone resin, furan resin, COPNA resin, silicon resin, dicyclopentadiene resin, benzocyclobutene resin, episulfide resin, ene-thiol resin, polyazomethine resin, polyvinylbenzyl ether compound, acenaphthylene, and ultraviolet-curable resins containing functional groups that undergo a polymerization reaction under ultraviolet light, such as unsaturated double bonds, cyclic ethers, and vinyl ethers.

[0031] The resin forming the insulating resin portion 7A and the resin forming the light-transmitting resin layer 7B may be the same. Since the insulating resin portion 7A and the light-transmitting resin layer 7B formed from the same resin have the same refractive index, the uniformity of the path length of light passing through the conductive film 20 can be further improved. When the resin forming the insulating resin portion 7A and the light-transmitting resin layer 7B are the same, the insulating resin portion 7A and the light-transmitting resin layer 7B can be easily formed collectively, for example, by forming a pattern from a single curable resin layer using an imprinting method or the like.

[0032] The resin forming the second resin layer 8 may be selected from the materials listed as the materials for the insulating resin portion 7A and the light-transmitting resin layer 7B of the first resin layer 7. The optical properties, such as light transmittance and refractive index, of the second resin layer 8 may be in the same ranges as those listed as examples for the light-transmitting resin layer 7B. The first resin layer 7 and the second resin layer 8 may be made of the same resin material. However, the first resin layer 7 and the second resin layer 8 may be made of different resin materials.

[0033] The conductive film 20 can be manufactured by a method including pattern formation using, for example, an imprinting method. One example of a method for manufacturing the conductive film 20 includes preparing a light-transmitting substrate 1 having a support film and, on one main surface of the support film, an intermediate resin layer and a catalyst-containing underlayer; forming a curable resin layer on the main surface 1S of the light-transmitting substrate 1 facing the underlayer; forming trenches exposing the underlayer by an imprinting method using a mold with protrusions; forming conductor portions 3 filling the trenches by an electroless plating method in which a metal plating grows from the underlayer; and forming a second resin layer 8 to cover the first resin layer 7 and the conductor layer 5. By curing the curable resin layer with the mold pressed into it, an insulating resin portion 7A having a pattern including openings with the inverse shape of the mold's protrusions and a light-transmitting resin layer 7B are simultaneously formed. The method for forming the insulating resin portion 7A having a pattern including openings is not limited to the imprinting method; any method, such as photolithography, can be used.

[0034] The conductive film described above can be incorporated into a display device, for example, as a planar transparent antenna. The display device may be, for example, a liquid crystal display device or an organic electroluminescence (EL) display device. FIG. 4 is a cross-sectional view showing an embodiment of a display device incorporating a conductive film. The display device 100 shown in FIG. 4 includes an image display unit 10 having an image display area 10S, a conductive film 20, a polarizing plate 30, and a cover glass 40. The conductive film 20, the polarizing plate 30, and the cover glass 40 are stacked in this order from the image display unit 10 side on the image display area 10S side of the image display unit 10. The configuration of the display device is not limited to the configuration shown in FIG. 4 and can be appropriately modified as needed. For example, the polarizing plate 30 may be provided between the image display unit 10 and the conductive film 20. The image display unit 10 may be, for example, a liquid crystal display unit. The polarizing plate 30 and the cover glass 40 may be those commonly used in display devices. The polarizing plate 30 and the cover glass 40 are not necessarily provided. Light for image display emitted from the image display region 10S of the image display unit 10 passes through a path with a highly uniform optical path length that includes the conductive film 20. This enables a good image display with a high degree of uniformity and suppressed moire.

[0035] Next, the conductor layer 5 and its surrounding structure will be described in more detail with reference to FIG. 5. FIG. 5 is a plan view of an antenna 300 including a wiring body 200. FIG. 5 also shows an enlarged view of a portion of the conductor layer 5. In the following description, XY coordinates are defined relative to a plane parallel to the main surface 1S. The Y-axis direction is a direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to a direction perpendicular to the sides of the conductive film 20. The central side of the conductive film 20 is defined as the positive side in the Y-axis direction, and the outer periphery of the conductive film 20 is defined as the negative side in the Y-axis direction. The X-axis direction is a direction perpendicular to the Y-axis direction along the main surface 1S, and in the example shown in FIG. 1, corresponds to the direction in which the sides of the conductive film 20 extend. One side of the conductive film 20 along which the sides extend is defined as the positive side in the X-axis direction, and the other side is defined as the negative side in the X-axis direction. The direction perpendicular to the X-axis direction and the Y-axis direction is defined as the Z-axis direction. The side of the light-transmitting substrate 1 on which the resin layer 9 is provided is defined as the positive side in the Z-axis direction.

[0036] As shown in FIG. 5 , the mesh pattern of the conductor layer 5 includes a plurality of first conductive wires 51 and a plurality of second conductive wires 52. The first conductive wires 51 are linear conductor portions 3 extending parallel to the Y-axis direction. The plurality of first conductive wires 51 are arranged spaced apart from one another in the X-axis direction. The plurality of first conductive wires 51 are arranged spaced apart at an equal pitch. The second conductive wires 52 are linear conductor portions 3 extending parallel to the X-axis direction. The plurality of second conductive wires 52 are arranged spaced apart from one another in the Y-axis direction. The plurality of second conductive wires 52 are arranged spaced apart at an equal pitch. The thickness of the conductive wires 51, 52 is not particularly limited, but may be set to, for example, 1 to 3 μm. The pitch of the conductive wires 51, 52 is also not particularly limited, but may be set to, for example, 100 to 300 μm. Note that the first conductive wire 51 does not have to be parallel to the Y-axis direction as long as it extends in the Y-axis direction, and the second conductive wire 52 does not have to be parallel to the X-axis direction as long as it extends in the X-axis direction. When the conductive wires 51 and 52 are not to be distinguished from each other, they may be referred to as conductive wire 50. Note that in FIG. 5, the conductive wires 51 and 52 are shown with hidden lines because they are shown through the second resin layer 8.

[0037] The conductor layer 5 has a radiating element portion 5A and a power feeding portion 5B. The radiating element portion 5A is a region that radiates a signal as an antenna. The radiating element portion 5A has a rectangular shape with two sides parallel to the Y-axis direction and two sides parallel to the X-axis direction. The power feeding portion 5B is a region that feeds power to the radiating element portion 5A. The power feeding portion 5B has a strip shape that extends parallel to the Y-axis direction. The power feeding portion 5B is connected to the negative side of the radiating element portion 5A in the Y-axis direction. The power feeding portion 5B is connected to a terminal not shown.

[0038] Next, the configurations of the resin layer 9 and the conductor layer 5 will be described in more detail with reference to FIG. 6 in addition to FIG. 5 . FIG. 6 is a cross-sectional view of the wiring body 200. Note that, although the terms "upper" and "lower" are used in the following description, this does not limit the orientation of the wiring body 200 during use. The positive side in the Z-axis direction may be referred to as "upper" and the negative side as "lower." As described above, as shown in FIG. 6 , the first resin layer 7 is provided on the light-transmitting substrate 1. The first resin layer 7 is provided so as to cover the main surface 1S on the positive side in the Z-axis direction of the light-transmitting substrate 1. The first resin layer 7 has an upper surface 7a on the positive side in the Z-axis direction and a lower surface 7b on the negative side. The lower surface 7b on the negative side is provided so as to contact the main surface 1S of the light-transmitting substrate 1.

[0039] The first resin layer 7 has mesh-shaped trenches 60 formed therein, penetrating the first resin layer 7 in the Z-axis direction (thickness direction). The mesh-shaped trenches 60 extend from the upper surface 7a on the positive side in the Z-axis direction of the first resin layer 7 to the lower surface 7b on the negative side. The conductive wires 50 of the conductor layer 5 are disposed in the mesh-shaped trenches 60. As shown in FIG. 5 , the mesh-shaped trench 60 has first trenches 61 in which the first conductive wires 51 are disposed and second trenches 62 in which the second conductive wires 52 are disposed. The first trenches 61 are disposed at a pitch and width corresponding to the first conductive wires 51 described above. The second trenches 62 are disposed at a pitch and width corresponding to the second conductive wires 52 described above. That is, the first trenches 61 are linear trenches extending parallel to the Y-axis direction. The first trenches 61 are disposed so as to be spaced apart from each other in the X-axis direction. The multiple first trenches 61 are arranged so as to be spaced apart at an equal pitch. The second trenches 62 are linear trenches extending parallel to the X-axis direction. The multiple second trenches 62 are arranged so as to be spaced apart from each other in the Y-axis direction. The multiple second trenches 62 are arranged so as to be spaced apart at an equal pitch.

[0040] With this configuration, the conductor layer 5 penetrates the first resin layer 7. That is, the conductive wire 50 extends from the upper surface 7a on the positive side of the first resin layer 7 to the lower surface 7b on the negative side. The upper surface 50a of the conductive wire 50 extends to the same position as the upper surface 7a of the first resin layer 7 or to a position near the upper surface 7a. The lower surface 50b of the conductive wire 50 contacts the main surface 1S of the light-transmitting substrate 1 (see also FIG. 7). Note that the state in which the conductor layer 5 penetrates the first resin layer 7 refers to a state in which the conductive wire 50 is disposed in the trench 60 of the first resin layer 7 and thus reaches the main surface 1S of the light-transmitting substrate 1. Therefore, the upper surface 50a of the conductive wire 50 does not have to reach the upper surface 7a of the first resin layer 7, and may be disposed on the negative side of the upper surface 7a in the Z-axis direction.

[0041] The second resin layer 8 is provided on the first resin layer 7 and the conductor layer 5. The lower surface 8b of the second resin layer 8 is disposed so as to be in contact with the upper surface 7a of the first resin layer 7 and the upper surface 50a of the conductive wire 50. In this case, the upper surface 8a of the second resin layer 8 is the uppermost surface of the wiring body 200. As shown in FIG. 5 , the second resin layer 8 covers not only the entire radiating element portion 5A and the power supply portion 5B of the conductor layer 5, but also the light-transmitting resin layer 7B in the region outside the radiating element portion 5A and the power supply portion 5B. Note that, if a terminal connected to the power supply portion 5B is formed on the wiring body 200, the terminal is not covered by the second resin layer 8. In this case, the region on the side connected to the terminal of the power supply portion 5B is also not covered by the second resin layer 8. Furthermore, on the side connected to the terminal of the power supply portion 5B, the region not covered by the second resin layer 8 may be approximately half of the power supply portion 5B in the Y-axis direction.

[0042] Next, referring to FIG. 7, the structure of the conductive wire 50 will be described in more detail. FIG. 7 is an enlarged cross-sectional view showing the structure near the conductive wire 50 shown in FIG. 6. In FIG. 7, a cross section of a first conductive wire 51 extending in the Y-axis direction is illustrated as the conductive wire 50, but a second conductive wire 52 extending in the X-axis direction and its surroundings have a similar structure. As shown in FIG. 7, the conductive wire 50 has side surfaces 56A and 56B facing each other in the width direction (here, the X-axis direction). The side surface 56A is located on one side in the width direction (the negative side in the X-axis direction), and the side surface 56B is located on the other side in the width direction (the positive side in the X-axis direction). As shown in the figure, the upper surface 50a of the conductive wire 50 may be curved so as to protrude upward. The trench 60 has inner surfaces 60a and 60b facing each other in the width direction. The side surfaces 56A and 56B of the conductive wire 50 are in surface contact with the inner surfaces 60a and 60b of the trench 60.

[0043] The width (dimension in the X-axis direction) of the conductive wire 50 may increase toward one side in the height direction (the positive side in the Z-axis direction). That is, the width dimension W2 of the upper surface 50a of the conductive wire 50 is greater than the width dimension W1 of the lower surface 50b. The side surfaces 56A, 56B are tapered so that the distance between them in the X-axis direction increases toward one side in the height direction (the positive side in the Z-axis direction). The width of the tapered conductive wire 50 is defined as the maximum width of the conductive wire 50. The height H1 of the conductive wire 50 and the thickness T1 (dimension in the height direction) of the first resin layer 7 may be 1.5 to 5.0 μm. In this embodiment, the height H1 (dimension in the height direction) of the conductive wire 50 is greater than the width (dimension in the X-axis direction). The aspect ratio (height / width) of the conductive wire 50, obtained by dividing the height H1 by the width, is greater than 1. The aspect ratio may be 2 or greater. The width W2 of the upper surface 50a of the conductive wire 50 may be 110 to 200% larger than the width W1 of the lower surface 50b.

[0044] The first resin layer 7 has raised portions 66A and 66B that protrude from both sides of the trench 60 toward one side in the height direction (the positive side in the Z-axis direction) from the upper surface 7a of the first resin layer 7. The raised portions 66A and 66B are raised portions of the first resin layer 7 near the corners between the side surfaces 56A and 56B and the upper surface 50a so as to be higher toward one side in the height direction than the upper surface 7a of the first resin layer 7. The height relationship between the apex of the curved surface of the upper surface 50a of the conductive wire 50 and the upper ends of the upper surface 7a of the first resin layer 7 and the raised portions 66A and 66B is not particularly limited. The raised portions 66A and 66B partially cover both ends in the width direction of the upper surface 50a of the conductive wire 50 with the inner peripheral edge 66a.

[0045] With the above-described configuration, the first resin layer 7 covers the side surfaces 56A, 56B and a portion of the top surface 50a of the conductive wires 50 constituting the conductor layer 5. Furthermore, the second resin layer 8 covers the first resin layer 7 and another portion of the top surface 50a of the conductive wires 50. The other portion of the top surface 50a is a portion near the center of the top surface 50a in the width direction that is exposed from the protrusions 66A, 66B of the first resin layer 7. The area of ​​the portion of the top surface 50a covered by the first resin layer 7 is smaller than the area of ​​the portion exposed from the first resin layer 7. Therefore, the area of ​​the top surface 50a of the conductive wires 50 that the second resin layer 8 covers is larger than the area of ​​the top surface 50a that the first resin layer 7 covers. If the entire area of ​​the top surface 50a is taken as 100%, the second resin layer 8 may cover a range of 0 to 80% of the top surface 50a.

[0046] Next, the thickness of the second resin layer 8 will be described. When the thickness of the second resin layer 8 is X and the resin refractive index of the resin layer 9 (here, the resin refractive index of the second resin layer 8) is Y, the formula (1) may be satisfied. The right-hand side of the formula (1) is the lower limit of the thickness X at which the visibility of the conductive wires 50 does not change when viewed from the top surface 8a side of the second resin layer 8. In other words, even if the thickness X of the second resin layer 8 is made larger than the right-hand side of the formula (1), the visibility does not improve, and the thickness simply increases. Therefore, the thickness X may be set within a range that satisfies the condition of the formula (1). The lower limit of the thickness X of the second resin layer 8 is not particularly limited, but the thickness X may be 0.5 μm or more. X≦-5.43 × Y+11.664 …(1)

[0047] The above-mentioned formula (1) will be further explained. As shown in FIG. 8(a), the line of sight when the conductive wire 50 is viewed at a 45° angle for a model without the second resin layer 8 will be explained. Here, the thickness of the first resin layer 7 (height of the conductive wire 50) is 3 μm, and the refractive index of the first resin layer 7 is 1.5. As shown in FIG. 8(a), a position P1 on the lower surface 50b of the conductive wire 50 is viewed from a viewpoint VP at a 45° angle. In this case, the angle of incidence θ1 of light from the position P1 on the lower surface 50b to the viewpoint VP is 28°, based on the relationship between the angle of incidence θ1 and the angle of refraction θ2 shown in FIG. 9(a). Based on the geometric relationship shown in FIG. 8(a), a virtual image of the position P1 on the lower surface 50b is seen at the position P2 from the viewpoint VP. Since position P1 on the lower surface 50b is the lowest position of the conductive wire 50, the range VE visible from viewpoint VP is approximately 1.6 μm, which is the range from the upper surface 50a of the conductive wire 50 to position P2. As shown in FIG. 8(b), when the second resin layer 8 is provided, position P2 of the virtual image at position P1 on the lower surface 50b is positioned higher than position P2 in FIG. 8(a). As the thickness of the second resin layer 8 is increased, when position P2 reaches the upper surface 50a of the conductive wire 50, the conductive wire 50 becomes invisible from viewpoint VP. At this time, the thickness of the second resin layer 8 is approximately 3.4 μm. Further increase in the thickness of the second resin layer 8 does not change the visibility from viewpoint VP. Thus, the relationship between the thickness of the second resin layer 8 and the refractive index when there is no change in visibility is plotted in FIG. 9(b). An approximation line NL is set for the plotted points. The approximate line NL was "y=-5.43x+11.664." Based on the approximate line NL, the formula (1) for the thickness of the second resin layer 8 was determined.

[0048] Next, the functions and effects of the wiring body 200 and the display device 100 according to this embodiment will be described.

[0049] The wiring body 200 of this embodiment comprises a light-transmitting substrate 1 (substrate), a mesh-shaped conductor layer 5 provided on the light-transmitting substrate 1, and a resin layer 9 covering the conductor layer 5, and the resin layer 9 has, in order from the light-transmitting substrate 1 side, a first resin layer 7 and a second resin layer 8, and the conductor layer 5 penetrates the first resin layer 7.

[0050] According to this wiring body 200, the mesh-shaped conductor layer 5 provided on the light-transmitting substrate 1 is covered with a multi-layer resin layer 9 made up of a first resin layer 7 and a second resin layer 8. Therefore, steps that may occur on the surface of the wiring body 200 due to the conductor layer 5 can be absorbed by the resin layer 9. This improves the flatness of the surface of the wiring body 200. In the embodiment, the upper surface 8a of the second resin layer 8 forms the surface of the wiring body 200. Furthermore, the conductor layer 5 penetrates the first resin layer 7 on the light-transmitting substrate 1 side. This makes it possible to ensure the volume of the conductor while suppressing the line width of the conductive wires 50 of the conductor layer 5. This therefore makes it possible to reduce the sheet resistance of the wiring body 200. As described above, it is possible to improve the flatness of the wiring body 200 while reducing the sheet resistance.

[0051] The thickness of the second resin layer 8 may be thinner than the thickness of the first resin layer 7. In this case, by thinning the second resin layer 8, which contributes to planarization, it is possible to planarize the surface of the wiring body 200 while suppressing an increase in the thickness of the wiring body 200.

[0052] The first resin layer 7 and the second resin layer 8 may be made of the same resin material, which can reduce the effect on visibility of the conductor layer 5 that may occur when using multiple resin layers.

[0053] The aspect ratio, which is the height divided by the width, of the conductive lines 50 constituting the conductor layer 5 may be greater than 1. In this case, increasing the visibility of the conductor layer 5 by thinning the conductive lines 50 can be suppressed, and the volume of the conductor can be secured by ensuring the height of the conductive lines 50, thereby reducing the sheet resistance.

[0054] The first resin layer 7 may cover the side surfaces 56A, 56B and part of the top surface 50a of the conductive wires 50 constituting the conductor layer 5, and the second resin layer 8 may cover the first resin layer 7 and another part of the top surface 50a of the conductive wires 50. In this case, the first resin layer 7 covers the corners between the top surface 50a of the conductive wires 50 and the side surfaces 56A, 56B, and therefore the interfaces between the side surfaces 56A, 56B of the conductive wires 50 and the first resin layer 7 and the interface between the top surface 50a of the conductive wires 50 and the second resin layer 8 can be prevented from being continuous, thereby preventing peeling.

[0055] The area over which the second resin layer 8 covers the upper surface 50a of the conductive wire 50 may be larger than the area over which the first resin layer 7 covers the upper surface 50a of the conductive wire 50. In this case, the width of the second resin layer 8 can be ensured when filling the grooves (spaces formed by the raised portions 66A, 66B, and the upper surface 50a) formed on the upper surface 50a by the first resin layer 7. This ensures adhesion between the resin layers due to the anchor effect.

[0056] When the thickness of the second resin layer 8 is X and the resin refractive index of the resin layer 9 is Y, the formula (1) may be satisfied. In this case, the thickness of the second resin layer 8 is set within a range that can suppress the effect on the visibility of the conductor layer 5, while preventing the wiring body 200 from becoming larger than necessary. X≦-5.43 × Y+11.664 …(1)

[0057] A display device 100 according to one aspect of the present disclosure includes the wiring body 200 described above.

[0058] According to the display device 100 described above, the same functions and effects as those of the wiring body 200 described above can be obtained.

[0059] The present disclosure is not limited to the above-described embodiments.

[0060] For example, the shapes of the conductive wires 50 and the resin layer 9 are not limited to those shown in Fig. 7 and can be modified as appropriate without departing from the spirit of the present disclosure. The height dimensions of each part, the relationship between the width dimensions, and the relationship between the aspect ratios are also not limited to the above-described embodiment and can be modified as appropriate. For example, the raised portions 66A and 66B may not be formed, and the entire upper surface 50a may be in contact with the second resin layer 8.

[0061] [Form 1] A substrate; a mesh-shaped conductor layer provided on the substrate; a resin layer covering the conductor layer, The resin layer has, in order from the base material side, a first resin layer and a second resin layer, The conductor layer penetrates the first resin layer. [Form 2] 2. The wiring body according to claim 1, wherein the second resin layer is thinner than the first resin layer. [Form 3] 3. The wiring body according to embodiment 1 or 2, wherein the first resin layer and the second resin layer are made of the same resin material. [Form 4] 4. The wiring body according to any one of embodiments 1 to 3, wherein an aspect ratio obtained by dividing the height dimension by the width dimension of the conductive wires constituting the conductor layer is greater than 1. [Form 5] the first resin layer covers a side surface and a part of an upper surface of the conductive wire constituting the conductor layer, 5. The wiring body according to any one of embodiments 1 to 4, wherein the second resin layer covers the first resin layer and another part of the upper surface of the conductive wire. [Form 6] The wiring body according to embodiment 5, wherein the area of ​​the second resin layer covering the upper surface of the conductive wire is larger than the area of ​​the first resin layer covering the upper surface of the conductive wire. [Form 7] 7. The wiring body according to any one of embodiments 1 to 6, wherein when the thickness of the second resin layer is X and the resin refractive index of the resin layer is Y, formula (1) is satisfied. X≦-5.43 × Y+11.664 …(1) [Form 8] A display device comprising the wiring body according to any one of the first to seventh aspects. [Explanation of symbols]

[0062] 1...light-transmitting substrate (substrate), 5...conductor layer, 7...first resin layer, 8...second resin layer, 9...resin layer, 50...conductive wire, 100...display device, 200...wiring body.

Claims

1. A substrate; a mesh-shaped conductor layer provided on the substrate; a resin layer covering the conductor layer, The resin layer has, in order from the base material side, a first resin layer and a second resin layer, The conductor layer penetrates the first resin layer.

2. The wiring body according to claim 1 , wherein the second resin layer is thinner than the first resin layer.

3. The wiring body according to claim 1 , wherein the first resin layer and the second resin layer are made of the same resin material.

4. The wiring body according to claim 1 , wherein an aspect ratio obtained by dividing a height dimension of the conductive wire constituting the conductor layer by a width dimension thereof is greater than 1.

5. the first resin layer covers a side surface and a part of an upper surface of the conductive wire constituting the conductor layer, The wiring body according to claim 1 , wherein the second resin layer covers the first resin layer and another part of the top surface of the conductive wire.

6. The wiring body according to claim 5 , wherein an area of ​​the second resin layer covering the upper surface of the conductive wire is larger than an area of ​​the first resin layer covering the upper surface of the conductive wire.

7. The wiring body according to claim 1 , wherein when the thickness of the second resin layer is X and the refractive index of the resin layer is Y, the following formula (1) is satisfied: X≦−5.43 × Y+11.664 … (1)

8. A display device comprising the wiring body according to any one of claims 1 to 7.

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