Working method in semiconductor manufacturing process and working apparatus used in semiconductor manufacturing process

Abstract

To provide a working method in a semiconductor manufacturing process and a working apparatus used in the semiconductor manufacturing process, by which a workpiece is prevented from being damaged by electrostatic discharge.SOLUTION: Provided are a working method in a semiconductor manufacturing process and a working apparatus used in the semiconductor manufacturing process, in which, before a working head performs a predetermined operation on a workpiece W, the electrostatic value of the workpiece W is measured, and the predetermined operation is not performed when the electrostatic value of the workpiece W is higher than a predetermined value.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a working method and working apparatus, and more particularly to a working method and working apparatus for measuring the electrostatic value of a workpiece before a working head performs a predetermined operation on the workpiece in a semiconductor manufacturing process. [Background technology]

[0002] In the semiconductor manufacturing process, as described in Patent Document 1, for example, in order to process a workpiece to create a qualified IC (integrated circuit), predetermined processing operations such as coating and implantation must be performed on the substrate on which the wafer is placed.

[0003] During these processing operations, charges gradually accumulate in the workpiece as static electricity. As a result, ESD (electrostatic discharge) can occur between the workpiece and the work head when performing a preset processing operation on the workpiece. In particular, as semiconductor manufacturing processes have become more precise than the previous 40nm process, miniaturized and precise ICs are more susceptible to damage from ESD than previous ICs, and ESD has therefore become a major factor affecting the manufacturing of qualified ICs. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Taiwan Patent Publication No. I568324 Specification Summary of the Invention [Problem to be solved by the invention]

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to provide a method of operating in a semiconductor manufacturing process that ameliorates at least one of the drawbacks of the prior art.

[0006] Another object of the present invention is to provide a work apparatus for use in semiconductor manufacturing processes that overcomes at least one of the drawbacks of the prior art. [Means for solving the problem]

[0007] In order to achieve the above object, the present invention provides a method for transporting at least one workpiece to a work area, Measure the static electricity value of the workpiece in the work area with a static electricity measuring means; If the measured static electricity value is lower than a predetermined value, a predetermined operation is performed on the workpiece by the work head; The present invention provides a method for performing a semiconductor manufacturing process, wherein the work head does not perform the predetermined operation on the workpiece when the measured static electricity value is higher than a predetermined value. The present invention also provides a conveying means provided with a work rail capable of conveying a workpiece; a working means provided with a working mechanism that is located above the working rail and is movable relative to the working rail; The present invention also provides an operating device for use in a semiconductor manufacturing process, wherein the operating mechanism is provided with an operating head capable of performing a predetermined operation on the workpiece and static electricity measuring means capable of measuring the static electricity value of the workpiece. [Effects of the Invention]

[0008] The working method in the semiconductor manufacturing process and the working device used in the semiconductor manufacturing process of the present invention ensure that the working head will not perform a predetermined operation on the workpiece if the static electricity value of the workpiece is higher than a predetermined value, thereby eliminating the risk of the workpiece being destroyed by electrostatic discharge. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a perspective view showing the configuration of a workpiece to which a working method and apparatus in a semiconductor manufacturing process of the present invention is applied; [Figure 2]1 is a perspective view showing a working device of a first embodiment of a working method and device for a semiconductor manufacturing process according to the present invention; [Figure 3] FIG. 2 is a top view showing the conveying means in the embodiment. [Figure 4] FIG. 2 is a top view showing the working means in the embodiment. [Figure 5] FIG. 2 is a partially exploded perspective view showing a working mechanism of the working means in the embodiment. [Figure 6] 10 is a perspective view showing a working mechanism and a driving mechanism of working means in a second embodiment of the working method and working device in a semiconductor manufacturing process according to the present invention; FIG. [Figure 7] FIG. 10 is a partially exploded perspective view showing a working mechanism of a working means in the second embodiment. [Figure 8] FIG. 10 is a perspective view showing a working mechanism and a driving mechanism of working means in a third embodiment of the working method and working device in a semiconductor manufacturing process according to the present invention. [Figure 9] FIG. 11 is a partially exploded perspective view showing a working mechanism of a working means in the third embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] 1 and 2, a first embodiment of a method and apparatus for a semiconductor manufacturing process according to the present invention is suitable for performing predetermined operations on a plurality of workpieces W shown in FIG. 2. Each workpiece W has a substrate W1 and a chip W2 mounted on the substrate W1. The predetermined operation here may be, for example, one of applying an adhesive material to each substrate W1, attaching a thermal interface material to the chip W2 of the workpiece W, or attaching a heat dissipation sheet to each workpiece W.

[0011] In this first embodiment, the working method of the first embodiment of the present invention shown in Fig. 2 can be performed using the working apparatus 1 of the first embodiment of the present invention shown in Fig. 2. In the following explanation, the working apparatus 1 will be described first, and then the working method will be described. The working apparatus 1 can apply glue (adhesive material) to the substrate W1 of each workpiece W. The working apparatus 1 is suitable for being placed on the table surface T1 of the table T, and is provided with a transport means A and a working means B.

[0012] As shown in Figures 2 and 3, the conveying means A has two work rail mechanisms A1 extending parallel to each other, and an upstream rail mechanism A2 and a downstream rail mechanism A3 located at both ends of the extension direction of the work rail mechanism A1.

[0013] The work rail mechanism A1 is provided with a work rail A11 suitable for transporting multiple workpieces W and a positioning pedestal A12 that can be raised and lowered relative to the work rail A11. Each work rail A11 is provided with two work rail frames A111 and two work belts A112 positioned relatively inward of the work rail frames A111. Each positioning pedestal A12 is provided between two work rail frames A111 in the multiple work rail frames A111. Multiple workpieces W can be arranged in a matrix on the support table S. The support table S on which the multiple workpieces W are placed is transported by the work belts A112 of each work rail A11 along a horizontal transport path to the work area A13 corresponding to the positioning pedestal A12. In another embodiment of the present invention, the support table S can be configured to hold only one workpiece W.

[0014] The upstream rail mechanism A2 has an upstream rail A21 mounted on an upstream rail base A22. The upstream rail A21 is provided with two upstream rail frames A211 and two upstream belts A212 positioned relatively inward of the two upstream rail frames A211. A support table S on which multiple workpieces W are placed is transported horizontally by each upstream belt A212 of the upstream rail A21. The upstream rail base A22 drives the upstream rail A21 to selectively move and connect to one end of the work rail A11 of any one of the work rail mechanisms A1.

[0015] The downstream rail mechanism A3 has a downstream rail A31 mounted on a downstream rail base A32. The downstream rail A31 is provided with two downstream rail frames A311 and two downstream belts A312 positioned relatively inward of the two downstream rail frames A311. A support table S on which multiple workpieces W are placed is transported horizontally by each downstream belt A312 of the downstream rail A31. The downstream rail base A32 drives the downstream rail A31 to selectively move and connect to the other end of the work rail A11 of any one of the work rail mechanisms A1.

[0016] As shown in Figures 2, 4, 5 and 6, the working means B is provided with two working mechanisms B1 located above the two working rail mechanisms A1, and two driving mechanisms B2 arranged in parallel with each other and driving the multi-axial movement of the two working mechanisms B1 relative to the two working rail mechanisms A1.

[0017] The working mechanism B1 is provided with a working head B11 capable of applying glue to each workpiece W, a static electricity measuring means B12 capable of measuring the static electricity value of each workpiece W, a visual alignment member B13 capable of detecting the position of each workpiece W, a distance measuring means B14 capable of measuring distance, and a driving member B15 capable of driving the movement of the working head B11 and the distance measuring means B14 in the Z-axis direction. The working head B11 can be a screw-type glue valve used in conjunction with a glue cartridge B111, a piezoelectric glue valve, an air-driven glue valve, or the like. When the working head B11 applies glue (performs work), static electricity conducts between the working head B11 and each workpiece W (i.e., a flow of positive / negative charges occurs between the working head B11 and the workpiece W).

[0018] The drive mechanism B2 is provided with a first drive frame B21 extending along the Y-axis direction, a second drive frame B22 provided on the first drive frame B21 and extending along the X-axis direction, and a holding frame B23 provided on the second drive frame B22.

[0019] The working mechanism B1 is mounted on a holding frame B23. The first drive frame B21 and the second drive frame B22 are linked to the holding frame B23 and can move in the X-axis and Y-axis directions relative to the first drive frame B21. When the holding frame B23 moves, the working head B11, static electricity measuring means B12, visual alignment member B13, distance measuring means B14, and drive member B15 held by the holding frame B23 all move horizontally.

[0020] The static electricity measuring means B12 and the visual alignment member B13 are fixed directly or indirectly to the holding frame B23. The visual alignment member B13 is provided with an image capture unit B131 located above and a light source unit B132 located below. The static electricity measuring means B12 is disposed next to the light source unit B132 and can measure static electricity downward. The working head B11 and the distance measuring means B14 are disposed on a driving member B15 mounted on the holding frame B23. The working head B11 is driven by the driving member B15 and can move vertically in the Z-axis direction relative to the holding frame B23. In other words, the static electricity measuring means B12 and the visual alignment member B13 can move horizontally in the X-axis and Y-axis directions, and the working head B11 and the distance measuring means B14 can move horizontally and vertically in the X-axis, Y-axis, and Z-axis directions. Since the height relationship between the distance measurement means B14 and the working head B11 is determined when they are attached, each distance measurement means B14 can measure the distance between itself and the measurement target, thereby measuring the distance between the working head B11 and the measurement target. The measurement target here may be, for example, the substrate W1 or chip W2 of the workpiece W, or the holder S.

[0021] 2 and 3, the table T is provided with a cover case T2 that covers the transport means A and the working means B. The working device 1 is provided with two static electricity removal means C that are each located above the work rail A11 (transport path) and that can remove static electricity from multiple workpieces W. The static electricity removal means C are suspended inside the cover case T2 and discharge charged bodies downward, thereby removing static electricity from each workpiece W before the working device 1 performs a predetermined task on each workpiece W.

[0022] An alarm D is provided on the outside of the cover case T2 of the working device 1. The alarm D can notify the worker of a warning message by emitting light or a warning sound.

[0023] The working device 1 has a control means E provided within the table T. The control means E receives information relating to the results of measurements and image captures performed on the workpiece W by the static electricity measuring means B12, the visual alignment member B13, and the distance measuring means B14. Based on this information, the control means E can control the transport means A and the working means B to perform a predetermined task on the workpiece W, and can also control the static electricity removing means C to remove static electricity from the workpiece W, or control the alarm D to output a warning message.

[0024] The following describes a working method in a semiconductor manufacturing process according to the present invention, which is carried out by the working device 1.

[0025] The method for working in a semiconductor manufacturing process of the present invention includes a transport step, a static electricity measurement step, a static electricity determination step, a work execution step, a static electricity removal step, and a warning step.

[0026] In the transport step, the support table S on which multiple workpieces W are placed is transported to the work area A13 via one of the transport paths. When the support table S is located in one of the work areas A13, the corresponding positioning base A12 is raised and sucked onto the support table S, thereby fixing the support table S to the positioning base A12.

[0027] In the static electricity measurement step, the static electricity measurement means B12 measures the static electricity value of the workpiece W located in the work area A13. First, the visual alignment member B13, which moves horizontally together with the work head B11, detects the position of one of the workpieces W on the support table S located in the work area A13, and then the static electricity measurement means B12, which moves horizontally together with the visual alignment member B13, measures the static electricity value of that workpiece W.

[0028] In the static electricity determination step, it is determined whether the static electricity value of the workpiece W measured by the control means E is higher or lower than a predetermined value.

[0029] When the control means E determines that the static electricity value of the workpiece W is lower than the predetermined value, the process enters into a work execution step, and a predetermined work is executed.

[0030] In the work execution step, the work head B11 executes a predetermined work on the workpiece W. An example of the predetermined work here is applying an adhesive material.

[0031] In the work execution step, the distance between the work head B11 and the workpiece W is first measured by a distance measuring means B14 that moves horizontally together with the work head B11, and the driving member B15 adjusts the distance between the work head B11 and the workpiece W, after which the work head B11 performs a predetermined work on the workpiece W at a predetermined height.

[0032] If the control means E determines that the static electricity value of the workpiece W is higher than the predetermined value, the work head B11 does not perform the predetermined work on the workpiece W. In other words, instead of entering the work execution step, it enters the static electricity removal step. In the static electricity removal step, the static electricity of the workpiece W is removed by the static electricity removal means C, and then the static electricity measurement step and static electricity determination step are executed again. In the static electricity measurement step that is executed again, the static electricity measurement means B12 is made to measure the static electricity value of the workpiece W again.

[0033] If the static electricity value of the workpiece W is determined to be lower than the predetermined value in the static electricity determination step, the process proceeds to the work execution step, and if the static electricity value of the workpiece W is still higher than the predetermined value, the warning step is executed. In the warning step, a warning message is output by alarm D to notify the worker.

[0034] In addition, during the work execution step, due to the conduction of static electricity between the work head B11 and the work W, there is a possibility that an electric charge (static electricity) will gradually accumulate on the work W and become higher than a predetermined value, so the static electricity measurement step, static electricity determination step, static electricity removal step, and warning step can be executed again even after the predetermined work has been performed.

[0035] In this way, the working method in the semiconductor manufacturing process of the present invention and the working device 1 used in the semiconductor manufacturing process ensure that the working head B11 does not perform a predetermined task on the work W when the static electricity value of the work W is higher than a predetermined value, thereby eliminating the risk of the work W being destroyed by ESD (electrostatic discharge).

[0036] In another embodiment of the present invention, the static electricity measuring means B12 can measure the static electricity value of the workpiece W even after the work head B11 has performed a predetermined task on the workpiece W. This allows the static electricity removing means C to remove static electricity from the workpiece W if a situation occurs again where the static electricity value of the workpiece W is higher than the predetermined value.

[0037] 1, 6, and 7, in the second embodiment of the working method and apparatus for a semiconductor manufacturing process of the present invention, the working means F of the working device 1 performs the task of attaching a thermal interface material to a chip W2 of a workpiece W. The working means F has a working mechanism F1 attached to a driving mechanism F2, and the working mechanism F1 can move along multiple axes by being driven by the driving mechanism F2.

[0038] The work mechanism F1 is provided with a work head F11 capable of performing the task of attaching a thermal interface material to a workpiece W, an electrostatic measuring means F12 capable of measuring the electrostatic value of each workpiece W, a visual alignment member F13 capable of detecting the position of each workpiece W, a distance measuring means F14 capable of measuring the distance between the workpiece W, a driving member F15 capable of driving the movement of the work head F11 and the distance measuring means F14 in the Z-axis direction, and a second driving member F16 that drives the movement of the electrostatic measuring means F12 and the visual alignment member F13 in the Z-axis direction.

[0039] The work head F11 includes, for example, a belt that holds a thermal interface material (TIM) and a roller F111 that applies the thermal interface material to the chip W2. When the work head F11 applies the thermal interface material, static electricity is conducted between the work head F11 and each workpiece W (i.e., a flow of positive and negative charges occurs between the work head F11 and the workpiece W). The visual alignment member F13 includes an image capture unit F131 located above and a light source unit F132 located below. The static electricity measurement means F12 is located next to the light source unit F132 and can measure static electricity downward.

[0040] The drive mechanism F2 is provided with two first drive frames F21 extending along the X-axis direction, a second drive frame F22 disposed across the two first drive frames F21 and extending along the Y-axis direction, and a holder frame F23 disposed on the second drive frame F22. The second drive frame F22 can move along the X-axis direction on the two first drive frames F21. The holder frame F23 can move along the Y-axis direction on the second drive frame F22. The working mechanism F1 is disposed on a holding frame F23 and can move in the X-axis and Y-axis directions in conjunction with the holding frame F23. When the holding frame F23 moves, the working head F11, static electricity measuring means F12, visual alignment member F13, distance measuring means F14, driving member F15, and second driving member F16 held by the holding frame F23 all move horizontally.

[0041] The work head F11 and distance measuring means F14 are mounted on a first drive member F15 and are vertically movable relative to the holding frame F23. The static electricity measuring means F12 and visual alignment member F13 are mounted on a second drive member F16 and are vertically movable relative to the holding frame F23. In other words, the work head F11, static electricity measuring means F12, visual alignment member F13, and distance measuring means F14 are all capable of horizontal and vertical movement in the X-axis, Y-axis, and Z-axis directions, but the vertical movement of the work head F11 and distance measuring means F14 and the vertical movement of the static electricity measuring means F12 and visual alignment member F13 are performed separately and independently.

[0042] 1, 8 and 9, in a third embodiment of the working method and apparatus for a semiconductor manufacturing process of the present invention, working means G of working device 1 can perform a heat dissipation sheet attachment operation to attach a heat dissipation sheet to a workpiece W. By attaching working mechanism G1 to drive mechanism G2 in working means G, working mechanism G1 can move along multiple axes by being driven by drive mechanism G2.

[0043] The work mechanism G1 is provided with a work head G11 capable of performing heat dissipation sheet attachment work to attach a heat dissipation sheet to a workpiece W, a static electricity measuring means G12 capable of measuring the static electricity value of each workpiece W, a visual alignment member G13 capable of detecting the position of each workpiece W, a distance measuring means G14 capable of measuring the distance between the workpiece W, a driving member G15 capable of driving the movement of the work head G11 and the distance measuring means G14 in the Z-axis direction, and a second driving member G16 that drives the movement of the static electricity measuring means G12 and the visual alignment member G13 in the Z-axis direction.

[0044] The work head G11 has, for example, a suction cup G111 that can adsorb a heat dissipation sheet, and when the work head G11 performs the heat dissipation sheet installation work, static electricity is conducted between the work head G11 and each workpiece W (i.e., a flow of positive / negative charges occurs between the work head G11 and the workpiece W). The visual alignment member G13 is provided with an image capture unit G131 located above and a light source unit G132 located below. The static electricity measuring means G12 is provided next to the light source unit G132 and can measure static electricity downward.

[0045] The drive mechanism G2 is provided with two first drive frames G21 extending along the X-axis direction, a second drive frame G22 arranged to straddle the two first drive frames G21 and extending along the Y-axis direction, and a holding frame G23 arranged on the second drive frame G22. The second drive frame G22 can move along the X-axis direction on the two first drive frames G21. The holding frame G23 can move along the Y-axis direction on the second drive frame G22. The working mechanism G1 is disposed on a holding frame G23 and can move in the X-axis and Y-axis directions in conjunction with the holding frame G23. When the holding frame G23 moves, the working head G11, static electricity measuring means G12, visual alignment member G13, distance measuring means G14, driving member G15, and second driving member G16 held by the holding frame G23 all move horizontally.

[0046] The work head G11 is mounted on a first drive member G15 and is vertically movable relative to the holding frame G23. The static electricity measuring means G12, visual alignment member G13, and distance measuring means G14 are mounted on a second drive member G16 and are vertically movable relative to the holding frame G23. In other words, the work head G11, static electricity measuring means G12, visual alignment member G13, and distance measuring means G14 are all capable of horizontal and vertical movement in the X-axis, Y-axis, and Z-axis directions, but the vertical movement of the work head G11 and the vertical movement of the static electricity measuring means G12, visual alignment member G13, and distance measuring means G14 are performed separately and independently.

[0047] Although the embodiment of the present invention has been described above, the present invention is not limited to this, and various modifications are possible without departing from the spirit of the present invention. [Explanation of symbols]

[0048] 1 Work equipment A. Means of transport A1 Working rail mechanism A11 Work Rail A111 Work rail frame A112 Work Belt A12 Positioning base A13 Work Area A2 Upstream rail mechanism A21 upstream rail A211 Upstream rail frame A212 Upstream Belt A22 Upstream rail stand A3 Downstream rail mechanism A31 downstream rail A311 downstream rail frame A312 Downstream Belt A32 downstream rail stand B Working means B1 Working mechanism B11 working head B111 Glue Cartridge B12 Electrostatic measurement means B13 Visual alignment member B131 Image capture unit B132 Light source section B14 Distance measuring means B15 Driving member B2 Drive mechanism B21 First drive frame B22 Second drive frame B23 Retaining frame C. Static electricity removal means D Alarm E. Control Means F Working means F1 working mechanism F11 work head F111 Roller F12 Electrostatic measurement means F13 Visual alignment member F131 Image capture unit F132 Light source section F14 Distance measurement means F15 First driving member F16 Second driving member F2 drive mechanism F21 1st drive frame F22 second drive frame F23 holding frame G Working means G1 working mechanism G11 working head G111 sucker G12 Electrostatic measurement means G13 Visual Alignment Member G131 Image Capture Unit G132 Light source section G14 Distance measuring means G15 First driving member G16 Second driving member G2 drive mechanism G21 First Drive Frame G22 Second drive frame G23 holding frame S Holding stand T-table T1 table surface T2 Cover Case double work W1 board W2 Chip

Claims

1. Transporting at least one workpiece to a work area; Measure the static electricity value of the workpiece in the work area with a static electricity measuring means; If the measured static electricity value is lower than a predetermined value, a predetermined operation is performed on the workpiece by the work head; A method for performing a semiconductor manufacturing process, wherein the work head does not perform the predetermined operation on the workpiece when the measured static electricity value is higher than a predetermined value.

2. 2. A method for working in a semiconductor manufacturing process according to claim 1, wherein the workpiece is transported to the working area via a transport path formed by a transport means, and the working head is moved to the working area before the electrostatic measuring means measures the electrostatic value of the workpiece.

3. 3. A method for performing a semiconductor manufacturing process according to claim 1, wherein said static electricity measuring means is moved together with said work head.

4. The workpiece is transported to the work area while being placed on a support table, Before the static electricity measuring means measures the static electricity value of the workpiece, confirming the position of the workpiece on the support table in the work area using a visual alignment member; 3. The method for operating in a semiconductor manufacturing process according to claim 1, wherein said visual alignment member is moved together with said static electricity measuring means.

5. 3. The method for performing a semiconductor manufacturing process according to claim 1, wherein electrostatic conduction occurs between the work head and the workpiece when the work head performs the predetermined operation on the workpiece.

6. the workpiece has a chip and a substrate on which the chip is mounted; 6. The method for performing a semiconductor manufacturing process according to claim 5, wherein the work head performs one of the following processes on the workpiece: attaching a thermal interface material to the chip; applying an adhesive material to the substrate; or attaching a heat dissipation sheet to the workpiece.

7. 3. A method for a semiconductor manufacturing process according to claim 1, wherein, if the measured static electricity value is higher than a predetermined value, static electricity is removed from the workpiece using a static electricity removal means, and then the static electricity value of the workpiece is measured again using the static electricity measurement means.

8. 8. A working method in a semiconductor manufacturing process according to claim 7, wherein, after removing static electricity from the workpiece, the static electricity value of the workpiece measured again by the static electricity measuring means is higher than a predetermined value, and an alarm is activated to notify a warning message to an operator.

9. 3. A method for performing a semiconductor manufacturing process according to claim 1, wherein the static electricity measuring means measures the static electricity value of the workpiece even after the work head has performed the predetermined task on the workpiece.

10. a conveying means provided with a work rail capable of conveying a workpiece; a working means provided with a working mechanism that is located above the working rail and is movable relative to the working rail; A working device in a semiconductor manufacturing process, wherein the working mechanism is provided with a working head capable of performing a predetermined work on the workpiece and static electricity measuring means capable of measuring the static electricity value of the workpiece.

11. 11. The working device for a semiconductor manufacturing process according to claim 10, wherein the working mechanism is further provided with a visual alignment member that is movable together with the working head and the static electricity measuring means.

12. 12. The working device for a semiconductor manufacturing process according to claim 11, wherein the working head, the static electricity measuring means, and the visual alignment member are directly or indirectly attached to a holding frame so as to be horizontally movable together.

13. 11. The working device for a semiconductor manufacturing process according to claim 10, wherein the working head is configured to be capable of performing any one of the processes of attaching a thermal interface material to the workpiece, applying an adhesive material, or attaching a heat dissipation sheet to the workpiece.

14. 11. The working device for a semiconductor manufacturing process according to claim 10, further comprising: static electricity removing means positioned above said working rail for removing static electricity from said workpiece.

15. 3. An operating device for a semiconductor manufacturing process used to carry out the operating method for a semiconductor manufacturing process according to claim 1 or 2.

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