Processing system and method

Abstract

To provide a processing system and method capable of determining appropriateness of processing without impairing processing efficiency of the processing system.SOLUTION: A processing system 1 includes: a chuck table 3 that rotationally attracts and holds a workpiece W; an index table 2 that rotationally moves the chuck table 3 around a rotation axis 2a; a measuring device 7c that measures a film thickness of the workpiece W that passes while rotating from a precision-grinding stage ST3 toward a polishing stage ST4 in a non-contact manner; a measuring device 7d that measures a film thickness of the workpiece W that passes while rotating from the polishing stage ST4 toward a platform stage ST1 in a non-contact manner; and a control device 8 that calculates predicted shapes of the workpiece W before and after polishing on the basis of measurement results of the measuring devices 7c, 7d, and determines appropriateness of processing on the basis of a predicted polishing amount obtained from a difference in the predicted shape of the workpiece W before and after polishing and a pre-stored target polishing amount of the workpiece W.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a machining system and method for machining a workpiece to a thin film. [Background technology]

[0002] In the field of semiconductor manufacturing, a grinding device is known that grinds semiconductor wafers such as silicon wafers (hereinafter referred to as "workpieces") into a thin, flat shape by pressing the grinding surface of a rotating grinding wheel against the workpiece.

[0003] Patent Document 1 discloses an apparatus that processes a workpiece through rough grinding and then fine grinding, cleans a protective tape and the back surface of the workpiece, and then measures the thickness of the workpiece using a capacitance sensor. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2009-117648 Summary of the Invention [Problem to be solved by the invention]

[0005] However, as workpiece processing efficiency improves, the time required to measure the workpiece thickness after cleaning has a negative impact on throughput. Furthermore, because the thickness measurement is performed after the workpiece is transferred from the chuck table, it is not possible to reprocess the workpiece even if the workpiece thickness is thicker than the target thickness.

[0006] Therefore, a technical problem arises that must be solved in order to determine whether machining is appropriate in a short time without impairing the efficiency of machining the workpiece, and an object of the present invention is to solve this problem. [Means for solving the problem]

[0007] In order to achieve the above object, the processing system of the present invention comprises a chuck that suction-holds a workpiece so that it can rotate, an index table that moves the chuck on a predetermined orbit to each processing position where processing is performed on each stage, a plurality of measuring devices that non-contactly measure the film thickness of the workpiece as it passes while rotating on the orbit between a predetermined processing position and the next processing position from the predetermined processing position, and a control device that calculates the predicted shapes of the two workpieces based on two of the measurement results of each measuring device, and determines whether processing is appropriate based on the predicted processing amount obtained from the difference between the predicted shapes of the two workpieces and a pre-stored target processing amount for the workpiece.

[0008] Furthermore, in the machining system according to the present invention, if the control device determines that the machining is not appropriate, it is preferable that the chuck is returned on the orbit and the workpiece is machined again.

[0009] In addition, in order to achieve the above-mentioned object, the processing method of the present invention is a processing method applied to a processing system including a chuck that rotatably suction-holds a workpiece, an index table that moves the chuck on a predetermined orbit to each processing position where processing is performed on each stage, multiple measuring devices each provided between a predetermined one of the processing positions on the orbit and the processing position next to the predetermined processing position, and a control device, wherein the multiple measuring devices each non-contact measure the film thickness of the workpiece as it passes while rotating from the predetermined processing position to the next processing position on the orbit between the predetermined processing position and the next processing position, the control device calculates the predicted shapes of the two workpieces based on two of the measurement results obtained by each measuring device, and the control device determines the appropriateness of processing based on the predicted processing amount obtained from the difference between the predicted shapes of the two workpieces and a pre-stored target processing amount for the workpiece. [Effects of the Invention]

[0010] The present invention can determine whether machining is appropriate or not without impairing the machining efficiency of the machining system. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a plan view showing a processing system according to an embodiment of the present invention; [Figure 2] FIG. 3 is a schematic diagram showing the positional relationship of measurement points of a measurement device on a workpiece. [Figure 3] FIG. 4 is a schematic diagram showing the cross-sectional shape of a workpiece calculated based on measurements made by a measuring device. DETAILED DESCRIPTION OF THE INVENTION

[0012] An embodiment of the present invention will be described with reference to the drawings. Note that, hereinafter, when referring to the number, numerical value, amount, range, etc. of components, unless otherwise specified or when it is clearly limited to a specific number in principle, the number is not limited to the specific number, and may be more or less than the specific number.

[0013] Furthermore, when referring to the shape or positional relationship of components, etc., it includes things that are substantially similar or approximate to those shapes, etc., unless otherwise specified or when it is clearly considered otherwise in principle.

[0014] In addition, the drawings may exaggerate characteristic parts to make the features easier to understand, and the dimensional proportions of the components may not be the same as in reality. In addition, in cross-sectional views, hatching of some components may be omitted to make the cross-sectional structure of the components easier to understand.

[0015] 1 is a plan view showing the basic configuration of a processing system 1. The processing system 1 continuously performs grinding and polishing of a workpiece W. Note that the processing system 1 may perform only one of grinding or polishing.

[0016] The processing system 1 is provided with four stages: a platform stage ST1, a rough grinding stage ST2, a fine grinding stage ST3, and a polishing stage ST4.

[0017] The processing system 1 includes an index table 2 that can rotate clockwise on the page of Fig. 1, and four chuck tables 3 that are arranged at equal intervals on a concentric circle centered on a rotation axis 2a of the index table 2. As the index table 2 rotates in 90° steps, the chuck table 3 can move in the following order: platform stage ST1, rough grinding stage ST2, fine grinding stage ST3, and polishing stage ST4.

[0018] The chuck table 3 has an adsorbent (not shown) made of a porous material such as alumina embedded in the upper surface of the rotary table 31. The chuck table 3 has a conduit (not shown) that runs through the interior and extends to the surface. The conduit is connected to a vacuum source, a compressed air source, or a water supply source via a rotary joint (not shown). When the vacuum source is activated, the workpiece placed on the chuck table 3 is adsorbed and held on the chuck table 3. When the compressed air source or water supply source is activated, the adsorption between the workpiece and the chuck table 3 is released.

[0019] The rotary table 31 is connected to a chuck spindle (not shown). The chuck spindle is configured to be rotatable about a rotation axis perpendicular to the rotary table 31. The chuck table 31 may be provided with a tilt mechanism (not shown) that tilts the rotary table 31.

[0020] On the platform stage ST1, the workpiece W before grinding is transferred by a transfer arm (not shown) onto the chuck table 3. The workpiece W is previously positioned so that its orientation coincides with a predetermined direction.

[0021] The rough grinding stage ST2 is provided with a rough grinding device 4. The rough grinding device 4 includes a rough grinding wheel (not shown), a first spindle 41 to the lower end of which the rough grinding wheel is attached and which rotatably supports the rough grinding wheel, and a first spindle feed mechanism 42 which moves the first spindle 41 up and down in the vertical direction.

[0022] The rough grinding wheel is, for example, a #600 cup-shaped grinding wheel. The first spindle feed mechanism 42 is composed of two linear guides 43 that guide the movement direction of the first spindle 41, and a ball screw slider mechanism 44 that raises and lowers the first spindle 41.

[0023] The rough grinding device 4 is also provided with a first contact type thickness measuring device 45. The first contact type thickness measuring device 45 has a pair of detection arms 46, 47 with contacts at the tips thereof.

[0024] During rough grinding, the contact of the detection arm 46 comes into contact with the top surface of the workpiece W, and the contact of the detection arm 47 comes into contact with the top surface of the chuck table 3, making it possible to measure the thickness of the workpiece W from the difference in height detected by the contacts of the detection arms 46 and 47. Note that the thickness (total thickness) of the workpiece W measured by the first contact-type thickness measuring device 45 includes the thickness of devices formed on one surface of the workpiece W and protective tape attached to one surface, etc.

[0025] The precision grinding stage ST3 is provided with a precision grinding device 5. The precision grinding device 5 includes a precision grinding wheel (not shown), a second spindle 51 to the lower end of which the precision grinding wheel is attached and which rotatably supports the precision grinding wheel, and a second spindle feed mechanism 52 which moves the second spindle 51 up and down in the vertical direction.

[0026] The precision grinding wheel is, for example, a #4000 cup-type grinding wheel. The second spindle feed mechanism 52 is composed of two linear guides 53 that guide the movement direction of the second spindle 51, and a ball screw slider mechanism 54 that raises and lowers the second spindle 51.

[0027] The precision grinding device 5 is also provided with a second contact type thickness measuring device 55. The second contact type thickness measuring device 55 has a pair of detection arms 56, 57 with contacts at the tips thereof.

[0028] During precision grinding, the contact of the detection arm 56 comes into contact with the top surface of the workpiece W, and the contact of the detection arm 57 comes into contact with the top surface of the chuck table 3, making it possible to measure the thickness of the workpiece W from the difference in height detected by the contacts of the detection arms 56 and 57. Note that the thickness (total thickness) of the workpiece W measured by the second contact-type thickness measuring device 55 includes the thickness of devices formed on one side of the workpiece W and the thickness of protective tape attached to the backside, etc.

[0029] The polishing stage ST4 is provided with a polishing device 6. The polishing device 6 includes a polishing head 61 having a polishing pad (not shown) attached to its lower end, a third spindle 62 having the polishing head 61 attached to its lower end and rotatably supporting the polishing head 61, and a third spindle feed mechanism (not shown) that raises and lowers the third spindle 62 in the vertical direction.

[0030] The processing system 1 is provided with a film thickness measuring device 7. The film thickness measuring device 7 measures the thickness (film thickness) of the workpiece W in a non-contact manner. Note that the film thickness of the workpiece W measured by the film thickness measuring device 7 does not include the thickness of a device formed on one surface of the workpiece W or a protective tape attached to one surface, etc.

[0031] The film thickness measuring device 7 is fixed to a frame 1a installed in the processing system 1, and is installed above the index table 2. The measurement point at which the film thickness measuring device 7 measures the film thickness of the workpiece W is set on the rotational orbit O of the central axis of the chuck table 3 when viewed from above.

[0032] 2 is a schematic diagram showing the positional relationship of the measurement points of the film thickness measuring device 7 on the workpiece W. Note that FIG. 2(a) illustrates the positional relationship of the measurement points of the film thickness measuring device 7 when the rotation speed of the index table 2 is set to 20 deg / s, the rotation speed of the chuck table 3 is set to 400 rpm, and the sampling period of the film thickness measuring device 7 is set to 4 msec. Because the workpiece W passes directly below the film thickness measuring device 7 while rotating, the trajectory of the measurement points of the film thickness measuring device 7 extends over the entire surface of the workpiece W, including the center of the workpiece W. Note that the trajectory of the measurement points of the film thickness measuring device 7 can be changed as appropriate by changing the rotation speed of the index table 2, the rotation speed of the chuck table 3, and the sampling period of the film thickness measuring device 7a.

[0033] Furthermore, the film thickness measuring device 7 preferably includes a nozzle for blowing air toward the surface of the workpiece W so that the cooling water at the measurement point is leveled to a substantially constant thickness.

[0034] One film thickness measuring device 7 is provided upstream of each of the stages ST1 to ST4 in the rotation direction of the index table 2. Hereinafter, when it is necessary to distinguish between the four film thickness measuring devices 7, they will be identified by the reference numerals 7a to 7d.

[0035] The operation of the machining system 1 is controlled by a control device 8. The control device 8 controls each of the components that make up the machining system 1. The control device 8 is configured with, for example, a CPU, a memory, etc. The functions of the control device 8 may be realized by control using software, or may be realized by operation using hardware.

[0036] Furthermore, the control device 8 can calculate the shape of the workpiece W based on the measurement values ​​of the film thickness measuring device 7. FIG. 3 shows the shape of the workpiece W calculated by the control device 8 based on the measurement values ​​of the film thickness measuring device 7. In FIG. 3, the vertical axis is set to the film thickness of the workpiece W, and the horizontal axis is set to the radial dimension of the workpiece W (-150 to 150 mm). It can be seen that the workpiece W shown in FIG. 3 has a concave shape in which the periphery of the workpiece W is thicker than the center of rotation of the workpiece W.

[0037] Next, the procedure for machining the workpiece W will be described.

[0038] [Rough grinding] On the platform stage ST1, the workpiece W is placed on the chuck table 3. Then, when the vacuum source is activated, negative pressure is supplied between the workpiece W and the chuck table 3, and the workpiece W is held by suction on the chuck table 3.

[0039] Next, when the index table 2 rotates and the chuck table 3 moves toward the rough grinding stage ST2, the film thickness measuring device 7a measures the film thickness of the workpiece W before rough grinding, which passes while rotating directly below.

[0040] The chuck table 3 moves to the rough grinding stage ST2, and rough grinding is performed on the workpiece W. In the rough grinding, the grinding surface of the rough grinding wheel is pressed against the workpiece W while the rough grinding wheel and the chuck table 3 are both rotating, to roughly grind the workpiece W. When the measurement value of the first contact-type thickness measuring device 45 reaches the desired thickness, the rough grinding device 4 ends the rough grinding.

[0041] Next, as the index table 2 rotates and the chuck table 3 moves toward the precision grinding stage ST3, the film thickness measuring device 7b measures the film thickness of the workpiece W before precision grinding as it passes while rotating directly below.

[0042] The control device 8 calculates a predicted shape of the workpiece W after rough grinding based on the measurement value of the film thickness measuring device 7b.

[0043] Then, the control device 8 compares the predicted shape of the workpiece W after rough grinding with a pre-stored target shape of the workpiece W after rough grinding, and determines whether the workpiece W has been appropriately rough ground.

[0044] Such a judgment may be made, for example, by determining whether the average film thickness in the predicted shape of the workpiece W after rough grinding falls within a predetermined error range with respect to the average film thickness in the target shape of the workpiece W after rough grinding, but is not limited to this.

[0045] If the predicted shape of the workpiece W reaches the target shape, it is determined that the rough grinding has been performed appropriately, and if the predicted shape of the workpiece W does not reach the target shape, it is determined that the rough grinding has been performed insufficiently.

[0046] In addition, the control device 8 may be configured to calculate the predicted shape of the workpiece W before and after rough grinding based on the measurement values ​​of the film thickness measuring devices 7a and 7b, and determine the suitability of the rough grinding from the expected processing amount in the rough grinding obtained from the difference between the predicted shapes.

[0047] In this case, the target grinding amount of the workpiece W in rough grinding is stored in advance in the control device 8, and the control device 8 compares the predicted grinding amount in the rough grinding process with the target grinding amount to determine whether the rough grinding process is appropriate.If the predicted grinding amount reaches the target grinding amount, it is determined that the rough grinding process has been performed appropriately, and if the predicted grinding amount does not reach the target grinding amount, it is determined that the rough grinding process is insufficient.

[0048] It should be noted that the consistency of the processing conditions (processing recipe) can be confirmed by using the measurement value of the first contact-type thickness measurement 45 and the film thickness measurement device 7a. Specifically, the thickness of the workpiece W excluding the Si layer can be obtained from the difference between the total thickness (the sum of the film thickness of the Si layer, the device layer, and the protective tape thickness) of the workpiece W measured by the film thickness measurement device 7a before the rough grinding process and the film thickness of the Si layer of the workpiece W measured by the film thickness measurement device 7a, so it is possible to confirm in advance whether the various setting values ​​included in the processing recipe are appropriate.

[0049] If it is determined that the rough grinding is insufficient, the index table 2 rotates counterclockwise in FIG. 1, the chuck table 3 returns to the rough grinding stage ST2, and the workpiece W is rough ground again.

[0050] [Precision grinding] If it is determined that the rough grinding has been performed appropriately, the index table 2 rotates, and the chuck table 3 moves to the precision grinding stage ST3, where precision grinding is performed on the workpiece W. In the precision grinding, the grinding surface of the precision grinding wheel is pressed against the workpiece W while the precision grinding wheel and the chuck table 3 are both rotating, to perform precision grinding of the workpiece W. When the measurement value of the second contact-type thickness measuring device 55 reaches the desired thickness, the precision grinding device 5 ends the precision grinding.

[0051] Next, when the index table 2 rotates and the chuck table 3 moves toward the polishing stage ST4, the film thickness measuring device 7c measures the film thickness of the workpiece W before polishing, which passes while rotating directly below.

[0052] The control device 8 calculates a predicted shape of the workpiece W after precision grinding based on the measurement value of the film thickness measuring device 7c.

[0053] The control device 8 then compares the predicted shape of the workpiece W after precision grinding with a pre-stored target shape of the workpiece W after precision grinding to determine whether or not the workpiece W has been appropriately precision ground. This determination may be made, for example, by determining whether or not the average film thickness in the predicted shape of the workpiece W after precision grinding falls within a predetermined error range with respect to the average film thickness in the target shape of the workpiece W after precision grinding, but is not limited to this.

[0054] If the predicted shape reaches the target shape, it is determined that the precision grinding has been performed appropriately, and if the predicted shape does not reach the target shape, it is determined that the precision grinding has been insufficient.

[0055] In addition, the suitability of the rough grinding process may be determined by the control device 8 calculating the predicted shape of the workpiece W before and after the fine grinding process based on the measurements of the film thickness measuring devices 7b and 7c, and judging the suitability of the fine grinding process from the predicted processing amount in the fine grinding process obtained from the difference between the predicted shapes.

[0056] In this case, the target grinding amount of the workpiece W for precision grinding is stored in advance in the control device 8, and the control device 8 compares the predicted grinding amount with the target grinding amount in the precision grinding process to determine whether the precision grinding process is appropriate.If the predicted grinding amount reaches the target grinding amount, it determines that the precision grinding process has been performed appropriately, and if the predicted grinding amount does not reach the target grinding amount, it determines that the precision grinding process is insufficient.

[0057] If it is determined that the precision grinding is insufficient, the index table 2 rotates counterclockwise in FIG. 1, the chuck table 3 returns to the precision grinding stage ST3, and the workpiece W is precision ground again.

[0058] The rough grinding and the judgment of the suitability of the rough grinding may be performed together. Specifically, the control device 8 calculates the predicted shape of the workpiece W before the rough grinding and the predicted shape of the workpiece W after the fine grinding based on the measurements of the film thickness measuring devices 7a and 7c, and judges the suitability of the grinding from the predicted processing amount in the grinding (rough grinding and fine grinding) obtained from the difference between the predicted shapes.

[0059] In this case, the control device 8 compares the predicted amount of grinding with the target grinding amount of the workpiece W for the grinding, which is stored in advance, to determine whether the grinding is appropriate. If the predicted amount of grinding reaches the target amount of grinding, it determines that the grinding has been performed appropriately, and if the predicted amount of grinding does not reach the target amount of grinding, it determines that the grinding is insufficient.

[0060] If it is determined that the grinding is insufficient, the index table 2 rotates clockwise in FIG. 1, the chuck table 3 returns to the rough grinding stage ST2 or the fine grinding stage ST3, and the workpiece W is ground again.

[0061] [Polishing] If it is determined that the precision grinding has been performed appropriately, the index table 2 rotates, the chuck table 3 moves to the polishing stage ST4, and the workpiece W is polished. In the polishing, the polishing pad and the chuck table 3 are rotated, and the lower surface of the polishing pad is pressed against the workpiece W to polish the workpiece W.

[0062] Then, when the index table 2 rotates and the chuck table 3 moves toward the platform stage ST1, the film thickness measuring device 7d measures the film thickness of the workpiece W.

[0063] The control device 8 calculates a predicted shape of the workpiece W after polishing based on the measurement value of the film thickness measuring device 7d. The control device 8 also compares the predicted shape of the workpiece W with a pre-stored target shape of the workpiece W after polishing to determine whether the workpiece W has been polished into the desired shape. This determination may be made, for example, by determining whether the average film thickness in the predicted shape of the workpiece W after polishing falls within a predetermined error range with respect to the average film thickness in the target shape of the workpiece W after polishing, but is not limited to this.

[0064] If the predicted shape reaches the target shape, it is determined that polishing has been performed appropriately, and if the predicted shape does not reach the target shape, it is determined that polishing has been performed insufficiently.

[0065] In addition, the control device 8 may be configured to calculate the predicted shape of the workpiece W before polishing and the predicted shape of the workpiece W after polishing based on the measurement values ​​of the film thickness measuring devices 7c and 7d, and determine the suitability of the polishing process from the estimated polishing amount obtained from the difference between each predicted shape.

[0066] In this case, the target polishing amount of the workpiece W in the polishing process is stored in advance in the control device 8, and the control device 8 compares the expected polishing amount in the polishing process with the target polishing amount to determine whether the polishing process is appropriate.If the expected polishing amount reaches the target polishing amount, it determines that the polishing process has been performed appropriately, and if the expected polishing amount does not reach the target polishing amount, it determines that the polishing process is insufficient.

[0067] If it is determined that the polishing is insufficient, the index table 2 rotates counterclockwise in FIG. 1, and the workpiece W is polished again.

[0068] Then, when the control device 8 determines that the workpiece W has been machined into the target shape, the vacuum source is stopped, and the water supply source or compressed air source is started, releasing the suction between the workpiece W and the chuck table 3.

[0069] In this way, the film thickness of the workpiece W can be measured promptly immediately after processing without interfering with the availability of the processing system 1.

[0070] Furthermore, the film thickness measuring devices 7a to 7d measure the film thickness of the workpiece W without releasing the suction between the workpiece W and the chuck table 3, and if the result of the judgment indicates that the predicted shape of the workpiece W is thicker than the target shape, the workpiece W can be machined with high precision by grinding or polishing it again as appropriate.

[0071] Furthermore, if there is a machining tendency (convex, concave, etc.) that can be read from the predicted shape of the workpiece W, the chuck table 3 may be tilted to correct the machining conditions so as to cancel out that tendency.

[0072] Furthermore, by comparing the predicted grinding amount of the workpiece W in the rough grinding process obtained from the measurement values ​​of the film thickness measuring devices 7a and 7b with a pre-set processing recipe for the rough grinding process, the grinding amount in the rough grinding process of the workpiece W to be processed thereafter can be optimized, thereby stabilizing the strength of the workpiece W.

[0073] Furthermore, by comparing the predicted grinding amount of the workpiece W in the precision grinding process obtained from the measurement values ​​of the film thickness measuring devices 7b and 7c with a pre-set processing recipe for the precision grinding process, the grinding amount in the precision grinding process of the workpiece W to be processed thereafter can be optimized, thereby stabilizing the strength of the workpiece W.

[0074] The processing system 1 is not limited to one equipped with all four film thickness measuring devices 7a to 7d, and only a combination that allows film thickness measurement of the workpiece W to be performed at a desired timing may be selected.

[0075] For example, it is conceivable to judge the suitability of the entire processing based only on the shape of the workpiece W after grinding and polishing, without judging the suitability of each individual processing. Specifically, it is conceivable that the control device 8 calculates a predicted shape of the workpiece W after polishing based only on the measurement values ​​of the film thickness measuring device 7d, compares the predicted shape of the workpiece W with a pre-stored target shape of the workpiece W after polishing, and judges whether the workpiece W has been processed into the desired shape, thereby judging the suitability of the entire processing.

[0076] Below, some examples of processing systems are listed. [1] A processing system for processing a workpiece into a desired shape, comprising: a chuck for suction-holding the workpiece; an index table for rotating the chuck on a predetermined orbit; a measuring device that is installed on the orbit between a previous processing position and a next processing position when viewed from above, and that measures the film thickness of the processed workpiece rotating on the chuck in a non-contact manner as the workpiece rotates from the previous processing position toward the next processing position; and a control device that calculates a predicted shape of the workpiece based on the measurement values ​​of the measuring device, compares the predicted shape of the workpiece with a target shape of the workpiece after processing that is stored in advance, and determines whether the processing is appropriate. [2] The processing system described in [1] further includes a grinding device that grinds the workpiece, wherein the measuring device measures the film thickness of the workpiece after grinding, and the control device compares the predicted shape of the workpiece after grinding with a target shape of the workpiece after grinding that is stored in advance to determine whether the grinding process is appropriate. [3] The processing system according to [2], wherein if the control device determines that the grinding process is inappropriate, the grinding device grinds the workpiece again after the grinding process. [4] The processing system described in [2] further includes a polishing device that polishes the workpiece after grinding, wherein the measuring device measures the film thickness of the workpiece after polishing, and the control device compares the predicted shape of the workpiece after polishing with a target shape of the workpiece after polishing that is stored in advance to determine whether the grinding and polishing processes are appropriate. [5] The processing system according to [4], wherein if the control device determines that the polishing process is inappropriate, the polishing device polishes the workpiece again after polishing. [6] A processing system for processing a workpiece into a desired shape, comprising: a chuck for suction-holding the workpiece; an index table for rotating the chuck on a predetermined orbit; a first measuring device that is installed on the orbit between a previous first processing position and a next second processing position when viewed from above, and that measures the film thickness of the workpiece before processing in a non-contact manner as the chuck rotates from the first processing position toward the second processing position; a second measuring device that is installed on the orbit between a previous third processing position and a next fourth processing position when viewed from above, and that measures the film thickness of the workpiece after processing in a non-contact manner as the chuck rotates from the third processing position toward the fourth processing position; and a control device that compares an expected processing amount, which is the difference between the measurement values ​​of the first measuring device and the second measuring device, with a pre-stored target processing amount for processing, to determine whether the processing is appropriate.

[0077] Furthermore, the present invention can be modified in various ways other than those described above without departing from the spirit of the present invention, and it goes without saying that the present invention also covers such modifications. Furthermore, the above-described embodiments and modifications may be combined with each other. [Explanation of symbols]

[0078] 1: Processing system 2: Index table 2a: Rotation axis 3: Chuck table 31: Rotating table 4: Rough grinding device 41: First spindle 42: First spindle feed mechanism 43: Linear guide (for rough grinding equipment) 44: Ball screw slider mechanism (for rough grinding equipment) 45: First contact type thickness measuring device 46, 47: Detection arms 5:Precision grinding device 51: Second spindle 52: Second spindle feed mechanism 53: Linear guide (for precision grinding equipment) 54: Ball screw slider mechanism (for precision grinding equipment) 55: Second contact type thickness measuring device 56, 57: Detection arms 6: Polishing equipment 61: Polishing head 62: Third spindle 7, 7a to 7d: Film thickness measuring device 8: Control device ST1: Platform Stage ST2: Rough grinding stage ST3: Precision grinding stage ST4: Polishing stage W: Work

Claims

1. a chuck that suction-holds the workpiece so that it can rotate; an index table that moves the chuck along a predetermined trajectory to each processing position where processing is performed in each stage; a plurality of measuring devices that measure, in a non-contact manner, the film thickness of the workpiece passing while rotating on the orbit between a predetermined processing position among the processing positions on the orbit and a processing position subsequent to the predetermined processing position; a control device that calculates predicted shapes of the two workpieces based on two of the measurement results of the measuring devices, and determines whether or not the processing is appropriate based on a predicted processing amount obtained from the difference between the predicted shapes of the two workpieces and a pre-stored target processing amount for the workpiece; A processing system comprising:

2. 2. The machining system according to claim 1, wherein, when the control device determines that the machining is not appropriate, the chuck is returned on the orbit and the workpiece is machined again.

3. A processing method applied to a processing system including a chuck that suction-holds a workpiece so that the workpiece can be rotated, an index table that moves the chuck on a predetermined track to each processing position where processing is performed on each stage, a plurality of measuring devices respectively provided between a predetermined processing position among the processing positions on the track and a processing position next to the predetermined processing position, and a control device, the plurality of measuring devices measure, in a non-contact manner, the film thickness of the workpiece passing while rotating from the predetermined processing position to the next processing position on the trajectory between the predetermined processing position and the next processing position; the control device calculates predicted shapes of the two workpieces based on two of the measurement results obtained by the measurement devices, A processing method characterized in that the control device determines whether processing is appropriate based on an estimated processing amount obtained from the difference between the estimated shapes of the two workpieces and a pre-stored target processing amount for the workpiece.

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