Substrate processing device and substrate processing method

Abstract

To provide a substrate processing device which can prevent contact between a facing member and a substrate even when the facing member is deformed.SOLUTION: A substrate processing device 1 processes a substrate W. A substrate holding part 20 holds the substrate W. A substrate rotation part 30 rotates the substrate holding part 20. A facing member 40 is disposed above the substrate holding part 20 and faces the substrate W. A member rotation part 50 rotates the facing member 40. A member moving part 60 moves up or down the facing member 40 between a stand-by position P1 and a proximity position P10 where the facing member 40 is placed closer to the substrate W than in the stand-by position P1. A detection part 100 detects a state of an outer periphery part 41 of the facing member 40. A position information change part 146 changes proximity position information indicating the proximity position P10 based on the state of the outer periphery part 41 of the facing member 40. A member movement control part 142 controls the member moving part 60 so that the facing member 40 is disposed at the proximity position indicated by the changed proximity position information.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a substrate processing apparatus and a substrate processing method. [Background technology]

[0002] The substrate processing apparatus described in Patent Document 1 is provided with a distance measuring sensor to determine the distance between the top plate and the wafer. If a malfunction occurs in the drive mechanism for raising and lowering the top plate, the distance between the top plate and the wafer at the processing position may fall outside the appropriate range. Since the distance between the top plate and the wafer can be determined, damage to the substrate processing apparatus due to a collision between the wafer and the top plate can be prevented. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-22558 Summary of the Invention [Problem to be solved by the invention]

[0004] However, in Patent Document 1, the distance measurement sensor is attached to the top plate. Therefore, if the top plate is deformed, an error may occur in the measurement value of the distance measurement sensor. Furthermore, Patent Document 1 only focuses on a defect in the drive mechanism for raising and lowering the top plate.

[0005] Meanwhile, the inventors of the present application have discovered that the heat from the motor that rotates the top plate (opposing member) can cause minute deformation of the top plate. When minute deformation occurs in the top plate, the top plate may come into contact with the wafer, potentially generating burrs on the top plate. When burrs are generated on the top plate, the burrs may come into contact with the wafer when the next wafer is processed, potentially generating particles.

[0006] The present invention has been made in consideration of the above-mentioned problems, and its purpose is to provide a substrate processing apparatus and a substrate processing method that can prevent contact between an opposing member and a substrate even if the opposing member is deformed. [Means for solving the problem]

[0007] According to one aspect of the present invention, a substrate processing apparatus processes a substrate. The substrate processing apparatus includes a substrate holding unit, a substrate rotation unit, an opposing member, a member rotation unit, a member movement unit, a detection unit, a position information change unit, and a member movement control unit. The substrate holding unit holds the substrate. The substrate rotation unit rotates the substrate holding unit. The opposing member is disposed above the substrate holding unit and faces the substrate. The member rotation unit rotates the opposing member. The member movement unit raises or lowers the opposing member between a proximity position closer to the substrate than a standby position and the standby position. The detection unit detects the state of an outer periphery of the opposing member. The position information change unit changes proximity position information indicating the proximity position based on the state of the outer periphery of the opposing member. The member movement control unit controls the member movement unit so that the opposing member is positioned at the proximity position indicated by the changed proximity position information.

[0008] In one aspect of the present invention, it is preferable that the detection section detects a state of the outer periphery of the opposing member that is placed at the standby position.

[0009] In one aspect of the present invention, it is preferable that the detection section detects the state of the outer circumferential portion of the opposing member while the opposing member is rotating.

[0010] In one aspect of the present invention, the state of the outer periphery of the opposing member is preferably indicated by a displacement amount of the outer periphery of the opposing member. The substrate holder preferably rotates about a rotation axis. The displacement amount preferably indicates a displacement amount along the axial direction of the rotation axis and indicates a displacement amount relative to a position of the outer periphery of the opposing member in a reference state.

[0011] In one aspect of the present invention, the displacement amount preferably indicates a downward displacement amount.

[0012] In one aspect of the present invention, the substrate processing apparatus preferably further includes a storage unit that stores the detection unit. The storage unit preferably includes a storage main body that stores the detection unit and a light transmission unit that transmits light. The detection unit preferably detects the amount of displacement by irradiating the outer periphery of the opposing member with light via the light transmission unit or by capturing an image of the outer periphery of the opposing member via the light transmission unit.

[0013] In one aspect of the present invention, the substrate processing apparatus preferably further includes a guard unit and a guard moving unit. The guard unit preferably surrounds the substrate holding unit in a plan view and receives processing liquid splashed from the substrate. The guard moving unit preferably raises or lowers the guard unit. The storage unit is preferably spaced apart from the guard unit when the guard unit is positioned at its uppermost position.

[0014] In another aspect of the present invention, a substrate processing method is performed by a substrate processing apparatus including a facing member facing a substrate and rising or lowering between a proximity position closer to the substrate than a standby position and the standby position, the substrate processing method including the steps of detecting a state of an outer periphery of the facing member, changing proximity position information indicating the proximity position based on the state of the outer periphery of the facing member, and disposing the facing member at the proximity position indicated by the changed proximity position information. [Effects of the Invention]

[0015] According to the present invention, even if the opposing member is deformed, it is possible to prevent the opposing member from coming into contact with the substrate. [Brief explanation of the drawings]

[0016] [Figure 1]1 is a schematic cross-sectional view showing a substrate processing apparatus according to an embodiment of the present invention when an opposing member of the substrate processing apparatus is located at a standby position. [Figure 2] 1 is a schematic cross-sectional view showing the substrate processing apparatus according to the present embodiment when an opposing member of the substrate processing apparatus is located at a first proximity position. [Figure 3] 2 is a schematic cross-sectional view showing a fluid supply unit and a nozzle of the substrate processing apparatus according to the present embodiment. FIG. [Figure 4] FIG. 10 is a side view showing a part of an opposing member according to a reference example. [Figure 5] 1A is a diagram showing a reference state of an opposing member of the substrate processing apparatus according to the present embodiment, and FIG. 1B is a diagram showing a deformed state of the opposing member of the present embodiment. [Figure 6] FIG. 2 is a block diagram showing a control device of the substrate processing apparatus according to the present embodiment. [Figure 7] 1 is a flowchart showing a substrate processing method according to the present embodiment. [Figure 8] FIG. 10 is a schematic cross-sectional view showing a substrate processing apparatus according to a first modified example of the present embodiment. [Figure 9] FIG. 10 is a schematic cross-sectional view showing a substrate processing apparatus according to a second modified example of the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0017] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In the drawings, the same or corresponding parts are designated by the same reference numerals, and description thereof will not be repeated. In this embodiment, the X-axis, Y-axis, and Z-axis are mutually orthogonal, the X-axis and Y-axis are parallel to the horizontal direction, and the Z-axis is parallel to the vertical direction. Furthermore, in this embodiment, a planar view indicates viewing an object from vertically above.

[0018] A substrate processing apparatus 1 according to this embodiment will be described with reference to Figures 1 to 7. Figures 1 and 2 are schematic cross-sectional views showing the substrate processing apparatus 1. As shown in Figure 1, the substrate processing apparatus 1 includes a substrate processing section 5 and a control device 120. The control device 120 controls the substrate processing section 5. The substrate processing section 5 processes a substrate W with a processing fluid.

[0019] The processing fluid is, for example, a processing liquid or a processing gas. The processing fluid is not particularly limited as long as it is a fluid that comes into contact with the substrate W. Therefore, the processing fluid is not limited to fluids that have a chemical or physical effect on the substrate W, and includes fluids that have no chemical or physical effect on the substrate W.

[0020] The processing liquid as a processing fluid is, for example, a chemical liquid, such as dilute hydrofluoric acid (DHF), hydrofluoric acid (HF), hydrofluoric nitric acid (a mixture of hydrofluoric acid and nitric acid (HNO3)), buffered hydrofluoric acid (BHF), ammonium fluoride, HFEG (a mixture of hydrofluoric acid and ethylene glycol), phosphoric acid (H3PO4), sulfuric acid, acetic acid, nitric acid, hydrochloric acid, ammonia water, hydrogen peroxide water, organic acid (e.g., citric acid, oxalic acid), organic alkali (e.g., TMAH: tetramethylammonium hydroxide), sulfuric acid hydrogen peroxide water mixture (SPM), ammonia hydrogen peroxide water mixture (SC1), hydrochloric acid hydrogen peroxide water mixture (SC2), isopropyl alcohol (IPA), a surfactant, or a corrosion inhibitor.

[0021] The processing liquid as a processing fluid is, for example, a rinse liquid, such as deionized water, carbonated water, electrolytic ionized water, hydrogen water, ozone water, or diluted hydrochloric acid water (for example, about 10 ppm to 100 ppm).

[0022] The processing gas as the processing fluid is, for example, a reactive gas that reacts with the liquid adhering to the substrate W or the substrate W, or an inert gas. The reactive gas is, for example, ozone gas, fluorine gas, a gas containing hydrogen fluoride, or a gas containing IPA. The inert gas is, for example, nitrogen, helium, or argon.

[0023] The substrate processing unit 5 includes a chamber 10, a substrate holding unit 20, a substrate rotating unit 30, an opposing member 40, a member rotating unit 50, a member moving unit 60, a nozzle 70, a guard unit 80, a guard moving unit 90, and a detection unit 100. The substrate processing unit 5 preferably further includes a storage unit 110.

[0024] The chamber 10 has a generally box-like shape and has an internal space. In the example of Fig. 1, the chamber 10 houses a substrate holder 20, a substrate rotation unit 30, an opposing member 40, a member rotation unit 50, a member movement unit 60, a nozzle 70, a guard unit 80, a guard movement unit 90, a detection unit 100, and a storage unit 110. The material of the chamber 10 is, for example, PVC (polyvinyl chloride).

[0025] The substrate holding unit 20 holds the substrate W in a substantially horizontal position. Specifically, the substrate holding unit 20 includes a spin base 21 and a plurality of holding members 22. The spin base 21 is substantially disk-shaped. The plurality of holding members 22 are arranged on the upper surface of the spin base 21. The substrate holding unit 20 holds the substrate W by the plurality of holding members 22. Specifically, the plurality of holding members 22 are arranged at intervals on a circumference corresponding to the outer peripheral shape of the substrate W, on the peripheral edge portion of the upper surface of the spin base 21. The plurality of holding members 22 hold the peripheral edge surface of the substrate W.

[0026] The substrate rotation unit 30 rotates the substrate holding unit 20 around the rotation axis AX1. Therefore, the substrate holding unit 20 rotates around the rotation axis AX1. As a result, the substrate W held by the substrate holding unit 20 rotates around the rotation axis AX1. Specifically, the substrate rotation unit 30 includes a spin motor 31 and a spin shaft 32. The spin shaft 32 is integrated with the drive shaft of the spin motor 31. A spin base 21 is attached approximately horizontally to the upper end of the spin shaft 32. The spin motor 31 rotates the spin base 21 around the rotation axis AX1, thereby rotating the substrate W held by the multiple holding members 22 around the rotation axis AX1. The rotation axis AX1 is approximately parallel to the vertical direction.

[0027] The facing member 40 is disposed above the substrate W and the substrate holder 20. The facing member 40 faces the substrate W in the axial direction D1 of the rotation axis AX1. The facing member 40 has a substantially circular disk shape. The axial direction D1 is substantially parallel to the rotation axis AX1. The facing member 40 is made of a material such as PVC or PCTFE (polychlorotrifluoroethylene), for example.

[0028] The member rotating unit 50 supports the opposing member 40 and rotates the opposing member 40 around the rotation axis AX1. Specifically, the member rotating unit 50 includes a motor 51 and a support shaft 52. The support shaft 52 is centered on the rotation axis AX1. The support shaft 52 supports the opposing member 40 in a substantially horizontal position. The lower end of the support shaft 52 is fixed to the center of the upper surface 40a of the opposing member 40. When the motor 51 rotates the upper end of the support shaft 52, the opposing member 40 rotates around the rotation axis AX1.

[0029] The member moving unit 60 moves the opposing member 40 along a horizontal plane. Specifically, the member moving unit 60 includes a drive unit 61, a support 62, and an arm 63. The support 62 extends vertically. The support 62 supports the arm 63. Specifically, the base end of the arm 63 is connected to the support 62. The arm 63 extends horizontally from the support 62. The member rotating unit 50 is disposed at the tip end of the arm 63. Therefore, the arm 63 supports the member rotating unit 50 and the opposing member 40. The drive unit 61 rotates the support 62 around a rotation axis AX2 extending vertically. As a result, the arm 63 rotates along a horizontal plane. Therefore, the member rotating unit 50 and the opposing member 40 rotate along the horizontal plane together with the arm 63. The drive unit 61 includes, for example, a motor for rotating the support 62.

[0030] The member moving unit 60 raises or lowers the opposing member 40. Specifically, the driving unit 61 raises or lowers the support member 62. As a result, the arm 63 rises or lowers. Therefore, the member rotating unit 50 and the opposing member 40 rise or lower together with the arm 63. In order to raise or lower the support member 62, the driving unit 61 includes, for example, a ball screw mechanism and an elevator motor 64 that provides driving force to the ball screw mechanism. The elevator motor 64 is, for example, a stepping motor.

[0031] In detail, the member moving part 60 raises or lowers the opposing member 40 between a standby position P1 and a first proximity position P10. The standby position P1 and the first proximity position P10 indicate positions in the axial direction D1. The standby position P1 and the first proximity position P10 are positions where the movement of the opposing member 40 in the axial direction D1 is stopped. The standby position P1 indicates a position where the member moving part 60 is kept on standby. The standby position P1 can also be regarded as a home position. The standby position P1 indicates a position above the substrate W. The first proximity position P10 indicates a position closer to the substrate W than the standby position P1. The first proximity position P10 indicates a position separated from the upper surface Wa of the substrate W. In this embodiment, the first proximity position P10 indicates the lowest position of the opposing member 40. In this case, the first proximity position P10 can also be regarded as the position where the opposing member 40 is closest to the substrate W (closest position).

[0032] The first proximity position P10 corresponds to an example of the "proximity position" of the present invention.

[0033] Note that one or more proximity positions for stopping the opposing member 40 in the axial direction D1 may be set between the standby position P1 and the first proximity position P10. In the example of Fig. 1, a second proximity position P20 is set between the standby position P1 and the first proximity position P10.

[0034] Fig. 1 shows the opposing member 40 disposed at the standby position P1. Fig. 2 shows the opposing member 40 disposed at the first approach position P10. Fig. 2 shows an enlarged view of an area A. At the first approach position P10, the opposing member 40 covers the upper surface Wa of the substrate W, shielding the area above the upper surface Wa of the substrate W.

[0035] The opposing member 40 has an outer circumferential portion 41. Specifically, the opposing member 40 has a main body portion 44 and the outer circumferential portion 41. The main body portion 44 has a generally circular disk shape. The outer circumferential portion 41 is a portion of the opposing member 40 that is located radially outward from the main body portion 44 in the radial direction D2. The outer circumferential portion 41 has a generally annular shape centered on the rotation axis AX1. In the example of FIG. 2, the outer circumferential portion 41 has a first outer circumferential portion 411 and a second outer circumferential portion 412.

[0036] The first outer peripheral portion 411 forms an upper portion of the outer peripheral portion 41. The first outer peripheral portion 411 has, for example, a substantially circular disk shape. The first outer peripheral portion 411 has a substantially annular first outer peripheral surface 411a.

[0037] The second outer peripheral portion 412 forms the lower part of the outer peripheral portion 41. The second outer peripheral portion 412 has, for example, a substantially inverted truncated cone shape. The second outer peripheral portion 412 has a substantially annular second outer peripheral surface 412a.

[0038] The nozzle 70 is disposed on the facing member 40. Specifically, a hollow portion (not shown) extending in the axial direction D1 is provided on the rotation axis AX1 in the facing member 40 and the support shaft 52. The nozzle 70 is disposed in the hollow portion. The nozzle 70 extends in the axial direction D1. The lower end surface of the nozzle 70 is disposed near the lower surface 40b of the facing member 40. The nozzle 70 is located in the center of the lower surface 40b of the facing member 40. When the facing member 40 is disposed at the first proximity position P10 or the second proximity position P20 (FIG. 1), the nozzle 70 faces the center of the upper surface Wa of the substrate W.

[0039] Fig. 3 is a schematic cross-sectional view showing the nozzle 70. As shown in Fig. 3, the substrate processing unit 5 further includes a fluid supply unit 128. The fluid supply unit 128 supplies a processing fluid supplied from a fluid supply source 129 to the nozzle 70. The nozzle 70 supplies the processing fluid supplied from the fluid supply unit 128 to the substrate W.

[0040] Specifically, the fluid supply unit 128 includes a processing liquid supply unit 131 and a processing gas supply unit 135. The fluid supply source 129 includes a processing liquid supply source 130 and a processing gas supply source .

[0041] The processing liquid supply unit 131 supplies the processing liquid supplied from the processing liquid supply source 130 to the nozzle 70. The nozzle 70 ejects the processing liquid onto the substrate W. The processing gas supply unit 135 supplies the processing gas supplied from the processing gas supply source 134 to the nozzle 70. The nozzle 70 ejects the processing gas toward the space SP. The space SP indicates the space between the facing member 40 and the substrate W.

[0042] In the following, as an example, the processing liquid is a rinse liquid, and the processing gas is an inert gas.

[0043] The processing liquid supply unit 131 includes a valve 132 and a pipe 133. The pipe 133 extends from the processing liquid supply source 130 to the nozzle 70. The valve 132 is disposed on the pipe 133. When the valve 132 is opened, the processing liquid is supplied from the pipe 133 to the nozzle 70. When the valve 132 is closed, the supply of the processing liquid to the nozzle 70 is stopped.

[0044] The process gas supply unit 135 includes a valve 136 and a pipe 137. The pipe 137 extends from the process gas supply source 134 to the nozzle 70. The valve 136 is disposed on the pipe 137. When the valve 136 is opened, the process gas is supplied from the pipe 137 to the nozzle 70. When the valve 136 is closed, the supply of the process gas to the nozzle 70 is stopped.

[0045] The nozzle 70 has a processing liquid outlet 71 and a processing gas outlet 72. The processing liquid outlet 71 and the processing gas outlet 72 are arranged on the lower end surface of the nozzle 70. The nozzle 70 ejects the processing liquid supplied from the pipe 133 from the processing liquid outlet 71. The nozzle 70 ejects the processing gas supplied from the pipe 137 from the processing gas outlet 72. The timing and period for ejecting the processing liquid and the timing and period for ejecting the processing gas may be the same, different, or overlapping.

[0046] 2, the guard portion 80 surrounds the substrate holding portion 20 in a plan view. The guard portion 80 receives the processing liquid splashed from the substrate W.

[0047] 2, the guard portion 80 includes a plurality of guards 81 and a plurality of cups 82. Note that the guard portion 80 may include one guard 81 and one cup 82.

[0048] The guard 81 is approximately cylindrical and surrounds the substrate holder 20. The cup 82 forms an approximately annular groove below the lower end of the guard 81. When the guard 81 is raised from the non-facing position to the facing position, the guard 81 receives processing liquid splashed from the substrate W. The facing position indicates a position where the guard 81 faces the substrate W in the radial direction D2. The radial direction D2 indicates a radial direction relative to the rotation axis AX1. The non-facing position indicates a position where the guard 81 does not face the substrate W in the radial direction D2. The non-facing position is a lower position than the facing position.

[0049] The guard moving unit 90 raises or lowers the guard unit 80. The guard moving unit 90 individually raises or lowers the guards 81. The guard moving unit 90 includes, for example, a ball screw mechanism and a motor that provides a driving force to the ball screw mechanism.

[0050] 2, the guard 81 on the outer side in the radial direction D2 is disposed in the opposing position, and the guard 81 on the inner side in the radial direction D2 is disposed in the non-opposing position. When the guard 81 on the outer side in the radial direction D2 is disposed in the opposing position, this indicates that the guard part 80 is disposed in the upper limit position G2.

[0051] 1, the outer guard 81 in the radial direction D2 and the inner guard 81 in the radial direction D2 are arranged in non-opposing positions. When the outer guard 81 in the radial direction D2 is arranged in the non-opposing position, this indicates that the guard part 80 is arranged in the lower limit position G1.

[0052] The detection unit 100 detects the state of the outer circumferential portion 41 of the opposing member 40. Hereinafter, the state of the outer circumferential portion 41 of the opposing member 40 may be referred to as the "outer circumferential state." As shown in FIG. 2, the detection unit 100 is spaced apart from the guard unit 80 when the guard unit 80 is positioned at the upper limit position G2. Therefore, according to this embodiment, contact between the guard unit 80 and the detection unit 100 can be prevented. For example, the detection unit 100 is positioned at a higher position than the upper limit position G2 of the guard unit 80. Furthermore, the detection unit 100 is positioned, for example, in the chamber 10 on the opposite side of the rotation axis AX1 from the drive unit 61 and the support body 62.

[0053] The storage unit 110 has a substantially box shape and stores the detection unit 100. Therefore, according to this embodiment, the processing liquid scattered from the substrate W and the mist of the processing liquid can be prevented from adhering to the detection unit 100. Furthermore, even if gas is generated by a reaction between the processing liquid and the substrate W, the detection unit 100 can be prevented from being exposed to the gas atmosphere. The storage unit 110 is made of a material such as PVC (polyvinyl chloride).

[0054] The storage unit 110 is spaced apart from the guard unit 80 when the guard unit 80 is positioned at the upper limit position G2. Therefore, according to this embodiment, contact between the guard unit 80 and the storage unit 110 can be prevented. For example, the storage unit 110 is positioned at a higher position than the upper limit position G2 of the guard unit 80. Furthermore, the storage unit 110 is positioned, for example, within the chamber 10 on the opposite side of the rotation axis AX1 from the drive unit 61 and the support body 62.

[0055] The storage unit 110 is fixed inside the chamber 10 by a fixture (not shown). The detection unit 100 is fixed inside the storage unit 110 by a fixture (not shown). If the substrate processing unit 5 does not include the storage unit 110, the detection unit 100 is fixed inside the chamber 10 by a fixture (not shown).

[0056] Specifically, the storage unit 110 includes a storage main body 111 and a light-transmitting portion 112. The storage main body 111 has a substantially box shape and stores the detection unit 100. The light-transmitting portion 112 transmits light. The light-transmitting portion 112 is, for example, transparent. The light-transmitting portion 112 is fixed to the storage main body 111.

[0057] The detection unit 100 optically detects the state of the outer periphery 41 of the opposing member 40 via the light transmitting portion 112.

[0058] Next, a reference example will be described with reference to FIG. 4. FIG. 4 is a side view showing a portion of a facing member 400 according to the reference example. As shown in FIG. 4, a contact mark 401 and a burr 402 are generated on the facing member 400 according to the reference example. Specifically, in the facing member 400 according to the reference example, the heat of the motor that rotates the facing member 400 may cause slight downward deformation of the outer periphery 403 of the facing member 400. When slight downward deformation occurs in the facing member 400, the lower surface of the outer periphery 403 of the facing member 400 may come into contact with the substrate, and the contact mark 401 and the burr 402 may be generated on the lower surface of the outer periphery 403. When the burr 402 is generated, the burr 402 may come into contact with the substrate when the next substrate is processed, which may result in the generation of particles.

[0059] The reason why the outer peripheral portion 403 of the opposing member 400 is slightly deformed downward is detailed as follows: For example, the heat of the motor causes the upper surface 404 of the outer peripheral portion 403 to expand, causing the outer peripheral portion 403 to be slightly deformed downward. In addition, for example, the heat of the motor causes the outer peripheral portion 403 to be slightly deformed downward due to its own weight.

[0060] In FIG. 4, the deformation of the outer periphery 403 is exaggerated for ease of understanding.

[0061] In this embodiment, as shown in FIG. 1, the state of the outer peripheral portion 403 of the opposing member 40 is detected by the detection unit 100, thereby preventing the opposing member 40 from coming into contact with the substrate W even if the outer peripheral portion 41 of the opposing member 40 is slightly deformed downward.

[0062] That is, the first proximity position information indicating the first proximity position P10 (FIG. 2) is changed based on the state of the outer periphery 41 of the facing member 40. Then, the facing member 40 is placed at the first proximity position P10 (hereinafter referred to as "P10#") indicated by the changed first proximity position information. Specifically, the changed first proximity position P10# is higher in the axial direction D1 than the first proximity position P10 before the change. Therefore, according to this embodiment, even if the outer periphery 41 of the facing member 40 is slightly deformed downward, the facing member 40 can be prevented from contacting the substrate W.

[0063] In particular, in this embodiment, the state of the outer circumferential portion 41 of the opposing member 40 detected by the detection unit 100 is indicated by the amount of displacement of the outer circumferential portion 41 of the opposing member 40. In this case, the amount of displacement of the outer circumferential portion 41 is the amount of displacement along the axial direction D1 of the rotation axis AX1, and indicates the amount of displacement relative to the position M1 of the outer circumferential portion 41 of the opposing member 40 in the reference state ST1. Therefore, according to this embodiment, minute deformation of the opposing member 40 due to heat can be detected with high accuracy.

[0064] Next, the reference state ST1, the deformed state ST2, and the displacement amount of the opposing member 40 will be described with reference to FIG.

[0065] 5(a) is a diagram showing the reference state ST1 of the opposing member 40 disposed at the reference position PB. As shown in FIG. 5(a), the detection unit 100 detects the state of the outer circumferential portion 41 of the opposing member 40 when the opposing member 40 is in the reference state ST1 and disposed at the reference position PB (FIG. 1).

[0066] The reference state ST1 indicates the state of the opposing member 40 when the reference position PB of the opposing member 40 is set, the state of the opposing member 40 immediately after introduction into the substrate processing unit 5, the state of the opposing member 40 immediately after replacement of the opposing member 40, the state of the opposing member 40 when it is unused, the state of the opposing member 40 when it is not deformed, or a state equivalent to these.

[0067] 1, the reference position PB is a position where the opposing member 40 is spaced apart from the substrate W in the axial direction D1, and is a fixed position determined as a position where the detection unit 100 detects the state of the outer periphery 41 of the opposing member 40. Once the reference position PB is determined, the rotational position of the lift motor 64 of the member moving unit 60 is stored as the reference rotational position in the memory unit 147 (FIG. 6) when the opposing member 40 is disposed at the reference position PB. Thereafter, by setting the rotational position of the lift motor 64 to the reference rotational position, the opposing member 40 is disposed at the reference position PB. Therefore, the reference position PB is set as a fixed position that does not fluctuate regardless of whether the opposing member 40 is deformed or not.

[0068] 1, the reference position PB is represented by the distance L1 between the upper surface Wa of the substrate W and the reference position PB. When the state of the facing member 40 is the reference state ST1, in the example of Fig. 1, the position in the axial direction D1 of the lower surface 40b of the facing member 40 is made to coincide with the reference position PB. Note that there are no particular limitations on the portion of the facing member 40 in the reference state ST1 that is made to coincide with the reference position PB.

[0069] 1, the reference position PB is the standby position P1 of the opposing member 40. That is, the detection unit 100 detects the state of the outer periphery 41 of the opposing member 40 disposed at the standby position P1. According to this preferred example, the throughput when processing the substrate W can be improved compared to when the reference position PB is set between the standby position P1 and the first approach position P10. This is because there is no need to ensure a period during which the opposing member 40 is stopped for detection by the detection unit 100 while the opposing member 40 is descending.

[0070] Returning to FIG. 5(a), in this embodiment, the detection unit 100 is a laser displacement meter. The laser displacement meter employs, for example, a diffuse reflection method or a specular reflection method. The light-transmitting portion 112 of the storage portion 110 is disposed on an optical path connecting the detection unit 100 and the outer periphery 41 of the opposing member 40. Therefore, the detection unit 100 irradiates the outer periphery 41 with laser light LT via the light-transmitting portion 112 and receives the reflected light, thereby detecting a position M1 of the outer periphery 41 of the opposing member 40 at the reference position PB and reference state ST1 of the opposing member 40. The position M1 indicates a position in the axial direction D1. The detection unit 100 includes a light-emitting element, a light-receiving element, and a lens.

[0071] The laser light LT corresponds to an example of the "light" of the present invention.

[0072] Fig. 5(b) is a diagram showing a deformation state ST2 of the opposing member 40 disposed at the reference position PB. In Fig. 5(b), the outer peripheral portion 41 of the opposing member 40 is slightly deformed downward due to the heat of the motor 51. Note that Fig. 5(b) exaggerates the deformation of the outer peripheral portion 41 for ease of understanding.

[0073] When the opposing member 40 is in the reference position PB and in the deformed state ST2, the detection unit 100 detects a position M2 of the outer circumferential portion 41 of the opposing member 40 by irradiating the outer circumferential portion 41 with laser light LT via the light transmitting portion 112 and receiving the reflected light. Position M1 indicates a position in the axial direction D1. The detection unit 100 then outputs a displacement amount d1, which is the difference between the position M1 of the outer circumferential portion 41 in the reference state ST1 and the position M2 of the outer circumferential portion 41 in the deformed state ST2. In other words, the detection unit 100 outputs the displacement amount d1 of the outer circumferential portion 41 in the deformed state ST2 relative to the outer circumferential portion 41 in the reference state ST1.

[0074] In particular, in this embodiment, the displacement amount d1 of the facing member 40 indicates the downward displacement amount. Therefore, the first approach position P10 (FIG. 2) can be changed based on the downward displacement amount d1 of the outer circumferential portion 41 of the facing member 40 due to the heat of the motor 51. Therefore, when the facing member 40 is displaced downward, contact between the facing member 40 and the substrate W can be prevented.

[0075] 5, the detection unit 100 irradiates the laser light LT onto the first outer peripheral surface 411a of the first outer peripheral portion 411. In this case, for example, the detection unit 100 may irradiate the laser light LT onto the lower edge 411b of the first outer peripheral surface 411a.

[0076] However, the irradiation position of the laser light LT is not particularly limited as long as the laser light LT is irradiated onto the outer circumferential portion 41. For example, the detection unit 100 may irradiate the laser light LT onto the second outer circumferential surface 412a of the second outer circumferential portion 412. In this case, for example, the detection unit 100 may irradiate the laser light LT onto the lower edge 412b of the second outer circumferential surface 412a.

[0077] Here, the position of the opposing member 40 in the axial direction D1 is indicated by the distance from the upper surface Wa of the substrate W to the lower surface 40b of the opposing member 40 as shown in FIG. 1. For example, as shown in FIG. 1, the standby position P1 of the opposing member 40 is indicated by the distance L1 from the upper surface Wa of the substrate W to the lower surface 40b of the opposing member 40. Also, as shown in FIG. 2, the first proximity position P10 of the opposing member 40 is indicated by the distance L2 from the upper surface Wa of the substrate W to the lower surface 40b of the opposing member 40. Therefore, the member moving unit 60 positions the opposing member 40 at the first proximity position P10 by lowering the opposing member 40, which is disposed at the standby position P1, from the position of distance L1 to the position of distance L2. In other words, the member moving unit 60 positions the opposing member 40 at the first proximity position P10 by lowering the opposing member 40 by the distance (L1-L2).

[0078] Next, details of the control device 120 will be described with reference to Fig. 6. Fig. 6 is a block diagram showing the control device 120. As shown in Fig. 6, the control device 120 includes a control unit 121 and a storage unit 147.

[0079] The control unit 121 includes a substrate rotation control unit 140, a member rotation control unit 141, a member movement control unit 142, a guard movement control unit 143, a fluid control unit 144, a detection control unit 145, and a position information change unit 146. The storage unit 147 stores a recipe 148. The recipe 148 indicates the processing content and processing procedure for the substrate W. The control unit 121 controls the substrate processing unit 5 in accordance with the recipe 148. The recipe 148 also stores first proximity position information indicating a first proximity position P10 when the state of the opposing member 40 is in the reference state ST1, and second proximity position information indicating a second proximity position P20 when the state of the opposing member 40 is in the reference state ST1.

[0080] The control unit 121 includes a processor such as a CPU (Central Processing Unit) and an MPU (Micro Processing Unit). The memory unit 127 includes a storage device and stores data and computer programs. Specifically, the memory unit 127 includes a main storage device such as a semiconductor memory, and an auxiliary storage device such as a semiconductor memory, a solid-state drive, and / or a hard disk drive. The memory unit 127 may include removable media. The memory unit 127 corresponds to an example of a non-transitory computer-readable storage medium.

[0081] The processor of the control unit 121 executes the computer program stored in the storage device of the memory unit 127, thereby functioning as a substrate rotation control unit 140, a member rotation control unit 141, a member movement control unit 142, a guard movement control unit 143, a fluid control unit 144, a detection control unit 145, and a position information change unit 146.

[0082] Next, a substrate processing method according to this embodiment will be described with reference to Figures 6 and 7. The substrate processing method is performed by a substrate processing apparatus 1. Figure 7 is a flowchart showing the substrate processing method according to this embodiment. As shown in Figure 7, the substrate processing method includes steps S1 to S16.

[0083] 6 and 7, in step S1, the control unit 121 controls a transfer robot (not shown) to load the substrate W into the chamber 10. As a result, the transfer robot transfers the substrate W into the chamber 10.

[0084] Next, in step S2, the substrate rotation control unit 140 controls the substrate rotation unit 30 to start rotating the substrate W. As a result, the substrate rotation unit 30 starts rotating the substrate holding unit 20, thereby starting rotation of the substrate W. For example, the number of rotations per unit time of the substrate W and the substrate holding unit 20 is denoted as "R1."

[0085] Next, in step S3, the member rotation control unit 141 controls the member rotation unit 50 to start rotating the opposing member 40 disposed at the reference position PB. As a result, the member rotation unit 50 rotates the opposing member 40. In this embodiment, the reference position PB coincides with the standby position P1. Also, for example, the rotation speed R2 per unit time of the opposing member 40 is lower than the rotation speed R1 per unit time of the substrate W in step S2.

[0086] Next, in step S4, the detection control unit 145 controls the detection unit 100 to detect the state of the outer periphery 41 of the facing member 40 placed at the reference position PB. As a result, the detection unit 100 detects the state of the outer periphery 41 of the facing member 40. In particular, in this embodiment, the detection unit 100 detects the state of the outer periphery 41 of the facing member 40 while the facing member 40 is rotating. Therefore, according to this embodiment, it is possible to detect the largest state change among state changes at multiple positions in the circumferential direction of the outer periphery 41 of the substrate W.

[0087] Specifically, the state of the outer peripheral portion 41 of the opposing member 40 detected by the detection unit 100 is indicated by the displacement amount d1 of the outer peripheral portion 41 of the opposing member 40 ( FIG. 5( b) ). Therefore, the detection control unit 145 controls the detection unit 100 to detect the displacement amount d1 of the outer peripheral portion 41 of the opposing member 40. As a result, the detection unit 100 detects the displacement amount d1 of the outer peripheral portion 41 of the opposing member 40, and outputs information indicating the displacement amount d1 to the control unit 121.

[0088] Next, in step S5, the member rotation control unit 141 controls the member rotation unit 50 so as to increase the rotation speed per unit time of the opposing member 40 from rotation speed R2 to the same rotation speed as rotation speed R1 of the substrate W. As a result, the member rotation unit 50 increases the rotation speed of the opposing member 40 from rotation speed R2 to the same rotation speed as rotation speed R1 of the substrate W.

[0089] Next, in step S6, the position information change unit 146 determines whether or not it is necessary to change the first proximity position information based on the state of the outer periphery 41 of the substrate W. Specifically, the position information change unit 146 determines whether or not it is necessary to change the first proximity position information based on the displacement amount d1 of the outer periphery 41 of the substrate W. More specifically, the position information change unit 146 determines whether or not the displacement amount d1 of the outer periphery 41 of the substrate W is equal to or greater than a threshold value TH.

[0090] If it is determined in step S6 that the first proximity position information does not need to be changed (No), the process proceeds to step S9. That is, if it is determined in step S6 that the displacement amount d1 is not equal to or greater than the threshold value TH (No), the process proceeds to step S9.

[0091] Next, in step S9, the member movement control unit 142 controls the member moving unit 60 to place the opposing member 40 at the second proximity position P20 (FIG. 1) indicated by the second proximity position information. As a result, the member moving unit 60 places the opposing member 40 at the second proximity position P20.

[0092] On the other hand, if it is determined in step S6 that the first proximity position information needs to be changed (Yes), the process proceeds to step S7. That is, if it is determined in step S6 that the displacement amount d1 is equal to or greater than the threshold value TH (Yes), the process proceeds to step S7.

[0093] Next, in step S7, the position information change unit 146 changes the first proximity position information indicating the first proximity position P10 and the second proximity position information indicating the second proximity position P20 based on the outer circumferential state of the opposing member 40. Specifically, the position information change unit 146 changes the first proximity position information and the second proximity position information based on the displacement amount d1 of the outer circumferential portion 41 of the opposing member 40.

[0094] More specifically, the position information change unit 146 changes the first proximity position P10 of the opposing member 40 in the reference state ST1 ( FIG. 5(a) ) upward in the axial direction D1 by a distance equal to the displacement amount d1, and registers the changed position as a new first proximity position P10# in the recipe 148. That is, the position information change unit 146 changes the first proximity position information in the recipe 148 so that it indicates the new first proximity position P10#. For example, if the first proximity position P10 indicated by the first proximity position information before the change is "L2" ( FIG. 2 ), the position information change unit 146 changes the first proximity position information in the recipe 148 to "L2+d1" as the new first proximity position P10#.

[0095] Similarly, the second proximity position P20 of the opposing member 40 in the reference state ST1 ( FIG. 5(a) ) is changed upward in the axial direction D1 by a distance equal to the displacement amount d1, and the changed position is registered as a new second proximity position P20# in the recipe 148. That is, the position information change unit 146 changes the second proximity position information in the recipe 148 so as to indicate the new second proximity position P20#.

[0096] Next, in step S8, the member movement control unit 142 controls the member moving unit 60 to place the opposing member 40 at the second proximity position P20# indicated by the changed second proximity position information. As a result, the member moving unit 60 places the opposing member 40 at the changed second proximity position P20#. In other words, the member moving unit 60 lowers the opposing member 40 from the standby position P1 to the changed second proximity position P20#.

[0097] In each of steps S8 and S9, the fluid control unit 126 controls the process gas supply unit 135 so that the nozzle 70 starts to eject the process gas. As a result, the process gas supply unit 135 causes the nozzle 70 to start to eject the process gas. Furthermore, in each of steps S8 and S9, the guard movement control unit 143 controls the guard moving unit 90 so that the guard 81 moves up to the facing position. As a result, the guard moving unit 90 moves the guard 81 up from the non-facing position to the facing position.

[0098] Next, in step S10, the fluid control unit 144 controls the processing liquid supply unit 131 so that the nozzle 70 discharges the processing liquid onto the substrate W for a first predetermined period. As a result, the nozzle 70 discharges the processing liquid onto the substrate W for the first predetermined period. Then, after the first predetermined period has elapsed, the nozzle 70 stops discharging the processing liquid.

[0099] Next, in step S11, if the first proximity position information has been changed (step S7), the member movement control unit 142 controls the member moving unit 60 to position the opposing member 40 at the first proximity position P10# indicated by the changed first proximity position information. As a result, the member moving unit 60 positions the opposing member 40 at the first proximity position P10# indicated by the changed first proximity position information. That is, the member moving unit 60 lowers the opposing member 40 from the second proximity position P20# to the changed first proximity position P10#. Because the changed first proximity position P10# is a proximity position changed depending on the state of the outer periphery 41 of the opposing member 40 (step S7), it is possible to prevent the opposing member 40 from contacting the substrate W even if the opposing member 40 is slightly deformed.

[0100] Specifically, the changed first proximity position P10# is a position higher than the first proximity position P10 before the change by a distance equal to the downward displacement d1 (FIG. 5(b)) of the outer circumferential portion 41 of the facing member 40. Therefore, according to this embodiment, even if the facing member 40 is slightly deformed downward, contact between the facing member 40 and the substrate W can be prevented.

[0101] On the other hand, if the first proximity position information has not been changed (No in step S6), in step S11, the member movement control unit 142 controls the member moving unit 60 so that the opposing member 40 is placed at the first proximity position P10 indicated by the unchanged first proximity position information. As a result, the member moving unit 60 places the opposing member 40 at the first proximity position P10 indicated by the unchanged first proximity position information.

[0102] Next, in step S12, the substrate rotation control unit 140 controls the substrate rotation unit 30 to increase the rotation speed per unit time of the substrate W from rotation speed R1. As a result, the substrate rotation unit 30 increases the rotation speed per unit time of the substrate holder 20 from rotation speed R1, thereby drying the substrate W. In this case, the member rotation control unit 141 controls the member rotation unit 50 to rotate the opposing member 40 at the same rotation speed per unit time as the substrate W. As a result, the member rotation unit 50 rotates the opposing member 40 at the same rotation speed as the substrate W. In step S12, drying of the substrate W is performed for a second predetermined period.

[0103] Next, in step S13, the substrate rotation control unit 140 controls the substrate rotation unit 30 to stop the rotation of the substrate W. As a result, the substrate rotation unit 30 stops the rotation of the substrate holder 20, and stops the rotation of the substrate W.

[0104] Next, in step S14, the member rotation control unit 141 controls the member rotation unit 50 to stop the rotation of the facing member 40. As a result, the member rotation unit 50 stops the rotation of the facing member 40. Also in step S14, the fluid control unit 126 controls the process gas supply unit 135 to stop the nozzle 70 from ejecting the process gas. As a result, the process gas supply unit 135 causes the nozzle 70 to stop ejecting the process gas. Furthermore, in step S14, the guard movement control unit 143 controls the guard movement unit 90 to lower the guard 81 to the non-facing position. As a result, the guard movement unit 90 lowers the guard 81 from the facing position to the non-facing position.

[0105] Next, in step S15, the member movement control unit 142 controls the member moving unit 60 to place the opposing member 40 at the reference position PB (standby position P1). As a result, the member moving unit 60 places the opposing member 40 at the reference position PB (standby position P1).

[0106] Specifically, if the first proximity position information has been changed (step S7), in step S15, the member moving unit 60 raises the opposing member 40 from the first proximity position P10# indicated by the changed first proximity position information to the reference position PB (standby position P1).

[0107] On the other hand, if the first proximity position information has not been changed (No in step S6), in step S15, the member moving unit 60 raises the opposing member 40 from the first proximity position P10 indicated by the unchanged first proximity position information to the reference position PB (standby position P1).

[0108] Next, in step S16, the control unit 121 controls the transfer robot to unload the substrate W from the chamber 10. As a result, the transfer robot unloads the substrate W from the chamber 10. Then, the substrate processing method is completed.

[0109] 7, according to this embodiment, the rotation speed R1 of the facing member 40 per unit time when the state of the facing member 40 is detected is lower than the rotation speed of the substrate W. In other words, the rotation speed R1 of the facing member 40 per unit time when the state of the facing member 40 is detected is lower than the rotation speeds of the substrate W and the facing member 40 in steps S10 and S12. This makes it easier for the detection unit 100 to detect the state of the outer circumferential portion 41 of the facing member 40.

[0110] (First Modification) A first modified example will be described with reference to Fig. 8. The first modified example differs mainly from the embodiment described above with reference to Fig. 1 in that the detection unit 100 is arranged outside the chamber 10. Below, the differences between the first modified example and the embodiment described above will be mainly described.

[0111] 8 is a schematic cross-sectional view showing a substrate processing apparatus 1A according to a first modified example. As shown in FIG. 8, in the substrate processing apparatus 1A, the detection unit 100 is disposed outside the chamber 10. This prevents the processing liquid scattered from the substrate W and the mist of the processing liquid from adhering to the detection unit 100. Furthermore, even if gas is generated by a reaction between the processing liquid and the substrate W, the detection unit 100 can be prevented from being exposed to the gas atmosphere. Furthermore, compared to when the detection unit 100 is disposed inside the chamber 10, the degree of freedom in arranging the detection unit 100 can be improved.

[0112] Moreover, in the first modified example, the chamber 10 has a light transmitting portion 113. Therefore, the detection unit 100 can optically detect the state of the outer circumferential portion 41 of the opposing member 40 via the light transmitting portion 113. In the example of FIG. 8, the light transmitting portion 113 is disposed on an upper portion of the side wall 10A of the chamber 10.

[0113] (Second Modification) A second modified example will be described with reference to Fig. 9. The second modified example differs from the embodiment described above with reference to Fig. 1 mainly in that the opposing member 40B has a peripheral wall portion 45. Below, the differences between the second modified example and the embodiment will be mainly described.

[0114] 9 is a schematic cross-sectional view showing a substrate processing apparatus 1B according to a second modified example. As shown in FIG. 9, in the substrate processing apparatus 1B, the opposing member 40B includes a main body portion 44 and an outer circumferential portion 41B. The outer circumferential portion 41B is a portion of the opposing member 40B that is located radially outward from the main body portion 44 in the radial direction D2. The outer circumferential portion 41B includes a peripheral wall portion 45. The peripheral wall portion 45 has a substantially cylindrical shape and extends downward from the outer edge of the main body portion 44. The peripheral wall portion 45 faces the outer edge of the substrate W in the radial direction D2 when the opposing member 40B is disposed at the first approach position P10.

[0115] The detection unit 100 detects the state of the peripheral wall portion 45 included in the outer circumferential portion 41B of the opposing member 40B when the opposing member 40B is disposed at the reference position PB (see FIG. 1). The state of the peripheral wall portion 45 is indicated by the amount of displacement of the peripheral wall portion 45. In this case, the amount of displacement of the peripheral wall portion 45 is the amount of displacement along the axial direction D1, and indicates the amount of displacement relative to the position of the peripheral wall portion 45 of the opposing member 40B in the reference state ST1.

[0116] The embodiments of the present invention have been described above with reference to the drawings. However, the present invention is not limited to the above embodiments and can be implemented in various forms without departing from the spirit of the present invention. Furthermore, the components disclosed in the above embodiments can be modified as appropriate. For example, some of the components shown in one embodiment may be added to the components of another embodiment, or some of the components shown in one embodiment may be deleted from the embodiment.

[0117] Furthermore, the drawings mainly show each component in a schematic manner to facilitate understanding of the invention, and the thickness, length, number, spacing, etc. of each component shown in the drawings may differ from the actual ones due to the convenience of creating the drawings. Furthermore, the configuration of each component shown in the above embodiment is merely an example and is not particularly limited, and it goes without saying that various modifications are possible within a range that does not substantially deviate from the effects of the present invention.

[0118] (1) In the embodiment (including the modified examples) described with reference to FIGS. 1 to 9 , a laser displacement meter has been described as an example of the detection unit 100. However, the detection unit 100 is not limited to a laser displacement meter and may be, for example, a device that can optically detect the state of the outer peripheries 41, 41B of the opposing members 40, 40B. In this case, the detection unit 100 is, for example, an imaging device such as a camera. In this case, the detection unit 100 captures an image of the outer peripheries 41, 41B of the opposing members 40, 40B via the light transmitting portion 112 or the light transmitting portion 113. The detection control unit 145 then analyzes the captured image showing the imaging results of the outer peripheries 41, 41B to identify the state of the outer peripheries 41, 41B. For example, the detection control unit 145 calculates the amount of displacement of the outer peripheries 41, 41B by analyzing the captured image showing the imaging results of the outer peripheries 41, 41B.

[0119] 1 to 9, the position information change unit 146 changes the first proximity position P10 of the opposing member 40 in the reference state ST1 upward in the axial direction D1 by a distance equal to the displacement amount d1, and sets the changed position as a new first proximity position P10#. However, the position information change unit 146 may also change the first proximity position P10 of the opposing member 40 in the reference state ST1 upward in the axial direction D1 by a distance equal to or greater than the displacement amount d1, and set the changed position as a new first proximity position P10#.

[0120] (3) In the embodiment (including the modified example) described with reference to FIGS. 1 to 9, the second proximity position P20 is set, but the second proximity position P20 does not have to be set. In this case, for example, in step S8 of FIG. 7, the opposing member 40 is placed at the changed first proximity position P10#. On the other hand, for example, in step S9 of FIG. 7, the opposing member 40 is placed at the unchanged first proximity position P10. Then, step S11 is omitted. [Industrial Applicability]

[0121] The present invention relates to a substrate processing apparatus and a substrate processing method, and has industrial applicability. [Explanation of symbols]

[0122] 1, 1A, 1B Substrate processing equipment 20 Board holding part 30 Substrate rotation unit 40, 40B opposing members 41, 41B outer periphery 50 Rotating part of component 60 Component moving section 70 nozzles 80 Guard section 90 Guard Moving Part 100 Detector 110 Storage section 111 Storage unit 112 Light transmission part 142 Component movement control unit 146 Location information change unit W substrate

Claims

1. A substrate processing apparatus for processing a substrate, a substrate holder for holding the substrate; a substrate rotation unit that rotates the substrate holding unit; an opposing member disposed above the substrate holding portion and facing the substrate; a member rotating unit that rotates the opposing member; a member moving unit that raises or lowers the opposing member between a proximity position that is closer to the substrate than a standby position and the standby position; a detection unit that detects a state of an outer periphery of the opposing member; a position information changing unit that changes proximity position information indicating the proximity position based on a state of the outer periphery of the opposing member; a member movement control unit that controls the member moving unit so that the opposing member is placed at the proximity position indicated by the changed proximity position information; A substrate processing apparatus comprising:

2. The substrate processing apparatus according to claim 1 , wherein the detection unit detects a state of the outer periphery of the opposing member disposed at the standby position.

3. 3. The substrate processing apparatus according to claim 1, wherein the detection unit detects the state of the outer periphery of the opposing member while the opposing member is rotating.

4. the state of the outer circumferential portion of the opposing member is indicated by a displacement amount of the outer circumferential portion of the opposing member, the substrate holder rotates about a rotation axis; 3. The substrate processing apparatus according to claim 1, wherein the displacement amount is a displacement amount along the axial direction of the rotation axis and indicates a displacement amount relative to a position of the outer periphery of the opposing member in a reference state.

5. The substrate processing apparatus according to claim 4 , wherein the displacement amount indicates a downward displacement amount.

6. Further provided is a storage section that stores the detection section, The storage section is a storage body that stores the detection unit; a light transmitting portion that transmits light; Including, 5. The substrate processing apparatus according to claim 4, wherein the detection unit detects the amount of displacement by irradiating the outer periphery of the opposing member with light through the light transmitting unit or by capturing an image of the outer periphery of the opposing member through the light transmitting unit.

7. a guard portion that surrounds the substrate holder in a plan view and receives processing liquid that has splashed from the substrate; a guard moving unit that raises or lowers the guard unit; Further provided with The substrate processing apparatus according to claim 6 , wherein the storage section is spaced apart from the guard section when the guard section is in the upper limit position.

8. 1. A substrate processing method performed by a substrate processing apparatus including an opposing member that faces a substrate and moves up or down between a proximity position that is closer to the substrate than a standby position and the standby position, detecting a state of an outer periphery of the opposing member; changing proximity position information indicating the proximity position based on a state of the outer periphery of the opposing member; placing the opposing member at the proximity position indicated by the changed proximity position information; A substrate processing method comprising:

Images