Holding member

Abstract

To provide a holding member with excellent durability that enables long-term use.SOLUTION: A holding member comprises a first member, a second member, and an adhesive member that bonds the first member and the second member, wherein when a stress generated in the adhesive member while the first member and the second member are being pulled with a constant tensile load along a connection direction in which the first member and the second member are connected via the adhesive member under a temperature condition of 120°C is defined as holding stress (MPa), and a time from when the holding stress (MPa) starts to be applied to the adhesive member until the adhesive member ruptures is defined as rupture time (h), an amount of change in the value of the holding stress (MPa) that increases the common logarithm of the rupture time (h) by 1 is a value within a range of -0.09 MPa or more and less than 0 MPa.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a retaining member. [Background technology]

[0002] As a holding member for holding an object, an electrostatic chuck that holds a wafer as an object by electrostatic attraction is known. For example, Patent Documents 1 and 2 disclose an electrostatic chuck that includes a base member made of metal, a ceramic member made of ceramic, and an adhesive member that bonds the base member and the ceramic member. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6611743 [Patent Document 2] Patent No. 6886440 Summary of the Invention [Problem to be solved by the invention]

[0004] However, neither of the techniques in Patent Documents 1 nor 2 fully considers the durability of the adhesive member against stress applied to the adhesive member when the base member and the ceramic member are pulled. A holding member with low durability against such stress may be limited in its long-term use. For this reason, there has been a demand for the development of a holding member with excellent durability.

[0005] The present invention has been made to solve at least part of the above-mentioned problems, and has an object to provide a holding member that is highly durable and can be used for a long period of time. [Means for solving the problem]

[0006] The present invention has been made to solve at least part of the above-mentioned problems, and can be realized in the following forms.

[0007] (1) According to one aspect of the present invention, there is provided a retaining member comprising a first member, a second member, and an adhesive member that bonds the first member and the second member together, wherein, when the first member and the second member are pulled with a constant tensile load along a connection direction in which the first member and the second member are connected via the adhesive member under a temperature condition of 120°C, the stress generated in the adhesive member when the first member and the second member are pulled with a constant tensile load is defined as a retaining stress (MPa), and the time from when the retaining stress (MPa) begins to act on the adhesive member until the adhesive member breaks is defined as a breaking time (h), the change in the value of the retaining stress (MPa) resulting from an increase in the common logarithm of the breaking time (h) by 1 is a value within a range of -0.09 MPa or more and less than 0 MPa.

[0008] This configuration makes it possible to provide a holding member equipped with an adhesive member in which the change in the value of the holding stress (MPa) resulting from an increase in the common logarithm of the time to fracture (h) by 1 is within the range of -0.09 MPa or more and less than 0 MPa. Therefore, since the change in the common logarithm of the time to fracture (h) when the value of the holding stress (MPa) is changed is relatively large, it is possible to provide a holding member in which the common logarithm of the time to fracture (h) increases significantly when the value of the holding stress (MPa) is reduced. In other words, it is possible to provide a holding member with excellent durability that can be used for long periods of time, even in an environment where a holding stress (MPa) close to the fracture limit is applied.

[0009] (2) In the holding member of the above aspect, the adhesive member may contain a silicone resin having an aromatic hydrocarbon group on at least a part of the side chain. According to this configuration, since at least a portion of the side chains of the silicone resin is provided with an aromatic hydrocarbon group, the occurrence of micro-crystallization and entanglement in the main chain of the silicone resin due to the steric hindrance of the aromatic hydrocarbon group is reduced, and the number of pseudo-crosslinking points present in the adhesive member can be reduced. As a result, it is possible to increase the proportion of crosslinking points formed by chemical bonds whose bonds are resistant to breaking when stress is applied in the adhesive member, while reducing the proportion of pseudo-crosslinking points whose bonds are easily broken when stress is applied, so that even if a holding stress (MPa) close to the breaking limit of the adhesive member is applied, it is possible to extend the time from when the holding stress (MPa) is applied to the adhesive member until the adhesive member breaks.

[0010] (3) In the holding member of the above aspect, the adhesive member may contain a filler whose main component is alumina. According to this configuration, the main component of the filler is alumina, which is highly hydrophilic. Therefore, when the resin contained in the adhesive member is a highly hydrophobic resin (e.g., silicone resin), the difference between the SP value of the resin and the SP value of the filler becomes larger, and the larger this difference in SP value, the fewer the number of pseudo-crosslinking points in the adhesive member can be. Therefore, since it is possible to increase the proportion of crosslinking points due to chemical bonds in the adhesive member while decreasing the proportion of pseudo-crosslinking points, even if a holding stress (MPa) close to the breaking limit of the adhesive member is applied, it is possible to further extend the time from when the holding stress (MPa) is applied to the adhesive member until the adhesive member breaks.

[0011] The present invention can be realized in various forms, for example, in the form of an electrostatic chuck or a vacuum chuck including the adhesive member, a semiconductor manufacturing apparatus or a ceramic heater including the adhesive member, a component including these components, and a method for manufacturing these components. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is an explanatory diagram schematically illustrating a cross-sectional configuration of a holding member according to an embodiment of the present invention. [Figure 2] FIG. 10 is an explanatory diagram illustrating an SP value. [Figure 3] FIG. 10 is an explanatory diagram showing the results of evaluating the performance of adhesive members. [Figure 4] FIG. 2 is an explanatory diagram of a test piece used to evaluate the performance of an adhesive member. [Figure 5] FIG. 10 is an explanatory diagram showing test results when a holding stress was measured using a test piece. [Figure 6] FIG. 10 is an explanatory diagram showing the time to fracture for each holding stress. DETAILED DESCRIPTION OF THE INVENTION

[0013] FIG. 1 is an explanatory diagram schematically illustrating a cross-sectional configuration of a holding member 1 according to an embodiment of the present invention. The holding member 1 is an electrostatic chuck that attracts and holds a semiconductor wafer W, which is an object, by electrostatic attraction. The arrows in FIG. 1 indicate the direction in which the semiconductor wafer W is attracted to the holding member 1. The holding member 1 is used, for example, to fix the semiconductor wafer W in a vacuum chamber of a semiconductor manufacturing device. The holding member 1 includes a ceramic member 10, a base member 20, an adhesive member 30, an electrostatic electrode 40, and a heater electrode 50.

[0014] The ceramic member 10 is a disk-shaped member made of ceramic. Examples of materials for forming the ceramic member 10 include aluminum oxide (alumina, Al2O3) and aluminum nitride (AlN), and in this embodiment, alumina is used. The ceramic member 10 has an adsorption surface 10f. The adsorption surface 10f is a circular surface on the side that adsorbs the semiconductor wafer W.

[0015] The base member 20 is a disk-shaped member having a larger diameter than the ceramic member 10, and is made of metal or various composite materials. The metal used to form the base member 20 is preferably aluminum (Al), titanium (Ti), or an alloy thereof. The composite material used to form the base member 20 is preferably a composite material obtained by melting an aluminum alloy, the main component of which is aluminum, into a porous ceramic, the main component of which is silicon carbide (SiC), and then pressurizing and infiltrating the melted aluminum alloy. The aluminum alloy contained in the composite material may contain silicon (Si) or magnesium (Mg), or may contain other elements as long as they do not affect the properties, etc.

[0016] A coolant flow path 21 is formed inside the base member 20. When a coolant (e.g., a fluorine-based inert liquid or water) flows through the coolant flow path 21, the base member 20 is cooled. At this time, the ceramic member 10 is also cooled by heat transfer (heat dissipation) between the base member 20 and the ceramic member 10 via the adhesive member 30, and the semiconductor wafer W attracted to the attracting surface 10f of the ceramic member 10 is also cooled.

[0017] The adhesive member 30 is disposed between the ceramic member 10 and the base member 20 and bonds the ceramic member 10 and the base member 20 together. The ceramic member 10 and the base member 20 correspond to a first member and a second member bonded to each other via the adhesive member 30. The terms "first member" and "second member" are used to refer to members bonded to each other via the adhesive member. The adhesive member 30 contains a silicone resin having a phenyl group as an aromatic hydrocarbon group in at least a portion of its side chain. In this embodiment, the silicone resin contains 5 mol% of phenyl groups. The adhesive member 30 also contains a filler whose main component is alumina. The "main component" refers to the component with the highest volumetric content.

[0018] The electrostatic electrode 40 is a disk-shaped member provided inside the ceramic member 10 and is made of a conductive material such as tungsten or molybdenum. When power is supplied to the electrostatic electrode 40 from an external power source (not shown), the electrostatic electrode 40 generates an electrostatic attraction force on the attraction surface 10f. The semiconductor wafer W is attracted toward the attraction surface 10f by this electrostatic attraction force and is thereby held on the attraction surface 10f.

[0019] The heater electrode 50 is provided inside the ceramic member 10 and is made of a conductive material such as tungsten or molybdenum. The heater electrode 50 generates heat when power is supplied from an external power source (not shown). This heat warms the ceramic member 10, and the semiconductor wafer W attracted to the attracting surface 10f of the ceramic member 10 is also heated.

[0020] FIG. 2 is an explanatory diagram illustrating the SP value. The SP value is a solubility parameter, and is an index that represents the hydrophilicity or hydrophobicity of a substance. A substance with a large SP value is highly hydrophilic, and a substance with a small SP value is highly hydrophobic. The double-headed arrows shown in each of FIGS. 2(A) to 2(C) indicate the difference in SP value between the silicone resin and the filler contained in the adhesive member. In detail, the further to the left the left arrowhead of the double-headed arrow is, the smaller the SP value of the silicone resin in the adhesive member, and the further to the right the right arrowhead is, the larger the SP value of the filler in the adhesive member.

[0021] In FIG. 2A, the left arrowhead indicates the SP value of the silicone resin (having phenyl groups in part of the side chain) contained in the adhesive member 30, and the right arrowhead indicates the SP value of the filler (mainly composed of alumina) contained in the adhesive member 30. That is, FIG. 2A shows the difference in SP values ​​between the silicone resin and filler contained in the adhesive member 30 of this embodiment. In contrast, FIGS. 2B and 2C show the difference in SP values ​​between the silicone resin and filler contained in the adhesive member of the comparative example. Specifically, in FIG. 2B, the left arrowhead indicates the SP value of the silicone resin (having no phenyl groups in the side chain), and the right arrowhead indicates the SP value of the filler (mainly composed of alumina). In FIG. 2C, the left arrowhead indicates the SP value of the silicone resin (having phenyl groups in part of the side chain) contained in the adhesive member 30, and the right arrowhead indicates the SP value of the filler (mainly composed of aluminum nitride). 2(A) to 2(C), the adhesive member 30 of this embodiment has a larger difference between the SP value of the silicone resin and the SP value of the filler compared to the adhesive member of the comparative example. The larger the difference in SP values, the lower the mutual affinity, and the fewer the number of pseudo-crosslinking points in the adhesive member. The pseudo-crosslinking points are crosslinking points formed pseudo-in the silicone resin due to the occurrence of minute crystallization and entanglement caused by the strong interaction between the main chains of the silicone resin.

[0022] Figure 3 is an explanatory diagram showing the results of performance evaluation of adhesive members. First, we will explain each item listed under "Materials" in Figure 3. A "○" in the "Silicone Resin" row indicates that the silicone resin contained in the adhesive member has a phenyl group in part of its side chain, while a "×" in the "Silicone Resin" row indicates that the silicone resin does not have a phenyl group in its side chain. The "Filler Type" row indicates the type of filler contained in the adhesive member. Regarding filler types, Al2O3 is alumina, and AlN is aluminum nitride. The "Filler Amount" row indicates the volumetric percentage of filler in the adhesive member when the total volume of the adhesive member is 100 volumetric percentages. As shown in Figure 3, both the adhesive member of the Example and the adhesive members of Comparative Examples 1 and 2 contain 44 volumetric parts of filler and 56 volumetric parts of silicone resin. The adhesive member of the Example corresponds to adhesive member 30 constituting the holding member 1 described above.

[0023] Next, the "Performance Evaluation" shown in the "Physical Properties" section of FIG. 3 will be described. In the "Performance Evaluation," as shown in FIG. 4, a test piece TP was used, in which two rod-shaped members (a first member 301 and a second member 302) were bonded at one end to the other with an adhesive member 30G (a collective term for the adhesive member of the Example and the adhesive members of Comparative Examples 1 and 2). Using this test piece TP, the first member 301 and the second member 302 were pulled with a constant tensile load along the connection direction CD in which the first member 301 and the second member 302 were connected via the adhesive member 30G at a temperature of 120°C. The stress generated in the adhesive member 30G when the first member 301 and the second member 302 were pulled with a constant tensile load was defined as the holding stress (MPa), and the time from when the holding stress (MPa) began to be applied to the adhesive member 30G until the adhesive member 30G broke was defined as the breaking time (h). Specifically, the holding stress (MPa) was calculated by dividing the load (N) applied when the test piece TP was pulled to break by the bonding area. In the "Performance Evaluation" section, we evaluated whether the change in the value of the retentive stress (MPa) resulting from an increase of 1 in the common logarithm of the time to fracture (h) was within the range of -0.09 MPa or more and less than 0 MPa. That is, a "○" in the "Performance Evaluation" row indicates that the change in the value of the retentive stress (MPa) resulting from an increase of 1 in the common logarithm of the time to fracture (h) was within the range of -0.09 MPa or more and less than 0 MPa, and an "×" in the "Performance Evaluation" row indicates that the change in the value of the retentive stress (MPa) resulting from an increase of 1 in the common logarithm of the time to fracture (h) was not within the range of -0.09 MPa or more and less than 0 MPa. Details will be explained using Figures 5(A) to 5(C).

[0024] 5(A) to (C) are explanatory diagrams showing test results when the holding stress (MPa) was measured using the test piece TP under the condition of a temperature of 120° C. In FIGS. 5(A) to (C), the horizontal axis is log 10 (t / h) log 10 (t / h) is the common logarithm of the time to failure, where t represents the time to failure (h). t / h is a dimensionless value obtained by dividing the time to failure (h) by a unit. For example, when t=10h, t / h=10, and log 10(10) = 1. In Figures 5(A) to 5(C), the vertical axis represents the holding stress (MPa). The results shown in Figures 5(A) to 5(C) are obtained when the first member 301 and the second member 302 were pulled along the connection direction CD at each holding stress (MPa). The first member 301 and the second member 302 were plate-shaped members measuring 20 mm in length, 10 mm in width, and 10 mm in thickness. The test specimen TP was formed by bonding the first member 301 and the second member 302 together with an adhesive member 30G having a thickness of 0.7 mm. The bonding conditions were adjusted appropriately depending on the adhesive member 30G used to obtain the desired adhesive properties. For example, the test specimen TP can be produced by sandwiching the adhesive member 30G between the first member 301 and the second member 302, heating it at 100°C for 72 hours, and then further heating it at 140°C for 10 hours. The shape of the test piece TP was created with reference to JIS K 6849. As a measuring device for measuring the holding stress (MPa), a known tensile tester or strength tester can be used, for example, Autograph AGS-5kNX manufactured by Shimadzu Corporation.

[0025] Line LA in FIG. 5(A) shows the test results for measuring the time to rupture (h) of a test piece TP made using the adhesive member of the example. Line LB in FIG. 5(B) shows the test results for measuring the time to rupture (h) of a test piece TP made using the adhesive member of Comparative Example 1. Line LC in FIG. 5(C) shows the test results for measuring the time to rupture (h) of a test piece TP made using the adhesive member of Comparative Example 2. Lines LA, LB, and LC correspond to regression lines calculated by the least squares method from the measurement data for multiple times to rupture (h) measured using each test piece TP. When the retained stress (MPa) is Hs and the common logarithm of the time to rupture (h) is CL, the regression equations representing the regression lines (lines LA, LB, and LC) are as follows: Adhesive member of the example (line segment LA): Hs = -0.0348CL + 0.9347 Adhesive member of Comparative Example 1 (line segment LB): Hs = -0.0967CL + 1.2979 Adhesive member of Comparative Example 2 (line segment LC): Hs = -0.1627CL + 1.4183

[0026] For the regression equation of the adhesive member of the example, the value of Hs changes by -0.0349 for every 1 increase in the value of CL. In other words, the change in the value of the holding stress (MPa) resulting from an increase of 1 in the common logarithm CL of the time to rupture (h) is -0.0348 (a value within the range of -0.09 MPa or more and less than 0 MPa). On the other hand, for the regression equations of the adhesive member of Comparative Example 1 and the adhesive member of Comparative Example 2, the change in the value of the holding stress (MPa) resulting from an increase of 1 in the common logarithm CL of the time to rupture (h) is not within the range of -0.09 MPa or more and less than 0 MPa. In this way, the "performance evaluation" is an evaluation based on the coefficient of the common logarithm CL of the time to rupture (h) in the regression line obtained by the least squares method from measurement data of multiple times to rupture (h) measured using the test piece TP. In other words, if the adhesive member 30G contained in the test piece TP is different, the coefficient and intercept value of the common logarithm CL of the time to break (h) in the regression equation will also be different, and the ``performance evaluation'' is performed based on the coefficient of the common logarithm CL of the time to break (h).

[0027] For example, when "performance evaluation" of the adhesive member 30 already included in the holding member 1 described above is performed, the following steps are carried out. First, a portion including the ceramic member 10, the base member 20, and the adhesive member 30 is cut out from the holding member 1, and a test specimen TP is prepared from the cut-out portion. In this case, the ceramic member 10 and the base member 20 correspond to the first member 301 and the second member 302 in the test specimen TP. Next, using the prepared test specimen TP, the first member 301 and the second member 302 are pulled along the connection direction CD at various holding stresses (MPa), and the time to failure (h) is measured to obtain multiple measurement data. Then, a regression equation representing a regression line obtained by the least squares method is created from the multiple measurement data. Then, "performance evaluation" is performed based on the coefficient CL of the common logarithm of the time to failure (h) in the regression equation. The shape of the test piece for which the "performance evaluation" is performed is not limited to the shape of the test piece TP, and may be any shape as long as the first member 301 and the second member 302 bonded via the adhesive member 30 can be pulled along the connection direction CD. In addition, in the test piece for which the "performance evaluation" is performed, the thickness of the adhesive member 30G is preferably 0.7 mm. However, since the effect of this thickness on the "performance evaluation" is small, even if the thickness of the adhesive member 30G is different from 0.7 mm, it is possible to measure the time to fracture (h) when the first member 301 and the second member 302 are pulled and consider this as "performance evaluation."

[0028] 3, when the adhesive member of the Example and the adhesive members of Comparative Examples 1 and 2 were evaluated, only the adhesive member of the Example received a "good" performance evaluation. The reason why the adhesive member of the Example (corresponding to the adhesive member 30 constituting the holding member 1 described above) received a "good" performance evaluation is thought to be because the adhesive member of the Example contained a silicone resin having a phenyl group (5 mol%) as an aromatic hydrocarbon group in part of its side chain, and a filler whose main component was alumina.

[0029] FIG. 6 is an explanatory diagram showing the time to rupture (h) for each holding stress (MPa). Line segment La shown in FIG. 6 is a line segment that shows the time to rupture (h) corresponding to each holding stress (MPa) using the regression equation that represents the above-mentioned line segment LA (see FIG. 5). Line segments Lb and Lc shown in FIG. 6 are line segments that show the time to rupture (h) corresponding to each holding stress (MPa) using the regression equation that represents the above-mentioned line segments LB and LC (see FIG. 5). In FIG. 6, the horizontal axis shows the holding stress (MPa) at each ratio, assuming that the holding stress (MPa) at which the test piece TP produced using each adhesive member 30G immediately ruptures is 100%. In FIG. 6, the vertical axis shows the time to rupture (h).

[0030] As shown by point Pa on line segment La, it was confirmed that the test piece TP produced using the adhesive member of the example had a time to fracture (h) of 10,000 h (= 1.E + 04) or more when the holding stress (MPa) was about 74% or less of the holding stress (MPa) at which immediate fracture occurred. On the other hand, as shown by point Pb on line segment Lb, it was confirmed that the test piece TP produced using the adhesive member of comparative example 1 had a time to fracture (h) of 10,000 h or more when the holding stress (MPa) was about 55% or less of the holding stress (MPa) at which immediate fracture occurred. Furthermore, although not shown on line segment Lc, it was confirmed that the test piece TP produced using the adhesive member of comparative example 2 had a time to fracture (h) of 10,000 h or more when the holding stress (MPa) was about 38% or less of the holding stress (MPa) at which immediate fracture occurred.

[0031] Furthermore, it was confirmed that the time to rupture (h) when a holding stress (MPa) that was 90% of the holding stress (MPa) at which immediate rupture occurred was applied was approximately 0.227 h for the Example, approximately 0.010 h for Comparative Example 1, and approximately 0.003 h for Comparative Example 2. On the other hand, it was confirmed that the time to rupture (h) when a holding stress (MPa) that was 70% of the holding stress (MPa) at which immediate rupture occurred was approximately 294090 h for the Example, approximately 27 h for Comparative Example 1, and approximately 1 h for Comparative Example 2. In other words, it was confirmed that regardless of the holding stress (MPa) applied, the time to rupture (h) was longest for the test piece TP produced using the adhesive member of the Example, and shortest for the test piece TP produced using the adhesive member of Comparative Example 2. These results are thought to be due to the fact that, in the adhesive members of the Examples, the change in the value of the retained stress (MPa) when the common logarithm of the time to fracture (h) increases by 1 is within the range of -0.09 MPa or more and less than 0 MPa, and therefore, compared to the adhesive members of Comparative Examples 1 and 2, when the value of the retained stress (MPa) is reduced (when the retained stress (MPa) at which immediate fracture occurs is reduced to 90% or 70%), the common logarithm of the time to fracture (h) increases significantly (see Figure 6). Therefore, it was confirmed that the adhesive members of the Examples can be used for long periods of time at retained stresses (MPa) close to the retained stress at which immediate fracture occurs, and have excellent durability.

[0032] In the adhesive member 30 (the adhesive member of the example) included in the retaining member 1 of the embodiment described above, the change in the value of the holding stress (MPa) resulting from an increase in the common logarithm of the time to fracture (h) by 1 is within the range of -0.09 MPa or more and less than 0 MPa. Therefore, in such an adhesive member 30, the change in the common logarithm of the time to fracture (h) when the value of the holding stress (MPa) is changed is relatively large, and therefore it is possible to provide a retaining member 1 in which the common logarithm of the time to fracture (h) increases significantly when the value of the holding stress (MPa) is decreased. In other words, it is possible to provide a retaining member 1 with excellent durability that can be used for long periods of time even in an environment where a holding stress (MPa) close to the fracture limit is applied. Here, a holding stress (MPa) close to the fracture limit refers to a stress close to the holding stress (MPa) at which immediate fracture occurs.

[0033] Furthermore, the adhesive member 30 (the adhesive member of the embodiment) provided in the holding member 1 contains a silicone resin having a phenyl group as an aromatic hydrocarbon group in part of its side chain. Therefore, the steric hindrance of the aromatic hydrocarbon group reduces the occurrence of microcrystallization and entanglement in the main chain of the silicone resin, thereby reducing the number of pseudo-crosslinking points present in the adhesive member 30. As a result, the adhesive member 30 can have a higher proportion of crosslinking points formed by chemical bonds that are resistant to breaking when stress is applied, while having a lower proportion of pseudo-crosslinking points that are susceptible to breaking when stress is applied. Therefore, even if a holding stress (MPa) close to the breaking limit of the adhesive member 30 is applied, the time from when the holding stress (MPa) is applied to the adhesive member 30 until the adhesive member 30 breaks can be extended.

[0034] Furthermore, in the adhesive member 30 (the adhesive member of the example) included in the holding member 1, the main component of the filler is alumina, which is highly hydrophilic. Furthermore, because the resin included in the adhesive member 30 is a highly hydrophobic silicone resin, the difference between the SP value of the resin and the SP value of the filler is large, and the number of pseudo-crosslinking points can be reduced. Therefore, since the proportion of crosslinking points due to chemical bonds can be increased while the proportion of pseudo-crosslinking points can be reduced in the adhesive member 30, even if a holding stress (MPa) close to the breaking limit of the adhesive member 30 is applied, the time from when the holding stress (MPa) is applied to the adhesive member 30 until the adhesive member 30 breaks can be further extended. As in the above-described embodiment, when the silicone resin has an aromatic hydrocarbon group in part of its side chain, the silicone resin is more hydrophobic than when it does not have an aromatic hydrocarbon group (see FIG. 2 ), and this is preferable because the difference in SP value from the filler is larger.

[0035] <Modification of this embodiment> The present invention is not limited to the above-described embodiment, and can be embodied in various forms without departing from the spirit of the invention. For example, the following modifications are also possible.

[0036] In the above embodiment, the silicone resin in the adhesive member 30 contained 5 mol % of phenyl groups, but this is not limited thereto. The proportion of phenyl groups contained in the silicone resin may be any proportion, preferably within the range of 3 mol % to 16 mol %. Furthermore, in the above embodiment, the silicone resin in the adhesive member 30 contained phenyl groups in at least a portion of its side chains, but this is not limited thereto. For example, the side chains of the silicone resin may contain aryl groups such as tolyl, xylyl, or naphthyl groups instead of or in addition to phenyl groups. Of course, it is preferable that the side chains of the silicone resin contain at least phenyl groups.

[0037] In the above embodiment, the filler in the adhesive member 30 may include carbon black. Alternatively, the filler may include carbon powder such as carbon fiber, carbon nanotubes, and graphene instead of or in addition to carbon black.

[0038] In the above embodiment, the adhesive member 30 contains a silicone resin and a filler, but this is not limiting. The adhesive member 30 may contain other components in addition to the silicone resin and the filler. Examples of other components include a reaction inhibitor, a viscosity adjuster, and a heat resistance improver. The heat resistance improver preferably has radical scavenging ability, and carbon black is particularly preferred.

[0039] This aspect has been described above based on embodiments and modifications. However, the above-described embodiments are intended to facilitate understanding of this aspect and are not intended to limit this aspect. This aspect may be modified or improved without departing from the spirit and scope of the claims, and equivalents thereof are included in this aspect. Furthermore, if a technical feature is not described as essential in this specification, it may be deleted as appropriate. [Explanation of symbols]

[0040] 1...Holding member 10...Ceramics components 10f…Adsorption surface 20...Base member 21... Refrigerant flow path 30, 30G...Adhesive material 40...Electrostatic electrode 50...Heater electrode 301...First member 302...Second member

Claims

1. A holding member, A first member; A second member; an adhesive member that bonds the first member and the second member, A retaining member characterized in that, when the stress generated in the adhesive member when the first member and the second member are pulled with a constant tensile load along the connection direction in which the first member and the second member are connected via the adhesive member under conditions of a temperature of 120°C is defined as the retaining stress (MPa), and the time from when the retaining stress (MPa) begins to be applied to the adhesive member until the adhesive member breaks is defined as the breakage time (h), the amount of change in the value of the retaining stress (MPa) resulting from increasing the common logarithm of the breakage time (h) by 1 is a value within the range of -0.09 MPa or more and less than 0 MPa.

2. The holding member according to claim 1, A holding member, wherein the adhesive member contains a silicone resin having an aromatic hydrocarbon group on at least a part of the side chain.

3. The holding member according to claim 1 or 2, A holding member, wherein the adhesive member contains a filler whose main component is alumina.

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