Vacuum processing device

Abstract

To provide a vacuum processing device capable of accurately matching reference coordinates for a specimen mounting surface of a specimen stage to center coordinates of a specimen when a transfer robot transfers the specimen to the stage.SOLUTION: A vacuum processing device measures a position of an outer edge of a specimen which has been transferred into a vacuum specimen chamber and moves a specimen stage below the specimen transferred into the vacuum specimen chamber based on the measured position of the outer edge.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to a technique for transferring a sample to a sample stage using a transfer robot in a vacuum processing apparatus. [Background technology]

[0002] There is a strong demand for improved throughput (the number of wafers that can be processed per hour) in vacuum processing equipment used in semiconductor processing and inspection. Charged particle beam inspection equipment irradiates charged particle beams in a high-vacuum environment, so wafers are transported from a pre-evacuation chamber, which connects the equipment to the atmospheric pressure environment outside the equipment, to a vacuum-environmented sample chamber. This makes it possible to transport the atmospheric sample wafer into the equipment using the pre-evacuation chamber while maintaining the high vacuum in the vacuum sample chamber, thereby achieving high throughput.

[0003] A transfer robot equipped with a hand is used to transport sample wafers between the pre-exhaust chamber and the vacuum sample chamber. When the transfer robot transports the sample wafer, it is necessary to align the center coordinates of the sample wafer with the reference coordinates of the sample mounting surface on the sample stage. In particular, in a charged particle beam inspection system, if the distance between the outer edge of the sample wafer and the ring-shaped electrode components attached around the sample mounting surface deviates from the target value set by the system, it becomes difficult to maintain the surface potential of the outer edge of the sample wafer equal to that of the center of the sample wafer. This increases the area of ​​the outer edge of the sample wafer where the accuracy of surface profile measurement using the charged particle beam cannot be guaranteed (hereinafter referred to as edge exclusion). As a result, the dimensional control of semiconductor device chips on the outer edge of the sample wafer cannot be performed in the same way as chips in the center of the sample wafer, resulting in reduced yield.

[0004] By transporting the sample wafer so that the reference coordinates of the sample mounting surface and the center coordinates of the sample wafer are aligned, it is possible to keep the surface potential of the outer edge of the sample wafer equal to the surface potential of the center of the sample wafer. This reduces edge exclusion and contributes to improving yield. For these reasons, technology to improve transport accuracy is required for vacuum processing equipment.

[0005] Generally, there are three main factors that can cause a decrease in conveying accuracy: (1) Slippage that occurs at the contact point between the sample and the hand (2) Thermal deformation of transport robot parts (3) Change in the relative position between the transfer start position and the transfer target position

[0006] Regarding point (1), as the robot moves, an inertial force occurs in the direction horizontal to the wafer surface at the contact point between the sample and the hand. If the inertial force exceeds the frictional force at the contact point between the sample and the hand, the sample will slip relative to the hand, causing a transfer error. Because the transfer robot is placed in a vacuum environment, it is difficult to implement a sample holding method that relies on pressure differences, such as vacuum suction. Furthermore, from the perspective of outgassing, it is difficult to install a sensor to detect slippage.

[0007] Regarding (2), since the robot is placed in a vacuum, there is no way for heat to escape, and the temperature of the parts inside the robot rises due to the robot's repeated movements. As the temperature rises, the parts inside the robot thermally expand, causing transport errors.

[0008] Regarding point (3), in vacuum processing equipment typically equipped with a pre-pumping chamber and a vacuum sample chamber, when the pre-pumping chamber and the vacuum sample chamber are sealed with a gate valve, the connection between the pre-pumping chamber and the vacuum sample chamber is rigid, so shocks caused by opening and closing the vacuum valve are transmitted to the vacuum sample chamber. In particular, in the case of charged particle beam inspection systems, vibrations transmitted to the vacuum sample chamber during measurement using a charged particle beam can degrade measurement accuracy. Therefore, measurement operations in the vacuum sample chamber are stopped while the vacuum valve is operating, and the vacuum valve operation is stopped while measurement operations are being performed in the vacuum sample chamber. However, stopping the processing in the vacuum sample chamber and the valve operation in this way increases the processing time per sample wafer and reduces the throughput of the system. On the other hand, connecting the pre-pumping chamber and the vacuum sample chamber with a flexible structure such as a bellows can suppress vibrations, but it also causes changes in the relative position between the transfer start position in the pre-pumping chamber and the transfer target position in the vacuum sample chamber.

[0009] Patent Document 1 discloses a configuration in which a pre-evacuation chamber and a vacuum sample chamber are connected by a bellows, and the bellows absorbs vibrations generated by the opening and closing of a vacuum valve.

[0010] Patent Document 2 discloses a technique for ensuring transfer accuracy, in which alignment marks patterned on a sample are detected by a detector and fed back to the robot's operation to improve transfer accuracy. The same document also discloses a configuration in which a bellows is used to connect the vacuum sample chamber and the pre-evacuation chamber, thereby isolating vibrations generated in the pre-evacuation chamber. [Prior art documents] [Patent documents]

[0011] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-104021 [Patent Document 2] Japanese Patent Application Publication No. 2023-094309 Summary of the Invention [Problem to be solved by the invention]

[0012] In Patent Document 1, the relative position between the vacuum sample chamber and the pre-evacuation chamber changes depending on the pressure inside the pre-evacuation chamber. Therefore, in a vacuum processing apparatus that repeatedly opens the pre-evacuation chamber to the atmosphere and evacuates it, the relative position between the pre-evacuation chamber and the vacuum sample chamber changes each time. In other words, the relative position between the sample table provided in the pre-evacuation chamber, which is the transfer start position, and the transfer target position inside the vacuum sample chamber changes, resulting in a decrease in transfer accuracy. Therefore, this document requires measures to ensure transfer accuracy.

[0013] The technique of Patent Document 2 is effective when alignment marks are always present at predetermined positions on the sample. However, when transporting a sample wafer without alignment marks, it is not possible to correct transport errors. Furthermore, even for a sample wafer with alignment marks, if it is desired to transport the sample after rotating it by a desired angle around the rotation axis, it is necessary to increase the number of alignment marks on the sample accordingly, which limits the samples that can be transported. Furthermore, high positioning accuracy is required for the transport robot, which increases the cost of the robot and increases design constraints.

[0014] The present disclosure has been made in consideration of the above-mentioned problems, and aims to provide a vacuum processing apparatus that can accurately match the reference coordinates of the sample placement surface of the stage with the center coordinates of the sample when a transport robot transports the sample to the sample stage. [Means for solving the problem]

[0015] The vacuum processing apparatus according to the present disclosure measures the position of the outer edge of a sample transported into a vacuum sample chamber, and based on the measured position of the outer edge, moves a sample stage below the sample transported into the vacuum sample chamber. [Effects of the Invention]

[0016] According to the vacuum processing apparatus of the present disclosure, when the transfer robot transfers a sample to the sample stage, the reference coordinates of the sample placement surface of the stage can be matched with the center coordinates of the sample with high precision. [Brief explanation of the drawings]

[0017] [Figure 1] 1 is a schematic top view illustrating the configuration of a vacuum processing apparatus according to a first embodiment. [Figure 2] FIG. 1 is a side cross-sectional view of a vacuum processing apparatus. [Figure 3] 10 is a flowchart illustrating an operation of the vacuum processing apparatus according to the first embodiment to transfer a sample wafer 113. [Figure 4] FIG. 10 is a schematic top view of a vacuum processing apparatus according to a second embodiment. [Figure 5] FIG. 10 is a side cross-sectional view of a vacuum processing apparatus according to a second embodiment. [Figure 6] FIG. 10 is a schematic top view of a vacuum processing apparatus according to a third embodiment. [Figure 7] FIG. 10 is a cross-sectional side view of a vacuum processing apparatus according to a third embodiment. [Figure 8] An example in which the sample wafer 113 is rectangular is shown. DETAILED DESCRIPTION OF THE INVENTION

[0018] <First Embodiment> 1 is a schematic top view illustrating the configuration of a vacuum processing apparatus according to a first embodiment of the present disclosure. The vacuum processing apparatus is an apparatus that processes a sample in a vacuum environment, and is configured as, for example, a charged particle beam apparatus that irradiates a sample with a charged particle beam.

[0019] The sample wafer 113 (shown in FIG. 2) is removed from the FOUP containing the sample wafer 113 by a transfer robot (not shown). After the door valve 22 of the pre-exhaust chamber 2, which is at atmospheric pressure, is opened, the transfer robot (not shown) transfers the sample wafer 113 onto the sample table 23. The interior of the pre-exhaust chamber 2 is evacuated by a vacuum pump (not shown). The vacuum sample chamber 1 is also evacuated by a vacuum pump (not shown) and is constantly maintained in a reduced pressure state. After the pressure in the pre-exhaust chamber 2 drops below a threshold, the gate valve 21 is opened, and the sample wafer 113 is transferred from the pre-exhaust chamber 2 to the vacuum sample chamber 1 by the transfer robot 12. The transfer robot 12 transfers the sample wafer 113 to a transfer target position 122 within the vacuum sample chamber 1.

[0020] The transfer robot 12 includes a hand 121. With the hand 121 holding the sample wafer 113, the sample wafer 113 is transferred onto the sample mounting surface 111 of the sample stage 11. A ring-shaped electrode 112 is arranged on the sample mounting surface 111. The sample wafer 113 needs to be transferred so that the distance between the outer edge of the sample wafer 113 and the electrode 112 is a target value.

[0021] The detection area 43 is an area for detecting the outer edge position of the sample wafer 113 placed on the transfer target position 122 by the detector 41 (shown in FIG. 2). As shown in FIG. 1, the detection area 43 is three or more separated areas. The computer system 3 will be described later.

[0022] 2 is a side cross-sectional view of the vacuum processing apparatus. A door valve 22 seals off the pre-exhaust chamber 2 from the atmospheric environment. A gate valve 21 seals off the pre-exhaust chamber 2 from the vacuum sample chamber 1. A sample wafer 113 is placed on a sample table 23 in the pre-exhaust chamber 2. The vacuum sample chamber 1 and pre-exhaust chamber 2 are mounted on vibration isolation mounts 52 fixed on a stand 51.

[0023] The transfer robot 12 receives the sample wafer 113 on the sample table 23 and transfers it to a transfer target position 122 in the vacuum sample chamber 1. The outer edge position of the sample wafer 113 transferred to the vacuum sample chamber 1 is detected using detection light 42 from a detector 41 installed in the vacuum sample chamber 1. The detector 41 is installed on the atmospheric side of the top surface of the vacuum sample chamber 1, and can detect the outer edge position of the sample wafer 113 in a detection area 43 inside the vacuum sample chamber 1 through a transmission window 44 made of a material that transmits the detection light 42, such as glass. By placing the detector 41 outside the vacuum partition of the vacuum sample chamber 1, it is possible to prevent gas from being released from the detector 41 into the vacuum sample chamber 1, which would otherwise cause a decrease in the degree of vacuum.

[0024] The detector 41 can irradiate a plurality of detection lights 42 within the detection region 43, and each detection light 42 can detect the presence or absence of a sample. All of the three or more detection regions 43 include both the outer edge of the sample wafer 113 and an area where no sample is present when the sample wafer 113 is present at the transfer target position 122. All of the three or more detection regions 43 include both the outer edge of the sample wafer 113 and an area where no sample is present, even if an expected transfer error occurs.

[0025] The sample stage 11 has a positioning accuracy that exceeds the required transport accuracy. For example, the sample stage 11 is configured so that its position can be identified by a sensor (not shown) such as a laser interferometer installed on the atmospheric side, and can be driven by a drive system (not shown) such as a linear motor.

[0026] The computer system 3 is a computer that controls the vacuum processing apparatus. The computer system 3 includes a main control unit 31, a stage control unit 32, a sample center coordinate calculation unit 33, and a transfer robot control unit 34. The main control unit 31 can communicate data with the stage control unit 32, the sample center coordinate calculation unit 33, and the transfer robot control unit 34. The operation of these functional units will be described later.

[0027] 3 is a flowchart illustrating the operation of the vacuum processing apparatus according to the first embodiment to transfer the sample wafer 113. The operation based on the flowchart of FIG.

[0028] Step 600: The transfer robot control unit 34 issues a command to the transfer robot 12, and the transfer robot 12 grips the sample wafer 113 on the sample table 23 using the hand 121 based on the command.

[0029] Step 601: The transfer robot control unit 34 issues a command to the transfer robot 12, and the transfer robot 12 moves the hand 121 to the transfer target position 122 while holding the sample wafer 113 based on the command.

[0030] Step 602: With the sample wafer 113 held by the hand 121, the main control unit 31 simultaneously operates the three sets of detectors 41 to acquire information on the presence or absence of a sample in a plurality of detection areas 43 near the outer edge of the sample wafer 113. The coordinates at which the presence or absence of a sample changes are set to the coordinates of the end of the outer edge of the sample wafer 113.

[0031] Step 603: The main control unit 31 transmits information on the coordinates of the edge of the outer edge of the sample wafer 113 to the sample center coordinate calculation unit 33. Based on the transmitted information, the sample center coordinate calculation unit 33 calculates the center coordinates of the sample wafer 113. Below, a method for calculating the sample center coordinates in the case of a system equipped with three sets of detectors 41 will be described.

[0032] Step 603: Calculation example: The three sets of coordinates acquired by the detector 41 are respectively defined as (x1, y1), (x2, y2), and (x3, y3). The sample center coordinate calculation unit 33 substitutes these three sets of coordinates into the equation x^2+y^2+ax+by+c=0, in which a, b, and c are unknown constants, to obtain the following simultaneous equations.

[0033] x1^2 + y1^2 + ax1 + by1 + c = 0 x2^2 + y2^2 + ax2 + by2 + c = 0 x3^2 + y3^2 + ax3 + by3 + c = 0

[0034] Since there are three equations for three unknown constants, it is possible to obtain solutions a, b, and c from this simultaneous equation. The sample center coordinate calculation unit 33 obtains solutions a, b, and c by solving the simultaneous equations. The center coordinates (x, y) of the sample have the relationship (x, y) = (-a / 2, -b / 2).

[0035] Step 604: The obtained center coordinates (x, y) of the sample wafer 113 are transmitted to the main controller 31. The stage controller 32 moves the sample stage 11 so that the distance between the reference coordinates of the sample mounting surface 111 on the sample stage 11 and the center coordinates of the sample wafer 113 is minimized.

[0036] Step 605: Using the lifting mechanism of the transfer robot 12 or the lifting mechanism of the sample stage 11, the sample wafer 113 held by the hand 121 is transferred to the sample placement surface 111 on the sample stage 11. By moving the sample stage 11 holding the sample wafer 113 onto the sample placement surface 111, the desired coordinates of the sample wafer 113 can be measured.

[0037] Steps 600 to 605 enable the reference coordinates of the sample mounting surface 111 to coincide with the center coordinates of the sample wafer 113, improving transport accuracy. Improved transport accuracy allows the distance between the sample wafer 113 on the sample mounting surface 111 and the electrode 112 to be kept within a target value range set by the device, reducing edge exclusion. As a result, it becomes possible to measure the length of the pattern of the semiconductor device chip near the outer edge of the sample wafer 113, improving dimensional control in semiconductor mass production and increasing yield.

[0038] <First embodiment: Summary> In the vacuum processing apparatus according to the first embodiment, the detector 41 detects the outer edge position of the sample wafer 113 detected within the detection region 43 after the sample wafer 113 has been transported by the transport robot 12 to the transport target position 122 within the vacuum sample chamber 1. Furthermore, the center position of the sample wafer 113 is calculated based on the measured outer edge position, and the sample stage 11 is moved so that the center position coincides with the reference position of the sample stage 11. This reduces misalignment of the sample wafer 113 due to transport accuracy. Therefore, transport errors caused by factors such as slippage at the contact point between the sample and the hand, thermal deformation of the transport robot's components, and changes in the relative position between the transport start position and the transport target position can be corrected, and the sample can be transported to a position that minimizes the distance between the center coordinate of the sample and the reference coordinate of the sample placement surface. For example, when the vacuum processing apparatus is a charged particle beam measurement instrument, this allows the distance between the sample and the electrode to be kept within a certain range, enabling the potential at the sample's outer edge and the surface potential at the sample's center to be equally corrected. This allows for an apparatus that can properly measure the sample's outer edge and reduces edge exclusion. The first embodiment can be applied to a variety of samples because it can be mounted even if the sample does not have an alignment mark.

[0039] <Embodiment 2> Fig. 4 is a schematic top view of a vacuum processing apparatus according to a second embodiment of the present disclosure. Fig. 5 is a side cross-sectional view of the vacuum processing apparatus according to the second embodiment. In addition to the configuration described in the first embodiment, the vacuum processing apparatus according to the second embodiment includes a bellows 71 between the vacuum sample chamber 1 and the preliminary exhaust chamber 2. The bellows 71 can change the relative position between the vacuum sample chamber 1 and the preliminary exhaust chamber 2. The other configurations are the same as those of the first embodiment.

[0040] The bellows 71 is arranged to maintain the vacuum while keeping the vacuum sample chamber 1 and the pre-exhaust chamber 2 at the same pressure when the gate valve 21 is open. The bellows 71 is sized so as not to interfere with the transfer robot 12 when the transfer robot 12 moves from the pre-exhaust chamber 2 to the vacuum sample chamber 1 while holding the sample wafer 113. By providing the bellows 71, it is possible to suppress the transmission of impacts and vibrations generated in the pre-exhaust chamber 2 to the vacuum sample chamber 1, improving measurement accuracy and also improving throughput by reducing vibration waiting time.

[0041] However, when the bellows 71 expands or contracts, the relative position between the transfer robot 12 and the sample table 23 changes, which may result in a decrease in positional accuracy when the sample wafer 113 is transferred to the transfer target position 122. To address this issue, in the second embodiment, even if the relative position between the sample table 23 and the transfer target position 122 changes, the sample stage 11 is moved based on the central coordinates of the sample wafer 113 that has actually been transferred to the vicinity of the transfer target position 122, and then the sample wafer 113 is transferred. Therefore, the transfer accuracy can be improved in the same way as in the first embodiment.

[0042] <Third Embodiment> FIG. 6 is a schematic top view of a vacuum processing apparatus according to a third embodiment of the present disclosure. FIG. 7 is a side cross-sectional view of the vacuum processing apparatus according to the third embodiment. In the vacuum processing apparatus according to the third embodiment, a robot chamber 8 is provided between the pre-exhaust chamber 2 and the vacuum sample chamber 1 to prevent a decrease in the vacuum level in the vacuum sample chamber 1, and a transfer robot 12 is mounted in the robot chamber 8. A gate valve 21-1 is provided between the robot chamber 8 and the vacuum sample chamber 1, a gate valve 21-2 is also provided between the robot chamber 8 and the pre-exhaust chamber 2, and a bellows 71 is provided between the robot chamber 8 and the pre-exhaust chamber 2. The bellows 71 is positioned so that, when the gate valve 21-1 is open, the vacuum sample chamber 1 and the robot chamber 8 maintain the same pressure, thereby maintaining a vacuum. The bellows 71 is sized so as not to interfere with the transfer robot 12 when the transfer robot 12 moves to the vacuum sample chamber 1 while holding the sample wafer 113. The bellows 71 can change the relative position between the vacuum sample chamber 1 and the robot chamber 8. The rest of the configuration is the same as in the second embodiment.

[0043] In the configuration of embodiment 3, compared to embodiment 2, the volume required to mount the transfer robot 12 can be reduced from within the vacuum sample chamber 1, allowing the vacuum sample chamber 1 to have high exhaust efficiency. In addition, by closing the gate valve 21-1 immediately after the transfer of the sample by the transfer robot 12 is completed, it is possible to prevent adsorbed gas adhering to the surface of the transfer robot 12 from flowing into the vacuum sample chamber 1 and prevent a decrease in the degree of vacuum. This improves the convergence rate of the charged particle beam in the charged particle beam inspection device, thereby improving measurement accuracy.

[0044] In the third embodiment, when the bellows 71 expands or contracts, the relative position between the robot chamber 8 and the vacuum sample chamber 1 changes, which may result in a decrease in positional accuracy when the sample wafer 113 is transported to the transfer target position 122. To address this issue, in the third embodiment, the sample stage 11 is moved based on the position of the sample wafer 113 that has actually been transported near the transfer target position 122, and then the sample wafer 113 is transferred, thereby improving the transport accuracy in the same way as in the first embodiment.

[0045] In the third embodiment, even when the transfer robot 12 discharges gas, the influence of the gas can be suppressed by hermetically sealing the space between the robot chamber 8 and the sample chamber. Furthermore, it is possible to suppress the propagation of vibrations caused by the transfer robot 12 to the vacuum sample chamber 1. Furthermore, in the third embodiment, even when the transfer target position 122 seen from the transfer robot 12 moves relatively, it is possible to suppress a decrease in transfer accuracy by detecting the position of the sample wafer 113 in the detection area 43.

[0046] <Modifications of the present disclosure> The present disclosure is not limited to the above-described embodiments and includes various modifications. For example, the above-described embodiments have been described in detail to clearly explain the present disclosure, and are not necessarily limited to those including all of the described configurations. Furthermore, it is possible to replace part of the configuration of one embodiment with the configuration of another embodiment, or to add the configuration of another embodiment to the configuration of one embodiment. Furthermore, it is possible to add, delete, or replace part of the configuration of each embodiment with other configurations.

[0047] FIG. 8 shows an example in which the sample wafer 113 is rectangular. It seems possible to identify the outer edge of the rectangular shape by line scanning each of its four sides, as shown in the upper part of FIG. 8. However, as shown in the lower part of FIG. 8, when the sample is rotated in a horizontal plane, detecting the four sides by line scanning results in a rectangle as shown by the dotted line in the lower part of FIG. 8. The dotted rectangle differs from the actual shape of the sample. In other words, in such a case, the correct shape and orientation of the sample cannot be recognized. In contrast, if the sample wafer 113 is circular, the center of the sample can be identified by line scanning three or more points, even if the sample is rotated in a horizontal plane. Therefore, in the above embodiment, the shape of the sample wafer 113 is assumed to be circular. Accordingly, the electrode 112 is assumed to be circular and slightly larger than the sample wafer 113.

[0048] In the above embodiments, the main control unit 31, the stage control unit 32, the sample center coordinate calculation unit 33, and the transport robot control unit 34 can be configured by hardware such as a circuit device that implements these functions, or by software that implements these functions being executed by a calculation device such as a CPU (Central Processing Unit).

[0049] In the above embodiment, the detector 41 is configured as a line sensor that irradiates linear detection light, but the configuration of the detector 41 is not limited to this. For example, the detector 41 may be configured as an image sensor or a camera that captures images inside the vacuum sample chamber 1. In other words, a sensor other than a line sensor may be used as long as it can accurately detect the center position of the sample wafer 113 in the detection area 43.

[0050] In the above embodiment, it has been described that the robot chamber 8 is disposed between the vacuum sample chamber 1 and the preliminary exhaust chamber 2, but the position of the robot chamber 8 is not limited to this, and for example, the robot chamber 8 may be disposed beside the preliminary exhaust chamber 2 in Fig. 1. In this case, the bellows 71 is disposed between the vacuum sample chamber 1 and the preliminary exhaust chamber 2, as in the second embodiment.

[0051] In the above embodiment, it is desirable that the bellows 71 be made of a material that can suppress the propagation of vibrations to the vacuum sample chamber 1. In other words, it is desirable that the material of the bellows has lower rigidity than the housing of the vacuum sample chamber 1 and lower rigidity than the housing of the pre-evacuation chamber 2. [Explanation of symbols]

[0052] 1. Vacuum sample chamber 11 Sample stage 111 Sample placement surface 112 Electrode 113 Sample wafer 12 Transport robot 121 hands 122 Transfer target position 2. Auxiliary exhaust chamber 21 Gate valve 22 Door Valve 23 Sample table 3. Computer Systems 31 Main control unit 32 Stage control section 33 Sample center coordinate calculation unit 34 Transport robot control unit 41 Detector 42 Detection light 43 Detection Area 44 Transparent window 51 Mounting stand 52 Anti-vibration mount 71 Bellows 8. Robot Room

Claims

1. a vacuum sample chamber for processing samples in a vacuum; a transfer robot that transfers the sample in the pre-evacuation chamber into the vacuum sample chamber; a detector that measures the position of the outer edge of the sample transferred into the vacuum sample chamber by the transfer robot; a stage disposed within the vacuum sample chamber and having a mounting surface on which the sample is held; a computer that controls the stage; Equipped with The computer moves the stage to below the sample transported into the vacuum sample chamber based on the measured position of the outer edge. A vacuum processing apparatus characterized by:

2. the transfer robot transfers the sample to a transfer target position within the vacuum sample chamber; the detector is disposed at a position where it can measure the position of the outer edge of the sample on the transfer target position; the computer calculates the center coordinates of the sample based on the position of the outer edge of the sample on the transfer target position; The computer moves the stage to a position below the sample located at the transfer target position based on the calculated center coordinates.

2. The vacuum processing apparatus according to claim 1.

3. the detector is arranged so as to be able to measure three or more points on the position of the outer edge of the sample located at the transfer target position; The computer calculates the center coordinates based on the positions of the three or more outer edge points.

3. The vacuum processing apparatus according to claim 2.

4. the vacuum sample chamber is isolated from the atmospheric environment by a vacuum partition; the detector is attached to the atmospheric environment side of the vacuum partition; The detector is positioned to measure the sample from above when the sample is transferred into the vacuum sample chamber.

2. The vacuum processing apparatus according to claim 1.

5. the detector is configured as a line sensor that detects the position of the outer edge by emitting a linear light segment, the vacuum partition includes a transparent portion that transmits at least a part of the light; The detector is positioned to emit the light into the vacuum sample chamber through the transmission portion.

5. The vacuum processing apparatus according to claim 4.

6. The computer moves the stage so that the calculated center coordinates coincide with the reference coordinates of the sample placement surface of the stage.

3. The vacuum processing apparatus according to claim 2.

7. The computer moves the stage below the sample, and then transfers the sample onto the stage, thereby aligning the sample with reference coordinates on the stage based on the measured position of the outer edge.

2. The vacuum processing apparatus according to claim 1.

8. The sample is in the shape of a disk, The detector is configured to be able to measure three or more positions on the circular outer periphery of the sample.

2. The vacuum processing apparatus according to claim 1.

9. the vacuum processing apparatus further includes a bellows for airtightly joining the preliminary exhaust chamber and the vacuum sample chamber; the bellows is configured to be able to change a relative position between the pre-evacuation chamber and the vacuum sample chamber; The computer moves the stage below the sample based on the position of the outer edge measured by the detector under the relative position.

2. The vacuum processing apparatus according to claim 1.

10. the vacuum processing apparatus further includes a robot chamber disposed between the vacuum sample chamber and the pre-evacuation chamber; the robot room houses the transfer robot, The transfer robot transfers the sample from the pre-evacuation chamber to the vacuum sample chamber via the robot chamber.

2. The vacuum processing apparatus according to claim 1.

11. the vacuum processing apparatus further includes a bellows for airtightly joining the vacuum sample chamber and the robot chamber; the bellows is configured to be able to change a relative position between the robot chamber and the vacuum sample chamber; The computer moves the stage below the sample based on the position of the outer edge measured by the detector under the relative position. The vacuum processing apparatus according to claim 10.

12. The bellows is made of a material having a lower rigidity than the vacuum sample chamber and the preliminary exhaust chamber.

12. The vacuum processing apparatus according to claim 9 or 11.

13. The vacuum processing apparatus is configured as a charged particle beam apparatus that irradiates the sample with a charged particle beam.

2. The vacuum processing apparatus according to claim 1.

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