Component mounting device and offset information acquisition method

Abstract

To shorten the time required for acquiring offset information for head parts.SOLUTION: A component mounting device comprises: a head unit including three or more head parts each including a nozzle for holding an electronic component and arrayed linearly; a head moving mechanism including a head holder to which the head unit is mounted in a detachable manner and moving the head unit in a horizontal direction; a sensor which outputs information on offset positions of the head parts; and a control unit which controls the head unit and the head moving mechanism. The control unit acquires first offset information for a first head part and second offset information for a second head part among the head parts based on the output of the sensor and generates offset information for head parts other than the first head part and the second head part on the basis of the first offset information and the second offset information.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The technology disclosed in this specification relates to a component mounting apparatus and an offset information acquisition method. [Background technology]

[0002] As disclosed in Patent Document 1, in the technical field related to component mounting devices, there is known a device in which a head unit having multiple head parts for mounting components is detachable from a movement mechanism. The head unit installed in the component mounting device can be replaced with a new head unit. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2014-207331 Summary of the Invention [Problem to be solved by the invention]

[0004] When the head unit is replaced, the position of each head part of the head unit changes due to individual differences and assembly errors. Therefore, before the component mounting operation, offset information for each head part of the component mounting device is acquired one by one. If a head unit has a large number of head parts, it takes a long time to acquire offset information for all of the head parts. Therefore, it is desirable to reduce the time required to acquire the offset information for the head parts.

[0005] The technology disclosed in this specification aims to reduce the time required to acquire offset information of the head unit. [Means for solving the problem]

[0006] This specification discloses a component mounting apparatus comprising: a head unit including three or more linearly arranged head units each having a nozzle for holding an electronic component; a head movement mechanism having a head holder to which the head unit is detachably attached and moving the head unit in a horizontal direction; a sensor that outputs information related to the offset positions of the head units; and a control unit that controls the head unit and the head movement mechanism, wherein the control unit acquires first offset information for a first head unit and second offset information for a second head unit among the head units based on the output of the sensor, and generates offset information for the head units other than the first head unit and the second head unit based on the first offset information and the second offset information.

[0007] This specification discloses an offset information acquisition method for a component mounting device equipped with a head unit having three or more linearly arranged heads, the offset information acquisition method including the steps of: acquiring first offset information for a first head among the three or more heads based on output from a sensor that outputs information related to the offset positions of the heads; acquiring second offset information for a second head among the three or more heads based on the output from the sensor; and generating offset information for the heads other than the first head and the second head based on the first offset information and the second offset information. [Effects of the Invention]

[0008] According to the technology disclosed in this specification, it is possible to reduce the time required to acquire offset information of the head unit. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 1 is a diagram schematically showing a component mounting apparatus according to an embodiment. [Figure 2] FIG. 2 is a hardware configuration diagram showing the control device according to the embodiment. [Figure 3] FIG. 3 is a schematic diagram illustrating a detachable structure of the head unit according to the embodiment. [Figure 4] FIG. 4 is a schematic diagram illustrating a head portion of a head unit according to an embodiment. [Figure 5] FIG. 5 is a schematic diagram showing offset information in the X and Y directions of each head unit. [Figure 6] FIG. 6 is a schematic diagram showing the operation of acquiring offset information for the substrate imaging device. [Figure 7] FIG. 7 is a schematic diagram illustrating a captured image of a jig part. [Figure 8] FIG. 8 is a diagram for explaining acquisition of offset information for each height position of the head unit. [Figure 9] FIG. 9 is a diagram showing a method for acquiring offset information at each height. [Figure 10] FIG. 10 is a schematic diagram showing a method for acquiring offset information for a laser recognition device. [Figure 11] FIG. 11 is a schematic diagram showing a method for acquiring offset information for a contact detection switch. [Figure 12] FIG. 12 is a schematic diagram showing the operation of acquiring offset information for the component imaging device. [Figure 13] FIG. 13 is a schematic diagram showing a bottom surface recognition device according to an embodiment. [Figure 14] FIG. 14 is a schematic diagram showing the operation of acquiring offset information for the bottom surface recognition device. [Figure 15] FIG. 15 is a flowchart showing an offset information acquisition method according to the embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be described with reference to the drawings. In the embodiments, a three-dimensional Cartesian coordinate system is set, and the positional relationship of each part will be described with reference to the three-dimensional Cartesian coordinate system. The direction parallel to the X-axis within a predetermined plane is defined as the X-axis direction. The direction parallel to the Y-axis perpendicular to the X-axis within the predetermined plane is defined as the Y-axis direction. The direction parallel to the Z-axis perpendicular to each of the X-axis and Y-axis is defined as the Z-axis direction. The direction of rotation or tilt around the X-axis is defined as the θX direction. The direction of rotation or tilt around the Y-axis is defined as the θY direction. The direction of rotation or tilt around the Z-axis is defined as the θZ direction. The plane including the X-axis and Y-axis is defined as the XY plane. The plane including the Y-axis and Z-axis is defined as the YZ plane. The plane including the Z-axis and X-axis is defined as the ZX plane. The predetermined plane is defined as the XY plane. In the embodiments, the predetermined plane is defined as being parallel to a horizontal plane. The X-axis direction is the front-to-back direction. The Y-axis direction is the left-to-right direction. The Z-axis direction is the up-and-down direction. The +X direction is to the right. The -X direction is to the left. The +Y direction is backward (farther back). The -Y direction is forward (closer to you). The +Z direction is upward. The -Z direction is downward.

[0011] [Component mounting equipment] 1 is a diagram schematically illustrating a component mounting apparatus 1 according to an embodiment. The component mounting apparatus 1 mounts a component C on a substrate P. As shown in FIG. 1, the component mounting apparatus 1 includes a component supply device 2, a substrate transport device 3, a head unit 4, a head movement mechanism 5, a sensor 6, and a control device 7.

[0012] The component supply device 2 supplies components C. The components C are electronic components. The component supply device 2 includes a feeder 2A that unwinds a tape holding the components C from a tape reel. The component supply device 2 may also include a tray that supports a plurality of components C. The component supply devices 2 are arranged in the +Y direction and the -Y direction relative to the board transport device 3.

[0013] The board transport device 3 transports the board P. The board transport device 3 includes a pair of conveyor rails that transport the board P in the X-axis direction. The board transport device 3 includes a clamping mechanism that fixes the board P that has been transported to a predetermined work position. The board transport device 3 transports and supports the board P to the work position. The board transport device 3 transports the board P from the work position after the mounting work has been performed.

[0014] The head unit 4 includes three or more head sections 10 arranged in a line. The head sections 10 perform the mounting work of the components C by switching between holding and releasing the components C. The head unit 4 moves in both the X-axis direction and the Y-axis direction by a head movement mechanism 5. The head unit 4 holds the components C supplied from the component supply device 2 with the head sections 10, and then transports them to the substrate P supported by the substrate transport device 3. The head unit 4 mounts the components C held by the head sections 10 on the substrate P.

[0015] The head moving mechanism 5 moves the head unit 4 in the horizontal direction. The head moving mechanism 5 is a Cartesian robot. The head moving mechanism 5 includes a head holder 20, an X-axis drive unit 21, and a Y-axis drive unit 22. The head unit 4 is detachably attached to the head holder 20. The head holder 20 supports the head unit 4. The X-axis drive unit 21 is connected to the head holder 20 and moves the head holder 20 in the X-axis direction. The Y-axis drive unit 22 is connected to the head holder 20 via the X-axis drive unit 21 and moves the X-axis drive unit 21 in the Y-axis direction, thereby moving the head holder 20 in the Y-axis direction. In this way, the head moving mechanism 5 moves the head unit 4 attached to the head holder 20 in the X-axis and Y-axis directions. Note that the X-axis drive unit 21 can be any of various mechanisms that move the head holder 20 in a predetermined direction. The Y-axis drive unit 22 can be any of various mechanisms that move the X-axis drive unit 21 in a predetermined direction. As a mechanism for moving an object in a predetermined direction, for example, a linear motor, a rack and pinion, a conveying mechanism using a ball screw, a conveying mechanism using a belt, or the like can be used.

[0016] The sensor 6 outputs information regarding the offset position of the head unit 10. The sensor 6 may be a dedicated sensor for acquiring information regarding the offset position of the head unit 10. The sensor 6 may be a sensor for acquiring information other than the offset position during mounting work, and may be used to acquire the information regarding the offset position. The information regarding the offset position of the head unit 10 output by the sensor 6 may be information that directly indicates the offset position of the head unit 10, or may be indirect information that allows the offset position of the head unit 10 to be calculated using the information output by the sensor 6. In other words, the information regarding the offset position may be position information of the head unit 10, or may be information other than the position information of the head unit 10. The information other than the position information of the head unit 10 may be, for example, a detection signal indicating that the head unit 10 has reached a predetermined position, specifically a contact detection signal.

[0017] In the embodiment, the sensor 6 includes a board imaging device 30, a laser recognition device 31, a contact detection switch 32, a component imaging device 33, and a bottom surface recognition device .

[0018] The board imaging device 30 is provided on the head holder 20. In the embodiment, one board imaging device 30 is provided on each end of the head holder 20 in the left-right direction (X-axis direction). The laser recognition device 31 is provided on the front surface (surface on the -Y direction side) of the head unit 4. The contact detection switch 32, the component imaging device 33, and the bottom surface recognition device 34 are arranged between the board transport device 3 and the component supply device 2 on the +Y direction side. The contact detection switch 32, the component imaging device 33, and the bottom surface recognition device 34 are aligned along the X-axis direction.

[0019] The control device 7 includes a control unit 7A, a memory unit 7B, an operation unit 7C, and a display unit 7D. The control unit 7A controls the operation of each unit of the component mounting apparatus 1. The control unit 7A controls the operation of the head unit 4 and the head movement mechanism 5. The control unit 7A controls the component supply device 2, the board transport device 3, and the various sensors 6 described above. As a result, the control unit 7A controls the mounting operation of the component C in the component mounting apparatus 1 and the operation of acquiring offset information for each head unit 10. The memory unit 7B stores various information related to the control of the component mounting apparatus 1. The memory unit 7B stores programs for controlling the component mounting apparatus 1, mounting programs, component data, board data, offset information for each head unit 10, etc. The operation unit 7C is an input device through which the operator inputs operations and is composed of devices such as a keyboard, mouse, and touch panel. The operation unit 7C sends various detected inputs to the control unit 7A. The display unit 7D is a screen that displays various information to the operator in response to image signals from the control unit 7A, and is configured from a display device such as a liquid crystal display.

[0020] FIG. 2 is a hardware configuration diagram showing a control device 7 according to an embodiment. The control device 7 includes a computer system 1000. The control device 7 includes a processor 1001 such as a CPU, a main memory 1002 including a nonvolatile memory such as a ROM and a volatile memory such as a RAM, a storage 1003, and an interface 1004 including an input / output circuit. The functions of the control device 7 are stored in the storage 1003 as a computer program. The processor 1001 reads the computer program from the storage 1003, loads it into the main memory 1002, and executes predetermined processing in accordance with the computer program. The computer program causes the processor 1001 (computer) to execute processing of each step of the offset information acquisition method according to the embodiment. The computer program may be distributed to the control device 7 via a network. The interface 1004 is connected to an operation unit 7C and a display unit 7D.

[0021] 3 is a schematic diagram illustrating the attachment / detachment structure of the head unit 4 according to the embodiment. The head movement mechanism 5 further includes a unit lifting unit 23. The head holder 20 holds the head unit 4 via the unit lifting unit 23. The unit lifting unit 23 moves a connection unit 25 in the Z-axis direction by driving an elevation motor 24. The head unit 4 is detachably attached to this connection unit 25. The component mounting apparatus 1 can remove the head unit 4 from the head holder 20 and replace it with a new head unit 4, for example, when an abnormality occurs due to aging or when switching to a new unit that is compatible with a specific component type.

[0022] The head unit 4 is held at a position higher (in the +Z direction) than the component supply device 2 and the board transport device 3. The unit lifting section 23 can adjust the height position of the head unit 4 relative to the board P supported by the board transport device 3 using a lifting motor 24. The head unit 4 can move linearly in the Z-axis direction using guide rails 26. When the lifting motor 24 is driven, the connection section 25 moves in the Z-axis direction, and the head unit 4 moves in the Z-axis direction along the guide rails 26 in conjunction with the movement of the connection section 25. In this way, the head movement mechanism 5 can move the head unit 4 vertically in addition to horizontally.

[0023] Board imaging devices 30 are provided at both ends of the head holder 20 in the X-axis direction. The board imaging device 30 includes a main body 30A having an image sensor, a lens unit 30B, and an illumination unit 30C, and is provided so that the imaging direction is downward (-Z direction). The board imaging device 30 recognizes the board P on which the component C is mounted by the head unit 10. During the mounting operation, the board imaging device 30 captures an image of the BOC mark M (see FIG. 1) that is pre-applied to the board P placed at the work position from above. The captured image of the BOC mark M is used to associate the mounting position coordinates of the component C on the board P with the machine coordinate system of the component mounting device 1.

[0024] Fig. 4 is a schematic diagram illustrating the head section 10 of the head unit 4 according to the embodiment. Fig. 4 is a schematic diagram of the head unit 4 as viewed from the front.

[0025] The number of head portions 10 provided in the head unit 4 is not particularly limited as long as it is three or more. In the embodiment, an example is shown in which the head unit 4 includes eight head portions 10. The eight head portions 10 are arranged in a line at predetermined intervals along the X-axis direction. Hereinafter, the eight head portions 10 will be referred to as head portions 10 No. 1, No. 2, ..., No. 8 from the -X direction side to the +X direction side, and the individual head portions 10 will be distinguished by their numbers. Head portion 10 No. 1 is located at one end (end portion in the -X direction) of the eight head portions 10, and head portion 10 No. 8 is located at the other end (end portion in the +X direction) of the eight head portions 10.

[0026] The head unit 4 has eight head units 10, a frame 11 that supports each head unit 10, a head drive unit 12, and a suction actuator 13. The head unit 10 includes a nozzle 14 that holds a component C and a shaft 15 to the tip (lower end) of which the nozzle 14 is attached. The nozzle 14 is a suction mechanism that suctions and holds the component C. The nozzle 14 has an opening at its tip, and suctions and holds the component C at its tip by sucking air through this opening. The shaft 15 is a hollow tubular member that extends along the Z-axis direction. The suction actuator 13 is fluidly connected to the nozzle 14 via the shaft 15. The suction actuator 13 includes an electromagnetic valve that switches on and off the supply of negative pressure to the nozzle 14, etc.

[0027] The head driving unit 12 moves the head unit 10 in the Z-axis direction. An example of a mechanism for moving the head unit 10 in the Z-axis direction is a mechanism having a direct-acting linear motor whose driving direction is the Z-axis direction. The head driving unit 12 moves the shaft 15 in the Z-axis direction, thereby moving the tip of the nozzle 14 in the Z-axis direction. The head unit 4 also includes a head rotation mechanism (not shown) that rotates the shaft 15 in the θZ direction. An example of the head rotation mechanism is a mechanism composed of a motor and a transmission element connected to the motor and the shaft 15. The head rotation mechanism transmits the driving force output from the motor to the shaft 15 via the transmission element, rotating the shaft 15 in the θZ direction, thereby rotating the nozzle 14 in the θZ direction. The head rotation mechanism may move the corresponding head units 10 individually in the θZ direction, or may move multiple head units 10 together in the θZ direction using, for example, a shared θZ drive motor and transmission element. For example, two of the eight head units 10 may be linked together to rotate four groups of head units 10 separately, or two groups of four head units 10 may be linked together to rotate two groups of four head units 10 separately.

[0028] As a result, the eight head units 10 can move together along the XY plane by moving the head unit 4 using the head moving mechanism 5. The eight head units 10 can also move together in the Z-axis direction by moving the head unit 4 up and down using the unit lifting unit 23. The eight head units 10 can also be moved individually in the Z-axis direction by the head driving unit 12. The eight head units 10 can be rotated in the θZ direction by a head rotation mechanism. The drive amounts of the head moving mechanism 5, head driving unit 12, and head rotation mechanism are detected by a detection means such as an encoder (not shown). The control unit 7A acquires the drive amounts of the head moving mechanism 5, head driving unit 12, and head rotation mechanism from the detection means, and controls the positions of the head unit 4 and each head unit 10 based on the acquired drive amounts.

[0029] [Get offset information] Next, acquisition of offset information for the component mounting apparatus 1 according to the embodiment will be described. Regarding a replacement head unit 4, before shipping from the factory, the replacement head unit 4 is attached to a reference component mounting apparatus, and position information for each head unit 10 is acquired, thereby acquiring initial offset information 40 in advance. This initial offset information 40 is provided to the user along with the replacement head unit 4 and recorded in the storage unit 7B of the component mounting apparatus 1. However, when replacing the head unit 4 with respect to the head holder 20, the position of the head unit 10 may deviate from the position indicated by the initial offset information 40 due to an assembly error or the like. For example, if the replaced head unit 4 is attached tilted around the Zθ axis, each head unit 10 will be offset in the XY plane in accordance with the tilt of the head unit 4. Therefore, after replacing the head unit 4, offset information 41, which is position information for the head unit 10, is acquired for each head unit 10. The offset information 41 is acquired as a preparatory step before performing mounting work using the replaced head unit 4. Then, the control device 7 controls the position coordinates of each head unit 10 using the acquired offset information 41, thereby performing the mounting work.

[0030] The offset information 41 is acquired as relative position coordinates of the nozzle 14 of the head unit 10 with respect to the position of each part of the component mounting apparatus 1. In the embodiment, the offset information 41 of each head unit 10 acquired includes offset information 41A for the board imaging device 30, offset information 41B for the laser recognition device 31, offset information 41C for the contact detection switch 32, offset information 41D for the component imaging device 33, and offset information 41E for the bottom surface recognition device 34.

[0031] However, measuring the offset information 41 for each of the eight head units 10 would take a long time. Therefore, in this embodiment, the control unit 7A acquires first offset information B1 for the first head unit A1 and second offset information B2 for the second head unit A2 of the head units 10 based on the output of the sensor 6. The first head unit A1 and the second head unit A2 are two head units 10 selected from the eight head units 10. The control unit 7A then generates offset information 41 for the head units 10 other than the first head unit A1 and the second head unit A2 based on the first offset information B1 and the second offset information B2. This allows offset measurement of the two head units 10, the first head unit A1 and the second head unit A2, and calculation of the offsets for the other six head units 10 without measurement.

[0032] (Offset information for the substrate imaging device) First, the acquisition of offset information 41A for the board imaging device 30 will be described. FIG. 5 is a schematic diagram showing offset information 41A in the XY directions for each head unit 10. FIG. 5 is a schematic diagram showing the position of the board imaging device 30 and the position of each head unit 10 (position of the nozzle 14) on the XY plane. Nozzle positions R1, R2, ..., R8 in FIG. 5 represent the positions of head units 10 Nos. 1 to 8 defined by the initial offset information 40. Nozzle positions N1, N2, ..., N8 in FIG. 5 represent the positions of head units 10 Nos. 1 to 8 acquired as offset information 41A after replacing the head unit 4. In the embodiment, the initial offset information 40 and the offset information 41A are relative position coordinates in the XY directions from the imaging center of the board imaging device 30 on the -X direction side.

[0033] In this embodiment, the first head unit A1 is located at one end of the linear array of head units 10, and the second head unit A2 is located at the other end of the linear array of head units 10. More specifically, the first head unit A1 is head unit 10 No. 1, which is located at one end of the linear array of head units 10. The second head unit A2 is head unit 10 No. 8, which is located at the other end of the linear array of head units 10.

[0034] The control unit 7A acquires first offset information B1 and second offset information B2 in the horizontal direction (XY direction) relative to the board imaging device 30 based on an image captured by the board imaging device 30. In this embodiment, the control unit 7A acquires first offset information B1 for the first head unit 10 and second offset information B2 for the eighth head unit 10. The control unit 7A then generates offset information 41 for the head units 10 other than the first head unit A1 and the second head unit A2 by linearly interpolating the first offset information B1 and the second offset information B2. That is, since the head units 10 are arranged linearly in the head unit 4, even if the position of each head unit 10 deviates from the position of the initial offset information 40 due to an installation error of the head unit 4, the position changes while maintaining the linear arrangement. Based on this relationship, the offset information 41 for each head unit 10 is acquired by linear interpolation from the offset information for the first head unit A1 and the second head unit A2. The control unit 7A calculates offset information 41 for each of the second to seventh head units 10 using the initial offset information 40 for each of the second to seventh head units 10, the first offset information B1, and the second offset information B2.

[0035] Fig. 6 is a schematic diagram showing the operation of acquiring offset information for the substrate imaging device 30. Fig. 6 explains the acquisition of first offset information B1 for the first head unit A1 (head unit 10 No. 1) as an example. In Fig. 6, the numbers 1 to 7 enclosed by squares or arrows indicate the steps of the operation of acquiring offset information.

[0036] The control unit 7A uses the board imaging device 30 to acquire a captured image of the jig component 91 placed on the jig table 35. As shown in FIG. 1, the jig table 35 is arranged between the board transport device 3 and the component supply device 2 on the +Y direction side so as to be aligned with the contact detection switch 32. The jig component 91 is placed on the upper surface of the jig table 35. The jig component 91 is a simulated component for measurement having known dimensions. (1) The control unit 7A controls the head moving mechanism 5 so that the board imaging device 30 is positioned directly above the jig component 91, and causes the board imaging device 30 to capture an image of the jig component 91. The rotation angle of the jig component 91 in the θZ direction at this time is set to 0 degrees. The control unit 7A acquires a captured image 51 obtained by capturing the jig component 91 when the rotation angle is 0 degrees.

[0037] Next, (2) the control unit 7A controls the head moving mechanism 5 based on the initial offset information 40 so that the first head unit A1 is positioned directly above the jig component 91. In other words, the control unit 7A moves the head unit 4 by the relative position coordinates of the first head unit 10 defined in the initial offset information 40. (3) The control unit 7A controls the head unit 4 so that the first head unit A1 picks up the jig component 91.

[0038] (4) The control unit 7A rotates the first head unit A1, which has adsorbed the jig component 91, by 180 degrees in the θZ direction. (5) The control unit 7A controls the head unit 4 to lower the first head unit A1, place the jig component 91 on the jig table 35, and release the adsorption. As a result, the jig component 91 is re-placed on the jig table 35 with its orientation rotated by 180 degrees in the θZ direction.

[0039] (6) Based on the initial offset information 40, the control unit 7A controls the head moving mechanism 5 so that the board imaging device 30 is positioned directly above the jig component 91. In other words, the control unit 7A moves the head unit 4 in the direction opposite to (2) by the amount of the relative position coordinates of the first head section 10 defined in the initial offset information 40 so that the board imaging device 30 is positioned at the position where the jig component 91 was first imaged. (7) The control unit 7A causes the board imaging device 30 to image the jig component 91 that has been repositioned in a 180-degree rotated state. The control unit 7A acquires a captured image 52 of the jig component 91 in a 180-degree rotated state.

[0040] FIG. 7 is a schematic diagram illustrating a captured image of a jig component 91. The center of the captured image 51 coincides with the center of the jig component 91. If the position of the first head unit A1 is shifted from the center of the jig component 91 when the head unit 4 is moved by the amount specified by the initial offset information 40 of the first head unit A1, the jig component 91 is displayed in the captured image 52 at a position rotated 180 degrees with a radius 53 representing the amount of deviation between the first head unit A1 and the center of the jig component 91. Therefore, the position of the nozzle 14 of the first head unit A1, indicated by the dotted line, is the midpoint between the center of the jig component 91 in the captured image 51 and the center of the jig component 91 in the captured image 52. Therefore, a vector corresponding to the radius 53 can be obtained. As shown in the lower part of FIG. 7, the first offset information B1 is calculated using the vector 54 specified in the initial offset information 40 of the first head unit A1 and the vector 55 corresponding to the radius 53 obtained from the captured image.

[0041] The second offset information B2 of the second head unit A2 is also acquired in the same manner as in Figures 6 and 7. The control unit 7A calculates the other offset information 41 for numbers 2 to 7 from the first offset information B1 and the second offset information B2 by linear interpolation. In this way, offset information 41A for each head unit 10 with respect to the board imaging device 30 is acquired.

[0042] (Offset information for each height position) As described above, the head unit 4 can be moved in the vertical direction (Z-axis direction) by the unit lifting section 23. As shown in Fig. 6, in this embodiment, the height position of the head unit 4 can be adjusted in six steps: height H1, height H2, ..., height H6. The height position of the head unit 4 may be continuously adjustable, or may be adjustable in five steps or less, or seven steps or more. For ease of explanation, the range of adjustable heights H1 to H6 is shown enlarged in Fig. 6.

[0043] Here, due to assembly errors, etc., the shaft 15 of each head section 10 may be slightly tilted with respect to the Z axis. In this case, if the height position of the head unit 4 changes, the amount of descent of each head section 10 during mounting changes, and therefore the amount of offset of each head section 10 in the horizontal plane (in the XY plane) also changes depending on the amount of descent. For example, the amount of descent of the head section 10 when picking up the jig component 91 from a position at height H1 differs from the amount of descent of the head section 10 when picking up the jig component 91 from a position at height H6, so the amount of offset in the XY directions changes depending on the angle of inclination of the shaft 15.

[0044] Therefore, in the embodiment, the control unit 7A performs control to acquire offset information 41A for the substrate imaging device 30 for each height position of the head unit 4.

[0045] 8 is a diagram illustrating acquisition of offset information for each height position of the head unit 4. In the embodiment, the control unit 7A acquires a first height data set DA1 including first offset information B1 and second offset information B2 at a first height position J1 of the head unit 4, and a second height data set DA2 including the first offset information B1 and second offset information B2 at a second height position J2 of the head unit 4. Then, based on the first height data set DA1 and the second height data set DA2, the control unit 7A generates the first offset information B1 and the second offset information B2 for height positions other than the first height position J1 and the second height position J2.

[0046] The first height position J1 and the second height position J2 are two heights selected from the height of the adjustable head unit 4. Preferably, the first height position J1 is a lower position from among the heights of the adjustable head unit 4. The second height position J2 is a higher position from among the heights of the adjustable head unit 4. In the embodiment, the first height position J1 is the lowest position, specifically height H1. The second height position J2 is the highest position, specifically height H6.

[0047] The first offset information B1 and second offset information B2 at the first height position J1 are acquired by placing the head unit 4 at the first height position J1 (height H1) and performing the operations described with reference to Figures 6 and 7. As a result, the control unit 7A acquires a first height data set DA1 including the first offset information B1 and second offset information B2 at the first height position J1 (height H1).

[0048] The first offset information B1 and second offset information B2 at the second height position J2 are acquired by performing the operations described with reference to Figures 6 and 7 with the head unit 4 placed at the second height position J2 (height H6). As a result, the control unit 7A acquires the second height data set DA2 including the first offset information B1 and second offset information B2 at the second height position J2 (height H6).

[0049] The control unit 7A acquires first offset information B1 at each of the intermediate heights (heights H2 to H5) by performing linear interpolation based on the first offset information B1 of the first height data set DA1 and the first offset information B1 of the second height data set DA2. Similarly, the control unit 7A acquires second offset information B2 at each of the intermediate heights (heights H2 to H5) by performing linear interpolation based on the second offset information B2 of the first height data set DA1 and the second offset information B2 of the second height data set DA2.

[0050] As a result, the first offset information B1 and the second offset information B2 are acquired for each of the heights H1 to H6.

[0051] 9 shows a method for acquiring offset information at each height. The control unit 7A generates offset information for the head units 10 other than the first head unit A1 and the second head unit A2 at each height by linearly interpolating the first offset information B1 and the second offset information B2.

[0052] That is, the control unit 7A acquires first offset information B1 and second offset information B2 for each of heights H2 to H5 by a first interpolation process based on the first height data set DA1 and the second height data set DA2. Then, the control unit 7A acquires offset information for the second to seventh head units 10 for each of heights H2 to H5 by a second interpolation process based on the first offset information B1 and second offset information B2 acquired by the first interpolation process. Note that the control unit 7A acquires the offset information for the second to seventh head units 10 at height H1 by an interpolation process based on the actually measured first offset information B1 and second offset information B2 that constitute the first height data set DA1, and acquires the offset information for the second to seventh head units 10 at height H6 by an interpolation process based on the actually measured first offset information B1 and second offset information B2 that constitute the second height data set DA2.

[0053] As a result, in the embodiment, by simply performing a total of four offset information acquisition operations, namely, acquiring the first offset information B1 and the second offset information B2 at the first height position J1 (height H1) and acquiring the first offset information B1 and the second offset information B2 at the second height position J2 (height H6), offset information 41A for 48 points from height H1 to height H6 for the eight head units 10 is acquired.

[0054] (Offset information for laser recognition device) The acquisition of offset information 41B for the laser recognition device 31 will now be described. Fig. 10 is a schematic diagram showing a method for acquiring offset information 41B for the laser recognition device 31. Fig. 10 schematically shows the laser recognition device 31 when the offset information 41B is acquired by the head unit 10 (first head unit A1) from which the offset information 41B is to be acquired. In the embodiment, the initial offset information 40 and the offset information 41B are relative position coordinates in the X and Y directions from the origin position of the laser recognition device 31.

[0055] First, the laser recognition device 31 will be described. As shown in FIG. 3, the laser recognition device 31 is provided below the head unit 4. When the head unit 4 is replaced, the laser recognition device 31 is also replaced. The laser recognition device 31 extends along the X-axis direction. As shown in FIG. 4, the laser recognition device 31 faces, in the Y-axis direction, each of the eight head units 10 that are linearly arranged in the X-axis direction. When each head unit 10 is raised while holding a component C, the laser recognition device 31 faces, in the Y-axis direction, the component C held by each head unit 10.

[0056] As shown in FIG. 10, the laser recognition device 31 includes an emitter 31A and a light-receiving device 31B. Note that the light-receiving device 31B is not shown in FIG. 4 for the convenience of illustrating each nozzle 14. The laser recognition device 31 detects the component C by irradiating the side of the component C picked up by the nozzle 14 of the head unit 10 with a laser beam 31C. Based on the detection results of the laser recognition device 31, the shape of the component C, the XY position coordinates of the nozzle 14 (i.e., the head unit 10), whether the nozzle 14 is picking up the component C in the correct orientation, and the like are determined. The emitter 31A includes a light-emitting element that outputs the laser beam 31C in the -Y direction. The emitter 31A emits laser beams from multiple locations in the X direction. The light-receiving device 31B includes a light-receiving element that detects the laser beam 31C. The emitter 31A and the light-receiving device 31B are at the same height in the Z axis direction and face each other in the Y axis direction. The head unit 10 is disposed between the light emitting device 31A and the light receiving device 31B.

[0057] The laser recognition device 31 detects the shape of the component C placed between the emitter 31A and the receiver 31B by emitting a laser beam 31C from the emitter 31A and detecting the laser beam 31C that reaches the component C with the receiver 31B. That is, the outermost shape of the component C can be determined from the intensity distribution of the laser beam 31C that is blocked by the component C. The head unit 10 rotates the nozzle 14 using the head rotation mechanism to rotate the component C, thereby changing the direction in which the laser beam 31C is irradiated onto the component C. The outer shape of the component C can be determined from the intensity distribution of the laser beam 31C that is blocked by the component C at each rotation angle during one rotation of the component C. Furthermore, the center of rotation of the component C, i.e., the XY position coordinates of the head unit 10 (nozzle 14), can be obtained from the intensity distribution of the laser beam 31C at each rotation angle.

[0058] Next, the acquisition of offset information 41B for the laser recognition device 31 will be described. The acquisition of first offset information B1 for the first head section A1 (the first head section 10) will be described as an example. As shown in FIG. 10, when acquiring offset information 41B, the laser recognition device 31 performs the above-described detection operation using a jig nozzle 92 having known dimensions. The jig nozzle 92 is installed in an exchange nozzle holding mechanism (not shown), and each head section 10 can be moved to the exchange nozzle holding mechanism by moving the head unit 4, thereby exchanging the component suction nozzle 14 and the jig nozzle 92. The jig nozzle 92 is attached to the shaft 15 of the first head section A1 in place of the nozzle 14. The XY plane shape of the jig nozzle 92 is known.

[0059] Based on the initial offset information 40, the control unit 7A controls the head moving mechanism 5 so that the first head unit A1 is positioned at the origin position of the laser recognition device 31. The laser recognition device 31 emits laser light 31C toward the side surface of the jig nozzle 92 using the emission device 31A and acquires the intensity distribution of the laser light 31C along the X-axis direction using the light receiving device 31B. The intensity distribution of the laser light 31C reflects the outermost shape of the jig nozzle 92 in the X-axis direction. The control unit 7A rotates the jig nozzle 92 in the θZ direction using the head driving unit 12. The control unit 7A acquires the intensity distribution of the laser light 31C using the laser recognition device 31 at each rotation angle until the jig nozzle 92 makes one rotation. The control unit 7A calculates the XY position coordinates of the rotation center of the jig nozzle 92 based on the intensity distribution of the laser light 31C acquired at each rotation angle. The control unit 7A acquires the XY position coordinates of the rotation center of the jig nozzle 92 relative to the origin position of the laser recognition device 31 as first offset information B1 related to the offset information 41B.

[0060] The second offset information B2 of the second head unit A2 is also acquired in the same manner as the first offset information B1. That is, the control unit 7A attaches the jig nozzle 92 to the shaft 15 of the second head unit A2, determines the XY position coordinates of the rotation center of the jig nozzle 92 using the laser recognition device 31, and acquires the obtained XY position coordinates of the rotation center as the second offset information B2.

[0061] In this way, the control unit 7A acquires the first offset information B1 and the second offset information B2 in the horizontal direction (XY direction) relative to the laser recognition device 31 based on the detection result of the laser recognition device 31. The control unit 7A calculates the other offset information Nos. 2 to 7 from the first offset information B1 and the second offset information B2 by linear interpolation. As a result, the offset information 41B relative to the laser recognition device 31 for each head unit 10 is acquired.

[0062] As a result, in this embodiment, offset information 41B for the laser recognition devices 31 for the eight head units 10 is acquired simply by performing two offset information acquisition operations, that is, the first offset information B1 and the second offset information B2.

[0063] (offset information for contact detection switch) The following describes how offset information 41C for the contact detection switch 32 is acquired. Fig. 11 is a schematic diagram showing a method for acquiring offset information 41C for the contact detection switch 32. Fig. 11 explains, as an example, how offset information 41C is acquired by the head unit 10 (first head unit A1) from which the offset information 41C is acquired. The initial offset information 40 and offset information 41C are relative position coordinates in the Z direction from the reference height position of the contact detection switch 32.

[0064] As shown in FIG. 11, the contact detection switch 32 is disposed adjacent to the jig stand 35. The contact detection switch 32 has a detection unit 32A on its upper surface, and detects contact of an object with the detection unit 32A. The contact surface (upper surface) of the detection unit 32A is disposed at a predetermined reference height position. The reference height position serves as a reference for the Z-axis position when each head unit 10 picks up and places electronic components. When the contact detection switch 32 detects contact of an object with the detection unit 32A, it outputs a detection signal to the control unit 7A.

[0065] When acquiring the offset information 41C, a jig nozzle 93 with known dimensions is used. The jig nozzle 93 is installed in an interchangeable nozzle holding mechanism, and each head unit 10 can exchange the jig nozzle 93 for a component suction nozzle 14 in the interchangeable nozzle holding mechanism. The jig nozzle 93 is attached to the shaft 15 of the first head unit A1 in place of the nozzle 14. The dimension of the jig nozzle 93 in the Z-axis direction is known.

[0066] Based on the detection signal from the contact detection switch 32, the control unit 7A acquires first offset information B1 and second offset information B2 in the up and down direction (Z-axis direction) relative to the reference height position.

[0067] The control unit 7A uses the head movement mechanism 5 to position the first head unit A1, from which offset information is to be acquired, above the contact detection switch 32. The control unit 7A uses the head drive unit 12 to lower the first head unit A1, to which the jig nozzle 93 is attached. As the first head unit A1 descends, the lower end of the jig nozzle 93 comes into contact with the detection unit 32A of the contact detection switch 32. When the jig nozzle 93 comes into contact with the detection unit 32A, the contact detection switch 32 outputs a detection signal to the control unit 7A. The control unit 7A acquires the drive amount (descent amount) of the first head unit A1 in the Z-axis direction from the detection means provided in the head drive unit 12. That is, the control unit 7A acquires the descent amount of the first head unit A1 from when the first head unit A1 starts to descend until it receives the detection signal from the contact detection switch 32. The control unit 7A determines the height position (Z-axis direction position coordinate) at the start of the descent of the first head unit A1 based on the amount of descent of the first head unit A1 until it contacts the contact detection switch 32 and the known dimensions of the jig nozzle 93, and acquires the determined Z-axis direction position coordinate as first offset information B1 relative to the reference height position.

[0068] The second offset information B2 of the second head unit A2 is also acquired in the same manner as the first offset information B1. That is, the control unit 7A attaches the jig nozzle 93 to the shaft 15 of the second head unit A2, acquires the amount of descent of the second head unit A2 until it contacts the contact detection switch 32, and determines the height position (Z-axis direction position coordinate) of the second head unit A2 at the start of descent based on the amount of descent and the dimensions of the jig nozzle 93. The control unit 7A acquires the determined Z-axis direction position coordinate as second offset information B2 relative to the reference height position.

[0069] The control unit 7A calculates the other offset information from No. 2 to No. 7 by linear interpolation from the first offset information B1 and the second offset information B2, thereby acquiring the offset information 41C for the contact detection switch 32 of each head unit 10.

[0070] As a result, in this embodiment, offset information 41C for the contact detection switches 32 for eight head units 10 is acquired simply by performing two offset information acquisition operations, that is, the first offset information B1 and the second offset information B2.

[0071] (Offset information for component imaging device) The following describes how offset information 41D is acquired for the component imaging device 33. Fig. 12 is a schematic diagram showing the operation of acquiring offset information 41D for the component imaging device 33. Fig. 12 explains how first offset information B1 for the first head unit A1 (the first head unit 10) is acquired, as an example.

[0072] First, the component imaging device 33 will be described. The component imaging device 33 is disposed at a position below the head unit 4. The component imaging device 33 includes a main body 33A having an image sensor, and a lens unit and an illumination unit (not shown), and is disposed so that the imaging direction faces upward. The component imaging device 33 captures an image of the underside of a component C placed by the head unit 10 at an imaging position above the component imaging device 33. The component imaging device 33 outputs the captured image to the control unit 7A. Based on the captured image of the underside of the component C, the shape of the component C picked up by the nozzle 14 and the holding state of the electronic component by the nozzle 14 are recognized.

[0073] When acquiring the offset information 41D, the control unit 7A causes the first head unit A1 to hold the jig component 91, and causes the head moving mechanism 5 to move the head unit 4 so that the jig component 91 is positioned at an imaging position above the component imaging device 33. Based on the image captured by the component imaging device 33, the control unit 7A acquires first offset information B1 and second offset information B2 in the horizontal direction relative to the component imaging device 33.

[0074] The control unit 7A acquires captured images at each of the rotational positions of 0 degrees and 180 degrees, in the same manner as acquiring the offset information 41A for the board imaging device 30 described above. Specifically, the control unit 7A controls the head moving mechanism 5 based on the initial offset information 40 so that the jig component 91 held by the first head unit A1 is positioned at the imaging position (imaging center) of the component imaging device 33. The control unit 7A causes the component imaging device 33 to capture an image of the bottom surface of the jig component 91 held by the first head unit A1 at a rotation angle of 0 degrees. The control unit 7A acquires the captured image 61 at a rotation angle of 0 degrees.

[0075] The control unit 7A rotates the first head unit A1, which has sucked the jig component 91, by 180 degrees in the θZ direction. The control unit 7A then causes the component imaging device 33 to capture an image of the underside of the jig component 91 in the 180-degree rotated state. The control unit 7A acquires the captured image 62 in the state at a rotation angle of 180 degrees.

[0076] 7 , in the captured images obtained by the component imaging device 33, the jig component 91 is shown in captured image 61 and captured image 62 as being positioned at a position rotated 180 degrees with radius 53 representing the amount of deviation between the nozzle 14 of the first head unit A1 and the center of the jig component 91. The position of the first head unit A1 is the midpoint between the center of the jig component 91 in captured image 61 and the center of the jig component 91 in captured image 62. The control unit 7A acquires first offset information B1 for the component imaging device 33 based on the initial offset information 40 and a vector corresponding to radius 53. The first offset information B1 is acquired as XY position coordinates of the nozzle 14 of the first head unit A1 relative to the imaging center of the component imaging device 33.

[0077] The second offset information B2 of the second head unit A2 is also acquired in the same manner as the first offset information B1. The control unit 7A calculates the other offset information for numbers 2 to 7 from the first offset information B1 and the second offset information B2 by linear interpolation. As a result, offset information 41D for each head unit 10 relative to the component imaging device 33 is acquired.

[0078] As a result, in the embodiment, the offset information 41D for the component imaging devices 33 for the eight head units 10 is acquired simply by executing two offset information acquisition operations, that is, the first offset information B1 and the second offset information B2.

[0079] (Offset information for bottom surface recognition device) The acquisition of offset information 41E for the bottom surface recognition device 34 will be described. Fig. 13 is a schematic diagram showing the bottom surface recognition device 34 according to the embodiment. Fig. 14 is a schematic diagram showing the operation of acquiring offset information 41E for the bottom surface recognition device 34. Fig. 13 is a diagram of the bottom surface recognition device 34 as seen from the Y-axis direction, and Fig. 14 is a diagram of the bottom surface recognition device 34 as seen from the Z-axis direction. Fig. 14 will describe the acquisition of first offset information B1 for the first head unit A1 (head unit 10 No. 1) as an example.

[0080] First, the bottom surface recognition device 34 will be described. The bottom surface recognition device 34 is disposed at a position below the head unit 4. The bottom surface recognition device 34 includes a light source unit 34A that emits laser light 34C and a light receiving unit 34B that receives the laser light 34C. The light source unit 34A is disposed so as to extend linearly, and is disposed so that the emission direction of the laser light 34C is upward (diagonally upward). The light receiving unit 34B includes a line sensor in which light receiving elements are linearly arranged, and is disposed so as to be parallel to the light source unit 34A. The light receiving unit 34B receives the laser light 34C that is emitted from the light source unit 34A and reflected by the bottom surface of the component C. Based on the light reception signals of each light receiving element of the light receiving unit 34B, the distance in the Z-axis direction from the bottom surface recognition device 34 to the reflection position is acquired. In other words, the bottom surface recognition device 34 obtains a distance profile along the linear direction in which the light receiving elements are arranged. The control unit 7A controls the head moving mechanism 5 so that the component C held by the head unit 10 crosses the detection position of the bottom surface recognition device 34. For example, in FIGS. 13 and 14, the light receiving unit 34B extends in the Y-axis direction, and the head unit 4 moves so that the component C crosses in the X-axis direction. As a result, a distance profile along the Y-axis direction of the component C is obtained at each position of the component C in the X-axis direction, and the bottom surface shape of the component C (displacement in the Z-axis direction) is detected based on each distance profile. Based on the detection results of the bottom surface recognition device 34, the control unit 7A performs a planarity check for, for example, lead lift (bending) of a lead component or ball deformation of a component such as a BGA (Ball Grid Array).

[0081] When acquiring the offset information 41E, the control unit 7A causes the first head unit A1 to hold the jig component 91, and causes the head moving mechanism 5 to move the head unit 4 so that the jig component 91 passes a detection position above the lower surface recognition device 34. Based on the detection result of the lower surface recognition device 34, the control unit 7A acquires first offset information B1 and second offset information B2 in the horizontal direction (XY direction) relative to the lower surface recognition device 34.

[0082] Specifically, the control unit 7A acquires each detection result by the bottom surface recognition device 34 at multiple rotation angles in the θZ direction. In the example of FIG. 14, the control unit 7A acquires detection results at four rotation angles: 0 degrees, 90 degrees, 180 degrees, and 270 degrees. First, based on the initial offset information 40, the control unit 7A controls the head moving mechanism 5 so that the jig component 91 held by the first head unit A1 passes through the detection position (origin position) of the bottom surface recognition device 34. The control unit 7A causes the bottom surface recognition device 34 to detect the bottom surface of the jig component 91 held by the first head unit A1 when the rotation angle is 0 degrees. The control unit 7A acquires the detection result 65A when the rotation angle is 0 degrees.

[0083] Similarly, the control unit 7A rotates the first head unit A1, which has picked up the jig component 91, through a rotation angle of 90 degrees. The control unit 7A causes the bottom surface recognition device 34 to detect the bottom surface of the jig component 91 in the 90-degree rotated state. The control unit 7A acquires a detection result 65B for the 90-degree rotation angle state. The control unit 7A rotates the first head unit A1, which has picked up the jig component 91, through a rotation angle of 180 degrees. The control unit 7A causes the bottom surface recognition device 34 to detect the bottom surface of the jig component 91 in the 180-degree rotated state. The control unit 7A acquires a detection result 65C for the 180-degree rotation angle state. The control unit 7A rotates the first head unit A1, which has picked up the jig component 91, through a rotation angle of 270 degrees. The control unit 7A causes the bottom surface recognition device 34 to detect the bottom surface of the jig component 91 in the 270-degree rotated state. The control unit 7A acquires a detection result 65D for the 270-degree rotation angle state.

[0084] 7, in detection results 65A, 65B, 65C, and 65D, the jig component 91 is arranged on a circular orbit with radius 53 being the deviation amount between the nozzle 14 of the first head unit A1 and the center of the jig component 91. The position of the nozzle 14 of the first head unit A1, which corresponds to the center of the circular orbit, is acquired from the center of the jig component 91 in each detection result. The control unit 7A acquires first offset information B1 for the bottom surface recognition device 34 based on the initial offset information 40 and a vector corresponding to radius 53. The first offset information B1 is acquired as XY position coordinates of the nozzle 14 of the first head unit A1 relative to the detection position (origin) of the bottom surface recognition device 34.

[0085] The second offset information B2 of the second head unit A2 is also acquired in the same manner as the first offset information B1. The control unit 7A calculates the other offset information for numbers 2 to 7 from the first offset information B1 and the second offset information B2 by linear interpolation. As a result, offset information 41E for each head unit 10 relative to the lower surface recognition device 34 is acquired.

[0086] As a result, in the embodiment, by simply executing the offset information acquisition operation twice, the first offset information B1 and the second offset information B2, offset information 41E for the underside recognition device 34 for eight head units 10 is acquired. Note that the number of rotation angles of the jig part 91 detected when acquiring the first offset information B1 and the second offset information B2 is not particularly limited as long as it is multiple (two or more). The greater the number of rotation angles, the greater the number of data points to be sampled, and therefore the greater the accuracy of the acquired XY position coordinates of the nozzle 14.

[0087] In this way, the control unit 7A acquires offset information 41 for each head unit 10, including offset information 41A for the board imaging device 30, offset information 41B for the laser recognition device 31, offset information 41C for the contact detection switch 32, offset information 41D for the component imaging device 33, and offset information 41E for the underside recognition device 34.

[0088] [How to obtain offset information] Next, an offset information acquisition method according to an embodiment will be described. Fig. 15 is a flowchart showing the offset information acquisition method according to an embodiment. The offset information acquisition method according to an embodiment is a method for acquiring offset information of the head section 10 in a component mounting apparatus 1 equipped with a head unit 4 having three or more head sections 10 arranged in a line. The offset information acquisition method is realized by control of the component mounting apparatus 1 by a control section 7A.

[0089] The control unit 7A acquires first offset information B1 of a first head unit A1 of the three or more head units 10 based on the output of the sensor 6 that outputs information related to the offset position of the head unit 10 (step S1). The control unit 7A acquires second offset information B2 of a second head unit A2 of the three or more head units 10 based on the output of the sensor 6 (step S2). The specific methods for acquiring the first offset information B1 and the second offset information B2 are as described above.

[0090] The control unit 7A generates offset information 41 for the head units 10 other than the first head unit A1 and the second head unit A2 based on the first offset information B1 and the second offset information B2 (step S3). The control unit 7A calculates the other offset information for numbers 2 to 7 from the first offset information B1 and the second offset information B2 by linear interpolation.

[0091] The control unit 7A stores in the storage unit 7B the acquired offset information 41 of each head unit 10. This completes the preparation work before performing the mounting work using the replaced head unit 4.

[0092] [effect] As described above, according to the embodiment, the component mounting apparatus 1 includes a head unit 4 having nozzles 14 for holding components C and including three or more head portions 10 arranged in a line, a head movement mechanism 5 having a head holder 20 to which the head unit 4 is detachably attached and moving the head unit 4 in a horizontal direction, a sensor 6 that outputs information regarding the offset position of the head portion 10, and a control unit 7A that controls the head unit 4 and the head movement mechanism 5. Based on the output of the sensor 6, the control unit 7A obtains first offset information B1 for a first head portion A1 and second offset information B2 for a second head portion A2 of the head portions 10, and generates offset information 41 for the head portions 10 other than the first head portion A1 and the second head portion A2 based on the first offset information B1 and the second offset information B2.

[0093] As a result, by simply obtaining the first offset information B1 of the first head unit A1 and the second offset information B2 of the second head unit A2 of the head units 10, it is possible to obtain the offset information 41 of the remaining head units 10. As a result, the time required to obtain the offset information 41 of the head units 10 can be reduced compared to, for example, performing offset measurement on all of the head units 10 one by one.

[0094] In the embodiment, the first head section A1 is located at one end of the linear arrangement of the head sections 10, and the second head section A2 is located at the other end of the linear arrangement of the head sections 10. As a result, since the first head section A1 and the second head section A2 are each located at the end, if there is an assembly error in the head unit 4, the displacement of the first head section A1 and the second head section A2 will be large. Therefore, the first offset information B1 and the second offset information B2 can be easily acquired.

[0095] In the embodiment, the control unit 7A generates offset information 41 for the head units 10 other than the first head unit A1 and the second head unit A2 by linearly interpolating the first offset information B1 and the second offset information B2. This allows the offset information 41 for each head unit 10 to be generated with high accuracy based on the positional relationship of the head units 10 arranged in a straight line.

[0096] In the embodiment, the sensor 6 includes a board imaging device 30 that recognizes the board P on which the component C is mounted by the head unit 10, and the control unit 7A acquires first offset information B1 and second offset information B2 in the horizontal direction relative to the board imaging device 30 based on an image captured by the board imaging device 30. This makes it possible to acquire offset information 41A of each head unit 10 relative to the board imaging device 30 in a short time based on the first offset information B1 and second offset information B2 relative to the board imaging device 30.

[0097] In the embodiment, the head movement mechanism 5 can move the head unit 4 in the vertical direction in addition to the horizontal direction, and the control unit 7A acquires a first height data set DA1 including first offset information B1 and second offset information B2 at the first height position J1 of the head unit 4 and a second height data set DA2 including the first offset information B1 and second offset information B2 at the second height position J2 of the head unit 4. Based on the first height data set DA1 and the second height data set DA2, the control unit 7A generates the first offset information B1 and the second offset information B2 at height positions other than the first height position J1 and the second height position J2. This allows offset information 41 to be acquired that reflects changes in the offset amount of each head unit 10 due to changes in the height position of the head unit 4. For example, the time required to acquire the offset information 41 of the head unit 10 can be effectively reduced compared to when offset measurements are performed for all head units 10 at all height positions.

[0098] In the embodiment, the sensor 6 includes a laser recognition device 31 that detects the component C by detecting reflection of laser light from the side surface of the component C held by the head unit 10, and the control unit 7A acquires first offset information B1 and second offset information B2 in the horizontal direction for the laser recognition device 31 based on the detection result of the laser recognition device 31. This makes it possible to acquire offset information 41B for the laser recognition device 31 of each head unit 10 in a short time based on the first offset information B1 and second offset information B2 for the laser recognition device 31.

[0099] In the embodiment, the sensor 6 is disposed at a predetermined reference height position and includes a contact detection switch 32 that detects contact with the head unit 10 as the head unit 10 is lowered, and the control unit 7A acquires first offset information B1 and second offset information B2 in the up and down direction relative to the reference height position based on a detection signal from the contact detection switch 32. This allows offset information 41C of each head unit 10 relative to the contact detection switch 32 to be acquired in a short time based on the first offset information B1 and second offset information B2 for the contact detection switch 32.

[0100] In the embodiment, the sensor 6 includes a component imaging device 33 that captures an image of the component C held by the head unit 10 from below, and the control unit 7A acquires first offset information B1 and second offset information B2 in the horizontal direction relative to the component imaging device 33 based on an image captured by the component imaging device 33. This allows offset information 41D relative to the component imaging device 33 of each head unit 10 to be acquired in a short time based on the first offset information B1 and second offset information B2 relative to the component imaging device 33.

[0101] In the embodiment, the sensor 6 includes a bottom surface recognition device 34 that detects the planarity of the component C based on the reflection of laser light from the bottom surface of the component C held by the head unit 10, and the control unit 7A acquires first offset information B1 and second offset information B2 in the horizontal direction for the bottom surface recognition device 34 based on the detection result of the bottom surface recognition device 34. This makes it possible to acquire offset information 41E for the bottom surface recognition device 34 of each head unit 10 in a short time based on the first offset information B1 and second offset information B2 for the bottom surface recognition device 34.

[0102] Also, according to an embodiment, the offset information acquisition method is a method for acquiring offset information of a head portion 10 in a component mounting device 1 equipped with a head unit 4 having three or more head portions 10 arranged in a linear manner, and includes step S1 of acquiring first offset information B1 of a first head portion A1 of the three or more head portions 10 based on the output of a sensor 6 that outputs information regarding the offset position of the head portion 10, step S2 of acquiring second offset information B2 of a second head portion A2 of the three or more head portions 10 based on the output of the sensor 6, and step S3 of generating offset information 41 of head portions 10 other than the first head portion A1 and the second head portion A2 based on the first offset information B1 and the second offset information B2.

[0103] As a result, by simply obtaining the first offset information B1 of the first head unit A1 and the second offset information B2 of the second head unit A2 of the head units 10, it is possible to obtain the offset information 41 of the remaining head units 10. As a result, the time required to obtain the offset information 41 of the head units 10 can be reduced compared to, for example, performing offset measurement on all of the head units 10 one by one.

[0104] [Other embodiments] In the above embodiment, the board imaging device 30, the laser recognition device 31, the contact detection switch 32, the component imaging device 33, and the underside recognition device 34 are shown as examples of the sensor 6, but the sensor 6 may be any device other than the board imaging device 30, the laser recognition device 31, the contact detection switch 32, the component imaging device 33, and the underside recognition device 34 as long as it is capable of outputting information regarding the offset position of the head unit 10.

[0105] In the above embodiment, an example is shown in which offset information 41A for the board imaging device 30, offset information 41B for the laser recognition device 31, offset information 41C for the contact detection switch 32, offset information 41D for the component imaging device 33, and offset information 41E for the underside recognition device 34 are acquired, but only a portion of these offset information may be acquired, or offset information for other sensors 6 other than these offset information may be acquired. [Explanation of symbols]

[0106] 1...component mounting device, 2...component supply device, 2A...feeder, 3...substrate transport device, 4...head unit, 5...head movement mechanism, 6...sensor, 7...control device, 7A...control unit, 7B...storage unit, 7C...operation unit, 7D...display unit, 10...head unit, 11...frame, 12...head drive unit, 13...suction actuation unit, 14...nozzle, 15...shaft, 20...head holder, 21...X-axis drive unit, 22...Y-axis drive unit, 23...unit lifting unit, 2 4...Lifting motor, 25...Connection portion, 26...Guide rail, 30...Board imaging device, 30A...Main body portion, 30B...Lens unit, 30C...Illumination portion, 31...Laser recognition device, 31A...Emitting device, 31B...Light receiving device, 31C...Laser light, 32...Contact detection switch, 32A...Detection portion, 33...Component imaging device, 33A...Main body portion, 34...Bottom surface recognition device, 34A...Light source portion, 34B...Light receiving portion, 34C...Laser light, 35...Jig stand, 40...Initial operation offset information, 41...offset information, 41A...offset information, 41B...offset information, 41C...offset information, 41D...offset information, 41E...offset information, 51...captured image, 52...captured image, 53...radius, 54...vector, 55...vector, 61...captured image, 62...captured image, 65A...detection result, 65B...detection result, 65C...detection result, 65D...detection result, 91...jig part, 92...jig nozzle, 9 3...jig nozzle, 1000...computer system, 1001...processor, 1002...main memory, 1003...storage, 1004...interface, A1...first head unit, A2...second head unit, B1...first offset information, B2...second offset information, C...component, DA1...first height data set, DA2...second height data set, J1...first height position, J2...second height position, M...BOC mark, P...board.

Claims

1. a head unit including three or more head portions arranged in a line, each head portion having a nozzle for holding an electronic component; a head moving mechanism having a head holder to which the head unit is detachably attached, and moving the head unit in a horizontal direction; a sensor that outputs information regarding the offset position of the head unit; a control unit that controls the head unit and the head moving mechanism, the control unit acquires first offset information of a first head unit and second offset information of a second head unit among the head units based on the output of the sensor, and generates offset information of the head units other than the first head unit and the second head unit based on the first offset information and the second offset information. Component mounting equipment.

2. the first head portion is located at one end side of the linear array of the head portions, The second head portion is located on the other end side of the linear arrangement of the head portions. The component mounting device according to claim 1 .

3. the control unit generates offset information for the head units other than the first head unit and the second head unit by linearly interpolating the first offset information and the second offset information. The component mounting device according to claim 1 or 2.

4. the sensor includes a board imaging device that recognizes a board on which an electronic component is mounted by the head unit, the control unit acquires the first offset information and the second offset information in a horizontal direction with respect to the substrate imaging device based on an image captured by the substrate imaging device. The component mounting device according to claim 1 .

5. the head moving mechanism is capable of moving the head unit in a vertical direction in addition to a horizontal direction, The control unit acquire a first height data set including the first offset information and the second offset information at a first height position of the head unit, and a second height data set including the first offset information and the second offset information at a second height position of the head unit; generating the first offset information and the second offset information at height positions other than the first height position and the second height position based on the first height data set and the second height data set; The component mounting device according to claim 4 .

6. the sensor includes a laser recognition device that detects the electronic component by detecting reflection of a laser beam from a side surface of the electronic component held by the head portion, The control unit acquires the first offset information and the second offset information in a horizontal direction with respect to the laser recognition device based on a detection result of the laser recognition device. The component mounting device according to claim 1 .

7. the sensor includes a contact detection switch that is disposed at a predetermined reference height and detects contact with the head portion when the head portion is lowered, the control unit acquires the first offset information and the second offset information in the up-down direction relative to the reference height position based on a detection signal from the contact detection switch. The component mounting device according to claim 1 .

8. the sensor includes a component imaging device that images the electronic component held by the head portion from below, the control unit acquires the first offset information and the second offset information in a horizontal direction with respect to the component imaging device based on an image captured by the component imaging device. The component mounting device according to claim 1 .

9. the sensor includes a bottom surface recognition device that detects planarity of the electronic component based on reflection of a laser beam from the bottom surface of the electronic component held by the head portion, The control unit acquires the first offset information and the second offset information in a horizontal direction with respect to the lower surface recognition device based on a detection result of the lower surface recognition device. The component mounting device according to claim 1 .

10. 1. A method for acquiring offset information of a head unit in a component mounting apparatus equipped with a head unit having three or more head units arranged in a line, comprising: acquiring first offset information of a first head unit among the three or more head units based on an output of a sensor that outputs information relating to an offset position of the head unit; acquiring second offset information of a second head unit among the three or more head units based on an output of the sensor; generating offset information for the head unit other than the first head unit and the second head unit based on the first offset information and the second offset information, How to obtain offset information.

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