Electrodeposited metal conveying system and conveying method

Abstract

To improve the quality of a product consisting of laminated electrodeposited metal without reducing the number of products produced per unit time.SOLUTION: Since a conveying system 1 includes a conveying device 12 for conveying electrodeposited metal 20-1, 20-2 peeled off from a cathode plate 10, and an ejection device 14 for ejecting gas onto the surface of the electrodeposited metal 20-1, 20-2 conveyed by the conveying device 12 to remove a foreign matter, the product can be prevented from being contaminated with a foreign matter, without lowering the efficiency of peeling off and the efficiency of laminating the electrodeposited metal 20-1, 20-2.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present invention relates to an electrodeposited metal transport system and transport method for transporting electrodeposited metal peeled from a cathode plate, and more particularly to an electrodeposited metal transport system and transport method for producing a product in which a predetermined number of electrodeposited metal sheets are stacked when the electrodeposited metal is peeled off and shipped, stored, etc. [Background technology]

[0002] In electrolytic refining of metals using the permanent cathode method, for example, in copper electrolytic refining (see Patent Documents 1 and 2, etc.), blister copper is cast using an anode casting machine to cast copper anodes, and this copper anode and a stainless steel cathode plate are alternately immersed in an electrolytic cell and electricity is passed through to electrodeposit copper onto the cathode plate. Once a sufficient amount of copper has been electrodeposited onto the cathode plate, the cathode plate is lifted out of the electrolytic cell, and the electrolytic copper electrodeposited on both sides of the cathode plate is stripped using a stripping device. This is then transported on a conveyor to be stacked, and finally shipped as a product bundled with bands or the like. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2008-231501 [Patent Document 2] Japanese Patent Application Laid-Open No. 2015-206101 Summary of the Invention [Problem to be solved by the invention]

[0004] However, stripping the electrolytic copper from both sides of the cathode plate using a stripping device requires processes such as grasping the pair of electrolytic copper particles electrodeposited on both sides of the cathode plate, opening the pair of electrolytic copper particles, and pulling the pair of electrolytic copper particles to separate them. During this process, the edge strip of the cathode plate can break, and the resulting debris can remain on the surface of the electrolytic copper. The cause of this damage is the deterioration of the edge strip over time, particularly the deterioration caused by increased electrodeposition in the gap between the mother plate and the edge strip due to a decrease in the insulation of the edge strip caused by an increase in the current density in electrolytic refining. In addition to edge strip debris, parts such as bolts and nuts that have fallen off the stripping device can also remain on the surface of the electrolytic copper. When the electrolytic copper is laminated with such debris, bolts, nuts, and other foreign objects remaining, it is impossible to determine whether or not foreign objects are present from the outside, so the electrolytic copper product is shipped as is, resulting in complaints and complaints.

[0005] Therefore, the present invention has been made in consideration of such problems, and aims to provide an electrodeposited metal conveying system and conveying method that can improve the quality of products made of laminated electrodeposited metal without reducing the number of products manufactured per unit time. [Means for solving the problem]

[0006] One electroplated metal transport system according to the present invention is characterized by including a transport device that transports electroplated metal peeled from a cathode plate, and an injection device that injects gas onto the surface of the electroplated metal transported by the transport device to remove foreign matter.

[0007] In any of the electroplated metal transport systems of the present invention, the transport device transports the first electroplated metal from a first area where the first electroplated metal peeled from the first surface of the cathode plate falls to a second area where the second electroplated metal peeled from the second surface of the cathode plate falls, and the spraying device performs a first spraying process of spraying gas onto the surface of the first electroplated metal before the second electroplated metal falls onto the first electroplated metal, and a second spraying process of spraying gas onto the surface of the second electroplated metal after the second electroplated metal falls onto the first electroplated metal.

[0008] In any of the electrodeposited metal transport systems according to the present invention, the spraying device may include a gas storage tank dedicated to the first spraying process and a gas storage tank dedicated to the second spraying process.

[0009] In any of the electroplated metal transport systems according to the present invention, the position and attitude of the nozzle for the first injection process may be set so that gas can be injected into the gap between the first electroplated metal transported to the second area and the second electroplated metal falling onto the first electroplated metal, and the position and attitude of the nozzle for the second injection process may be set so that gas can be injected toward the surface of the second electroplated metal that has fallen onto the first electroplated metal.

[0010] In any of the electroplated metal transport systems according to the present invention, the nozzle for the first injection process may be positioned diagonally above a first corner of the second area, with its opening facing the center of the second area, and the nozzle for the second injection process may be positioned diagonally above a second corner of the second area, with its opening facing the center of the second area.

[0011] In any of the electroplated metal transport systems according to the present invention, the nozzle opening of the first spray treatment and the nozzle opening of the second spray treatment may be set to a flat shape so that gas is sprayed over the entire surface of the first electroplated metal or the second electroplated metal arranged in the second area.

[0012] In any of the electroplated metal conveying systems according to the present invention, the pressure of the gas sprayed onto the surface of the first electroplated metal and the pressure of the gas sprayed onto the surface of the second electroplated metal may be set to a pressure that can blow foreign matter out of the conveying path.

[0013] Any of the electroplated metal transport systems according to the present invention continuously transports a plurality of the cathode plates, and the spray device may execute the first spray process in response to a disconnection detection signal indicating that the first electroplated metal and the second electroplated metal have been separated, and may execute the second spray process in response to a forward rotation signal for transporting the first electroplated metal from the first area to the second area.

[0014] One method for transporting electroplated metal according to the present invention is characterized by comprising the steps of transporting electroplated metal peeled off from a cathode plate and spraying gas onto the surface of the transported electroplated metal to remove foreign matter. [Effects of the Invention]

[0015] The electrodeposited metal conveying system or method according to the present invention removes foreign matter by injecting gas onto the surface of the electrodeposited metal being conveyed, thereby preventing a decrease in the efficiency of stripping and laminating the electrodeposited metal. This has the effect of improving the quality of products made of laminated electrodeposited metal without reducing the number of products manufactured per unit time. [Brief explanation of the drawings]

[0016] [Figure 1] FIG. 1 is an explanatory diagram illustrating the state of the electrolytic copper transport system before the electrolytic copper is stripped. [Figure 2] FIG. 2 is an explanatory diagram illustrating the state of the electrolytic copper transport system during the electrolytic copper stripping process. [Figure 3] FIG. 3 is an explanatory view illustrating the state of the electrolytic copper transport system during the first jetting treatment. [Figure 4] FIG. 4 is an explanatory view illustrating the state of the electrolytic copper transport system during the second jetting treatment. [Figure 5] FIG. 5 is a functional block diagram of the peeling device and its periphery. [Figure 6] FIG. 6 is an explanatory diagram illustrating the nozzle. [Figure 7] FIG. 7 is a diagram showing the configuration of the injection device. [Figure 8] FIG. 8 is an operation timing chart of the peeling device, the transport device, and the injection device. DETAILED DESCRIPTION OF THE INVENTION

[0017] 1. Embodiment Hereinafter, a system and method for transporting electrolytic copper will be described as one embodiment of a system and method for transporting electrodeposited metal according to the present invention.

[0018] 1-1.Conveyor system configuration Fig. 1 is an explanatory diagram illustrating the state of the electrolytic copper transport system before the electrolytic copper stripping process, Fig. 2 is an explanatory diagram illustrating the state of the electrolytic copper transport system during the electrolytic copper stripping process, Fig. 3 is an explanatory diagram illustrating the state of the electrolytic copper transport system during the first injection process, and Fig. 4 is an explanatory diagram illustrating the state of the electrolytic copper transport system during the second injection process. Note that Figs. 1 to 4(A) are schematic perspective views of the entire transport system, and Figs. 1 to 4(B) are schematic side views of the transport conveyor and its periphery.

[0019] The electrolytic copper conveying system 1 shown in Figures 1 to 4 is a conveying system that continuously conveys multiple cathode plates 10, 10, ... on which electrolytic copper has been electrodeposited by electrolytic refining using a permanent cathode method, particularly the ISA method, and is equipped with a traverse conveyor 11, a stripping device 15, a transport conveyor 12 (an example of a transport device), an inspection walkway 13, an injection device 14, etc.

[0020] The traverse conveyor 11 is a conveyor that sequentially transports multiple cathode plates (also called "copper-deposited cathodes") 10 onto which electrolytic copper has been electrodeposited to the location where the stripping device 15 is installed, and sequentially transports the cathode plates 10 from the location where the stripping device 15 is installed after the stripping process.

[0021] The stripping device 15 is a device that performs a stripping process to strip the first electrolytic copper 20-1 and the second electrolytic copper 20-2 from both sides of the cathode plate 10 that has been transported by the traverse conveyor 11. The stripping device 15 will be described in detail later.

[0022] The transport conveyor 12 is a conveyor disposed below the stripping device 15 so as to cross the traverse conveyor 11. This transport conveyor 12 transports the first electrolytic copper 20-1 from a first area A1, where the first electrolytic copper 20-1 peeled from the first surface of the cathode plate 10 falls, to a second area A2, where the second electrolytic copper 20-2 peeled from the second surface of the cathode plate 10 falls. Such operation of the transport conveyor 12 allows the second electrolytic copper 20-2 to fall onto the first electrolytic copper 20-1, and also transports the stacked first electrolytic copper 20-1 and second electrolytic copper 20-2 from the second area A2 to below the inspection corridor 13.

[0023] The inspection walkway 13 is a passageway that is suspended above the transport conveyor 12 and is used when an inspector or worker crosses the transport conveyor 12. In this embodiment, the stand of the inspection walkway 13 is used as the attachment point for nozzles N1 and N2 of the spray device 14, which will be described later. The first electrolytic copper 20-1 and the second electrolytic copper 20-2 that have been transported by the transport conveyor 12 and passed under the inspection walkway 13 are pressed in the thickness direction by a press device (not shown). After the press treatment, the first electrolytic copper 20-1 and the second electrolytic copper 20-2 are stacked in a predetermined number of sheets to form a pile, and then weighed, labeled, bound, and so on before being shipped.

[0024] The spraying device 14 is a device that removes foreign matter by spraying gas onto the surfaces of the first electrodeposited metal 20-1 and the second electrodeposited metal 20-2 that are conveyed by the transport conveyor 12. Specifically, a first spraying process is performed in which gas is sprayed onto the surface of the first electrolytic copper 20-1 immediately before the second electrolytic copper 20-2 falls onto the first electrolytic copper 20-1 that has been conveyed to the second area A2 (FIG. 3), and a second spraying process is performed in which gas is sprayed onto the surface of the second electrolytic copper 20-2 immediately after the second electrolytic copper 20-2 falls onto the first electrolytic copper 20-1 (FIG. 4). The first jetting process (FIG. 3) can prevent foreign matter from remaining between the first electrolytic copper 20-1 and the second electrolytic copper 20-2, and the second jetting process can prevent foreign matter from remaining on the surface of the second electrolytic copper 20-2, so that foreign matter such as parts of the stripping device 15 or pieces of parts of the cathode plate 10 can be prevented from being mixed into the final product. Here, in order not to reduce the manufacturing efficiency, it is preferable to set the time lag between the execution of the first jetting process and the fall of the second electrolytic copper 20-2 and the time lag between the fall of the second electrodeposited metal 20-2 and the execution of the second jetting process as short as possible (see FIG. 8 and its explanation below). The injection pipes (reference numerals 38g, 38g in FIG. 7) and nozzles N1, N2 of the injection device 14 are attached, for example, to the platform portion of the inspection corridor 13, and other parts of the injection device 14 (reference numerals 31, 38, 38 in FIG. 7, etc.) are arranged, for example, in an empty space away from the conveying path of the traverse conveyor 11 and the conveying path of the conveying conveyor 12.

[0025] 1-2. Function of the stripping device Fig. 5 is a functional block diagram of the stripping device and its periphery. As shown in Fig. 5, the stripping device 15 includes grips 15a, 15a that hold the first electrolytic copper 20-1 and the second electrolytic copper 20-2 electrodeposited on the cathode plate 10, arms 15b, 15b connected to the grips 15a, 15a, cylinders 15c, 15c that drive the arms 15b, 15b, a cut detection sensor 15d that detects the timing when the first electrolytic copper 20-1 and the second electrolytic copper 20-2 are separated and outputs a cut detection signal, and a drop sensor 15e that detects the timing when the first electrolytic copper 20-1 falls into the first area A1 of the transfer conveyor 12 and outputs a drop signal. The peeling device 15 having the above configuration executes the peeling process under the control of, for example, the control panel 50. This peeling process comprises the following steps (1) to (4).

[0026] (1) A step of gripping the first electrolytic copper 20-1 and the second electrolytic copper 20-2 electrodeposited on both sides of the cathode plate 10 with grips 15a, 15a. (2) A process (flapping) in which the grips 15a, 15a are driven by the cylinders 15c, 15c to repeatedly open the upper ends of the first electrolytic copper 20-1 and the second electrolytic copper 20-2 in directions away from each other. (3) When it is detected that the first electrolytic copper 20-1 and the second electrolytic copper 20-2 are completely opened due to the stroke of the cylinders 15c, 15c reaching a predetermined value, a process of pulling the first electrolytic copper 20-1 and the second electrolytic copper 20-2 to separate the lower end sides. (4) When it is detected that the first electrolytic copper 20-1 and the second electrolytic copper 20-2 have been separated from each other based on the cut detection signal output from the cut detection sensor 15e, the first electrolytic copper 20-1 and the second electrolytic copper 20-2 are released from the grips 15a, 15a, thereby causing the first electrolytic copper 20-1 and the second electrolytic copper 20-2 to fall downward.

[0027] When the first electrolytic copper 20-1 and the second electrolytic copper 20-2 fall onto the transport conveyor 12, a fall signal is output from the fall sensor 15e. This fall signal triggers the control panel 50 to give a forward rotation signal to the transport conveyor 12 and the traverse conveyor 11. In response to this forward rotation signal, the transport conveyor 12 and the traverse conveyor 11 rotate forward by one pitch, so that the target of the stripping process is switched from the preceding cathode plate 10 to the following cathode plate 10.

[0028] 1-3.Nozzle details FIG. 6 is an explanatory diagram illustrating the nozzle. First, the position and attitude of the nozzle N1 used in the first injection process are set so that gas can be injected into the gap A between the first electrolytic copper 20-1 transported to the second area A2 and the second electrolytic copper 20-2 falling onto the first electrolytic copper 20-1, as shown in Figure 6(1). For this reason, a certain level of precision is required in adjusting the position and attitude of the nozzle N1. 6(2), the position and posture of the nozzle N2 used in the second jetting process only need to be set so that the gas can be jetted toward the surface of the second electrolytic copper 20-2 that has fallen onto the first electrolytic copper 20-1. Therefore, the adjustment of the position and posture of the nozzle N2 does not require as high precision as that of the nozzle N1.

[0029] For example, the nozzle N1 for the first jetting process is disposed at a position diagonally above a first corner of the second area A2 with its opening facing the center of the second area A2 (FIG. 6(1)), and the nozzle N2 for the second jetting process is disposed at a position diagonally above a second corner of the second area A2 with its opening facing the center of the second area A2 (FIG. 6(2)). The angle formed between the surface of the first electrolytic copper 20-1 disposed in the second area A2 and the normal to the opening of the nozzle N1 is, for example, 15° to 25°, and the angle formed between the surface of the second electrolytic copper 20-2 and the normal to the opening of the nozzle N2 is, for example, 15° to 25°.

[0030] Here, the openings of the nozzles N1 and N2 are set to a flat shape so that gas can be forcefully sprayed over the entire surface of the first electrolytic copper 20-1 or the second electrolytic copper 20-2 arranged in the second area A2, and the pressure of the gas sprayed onto the surface of the first electrolytic copper 20-1 (the pressure of the gas sprayed in the first spraying process) and the pressure of the gas sprayed onto the surface of the second electrolytic copper 20-2 (the pressure of the gas sprayed in the second spraying process) are set to a pressure sufficient to blow away foreign matter (here, pieces of the edge strip of the cathode plate, parts such as bolts and nuts that have fallen off the equipment of the stripping device) outside the transport path. Such pressures are, for example, 0.5 MPa to 0.6 MPa.

[0031] 1-4.Injection device configuration Fig. 7 is a configuration diagram of the injection device. As shown in Fig. 7, the injection device 14 includes one screw compressor 31, a pipe 32 connected to the screw compressor 31, two pipes 33, 33 branching from the pipe 32, two bottle blowers 38, 38 individually connected to the tip ends of the two pipes 33, 33, and nozzles N1, N2 individually provided at the tips of the injection pipes 38g, 38g of the two bottle blowers 38, 38, and the solenoid valves 38e, 38e of the bottle blowers 38, 38 are controlled by the above-mentioned control panel 50. The diameter of the two pipes 33, 33 is, for example, 10A (=17.3mm), and the diameter of the pipe 32 which is the mother pipe of these two pipes 33, 33 is, for example, 15A to 20A (=21.7mm to 27.2mm).

[0032] One of the bottle blowers 38 is a compressed gas storage tank dedicated to the first injection process (one of the nozzles N1), and the other bottle blow 38 is a compressed gas storage tank dedicated to the second injection process (the other nozzle N2). Generally, the bottle blowers 38, 38 require an accumulation time (an accumulation mode time, described later) to accumulate compressed gas before injection, but by providing two systems of bottle blowers 38, 38 and injecting alternately in this way, it is possible to perform the first injection process and the second injection process consecutively at a time interval shorter than the accumulation time.

[0033] Each of these bin blowers 38, 38 includes a tank 38a, a cylinder 38b, a pressure plate ball valve 38c, a stand 38d, an electromagnetic valve 38e, a silencer 38f, an injection pipe 38g, an air intake ball valve 38h, a rubber hose 38i, a check valve 38j, and a pilot hose 38m.

[0034] 1-5.Bin Blow Movement The bottle blower 38 switches from the accumulation mode to the injection mode described below by controlling the opening and closing of the electromagnetic valve 38e, and immediately after switching, it injects gas from the nozzle N1 or N2 attached to the tip of the injection pipe 38g. The type of gas to be injected is selected to be safe for the human body (e.g., air).

[0035] (1) Accumulation mode: With solenoid valve 38e closed, compressed gas supplied from screw compressor 31 enters tank 38a, and gas also enters cylinder 38b via pilot hose 38m. At this time, the piston (not shown) in cylinder 38b is held in the "closed position" due to the pressure difference between the inside of tank 38a and the inside of cylinder 38b, and compressed gas fills tank 38a.

[0036] (2) Injection mode: When the solenoid valve 38e is then opened, the gas inside the cylinder 38b is exhausted to the outside, and the piston (not shown) inside the cylinder 38b instantly moves to the "open position" due to the pressure difference between the inside of the tank 38a and the inside of the cylinder 38b. As a result, the compressed gas inside the tank 38a is explosively ejected to the outside through the cylinder 38b, the ejection pipe 38g, and the nozzle N1 or N2.

[0037] 1-6.Timing chart 8 is a timing chart of the operation of the peeling device, the transport device, and the injection device. The "transport device" here includes the traverse conveyor 11 and the transport conveyor 12 described above.

[0038] 8(A), the stripping device 15 repeatedly performs the stripping process consisting of the above-described steps (1) to (4) on a plurality of cathode plates 10. Depending on the cathode plate 10, the stripping process may proceed smoothly or may be difficult, so the time required for steps (2) and (3) of steps (1) to (4) varies depending on the cathode plate 10.

[0039] As shown in FIG. 8(B), the traverse conveyor 11 and the transport conveyor 12 are triggered by a drop signal output from the drop sensor 15e of the peeling device 15 to rotate forward.

[0040] As shown in Figure 8(C), the spraying device 14 executes a first spraying process in which compressed gas is sprayed from the nozzle N1 onto the surface of the first electrolytic copper 20-1, triggered by a cut detection signal output from the cut detection sensor 15d of the peeling device 15, and executes a second spraying process in which compressed gas is sprayed from the nozzle N2 onto the surface of the second electrolytic copper 20-2, triggered by a forward rotation signal given to the transport conveyor 12 and the traverse conveyor 12.

[0041] Therefore, as shown in FIG. 8(D), the ejection device 14 repeats a cycle T (=about 5 to 10 seconds) consisting of an ejection time T1 of the first ejection process, a waiting time T3, an ejection time T2 of the second ejection process, and a waiting time T4.

[0042] The ejection period T1 is the time from the ejection start timing (= the output timing of the cut detection signal) of the nozzle N1 to the ejection end timing. This ejection period T1 corresponds to the time required to blow off foreign matter from the surface of the first electrolytic copper 20-1 to the outside of the transport path, and is a fixed value of, for example, 1 second or less.

[0043] The waiting time T3 is the waiting time from the timing when nozzle N1 completes ejection to the timing when nozzle N2 starts ejecting (= the timing when the normal rotation signal is output). This waiting time T3 is a variable value (for example, several seconds) that varies depending on the timing when the normal rotation signal is output.

[0044] The ejection time T2 is the time from the ejection start timing (= the output timing of the normal rotation signal) of the nozzle N2 to the ejection end timing. This ejection time T2 corresponds to the time required to blow off foreign matter from the surface of the second electrolytic copper 20-2 to the outside of the transfer path, and is a fixed value of, for example, 1 second or less.

[0045] The waiting time T4 is the time from when nozzle N2 completes jetting to when nozzle N1 next starts jetting (=when the disconnection detection signal is output). This waiting time T4 is a variable value (for example, several seconds to 10 seconds) that varies depending on when the disconnection detection signal is output.

[0046] 2. Effects of the embodiment As explained above, the conveying system and conveying method for electrodeposited metals according to one embodiment of the present invention removes foreign matter by injecting gas onto the surfaces of the first electrolytic copper 20-1 and the second electrolytic copper 20-2 conveyed by the conveyor 12, and therefore does not reduce the efficiency of stripping or laminating the first electrolytic copper 20-1 and the second electrolytic copper 20-2 from the cathode plate 10. Therefore, the quality of the products made of laminated electrolytic copper can be improved without reducing the number of products manufactured per unit time. Therefore, one embodiment of the present invention may contribute to the achievement of Goal 9 "Build resilient infrastructure, promote inclusive and sustainable industrialization and foster innovation" and Goal 12 "Ensure sustainable consumption and production patterns" of the United Nations-led Sustainable Development Goals (SDGs) by promoting the reuse of waste and improving resource utilization efficiency.

[0047] 3. Supplementary Description of Embodiments In the conveying system 1 of the above-described embodiment, the injection device 14 may generate noise due to the principle of instantaneous injection of compressed gas. Therefore, the parts of the injection device 14 that may generate noise (e.g., the nozzles N1, N2, and the bottle blowers 38, 38) may be disposed in a space surrounded by a soundproof cover.

[0048] Furthermore, in the transport system 1 of the above-described embodiment, a foreign matter sensor may be used to detect whether or not foreign matter is present on the surface of the first electrolytic copper 20-1 or the second electrolytic copper 20-2 peeled off from the cathode plate 10, and if no foreign matter is present, the first ejection process or the second ejection process may be omitted, thereby reducing the number of times the ejection device 14 is driven.

[0049] Although the preferred embodiment of the present invention has been described in detail above, it goes without saying that the present invention is not limited to the specific embodiment and various modifications and variations are possible within the scope of the gist of the present invention as set forth in the claims. For example, at least some of the operations of the conveyance system 1 may be performed manually by an operator. [Explanation of symbols]

[0050] 1. Transport system 10 cathode plate 11 Traverse conveyor 12 Transport conveyor 13 Inspection Corridor 14 Injection device 15 Stripping device 15a Grip 20 Electrolytic copper 20-1 First Electrolytic Copper 20-2 Secondary Electrolytic Copper 31 Screw compressor 32 Piping 33 Piping 38 Binbro 38a Tank 38b cylinder 38c Pressure plate ball valve 38d Mounting stand 38e Solenoid valve 38f silencer 38g injection tube 38h Air intake ball valve 38i rubber hose 38j Check valve 38k pressure gauge 38m pilot hose 50 Control Panel N1 nozzle N2 nozzle

Claims

1. a conveying device for conveying the electrodeposited metal peeled off from the cathode plate; an injector that injects gas onto the surface of the electrodeposited metal conveyed by the conveyor to remove foreign matter; 1. A transport system for electrodeposited metal comprising:

2. 2. The electrodeposited metal transport system according to claim 1, The conveying device is conveying the first electrodeposited metal peeled from the first surface of the cathode plate from a first area where the first electrodeposited metal falls toward a second area where the second electrodeposited metal peeled from the second surface of the cathode plate falls; The injection device a first injection process of injecting a gas onto a surface of the first electrodeposited metal before the second electrodeposited metal falls onto the first electrodeposited metal; a second injection process in which a gas is injected onto the surface of the second electrodeposited metal after the second electrodeposited metal has fallen onto the first electrodeposited metal; Electrodeposited metal transport system, characterized by carrying out the above steps.

3. 3. The electrodeposited metal transport system according to claim 2, The injection device A gas storage tank dedicated to the first injection process and a gas storage tank dedicated to the second injection process are provided. A transport system for electrodeposited metals.

4. 3. The electrodeposited metal transport system according to claim 2, a position and an attitude of a nozzle of the first jetting process are set so that gas can be jetted into a gap between the first electrodeposited metal transported to the second area and the second electrodeposited metal falling onto the first electrodeposited metal; The position and attitude of the nozzle for the second injection process are set so that gas can be injected toward the surface of the second electrodeposited metal that has fallen onto the first electrodeposited metal. A transport system for electrodeposited metals.

5. 5. The electrodeposited metal transport system according to claim 4, the nozzle of the first jetting process is disposed at a position diagonally above a first corner of the second area with an opening facing a center of the second area; The nozzle for the second jetting process is disposed at a position diagonally above a second corner of the second area with its opening facing the center of the second area. A transport system for electrodeposited metals.

6. 3. The electrodeposited metal transport system according to claim 2, The nozzle opening for the first jetting process and the nozzle opening for the second jetting process are set to have a flat shape so that gas can be sprayed onto the entire surface of the first electrodeposited metal or the second electrodeposited metal arranged in the second area. A transport system for electrodeposited metals.

7. 3. The electrodeposited metal transport system according to claim 2, The pressure of the gas blown onto the surface of the first electrodeposited metal and the pressure of the gas blown onto the surface of the second electrodeposited metal are set to a pressure that can blow off foreign matter outside the conveying path. A transport system for electrodeposited metals.

8. The electrodeposited metal transport system according to claim 2 is configured to continuously transport a plurality of the cathode plates, The injection device executing the first ejection process using a cut detection signal indicating that the first electrodeposited metal and the second electrodeposited metal have been separated as a trigger; The second ejection process is performed using a forward rotation signal as a trigger for transporting the first electrodeposited metal from the first area to the second area. A transport system for electrodeposited metals.

9. conveying the electrodeposited metal peeled from the cathode plate; a step of spraying gas onto the surface of the transported electrodeposited metal to remove foreign matter; A method for transporting electrodeposited metal, comprising:

Images