Substrate processing method, substrate processing apparatus, and program

Abstract

To provide a method and an apparatus for easily filling a chemical solution into a gap between substrates.SOLUTION: A substrate processing method includes supplying a first chemical liquid to a gap G between a first substrate W1 and a second substrate W2 at a peripheral portion W3a of a laminated substrate W3 in which the first substrate W1 and the second substrate W2 are bonded together, supplying a second chemical liquid to the gap G at the peripheral portion W3a so as to replace the first chemical liquid in the gap G with a second chemical liquid different from the first chemical liquid, and hardening the second chemical liquid in the gap G.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present disclosure relates to a substrate processing method, a substrate processing apparatus, and a program. [Background technology]

[0002] Patent Document 1 discloses a substrate processing method that includes holding bonded substrates, preheating the bonded substrates, and filling a protective material into the gap between the bonded substrates along the edges of the substrates. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] U.S. Patent No. 9,508,659 Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a method, an apparatus, and a program that make it easy to fill a chemical solution into gaps between substrates at the periphery of a laminated substrate. [Means for solving the problem]

[0005] In one exemplary embodiment, a substrate processing method includes supplying a first chemical liquid to a gap between a first substrate and a second substrate at a peripheral portion of a laminated substrate in which the first substrate and the second substrate are bonded together; supplying a second chemical liquid to the gap at the peripheral portion so as to replace the first chemical liquid in the gap with a second chemical liquid different from the first chemical liquid; and hardening the second chemical liquid in the gap. [Effects of the Invention]

[0006] According to the present disclosure, a method and apparatus are provided that facilitate filling a chemical solution into a gap between substrates. [Brief explanation of the drawings]

[0007] [Figure 1] FIG. 1 is a plan view illustrating a schematic configuration of a substrate processing apparatus. [Figure 2] FIG. 2 is a side view showing an example of a liquid processing module. [Figure 3] FIG. 3 is a plan view showing a simplified view of the liquid treatment module. [Figure 4] Fig. 4(a) is a diagram illustrating an operation in which the control device controls the liquid treatment module to supply a first chemical liquid, and Fig. 4(b) is a diagram illustrating an operation in which the control device controls the liquid treatment module to supply a second chemical liquid. [Figure 5] Fig. 5(a) is a diagram for explaining an example in which the second chemical liquid is filled into the gap using the first chemical liquid as a priming liquid, and Fig. 5(b) is a diagram for explaining an example in which the second chemical liquid is filled deep into the gap. [Figure 6] FIG. 6 is a diagram showing an example of a second nozzle including a guide member. [Figure 7] FIG. 7 is a diagram showing another example of a second nozzle including a guide member. [Figure 8] FIG. 8 is a diagram showing an example of chemical liquid supply by a guide member. [Figure 9] FIG. 9 is a diagram showing an example of chemical supply using an inert gas. [Figure 10] FIG. 10 is a diagram showing another example of chemical solution supply by a nozzle. [Figure 11] FIG. 11 is a diagram showing an example of hydrophilic treatment for a laminated substrate. [Figure 12] FIG. 12 is a diagram showing an example of a cleaning process for a multilayer substrate. [Figure 13] FIG. 13 is a side view showing an example of a liquid processing module according to a modified example. [Figure 14] FIG. 14 is a side view showing another example of a liquid processing module according to a modified example. [Figure 15] FIG. 15 is a diagram showing an example of impregnation of a laminated substrate by a liquid pool. [Figure 16]FIG. 16 is a diagram showing an example in which the second chemical liquid is supplied by a plurality of jet dispensers. [Figure 17] Fig. 17(a) is a side view showing an example of a guide member covering the peripheral edge of a laminated substrate, Fig. 17(b) is a plan view showing an example of a guide member covering the peripheral edge of a laminated substrate, and Fig. 17(c) is a plan view showing another example of a guide member covering the peripheral edge of a laminated substrate. [Figure 18] Fig. 18(a) is a diagram showing that the second chemical solution is directly applied to the gap by the supply brush, and Fig. 18(b) is a diagram showing that the second chemical solution is directly applied to the gap by the supply yarn. [Figure 19] Fig. 19(a) is a diagram showing an example of a side view of a spin holder according to a modified example, and Fig. 19(b) is a diagram showing an example of a side view of the spin holder after vacuum suction. [Figure 20] Figure 20(a) is a plan view showing the state of the gap, Figure 20(b) is a diagram showing the extent to which the second chemical liquid has filled the gap after the second chemical liquid has been supplied to the gap, and Figure 20(c) is a diagram showing the extent to which the second chemical liquid has filled the gap after one cycle has been repeated. [Figure 21] Fig. 21(a) is a plan view showing the state of the gap. Fig. 21(b) is a diagram showing the extent to which the second chemical liquid has filled the gap after the second chemical liquid has been supplied to the gap. Fig. 21(c) is a diagram showing the extent to which the second chemical liquid has filled the gap after the laminated substrate has been rotated at a second rotation speed. Fig. 21(d) is a diagram showing the extent to which the second chemical liquid has filled the gap after one cycle has been repeated. [Figure 22] Fig. 22(a) is a diagram showing an example of measurement of the peripheral portion by the detection unit, and Fig. 22(b) is a diagram showing an example of a projected image. [Figure 23] FIG. 23 is a diagram illustrating an example of a hardware configuration of the control device. [Figure 24] FIG. 24 is a flowchart showing an example of a substrate processing method executed by the control device for the liquid processing module according to the embodiment. [Figure 25]FIG. 25 is a flowchart showing an example of a substrate processing method executed by a control device on a liquid processing module according to a modified example. DETAILED DESCRIPTION OF THE INVENTION

[0008] Hereinafter, a substrate processing apparatus according to this embodiment will be described with reference to the drawings. In this specification, elements having substantially the same functional configurations are designated by the same reference numerals, and redundant description will be omitted.

[0009] [Substrate processing equipment] First, the configuration of a substrate processing apparatus according to this embodiment will be described. Fig. 1 is a plan view schematically showing the configuration of the substrate processing apparatus. The substrate processing apparatus 1 is an apparatus for filling a chemical solution into the gap between a first substrate and a second substrate of a laminated substrate W3, which is formed by bonding a first substrate and a second substrate together.

[0010] 1, the substrate processing apparatus 1 has a cassette station 2 into which a cassette C containing a plurality of laminated substrates W3 is loaded and unloaded, and a processing station 3 equipped with a plurality of various processing devices that perform predetermined processing on the laminated substrates W3. The substrate processing apparatus 1 has a configuration in which the cassette station 2 and the processing station 3 are integrally connected.

[0011] The cassette station 2 is provided with a plurality of cassette mounting tables 21 and substrate transport devices 22 and 23. The cassette station 2 transports the laminated substrate W3 between the cassette C mounted on the cassette mounting table 21 and the processing station 3 using the substrate transport device 22 or 23. To this end, the substrate transport devices 22 and 23 are each provided with drive mechanisms in directions such as the longitudinal direction, width direction, up / down direction, and around the vertical axis (θ direction) as needed, and may also be provided with drive mechanisms in all directions.

[0012] At least one of the substrate transfer devices 22 and 23 is capable of transferring the laminated substrate W3 between the cassette C and the processing station 3, and is also capable of transferring the laminated substrate W3 to and from the processing station 3. Note that the transfer operation of the laminated substrate W3 to and from the processing station 3 means, for example, transferring the laminated substrate W3 to and from a third block G3 that includes a transfer device accessible by a substrate transfer device 33 in the processing station 3, which will be described later. The third block G3 may be equipped with a plurality of transfer devices (not shown) lined up in the vertical direction.

[0013] The processing station 3 is provided with a plurality of blocks, for example, a first block G1 and a second block G2. For example, a plurality of layers each including the first block G1 and the second block G2 are stacked vertically. For example, the first block G1 is provided on the front side of the processing station 3 (the negative X-direction side in FIG. 1), and the second block G2 is provided on the back side of the processing station 3 (the positive X-direction side in FIG. 1). The aforementioned third block G3 may also be provided within the processing station 3.

[0014] The first block G1 is provided with a plurality of liquid treatment modules 4. The liquid treatment modules 4 supply chemical liquids to the gap between the first and second substrates of the laminated substrate W3. The second block G2 is provided with a plurality of hardening treatment modules 31 (hardening units). The hardening treatment modules 31 harden the chemical liquids supplied to the gap between the first and second substrates by the liquid treatment modules 4. For example, if the chemical liquid is a heat-curing type, the hardening treatment module 31 may be a heat treatment module that heats the laminated substrate W3. The heat treatment module may have, for example, a heating plate that supports the laminated substrate W3 and hardens the laminated substrate W3 using a heater built into the heating plate. If the chemical liquid is a light-curing type, the hardening treatment module 31 may be a light irradiation module that irradiates the gap between the first and second substrates with energy rays such as UV light. If the chemical liquid is a gas-curing type, the hardening treatment module 31 may be a gas supply module that supplies an inert gas to the gap between the first and second substrates.

[0015] 1, a substrate transfer region 32 is formed in the region sandwiched between the first block G1 and the second block G2 in a plan view. In the substrate transfer region 32, for example, a substrate transfer device 33 is disposed. The substrate transfer device 33 has a transfer arm that is movable in, for example, the X direction, the Y direction, the θ direction, and the up and down direction. The substrate transfer device 33 moves within the substrate transfer region 32 and can transfer the laminated substrate W3 to predetermined devices in the surrounding first block G1, second block G2, and third block G3.

[0016] The substrate processing apparatus 1 may further include a polishing apparatus, a trimming apparatus, a patterning film forming apparatus, a developing treatment apparatus, and an interface block. The polishing apparatus, for example, polishes the surfaces of the first and second substrates after the chemical solution in the gaps between the laminated substrate W3 has hardened. The polishing apparatus may thereby adjust the thickness of the laminated substrate W3. The trimming apparatus, for example, trims the outer edge of the laminated substrate W3 by polishing or the like after polishing by the polishing apparatus. The patterning film forming apparatus, for example, forms a patterning film such as a resist film on the laminated substrate W3. The developing treatment apparatus, for example, removes a portion of the patterning film exposed by the exposure apparatus to form a concave-convex pattern as a mask. The polishing apparatus, trimming apparatus, patterning film forming apparatus, developing treatment apparatus, etc. may be provided in any of the first block G1, the second block G2, or the third block G3. When the substrate processing apparatus 1 includes the patterning film forming apparatus and the developing treatment apparatus, the substrate processing apparatus 1 may further include an interface station for transferring the laminated substrate W3 to and from the exposure apparatus.

[0017] The substrate processing apparatus 1 is provided with a control device 100. The control device 100 is, for example, a computer, and has a program storage unit (not shown). The program storage unit stores a program for controlling the processing of the laminated substrate W3 in the substrate processing apparatus 1. The program storage unit also stores a program for controlling the operation of the drive systems of the various processing devices and transport devices described above to realize the chemical liquid filling process in the substrate processing apparatus 1. The program may be recorded on a computer-readable storage medium H and installed into the control device 100 from the storage medium H.

[0018] The control device 100 controls the substrate transfer devices 22, 23, and 33 to remove the laminated substrate W3 from the cassette C placed on the cassette mounting table 21 and carry it into the liquid treatment module 4. Next, the control device 100 controls the liquid treatment module 4 to fill the gap between the first and second substrates with a chemical solution, and controls the substrate transfer device 33 to remove the laminated substrate W3 from the liquid treatment module 4 and carry it into the hardening treatment module 31. Next, the control device 100 controls the hardening treatment module to harden the chemical solution filled in the gap between the first and second substrates. Next, the control device 100 controls the substrate transfer devices 33, 22, and 23 to remove the laminated substrate W3 from the hardening treatment module 31 and return it to the cassette C.

[0019] The following describes an example of the configuration of the liquid processing module 4 that makes it easier to fill the gap between the first and second substrates with a chemical liquid.

[0020] [Liquid treatment module] FIG. 2 is a side view showing an example of a liquid treatment module. The liquid treatment module 4 includes a chemical liquid supply unit. The chemical liquid supply unit horizontally holds a laminated substrate W3, which is formed by bonding a first substrate W1 and a second substrate W2, so that the first substrate W1 is positioned above the second substrate W2. The chemical liquid supply unit supplies a chemical liquid to the peripheral edge W1a of the first substrate W1 and moves the chemical liquid from the peripheral edge W1a of the first substrate W1 to the gap G between the first substrate W1 and the second substrate W2. The chemical liquid supply unit includes a first chemical liquid supply unit 91 and a second chemical liquid supply unit 92. The liquid treatment module 4 does not require the chemical liquid to reach the gap with high precision, so that the chemical liquid can be easily filled into the gap G while suppressing the effects of warping of the laminated substrate W3. The first substrate W1 and the second substrate W2 may be bonded together by fusion bonding, anodic bonding, or the like, without using an adhesive, or may be bonded together using an adhesive (see adhesive AD in FIGS. 4 and 5).

[0021] First chemical liquid supply unit 91 supplies a first chemical liquid to gap G between first substrate W1 and second substrate W2 at peripheral edge W3a of laminated substrate W3, in which first substrate W1 and second substrate W2 are bonded together. Second chemical liquid supply unit 92 supplies a second chemical liquid to gap G at peripheral edge W3a so as to replace the first chemical liquid in gap G with a second chemical liquid different from the first chemical liquid. In this way, by supplying the first chemical liquid to the gap prior to the second chemical liquid to be cured, the first chemical liquid in gap G acts as a priming liquid, making it possible to easily fill gap G with the second chemical liquid.

[0022] For example, liquid processing module 4 includes spin holder 5, first nozzle 6, second nozzle 7, nozzle moving mechanism 8, first chemical liquid supply unit 91, and second chemical liquid supply unit 92.

[0023] The rotational holder 5 holds and rotates the laminated substrate W3. The rotational holder 5 has, for example, a holder 51 and a rotational driver 52. The holder 51 supports the center of the laminated substrate W3, which is arranged horizontally with the first substrate W1 facing up, and holds the laminated substrate W3 by, for example, vacuum suction. The rotational driver 52 is, for example, an actuator powered by an electric motor or the like. FIG. 3 is a simplified plan view showing the liquid processing module. The rotational driver 52 rotates the holder 51 around a vertical center of rotation RC in response to instructions from the control device 100. This causes the laminated substrate W3 to rotate around the center of rotation RC.

[0024] The first nozzle 6 ejects a first chemical liquid. The first chemical liquid supply unit 91 supplies the first chemical liquid to the first nozzle 6. The second nozzle 7 ejects a second chemical liquid. The second chemical liquid supply unit 92 supplies the second chemical liquid to the second nozzle 7. The first chemical liquid supply unit 91 and the second chemical liquid supply unit 92 each include a supply path for supplying the chemical liquid, a chemical liquid supply source, a pump for transporting the chemical liquid, and the like. For example, the first chemical liquid supply unit 91 drives a pump in response to an instruction from the control device 100 to supply the first chemical liquid to the first nozzle 6. Similarly, the second chemical liquid supply unit 92 drives a pump in response to an instruction from the control device 100 to supply the second chemical liquid to the second nozzle 7.

[0025] The nozzle movement mechanism 8 moves the first nozzle 6 and the second nozzle 7 to desired positions, for example, in response to an instruction from the control device 100. For example, the nozzle movement mechanism 8 positions the first nozzle 6 at a position where the first chemical liquid can be supplied to the gap G. For example, the nozzle movement mechanism 8 positions the first nozzle 6 so that it faces the upper surface of the peripheral portion W1a of the first substrate W1 from diagonally above, facing away from the rotation center RC of the laminated substrate W3. As a result, the first chemical liquid ejected from the first nozzle 6 is supplied to the upper surface of the peripheral portion W1a of the first substrate W1 from diagonally above, facing away from the rotation center RC of the laminated substrate W3. The first chemical liquid supplied to the upper surface of the peripheral portion W1a moves to the gap G via the outer peripheral surface of the first substrate W1.

[0026] For example, the nozzle movement mechanism 8 positions the second nozzle 7 at a position where the second chemical liquid can be supplied to the gap G. For example, the nozzle movement mechanism 8 positions the second nozzle 7 so that it faces the upper surface of the peripheral edge portion W1a of the first substrate W1 from diagonally above, facing away from the rotation center RC of the laminated substrate W3. As a result, the second chemical liquid ejected from the second nozzle 7 is supplied to the upper surface of the peripheral edge portion W1a of the first substrate W1 from diagonally above, facing away from the rotation center RC of the laminated substrate W3. The second chemical liquid supplied to the upper surface of the peripheral edge portion W1a moves to the gap G via the outer peripheral surface of the first substrate W1.

[0027] As shown in FIG. 3 , the nozzle movement mechanism 8 may, for example, arrange the first nozzle 6 and the second nozzle 7 at an angle relative to the radial direction of the laminated substrate W3. In this case, the first nozzle 6 and the second nozzle 7 may be inclined relative to the radial direction of the laminated substrate W3 toward the rotation direction of the peripheral edge portion W1a. The nozzle movement mechanism 8 may move the first nozzle 6 and the second nozzle 7 separately or simultaneously. For example, the nozzle movement mechanism 8 may use an electric motor or the like as a power source to move the first nozzle 6 and the second nozzle 7 along a horizontal straight line. In this case, the nozzle movement mechanism 8 may move the first nozzle 6 and the second nozzle 7 while fixing the orientation of the first nozzle 6 and the second nozzle 7.

[0028] Controller 100 may cause liquid treatment module 4 to supply a chemical liquid to peripheral edge portion W1a of first substrate W1 and move the chemical liquid from peripheral edge portion W1a of first substrate W1 to gap G between first substrate W1 and second substrate W2, while holding laminated substrate W3 formed by bonding first substrate W1 and second substrate W2 horizontally so that the first substrate W1 is positioned above the second substrate W2. Controller 100 may cause liquid treatment module 4 to supply a first chemical liquid to gap G between first substrate W1 and second substrate W2, at peripheral edge portion W3a of laminated substrate W3 formed by bonding first substrate W1 and second substrate W2, and to supply a second chemical liquid to gap G so as to replace the first chemical liquid in gap G with a second chemical liquid different from the first chemical liquid.

[0029] For example, the control device 100 controls the rotation holder 5 to horizontally hold and rotate the laminated substrate W3 so that the first substrate W1 is positioned above the second substrate W2. The control device 100 may control the nozzle movement mechanism 8 and the first chemical liquid supply unit 91 to supply the first chemical liquid from the first nozzle 6 to the gap G in one region through which the peripheral edge W3a of the laminated substrate W3 passes as the laminated substrate W3 rotates. The one region includes the position through which the peripheral edge W3a of the laminated substrate W3 passes and its surroundings. Similarly, the control device 100 may control the nozzle movement mechanism 8 and the second chemical liquid supply unit 92 to supply the second chemical liquid from the second nozzle 7 to the gap G in the one region through which the laminated substrate W3 passes as the peripheral edge W3a passes. This eliminates the need to displace the first nozzle 6, which supplies the first chemical liquid, and the second nozzle 7, which supplies the second chemical liquid, along the circumferential direction of the laminated substrate W3, and allows the second chemical liquid to be easily filled.

[0030] During the supply of the first and second chemical liquids, the control device 100 may control the rotation holder 5 to rotate the laminated substrate W3 at a rotation speed at which centrifugal force due to the rotation does not hinder the movement of the second chemical liquid into the gap G. This makes it possible to achieve both ease of supplying the first and second chemical liquids by rotating the laminated substrate W3 and ease of movement of the first and second chemical liquids into the gap G. For example, the control device 100 may set the rotation speed during the supply of the first and second chemical liquids to 60 rpm or less, or to a range of 10 rpm to 60 rpm. The control device 100 may set the rotation speed during the supply of the first chemical liquid to be different from the rotation speed during the supply of the second chemical liquid.

[0031] 4 and 5, the operation of the control device 100 to control the liquid treatment module 4 to supply the chemical liquid will be described in more detail. The control device 100 controls the liquid treatment module 4 to supply the first chemical liquid F1 from the first nozzle 6 to the gap G. As shown in FIG. 4(a), the control device 100 causes the nozzle movement mechanism 8 to position the first nozzle 6 so that the first nozzle 6 faces the upper surface of the peripheral edge portion W1a of the first substrate W1 from diagonally above, in a direction away from the rotation center RC of the laminated substrate W3. The control device 100 then causes the first chemical liquid supply unit 91 to supply the first nozzle 6 with the first chemical liquid. This causes the first chemical liquid to be supplied to the upper surface of the peripheral edge portion W1a of the first substrate. The first chemical liquid F1 supplied to the upper surface W1b passes through the outer peripheral surface W1c of the first substrate W1 and moves from the upper surface W1b to the gap G. In this way, the first chemical liquid F1 can be supplied from the outer peripheral surface W1c without being affected by warping or the like of the laminated substrate W3.

[0032] Next, the control device 100 controls the liquid processing module 4 to supply the second chemical liquid F2 from the second nozzle 7 to the gap G. As shown in FIG. 4(b), the control device 100 causes the nozzle movement mechanism 8 to position the second nozzle 7 so that the second nozzle 7 is directed obliquely upward toward the upper surface of the peripheral edge portion W1a of the first substrate W1, facing away from the rotation center RC of the laminated substrate W3. The control device 100 then causes the second chemical liquid supply unit 92 to supply the second chemical liquid to the second nozzle 7. As a result, the second chemical liquid is supplied to the upper surface of the peripheral edge portion W1a of the first substrate W1. The second chemical liquid F2 supplied to the upper surface W1b moves from the upper surface W1b to the gap G via the outer peripheral surface W1c of the first substrate W1, as shown in FIG. 5(a).

[0033] 5(b), the first chemical liquid F1 that had filled the gap G is replaced by the second chemical liquid F2. By supplying the first chemical liquid F1 to the gap G prior to the second chemical liquid F2 in this manner, the first chemical liquid F1 in the gap G serves as a priming agent, allowing the second chemical liquid F2 to be easily filled into the gap G. The second chemical liquid F2 filled into the gap G is hardened by the hardening treatment module 31, as described above.

[0034] The surface tension of the first chemical liquid F1 may be equal to or less than the surface tension of the second chemical liquid F2. In this case, the first chemical liquid F1 serving as a priming liquid can be easily penetrated to the depths of the gap G. This makes it easy to fill the second chemical liquid F2. The surface tension of the first chemical liquid F1 may be equal to or less than 30 mN / m. Here, the surface tension refers to, for example, the surface tension of a 0.1% solution, i.e., when the solute is 0.1 grams and the solvent is 99.9 grams. The surface tension of the first chemical liquid F1 may be equal to or greater than 10 mN / m and equal to or less than 50 mN / m. In this case, the first chemical liquid F1 can be more easily penetrated to the depths of the gap G.

[0035] The first chemical liquid F1 may contain, for example, thinner. The first chemical liquid F1 may contain at least one of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether. The first chemical liquid F1 may contain only polyethylene glycol monomethyl ether acetate, only polyethylene glycol monomethyl ether, or both. The above-mentioned liquids have low surface tension, so the first chemical liquid F1 can penetrate deeper into the gap G more easily.

[0036] The viscosity of the second chemical liquid F2 may be higher than the viscosity of the first chemical liquid F1. Viscosity indicates the ease with which an object flows, and therefore the second chemical liquid F2 is less likely to flow than the first chemical liquid F1. In this case, by utilizing the priming effect of the first chemical liquid F1 to fill the gap G with the second chemical liquid F2, which has a higher viscosity than the first chemical liquid F1, the strength of the peripheral edge portion W3a of the laminated substrate W3 can be improved. The viscosity of the second chemical liquid F2 may be 5 cP (centipoise) or more and 40 cP or less. In contrast, the viscosity of the first chemical liquid F1 may be 1 cP or more and 5 cP or less.

[0037] The second chemical liquid F2 may be a liquid material that hardens when heated. By hardening the second chemical liquid F2 by heat treatment, the second chemical liquid F2 filled in the gap G can be easily hardened to the depth of the gap G. The second chemical liquid F2 may be, for example, SOG (Spin-On Glass). The second chemical liquid F2 may be an organic polymer solution containing a glass component such as silica (SiO2). The second chemical liquid F2 may be a resist.

[0038] The liquid processing module 4 may be configured to use a guide member to promote the movement of the second chemical liquid F2 from the peripheral edge W1a of the first substrate W1 to the gap G. An example of chemical liquid supply using a guide will be described with reference to FIGS.

[0039] As shown in FIG. 6, the liquid treatment module 4 may further include a guide member 72. The guide member 72 faces the upper surface W1b when the second nozzle 7 supplies the second chemical liquid F2 to the peripheral edge W1a. This allows the second chemical liquid F2 ejected by the second nozzle 7 to be supplied between the upper surface W1b and the guide member 72. The guide member 72 may be formed integrally with the second nozzle 7. For example, the guide member 72 is provided to surround the chemical liquid flow path 71 of the second nozzle 7 and has a flat guide surface 72a that surrounds the opening of the chemical liquid flow path 71. The control device 100 may supply the second chemical liquid F2 from the second nozzle 7 between the upper surface W1b and the guide member 72 with the guide member 72 facing the upper surface W1b. For example, the control device 100 moves the second nozzle 7 to a position where the guide surface 72a of the guide member 72 faces the upper surface W1b, and starts discharging the chemical liquid from the chemical liquid flow path 71. In this case, the guide member 72 suppresses the second chemical liquid F2 from swelling upward, thereby promoting the movement of the second chemical liquid F2 toward the outer peripheral surface W1c.

[0040] As shown in FIG. 7 , the liquid processing module 4 may further include a guide member 74. The guide member 74 faces the outer peripheral surface W1c of the first substrate W1 when the second nozzle 7 supplies the second chemical liquid F2 to the peripheral edge W1a. This allows the second chemical liquid F2 discharged by the second nozzle 7 to be supplied between the outer peripheral surface W1c and the guide member 74. The guide member 74 may be integrally formed with the second nozzle 7. The guide member 74 may be provided adjacent to the chemical liquid outlet path 73 in a direction farther from the rotation center RC than the chemical liquid flow path 71. The tip of the guide member 74 may be discharged, for example, vertically below the end face of the second nozzle 7 and may be located between the outer peripheral surface W1c and the gap G. The control device 100 may supply the second chemical liquid F2 from the second nozzle 7 between the outer peripheral surface W1c and the guide member 74 with the guide member 74 facing the outer peripheral surface W1c. For example, the control device 100 moves the second nozzle 7 to a position where the guide member 74 faces the outer peripheral surface W1c, and starts discharging the chemical solution from the chemical solution flow path 71. In this case, by suppressing the movement of the second chemical solution F2 away from the rotation center RC of the laminated substrate W3, the movement of the second chemical solution F2 into the gap G can be promoted.

[0041] As shown in FIG. 8, the liquid treatment module 4 may further include a guide member 75. The guide member 75 is provided around the laminated substrate W3 and has a guide surface 75a that supports the first chemical liquid F1 from below. The guide surface 75a is inclined so that it becomes higher as it moves away from the laminated substrate W3. The tip of the guide surface 75a is located between the first substrate W1 and the second substrate W2 at a position closest to the laminated substrate W3. The space between the first substrate W1 and the second substrate W2 is, for example, between the center of the thickness of the first substrate W1 and the center of the thickness of the second substrate W2. The guide member 75 promotes the movement of the first chemical liquid F1 and the second chemical liquid F2 into the gap G via the inclined guide surface 75a. The control device 100 may control the nozzle movement mechanism 8 and the first chemical liquid supply unit 91 to supply the first chemical liquid F1 from the first nozzle 6 toward the guide surface 75a. Similarly, the control device 100 may control the nozzle movement mechanism 8 and the second chemical liquid supply unit 92 so as to supply the second chemical liquid F2 from the second nozzle 7 toward the guide surface 75a.

[0042] The liquid processing module 4 may further include a gas supply unit 93. As shown in FIG. 9 , the gas supply unit 93 includes, for example, a gas nozzle 931 that discharges an inert gas toward the gap G from the outside around the laminated substrate W3, and a gas supply source 932 that supplies the inert gas GS to the gas nozzle 931. After supplying the second chemical liquid F2 to the gap G, the control device 100 controls the gas supply unit 93 to further push the second chemical liquid F2 into the gap G. The inert gas GS is, for example, a nitrogen-containing gas. The inert gas can push the second chemical liquid F2 deeper into the gap G. The control device 100 may also control the gas supply unit 93 to further push the second chemical liquid F2 into the gap G using the guide member 75. In this case, the control device 100 discharges the inert gas GS from the gas nozzle 931 onto the guide surface 75a. This allows the inert gas GS to flow along the guide surface 75a into the gap G, thereby pushing the second chemical liquid F2.

[0043] Although the above describes an example in which the second nozzle 7 supplies the second chemical liquid F2 to the upper surface W1b of the first substrate W1, the liquid processing module 4 may be configured to supply the second chemical liquid F2 toward the outer peripheral surface W1c of the first substrate W1. For example, as shown in FIG. 10 , the nozzle movement mechanism 8 positions the second nozzle 7 outward from the peripheral edge W1a of the first substrate W1 so as to face the outer peripheral surface W1c from an obliquely upward direction. This allows the second chemical liquid F2 ejected from the second nozzle 7 to be supplied to the outer peripheral surface W1c from an obliquely upward direction. The second chemical liquid F2 supplied to the outer peripheral surface W1c moves into the gap G. By supplying the second chemical liquid F2 from an obliquely upward direction, it is possible to prevent the second chemical liquid F2 from bouncing back toward the second nozzle 7, which is the supply source.

[0044] The liquid treatment module 4 may be configured to perform a hydrophilic treatment on the peripheral edge portion W3a of the laminated substrate W3 before supplying the first chemical liquid F1. For example, as shown in FIG. 11 , the liquid treatment module 4 may further include a hydrophilic treatment unit 94. The hydrophilic treatment unit 94 may perform the hydrophilic treatment by irradiating the peripheral edge portion W3a with energy rays E1. The hydrophilic treatment unit 94 may be a UV irradiation device that performs the hydrophilic treatment by irradiating the peripheral edge portion W3a with ultraviolet rays. The hydrophilic treatment unit 94 may be a plasma irradiation device that performs the hydrophilic treatment by irradiating the peripheral edge portion W3a with plasma rays. The control device 100 performs the hydrophilic treatment before supplying the first chemical liquid F1 to the gap G. By improving the hydrophilicity of the peripheral edge portion W3a of the laminated substrate W3, it becomes easier to fill the gap G with the first chemical liquid F1 and the second chemical liquid F2.

[0045] A portion of the second chemical liquid F2 supplied to the peripheral edge portion W1a of the first substrate W1 may remain on the peripheral edge portion W1a without moving to the gap G. The liquid treatment module 4 may be configured to supply a cleaning liquid that cleans away the second chemical liquid F2 remaining on the peripheral edge portion W1a of the first substrate W1. For example, as shown in FIG. 12, the liquid treatment module 4 may further include a cleaning liquid supply unit 95. The cleaning liquid supply unit 95 includes, for example, a cleaning liquid nozzle 951 that discharges the cleaning liquid around the periphery of the laminated substrate and a cleaning liquid supply source 952 that supplies the cleaning liquid to the cleaning liquid nozzle 951. The control device 100 adjusts the angle of the cleaning liquid nozzle 951 so that the cleaning liquid nozzle 951 supplies the cleaning liquid from obliquely above onto the upper surface W1b of the laminated substrate W3, moving away from the rotation center RC. The control device 100 controls the cleaning liquid supply unit 95 to start supplying the cleaning liquid at least after supplying the second chemical liquid F2 to the gap G. The control device 100 may start supplying the cleaning liquid while the second chemical liquid F2 is being supplied to the gap G or after the second chemical liquid F2 has been supplied to the gap G. The cleaning liquid may be, for example, the same chemical liquid as the first chemical liquid F1. That is, the cleaning liquid may contain at least one of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether. Because the cleaning process eliminates the need to worry about the second chemical liquid F2 remaining on the peripheral edge portion W1a of the first substrate W1, the second chemical liquid F2 can be supplied in sufficient quantity to easily fill the gap G.

[0046] When supplying the cleaning liquid, the control device 100 causes the rotational holding unit 5 to horizontally hold and rotate the laminated substrate W3 so that the first substrate W1 is positioned above the second substrate W2. The control device 100 may rotate the laminated substrate W3 at a rotational speed of 60 rpm or more when supplying the cleaning liquid to the peripheral edge W1a of the first substrate W1 than when supplying the second chemical liquid F2 to the peripheral edge W1a and moving the second chemical liquid F2 into the gap G. The rotational holding unit 5 may rotate the laminated substrate W3 at a rotational speed of 60 rpm or more. The rotational holding unit 5 may rotate the laminated substrate W3 at a rotational speed of 500 rpm to 2000 rpm, for example. In this case, the peripheral edge W1a of the first substrate W1 can be cleaned while preventing the cleaning liquid from entering the gap G.

[0047] A portion of the second chemical liquid F2 supplied to the peripheral edge W1a of the first substrate W1 may pass through the gap G and move to the peripheral edge W2a of the second substrate W2. The liquid processing module 4 may be configured to supply a cleaning liquid that cleans away the second chemical liquid F2 remaining on the peripheral edge W2a of the second substrate W2. The control device 100, for example, adjusts the angle of the cleaning liquid nozzle 951 so that the cleaning liquid is supplied to the upper surface of the second substrate W2 from diagonally below in a direction away from the rotation center RC of the laminated substrate W3. The control device 100, for example, starts supplying the cleaning liquid after supplying the second chemical liquid F2 to the gap G. Even in this case, there is no need to worry about the second chemical liquid F2 remaining on the peripheral edge W2a of the second substrate W2, so that a sufficient amount of the second chemical liquid F2 can be supplied to easily fill the gap G.

[0048] As described above, the control device 100 controls the liquid treatment module 4 to supply the first chemical liquid F1 to the gap G prior to the second chemical liquid F2 to be cured. This allows the first chemical liquid F1 in the gap G to act as a priming agent, making it possible to easily fill the gap G with the second chemical liquid F2. This effect is not necessarily limited to the case where the second chemical liquid F2 is supplied to the gap G by moving the second chemical liquid F2 from the peripheral edge W1a of the first substrate W1 to the gap G between the first substrate W1 and the second substrate W2. The liquid treatment module 4 may be configured to directly supply the second chemical liquid F2 to the gap G. For example, the liquid treatment module may supply the second chemical liquid F2 from a nozzle (e.g., a head of a jet dispenser, which will be described later) so that the second chemical liquid F2 ejected from the nozzle reaches the gap G directly. In this case, the second chemical liquid F2 can be more reliably filled into the gap G. The following description will be given of a liquid treatment module that directly supplies the second chemical liquid F2 to the gap G. Although the supply of the second chemical liquid F2 will be described as an example, it may also be applied to the supply of the first chemical liquid F1.

[0049] For example, liquid processing module 4A shown in FIG. 13 includes a jet dispenser 96 instead of second nozzle 7. Jet dispenser 96 includes a cylinder 961, a head 962, a reservoir tank 963, a plunger 964, and a plunger driver 965. Cylinder 961 extends around the periphery of laminated substrate W3 along a line toward gap G. Cylinder 961 is, for example, a cylindrical container and contains second chemical liquid F2. Head 962 is provided at an end of cylinder 961 facing laminated substrate W3. Head 962 ejects second chemical liquid F2 toward gap G. Reservoir tank 963 contains second chemical liquid F2 and supplies it to cylinder 961. Reservoir tank 963 supplies second chemical liquid F2 from a liquid supply port provided in cylinder 961 via, for example, a liquid supply tube. The plunger 964 reciprocates within the cylinder 961. When the plunger 964 moves in a direction away from the head 962, the pressure within the cylinder 961 decreases, and the chemical liquid is supplied from the reservoir tank 963 into the cylinder 961. When the plunger 964 moves toward the head 962, the pressure within the cylinder 961 increases, and the second chemical liquid F2 is discharged from the head 962.

[0050] The control device 100 may alternate between supplying the second chemical liquid F2 to the gap G and replenishing the second chemical liquid F2 from the reservoir tank 963 by causing the plunger drive unit 965 to reciprocate the plunger 964. In this case, by intermittently supplying the second chemical liquid F2 while pumping the second chemical liquid F2 at high speed, the second chemical liquid F2 can be more reliably filled into the gap G. For example, the control device 100 may output a drive signal of a predetermined frequency to the plunger drive unit 965, and the plunger drive unit 965 may reciprocate the plunger 964 in response to the drive signal.

[0051] Fig. 14 is a side view showing another example of a liquid processing module according to a modified example. In the example of Fig. 14, the rotary holder 5 holds the laminated substrate W3 by the holder 51 vertically and rotates the laminated substrate W3 around a horizontal rotation axis. Correspondingly, the jet dispenser 96 is disposed vertically above the laminated substrate W3 and dispenses the second chemical liquid F2 toward the gap G vertically below.

[0052] As shown in FIG. 15, the liquid treatment module 4A may be configured to supply the second chemical liquid F2 to the gap G by immersing a portion of the laminated substrate W3 in a liquid pool. For example, the liquid treatment module 4A may further include a reservoir 63 that forms the liquid pool, instead of the second nozzle 7. The reservoir 63 opens upward and stores the second chemical liquid F2 supplied from a second chemical liquid supply unit 92. The laminated substrate W3 is positioned so that a lower portion of the peripheral edge W3a is immersed in the liquid pool of the second chemical liquid F2 in the reservoir 63, and is rotated around a horizontal rotation axis. This causes the entire periphery of the peripheral edge W3a to be immersed in the liquid pool. The second chemical liquid F2 in the liquid pool permeates into the gap G by capillary action. Since a larger amount of the second chemical liquid F2 is supplied to the peripheral edge W3a while the peripheral edge W3a is immersed in the liquid pool, the second chemical liquid F2 can be more sufficiently filled in the gap G.

[0053] The liquid treatment module 4A may be configured to perform a first set of supplying the second chemical liquid F2 over the entire circumference at a predetermined cycle, and a second set of supplying the second chemical liquid F2 over the entire circumference at a different phase from the first set of supplying. The different phases mean that the position where the second chemical liquid F2 is supplied to the peripheral edge portion W3a in the first set of supplying and the position where the second chemical liquid F2 is supplied to the peripheral edge portion W3a in the second set of supplying are different in the circumferential direction. The liquid treatment module 4A may be configured to perform the first set of supplying and the second set of supplying at two locations aligned in the circumferential direction. For example, as shown in FIG. 16, the liquid treatment module 4A may include two jet dispensers 96A and 96B aligned in the circumferential direction. Each of the jet dispensers 96A and 96B has a configuration similar to the jet dispenser 96 described above. By at least partially overlapping the period during which the first set of supply is performed and the period during which the second set of supply is performed, the period during which the second chemical liquid F2 is supplied to the gap G can be shortened.

[0054] The liquid treatment module 4A may be configured to supply the second chemical liquid F2 while covering the supply location of the second chemical liquid F2 with a guide member. For example, as shown in FIG. 17(a), the liquid treatment module 4A includes a guide member 641 instead of the jet dispenser 96. In the example of FIG. 17, the rotating holder 5 horizontally positions the laminated substrate W3. The guide member 641 is configured to cover the outer peripheral surfaces W1c and W2c, the upper surface W1b of the first substrate W1, and the upper surface W2b of the second substrate W2 in part of the peripheral edge portion W3a of the laminated substrate W3. For example, the guide member 641 has a portion 641a covering the outer peripheral surfaces W1c and W2c, a portion 641b covering the upper surface W1b of the first substrate W1, and a portion 641c covering the upper surface W2b of the second substrate W2. The second chemical liquid supply unit 92 supplies the second chemical liquid F2 into the guide member 641. For example, guide member 641 has chemical liquid supply port 641d in portion 641a. For example, supply port 641d is provided in the center of portion 641a in the circumferential direction of laminated substrate W3. Second chemical liquid supply unit 92 supplies second chemical liquid F2 into guide member 641 from supply port 641d. The second chemical liquid F2 supplied into guide member 641 is held between portions 641a, 641b, and 641c by, for example, surface tension, and peripheral edge portion W3a comes into contact with the held second chemical liquid F2. As a result, second chemical liquid F2 is supplied to gap G.

[0055] The liquid processing module 4A may further include a guide member 642 and a suction device 643. The guide member 642 is disposed opposite the guide member 641 in the circumferential direction of the laminated substrate W3. Like the guide member 641, the guide member 642 covers the outer peripheral surfaces W1c and W2c, the upper surface W1b of the first substrate W1, and the upper surface W2b of the second substrate W2 in part of the peripheral edge W3a. For example, the guide member 642 has a portion 642a covering the outer peripheral surfaces W1c and W2c, a portion 642b covering the upper surface W1b of the first substrate W1, and a portion 642c covering the upper surface W2b of the second substrate W2, and includes a suction port 642d in the portion 642a. As shown in FIG. 17(b), the suction port 642d is provided in the center of the portion 642a in the circumferential direction of the laminated substrate W3. Aspirator 643 aspirates gas from inside guide member 642 through suction port 642d. Guide member 641, guide member 642, and suction device 643 generate an airflow in the circumferential direction in peripheral portion W3a from supply port 641d to suction port 642d. This airflow causes second chemical solution F2 supplied to supply port 641d to spread circumferentially, as shown in FIG. 17(c), and is supplied to gap G over a wider area.

[0056] The liquid treatment module 4A may be configured to supply the second chemical liquid F2 by a supply member for directly applying the second chemical liquid F2 to the gap G. As shown in FIG. 18(a), the liquid treatment module 4A may further include a supply member 651. In the example of FIG. 18(a), the supply member 651 is a brush. The supply member 651 is placed near the gap G with the second chemical liquid F2 adhering to the bristles of the supply member 651. In this state, the control device 100 controls the rotation holder 5 to hold and rotate the laminated substrate W3 horizontally. As a result, the second chemical liquid F2 adhering to the bristles of the supply member 651 is supplied to the gap G.

[0057] 18(b), the supply member 652 may be a thread-like member. The supply member 652 is placed near the gap G with the second chemical liquid F2 adhering to the surface of the supply member 652. In this state, the control device 100 controls the rotation holder 5 to hold and rotate the laminated substrate W3 horizontally. As a result, the second chemical liquid F2 adhering to the surface of the supply member 652 is supplied to the gap G.

[0058] The liquid processing module 4A may be configured to process the horizontally disposed laminated substrate W3 in a curved state so that the peripheral edge of the laminated substrate W3 is higher than the center of the laminated substrate W3. For example, as shown in FIG. 19, the liquid processing module 4, 4A may have a rotary holder 5A instead of the rotary holder 5. The rotary holder 5A has a support plate 510 and a suction port 520. The support plate 510 extends horizontally from the center of rotation around the entire circumference and supports the laminated substrate W3 from below. The support plate 510 has a support wall 511. The support wall 511 is formed around the entire periphery of the upper surface 51a of the support plate 510 and protrudes upward from the upper surface 51a. The laminated substrate W3 is supported by the support wall 511. Supporting the laminated substrate W3 by the support wall 511 forms a space SP between the upper surface 51a and the laminated substrate W3. The suction port 520 opens at the center of the upper surface 51a. When the upper surface 51a adsorbs the laminated substrate W3, gas in the space SP is sucked out through the suction port 520. As a result, the portion of the laminated substrate W3 located inside the support wall 511 is attracted to the upper surface 51a, and the laminated substrate W3 is curved so that the periphery of the laminated substrate W3 is higher than the center of the laminated substrate W3. With the laminated substrate W3 in this curved state, the rotary holder 5 rotates the laminated substrate W3, and the jet dispenser 96 supplies the second chemical solution F2 to the gap G. The jet dispenser 96 may be tilted diagonally downward to match the curvature of the laminated substrate W3.

[0059] The control device 100 may control the liquid treatment modules 4, 4A to repeatedly supply the second chemical liquid F2 to the gap G multiple times, and then control the curing treatment module 31 to harden the second chemical liquid F2. For example, the control device 100 may control the liquid treatment modules 4, 4A to repeatedly supply the second chemical liquid F2 to the peripheral edge W1a of the first substrate W1 and move the second chemical liquid F2 from the peripheral edge W1a to the gap G multiple times. Thereafter, the control device 100 may control the curing treatment module 31 to harden the second chemical liquid F2. If supplying the second chemical liquid F2 to the gap G constitutes one cycle, the second chemical liquid F2 can be filled in areas that were not filled with the second chemical liquid F2 in one cycle by repeating the same cycle. This allows the second chemical liquid F2 to be filled more sufficiently.

[0060] FIG. 20 is a plan view showing the state of the gap G. As shown in FIG. 20(a), after the completion of the one cycle, the gap G formed in the peripheral edge portion W3a is filled with the second chemical liquid F2 as shown in FIG. 20(b). With only the one cycle, an unfilled portion BR remains in the gap G. In contrast, as shown in FIG. 20(c), by repeating the one cycle, the unfilled portion BR is also filled with the second chemical liquid F2.

[0061] The control device 100 may control the liquid treatment modules 4, 4A to repeat multiple times the supply of the first chemical liquid F1 to the gap G and the supply of the second chemical liquid F2 to the gap G, and then control the hardening treatment module 31 to harden the second chemical liquid F2. By also repeatedly supplying the first chemical liquid F1 to the gap G, the second chemical liquid F2 can be more sufficiently filled.

[0062] After executing the supply of the second chemical liquid F2 and before executing the next supply, the control device 100 may control the liquid treatment modules 4, 4A to temporarily increase the rotation speed of the laminated substrate W3 when the second chemical liquid F2 is supplied. For example, the control device 100 may control the rotation holder 5 to rotate the laminated substrate W3 at a second rotation speed that is higher than the rotation speed of the laminated substrate W3 when the second chemical liquid F2 is supplied.

[0063] FIG. 21 is a plan view showing the state of the gap G. As shown in FIG. 21(a), the gap G formed in the peripheral portion W3a of the laminated substrate W3 is filled with the second chemical liquid F2 as shown in FIG. 20(b) after the completion of the above-mentioned one cycle. After the above-mentioned one cycle, the unfilled portion BR may remain in a bubble-like state inside the gap G. In this case, by temporarily increasing the rotation speed of the laminated substrate W3, the unfilled portion BR is extended outward (outside the peripheral portion W3a of the laminated substrate W3) and opened outward due to the centrifugal force of the rotation as shown in FIG. 21(c). Therefore, in the next cycle, the unfilled portion BR can be easily filled with the second chemical liquid F2 as shown in FIG. 21(d).

[0064] When the liquid treatment module 4, 4A repeatedly supplies the first chemical liquid F1 and the second chemical liquid F2, the control device 100 may control the liquid treatment module 4, 4A to temporarily increase the rotational speed when supplying the second chemical liquid F2 after supplying the second chemical liquid F2 and before supplying the first chemical liquid F1.

[0065] The control device 100 may control the liquid treatment modules 4, 4A to repeat multiple times the supply of the second chemical liquid F2 to the gap G and the temporary increase in the rotation speed of the laminated substrate W3, and then control the hardening treatment module 31 to harden the second chemical liquid F2. For example, the control device 100 may control the liquid treatment modules 4, 4A to repeat multiple times the supply of the first chemical liquid F1 to the gap G, the supply of the second chemical liquid F2 to the gap G, and the rotation of the laminated substrate W3 at the second rotation speed, and then control the hardening treatment module 31 to harden the second chemical liquid F2. By also temporarily increasing the rotation speed of the laminated substrate W3 multiple times, the unfilled portion BR can be more reliably filled with the second chemical liquid F2.

[0066] The control device 100 may be configured to control the solution treatment module 4, 4A based on the state of the second chemical liquid F2 in the gap G. For example, the solution treatment module 4, 4A may further include a detection unit 98 that detects the shape and dimensions of the peripheral edge portion W3a of the laminated substrate W3. FIG. 22 is a diagram showing an example of measurement of the peripheral edge portion by the detection unit. The detection unit 98 may be, for example, a projection image measurement device. As shown in FIG. 22(a), the detection unit 98 may include a light-projecting unit 981 and a light-receiving unit 982. The light-projecting unit 981 and the light-receiving unit 982 are arranged along the orientation of the laminated substrate W3 so as to sandwich a part of the peripheral edge portion W3a therebetween. Light emitted from the light-projecting unit 981 passes through the peripheral edge portion W3a and enters the light-receiving unit 982. The light-receiving unit 982 may include, for example, a screen. A shadow of the peripheral edge portion W3a is projected onto the screen of the light-receiving unit 982. The light receiving unit 982 generates data of the projected image. The control device 100 may detect the state (height, shape, size, etc.) of the peripheral edge portion W3a based on the data generated by the light receiving unit 982. Examples of the state of the peripheral edge portion W3a include the height and shape of the peripheral edge portion W3a of the laminated substrate W3, the thickness of the peripheral edge portion W1a of the first substrate W1, the thickness of the peripheral edge portion W2a of the second substrate W2, the thickness of the gap G, the inclination angle of the peripheral edge portion W1a, and the inclination angle of the peripheral edge portion W2a.

[0067] FIG. 22(b) is a diagram showing an example of a projected image. The control device 100 may, for example, detect the position (e.g., height) of the gap G in the vertical direction from the projected image. The control device 100 may control the supply position of the second chemical liquid F2, i.e., the position at which the second chemical liquid F2 is supplied from the head 962 to the gap G, based on the detection result of the position of the gap G. For example, the control device 100 may control the nozzle movement mechanism 8 to align the position of the head 962 with the position of the gap G. In this case, by dynamically adapting the supply position of the second chemical liquid F2 to the detection result of the position of the gap G, the second chemical liquid F2 can be more reliably supplied to the gap.

[0068] The control device 100 may adjust the supply parameters of the second chemical liquid F2 based on the detection results of the state of the second chemical liquid F2. The supply parameters may be the number of times the cycle described above is repeated, the time for supplying the first chemical liquid F1 or the second chemical liquid F2, or the supply amount of the second chemical liquid F2 (e.g., the supply amount per unit time or the length of the supply time). By dynamically adapting the supply parameters of the second chemical liquid F2 to the detection results of the state of the second chemical liquid F2, the second chemical liquid F2 can be more reliably supplied to the gap G.

[0069] For example, the control device 100 may detect the degree to which the second chemical liquid F2 has filled the gap G based on the state of the second chemical liquid F2, and adjust the supply amount of F2 based on the degree of filling. For example, the control device 100 may calculate the proportion of the area of ​​the second chemical liquid F2 to the area of ​​the gap G on the image as the degree of filling.

[0070] The program storage unit of the control device 100 may store a program for controlling the processing of the laminated substrate W3 in the liquid processing modules 4, 4A and the heat treatment device. The control device 100 described above is configured with one or more control computers. FIG. 23 is a diagram showing an example of the hardware configuration of the control device. For example, the control device 100 has a circuit 150 shown in FIG. 23. The circuit 150 has one or more processors 151, a memory 152, a storage 153, and an input / output port 154. The storage 153 has a computer-readable storage medium such as a hard disk. The storage medium stores a program for causing the control device 100 to execute a substrate processing method using the liquid processing modules 4, 4A and the heat treatment device. The storage medium may be a removable medium such as a non-volatile semiconductor memory, a magnetic disk, or an optical disk. The storage medium may also be a computer-readable storage medium.

[0071] The memory 152 temporarily stores the programs loaded from the storage medium of the storage 153 and the results of calculations by the processor 151. The processor 151 executes the programs in cooperation with the memory 152 to configure each of the functional modules described above. The input / output port 154 inputs and outputs electrical signals to and from each part of the processing station 3 in accordance with instructions from the processor 151. The control device 100 may be configured with multiple control computers. The hardware configuration of the control device 100 is not necessarily limited to configuring each functional module by a program. For example, each functional module of the control device 100 may be configured with a dedicated logic circuit or an ASIC (Application Specific Integrated Circuit) that integrates such logic circuits.

[0072] [Substrate processing procedure] As an example of a substrate processing method, a substrate processing procedure executed by the control device 100 will be illustrated. FIG. 24 is a flowchart illustrating an example of the substrate processing procedure executed by the control device. The flowchart shown in FIG. 24 is an example in which the control device 100 controls the liquid processing module 4, which supplies the second chemical liquid F2 to the gap G by moving the second chemical liquid F2 into the gap G. As shown in FIG. 24, the control device 100 sequentially executes steps ST1 to ST13. In step ST1, before supplying the first chemical liquid F1, the hydrophilization processor 94 performs hydrophilization processing on the peripheral edge portion W3a of the laminated substrate W3. In step ST2, the control device 100 detects the shape of the peripheral edge portion W3a of the laminated substrate W3 from the image input from the detection unit 98. In step ST3, the control device 100 determines whether or not adjustment of the supply parameters of at least one of the first chemical liquid F1 and the second chemical liquid F2 is necessary based on the detection result of the shape of the peripheral edge portion W3a. If the supply parameters need to be adjusted (step ST3: YES), the control device 100 adjusts the supply parameters in step ST4. For example, if the thickness of the gap G is thicker than the reference value, the control device 100 sets the supply amounts of the first chemical liquid F1 and the second chemical liquid F2 to be large.

[0073] Next, the control device 100 executes step ST5. If adjustment of the supply parameters is not required (step ST3: NO), the control device 100 executes step ST5 without executing step ST4. In step ST5, the control device 100 controls the liquid treatment module 4 to supply the first chemical liquid F1 to the first substrate W1 and move the first chemical liquid F1 to the gap G. Subsequently, in step ST6, the control device 100 controls the liquid treatment module 4 to supply the second chemical liquid F2 to the first substrate W1 and move the second chemical liquid F2 to the gap G, thereby replacing the first chemical liquid F1 in the gap G with the second chemical liquid F2. Subsequently, in step ST7, the control device 100 temporarily increases the rotation speed of the laminated substrate W3. For example, the control device 100 increases the rotation speed of the laminated substrate W3 to the second rotation speed and then returns it to the rotation speed before the increase. Next, in step ST8, the control device 100 detects the state of the second chemical liquid F2 supplied to the gap G from the image input from the detection unit 98. In step ST9, the control device 100 determines whether or not adjustment of the supply amount of at least one of the first chemical liquid F1 and the second chemical liquid F2 is necessary based on the detection result of the state of the second chemical liquid F2. If adjustment of the supply amount is necessary (step ST9: YES), the control device 100 adjusts the supply amount in step ST10. Next, the control device 100 executes step ST11. If it is determined in step ST9 that adjustment of the supply amount is not necessary, the control device 100 executes step ST11 without executing step ST10. In step ST11, based on the detection result of the state of the second chemical liquid F2, it is confirmed whether or not the filling of the second chemical liquid F2 into the gap G has reached a target level. If it is determined that the filling of the second chemical liquid F2 into the gap G is insufficient (step ST11: NO), the control device 100 returns the process to step ST5. As a result, steps ST5 to ST9 are repeated.

[0074] If it is determined that the filling of the second chemical liquid F2 into the gap G has reached the target level (step ST11: YES), then in step ST12, the control device 100 controls the liquid treatment module 4 so that the cleaning liquid supply unit 95 supplies the cleaning liquid to the peripheral edge portion W3a of the laminated substrate W3. Subsequently, in step ST13, the control device 100 controls the hardening treatment module 31 to harden the second chemical liquid F2. This completes the substrate treatment procedure.

[0075] 25 is a flowchart showing another example of a substrate processing procedure executed by the control device. The flowchart shown in FIG. 25 is an example in which control device 100 controls liquid processing module 4A, which directly supplies second chemical liquid F2 to gap G. First, control device 100 executes step ST21. In step ST21, control device 100 detects the position of gap G from an image input from detection unit 98. Control device 100 may generate a profile representing the relationship between the rotation angle of laminated substrate W3 and the position of gap G by sequentially detecting the position of gap G while rotating laminated substrate W3 using rotation holder 5.

[0076] Thereafter, control device 100 executes ST22 to ST34, which are similar to ST1 to ST13. In ST27, which corresponds to ST6, liquid treatment module 4A supplies second chemical liquid F2 to gap G. During this period, control device 100 may control nozzle movement mechanism 8 to adjust the position of jet dispenser 96 in accordance with the rotation angle of laminated substrate W3, based on the above-described profile.

[0077] The above describes embodiments and modifications of the present disclosure, but the present disclosure is not necessarily limited to the above-described embodiments and modifications, and various modifications are possible without departing from the spirit of the present disclosure.

[0078] The above-described embodiments and modifications may be combined as appropriate. For example, the jet dispenser 96 in the liquid processing module 4A may be provided with guide members 72, 74 as described in FIGS. 6 and 7. For example, the liquid processing module 4 may be provided with the spin holder 5A as described in FIG. 19. In the substrate processing procedure performed on the liquid processing module 4 described in FIG. 24, steps ST1 to ST4, ST9, and ST10 may not be performed. In the substrate processing procedure performed on the liquid processing module 4A described in FIG. 25, steps ST21 to ST25, ST30, and ST31 may not be performed.

[0079] The above-described exemplary embodiments and modifications include the following configurations. [1] A substrate processing method comprising: supplying a first chemical liquid to a gap between a first substrate and a second substrate at a peripheral portion of a laminated substrate in which the first substrate and the second substrate are bonded together; supplying a second chemical liquid to the gap at the peripheral portion so as to replace the first chemical liquid in the gap with a second chemical liquid different from the first chemical liquid; and hardening the second chemical liquid in the gap. [2] The substrate processing method described in [1], wherein, in supplying the first chemical liquid to the gap, the laminated substrate is rotated while the first chemical liquid is supplied to the gap in one area through which the peripheral edge of the laminated substrate passes due to the rotation, and, in supplying the second chemical liquid to the gap, the laminated substrate is rotated while the second chemical liquid is supplied to the gap in one area through which the peripheral edge of the laminated substrate passes due to the rotation. [3] A substrate processing method according to [2], wherein the second chemical liquid is hardened after the supply of the first chemical liquid to the gap and the supply of the second chemical liquid to the gap are repeated multiple times. [4] The substrate processing method according to [2] or [3], further comprising, after supplying the second chemical liquid and before supplying the first chemical liquid, rotating the laminated substrate at a second rotation speed higher than the rotation speed of the laminated substrate when supplying the second chemical liquid. [5] A substrate processing method according to [4], wherein the second chemical liquid is hardened after multiple cycles of supplying the first chemical liquid to the gap, supplying the second chemical liquid to the gap, and rotating the laminated substrate at the second rotation speed. [6] The substrate processing method according to any one of [1] to [5], wherein the second chemical liquid is cured by a heat treatment in curing the second chemical liquid. [7] The substrate processing method according to any one of [1] to [6], wherein the surface tension of the first chemical liquid is equal to or lower than the surface tension of the second chemical liquid. [8] The substrate processing method according to [7], wherein the surface tension of the first chemical liquid is 30 mN / m or less. [9] The substrate processing method according to any one of [1] to [8], wherein the first chemical liquid contains at least one of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether.

[10] The substrate processing method according to any one of [1] to [9], wherein the viscosity of the second chemical liquid is higher than the viscosity of the first chemical liquid.

[11] The substrate processing method according to any one of [1] to

[10] , wherein supplying the second chemical liquid to the gap includes supplying the second chemical liquid to the peripheral portion of the first substrate while holding and rotating the laminated substrate horizontally so that the first substrate is positioned above the second substrate, and moving the second chemical liquid from the peripheral portion of the first substrate to the gap.

[12] A substrate processing method according to any one of [1] to

[11] , wherein supplying the first chemical liquid to the gap includes supplying the first chemical liquid to the peripheral portion of the first substrate while holding and rotating the laminated substrate horizontally so that the first substrate is positioned above the second substrate, and moving the first chemical liquid from the peripheral portion of the first substrate to the gap.

[13] A substrate processing method according to any one of [1] to

[10] , wherein, in supplying the second chemical liquid to the gap, the second chemical liquid is supplied from the nozzle so that the second chemical liquid coming out of the nozzle reaches the gap directly.

[14] The substrate processing method according to

[13] , wherein supplying the second chemical liquid to the gap includes periodically supplying the second chemical liquid by reciprocating a plunger.

[15] The substrate processing method described in

[14] , wherein supplying the second chemical liquid to the gap includes a first set of supply that supplies the second chemical liquid over the entire circumference at a predetermined cycle, and a second set of supply that supplies the second chemical liquid over the entire circumference at the predetermined cycle in a phase different from that of the first set of supply.

[16] A substrate processing method according to any one of [1] to

[15] , wherein the second chemical liquid is supplied to the gap while the horizontally arranged laminated substrate is curved so that the peripheral edge of the laminated substrate is higher than the center of the laminated substrate.

[17] A substrate processing method according to any one of [1] to

[16] , wherein, in supplying the second chemical liquid to the gap, the laminated substrate is rotated while the peripheral portion of the laminated substrate is immersed in a puddle of the second chemical liquid.

[18] The substrate processing method according to any one of [1] to

[17] , further comprising: detecting the position of the gap in a direction perpendicular to the laminated substrate; and controlling the supply position of the second chemical liquid based on the detection result of the position of the gap.

[19] A substrate processing apparatus including: a first chemical liquid supply unit that supplies a first chemical liquid to a gap between a first substrate and a second substrate at a peripheral portion of a laminated substrate in which the first substrate and the second substrate are bonded together; a second chemical liquid supply unit that supplies the second chemical liquid to the gap at the peripheral portion so as to replace the first chemical liquid in the gap with a second chemical liquid different from the first chemical liquid; and a curing unit that hardens the second chemical liquid in the gap.

[20] A substrate processing program that causes a computer to execute the substrate processing method according to any one of [1] to

[18] . [Explanation of symbols]

[0080] 1...substrate processing apparatus, 31...hardening processing module (hardening section), 6, 7...nozzle, 63...liquid reservoir, 91...first chemical liquid supply section, 92...second chemical liquid supply section, 964...plunger, F1...first chemical liquid, F2...second chemical liquid, G...gap, W1...first substrate, W2...second substrate, W3...laminated substrate, W1a...periphery of first substrate, W3a...periphery of laminated substrate.

Claims

1. supplying a first chemical liquid to a gap between the first substrate and the second substrate at a peripheral portion of a laminated substrate in which the first substrate and the second substrate are bonded together; supplying a second chemical liquid to the gap at the peripheral edge portion so as to replace the first chemical liquid in the gap with a second chemical liquid different from the first chemical liquid; and curing the second chemical liquid in the gap.

2. supplying the first chemical liquid to the gap in an area through which a peripheral edge of the laminated substrate passes while rotating the laminated substrate; The substrate processing method of claim 1, wherein, in supplying the second chemical liquid to the gap, the laminated substrate is rotated while the second chemical liquid is supplied to the gap in one area through which the peripheral portion of the laminated substrate passes due to the rotation.

3. The substrate processing method according to claim 2 , further comprising the steps of supplying the first chemical liquid to the gap and supplying the second chemical liquid to the gap multiple times, and then curing the second chemical liquid.

4. 4. The substrate processing method of claim 2, further comprising: after supplying the second chemical liquid, and before supplying the first chemical liquid, rotating the laminated substrate at a second rotation speed higher than the rotation speed of the laminated substrate when supplying the second chemical liquid.

5. 5. The substrate processing method of claim 4, wherein the second chemical liquid is hardened after multiple cycles of supplying the first chemical liquid to the gap, supplying the second chemical liquid to the gap, and rotating the laminated substrate at the second rotation speed.

6. 4. The substrate processing method according to claim 1, wherein the second chemical liquid is cured by a heat treatment in curing the second chemical liquid.

7. 4. The substrate processing method according to claim 1, wherein the surface tension of the first chemical liquid is equal to or lower than the surface tension of the second chemical liquid.

8. 8. The substrate processing method according to claim 7, wherein the first chemical liquid has a surface tension of 30 mN / m or less.

9. 4. The substrate processing method according to claim 1, wherein the first chemical liquid contains at least one of polyethylene glycol monomethyl ether acetate and polyethylene glycol monomethyl ether.

10. 4. The substrate processing method according to claim 1, wherein the second chemical liquid has a higher viscosity than the first chemical liquid.

11. The substrate processing method of any one of claims 1 to 3, wherein supplying the second chemical liquid to the gap includes supplying the second chemical liquid to the peripheral portion of the first substrate while holding and rotating the laminated substrate horizontally so that the first substrate is positioned above the second substrate, and moving the second chemical liquid from the peripheral portion of the first substrate to the gap.

12. The substrate processing method of any one of claims 1 to 3, wherein supplying the first chemical liquid to the gap includes supplying the first chemical liquid to the peripheral portion of the first substrate while holding and rotating the laminated substrate horizontally so that the first substrate is positioned above the second substrate, and moving the first chemical liquid from the peripheral portion of the first substrate to the gap.

13. A substrate processing method according to any one of claims 1 to 3, wherein, in supplying the second chemical liquid to the gap, the second chemical liquid is supplied from the nozzle so that the second chemical liquid coming out of the nozzle reaches the gap directly.

14. The substrate processing method according to claim 13 , wherein supplying the second chemical liquid to the gap includes periodically supplying the second chemical liquid by reciprocating a plunger.

15. Supplying the second chemical liquid to the gap includes: a first set of supplying the second chemical solution over the entire circumference at a predetermined cycle; 15. The substrate processing method according to claim 14, further comprising: a second set of supplying the second chemical liquid over the entire circumference in the predetermined cycle at a phase different from that of the first set of supplying.

16. 4. The substrate processing method according to claim 1, wherein the second chemical liquid is supplied to the gap while the horizontally arranged laminated substrate is curved so that the peripheral edge of the laminated substrate is higher than the center of the laminated substrate.

17. The substrate processing method according to any one of claims 1 to 3, wherein, when supplying the second chemical liquid to the gap, the laminated substrate is rotated while immersing the peripheral portion of the laminated substrate in a puddle of the second chemical liquid.

18. Detecting the position of the gap in a direction perpendicular to the laminated substrate; 4. The substrate processing method according to claim 1, further comprising: controlling a supply position of the second chemical liquid based on a detection result of the position of the gap.

19. a first chemical liquid supply unit that supplies a first chemical liquid to a gap between the first substrate and the second substrate at a peripheral portion of a laminated substrate in which the first substrate and the second substrate are bonded together; a second chemical liquid supply unit that supplies the second chemical liquid to the gap so as to replace the first chemical liquid in the gap with a second chemical liquid different from the first chemical liquid at the peripheral edge portion; a curing unit that cures the second chemical liquid in the gap.

20. A substrate processing program that causes a computer to execute the substrate processing method according to any one of claims 1 to 3.

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