Sheet contactor socket

Abstract

To provide a sheet contactor socket for placing a semiconductor package at an appropriate position of a plate when placing the semiconductor package on the plate.SOLUTION: The sheet contactor socket includes: a plate positioned above a sheet contactor having a plurality of contact terminals and having a storage part for storing a semiconductor package having a plurality of contact parts in contact with each of the plurality of contact terminals; and a cover elastically supporting the plate. The storage part includes: a placement part capable of placing the semiconductor package thereon and having a guide part for guiding the contact part to a position where the plurality of contact parts come into contact with the plurality of contact terminals; and a non-placement part not placing the semiconductor package thereon. A placed area of the placement part included in the storage part is smaller than a non-placed area of the non-placement part not placing the semiconductor package.SELECTED DRAWING: Figure 1A

Description

[Technical Field]

[0001] The present invention relates to a seat contactor socket. [Background technology]

[0002] Semiconductor packages are inspected by bringing many pins of the semiconductor package into contact with conductive parts of an inspection socket.

[0003] The inspection socket includes an inspection conducting part, a plate on which the semiconductor package is placed, and a cover that supports the plate. During inspection, the semiconductor package is placed on the plate using a handler device or the like, and then the semiconductor package is brought into contact with the conducting part.

[0004] Known examples of the conductive parts of such inspection sockets include a contact probe that includes a tiny spring and plunger, as described in Patent Document 1, and a sheet contactor in which contact terminals are arranged on a sheet, as described in Patent Document 2. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent Publication No. 2023-036137 [Patent Document 2] Patent Publication No. 2000-030828 Summary of the Invention [Problem to be solved by the invention]

[0006] When inspecting a semiconductor package, the package may be dropped onto a plate, in which case it is necessary to place the package in an appropriate position on the plate.

[0007] An example of an object of the present invention is to provide a sheet contactor socket that places a semiconductor package in an appropriate position when the semiconductor package is placed on a plate. Other objects of the present invention will become apparent from the description of this specification. [Means for solving the problem]

[0008] One aspect of the present invention is a sheet contactor including: a plate having an accommodating portion positioned above a sheet contactor having a plurality of contact terminals, the plate being capable of accommodating a semiconductor package having a plurality of contact portions that contact each of the plurality of contact terminals; and a cover that elastically supports the plate; the accommodation section includes a placement section on which the semiconductor package can be placed and which has guide sections that guide the contact sections to positions where the contact sections can come into contact with the contact terminals, and a non-placement section on which the semiconductor package is not placed; The mounting area of ​​the mounting portion in the accommodation portion is a sheet contactor socket that is smaller than the non-mounting area of ​​the non-mounting portion on which the semiconductor package is not mounted. [Brief explanation of the drawings]

[0009] [Figure 1A] FIG. 1A is an exploded perspective view of one embodiment of a seat contactor socket 100. FIG. [Figure 1B] FIG. 1B is a perspective view of the seat contactor socket 100 of FIG. 1A in an assembled state. [Figure 1C] FIG. 1C is an exploded perspective view showing the fixing of the seat contactor socket 100 to the stiffener 80. FIG. [Figure 2] FIG. 2 is a plan view of one embodiment of the seat contactor 10. [Figure 3A] FIG. 3A is a cross-sectional view of one embodiment of the support portion of the cover 30 that resiliently supports the plate 20. As shown in FIG. [Figure 3B] FIG. 3B is a cross-sectional view of one embodiment of the support portion of the cover 30 that elastically supports the plate 20, showing the support portion in a different state from that in FIG. 3A. [Figure 3C] FIG. 3C is a conceptual diagram showing that first guide portion 21b guides electrodes 210 of semiconductor package 200. As shown in FIG. [Figure 4A] FIG. 4A is a plan view of one embodiment of plate 20. FIG. [Figure 4B] FIG. 4B is an enlarged view of one embodiment of the mounting portion 21 and second guide portion 24 of the plate 20 of FIG. 4A. [Figure 5A] FIG. 5A is a cross-sectional view of one embodiment of the sheet contactor socket 100 with a semiconductor package 200 mounted on the plate 20. As shown in FIG. [Figure 5B] FIG. 5B is a cross-sectional view of one embodiment of the sheet contactor socket 100 in a state where a semiconductor package 200 is placed on the plate 20, and shows a state of the sheet contactor socket 100 different from that in FIG. 5A. [Figure 5C] FIG. 5C is an enlarged view showing the contact portion between the electrode 210 of the semiconductor package 200 and the contact terminal 11 of the sheet contactor 10 in FIG. 5B. DETAILED DESCRIPTION OF THE INVENTION

[0010] The present invention will be described in detail using the following embodiments as examples, but the present invention is not limited thereto. Unless specific details are mentioned for each device, mechanism, means, etc. in this specification, those skilled in the art can use mechanical devices, mechanisms, means, etc. that are well known to those skilled in the art. Each embodiment can be combined based on the common knowledge of those skilled in the art, and configurations not specifically described for each embodiment can have the same configuration as other embodiments or a configuration appropriate for that embodiment. In cross-sectional views, the cross section of each component is represented by various diagonal lines to make it easier to distinguish from other components, but the differences in these diagonal lines do not represent differences in the material, shape, etc. of the component.

[0011] To explain the directions, an X direction, a Y direction, and a Z direction are defined. The X direction is one of the directions perpendicular to the thickness direction of the seat contactor socket 100. The Y direction is one of the directions perpendicular to the thickness direction of the seat contactor socket 100 and the X direction. The Z direction is the thickness direction of the seat contactor socket 100. In this embodiment, the X direction is the front-to-rear direction of the seat contactor 10, the Y direction is the left-to-right direction of the seat contactor 10, and the Z direction is the up-down direction. In FIG. 1 etc., the direction indicated by the X-axis arrow is defined as the forward direction, the direction indicated by the Y-axis arrow is defined as the leftward direction, and the direction indicated by the Z-axis arrow is defined as the upward direction.

[0012] The configuration of a seat contactor socket 100 according to this embodiment will be described using FIGS. 1A to 1C, 2, 3A to 3C, 4A, and 4B. FIG. 1A is an exploded perspective view of the seat contactor socket 100 according to this embodiment. FIG. 1B is a perspective view of the seat contactor socket 100 of FIG. 1A in an assembled state. FIG. 1C is an exploded perspective view showing the fixation of the seat contactor socket 100 to a stiffener 80. FIG. 2 is a plan view of the seat contactor 10 according to this embodiment. FIG. 3A is a cross-sectional view showing the AA cross section of the seat contactor socket 100 of FIG. 1B according to this embodiment, illustrating the support portion of the cover 30 that elastically supports the plate 20. FIG. 3B is a cross-sectional view showing the AA cross section of the seat contactor socket 100 of FIG. 1B according to this embodiment, illustrating the support portion of the cover 30 that elastically supports the plate 20 in a state different from that shown in FIG. 3A. Fig. 3C is a conceptual diagram showing how first guide portion 21b guides electrodes 210 of semiconductor package 200. Fig. 4A is a plan view of plate 20 in this embodiment. Fig. 4B is an enlarged view of mounting portion 21 and second guide portion 24 of plate 20 in Fig. 4A.

[0013] As shown in FIGS. 1A and 1B, the seat contactor socket 100 includes a seat contactor 10, a plate 20, and a cover 30. In this embodiment, the seat contactor socket 100 includes the seat contactor 10, the plate 20, and the cover 30. However, the seat contactor socket 100 may include the plate 20 and the cover 30 without the seat contactor 10. In this embodiment, the seat contactor socket 100 has four spring members 40 between the plate 20 and the cover 30. The seat contactor socket 100 also has four pressing members 50 for pressing the plate 20 against the cover 30. Furthermore, in this embodiment, as shown in FIG. 1C, the seat contactor socket 100 has four fixing members 60 for fixing the cover 30 to a stiffener 80 via a substrate 70.

[0014] 1A, 1B, and 2, the sheet contactor 10 has a plurality of contact terminals 11, a sheet main body 12, a sheet base material portion 13, and a plurality of sheet fixing portions 14. The sheet main body 12 also has a carrying region 12a that carries an array of the plurality of contact terminals 11, and a non-carrying region 12b that is open and does not carry any contact terminals 11. As shown in FIG. 2, the plurality of contact terminals 11 are arranged in close contact with each other over substantially the entire carrying region 12a.

[0015] In order to test the electrical characteristics of the semiconductor package 200, the multiple contact terminals 11 contact and energize multiple electrodes 210 corresponding to contact portions provided on the semiconductor package 200 shown in FIG. 3C. The contact terminals 11 are not shown in FIGS. 1A and 1B. Also, in FIG. 2, only some of the contact terminals 11 are shown, and the arrangement of the contact terminals 11 within the support area 12a is partially omitted. The non-support area 12b is an opening provided in the center of the support area 12a, where no contact terminals 11 are provided. The non-support area 12b corresponds to an area of ​​the semiconductor package 200 where no electrodes 210 are provided. Each of the multiple contact terminals 11 arranged in the support area 12a corresponds one-to-one to each of the multiple electrodes 210 of the semiconductor package 200. Each of the multiple contact terminals 11 is positioned to face each of the multiple electrodes 210 of the semiconductor package 200 when the semiconductor package 200 is placed on the plate 20.

[0016] The plurality of contact terminals 11 are formed by, for example, conductive particles of metal or the like carried by a resin such as silicone resin. The form of the plurality of contact terminals 11 is not particularly limited as long as they can contact the electrodes 210 of the semiconductor package 200 and conduct electricity. Such contact terminals 11 have a limited amount of upward protrusion from the sheet contactor 10. When considering guiding each of the plurality of electrodes 210 to an appropriate position for contacting each of the plurality of contact terminals 11, it is desirable to provide a structure for guiding each of the plurality of electrodes 210 to the plurality of contact terminals 11.

[0017] However, since the amount by which the multiple contact terminals 11 protrude upward from the sheet contactor 10 is limited, it is difficult to increase the thickness of the plate 20 in the upward direction. Furthermore, if an attempt is made to provide a structure for guiding each of the multiple contact terminals 11 without increasing the thickness of the plate 20, defects such as warping may occur due to processing of the plate 20. In this embodiment, it is possible to guide each of the multiple electrodes 210 to an appropriate position for contacting each of the multiple contact terminals 11 without increasing the thickness of the plate 20.

[0018] Furthermore, in the sheet contactor 10 of this embodiment, metal particles come into contact with each other within the sheet contactor 10 for the first time when a force is applied from, for example, the downward direction, thereby enabling electrical conduction. Furthermore, compared to a case in which a contact probe that is extendable in the Z direction is used, such contact terminals 11 can be made much shorter in length in the Z direction, thereby shortening the transmission distance and reducing loss at high frequencies. This allows electrical testing of the semiconductor package 200 at higher frequencies. In this embodiment, the multiple electrodes 210 provided on the semiconductor package 200 are approximately hemispherical and protrude downward.

[0019] The sheet body 12 has substantially the same shape as the planar shape of the semiconductor package 200, and is a substantially quadrilateral shape consisting of two sides extending in the X direction and two sides extending in the Y direction. Note that the sheet body 12 does not have to have substantially the same shape as the semiconductor package 200, as long as the shape allows each of the multiple contact terminals 11 to come into contact with each of the multiple electrodes 210 of the semiconductor package 200.

[0020] The sheet base member 13 has a sheet fixing portion 14. The sheet base member 13 is provided along each of two sides of the sheet main body 12 extending in the Y direction in FIG. 2. As shown in FIG. 2, the sheet fixing portion 14 is a hole that penetrates the sheet base member 13 in the Z direction at a plurality of positions, and in this embodiment, two sheet fixing portions 14 are provided spaced apart in the Y direction. The sheet contactor 10 is attached to the cover 30 or the like by passing a screw or the like through the hole in the sheet fixing portion 14 from the lower side of the cover 30 toward the upper side.

[0021] Plate 20 is a member located above sheet contactor 10 and cover 30 and placed on cover 30. As shown in Figures 1A, 1B, 4A, and 4B, plate 20 has mounting portion 21, through-hole 21a, first guide portion 21b, opening 22, chamfered portion 23, second guide portion 24, perforated portion 25, plate outer periphery 26, locking portion 27, and restraining portion 28. The combination of mounting portion 21 and opening 22 is an area that accommodates semiconductor package 200, and constitutes accommodation portion 20a in the present invention.

[0022] The accommodating section 20a is a portion inside the plate 20 that accommodates the semiconductor package 200. In this embodiment, an example is shown in which the accommodating section 20a, which is a combination of the mounting section 21 and the opening 22, has a substantially quadrilateral shape, but the specific shape is not limited as long as it corresponds to the outer shape of the semiconductor package 200. In the example shown in FIG. 4A , the accommodating section 20a has a size substantially equal to that of the semiconductor package 200.

[0023] The mounting portion 21 includes a mounting area on which the semiconductor package 200 can be mounted. The mounting portion 21 has through holes 21a that guide portions of the electrodes 210 to positions where they can contact portions of the contact terminals 11 of the sheet contactor 10, in order to guide each of the electrodes 210 of the semiconductor package 200 to a position where they can contact each of the contact terminals 11 of the sheet contactor 10. The mounting portion 21 also has first guide portions 21b around each of the through holes 21a. While FIG. 4A shows an example in which the plate-shaped mounting portions 21 are disposed at the four corners of the opening 22, the positions of the mounting portions 21 are not limited thereto and may be disposed along each side of the opening 22. Each of the four mounting portions 21 has a substantially triangular shape, and a plurality of through holes 21a and first guide portions 21b are arranged in an array within this substantially triangular mounting area.

[0024] It is more preferable that one mounting portion 21 has multiple through holes 21a and first guide portion 21b than that at least one mounting portion 21 has one through hole 21a and first guide portion 21b. Furthermore, the size of mounting portion 21 is not limited, but it is preferable that the total area of ​​the multiple mounting portions 21 is smaller than the area of ​​opening 22.

[0025] In a socket using contact probes as contact terminals, the contact probes can be extended and retracted in the vertical direction to contact the electrodes 210 of the semiconductor package 200, allowing the plate 20 on which the semiconductor package 200 is placed to be thick. However, when a sheet contactor 10 is used, the vertical movement of the contact terminals 11 or the height that they protrude upward from the sheet contactor 10 is limited, so the thickness of the mounting portion 21 of the plate 20 needs to be thin. However, if the mounting portion 21 is formed over substantially the entire area of ​​the plate 20 to reduce the thickness, it has been found that distortion occurs when machining the through-holes 21a in the mounting portion 21, making it difficult to maintain machining precision.

[0026] Therefore, in the sheet contactor socket 100 of this embodiment, the mounting portion 21 that supports the semiconductor package 200 is formed only on a part of the plate 20, so that the electrodes 210 of the semiconductor package 200 and the contact terminals 11 of the sheet contactor 10 can be connected even in the opening 22.

[0027] For example, the width of the mounting portion 21 is preferably in the range of 1 mm to 100 mm in the XY plane from the lower end of the second guide portion 24. If the width of the mounting portion 21 is less than 1 mm, it becomes difficult to mount and properly position and hold the semiconductor package 200. Furthermore, if the width of the mounting portion 21 is greater than 100 mm, processing distortion is likely to occur when processing the through-hole 21a and the first guide portion 21b, which is undesirable. Furthermore, the thickness of the mounting portion 21 is not limited, but is preferably in the range of 0.05 mm to 0.45 mm, more preferably in the range of 0.2 mm to 0.3 mm. Furthermore, the area of ​​the mounting portion 21 of the plate 20 (the total area of ​​the four mounting portions 21 in this embodiment) is preferably 0.1 times or less the area of ​​the opening 22.

[0028] The through holes 21a are holes formed penetrating from the upper surface side to the lower surface side of the mounting portion 21. As shown in FIG. 4A, each of the multiple through holes 21a is arranged with a gap between adjacent through holes 21a and corresponds to the position of an electrode 210 of the semiconductor package 200. The shape of the through holes 21a is not limited, but is a shape that allows the electrode 210 to be positioned within the through hole 21a, and in the example shown in FIGS. 4A and 4B, the through holes 21a are substantially cylindrical. Furthermore, the inner diameter of each of the multiple through holes 21a is larger than the outermost diameter of the electrode 210 so that the electrode 210, which has a substantially hemispherical shape, can be inserted therein. Furthermore, as shown in FIG. 4B, a first guide portion 21b is formed around each of the multiple through holes 21a in the mounting portion 21. Furthermore, as shown in FIG. 4B, a portion of the arranged through holes 21a and first guide portion 21b may be cut off by the outer edge of the mounting portion 21.

[0029] The first guide portions 21b are tapered portions formed around the plurality of through holes 21a by chamfering, and are inclined downward so that their width narrows. The inclination angle of the first guide portions 21b is not limited, but is set to a value that allows a force to be applied to move the semiconductor package 200 in the XY plane when the electrodes 210 of the semiconductor package 200 contact the first guide portions 21b. The first guide portions 21b have a shape similar to that of the through holes 21a, and the centers of the through holes 21a and the first guide portions 21b are substantially aligned. As described below, the first guide portions 21b guide the semiconductor package 200, which has been transferred onto the plate 20 and dropped toward the plate 20, into the through holes 21a of the plate 20. The first guide portions 21b correspond to one of the guide portions of the present invention. Even if the falling direction of the semiconductor package 200 dropped onto the plate 20 is misaligned with the through hole 21a, the first guide portion 21b can guide the semiconductor package 200 into the through hole 21a by utilizing the inclination of the first guide portion 21b.

[0030] The opening 22 is an opening formed on the inner side of the plate 20. In a plan view of the plate 20 from above when the semiconductor package 200 is not placed thereon, the opening 22 exposes the multiple contact terminals 11 of the sheet contactor 10. Therefore, the opening 22 is an area where the semiconductor package 200 is not placed and corresponds to the non-placement area in the present invention. Furthermore, when the semiconductor package 200 is placed on the plate 20, each of the multiple electrodes 210 of the semiconductor package 200 contacts each of the multiple contact terminals 11 exposed through the opening 22. However, even in the opening 22 of the plate 20, the contact terminals 11 and / or the electrodes 210 of the semiconductor package 200 are not present in the non-supporting area 12b of the sheet contactor 10, so they do not come into contact with each other. As described above, the non-supporting area 12b of the sheet contactor 10 is an area provided to expose a portion of a circuit on a test board (not shown) provided below the sheet contactor 10, for example, and is not necessarily provided as the non-supporting area 12b. The test board (not shown) is in contact with each of the contact terminals 11 of the sheet contactor 10, and is electrically connected to each of the electrodes 210 of the semiconductor package 200 via each of the contact terminals 11. Then, the electrical characteristics of the semiconductor package 200 are tested.

[0031] The chamfered portions 23 are grooves formed near the corners of the storage portion 20a by cutting out portions of the second guide portion 24. As shown in FIG. 4B , the second guide portion 24 and the mounting portion 21, which form two sides of a quadrilateral, intersect at the corners of the storage portion 20a. It is difficult to perform high-precision mechanical processing on corners where two inclined surfaces and a flat surface intersect. However, in this embodiment, the chamfered portions 23 are formed at the four corners of the plate 20, making it easier to process the plate 20.

[0032] The second guide portion 24 is a tapered portion formed on the plate 20, inclined obliquely upward from the XY plane on which the placement portion 21 and the opening 22 are located, so as to expand outward from the plate 20. The second guide portion 24 has a generally quadrilateral shape with two sides extending in the X direction and two sides extending in the Y direction. The second guide portion 24 has a function of guiding the semiconductor package 200, which has been transferred onto the plate 20 and dropped onto the plate 20, into the accommodating portion 20a of the plate 20. Even if the falling direction of the semiconductor package 200 dropped onto the plate 20 is misaligned in the front-to-back or left-to-right direction with respect to the accommodating portion 20a, the second guide portion 24 can guide the semiconductor package 200 into the accommodating portion 20a by utilizing the inclination of the second guide portion 24.

[0033] Perforated portion 25 is a portion that is cut out in a concave shape along the X direction on the downward side of second guide portion 24, approximately in the center of each of two sides extending in the X direction of plate 20. By providing perforated portion 25 in second guide portion 24, when semiconductor package 200 placed on plate 20 is held with tweezers during, for example, a hand test, it becomes easier to insert the tip of the tweezers between the side surface of semiconductor package 200 and second guide portion 24.

[0034] The plate outer periphery 26 is a portion that extends along each of two sides of the plate 20 that extend in the Y direction. A plurality of locking portions 27 and a plurality of restraining portions 28 are formed on the plate outer periphery 26. As shown in FIG. 1A , the plate outer periphery 26 is provided at a position facing a plate mounting portion 33 of the cover 30, which will be described later, and has a shape that corresponds to the inner periphery of the frame portion 31. Therefore, when the plate 20 is placed on the cover 30, the outer periphery of the plate outer periphery 26 is disposed along the inner periphery of the frame portion 31. Therefore, the plate 20 is disposed on the cover 30 in a state where movement in the XY plane is restricted but movement in the up-and-down direction (Z direction) is possible.

[0035] The locking portions 27 are holes that penetrate the plate outer periphery 26 in the Z direction, and two are provided on each plate outer periphery 26 at intervals in the Y direction. The locking portions 27 are used to lock one end of the spring members 40, and their diameter is approximately the same as the wire diameter of the spring members 40. As shown in FIGS. 3A and 3B , a spring accommodating portion 27a is provided on the downward side of the plate outer periphery 26 at the position where the locking portions 27 are formed.

[0036] The spring accommodating portion 27a is a recess provided on the surface (downward side) of the plate outer periphery 26 that faces the plate mounting portion 33, and is a space that accommodates the spring member 40. One end of the spring member 40 accommodated in the spring accommodating portion 27a is inserted into the locking portion 27 and bent and locked on the upper surface of the plate outer periphery 26. The shape and size of the spring accommodating portion 27a are not limited, but it is preferable that the recess be slightly larger than the outer shape of the spring member 40. By arranging the spring accommodating portion 27a in the plate outer periphery 26, it is possible to thin the plate outer periphery 26 at the position where the locking portion 27 is formed, while ensuring the thickness of the plate outer periphery 26 in other portions, thereby ensuring strength.

[0037] The restraining portions 28 are formed on the plate outer peripheral portion 26 and are portions where restraining members 50 are disposed to restrict upward movement of the plate 20. By disposing the restraining members 50 on the restraining portions 28, movement of the plate 20, which is elastically supported by the spring members 40, in the Z direction is restricted. Furthermore, on one plate outer peripheral portion 26, the restraining portions 28 are recessed in an arc shape facing forward, and two restraining portions 28 are provided at intervals along the Y direction. On the other plate outer peripheral portion 26, the restraining portions 28 are recessed in an arc shape facing rearward, and two restraining portions 28 are provided at intervals along the Y direction. Furthermore, the restraining portions 28 are stepped, and a portion of the restraining member 50 is disposed on the upper step. The locations and numbers of the engagement portions 27 and the restraining portions 28 are not limited to those described above.

[0038] The cover 30 is a member that elastically supports the plate 20 so that it can move in the Z direction using the spring members 40. As shown in FIG. 1A, the cover 30 elastically supports the plate 20 using four spring members 40. Note that the number of spring members 40 is not limited to this. As shown in FIGS. 1A and 1B, the cover 30 has a frame portion 31, a cover opening 32, a plate mounting portion 33, an arrangement portion 34, and a fixing hole 35.

[0039] In this specification, "elastically supported" means that the semiconductor package 200 is supported so as to reduce the impact on the semiconductor package 200 when the semiconductor package 200 is dropped from above and brought into contact with the plate 20 in order to place the semiconductor package 200 on the plate 20. This reduces the impact on the semiconductor package 200 compared to when the cover 30 simply fixes and supports the plate 20 with screws or the like. Examples of a configuration that achieves such elastic support include not only the spring member 40 but also an elastic body made of a soft material such as rubber. Furthermore, the sheet contactor 10 is positioned and attached to the lower side of the cover 30, and the sheet contactor 10 and the plate 20 are positioned relative to each other via the cover 30.

[0040] The frame portion 31 is a frame-shaped member that constitutes the outer shape of the cover 30. As shown in Figures 1A, 1B, and 1C, the frame portion 31 is provided with a cover opening 32, a plate mounting portion 33, an arrangement portion 34, and a fixing hole 35. The frame portion 31 accommodates the plate 20 within the cover opening 32 so that the plate 20 is movable in the Z direction, and is fixed to a stiffener 80 by a fixing member 60 via a substrate 70.

[0041] The cover opening 32 is an opening that penetrates the center of the cover 30 in the Z direction and is surrounded by the frame portion 31. As shown in Fig. 1B, the plate 20 is disposed through the cover opening 32, and the inside of the opening 22 of the plate 20 is exposed. Therefore, the plate 20 and the sheet contactor 10 disposed below the cover 30 are partially exposed through the cover opening 32, exposing the support region 12a and the non-support region 12b.

[0042] The plate mounting portion 33 is provided on the frame portion 31 around the cover opening 32 and is a stepped portion for mounting the plate 20. As shown in FIG. 1A, the plate mounting portion 33 is provided at a position one step lower from the upper surface of the frame portion 31 along the front-rear and left-right directions so as to surround the cover opening 32. The outline of the plate mounting portion 33 is substantially the same as the outer shape of the plate 20, allowing the plate 20 to be accommodated. Furthermore, when the plate 20 is mounted, the plate mounting portion 33 faces a portion of the back surface of the plate 20. In this embodiment, as shown in FIGS. 1A and 1B, the plate outer peripheral portion 26 and the plate mounting portion 33 have a shape that partially protrudes in the left-right direction (Y direction). As a result, when the plate 20 is mounted on the cover 30, movement of the plate 20 in the XY plane is restricted, thereby positioning the plate 20.

[0043] The arrangement portion 34 is a portion on the upper surface of the frame portion 31 for arranging the restraining member 50. Threaded holes are formed in the arrangement portion 34, into which the restraining member 50 is screwed and fixed. In this embodiment, two arrangement portions 34 are provided on the front and rear of the cover 30, at positions corresponding to the restraining portions 28 of the plate 20. Each arrangement portion 34 has an arc-shaped recess facing the front-rear direction and a substantially cylindrical portion protruding toward the plate mounting portion 33. The substantially arc-shaped recess and the substantially cylindrical shape of the arrangement portion 34 have a shape and size corresponding to the substantially arc-shaped recess of the restraining portion 28. When the plate 20 is mounted on the cover 30, the arrangement portions 34 and the restraining portions 28 combine to form a substantially circular shape.

[0044] The fixing holes 35 are holes that penetrate the frame portion 31 in the Z direction and into which the fixing members 60 are inserted from above. In this embodiment, two fixing holes 35 are provided near each of the corners on the front and rear of the frame portion 31.

[0045] The spring member 40 is a spirally wound spring and is disposed between the plate mounting portion 33 of the cover 30. The spring member 40 is housed in the spring housing portion 27a of the plate 20, and one end thereof passes through the locking portion 27 formed on the plate outer peripheral portion 26. The passed-through end is bent on the plate outer peripheral portion 26, thereby locking the spring member 40 to the plate 20. The other end of the spring member 40 is disposed opposite the plate mounting portion 33 of the cover 30, and comes into contact with the plate mounting portion 33 when the plate 20 is placed on the cover 30. At this time, the plate mounting portion 33 of the cover 30 and the plate outer peripheral portion 26 overlap in the Z direction.

[0046] The pressing member 50 is disposed in the mounting portion 34 of the cover 30 and interferes with the pressing portion 28 from above, restricting movement of the plate 20 in the Z direction. The specific shape of the pressing member 50 is not limited, but in the example shown in FIG. 1A , the pressing member 50 has a screw shape with a head that interferes with the pressing portion 28 and a thread that screws into a screw hole formed in the mounting portion 34. The head of the pressing member 50 has a diameter that corresponds to the generally concave, arc-shaped shape of the pressing portion 28. As shown in FIG. 1B , when the plate 20 is placed within the frame portion 31 of the cover 30 and the pressing member 50 is threaded into the screw hole of the mounting portion 34, the head of the pressing member 50 interferes with the upper surface of the pressing portion 28, restricting movement of the plate 20 in the Z direction.

[0047] The fixing member 60 is a member that is inserted into the fixing hole 35 and fixes the sheet contactor socket 100 to the stiffener 80 via the substrate 70. The substrate 70 is a generally plate-shaped member that has a plate-shaped portion 71 on one side to which the sheet contactor socket 100 is attached and the stiffener 80 on the other side of the plate-shaped portion 71. Through holes 72 are formed in the substrate 70 at positions corresponding to the fixing holes 35. The stiffener 80 is a generally plate-shaped member that is attached to the side of the substrate 70 opposite to the sheet contactor socket 100 and increases the rigidity of the substrate 70. Screw holes 82 are formed in the stiffener 80 at positions corresponding to the fixing holes 35 of the support plate 81.

[0048] As shown in FIG. 1C , the sheet contactor socket 100 is placed on one side of the substrate 70, the stiffener 80 is placed on the other side of the substrate 70, and the fixing member 60 is inserted into the through hole 72 and fastened to the screw hole 82, thereby fixing the sheet contactor socket 100 and the stiffener 80 to the substrate 70.

[0049] 3A and 3B, a configuration in which the cover 30 elastically supports the plate 20 will be described. As shown in FIG. 3A, one end of the spring member 40 is inserted into and locked in the locking portion 27, and the spring member 40 is disposed within the spring accommodating portion 27a between the rear surface of the plate outer periphery 26 and the plate mounting portion 33. When the semiconductor package 200 is not dropped onto the plate 20, the spring member 40 exerts its biasing force upward, pressing the plate outer periphery 26 of the plate 20 upward. The plate 20 is restricted from moving upward by the pressing member 50 disposed in the pressing portion 28 of the plate outer periphery 26. Therefore, the top surface of the plate outer periphery 26 and the top surface of the frame portion 31 are at approximately the same height.

[0050] 3B, when the semiconductor package 200 is dropped onto the plate 20, the spring member 40 is compressed because a force acting against the upward biasing force is generated by the downward load acting on the plate 20. Then, the spring member 40 is elastically deformed, thereby absorbing the impact caused by the semiconductor package 200 being dropped, and the semiconductor package 200 can be placed in the accommodation portion 20a of the plate 20.

[0051] Next, using Figure 3C, we will explain the movement of electrode 210 guided into through hole 21a by first guide portion 21b when semiconductor package 200 is placed on mounting portion 21. The diagram on the left side of Figure 3C shows a state in which electrode 210 of semiconductor package 200 is inserted off-center into through hole 21a. The diagram on the right side of Figure 3C shows a state in which electrode 210, inserted off-center into through hole 21a, moves along first guide portion 21b and is aligned with through hole 21a.

[0052] As shown in the left diagram of FIG. 3C , the electrode 210 of the semiconductor package 200 comes into contact with the first guide portion 21b at a position offset from the center of the opening of the through hole 21a. At this time, because the first guide portion 21b has a tapered shape that is inclined toward the inside of the through hole 21a, a force acts on the electrode 210 in the direction of the arrow shown in FIG. 3C at the contact point between the electrode 210 and the first guide portion 21b. As a result, as shown in the right diagram of FIG. 3C , the electrode 210 and the semiconductor package 200 move along the inclination of the first guide portion 21b, and the electrode 210 of the semiconductor package 200 is guided to an approximate center position of the through hole 21a. When the electrode 210 of the semiconductor package 200 is guided to an approximate center position of the through hole 21a by the first guide portion 21b, it comes into contact with the contact terminal 11 of the sheet contactor 10, which is located at the approximate center position, and becomes conductive with the contact terminal 11.

[0053] 4A, the mounting portions 21 are provided in the accommodating portions 20a of the plate 20 that accommodate the semiconductor packages 200. The semiconductor packages 200 dropped onto the plate 20 are placed on the mounting areas of the four mounting portions 21. The through holes 21a are arranged so that some of the contact terminals 11 of the sheet contactor 10 arranged on the lower side of the plate 20 are positioned approximately at the center of the through holes 21a. Some of the electrodes 210 of the semiconductor package 200 are inserted into each of the through holes 21a.

[0054] Here, each of the multiple electrodes 210 of the semiconductor package 200 is guided by each of the multiple through holes 21a to approximately the center position of the corresponding through hole 21a. As a result, the multiple electrodes 210 of the semiconductor package 200 located above the opening 22 of the plate 20 also move toward an appropriate position of the sheet contactor 10 exposed from the opening 22. Then, each of the multiple electrodes 210 comes into contact with each of the multiple contact terminals 11 exposed from the opening 22, and becomes conductive.

[0055] In the accommodation section 20a of the plate 20, the placement section 21 on which the semiconductor package 200 can be placed and the opening 22 as a non-placement section on which the semiconductor package 200 is not placed are located on a plane that includes the X and Y directions. This allows the contact terminals 11 carried on the carrying area 12a of the sheet body 12 of the sheet contactor 10 to come into contact with the electrodes 210 of the semiconductor package 200.

[0056] In the present embodiment, the through holes 21a are arranged at the four corners of the generally quadrilateral accommodating portion 20a as shown in FIG. 4A . However, this is not limiting. For example, as long as the semiconductor package 200 can be stably mounted, the through holes 21a may be arranged at at least two opposing corners of the generally quadrilateral accommodating portion 20a, but not at the other two opposing corners. Furthermore, the through holes 21a do not have to be arranged at the corners of the accommodating portion 20a. For example, the generally quadrilateral accommodating portion 20a may have a mounting portion 21 with a plurality of through holes 21a arranged along the entire length or a portion of each of two sides along the X direction, or along the entire length or a portion of each of two sides along the Y direction. Even in this case, arranging the through holes 21a in an array as described above allows the electrodes 210 of the semiconductor package 200 to be guided to appropriate positions where they can contact the contact terminals 11 of the sheet contactor 10.

[0057] The mounting area of ​​the mounting portion 21 in the accommodation section 20a is smaller than the non-mounting area of ​​the opening 22 serving as the non-mounting portion. By making the area of ​​the mounting portion 21 smaller than the opening 22 serving as the non-mounting portion, processing defects such as distortion in the mounting portion 21 when forming the multiple through holes 21a can be suppressed compared to when the area of ​​the mounting portion 21 is increased. Therefore, even if the thickness of the mounting portion 21 is thin, the multiple through holes 21a and first guide portions 21b can be formed in an array in the mounting portion 21. This allows the contact terminals 11 to make good contact with the electrodes 210 even if the amount of protrusion of the contact terminals 11 from the sheet main body 12 is small.

[0058] Next, referring to FIGS. 5A and 5B, a description will be given of the change in state of the sheet contactor socket 100 when the semiconductor package 200 is placed on the plate 20. Because FIGS. 5A and 5B show an XZ cross section at the center of the pressing member 50, only a portion of the lower end of the spring member 40, which is located behind the pressing member 50, is shown. FIG. 5A is a cross-sectional view of one embodiment of the sheet contactor socket 100 with the semiconductor package 200 placed on the plate 20, showing the state just before the semiconductor package 200 drops from the plate 20 and is placed on the plate 20. In FIG. 5A, the plate 20 is floating upward relative to the cover 30 due to the elastic force of the spring member 40. In this state, the electrodes 210 of the semiconductor package 200 are inserted into the through-holes 21a of the mounting portion 21 of the plate 20, but are not in contact with the contact terminals 11 of the sheet contactor 10.

[0059] 5B is a cross-sectional view of one embodiment of the sheet contactor socket 100 with the semiconductor package 200 placed on the plate 20, illustrating a state of the sheet contactor socket 100 different from that shown in FIG. 5A. FIG. 5B illustrates a state in which the semiconductor package 200 is placed on the plate 20 and the spring member 40 is compressed by the load of the semiconductor package 200. In this state, the plate 20 moves downward as the spring member 40 is compressed, and the electrodes 210 of the semiconductor package 200 come into contact with the contact terminals 11 of the sheet contactor 10, enabling a continuity test. Note that the plate 20 may be brought into a sunken state by pressing the plate 20 and / or the semiconductor package 200 with a handler device or the like.

[0060] 5A and 5B, when plate 20 is in a floating state, restraining member 50 presses down on restraining portion 28 of plate 20 from above, but when plate 20 is in a submerged state, restraining member 50 is separated from restraining portion 28 of plate 20. In this way, if cover 30 were to support plate 20 using spring member 40 alone, plate 20 would be in a floating state and would become unstable, so restraining member 50 is a member that restricts plate 20 so that it can move downward but cannot move upward.

[0061] 5C is an enlarged view showing the contact portion between the electrode 210 of the semiconductor package 200 in FIG. 5B and the contact terminal 11 of the sheet contactor 10. As shown in FIG. 5C, the contact terminal 11 of the sheet contactor 10 contacts the electrode 210 of the semiconductor package 200 both in the mounting portion 21 of the plate 20 and in the opening 22.

[0062] Although the embodiments and modifications of the present invention have been described above with reference to the drawings, these are merely examples of the present invention, and various configurations other than those described above can also be adopted.

[0063] According to the present specification, there is provided a sheet contactor socket having the following configuration. (Aspect 1) The seat contactor socket of aspect 1 is a plate having a receiving portion located above a sheet contactor having a plurality of contact terminals and capable of receiving a semiconductor package having a plurality of contact portions that contact each of the plurality of contact terminals; a cover that elastically supports the plate; the accommodation section includes a placement section on which the semiconductor package can be placed and which has guide sections that guide the contact sections to positions where the contact sections can come into contact with the contact terminals, and a non-placement section on which the semiconductor package is not placed; The mounting area of ​​the mounting section in the accommodation section is smaller than the non-mounting area of ​​the non-mounting section on which the semiconductor package is not mounted.

[0064] According to the above-described aspect, when the semiconductor package is placed on the plate, the plate is elastically supported by the cover, so that the elasticity of the plate absorbs the impact, thereby reducing the impact on the semiconductor package. Furthermore, since the mounting area of ​​the mounting part is smaller than the non-mounting area, processing defects can be suppressed even if the thickness of the mounting part is reduced.

[0065] (Aspect 2) In the sheet contactor socket of aspect 2, the non-mounting area has an opening, and the contact terminal and the contact portion can come into contact with each other even within the opening.

[0066] According to the above-described aspect, the contact terminals of the sheet contactor and the contact portions of the semiconductor package are brought into contact with each other through the openings even in the non-mounting area, so that the area of ​​the mounting portion can be reduced and processing defects can be suppressed.

[0067] (Aspect 3) In the sheet contactor socket of aspect 3, the placing portion has a first guide portion that guides the plurality of contact portions of the semiconductor package.

[0068] According to the above-described aspect, it is possible to easily align the pins of the semiconductor package when inserting them into the holes in the mounting portion of the plate.

[0069] (Aspect 4) In a sheet contactor socket of a fourth aspect, the guide portion has a second guide portion that guides the semiconductor package to the placing portion.

[0070] According to the above-described aspect, when the semiconductor package is placed on the plate of the sheet contactor socket, it is easy to align the semiconductor package with the placement portion of the plate.

[0071] (Aspect 5) In a fifth aspect of the sheet contactor socket, the area of ​​the mounting portion of the plate is 0.1 times or less the area of ​​the non-mounting portion.

[0072] According to the above-described aspect, since the area of ​​the mounting portion is small, it is possible to easily process the mounting portion of the plate.

[0073] (Aspect 6) In a sixth aspect of the sheet contactor socket, the semiconductor package is quadrilateral in shape, and the mounting portion of the plate is capable of mounting at least two corners of the semiconductor package.

[0074] According to the above-described aspect, even if the area of ​​the mounting portion is small, the mounting portion can easily support the semiconductor package.

[0075] (Aspect 7) In the sheet contactor socket of aspect 7, the plurality of contact terminals of the sheet contactor include conductive particles.

[0076] According to the above-described aspect, the movement of the seat contactor in the vertical direction is more limited, making it easier to obtain the advantageous effects of this embodiment.

[0077] (Aspect 8) In the sheet contactor socket of aspect 8, the cover elastically supports the plate by means of a spring member.

[0078] According to the above-described embodiment, when the semiconductor package is placed on the plate, the shock that the semiconductor package receives from the spring member can be significantly reduced.

[0079] (Aspect 9) The seat contactor socket of aspect 9 includes: a sheet contactor having a plurality of contact terminals; a plate having a housing portion capable of housing a semiconductor package having a plurality of contact portions that come into contact with the plurality of contact terminals; a cover that elastically supports the plate, the accommodation section has a placement section on which the semiconductor package can be placed and which has guide sections that guide the contact sections to positions where the contact sections can come into contact with the contact terminals, and a non-placement section on which the semiconductor package is not placed; The mounting area of ​​the mounting section in the accommodation section is smaller than the non-mounting area of ​​the non-mounting section on which the semiconductor package is not mounted.

[0080] According to the above-described aspect, when the semiconductor package is placed on the plate, the plate is elastically supported by the cover, so that the elasticity of the plate absorbs the impact, thereby reducing the impact on the semiconductor package. Furthermore, since the mounting area of ​​the mounting part is smaller than the non-mounting area, processing defects can be suppressed even if the thickness of the mounting part is reduced. [Explanation of symbols]

[0081] 100...Sheet contactor socket 200...Semiconductor package 210...Electrode (contact part) 10...Sheet contactor 20...Plate 30...Cover 40...Spring member 11...Contact terminal 12a...Supporting region 12b...Non-supported region 20a...Storage section 21...Placement section 21a...Through hole 21b...First guide part 22...Opening

Claims

1. a plate having a receiving portion located above a sheet contactor having a plurality of contact terminals and capable of receiving a semiconductor package having a plurality of contact portions that contact each of the plurality of contact terminals; a cover that elastically supports the plate; the accommodation section includes a placement section on which the semiconductor package can be placed and which has guide sections that guide the contact sections to positions where the contact sections can come into contact with the contact terminals, and a non-placement section on which the semiconductor package is not placed; A sheet contactor socket, wherein a mounting area of ​​the mounting portion in the accommodation portion is smaller than a non-mounting area of ​​a non-mounting portion on which the semiconductor package is not mounted.

2. 2. The sheet contactor socket according to claim 1, wherein the non-mounting area has an opening, and the contact terminal and the contact portion can be in contact with each other even within the opening.

3. 2. The sheet contactor socket according to claim 1, wherein the mounting portion has a first guide portion for guiding the plurality of contact portions of the semiconductor package.

4. 2. The sheet contactor socket according to claim 1, wherein the guide portion has a second guide portion that guides the semiconductor package to the placing portion.

5. 2. The sheet contactor socket according to claim 1, wherein the area of ​​the mounting portion of the plate is 0.1 times or less the area of ​​the non-mounting portion.

6. 2. The sheet contactor socket according to claim 1, wherein the semiconductor package is quadrilateral-shaped, and the mounting portion is capable of mounting at least two corners of the semiconductor package.

7. The seat contactor socket of claim 1 , wherein the plurality of contact terminals of the seat contactor include conductive particles.

8. 8. The sheet contactor socket according to claim 1, wherein the cover elastically supports the plate by means of a spring member.

9. a sheet contactor having a plurality of contact terminals; a plate having a housing portion capable of housing a semiconductor package having a plurality of contact portions that come into contact with the plurality of contact terminals; a cover that elastically supports the plate, the accommodation section has a placement section on which the semiconductor package can be placed and which has guide sections that guide the contact sections to positions where the contact sections can come into contact with the contact terminals, and a non-placement section on which the semiconductor package is not placed; A sheet contactor socket, wherein a mounting area of ​​the mounting portion in the accommodation portion is smaller than a non-mounting area of ​​a non-mounting portion on which the semiconductor package is not mounted.

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