Light irradiation device

Abstract

To provide a light irradiation device that is capable of suppressing in-plane nonuniformity of accumulated light quantity in a workpiece while allowing the device to be downsized.SOLUTION: A light irradiation device according to an embodiment comprises: a discharge lamp that applies light onto a workpiece; a first light-shielding section that swings between a first position blocking light traveling from the discharge lamp toward the workpiece and a second position allowing the light to pass; and a second light-shielding section that swings between the first position and a third position allowing the light to pass. By alternately swinging the first light-shielding section and the second light-shielding section, transmission and blocking of the light are switched.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] FIELD An embodiment of the present invention relates to a light irradiation device. [Background technology]

[0002] There are light irradiation devices that irradiate light onto an object to process it. For example, light irradiation devices have been proposed that irradiate ultraviolet light onto an ultraviolet curable resin, an ultraviolet curable adhesive, an adhesive sheet containing an ultraviolet curable resin, or the like to cure the ultraviolet curable resin or the ultraviolet curable adhesive or adjust the adhesive strength of the adhesive sheet.

[0003] If the cumulative amount of ultraviolet light on the object to be treated is uneven across its surface, it may result in unevenness in the degree of curing or adhesive strength of the object, potentially resulting in a decrease in the quality of the treatment. For this reason, a light irradiation device has been proposed in which the object to be treated is moved in one direction and irradiated with ultraviolet light from a mercury lamp while moving in one direction. This arrangement makes it possible to prevent unevenness in the cumulative amount of ultraviolet light on the object to be treated.

[0004] However, when the object to be treated is moved in order to irradiate it with ultraviolet light, the size of the light irradiation device increases in the direction of movement of the object to be treated. Therefore, there has been a demand for the development of a light irradiation device that can suppress the occurrence of an in-plane distribution in the integrated light amount of light on the object to be treated and that can also be made smaller. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] Patent No. 5324130 Summary of the Invention [Problem to be solved by the invention]

[0006] The problem that the present invention aims to solve is to provide a light irradiation device that can suppress the occurrence of an in-plane distribution in the cumulative light amount of light on the object to be treated and that can facilitate miniaturization of the device. [Means for solving the problem]

[0007] The light irradiation device according to the embodiment includes a discharge lamp that irradiates light onto an object to be treated; a first light-shielding part that oscillates between a first position that blocks light from the discharge lamp toward the object to be treated and a second position that transmits the light; and a second light-shielding part that oscillates between the first position and a third position that transmits the light. The first light-shielding part and the second light-shielding part alternately oscillate to switch between transmitting the light and blocking the light. [Effects of the Invention]

[0008] According to an embodiment of the present invention, it is possible to provide a light irradiation device that can suppress the occurrence of an in-plane distribution in the integrated light amount of light on the object to be treated and that can achieve miniaturization of the device. [Brief explanation of the drawings]

[0009] [Figure 1] FIG. 2 is a schematic plan view illustrating the object to be processed. [Figure 2] FIG. 2 is a schematic cross-sectional view illustrating the light irradiation device according to the present embodiment. [Figure 3] 10(a) to 10(c) are schematic views illustrating the swing movement of a light blocking portion according to a comparative example. [Figure 4] 6(a) to 6(c) are schematic views illustrating the swing movement of a pair of light blocking parts according to the present embodiment. DETAILED DESCRIPTION OF THE INVENTION

[0010] Hereinafter, embodiments will be illustrated with reference to the drawings. In the drawings, like components are designated by like reference numerals and detailed descriptions thereof will be omitted where appropriate. The light irradiation device according to the present embodiment can be used, for example, to heat an object to be treated by irradiating infrared rays or far-infrared rays, to cure an ultraviolet-curable resin or an ultraviolet-curable adhesive by irradiating ultraviolet rays, to adjust the adhesive strength of an adhesive sheet containing an ultraviolet-curable resin, or to sterilize an object to be treated. The wavelength of the irradiated light can be changed as appropriate depending on the application of the light irradiation device, the purpose of the treatment, etc.

[0011] Here, as an example, a light irradiation device that irradiates an adhesive sheet provided on a semiconductor wafer with ultraviolet light to reduce the adhesive strength of the adhesive sheet will be described. FIG. 1 is a schematic plan view illustrating an object 100 to be processed. As shown in FIG. 1, the processing object 100 includes a frame 101 , a semiconductor wafer 102 , and an adhesive sheet 103 .

[0012] The frame 101 has a plate shape and can be made of a material that can transmit the ultraviolet light 200. The frame 101 is made of, for example, quartz glass. The semiconductor wafer 102 can be provided in the central region of the frame 101. The semiconductor wafer 102 has a plurality of chip-shaped semiconductor elements that have been separated by dicing. The adhesive sheet 103 is provided between the frame 101 and the semiconductor wafer 102. The adhesive sheet 103 is adhered to the surface of the semiconductor wafer 102 that faces the frame 101. The adhesive sheet 103 contains an ultraviolet-curable resin.

[0013] FIG. 2 is a schematic cross-sectional view illustrating the light irradiation device 1 according to this embodiment. As shown in FIG. 2, the light irradiation device 1 includes, for example, a housing 2, a processing section 3, a reflecting section 4, a light source section 5, a shutter 6, an exhaust section 7, and a controller 8.

[0014] The housing 2 is, for example, box-shaped and has an internal space for accommodating a processing unit 3, a reflecting unit 4, a light source unit 5, a shutter 6, an exhaust unit 7, and a controller 8. The internal space of the housing 2 can be divided into, for example, three levels. For example, as shown in FIG. 2, the lowest level 2a of the housing 2 can be provided with the exhaust unit 7 and the controller 8. The level 2b above level 2a can be provided with the light source unit 5 and the shutter 6. The highest level 2c of the housing 2 can be provided with the processing unit 3 and the reflecting unit 4.

[0015] The exterior of the housing 2 may be, for example, a rectangular parallelepiped. The housing 2 has a framework structure using, for example, structural steel or square pipes. The housing 2 may be made of, for example, metal.

[0016] An opening / closing door 2d for carrying the object to be treated 100 into and out of the container 31 of the treatment section 3 can be provided on the side of the housing 2. A cover, for example, can be provided on the outer surface of the housing 2. In addition, doors for performing maintenance on the treatment section 3, the reflecting section 4, the light source section 5, the shutter 6, the exhaust section 7, the controller 8, and the like can also be provided on the outer surface of the housing 2 as appropriate. The opening / closing door 2d, the cover, the door for performing maintenance, and the like can be made of, for example, metal. If the opening / closing door 2d, the cover, the door for performing maintenance, and the like are provided, it is possible to prevent ultraviolet light 200 irradiated from the light source section 5 from leaking outside the housing 2. Furthermore, the bottom surface of the housing 2 can be provided with legs 2e such as adjuster feet.

[0017] The processing section 3 includes, for example, a container 31, a window 32, a mounting section 33, and a gas supply section . The container 31 is provided, for example, at the end of the reflecting unit 4 opposite to the light source unit 5 side. The container 31 is, for example, box-shaped. The container 31 has a space inside for storing the object to be treated 100. An opening / closing door 31a for carrying the object to be treated 100 into and out of the container 31 can be provided on the side of the container 31. The opening / closing door 31a can be provided in a position opposite the opening / closing door 2d. The container 31 and the opening / closing door 31a can be made of, for example, metal. If the container 31 and the opening / closing door 31a are provided, the ultraviolet light 200 irradiated onto the object to be treated 100 can be irradiated into the inside of the housing 2, and the atmosphere in which the object to be treated 100 is treated can be made different from the atmosphere inside the housing 2. The surface of the container 31 on the side of the reflecting section 4 is provided with holes 31b through which the ultraviolet light 200 emitted from the light source section 5 passes.

[0018] The window 32 has a plate-like shape and closes the hole 31b of the container 31. The window 32 can be provided on the outside of the container 31, inside the hole 31b, or inside the container 31. The window 32 can be made of a material that can transmit the ultraviolet light 200 irradiated from the light source unit 5. The window 32 is made of, for example, quartz glass.

[0019] The placing section 33 is provided inside the container 31. The placing section 33 is provided around the hole 31b of the container 31. The object to be treated 100 is placed on the placing section 33. The periphery of the object to be treated 100 (frame 101) is supported by the placing section 33. When the object to be treated 100 supported by the placing section 33 is viewed from the direction from the object to be treated 100 toward the placing section 33, the placing section 33 is provided at a position where it does not overlap at least the semiconductor wafer 102. Therefore, ultraviolet light 200 transmitted through the window 32 can be irradiated via the frame 101 onto the adhesive sheet 103 adhered to the surface of the semiconductor wafer 102 facing the frame 101.

[0020] Here, depending on the ultraviolet-curable resin contained in the adhesive sheet 103, the processing time may be shortened by irradiating the ultraviolet rays 200 in an inert gas atmosphere. Therefore, the light irradiation device 1 is provided with a gas supply unit 34 together with the container 31.

[0021] The gas supply unit 34 is connected to the container 31. The gas supply unit 34 supplies an inert gas to the container 31 and the space defined by the window 32. The inert gas is, for example, nitrogen gas or a rare gas.

[0022] The gas supply unit 34 includes, for example, a gas source 34a, an opening / closing valve 34b, and a control valve 34c. The gas source 34a may be a high-pressure cylinder containing an inert gas, factory piping, or the like.

[0023] The on-off valve 34b switches between starting and stopping the supply of the inert gas. The control valve 34c controls at least one of the flow rate and pressure of the inert gas supplied to the space defined by the container 31 and the window 32. The control valve 34c may also have the function of the on-off valve 34b. When the control valve 34c has the function of the on-off valve 34b, the on-off valve 34b can be omitted.

[0024] As will be described later, the light source unit 5 includes a discharge lamp 51. The discharge lamp 51 radiates ultraviolet rays 200 radially in all directions, but the intensity of the ultraviolet rays 200 at the irradiation position decreases as the distance to the irradiation position increases. Therefore, as shown in FIG. 2, the intensity of the ultraviolet rays 200 directly incident on the adhesive sheet 103 adhered to the central region of the semiconductor wafer 102 is higher than the intensity of the ultraviolet rays 200 directly incident on the adhesive sheet 103 adhered to the peripheral region of the semiconductor wafer 102. Furthermore, the discharge lamp 51 has a shape that extends in one direction. Therefore, a linear region where the intensity of the directly incident ultraviolet rays 200 is highest is generated in the central region of the adhesive sheet 103 adhered to the semiconductor wafer 102.

[0025] That is, when the ultraviolet rays 200 are directly incident on the adhesive sheet 103 adhered to the semiconductor wafer 102, the intensity of the ultraviolet rays 200 incident on the adhesive sheet 103 varies greatly. When the intensity of the incident ultraviolet rays 200 varies greatly, the adhesive strength of the adhesive sheet 103 varies greatly. Therefore, there is a risk that the individual chip-shaped semiconductor elements may easily fall off the adhesive sheet 103 or may be difficult to separate from the adhesive sheet 103.

[0026] Furthermore, when the discharge lamp 51 of the light source unit 5 is turned on, heat is generated along with ultraviolet rays 200. The generated heat is irradiated from the discharge lamp 51 as infrared rays (heat rays) 201. The infrared rays 201 are also irradiated radially in all directions from the discharge lamp 51. Furthermore, the shorter the distance to the irradiation position, the higher the intensity of the infrared rays 201 at the irradiation position. Therefore, there is a risk that the temperature of the adhesive sheet 103 will locally increase in the central region of the adhesive sheet 103 adhered to the semiconductor wafer 102. If the temperature of the adhesive sheet 103 locally increases, there is a risk that the adhesive sheet 103 will locally thermally deform. If the adhesive sheet 103 locally thermally deforms, it may be difficult to separate the semiconductor element adhered to the thermally deformed portion.

[0027] Therefore, the light irradiation device 1 is provided with a reflecting section 4. The reflecting section 4 is cylindrical and is provided between the container 31 (processing object 100) and the light source section 5 (discharge lamp 51). Both ends of the reflecting section 4 are open. One opening of the reflecting section 4 faces the window 32 of the processing section 3. The other opening of the reflecting section 4 faces the discharge lamp 51 of the light source section 5 via a hole 2c1 provided in the bottom plate of the story 2c of the housing 2.

[0028] 2, a portion of the ultraviolet light 200 emitted from the discharge lamp 51 and directed toward the processing object 100 is incident on the inner wall of the reflecting section 4 through the hole 2c1, reflected by the inner wall of the reflecting section 4, and then incident on the processing object 100. The reflected ultraviolet light 200 can be made to impinge on substantially the entire area of ​​the adhesive sheet 103 adhered to the semiconductor wafer 102. As a result, the aforementioned variation in the intensity of the ultraviolet light 200 on the adhesive sheet 103 can be alleviated.

[0029] The inner wall of the reflective portion 4 can be made of a material that has a high reflectivity for ultraviolet light 200. For example, the reflective portion 4 can be made of an aluminum alloy, or a film or layer containing an aluminum alloy can be provided on the inner wall of the reflective portion 4, or a white film or layer can be provided on the inner wall of the reflective portion 4.

[0030] Furthermore, the inner wall of the reflecting section 4 can be provided with irregularities. For example, the inner wall of the reflecting section 4 can be embossed. If the inner wall of the reflecting section 4 is provided with irregularities, the ultraviolet rays 200 incident on the inner wall of the reflecting section 4 can be diffused. This makes it easy to make the reflected ultraviolet rays 200 incident approximately evenly on the entire area of ​​the adhesive sheet 103 adhered to the semiconductor wafer 102. If the reflected ultraviolet rays 200 are incident approximately evenly on the adhesive sheet 103, the aforementioned variation in the intensity of the ultraviolet rays 200 on the adhesive sheet 103 can be further alleviated.

[0031] Furthermore, if the reflecting portion 4 is provided, part of the infrared rays 201 emitted from the discharge lamp 51 can be reflected by the reflecting portion 4 and made to be incident on the entire area of ​​the adhesive sheet 103. Therefore, it is possible to prevent the temperature of the adhesive sheet 103 from increasing locally and the adhesive sheet 103 from being thermally deformed locally.

[0032] The temperature rise of the discharge lamp 51 can be suppressed by the exhaust section 7, which will be described later, and therefore it is possible to reduce the overall intensity of the infrared rays 201 incident on the adhesive sheet 103. Therefore, if the intensity of the infrared rays 201 incident on the adhesive sheet 103 is not locally high, it is possible to suppress thermal deformation of the adhesive sheet 103.

[0033] Furthermore, if the inner wall of the reflecting portion 4 is provided with irregularities, the infrared rays 201 incident on the inner wall of the reflecting portion 4 can be diffused. This makes it easy to make the reflected infrared rays 201 incident approximately evenly on the entire area of ​​the adhesive sheet 103. If the reflected infrared rays 201 are incident approximately evenly on the adhesive sheet 103, it is possible to effectively prevent the adhesive sheet 103 from being locally thermally deformed.

[0034] The light source unit 5 faces the semiconductor wafer 102 of the processing object 100 placed on the placement unit 33 via the reflector 4 and the window 32 of the processing unit 3. The light source unit 5 includes, for example, a discharge lamp 51 and a reflector 52 . The discharge lamp 51 irradiates the workpiece 100 with ultraviolet light 200. The discharge lamp 51 is provided inside the reflector 52. There are no particular limitations on the type of discharge lamp 51, as long as it irradiates ultraviolet light with a wavelength that can reduce the adhesive strength of the adhesive sheet 103. The discharge lamp 51 can be, for example, a low-pressure mercury lamp. The discharge lamp 51 has a shape that extends in one direction. The light-emitting length of the discharge lamp 51 can be longer than the planar dimensions of the semiconductor wafer 102. For example, if the diameter of the semiconductor wafer 102 is 300 mm, the light-emitting length of the discharge lamp 51 can be approximately 400 mm.

[0035] The reflector 52 surrounds the discharge lamp 51 and is open on the side facing the object 100 to be treated. The inner surface of the reflector 52 is inclined in a direction away from the discharge lamp 51 as it approaches the opening side of the reflector 52. The inner surface of the reflector 52 may be, for example, a curved surface. The inner surface of the reflector 52 may be, for example, a parabolic surface. The inner surface of the reflector 52 may be formed from a material that has a high reflectivity for ultraviolet rays 200. For example, the reflector 52 may be formed from an aluminum alloy, or a film or layer containing an aluminum alloy may be provided on the inner wall of the reflector 52, or a white film or layer may be provided on the inner wall of the reflector 52.

[0036] 2, the provision of the reflector 52 makes it possible to reflect the ultraviolet rays 200 that are irradiated from the discharge lamp 51 and do not travel toward the reflecting unit 4 and the object to be treated 100 so that they travel toward the reflecting unit 4 and the object to be treated 100. This improves the utilization efficiency of the ultraviolet rays 200 irradiated from the discharge lamp 51.

[0037] Here, when the processed object 100 is carried out of the container 31, it is necessary to prevent the ultraviolet rays 200 from being irradiated into the inside of the container 31. In this case, if the discharge lamp 51 is turned off, the ultraviolet rays 200 will no longer be irradiated into the inside of the container 31. However, if this is done, it will be necessary to turn the discharge lamp 51 back on when processing the next object 100. If the discharge lamp 51 is turned on again, it will take a certain time for the discharge to stabilize, and the processing time will be longer.

[0038] Therefore, the light irradiation device 1 is provided with a shutter 6. The shutter 6 switches between transmitting and blocking the ultraviolet light 200 irradiated from the light source unit 5 (discharge lamp 51) toward the reflector unit 4 (processing object 100).

[0039] 2, a pair of shutters 6 can be provided. When viewed from a direction along the central axis (tube axis) of the discharge lamp 51, the pair of shutters 6 face each other across the light source unit 5. The pair of shutters 6 are provided at positions symmetrical to each other with respect to the central axis of the discharge lamp 51.

[0040] The shutter 6 includes, for example, a light blocking portion 61, an arm 62, a rotation shaft 63, and a drive portion 64. The light-shielding portion 61 has, for example, a plate shape. When viewed from a direction along the central axis of the discharge lamp 51, the light-shielding portion 61 has a shape that curves outward from the discharge lamp 51. When viewed from a direction along the central axis of the discharge lamp 51, the outline of the outer surface of the light-shielding portion 61 can be, for example, a part of a circle.

[0041] The light-shielding portion 61 can be made of a material that can block the ultraviolet light 200 emitted from the light source portion 5. The light-shielding portion 61 is made of a metal such as stainless steel or an aluminum alloy, for example.

[0042] If the light-shielding section 61 can block the ultraviolet light 200 emitted from the light source section 5, the discharge lamp 51 can be kept lit when the processed object 100 is carried out of the container 31. Therefore, the processing time when processing a plurality of objects 100 sequentially can be shortened.

[0043] When viewed from a direction along the central axis of the discharge lamp 51, the arm 62 has a shape that is curved outward from the discharge lamp 51. The light-shielding portion 61 is provided on the outer surface of the arm 62. The arm 62 can be made of a metal such as an aluminum alloy, for example.

[0044] When viewed from the direction along the central axis of the discharge lamp 51, the rotation shaft 63 is provided near the end of the arm 62 on the opposite side from the discharge lamp 51. The rotation shaft 63 is columnar and extends in the direction along the central axis of the discharge lamp 51.

[0045] The drive unit 64 is connected to the rotation shaft 63. The drive unit 64 swings the light-shielding unit 61 via the rotation shaft 63 and the arm 62, thereby switching between transmitting and blocking the ultraviolet light 200 irradiated from the light source unit 5 (discharge lamp 51) toward the reflector 4 (processing object 100). The drive unit 64 may include, for example, a control motor such as a servo motor, an air cylinder, a hydraulic cylinder, or a motor and crank mechanism. When the light-shielding unit 61 swings, the tip of the light-shielding unit 61 swings in an arc around the rotation shaft 63.

[0046] One of the shading parts 61 (corresponding to an example of a first shading part) oscillates between a first position where it blocks ultraviolet rays 200 from the discharge lamp 51 toward the object to be treated 100, and a second position where it transmits the ultraviolet rays 200. The other light-shielding portion 61 (corresponding to an example of a second light-shielding portion) swings and moves between a first position and a third position where the ultraviolet light 200 is transmitted.

[0047] One light-shielding portion 61 and the other light-shielding portion 61 alternately swing and move, thereby switching between transmitting ultraviolet light 200 and blocking ultraviolet light 200. The details of the swinging movement of the light blocking portion 61 will be described later.

[0048] In addition, although the above example illustrates a case where a pair of light-shielding parts 61 having the same size and shape are provided, two light-shielding parts 61 having different sizes and shapes may also be provided. In other words, it is sufficient for the light-shielding part 61 to be able to block ultraviolet rays 200 directed from the discharge lamp 51 toward the treatment object 100. However, if the pair of light-shielding portions 61 have the same dimensions and shape, it is possible to standardize the elements that make up the shutter 6. Therefore, it is possible to reduce the manufacturing cost of the light irradiation device 1.

[0049] The exhaust unit 7 exhausts gas from the space surrounded by the pair of shutters 6 (light-shielding units 61), thereby suppressing a temperature rise in the discharge lamp 51. If the temperature rise in the discharge lamp 51 can be suppressed, the intensity of the infrared rays 201 emitted from the discharge lamp 51 can be reduced. Therefore, the thermal deformation caused by the temperature rise in the adhesive sheet 103 described above can be suppressed.

[0050] The exhaust unit 7 includes, for example, a duct 71 and an exhaust pump 72 . One end of the duct 71 communicates with a space surrounded by a pair of shutters 6 (light-shielding portions 61). The other end of the duct 71 is connected to an exhaust pump 72. The duct 71 may be, for example, a flexible duct.

[0051] The exhaust pump 72 exhausts gas from the space surrounded by the pair of shutters 6 (light-shielding portions 61) through the duct 71. At this time, the exhaust pump 72 can also exhaust gas from the internal space of the reflecting portion 4. The exhaust pump 72 can be, for example, a blower.

[0052] Furthermore, a vent hole can be provided on the side surface of the housing 2 or the like to introduce gas in the atmosphere where the light irradiation device 1 is installed into the housing 2. The vent hole can be provided with a filter or the like to capture dust and the like contained in the gas.

[0053] The controller 8 includes, for example, a calculation unit such as a CPU (Central Processing Unit) and a storage unit such as a memory. The controller 8 can be, for example, a computer. The controller 8 controls the operation of each element provided in the light irradiation device 1 based on a control program stored in the storage unit. The controller 8 can also include, for example, a lighting circuit and a power supply for the discharge lamp 51.

[0054] Next, the swinging movement of the light blocking portion 61 will be further described. 3(a) to 3(c) are schematic views illustrating the swing movement of the light blocking portion 61 according to the comparative example. The swing movement of the light blocking portion 61 according to the comparative example is a case where one of the pair of shutters 6 described above is used to switch between transmitting and blocking ultraviolet light 200. 3(a) to 3(c) illustrate only the light-shielding portion 61. Furthermore, the reflection of ultraviolet rays 200 and infrared rays 201 by the reflector 4 and the reflector 52 described above is also omitted.

[0055] 3(a), when the object 100 to be treated is carried into the treatment section 3, the light-shielding section 61 swings from side A to side B, and the light-shielding section 61 is provided between the discharge lamp 51 and the object 100 to be treated. Therefore, the ultraviolet rays 200 and infrared rays 201 irradiated from the discharge lamp 51 are blocked by the light-shielding section 61.

[0056] Next, to start processing the processing object 100, as shown in Fig. 3(b), the light-shielding portion 61 swings from side B to side A, and the light-shielding portion 61 is removed from between the discharge lamp 51 and the processing object 100. Therefore, the ultraviolet rays 200 emitted from the discharge lamp 51 can be irradiated onto the adhesive sheet 103 of the processing object 100, and the adhesive strength of the adhesive sheet 103 can be reduced.

[0057] 3(c), in order to finish the treatment, the light-shielding part 61 swings from side A to side B, and the light-shielding part 61 is provided between the discharge lamp 51 and the treatment object 100. Therefore, the ultraviolet rays 200 and infrared rays 201 irradiated from the discharge lamp 51 are blocked by the light-shielding part 61.

[0058] The processed object 100 is carried out from the light irradiation device 1, and the next object 100 to be processed is carried into the processing section 3. Thereafter, by repeating the procedures of Figures 3(a) to 3(c), it is possible to process a plurality of objects 100 in sequence. Even in this way, the discharge lamp 51 can be kept lit, so that the processing time when processing a plurality of objects 100 in sequence can be shortened.

[0059] However, when starting the processing of the object 100, as shown in FIG. 3(b), the adhesive sheet 103 on side B is irradiated with ultraviolet light 200 and infrared light 201 before the adhesive sheet 103 on side A is irradiated with ultraviolet light 200 and infrared light 201.

[0060] Furthermore, when the process is terminated, as shown in FIG. 3(c), the ultraviolet rays 200 and infrared rays 201 irradiated onto the adhesive sheet 103 on side B are blocked after the ultraviolet rays 200 and infrared rays 201 irradiated onto the adhesive sheet 103 on side A.

[0061] Therefore, the integrated light amount of ultraviolet rays 200 and the integrated light amount of infrared rays 201 in adhesive sheet 103 are greater on side B than on side A. This may cause an in-plane distribution in the adhesive strength of treated adhesive sheet 103, or cause thermal deformation on side B of adhesive sheet 103.

[0062] Furthermore, in recent years, there has been a trend toward shorter irradiation times of the ultraviolet rays 200 onto the adhesive sheet 103. For example, the irradiation time of the ultraviolet rays 200 onto the adhesive sheet 103 may become 10 seconds or less. When the irradiation time of the ultraviolet rays 200 onto the adhesive sheet 103 becomes shorter, the variation in the adhesive strength of the adhesive sheet 103 tends to become even greater.

[0063] 4(a) to 4(c) are schematic views illustrating the swing movement of a pair of light blocking portions 61 according to this embodiment. 4(a) to 4(c) illustrate only the light-shielding portion 61a provided on side A and the light-shielding portion 61b provided on side B. Also, the reflection of ultraviolet rays 200 and infrared rays 201 by the reflector 4 and the reflector 52 described above is omitted from the illustration.

[0064] 4(a), when the object 100 to be treated is carried into the treatment section 3, the light-shielding portion 61b provided on the B side swings from the B side toward the A side, and the light-shielding portion 61b is provided between the discharge lamp 51 and the object 100 to be treated. Therefore, the ultraviolet rays 200 and the infrared rays 201 irradiated from the discharge lamp 51 are blocked by the light-shielding portion 61b.

[0065] Next, to start processing the processing object 100, as shown in Fig. 4(b), the light-shielding portion 61b provided on the B side swings from the A side toward the B side, and the light-shielding portion 61b is removed from between the discharge lamp 51 and the processing object 100. Therefore, the ultraviolet light 200 emitted from the discharge lamp 51 can be irradiated onto the adhesive sheet 103 of the processing object 100, and the adhesive strength of the adhesive sheet 103 can be reduced.

[0066] Next, to finish the treatment, as shown in Fig. 4(c), the light-shielding part 61a provided on the A side swings from the A side to the B side, and the light-shielding part 61a is provided between the discharge lamp 51 and the treatment object 100. Therefore, the ultraviolet rays 200 and the infrared rays 201 irradiated from the discharge lamp 51 are blocked by the light-shielding part 61a.

[0067] The processed object 100 is carried out from the light irradiation device 1, and the next object 100 to be processed is carried into the processing section 3. Thereafter, the pair of light-shielding sections 61a, 61b are alternately oscillated to switch between transmitting and blocking the ultraviolet light 200 and the infrared light 201, thereby processing the plurality of objects 100 in sequence. In this way, the discharge lamp 51 can be kept lit, thereby shortening the processing time when processing the plurality of objects 100 in sequence.

[0068] Furthermore, when starting the processing of the object 100 to be processed, as shown in FIG. 4(b), the adhesive sheet 103 on side A is irradiated with ultraviolet light 200 and infrared light 201 before the adhesive sheet 103 on side B.

[0069] Furthermore, when the process is terminated, as shown in FIG. 4(c), the ultraviolet rays 200 and infrared rays 201 irradiated onto the adhesive sheet 103 on side A are blocked before the ultraviolet rays 200 and infrared rays 201 irradiated onto the adhesive sheet 103 on side B.

[0070] Therefore, the integrated light amount of ultraviolet light 200 and the integrated light amount of infrared light 201 on adhesive sheet 103 are approximately equal on sides A and B. This makes it possible to prevent in-plane distribution of the adhesive strength of treated adhesive sheet 103 and to prevent adhesive sheet 103 from being locally heated and thermal deformation.

[0071] In this case, even if the irradiation time of the ultraviolet light 200 on the adhesive sheet 103 is 10 seconds or less, it is possible to prevent the variation in adhesive strength of the adhesive sheet 103 from increasing. That is, by alternately swinging the light-shielding portion 61a and the light-shielding portion 61b, it is possible to reduce the time during which the adhesive sheet 103 is irradiated with the ultraviolet light 200 to 10 seconds or less.

[0072] Furthermore, since the pair of light-shielding parts 61a, 61b alternately oscillate around the discharge lamp 51, the light irradiation device 1 can be made smaller than when, for example, the light-shielding parts move linearly to switch between transmitting and blocking ultraviolet light 200 and infrared light 201.

[0073] Although several embodiments of the present invention have been described above, these embodiments are presented by way of example only and are not intended to limit the scope of the invention. These novel embodiments can be embodied in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the spirit of the invention. These embodiments and their modifications are included within the scope and spirit of the invention, as well as within the scope of the invention and its equivalents as set forth in the claims. Furthermore, the above-described embodiments can be implemented in combination with each other.

[0074] The following are additional notes regarding the above-described embodiment.

[0075] (Appendix 1) a discharge lamp for irradiating the object to be treated with light; a first light-blocking portion that swings between a first position that blocks light from the discharge lamp toward the object to be treated and a second position that transmits the light; a second light-blocking portion that swings between the first position and a third position at which the light is transmitted; Equipped with The light irradiation device switches between transmitting the light and blocking the light by the first light-shielding portion and the second light-shielding portion alternately swinging and moving.

[0076] (Appendix 2) A light irradiation device as described in Appendix 1, wherein when viewed from a direction along the central axis of the discharge lamp, the first shading portion and the second shading portion have a shape that is curved toward the outside of the discharge lamp.

[0077] (Appendix 3) The lamp further includes a cylindrical reflector provided between the object to be treated and the discharge lamp, 3. The light irradiation device according to claim 1, wherein a portion of the light directed toward the object to be treated is reflected by an inner wall of the reflecting section and is incident on the object to be treated.

[0078] (Appendix 4) a container having a space therein for storing the material to be treated; a gas supply unit that supplies an inert gas to the space of the container; 4. The light irradiation device according to any one of claims 1 to 3, further comprising:

[0079] (Appendix 5) the workpiece comprises a semiconductor wafer and an adhesive sheet; the discharge lamp irradiates the adhesive sheet with ultraviolet light; The light irradiation device according to any one of claims 1 to 4, wherein the first light-shielding section and the second light-shielding section alternately oscillate and move, so that the time during which the ultraviolet light is irradiated onto the adhesive sheet is 10 seconds or less. [Explanation of symbols]

[0080] REFERENCE SIGNS LIST 1 light irradiation device, 2 housing, 3 processing section, 4 reflecting section, 5 light source section, 6 shutter, 7 exhaust section, 8 controller, 31 container, 33 placing section, 34 gas supply section, 51 discharge lamp, 61 light shielding section, 61a light shielding section, 61b light shielding section, 100 processing object, 101 frame, 102 semiconductor wafer, 103 adhesive sheet, 200 ultraviolet light, 201 infrared light

Claims

1. a discharge lamp for irradiating the object to be treated with light; a first light-blocking portion that swings between a first position that blocks light from the discharge lamp toward the object to be treated and a second position that transmits the light; a second light-blocking portion that swings between the first position and a third position at which the light is transmitted; Equipped with The light irradiation device switches between transmitting the light and blocking the light by the first light-shielding portion and the second light-shielding portion alternately swinging and moving.

2. 2. The light irradiation device according to claim 1, wherein when viewed from a direction along the central axis of the discharge lamp, the first shading portion and the second shading portion have a shape that is curved toward the outside of the discharge lamp.

3. The lamp further includes a cylindrical reflector disposed between the object to be treated and the discharge lamp, The light irradiation device according to claim 1 or 2, wherein a portion of the light directed toward the object to be treated is reflected by an inner wall of the reflecting section and is incident on the object to be treated.

4. a container having an internal space for storing the material to be treated; a gas supply unit that supplies an inert gas to the space of the container; The light irradiation device according to claim 1 or 2, further comprising:

5. the workpiece comprises a semiconductor wafer and an adhesive sheet; the discharge lamp irradiates the adhesive sheet with ultraviolet light; The light irradiation device according to claim 1 or 2, wherein the first light-shielding portion and the second light-shielding portion alternately oscillate and move, thereby setting the time during which the ultraviolet light is irradiated onto the adhesive sheet to 10 seconds or less.

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