Semiconductor device and manufacturing method for the same

Abstract

To provide a semiconductor device suitable for achieving low-resistance re-wiring.SOLUTION: A semiconductor device A10 includes a semiconductor element 10, an electrode 21 positioned on a z1 side in a thickness direction z of the semiconductor device 10, a redistribution line 40 positioned on the z1 side in the thickness direction z relative to the electrode 21 and electrically connected to the electrode 21, and a terminal 50 positioned on the z1 side in the thickness direction z relative to the redistribution line 40 and electrically connected to the redistribution line 40. The redistribution line 40 includes a first redistribution line 411 and a second redistribution line 412. A dimension t2 of the second redistribution line 412 in the thickness direction z is greater than a dimension t1 of the first redistribution line 411 in the thickness direction z.SELECTED DRAWING: Figure 5

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