Resin encapsulated semiconductor module and electrical equipment and method for manufacturing resin encapsulated semiconductor module and electrical equipment

Abstract

To provide a resin encapsulated semiconductor module capable of preventing damage such as cracks in a mold resin when an external terminal for electrical connection to the outside is inserted into a sleeve, and a method for manufacturing such a resin encapsulated semiconductor module.SOLUTION: A resin encapsulated semiconductor module 100 comprises a substrate 1, a semiconductor element 10 provided on the substrate, a sleeve 3 electrically connected to a metal pattern 2 on the substrate, into which an external terminal 20 is inserted, and a mold resin 4 for encapsulating the semiconductor elements, there is a space 5 between the sleeve 3 and the mold resin 4, and the sleeve 3 and the mold resin 4 do not come into contact.SELECTED DRAWING: Figure 1

Description

[Technical Field]

[0001] The present disclosure relates to a resin-sealed semiconductor module and an electric device, as well as a method for manufacturing a resin-sealed semiconductor module and a method for manufacturing an electric device. [Background technology]

[0002] Conventionally, a semiconductor device has been known in which a semiconductor chip is mounted on an insulating circuit board on which a circuit pattern is formed, and a cylindrical external terminal communication part into which an external terminal can be inserted and connected is disposed approximately perpendicular to the circuit pattern (Patent Document 1). [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Laid-Open No. 2010-27813 Summary of the Invention [Problem to be solved by the invention]

[0004] In a semiconductor device having a cylindrical external terminal communicating portion (also referred to as a sleeve) as described in Patent Document 1, after the molding resin for resin sealing is cured, an external terminal (such as a press-fit pin or a pin terminal) for electrical connection to the outside is inserted into the cylindrical external terminal communicating portion. To increase the strength of the connection between the cylindrical external terminal communicating portion and the external terminal, an external terminal having a maximum outer diameter larger than the inner diameter of the cylindrical external terminal communicating portion is used. When such an external terminal is inserted (press-fitted) into the cylindrical external terminal communicating portion, the cylindrical external terminal communicating portion deforms outward from the tube. Because the cylindrical external terminal communicating portion is embedded in the cured molding resin (FIGS. 1-7 of Patent Document 1), and the outer periphery of the cylindrical external terminal communicating portion is in close contact with the resin, there is a concern that the expansion of the outer shape of the cylindrical external terminal communicating portion will apply stress to the resin, resulting in cracks in the molding resin.

[0005] The present disclosure has been made to solve the above problems, and aims to provide a resin-sealed semiconductor module that can prevent damage such as cracks from occurring in the molded resin when an external terminal for electrically connecting to the outside is inserted into a sleeve, and a method for manufacturing such a resin-sealed semiconductor module. [Means for solving the problem]

[0006] The present disclosure has been made to achieve the above-mentioned object, and provides a resin-sealed semiconductor module comprising: a substrate; a semiconductor element provided on the substrate; a sleeve electrically connected to a metal pattern on the substrate and into which an external terminal is inserted; and a molded resin that seals the semiconductor element with resin, wherein a space is provided between the sleeve and the molded resin, and the sleeve and the molded resin do not come into contact with each other.

[0007] Such a resin-sealed semiconductor module has a space between the sleeve and the molded resin, so even if the sleeve deforms (expands) when an external terminal is inserted into the sleeve, stress on the molded resin can be suppressed, preventing damage such as cracks from occurring in the molded resin and resulting in high reliability.

[0008] In this case, the sleeve can have a flange portion at its end, the substrate can have a bonding material at the joint with the sleeve, and the flange portion of the sleeve can be bonded to the substrate via the bonding material, resulting in a resin-sealed semiconductor module.

[0009] This allows the sleeve to be easily and stably fixed to the substrate.

[0010] In this case, the resin-sealed semiconductor module can be one that has a resist portion containing a resist material around the bonding material, and the boundary between the space on the substrate surface and the molded resin facing the space is located above the resist portion.

[0011] In such a resin-sealed semiconductor module, the positioning accuracy of the sleeve is high, and leakage of the molding resin is effectively prevented.

[0012] In this case, the resist material may be at least one selected from the group consisting of epoxy resin, glass fiber-containing resin, urethane resin, and silicone resin, making the semiconductor module a resin-sealed type.

[0013] Such materials can be suitably used as the resist material.

[0014] In this case, the semiconductor module may be a resin-sealed type semiconductor module including the external terminal inserted into the sleeve.

[0015] The semiconductor module may be a resin-sealed type in which the external terminals are inserted into a sleeve, thereby enabling the external terminals to be disposed substantially perpendicular to the upper surface of the package.

[0016] In this case, the electrical equipment can include the resin-sealed semiconductor module described above.

[0017] This results in a highly reliable electrical device.

[0018] The present disclosure has been made to achieve the above-mentioned object, and provides a method for manufacturing a resin-sealed semiconductor module including a substrate, a semiconductor element provided on the substrate, a sleeve electrically connected to a metal pattern on the substrate and into which an external terminal is inserted, and a molded resin that resin-seals the semiconductor element, the method using a mold that positions the semiconductor element and the sleeve on the substrate and has a cavity into which the molded resin is filled, such that the sleeve is not contained within the cavity when the mold is closed, and by closing the mold and filling the cavity with the molded resin, a space is formed between the sleeve and the molded resin, and resin-sealing is performed so that the sleeve and the molded resin do not come into contact with each other.

[0019] According to this method for manufacturing a resin-sealed semiconductor module, since a space is provided between the sleeve and the molded resin, even if the sleeve deforms (expands) when an external terminal is inserted into the sleeve, stress on the molded resin can be suppressed, thereby preventing damage such as cracks from occurring in the molded resin, and enabling the manufacture of a highly reliable resin-sealed semiconductor module.

[0020] In this case, a manufacturing method for a resin-sealed semiconductor module can be achieved by placing a bonding material at the joint between the substrate and the sleeve, using a sleeve with a flange portion at the end as the sleeve, and bonding the flange portion to the joint.

[0021] This allows the sleeve to be easily and stably fixed to the substrate.

[0022] In this case, a resist material is applied to the area around the joint where the inner wall of the cavity is located when the mold is closed to form a resist portion, and the mold is then closed to fill the cavity with the molded resin and perform the resin sealing, thereby forming a method for manufacturing a resin-sealed semiconductor module in which the boundary between the space and the molded resin facing the space is located above the resist portion.

[0023] This makes it possible to improve the positional accuracy of the sleeve and effectively prevent leakage of molding resin.

[0024] In this case, the method for manufacturing a resin-sealed semiconductor module may use at least one selected from the group consisting of epoxy resin, glass fiber-containing resin, urethane resin, and silicone resin as the resist material.

[0025] Such materials can be suitably used as the resist material.

[0026] In this case, the method for manufacturing a resin-sealed semiconductor module may include inserting the external terminal into the sleeve after the resin sealing.

[0027] The external terminals may be inserted into a sleeve to form a resin-sealed semiconductor module, which allows the external terminals to be positioned substantially perpendicular to the top surface of the package.

[0028] In this case, the method for manufacturing an electric device can be a method for manufacturing an electric device using the resin-sealed semiconductor module manufactured by the above-mentioned method for manufacturing a resin-sealed semiconductor module.

[0029] This makes it possible to provide highly reliable electrical equipment. [Effects of the Invention]

[0030] As described above, according to the resin-sealed semiconductor module of the present disclosure, the external terminals can be installed approximately perpendicular to the top surface of the package, and because a space is provided between the sleeve and the molded resin, even if the sleeve deforms (expands) when the external terminals are inserted into the sleeve, stress is suppressed from occurring in the molded resin, thereby preventing damage such as cracks from occurring in the molded resin, resulting in a highly reliable resin-sealed semiconductor module. According to the manufacturing method of the resin-sealed semiconductor module of the present disclosure, because a space is provided between the sleeve and the molded resin, stress is suppressed from occurring in the molded resin even if the sleeve deforms (expands) when the external terminals are inserted into the sleeve. Therefore, damage such as cracks can be prevented from occurring in the molded resin, making it possible to manufacture a highly reliable resin-sealed semiconductor module. [Brief explanation of the drawings]

[0031] [Figure 1] 1 illustrates an embodiment of a resin-encapsulated semiconductor module according to the present disclosure. [Figure 2] 1 is a diagram illustrating a manufacturing process of a resin-sealed semiconductor module according to the present disclosure. [Figure 3] 1 is a diagram illustrating a manufacturing process of a resin-sealed semiconductor module according to the present disclosure. [Figure 4] 1 is a diagram illustrating a manufacturing process of a resin-sealed semiconductor module according to the present disclosure. [Figure 5] 1 is a diagram illustrating a manufacturing process of a resin-sealed semiconductor module according to the present disclosure. [Figure 6] 1 illustrates an example of a sleeve according to the present disclosure. [Figure 7] An example of an air conditioner will be described as an embodiment of an electrical appliance according to the present disclosure. DETAILED DESCRIPTION OF THE INVENTION

[0032] The present disclosure will be described in detail below, but the present disclosure is not limited thereto.

[0033] As described above, there has been a demand for a resin-sealed semiconductor module that can prevent damage such as cracks from occurring in the molding resin when external terminals for electrical connection to the outside are inserted into the sleeve, and a method for manufacturing such a resin-sealed semiconductor module.

[0034] As a result of extensive research into the above-mentioned problems, the present inventors have discovered a resin-sealed semiconductor module including a substrate, a semiconductor element provided on the substrate, a sleeve electrically connected to a metal pattern on the substrate and into which an external terminal is inserted, and a molded resin that seals the semiconductor element, wherein a space is provided between the sleeve and the molded resin so that the sleeve and the molded resin do not come into contact with each other, and because a space is provided between the sleeve and the molded resin, stress is suppressed from occurring in the molded resin even if the sleeve deforms (expands) when the external terminal is inserted into the sleeve, and therefore damage such as cracks can be prevented from occurring in the molded resin, thereby completing the present disclosure.

[0035] The present inventors have also discovered a method for manufacturing a resin-sealed semiconductor module including a substrate, a semiconductor element provided on the substrate, a sleeve electrically connected to a metal pattern on the substrate and into which external terminals are inserted, and a molded resin for resin-sealing the semiconductor element, the method including: arranging the semiconductor element and the sleeve on the substrate; using a mold having a cavity into which the molded resin is filled; using a mold in which the sleeve is not contained within the cavity when the mold is closed; and filling the cavity with the molded resin by closing the mold to form a space between the sleeve and the molded resin, thereby performing resin-sealing so that the sleeve and the molded resin do not come into contact with each other. Because of the space between the sleeve and the molded resin, stress can be suppressed in the molded resin even if the sleeve deforms (expands) when the external terminals are inserted into the sleeve. This discovery led to the completion of the present disclosure.

[0036] The following description will be made with reference to the drawings.

[0037] [Resin-encapsulated semiconductor module] FIG. 1 shows an example of a resin-sealed semiconductor module according to the present disclosure. As shown in FIG. 1, the resin-sealed semiconductor module 100 according to the present disclosure includes a substrate 1, a semiconductor element 10 provided on the substrate 1, a sleeve 3 electrically connected to a metal pattern 2 on the substrate 1, and a molded resin 4 that resin-seals the semiconductor element 10. An external terminal 20 is inserted into the sleeve 3. A space 5 is provided between the sleeve 3 and the molded resin 4. The space 5 prevents the sleeve 3 from contacting the molded resin 4. Therefore, the resin-sealed semiconductor module 100 according to the present disclosure can suppress stress from being generated in the molded resin 4 even if the sleeve 3 is deformed (expanded) when the external terminal 20 is inserted into the sleeve 3, thereby preventing damage such as cracks from occurring in the molded resin 4.

[0038] In the resin-sealed semiconductor module according to the present disclosure, the sleeve 3 and the molded resin 4 need not be in contact with each other, and the distance between them (the size of the space 5 between the sleeve 3 and the molded resin 4) is not particularly limited. From the viewpoint of the molding resin filling process, the minimum thickness of the mold that can withstand the filling pressure when filling the molding resin can be set as the minimum value of the distance between the sleeve 3 and the molded resin 4. The distance between the sleeve 3 and the molded resin 4 can be, for example, 0.8 mm or more.

[0039] 1 shows an example in which only external terminals are provided for electrical connection to the outside, but the module may further include outer leads extending from the side surfaces of the conventional resin-sealed semiconductor module to the outside. In this case, the outer leads are input terminals, output terminals, etc.

[0040] 1, the upper end of the sleeve 3 is positioned lower than the surface of the molded resin 4, but the resin-sealed semiconductor module according to the present disclosure is not limited to this. The upper end of the sleeve 3 and the surface of the molded resin 4 may be on the same plane, or the upper end of the sleeve 3 may be slightly higher than the surface of the molded resin 4.

[0041] The resin-sealed semiconductor module according to the present disclosure may include external terminals inserted into sleeves. In such a resin-sealed semiconductor module, the external terminals are disposed substantially perpendicular to the top surface of the package.

[0042] (substrate) There are no particular limitations on the substrate 1 as long as it has a metal pattern 2 on its surface and can accommodate a semiconductor element 10 and a sleeve 3. For example, a substrate having metal patterns 2 on both sides of a ceramic substrate 12 as shown in Fig. 1 can be used, more specifically, a DBC substrate (Direct Bonded Copper substrate) in which a copper material is directly bonded to a ceramic insulating substrate.

[0043] It is also preferable to provide a bonding material 6 on the substrate 1 at the joint with the sleeve 3 (see FIG. 2-5). The material of the bonding material is not particularly limited as long as it can bond the sleeve 3 and the substrate 1 (metal pattern 2), but a solder material or the like can be suitably used.

[0044] It is also preferable to provide a resist section 7 containing a resist material around the bonding material 6 on the substrate 1 (see FIG. 2-5). As will be described later, if the resist section 7 is formed around the bonding material 6, the bonding material will not spread onto the resist section 7 when the bonding material 6 is formed, and therefore the sleeve 3 can be easily positioned with high precision. If the placement precision of the sleeve 3 is increased in this way, it is possible to prevent the sleeve from being pinched when the mold is closed during resin sealing, and it is possible to avoid damage to the mold.

[0045] The resist material is not particularly limited, but for example, a material containing at least one selected from epoxy resin, glass fiber-reinforced resin, urethane resin, and silicone resin can be suitably used. Note that if the resist material is the same resin as the mold resin, for example, epoxy resin, the adhesive strength of the mold resin to the substrate is improved.

[0046] Furthermore, when a mold is used for resin sealing with a mold resin, by providing a resist portion 7 in the region where the inner wall of the mold cavity is located when the mold is closed, the resist portion 7 functions as a buffer between the mold and the substrate when the mold is closed, effectively preventing leakage of the mold resin. In this case, the boundary 8 between the space 5 on the substrate surface and the mold resin 4 facing the space 5 is located above the resist portion 7 (see FIG. 5).

[0047] (sleeve) The structure of the sleeve 3 is not particularly limited as long as it is cylindrical and allows the external terminal 20 to be inserted therein. A cylindrical shape is preferable, but it does not have to be a perfect cylinder. The material constituting the sleeve 3 is also not particularly limited as long as it has sufficient strength and conductivity when the external terminal is inserted therein. For example, a copper-based alloy material such as brass or phosphor bronze can be suitably used.

[0048] Moreover, it is preferable that the sleeve 3 has a flange portion 3A at its end, as shown in Fig. 1. By joining the flange portion 3A to the substrate 1 having the above-mentioned bonding material 6 via the bonding material (see Fig. 2), the sleeve can be easily and stably fixed to the substrate.

[0049] Furthermore, it is preferable that the opening on the top surface of the sleeve (the side opposite to the side bonded to the substrate) is sealed. If the top surface of the sleeve is thinly sealed, foreign matter is less likely to enter the sleeve during manufacturing. Also, as shown in Figure 6, if the top surface of the sleeve is sealed, providing an air hole allows the internal pressure to escape when the bottom surface is bonded to the substrate by soldering or the like.

[0050] Also, as shown in Figure 6, the upper surface of the sleeve may be sealed with a thickness thinner than the thickness of the flange portion, and a notch (annular as in Figure 6(a) or cross-shaped as in Figure 6(b)) may be provided on the upper surface. With this structure, when inserting the external terminal, it breaks through the sleeve and is locked into the sleeve, further improving the fixing strength. When sealing the upper surface, it is possible to use the same material as the sleeve, or tape or plastic molding.

[0051] (semiconductor element) The semiconductor element 10 in the resin-sealed semiconductor module 100 according to the present disclosure is not particularly limited. For example, it may be a power chip such as a transistor or diode that handles high power, or a power chip and a control chip such as a control IC that handles less power than the power chip may be arranged separately in different positions on the substrate. These may be fixed to the substrate 1 by soldering, a conductive adhesive, or the like.

[0052] (mold resin) The mold resin 4 in the resin-sealed semiconductor module 100 according to the present disclosure is not particularly limited. Any known mold resin material can be used. For example, the mold resin material can be a thermosetting epoxy resin mixed with fine particles such as silica (SiO2, silicon dioxide) to impart functionality such as heat dissipation and a thermal expansion coefficient. Alternatively, an environmentally friendly bromine (Br)-free resin can be used.

[0053] [Electrical Equipment] The above-described resin-sealed semiconductor module can be applied to electrical equipment. By using the resin-sealed semiconductor module with improved reliability according to the present disclosure, the reliability of the electrical equipment can also be increased. While the electrical equipment is not particularly limited, the example of the resin-sealed semiconductor module IPM200 can be particularly suitably applied as a small, high-voltage, three-phase motor driver for driving compressors in air conditioners, refrigerators, and other electrical equipment. It can also be applied to driving various motors in automobiles.

[0054] 7 is a diagram illustrating an air conditioner 300 as one embodiment of an electrical device. The air conditioner 300 is composed of an indoor unit 310 and an outdoor unit 320, each equipped with fan motors 311 and 321, a compressor 322, and an IPM 200, which is an electrical device. It is advisable to use IPM 200 with specifications suitable for driving the respective motors and compressors.

[0055] [Manufacturing method for resin-encapsulated semiconductor modules] Next, a method for manufacturing a resin-sealed semiconductor module according to the present disclosure, as shown in Fig. 1, will be described with reference to Figs. 2-5. Figs. 2-5 show an enlarged view of the vicinity of the sleeve 3 in the resin-sealed semiconductor module shown in Fig. 1 (the semiconductor element 10 is not shown). Note that some of the details explained about the resin-sealed semiconductor module may be omitted.

[0056] In the method for manufacturing a resin-sealed semiconductor module according to the present disclosure, a semiconductor element 10 and a sleeve 3 are placed on a substrate 1 (see FIG. 1). When placing the sleeve 3 on the substrate 1, as shown in FIG. 2, it is preferable to place a bonding material 6 at the joint between the substrate 1 and the sleeve 3, use a sleeve 3 with a flange 3A at its end, and bond the flange 3A of the sleeve 3 to the joint. In this way, the sleeve can be easily and stably fixed to the substrate.

[0057] As shown in FIGS. 2 and 3 , it is preferable to form a resist portion 7 by providing a resist material in the area around the joint where the inner wall 22A of the cavity 22 is located when the mold 21 is closed. Because the mold used for the molding process becomes hot during resin sealing, providing the resist portion 7 in the area where the inner wall 22A of the cavity 22 of the mold 21 is located softens the resin, such as epoxy, used for the resist when the mold 21 is closed. Furthermore, the resist portion 7 functions as a buffer between the mold and the substrate, effectively preventing leakage of the mold resin during resin sealing. By closing the mold 21 and filling the cavity 22 with the mold resin 4 for resin sealing in this way, the boundary 8 between the space 5 on the substrate surface and the mold resin 4 facing the space 5 can be positioned above the resist portion 7. Furthermore, using epoxy resins for both the mold resin and the resist improves adhesion and further enhances reliability.

[0058] The resist portion 7 is usually formed before placing the bonding material 6. This is because if the resist portion 7 is formed around the bonding portion before placing the bonding material 6, the sleeve 3 can be stably placed within the area surrounded by the resist portion.

[0059] As described above, the resist material may be at least one selected from the group consisting of epoxy resin, glass fiber-reinforced resin, urethane resin, and silicone resin, which have insulating properties.

[0060] After the semiconductor element 10, sleeve 3, etc. are arranged on the substrate 1, as shown in FIGS. 3 and 4, a mold 21 having a cavity to be filled with the mold resin is used to fill the mold resin into the cavity 22, thereby performing resin sealing. In the method for manufacturing a resin-sealed semiconductor module according to the present disclosure, a mold is used in which the sleeve 3 is not included in the cavity 22 when the mold 21 is closed. By using such a mold and closing the mold (see FIG. 3) and filling the cavity with the mold resin (see FIG. 4), a space 5 is formed between the sleeve 3 and the mold resin 4, and resin sealing is performed so that the sleeve 3 and the mold resin 4 do not come into contact with each other. In this way, a resin-sealed semiconductor module such as that shown in FIGS. 1 and 5 can be manufactured.

[0061] After resin sealing, external terminals may be inserted (press-fitted) into the sleeve to form a resin-sealed semiconductor module equipped with external terminals. This allows the external terminals to be installed approximately perpendicular to the top surface of the package. Furthermore, such a resin-sealed semiconductor module is highly reliable because no stress is applied to the mold resin when the external terminals are inserted, and there is no risk of damage such as cracks.

[0062] [Manufacturing methods for electrical equipment] An electric device such as that shown in FIG. 7 can be manufactured using a resin-sealed semiconductor module manufactured by the above-described method for manufacturing a resin-sealed semiconductor module.

[0063] As described above, the resin-sealed semiconductor module of the present disclosure can prevent damage such as cracks from occurring in the mold resin when the external terminals are inserted into the sleeve, resulting in high reliability. The method for manufacturing a resin-sealed semiconductor module of the present disclosure makes it possible to manufacture a highly reliable resin-sealed semiconductor module.

[0064] The present specification includes the following aspects. [1]: A resin-sealed semiconductor module comprising a substrate, a semiconductor element provided on the substrate, a sleeve electrically connected to a metal pattern on the substrate and into which an external terminal is inserted, and a molding resin that seals the semiconductor element, wherein a space is provided between the sleeve and the molding resin, and the sleeve and the molding resin do not come into contact with each other. [2]: The sleeve has a flange portion at an end thereof, the substrate has a bonding material at a bonding portion with the sleeve; The resin-sealed semiconductor module according to [1] above, wherein the flange portion of the sleeve is bonded onto the substrate via the bonding material. [3]: A resin-sealed semiconductor module according to [1] or [2] above, which has a resist portion containing a resist material around the bonding material, and the boundary between the space on the substrate surface and the molding resin facing the space is on the resist portion. [4]: The resin-sealed semiconductor module according to [3], wherein the resist material contains at least one selected from the group consisting of epoxy resin, glass fiber-reinforced resin, urethane resin, and silicone resin. [5]: The resin-sealed semiconductor module according to [1], [2], [3] or [4], which includes the external terminal inserted into the sleeve. [6]: An electrical device including the resin-sealed semiconductor module of [1], [2], [3], [4] or [5] above. [7]: A method for manufacturing a resin-sealed semiconductor module including a substrate, a semiconductor element provided on the substrate, a sleeve electrically connected to a metal pattern on the substrate and into which an external terminal is inserted, and a molding resin for resin-sealing the semiconductor element, disposing the semiconductor element and the sleeve on the substrate; A method for manufacturing a resin-sealed semiconductor module using a mold having a cavity into which the molding resin is filled, wherein the sleeve is not contained within the cavity when the mold is closed, and by closing the mold and filling the cavity with the molding resin, a space is created between the sleeve and the molding resin, and resin sealing is performed so that the sleeve and the molding resin do not come into contact with each other. [8]: A bonding material is placed at the bonding portion between the substrate and the sleeve, The method for manufacturing a resin-sealed semiconductor module according to [7] above, wherein a sleeve having a flange portion at an end thereof is used as the sleeve, and the flange portion is joined to the joining portion. [9]: A resist material is provided in a region around the joint where the inner wall of the cavity is located when the mold is closed to form a resist portion; A method for manufacturing a resin-sealed semiconductor module according to [7] or [8] above, wherein the mold is closed, the cavity is filled with the molding resin, and the resin sealing is performed, so that the boundary between the space and the molding resin facing the space is located above the resist portion.

[10] : The method for producing a resin-sealed semiconductor module according to [9], wherein the resist material is at least one selected from the group consisting of epoxy resin, glass fiber-containing resin, urethane resin, and silicone resin.

[11] : The method for manufacturing a resin-sealed semiconductor module according to [7], [8], [9] or

[10] , wherein the external terminal is inserted into the sleeve after the resin sealing.

[12] : A method for manufacturing an electrical device using a resin-sealed semiconductor module manufactured by the method for manufacturing a resin-sealed semiconductor module according to [7], [8], [9],

[10] or

[11] .

[0065] The present disclosure is not limited to the above-described embodiments. The above-described embodiments are merely examples, and any configuration that is substantially identical to the technical idea described in the claims of the present disclosure and that provides similar effects is included within the technical scope of the present disclosure. [Explanation of symbols]

[0066] 1...substrate, 2...metal pattern, 3...sleeve, 3A...flange portion, 4...Molding resin, 5...Space, 6...Joint material, 7...Resist portion, 8...Boundary, 10...semiconductor element, 12...ceramic substrate, 20...external terminal, 21...mold, 22...cavity, 22A...inner wall, 100...resin-sealed semiconductor module, 200...Intelligent Power Module (IPM), 300...Air conditioner, 310... indoor unit, 320... outdoor unit, 311, 321... fan motor, 322...Compressor.

Claims

1. A resin-sealed semiconductor module comprising: a substrate; a semiconductor element provided on the substrate; a sleeve electrically connected to a metal pattern on the substrate, the sleeve into which an external terminal is inserted; and a molding resin that seals the semiconductor element with resin, A resin-sealed semiconductor module, characterized in that a space is provided between the sleeve and the molding resin, and the sleeve and the molding resin do not come into contact with each other.

2. The sleeve has a flange at an end thereof, the substrate has a bonding material at a bonding portion with the sleeve; 2. The resin-sealed semiconductor module according to claim 1, wherein the flange portion of the sleeve is bonded onto the substrate via the bonding material.

3. 2. The resin-sealed semiconductor module according to claim 1, characterized in that a resist portion containing a resist material is provided around the bonding material, and the boundary between the space on the surface of the substrate and the molding resin facing the space is located above the resist portion.

4. 4. The resin-sealed semiconductor module according to claim 3, wherein the resist material contains at least one selected from the group consisting of epoxy resin, glass fiber-containing resin, urethane resin, and silicone resin.

5. 2. The resin-sealed semiconductor module according to claim 1, further comprising the external terminal inserted into the sleeve.

6. An electrical device comprising the resin-sealed semiconductor module according to any one of claims 1 to 5.

7. A method for manufacturing a resin-sealed semiconductor module including: a substrate; a semiconductor element provided on the substrate; a sleeve electrically connected to a metal pattern on the substrate, the sleeve into which an external terminal is inserted; and a molding resin for resin-sealing the semiconductor element, disposing the semiconductor element and the sleeve on the substrate; A method for manufacturing a resin-sealed semiconductor module, characterized in that a mold having a cavity into which the molding resin is filled is used, and the sleeve is not included in the cavity when the mold is closed, and by closing the mold and filling the cavity with the molding resin, a space is created between the sleeve and the molding resin, and resin sealing is performed so that the sleeve and the molding resin do not come into contact with each other.

8. a bonding material is placed at a bonding portion between the substrate and the sleeve; 8. The method for manufacturing a resin-sealed semiconductor module according to claim 7, wherein the sleeve has a flange at an end thereof, and the flange is joined to the joining portion.

9. forming a resist portion by providing a resist material in a region around the joint portion where the inner wall of the cavity is located when the mold is closed; 8. The method for manufacturing a resin-sealed semiconductor module according to claim 7, characterized in that by closing the mold, filling the cavity with the molding resin, and sealing with the resin, the boundary between the space and the molding resin facing the space is located above the resist portion.

10. 10. The method for manufacturing a resin-sealed semiconductor module according to claim 9, wherein the resist material is at least one selected from the group consisting of epoxy resin, glass fiber-containing resin, urethane resin, and silicone resin.

11. 8. The method for manufacturing a resin-sealed semiconductor module according to claim 7, wherein the external terminals are inserted into the sleeves after the resin sealing.

12. 12. A method for manufacturing an electric device, comprising manufacturing the electric device by using the resin-sealed semiconductor module manufactured by the method for manufacturing a resin-sealed semiconductor module according to claim 7.

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