Electric power conversion system

Abstract

To provide an electric power conversion system that supports a power module on a substrate at a proper position and also allows a connection state to be easily checked.SOLUTION: An electric power conversion system comprises a substrate 12 having a mount surface 12S, a base 13 on the mount surface 12S of the substrate 12, a fixation member 14 having one end side supported by the base 13, and a power module PM mounted on the substrate 12 while having a terminal 22 electrically connected to printed wiring 12b of the substrate 12 with solder 15, and the power module PM is supported on the other end side of the fixation member 14 and fixed to the substrate 12.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a power conversion device. [Background technology]

[0002] Patent Document 1, which describes a technique for manufacturing a power conversion device, describes a process in which an electronic component (20) is temporarily fixed to a substrate (50) via a temporary fixing member (90), and in this temporarily fixed state, a lead wire (22) of the electronic component (20) is connected to the substrate (50) by soldering.

[0003] In addition, in the process described in Patent Document 1, a substrate (50) with an electronic component (20) temporarily attached is housed inside a housing (60), and the substrate (50) and the electronic component (20) are fixed to the housing (60) with screws (80). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2013-8853 Summary of the Invention [Problem to be solved by the invention]

[0005] In vehicles equipped with electric motors for driving, such as battery electric vehicles (BEVs) and hybrid electric vehicles (HEVs), it is also required to integrate the power conversion device into a single unit in order to reduce the size of the system.

[0006] For this reason, it is being considered to configure a power conversion device that includes a power module on a substrate. A power module is a circuit that combines multiple power control semiconductors, such as power MOSFETs and IGBTs, integrated into a single package.

[0007] However, in the case of using the temporary fastening members described in Patent Document 1 to mount a power module on a substrate, the temporary fastening members remain inside the device even after the power conversion device is constructed, which limits miniaturization and makes it difficult to check the state of soldering on the mounting surface side from between the substrate and the power module.

[0008] For these reasons, there is a demand for a power conversion device that supports a power module in an appropriate position on a board and that makes it easy to check the connection state. [Means for solving the problem]

[0009] A characteristic configuration of a power conversion device according to the present invention is that it comprises a substrate having a mounting surface, a base provided on the mounting surface of the substrate, a fixing member having one end supported by the base, and a power module mounted on the substrate with terminals electrically connected by solder to printed wiring on the substrate, and the power module is supported on the other end of the fixing member and fixed to the substrate.

[0010] According to this configuration, by using a fixing member whose one end is supported by a base and supporting the power module on the other end of this fixing member, the terminals of the power module can be connected by soldering to the printed wiring of the board while setting the required distance between the board and the fixing member. Also, with this configuration, an open space can be formed between the power module and the board, and soldering when mounting the power module on the board can be performed in a state separated from the housing, etc. Therefore, it is easy to check the state of the solder connection on the mounting surface of the board. Therefore, a power conversion device is configured in which the power module is supported in an appropriate position on the board and the connection state can be easily confirmed. [Brief explanation of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view of a vehicle drive device that houses a traction motor and a power conversion device. [Figure 2] FIG. 2 is an enlarged cross-sectional view of a power converter mounted on a substrate. [Figure 3] FIG. 2 is a plan view of the power module. [Figure 4] FIG. 10 is a cross-sectional view illustrating a first step of the procedure for mounting the power module. [Figure 5] FIG. 10 is a cross-sectional view illustrating a second step of the power module mounting procedure. [Figure 6] FIG. 10 is a cross-sectional view illustrating a third step of the power module mounting procedure. [Figure 7] FIG. 10 is a cross-sectional view illustrating a fourth step of the power module mounting procedure. DETAILED DESCRIPTION OF THE INVENTION

[0012] Hereinafter, an embodiment of a power conversion device according to the present invention will be described with reference to the drawings. However, the present invention is not limited to the following embodiment, and various modifications are possible without departing from the spirit of the present invention.

[0013] [Basic configuration] 1 shows a vehicle drive device A that transmits the driving force of a drive motor M to wheels (not shown). This vehicle drive device A accommodates the drive motor M, a gear reduction mechanism G that reduces the driving force transmitted from the drive motor M and transmits it to the drive wheels (not shown), and a power conversion device T, all housed in a housing H. The power conversion device T is configured as a single unit comprising a power conversion section B, an inverter C, and a control section D.

[0014] The vehicle drive device A shown in FIG. 1 is mounted on a plug-in hybrid electric vehicle (PHEV) as an example of an electric vehicle (not shown) equipped with a driving motor M.

[0015] In addition, examples of electric vehicles equipped with a driving motor M include hybrid electric vehicles (HEVs), battery electric vehicles (BEVs), and fuel cell electric vehicles (FCEVs), and the power conversion device T can be used in these vehicles.

[0016] Since the vehicle drive device A is provided on the electric vehicle in the position shown in Fig. 1, in this embodiment, the up-down relationship and the positional relationship of each part will be described in accordance with the up-down direction shown in Fig. 1. Also, Fig. 1 shows a cross section of the vehicle drive device A as seen from the front-rear direction, and the left-right direction in Fig. 1 corresponds to the width direction of the body of the electric vehicle.

[0017] The substrate 12 constituting the power conversion device T can be used in a vertical or oblique position, and the power module PM can also be used in a position corresponding to the position of the substrate 12.

[0018] [Vehicle drive system structure] 1, the vehicle drive device A has a housing H that includes a metal housing main body 1, a pair of metal side covers 2 that cover both sides of a lower space LS of the housing H, and a metal upper cover 3 that covers an upper part of an upper space HS of the housing H. The lower space LS and the upper space HS are formed as independent spaces that do not communicate with each other.

[0019] The housing H accommodates the driving motor M and the gear reduction mechanism G in the lower space LS. The housing H also accommodates the power conversion device T in the upper space HS. In the vehicle drive device A, the axle 4 protruding outward from the driving motor M penetrates one of the side covers 2, and the axle 4 protruding outward from the gear reduction mechanism G penetrates the other side cover 2 of the lower space LS.

[0020] The left and right axles 4 are drive shafts that transmit driving force to wheels (not shown), and the rotational axes X of these axles 4, the rotational axes X of the travel motor M, and the rotational axes X of the gear reduction mechanism G are arranged coaxially.

[0021] [Power conversion device] 1 and 2, the power conversion device T includes a power conversion unit B, an inverter C, a control unit D, a pair of cooling plates 10, and a plurality of circuit boards 12. An upper space HS accommodating the cooling plates 10 is closed by an upper cover 3. Note that the circuit boards 12 are not only disposed at the positions shown in FIG. 2, but are also disposed inside the power conversion unit B and the inverter C.

[0022] The power conversion unit B has a charging circuit for charging the main battery (not shown), a DC-DC conversion circuit for converting the high-voltage power of the main battery into low-voltage power, a DC-AC converter circuit for converting the high-voltage power of the main battery into AC power of a voltage similar to that of a commercial power source and supplying it to the vehicle's air conditioner, etc. The control unit D has an ECU (Electronic Control Unit) for executing a preset program.

[0023] The charging circuit converts AC power from an AC power source (basically a commercial power source) supplied from outside the vehicle into high-voltage DC power and supplies it to the main battery. The DC-AC converter circuit converts DC power from the battery to generate AC power similar to that of the commercial power source and supplies it to the outside of the vehicle.

[0024] The inverter C has a power module PM (see FIGS. 2 and 3) that converts DC power from the main battery into three-phase AC power to supply to the traction motor M. This power module PM is controlled by a control unit D. Note that the control unit D controls the power module PM of the inverter C based on the amount of depression of the accelerator pedal (not shown) and preset parameters, for example, to realize traveling at a speed corresponding to the amount of depression of the accelerator pedal when the accelerator pedal is depressed.

[0025] The power module PM can be used, for example, in a DC-DC conversion circuit, a DC-AC converter circuit, etc. of the power conversion unit B. Therefore, even when used in these circuits, the power module PM is provided on the substrate 12 in the same manner as in the configuration shown in FIG.

[0026] As partially explained above, the power module PM is a circuit in which a plurality of power control semiconductors such as power MOSFETs and IGBTs are combined and integrated into one package 21.

[0027] As shown in FIG. 1, the power conversion device T has a pair of cooling plates 10 arranged in a vertical position and parallel to each other, and an inverter C and a control unit D are arranged on the upper surface of the upper cooling plate 10.

[0028] The cooling plate 10 reduces the temperature on both the front and back sides of the cooling plate 10 by allowing cooling fluid supplied from the outside to flow through the internal flow path, thereby realizing heat dissipation from the power module PM, power control elements, capacitors, choke coils, etc. that come into contact with the cooling plate 10 via the heat transfer material 24.

[0029] The cooling plate 10 can use cooling water such as long-life coolant (LLC), insulating oil such as paraffin, or refrigerant such as hydrofluorocarbon (HFC) or hydrofluoroolefin (HFO) as a cooling fluid, but in this embodiment, cooling water such as long-life coolant (LLC) containing ethylene glycol, propylene glycol, etc. is used.

[0030] The power conversion device T has a power conversion unit B disposed between a pair of upper and lower cooling plates 10 and below the lower cooling plate 10. The power conversion unit B includes a transformer for realizing voltage conversion, a smoothing choke coil, a capacitor, etc.

[0031] [Power conversion device] FIG. 2 shows a power conversion device T having a substrate 12 used for an inverter C, a power conversion unit B, etc., and a power module PM mounted on a mounting surface 12S of the substrate 12 (the lower surface in the figure).

[0032] In this embodiment, since the power conversion device T is configured as a unit, the board 12 is indirectly supported by the housing main body 1 (an example of a case). Note that in a configuration in which the board 12 is exposed, such as a configuration in which the power conversion device T does not include the cooling plate 10, the board 12 is directly fixed to the housing main body 1.

[0033] The substrate 12 has a metal base 13 on the mounting surface 12S. As shown in Fig. 2, the base 13 has a channel shape in a side view, and has an engagement opening 13a formed by cutting out a part of a plate-like portion on the side opposite to the side facing the mounting surface 12S.

[0034] As shown in FIG. 3, the power module PM has a package 21 that is rectangular in plan view, and a plurality of terminals 22 that are electrically connected to the internal power MOSFETs, IGBTs, etc. are protruded from the upper surface of the package 21.

[0035] The power module PM has brackets 23 protruding outward from two locations on the outer edge of the package 21, and an engaging recess 23a is formed at the protruding end of each bracket 23. The number of brackets 23 may be one, or three or more.

[0036] In the power conversion device T, the relative positional relationship between the substrate 12 and the power module PM is determined by inserting multiple terminals 22 of the power module PM into terminal insertion holes 12a (e.g., through holes) of the substrate 12 and providing a fixing member 14 between the base 13 and the bracket 23 of the power module PM.

[0037] Furthermore, in the power conversion device T, with the positional relationship between the substrate 12 and the power module PM determined, the projection margin of the terminal 22 relative to the substrate 12 is set by adjusting the length of the fixing member 14. With the projection margin of the terminal 22 set in this manner, the terminal 22 and the printed wiring 12b are connected by the solder 15.

[0038] [Power conversion device: fixed member] 2, the fixing member 14 has a main fixing member 14M made of insulating resin and having a cylindrical portion, and a resin sub-fixing member 14S that is slidably housed in the cylindrical portion of the main fixing member 14M. Furthermore, the fixing member 14 has a projection adjustment portion V that adjusts the projection by relative sliding movement between the main fixing member 14M and the sub-fixing member 14S.

[0039] The fixing member 14 is rod-shaped overall, and the projection adjustment unit V sets the relative movement amount of the main fixing member 14M and the sub-fixing member 14S, thereby allowing the overall length of the fixing member 14 to be adjusted.

[0040] The projection adjustment portion V has a plurality of engagement holes 14x formed along the extension / contraction direction in the cylindrical portion of the main fixing member 14M, and a locking body 14y formed on the secondary fixing member 14S so as to be able to engage with any of the plurality of engagement holes 14x.

[0041] The locking body 14y has a shape that becomes more pointed outward and is formed integrally with the secondary fixing member 14S so as to protrude outward due to the elastic force of the resin. The projection adjustment portion V is configured to separate the locking body 14y from the engagement hole 14x by applying an artificial force in the extension / contraction direction of the main fixing member 14M and the secondary fixing member 14S (the up-and-down direction in FIG. 2), and to be able to engage with the adjacent engagement hole 14x after this separation.

[0042] The structure of the projection adjustment portion V is not limited to that shown in Fig. 2, and any other structure can be adopted. Different structures of this fixing member 14 are described in the section on other embodiments.

[0043] In this way, the distance between the main engagement portion 14Mb and the sub-engagement portion 14Sb of the fixing member 14 (the entire length of the fixing member 14) can be adjusted to any value by fitting the locking body 14y into any of the plurality of engagement holes 14x.

[0044] As shown in Figure 2, the main fixing member 14M has a groove-shaped main fitting portion 14Ma formed around the entire circumference of the end opposite the side where the secondary fixing member 14S is housed, and a flange-shaped main engagement portion 14Mb formed at the outer end of this main fitting portion 14Ma.

[0045] As shown in FIG. 2, the secondary fixing member 14S has a rod-shaped secondary fitting portion 14Sa formed around the entire circumference of the end opposite to the side housed in the main fixing member 14M, and a flange-shaped secondary engagement portion 14Sb formed at the outer end of this secondary fitting portion 14Sa.

[0046] With this configuration, the fixing member 14 engages with the engagement recess 23a of the bracket 23 by fitting the small-diameter main fitting portion 14Ma at the lower end (other end) of the main fixing member 14M, so that the flange-shaped main engagement portion 14Mb at the lower end engages in a non-slip state.

[0047] In addition, the small-diameter secondary fitting portion 14Sa on the upper end side (one end side) of the secondary fixing member 14S of the fixing member 14 fits into the engagement opening 13a of the base 13, so that the secondary engagement portion 14Sb on the upper end of the secondary fixing member 14S engages in a non-slip state.

[0048] [Power conversion device: Power module layout] 2, the lower surface of the power module PM is brought into contact with the cooling plate 10 via a heat transfer material 24, thereby enabling heat dissipation from the power module PM. Note that this power conversion device T may be configured so that the lower surface of the power module PM is in direct contact with the cooling plate 10, or may be simply in close proximity without contact.

[0049] In particular, in order to dissipate heat from the power module PM, it is possible to configure it so that it comes into contact with the housing main body 1 (case) via the heat transfer material 24. Furthermore, it is also possible to configure it so that heat dissipation is possible by bringing the bottom surface of the power module PM into direct contact with the housing main body 1 (case) or by bringing it close to the housing main body 1 (case).

[0050] In this power conversion device T, with the terminals 22 of the power module PM connected to the printed wiring 12b of the substrate 12 by solder 15, the main engagement portion 14Mb at the lower end of the fixing member 14 is located at a position separated from the cooling plate 10. In addition, in a configuration in which the substrate 12 is supported by the housing main body 1 (case), the main engagement portion 14Mb at the lower end of the fixing member 14 is separated from the housing main body 1.

[0051] [Power module installation procedure] The procedure for installing the power module PM is shown in Figures 4 to 7.

[0052] (I) First Step: As shown in FIG. 4, in the first step, a pair of bases 13 are attached to the mounting surface 12S of the substrate 12 on which the power module PM is to be placed.

[0053] The base 13 is made of a metal material, such as copper, that can be connected with solder 15, and is fixed by a reflow process. To enable such a reflow process, a mounting surface made of copper foil is formed on the base 13 and the mounting surface 12S. This mounting surface is formed in an area of ​​the mounting surface 12S that is not electrically connected to the printed wiring 12b.

[0054] (II) Second Step: As shown in FIG. 5, in the second step, the terminals 22 of the power module PM are inserted into the corresponding terminal insertion holes 12a of the substrate 12 (see FIG. 2).

[0055] Furthermore, a fixing member 14 is provided between a bracket 23 (see FIG. 3) provided on the package 21 and the base 13. That is, the fixing member 14 is provided in such a manner that a sub-engagement portion 14Sb on the upper end side (one end side) of the fixing member 14 is fitted into an engagement opening 13a of the base 13, and a main engagement portion 14Mb on the lower end side (the other end side) of the fixing member 14 is fitted into an engagement recess 23a of the bracket 23.

[0056] The fixing member 14 can adjust the distance between the sub-engagement portion 14Sb and the main engagement portion 14Mb using the projection adjustment portion V. Therefore, by setting the length of the fixing member 14, the distance from the mounting surface 12S of the substrate 12 to the upper surface of the power module PM can be set to a required value.

[0057] (III) Third Step: As shown in Fig. 6, in the third step, the terminals 22 inserted into the terminal insertion holes 12a of the substrate 12 are connected to the printed wiring 12b by solder 15. This connection by solder 15 may be made by either a reflow process or a soldering iron.

[0058] Such connection by solder 15 is made on both the mounting surface 12S of the substrate 12 on which the power module PM is arranged and the surface of the substrate opposite thereto.

[0059] The operations from the first step (I) to the third step (III) are performed on the substrate 12 in a state where it is separated from the housing body 1. Therefore, the mounting surface 12S side of the substrate 12 is not obscured by the housing body 1 or the cooling plate 10. In addition, an open space is formed between the mounting surface 12S and the power module PM. Therefore, the state of the solder 15 on the mounting surface 12S side of the substrate 12 can be visually confirmed.

[0060] (IV) Fourth Step: As shown in Fig. 7, in the fourth step, the substrate 12 equipped with the power module PM is supported inside the housing body 1 (case). By supporting the power conversion device T in the housing body 1, the substrate 12 reaches a state in which it is indirectly supported by the housing body 1 (case). As explained above, in this embodiment, the substrate 12 is not directly supported by the housing body 1 (case), but Fig. 7 shows a state in which the substrate 12 is directly supported by the housing body 1.

[0061] In this embodiment, when the substrate 12 is supported on the housing main body 1 (case), a heat transfer material 24 is disposed between the bottom surface of the power module PM and the upper surface of the cooling plate 10, as shown in Figures 2 and 7. The heat transfer material 24 is a flexible sheet with good thermal conductivity, or a paste-like material with good thermal conductivity.

[0062] 2 and 7, the main engagement portion 14Mb at the lower end of the fixing member 14 is located at a position separated from the cooling plate 10. Furthermore, in a configuration in which the substrate 12 is supported by the housing main body 1 (case), the main engagement portion 14Mb at the lower end of the fixing member 14 is separated from the housing main body 1.

[0063] [Effects of the embodiment] In this way, the power conversion device T supports the power module PM on the base 13 provided on the substrate 12 via the fixing members 14. Therefore, compared to a configuration in which an intermediate member is temporarily fixed between the substrate 12 and the power module PM by a technique such as adhesion, not only is the intermediate member not required, but the power conversion device T can also be made smaller.

[0064] The power module PM is supported by the fixing member 14, and the fixing member 14 is extendable and contractible by the projection adjustment portion V, so the distance between the mounting surface 12S and the power module PM can be set to any value (in other words, the projection of the terminals 22 relative to the substrate 12 can be set to any value). Therefore, the substrate 12 and the terminals 22 can be easily connected by the solder 15.

[0065] In the power conversion device T, a gap is formed between the power module PM and a mounting surface 12S of the substrate 12 that faces the power module PM, with the power module PM supported on the substrate 12 by solder 15. Furthermore, soldering when mounting the power module PM on the substrate 12 can be performed in a state separated from the housing main body 1. Therefore, it becomes possible to easily visually check the connection state between the mounting surface 12S and the power module PM by the solder 15.

[0066] Furthermore, in the power conversion device T, the main engagement portion 14Mb at the lower end of the fixing member 14 is located at a position separated from the cooling plate 10. As a result, even if the cooling plate 10 vibrates, for example, as when vibrations are transmitted from the outside to the vehicle drive device A, the phenomenon of the vibrations being transmitted to the power module PM can be suppressed, and damage to the power module PM or the joints between the terminals 22 and the substrate 12 due to the vibrations can be suppressed.

[0067] Similarly, for example, if the substrate 12 is configured to be supported by the housing main body 1 (case), even if the housing main body 1 vibrates, such as when vibrations are transmitted from the outside to the vehicle drive device A, the phenomenon of the vibrations being transmitted to the power module PM can be suppressed, and damage to the power module PM or the joints between the terminals 22 and the substrate 12 due to the vibrations can be suppressed.

[0068] [Another embodiment] The present invention may be configured as follows in addition to the above-described embodiments (common numbers and symbols are used to designate components having the same functions as those in the embodiments).

[0069] (a) As partially described in the embodiment, the power conversion device T can be arranged so that the surface of the power module PM opposite to the side facing the substrate 12 is in direct contact with the housing main body 1 (case) or the cooling plate 10, or so that heat is transferred via the heat transfer material 24.

[0070] (b) The shape of the package 21 of the power module PM is not limited to that shown in the embodiment. The shape of the base 13 and the shape of the fixing member 14 can also be set arbitrarily.

[0071] (c) The fixing member 14 is not limited to the structure shown in the embodiment. For example, a screw-type expandable / contractible member such as a turnbuckle can be used. In such a turnbuckle-type expandable / contractible member, the projection adjustment portion V is configured by a screw-type expandable / contractible structure.

[0072] (d) Furthermore, the structure of the fixing member 14 is not limited to that shown in the embodiment. For example, the main fixing member 14M and the sub-fixing member 14S may be arranged in a sliding manner so as to be freely retractable, and each of the main fixing member 14M and the sub-fixing member 14S may have a row of through-holes formed along the extension / retraction direction, and the extension length may be fixed by inserting pins or the like into the through-holes. In this configuration, the projection adjustment portion V is formed by the plurality of through-holes and the pins or the like.

[0073] (e) Furthermore, the fixing member 14 is not limited to one configured to be flexible, and it is also possible to use one with a fixed length. If such a fixed member is used, it is also possible to prepare fixing members 14 of different lengths and use one of the required length.

[0074] (f) The projection adjustment portion V may be configured by a female screw portion formed on the base 13 and a male screw portion formed on the fixing member 14. In this case, by rotating the fixing member 14, the distance between the mounting surface 12S and the power module PM (in other words, the projection of the terminal 22 relative to the substrate 12) can be adjusted.

[0075] (g) As a structure for supporting one end of the fixing member 14 relative to the base 13, for example, a structure in which a hook formed on the fixing member 14 is engaged with a hole formed in the base 13 can be used. Similarly, a structure in which a bracket 23 formed on the power module PM and the other end of the fixing member 14 are engaged with a hook may also be used.

[0076] (h) As a configuration for supporting one end of the fixing member 14 relative to the base 13, and a configuration for supporting the other end of the fixing member 14 relative to the bracket 23 of the power module PM, etc., a screw-type configuration using male and female threads, or a configuration in which a fitting hole having an engaging recess on the inner circumference and a rod material having a claw formed at the tip are used, and when the rod material is inserted into the fitting hole, the claw engages with the engaging recess by rotating the rod material, thereby reaching a non-detachable state, can be used.

[0077] Furthermore, the configurations disclosed in the above embodiments (including other embodiments, the same applies below) can be applied in combination with configurations disclosed in other embodiments, as long as no contradictions arise. Furthermore, the embodiments disclosed in this specification are examples, and the embodiments of the present invention are not limited to these, and can be modified as appropriate within the scope that does not deviate from the purpose of the present invention.

[0078] In the above-described embodiment, the following configurations are envisioned. (1) A power conversion device comprising: a substrate 12 having a mounting surface 12S; a base 13 provided on the mounting surface 12S of the substrate 12; a fixing member 14 having one end supported by the base 13; and a power module PM mounted on the substrate 12 with terminals 22 electrically connected to printed wiring 12b of the substrate 12 by solder 15, wherein the power module PM is supported on the other end of the fixing member 14 and fixed to the substrate 12.

[0079] According to this, by supporting the power module PM on the substrate 12 using the base 13 and the fixing member 14, the power module PM can be disposed at a position separated from the mounting surface 12S of the substrate 12. Furthermore, the power conversion device T can be configured by connecting the terminals 22 of the power module PM to the printed wiring 12b of the substrate 12 with solder 15. In this configuration, unlike the configuration using the temporary fixing member described in Patent Document 1, no temporary fixing member is present between the power module PM and the mounting surface 12S of the substrate 12, and an open space is formed. Furthermore, soldering when mounting the power module PM on the substrate 12 can be performed in a state separated from the housing main body 1 and the cooling plate 10. Therefore, it is easy to check the connection state of the solder 15 on the mounting surface 12S of the substrate 12.

[0080] (2) In the power conversion device T of (1), it is preferable that at least one of the base 13 and the fixing member 14 has a projection adjustment portion V that can adjust the projection of the terminal 22 of the power module PM from the terminal insertion hole 12a formed in the substrate 12.

[0081] According to this, one end of the fixing member 14 is supported on the base 13, the other end of the fixing member 14 is supported on the power module PM, and the projection of the terminal 22 relative to the substrate 12 can be adjusted by adjusting the projection using the projection adjustment unit V. By adjusting this projection, the distance from the mounting surface 12S to the power module PM can also be set arbitrarily.

[0082] (3) In the power conversion device T of (1) or (2), it is preferable that the substrate 12 is supported by a case (housing body 1) that accommodates the substrate 12, and the power module PM is in contact with either the inner surface of the case (housing body 1) or the cooling plate 10 inside the case (housing body 1).

[0083] This allows heat generated in the power module PM to be dissipated by transferring it to the case (housing body 1) or the cooling plate 10.

[0084] In the power converter T of (4)(3), it is preferable that the other end of the fixing member 14 is located at a position separated from the inner surface of the case (housing body 1) or the surface of the cooling plate 10.

[0085] This can suppress the phenomenon in which, when the case (housing main body 1) vibrates, the vibration is transmitted from the case (housing main body 1) to the fixed member 14, or from the case (housing main body 1) to the fixed member 14 via the cooling plate 10. As a result, the vibration is not transmitted to the power module PM, and the vibration does not cause a deterioration in performance, such as damage to the power module PM.

[0086] (Additional Note) It is preferable that the power module PM includes a bracket 23 that protrudes outward, and the other end of the fixing member 14 is fixed to the bracket 23.

[0087] According to this, by fixing one end of the fixing member 14 to the mounting surface 12S side of the substrate 12 and fixing the other end of this fixing member 14 to the bracket 23, the power module PM can be fixed to the mounting surface 12S side of the substrate 12. [Industrial Applicability]

[0088] The present invention can be used in a power conversion device having a power module on a substrate. [Explanation of symbols]

[0089] 1: case, 12: substrate, 12a: terminal insertion hole, 12b: printed wiring, 12S: mounting surface, 13: base, 14: fixing member, 15: solder, 20: cooling plate, 22: terminal, PM: power module, T: power conversion device, V: output adjustment section

Claims

1. a substrate having a mounting surface; a base provided on the mounting surface of the substrate; a fixed member having one end supported by the base; a power module mounted on the substrate with terminals electrically connected to printed wiring on the substrate by soldering; The power module is supported on the other end of the fixing member and fixed to the substrate.

2. 2. The power conversion device according to claim 1, wherein at least one of the base and the fixing member has a projection adjustment portion that can adjust the projection of the terminal of the power module from a terminal insertion hole formed in the substrate.

3. the substrate is supported by a case that houses the substrate; 3. The power conversion device according to claim 1, wherein the power module is in contact with either an inner surface of the case or a cooling plate inside the case.

4. The power conversion device according to claim 3 , wherein the other end of the fixing member is located at a position spaced apart from the inner surface of the case or a surface of the cooling plate.

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