Inductor component

Abstract

To provide an inductor component capable of increasing the short-circuit resistance between first and second inductor wirings adjacent to each other.SOLUTION: An inductor component 1 includes: a first conductor layer; a second conductor layer 12; a first inductor wiring that is provided on the first conductor layer, that is located between the first and second conductor layers in a first direction, and that extends around a first turning axis along the first direction; and a second inductor wiring 22 that is provided on the second conductor layer and that extends around a second turning axis A2 along the first direction, the second conductor layer being located between the first and second inductor wirings in the first direction. The first conductor layer includes a first body portion that extends around the first turning axis, and a first protruding portion 112 that extends from the first body portion in a direction separated from the first turning axis along a second direction X. The second conductor layer includes a second body portion 121 that extends around the second turning axis, and a second protruding portion 122 that extends from the second body portion in a direction separated from the second turning axis along a third direction Y and that is located at a position not overlapping with the first protruding portion when viewed along the first direction.SELECTED DRAWING: Figure 4

Description

[Technical Field]

[0001] The present disclosure relates to inductor components. [Background technology]

[0002] Patent Document 1 discloses an inductor component including a spiral wiring. In the inductor component of Patent Document 1, the spiral wiring is disposed between a first magnetic layer and a second magnetic layer stacked along a first direction. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6922871 Summary of the Invention [Problem to be solved by the invention]

[0004] When multiple inductor components of Patent Document 1 are stacked in the first direction, the inductor component of Patent Document 1 has room for improvement in terms of increasing short-circuit resistance between the spiral wirings of inductor components adjacent in the first direction.

[0005] The present disclosure aims to provide an inductor component that can increase short-circuit resistance between a first inductor wiring located on a first imaginary plane and a second inductor wiring located on a second imaginary plane adjacent to and parallel to the first imaginary plane. [Means for solving the problem]

[0006] An inductor component according to one aspect of the present disclosure includes: a first conductor layer located on a first imaginary plane; a second conductor layer located on a second imaginary plane adjacent to and parallel to the first imaginary plane; a first inductor wiring provided on the first conductor layer, positioned between the first conductor layer and the second conductor layer in a first direction intersecting the first imaginary plane and the second imaginary plane, and extending around a first pivot axis along the first direction; a second inductor wiring provided on the second conductor layer, the second conductor layer being positioned between the first inductor wiring and the second inductor wiring in the first direction, and extending around a second pivot axis along the first direction; Equipped with The first conductor layer is a first main body portion extending about the first pivot axis; a first protrusion extending from the first main body portion in a direction away from the first pivot axis along a second direction intersecting the first direction; Including, The second conductor layer is a second body portion extending about the second pivot axis; a second protrusion extending from the second main body portion in a direction away from the second pivot axis along a third direction intersecting the first direction, and positioned so as not to overlap with the first protrusion when viewed along the first direction; Includes. [Effects of the Invention]

[0007] According to the inductor component of the above aspect, it is possible to improve short-circuit resistance between the first inductor wiring located on the first imaginary plane and the second inductor wiring located on the second imaginary plane adjacent to and parallel to the first imaginary plane. [Brief explanation of the drawings]

[0008] [Figure 1] 1 is a plan view illustrating an inductor component according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] 2 is a schematic plan view illustrating layers of a first inductor wiring and a third inductor wiring of the inductor component of FIG. 1. FIG. [Figure 4]2 is a schematic plan view illustrating layers of a second inductor wiring and a fourth inductor wiring of the inductor component of FIG. 1; [Figure 5] FIG. 2 is a first diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 6] FIG. 2 is a second diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 7] FIG. 3 is a third diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 8] FIG. 4 is a fourth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 9] 1. FIG. 5 is a fifth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 10] FIG. 6 is a sixth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 11] 7 is a seventh diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 12] 8 is an eighth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 13] 9 is a ninth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 14] FIG. 19 is a tenth diagram illustrating an example of a method for manufacturing the inductor component of FIG. [Figure 15] FIG. 2 is a first schematic plan view showing a first modified example of the inductor component of FIG. [Figure 16] 1. FIG. 4 is a second schematic plan view showing a first modified example of the inductor component of FIG. [Figure 17] FIG. 2 is an enlarged side view showing a second modified example of the inductor component of FIG. [Figure 18] FIG. 10 is a perspective view showing a third modified example of the inductor component of FIG. DETAILED DESCRIPTION OF THE INVENTION

[0009] Various aspects of the present disclosure will now be described.

[0010] The inductor component of the first aspect comprises: a first conductor layer located on a first imaginary plane; a second conductor layer located on a second imaginary plane adjacent to and parallel to the first imaginary plane; a first inductor wiring provided on the first conductor layer, positioned between the first conductor layer and the second conductor layer in a first direction intersecting the first imaginary plane and the second imaginary plane, and extending around a first pivot axis along the first direction; a second inductor wiring provided on the second conductor layer, the second conductor layer being positioned between the first inductor wiring and the second inductor wiring in the first direction, and extending around a second pivot axis along the first direction; Equipped with The first conductor layer is a first main body portion extending about the first pivot axis; a first protrusion extending from the first main body portion in a direction away from the first pivot axis along a second direction intersecting the first direction; Including, The second conductor layer is a second body portion extending about the second pivot axis; a second protrusion extending from the second main body portion in a direction away from the second pivot axis along a third direction intersecting the first direction, and positioned so as not to overlap with the first protrusion when viewed along the first direction; Includes.

[0011] The inductor component of the second aspect is the inductor component of the first aspect, When viewed along the first direction, When a virtual line connecting the first pivot axis and the center of the first protrusion in a direction intersecting the second direction is defined as a first virtual line, and a virtual line connecting the second pivot axis and the center of the second protrusion in a direction intersecting the third direction is defined as a second virtual line, The first imaginary line and the second imaginary line form an angle of 80 degrees to 110 degrees.

[0012] An inductor component of a third aspect is the inductor component of the first or second aspect, wherein: an element body in which the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring are located; a first insulating layer provided on the first conductor layer and positioned on the opposite side of the first inductor wiring with respect to the first conductor layer in the first direction; a second insulating layer provided on the second conductor layer and positioned on the opposite side of the second inductor wiring with respect to the second conductor layer in the first direction; Equipped with the first protrusion is located closer to the first pivot axis than an end of the first insulating layer in the second direction when viewed along the first direction, When viewed along the first direction, the second protrusion is located closer to the second pivot axis than the end of the second insulating layer in the third direction.

[0013] An inductor component of a fourth aspect is the inductor component of the third aspect, the element body has a side surface that intersects with the second direction, The second conductor layer has a plurality of protrusions provided on a portion facing the side surface.

[0014] An inductor component of a fifth aspect is the inductor component of any one of the first to fourth aspects, the first conductor layer has a thickness in the first direction that is less than 1.0 μm; The thickness of the first conductor layer is smaller than 1 / 100 of the thickness of the first inductor wiring.

[0015] An inductor component of a sixth aspect is the inductor component of any one of the first to fifth aspects, Each of the first conductor layer and the second conductor layer includes a plurality of layers stacked along the first direction.

[0016] An inductor component of a seventh aspect is the inductor component of any one of the first to sixth aspects, The third insulating layer extends from the first protruding portion toward the second imaginary plane along the first direction, and has a thickness in the first direction that is greater than the thickness of the first inductor wiring.

[0017] An inductor component of an eighth aspect is the inductor component of any one of the first to seventh aspects, an element body including a magnetic material and having the first inductor wiring and the second inductor wiring located therein; an external terminal provided on an outer surface of the element body that intersects with the first direction; a vertical wiring and a fourth insulating layer located inside the element body; Equipped with Among all the inductor wirings including the first inductor wiring and the second inductor wiring, the second inductor wiring is located closest to the external terminal in the first direction, the vertical wiring extends in the first direction and connects the second inductor wiring to the external terminal while being in contact with the magnetic material of the element body in the second direction; The fourth insulating layer is located between the second inductor wiring and the magnetic material of the element body.

[0018] An inductor component of a ninth aspect is the inductor component of any one of the first to eighth aspects, an element body including a magnetic material, the element body having the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring located therein; Of both ends of the first protrusion in the second direction, the tip end farther from the first main body portion is in contact with the magnetic material.

[0019] An inductor component of a tenth aspect is the inductor component of any one of the first to ninth aspects, an element body in which the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring are located; the element body has a side surface that intersects with the second direction, Of both ends of the first protrusion in the second direction, the tip end farther from the first main body is exposed from the side surface and is in contact with at least one insulating layer.

[0020] An inductor component of an eleventh aspect is the inductor component of the tenth aspect, The tip contacts a plurality of insulating layers.

[0021] An inductor component of a twelfth aspect is the inductor component of any one of the first to eleventh aspects, wherein: a rectangular parallelepiped element body in which the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring are located; an external terminal provided on an outer surface of the element body that intersects with the first direction; Equipped with Among all the inductor wirings including the first inductor wiring and the second inductor wiring, the second inductor wiring is located closest to the external terminal in the first direction, the element body has a side surface that intersects with the third direction, the side surface intersecting the third direction includes a side surface extending in the longitudinal direction of the element body, Of both ends of the second protrusion in the third direction, the tip end farther from the second main body portion is exposed only from the side surface extending in the longitudinal direction.

[0022] An inductor component of a thirteenth aspect is the inductor component of any one of the first to twelfth aspects, wherein: an element body including a magnetic material, the element body having the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring located therein; a fourth protrusion located inside the element body and extending from the first main body portion along the second direction toward the first pivot axis; a fifth protrusion located inside the element body and extending from the second main body portion along the third direction toward the second pivot axis; Equipped with one end of the fourth protrusion in the second direction that is closer to the first pivot axis is in contact with the magnetic material of the element body, Of both ends of the fifth protrusion in the third direction, the end closer to the second pivot axis comes into contact with the magnetic material of the element body.

[0023] An inductor component of a fourteenth aspect is the inductor component of the thirteenth aspect, A plurality of the fourth protrusions; A plurality of the fifth protrusions; Equipped with the number of the fourth protrusions is equal to or greater than the number of the first protrusions, The number of the fifth protrusions is equal to or greater than the number of the second protrusions.

[0024] An inductor component of a fifteenth aspect is the inductor component of any one of the first to fourteenth aspects, a third conductor layer located on the first imaginary plane and electrically independent of the first conductor layer; a third inductor wiring provided on the third conductor layer, positioned between the third conductor layer and the second conductor layer in the first direction, and extending in the first direction around a third pivot axis positioned away from the first pivot axis; a third protrusion extending from the third conductor layer along the second direction in a direction away from the third pivot axis; Equipped with The first protrusion and the third protrusion are located on the same imaginary straight line.

[0025] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description does not limit the present disclosure, but is merely exemplary in nature, and appropriate modifications can be made without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of the dimensions do not necessarily correspond to the actual ones. In the following description, terms such as "about," "approximately," or "substantially" mean that the values, shapes, etc. following these terms include an acceptable range of error as determined by a person skilled in the art.

[0026] As shown in FIGS. 1 and 2, the inductor component 1 of the present disclosure includes a first conductor layer 11, a first inductor wiring 21, a second conductor layer 12, and a second inductor wiring 22.

[0027] As shown in FIG. 2, the first conductor layer 11 is located on a first imaginary plane S1, and the second conductor layer 12 is located on a second imaginary plane S2 that is adjacent and parallel to the first imaginary plane S1. Here, "the second imaginary plane S2 is adjacent and parallel to the first imaginary plane S1" means that the first imaginary plane S1 and the second imaginary plane S2 are parallel to each other and that the second imaginary plane S2 is located at a distance in a direction perpendicular to the first imaginary plane S1. The first inductor wiring 21 is provided on the first conductor layer 11 and extends along the first imaginary plane S1. The first inductor wiring 21 is located between the first conductor layer 11 and the second conductor layer 12 in a first direction (e.g., Z direction) that intersects the first imaginary plane S1 and the second imaginary plane S2, and extends (is located) around a first pivot axis A1 that intersects (e.g., is perpendicular to) the first imaginary plane S1. As an example, the first imaginary plane S1 is located at the boundary between the first conductor layer 11 and the first inductor wiring 21. The second inductor wiring 22 is provided on the second conductor layer 12 and extends along the second imaginary plane S2. The second inductor wiring 22 is located on the opposite side of the second conductor layer 12 from the first inductor wiring 21 in the first direction Z, and extends (is located) around a second pivot axis A2 that intersects with (e.g., is perpendicular to) the second imaginary plane S2. As an example, the second imaginary plane S2 is located at the boundary between the second conductor layer 12 and the second inductor wiring 22.

[0028] In this embodiment, as shown in FIGS. 1 to 4 , the inductor component 1 includes a substantially rectangular parallelepiped element body 2, a third conductor layer 13, a fourth conductor layer 14, a third inductor wiring 23 provided on the third conductor layer 13, and a fourth inductor wiring 24 provided on the fourth conductor layer 14. The element body 2 has a size of, for example, 1.2 × 2.1 × 0.55 mm. The third conductor layer 13 is located on a first imaginary plane S1 and is electrically independent from the first conductor layer 11. The fourth conductor layer 14 is located on a second imaginary plane S2 and is electrically independent from the second conductor layer 12. The third inductor wiring 23 extends along the first imaginary plane S1. The fourth inductor wiring 24 extends along the second imaginary plane S2. Between the first imaginary plane S1 and the second imaginary plane S2, layers of the first inductor wiring 21 and the third inductor wiring 23 are located, and between the second imaginary plane S2 and the main surface 202 of the element body 2 described later, layers of the second inductor wiring 22 and the fourth inductor wiring 24 are located.

[0029] The element body 2 includes a magnetic material (magnetic layer) 201, and includes a first conductor layer 11, a second conductor layer 12, a third conductor layer 13, a fourth conductor layer 14, a first inductor wiring 21, a second inductor wiring 22, a third inductor wiring 23, and a fourth inductor wiring 24 located therein. As shown in FIG. 2, the element body 2 has an outer surface (hereinafter referred to as the main surface 202) that intersects with the first direction Z. As shown in FIG. 1, the main surface 202 is provided with a plurality of external terminals (six external terminals 101 to 106 in this embodiment) and an insulating layer 76. The insulating layer 76 has a thickness of, for example, 10 μm. In this embodiment, of all the inductor wirings including the first inductor wiring 21 and the second inductor wiring 22, the second inductor wiring 22 is located closest to the main surface 202 (i.e., the external terminal 101) in the first direction Z. Each of the external terminals 101 to 106 is made of, for example, a laminate of Cu / Ni / Au (=5 / 5 / 0.1 μm).

[0030] 3, when viewed along the first direction Z, the third conductor layer 13 is positioned symmetrically to the first conductor layer 11 with respect to a first center line CL1 that extends on the first imaginary plane S1 in the short-side direction of the inductor component 1 (for example, the X direction), and has a shape symmetrical to the first conductor layer 11 with respect to the first center line CL1. The third inductor wiring 23 is positioned symmetrical to the first inductor wiring 21 with respect to the first center line CL1, and has a shape symmetrical to the first inductor wiring 21 with respect to the first center line CL1. The third inductor wiring 23 is positioned around a third pivot axis A3 that is positioned symmetrical to the first pivot axis A1 with respect to the first center line CL1.

[0031] 4, when viewed along the first direction Z, the fourth conductor layer 14 is positioned symmetrically to the second conductor layer 12 with respect to a second center line CL2 extending in the short direction X on the second imaginary plane S2, and has a shape symmetrical to the second conductor layer 12 with respect to the second center line CL2. The fourth inductor wiring 24 is positioned symmetrical to the second inductor wiring 22 with respect to the second center line CL2, and has a shape symmetrical to the second inductor wiring 22 with respect to the second center line CL2. The fourth inductor wiring 24 is positioned around a fourth pivot axis A4 that is positioned symmetrical to the second pivot axis A2 with respect to the second center line CL2.

[0032] For example, the first pivot axis A1 and the second pivot axis A2 are located on the same line (see FIG. 2), and the third pivot axis A3 and the fourth pivot axis A4 are located on the same line. The first center line CL1 and the second center line CL2 are located at approximately the center of the inductor component 1 in the longitudinal direction (e.g., the Y direction) when viewed along the first direction Z.

[0033] 3, the first inductor wiring 21 has a spiral shape when viewed in the first direction Z, for example. The first pivot axis A1 is located at the center of the outer shape of the first inductor wiring 21, for example. Vias 51 and 52 are connected to both ends of the first inductor wiring 21 in the direction in which the first inductor wiring 21 extends, respectively. The first inductor wiring 21 is formed of, for example, an L / S / t (=100 / 10 / 150 μm) laminate.

[0034] The first inductor wiring 21 has a first portion 211 to a seventh portion 217 .

[0035] The first portion 211 extends from an end portion located near the first pivot axis A1 to which the via 51 is connected in a direction away from the first center line CL1 along the longitudinal direction Y. As an example, the portion of the first portion 211 to which the via 51 is connected constitutes a first output portion.

[0036] The second portion 212 extends in the short direction X from one of both ends of the first portion 211 in the longitudinal direction Y that is farther from the first center line CL1.

[0037] The third portion 213 extends from one of both ends of the second portion 212 in the short-side direction X that is farther from the first portion 211 along the longitudinal direction Y in a direction approaching the first center line CL1.

[0038] The fourth portion 214 extends from one of the ends of the third portion 213 in the longitudinal direction Y that is farther from the second portion 212 in the short direction Y toward the first portion 211.

[0039] The fifth portion 215 extends from one of both ends of the fourth portion 214 in the short-side direction X that is farther from the third portion 213 in the longitudinal direction Y in a direction away from the first center line CL1. The fifth portion 215 is located farther from the first pivot axis A1 in the short-side direction X than the first portion 211, and when viewed from the first pivot axis A1 in the short-side direction X, a part of the fifth portion 215 overlaps with the first portion 211. The fifth portion 215 and the first portion 211 are insulated from each other.

[0040] The sixth portion 216 extends from one of the ends of the fifth portion 215 in the longitudinal direction Y that is farther from the fourth portion 214 in the short direction X toward the third portion 213. The sixth portion 216 is located farther from the first pivot axis A1 in the longitudinal direction Y than the second portion 212, and when viewed from the first pivot axis A1 along the longitudinal direction Y, a part of the sixth portion 216 overlaps with the second portion 212. The sixth portion 216 and the second portion 212 are insulated from each other.

[0041] The seventh portion 217 extends from one of the ends of the sixth portion 216 in the short-side direction X that is farther from the fifth portion 215 along the longitudinal direction Y in a direction approaching the first center line CL1. The seventh portion 217 is located farther from the first pivot axis A1 in the short-side direction X than the third portion 213, and when viewed from the first pivot axis A1 along the short-side direction X, a portion of the seventh portion 217 overlaps with the third portion 213. The seventh portion 217 and the third portion 213 are insulated from each other. A via 52 is connected to one of the ends of the seventh portion 217 in the long-side direction Y that is closer to the first center line CL1. As an example, the portion of the seventh portion 217 to which the via 52 is connected configures a first input section.

[0042] 3, the first conductor layer 11 includes a first main body portion 111 extending (positioned) around the first pivot axis A1, and a protrusion 112 (an example of a first protrusion) provided on the first main body portion 111. In this embodiment, the first main body portion 111 has substantially the same shape as the first inductor wiring 21 when viewed along the first direction Z, and the entire first main body portion 111 overlaps with the first inductor wiring 21. The protrusion 112 extends from the first main body portion 111 in a direction away from the first pivot axis A1 along a second direction (for example, the short-side direction X) intersecting the first direction Z. The first main body portion 111 and the protrusion 112 may be made of the same material or different materials.

[0043] In this embodiment, the first conductor layer 11 has two protrusions 112 extending along the second direction X. The two protrusions 112 are, for example, positioned symmetrically with respect to the first pivot axis A1. Each protrusion 112 is provided in a portion of the first main body 111 corresponding to the fifth portion 215 (in other words, a portion of the first main body 111 overlapping with the fifth portion 215 when viewed along the first direction Z) and in a portion of the first main body 111 corresponding to the seventh portion 217 (in other words, a portion of the first main body 111 overlapping with the seventh portion 217 when viewed along the first direction Z). Of both ends of each protrusion 112 in the second direction X, the tip end farther from the first main body 111 contacts the magnetic material 201 of the element body 2.

[0044] Contact with the magnetic material 201 refers to contact with a portion of the material constituting the magnetic material 201. When the magnetic material 201 is formed, for example, of a composite of resin and inorganic filler (e.g., a composite of epoxy and FeSiCr), the tip of the protrusion 112 contacts at least one of the resin and inorganic filler of the magnetic material 201. The resin contained in the magnetic material 201 includes, for example, epoxy, acrylic, liquid crystal polymer, phenol, and combinations thereof, and is responsible for the strength and good insulating properties of the element body 2. The inorganic filler contained in the magnetic material 201 includes, for example, metal magnetic powder (e.g., Fe, FeSi, FeSiCr, FeNi, etc., containing Fe as the main component). In this case, the magnetic material 201 has high magnetic permeability and high magnetic saturation density. The inorganic filler does not need to be a single type of magnetic powder; it may be a combination of magnetic powders with different compositions and particle sizes, or it may contain an insulating filler such as silica to ensure a linear expansion coefficient and insulating properties.

[0045] 3, the element body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the first inductor wiring 21, and a second region B2 that is farther from the first pivot axis A1 than the first inductor wiring 21. In this embodiment, the first region B1 is surrounded by the first portion 211 to the fourth portion 214 and part of the fifth portion 215 of the first inductor wiring 21 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region B1. The magnetic material 201 in the first region B1 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the portion where the first inductor wiring 21 overlaps (the first portion 211 to the third portion 213 in this embodiment) when viewed along a direction intersecting the first direction from the first pivot axis A1. In other words, when viewed from the first pivot axis A1 along a direction intersecting the first direction, the magnetic material 201 is adjacent to the portion with the largest number of first inductor wirings 21. When viewed from the first pivot axis A1 along the second direction, the non-magnetic material 203 in the first region B1 is provided between the magnetic material 201 in the first region B1 and portions where the first inductor wirings 21 do not overlap (in this embodiment, the fourth portion 214 and the fifth portion 215). When viewed along the first direction Z, the non-magnetic material 203 extends along the third portion 213, the fourth portion 214, and the fifth portion 215. The magnetic material 201 is located throughout the entire second region B2.

[0046] As shown in FIG. 4, the second inductor wiring 22 is positioned around a second pivot axis A2 along the first direction Z. In this embodiment, the second inductor wiring 22 has a spiral shape that is spiral in the opposite direction to the first inductor wiring 21 when viewed along the first direction Z. The second pivot axis A2 is, for example, positioned at the center of the outer shape of the second inductor wiring 22. The second inductor wiring 22 is configured, for example, with an L / S / t (=100 / 10 / 150 μm) laminate. Vias 53 and 54 extending in the first direction Z are connected to both ends of the second inductor wiring 22 in the direction in which the second inductor wiring 22 extends. As shown in FIG. 2, the via 53 connects the second inductor wiring 22 and the vertical wiring 61. The vertical wiring 61 connects the second inductor wiring 22 and the external terminal 101 via the via 53. An insulating layer 75 is located between the second inductor wiring 22 and the vertical wiring 61 in the first direction Z. The insulating layer 75 has a thickness of, for example, 15 μm.

[0047] The second inductor wiring 22 has a first portion 221 to a seventh portion 227.

[0048] The first portion 221 extends from an end portion located near the first pivot axis A1 to which the via 53 is connected in the longitudinal direction Y toward the second center line CL2. As an example, the portion of the first portion 221 to which the via 53 is connected constitutes the second output portion. When viewed along the first direction Z, the via 51 and the via 53 are adjacent to each other. The via 51 connects the portion of the first inductor wiring 21 to which the via 51 is connected and the portion of the second inductor wiring 22 to which the via 53 is connected. In other words, the first output portion and the second output portion are adjacent to each other. "The first output portion and the second output portion are adjacent to each other" refers to, for example, a state in which the via 51 and the via 53 are located in a very small area (e.g., within 20 μm) when viewed along the first direction Z. In this embodiment, the via 51 and the via 53 are located at a distance of approximately 10 μm when viewed along the first direction Z.

[0049] The second portion 222 extends in the short direction X from one of both ends of the first portion 221 in the longitudinal direction Y that is closer to the second center line CL2.

[0050] The third portion 223 extends from one of both ends of the second portion 222 in the short-side direction X that is farther from the first portion 221 along the longitudinal direction Y in a direction away from the second center line CL2.

[0051] The fourth portion 224 extends from one of the ends of the third portion 223 in the longitudinal direction Y that is farther from the second portion 222 in the short direction Y in a direction approaching the first portion 221.

[0052] The fifth portion 225 extends from one of both ends of the fourth portion 224 in the short-side direction X that is farther from the third portion 223 in the longitudinal direction Y toward the second center line CL2. The fifth portion 225 is located farther from the second pivot axis A2 in the short-side direction X than the first portion 221, and when viewed from the second pivot axis A2 in the short-side direction X, a part of the fifth portion 225 overlaps with the first portion 221. The fifth portion 225 and the first portion 221 are insulated from each other.

[0053] The sixth portion 226 extends from one of the ends of the fifth portion 225 in the longitudinal direction Y that is farther from the fourth portion 224 in the short direction X toward the third portion 223. The sixth portion 226 is located farther from the second pivot axis A2 in the longitudinal direction Y than the second portion 222, and when viewed from the second pivot axis A2 in the longitudinal direction Y, a part of the sixth portion 226 overlaps with the second portion 222. The sixth portion 226 and the second portion 222 are insulated from each other.

[0054] The seventh portion 227 extends from one of the ends of the sixth portion 226 in the short-side direction X that is farther from the fifth portion 225 along the longitudinal direction Y in a direction away from the second center line CL2. The seventh portion 227 is located farther from the second pivot axis A2 in the short-side direction X than the third portion 223. When viewed from the second pivot axis A2 along the short-side direction X, a portion of the seventh portion 227 overlaps with the third portion 223. The seventh portion 227 and the third portion 223 are insulated from each other. A via 54 is connected to one of the ends of the seventh portion 227 in the long-side direction Y that is farther from the second center line CL2. As an example, the portion of the seventh portion 227 to which the via 54 is connected constitutes a second input section. As shown in FIGS. 3 and 4 , when viewed along the first direction Z, the vias 52 and 54 are spaced apart in the longitudinal direction Y. That is, the first input portion and the second input portion are positioned apart in the longitudinal direction Y. When viewed along the first direction Z, the vias 52 and 54 are positioned apart by 200 μm or more (for example, 500 μm), thereby separating the first input portion and the second input portion.

[0055] 4, the second conductor layer 12 includes a second main body portion 121 extending (positioned) around the second pivot axis A2 and a protrusion 122 (an example of a second protrusion) provided on the second main body portion 121. When viewed along the first direction Z, the second main body portion 121 has a swirling portion 1211 having substantially the same shape as the second inductor wiring 22, and a non-swirling portion 1212 adjacent to the swirling portion 1211 and electrically independent of it. In this embodiment, when viewed along the first direction Z, the swirling portion 1211 entirely overlaps with the second inductor wiring 22. When viewed along the first direction Z, the non-swirling portion 1212 has an oval shape extending along the longitudinal direction Y, and is adjacent to a portion where the sixth portion 226 and the seventh portion 227 of the second inductor wiring 22 are connected. The swivel portion 1211 and the protrusion portion 122 of the second main body portion 121 may be made of the same material, or may be made of different materials.

[0056] A protruding portion 123 is provided at the center of the non-orbiting portion 1212 in the longitudinal direction Y. The protruding portion 123 extends from the non-orbiting portion 1212 in the short-side direction X and in a direction away from the second pivot axis A2. Of both ends of the protruding portion 123 in the short-side direction X, the tip end farther from the non-orbiting portion 1212 is in contact with the magnetic material 201 of the element body 2. The non-orbiting portion 1212 and the protruding portion 123 of the second main body portion 121 may be made of the same material or different materials.

[0057] As shown in FIG. 4 , in this embodiment, the second conductor layer 12 has two protrusions 122 extending from the second main body portion 121 (the pivoting portion 1211 in this embodiment) along the third direction (for example, the longitudinal direction Y). The two protrusions 122 are, for example, positioned symmetrically with respect to the second pivot axis A2. Each protrusion 122 is provided in a portion of the second main body portion 121 corresponding to the fourth portion 224 (in other words, a portion of the second main body portion 121 overlapping with the fourth portion 224 when viewed along the first direction Z) and a portion of the second main body portion 121 corresponding to the sixth portion 226 (in other words, a portion of the second main body portion 121 overlapping with the sixth portion 226 when viewed along the first direction Z). That is, the protrusions 122 are positioned so as not to overlap the protrusions 112 when viewed along the first direction Z. Of the two ends of each protrusion 122 in the third direction Y, the tip end farther from the second main body portion 121 is in contact with the magnetic material 201 of the element body 2.

[0058] As shown in FIG. 4, the element body 2 has therein a first region C1 that is closer to the second pivot axis A2 than the second inductor wiring 22, and a second region C2 that is farther from the second pivot axis A2 than the second inductor wiring 22. In this embodiment, the first region C1 is surrounded by the first portion 221 to the fifth portion 225 of the second inductor wiring 22 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region C1. The magnetic material 201 in the first region C1 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the first portion 211 to the fourth portion 224. In other words, when viewed along the second direction from the second pivot axis A2, the magnetic material 201 is located near the portion with the largest number of second inductor wirings 22. When viewed along the first direction Z, the non-magnetic material 203 in the first region C1 is adjacent to the magnetic material 201, the first portion 221, the fourth portion 224, and the fifth portion 225 in the first region C1. The magnetic material 201 is located throughout the second region C2.

[0059] 3, a virtual line connecting the first pivot axis A1 and the center of the protrusion 112 in a direction intersecting the second direction (for example, the longitudinal direction Y) is defined as a first virtual line L1. As shown in Fig. 4, a virtual line connecting the second pivot axis A2 and the center of the protrusion 122 in a direction intersecting the third direction (for example, the lateral direction X) is defined as a second virtual line L2. The inductor component 1 is configured such that the first virtual line L1 and the second virtual line L2 form an angle of 80 to 110 degrees.

[0060] 4, the inductor component 1 includes a first pad portion 81 and a second pad portion 82 located on a second imaginary plane S2. When viewed along the first direction Z, the first pad portion 81 is located so as to overlap with the non-wound portion 1212 of the second conductor layer 12. Of both ends of the first pad portion 81 in the longitudinal direction Y, a via 55 is connected to the end closest to the second center line CL2. The first pad portion 81 and the second pad portion 82 are located symmetrically with respect to the second center line CL2 and have shapes symmetrical with respect to the second center line CL2.

[0061] In this embodiment, as shown in FIG. 2 , the inductor component 1 includes a first insulating layer 71 and a second insulating layer 72 located inside the element body 2. The first insulating layer 71 is provided on the first conductor layer 11 and is located on the opposite side of the first inductor wiring 21 with respect to the first conductor layer 11 in the first direction Z. The second insulating layer 72 is provided on the second conductor layer 12 and is located on the opposite side of the second inductor wiring 22 with respect to the second conductor layer 12 in the first direction Z. When viewed along the first direction Z, the protrusion 112 is located closer to the first pivot axis A1 than the end of the first insulating layer 71 in the second direction (e.g., the end 711 in the lateral direction X shown in FIG. 2 ). When viewed along the first direction Z, the protrusion 122 is located closer to the second pivot axis A2 than the end of the second insulating layer 72 in the third direction X (e.g., the end 721 in the lateral direction X shown in FIG. 2 ).

[0062] As an example, the first conductor layer 11 has a thickness in the first direction Z that is less than 1.0 μm. The thickness of the first conductor layer 11 is smaller than 1 / 100 of the thickness of the first inductor wiring 21. The second conductor layer 12 may also be configured in the same manner as the first conductor layer 11. In other words, the second conductor layer 12 may be configured to have a thickness that is less than 1.0 μm and smaller than 1 / 100 of the thickness of the second inductor wiring 22.

[0063] As an example, each of the first conductor layer 11 and the second conductor layer 12 includes a single layer (Cu or Ag) or multiple layers (for example, Ti / Cu) stacked along the first direction Z.

[0064] 2, the inductor component 1 includes a third insulating layer 73 located inside the element body 2. The third insulating layer 73 extends from the protruding portion 112 along the first direction Z toward the second imaginary plane S2. The dimension (thickness) of the third insulating layer 73 in the first direction Z is greater than the thickness of the first inductor wiring 21. The inductor component 1 may also include an insulating layer (not shown) that extends from the protruding portion 122 along the first direction Z in a direction away from the first imaginary plane S1 and has a thickness greater than that of the second inductor wiring 22.

[0065] 2 , the inductor component 1 includes an external terminal 101 provided on the main surface 202, and a vertical wiring 61 and a fourth insulating layer 74 located inside the element body 2. The vertical wiring 61 extends in the first direction Z and connects the second inductor wiring 22 to the external terminal 101 while being in contact with the magnetic material 201 of the element body 2 in the second direction. The fourth insulating layer 74 is located between the second inductor wiring 22 and the magnetic material 201 of the element body 2.

[0066] As an example, as shown in Fig. 3, the protrusion 112 of the first conductor layer 11 and the protrusion 132 (an example of a third protrusion) of the third conductor layer 13 are located on the same imaginary straight line L3, L4. The protrusion 132 extends from the third main body portion 131 in the short direction X in a direction away from the third pivot axis A3. As shown in Fig. 4, the protrusion 122 of the second conductor layer 12 and the protrusion 142 of the fourth conductor layer 14 are located on the same imaginary straight line L2. The protrusion 142 extends from the pivot portion 1411 of the fourth main board portion 141 in the longitudinal direction Y in a direction away from the fourth pivot axis A4.

[0067] The insulating layers (e.g., insulating layers 71, 72, 75) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the first direction Z and the insulating layers (e.g., insulating layers 73, 74) in contact with both ends of the first inductor wiring 21 and the second inductor wiring 22 in the second direction are formed of, for example, different materials. As an example, the insulating layers 71, 72, 75 are formed of an insulating material made of an epoxy system and an inorganic filler, and the insulating layers 73, 74 are formed of an acrylic system insulating material.

[0068] An example of a method for manufacturing the inductor component 1 will be described with reference to Figures 5 to 14. In the following description, the third conductor layer 13, the fourth conductor layer 14, the third inductor wiring 23, and the fourth inductor wiring 24 will not be described. Figures 5 to 14 are drawings corresponding to a cross section taken along line II-II in Figure 1. In the manufacturing method shown in Figures 5 to 14, some or all of the steps are automatically performed using, for example, a manufacturing device for the inductor component 1.

[0069] As shown in FIGS. 5 and 6 , the manufacturing equipment forms a first insulating layer 71 on a first laminate 1001, which is formed by laminating an adhesive layer 1100 and a seed layer (conductor) 1200 on a substrate 1000. Then, a pattern seed 1300 and a permanent resist 1400 are formed over the first insulating layer 71 and the seed layer 1200 to form a second laminate 1002. The pattern seed 1300 constitutes the first conductor layer 11. The first insulating layer 71 is formed, for example, by a process including laminating an insulating layer, photolithography (photolithography), and curing. The pattern seed 1300 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1400 is formed, for example, by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1400 constitutes the nonmagnetic material 203 and the third insulating layer 73.

[0070] 7, the manufacturing equipment simultaneously forms the first inductor wiring 21 and sacrificial copper 1500 on the second laminate 1002, and then forms the second insulating layer 72 on the first inductor wiring 21. The first inductor wiring 21 and the sacrificial copper 1500 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The second insulating layer 72 is formed, for example, by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1501 and the vias 51 and 52 are simultaneously formed during the photolithography process.

[0071] As shown in FIG. 8 , the manufacturing equipment forms a fourth laminate 1004 by forming a pattern seed 1600 located on the second insulating layer 72 and a permanent resist 1700 on the third laminate 1003. The pattern seed 1600 constitutes the second conductor layer 12. The pattern seed 1600 is formed by a process including, for example, sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1700 is formed by a process including permanent resist lamination, photolithography, and hardening. A portion of the permanent resist 1700 constitutes the fourth insulating layer 74.

[0072] The pattern seed 1600 may be formed of the same material as the pattern seed 1300 of the second laminate 1002, or may be formed of a material different from that of the pattern seed 1300. The pattern seeds 1300 and 1600 are formed by selecting an optimum material for each layer. For example, by forming the first-layer pattern seed 1300 from a conductive material containing Ti, it is possible to improve adhesion to the first insulating layer 71 and the seed layer 1200. By forming the second-layer pattern seed 1600 from the same conductive material as the second inductor wiring 22 (for example, only Cu), it is possible to improve connectivity with the vias 53 and 54.

[0073] As shown in FIG. 9 , the manufacturing equipment simultaneously forms the second inductor wiring 22 and sacrificial copper 1800 on the fourth laminate 1004, then forms an insulating layer 75 on the second inductor wiring 22, and forms a vertical wiring 61 on the insulating layer 75 to form a fifth laminate 1005. The second inductor wiring 22 and the sacrificial copper 1800 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 75 is formed by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1801 and vias 53 and 54 are simultaneously formed during the photolithography process. The vertical wiring 61 is formed, for example, by a process including sputtering (full-surface seed formation), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching.

[0074] As shown in FIG. 10 , the manufacturing equipment forms a protective layer 1900 on the vertical wiring 61 of the fifth laminate 1005, then removes the sacrificial copper 1500 and 1800 to form a magnetic path hole 2000, thereby forming a sixth laminate 1006. The protective layer 1900 is formed, for example, by a process including resist lamination and photolithography. The sacrificial copper 1500 and 1800 are removed, for example, by etching. If the first-layer pattern seed 1300 contains Ti, Ti etching is performed after Cu etching, leaving a portion of the seed layer 1200.

[0075] As shown in FIG. 11 , the manufacturing equipment removes the protective layer 1900 from the sixth laminate 1006, then forms a magnetic layer 2100, and forms a solder resist (insulating layer) 2200 on the magnetic layer 2100 to form the seventh laminate 1007. The protective layer 1900 is removed, for example, by a process including resist stripping. The magnetic layer 2100 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding exposes the vertical wiring 61 to the outside. The magnetic layer 2100 constitutes a part of the magnetic material 201. The solder resist 2200 is formed, for example, by a process including solder resist lamination, photolithography, and hardening. The solder resist 2200 has openings 2201 that expose the vertical wiring 61 to the outside. The solder resist 2200 constitutes the insulating layer 76.

[0076] As shown in FIG. 12 , the manufacturing equipment removes the substrate 1000, adhesive layer 1100, and seed layer 1200 from the seventh laminate 1007 to create an eighth laminate 1008. The substrate 1000 and adhesive layer 1100 are removed, for example, by mechanically peeling off the adhesive layer 1100. The seed layer 1200 is removed, for example, by wet etching or polishing. When the seed layer 1200 is removed by wet etching, part of the metal magnetic powder in the magnetic layer 2100 is etched, roughening its surface, thereby improving adhesion with the magnetic layer 2300 formed in the next process.

[0077] As shown in FIG. 13 , the manufacturing equipment forms a magnetic layer 2300 on the eighth laminate 1008 to form a ninth laminate 1009. The magnetic layer 2300 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding is performed to adjust the thickness of the element body 2. The thickness of the element body 2 may be adjusted by adjusting the amount of pressing when forming the magnetic layer 2300 without grinding. The magnetic layer 2300 constitutes a part of the magnetic material 201.

[0078] As shown in Fig. 14, the manufacturing equipment forms external terminals 101 on the ninth laminate 1009, forms a tenth laminate 1010, and then singulates the tenth laminate 1010 to form the inductor component 1 shown in Fig. 2. The external terminals 101 are formed by a process including, for example, sputtering (Cu seed), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching. The singulation is performed, for example, along the dashed lines shown in Fig. 14.

[0079] Instead of forming the external terminals 101, the exposed vertical wiring 61 may serve as the external terminals. By adopting a configuration in which the external terminals 101 are formed in the openings 2201 of the solder resist 2200 and connected to the vertical wiring 61, as in this embodiment, the area of ​​the external terminals 101 can be increased, thereby improving the adhesive strength of the inductor component 1 to other devices, etc. Furthermore, the external terminals 101 can be formed in any shape, such as a convex shape, which increases the degree of freedom when mounting the inductor component 1.

[0080] The external terminals 101 may be formed without forming the solder resist 2200. The external terminals 101 may be formed by forming a seed layer on the entire surface and then performing electrolytic plating, as with the vertical wiring 61. In this case, the external terminals 101 have a structure similar to that of a Cu bump.

[0081] The inductor component 1 can provide the following effects.

[0082] The inductor component 1 includes a first conductor layer 11, a second conductor layer 12, a first inductor wiring 21, and a second inductor wiring 22. The first conductor layer 11 is located on a first imaginary plane S1. The second conductor layer 12 is located on a second imaginary plane S2. The first inductor wiring 21 is provided on the first conductor layer 11, is located between the first conductor layer 11 and the second conductor layer 12 in the first direction Z, and extends around a first pivot axis A1. The second inductor wiring 22 is provided on the second conductor layer 12, is located between the second conductor layer 12 and the first inductor wiring 21 in the first direction Z, and extends around a second pivot axis A2. The first conductor layer 11 includes a first main body portion 111 extending around the first pivot axis A1 and a protrusion portion 112 extending from the first main body portion 111 along the second direction Y in a direction away from the first pivot axis A1. The second conductor layer 12 includes a second body portion 121 extending around the second pivot axis A2 and a protruding portion 122 extending from the second body portion 121 along the third direction X away from the second pivot axis A2 and positioned so as not to overlap the protruding portion 112 when viewed along the first direction Z. This configuration realizes an inductor component 1 that can improve short-circuit resistance (interlayer short-circuit resistance) between the first inductor wiring 21 located on the first imaginary plane S1 and the second inductor wiring 22 located on the second imaginary plane S2 adjacent to and parallel to the first imaginary plane S1. Furthermore, the provision of the protruding portions 112 and 122 enables power supply via an insulating layer, allowing the first inductor wiring 21 and the second inductor wiring 22 to be formed by plating growth. Plating growth (e.g., electrolytic plating) can form the first conductor layer 11 and the second conductor layer 12 with extremely high purity, thereby enabling the formation of the first inductor wiring 21 and the second inductor wiring 22 with high conductivity. As a result, the DC electrical resistance of the inductor component 1 can be reduced. The second direction is not limited to the longitudinal direction Y, but may be the lateral direction X, or may be a direction having components or vectors in both the lateral direction X and the longitudinal direction Y. The third direction is not limited to the lateral direction X, but may be the longitudinal direction Y, or may be a direction having components or vectors in both the lateral direction X and the longitudinal direction Y. The second and third directions may be the same direction (for example, the longitudinal direction Y).

[0083] The first imaginary straight line L1 and the second imaginary straight line L2 form an angle of 80 degrees to 110 degrees. With this configuration, it is possible to more reliably increase resistance to interlayer short circuits.

[0084] The inductor component 1 includes an element body 2, a first insulating layer 71, and a second insulating layer 72. The first insulating layer 71 is provided on the first conductor layer 11 and is located on the opposite side of the first inductor wiring 21 from the first conductor layer 11 in the first direction Z. The second insulating layer 72 is provided on the second conductor layer 12 and is located on the opposite side of the second inductor wiring 22 from the second conductor layer 12 in the first direction Z. When viewed along the first direction Z, the protrusion 112 is located closer to the first pivot axis A1 than the end of the first insulating layer 71 in the second direction Y. When viewed along the first direction Z, the protrusion 122 is located closer to the second pivot axis A2 than the end of the second insulating layer 72 in the third direction X. This configuration ensures insulation between the first inductor wiring 21 and the second inductor wiring 22, thereby improving the design freedom of the inductor component 1.

[0085] The first conductor layer 11 has a thickness of less than 1.0 μm. The thickness of the first conductor layer 11 is less than 1 / 100 of the thickness of the first inductor wiring 21. With this configuration, the first conductor layer 11 is sufficiently thin compared to the first inductor wiring 21, so that the resistance of the first inductor wiring 21, rather than the first conductor layer 11, becomes dominant. As a result, the selectivity of the metal material constituting the first conductor layer 11 is improved. Furthermore, because the thickness of the first conductor layer 11 itself is sufficiently thin, interlayer short circuits via the first conductor layer 11 can be suppressed. For example, if the first conductor layer 11 is Ti / Cu deposited by sputtering, Ti is formed to a thickness of 30 nm and Cu is formed to a thickness of 800 nm. The first conductor layer 11 can be formed by electroless plating or printing, in addition to sputtering. For example, Au, Ag, or Al can be used as the material for the first conductor layer 11.

[0086] Each of the first conductor layer 11 and the second conductor layer 12 includes multiple layers stacked along the first direction Z. This configuration increases the degree of freedom in designing the inductor component 1, thereby reducing costs without compromising the quality of the inductor component 1. For example, the number of layers forming each conductor layer can be set arbitrarily depending on the layer. For example, by configuring the first conductor layer 11 to include two layers (Ti / Cu) and the second conductor layer 12 to include two layers (Cu), it is possible to improve the adhesion of the first conductor layer 11 to the resin while also improving the adhesion of the second conductor layer 12 to copper (sacrificial copper).

[0087] The inductor component 1 includes a third insulating layer 73. The third insulating layer 73 extends from the protruding portion 112 toward the second imaginary plane S2 along the first direction Z, and has a thickness greater than that of the first inductor wiring 21. This configuration ensures insulation between the first layer including the first conductor layer 11 and the first inductor wiring 21 and the second layer including the second conductor layer 12 and the second inductor wiring 22.

[0088] The inductor component 1 includes an external terminal 101, a vertical wiring 61 located inside an element body 2, and a fourth insulating layer 74. Of all the inductor wirings, including the first inductor wiring 21 and the second inductor wiring 22, the second inductor wiring 22 is located closest to the external terminal 101 in the first direction Z. The vertical wiring 61 extends in the first direction Z and connects the second inductor wiring 22 to the external terminal 101 while being in contact with the magnetic material 201 of the element body 2 in the second direction. The fourth insulating layer 74 is located between the second inductor wiring 22 and the magnetic material 201 of the element body 2. The vertical wiring 61 is a wiring for connecting to the external terminal 101, and therefore insulation can be ensured even without an insulating layer. This eliminates the need for a process for forming an insulating layer on the vertical wiring 61, thereby reducing the manufacturing cost of the inductor component 1. The vertical wiring 61 is not limited to being connected to the second inductor wiring 22 via a via 53, but may also be directly connected to the second inductor wiring 22. Furthermore, the vertical wiring 61 may be connected to the second inductor wiring 22 via a seed layer or a layer required for forming the vertical wiring 61 in addition to the via 53 .

[0089] Of both ends of the protrusion 112 in the second direction, the tip end farther from the first body 111 is in contact with the magnetic material 201 of the element body 2. This configuration can suppress corrosion of the first conductor layer 11. Furthermore, because the protrusion 112 is not exposed from the element body 2, the first conductor layer 11 can be isolated within the inductor component 1, allowing multiple electrically independent inductor wirings to be arranged on the same imaginary plane. As a result, the design freedom of the inductor component 1 can be improved.

[0090] The inductor component 1 is located on a first imaginary plane S1 and includes a third conductor layer 13 that is electrically independent of the first conductor layer, and a third inductor wiring 23 provided on the third conductor layer 13. The protruding portion 112 of the first conductor layer 11 and the protruding portion 132 of the third conductor layer 13 are located on the same imaginary straight lines L3 and L4. This configuration makes it possible to realize an inductor component 1 in which multiple electrically independent inductor wirings are arranged on the same imaginary plane.

[0091] The inductor component 1 can be configured as follows.

[0092] The inductor component 1 may be configured such that the protrusions 122 and 123 are the "second protrusions," or such that only the protrusions 122 or only the protrusions 123 are the "second protrusions." In the inductor component 1 having the layers shown in FIGS. 3 and 4, when viewed along the first direction Z, not only the protrusions 122 but also the protrusions 123 are positioned so as not to overlap with the protrusions 112. In the inductor component 1 having the layers shown in FIGS. 15 and 16, when viewed along the first direction Z, the protrusions 122 and 123 are positioned so as not to overlap with the protrusions 112. In the inductor component 1 having the layers shown in FIGS. 15 and 16, the second conductor layer 12 has multiple protrusions 122 and 123 provided in a portion facing the side surface 204 of the element body 2, allowing multiple plating power feeders to be provided on the same imaginary plane S2. As a result, the design flexibility of the inductor component 1 can be improved. In addition to or instead of the second conductor layer 12, the first conductor layer 11 may have a plurality of protrusions provided on a portion facing the side surface 204 of the element body 2. The side surface of the element body 2 on which the plurality of protrusions are provided may be a side surface other than the side surface 204.

[0093] 15 and 16, the tip of the protrusion 112, one of the ends in the third direction X that is farther from the first body portion 111, is exposed from side surfaces 204 and 205 of the element body 2 and is in contact with at least one insulating layer. The insulating layer improves the interlayer short-circuit resistance, solder short-circuit resistance, and corrosion resistance of the protrusion 112. In the inductor component 1 shown in FIGS. 15 and 16, the tips of the protrusions 122 and 123 are also exposed from the side surfaces 204 and 205. The side surfaces 204 and 205 form a pair of side surfaces of the element body 2 that intersect with the third direction X.

[0094] For example, by performing down-cutting or up-cutting (moving the blade while rotating it in the first direction Z) during singulation (see FIG. 14), the insulating layers (e.g., first insulating layer 71 and third insulating layer 73) positioned around the protrusion 112 are stretched to cover the tip of the protrusion 112, as shown in FIG. 17. At the same time, the insulating layers (e.g., second insulating layer 72 and fourth insulating layer 74) positioned around the protrusion 122 are stretched to cover the tip of the protrusion 122. This results in the protrusions 112 and 122 having their tips in contact with at least one insulating layer.

[0095] 17, the stretched portion of the first insulating layer 71 is indicated by 710, and the stretched portion of the third insulating layer 73 is indicated by 730. By configuring the protrusion 112 so that its tip contacts multiple insulating layers in this way, the interlayer short-circuit resistance, solder short-circuit resistance, and corrosion resistance of the protrusion 112 are more reliably improved. By covering the tip of the protrusion 112 with an insulating filler such as silica contained in the first insulating layer 71 or the third insulating layer 73, the interlayer short-circuit resistance and the like are further improved.

[0096] Of all the inductor wirings, including the first inductor wiring 21 and the second inductor wiring 22, the second inductor wiring 22 is located closest to the external terminal 107 in the first direction Z. If the tip of the protrusion 122 of the second conductor layer 12 located closest to the external terminal 107 is exposed from the element body 2, there is a possibility of a solder short circuit. As shown in FIG. 18 , the inductor component 1 is configured so that the tip of the protrusion 122 is exposed only from the side surface 204 of the element body 2 that intersects with the third direction X, thereby reducing the risk of a solder short circuit. By exposing the tip of the protrusion 122 from the center of the side surface 204 in the second direction Y, the risk of a solder short circuit can be more reliably reduced. In the inductor component 1 shown in FIG. 18 , the tip of the protrusion 112 is exposed only from the side surface 206 of the element body 2 that extends in the third direction X. In other words, in layers of inductor wirings other than the inductor wiring located closest to the external terminal, the tip of the protrusion may be exposed from a side surface other than the side surface extending in the second direction Y.

[0097] The inductor component 1 may include at least one fourth protrusion extending from the first body portion 111 along the second direction toward the first pivot axis A1, and at least one fifth protrusion extending from the second body portion 121 along the third direction toward the second pivot axis A2. The inductor component 1 shown in FIGS. 15 and 16 includes three protrusions 113, 114, and 115 as examples of fourth protrusions and three protrusions 124, 125, and 126 as examples of fifth protrusions. The protrusions 113 and 115 extend along the third direction X, and one of their ends in the third direction X that is closer to the first pivot axis A1 contacts the magnetic material 201 of the element body 2. The protrusion 114 extends along the second direction Y, and one of their ends in the second direction Y that is closer to the first pivot axis A1 contacts the magnetic material 201 of the element body 2. The protrusions 124 and 126 extend along the third direction X, and of their ends in the third direction X, the end closer to the second pivot axis A2 contacts the magnetic material 201 of the element body 2. The protrusion 125 extends along the second direction Y, and of their ends in the second direction Y, the end closer to the second pivot axis A2 contacts the magnetic material 201 of the element body 2. This configuration facilitates the formation of sacrificial copper and enables the magnetic path hole to be formed wide (with precision), thereby increasing the volume of the magnetic material 201 that can be filled and improving the efficiency with which inductance can be obtained from the inductor component 1. Furthermore, since the conductor layers can be connected, resistance during plating growth is reduced and variations in plating thickness are suppressed, resulting in an inductor component 1 having the designed DC electrical resistance.

[0098] In the inductor component 1 shown in FIGS. 15 and 16, the number of fourth protrusions (i.e., protrusions 113, 114, and 115) is equal to or greater than the number of first protrusions (i.e., two protrusions 112), and the number of fifth protrusions (i.e., protrusions 124, 125, and 126) is equal to or greater than the number of second protrusions (two protrusions 122 and protrusion 123). Increasing the number of protrusions extending toward each pivot axis reduces the resistance of the conductor layer, facilitating plating growth of sacrificial copper to form the internal magnetic path in the first regions B1 and C1. This allows the next inductor wiring layer to be formed on a flat surface, suppressing variations in the first inductor wiring 21 and the second inductor wiring 22, resulting in an inductor component 1 with the designed DC electrical resistance.

[0099] The inductor component 1 may be configured to include conductor layers located on three or more parallel imaginary planes and inductor wiring provided on each of these conductor layers, i.e., the inductor component 1 may include three or more layers of inductor wiring.

[0100] The inductor component 1 may be configured so that only the first conductor layer 11 is located on the first imaginary plane S1, or so that three or more conductor layers including the first conductor layer 11 and the third conductor layer 13 are located on the first imaginary plane S1. Similarly, the inductor component 1 may be configured so that only the second conductor layer 12 is located on the second imaginary plane S2, or so that three or more conductor layers including the second conductor layer 12 and the fourth conductor layer 14 are located on the second imaginary plane S2.

[0101] The angle formed by the first virtual straight line L1 and the second virtual straight line L2 is not limited to an angle between 80 degrees and 110 degrees, and may be another angle.

[0102] The insulating layers (e.g., first insulating layer 71, second insulating layer 72, third insulating layer 73 and fourth insulating layer 74) located inside the element body 2, the vertical wiring 61 and the vias 51, 52, 53, 54 and 55 may be omitted depending on the design of the inductor component 1, etc.

[0103] The shape and size of each part constituting the inductor component 1 are not limited to the above-described embodiments and can be set arbitrarily depending on the design of the inductor component 1. For example, the thickness of the first conductor layer 11 of the inductor component 1 is not limited to being less than 1.0 μm and less than 1 / 100 of the thickness of the first inductor wiring.

[0104] Each inductor wiring may have a spiral shape when viewed in the first direction Z. For example, each inductor wiring may be a curve with one or more windings (turns), or a curve with less than one winding. Each inductor wiring may have a linear shape in part.

[0105] Each inductor wiring may have a spiral shape when viewed in the first direction Z. For example, each inductor wiring may be a curve with one or more windings (turns), or a curve with less than one winding. Each inductor wiring may have a linear shape in part.

[0106] The embodiments and modifications of the present disclosure can be combined with each other, or with modifications, or with each other. Features included in the embodiments and modifications of the present disclosure can also be combined with each other.

[0107] The disclosure of the present disclosure may vary in structural details, and changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the claimed disclosure. [Explanation of symbols]

[0108] 1. Inductor components 2 Base 201 Magnetic materials 202 Main surface 203 Non-magnetic materials 204, 205, 206 Side 11 First conductor layer 111 First main body part 112, 113, 114, 115 protrusion 12 Second conductor layer 121 Second main body 1211 Swivel section 1212 Non-rotating part 122, 123, 124, 125, 126, 132, 142 Protrusion 13 Third conductor layer 14 Fourth conductor layer 21 First inductor wiring 22 Second inductor wiring 23 Third inductor wiring 24 Fourth inductor wiring 51, 52, 53, 54, 55 vias 61 Vertical wiring 71 First insulating layer 72 Second insulating layer 73 Third insulating layer 74 Fourth insulating layer 75, 76 Insulating layer 81 First pad section 82 Second pad section 101, 102, 103, 104, 105, 106, 107 External terminals

Claims

1. a first conductor layer located on a first imaginary plane; a second conductor layer located on a second imaginary plane adjacent to and parallel to the first imaginary plane; a first inductor wiring provided on the first conductor layer, positioned between the first conductor layer and the second conductor layer in a first direction intersecting the first imaginary plane and the second imaginary plane, and extending around a first pivot axis along the first direction; a second inductor wiring provided on the second conductor layer, the second conductor layer being positioned between the first inductor wiring and the second conductor layer in the first direction, and extending around a second pivot axis along the first direction; Equipped with The first conductor layer is a first body portion extending about the first pivot axis; a first protrusion extending from the first main body portion in a direction away from the first pivot axis along a second direction intersecting the first direction; Including, The second conductor layer is a second body portion extending about the second pivot axis; a second protrusion extending from the second main body portion in a direction away from the second pivot axis along a third direction intersecting the first direction, and positioned so as not to overlap with the first protrusion when viewed along the first direction; , an inductor component.

2. When viewed along the first direction, When a virtual line connecting the first pivot axis and the center of the first protrusion in a direction intersecting the second direction is defined as a first virtual line, and a virtual line connecting the second pivot axis and the center of the second protrusion in a direction intersecting the third direction is defined as a second virtual line, 2. The inductor component according to claim 1, wherein the first imaginary line and the second imaginary line form an angle of 80 degrees to 110 degrees.

3. an element body in which the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring are located; a first insulating layer provided on the first conductor layer and positioned on the opposite side of the first inductor wiring with respect to the first conductor layer in the first direction; a second insulating layer provided on the second conductor layer and positioned on the opposite side of the second inductor wiring with respect to the second conductor layer in the first direction; Equipped with the first protrusion is located closer to the first pivot axis than an end of the first insulating layer in the second direction when viewed along the first direction, The inductor component according to claim 1 or 2, wherein the second protrusion is located closer to the second pivot axis than the end of the second insulating layer in the third direction when viewed along the first direction.

4. the element body has a side surface that intersects with the second direction, The inductor component according to claim 3 , wherein the second conductor layer has a plurality of protrusions provided on a portion facing the side surface.

5. the first conductor layer has a thickness in the first direction that is less than 1.0 μm; The inductor component according to claim 1 , wherein the thickness of the first conductor layer is smaller than 1 / 100 of the thickness of the first inductor wiring.

6. The inductor component according to claim 1 , wherein each of the first conductor layer and the second conductor layer includes a plurality of layers stacked along the first direction.

7. 3. The inductor component according to claim 1, further comprising a third insulating layer extending from the first protrusion along the first direction toward the second imaginary plane and having a thickness in the first direction that is greater than the thickness of the first inductor wiring.

8. an element body including a magnetic material and having the first inductor wiring and the second inductor wiring located therein; an external terminal provided on an outer surface of the element body that intersects with the first direction; a vertical wiring and a fourth insulating layer located inside the element body; Equipped with Among all the inductor wirings including the first inductor wiring and the second inductor wiring, the second inductor wiring is located closest to the external terminal in the first direction, the vertical wiring extends in the first direction and connects the second inductor wiring to the external terminal while being in contact with the magnetic material of the element body in the second direction; 3. The inductor component according to claim 1, wherein the fourth insulating layer is located between the second inductor wiring and the magnetic material of the element body.

9. an element body including a magnetic material, the element body having the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring located therein; The inductor component according to claim 1 , wherein the tip end of the first protrusion, which is farther from the first body portion than the tip end in the second direction, is in contact with the magnetic material.

10. an element body having the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring located therein; the element body has a side surface that intersects with the second direction, 3. The inductor component according to claim 1, wherein the tip end of the first protrusion, which is farther from the first body portion than the other end in the second direction, is exposed from the side surface and is in contact with at least one insulating layer.

11. The inductor component of claim 10 , wherein the tip contacts a plurality of insulating layers.

12. a rectangular parallelepiped element body in which the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring are located; an external terminal provided on an outer surface of the element body that intersects with the first direction; Equipped with Among all the inductor wirings including the first inductor wiring and the second inductor wiring, the second inductor wiring is located closest to the external terminal in the first direction, the element body has a side surface that intersects with the third direction, the side surface intersecting the third direction includes a side surface extending in a longitudinal direction of the element body, 3 . The inductor component according to claim 1 , wherein the tip end of the second protrusion, which is farther from the second body portion than the other end in the third direction, is exposed only from the side surface extending in the longitudinal direction.

13. an element body including a magnetic material, the element body having the first conductor layer, the second conductor layer, the first inductor wiring, and the second inductor wiring located therein; a fourth protrusion located inside the element body and extending from the first main body portion along the second direction toward the first pivot axis; a fifth protrusion located inside the element body and extending from the second main body portion along the third direction toward the second pivot axis; Equipped with one end of the fourth protrusion in the second direction that is closer to the first pivot axis is in contact with the magnetic material of the element body, 3 . The inductor component according to claim 1 , wherein one of the ends of the fifth protrusion in the third direction that is closer to the second pivot axis is in contact with the magnetic material of the element body.

14. A plurality of the fourth protrusions; A plurality of the fifth protrusions; Equipped with the number of the fourth protrusions is equal to or greater than the number of the first protrusions, The inductor component according to claim 13 , wherein the number of the fifth protrusions is equal to or greater than the number of the second protrusions.

15. a third conductor layer located on the first imaginary plane and electrically independent of the first conductor layer; a third inductor wiring provided on the third conductor layer, positioned between the third conductor layer and the second conductor layer in the first direction, and extending in the first direction around a third pivot axis positioned away from the first pivot axis; a third protrusion extending from the third conductor layer along the second direction in a direction away from the third pivot axis; Equipped with The inductor component according to claim 1 , wherein the first protrusion and the third protrusion are positioned on the same imaginary straight line.

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