Inductor component and buck converter

Abstract

To provide an inductor component with which it is possible to improve the efficiency of inductance acquisition.SOLUTION: An inductor component comprises: first inductor wiring extending along a first virtual plane and extending around a first swing shaft along a first direction intersecting the first virtual plane; second inductor wiring extending along a second virtual plane adjoining the first virtual plane in parallel and extending around a second swing shaft along the first direction; and an element body which includes a magnetic material, and in which the first inductor wiring and the second inductor wiring are located. The magnetic material includes a first magnetic part located in a region closer to the first swing shaft than the first inductor wiring, and a second magnetic part located in a region closer to the second swing shaft than the second inductor wiring. The first magnetic part and the second magnetic part are constituted to coincide when seen along the first direction. The first swing shaft and the second swing shaft are located apart from each other in a second direction intersecting the first direction.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present disclosure relates to an inductor component and a buck converter including the inductor component. [Background technology]

[0002] Patent Document 1 discloses a coil component including a magnetic support layer, a first coil pattern arranged on a first main surface of the magnetic support layer, and a second coil pattern arranged on a second main surface of the magnetic support layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 2023-148899 Summary of the Invention [Problem to be solved by the invention]

[0004] The coil component of Patent Document 1 has room for improvement in terms of improving the efficiency of obtaining inductance.

[0005] An object of the present disclosure is to provide an inductor component and a buck converter that can improve the efficiency of obtaining inductance. [Means for solving the problem]

[0006] An inductor component according to one aspect of the present disclosure includes: a first inductor wiring extending along a first imaginary plane and positioned around a first pivot axis along a first direction intersecting the first imaginary plane; a second inductor wiring extending along a second imaginary plane adjacent to and parallel to the first imaginary plane and positioned around a second pivot axis along the first direction; an element body including a magnetic material and having the first inductor wiring and the second inductor wiring located therein; Equipped with The magnetic material is a first magnetic portion located in a region closer to the first pivot axis than the first inductor wiring; a second magnetic portion located in a region closer to the second pivot axis than the second inductor wiring; Including, the first magnetic portion and the second magnetic portion are configured to coincide when viewed along the first direction, The first pivot axis and the second pivot axis are spaced apart in a second direction that intersects with the first direction.

[0007] A buck converter according to one aspect of the present disclosure includes: a package substrate configured to be connectable to a semiconductor module; the inductor component according to the above aspect, which is located inside the package substrate; Equipped with The inductor component includes an external terminal provided on an outer surface of the element body that intersects the first direction and faces the semiconductor module when the semiconductor module is connected to the package substrate. [Effects of the Invention]

[0008] According to the inductor component and the buck converter of the above aspect, the efficiency of obtaining inductance can be improved. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a plan view illustrating an inductor component according to one embodiment of the present disclosure. [Figure 2] FIG. 2 is a cross-sectional view taken along line II-II in FIG. [Figure 3] 2 is a schematic plan view illustrating layers of a first inductor wiring and a third inductor wiring of the inductor component of FIG. 1. FIG. [Figure 4] 2 is a schematic plan view illustrating layers of a second inductor wiring and a fourth inductor wiring of the inductor component of FIG. 1; [Figure 5]FIG. 2 is a first diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 6] FIG. 2 is a second diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 7] FIG. 3 is a third diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 8] FIG. 4 is a fourth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 9] 1. FIG. 5 is a fifth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 10] FIG. 6 is a sixth diagram for explaining an example of a method for manufacturing the inductor component of FIG. [Figure 11] 7 is a seventh diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 12] 8 is an eighth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1; [Figure 13] 9 is a ninth diagram for explaining an example of a method for manufacturing the inductor component of FIG. 1. FIG. [Figure 14] FIG. 19 is a tenth diagram illustrating an example of a method for manufacturing the inductor component of FIG. [Figure 15] FIG. 2 is a circuit diagram showing a buck converter including the inductor components of FIG. 1. [Figure 16] 16 is a side view of the inductor component of the buck converter of FIG. 15. DETAILED DESCRIPTION OF THE INVENTION

[0010] Various aspects of the present disclosure will now be described.

[0011] The inductor component of the first aspect comprises: a first inductor wiring that extends along a first imaginary plane and that extends around a first pivot axis along a first direction that intersects with the first imaginary plane; a second inductor wiring extending along a second imaginary plane adjacent to and parallel to the first imaginary plane and extending around a second pivot axis along the first direction; an element body including a magnetic material and having the first inductor wiring and the second inductor wiring located therein; Equipped with The magnetic material is a first magnetic portion located in a region closer to the first pivot axis than the first inductor wiring; a second magnetic portion located in a region closer to the second pivot axis than the second inductor wiring; Including, the first magnetic portion and the second magnetic portion are configured to coincide when viewed along the first direction, The first pivot axis and the second pivot axis are spaced apart in a second direction that intersects with the first direction.

[0012] The inductor component of the second aspect is the inductor component of the first aspect, The first magnetic portion and the second magnetic portion are made of a composite material of a metal magnetic alloy containing iron element in the largest amount and an organic resin.

[0013] An inductor component of a third aspect is the inductor component of the first or second aspect, wherein: Both ends of the first inductor wiring in an extending direction of the first inductor wiring are defined as a first end and a second end, When both ends of the second inductor wiring in the direction in which the second inductor wiring extends are defined as a third end and a fourth end, The first end and the third end are electrically independent, and the second end and the fourth end are electrically connected.

[0014] The inductor component of a fourth aspect is the inductor component of the third aspect, an external terminal provided on an outer surface of the element body that intersects with the first direction; a vertical wiring connecting the fourth end and the external terminal; a via conductor connecting the second end and the fourth end; Equipped with.

[0015] An inductor component of a fifth aspect is the inductor component of any one of the first to fourth aspects, When viewed along the first direction, the outer shape of the first inductor wiring and the outer shape of the second inductor wiring match.

[0016] An inductor component of a sixth aspect is the inductor component of any one of the first to fifth aspects, The first inductor wiring has a direction of rotation about the first pivot axis opposite to the direction of rotation about the second inductor wiring.

[0017] An inductor component of a seventh aspect is the inductor component of any one of the first to sixth aspects, the first inductor wiring has a spiral shape with a number of turns greater than one, the element body has a first region therein that is closer to the first pivot axis than the first inductor wiring; the first magnetic portion and the nonmagnetic material are located in the first region, The first magnetic portion is adjacent to a portion where the number of first inductor wires is greatest when viewed from the first pivot axis along the second direction.

[0018] An inductor component of an eighth aspect is the inductor component of the seventh aspect, The non-magnetic material includes a photosensitive insulating material.

[0019] An inductor component of a ninth aspect is the inductor component of the seventh or eighth aspect, wherein: the non-magnetic material extends along the first inductor wiring, When viewed along the first direction, the dimension of the non-magnetic material in a direction perpendicular to the direction in which the non-magnetic material extends is defined as the width of the non-magnetic material, and the dimension of the first inductor wiring in a direction perpendicular to the direction in which the first inductor wiring extends is defined as the width of the first inductor wiring, The maximum width of the nonmagnetic material is greater than the maximum width of the first inductor wiring.

[0020] An inductor component of a tenth aspect is the inductor component of the third aspect, a first external terminal, a second external terminal, and a third external terminal provided on outer surfaces of the element body that intersect with the first direction, the first external terminal is electrically connected to the first end, the second external terminal is electrically connected to the second end and the fourth end, the third external terminal is electrically connected to the third end portion, When viewed along the first direction, the area of ​​the second external terminal is larger than the areas of the first external terminal and the third external terminal.

[0021] An inductor component of an eleventh aspect is the inductor component of any one of the first to tenth aspects, The first pad extends along the second imaginary plane and is adjacent to the second inductor wiring while being electrically independent from the second inductor wiring.

[0022] The buck converter of the twelfth aspect is A package substrate; an inductor component according to a third embodiment, which is located inside the package substrate; Equipped with The second end and the fourth end are configured to be connected to a load side.

[0023] The buck converter of the thirteenth aspect is a package substrate configured to be connectable to a semiconductor module; an inductor component according to any one of the first to eleventh aspects, which is located inside the package substrate; Equipped with The inductor component includes an external terminal provided on an outer surface of the element body that intersects the first direction and faces the semiconductor module when the semiconductor module is connected to the package substrate.

[0024] The buck converter of the fourteenth aspect is A package substrate; an inductor component according to any one of the first to eleventh aspects, which is located inside the package substrate; Equipped with The inductor component is a third inductor wiring extending along the first imaginary plane and spaced apart from the first inductor wiring in the second direction; The absolute value of the magnetic coupling between the first inductor wiring and the second inductor wiring is greater than the absolute value of the magnetic coupling between the first inductor wiring and the third inductor wiring, and is in the range of 0.2 to 0.7.

[0025] A buck converter according to a fifteenth aspect is the buck converter according to the thirteenth aspect, When viewed along the first direction, the inductor component is located inside the outer shape of the semiconductor module.

[0026] Hereinafter, embodiments of the present disclosure will be described with reference to the drawings. The following description does not limit the present disclosure, but is essentially merely illustrative, and appropriate modifications can be made without departing from the spirit of the present disclosure. The drawings are schematic, and the ratios of dimensions and the like do not necessarily correspond to reality.

[0027] As shown in FIGS. 1 and 2, the inductor component 1 of the present disclosure includes a first inductor wiring 21, a second inductor wiring 22, and an element body 2. As shown in FIG. 2, the first inductor wiring 21 extends along a first imaginary plane S1, and as shown in FIG. 3, the first inductor wiring 21 extends (is located) around a first pivot axis A1 along a first direction (e.g., the Z direction) intersecting the first imaginary plane S1. As shown in FIG. 2, the second inductor wiring 22 extends along a second imaginary plane S2 adjacent to and parallel to the first imaginary plane S1, and as shown in FIG. 4, the second inductor wiring 22 extends (is located) around a second pivot axis A2 along the first direction Z. As an example, when viewed along the first direction Z, the outer shape of the first inductor wiring 21 and the outer shape of the second inductor wiring 22 are the same (see FIGS. 3 and 4). As shown in FIG. 2, the element body 2 includes a magnetic material 201, and the first inductor wiring 21 and the second inductor wiring 22 are located therein.

[0028] In this embodiment, the inductor component 1 includes a first conductor layer 11 and a second conductor layer 12. The first conductor layer 11 and the second conductor layer 12 are located inside the element body 2. As shown in FIG. 2 , the first conductor layer 11 is located on a first imaginary plane S1. The first inductor wiring 21 is provided on the first conductor layer 11 and extends along the first imaginary plane S1. As an example, the first imaginary plane S1 is located at the boundary between the first conductor layer 11 and the first inductor wiring 21.

[0029] As shown in FIG. 2 , the second conductor layer 12 is located on a second imaginary plane S2 that is adjacent and parallel to the first imaginary plane S1. Here, the term "the second imaginary plane S2 is adjacent and parallel to the first imaginary plane S1" means that the first imaginary plane S1 and the second imaginary plane S2 are parallel to each other and that the second imaginary plane is located at a distance in a direction perpendicular to the first imaginary plane S1. The first inductor wiring 21 is located between the first conductor layer 11 and the second conductor layer 12 in a first direction Z that intersects the first imaginary plane S1 and the second imaginary plane S2. The second inductor wiring 22 is provided on the second conductor layer 12 and extends along the second imaginary plane S2. The second conductor layer 12 is located between the first inductor wiring 21 and the second inductor wiring 22 in the first direction Z. The second imaginary plane S2 is located at the boundary between the second conductor layer 12 and the second inductor wiring 22.

[0030] As shown in FIGS. 1 to 4 , the inductor component 1 includes a third conductor layer 13, a fourth conductor layer 14, a third inductor wiring 23 provided on the third conductor layer 13, and a fourth inductor wiring 24 provided on the fourth conductor layer 14. The third conductor layer 13, the fourth conductor layer 14, the third inductor wiring 23, and the fourth inductor wiring 24 are located inside the element body 2. The third conductor layer 13 is located on a first imaginary plane S1 and is electrically independent from the first conductor layer 11. The fourth conductor layer 14 is located on a second imaginary plane S2 and is electrically independent from the second conductor layer 12. The third inductor wiring 23 extends along the first imaginary plane S1. The fourth inductor wiring 24 extends along the second imaginary plane S2. Between the first imaginary plane S1 and the second imaginary plane S2, layers of the first inductor wiring 21 and the third inductor wiring 23 are located, and between the second imaginary plane S2 and the main surface 202 of the element body 2 described later, layers of the second inductor wiring 22 and the fourth inductor wiring 24 are located.

[0031] The element body 2 includes a magnetic material 201, and has a first inductor wiring 21 and a second inductor wiring 22 located therein. As an example, the element body 2 has a substantially rectangular parallelepiped shape. As shown in FIG. 2, the element body 2 has an outer surface (hereinafter referred to as the main surface 202) that intersects with the first direction Z. As shown in FIG. 1, the main surface 202 is provided with a plurality of external terminals (six external terminals 101 to 106 in this embodiment) and an insulating layer 76. In this embodiment, the second inductor wiring 22 is located closest to the main surface 202 (i.e., the external terminal 101) in the first direction Z. Each of the external terminals 101 to 106 is formed, for example, of a laminate of Cu / Ni / Au (=5 / 5 / 0.1 μm).

[0032] 3, when viewed along the first direction Z, the third conductor layer 13 is positioned symmetrically to the first conductor layer 11 with respect to a first center line CL1 that extends on the first imaginary plane S1 in the short-side direction of the inductor component 1 (for example, the X direction), and has a shape symmetrical to the first conductor layer 11 with respect to the first center line CL1. The third inductor wiring 23 is positioned symmetrical to the first inductor wiring 21 with respect to the first center line CL1, and has a shape symmetrical to the first inductor wiring 21 with respect to the first center line CL1. The third inductor wiring 23 extends around a third pivot axis A3 that is positioned symmetrical to the first pivot axis A1 with respect to the first center line CL1.

[0033] 4, when viewed along the first direction Z, the fourth conductor layer 14 is positioned symmetrically to the second conductor layer 12 with respect to a second center line CL2 that extends in the short direction X on the second imaginary plane S2, and has a shape symmetrical to the second conductor layer 12 with respect to the second center line CL2. The fourth inductor wiring 24 is positioned symmetrical to the second inductor wiring 22 with respect to the second center line CL2, and has a shape symmetrical to the second inductor wiring 22 with respect to the second center line CL2. The fourth inductor wiring 24 extends around a fourth pivot axis A4 that is positioned symmetrical to the second pivot axis A2 with respect to the second center line CL2.

[0034] When viewed along the first direction Z, the first center line CL1 and the second center line CL2 are located approximately at the center of the inductor component 1 in the longitudinal direction (for example, the Y direction).

[0035] 3, the first inductor wiring 21 has, as an example, a spiral shape with a number of turns greater than 1 when viewed along the first direction Z. Vias 51 and 52 are connected to both ends of the first inductor wiring 21 in the direction in which the first inductor wiring 21 extends, respectively.

[0036] The first inductor wiring 21 has a first portion 211 to a seventh portion 217 .

[0037] The first portion 211 extends from an end portion located near the first pivot axis A1 to which the via 51 (an example of a via conductor) is connected, in a direction away from the first center line CL1 along the longitudinal direction Y. As an example, the portion of the first portion 211 to which the via 51 is connected constitutes a first output portion (an example of a second end portion).

[0038] The second portion 212 extends in the short direction X from one of both ends of the first portion 211 in the longitudinal direction Y that is farther from the first center line CL1.

[0039] The third portion 213 extends from one of both ends of the second portion 212 in the short-side direction X that is farther from the first portion 211 along the longitudinal direction Y in a direction approaching the first center line CL1.

[0040] The fourth portion 214 extends from one of the ends of the third portion 213 in the longitudinal direction Y that is farther from the second portion 212 in the short direction X toward the first portion 211.

[0041] The fifth portion 215 extends from one of both ends of the fourth portion 214 in the short-side direction X that is farther from the third portion 213 along the longitudinal direction Y in a direction away from the first center line CL1. The fifth portion 215 is located farther from the first pivot axis A1 in the short-side direction X than the first portion 211, and when viewed from the first pivot axis A1 in the short-side direction X, a part of the fifth portion 215 overlaps with the first portion 211. The fifth portion 215 and the first portion 211 are insulated from each other.

[0042] The sixth portion 216 extends from one of the ends of the fifth portion 215 in the longitudinal direction Y that is farther from the fourth portion 214 in the short direction X toward the third portion 213. The sixth portion 216 is located farther from the first pivot axis A1 in the longitudinal direction Y than the second portion 212, and when viewed from the first pivot axis A1 along the longitudinal direction Y, a part of the sixth portion 216 overlaps with the second portion 212. The sixth portion 216 and the second portion 212 are insulated from each other.

[0043] The seventh portion 217 extends from one of the ends of the sixth portion 216 in the short-side direction X that is farther from the fifth portion 215 along the longitudinal direction Y in a direction approaching the first center line CL1. The seventh portion 217 is located farther from the first pivot axis A1 in the short-side direction X than the third portion 213, and when viewed from the first pivot axis A1 along the short-side direction X, a portion of the seventh portion 217 overlaps with the third portion 213. The seventh portion 217 and the third portion 213 are insulated from each other. A via 52 is connected to one of the ends of the seventh portion 217 that is closer to the first center line CL1. As an example, the portion of the seventh portion 217 to which the via 52 is connected configures a first input portion (an example of a first end portion).

[0044] The first conductor layer 11 includes a first main body portion 111 positioned around the first pivot axis A1, and a protrusion 112 provided on the first main body portion 111. In this embodiment, the first main body portion 111 has substantially the same shape as the first inductor wiring 21 when viewed along the first direction Z, and the entire first main body portion 111 overlaps with the first inductor wiring 21. The protrusion 112 extends from the first main body portion 111 in a direction away from the first pivot axis A1 along a second direction intersecting the first direction Z.

[0045] As shown in FIG. 3 , in this embodiment, the first conductor layer 11 has two protrusions 112 extending along the short-side direction X. For example, the two protrusions 112 are positioned symmetrically with respect to the first pivot axis A1. Each protrusion 112 is provided in a portion of the first main body 111 corresponding to the fifth portion 215 (i.e., a portion of the first main body 111 overlapping with the fifth portion 215 when viewed along the first direction Z) and a portion of the first main body 111 corresponding to the seventh portion 217 (i.e., a portion of the first main body 111 overlapping with the seventh portion 217 when viewed along the first direction Z). Of both ends of each protrusion 112 in the second direction (e.g., the short-side direction X), the tip end farther from the first main body 111 contacts the magnetic material 201 of the element body 2. This can suppress corrosion of the first conductor layer 11. Furthermore, because the protruding portion 112 is not exposed from the element body 2, the first conductor layer 11 can be isolated within the inductor component 1, allowing multiple electrically independent inductor wirings to be arranged on the same imaginary plane. As a result, it is possible to improve the design freedom of the inductor component 1. The second direction may be any direction that intersects with the first direction, and may be, for example, the short-side direction X or the long-side direction Y, or a direction having components or vectors in both the short-side direction X and the long-side direction Y.

[0046] Contact with the magnetic material 201 refers to contact with a portion of the material constituting the magnetic material 201. When the magnetic material 201 is formed, for example, of a composite of resin and inorganic filler (e.g., a composite of epoxy and FeSiCr), the tip of the first main body portion 111 contacts at least one of the resin and inorganic filler of the magnetic material 201. The resin contained in the magnetic material 201 includes, for example, epoxy, acrylic, liquid crystal polymer, phenol, and combinations thereof, and is responsible for the strength and good insulating properties of the element body 2. The inorganic filler contained in the magnetic material 201 includes, for example, metal magnetic powder (e.g., Fe, FeSi-based, FeSiCr-based, FeNi-based, etc., containing Fe as the main component). In this case, the magnetic material 201 has high magnetic permeability and high magnetic saturation density. The inorganic filler does not need to be a single type of magnetic powder; it may be a combination of magnetic powders with different compositions and particle sizes, or it may contain an insulating filler such as silica to ensure a linear expansion coefficient and insulating properties.

[0047] As shown in FIG. 3 , the element body 2 has therein a first region B1 that is closer to the first pivot axis A1 than the first inductor wiring 21, and a second region B2 that is farther from the first pivot axis A1 than the first inductor wiring 21. In this embodiment, the first region B1 is surrounded by the first portion 211 to the fifth portion 215 of the first inductor wiring 21 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region B1. The magnetic material 201 located in the first region B1 constitutes a first magnetic part 2011. The first magnetic part 2011 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the portion where the first inductor wiring 21 overlaps (the first portion 211 to the third portion 213 in this embodiment) when viewed along the second direction from the first pivot axis A1. In other words, when viewed from the first pivot axis A1 along the second direction, the magnetic material 201 is adjacent to the portion where the number of first inductor wirings 21 is greatest. Here, "the first magnetic portion 2011 is adjacent to the first inductor wiring 21" means that the width in the second direction of the nonmagnetic material 203 existing between the first magnetic portion 2011 and the first inductor wiring 21 is 25 μm or less and is equal to or less than twice the wiring spacing between adjacent first inductor wirings 21. In FIG. 3, the wiring spacing of the first inductor wirings 21 (e.g., the spacing between the first portion 211 and the fifth portion 215) is 10 μm, and the width in the second direction (e.g., the short-side direction X) of the nonmagnetic material 203 existing between the first magnetic portion 2011 and the first inductor wiring 21 (e.g., the first portion 211) is 20 μm or less. When viewed from the first pivot axis A1 along the second direction, the nonmagnetic material 203 is adjacent to a portion where the first inductor wiring 21 does not overlap (in this embodiment, the fourth portion 214 and the fifth portion 215) and the first magnetic portion 2011. Here, "the nonmagnetic material 203 is adjacent to the first inductor wiring 21" means that the first magnetic portion 2011 is not present between the nonmagnetic material 203 and the first inductor wiring 21 and the two are in contact with each other. When viewed along the first direction Z, the nonmagnetic material 203 in the first region B1 has a substantially C-shape extending along the fourth portion 214 and the fifth portion 215. The nonmagnetic material 203 in the first region B1 includes, for example, a photosensitive insulating material. The magnetic material 201 is located throughout the second region B2.

[0048] As shown in FIG. 4, the second inductor wiring 22 extends around a second pivot axis A2 along the first direction Z. In this embodiment, the second inductor wiring 22 has a spiral shape with a number of turns greater than one and a spiral shape that is wound in the opposite direction to the first inductor wiring 21 when viewed along the first direction Z. In other words, the first inductor wiring 21 spirals counterclockwise from the inside to the outside of the first pivot axis A1, whereas the second inductor wiring 22 spirals clockwise from the inside to the outside of the second pivot axis A2. In other words, the direction in which the first inductor wiring 21 spirals around the first pivot axis A1 is opposite to the direction in which the second inductor wiring 22 spirals around the second pivot axis A2. Vias 53 and 54 extending in the first direction Z are connected to both ends of the second inductor wiring 22 in the direction in which the second inductor wiring 22 extends. As shown in FIG. 2, the via 53 connects the second inductor wiring 22 and the vertical wiring 61. The vertical wiring 61 connects the second inductor wiring 22 and the external terminal 101 through the via 53. Between the second inductor wiring 22 and the vertical wiring 61 in the first direction Z, an insulating layer 75 is located.

[0049] The second inductor wiring 22 has a first portion 221 to a seventh portion 227.

[0050] The first portion 221 extends from an end portion located near the first pivot axis A1, to which the via 53 is connected, along the longitudinal direction Y in a direction approaching the second center line CL2. As an example, the portion of the first portion 221 to which the via 53 is connected constitutes a second output portion (an example of a fourth end portion). When viewed along the first direction Z, the via 51 and the via 53 are adjacent to each other. The via 51 connects the portion of the first inductor wiring 21 to which the via 51 is connected and the portion of the second inductor wiring 22 to which the via 53 is connected. In other words, the first output portion and the second output portion are adjacent to each other and electrically connected. "The first output portion and the second output portion are adjacent to each other" refers to, for example, a state in which the via 51 and the via 53 are located in a very small area (e.g., within 20 μm) when viewed along the first direction Z. In this embodiment, the via 51 and the via 53 are located at a distance of approximately 10 μm when viewed along the first direction Z.

[0051] The second portion 222 extends in the short direction X from one of both ends of the first portion 221 in the longitudinal direction Y that is closer to the second center line CL2.

[0052] The third portion 223 extends from one of both ends of the second portion 222 in the short-side direction X that is farther from the first portion 221 along the longitudinal direction Y in a direction away from the second center line CL2.

[0053] The fourth portion 224 extends from one of the ends of the third portion 223 in the longitudinal direction Y that is farther from the second portion 222 in the short direction X toward the first portion 221.

[0054] The fifth portion 225 extends from one of both ends of the fourth portion 224 in the short-side direction X that is farther from the third portion 223 in the longitudinal direction Y toward the second center line CL2. The fifth portion 225 is located farther from the second pivot axis A2 in the short-side direction X than the first portion 221, and when viewed from the second pivot axis A2 in the short-side direction X, a part of the fifth portion 225 overlaps with the first portion 221. The fifth portion 225 and the first portion 221 are insulated from each other.

[0055] The sixth portion 226 extends from one of the ends of the fifth portion 225 in the longitudinal direction Y that is farther from the fourth portion 224 in the short direction X toward the third portion 223. The sixth portion 226 is located farther from the second pivot axis A2 in the longitudinal direction Y than the second portion 222, and when viewed from the second pivot axis A2 in the longitudinal direction Y, a part of the sixth portion 226 overlaps with the second portion 222. The sixth portion 226 and the second portion 222 are insulated from each other.

[0056] The seventh portion 227 extends from one of the ends of the sixth portion 226 in the short-side direction X that is farther from the fifth portion 225 along the longitudinal direction Y in a direction away from the second center line CL2. The seventh portion 227 is located farther from the second pivot axis A2 in the short-side direction X than the third portion 223. When viewed from the second pivot axis A2 along the short-side direction X, a portion of the seventh portion 227 overlaps with the third portion 223. The seventh portion 227 and the third portion 223 are insulated from each other. A via 54 is connected to one of the ends of the seventh portion 227 in the long-side direction Y that is closer to the second center line CL2. As an example, the portion of the seventh portion 227 to which the via 54 is connected constitutes a second input portion (an example of a third end portion). As viewed along the first direction Z as shown in FIGS. 3 and 4 , the vias 52 and 54 are spaced apart in the longitudinal direction Y. That is, the first input section and the second input section are located apart in the second direction (e.g., the longitudinal direction Y) and are not connected via a via or the like inside the element body 2, that is, the first input section and the second input section are electrically independent. When viewed along the first direction Z, the vias 52 and 54 are located apart by 200 μm or more (e.g., 500 μm), thereby separating the first input section and the second input section.

[0057] The second conductor layer 12 includes a second main body portion 121 positioned around the second pivot axis A2 and a protrusion portion 122 provided on the second main body portion 121. When viewed along the first direction Z, the second main body portion 121 has a swirling portion 1211 having substantially the same shape as the second inductor wiring 22, and a non-swirling portion 1212 adjacent to the swirling portion 1211 and electrically independent of it. In this embodiment, when viewed along the first direction Z, the swirling portion 1211 entirely overlaps with the second inductor wiring 22. When viewed along the first direction Z, the non-swirling portion 1212 has an oval shape extending along the longitudinal direction Y, and is adjacent to the portion where the sixth portion 226 and the seventh portion 227 of the second inductor wiring 22 are connected.

[0058] Of both ends of the non-orbiting portion 1212 in the longitudinal direction Y, the end closest to the second center line CL2 is connected to a via 55. A protrusion 123 is provided in the center of the non-orbiting portion 1212 in the longitudinal direction Y. The protrusion 123 extends from the non-orbiting portion 1212 in the short direction X and in a direction away from the second pivot axis A2. Of both ends of the protrusion 123 in the short direction X, the tip end farther from the non-orbiting portion 1212 contacts the magnetic material 201 of the element body 2.

[0059] As shown in FIG. 4 , in this embodiment, the second conductor layer 12 has two protrusions 122 extending from the second main body portion 121 (the pivoting portion 1211 in this embodiment) along the longitudinal direction Y. The two protrusions 122 are, for example, positioned symmetrically with respect to the second pivot axis A2. Each protrusion 122 is provided in a portion of the second main body portion 121 corresponding to the fourth portion 224 (in other words, a portion of the second main body portion 121 overlapping with the fourth portion 224 when viewed along the first direction Z) and a portion of the second main body portion 121 corresponding to the sixth portion 226 (in other words, a portion of the second main body portion 121 overlapping with the sixth portion 226 when viewed along the first direction Z). In other words, the protrusions 122 are located so as not to overlap the protrusions 112 when viewed along the first direction Z. This allows for the realization of an inductor component 1 that can enhance short-circuit resistance (interlayer short-circuit resistance) between the first inductor wiring 21 located on the first imaginary plane S1 and the second inductor wiring 22 located on the second imaginary plane S2 adjacent and parallel to the first imaginary plane S1. Furthermore, the provision of the protrusions 112 and 122 allows power to be supplied via an insulating layer, making it possible to form the first inductor wiring 21 and the second inductor wiring 22 by plating growth. Plating growth (e.g., electrolytic plating) can form the first conductor layer 11 and the second conductor layer 12 with extremely high purity, thereby enabling the formation of the first inductor wiring 21 and the second inductor wiring 22 with high conductivity. As a result, the DC electrical resistance of the inductor component 1 can be reduced. Of both ends of each protrusion 122 in the second direction (e.g., the longitudinal direction Y), the tip end farther from the second body portion 121 contacts the magnetic material 201 of the element body 2.

[0060] As shown in FIG. 4, the element body 2 has therein a first region C1 that is closer to the second pivot axis A2 than the second inductor wiring 22, and a second region C2 that is farther from the second pivot axis A2 than the second inductor wiring 22. In this embodiment, the first region C1 is surrounded by the first portion 221 to the fifth portion 225 of the second inductor wiring 22 when viewed along the first direction Z. A magnetic material 201 and a non-magnetic material 203 are located in the first region C1. The magnetic material 201 located in the first region C1 constitutes the second magnetic unit 2012. The second magnetic unit 2012 has a substantially rectangular shape when viewed along the first direction Z, and is adjacent to the portion where the second inductor wiring 22 overlaps (the first portion 221 to the third portion 223 in this embodiment) when viewed along the second direction from the second pivot axis A2. In other words, when viewed from the second pivot axis A2 along the second direction, the magnetic material 201 is adjacent to the portion where the number of second inductor wirings 22 is greatest. Here, the fact that the second magnetic portion 2012 is adjacent to the second inductor wiring 22 means that the width in the second direction of the nonmagnetic material 203 present between the second magnetic portion 2012 and the second inductor wiring 22 is 25 μm or less and is equal to or less than twice the wiring spacing between adjacent second inductor wirings 22. In FIG. 4, the wiring spacing of the second inductor wirings 22 (e.g., the spacing between the first portion 221 and the fifth portion 225) is 10 μm, and the width in the second direction (e.g., the short-side direction X) of the nonmagnetic material 203 present between the second magnetic portion 2012 and the second inductor wiring 22 (e.g., the first portion 221) is 20 μm or less. When viewed from the second pivot axis A2 along the second direction, the nonmagnetic material 203 is adjacent to a portion where the first inductor wiring 21 does not overlap (in this embodiment, the fourth portion 224 and the fifth portion 225) and the second magnetic portion 2012. Here, "the nonmagnetic material 203 is adjacent to the second inductor wiring 22" means that the second magnetic portion 2012 is not present between the nonmagnetic material 203 and the second inductor wiring 22 and the two are in contact with each other. When viewed along the first direction Z, the nonmagnetic material 203 in the first region C1 extends in a substantially linear manner along the fourth portion 224. The nonmagnetic material 203 in the first region C1 includes, for example, a photosensitive insulating material. The magnetic material 201 is located throughout the second region B2.

[0061] As shown in FIGS. 3 and 4, the first magnetic portion 2011 and the second magnetic portion 2012 are configured to coincide when viewed along the first direction Z. The first pivot axis A1 and the second pivot axis A2 are spaced apart in the second direction (e.g., the longitudinal direction Y). As an example, the first pivot axis A1 and the second pivot axis A2 are located at the centers of the outer shapes of the first regions B1 and C1, but this is not limiting. The first pivot axis A1 and the second pivot axis A2 may be arranged such that the centers of gravity of the first inductor wiring 21 and the second inductor wiring 22 are at different positions. For example, the first pivot axis A1 may be located at the center of the outer shape of the first inductor wiring 21, and the second pivot axis A2 may be located at the center of the inner shape of the second inductor wiring 22.

[0062] For example, the first magnetic portion 2011 and the second magnetic portion 2012 are made of a composite material of a metal magnetic alloy containing the largest amount of iron and an organic resin. The metal magnetic alloy is, for example, an alloy in which the Fe element accounts for the largest proportion, such as FeSiCr or FeSiNbCu. By dispersing the metal magnetic alloy in, for example, an epoxy resin, the metal magnetic alloy is insulated and eddy currents are suppressed, resulting in a low-loss magnetic material. The first magnetic portion 2011 and the second magnetic portion 2012 may be made of a material other than the composite material described above.

[0063] 1 to 4, the external terminal 103 (an example of a first external terminal) is electrically connected to a portion of the first inductor wiring 21 to which the via 52 is connected (an example of a first end portion). The external terminal 101 (an example of a second external terminal) is electrically connected to a portion of the first inductor wiring 21 to which the via 51 is connected (an example of a second end portion) and a portion of the second inductor wiring 22 to which the via 53 is connected (an example of a fourth end portion). The external terminal 102 (an example of a third external terminal) is electrically connected to a portion of the second inductor wiring 22 to which the via 54 is connected (an example of a third end portion). When viewed along the first direction Z, the area of ​​the external terminal 101 is larger than the areas of the external terminals 102 and 103.

[0064] As shown in Fig. 3, a virtual line connecting the first pivot axis A1 and the center of the protrusion 112 in a direction intersecting the second direction (for example, the longitudinal direction Y) is defined as a first virtual line L1. As shown in Fig. 4, a virtual line connecting the second pivot axis A2 and the center of the protrusion 122 in a direction intersecting the third direction (for example, the lateral direction X) is defined as a second virtual line L2. The inductor component 1 is configured so that the first virtual line L1 and the second virtual line L2 form an angle of 80 to 110 degrees. This makes it possible to more reliably increase resistance to interlayer short circuits.

[0065] 4, the inductor component 1 includes a first pad portion 81 and a second pad portion 82 located on a second imaginary plane S2. When viewed along the first direction Z, the first pad portion 81 is located so as to overlap with the non-wound portion 1212 of the second conductor layer 12. The first pad portion 81 is electrically independent from the second inductor wiring 22. The first pad portion 81 and the second pad portion 82 are located symmetrically with respect to the second center line CL2 and have shapes symmetrical with respect to the second center line CL2.

[0066] As shown in FIG. 2, the inductor component 1 includes an insulating layer 71 and an insulating layer 72 located inside the element body 2. The first insulating layer 71 is provided on the first conductor layer 11 and is located on the opposite side of the first inductor wiring 21 with respect to the first conductor layer 11 in the first direction Z. The second insulating layer 72 is provided on the second conductor layer 12 and is located on the opposite side of the second inductor wiring 22 with respect to the second conductor layer 12 in the first direction Z. When viewed along the first direction Z, the protrusion 112 is located closer to the first pivot axis A1 than the end of the insulating layer 71 in the second direction (for example, the end 711 in the short direction X shown in FIG. 2). When viewed along the first direction Z, the protrusion 122 is located closer to the second pivot axis A2 than the end of the insulating layer 72 in the second direction (for example, the end in the longitudinal direction Y, not shown). This ensures insulation between the first inductor wiring 21 and the second inductor wiring 22, thereby improving the design flexibility of the inductor component 1.

[0067] As an example, the first conductor layer 11 has a thickness in the first direction Z of less than 1.0 μm. The thickness of the first conductor layer 11 is smaller than 1 / 100 of the thickness of the first inductor wiring 21. The second conductor layer 12 may also be configured similarly to the first conductor layer 11. That is, the second conductor layer 12 may be configured to have a thickness of less than 1.0 μm and smaller than 1 / 100 of the thickness of the second inductor wiring 22. This makes the first conductor layer 11 sufficiently thin relative to the first inductor wiring 21, so that the resistance of the first inductor wiring 21, rather than the first conductor layer 11, becomes dominant. As a result, the selectivity of the metal material constituting the first conductor layer 11 is improved. Furthermore, because the thickness of the first conductor layer 11 itself is sufficiently thin, interlayer short circuits via the first conductor layer 11 can be suppressed. For example, if the first conductor layer 11 is Ti / Cu deposited by sputtering, Ti is formed to a thickness of 30 nm and Cu is formed to a thickness of 800 nm. The first conductor layer 11 can be formed by sputtering, electroless plating, printing, etc. The first conductor layer 11 can be made of, for example, Au, Ag, or Al.

[0068] As an example, each of the first conductor layer 11 and the second conductor layer 12 includes a single layer (Cu or Ag) or multiple layers (e.g., Ti / Cu) stacked along the first direction Z. When each of the first conductor layer 11 and the second conductor layer 12 includes multiple layers stacked along the first direction Z, the design flexibility of the inductor component 1 is increased, thereby achieving cost reduction without compromising the quality of the inductor component 1. For example, the number of layers forming each conductor layer can be set arbitrarily depending on the layer. For example, by configuring the first conductor layer 11 to include two layers (Ti / Cu) and the second conductor layer 12 to include two layers (Cu), the adhesion of the first conductor layer 11 to the resin can be improved while the adhesion of the second conductor layer 12 to copper (sacrificial copper) can be improved.

[0069] As shown in FIG. 2, the inductor component 1 includes an insulating layer 73 located inside the element body 2. The insulating layer 73 extends from the protruding portion 112 along the first direction Z toward the second imaginary plane S2. The dimension (i.e., thickness) of the insulating layer 73 in the first direction Z is greater than the thickness of the first inductor wiring 21. This ensures insulation between the first layer including the first conductor layer 11 and the first inductor wiring 21 and the second layer including the second conductor layer 12 and the second inductor wiring 22. The inductor component 1 may also include an insulating layer (not shown) that extends from the protruding portion 122 along the first direction Z in a direction away from the first imaginary plane S1 and has a thickness greater than that of the second inductor wiring 22.

[0070] As shown in FIG. 2 , the inductor component 1 includes an external terminal 101, a vertical wiring 61 located inside the element body 2, and an insulating layer 74. As described above, the external terminal 101 is provided on the main surface 202. The vertical wiring 61 extends in the first direction Z and connects the second inductor wiring 22 to the external terminal 101 while being in contact with the magnetic material 201 of the element body 2 in the second direction. The insulating layer 74 is located between the second inductor wiring 22 and the magnetic material 201 of the element body 2. Because the vertical wiring 61 is a wiring for connecting to the external terminal 101, insulation can be ensured even without an insulating layer. This eliminates the need for a step of forming an insulating layer on the vertical wiring 61, thereby reducing the manufacturing cost of the inductor component 1. The vertical wiring 61 is not limited to being connected to the second inductor wiring 22 via the via 53, but may also be directly connected to the second inductor wiring 22. Furthermore, the vertical wiring 61 may be connected to the second inductor wiring 22 via a seed layer or a layer required for forming the vertical wiring 61 in addition to the via 53 .

[0071] As an example, as shown in Fig. 3, the protrusion 112 of the first conductor layer 11 and the protrusion 132 (an example of a third protrusion) of the third conductor layer 13 are located on the same imaginary straight lines L3 and L4. As shown in Fig. 4, the protrusion 122 of the second conductor layer 12 and the protrusion 142 of the fourth conductor layer 14 are located on the same imaginary straight line L2. This makes it possible to realize an inductor component 1 in which a plurality of electrically independent inductor wirings are arranged on the same imaginary plane.

[0072] An example of a method for manufacturing the inductor component 1 will be described with reference to Figures 5 to 14. In the following description, the third conductor layer 13, the fourth conductor layer 14, the third inductor wiring 23, and the fourth inductor wiring 24 will not be described. Figures 5 to 14 are drawings corresponding to a cross section taken along line II-II in Figure 1. In the manufacturing method shown in Figures 5 to 14, some or all of the steps are automatically performed using, for example, a manufacturing device for the inductor component 1.

[0073] As shown in FIGS. 5 and 6 , the manufacturing equipment forms an insulating layer 71 on a first laminate 1001, which is formed by laminating an adhesive layer 1100 and a seed layer (conductor) 1200 on a substrate 1000. Then, a pattern seed 1300 and a permanent resist 1400 are formed on the insulating layer 71 and the seed layer 1200 to form a second laminate 1002. The pattern seed 1300 constitutes the first conductor layer 11. The insulating layer 71 is formed, for example, by a process including laminating an insulating layer, photolithography (photolithography), and curing. The pattern seed 1300 is formed, for example, by a process including sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1400 is formed, for example, by a process including permanent resist lamination, photolithography, and curing. A portion of the permanent resist 1400 constitutes the nonmagnetic material 203 and the insulating layer 73.

[0074] 7, the manufacturing equipment simultaneously forms the first inductor wiring 21 and sacrificial copper 1500 on the second laminate 1002, and then forms an insulating layer 72 on the first inductor wiring 21. The first inductor wiring 21 and the sacrificial copper 1500 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 72 is formed, for example, by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1501 and the vias 51 and 52 are simultaneously formed during the photolithography process.

[0075] As shown in FIG. 8 , the manufacturing equipment forms a fourth laminate 1004 by forming a pattern seed 1600 located on the insulating layer 72 and a permanent resist 1700 on the third laminate 1003. The pattern seed 1600 constitutes the second conductor layer 12. The pattern seed 1600 is formed by a process including, for example, sputtering (seed formation), resist lamination, photolithography, seed etching, and resist stripping. The permanent resist 1700 is formed by a process including permanent resist lamination, photolithography, and hardening. A portion of the permanent resist 1700 constitutes the insulating layer 74.

[0076] The pattern seed 1600 may be formed of the same material as the pattern seed 1300 of the second laminate 1002, or may be formed of a material different from that of the pattern seed 1300. The pattern seeds 1300 and 1600 are formed by selecting an optimum material for each layer. For example, by forming the first-layer pattern seed 1300 from a conductive material containing Ti, it is possible to improve adhesion to the insulating layer 71 and the seed layer 1200. By forming the second-layer pattern seed 1600 from the same conductive material as the second inductor wiring 22 (for example, only Cu), it is possible to improve connectivity with the vias 53 and 54.

[0077] As shown in FIG. 9 , the manufacturing equipment simultaneously forms the second inductor wiring 22 and sacrificial copper 1800 on the fourth laminate 1004, then forms an insulating layer 75 on the second inductor wiring 22, and forms a vertical wiring 61 on the insulating layer 75 to form a fifth laminate 1005. The second inductor wiring 22 and the sacrificial copper 1800 are formed, for example, by a process including electrolytic plating (e.g., electrolytic copper plating). The insulating layer 75 is formed by a process including insulating layer lamination, photolithography, and curing. In this case, the magnetic path opening 1801 and vias 53 and 54 are simultaneously formed during the photolithography process. The vertical wiring 61 is formed, for example, by a process including sputtering (full-surface seed formation), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching.

[0078] As shown in FIG. 10 , the manufacturing equipment forms a protective layer 1900 on the vertical wiring 61 of the fifth laminate 1005, then removes the sacrificial copper 1500 and 1800 to form a magnetic path hole 2000, thereby forming a sixth laminate 1006. The protective layer 1900 is formed, for example, by a process including resist lamination and photolithography. The sacrificial copper 1500 and 1800 are removed, for example, by etching. If the first-layer pattern seed 1300 contains Ti, Ti etching is performed after Cu etching, leaving a portion of the seed layer 1200.

[0079] As shown in FIG. 11 , the manufacturing equipment removes the protective layer 1900 from the sixth laminate 1006, then forms a magnetic layer 2100, and forms a solder resist (insulating layer) 2200 on the magnetic layer 2100 to form the seventh laminate 1007. The protective layer 1900 is removed, for example, by a process including resist stripping. The magnetic layer 2100 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding exposes the vertical wiring 61 to the outside. The magnetic layer 2100 constitutes a part of the magnetic material 201. The solder resist 2200 is formed, for example, by a process including solder resist lamination, photolithography, and hardening. The solder resist 2200 has openings 2201 that expose the vertical wiring 61 to the outside. The solder resist 2200 constitutes the insulating layer 76.

[0080] As shown in FIG. 12 , the manufacturing equipment removes the substrate 1000, adhesive layer 1100, and seed layer 1200 from the seventh laminate 1007 to create an eighth laminate 1008. The substrate 1000 and adhesive layer 1100 are removed, for example, by mechanically peeling off the adhesive layer 1100. The seed layer 1200 is removed, for example, by wet etching or polishing. When the seed layer 1200 is removed by wet etching, part of the metal magnetic powder in the magnetic layer 2100 is etched, roughening its surface, thereby improving adhesion with the magnetic layer 2300 formed in the next process.

[0081] As shown in FIG. 13 , the manufacturing equipment forms a magnetic layer 2300 on the eighth laminate 1008 to form a ninth laminate 1009. The magnetic layer 2300 is formed, for example, by a process including magnetic material pressing, hardening, and grinding. The grinding is performed to adjust the thickness of the element body 2. The thickness of the element body 2 may be adjusted by adjusting the amount of pressing when forming the magnetic layer 2300 without grinding. The magnetic layer 2300 constitutes a part of the magnetic material 201.

[0082] As shown in Fig. 14, the manufacturing equipment forms external terminals 101 on the ninth laminate 1009, forms a tenth laminate 1010, and then singulates the tenth laminate 1010 to form the inductor component 1 shown in Fig. 2. The external terminals 101 are formed by a process including, for example, sputtering (Cu seed), resist lamination, photolithography, electrolytic plating, resist stripping, and seed etching. The singulation is performed, for example, along the dashed lines shown in Fig. 14.

[0083] Instead of forming the external terminals 101, the exposed vertical wiring 61 may serve as the external terminals. By adopting a configuration in which the external terminals 101 are formed in the openings 2201 of the solder resist 2200 and connected to the vertical wiring 61, as in this embodiment, the area of ​​the external terminals 101 can be increased, thereby improving the adhesive strength of the inductor component 1 to other devices, etc. Furthermore, the external terminals 101 can be formed in any shape, such as a convex shape, which increases the degree of freedom when mounting the inductor component 1.

[0084] The external terminals 101 may be formed without forming the solder resist 2200. The external terminals 101 may be formed by forming a seed layer on the entire surface and then performing electrolytic plating, as with the vertical wiring 61. In this case, the external terminals 101 have a structure similar to that of a Cu bump.

[0085] The inductor component 1 can provide the following effects.

[0086] The inductor component 1 includes a first inductor wiring 21, a second inductor wiring 22, and an element body 2. The first inductor wiring 21 extends along a first imaginary plane S1 and around a first pivot axis A1 along a first direction Z that intersects the first imaginary plane S1. The second inductor wiring 22 extends along a second imaginary plane S2 that is adjacent to and parallel to the first imaginary plane S1 and around a second pivot axis A2 along the first direction Z. The element body 2 includes a magnetic material 201, and the first inductor wiring 21 and the second inductor wiring 22 are located inside the magnetic material 201. The magnetic material 201 includes a first magnetic part 2011 located in a region closer to the first pivot axis A1 than the first inductor wiring 21, and a second magnetic part 2012 located in a region closer to the second pivot axis A2 than the second inductor wiring 22. The first magnetic part 2011 and the second magnetic part 2012 are configured to coincide when viewed along the first direction Z. The first pivot axis A1 and the second pivot axis A2 are spaced apart in a second direction intersecting the first direction Z. By offsetting the pivot axes of the first inductor wiring 21 and the second inductor wiring 22, a common magnetic path is achieved, improving the packing density of the magnetic material 201 without extremely increasing the magnetic coupling. As a result, an inductor component 1 with high inductance acquisition efficiency can be realized. Furthermore, by using an inductor array, the mounting area of ​​the inductor component 1 can be reduced. For example, when the inductor component 1 is applied to a buck converter, if the magnetic coupling is extremely high, when an antiphase signal is input between the first inductor wiring 21 and the second inductor wiring 22, the ripple current increases, reducing the power conversion efficiency of the buck converter.

[0087] The first magnetic portion 2011 and the second magnetic portion 2012 are made of a composite material of a metal magnetic alloy containing the largest amount of iron and an organic resin. This configuration improves the electrical characteristics of the inductor component 1. In addition, stress is less likely to be present inside the element body 2, which reduces the occurrence of cracks in the element body 2.

[0088] The portion of the first inductor wiring 21 to which the via 52 is connected is electrically independent from the portion of the second inductor wiring 22 to which the via 54 is connected. The portion of the first inductor wiring 21 to which the via 51 is connected is electrically connected to the portion of the second inductor wiring 22 to which the via 53 is connected. With this configuration, different signals can be input to the inductor component 1, and the inductor component 1's resistance to breakdown due to static electricity can be improved.

[0089] The inductor component 1 includes an external terminal 101, a vertical wiring 61, and a via 51 (an example of a via conductor) provided on the main surface 202 of the element body 2. The vertical wiring 61 connects the external terminal 101 to a portion of the second inductor wiring 22 to which the via 53 is connected. The via 51 connects the portion of the first inductor wiring 21 to which the via 51 is connected and the portion of the second inductor wiring 22 to which the via 53 is connected. This configuration makes it possible to employ a bottom electrode structure, thereby further reducing the mounting area of ​​the inductor component 1. For example, the portion of the vertical wiring 61 exposed from the main surface 202 of the element body 2 may serve as the external terminal 101.

[0090] When viewed along the first direction Z, the outer shape of the first inductor wiring 21 and the outer shape of the second inductor wiring 22 match. This configuration makes it easy to fill the magnetic material 201 during the manufacture of the inductor component 1. As a result, an inductor component 1 can be realized that has high filling efficiency of the magnetic material 201 and high inductance acquisition efficiency.

[0091] The direction in which the first inductor wiring 21 extends around the first pivot axis A1 is opposite to the direction in which the second inductor wiring 22 extends around the second pivot axis A2. This configuration makes it possible to control the polarity of the magnetic coupling between the first inductor wiring 21 and the second inductor wiring 22. By reversing the winding directions of the first inductor wiring 21 and the second inductor wiring 22, the magnetic coupling between the first inductor wiring 21 and the second inductor wiring 22 becomes negative. For example, when the inductor component 1 is applied to a buck converter, the ripple current can be reduced, thereby improving the efficiency of the buck converter.

[0092] The first inductor wiring 21 has a spiral shape with a number of turns greater than one. The element body 2 has a first region B1 therein that is closer to the first pivot axis A1 than the first inductor wiring 21. A first magnetic part 2011 and a non-magnetic material 203 are located in the first region B1. When viewed from the first pivot axis A1 along the second direction, the first magnetic part 2011 is adjacent to the part where the number of first inductor wiring 21 is greatest. With this configuration, the first magnetic part 2011 is located in a region with a large amount of magnetic flux (= a region where the number of turns of the first inductor wiring 21 is greater), thereby improving the efficiency with which the inductor component 1 obtains inductance.

[0093] The non-magnetic material 203 includes a photosensitive insulating material. This configuration allows the non-magnetic material 203 to be formed simultaneously with other insulating layers, thereby reducing the manufacturing cost of the inductor component 1. Furthermore, the inclusion of a photosensitive material allows the formation of fine, high-aspect ratio regions of the non-magnetic material 203, thereby improving the structural freedom of the inductor component 1.

[0094] When viewed along the first direction Z, the area of ​​the external terminal 101 is larger than the areas of the external terminals 102 and 103. With this configuration, electromigration can be suppressed.

[0095] The inductor component 1 includes a first pad portion 81 that extends along the second imaginary plane S2 and is adjacent to the second inductor wiring 22 while being electrically independent of it. This configuration improves the degree of freedom in designing the inductor component 1. For example, an inductor component 1 that includes more inductor wiring can be realized. The first pad portion 81 can be used, for example, to pull out wiring from a lower layer to an upper layer.

[0096] The inductor component 1 can be configured as follows.

[0097] When viewed along the first direction Z, the dimension of the nonmagnetic material 203 in the first region B1 in a direction perpendicular to the direction in which the nonmagnetic material 203 extends is defined as the “width of the nonmagnetic material 203 in the first region B1,” and the dimension of the first inductor wiring 21 in a direction perpendicular to the direction in which the first inductor wiring 21 extends is defined as the “width of the first inductor wiring 21.” The inductor component 1 may be configured so that the maximum value of the width of the nonmagnetic material 203 in the first region B1 is greater than the maximum value of the width of the first inductor wiring 21. Similarly, the dimension of the nonmagnetic material 203 in the first region C1 in a direction perpendicular to the direction in which the nonmagnetic material 203 extends is defined as the “width of the nonmagnetic material 203 in the first region C1,” and the dimension of the second inductor wiring 22 in a direction perpendicular to the direction in which the second inductor wiring 22 extends is defined as the “width of the second inductor wiring 22.” The inductor component 1 may be configured so that the maximum value of the width of the nonmagnetic material 203 in the first region C1 is greater than the maximum value of the width of the second inductor wiring 22. This configuration can suppress leakage between the magnetic material 201 and the first inductor wiring 21 and the second inductor wiring 22. Increasing the thickness of the nonmagnetic material 203 can increase the deformation resistance of the element body 2. In addition, increasing the thickness of the nonmagnetic material 203 can suppress magnetic saturation and improve the DC superposition characteristics of the inductor component 1.

[0098] The inductor component 1 can be applied to a buck converter 300, for example, as shown in Fig. 15 and Fig. 16. As an example, the buck converter 300 includes the inductor component 1, a controller 310, a switching element 320, a VRM (Voltage regulator module) 330, and a load circuit (e.g., a semiconductor integrated circuit) 340, as shown in Fig. 15. The controller 310 controls the switching element 320 to supply a direct current converted by the VRM to the inductor component 1. The output side of the inductor component 1 is connected to the controller 310 and the load circuit 340.

[0099] As shown in FIG. 16, the buck converter 300 includes a package substrate 350 and an inductor component 1 located inside the package substrate 350. As an example, the buck converter 300 includes two inductor components 1. The external terminals 101 to 106 of each inductor component 1 are connected to a load circuit 340 (i.e., the load side). In operation of the buck converter 300, current is supplied to each inductor component 1 on the input side, and the current on the output side (i.e., the load side) is integrated. Therefore, by arranging the external terminal 101, which is a common terminal, on the load side, unnecessary wiring for integration is not required. As a result, wiring loss in the buck converter 300 is reduced, and the power conversion efficiency of the buck converter 300 can be improved.

[0100] 16 is configured to allow connection of a semiconductor module 341 (an example of a load circuit 340). The main surface 202 (an example of an outer surface of the element body 2) of the element body 2, on which the external terminals 101-106 of each inductor component 1 are provided, intersects with the first direction Z and faces the semiconductor module 341 when the semiconductor module 341 is connected to the package substrate 350. In the buck converter 300 shown in FIG. 16, the external terminals 101-106 are formed on the main surface 202 of the element body 2, thereby improving the efficiency of the current path between the inductor component 1 and the semiconductor module 341. As a result, the power loss of the buck converter 300 can be reduced.

[0101] 16, when viewed in the first direction Z, the inductor component 1 is located inside the outer shape of the semiconductor module 341. With this configuration, the wiring loss of the buck converter 300 can be reduced.

[0102] In the buck converter 300 shown in FIG. 16, each inductor component 1 is configured so that the absolute value of the magnetic coupling between the first inductor wiring 21 and the second inductor wiring 22 is greater than the absolute value of the magnetic coupling between the first inductor wiring 21 and the third inductor wiring 23 and is in the range of 0.2 to 0.7. As an example, the buck converter 300 shown in FIG. 16 has a switching frequency of 10 MHz to 100 MHz, an input voltage of 1.8 V to 20 V, and an output voltage of 0.5 V to 1.0 V. This makes it possible to suppress the ripple current in each inductor component 1. Furthermore, because the frequency on the output side of each inductor component 1 is apparently doubled, the buck converter 300 can be realized with high power conversion efficiency and responsiveness.

[0103] If the absolute value of the magnetic coupling between the first inductor wiring 21 and the second inductor wiring 22 is less than 0.2, the effect described above is not achieved because multiple inductor wirings are simply arranged side by side. When the absolute value of the magnetic coupling between the first inductor wiring 21 and the second inductor wiring 22 is greater than 0.7, the duty ratio (Vout (output voltage) / Vin (input voltage)) is limited. The greater the duty ratio is above 0.7, the lower the power conversion efficiency of the buck converter 300 becomes.

[0104] For example, by setting the magnetic coupling between the first inductor wiring 21 and the second inductor wiring 22 to negative coupling, the responsiveness of the buck converter 300 can be further improved. When a semiconductor switch is used as the switching element, lowering the switching frequency increases the withstand voltage of the semiconductor switch, thereby increasing the input voltage to the inductor component 1. Increasing the switching frequency improves the voltage responsiveness of the inductor component 1 to load fluctuations. If the switching frequency is higher than 100 MHz, switching loss increases.

[0105] The inductor component 1 may be configured to include conductor layers located on three or more parallel imaginary planes and inductor wiring provided on each of these conductor layers, i.e., the inductor component 1 may include three or more layers of inductor wiring.

[0106] The inductor component 1 may be configured so that only the first conductor layer 11 is located on the first imaginary plane S1, or so that three or more conductor layers including the first conductor layer 11 and the third conductor layer 13 are located on the first imaginary plane S1. Similarly, the inductor component 1 may be configured so that only the second conductor layer 12 is located on the second imaginary plane S2, or so that three or more conductor layers including the second conductor layer 12 and the fourth conductor layer 14 are located on the second imaginary plane S2.

[0107] The angle formed by the first virtual straight line L1 and the second virtual straight line L2 is not limited to an angle between 80 degrees and 110 degrees, and may be another angle.

[0108] The conductor layers (e.g., first conductor layer 11, second conductor layer 12, third conductor layer 13 and fourth conductor layer 14), insulating layers (e.g., insulating layer 71, insulating layer 72, insulating layer 73 and insulating layer 74), vertical wiring 61, and vias 51, 52, 53, 54 and 55 located inside the element body 2 may be omitted depending on the design of the inductor component 1, etc.

[0109] The shape and size of each part constituting the inductor component 1 are not limited to the above-described embodiments and can be set arbitrarily depending on the design of the inductor component 1. For example, the thickness of the first conductor layer 11 of the inductor component 1 is not limited to being less than 1.0 μm and less than 1 / 100 of the thickness of the first inductor wiring.

[0110] The portion of the first inductor wiring 21 to which the via 51 is connected may form the input section, and the portion to which the via 52 is connected may form the output section. The portion of the second inductor wiring 22 to which the via 53 is connected may form the input section, and the portion to which the via 54 is connected may form the output section.

[0111] Each inductor wiring may have a spiral shape when viewed in the first direction Z. For example, each inductor wiring may be a curve with one or more windings (turns), or a curve with less than one winding. Each inductor wiring may have a linear shape in part.

[0112] The embodiments and modifications of the present disclosure can be combined with each other, or with modifications, or with each other. Features included in the embodiments and modifications of the present disclosure can also be combined with each other.

[0113] The disclosure of the present disclosure may vary in structural details, and changes in the combination and order of elements in each embodiment may be made without departing from the scope and spirit of the claimed disclosure. [Explanation of symbols]

[0114] 1. Inductor components 2 Base 201 Magnetic materials 2011 1st magnetic section 2012 2nd magnetic part 202 Main surface 203 Non-magnetic materials 11 First conductor layer 111 First main body part 112, 113, 114, 115 protrusion 12 Second conductor layer 121 Second main body part 1211 Swivel section 1212 Non-rotating part 122, 123, 124, 125, 126, 132, 142 Projection 13 Third conductor layer 14 Fourth conductor layer 21 First inductor wiring 22 Second inductor wiring 23 Third inductor wiring 24 Fourth inductor wiring 51, 52, 53, 54, 55 vias 61 Vertical wiring 71, 72, 73, 74, 75, 76 Insulating layer 81 First pad section 82 Second pad section 101, 102, 103, 104, 105, 106 External terminals 300 buck converter 310 Controller 320 Switching element 340 load circuit 341 Semiconductor Module 350 package substrate

Claims

1. a first inductor wiring extending along a first imaginary plane and extending around a first pivot axis along a first direction intersecting the first imaginary plane; a second inductor wiring extending along a second imaginary plane adjacent to and parallel to the first imaginary plane and extending around a second pivot axis along the first direction; an element body including a magnetic material and having the first inductor wiring and the second inductor wiring located therein; Equipped with The magnetic material is a first magnetic portion located in a region closer to the first pivot axis than the first inductor wiring; a second magnetic portion located in a region closer to the second pivot axis than the second inductor wiring; Including, the first magnetic portion and the second magnetic portion are configured to coincide when viewed along the first direction, The inductor component, wherein the first pivot axis and the second pivot axis are spaced apart in a second direction that intersects with the first direction.

2. 2. The inductor component according to claim 1, wherein the first magnetic portion and the second magnetic portion are made of a composite material of a metal magnetic alloy containing iron element in the largest amount and an organic resin.

3. Both ends of the first inductor wiring in an extending direction of the first inductor wiring are defined as a first end and a second end, When both ends of the second inductor wiring in the extending direction of the second inductor wiring are defined as a third end and a fourth end, respectively, 3. The inductor component according to claim 1, wherein the first end and the third end are electrically independent, and the second end and the fourth end are electrically connected.

4. an external terminal provided on an outer surface of the element body that intersects with the first direction; a vertical wiring connecting the fourth end and the external terminal; a via conductor connecting the second end and the fourth end; The inductor component of claim 3 , comprising:

5. 3. The inductor component according to claim 1, wherein an outer shape of the first inductor wiring and an outer shape of the second inductor wiring are the same when viewed in the first direction.

6. 3. The inductor component according to claim 1, wherein the first inductor wiring has a direction of rotation about the first rotation axis opposite to the direction of rotation about the second rotation axis of the second inductor wiring.

7. the first inductor wiring has a spiral shape with a number of turns greater than one, the element body has a first region therein that is closer to the first pivot axis than the first inductor wiring; the first magnetic portion and the nonmagnetic material are located in the first region, The inductor component according to claim 1 , wherein the first magnetic portion is adjacent to a portion where the number of the first inductor wirings is the largest when viewed from the first pivot axis along the second direction.

8. The inductor component of claim 7 , wherein the non-magnetic material comprises a photosensitive insulating material.

9. the non-magnetic material extends along the first inductor wiring, When viewed along the first direction, the dimension of the nonmagnetic material in a direction perpendicular to the direction in which the nonmagnetic material extends is defined as the width of the nonmagnetic material, and the dimension of the first inductor wiring in a direction perpendicular to the direction in which the first inductor wiring extends is defined as the width of the first inductor wiring, The inductor component according to claim 7 , wherein the maximum width of the non-magnetic material is greater than the maximum width of the first inductor wiring.

10. a first external terminal, a second external terminal, and a third external terminal provided on outer surfaces of the element body that intersect with the first direction, the first external terminal is electrically connected to the first end, the second external terminal is electrically connected to the second end and the fourth end, the third external terminal is electrically connected to the third end portion; The inductor component according to claim 3 , wherein an area of ​​the second external terminal is larger than areas of the first external terminal and the third external terminal when viewed in the first direction.

11. 3. The inductor component according to claim 1, further comprising a first pad portion extending along the second imaginary plane and adjacent to the second inductor wiring while being electrically independent from the second inductor wiring.

12. A package substrate; The inductor component according to claim 3 , which is located inside the package substrate; Equipped with The second end and the fourth end are configured to be connected to a load side.

13. a package substrate configured to be connectable to a semiconductor module; an inductor component according to claim 1 or 2 located inside the package substrate; Equipped with a buck converter, wherein the inductor component includes an external terminal provided on an outer surface of the element body that intersects the first direction and faces the semiconductor module when the semiconductor module is connected to the package substrate.

14. A package substrate; an inductor component according to claim 1 or 2 located inside the package substrate; Equipped with The inductor component is a third inductor wiring extending along the first imaginary plane and spaced apart from the first inductor wiring in the second direction; a buck converter, wherein an absolute value of magnetic coupling between the first inductor wiring and the second inductor wiring is greater than an absolute value of magnetic coupling between the first inductor wiring and the third inductor wiring and is in a range of 0.2 to 0.7;

15. The buck converter according to claim 13 , wherein the inductor component is located inside an outer shape of the semiconductor module when viewed along the first direction.

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