Resin sealing device

Abstract

To reduce damage to a substrate when an unnecessary resin is separated from a molding, and surely remove the unnecessary resin.SOLUTION: A lower mold 40 includes a pot 42 for heating and melting a resin, and a mounting part 41 on which an electric component is mounted, an intermediate plate 30 includes a cull 31 vertically penetrating, to which a resin is supplied from the pot 42, a first runner 32 communicating with the cull 31, a molding cavity 33 forming a resin sealing molding space of an electronic component 12, and a gate 34 which communicates with the molding cavity 33, and is tapered off, an upper mold 20 includes a second runner 21 which communicates with the first runner 32 of the intermediate plate 30 and the gate 34, and has an engagement part 22 for holding an unnecessary resin, and further includes a first pressing member 27 for pressing the intermediate plate 30 in the lower mold 40 direction, and mold opening in a state in which a resin sealing molding of the electronic component 12 is held by the intermediate plate 30 and the lower mold 40, and thereby separating the unnecessary resin from the intermediate plate 30.SELECTED DRAWING: Figure 2

Description

[Technical Field]

[0001] The present invention relates to a resin sealing apparatus that seals electronic components, each of which has a semiconductor chip mounted on a substrate, with resin. [Background technology]

[0002] When electronic components equipped with semiconductor chips or the like are resin-encapsulated onto a substrate such as a metal lead frame, the side gate method is generally used, in which resin is injected into a molding cavity from the side of the substrate using a transfer method. After molding, unnecessary resin such as culls, runners, and gates is removed by methods such as punching or laser light irradiation (see, for example, Patent Document 1).

[0003] Meanwhile, resin printed circuit boards are used for applications such as BGA (ball grid arrays). In addition, with the recent spread of small precision electronic devices such as IC cards and smartphones, there is an increasing demand for glass epoxy substrates and other circuit boards that can meet the high frequency operation and high reliability that are particularly required for these applications. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Laid-Open No. 2004-111465 Summary of the Invention [Problem to be solved by the invention]

[0005] When removing unnecessary resin after molding, the conventional punching method can damage substrates such as lead frames. On the other hand, the laser light irradiation method increases costs. In addition, both methods require a separate stage outside the mold to remove the unnecessary resin, which also increases costs.

[0006] Furthermore, printed circuit boards such as glass epoxy boards are more fragile than metal lead frames and are more susceptible to cracking and other damage caused by pressure or impact. Therefore, during the process of removing the unnecessary resin, a large load is placed on the board, which may result in damage to the board. Furthermore, if the resin residue is not completely removed during the removal of the unnecessary resin and is sent to the next process while still attached to the board, the board may be damaged.

[0007] Furthermore, glass epoxy substrates are made of a glass epoxy material in which glass fibers are layered like a cloth and impregnated with epoxy resin, and there is greater variation in thickness compared to lead frames. If the substrate is thin, resin is likely to leak from the gap between the substrate and the mold during resin encapsulation molding, resulting in molding defects such as burrs. On the other hand, if the substrate is thick, there is a risk of damage due to the large pressure applied when the substrate is clamped by the mold.

[0008] Therefore, an object of the present invention is to provide a resin sealing apparatus that can reduce damage to a substrate when separating unnecessary resin from a molded product and can reliably remove unnecessary resin. [Means for solving the problem]

[0009] The resin sealing device of the present invention is a resin sealing device that includes a mold including an upper mold and a lower mold and resin-seals an electronic component having a semiconductor chip mounted on a substrate, and includes an intermediate plate sandwiched between the upper mold and the lower mold, and the lower mold includes a pot for heating and melting the resin and a mounting portion on which the electronic component is placed, and the intermediate plate is a cull to which resin is supplied from the pot, and includes a cull that penetrates vertically, a first runner on the upper surface that communicates with the cull, a molding cavity on the lower surface that forms a resin-sealing molding space for the electronic component, and a gate on the upper surface that communicates with the molding cavity, and the molding cavity The upper mold has a first runner of the intermediate plate on its underside and a second runner that is connected to the gate, and the second runner has a locking portion for holding the unnecessary resin filled in the cull, the first runner, the second runner, and the gate.The upper mold further has a first pressing member that presses the intermediate plate toward the lower mold, and the first pressing member presses the intermediate plate toward the lower mold to separate the unnecessary resin from the intermediate plate by opening the mold while holding the resin-sealed molded product of the electronic component between the intermediate plate and the lower mold.

[0010] According to the resin sealing device of the present invention, when the mold is opened after molding, the first pressing member presses the intermediate plate toward the lower mold, and the resin-sealed molded electronic component is held between the intermediate plate and the lower mold, and the unnecessary resin is held in the upper mold by the engaging portion of the second runner, and the unnecessary resin is separated at the tapered tip of the gate.

[0011] The upper mold preferably includes a first through hole provided in the mold opening / closing direction toward the second runner, a first movable pin sliding within the first through hole, the first movable pin having a Z-shaped notch formed at its lower end that forms the locking portion, a second through hole provided in the mold opening / closing direction at a position where it presses the resin filled in the first runner or the second runner, and the second movable pin sliding within the second through hole, and the second movable pin desirably advances from the first through hole to push out the unwanted resin, thereby releasing the unwanted resin from the locking portion formed by the Z-shaped notch of the first movable pin.

[0012] The resin sealing device of the present invention preferably includes a loader that moves back and forth between the inside and outside of a mold, an intermediate plate holding unit that holds an intermediate plate, an intermediate plate holding unit that transfers the intermediate plate to a lower mold, and a resin holding unit that holds resin to be supplied to a pot, the resin holding unit pressing the intermediate plate transferred from the intermediate plate holding unit to the lower mold against the lower mold and supplying the resin to the pot through the cull of the intermediate plate.As a result, after the intermediate plate is transferred from the intermediate plate holding unit of the loader to the lower mold, the intermediate plate is pressed against the lower mold by the resin holding unit, and the resin is supplied to the pot through the cull of the intermediate plate.

[0013] The lower mold is preferably provided with a second pressing member that presses the intermediate plate toward the upper mold, and that pushes up the intermediate plate in the mold open state after molding, separates the intermediate plate from the lower mold, and delivers it to the loader. As a result, in the mold open state after molding, the intermediate plate is pushed up by the second pressing member, separated from the lower mold, and delivered to the loader.

[0014] The loader is preferably a loader pin that can be raised and lowered, and that releases the molded product from the intermediate plate by pressing a non-molded portion of the molded product through a through-hole formed in the intermediate plate while the intermediate plate is held by the intermediate plate holding portion. As a result, the non-molded portion of the molded product is pressed by the loader pin through the through-hole of the intermediate plate while the intermediate plate is held by the intermediate plate holding portion, and the molded product is released from the intermediate plate.

[0015] The resin sealing apparatus of the present invention preferably includes a first cleaner that moves between the upper and lower dies after the dies are opened to clean the surfaces of the upper and lower dies, and a second cleaner that cleans the upper and lower surfaces of the intermediate plate that is carried out from between the upper and lower dies after the dies are opened. Thus, after the dies are opened, the surfaces of the upper and lower dies are cleaned by the first cleaner, and the upper and lower surfaces of the intermediate plate are cleaned by the second cleaner.

[0016] The first cleaner preferably includes a suction unit that sucks the surfaces of the upper and lower dies, and an adhesive roller that is pressed against the surface of the mounting unit and moves over the surface of the mounting unit while rotating, so that the resin residue on the surfaces of the upper and lower dies is sucked by the suction unit, and the resin residue on the surface of the mounting unit is attached to the adhesive roller and removed.

[0017] The resin sealing device of the present invention preferably includes an elastic member that biases the mounting portion toward the upper mold. As a result, when a substrate is placed on the mounting portion, and then the intermediate plate is placed on the substrate and the molds are closed, the elastic force of the elastic member presses the substrate against the bottom surface of the intermediate plate, so that the top surface of the substrate and the top surface of the lower mold become flush with each other.

[0018] The resin sealing device of the present invention is preferably provided with an air vent on either the peripheral surface of the second runner of the upper mold or the abutment surface of the upper surface of the intermediate plate facing the peripheral surface of the second runner, so that residual air in the cull, first runner, and second runner can be discharged through the air vent. [Effects of the Invention]

[0019] (1) An intermediate plate is sandwiched between an upper mold and a lower mold. The lower mold has a pot for heating and melting resin and a mounting portion on which electronic components are placed. The intermediate plate is a cull into which resin is supplied from the pot, and is provided with a cull that penetrates vertically, a first runner on the upper surface that communicates with the cull, a molding cavity on the lower surface that forms a resin-encapsulating molding space for the electronic components, and a gate on the upper surface that communicates with the molding cavity and that tapers toward the molding cavity. The upper mold has a second runner on the lower surface that communicates with the first runner and gate of the intermediate plate, and the cull, first runner, and second runner and a second runner having a locking portion for retaining the unwanted resin filled in the gate, and further a first pressing member for pressing the intermediate plate toward the lower mold, and by pressing the intermediate plate toward the lower mold and opening the mold with the resin-sealed molded electronic component held between the intermediate plate and the lower mold, the unwanted resin is separated from the molded product by the tapered tip of the gate when the mold is opened after molding, so that damage to the substrate when the unwanted resin is separated from the molded product is reduced and the unwanted resin can be removed reliably.

[0020] (2) The upper mold is provided with a first through hole provided in the mold opening / closing direction toward the second runner, a first movable pin that slides within the first through hole, the first movable pin having a Z-shaped notch formed at its lower end that forms the engagement portion, a second through hole provided in the mold opening / closing direction at a position that presses the resin filled in the first runner or the second runner, and the second movable pin that slides within the second through hole, and the second movable pin advances further after the first movable pin has advanced from the first through hole and pushed out the unwanted resin, thereby releasing the unwanted resin from the engagement portion, thereby making it possible to reliably remove the unwanted resin from the mold.

[0021] (3) By providing a loader that moves back and forth between the inside and outside of the mold, an intermediate plate holding section that holds the intermediate plate, an intermediate plate holding section that transfers the intermediate plate to the lower mold, and a resin holding section that holds the resin to be supplied to the pot, the intermediate plate transferred from the intermediate plate holding section to the lower mold is pressed against the lower mold and the resin is supplied to the pot through the cull of the intermediate plate, it is possible to reliably place the intermediate plate on the lower mold without any gaps and reliably pour the resin into the pot.

[0022] (4) The lower mold is a second pressing member that presses the intermediate plate toward the upper mold. When the mold is open after molding, the second pressing member pushes up the intermediate plate, separates the intermediate plate from the lower mold, and transfers it to the loader. This makes it possible to reliably transfer the intermediate plate from the lower mold to the loader.

[0023] (5) The loader is a loader pin that can be raised and lowered, and by providing the loader pin that presses the non-molded portion of the molded product through a through-hole formed in the intermediate plate while the intermediate plate is held by the intermediate plate holding portion, the molded product can be reliably released from the intermediate plate. In addition, because the loader pin presses the non-molded portion of the molded product, no pin marks are left on the molded portion.

[0024] (6) By providing a first cleaner that moves between the upper and lower dies after the dies are opened to clean the surfaces of the upper and lower dies, and a second cleaner that cleans the upper and lower surfaces of the intermediate plate that is carried out from between the upper and lower dies after the dies are opened, the surfaces of the upper and lower dies and the upper and lower surfaces of the intermediate plate can be cleaned individually and simultaneously after the dies are opened, making it possible to reliably clean the dies in a short amount of time.

[0025] (7) The first cleaner is provided with a suction section that sucks the surfaces of the upper and lower dies, and an adhesive roller that is pressed against the surface of the mounting section and moves across the surface of the mounting section while rotating, thereby reducing the amount of resin residue remaining on the mold and preventing the resin residue from adhering to the molded product.

[0026] (8) By providing an elastic member that biases the mounting portion toward the upper mold, the surface of the substrate and the surface of the lower mold become flush, variations in the thickness of the substrate are absorbed, and the substrate is clamped with appropriate pressure, thereby reducing resin leakage and damage to the substrate.

[0027] (9) By providing an air vent on either the peripheral surface of the second runner of the upper mold or the contact surface facing the peripheral surface of the second runner on the upper surface of the intermediate plate, the amount of remaining air in the cull, first runner, and second runner that enters the molding cavity can be reduced, thereby reducing voids. [Brief explanation of the drawings]

[0028] [Figure 1] 1 is a schematic plan view of a resin sealing apparatus according to an embodiment of the present invention; [Figure 2] FIG. 2 is a cross-sectional view of the mold of FIG. 1. [Figure 3] FIG. 2 is a cross-sectional view taken along line XX in FIG. 1, illustrating a molding process. [Figure 4] FIG. 2 is a cross-sectional view taken along line XX in FIG. 1, illustrating a molding process. [Figure 5] FIG. 2 is a cross-sectional view taken along line XX in FIG. 1, illustrating a molding process. [Figure 6] FIG. 2 is a cross-sectional view taken along line XX in FIG. 1, illustrating a molding process. [Figure 7] FIG. 2 is a cross-sectional view taken along line XX in FIG. 1, illustrating a molding process. [Figure 8] FIG. 2 is a cross-sectional view taken along line XX in FIG. 1, illustrating a molding process. [Figure 9] FIG. XX cross-sectional view showing the process of separating and discharging unnecessary resin. [Figure 10] XX cross-sectional view showing how the intermediate plate is separated from the lower mold. [Figure 11] XX cross-sectional view showing how the intermediate plate is held by the loader. [Figure 12] XX cross-sectional view showing the state in which the molded product is separated from the intermediate plate. [Figure 13]2 is a cross-sectional view taken along line XX in FIG. 1 showing the first cleaner. [Figure 14] 2 is a cross-sectional view taken along line XX in FIG. 1 showing the first cleaner. [Figure 15] 2 is a cross-sectional view taken along line XX in FIG. 1 showing the first cleaner. [Figure 16] 2 is a cross-sectional view taken along line XX in FIG. 1 showing the first cleaner. [Figure 17] 2 is a cross-sectional view taken along line XX in FIG. 1 showing the first cleaner. [Figure 18] FIG. 2 is a cross-sectional view taken along the line YY in FIG. 1, showing the second cleaner. DETAILED DESCRIPTION OF THE INVENTION

[0029] FIG. 1 is a schematic plan view of a resin sealing apparatus according to an embodiment of the present invention, FIG. 2 is a cross-sectional view of the mold of FIG. 1, and FIGS. 3 to 8 are cross-sectional views taken along line XX in FIG. 1 showing the molding process.

[0030] As shown in Figures 1 and 2, a resin sealing apparatus 1 according to an embodiment of the present invention is used to resin-seal an electronic component 12 having a semiconductor chip 11 mounted on a substrate 10. The resin sealing apparatus 1 includes a mold 2 made up of an upper mold 20, an intermediate plate 30, and a lower mold 40. The mold 2 is mounted on a press unit 3, and is driven for clamping and other operations. The resin sealing apparatus 1 also includes an intermediate plate holder 4, a loader 5, a resin supply unit 6, a first cleaner 7, and a second cleaner 8.

[0031] The lower die 40 includes a mounting portion 41 on which the electronic component 12 is placed, a pot 42 for heating and melting the resin, and a plunger 43 for pressure-feeding the heated and melted resin in the pot 42. The mounting portion 41 is biased toward the upper die 20 by a spring 44 serving as an elastic member. The substrate 10 side of the electronic component 12 is placed on the mounting portion 41.

[0032] The intermediate plate 30 is sandwiched between the upper mold 20 and the lower mold 40. The intermediate plate 30 is detachable from the mold 2. The intermediate plate 30 includes a cull 31 that penetrates vertically, a first runner 32 that communicates with the cull 31, a molding cavity 33 that forms a resin-sealing molding space for the electronic component 12, and a gate 34 that communicates with the molding cavity 33.

[0033] Cull 31 is formed at a position corresponding to pot 42 of lower mold 40. Resin is supplied to cull 31 from pot 42 of lower mold 40. First runner 32 and gate 34 are provided on upper surface 30A. Molding cavity 33 is provided on lower surface 30B. Molding cavity 33 is provided at a position corresponding to semiconductor chip 11 of electronic component 12. Gate 34 is tapered toward molding cavity 33. The inner diameter of the tapered tip of gate 34 is, for example, φ0.2 to 0.5 mm.

[0034] The upper mold 20 has a second runner 21 on its lower surface. The second runner 21 is connected to the first runner 32 and gate 34 of the intermediate plate 30. Resin supplied from the pot 42 of the lower mold 40 to the cull 31 of the intermediate plate 30 is filled into the molding cavity 33 through the first runner 32, second runner 21, and gate 34. The resin filled in the areas of the cull 31, first runner 32, second runner 21, and gate 34 becomes waste resin 14 (see Figure 6). The second runner 21 is formed with a locking portion 22 for holding this waste resin in the upper mold 20.

[0035] The upper mold 20 includes a first through hole 23 and a second through hole 24 provided in the mold opening / closing direction toward the second runner 21, a first movable pin 25 and a second movable pin 26 that slide up and down within the first through hole 23 and the second through hole 24, respectively, and a first pressing member 27 that presses the intermediate plate 30 toward the lower mold 40. Meanwhile, the lower mold 40 includes a second pressing member 45 that presses the intermediate plate 30 toward the upper mold 20.

[0036] The first through-hole 23 of the upper die 20 is provided at a position overlapping the gate 34 in a plan view. A Z-shaped notch that constitutes the locking portion 22 is formed at the lower end (tip) of the first movable pin 25. That is, the locking portion 22 formed on the first movable pin 25 that slides inside the first through-hole 23 is at a position overlapping the gate 34 in a plan view. Note that the locking portion 22 may have any structure as long as it can hold the unnecessary resin in the upper die 20 when the intermediate plate 30 is separated from the upper die 20.

[0037] The second through-hole 24 is provided at a position where it presses the resin filled in the first runner 32 or the second runner 21. The lower end (tip) of the second movable pin 26 is flat. The second movable pin 26 slides a longer distance than the first movable pin 25. In other words, the second movable pin 26 can advance further from the state in which the first movable pin 25 advances from inside the first through-hole 23 and pushes out the unwanted resin. The first pressing member 27 is urged toward the lower mold 40 by a spring 28.

[0038] The intermediate plate holder 4 is equipped with a preheating mechanism that preheats the intermediate plate 30 to a predetermined temperature for a predetermined time. The loader 5 receives the intermediate plate 30 from the intermediate plate holder 4 and transports it inside and outside the mold 2.

[0039] As shown in FIG. 3, the loader 5 includes a resin holding unit 50 and an intermediate plate holding unit 51. The resin holding unit 50 receives and holds sealing resin 60 from the resin supply unit 6 (see FIG. 1). The intermediate plate holding unit 51 includes a pair of arms 51A, 51B that sandwich the intermediate plate 30. The loader 5 receives and holds the preheated intermediate plate 30 between the pair of arms 51A, 51B from the intermediate plate holder 4 (see FIG. 1).

[0040] The loader 5 also includes a loader pin 52 that can be raised and lowered. The loader pin 52 is provided at a position corresponding to the through hole 35 formed in the intermediate plate 30. The through hole 35 is provided outside the range of the resin injection path of the cull 31, the first runner 32, the second runner 21, and the gate 34, and outside the range of the molding cavity 33, but within a range where it can directly press against the substrate 10. In other words, the loader pin 52 presses against the non-molded portion of the molded product 13. It is desirable that the through hole 35 be provided at a position close to the molding cavity 33.

[0041] Next, the molding process in the resin sealing apparatus 1 having the above configuration will be described. As shown in FIG. 3, a substrate 10 (electronic component 12) on which a semiconductor chip 11 is mounted is placed on the placement portion 41 of the lower mold 40. In the loader 5, the resin holding portion 50 receives sealing resin 60 from the resin supply portion 6 (see FIG. 1). The intermediate plate holding portion 51 of the loader 5 receives the preheated intermediate plate 30 from the intermediate plate holder 4 (see FIG. 1). The loader 5 enters the mold 2, and as shown in FIG. 4, the intermediate plate holding portion 51 transfers the intermediate plate 30 to a predetermined position in the lower mold 40.

[0042] Next, as shown in Figure 5, the loader 5 retracts to a position where the resin holding unit 50 can supply resin to the pot 42 through the cull 31 of the intermediate plate 30. While pressing the intermediate plate 30 against the lower mold 40, the resin holding unit 50 supplies resin 60 to the pot 42 through the cull 31 of the intermediate plate 30. This ensures that the intermediate plate 30 is securely placed on the lower mold 40 without any gaps, and the resin 60 is also reliably poured into the pot 42.

[0043] Next, as shown in Fig. 6, the lower mold 40 rises, causing the intermediate plate 30 to come into contact with the upper mold 20, and the lower mold 40, intermediate plate 30, and upper mold 20 are clamped together with a predetermined force, thereby clamping the substrate 10 (see Fig. 3). The lower mold 40 is raised and lowered toward and away from the upper mold 20 by a drive unit (not shown).

[0044] At this time, because the mounting portion 41 is biased toward the upper mold 20 by the spring 44, the substrate 10 is pressed against the lower surface 30B of the intermediate plate 30 by the elastic force of the spring 44. Therefore, regardless of variations in the thickness of the substrate 10, the upper surface 10A of the substrate 10 and the upper surface 40A of the lower mold 40 become flush with each other, and the substrate 10 is clamped between the intermediate plate 30 and the substrate 10 by a predetermined spring force without any gaps. This absorbs variations in the thickness of the substrate 10 and clamps the substrate 10 with an appropriate pressure, thereby reducing resin leakage and damage to the substrate 10.

[0045] Resin 60 heated and melted in pot 42 is pushed out by plunger 43 and injected into molding cavity 33 via first runner 32 connected to cull 31 of intermediate plate 30, second runner 21 of upper mold 20, and gate 34 of intermediate plate 30, thereby resin-sealing semiconductor chip 11 in molding cavity 33. At this time, resin 60 is also filled into locking portion 22.

[0046] When the molds begin to open after molding, the intermediate plate 30 is pressed toward the lower mold 40 by the first pressing member 27, so that the molded product 13 is held between the mounting portion 41 and the intermediate plate 30. In addition, the waste resin 14 filled in the cull 31, the first runner 32, the second runner 21, and the gate 34 is held by the resin 60 filled in the locking portion 22 of the upper mold 20.

[0047] In this state, as shown in Fig. 7, when the lower mold 40 descends and separates from the upper mold 20, the molded product 13 and the waste resin 14 are separated at the tapered tip of the gate 34. In this embodiment, since the locking portion 22 is positioned so as to overlap with the gate 34 in a plan view, separation of the molded product 13 and the waste resin 14 after molding is more reliable. Thereafter, as shown in Fig. 8, the lower mold 40 is further descended, causing the first pressing member 27 to separate from the intermediate plate 30.

[0048] As described above, in the resin sealing apparatus 1 of this embodiment, when the molds are opened after molding, the first pressing member 27 presses the intermediate plate 30 toward the lower mold 40, so that the molded product 13 of the electronic component 12 is held between the intermediate plate 30 and the lower mold 40, and the locking portion 22 of the second runner 21 holds the unwanted resin 14 in the upper mold 20. As a result, the unwanted resin 14 is separated at the tapered tip of the gate 34, which reduces damage to the substrate 10 when the unwanted resin 14 is separated from the molded product 13, and it is possible to reliably remove the unwanted resin 14.

[0049] 9 is a cross-sectional view taken along line XX showing the process of separating and discharging the unwanted resin. As shown in FIG. 9(A), the unwanted resin 14 held in the upper mold 20 in the mold open state is pushed out by the first movable pin 25 advancing from the first through-hole 23 and the second movable pin 26 advancing from the second through-hole 24, as shown in FIG. 9(B). Furthermore, when only the second movable pin 26 is advanced from this state as shown in FIG. 9(C), the unwanted resin 14 is separated and discharged from the engaging portion 22 of the first movable pin 25.

[0050] In this way, in the resin sealing device 1 of this embodiment, the first movable pin 25 advances from within the first through hole 23 to push out the unwanted resin 14, and then the second movable pin 26 advances further to push out the unwanted resin 14, and the unwanted resin 14 is separated from the engagement portion 22 formed by the Z-shaped notch of the first movable pin 25, allowing the unwanted resin 14 to be reliably removed from the upper mold 20.

[0051] Meanwhile, in the lower mold 40, the second pressing member 45 lifts the intermediate plate 30 and separates it from the lower mold 40, as shown in Fig. 10. Then, as shown in Fig. 11, the intermediate plate 30 is handed over to the loader 5 and held by the intermediate plate holding section 51. At this time, the molded product 13 may be held by the intermediate plate 30. In this case, the molded product 13 is separated from the intermediate plate 30 by being pressed by the loader pin 52 through the through hole 35 of the intermediate plate 30, as shown in Fig. 12.

[0052] In this way, in the resin sealing apparatus 1 of this embodiment, while the intermediate plate 30 is held by the intermediate plate holding portion 51, the loader pin 52 presses the non-molded portion of the molded product 13 through the through hole 35 of the intermediate plate 30, and the molded product 13 is released from the intermediate plate 30. Therefore, no pin marks remain on the molded product 13. The loader 5 carries the intermediate plate 30 out of the mold 2.

[0053] Although not shown, the substrate clamping surface (lower surface 30B (see FIG. 2)) of intermediate plate 30 that contacts upper surface 10A of substrate 10 has an air vent for discharging remaining air in molding cavity 33 using resin injection pressure. In addition, air vents are also provided on either the contact surface (upper surface 30A, lower surface 20A (see FIG. 2)) between intermediate plate 30 and upper mold 20, and by discharging remaining air from these vents in cull 31, first runner 32, and second runner 21, the amount of remaining air that enters molding cavity 33 can be reduced, voids can be reduced, and resin leakage due to the discharge of remaining air from the substrate clamping surface can be minimized.

[0054] The intermediate plate 30 carried out of the mold 2 by the loader 5 is transferred to the intermediate plate holder 4. At this time, the intermediate plate 30 passes through the second cleaner 8, whereby the upper surface 30A and the lower surface 30B thereof are cleaned.

[0055] Figure 18 is a cross-sectional view taken along the line YY in Figure 1, showing the second cleaner. As shown in Figure 18, the second cleaner 8 is equipped with a rotating brush 80 and a suction unit (not shown). The transported intermediate plate 30 is handed over to the intermediate plate holder 4 and passes between the rotating brushes 80 of the second cleaner 8 while moving in a direction intersecting the direction of transport into and out of the mold 2 (the left-right direction in Figure 18). As a result, the upper surface 30A and the lower surface 30B of the intermediate plate 30 are cleaned by scraping with the rotating brush 80 and suction with the suction unit.

[0056] Next, remaining resin in the cull 31 and gate 34 is detected, and an alarm is sounded if detected. Note that the detection positions of the second cleaner 8 and the remaining resin can be reversed so that the remaining resin is detected before passing through the second cleaner 8. After that, the intermediate plate 30 can be maintained at a predetermined position, such as when remaining resin is detected or at predetermined intervals, or it can be replaced with a new intermediate plate.

[0057] Meanwhile, after the mold is opened, the mold 2 is cleaned by the first cleaner 7. Figures 13 to 17 are cross-sectional views of the first cleaner 7 taken along the line XX in Figure 1. The first cleaner 7 includes a first suction unit 70 that sucks the surface of the lower mold 40, a second suction unit 71 that sucks the surface of the upper mold 20, and an adhesive roller 72 that is pressed against the surface of the mounting unit 41 and moves while rotating. The first suction unit 70 includes a vacuum duct 73 having a suction port 73A. The second suction unit 71 includes a brush 74 that brushes the surface of the upper mold 20 and a vacuum duct 75 having a suction port 75A. The brush 74 is provided near the suction port 75A.

[0058] After molding, when the intermediate plate 30 is removed from the mold 2, the first cleaner 7 enters between the upper mold 20 and the lower mold 40, as shown in Fig. 13. Next, as shown in Fig. 14, the first cleaner 7 descends so that the suction port 73A of the first suction unit 70 faces the pot 42 of the lower mold 40, and sucks resin residue and the like from the pot 42 through the suction port 73A and discharges it through the vacuum duct 73. At this time, the first cleaner 7 can also collect the unwanted resin 14 that has been released from the upper mold 20.

[0059] Thereafter, as shown in FIG. 15, the first cleaner 7 rises so that the suction port 75A of the second suction section 71 faces the lower surface 20A of the upper mold 20, and while retreating to the rear of the mold 2 (the right side in FIG. 15), it brushes the lower surface 20A of the upper mold 20 with the brush 74 while sucking up resin residue and the like through the suction port 75A and discharging it through the vacuum duct 75.

[0060] 16, the adhesive roller 72 is pressed against the surface of the mounting portion 41 in the front portion (left side of FIG. 15) of the lower mold 40 and moves in the left-right direction (the longitudinal direction of the mounting portion 41 in FIG. 1) while rotating, cleaning by adhesively holding resin residue and the like on the surface of the mounting portion 41. Thereafter, as shown in FIG. 17, when the first cleaner 7 retreats and reaches the surface of the mounting portion 41 in the rear portion (right side of FIG. 15) of the lower mold 40, the adhesive roller 72 is pressed against the surface and moves in the left-right direction (a direction perpendicular to the plane shown in FIG. 15) while rotating, cleaning by adhesively holding resin residue and the like on the surface of the mounting portion 41.

[0061] After cleaning the mold 2 as described above, the first cleaner 7 retreats from the mold 2 and discharges the collected unnecessary resin to a predetermined disposal position 9 (see FIG. 1). In this way, in the resin sealing apparatus 1 of this embodiment, after the mold is opened, the surfaces (lower surface 20A, upper surface 40A) of the upper mold 20 and the lower mold 40 and the upper surface 30A and lower surface 30B of the intermediate plate 30 can be cleaned individually 2 simultaneously, and the mold 2 can be reliably cleaned in a short time. [Industrial Applicability]

[0062] The resin encapsulation apparatus of the present invention is useful as an apparatus for resin-encapsulating electronic components having semiconductor chips mounted on a substrate, and is suitable as a resin encapsulation apparatus that reduces damage to the substrate when separating the unnecessary resin from the molded product and can reliably remove the unnecessary resin. The resin encapsulation apparatus of the present invention can also be used when electronic components having semiconductor chips mounted on tape-shaped substrates are transported to a mold by reel-to-reel and encapsulated with resin, or when electronic components using strip-shaped substrates are transported to a mold and encapsulated with resin. Furthermore, the substrate material is not limited to glass epoxy resin, and can be used with other resin substrates, metal lead frames, etc. [Explanation of symbols]

[0063] 1 Resin sealing equipment 2. Mold 3 Press Department 4 Intermediate Plate Holder 5. Loader 6 Resin supply section 7. First Cleaner 8. Second Cleaner 9 Disposal Location 10 Substrate 11 Semiconductor chips 12 Electronic Components 13 Molded products 14 Unnecessary resin 20 Upper mold 21 Second Runner 22 Locking portion 23 First through hole 24 Second through hole 25 First movable pin 26 Second movable pin 27 First pressing member 28 Spring 30 Intermediate Plate 31 Cal 32 First Runner 33 Molding cavity Gate 34 35 through holes 40 Lower mold 41 Placement section 42 pot 43 Plunger 44 Spring 45 Second pressing member 50 Resin holding part 51 Intermediate plate holder 51A Arm 52 Loader pin 60 Resin 70 1st suction part 71 2nd suction part 72 Sticky Roller 73 Vacuum Duct 73A Suction port 74 Brushes 75 Vacuum Duct 75A Suction port 80 Rotating Brush

Claims

1. A resin sealing apparatus that includes a mold including an upper mold and a lower mold and that resin-seals an electronic component having a semiconductor chip mounted on a substrate, an intermediate plate sandwiched between the upper mold and the lower mold, the lower mold includes a pot for heating and melting a resin and a placement portion on which the electronic component is placed, The intermediate plate is a cull into which resin is supplied from the pot, and is provided with a cull penetrating vertically, a first runner on the top surface communicating with the cull, a molding cavity on the bottom surface forming a resin sealing molding space for the electronic component, and a gate on the top surface communicating with the molding cavity, the gate tapering toward the molding cavity; the upper mold is provided with a second runner on its lower surface, which is in communication with the first runner and the gate of the intermediate plate, and which has a locking portion for holding the waste resin filled in the cull, the first runner, the second runner, and the gate; Further, a first pressing member is provided which presses the intermediate plate toward a lower mold, and which separates the unnecessary resin from the intermediate plate by pressing the intermediate plate toward the lower mold and opening the mold while the intermediate plate and the lower mold hold the resin-sealed molded product of the electronic component. Resin sealing equipment.

2. the upper mold includes: a first through hole provided in the mold opening / closing direction toward the second runner; a first movable pin that slides within the first through hole, the first movable pin having a Z-shaped notch formed at a lower end thereof that forms the locking portion; a second through hole provided in the mold opening / closing direction at a position that presses the resin filled in the first runner or the second runner; and the second movable pin that slides within the second through hole; The second movable pin further advances in a state in which the first movable pin advances from the first through hole and pushes out the unnecessary resin, thereby releasing the unnecessary resin from the locking portion. The resin sealing device according to claim 1.

3. a loader that moves back and forth between the inside and outside of the mold, an intermediate plate holding section that holds the intermediate plate, and that transfers the intermediate plate to the lower mold; and a resin holding section that holds resin to be supplied to the pot, and that presses the intermediate plate transferred from the intermediate plate holding section to the lower mold against the lower mold and supplies resin to the pot through the cull of the intermediate plate. The resin sealing device according to claim 1.

4. The lower mold is provided with a second pressing member that presses the intermediate plate toward the upper mold, and that pushes up the intermediate plate in a mold open state after molding, separates the intermediate plate from the lower mold, and delivers it to the loader. The resin sealing device according to claim 3.

5. The loader is a loader pin that can be raised and lowered, and is provided with a loader pin that presses a non-molded portion of the molded product through a through hole formed in the intermediate plate while holding the intermediate plate in the intermediate plate holding portion, thereby releasing the molded product from the intermediate plate. The resin sealing device according to claim 3.

6. a first cleaner that moves between the upper mold and the lower mold after the molds are opened to clean the surfaces of the upper mold and the lower mold; and a second cleaner for cleaning the upper and lower surfaces of the intermediate plate carried out from between the upper and lower dies after the dies are opened. The resin sealing device according to claim 1 .

7. The first cleaner includes a suction unit that sucks the surfaces of the upper mold and the lower mold, and an adhesive roller that is pressed against the surface of the placement unit and moves on the surface of the placement unit while rotating. The resin sealing device according to claim 6.

8. An elastic member is provided to bias the mounting portion toward the upper mold. The resin sealing device according to claim 1 .

9. An air vent is provided on either the peripheral surface of the second runner of the upper mold or the contact surface of the upper surface of the intermediate plate facing the peripheral surface of the second runner. The resin sealing device according to claim 1 .

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