Conductive collars for electrical contact

Abstract

To provide a method for coating contacts to have different colors.SOLUTION: The color can be selected to match the color of a portion of a device housing of an electronic device that houses the contact. Alternatively, embodiments can provide methods for coating the contact 200 to have a color that contrasts with the color of the portion of the device housing. These methods can provide electrical contacts with low contact resistance and good corrosion and scratch resistance.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] (CROSS-REFERENCE TO RELATED APPLICATIONS) This application claims the benefit of U.S. Provisional Patent Application No. 63 / 644,879, filed May 9, 2024, which is incorporated herein by reference. [Background technology]

[0002] The number of types of electronic devices available on the market has increased dramatically over the past few years, and the rate of adoption of new devices shows no signs of slowing. Tablets, laptops, netbooks, desktop and all-in-one computers, smartphones, storage devices, portable media players, wearable computing devices, navigation systems, monitors, and other devices are ubiquitous.

[0003] These electronic devices often include one or more connector receptacles through which power and data can be transmitted. Power and data can be transmitted through cables that include connector inserts at each end of the cable. The connector inserts can be inserted into the receptacles of the communicating electronic devices.

[0004] In other electronic systems, contacts on the surface of a first device can be in direct contact with contacts on a second device, without the need for an intervening cable. Contacts on the surface of electronic devices can be placed in highly visible locations. Thus, their appearance can reflect the care and quality with which the electronic device was made. These contacts, given their location, may be more susceptible to exposure to liquids or other substances that can cause corrosion or discoloration. Contacts on the surface of electronic devices may also be more susceptible to scratches and other types of damage.

[0005] Some of these electronic devices may be very popular and therefore manufactured in large quantities. Therefore, it may be desirable for these contacts to be easily manufactured to meet the demand for electronic devices. It may also be desirable to reduce consumption of resources, such as rare or precious materials, used in their manufacture.

[0006] Therefore, what is needed are electrical contacts and methods for their manufacture, where the electrical contacts have a desirable appearance and low contact resistance. It may also be desirable for these contacts to have good corrosion protection and scratch resistance, and be easily manufactured while consuming a small amount of resources. Summary of the Invention

[0007] Thus, embodiments of the present invention can provide electrical contacts and methods for their manufacture that have desirable appearance and low contact resistance. These contacts can have good corrosion protection and scratch resistance and can be easily manufactured while reducing the consumption of rare or valuable materials. These contacts can be located on the surface of an electronic device, on the surface of a connector insert, within a connector insert on a cable, within a connector receptacle on an electronic device, or anywhere within a connector system.

[0008] Contacts on the surface of a device can be in highly visible locations. Thus, embodiments of the present invention can provide a method for coating contacts to have a variety of colors. The colors can be selected to match the color of a portion of the device housing of the electronic device that houses the contacts. For example, the color of the contacts can be selected to match the portion of the device housing that surrounds or is near the contacts. This can provide an electronic device in which the contacts and at least a portion of the device housing appear to be made of the same material. This uniform appearance can enhance the perceived quality and value of the electronic device.

[0009] These and other embodiments of the present invention may instead provide a method of coating contacts to provide a color that contrasts with the color of a portion of the device housing of the electronic device that houses the contacts. This color may be a noticeable color that allows a user to quickly find the contacts for mating with contacts of a second or accessory device. This contrasting color may also be selected to suggest a manufacturing source or to match other electronic devices, such as the second or accessory device.

[0010] In these and other embodiments of the invention, the contacts can have a particular finish, such as a matte or glossy finish. The color can also have a level of transparency. The contacts can also have more than one color. For example, a logo or other unique, identifying, or other information can be conveyed by two or more colors on the contacts.

[0011] These and other embodiments of the present invention can provide electrical contacts with low contact resistance. For example, the contacts can have a textured surface that includes a plurality of pillars. The pillars can provide multiple contact points between the contacts and corresponding contacts on a second or accessory device when the contacts are mated with corresponding contacts.

[0012] In these and other embodiments of the present invention, a contact substrate can be received. The contact substrate can be copper, aluminum, one of their alloys, stainless steel, or other material. The contact substrate can be plastic with a layer of copper or other material plated on the top surface. The plastic can have an affinity for the plated layer. For example, the plastic can be a thermoplastic polymer such as acrylonitrile butadiene styrene or other material. An electrophoretic deposition coating can be formed on the top surface of the contact substrate. The electrophoretic deposition coating can be an epoxy, acrylic, paint, or other material. The electrophoretic deposition coating can include one or more pigments to provide the electrophoretic deposition coating with a desired color.

[0013] Holes can be formed in the electrophoretically deposited coating. These holes can be formed by sandblasting, chemical etching, photolithography, laser etching, stamping, coining, 3D printing, metal injection molding, printing, casting, or other methods. These holes can be formed through the electrophoretically deposited coating to the top surface of the contact substrate. The bottoms of the holes can be plated to form several pillars, each pillar residing within a corresponding hole. The pillars can have cross-sections of various shapes. For example, they can have cross-sections of circular, square, oval, rectangular, or other shapes. The plating can be copper or other conductive material. The plating can be such that the pillars extend above the top surface of the electrophoretically deposited coating, and when mated, the pillars can form an electrical connection with corresponding contacts on a second or accessory device. That is, the top surfaces of the pillars can form an electrical path with corresponding contacts on a corresponding connector or device when the contacts and corresponding contacts are mated. Because the pillars extend above the top surface of the electrophoretically deposited coating, the contacts can also feel metallic.

[0014] One or more plating layers can be formed on the top of the pillar to help prevent or reduce damage and corrosion. For example, a copper layer can be formed to help planarize the top surface of the pillar. A layer of nickel, which can be electroless nickel, can be plated. A barrier layer can be formed, and the barrier layer can be palladium or other material. A top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, rhodium, or other material or material combination can be plated or otherwise disposed on the barrier layer. A layer of dark rhodium, in which the rhodium is darkened by porosity, can be plated or otherwise disposed on the barrier layer. A gold flash layer can be formed on the barrier layer before the top plate is added to improve adhesion. Plating the top of the pillar instead of the entire top surface of the contact substrate can significantly reduce the amount of area plated, which can help conserve resources such as precious metals.

[0015] More generally, after the pillars are formed, one or more plating layers may be applied to the pillar surfaces. For example, to provide corrosion and scratch protection, a top plate may be formed over the contact substrate. This top plate may be formed from rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, rhodium, or other materials or combinations of materials. The top plate may be formed from dark rhodium, with the rhodium being darkened by porosity. To prevent discoloration of the top plate by the copper substrate, a barrier layer may be formed over the contacts before the top plate is formed. The barrier layer may be tin-copper, nickel, palladium, silver, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, electroless nickel, or other materials. One or more adhesion layers may be applied before or after the barrier layer, or both. These adhesion layers may be gold flash or other layers. Other layers may also be included. For example, a layer of nickel-tungsten alloy, tin-nickel, electroless nickel, copper-nickel, silver, or other material may be plated or formed over the substrate prior to the barrier layer. Other combinations may be used, such as a top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, rhodium, dark rhodium, or other materials or combinations of materials over silver, palladium, nickel, electroless nickel, nickel-tungsten alloy, tin-nickel, tin-copper, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, or other nickel alloy, which may include one or more gold layers. A gold layer over nickel may also be used in these and other embodiments of the present invention. After the holes are formed, additional steps, such as electropolishing or copper plating, may be performed on the substrate before further plating to smooth the laser-damaged areas. In these and other embodiments of the present invention, these layers may be formed by sputtering, evaporation, electroplating, or other methods. The order of these steps may be varied in these and other embodiments of the present invention.

[0016] The location of the pillars can be varied or randomized to avoid the appearance of lines or other artifacts in the pillar pattern, such as light or dark patches. For example, a laser can vary or randomize some of its position information for some or all of the pillars to break up straight lines or other regular or repeating patterns that might otherwise be visible. In these and other embodiments of the invention, the diameter of the pillars can be varied or randomized. Also, pillars can be omitted from areas or regions above the contacts where such pillars might interfere with assembly or operation of the contacts. For example, if the contacts are disposed within an injection-molded housing, pillars can be omitted from areas or regions below or near the injection-molded housing.

[0017] These and other embodiments of the present invention can receive a contact substrate. The contact substrate can be copper, aluminum, one of their alloys, stainless steel, or other materials. The contact substrate can be plastic with a layer of copper or other material plated on its top surface. The plastic can have an affinity for the plated layer. For example, the plastic can be a thermoplastic polymer such as acrylonitrile butadiene styrene or other material. Several holes can be formed in the top surface of the contact substrate. These holes can be formed by sandblasting, chemical etching, photolithography, laser etching, stamping, coining, 3D printing, metal injection molding, printing, casting, or can be formed by other methods. The holes can have various cross sections, such as round, square, oval, rectangular, or other cross sections.

[0018] The top surface of the contact substrate can then be optionally plated with copper. A layer of nickel, which can be electroless nickel, can be plated. A barrier layer can be formed, the barrier layer being palladium or other material. A top plate of rhodium ruthenium, rhodium iridium, platinum ruthenium, rhodium, dark rhodium, or other material or combination of materials can be placed on the barrier layer. A gold flash layer can be formed on the barrier layer before the top plate is added to improve adhesion.

[0019] An electrophoretic deposition coating can be formed on the surface of the contact substrate. As previously mentioned, the electrophoretic deposition coating can be an epoxy, acrylic, or other material. The electrophoretic deposition coating can include a pigment to provide a particular color to the contact substrate and the resulting contacts. Excess electrophoretic deposition coating can then be wiped away, allowing the raised areas between the holes to form electrical connections with corresponding contacts on a second or accessory device.

[0020] These steps may be performed in different orders in this and other embodiments of the invention. For example, some or all of the plating of the top plate and associated layers may be performed after the holes have been filled with the electrophoretically deposited coating and the excess removed.

[0021] The location of the holes can be varied or randomized to avoid the appearance of lines or other artifacts in the hole pattern, such as light or dark patches. For example, a laser can vary or randomize some of its position information for some or all of the holes to break up lines or other regular or repeating patterns that might otherwise be visible to the eye. In these and other embodiments of the invention, the diameter of the holes can be varied or randomized. Also, holes can be omitted from areas or regions on the contacts where such holes might interfere with assembly or operation of the contacts. For example, if the contacts are placed in an injection-molded housing, holes can be omitted from areas or regions under or near the injection-molded housing.

[0022] While embodiments of the present invention are well suited to electrical contacts and their manufacturing methods, these and other embodiments of the present invention can be used to improve the appearance and corrosion resistance of other structures. For example, various parts such as cases and enclosures for electronic devices, connector housings and shields, battery terminals, magnetic elements, measurement and medical instruments, sensors, fasteners, clips and bands for wearable computing devices, bearings, gears, chains, tools, or any portion thereof, can be covered with coatings, platings, and other layers as described herein or otherwise provided by embodiments of the present invention. Coatings, platings, and other layers for these other structures can be formed or manufactured as described herein or otherwise provided by embodiments of the present invention. For example, magnets and other structures for fasteners, connectors, speakers, receiver magnets, receiver-magnet assemblies, microphones, and other devices can be improved with structures and methods such as those shown here and in other embodiments of the present invention. Embodiments of the present invention can be utilized in a variety of industries, including automotive, aerospace, electronic devices, and jewelry.

[0023] In various embodiments of the present invention, the contacts and their connector assemblies can be formed from a variety of materials and by a variety of methods. For example, the contacts and other conductive portions can be formed by stamping, coining, metal injection molding, machining, micromachining, 3D printing, or other manufacturing processes. As described herein, the conductive portions can be formed from stainless steel, steel, copper, copper alloys, copper titanium, phosphor bronze, palladium, palladium silver, or other materials or combinations of materials. As described herein, the conductive portions can be plated or coated with nickel, gold, palladium, rhodium, dark rhodium, ruthenium, or other materials. Injection or other molding, 3D printing, machining, or other manufacturing processes can be used to form the non-conductive portions. The non-conductive portions can be formed from silicon, silicone, Mylar, Mylar tape, rubber, hard rubber, plastic, nylon, elastomer, liquid crystal polymer (LCP), ceramic, or other non-conductive materials or combinations of materials.

[0024] Embodiments of the present invention can provide contacts and their connector assemblies that can be located in and connected to a variety of devices, such as portable computing devices, tablet computers, desktop computers, laptops, all-in-one computers, wearable computing devices, mobile phones, smartphones, media phones, storage devices, keyboards, covers, cases, portable media players, navigation systems, monitors, power supplies, adapters, remote control devices, chargers, and other devices. These contacts and their connector assemblies can provide paths for signals conforming to various standards, such as Universal Serial Bus (USB), High-Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI), Ethernet, DisplayPort, Thunderbolt, Lightning, Joint Test Action Group (JTAG), Test Access Port (TAP), Guided Automatic Random Test (DART), Universal Asynchronous Receiver / Transmitter (UART), clock signals, power signals, and other types of standardized, non-standard, and proprietary interfaces that have been developed, are being developed, or will be developed in the future, and combinations thereof. In various embodiments of the present invention, these interconnect paths provided by these contacts can be used to convey power, ground, signals, test points, and other voltages, currents, data, or other information.

[0025] Various embodiments of the present invention may incorporate one or more of these and other features described herein. A better understanding of the nature and advantages of the present invention can be obtained by reference to the following detailed description and accompanying drawings. [Brief explanation of the drawings]

[0026] [Figure 1] 1 illustrates an electronic system according to one embodiment of the present invention.

[0027] [Figure 2] 1A-1C illustrate a method of manufacturing a contact according to an embodiment of the present invention. [Figure 3] 1A-1C illustrate a method of manufacturing a contact according to an embodiment of the present invention. [Figure 4] 1A-1C illustrate a method of manufacturing a contact according to an embodiment of the present invention. [Figure 5] 1A-1C illustrate a method of manufacturing a contact according to an embodiment of the present invention.

[0028] [Figure 6] 10A-10C illustrate another method of manufacturing a contact according to an embodiment of the present invention. [Figure 7] 10A-10C illustrate another method of manufacturing a contact according to an embodiment of the present invention. [Figure 8] 10A-10C illustrate another method of manufacturing a contact according to an embodiment of the present invention. [Figure 9] 10A-10C illustrate another method of manufacturing a contact according to an embodiment of the present invention.

[0029] [Figure 10] 1 illustrates a method for avoiding visible patterns on the surface of a contact, according to one embodiment of the present invention. [Figure 11] 1 illustrates a method for avoiding visible patterns on the surface of a contact, according to one embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0030] Figure 1 illustrates an electronic system according to one embodiment of the present invention. This figure, as well as the other figures included therein, are shown for illustrative purposes and are not intended to limit any of the possible embodiments of the invention or the scope of the claims.

[0031] In this example, host device 110 may be connected to accessory device 120 to share data, power, or both. Specifically, electrical contacts (or more simply, contacts) 112 on host device 110 may be electrically connected to contacts 122 on accessory device 120. Contacts 112 on host device 110 may be electrically connected to contacts 122 on accessory device 120 via cable 130. In other embodiments of the invention, contacts 112 on host device 110 may be in physical contact with and directly electrically connected to contacts 122 on accessory device 120. In yet other embodiments of the invention, contacts 112 and 122 may include one or more optical contacts (not shown) supporting one or more optical connections between host device 110 and accessory device 120.

[0032] To facilitate a direct connection between contacts 112 on host device 110 and contacts 122 on accessory device 120, contacts 112 on host device 110 and contacts 122 on accessory device 120 may be located on the surface of their respective devices. However, this location may make them highly visible to a user and vulnerable to exposure to liquids, fluids, or other types of contaminants. This location may also make the contacts vulnerable to scratches, nicks, or other damage.

[0033] Thus, embodiments of the present invention can provide a method of coating contacts to provide a particular color. The color can be selected to match the color of a portion of the device housing of the electronic device that houses the contacts. For example, the color of the contacts can be selected to match a portion of the device housing that surrounds or is near the contacts. This can provide an electronic device in which the contacts and at least a portion of the device housing appear to be made of the same material. This uniform appearance can enhance the perceived quality and value of the electronic device.

[0034] These and other embodiments of the present invention may instead provide a method of coating contacts to provide a color that contrasts with the color of a portion of the device housing of the electronic device that houses the contacts. This color may be a noticeable color that allows a user to quickly find the contacts for mating with contacts of a second or accessory device. This contrasting color may also be selected to suggest a manufacturing source or to match other electronic devices, such as the second or accessory device.

[0035] In these and other embodiments of the invention, the contacts can have a particular finish, such as a matte or glossy finish. The color can also have a level of transparency. The contacts can also have more than one color. For example, a logo or other unique, identifying, or other information can be conveyed by two or more colors on the contacts, by the position of pillars or other raised surfaces, or by a combination thereof.

[0036] These and other embodiments of the present invention can provide electrical contacts with low contact resistance. For example, the contacts can have a textured surface with a pattern of raised areas or ridges. These raised areas or ridges can provide multiple contact points between the contacts and corresponding contacts on a second or accessory device when the contacts are mated with corresponding contacts.

[0037] These and other embodiments of the present invention can provide electrical contacts with good corrosion and scratch resistance. For example, a coating to provide color can be placed on the surface of the contact. This coating can be interspersed with conductive pillars or other raised portions that can provide some protection to the contact against corrosion or scratches. An example is shown in the following figure.

[0038] 2-5 illustrate a method of fabricating a contact according to an embodiment of the invention. In FIG. 2, a contact substrate 210 for contact 200 can be received, which can be used as contact 112 (shown in FIG. 1). Contact substrate 210 can be for contact 122 or other contacts in other devices. Contact substrate 210 for contact 200 can be formed from copper, a copper alloy, stainless steel, aluminum, or other materials. Contact substrate 210 can also be plastic plated with a layer of copper (not shown) or other material on its top surface. The plastic can have an affinity for the plated layer. For example, the plastic can be a thermoplastic polymer such as acrylonitrile butadiene styrene or other material. An electrophoretically deposited coating 220 can be formed on the top surface of the contact substrate. Electrophoretically deposited coating 220 can be epoxy, acrylic, paint, or other material. Electrophoretically deposited coating 220 can include one or more pigments to provide electrophoretically deposited coating 220 with a desired color.

[0039] In these and other embodiments of the invention, instead of using an electrophoretically deposited coating 220, other materials, such as conductive inks or other types of inks, can be used. In these and other embodiments of the invention, paints can be used. For example, polymer paints, such as polytetrafluoroethylene (PTFE)-based paints, can be used. These inks or paints can be applied using pad printing, inkjet printing, 3D printing, aerosol jet printing, or other types of printing.

[0040] 3, several holes 310 can be formed in the electrophoretically deposited coating 220. These holes 310 can be formed in at least a portion of one or more surfaces of the contact 200, for example along the top surface of the contact 200. These holes 310 can be formed in the electrophoretically deposited coating 220 in a variety of ways. The holes 310 can be formed by sandblasting, chemical etching, photolithographic formation, laser etching, stamping, coining, 3D printing, metal injection molding, printing, casting, or other methods. The holes 310 can extend to the top surface of the contact substrate 210.

[0041] In FIG. 4 , several pillars 410 can be formed by plating portions of the contact substrate 210 exposed by the holes 310. These pillars 410 can be formed from copper or other plating material. Each pillar 410 can be formed in a corresponding one of the holes 310. The pillars 410 can have cross-sections of various shapes. For example, the pillars 410 can have cross-sections that are circular, square, oval, rectangular, or other shapes. The pillars 410 can extend above the surrounding electrophoretically deposited coating 220 to form electrical connections with corresponding contacts on a second or accessory device. Because the pillars extend above the top surface of the electrophoretically deposited coating, the contacts 200 can also feel metallic.

[0042] In FIG. 5 , the top surface of the pillar 410 of the contact 200 can be plated with one or more plating layers 510. The plating layer 510 can include a top plate that can be formed on the pillar 410 to provide corrosion and scratch protection. The top plate can be formed from rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, ruthenium, rhodium, or other materials or combinations of materials. The top plate can be formed from dark rhodium, with the rhodium being darkened by porosity. To prevent discoloration of the top plate by the contact substrate 210, a barrier layer can be formed over the pillar 410 before the top plate is formed. The barrier layer can be tin-copper, nickel, palladium, silver, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, electroless nickel, or other materials. One or more adhesion layers can be applied before or after the barrier layer, or both. These adhesion layers can be gold flash or other layers. Other layers can also be included. For example, a layer of nickel-tungsten alloy, tin-nickel, electroless nickel, copper-nickel, silver, or other material may be plated or formed over the substrate prior to the barrier layer. Other combinations may be used, such as a top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, or other material or combination of materials over silver, including silver, palladium, nickel, electroless nickel, nickel-tungsten alloy, tin-nickel, tin-copper, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, or other nickel alloy, which may include one or more gold layers. In these and other embodiments of the present invention, a gold layer over nickel may also be used. After the holes are formed, additional steps, such as electropolishing or copper plating, may be performed on the substrate before plating to smooth any areas damaged by the laser. In these and other embodiments of the present invention, these layers may be formed by sputtering, evaporation, electroplating, or other methods. Plating the plating layer 510 only on the top of the pillars 410 reduces the area to be plated, conserving resources such as precious metals.

[0043] 6-9 illustrate another method for fabricating a contact according to an embodiment of the present invention. In FIG. 6, a contact substrate 610 for contact 600 can be received, which can be used as contact 112 (shown in FIG. 1). The contact substrate 610 can be for contact 122 or other contacts in other devices. The contact substrate 610 for contact 600 can be formed from copper, a copper alloy, stainless steel, aluminum, or other materials. The contact substrate 610 can also be plastic with a copper layer (not shown) or other material plated on top. The plastic can have an affinity for the plated layer. For example, the plastic can be a thermoplastic polymer such as acrylonitrile butadiene styrene or other material. Several holes 630 can be formed in the top surface of the contact substrate 610, leaving raised areas 620. The holes 630 can be formed by sandblasting, chemical etching, photolithographic formation, laser etching, stamping, coining, 3D printing, metal injection molding, printing, casting, or other methods. The holes 630 can have various cross-sectional shapes. For example, the holes 630 can have a cross section that is circular, square, oval, rectangular, or other shape.

[0044] In FIG. 7 , an optional layer, such as a copper layer 710, can be plated on the top surface of the contact substrate 610. In FIG. 8 , the top surface of the contact substrate 610 can be plated with one or more plating layers 810. The plating layer 810 can include a top plate that can be formed on the top surface of the contact substrate 610 to provide corrosion and scratch protection. This top plate can be formed of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, or other materials or combinations of materials. A barrier layer can be formed on the top surface of the contact substrate 610 before the top plate is formed to prevent discoloration of the top plate by the contact substrate 610. The barrier layer can be tin-copper, nickel, palladium, silver, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, electroless nickel, or other materials. One or more adhesion layers can be applied before or after the barrier layer, or both. These adhesion layers can be gold flash or other layers. Other layers can also be included. For example, a layer of nickel-tungsten alloy, tin-nickel, electroless nickel, copper-nickel, silver, or other material may be plated or formed over the substrate prior to the barrier layer. Other combinations may also be used, such as a top plate of rhodium-ruthenium, rhodium-iridium, platinum-ruthenium, or other material or combination of materials over silver, over silver, palladium, nickel, electroless nickel, nickel-tungsten alloy, tin-nickel, tin-copper, tin-copper-nickel, copper-nickel, tin-nickel, nickel-tungsten, or other nickel alloy, which may include one or more layers of gold. In these and other embodiments of the present invention, a layer of gold over nickel may also be used. After the holes are formed, additional steps, such as electropolishing or copper plating, may be performed on the substrate before plating to smooth areas damaged by the laser. In these and other embodiments of the present invention, these layers may be formed by sputtering, evaporation, electroplating, or other methods.

[0045] 9, an electrophoretically deposited coating 910 may be formed on the top surface of the contact substrate 610. The electrophoretically deposited coating 910 may be an epoxy, acrylic, paint, or other material. The electrophoretically deposited coating 910 may include one or more pigments to provide the electrophoretically deposited coating 910 with a desired color. After the electrophoretically deposited coating 910 is applied to the top surface of the contact substrate 610, excess may be wiped off to expose the raised areas 620.

[0046] These steps may be performed in different orders in this and other embodiments of the invention. For example, some or all of the plating of the top plate and associated plating layer 810 may be performed after the holes have been filled with the electrophoretically deposited coating 910 and the excess removed. This helps reduce the area of ​​the contacts 600 that is plated, thereby conserving resources such as precious metals.

[0047] In these and other embodiments of the invention, instead of using an electrophoretically deposited coating 910, other materials, such as conductive inks or other types of inks, can be used. In these and other embodiments of the invention, paints can be used. For example, polymer paints, such as polytetrafluoroethylene (PTFE)-based paints, can be used. These inks or paints can be applied using pad printing, inkjet printing, 3D printing, aerosol jet printing, or other types of printing.

[0048] 10 and 11 illustrate a method for avoiding visible patterns on the surface of a contact, according to one embodiment of the present invention. FIG. 10 shows a line 1000 that can be seen in the pattern of pillars 410 and surrounds the electrophoretically deposited coating 220. To avoid the appearance of lines or other artifacts in the pattern of pillars 410, the location of the pillars 410 can be varied or randomized, or more specifically, pseudo-randomized. That is, the location of the pillars 410 formed in the electrophoretically deposited coating 220 can be varied or randomized. For example, a laser can vary or randomize some of its position information for some or all of the pillars 410 to break up straight lines or other regular patterns that might otherwise be visible. In FIG. 11, the location or position of the pillars 410 has been altered to prevent artifacts along the line 1000.

[0049] Using these variations, the resulting pattern of pillars 410 can appear randomized, reducing the occurrence of regular or repeating lines, patterns, or observable light or dark areas. In these and other embodiments of the invention, the diameter of the pillars 410 can be varied or randomized to avoid the appearance of lines, light or dark patches, or other artifacts. Also, pillars 410 can be omitted from areas or regions above the contact where such pillars 410 may interfere with further assembly or operation of the contact. For example, if the contact is disposed within an injection-molded housing, pillars 410 can be omitted from areas or regions below or near the injection-molded housing.

[0050] In these and other embodiments of the invention, pillars 410 may be arranged to provide contact 200 with a texture that may match or resemble the texture of the surrounding device housing (not shown). That is, the laser pattern may be tailored such that the texture of contact 200 can provide an appealing effect when contact 200 is combined with the surrounding material of the device housing. In these and other embodiments of the invention, pillars 410 may be formed within the device housing as well as within the contact surface of contact 200. In these and other embodiments of the invention, pillars 410 may be arranged to provide other textures to contact 200.

[0051] 10 and 11 are described in the context of pillars 410 of contact 600, these concepts can be applied to holes 630 of contact 200.

[0052] While embodiments of the present invention are well suited to electrical contacts and their manufacturing methods, these and other embodiments of the present invention can be used to improve the appearance and corrosion resistance of other structures. For example, various parts such as cases and enclosures for electronic devices, connector housings and shields, battery terminals, magnetic elements, measurement and medical instruments, sensors, fasteners, clips and bands for wearable computing devices, bearings, gears, chains, tools, or any portion thereof, can be covered with coatings, platings, and other layers as described herein or otherwise provided by embodiments of the present invention. Coatings, platings, and other layers for these other structures can be formed or manufactured as described herein or otherwise provided by embodiments of the present invention. For example, magnets and other structures for fasteners, connectors, speakers, receiver magnets, receiver-magnet assemblies, microphones, and other devices can be improved with structures and methods such as those shown here and in other embodiments of the present invention. Embodiments of the present invention can be utilized in a variety of industries, including automotive, aerospace, electronic devices, and jewelry.

[0053] These and other embodiments of the present invention, including the contacts described above, may include other layers, such as barrier layers to prevent corrosion of internal structures. For example, a barrier layer, such as a zinc barrier layer, may be used to protect the magnet or other internal structures from corrosion via a cladding or plating layer. Catalyst layers may be used to improve the deposition rate of other layers, thereby improving the manufacturing process. These catalyst layers may be formed of palladium or other materials. These and other embodiments of the present invention, including the contacts described above, may also include stress isolation layers, such as those formed of copper. Other scratch protection layers, passivation layers, and corrosion-resistant layers may also be included.

[0054] In various embodiments of the present invention, contacts and their connector assemblies can be formed from a variety of materials and by a variety of methods. For example, contacts and other conductive portions can be formed by stamping, coining, metal injection molding, machining, micromachining, 3D printing, or other manufacturing processes. As described herein, conductive portions can be formed from stainless steel, steel, copper, copper alloys, copper titanium, phosphor bronze, palladium, palladium silver, or other materials or combinations of materials. As described herein, conductive portions can be plated or coated with nickel, gold, palladium, rhodium, ruthenium, or other materials. These can be plated with dark rhodium, which is darkened by porosity. Non-conductive portions can be formed using injection or other molding, 3D printing, machining, or other manufacturing processes. Non-conductive portions can be formed from silicon, silicone, Mylar, Mylar tape, rubber, hard rubber, plastic, nylon, elastomer, liquid crystal polymer (LCP), ceramic, or other non-conductive materials or combinations of materials.

[0055] Embodiments of the present invention can provide contacts and their connector assemblies that can be located in and connected to a variety of devices, such as portable computing devices, tablet computers, desktop computers, laptops, all-in-one computers, wearable computing devices, mobile phones, smartphones, media phones, storage devices, keyboards, covers, cases, portable media players, navigation systems, monitors, power supplies, adapters, remote control devices, chargers, and other devices. These contacts and their connector assemblies can provide paths for signals conforming to various standards, such as Universal Serial Bus (USB), High-Definition Multimedia Interface (HDMI), Digital Visual Interface (DVI), Ethernet, DisplayPort, Thunderbolt, Lightning®, Joint Test Action Group (JTAG), Test Access Port (TAP), Guided Automatic Random Test (DART), Universal Asynchronous Receiver / Transmitter (UART), clock signals, power signals, and other types of standardized, non-standard, and proprietary interfaces, as well as combinations thereof, developed, in development, or to be developed in the future. In various embodiments of the present invention, these interconnect paths provided by these connectors can be used to convey power, ground, signals, test points, and other voltages, currents, data, or other information.

[0056] The foregoing description of embodiments of the present invention has been presented for purposes of illustration and description. It is not intended to be exhaustive or to limit the invention to the precise form described, as many modifications and variations are possible in light of the above teachings. The embodiments have been chosen and described to best explain the principles of the invention and its practical application, thereby enabling others skilled in the art to best utilize the invention in various embodiments, and with various modifications as may be suitable for the particular use contemplated. It is therefore to be understood that the invention is intended to cover all modifications and equivalents within the scope of the following claims.

Claims

1. 1. A method of manufacturing an electrical contact, the method comprising: receiving a contact substrate; forming a coating layer on an upper surface of the contact substrate; forming a plurality of holes in the coating layer, the holes extending to a top layer of the contact substrate; plating the holes in the top surface of the contact substrate to form a plurality of pillars; A method comprising:

2. The method of claim 1 , further comprising plating a top surface of each of the plurality of pillars.

3. The method of claim 2 , wherein the contact substrate comprises copper.

4. The method of claim 2 , wherein the contact substrate comprises a plating layer on plastic.

5. The method of claim 2 , wherein the coating layer comprises an electrophoretic deposition coating.

6. The method of claim 5 , wherein the electrophoretically deposited coating comprises an epoxy.

7. The method of claim 5 , wherein the electrophoretically deposited coating comprises an acrylic.

8. 6. The method of claim 5, wherein plating the plurality of pillars comprises plating a surface of each pillar with palladium, applying a gold flash to the palladium, and plating the gold flash with one of rhodium, rhodium ruthenium, or platinum ruthenium.

9. The method of claim 8 , wherein the plurality of pillars are formed at locations that vary by varying amounts from a regularly repeating pattern.

10. 10. The method of claim 9, wherein the location of each of the plurality of pillars within the plurality of pillars varies from a regularly repeating pattern by a first amount in a first direction and by a second amount in a second direction, the first amount and the second amount varying among the plurality of pillars.

11. The method of claim 9 , wherein a width of a first pillar in the plurality of pillars varies compared to a width of a second pillar in the plurality of pillars.

12. 1. An electrical contact for an electronic device, the electrical contact comprising: a contact substrate; a coating layer on the contact substrate, the coating layer having a plurality of holes; a plurality of pillars, each pillar formed in a corresponding one of the plurality of holes; An electrical contact comprising:

13. The electrical contact of claim 12 , further comprising a plating layer on an upper surface of each of the plurality of pillars.

14. The electrical contact of claim 13 , wherein the coating layer comprises an electrophoretic deposition coating.

15. The electrical contact of claim 14 , wherein the electrophoretically deposited coating includes a pigment such that the color of the electrical contact matches the color of the surrounding portion of the housing of the electronic device.

16. 15. The electrical contact of claim 14, wherein the electrophoretically deposited coating includes a pigment such that the color of the electrical contact contrasts with the color of the surrounding portion of the housing of the electronic device.

17. 1. A method of manufacturing an electrical contact, the method comprising: receiving a contact substrate; forming a plurality of holes in an upper surface of the contact substrate; forming a coating layer on the top surface of the contact substrate; removing excess coating layer from the top surface of the contact substrate so that the coating layer remains in the holes on the top surface of the contact substrate; A method comprising:

18. 20. The method of claim 17, further comprising plating the top surface of the contact substrate before forming the coating layer on the top surface of the contact substrate.

19. 20. The method of claim 17, further comprising plating the top surface of the contact substrate after removing excess coating layers from the top surface of the contact substrate.

20. The method of claim 17 , wherein the coating layer comprises an electrophoretic deposition coating.

Images