Cutting device

Abstract

To provide a cutting device that is configured to shorten a time required in dressing a cutting blade.SOLUTION: A first lifting mechanism 16 lifts up a first cutting mechanism 18 so as to make an upper end of a cutting blade 31 contact a dressing grindstone 51 arranged above the cutting blade 31 to dress the cutting blade 31. Therefore, the cutting blade 31 can be dressed, just by lifting up the cutting blade 31 for each first cutting mechanism 18. This can shorten a time required in dressing the cutting blade, in comparison with a case where the first cutting mechanism 18 is moved onto a dressing board held on a sub-chuck table to cut the cutting blade 31 into the dressing board.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] The present invention relates to a cutting device. [Background technology]

[0002] As disclosed in Patent Document 1, a sub-chuck table is arranged in the cutting device to enable dressing of the cutting blade during cutting processing, and a dressing board is arranged on the sub-chuck table. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Publication No. 2023-051422 Summary of the Invention [Problem to be solved by the invention]

[0004] When dressing a cutting blade, the cutting blade is forced into a dressing board held by a sub-chuck table, which requires movement time for dressing during cutting.

[0005] SUMMARY OF THE INVENTION It is therefore an object of the present invention to shorten the time required for dressing a cutting device. [Means for solving the problem]

[0006] The cutting device of the present invention (the present cutting device) is a cutting device comprising: a chuck table for holding a workpiece; a cutting mechanism for cutting the workpiece with a rotating cutting blade; a lifting mechanism for raising and lowering the cutting mechanism; a dressing mechanism equipped with a dressing grindstone for dressing the cutting blade; and a dressing control unit for dressing the cutting blade by bringing the tip of the cutting blade into contact with the dressing grindstone, wherein the dressing mechanism comprises a holding unit positioned above the cutting blade for holding the dressing grindstone, and the dressing control unit raises the cutting mechanism to bring the upper end of the cutting blade into contact with the dressing grindstone held in the holding unit, thereby dressing the cutting blade.

[0007] In this cutting device, the dressing mechanism may further include a guide section that supports the holding section so that it can be raised and lowered freely, an upward biasing section that biases the holding section upward, and a block that is arranged above the holding section and is not raised and lowered by the lifting mechanism, and the holding section, the guide section, and the upward biasing section may be arranged above the cutting blade in the cutting mechanism and configured to be raised and lowered together with the cutting mechanism by the lifting mechanism, and the dressing control section may raise the cutting mechanism and press the holding section against the block to stop the rise of the dressing grindstone, and bring the upper end of the cutting blade, which rises against the biasing force of the upward biasing section, into contact with the dressing grindstone.

[0008] The cutting device may be equipped with an AE sensor that measures the vibrations that occur when the cutting blade comes into contact with the dressing grindstone, and the dressing control unit may raise the cutting mechanism to bring the cutting blade into contact with the dressing grindstone so that the measurement value of the AE sensor when the cutting blade comes into contact with the dressing grindstone becomes a predetermined value.

[0009] In this cutting device, the cutting mechanism may include a motor that rotates the cutting blade and a rotational load detection unit that detects the load current value that increases due to the rotational load on the motor, and the dress control unit may raise the cutting mechanism to bring the cutting blade into contact with the dressing grindstone so that the load current value detected by the rotational load detection unit when the cutting blade comes into contact with the dressing grindstone becomes a predetermined value.

[0010] In this cutting device, the dressing mechanism may include a rotating shaft that suspends the dressing grindstone and a rotary drive source that rotates the rotating shaft, and the dressing control unit may bring the tip of the cutting blade into contact with the dressing grindstone that rotates by rotating the rotating shaft. [Effects of the Invention]

[0011] In this cutting machine, the dressing control unit uses the lifting mechanism to raise the cutting mechanism and bring the upper end of the cutting blade into contact with the dressing grindstone located above the cutting blade, thereby dressing the cutting blade. Therefore, the cutting blade can be dressed simply by raising the cutting mechanism and the cutting blade together with the lifting mechanism. This reduces the time required to dress the cutting blade compared to moving the cutting mechanism over a dressing board held on a sub-chuck table and cutting the cutting blade into the dressing board. [Brief explanation of the drawings]

[0012] [Figure 1] FIG. 2 is a perspective view showing the configuration of a cutting device. [Figure 2] FIG. 4 is a side view showing the configuration of a first cutting mechanism and a dressing mechanism. [Figure 3] FIG. 4 is a side view showing the configuration of a first cutting mechanism and a dressing mechanism. [Figure 4] FIG. 10 is a side view showing another configuration of the first cutting mechanism and the dressing mechanism. [Figure 5] FIG. 10 is a side view showing another configuration of the first cutting mechanism and the dressing mechanism. [Figure 6] FIG. 10 is a perspective view showing another configuration of the first cutting mechanism and the dressing mechanism. DETAILED DESCRIPTION OF THE INVENTION

[0013] 1 is an example of a workpiece, and has a roughly circular disk shape. A grid-like dividing line 102 is formed on the surface of the wafer 100. Various devices (not shown) are formed in each of the areas partitioned by the dividing lines 102.

[0014] A dicing tape 103 is attached to the back surface of the wafer 100. A ring frame 105 is attached to the outer periphery of the dicing tape 103. In this manner, the wafer 100 is processed in the cutting device 1 in the state of a work set 107 supported by the ring frame 105 via the dicing tape 103.

[0015] The cutting device 1 is an example of a processing device that processes a wafer 100, which is a workpiece. The cutting device 1 is what is called a dual dicer, and performs cutting processing on the wafer 100. The cutting device 1 includes a base 10, a gate-type column 14 erected on the base 10, and a control unit 7 that controls each component of the cutting device 1.

[0016] An X-axis direction moving mechanism 11 is disposed on the base 10. The X-axis direction moving mechanism 11 is an example of a moving unit that moves a first cutting mechanism 18 and a second cutting mechanism 19, which are processing units, relatively closer to and farther away from a chuck table 20. The X-axis direction moving mechanism 11 moves the chuck table 20 along the cutting feed direction (X-axis direction).

[0017] The X-axis movement mechanism 11 includes a pair of guide rails 111 extending in the X-axis direction, an X-axis table 113 placed on the guide rails 111, a ball screw 110 extending parallel to the guide rails 111, and a motor 112 that rotates the ball screw 110.

[0018] A pair of guide rails 111 are arranged on the upper surface of the base 10, parallel to the X-axis direction. The X-axis table 113 is installed on the pair of guide rails 111 so as to be slidable along these guide rails 111. The θ table 25 and the chuck table 20 are arranged on the X-axis table 113.

[0019] The ball screw 110 is threadedly engaged with a nut portion (not shown) provided on the X-axis table 113. The motor 112 is connected to one end of the ball screw 110 and rotates the ball screw 110. When the ball screw 110 is rotated, the X-axis table 113, the θ table 25, and the chuck table 20 move in the X-axis direction along the guide rail 111.

[0020] The chuck table 20 holds the wafer 100, which is the workpiece. In this embodiment, the wafer 100 is held by the chuck table 20 in the state of the work set 107 described above. The upper surface of the chuck table 20 serves as a holding surface 22 that suction-holds the wafer 100 in the work set 107. In addition, four clamps 28 are provided on the outer edge of the chuck table 20.

[0021] In the chuck table 20, the holding surface 22 is connected to a suction source (not shown), so that the wafer 100 of the work set 107 is suction-held on the holding surface 22 via the dicing tape 103. In addition, the ring frame 105 of the work set 107 is clamped and fixed from all four sides by the clamps 28. In this manner, the chuck table 20 holds the work set 107.

[0022] The chuck table 20 is supported by a θ table 25 disposed on the bottom side of the chuck table 20. The θ table 25 is provided on the upper surface of the X-axis table 113 so as to be rotatable within the XY plane. Therefore, the θ table 25 not only supports the chuck table 20, but also can rotate the chuck table 20 within the XY plane.

[0023] A gate-shaped column 14 is erected on the rear side (−X direction side) of the base 10 so as to straddle the X-axis direction moving mechanism 11.

[0024] A moving mechanism 13 that moves the first cutting mechanism 18 and the second cutting mechanism 19 is provided on the front surface (the surface on the +X direction side) of the gantry column 14. The moving mechanism 13 indexes the first cutting mechanism 18 and the second cutting mechanism 19 in the Y-axis direction and cuts them in the Z-axis direction.

[0025] The movement mechanism 13 includes a first lifting mechanism 16 that raises and lowers the first cutting mechanism 18 on the +Y direction side, a second lifting mechanism 17 that raises and lowers the second cutting mechanism 19 on the -Y direction side, and a Y-axis movement mechanism 12 that moves the first cutting mechanism 18 and the second cutting mechanism 19 in the Y-axis direction. The first lifting mechanism 16, the second lifting mechanism 17, and the Y-axis movement mechanism 12 are an example of a movement unit that moves the first cutting mechanism 18 and the second cutting mechanism 19, which are processing units, relatively closer to and farther away from the chuck table 20.

[0026] The Y-axis direction moving mechanism 12 is disposed in front of the gantry column 14. The Y-axis direction moving mechanism 12 reciprocates a first lifting mechanism 16 supporting a first cutting mechanism 18 and a second lifting mechanism 17 supporting a second cutting mechanism 19 along the Y-axis direction.

[0027] The Y-axis direction moving mechanism 12 includes a pair of guide rails 121 extending in the Y-axis direction, a first Y-axis table 123 and a second Y-axis table 125 attached to the guide rails 121, a first ball screw 120 and a second ball screw 122 extending parallel to the guide rails 121, a first motor 124 that rotates the first ball screw 120, and a second motor (not shown) that rotates the second ball screw 122.

[0028] A pair of guide rails 121 are arranged in front of the gate-shaped column 14, parallel to the Y-axis direction. The first Y-axis table 123 and the second Y-axis table 125 are installed on the pair of guide rails 121 so as to be slidable along these guide rails 121. A first lifting mechanism 16 and a first cutting mechanism 18 are attached to the first Y-axis table 123. A second lifting mechanism 17 and a second cutting mechanism 19 are attached to the second Y-axis table 125.

[0029] The first ball screw 120 is threadedly engaged with a nut portion (not shown) provided on the first Y-axis table 123. The first motor 124 is connected to one end of the first ball screw 120 and rotates the first ball screw 120. As the first ball screw 120 is rotated, the first Y-axis table 123, the first lifting mechanism 16, and the first cutting mechanism 18 move in the Y-axis direction along the guide rail 121.

[0030] Similarly, the second ball screw 122 is threaded into a nut portion (not shown) of the second Y-axis table 125, and is rotationally driven by a second motor connected to one end of the nut portion. This causes the second Y-axis table 125, the second lifting mechanism 17, and the second cutting mechanism 19 to move in the Y-axis direction along the guide rail 121.

[0031] The first lifting mechanism 16 reciprocates the first cutting mechanism 18 in the Z-axis direction. The first lifting mechanism 16 includes a pair of guide rails 161 extending in the Z-axis direction, a support member 163 arranged on the guide rails 161, a ball screw 160 extending parallel to the guide rails 161, and a motor 162 that rotates the ball screw 160.

[0032] A pair of guide rails 161 are arranged parallel to the Z-axis direction on the first Y-axis table 123. A support member 163 is installed on the pair of guide rails 161 so as to be slidable along these guide rails 161. A first cutting mechanism 18 is attached to the lower end of the support member 163.

[0033] The ball screw 160 is threadedly engaged with a nut portion (not shown) provided on the support member 163. The motor 162 is connected to one end of the ball screw 160 and rotates the ball screw 160. When the ball screw 160 is rotated, the support member 163 and the first cutting mechanism 18 move in the Z-axis direction along the guide rail 161.

[0034] The second lifting mechanism 17 also reciprocates the second cutting mechanism 19 in the Z-axis direction. The second lifting mechanism 17 has a similar configuration to the first lifting mechanism 16, and therefore a description thereof will be omitted.

[0035] The first cutting mechanism 18 and the second cutting mechanism 19 cut the wafer 100 held on the chuck table 20 with a rotating cutting blade.

[0036] 2, the first cutting mechanism 18 includes a spindle 30 extending in the Y-axis direction, a motor 39 that drives the spindle 30, a cutting blade 31 attached to the spindle 30, and a first blade cover 34 and a second blade cover 35 that surround the cutting blade 31. In this configuration, a gap is formed between the first blade cover 34 on the -X direction side and the second blade cover 35 on the +X direction side. The motor 39 rotates the spindle 30, thereby rotating the cutting blade 31 attached to the spindle 30. The spindle 30 and the motor 39 are disposed in a casing 40 shown in FIG. 1. The first cutting mechanism 18 also includes a rotation load detection unit 391. The rotation load detection unit 391 detects the load current value of the motor 39.

[0037] 2, blade cooling nozzles 36 are disposed on the first blade cover 34. The blade cooling nozzles 36 are generally L-shaped, and a pair of them are provided so as to face each other on both sides (the front and back surfaces) of the cutting blade 31. The pair of blade cooling nozzles 36 are connected to a cutting water source 201, and spray cutting water to the sides of the cutting blade 31 during cutting.

[0038] In addition, a cutting water nozzle 38 is disposed on the second blade cover 35. The cutting water nozzle 38 is connected to a cutting water source 201, and is configured to spray cutting water from obliquely above toward the contact portion (processing point) between the cutting blade 31 and the wafer 100 during cutting processing.

[0039] The cutting blade 31 has a disk-shaped flange 32 and an annular cutting edge (cutting edge) 33 provided on the outer periphery of the flange 32. The tip of the spindle 30 is inserted into and fixed to the center of the flange 32. The cutting edge 33 is formed, for example, by fixing diamond abrasive grains or the like with an appropriate binder.

[0040] In the first cutting mechanism 18 having such a configuration, the motor 39 drives the spindle 30 to rotate at high speed, thereby rotating the cutting blade 31 at high speed, and cutting of the wafer 100 is performed.

[0041] Moreover, above the first cutting mechanism 18, a dressing mechanism 50 equipped with a dressing grindstone for dressing the cutting blade 31 is disposed.

[0042] The dressing mechanism 50 has a dressing grindstone 51 and a holder 52 that holds the dressing grindstone 51. The holder 52 is disposed above the cutting blade 31 together with the dressing grindstone 51.

[0043] The dressing grindstone 51 has a substantially cylindrical shape, and its diameter is smaller than the gap between the first blade cover 34 and the second blade cover 35. The holding portion 52 holds the dressing grindstone 51 so that the dressing grindstone 51 protrudes into the gap between the first blade cover 34 and the second blade cover 35 below and faces the cutting blade 31.

[0044] In this embodiment, the dressing wheel 51 is rotatably mounted on the holding part 52. Specifically, the dressing mechanism 50 includes a rotating shaft 55 that suspends (holds) the dressing wheel 51 in the holding part 52, and a water wheel 56 that serves as a rotational drive source for rotating the rotating shaft 55. The water wheel 56 is rotatably mounted inside the holding part 52. The upper end of the rotating shaft 55 is connected to the water wheel 56, and the dressing wheel 51 is attached to the lower end of the rotating shaft 55.

[0045] The water wheel 56 is connected to the cutting water source 201 and receives a supply of cutting water from the cutting water source 201. This cutting water causes the water wheel 56 to rotate together with the rotating shaft 55 around an axis of rotation that passes through the center of the dressing wheel 51 and extends in the Z-axis direction. Therefore, the dressing wheel 51 attached to the lower end of the rotating shaft 55 is also configured to rotate in the gap between the first blade cover 34 and the second blade cover 35 as the water wheel 56 rotates.

[0046] The dressing mechanism 50 also includes a guide portion 53 that supports the holding portion 52 so that it can move up and down freely. The guide portion 53 is a guide rail that is provided on the upper surfaces of the first blade cover 34 and the second blade cover 35 and extends in the Z-axis direction. The guide portion 53 supports the holding portion 52, which holds the dressing grindstone 51, in a state where it can slide along the Z-axis direction. Therefore, the holding portion 52 can move up and down along the guide portion 53 relative to the cutting blade 31 of the first cutting mechanism 18, either toward or away from the cutting blade 31. This allows the dressing grindstone 51 held by the holding portion 52 to move up and down relative to the cutting blade 31.

[0047] The dressing mechanism 50 also has a pair of upward biasing portions 54 that bias the holding portion 52 upward. The upward biasing portions 54 are disposed between the first blade cover 34 and the second blade cover 35 and the holding portion 52 so as to support the holding portion 52 relative to the first cutting mechanism 18. That is, the lower ends of the upward biasing portions 54 are installed on the upper surfaces of the first blade cover 34 and the second blade cover 35, while the upper ends thereof support the outer edge portions of the holding portion 52 from below.

[0048] When the holding part 52 moves along the guide part 53 in a direction approaching the cutting blade 31, the upward biasing part 54 biases the holding part 52 upward (in a direction away from the first cutting mechanism 18).

[0049] In this way, the dressing grindstone 51, holding portion 52, guide portion 53, and upward biasing portion 54 of the dressing mechanism 50 are disposed on the upper surfaces of the first blade cover 34 and the second blade cover 35, i.e., above the cutting blade 31 in the first cutting mechanism 18. Therefore, the dressing grindstone 51, holding portion 52, guide portion 53, and upward biasing portion 54 are raised and lowered together with the first cutting mechanism 18 by the first lifting mechanism 16.

[0050] The dressing mechanism 50 is disposed above the holder 52 and includes a block 57 that is not moved up and down by the first lifting mechanism 16, and an AE (acoustic emission) sensor 58.

[0051] Specifically, as shown in Fig. 1, a support pillar 60 extending in the Z-axis direction is installed on the side of the first Y-axis table 123 of the Y-axis movement mechanism 12 to which the first lifting mechanism 16 is attached. Then, as shown in Fig. 2, an AE sensor 58 is attached to the lower end of this support pillar 60. Furthermore, a block 57 is provided on the lower surface of the AE sensor 58.

[0052] The block 57 is configured to come into contact with the upper surface of the holding part 52 when the holding part 52 rises together with the first cutting mechanism 18. The AE sensor 58 measures vibrations (vibrations generated in the dressing grindstone 51 in this embodiment) that occur when the cutting blade 31 comes into contact with the dressing grindstone 51. That is, the AE sensor 58 is used to detect that the cutting blade 31 has come into contact with the dressing grindstone 51.

[0053] The second cutting mechanism 19 is a cutting mechanism similar to the first cutting mechanism 18, and is provided with a dressing mechanism 50 above it. The second cutting mechanism 19 has the same configuration as the first cutting mechanism 18, and therefore a description thereof will be omitted.

[0054] 1 includes a CPU that performs arithmetic processing according to a control program, a storage medium such as a memory, etc. The control unit 7 executes various processes and controls each component of the cutting device 1.

[0055] The control unit 7 also functions as a dressing control unit that dresses the cutting blade 31 by bringing the tip (upper end) of the cutting blade 31 into contact with the dressing grindstone 51 of the dressing mechanism 50 shown in FIG.

[0056] The following describes the operation of dressing the cutting blade 31 of the first cutting mechanism 18, which is controlled by the control unit 7. This operation is performed, for example, between cutting processes on the wafer 100 (see FIG. 1).

[0057] In the dressing operation of the cutting blade 31, the control unit 7 rotates the spindle 30 of the first cutting mechanism 18 shown in Fig. 2, thereby rotating the cutting blade 31 as indicated by the arrow 301. Furthermore, the control unit 7 connects the water wheel 56 of the dressing mechanism 50 to the cutting water source 201, and supplies cutting water to the water wheel 56, thereby rotating the water wheel 56. This causes the rotating shaft 55 connected to the water wheel 56 and the dressing grindstone 51 attached to the lower end of the rotating shaft 55 to rotate.

[0058] Next, the control unit 7 uses the first lifting mechanism 16 to raise the first cutting mechanism 18. As a result, the dressing grindstone 51, the holding unit 52, the guide unit 53, and the upward biasing unit 54 of the dressing mechanism 50, which are arranged above the first cutting mechanism 18, also rise together with the first cutting mechanism 18.

[0059] As the dressing mechanism 50 moves upward, the holding portion 52 of the dressing mechanism 50 is pressed against the block 57 of the dressing mechanism 50 arranged above it, and the upward movement of the dressing grindstone 51 held by the holding portion 52 also stops.

[0060] Thereafter, the control unit 7 continues to raise the first cutting mechanism 18 using the first lifting mechanism 16. As a result, the upward biasing part 54 contracts between the holding part 52 and the first cutting mechanism 18, and the first cutting mechanism 18 having the cutting blade 31 is further raised while receiving the biasing force of the upward biasing part 54.

[0061] 3, the dressing grindstone 51, which rotates together with the water wheel 56 and the rotating shaft 55, enters the gap between the first blade cover 34 and the second blade cover 35 of the rising first cutting mechanism 18, and the upper end (cutting edge 33) of the cutting blade 31 comes into contact with the lower end of the dressing grindstone 51. In this way, the control unit 7 rotates the rotating shaft 55, thereby bringing the tip of the cutting blade 31 into contact with the rotating dressing grindstone 51.

[0062] At this time, vibrations generated in the dressing grindstone 51 due to contact between the dressing grindstone 51 and the cutting blade 31 are detected by the AE sensor 58. Based on the detection result of the AE sensor 58, the control unit 7 detects that the cutting blade 31 has come into contact with the dressing grindstone 51, and stops the first lifting mechanism 16 from raising the first cutting mechanism 18. In the above description, the control unit 7 stops the lifting of the first cutting mechanism 18 when the cutting blade 31 comes into contact with the dressing grindstone 51. Alternatively, the control unit 7 may control the lifting and lowering of the first cutting mechanism 18 so that the value detected by the AE sensor 58 is maintained within a predetermined range for a predetermined time after the cutting blade 31 comes into contact with the dressing grindstone 51.

[0063] In this way, the control unit 7 brings the cutting blade 31 into contact with the dressing grindstone 51 to dress the cutting blade 31. At this time, the cutting water used to rotate the water wheel 56 falls down the sides of the rotating shaft 55 and the dressing grindstone 51, and is supplied to the contact portion between the cutting blade 31 and the dressing grindstone 51, functioning as processing water for dressing. When dressing the cutting blade 31 that cuts the wafer 100 in the XY direction, it is advisable to position the rotation axis of the dressing grindstone 51 directly above the rotation axis of the spindle 30 and directly above the center of the cutting blade 31 in the thickness direction. Furthermore, when dressing the cutting blade 31 that edge-trimmes the outer periphery of the wafer 100, the rotation axis of the dressing grindstone 51 should be positioned above a part other than the center of the cutting blade 31 in the thickness direction.

[0064] Then, for example, after a predetermined time has elapsed since the cutting blade 31 was brought into contact with the dressing grindstone 51, the control unit 7 lowers the first cutting mechanism 18 using the first lifting mechanism 16, and moves the cutting blade 31 away from the dressing grindstone 51, thereby completing the dressing operation of the cutting blade 31.

[0065] As described above, in this embodiment, the control unit 7 raises the first cutting mechanism 18 using the first lifting mechanism 16, brings the upper end of the cutting blade 31 into contact with the dressing grindstone 51 held by the holding unit 52, and dresses the cutting blade 31. That is, the control unit 7 raises the first cutting mechanism 18 using the first lifting mechanism 16, stops the rise of the dressing grindstone 51 by pressing the holding part 52 against the block 57, and brings the upper end of the cutting blade 31, which is rising against the biasing force of the upward biasing part 54, into contact with the dressing grindstone 51, thereby dressing the cutting blade 31. The dressing may be performed by cutting the tip of the cutting blade 31 into the dressing grindstone 51.

[0066] Therefore, in this embodiment, the cutting blade 31 can be dressed simply by raising the cutting blade 31 together with the first cutting mechanism 18 using the first lifting mechanism 16. This reduces the time required to dress the cutting blade 31 compared to when the first cutting mechanism 18 is moved onto a dressing board held on a sub-chuck table and the cutting blade 31 is cut into the dressing board.

[0067] In this embodiment, the block 57 and the AE sensor 58 are attached to the lower end of a support column 60 provided on the side of the first Y-axis table 123. However, the present invention is not limited to this. The block 57 and the AE sensor 58 may be attached to another member that is not raised and lowered by the first lifting mechanism 16, such as the base 10 or the gate-type column 14 of the cutting device 1, via a support column such as the support column 60, or may be provided on a member that is raised and lowered by the first lifting mechanism 16, such as the casing 40 that supports the spindle 30 on which the cutting blade 31 is attached, or a support member 163 connected to the casing 40.

[0068] Furthermore, the first cutting mechanism 18 (and the second cutting mechanism 19) may have a configuration as shown in Fig. 4. In this configuration, as shown in Fig. 4, an end 341 on the +X direction side of the first blade cover 34 overlaps the upper surface of an end 351 on the -X direction side of the second blade cover 35, and the first blade cover 34 and the second blade cover 35 can be connected without any gaps.

[0069] Therefore, while the cutting blade 31 is cutting the wafer 100, the first blade cover 34 and the second blade cover 35 can be connected to block the area above the cutting blade 31, thereby preventing cutting water and cutting chips from splashing above the cutting blade 31.

[0070] In addition, in this configuration, the first cutting mechanism 18 includes a movement mechanism 342 for moving the first blade cover 34 in the −X direction. Therefore, in this configuration, as shown in Figures 5 and 6, by moving the first blade cover 34 in the −X direction, the upper part of the cutting blade 31 is opened and a gap for inserting the dressing grindstone 51 can be formed between the first blade cover 34 and the second blade cover 35.

[0071] As shown in FIG. 4, in this configuration, the entire dressing mechanism 50 is attached to a support column 60 provided on the side of the first Y-axis table 123 (see FIG. 1).

[0072] 2, in this dressing mechanism 50, an AE sensor 58 is attached to the lower end of a support column 60. Furthermore, a block 57 is provided on the lower surface of the AE sensor 58.

[0073] 4, a holder 52 that holds the dressing wheel 51 is attached to the underside of the block 57. Similar to the configuration shown in FIG. 2, the holder 52 includes a rotating shaft 55 that suspends (holds) the dressing wheel 51 and a water wheel 56 that serves as a rotational drive source for rotating the rotating shaft 55. The water wheel 56 is rotatably mounted inside the holder 52. The upper end of the rotating shaft 55 is connected to the water wheel 56, and the dressing wheel 51 is attached to the lower end of the rotating shaft 55. Therefore, even in this configuration, when the water wheel 56 is rotated by cutting water supplied from the cutting water source 201, the rotating shaft 55 and the dressing wheel 51 can also be rotated.

[0074] In this configuration, when dressing the cutting blade 31 of the first cutting mechanism 18, the control unit 7 rotates the spindle 30 to rotate the cutting blade 31, and also connects the water wheel 56 of the dressing mechanism 50 to the cutting water source 201 to rotate the water wheel 56, thereby rotating the rotating shaft 55 and the dressing grinding wheel 51.

[0075] Next, as shown in Figure 5, the control unit 7 moves the first blade cover 34 in the -X direction using the moving mechanism 342, thereby opening up the top of the cutting blade 31 and creating a gap between the first blade cover 34 and the second blade cover 35 through which the dressing grindstone 51 can enter.

[0076] Thereafter, the control unit 7 uses the first lifting mechanism 16 to raise the first cutting mechanism 18. As the first cutting mechanism 18 rises, the dressing grindstone 51, which rotates together with the rotating shaft 55, enters the gap between the first blade cover 34 and the second blade cover 35 of the rising first cutting mechanism 18, and the upper end (cutting edge 33) of the cutting blade 31 comes into contact with the lower end of the dressing grindstone 51. In this way, the control unit 7 rotates the rotating shaft 55 to bring the tip of the cutting blade 31 into contact with the rotating dressing grindstone 51.

[0077] At this time, vibrations generated in the dressing grindstone 51 due to contact between the dressing grindstone 51 and the cutting blade 31 are detected by the AE sensor 58. Based on the detection result of the AE sensor 58, the control unit 7 detects that the cutting blade 31 has come into contact with the dressing grindstone 51, and stops the first lifting mechanism 16 from raising the first cutting mechanism 18.

[0078] In this way, the control unit 7 brings the cutting blade 31 into contact with the dressing grindstone 51 to dress the cutting blade 31. At this time, the cutting water rotating the water wheel 56 is supplied to the contact area between the cutting blade 31 and the dressing grindstone 51 and functions as processing water for dressing. Then, for example, after a predetermined time has elapsed since the cutting blade 31 was brought into contact with the dressing grindstone 51, the control unit 7 lowers the first cutting mechanism 18 using the first lifting mechanism 16, and moves the cutting blade 31 away from the dressing grindstone 51, thereby completing the dressing operation of the cutting blade 31.

[0079] 4 to 6, the control unit 7 causes the first lifting mechanism 16 to raise the first cutting mechanism 18, and brings the upper end of the cutting blade 31 into contact with the dressing grindstone 51 held by the holding unit 52, thereby dressing the cutting blade 31. Therefore, the cutting blade 31 can be dressed simply by raising the cutting blade 31 together with the first cutting mechanism 18 using the first lifting mechanism 16. Therefore, the time required for dressing can be shortened compared to a configuration in which the cutting blade 31 is dressed using a dressing board on a sub-chuck table.

[0080] 4 to 6, the entire dressing mechanism 50 is attached to the lower end of the support column 60. However, the dressing mechanism 50 may be attached to another member that is not raised and lowered by the first lifting mechanism 16, such as the base 10 or the gate-type column 14 of the cutting device 1, via a support column such as the support column 60.

[0081] Furthermore, when the first lifting mechanism 16 raises the first cutting mechanism 18 including the cutting blade 31 to dress the cutting blade 31, the control unit 7 is preferably configured to raise the first cutting mechanism 18 to bring the cutting blade 31 into contact with the dressing grindstone 51 so that the measurement value of the AE sensor 58 when the cutting blade 31 comes into contact with the dressing grindstone 51 becomes a predetermined value. In other words, the control unit 7 preferably raises the first cutting mechanism 18 with a strength (speed) that makes the measurement value of the AE sensor 58 become a predetermined value, and brings the cutting blade 31 into contact with the dressing grindstone 51.

[0082] The measurement value of the AE sensor 58 is usually approximately proportional to the strength of contact between the cutting blade 31 and the dress grindstone 51. The predetermined value in the measurement value of the AE sensor 58 is a value at which the strength of contact between the cutting blade 31 and the dress grindstone 51 is appropriate when the measurement value of the AE sensor 58 is the predetermined value. With this configuration, it is possible to effectively prevent the strength of contact between the cutting blade 31 and the dress grindstone 51 from becoming excessive or insufficient. In this embodiment, the AE sensor 58 is provided in the dressing mechanism 50. In this regard, the AE sensor 58 is not limited to being provided in the dressing mechanism 50, but may be provided in any part of the cutting device 1 that can detect vibrations that occur when the cutting blade 31 comes into contact with the dressing grindstone 51.

[0083] 4 to 6, the rotary shaft 55 may extend upward to pass through the water wheel 56, and the upper end of the rotary shaft 55 may be rotatably attached to the block 57. The holder 52 may be attached to the lower end of the rotary shaft 55 and suspended from the rotary shaft 55. The dressing stone 51 may be attached to the lower end of the holder 52. In this configuration, cutting water is supplied to the water wheel 56, causing the water wheel 56 to rotate, thereby rotating the rotary shaft 55, and the holder 52 at the lower end of the rotary shaft 55 rotates together with the dressing stone 51.

[0084] In this embodiment, the AE sensor 58 is used to detect that the cutting blade 31 has come into contact with the dressing grindstone 51. In this regard, the rotation load detection unit 391 shown in FIGS. 2 to 5 may be used to detect that the cutting blade 31 has come into contact with the dressing grindstone 51.

[0085] The rotation load detection unit 391 detects the load current value of the current supplied to the motor 39 (load current value of the motor 39) as the rotation load of the motor 39. *Specifically, when the upper end of the cutting blade 31 comes into contact with the dressing grindstone 51, a rotational load that slows the rotational speed is generated in the motor 39 that rotates the spindle 30 and the cutting blade 31. Therefore, the load current value of the motor 39 increases in order to maintain a preset rotational speed. The rotational load detection unit 391 measures the load current value of the motor 39 that changes in this way.

[0086] In this way, the rotational load detection unit 391 detects the load current value that increases due to the rotational load applied to the motor 39. In other words, the rotational load detection unit 391 is used to detect that the cutting blade 31 has come into contact with the dressing grindstone 51 based on the load current value of the motor 39.

[0087] In this configuration, as shown in FIG. 3 or 5 , the control unit 7 causes the first lifting mechanism 16 to raise the first cutting mechanism 18 and bring the tip of the cutting blade 31 into contact with the dressing grindstone 51, thereby dressing the cutting blade 31. At this time, the load current value of the motor 39, which has risen due to contact between the dressing grindstone 51 and the cutting blade 31, is detected by the rotational load detection unit 391. Based on the detection result of the rotational load detection unit 391, the control unit 7 detects that the cutting blade 31 has come into contact with the dressing grindstone 51, and stops the lifting of the first cutting mechanism 18 by the first lifting mechanism 16. Then, for example, after a predetermined time has elapsed since the cutting blade 31 came into contact with the dressing grindstone 51, the control unit 7 separates the cutting blade 31 from the dressing grindstone 51, thereby completing the dressing operation of the cutting blade 31. The dressing may be performed by cutting the tip of the cutting blade 31 into the dressing grindstone 51.

[0088] In addition, the control unit 7 may control the raising and lowering of the first cutting mechanism 18 so that the load current value detected by the rotational load detection unit 391 is maintained within a predetermined range for a predetermined time after the cutting blade 31 comes into contact with the dressing grindstone 51.

[0089] Furthermore, when the control unit 7 raises the first cutting mechanism 18 including the cutting blade 31 by the first lifting mechanism 16 to dress the cutting blade 31, it is preferable that the control unit 7 is configured to raise the first cutting mechanism 18 to bring the cutting blade 31 into contact with the dressing grindstone 51 so that the load current value detected by the rotational load detection unit 391 when the cutting blade 31 comes into contact with the dressing grindstone 51 becomes a predetermined value. In other words, it is preferable that the control unit 7 raises the first cutting mechanism 18 with a strength (speed) such that the load current value of the motor 39 detected by the rotational load detection unit 391 becomes a predetermined value, to bring the cutting blade 31 into contact with the dressing grindstone 51.

[0090] The load current value of the motor 39 normally changes depending on the strength of contact between the cutting blade 31 and the dressing grindstone 51. The predetermined value of the load current value of the motor 39 is a value at which the strength of contact between the cutting blade 31 and the dressing grindstone 51 is appropriate when this load current value is a predetermined value. With this configuration, it is possible to effectively prevent the strength of contact between the cutting blade 31 and the dressing grindstone 51 from becoming excessive or insufficient. [Explanation of symbols]

[0091] 1: cutting device, 7: control unit, 10: base, 11: X-axis direction movement mechanism 12: Y-axis direction movement mechanism, 13: movement mechanism, 14: gate-type column, 16: First lifting mechanism, 17: Second lifting mechanism, 18: First cutting mechanism, 19: Second cutting mechanism, 20: chuck table, 22: holding surface, 25: θ table, 28: clamp, 30: spindle, 31: cutting blade, 32: flange, 33: cutting edge, 34: first blade cover, 35: second blade cover, 36: blade cooling nozzle, 38: cutting water nozzle, 39: motor, 40: casing, 50: dressing mechanism, 51: dressing grindstone, 52: holding part, 53: guide part, 54: upward biasing portion, 55: rotating shaft, 56: water wheel, 57: block, 58: AE sensor, 60: support column, 100: wafer, 102: planned dividing line, 103: dicing tape, 105: Ring frame, 107: Work set, 110: ball screw, 111: guide rail, 112: motor, 113: X-axis table, 120: First ball screw, 121: Guide rail, 122: Second ball screw, 123: first Y-axis table, 124: first motor, 125: second Y-axis table, 160: ball screw, 161: guide rail, 162: motor, 163: support member, 201: cutting water source, 301: arrow, 341: end of first blade cover, 342: moving mechanism, 351: end of second blade cover, 391: rotation load detection unit

Claims

1. A cutting device comprising: a chuck table for holding a workpiece; a cutting mechanism for cutting the workpiece with a rotating cutting blade; an elevating mechanism for raising and lowering the cutting mechanism; a dressing mechanism having a dressing grindstone for dressing the cutting blade; and a dressing control unit for dressing the cutting blade by bringing a tip of the cutting blade into contact with the dressing grindstone, the dressing mechanism includes a holding portion disposed above the cutting blade and holding the dressing stone; the dressing control unit raises the cutting mechanism to bring the upper end of the cutting blade into contact with the dressing grindstone held by the holding unit, thereby dressing the cutting blade. cutting equipment.

2. The dressing mechanism includes: a guide portion that supports the holding portion so that it can move up and down freely; an upward biasing portion that biases the holding portion upward; a block disposed above the holding portion and not moved up and down by the lifting mechanism; the holding portion, the guide portion, and the upward biasing portion are arranged above the cutting blade in the cutting mechanism and are configured to be raised and lowered together with the cutting mechanism by the lifting mechanism, the dress control unit raises the cutting mechanism and presses the holding unit against the block to stop the lifting of the dress grindstone, and brings the upper end of the cutting blade, which rises against the biasing force of the upward biasing unit, into contact with the dress grindstone. The cutting device according to claim 1.

3. an AE sensor for measuring vibrations generated when the cutting blade comes into contact with the dressing grindstone; the dressing control unit raises the cutting mechanism to bring the cutting blade into contact with the dressing grindstone so that the measurement value of the AE sensor when the cutting blade comes into contact with the dressing grindstone becomes a predetermined value; The cutting device according to claim 1.

4. the cutting mechanism includes a motor that rotates the cutting blade, and a rotation load detection unit that detects a load current value that increases due to a rotation load applied to the motor; the dressing control unit raises the cutting mechanism to bring the cutting blade into contact with the dressing grindstone so that a load current value detected by the rotation load detection unit when the cutting blade comes into contact with the dressing grindstone becomes a predetermined value; The cutting device according to claim 1.

5. the dressing mechanism includes a rotating shaft that suspends the dressing grindstone, and a rotation drive source that rotates the rotating shaft; the dressing control unit rotates the rotary shaft to bring the tip of the cutting blade into contact with the rotating dressing stone; The cutting device according to any one of claims 1 to 4.

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